Microphone structure with improved substrate

Abstract

The embodiment of the present invention discloses a microphone structure with an improved substrate, comprising an L-shaped substrate, wherein the front cross-section of the L-shaped substrate is L-shaped; a packaging shell, which forms a microphone acoustic cavity with the L-shaped substrate; an acoustic sensor is arranged in the microphone acoustic cavity; a dedicated integrated chip, which is connected to the acoustic sensor signal; and an acoustic through hole, which is arranged on the L-shaped substrate or the packaging shell. An L-shaped ceramic substrate is designed, and a welding pad is arranged on the vertical surface of the L-shaped substrate, so that electronic equipment can be welded on the vertical surface of the L-shaped substrate, thereby avoiding excessive electronic equipment laying area caused by too many electronic equipment on the substrate, and making the best use of the installation space on the vertical and horizontal surfaces of the microphone, thereby reducing the length or width of the microphone, and achieving the purpose of reducing the size of the microphone and high integration.

Description

Technical Field

[0001] The invention relates to the field of electronic equipment, and in particular to a microphone structure with an improved substrate. Background Art

[0002] Microphone, scientifically known as microphone, is an energy conversion device that converts sound signals into electrical signals. It is a transliteration of the English word "Microphone". It is also called microphone or micro-phone. In the 20th century, microphones evolved from converting sound to electricity through resistance to inductance and capacitance. A large number of new microphone technologies have gradually developed, including aluminum ribbon, dynamic microphones, and the currently widely used condenser microphone and electret microphone.

[0003] Silicon micro-microphones are based on CMOSMEMS technology and are smaller in size. Their consistency will be more than 4 times better than that of electret capacitor microphones, so MEMS microphones are particularly suitable for cost-effective microphone array applications, where better matched microphones will improve sound wave formation and reduce noise.

[0004] In the prior art MEMS microphone, the substrate is a PCB board, and the pad is located on the bottom surface of the PCB board; the advantages are low cost, simple process, and intensive production. The problem with this structure is that the integration is limited and it cannot meet the customer's requirements for the length or width to be as small as possible. Summary of the invention

[0005] The purpose of the present invention is to provide a microphone structure with an improved substrate to solve the above technical problems.

[0006] The technical problem solved by the present invention can be achieved by adopting the following technical solutions:

[0007] A microphone structure with an improved substrate, comprising:

[0008] An L-shaped substrate, wherein the front cross-section of the L-shaped substrate is L-shaped;

[0009] A packaging shell, which together with the L-shaped substrate forms an acoustic cavity of a microphone; the acoustic cavity of the microphone is provided with:

[0010] An acoustic sensor;

[0011] A dedicated integrated chip, connected to the acoustic sensor signal;

[0012] An acoustic through hole is arranged on the L-shaped substrate or the packaging shell.

[0013] Preferably, the L-shaped substrate is an integrally formed ceramic substrate.

[0014] Preferably, the L-shaped substrate includes a first substrate and a second substrate vertically connected to the first substrate, the second substrate is shorter than the first substrate, and a plurality of pads are disposed on the first substrate or the second substrate.

[0015] Preferably, the acoustic sensor and the dedicated integrated chip are arranged on the first substrate, the acoustic through hole is arranged at the acoustic sensor installation position on the first substrate, and the soldering pad is arranged on the outer side surface of the first substrate.

[0016] Preferably, the acoustic sensor is disposed on the first substrate, and the dedicated integrated chip is disposed on the second substrate.

[0017] Preferably, the dedicated integrated chip is arranged on the first substrate, the acoustic sensor is arranged on the second substrate, the acoustic through hole is arranged at the acoustic sensor installation position on the second substrate, and the solder pad is arranged on the outer side surface of the second substrate.

[0018] Preferably, the acoustic through hole is arranged on a top surface or a side surface of the packaging shell.

[0019] Preferably, the packaging shell is a metal shell.

[0020] Preferably, the packaging shell is an L-shaped packaging shell in cross section, which matches the L-shaped substrate to form the acoustic cavity.

[0021] Beneficial effects: The present invention designs an L-shaped ceramic substrate, and sets the welding pad on the vertical surface of the L-shaped substrate, so that the electronic equipment can be welded on the vertical surface of the L-shaped substrate, thereby avoiding too large an electronic equipment laying area caused by too many electronic equipment on the substrate, and making full use of the installation space on the vertical and horizontal surfaces of the microphone, thereby reducing the length or width of the microphone, achieving the purpose of reducing the size of the microphone and high integration, and the L-shaped ceramic substrate has a high temperature resistance function, avoiding high-temperature damage to highly integrated electronic devices and extending the life of the microphone, and the dedicated integrated chip and acoustic sensor have a variety of installation methods, wide applicability, and the setting of the acoustic through hole is also flexible and diverse, suitable for a variety of equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic cross-sectional structural diagram of a microphone according to a first embodiment of the present invention;

[0023] Figure 2 It is a schematic diagram of the three-dimensional structure of a microphone according to the first embodiment of the present invention;

[0024] Figure 3 It is a schematic diagram of another arrangement of acoustic through holes on a microphone according to the first embodiment of the present invention;

[0025] Figure 4 It is a schematic diagram of the internal cross-sectional structure of a microphone according to a second embodiment of the present invention;

[0026] Figure 5 FIG. 1 is a schematic diagram of the internal cross-sectional structure of a microphone according to Embodiment 3 of the present invention.

[0027] In the figure: 1-L-shaped substrate; 2-soldering pad; 3-acoustic sensor; 4-dedicated integrated chip; 5-acoustic through hole; 6-package shell; 7-acoustic cavity;

[0028] 11- first substrate; 12- second substrate. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0031] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0032] Embodiment 1

[0033] like Figure 1 and Figure 2 As shown, the present invention provides a microphone structure with an improved substrate, comprising

[0034] An L-shaped substrate 1, wherein the front section of the L-shaped substrate 1 is L-shaped;

[0035] A packaging shell 6 and the L-shaped substrate 1 form a microphone acoustic cavity 7; the microphone acoustic cavity 7 is provided with:

[0036] An acoustic sensor 3;

[0037] A dedicated integrated chip 4, connected to the acoustic sensor 3 for signal;

[0038] An acoustic through hole 5 is disposed on the L-shaped substrate 1 or the packaging shell 6 .

[0039] The advantages of the present invention are:

[0040] The present invention designs an L-shaped ceramic substrate and sets the welding pad on the vertical surface of the L-shaped substrate, so that the electronic equipment can be welded on the vertical surface of the L-shaped substrate, thereby avoiding too large an area for laying the electronic equipment due to too many electronic equipment on the substrate, and making full use of the installation space on the vertical and horizontal surfaces of the microphone, thereby reducing the length or width of the microphone, achieving the purpose of reducing the size of the microphone and high integration.

[0041] As a preferred embodiment of the present invention, the L-shaped substrate 1 is an integrally formed ceramic substrate. The ceramic substrate has a high temperature resistance function, which avoids high temperature damage to highly integrated electronic devices and prolongs the life of the microphone.

[0042] As a preferred embodiment of the present invention, the packaging shell 6 is a metal shell.

[0043] The front cross-section of the packaging shell 6 is L-shaped, and the bottom end of the shorter side of the packaging shell 6 is fixedly connected to the top of one end of the first substrate 11, and the longer side end of the packaging shell 6 is fixedly connected to the top of the inner side surface of the second substrate 12. This connection method saves the volume of the entire microphone, makes the connection more compact, has smaller gaps, and has good sealing performance.

[0044] As a preferred embodiment of the present invention, the L-shaped substrate 1 includes a first substrate 11 and a second substrate 12 vertically connected to the first substrate 11 , the length of the second substrate 12 is smaller than the first substrate 11 , and a plurality of pads 2 are arranged on the first substrate 11 or the second substrate 12 .

[0045] As a preferred embodiment of the present invention, an acoustic sensor 3 and a dedicated integrated chip 4 are arranged on the first substrate 11, an acoustic through hole 5 is arranged at the installation position of the acoustic sensor 3 on the first substrate 11, and a solder pad 2 is arranged on the outer side of the first substrate 11. The solder pad 2 is used to electrically connect with an external device and transmit the signal in the microphone to the outside of the microphone.

[0046] Some electronic components of traditional microphones are directly soldered on a flat substrate. If there are many electronic devices, the substrate area needs to be large enough, so the overall volume of the microphone is relatively large. Figure 2As shown, the present invention designs an L-shaped substrate 1, installs the acoustic sensor 3 and the dedicated integrated chip 4 on the first substrate 11, and installs the capacitor, resistor and some necessary circuit chips for the microphone on the vertical surface of the second substrate 12 (or installs the acoustic sensor 3 on the second substrate 12, and other electronic devices on the first substrate 11). This greatly utilizes the horizontal and vertical spaces of the L-shaped substrate 1, and converts the plane installation into a combination of plane and three-dimensional installation, thereby shortening the length of the L-shaped substrate 1, thereby greatly reducing the occupied area of ​​the substrate. In addition, the L-shaped substrate 1 is manufactured using an integrated molding process, which is convenient and quick to manufacture and has a compact structure. As a result, the overall volume of the microphone is reduced along the Figure 2 The x-axis or y-axis direction is minimized as much as possible, which greatly reduces the length or width of the substrate, thereby achieving the effect of reducing the substrate area.

[0047] As a preferred embodiment of the present invention, the packaging shell 6 can be provided with an acoustic through hole 5 (or may not be provided), and the acoustic through hole 5 is used to receive the speaking sound of the external user to make the silicon diaphragm on the acoustic sensor 3 vibrate, and then the acoustic sensor 3 converts the changing voltage generated by the vibration of the silicon diaphragm into an electrical signal and transmits it to the microphone dedicated integrated chip 4, so that the signal is converted into a transmittable and receivable signal and sent to the receiving end such as a speaker.

[0048] Preferably, an acoustic through hole is provided on the side of the packaging shell 6, and the acoustic through hole 5 is connected to the acoustic cavity 7. The acoustic through hole can be installed at a vertical angle of the device, so that the two adjacent sides of the device have acoustic through holes, and when any one side is covered (such as when the flip device is closed), the other acoustic through hole can still receive sound. The design of the two acoustic through holes 5 provides more ways for sound to enter the microphone, thereby increasing the fault tolerance of the microphone. That is, when any one acoustic through hole 5 is damaged or blocked, the sound can enter the microphone through another intact acoustic through hole 5. It is applicable to more types of devices.

[0049] In addition, if Figure 3 As shown, the acoustic through hole 5 can also be set on the top surface of the packaging shell 6. At this time, the air intake directions of the two acoustic through holes 5 are opposite. In this way, after the microphone is installed on the device, the two acoustic through holes 5 can be located on two opposite surfaces of the device. In this way, when the microphone is set at the front center of the flip device, there is no need to worry about the problem that the microphone cannot receive sound after the cover is closed (because the acoustic through hole 5 on the back of the device can easily receive sound).

[0050] Embodiment 2

[0051] like Figure 4 As shown, the acoustic sensor 3 is disposed on the first substrate 11 , and the dedicated integrated chip 4 is disposed on the second substrate 12 .

[0052] Compared with the first embodiment, the adjustments of this embodiment are as follows:

[0053] The dedicated integrated chip 4 on the first substrate 11 is moved to the outer surface of the second substrate 12, and the other parts remain unchanged. The advantages of this design are: the mounting surface of the acoustic sensor 3 and the mounting surface of the dedicated integrated chip 4 can be separated, so that other transfer electronic components such as resistors and signal processors can be installed between the two, and because the distance between the two is increased, heat is not easily transmitted, and there is no interference between them, and the sound transmission effect is better.

[0054] Embodiment 3

[0055] like Figure 5 As shown, a dedicated integrated chip 4 is disposed on the first substrate 11 , an acoustic sensor 3 is disposed on the second substrate 12 , an acoustic through hole 5 is disposed at the mounting position of the acoustic sensor 3 on the second substrate 12 , and a solder pad 2 is disposed on the outer side surface of the second substrate 12 .

[0056] Compared with the first embodiment, the adjustments of this embodiment are as follows:

[0057] The acoustic sensor 3 on the first substrate 11 is replaced on the second substrate 12, and the acoustic through hole 5 on the first substrate 11 is changed to the position of the acoustic sensor 3 on the second substrate 12, so that the microphone has better sound transmission efficiency. In addition, the pad 2 can also be set on the outer side of the second substrate 12 to facilitate the connection between the microphone and external equipment.

[0058] It can be seen from the above three embodiments that the installation positions of the dedicated integrated chip 7, the acoustic sensor 3 and the pad 2 are not fixed, and a microphone with special functions can be customized according to the characteristics of the device, which is practical. In addition, there is no limit on the number and position of the acoustic through holes 5, which can be flexibly adjusted according to the sealing and ventilation of the device, so that the microphone is suitable for most audio equipment and has a wide applicability.

[0059] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A microphone structure with an improved substrate, characterized in that: include An L-shaped substrate, wherein the front cross-section of the L-shaped substrate is L-shaped; A packaging shell, which together with the L-shaped substrate forms an acoustic cavity of a microphone; the acoustic cavity of the microphone is provided with: An acoustic sensor; A dedicated integrated chip, connected to the acoustic sensor signal; an acoustic through hole, disposed on the L-shaped substrate; The L-shaped substrate is an integrally formed ceramic substrate. The packaging shell is also provided with another acoustic through hole, and the other acoustic through hole is located at a vertical angle of the microphone structure. The L-shaped substrate includes a first substrate and a second substrate vertically connected to the first substrate, and a solder pad is provided on the outer side of the second substrate.

2. The microphone structure of the improved substrate according to claim 1, characterized in that: The second substrate is shorter than the first substrate, and a plurality of pads are disposed on the first substrate or the second substrate.

3. The microphone structure of the improved substrate according to claim 2, characterized in that: The acoustic sensor and the dedicated integrated chip are arranged on the first substrate, the acoustic through hole is arranged at the installation position of the acoustic sensor on the first substrate, and the solder pad is arranged on the outer side surface of the first substrate.

4. The microphone structure of the improved substrate according to claim 2, characterized in that: The acoustic sensor is arranged on the first substrate, and the dedicated integrated chip is arranged on the second substrate.

5. The microphone structure of the improved substrate according to claim 2, characterized in that: The dedicated integrated chip is arranged on the first substrate, the acoustic sensor is arranged on the second substrate, and the acoustic through hole is arranged at the installation position of the acoustic sensor on the second substrate.

6. The microphone structure of the improved substrate according to claim 1, characterized in that: The other acoustic through hole is arranged on the top surface or the side surface of the packaging shell, and the other acoustic through hole and the acoustic through hole are located on two adjacent surfaces.

7. The microphone structure of the improved substrate according to claim 1, characterized in that: The packaging shell is a metal shell.

8. The microphone structure of the improved substrate according to claim 1, characterized in that: The packaging shell is an L-shaped packaging shell in cross section, which is matched with the L-shaped substrate to form the acoustic cavity.

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