High-sealing LED bracket, LED and lighting device

Abstract

The present invention provides a highly sealed LED bracket, an LED and a lighting device, which includes a positive electrode substrate, a negative electrode substrate and an insulating isolation belt for insulating and isolating the two, and further includes an insulating enclosure body that encloses the positive electrode substrate, the negative electrode substrate and the insulating isolation belt. The front sides of the positive electrode substrate and the negative electrode substrate have a functional area and an enclosure contact area that contacts the enclosure body, and at least one of the functional area and the enclosure contact area of the positive electrode substrate and the negative electrode substrate is not in the same plane. Therefore, the path between the enclosure contact area and the functional area of the substrate can be extended, that is, the path for moisture to enter the functional area can be extended, thereby improving the moisture-proof performance of the LED bracket and the LED manufactured by using the LED bracket, enhancing the reliability and durability of the LED, enabling the LED to be better applicable to application scenarios in various environments, and being more conducive to the popularization and use of the LED.

Description

Technical Field

[0001] The present invention relates to the field of LEDs (Light Emitting Diodes), and particularly to a highly sealed LED bracket, an LED, and a lighting device. Background Art

[0002] Due to the advantages of rich colors, small size, environmental protection, energy saving, long lifespan, etc. of LEDs, they have been widely used and promoted in various fields, such as including but not limited to daily lighting, outdoor lighting, lighting decoration, advertising signs, automotive lighting or indication, traffic indication, etc. Since the external environments in which LEDs are used in different fields vary, relatively high requirements are imposed on the reliability of LEDs. Among them, the moisture-proof performance of LEDs is an important measure of LED reliability, especially for application scenarios with relatively humid use or storage environments.

[0003] The existing LED bracket is shown in Figures 1-1 to 1-2 As shown, it includes a plastic enclosure 10 forming a reflection cavity, a positive electrode substrate 11, a negative electrode substrate 12 enclosed by the plastic enclosure 10, and an isolation strip 13 that insulates and isolates the positive electrode substrate 11 and the negative electrode substrate 12. A part of the front surface area of the positive electrode substrate 11 and the negative electrode substrate 12 is in direct contact with the plastic enclosure 10, which is called the enclosure contact area; another part of the area is located at the bottom of the reflection cavity as a functional area, which can be used to carry LED chips and other possible electronic devices, as well as for wiring, die bonding, and as a light reflection area, etc. In the existing LED bracket, the enclosure contact area and the functional area on the front surface of the positive electrode substrate 11 and the negative electrode substrate 12 are on the same plane. Therefore, when moisture spreads along the joint between the side surface of the substrate and the plastic enclosure 10 to the front surface of the substrate, it is very easy to enter the functional area through the enclosure contact area on the front surface of the substrate, resulting in short circuits in the circuits in the functional area, damage to devices, and even directly causing dead lights; and most of the functional areas of the substrates are plated with a metal silver layer, and the metal silver layer is also very easy to corrode under the action of moisture, causing functional defects. It can be seen that the existing LED bracket and the LED prepared using this bracket have poor moisture-proof performance. Summary of the Invention

[0004] The highly sealed LED bracket, LED, and lighting device provided by the present invention mainly solve the technical problem of: solving the poor moisture-proof performance of the existing LED bracket and the LED prepared using this bracket.

[0005] To solve the above technical problems, the present invention provides a highly sealed LED bracket, which includes a positive electrode substrate, a negative electrode substrate, and an insulating isolation belt. The insulating isolation belt is located between the positive electrode substrate and the negative electrode substrate to insulate and isolate the two. It also includes an insulating enclosure wall that encloses the positive electrode substrate, the negative electrode substrate, and the insulating isolation belt. The front surfaces of the positive electrode substrate and the negative electrode substrate have a functional area and an enclosure contact area that contacts the enclosure wall;

[0006] The functional area and the enclosure contact area of at least one of the positive electrode substrate and the negative electrode substrate are not in the same plane.

[0007] In an embodiment of the present invention, the functional areas and the enclosure contact areas of both the positive electrode substrate and the negative electrode substrate are not in the same plane.

[0008] In an embodiment of the present invention, the enclosure contact area is directly connected to the functional area.

[0009] In an embodiment of the present invention, there is also a connection transition area between the functional area and the enclosure contact area of at least one of the positive electrode substrate and the negative electrode substrate.

[0010] In an embodiment of the present invention, the plane where the functional area is located is higher than the plane where the enclosure contact area is located.

[0011] In an embodiment of the present invention, the connection transition area is an inclined plane, an arc surface, or a combined surface, and the combined surface is a combination of at least two of a plane, an inclined plane, and an arc surface.

[0012] In an embodiment of the present invention, at least a part of the connection transition area contacts the enclosure wall.

[0013] In an embodiment of the present invention, the functional areas of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the enclosure wall; the height difference between the plane where the functional area is located and the plane where the enclosure contact area is located is greater than 0 and less than or equal to one-fourth of the depth of the reflection cavity.

[0014] In an embodiment of the present invention, the two opposite long sides of the cross-sectional profile of the insulating isolation belt are arc-shaped sides, or curved sides with at least one bend, or broken line sides with at least one fold, or hypotenuse sides with an included angle greater than or equal to 10° and less than 90° with the short side of the negative electrode substrate.

[0015] In an embodiment of the present invention, the two opposite long sides of the cross-sectional profile of the insulating isolation belt are parallel to each other.

[0016] To solve the above problems, the present invention also provides an LED, comprising the high-sealing LED bracket as described above and at least one LED chip, wherein the LED chip is disposed on the positive electrode substrate and / or the negative electrode substrate, and the positive electrode pin and the negative electrode pin of the LED chip are electrically connected to the positive electrode substrate and the negative electrode substrate respectively.

[0017] To solve the above problems, the present invention also provides a light-emitting device, comprising the LED as described above, and the light-emitting device is a lighting device, a light signal indicating device, a supplementary lighting device or a backlight device.

[0018] The beneficial effects of the present invention are as follows:

[0019] The high-sealing LED bracket, LED and light-emitting device provided by the present invention include a positive electrode substrate, a negative electrode substrate and an insulating isolation belt for insulating and isolating the two, and also include an insulating enclosure body surrounding the positive electrode substrate, the negative electrode substrate and the insulating isolation belt. The front surfaces of the positive electrode substrate and the negative electrode substrate have a functional area and an enclosure contact area in contact with the enclosure body, and at least one of the functional area and the enclosure contact area of the positive electrode substrate and the negative electrode substrate is not in the same plane. Therefore, the path between the enclosure contact area and the functional area of the substrate can be extended, that is, the path for moisture to enter the functional area can be extended, thereby improving the moisture-proof performance of the LED bracket and the LED made by using the LED bracket, enhancing the reliability and durability of the LED, enabling the LED to be better applicable to application scenarios in various environments, and being more conducive to the popularization and use of the LED. Description of the Drawings

[0020] Figure 1-1 Is a top view of an LED bracket;

[0021] Figure 1-2 Is Figure 1-1 The cross-sectional view of the shown LED bracket;

[0022] Figure 2-1 Is the first cross-sectional view of the LED bracket provided in the second embodiment of the present invention;

[0023] Figure 2-2 Is the second cross-sectional view of the LED bracket provided in the second embodiment of the present invention;

[0024] Figure 2-3 Is the third cross-sectional view of the LED bracket provided in the second embodiment of the present invention;

[0025] Figure 2-4 Is the fourth cross-sectional view of the LED bracket provided in the second embodiment of the present invention;

[0026] Figure 3-1 Is the first cross-sectional view of the LED bracket provided in the third embodiment of the present invention;

[0027] Figure 3-2 Figure 2 of the cross-sectional view of the LED bracket provided in the third embodiment of the present invention;

[0028] Figure 3-3 Figure 3 of the cross-sectional view of the LED bracket provided in the third embodiment of the present invention;

[0029] Figure 3-4 Figure 4 of the cross-sectional view of the LED bracket provided in the third embodiment of the present invention;

[0030] Figure 3-5 Figure 5 of the cross-sectional view of the LED bracket provided in the third embodiment of the present invention;

[0031] Figure 3-6 Figure 6 of the cross-sectional view of the LED bracket provided in the third embodiment of the present invention;

[0032] Figure 3-7 Figure 7 of the cross-sectional view of the LED bracket provided in the third embodiment of the present invention;

[0033] Figure 3-8 Figure 8 of the cross-sectional view of the LED bracket provided in the third embodiment of the present invention;

[0034] Figure 4-1 Top view 1 of the LED bracket provided in the fifth embodiment of the present invention;

[0035] Figure 4-2 Top view 2 of the LED bracket provided in the fifth embodiment of the present invention;

[0036] Figure 4-3 Top view 3 of the LED bracket provided in the fifth embodiment of the present invention;

[0037] Figure 4-4 Top view 4 of the LED bracket provided in the fifth embodiment of the present invention;

[0038] Figure 4-5 Top view 5 of the LED bracket provided in the fifth embodiment of the present invention;

[0039] Figure 4-6 Top view 6 of the LED bracket provided in the fifth embodiment of the present invention;

[0040] Figure 5-1 Top view 7 of the LED bracket provided in the fifth embodiment of the present invention;

[0041] Figure 5-2 Top view 8 of the LED bracket provided in the fifth embodiment of the present invention;

[0042] Figure 5-3 Top view 9 of the LED bracket provided in the fifth embodiment of the present invention;

[0043] Figure 5-4 Top view 10 of the LED bracket provided in the fifth embodiment of the present invention;

[0044] Among them, Figures 1-1 to 1-2 in the attached drawing reference numeral 10 is a plastic enclosure wall, 11 is a positive electrode substrate, 12 is a negative electrode substrate, and 13 is an isolation strip; Figures 2-1 to 2-4 in it, 20 is an enclosure wall body, 21 is a substrate, 211 is a functional area, and 212 is an enclosure wall contact area; Figures 3-1 to 3-8 in it, 30 is an enclosure wall body, 31 is a substrate, 311 is a functional area, 312 is an enclosure wall contact area, and 313 is a connection transition area; Figures 4-1 to 4-6 in it, 50 is an enclosure wall body, 51 is a positive electrode substrate, 52 is a negative electrode substrate, and 53 is an insulating isolation area; Figures 4-1 to 4-4 in it, 60 is an enclosure wall body, 61 is a substrate, 61 is a positive electrode substrate, 62 is a negative electrode substrate, and 63 is an insulating isolation area. Specific embodiments

[0045] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the embodiments of the present invention will be further described in detail below through specific embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0046] Embodiment 1:

[0047] In order to solve the problem of poor moisture resistance of existing LED brackets, this embodiment provides an LED bracket with high sealing performance, which includes a positive electrode substrate, a negative electrode substrate and an insulating isolation strip. The insulating isolation strip is located between the positive electrode substrate and the negative electrode substrate to insulate and isolate the two. The LED bracket in this embodiment further includes an insulating enclosure wall body that encloses the positive electrode substrate, the negative electrode substrate and the insulating isolation strip. The front sides of the positive electrode substrate and the negative electrode substrate have a functional area and an enclosure wall contact area that contacts the enclosure wall body; in one example, the functional areas on the front sides of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the enclosure wall body.

[0048] The positive electrode substrate and the negative electrode substrate in this embodiment are both conductive substrates. The conductive substrates in this embodiment can be substrates made of various conductive materials, such as various metal conductive substrates, including but not limited to copper substrates, aluminum substrates, iron substrates, silver substrates; the conductive substrates can also be hybrid material conductive substrates containing conductive materials, such as conductive rubber, etc.

[0049] Optionally, a reflection layer can be further provided in the functional area on at least one of the front sides of the positive electrode substrate and the negative electrode substrate in this embodiment to improve the light extraction efficiency of the bracket. The reflection layer can be various light reflection layers that can improve the light extraction efficiency, such as including but not limited to a silver plating layer.

[0050] Optionally, in this embodiment, the back surface of at least one of the positive electrode substrate and the negative electrode substrate exposes the bottom of the surrounding wall body as an electrode welding area. Of course, in some examples, the back surface of at least one of the positive electrode substrate and the negative electrode substrate may not be used as a welding area, but its side surface may be used as a welding area, and the specific setting can be flexibly determined according to specific application requirements.

[0051] Optionally, in this embodiment, the surrounding wall body can be a surrounding wall body made of various insulating materials, such as but not limited to various plastics, insulating ceramics, etc. For example, in one example, the materials that the surrounding wall body can adopt include but are not limited to epoxy resins (EP), high-temperature resistant nylon (PPA plastic), polyphthalamide (PPA), poly(1,4-cyclohexylene dimethylene terephthalate) (PCT), liquid crystal polymer (LCP), sheet molding compound (SMC), epoxy molding compound (EMC), unsaturated polyester (UP) resin, polyethylene terephthalate (PET), polycarbonate (PC), polyhexamethylene adipamide (nylon66), and glass fiber.

[0052] Optionally, in this embodiment, the material of the insulating isolation belt can be the same as or different from that of the surrounding wall body, and it can be formed together with the surrounding wall body or separately.

[0053] In addition, it should be understood that the formation method of the surrounding wall body in this embodiment can also be flexibly selected, such as but not limited to injection molding.

[0054] In this embodiment, the functional area and the enclosure contact area of at least one of the positive electrode substrate and the negative electrode substrate of the LED bracket are not in the same plane. For example, the functional area and the enclosure contact area on the front side of the positive electrode substrate are not in the same plane, and / or the functional area and the enclosure contact area on the front side of the negative electrode substrate are not in the same plane. Specifically, whether one or both of the positive electrode substrate and the negative electrode substrate have the functional area and the enclosure contact area not in the same plane can be flexibly set according to specific requirements. For example, in one example, in order to comprehensively improve the sealing performance of the LED bracket, it can be set that both the functional area and the enclosure contact area of the positive electrode substrate and the negative electrode substrate are not in the same plane. This setting can extend the path between the enclosure contact areas of the substrate and the functional areas, that is, extend the path for moisture to enter the functional areas, thereby improving the sealing performance of the LED bracket and the LED manufactured using the LED bracket, enhancing the reliability and durability of the LED, enabling the LED to better meet the usage requirements in various environments, and being more conducive to the popularization and use of the LED.

[0055] In one example of this embodiment, the enclosure contact area on the front side of the substrate can be directly connected to the functional area, and the enclosure contact area can be an inclined surface, a curved surface, or other types of surfaces.

[0056] In another example of this embodiment, in order to further extend the path between the enclosure contact area and the functional area of the substrate, a connection transition area can also be provided between the enclosure contact area and the functional area of the substrate. In this way, moisture needs to pass through the enclosure contact area and the connection transition area before entering the functional area, which can further improve the moisture-proof performance of the bracket. In this embodiment, the connection transition area can also be an inclined surface, a curved surface, or a combined surface, and the combined surface can also include, but is not limited to, the combination of at least two of a plane, an inclined surface, and a curved surface.

[0057] In this embodiment, by setting that the functional area and the enclosure contact area of at least one of the positive electrode substrate and the negative electrode substrate of the LED bracket are not in the same plane, and optionally, the plane where the functional area is located can be higher than the plane where the enclosure contact area is located, or the plane where the functional area is located can be lower than the plane where the enclosure contact area is located. Therefore, the path between the enclosure contact area and the functional area of the substrate can be extended, that is, the path for moisture to enter the functional area can be extended, thereby improving the moisture-proof performance of the LED bracket and the LED manufactured using the LED bracket.

[0058] Embodiment 2:

[0059] For the sake of easy understanding, this embodiment is described by taking the example that the enclosure contact area and the functional area on the substrate are directly connected, and the functional area is located above the enclosure contact area.

[0060] Please refer to Figure 2-1As shown, the figure shows a schematic diagram of the direct connection between the enclosure contact area and the functional area on a substrate, where 20 is the enclosure body, 21 is the substrate (which may be the positive substrate and / or the negative substrate), 211 is the functional area, and 212 is the enclosure contact area. In Figure 2-1 the enclosure contact area 212 is an inclined surface, and the functional area 211 is a plane located in the enclosure contact area 212. Of course, according to requirements, the functional area 211 can also be set as a non-planar surface. The path between the enclosure contact area 212 and the functional area 211 is significantly longer than the path when the existing enclosure contact area and the functional area are set on the same plane. Therefore, the path for moisture to enter the functional area can be lengthened, thereby improving the moisture-proof performance of the bracket and enhancing the reliability of the LED lamp beads or other products made using this bracket.

[0061] In some examples, the enclosure contact area 212 may not be an inclined surface but other types of surfaces. For example, see Figure 2-2 As shown, in this figure, the enclosure contact area 212 is an arc surface, and it is a convex arc surface that protrudes outward from the substrate 21. Figure 2-2 The setting of the convex arc surface shown in Figure 2-1 compared with the inclined surface shown in

[0062] can further extend the path for moisture to enter the functional area, so the moisture-proof effect can be further improved. Figure 2-2 In some examples, when the enclosure contact area 212 is an arc surface, in addition to being the Figure 2-3 convex arc surface shown in Figure 2-1 it can also be other types of arc surfaces. For example, see

[0063] As shown, it is an inner arc surface that concaves inward from the substrate 21. Compared with the inclined surface shown in Figure 2-4 it can also further extend the path for moisture to enter the functional area, so the moisture-proof effect can be further improved. Figure 2-1

[0064] Of course, it should be understood that in this embodiment, in addition to being an inclined surface or an arc surface, the enclosure contact area 212 can also be set as other types of surfaces according to requirements, and it can specifically be a regular surface or an irregular surface. For example, see Figures 2-1 to 2-4 As shown, the enclosure contact area 212 is a curved surface. Compared with the inclined surface shown in

[0065] it can also further extend the path for moisture to enter the functional area, so the moisture-proof effect can be further improved.In some examples, the formation process of the above-mentioned enclosure contact area 212 can be flexibly selected. For example, it includes but is not limited to etching and cutting. The formation method is simple, low in cost, and high in efficiency. While ensuring the production cost and efficiency of the bracket, the moisture-proof performance of the LED bracket can be improved.

[0066] Embodiment 3:

[0067] For ease of understanding, in this embodiment, an example is given where there is a connection transition area between the enclosure contact area and the functional area on the substrate, and the functional area is located above the enclosure contact area.

[0068] Optionally, in this embodiment, the plane where the functional area is located can be higher than the plane where the enclosure contact area is located, and the specific height difference between the two can be flexibly set according to the application scenario. For example, the height difference between the plane where the functional area is located and the plane where the enclosure contact area is located can be set to be greater than 0 and less than or equal to one-fourth of the depth of the reflection cavity; of course, according to specific requirements, it can also be set to other values, such as the height difference can be set to be greater than 0 and less than or equal to one-fifth, one-sixth, or one-third of the depth of the reflection cavity, etc.

[0069] Optionally, in this embodiment, at least part of the connection transition area between the enclosure contact area and the functional area can also be in contact with the enclosure body, so as to increase the contact area between the substrate and the enclosure body, improve the strength of the bracket, and at the same time further extend the path for moisture to enter the functional area.

[0070] In this embodiment, the enclosure contact area and the connection transition area can be on the same plane or on different planes, and their types can be the same or different. And it should be understood that the enclosure contact area in this embodiment can also be several types of surfaces shown in Embodiment 2.

[0071] For example, in one example, refer to Figure 3-1 as shown, where 30 is the enclosure body, 31 is the substrate (which may be the positive substrate and / or the negative substrate), 311 is the functional area, 312 is the enclosure contact area, and 313 is the connection transition area. In Figure 3-1 the area of the enclosure contact area 312 is the inclined plane area where the front side of the substrate is in direct contact with the enclosure body 30, and the connection transition area 313 is the inclined plane area where the front side of the substrate is not in contact with the enclosure body 30. The connection transition area 313 and the enclosure contact area 312 form an inclined plane, that is, the two are on the same plane. Through the setting of the connection transition area 313, the path between the enclosure contact area 312 and the functional area 311 can be further increased, and the moisture-proof performance of the bracket can be improved.

[0072] Again, for example, in one example, refer to Figure 3-2As shown, the area of the enclosure contact area 312 is the planar area where the front side of the substrate directly contacts the enclosure body 30, and the connection transition area 313 is the inclined plane area on the front side of the substrate that connects the enclosure contact area 312 and the functional area 311. In Figure 3-2 In the example shown, a part of the connection transition area 313 also directly contacts the enclosure body 30. Therefore, while further increasing the path between the enclosure contact area 312 and the functional area 311, the strength of the bracket can be improved, that is, the moisture-proof performance and strength of the bracket can be improved simultaneously.

[0073] For another example, in one example, refer to Figure 3-3 As shown, the area of the enclosure contact area 312 is the planar area where the front side of the substrate directly contacts the enclosure body 30, and the connection transition area 313 is the arc surface area on the front side of the substrate that connects the enclosure contact area 312 and the functional area 311. This arc surface area is a convex arc surface area that protrudes outward from the outside of the substrate 31; in Figure 3-3 In the example shown, a part of the connection transition area 313 also directly contacts the enclosure body 30. Therefore, while further increasing the path between the enclosure contact area 312 and the functional area 311 to improve the moisture-proof performance, the strength of the bracket can be improved. Of course, in this embodiment, the connection transition area 313 can be not only a convex arc surface, but also a concave arc surface that concaves inward from the inside of the substrate 31. For example, refer to Figure 3-4 As shown, the figure shows a case where the connection transition area 313 of an example is a concave arc surface, and it can also increase the path between the enclosure contact area 312 and the functional area 311 to improve the moisture-proof performance while improving the strength of the bracket.

[0074] In addition, it should be understood that the connection transition areas 313 on the opposite sides of the front side of the substrate in this embodiment can also be set to the same type of surface or different types of surfaces. For example, refer to Figure 3-5 As shown, the connection transition area 313 on one side of the substrate is set to a convex arc surface, and the connection transition area 313 on the opposite side is set to a concave arc surface. The specific setting method can be flexibly determined according to the specific application scenario and the process adopted.

[0075] In this embodiment, the connection transition area can also be a combined surface, and this combined surface can include, but is not limited to, the combination of at least two of a plane, an inclined plane, and an arc surface.

[0076] For example, refer to Figure 3-6 As shown, the area of the enclosure contact area 312 is the planar area where the front side of the substrate directly contacts the enclosure body 30, and the connection transition area 313 is a combined surface of the combination of an inclined plane and an arc surface on the front side of the substrate that connects the enclosure contact area 312 and the functional area 311; for another example, refer to Figure 3-7 As shown, it is the same as Figure 3-6The difference of the shown bracket is that the connection transition area 313 is composed of the combination of two inclined surfaces and a plane connecting the two inclined surfaces; for another example, see Figure 3-8 as shown, it is different from Figure 3-6 and Figure 3-7 the shown bracket in that the connection transition area 313 is composed of the combination of an inclined surface, a plane and an arc surface connected in sequence. It can be seen that when the connection transition area 313 in this embodiment is a combined surface, the specific combination method can be set flexibly. And it should be understood that the enclosure contact area 312 in this embodiment can also be a combined surface, and can be a combined surface of the same type as the connection transition area 313, or a combined surface of a different type from the connection transition area 313.

[0077] In this embodiment, a connection transition area is further provided between the enclosure contact area and the functional area on the substrate, which can further increase the path between the enclosure contact area 312 and the functional area 311 to improve the moisture-proof performance; and optionally, at least part of the connection transition area can be set to contact the enclosure body to simultaneously increase the contact area between the substrate and the enclosure body, thereby improving the strength of the bracket.

[0078] Embodiment 4:

[0079] See Figures 1-1 to 1-2 as shown, in the existing LED bracket, the sides of the positive substrate 11 and the negative substrate 12 are both vertical surfaces. As Figure 1-2 shown, when moisture is relatively easy to spread along the joint between the side of the substrate and the plastic enclosure 10 to the front of the substrate, it is very easy to enter the functional area through the sides of the positive substrate 11 and the negative substrate 12 and the enclosure contact area, resulting in a short circuit in the circuit in the functional area, damage to the device or even directly causing the LED to die; and most of the functional areas of the substrate are plated with a silver metal layer, and the silver metal layer is also very easy to corrode under the action of moisture, causing functional defects. It can be seen that the existing LED bracket and the LED made by using this bracket have poor moisture-proof performance.

[0080] To solve the above problems, this embodiment also provides a highly reliable LED bracket. Among the positive substrate and the negative substrate, at least one of the substrates has at least one target side surface, and the surface path value of the target side surface in the height direction is greater than the side height value of the target side surface, and the target side surface is a non-planar surface. Compared with the existing setting where the side surface of the substrate is a vertical surface, the path of the side surface of the substrate can be extended, that is, the path for moisture to enter the functional area can be extended, thereby improving the moisture-proof performance of the LED bracket and the LED made by using this LED bracket, enhancing the reliability and durability of the LED, and enabling the LED to be better applicable to various environmental application scenarios.

[0081] In order to better improve the airtightness of the LED bracket and thus enhance its moisture-proof performance, in some examples, the above-mentioned target side surfaces can be provided on the side surfaces of both the positive electrode substrate and the negative electrode substrate. For example:

[0082] Example 1: At least one of the above-mentioned target side surfaces is provided on the side surface of the positive electrode substrate and the negative electrode substrate that contacts the surrounding wall body;

[0083] For example, when three side surfaces of the positive electrode substrate and the negative electrode substrate need to contact the surrounding wall body, and the two side surfaces in the width direction are opposite side surfaces, all three side surfaces can be set as the above-mentioned target side surfaces, or only the two opposite side surfaces among the three side surfaces can be set as the above-mentioned target side surfaces, or only one of the side surfaces can be set as the above-mentioned target side surface; specifically, which side surfaces are set as the above-mentioned target side surfaces can be selected according to requirements.

[0084] Example 2:

[0085] The side surfaces of the positive electrode substrate and the negative electrode substrate that contact the insulating isolation strip are set as the above-mentioned target side surfaces.

[0086] Example 3:

[0087] At least one of the above-mentioned target side surfaces is provided on the side surface of the positive electrode substrate and the negative electrode substrate that contacts the surrounding wall body, and the side surfaces of the positive electrode substrate and the negative electrode substrate that contact the insulating isolation strip are set as the above-mentioned target side surfaces.

[0088] In this embodiment, the target side surface can be any surface whose surface path value along the height direction is greater than the side surface height value of the target side surface, and the target side surface is a non-planar surface; for example, it can be a curved surface, and when it is a curved surface, the curved surface can be set as a regular arc-shaped curved surface or an irregular curved surface. Also, for example, in some examples, the target side surface can also be a combined surface, and the combined surface includes, but is not limited to, a combined surface obtained by combining at least two of a plane, an inclined plane, and an arc-shaped plane. And when it is a combined surface, it can also be a stepped combined surface including at least two of a plane, an inclined plane, and an arc-shaped plane combined to further extend the side surface path and improve the moisture-proof performance. For example, in one example, the stepped combined surface is composed of a horizontal plane, a vertical plane, and an arc-shaped plane connecting the horizontal plane and the vertical plane; or composed of multiple inclined planes, or composed of a horizontal plane or a vertical plane and an inclined plane, or composed of a vertical plane, an inclined plane, and an arc surface, or composed of a horizontal plane, an inclined plane, and an arc surface; the specific combination composition method can be set flexibly.

[0089] In one example of this embodiment, the width of the front surface of the positive electrode substrate and the negative electrode substrate can be set to be greater than the width of the back surface, so as to better prevent external moisture from entering the functional area through the side surface of the substrate, and it is also more conducive to the production and processing of the substrate and the LED bracket.

[0090] In this embodiment, the target side surface can be formed by, but not limited to, stamping, etching, cutting, etc.

[0091] In this embodiment, by setting the surface path value of at least one side surface of at least one of the positive electrode substrate and the negative electrode substrate to be greater than the side height value of this side surface, and this side surface is non-planar. Compared with the existing substrate side surface which is a vertical surface, the path of the substrate side surface can be extended, that is, the path for moisture to enter the functional area can be extended. Thus, the moisture-proof performance of the LED bracket and the LED manufactured using this LED bracket can be improved, the reliability and durability of the LED can be enhanced, enabling the LED to be better applicable to various environmental application scenarios and being more conducive to the popularization and use of the LED. And in this embodiment, the setting of the target side surface on the substrate side surface can be flexibly combined with the setting of the substrate front functional area in the first to third embodiments above to achieve the function of doubly extending the path for moisture to enter the functional area of the LED bracket and further improve the moisture-proof performance of the LED bracket.

[0092] Embodiment Five:

[0093] See Figures 1-1 to 1-2 As shown, in the existing LED bracket, the insulating isolation strip between the positive electrode substrate and the negative electrode substrate is perpendicular to the long side of the bracket and is arranged parallel to the positive electrode substrate and the negative electrode substrate; and the insulating isolation strip is made of a relatively fragile insulating material. Coupled with the narrow width of the insulating isolation strip, it is easy for the insulating isolation strip to break, reducing the overall strength and reliability of the LED bracket.

[0094] To solve this problem, in this embodiment, an LED bracket with a new structure is also provided. The cross-sectional profile of the insulating isolation strip of this LED bracket has two long sides that are arc-shaped sides, or are curved sides with at least one bend, or are broken-line sides with at least one bend, or are hypotenuse sides with an included angle greater than or equal to 10° and less than 90° with the short side of the negative electrode substrate. In this way, when the isolation strip is stressed, a part of the mechanical force can be transmitted to the positive electrode substrate, the negative electrode substrate, and the enclosure wall, so the strength of the insulating isolation strip can be increased.

[0095] Optionally, in this embodiment, the two long sides of the cross-sectional profile of the insulating isolation strip can be parallel or can be set to be non-parallel, and can be flexibly set according to requirements; for the sake of easy understanding, two examples of parallel setting and non-parallel setting are respectively described below in this embodiment.

[0096] Example of parallel setting:

[0097] See Figure 4-1 As shown, where 50 is the enclosure wall, 51 is the positive electrode substrate, 52 is the negative electrode substrate, and 53 is the insulating isolation area. In Figure 4-1 the dotted line is the short side of the negative electrode substrate 52. In Figure 4-1In [description], the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other are two parallel inclined sides with an included angle A with the short side of the negative substrate 52 being greater than or equal to 10° and less than 90°, that is Figure 4-1 the included angle A in [description] is greater than or equal to 10° and less than 90°, and the value of this included angle can be flexibly set according to at least one of the intensity requirements of the specific application scenario, the material used for the insulating isolation strip, the forming process, etc. For example, in one example, the value of the included angle A can be from 75° to 85°, such as the specific values being 75°, 78°, 80°, 83°, 85°, etc. In this way, when the insulating isolation strip 53 is subjected to mechanical force, a part of the mechanical force received can be transmitted to the positive substrate 51, the negative substrate 52, and the surrounding wall body 50, thereby enhancing the strength of the insulating isolation strip 53, and further enhancing the overall strength and reliability of the LED bracket.

[0098] In this embodiment, in addition to being inclined sides, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other can also be arc-shaped sides. For example, one setting is shown in Figure 4-2 As shown, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other are two parallel arc-shaped sides. The setting of the arc-shaped sides can also make it possible that when the insulating isolation strip 53 is subjected to mechanical force, a part of the mechanical force received is transmitted to the positive substrate 51, the negative substrate 52, and the surrounding wall body 50, enhancing the strength of the insulating isolation strip 53.

[0099] In this embodiment, in addition to being inclined sides and arc-shaped sides, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other can also be curved sides. For example, one setting is shown in Figure 4-3 As shown, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other are two parallel curved sides. The setting of the curved sides can also make it possible that when the insulating isolation strip 53 is subjected to mechanical force, a part of the mechanical force received is transmitted to the positive substrate 51, the negative substrate 52, and the surrounding wall body 50, enhancing the strength of the insulating isolation strip 53. In this embodiment, in addition to the number of bending points of the curved sides that can be flexibly set, for example, in addition to the curved sides shown in Figure 4-3 it can also be the curved sides shown in Figure 4-5 As shown, and of course, it can also be other forms of curved sides.

[0100] In this embodiment, in addition to being inclined sides, arc-shaped sides, and curved sides, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other can also be broken line sides with at least one bend. For example, one setting is shown in Figure 4-4 As shown, the two long sides of the cross-sectional profile of the insulating isolation strip 53 that are opposite to each other are two parallel broken line sides. The setting of the broken line sides can also make it possible that when the insulating isolation strip 53 is subjected to mechanical force, a part of the mechanical force received is transmitted to the positive substrate 51, the negative substrate 52, and the surrounding wall body 50, enhancing the strength of the insulating isolation strip 53. In this embodiment, in addition to the number of bending points of the broken line sides that can be flexibly set, for example, in addition to Figure 4-4In addition to the broken line edges shown, it can also be Figure 4-6 the broken line edges shown. Of course, it can also be other forms of broken line edges.

[0101] Non - parallel setting example:

[0102] See Figure 5-1 as shown, where 60 is the enclosure wall, 61 is the positive electrode substrate, 62 is the negative electrode substrate, and 63 is the insulation isolation area. In Figure 5-1 , the two long sides of the cross - sectional profile of the insulation isolation strip 63 that are opposite to each other are the short sides of the negative electrode substrate 52, and these two hypotenuse sides are not parallel. In this way, when the insulation isolation strip 63 is subjected to mechanical force, a part of the mechanical force received can be transmitted to the positive electrode substrate 61, the negative electrode substrate 62, and the enclosure wall 60, thereby enhancing the strength of the insulation isolation strip 63, and further enhancing the overall strength and reliability of the LED bracket.

[0103] In this embodiment, in addition to being hypotenuse sides, the two long sides of the cross - sectional profile of the insulation isolation strip 63 that are opposite to each other can also be arc - shaped edges. For example, one setting is shown in Figure 5-2 as shown, the two long sides of the cross - sectional profile of the insulation isolation strip 63 that are opposite to each other are two non - parallel arc - shaped edges. The setting of the non - parallel arc - shaped edges can also make it possible that when the insulation isolation strip 63 is subjected to mechanical force, a part of the mechanical force received is transmitted to the positive electrode substrate 61, the negative electrode substrate 62, and the enclosure wall 60, enhancing the strength of the insulation isolation strip 63.

[0104] In this embodiment, in addition to being hypotenuse sides, arc - shaped edges, the two long sides of the cross - sectional profile of the insulation isolation strip 63 that are opposite to each other can also be curved edges. For example, one setting is shown in Figure 5-3 as shown, the two long sides of the cross - sectional profile of the insulation isolation strip 63 that are opposite to each other are two non - parallel curved edges. The setting of the two non - parallel curved edges can also make it possible that when the insulation isolation strip 63 is subjected to mechanical force, a part of the mechanical force received is transmitted to the positive electrode substrate 61, the negative electrode substrate 62, and the enclosure wall 60, enhancing the strength of the insulation isolation strip 63.

[0105] In this embodiment, in addition to being hypotenuse sides, arc - shaped edges, and curved edges, the two long sides of the cross - sectional profile of the insulation isolation strip 63 that are opposite to each other can also be broken line edges with at least one bend. For example, one setting is shown in Figure 5-4 as shown, the two long sides of the cross - sectional profile of the insulation isolation strip 63 that are opposite to each other are two non - parallel broken line edges. The setting of the two non - parallel broken line edges can also make it possible that when the insulation isolation strip 63 is subjected to mechanical force, a part of the mechanical force received is transmitted to the positive electrode substrate 61, the negative electrode substrate 62, and the enclosure wall 60, enhancing the strength of the insulation isolation strip 63.

[0106] In this embodiment, two opposite long sides of the cross-sectional profile of the insulating isolation strip are set as arc-shaped sides, or curved sides, or broken-line sides, or beveled sides with an included angle greater than or equal to 10° and less than 90° with the short side of the negative substrate. When the isolation strip is stressed, part of the mechanical force can be transmitted to the positive substrate, the negative substrate, and the surrounding wall body, so the strength of the insulating isolation strip can be increased, and the overall strength and reliability of the LED bracket and the LED manufactured using the bracket can be improved.

[0107] Embodiment Six:

[0108] This embodiment provides an LED, which includes the LED bracket as shown in each of the above embodiments, and further has at least one LED chip. The LED chip is disposed on the positive substrate and / or the negative substrate, and the positive pin and the negative pin of the LED chip are electrically connected to the positive substrate and the negative substrate respectively.

[0109] It should be understood that the color of the light emitted by the LED provided in this embodiment and presented to the user can be flexibly set according to actual needs and application scenarios. The color of the light emitted by the LED can be flexibly controlled by, but not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED includes a light-emitting conversion layer, and the type of the light-emitting conversion layer when the LED includes a light-emitting conversion layer.

[0110] In an example of this embodiment, the LED may further include a lens glue layer or a diffusion glue layer disposed on the LED chip (when there is a light-emitting conversion glue layer on the LED chip, it is disposed on the light-emitting conversion glue layer).

[0111] It should be understood that, in an example, the light-emitting conversion glue layer can be a fluorescent glue layer containing phosphor, or a colloid containing quantum dot light-emitting materials, or other light-emitting conversion glues or films that can achieve light-emitting conversion, and can also include diffusion powder or silicon powder, etc. according to needs; in this embodiment, the methods of forming the light-emitting conversion glue layer, the lens glue layer, or the diffusion glue layer on the LED chip include but are not limited to dispensing, molding, spraying, pasting, etc.

[0112] For example, the light-emitting conversion layer can include a phosphor glue layer, a fluorescent film, or a quantum dot QD film; the phosphor glue layer and the fluorescent film can be made of inorganic phosphors, which can be inorganic phosphors doped with rare earth elements. Among them, the inorganic phosphors include but are not limited to at least one of silicate, aluminate, phosphate, nitride, and fluoride phosphors.

[0113] For another example, the quantum dot QD film can be made of quantum dot phosphors; the quantum dot phosphors include, but are not limited to, at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd(SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI3.

[0114] In this embodiment, the type of light emitted by the LED chip itself can be visible light visible to the naked eye, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a light conversion layer can be provided on the LED chip to convert the invisible light into visible light visible to the naked eye, so that the light emitted by the LED is visible to the user. For example, when the light emitted by the LED chip itself is ultraviolet light, if the LED is to emit white light visible to the user, the light conversion layer can be made by mixing red, green, and blue phosphors.

[0115] This embodiment also provides a light-emitting device, which includes the LED shown in the above embodiment. The light-emitting device in this embodiment can be a lighting device, a light signal indicating device, a supplementary lighting device, or a backlight device, etc. When it is a lighting device, it can specifically be a lighting device applied to various fields, such as table lamps, fluorescent lamps, ceiling lamps, downlights, street lamps, projection lamps, etc. in daily life, and also, for example, high beam lights, low beam lights, and ambient lights in automobiles, and also, for example, surgical lights, low electromagnetic lighting lamps, and lighting lamps for various medical instruments in the medical field, and also, for example, various colored lights, landscape lighting lamps, and advertising lights in the field of decorative lighting; when it is a light signal indicating device, it can specifically be a light signal indicating device applied to various fields, such as signal indicator lights in the transportation field, various signal status indicator lights on communication devices in the communication field, and various indicator lights on vehicles; when it is a supplementary lighting device, it can be a supplementary lighting lamp in the photography field, such as a flash lamp and a supplementary lighting lamp, or it can also be a plant supplementary lighting lamp for supplementing light to plants in the agricultural field; when it is a backlight device, it can be a backlight module applied to various backlight fields, such as being applicable to mobile terminals such as monitors, televisions, mobile phones, and advertising machines.

[0116] It should be understood that the above applications are only several applications exemplified in this embodiment, and it should be understood that the applications of the LED are not limited to the several fields exemplified above.

[0117] The above content is a further detailed description of the embodiments of the present invention in combination with specific implementation manners. It cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, and all should be regarded as belonging to the protection scope of the present invention.

Claims

1. A highly-sealed LED bracket, characterized in that, It includes a positive electrode substrate, a negative electrode substrate and an insulating isolation strip. The insulating isolation strip is located between the positive electrode substrate and the negative electrode substrate to insulate and isolate the two. It also includes an insulating enclosure wall that encloses the positive electrode substrate, the negative electrode substrate and the insulating isolation strip. The front sides of the positive electrode substrate and the negative electrode substrate have a functional area, an enclosure wall contact area that is in direct contact with the enclosure wall body, and a connection transition area connected between the functional area and the enclosure wall contact area. A part of the connection transition area is in contact with the enclosure wall body, and the other part is not in contact with the enclosure wall body; For at least one of the positive electrode substrate and the negative electrode substrate, the plane where the functional area is located is higher than the plane where the connection transition area is located, and the plane where the connection transition area is located is higher than the plane where the enclosure wall contact area is located.

2. The highly-sealed LED bracket according to claim 1, wherein The functional areas and the enclosure wall contact areas of the positive electrode substrate and the negative electrode substrate are not in the same plane.

3. The highly-sealed LED bracket according to claim 1 or 2, characterized in that, The enclosure wall contact area is directly connected to the functional area.

4. The highly-sealed LED bracket according to claim 1 or 2, wherein There is also a connection transition area between the functional area and the enclosure wall contact area of at least one of the positive electrode substrate and the negative electrode substrate.

5. The highly-sealed LED bracket according to claim 4, wherein, The connection transition area is an inclined plane, an arc surface, or a combined surface, and the combined surface is a combination of at least two of a plane, an inclined plane, and an arc surface.

6. The highly-sealed LED bracket according to claim 4, wherein At least part of the connection transition area is in contact with the enclosure wall body.

7. The highly-sealed LED bracket according to claim 4, wherein The functional areas of the positive electrode substrate and the negative electrode substrate are located at the bottom of the reflection cavity formed by the enclosure wall body; the height difference between the plane where the functional area is located and the plane where the enclosure wall contact area is located is greater than 0 and less than or equal to one-fourth of the depth of the reflection cavity.

8. The highly-sealed LED bracket according to claim 1 or 2, characterized in that, For the cross-sectional profile of the insulating isolation strip, the two opposite long sides are arc-shaped sides, or curved sides with at least one bend, or broken line sides with at least one fold, or hypotenuse sides with an included angle of greater than or equal to 10° and less than 90° with the short side of the negative electrode substrate.

9. The highly-sealed LED bracket according to claim 8, wherein The two opposite long sides of the cross-sectional profile of the insulating isolation strip are parallel to each other.

10. An LED, characterized in that, It includes a high-sealing LED bracket as described in any one of claims 1-9 and at least one LED chip. The LED chip is arranged on the positive electrode substrate and / or the negative electrode substrate, and the positive electrode pin and the negative electrode pin of the LED chip are electrically connected to the positive electrode substrate and the negative electrode substrate respectively.

11. A light-emitting device, characterized in that, It includes an LED as described in claim 10, and the light-emitting device is a lighting device, a light signal indicating device, a supplementary lighting device or a backlight device.

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