Display device including display unit having recessed shape

Abstract

Disclosed is a display device including a substrate including a first recessed portion recessed inward along one side of the substrate, a first pad group and a second pad group separated from each other on the substrate along the one side, a display unit located on the substrate and having a shape recessed inward between the first pad group and the second pad group, an encapsulation layer encapsulating the display unit, a first wiring film including a third pad group connected to the first pad group, and a second wiring film including a fourth pad group connected to the second pad group. The first wiring film and the second wiring film are bent from a first surface of the substrate toward a second surface of the substrate opposite the first surface of the substrate, and the second wiring film is separated from the first wiring film.

Description

[0001] This application claims the benefit and priority of Korean Patent Application No. 10-2018-0106748, filed on September 6, 2018, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] One or more embodiments of this disclosure relate to a display device, and more specifically, to a display device including display units having a recessed shape. Background Technology

[0003] The demand for large screens in portable display devices, including display units (such as mobile phones, tablet PCs, game consoles, etc.), is growing.

[0004] At the same time, in order to meet the various needs of consumers, it is necessary to provide or install peripheral components or devices such as camera modules, speakers and sensors on the display unit of portable display devices to extend and support the features of the display devices. Summary of the Invention

[0005] This disclosure provides a display device including a display unit with a recessed shape. The display unit has a form factor that allows for easy provision of multiple components, particularly for display units with large screens.

[0006] One or more embodiments of this disclosure include a display device on which various components can be mounted to achieve a large screen. However, it should be understood that the embodiments described herein should be considered in a descriptive sense only and are not intended to limit the scope of this disclosure.

[0007] Additional aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of the exemplary embodiments presented herein.

[0008] According to one or more embodiments, a display device includes: a substrate including a first recessed portion recessed inward along one side of the substrate; a first pad assembly and a second pad assembly spaced apart from each other on the substrate along said side; a display unit located on the substrate and having a shape recessed inward between the first pad assembly and the second pad assembly; an encapsulation layer encapsulating the display unit; a first wiring film including a third pad assembly connected to the first pad assembly, the first wiring film bending from a first surface of the substrate toward a second surface of the substrate opposite to the first surface of the substrate; and a second wiring film including a fourth pad assembly connected to the second pad assembly, the second wiring film bending from the first surface of the substrate toward the second surface of the substrate and spaced apart from the first wiring film.

[0009] The display device may also include: a flexible printed circuit board connected to the first wiring film and the second wiring film.

[0010] Flexible printed circuit boards may include integrated circuit chips stacked with display units.

[0011] The encapsulation layer may include at least one inorganic layer and at least one organic layer.

[0012] The encapsulation layer may include at least one inorganic layer and at least one organic layer. The outermost layer of the encapsulation layer may be an inorganic layer, and the inorganic layer may cover the side surface of the at least one organic layer.

[0013] The encapsulation layer may include at least one inorganic layer and at least one organic layer, the outermost layer of the encapsulation layer may be an inorganic layer, and the inorganic layer may cover the side surface of the substrate in which the first recessed portion is disposed.

[0014] The dummy pixels used for testing can be arranged along the first recessed portion on the outside of the display unit.

[0015] The first grounding portion grounded to the first wiring film and the second grounding portion grounded to the second wiring film can be respectively arranged on the first wiring film and the second wiring film.

[0016] A transparent substrate can be placed on the encapsulation layer.

[0017] The black matrix can be arranged on a transparent substrate at a position corresponding to the outside of the display unit.

[0018] The first opening can be set in the black matrix at a position corresponding to the first recessed portion.

[0019] The second opening can be placed in a transparent substrate at the position corresponding to the first opening.

[0020] The display device may also include a polarizing film located between the encapsulation layer and the transparent substrate.

[0021] The display device may also include an adhesive film located between the polarizing film and the transparent substrate.

[0022] The display device may also include a filler material separated from the adhesive film and surrounding the periphery of the display unit, the filler material being located between the substrate and the transparent substrate.

[0023] The display device may also include a cover panel disposed on a second surface of the substrate and comprising a cushioning material.

[0024] The end of the cover panel can coincide with the end of the base at the first recessed portion.

[0025] The end of the cover panel may protrude further outward from the display unit than the end of the base at the first recessed portion.

[0026] Each of the first and second pad groups may include multiple pad lines with diagonal lines, such that the multiple pad lines are symmetrical about the center of the first recess.

[0027] Each of the third and fourth pad groups may include multiple pad lines with diagonal lines, such that the multiple pad lines are symmetrical about the center of the first recess.

[0028] The maximum depth from the edge of the curved area of ​​the first wiring film and the second wiring film to the flexible printed circuit board can be equal to or greater than the maximum depth from the edge of the curved area of ​​the first wiring film and the second wiring film to the first recessed portion.

[0029] The flexible printed circuit board may include a second recess that faces the first recess and is recessed inward between the first wiring film and the second wiring film.

[0030] The distance from one end of the first wiring film to the flexible printed circuit board can be equal to or greater than the distance from the end of the first recessed portion of the substrate to the end of the substrate.

[0031] According to one or more embodiments, a display device includes: a substrate including a first recessed portion recessed inward along one side of the substrate; a first pad group and a second pad group spaced apart from each other on the substrate along said side; a display unit located on the substrate and having an inwardly recessed shape between the first pad group and the second pad group; an encapsulation layer encapsulating the display unit; a first wiring film including a third pad group connected to the first pad group, the first wiring film bending from a first surface of the substrate to a second surface of the substrate opposite to the first surface of the substrate; a second wiring film including a fourth pad group connected to the second pad group, the second wiring film bending from the first surface of the substrate to the second surface of the substrate; and a first connecting wiring film connecting the first wiring film to the second wiring film and located between the third pad group and the fourth pad group.

[0032] The display device may further include a second connecting wiring film disposed at a position facing the first connecting wiring film, wherein the first wiring film and the second wiring film, as well as the first connecting wiring film and the second connecting wiring film, may form through holes. Attached Figure Description

[0033] These and / or other aspects will become apparent and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, in which:

[0034] Figures 1A to 1C This is a plan view of the process of connecting a substrate to a wiring film in a display device according to an embodiment;

[0035] Figure 2 It is along Figure 1C A cross-sectional view of a portion of the display device taken by lines A1-A2;

[0036] Figure 3 It is along Figure 1C A cross-sectional view of a portion of the display device taken by lines B1-B2;

[0037] Figure 4 yes Figure 1A A partial sectional view of IV;

[0038] Figures 5A to 5C It is a plan view comparing the display area of ​​the display device according to the embodiment with the display area of ​​a comparative display device;

[0039] Figure 6 This is a cross-sectional view of a portion of a display device according to another embodiment;

[0040] Figure 7 This is a cross-sectional view of a portion of a display device according to another embodiment;

[0041] Figure 8 This is a plan view showing the wiring of the first and second pad groups, as well as the third and fourth pad groups according to an embodiment, including diagonal wiring;

[0042] Figure 9 This is a plan view of a portion of a display device according to another embodiment;

[0043] Figure 10 This is a plan view of a portion of a display device according to another embodiment;

[0044] Figure 11 This is a plan view of a portion of a display device according to another embodiment;

[0045] Figure 12 This is a plan view of a portion of a display device according to another embodiment;

[0046] Figure 13 This is a plan view of a portion of a display device according to another embodiment;

[0047] Figure 14 This is a plan view of a portion of a display device according to another embodiment;

[0048] Figure 15 This is a cross-sectional view of a portion of a display device according to another embodiment;

[0049] Figure 16A and Figure 16B This is a plan view of a portion of a display device according to another embodiment;

[0050] Figure 17 It is a view of the various shapes of the first recessed portion; and

[0051] Figure 18It is a view of the various shapes of the second recessed portion. Detailed Implementation

[0052] Because this disclosure allows for various modifications and numerous embodiments, exemplary embodiments will be shown in the accompanying drawings and described in detail in the written description. The effects and features of this disclosure, as well as one or more methods for achieving these effects and features, will become apparent when referring to the exemplary embodiments described with reference to the accompanying drawings. However, this disclosure may be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein.

[0053] In the following description, the present disclosure will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the present disclosure are illustrated. When describing with reference to the accompanying drawings, the same reference numerals in the drawings denote the same or corresponding elements, and repeated descriptions thereof will be omitted.

[0054] As used herein, the term “and / or” can include any and all combinations of one or more of the relevant listed items.

[0055] When a statement such as “at least one of…” follows a column of elements, it can modify the entire column of elements, but not individual elements in that column.

[0056] It will be understood that when a layer, region, or component is referred to as "formed (located, arranged, positioned, positioned, etc.) on" another layer, region, or component, that layer, region, or component may be formed (located, arranged, positioned, positioned, etc.) directly or indirectly on said other layer, region, or component. That is, for example, one or more intermediate layers, regions, or components may exist. For ease of explanation, the dimensions of the elements in the figures may be exaggerated. In other words, because the dimensions and thicknesses of the components in the figures may be arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0057] Figures 1A to 1C This is a plan view of the process of connecting the substrate 10 to the wiring film 80 in the display device 1 according to the embodiment. Figure 2 It is along Figure 1C A cross-sectional view of a portion of the display device 1 taken by lines A1-A2. Figure 3 It is along Figure 1C A cross-sectional view of a portion of the display device 1 taken by lines B1-B2. Figure 4 yes Figure 1A A sectional view of part IV.

[0058] Reference Figures 1A to 4According to an embodiment, the display device 1 includes: a substrate 10 including a first recessed portion IP1 recessed inwardly along one side of the substrate 10; a first pad (or "solder pad") group 11 and a second pad group 12 arranged on the substrate 10 and spaced apart from each other along one side of the substrate 10; a display unit 20 having a shape recessed inwardly between the first pad group 11 and the second pad group 12; an encapsulation layer 30 encapsulating the display unit 20; a third pad group 81 connected to the first pad group 11; a first wiring film 80-1; a fourth pad group 82 connected to the second pad group 12; and a second wiring film 80-2 separated from the first wiring film 80-1. The first wiring film 80-1 and the second wiring film 80-2 may be collectively referred to as wiring film 80. (Refer to...) Figure 1B and Figure 1C The first wiring film 80-1 and the second wiring film 80-2 bend from one side of the substrate 10 to the other side of the substrate 10.

[0059] The substrate 10 may include various materials such as glass, metal, or plastic. For example, the substrate 10 may include a flexible substrate comprising, but not limited to, polymer resins such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), and cellulose acetate propionate (CAP).

[0060] The substrate 10 includes a first recessed portion IP1 recessed inward from one side of the substrate 10 into the inner side of the substrate 10. The first recessed portion IP1 can be formed by cutting the substrate 10 using, for example, a cutting process using a laser beam.

[0061] Components 110 that can provide one or more features of the display device 1 may be arranged in the first recessed portion IP1 of the substrate 10. Examples of components 110 include, but are not limited to, a camera module 111, a speaker 112, and a sensor 113. Here, components 110 collectively refer to one or more of the camera module 111, the speaker 112, and the sensor 113, as well as any other components that may be arranged in the first recessed portion IP1 of the substrate 10. Examples of sensors 113 include, but are not limited to, proximity sensors, illuminance sensors, accelerometers, and biosensors.

[0062] The first pad group 11 and the second pad group 12 are arranged to be spaced apart from each other on the substrate 10. For example, the first pad group 11 and the second pad group 12 are arranged on two opposite sides of the region in which the first recessed portion IP1 is formed.

[0063] Each of the first pad group 11 and the second pad group 12 includes multiple wirings containing conductive material. Each of the first pad group 11 and the second pad group 12 can be connected to various wirings (not shown), such as scan lines, data lines and power lines, arranged in a plurality of pixels (not shown) in the display unit 20, and can transmit signals to the display unit 20.

[0064] Display unit 20 may include a plurality of pixels (not shown) capable of displaying images. Each pixel may include a display element such as an organic light-emitting diode, a liquid crystal element, an electrophoretic element, and a micro-inorganic light-emitting diode. This embodiment provides a display element including an organic light-emitting diode OLED (see [link to OLED display]). Figure 4 A display device that serves as an example of a display element.

[0065] In this embodiment, the display unit 20 includes a display screen having a recessed shape on at least one side, which differs from a quadrilateral display screen in which all four sides are substantially straight. The first recessed portion IP1 has a predetermined shape and dimensions (e.g., width and height) measured from the edge of the display unit 20.

[0066] An encapsulation layer 30 is disposed on the display unit 20. The encapsulation layer 30 is wider than the display unit 20 to cover the edge of the display unit 20 and to prevent external impurities from penetrating into the display unit 20.

[0067] The first pad group 11 and the second pad group 12 of the substrate 10 are respectively aligned with the third pad group 81 of the first wiring film 80-1 and the fourth pad group 82 of the second wiring film 80-2 (see...). Figure 1A And they are connected to each other (see) Figure 1B After that, each of the first wiring film 80-1 and the second wiring film 80-2 bends from one side of the substrate 10 to the other side of the substrate 10 (see...). Figure 1C ).

[0068] Each of the first wiring film 80-1 and the second wiring film 80-2 may include a flexible resin such as polyimide resin and epoxy resin to facilitate bending. Each of the third pad group 81 of the first wiring film 80-1 and the fourth pad group 82 of the second wiring film 80-2 may include multiple wirings containing conductive material.

[0069] A conductive bonding layer (not shown), such as an anisotropic conductive film, can be disposed between the first pad group 11 of the substrate 10 and the third pad group 81 of the first wiring film 80-1, and between the second pad group 12 of the substrate 10 and the fourth pad group 82 of the second wiring film 80-2. The substrate 10 is physically bonded to the first wiring film 80-1 and the second wiring film 80-2 by pressure and electrically connected to the first wiring film 80-1 and the second wiring film 80-2.

[0070] In this embodiment, the first wiring film 80-1 and the second wiring film 80-2 have a length LH0 and are separated from each other.

[0071] The fifth pad group 83 is arranged on the side of the first wiring film 80-1 facing the third pad group 81, and the sixth pad group 84 is arranged on the side of the second wiring film 80-2 facing the fourth pad group 82.

[0072] The first wiring film 80-1 and the second wiring film 80-2 can be connected to the flexible printed circuit board 90 through the fifth pad group 83 and the sixth pad group 84, respectively.

[0073] The first wiring film 80-1 and the second wiring film 80-2 may comprise materials more flexible than the material of the flexible printed circuit board 90, and may be formed thinner than the flexible printed circuit board 90 to reduce bending stress.

[0074] Because the first wiring film 80-1 and the second wiring film 80-2 are separated from each other and the first recessed portion IP1 is located between the first wiring film 80-1 and the second wiring film 80-2, when the first wiring film 80-1 and the second wiring film 80-2 are connected to the substrate 10 and then bent, the first wiring film 80-1 and the second wiring film 80-2 do not interfere with the space in which the component 110 is arranged.

[0075] Reference Figure 1B and Figure 3 The maximum depth H1 measured from edge L0 to flexible printed circuit board 90 can be equal to or greater than the maximum depth H21 measured from edge L0 to end of cover panel 70. For example... Figure 1C , Figure 2 and Figure 3 As shown, edge L0 refers to the outer edge of the first wiring film 80-1 and the second wiring film 80-2 when the first wiring film 80-1 and the second wiring film 80-2 are bent to connect to the cover panel 70 formed on the substrate 10.

[0076] Reference Figure 3 The end of the cover panel 70 may protrude further from the first recessed portion IP1 toward the outer edge of the display device 1 than the end of the base 10. The end of the cover panel 70 does not need to have the same shape as the first recessed portion IP1. Because the end of the cover panel 70 protrudes further toward the outer edge of the display device 1 than the end of the base 10, the cover panel 70 stably supports the base 10 when the first wiring film 80-1 is bonded to the base 10.

[0077] In this embodiment, the maximum depth H1 measured from edge L0 to flexible printed circuit board 90 can be equal to or greater than the maximum depth H21 measured from edge L0 to end of cover panel 70. Component 110 (see...) Figure 1CIt can be arranged in the space between the edge L0 and the end of the cover panel 70.

[0078] The integrated circuit chip 100 is mounted on the flexible printed circuit board 90. The integrated circuit chip 100 can be arranged on the rear side of the substrate 10, separated from the first recessed portion IP1. Therefore, even when the first wiring film 80-1 and the second wiring film 80-2 are bent, the integrated circuit chip 100 is arranged away from the first recessed portion IP1 in the plan view to overlap with the display unit 20 without obstructing the space where the components 110 can be arranged.

[0079] The integrated circuit chip 100 may include at least one of a scan driver circuit chip, a data driver circuit chip, and a power driver circuit chip.

[0080] Multiple wirings (not shown) can be arranged between the integrated circuit chip 100 and the third pad group 81 and the fourth pad group 82 to transmit the signals of the integrated circuit chip 100 to the display unit 20 through the first pad group 11 and the second pad group 12.

[0081] A cover panel 70 supporting the substrate 10 can be disposed on the rear side of the substrate 10. The first wiring film 80-1 and the second wiring film 80-2 are bent to connect the flexible printed circuit board 90 to the rear side of the cover panel 70.

[0082] The cover panel 70 may include a buffer strip layer (not shown) that absorbs impacts to the rear side of the substrate 10 and a black strip layer (not shown) that prevents light from leaking from the rear side of the substrate 10.

[0083] Figure 4 It is a cross-sectional view of the structure of the base 10, display unit 20, encapsulation layer 30 and cover panel 70 surrounding the first recessed portion IP1.

[0084] In embodiments where the display unit 20 includes an organic light-emitting diode (OLED), the encapsulation layer 30 includes a plurality of thin layers 31, 33, and 35.

[0085] A first thin-film transistor (TFT) 1, comprising a semiconductor layer 312, a gate electrode 14, a source electrode 16a, and a drain electrode 16b, is disposed on a substrate 10.

[0086] A buffer layer 311 is disposed between the substrate 10 and the semiconductor layer 312, and a gate insulating layer 13 is disposed between the semiconductor layer 312 and the gate electrode 14. An interlayer insulating layer 15 is disposed between the gate electrode 14 and the source electrode 16a and the drain electrode 16b, and a planarization layer 17 covers the interlayer insulating layer 15, the source electrode 16a, and the drain electrode 16b.

[0087] Each of the buffer layer 311, the gate insulating layer 13, and the interlayer insulating layer 15 may comprise an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. The planarization layer 17 may comprise an inorganic layer and / or an organic layer.

[0088] supply Figure 4 The structure of the first thin-film transistor TFT1 and the structure and materials of the insulating layers (e.g., gate insulating layer 113 and interlayer insulating layer 15) shown are examples to which this disclosure applies. It should be noted that this disclosure is not limited to... Figure 4 The structure and insulating layer of the first thin-film transistor TFT1 are shown in the figure.

[0089] The first thin-film transistor TFT1 serves as a driving transistor and is connected to the pixel electrode 21 to transmit driving signals. The end of the pixel electrode 21 is surrounded by a pixel defining layer 18, which may include an organic insulating layer. The pixel defining layer 18 can prevent electric arcing at the end of the pixel electrode 21.

[0090] The second thin-film transistor TFT2 can be used as a transistor for testing the performance of a device, rather than as a driving transistor. The second thin-film transistor TFT2 can have the same structure as the first thin-film transistor TFT1.

[0091] An intermediate layer (not shown) including the organic emission layer 22 may be disposed on the pixel electrode 21. The organic emission layer 22 may comprise a low-molecular-weight organic emission material or a polymeric organic emission material. If the organic emission layer 22 comprises a low-molecular-weight material, the intermediate layer may further comprise at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. If the organic emission layer 22 comprises a polymeric material, the intermediate layer may further comprise a hole transport layer.

[0092] The counter electrode 23, which is commonly disposed on multiple pixels PXL1 and PXL2, can be arranged on the organic emission layer 22.

[0093] An organic light-emitting diode (OLED), comprising a pixel electrode 21, an organic emitting layer 22, and a counter electrode 23, is a self-emissive display element that emits light when excitons descend from an excited state to a ground state. Excitons are generated when holes injected from the hole injection electrode and electrons injected from the electron injection electrode combine in the organic emitting layer 22. Because OLEDs can be constructed to be lightweight and thin, the display device 1 comprising an OLED can be used in a portable display device.

[0094] exist Figure 4In the display unit 20, the first pixel PXL1, which is arranged near the inner side, corresponds to a pixel in the display area that emits light based on the above-described operating rules, and displays an image of the display device 1. Conversely, the second pixel PXL2, which is arranged from the edge of the substrate 10 near the first recessed portion IP1, may be a dummy pixel that does not display an image.

[0095] The second thin-film transistor TFT2 can be connected to the second pixel PXL2. The dummy pixel can be used for signal testing, aging testing, etc., and can also be used as a barrier or buffer to reduce defects in the display device 1.

[0096] Because the second pixel PXL2 will be damaged when the first recessed portion IP1 is cut, the second pixel PXL2 can be used as a space for testing or as a barrier or buffer to reduce potential damage, rather than as a pixel for displaying an image.

[0097] The encapsulation layer 30 of the encapsulated display unit 20 may include multiple thin film layers. For example, in this embodiment, the encapsulation layer 30 may have a structure in which a first inorganic layer 31, a first organic layer 33, and a second inorganic layer 35 are sequentially stacked. The encapsulation layer 30 is not limited to this example which includes three layers, and may include at least one inorganic layer and at least one organic layer. Various modifications may be made to the encapsulation layer 30 without departing from the scope of this disclosure.

[0098] The first inorganic layer 31 and the second inorganic layer 35 may comprise silicon oxide, silicon nitride, and / or silicon oxynitride. The first organic layer 33 may comprise at least one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, polyacrylate, and hexamethyldisiloxane (HMDSO).

[0099] The first inorganic layer 31 can be bent according to the underlying structure, and the surface of the first inorganic layer 31 is uneven. The first organic layer 33 can be used to planarize the top surface of the encapsulation layer 30 by covering the uneven first inorganic layer 31. The second inorganic layer 35 covers the first organic layer 33.

[0100] As described above, when cracks occur inside the encapsulation layer 30, cracks occurring between the first inorganic layer 31 and the first organic layer 33, and between the first organic layer 33 and the second inorganic layer 35, can pass through the multilayer structure of the encapsulation layer 30 without connecting to each other. Therefore, the multilayer structure of the encapsulation layer 30 can prevent or reduce the formation of external moisture or impurities such as oxygen through its path into the display unit 20.

[0101] Furthermore, the outermost layer of the encapsulation layer 30 (e.g., the second inorganic layer 35) can be made of an inorganic material to prevent the propagation of external moisture. In this example, the ends of the first organic layer 33 can be covered by the second inorganic layer 35. Figure 4 An example is shown in which the second inorganic layer 35 covers the side surface of the substrate 10 along the periphery of the first recessed portion IP1.

[0102] Therefore, according to this embodiment, when the first recessed portion IP1 is formed, by arranging dummy pixels PXL2 at the portion of the display unit 20 adjacent to the first recessed portion IP1, one or more pixels of the displayed image are not directly exposed to the cut surface of the substrate 10. Furthermore, the encapsulation layer 30 includes at least one inorganic layer and at least one organic layer, with the outermost layer of the encapsulation layer 30 comprising the inorganic layer and covering the ends of the organic layer of the encapsulation layer 30. Therefore, the outermost inorganic layer of the encapsulation layer 30 covers the ends of the organic layer of the encapsulation layer 30 to prevent the organic layer from being directly exposed during the cutting process, and thus prevents moisture from propagating through the side surface of the substrate 10 even after the cutting process.

[0103] Figures 5A to 5C This is a plan view comparing the display area of ​​the display device 1 according to the embodiment with the display area of ​​a comparative display device.

[0104] Figure 5A A display device according to the first comparative example is shown. Figure 5A In the display device, components 110 (such as camera module 111, speaker 112 and sensor 113) that provide one or more features of the display device are arranged at the upper end of the substrate 10, and wiring film 80 on which integrated circuit chip 100 is mounted is arranged at the lower end of the substrate 10.

[0105] The approximate display area of ​​the display device according to the comparative example is a first region D1 excluding the upper and lower ends of the substrate 10.

[0106] Although the first region D1 can correspond to the region of the display unit 20 disposed inward from the substrate 10, the substrate 10 is used for the purpose of explaining the difference in display regions between the following comparative examples.

[0107] Figure 5B A display device according to the second comparative example is shown. Figure 5B In the display device, a first recessed portion IP1 is formed at the upper end of the substrate 10, and components 110 (such as a camera module 111, a speaker 112, and a sensor 113) providing one or more features of the display device are arranged in a cut space of the substrate 10 (e.g., the first recessed portion IP1). Figure 5AThe first comparative example is similar, including an integrated circuit chip 100 with a wiring film 80 disposed at the lower end of the substrate 10.

[0108] according to Figure 5B The approximate display area of ​​the display device in the second comparative example is the sum of the first area D1 and the second area D2 at the upper end of the substrate 10, excluding the first recessed portion IP1. Therefore, compared with... Figure 5A Compared to the display area of ​​the first comparative example display device, according to Figure 5B The display area of ​​the display device in the second comparative example has been increased.

[0109] Figure 5C A display device 1 according to this embodiment is shown. Figure 5C In the display device 1, a first wiring film 80-1 and a second wiring film 80-2, separated from each other, are arranged at the upper end of the substrate 10. Components 110 that can provide one or more features of the display device 1 (such as a camera module 111, a speaker 112, and a sensor 113) are arranged in a cut space (e.g., a first recessed portion IP1) formed by the flexible printed circuit board 90 and the first wiring film 80-1 and the second wiring film 80-2 in the substrate 10. In addition, the first wiring film 80-1, the second wiring film 80-2, and the flexible printed circuit board 90 including the integrated circuit chip 100 are arranged at the upper end of the substrate 10.

[0110] therefore, Figure 5C The approximate display area of ​​the display device 1 is the sum of the first area D1, the second area D2 excluding the first recessed portion IP1 at the upper end of the substrate 10, and the third area D3 extending from the lower end of the substrate 10. Therefore, compared with... Figure 5A and Figure 5B Compared to the display area shown in the comparison example, Figure 5C The display area of ​​the display device 1 according to this embodiment shown in the figure has been increased.

[0111] Therefore, by using a substrate with a recessed shape, the display device 1 of this embodiment can facilitate the installation of one or more components thereon, while expanding the display area of ​​the display device 1.

[0112] Reference Figure 2 and Figure 3 The polarizing film 40 can be arranged on the encapsulation layer 30.

[0113] According to one embodiment, the polarizing film 40 can include a multilinear polarizing film and a circular polarizer film by combining films with phase differences.

[0114] A transparent substrate 60 can be disposed on a polarizing film 40, and an adhesive film 50 can be disposed between the polarizing film 40 and the transparent substrate 60.

[0115] The transparent substrate 60 may include a transparent material. The transparent substrate 60 covers not only the display unit 20 but also the area therein where the components 110 are disposed. The transparent substrate 60 may include a touch screen panel that provides touch sensing features on the display unit 20.

[0116] According to one embodiment, after the process of cutting the first recessed portion IP1, a polarizing film 40 can be formed on the encapsulation layer 30. In this case, the polarizing film 40 can be pre-cut to reflect the shape of the first recessed portion IP1 and then disposed on the encapsulation layer 30.

[0117] According to one embodiment, after the process of cutting the first recessed portion IP1, an adhesive film 50 can be formed on the polarizing film 40. In this case, the adhesive film 50 can be first cut or coated to reflect the shape of the first recessed portion IP1, and then the adhesive film 50 can be disposed on the polarizing film 40. In another embodiment, the adhesive film 50 (which will be described below) can be first coated on a transparent substrate 60, and the adhesive film 50 can be disposed on the polarizing film 40 together with the transparent substrate 60.

[0118] Figure 6 This is a cross-sectional view of a portion of a display device 2 according to another embodiment. It mainly describes the... Figure 3 The differences between display device 1 and display device 2 in the embodiments.

[0119] Reference Figure 6 The end of the cover panel 70 substantially coincides with the end of the base 10 at the first recessed portion IP1.

[0120] The maximum depth H1 measured from edge L0 to flexible printed circuit board 90 can be substantially equal to or greater than the maximum depth H22 measured from edge L0 to the first recessed portion IP1 formed in substrate 10.

[0121] With the end of the cover panel 70 substantially coinciding with the end of the base 10 at the first recessed portion IP1, the space that can accommodate the component 110 can be maximized while still stably supporting the base 10.

[0122] Figure 7 This is a cross-sectional view of a portion of a display device 3 according to another embodiment. It mainly describes the... Figure 3 The differences between display device 1 and display device 3 in the embodiments.

[0123] Reference Figure 7The black matrix BM is disposed on the surface of the transparent substrate 60 facing the display unit 20. The black matrix BM can be disposed on the outside of the display unit 20, and the module opening MO can be formed on the surface where the component 110 is disposed (see...). Figure 1C In other words, the module opening MO can be positioned within the black matrix BM at a location corresponding to the first recessed portion IP1. The black matrix BM can prevent the passage of component 110 (see...) within it. Figure 1C Light leakage in the area.

[0124] The maximum depth H1 measured from edge L0 to flexible printed circuit board 90 can be substantially equal to or greater than the maximum depth H23 measured from edge L0 to the module opening MO of black matrix BM closer to display unit 20. Component 110 (see Figure 1C It can be arranged in the space formed by the module opening MO.

[0125] As long as the cover panel 70 of the display device 3 does not overlap with the module opening MO of the transparent substrate 60, the cover panel 70 of the display device 3 can be designed freely.

[0126] In addition, although Figure 7 Although not shown, a second opening (not shown) may be formed in the region of the transparent substrate 60 corresponding to the module opening MO. Unlike the camera module 111 and sensor 113, the speaker 112 may require a second opening (not shown) formed in the transparent substrate 60 to transmit sound.

[0127] Figure 8 This is a plan view showing the wiring of the first pad group 11, the second pad group 12, the third pad group 81, and the fourth pad group 82 according to an embodiment, including diagonal wiring.

[0128] When the substrate 10 is aligned and bonded to the first wiring film 80-1 and the second wiring film 80-2, a conductive bonding layer (not shown), such as an anisotropic conductive film, is disposed between the first pad group 11 of the substrate 10 and the third pad group 81 of the first wiring film 80-1, and between the second pad group 12 of the substrate 10 and the fourth pad group 82 of the second wiring film 80-2. The substrate 10 is physically bonded to the first wiring film 80-1 and the second wiring film 80-2 and electrically connected to the first wiring film 80-1 and the second wiring film 80-2 by applying pressure. In this case, during the pressurization process, the anisotropic conductive films may not be aligned, thus a break may occur between the wiring of the anisotropic conductive films and the pad groups.

[0129] This embodiment prevents the anisotropic conductive film from disconnecting from the pads by forming the first pad group 11, the second pad group 12, the third pad group 81, and the fourth pad group 82 in a diagonal pattern. In one embodiment, the diagonal lines have a slope that gradually increases from the center outwards from a first angle (e.g., 0° when measured relative to a vertical line) to a second angle (e.g., θ2). Angle θ1 represents any angle between the first angle and the second angle. The width of the diagonal lines can be constant, and the spatial spacing between adjacent diagonal lines can remain constant.

[0130] Although Figure 8 The illustration shows a wiring pattern with a slope that gradually increases from a first angle to a second angle outwards from the center, but this disclosure is not limited thereto. For example, the slope angle of the diagonal line may be constant. In another embodiment, the slope angle may gradually decrease, increase, and decrease, or decrease and increase, from the first angle to the second angle outwards from the center. In some embodiments, the width of the diagonal line and the spatial spacing between adjacent diagonal lines may vary.

[0131] Each of the first pad group 11 and the second pad group 12 may include multiple pad wirings with diagonal lines, such that the multiple pad wirings are symmetrical about the center of the first recessed portion IP1.

[0132] Each of the third pad group 81 and the fourth pad group 82 may include multiple pad wirings with diagonal lines, such that the multiple pad wirings are symmetrical about the center of the first recessed portion IP1.

[0133] Figure 9 This is a plan view of a portion of a display device 4 according to another embodiment. When compared with... Figure 1B When comparing the display device 1 of the embodiment, the main differences are described.

[0134] The maximum depth H3 measured from the end L3 of the third pad group 81 of the first wiring film 80-1 and the fourth pad group 82 of the second wiring film 80-2 to the flexible printed circuit board 90 can be equal to or greater than the maximum depth H4 measured from the end of the substrate 10 to the end of the first recessed portion IP1 formed in the substrate 10.

[0135] Figure 10 This is a plan view of a portion of a display device 5 according to another embodiment. When compared with... Figure 1B When comparing the display device 1 of the embodiment, the main differences are described.

[0136] In this embodiment, the maximum width W1L measured from the central axis C to the inner side of the first wiring film 80-1 can be equal to or greater than the maximum width W2L measured from the central axis C to the leftmost side of the component 110, and the maximum width W1R measured from the central axis C to the inner side of the second wiring film 80-2 can be equal to or greater than the maximum width W2R measured from the central axis C to the rightmost side of the component 110.

[0137] Figure 11 This is a plan view of a portion of a display device 6 according to another embodiment. When compared with... Figure 1B When comparing the display device 1 of the embodiment, the main differences are described.

[0138] In this embodiment, the maximum width W3, measured from the end of the first recessed portion IP1 on one side of the substrate 10 to the edge of the substrate 10, can be equal to or greater than the maximum width W4, measured from the end of the first recessed portion IP1 on one side to the central axis C. Therefore, sufficient space can be obtained to form the pad assembly.

[0139] Figure 12 This is a plan view of a portion of a display device 7 according to another embodiment. When compared with... Figure 1B When comparing the display device 1 of the embodiment, the main differences are described.

[0140] In this embodiment, the wiring film 80 further includes a first connecting wiring film 80-3 disposed between the third pad group 81 and the fourth pad group 82. The first connecting wiring film 80-3 can enhance the adhesion between the substrate 10 and the first wiring film 80-1 and the second wiring film 80-2 by contacting the portion of the substrate 10 located between the first pad group 11 and the second pad group 12.

[0141] Figure 13 This is a plan view of a portion of a display device 8 according to another embodiment. When compared with... Figure 12 The main differences are described when comparing the display device 7 of the embodiment.

[0142] In this embodiment, in addition to the first connecting wiring film 80-3 disposed between the third pad group 81 and the fourth pad group 82, the wiring film 80 also includes a second connecting wiring film 80-4 disposed between the fifth pad group 83 and the sixth pad group 84. The first wiring film 80-1 and the second wiring film 80-2, as well as the first connecting wiring film 80-3 and the second connecting wiring film 80-4, form a through hole.

[0143] The first connecting wiring film 80-3 and the second connecting wiring film 80-4 can respectively enhance the adhesion between the substrate 10 and the first wiring film 80-1 and the second wiring film 80-2, as well as the adhesion between the first wiring film 80-1 and the second wiring film 80-2 and the flexible printed circuit board 90.

[0144] Figure 14 This is a plan view of a portion of a display device 9 according to another embodiment. When compared with... Figure 1B When comparing the display device 1 of the embodiment, the main differences are described.

[0145] In this embodiment, the first wiring film 80-1 includes a first grounding portion 80-1E, and the second wiring film 80-2 includes a second grounding portion 80-2E. Each of the first grounding portion 80-1E and the second grounding portion 80-2E may include a conductive material. The first grounding portion 80-1E and the second grounding portion 80-2E may be grounded on the first wiring film 80-1 and the second wiring film 80-2, respectively, to prevent the generation of static electricity in the first wiring film 80-1 and the second wiring film 80-2 and to suppress or block electrical noise.

[0146] Figure 15 This is a cross-sectional view of a portion of a display device 10E according to another embodiment. When compared with... Figure 2 When comparing the display device 1 of the embodiment, the main differences are described.

[0147] In this embodiment, the filler material 120 is further disposed between the substrate 10 and the transparent substrate 60. The filler material 120 can disperse the impact applied to the substrate 10 and the transparent substrate 60. Because the filler material 120 surrounds the edge of the encapsulation layer 30 without directly contacting the display unit 20, and is also separated from the adhesive film 50 by a predetermined interval, chemical reaction between the filler material 120 and the adhesive film 50 can be prevented, and the filler material 120 can be prevented from penetrating into the display unit 20.

[0148] Figure 16A and Figure 16B This is a plan view of a portion of a display device 11E according to another embodiment. When compared with... Figure 1B When comparing the display device 1 of the embodiment, the main differences are described.

[0149] In this embodiment, the second recessed portion IP2 is formed on the side of the flexible printed circuit board 90 facing the first recessed portion IP1, and is recessed into the interior of the flexible printed circuit board 90 between the first wiring film 80-1 and the second wiring film 80-2. When the lengths of the first wiring film 80-1 and the second wiring film 80-2 of the display device 11E are compared to... Figure 2 When the length of the display device 1 is shortened, the second recessed portion IP2 provides more space between the flexible printed circuit board 90 and the component 110.

[0150] Figure 17 This is a view of various shapes of the first recessed portion according to an embodiment. Figure 17The diagram shows a first recessed portion IP11 with a semi-circular shape, a first recessed portion IP12 with a semi-elliptical shape, a first recessed portion IP13 with an arched shape, and a first recessed portion IP14 with a quadrilateral shape. However, it should be noted that the shape of the first recessed portion formed in the substrate 10 according to this disclosure is not limited to... Figure 17 The exemplary shape shown is shown in the figure.

[0151] Figure 18 This is a view of various shapes of the second recessed portion formed in the flexible printed circuit board 90. Figure 18 The diagram shows a second recessed portion IP21 with a semi-circular shape, a second recessed portion IP22 with a semi-elliptical shape, a second recessed portion IP23 with a rectangular shape, and a second recessed portion IP24 with a quadrilateral shape. However, it should be noted that the shape of the second recessed portion formed in the flexible printed circuit board 90 according to this disclosure is not limited to... Figure 18 The exemplary shape shown is shown in the figure.

[0152] Embodiments of this disclosure provide a display device that can facilitate the mounting of various components thereon while increasing the size of the display screen by using a substrate with a recessed shape.

[0153] Although the present disclosure has been described with reference to embodiments shown in the accompanying drawings, these are provided by way of example only, and it will be understood by those skilled in the art that various changes in form and detail and their equivalents may be made therein without departing from the spirit and scope of the present disclosure as defined by the claims.

Claims

1. A display device, the display device comprising: The base includes a first recessed portion recessed inward along one side of the base; The first pad group and the second pad group are separated from each other along one side of the first surface of the substrate by the first recessed portion; The display unit is located on the substrate and has a shape that is recessed inward between the first pad group and the second pad group; Encapsulation layer, which encapsulates the display unit; A first wiring film includes a third pad assembly connected to the first pad assembly, the first wiring film being bent from a first surface of the substrate toward a second surface of the substrate opposite to the first surface of the substrate; The second wiring film includes a fourth pad assembly connected to the second pad assembly, the second wiring film being bent from the first surface of the substrate to the second surface of the substrate, and being separated from the first wiring film by the first recessed portion; A flexible printed circuit board is located on the second surface of the substrate and does not overlap with the first recessed portion; the flexible printed circuit board is connected to the first wiring film and the second wiring film. A transparent substrate is disposed on the encapsulation layer; A polarizing film is located between the encapsulation layer and the transparent substrate; An adhesive film is located between the polarizing film and the transparent substrate; as well as A filler material, separated from the adhesive film and surrounding the periphery of the display unit without contacting the display unit, is located between the substrate and the transparent substrate.

2. The display device according to claim 1, wherein, The encapsulation layer includes at least one inorganic layer and at least one organic layer.

3. The display device according to claim 1, wherein, The encapsulation layer includes at least one inorganic layer and at least one organic layer, the outermost layer of the encapsulation layer being an inorganic layer, and the inorganic layer covering the side surface of the at least one organic layer.

4. The display device according to claim 1, wherein, The encapsulation layer includes at least one inorganic layer and at least one organic layer, the outermost layer of the encapsulation layer being an inorganic layer, and the inorganic layer covering the side surface of the substrate in which the first recessed portion is disposed.

5. The display device according to claim 1, wherein, The dummy pixels used for testing are arranged along the first recessed portion on the outside of the display unit.

6. The display device according to claim 1, wherein, A first grounding portion grounded to the first wiring film and a second grounding portion grounded to the second wiring film are respectively arranged on the first wiring film and the second wiring film.

7. The display device according to claim 1, wherein, The black matrix is ​​arranged on the transparent substrate at a position corresponding to the outer side of the display unit.

8. The display device according to claim 7, wherein, The first opening is located in the black matrix at a position corresponding to the first recessed portion.

9. The display device according to claim 8, wherein, A second opening is provided in the transparent substrate at a position corresponding to the first opening.

10. The display device according to claim 1, further comprising: A cover panel is disposed on the second surface of the substrate and includes a cushioning material.

11. The display device according to claim 10, wherein, The end of the cover panel coincides with the end of the substrate at the first recessed portion.

12. The display device according to claim 10, wherein, The end of the cover panel protrudes further outward from the display unit than the end of the base at the first recessed portion.

13. The display device according to claim 1, wherein, Each of the first pad group and the second pad group includes multiple pad lines with diagonal lines, such that the multiple pad lines are symmetrical about the center of the first recess.

14. The display device according to claim 13, wherein, Each of the third and fourth pad groups includes multiple pad lines with diagonal lines, such that the multiple pad lines are symmetrical about the center of the first recess.

15. The display device according to claim 1, wherein, The maximum depth from the edge of the curved region of the first wiring film and the second wiring film to the flexible printed circuit board is equal to or greater than the maximum depth from the edge of the curved region of the first wiring film and the second wiring film to the first recessed portion.

16. The display device according to claim 1, wherein, The flexible printed circuit board includes a second recessed portion that faces the first recessed portion and is recessed inward between the first wiring film and the second wiring film.

17. The display device according to claim 1, wherein, The distance from one end of the first wiring film to the flexible printed circuit board is equal to or greater than the distance from the end of the first recessed portion of the substrate to the end of the substrate.

18. The display device according to claim 1, wherein, The flexible printed circuit board includes an integrated circuit chip stacked with the display unit.

19. The display device according to claim 18, wherein, The integrated circuit chip is separated from the first wiring film and the second wiring film on the surface of the flexible printed circuit board opposite to the second surface of the substrate.

20. A display device, the display device comprising: The base includes a first recessed portion recessed inward along one side of the base; The first pad group and the second pad group are separated from each other along one side of the first surface of the substrate by the first recessed portion; The display unit is located on the substrate and has a shape that is recessed inward between the first pad group and the second pad group; Encapsulation layer, which encapsulates the display unit; A first wiring film includes a third pad assembly connected to the first pad assembly, the first wiring film being bent from a first surface of the substrate toward a second surface of the substrate opposite to the first surface of the substrate; The second wiring film includes a fourth pad assembly connected to the second pad assembly, the second wiring film being bent from the first surface of the substrate to the second surface of the substrate; A first connecting wiring film connects the first wiring film to the second wiring film and is located between the third pad group and the fourth pad group; A flexible printed circuit board is located on the second surface of the substrate and does not overlap with the first recessed portion; the flexible printed circuit board is connected to the first wiring film and the second wiring film. A transparent substrate is disposed on the encapsulation layer; A polarizing film is located between the encapsulation layer and the transparent substrate; An adhesive film is located between the polarizing film and the transparent substrate; as well as A filler material, separated from the adhesive film and surrounding the periphery of the display unit without contacting the display unit, is located between the substrate and the transparent substrate.

21. The display device according to claim 20, further comprising: The second connecting wiring membrane is disposed at a position facing the first connecting wiring membrane. The first wiring film and the second wiring film, as well as the first connecting wiring film and the second connecting wiring film, form a through hole.

22. The display device according to claim 20, wherein, The flexible printed circuit board includes an integrated circuit chip stacked with the display unit.

23. The display device according to claim 22, wherein, The integrated circuit chip is separated from the first wiring film and the second wiring film on the surface of the flexible printed circuit board opposite to the second surface of the substrate.

Images