Method for manufacturing a display device

Abstract

A method for manufacturing a display device is provided, the method comprising: providing a display panel divided into a cutting area and a main body portion surrounding the cutting area; attaching a dummy film to a bottom surface of the display panel; cutting the cutting area by irradiating a laser toward a cutting line, the cutting line being defined as a boundary between the cutting area and the main body portion; irradiating a laser to a groove line of the dummy film overlapping the cutting line, thereby defining a groove in the dummy film along the groove line; and separating the dummy film from the main body portion.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0107521, filed on September 10, 2018, which is hereby incorporated by reference in its entirety. Technical Field

[0002] Aspects of some example embodiments of the present disclosure herein relate to a method for manufacturing a display device. Background Art

[0003] Generally, an electronic device that provides an image to a user (such as a smart phone, a digital camera, a notebook computer, a navigation device, or a smart TV) includes a display device for displaying the image. The display device generates an image and provides the generated image to the user through a display screen.

[0004] The display device includes a display panel for generating an image and a functional element for providing various functions to a user. The functional element may include, for example, a speaker, a camera, or a functional button. In the display panel, a plurality of holes may be formed so that the functional element is located therein, and the functional element may be exposed to the outside through the holes. When manufacturing the display device, a cutout area of ​​the display panel may be removed to provide the hole.

[0005] Each of the cutting areas can be defined as a closed curve, and the laser can be irradiated to the closed curve to cut the cutting area. The starting point and the end point of the closed curve to which the laser is irradiated can be the same. The laser is irradiated from the first point of the closed curve, moves along the closed curve, and then moves to the first point again.

[0006] However, when the laser is irradiated from the first point and moved again to the portion adjacent to the first point, the earlier cut portion of the cutting area may sag due to gravity. In this case, the first cutting area may not be accurately cut.

[0007] The above information disclosed in this Background section is only for enhancement of background understanding and therefore it may contain information that does not constitute prior art. Summary of the invention

[0008] The present disclosure provides a method for manufacturing a display device that can improve the yield rate of the display device.

[0009] According to some example embodiments of the inventive concept, in a method for manufacturing a display device, the method includes: providing a display panel divided into a cutting area and a main body portion surrounding the cutting area; attaching a dummy film to a bottom surface of the display panel; cutting the cutting area by irradiating a laser toward a cutting line, wherein the cutting line is defined as a boundary between the cutting area and the main body portion; irradiating a laser to a groove line of the dummy film overlapping the cutting line, thereby defining a groove in the dummy film along the groove line; and separating the dummy film from the main body portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The accompanying drawings are included to further understand the various aspects of some exemplary embodiments of the inventive concept, and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the inventive concept and, together with the description, are used to explain the principles of the inventive concept. In the drawings:

[0011] Figure 1 is a plan view of a display panel used in a method for manufacturing a display device according to some example embodiments of the inventive concept;

[0012] Figure 2 Schematically shows Figure 1 A cross section of a display panel shown in FIG.

[0013] Figure 3 Shown in Figure 2 A cross-sectional structure of any one pixel in the pixel layer shown in FIG.

[0014] Figures 4 to 10 are diagrams for explaining a method for manufacturing a display device according to some example embodiments of the inventive concept;

[0015] Figures 11 to 15 are diagrams for explaining a method for manufacturing a display device according to some example embodiments of the inventive concept; and

[0016] Fig.16 and Fig.17 are diagrams for explaining a method for manufacturing a display device according to some example embodiments of the inventive concept. DETAILED DESCRIPTION

[0017] It will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, directly connected to or directly coupled to the other element or layer, or an intervening third element or layer may be present.

[0018] The same reference numerals in the drawings represent the same elements. In addition, in the drawings, the thickness, proportion and size of the elements are exaggerated to effectively describe the technical content.

[0019] The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0020] Terms such as "first", "second", etc. may be used to describe various components, but these components should not be limited by these terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, or similarly, a second component may be referred to as a first component. Unless the context clearly indicates otherwise, the singular forms "a (kind / person)", and "the (the)" are also intended to include plural forms.

[0021] Additionally, terms such as "below," "below," "above," and "upper" are used to explain the relationship of items shown in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings.

[0022] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the example embodiments belong. It will also be understood that, unless expressly defined herein, terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an ideal or overly formal sense.

[0023] It will also be understood that the terms “comprise” and / or “include” when used in this specification indicate the presence of the stated features, integers, steps, operations, elements, components or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components or combinations thereof.

[0024] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0025] Figure 1 is a plan view of a display panel used in a method for manufacturing a display device according to some example embodiments of the inventive concept.

[0026] Reference Figure 1 , the display panel DP may have a rectangular shape having a short side in a first direction DR1 and a long side in a second direction DR2 intersecting with the first direction DR1 (e.g., perpendicular to the first direction DR1). The edge of the display panel DP may have a circular shape. The polarizing film may be located on the display panel DP, for example, Figure 2 A polarizing film POL is shown in FIG.

[0027] The display panel DP may be an organic light emitting display panel. However, embodiments of the inventive concept are not limited thereto, and various image display panels that can display images, such as a liquid crystal display panel, an electrowetting display panel, and an electrophoretic display panel, may be used as the display panel DP.

[0028] The display panel DP may have a plane defined by the first direction DR1 and the second direction DR2. The plane area of ​​the display panel DP may include a display area DA on which an image is displayed and a non-display area NDA surrounding the display area DA.

[0029] The display panel DP may be divided into a plurality of cutting areas CA1, CA2, and CA3 and a body part BP surrounding the cutting areas CA1, CA2, and CA3. Boundaries between the cutting areas CA1, CA2, and CA3 and the body part BP may be defined as cutting lines CL1, CL2, and CL3, respectively.

[0030] The cutting areas CA1, CA2, and CA3 are parts to be removed when manufacturing the display device, and the main body part BP may be a part to be retained. Three example cutting areas CA1, CA2, and CA3 are shown, but the number of cutting areas CA1, CA2, and CA3 is not limited to Figure 1 Various embodiments may include additional or fewer cutting areas than the numbers shown.

[0031] The cutting areas CA1, CA2, and CA3 may be located in the non-display area NDA. The body portion BP may be a portion of the display panel DP excluding the cutting areas CA1, CA2, and CA3. For example, the body portion BP may include the display area DA and a portion of the non-display area NDA excluding the cutting areas CA1, CA2, and CA3.

[0032] The cutting areas CA1, CA2 and CA3 may include a first cutting area CA1, a second cutting area CA2 and a third cutting area CA3. The cutting lines CL1, CL2 and CL3 may include: a first cutting line CL1 which is a boundary between the first cutting area CA1 and the main body part BP; a second cutting line CL2 which is a boundary between the second cutting area CA2 and the main body part BP; and a third cutting line CL3 which is a boundary between the third cutting area CA3 and the main body part BP.

[0033] Each of the cutting areas CA1, CA2 and CA3 can be defined, for example, by a single closed curve. A single closed curve can be defined by a closed figure such as a polygon, a circle or an ellipse, wherein when a point is marked on a straight line or a curve, the starting point and the end point of the closed figure are the same.

[0034] The laser may be irradiated to the first cutting line CL1, the second cutting line CL2, and the third cutting line CL3 to cut the first cutting area CA1, the second cutting area CA2, and the third cutting area CA3, respectively. This manufacturing process will be described in more detail below. The functional element may be located in the hole of the display panel defined by removing the first cutting area CA1, the second cutting area CA2, and the third cutting area CA3.

[0035] Figure 2 Show Figure 1 A cross section of a display panel is shown in FIG.

[0036] Reference Figure 2 The display panel DP may include a substrate SUB, a pixel layer PXL on the substrate SUB, a thin film encapsulation layer TFE on the substrate SUB for covering the pixel layer PXL, and a protection substrate PSUB under the substrate SUB.

[0037] The substrate SUB may include polyimide as a plastic material having flexibility. The protection substrate PSUB may include polyimide or polyethylene terephthalate as a plastic material having flexibility.

[0038] The bottom surface of the protection substrate PSUB may define the bottom surface of the display panel DP. The protection substrate PSUB may be omitted. When the protection substrate PSUB is omitted, the bottom surface of the substrate SUB may define the bottom surface of the display panel DP.

[0039] The substrate SUB may include a display area DA and a non-display area NDA surrounding the display area DA. The pixel layer PXL may be located on the display area DA. The pixel layer PXL may include a plurality of pixels, and each of the pixels may include a light emitting element.

[0040] The thin film encapsulation layer TFE may include at least two inorganic layers and an organic layer therebetween. The inorganic layer may include an inorganic material and protect the pixel layer PXL from moisture / oxygen. The organic layer may include an organic material and protect the pixel layer PXL from foreign substances or contaminants such as dust particles, moisture, etc.

[0041] An example of a thin film encapsulation layer TFE is shown to protect the pixel layer PXL, but the embodiments of the inventive concept are not limited thereto. In order to protect the pixel layer PXL, an encapsulation substrate (e.g., encapsulation glass) may be used. When an encapsulation substrate is used, the substrate SUB may include a glass substrate to produce a rigid product.

[0042] The encapsulation substrate may be located on the substrate SUB, and the pixel layer PXL may be located between the encapsulation substrate and the substrate SUB. The encapsulation substrate may be attached to the substrate SUB by a sealing member located on the non-display area NDA of the substrate SUB.

[0043] The encapsulation substrate may include a synthetic resin substrate or a glass substrate. The sealing member may include an inorganic bonding member such as glass frit. However, the sealing member is not limited thereto, but may include an organic bonding member. The pixel layer PXL may be encapsulated from the outside by the encapsulation substrate and the sealing member, thereby preventing or reducing the occurrence of defects in the light-emitting element caused by moisture.

[0044] The polarizing film POL may be located on the display panel DP. The polarizing film POL may be adhered to the display panel DP by an adhesive OCA. The adhesive OCA may include an optically transparent adhesive. The polarizing film POL may be defined as an anti-reflection film.

[0045] The polarizing film POL may reduce reflectivity of external light incident toward the display panel DP above the display panel DP. For example, the polarizing film POL may include a retardation member and a polarizing member. The polarizing film POL may be omitted.

[0046] Figure 3 Shown at Figure 2 The cross-sectional structure of any one pixel in the pixel layer shown in FIG.

[0047] Reference Figure 3 , the pixel PX may include a light emitting element OLED and a transistor TR connected to the light emitting element OLED. The light emitting element OLED may include an organic light emitting diode. The transistor TR and the light emitting element OLED may be located on a substrate SUB. The layer where the transistor TR and the light emitting element OLED are located may be defined as a pixel layer PXL.

[0048] The protection substrate PSUB is located under the substrate SUB, and the buffer layer BFL may be located on the substrate SUB. The buffer layer BFL may include an inorganic material. The buffer layer BFL may be omitted.

[0049] The semiconductor layer SM of the transistor TR may be located on the buffer layer BFL. The semiconductor layer SM may include a semiconductor of an inorganic material such as amorphous silicon or polycrystalline silicon or an organic semiconductor. In addition, the semiconductor layer SM may include an oxide semiconductor. Figure 3 Although not shown in the figure, the semiconductor layer SM may include a source region, a drain region, and a channel region between the source region and the drain region.

[0050] The first insulating layer INS1 may be located on the buffer layer BFL to cover the semiconductor layer SM. The first insulating layer INS1 may include an inorganic material. The gate electrode GE of the transistor TR overlapping the semiconductor layer SM may be located on the first insulating layer INS1. The gate electrode GE may be positioned to overlap the channel region of the semiconductor layer SM.

[0051] The second insulating layer INS2 may be located on the first insulating layer INS1 to cover the gate electrode GE. The second insulating layer INS2 may be defined as an interlayer insulating layer. The second insulating layer INS2 may include an organic material and / or an inorganic material.

[0052] The source electrode SE and the drain electrode DE of the transistor TR may be separately located on the second insulating layer INS2. The source electrode SE may be connected to the source region of the semiconductor layer SM through a first contact hole CH1 defined by penetrating through the first insulating layer INS1 and the second insulating layer INS2. The drain electrode DE may be connected to the drain region of the semiconductor layer SM through a second contact hole CH2 defined by penetrating through the first insulating layer INS1 and the second insulating layer INS2.

[0053] The third insulating layer INS3 may be located on the second insulating layer INS2 to cover the source electrode SE and the drain electrode DE of the transistor TR. The third insulating layer INS3 may be defined as a planarization layer configured to provide a flat top surface, and may include an organic material.

[0054] The first electrode E1 of the light emitting element OLED may be located on the third insulating layer INS3. The first electrode E1 may be connected to the drain electrode DE of the transistor TR through a third contact hole CH3 defined by penetrating the third insulating layer INS3. The first electrode E1 may be defined as a pixel electrode or an anode electrode.

[0055] A pixel defining layer PDL configured to expose a specific portion of the first electrode E1 may be located on the first electrode E1 and the third insulating layer INS3. In the pixel defining layer PDL, a pixel opening portion PX_OP may be defined to expose a specific portion of the first electrode E1, and a region in which the pixel opening portion PX_OP is located may be defined as a pixel area PA. The periphery of the pixel area PA may be defined as a non-pixel area NPA.

[0056] In the pixel opening portion PX-OP, the organic light emitting layer OEL may be located on the first electrode E1. The organic light emitting layer OEL may include an organic material that may generate light of any one color of red, green, and blue. The organic light emitting layer OEL may generate light of any one color of red, green, and blue. However, embodiments of the inventive concept are not limited thereto, and the organic light emitting layer OEL may generate white light by combining organic materials that respectively generate red light, green light, and blue light.

[0057] The second electrode E2 may be located on the pixel defining layer PDL and the organic light emitting layer OEL. The second electrode E2 may be defined as a common electrode or a cathode electrode. The display panel DP may be a top emission type, in which case the first electrode E1 may include a reflective electrode and the second electrode E2 may be a transparent electrode.

[0058] The light emitting element OLED may be disposed in the pixel area PA and include a first electrode E1, an organic light emitting layer OEL, and a second electrode E2. The first electrode E1 may be an anode as a hole injection electrode, and the second electrode E2 may be a cathode as an electron injection electrode.

[0059] The thin film encapsulation layer TFE may be located on the light emitting element OLED to cover the pixel PX. For example, the thin film encapsulation layer TFE may be located on the second electrode E2.

[0060] A first voltage that enables the organic light emitting layer OEL to emit light by means of the transistor TR may be applied to the first electrode E1. A second voltage having an opposite polarity to the first voltage may be applied to the second electrode E2.

[0061] The holes and electrons injected into the organic light emitting layer OEL combine to provide excitons, and the light emitting element OLED can emit light when the excitons transition to a ground state. The light emitting element OLED can emit red light, green light, and blue light according to the flow of current to display specific image information.

[0062] Figures 4 to 10 are diagrams for explaining a method for manufacturing a display device according to some example embodiments of the inventive concept.

[0063] For example, Figures 4 to 9 Shown with Figure 1 The cross-sectional view corresponding to line II′ shown in FIG. Figures 4 to 9 2 shows a process for removing the first cutting area CA1. Figures 4 to 9 A lower layer configuration of the display panel DP is not shown, and an adhesive OCA configured to bond the display panel DP and the polarizing film POL is omitted.

[0064] According to some example embodiments, the second cutting area CA2 and the third cutting area CA3 may also be based on Figures 4 to 9 Therefore, the process for removing the first cutting area CA1 will be described in more detail below, and the process for removing the second cutting area CA2 and the third cutting area CA3 will be omitted for the sake of brevity.

[0065] Reference Figure 4 The polarizing film POL on the display panel DP may be divided into a sub-cutting area SCA and a sub-body part SBP surrounding the sub-cutting area SCA. The sub-cutting area SCA overlaps the first cutting area CA1, and the sub-body part SBP may overlap the body part BP.

[0066] A boundary between the sub-cut area SCA and the sub-body portion SBP may be defined as a sub-cut line SCL. The sub-cut line SCL may overlap the first cut line CL1.

[0067] The dummy film DF may be attached to the bottom surface of the display panel DP. For example, the dummy film DF may be attached to the bottom surface of the protection substrate PSUB, the bottom surface of the protection substrate PSUB being configured to define the bottom surface of the display panel DP. According to some example embodiments, the dummy film DF may be attached to the bottom surface of the display panel DP by a pressure-sensitive adhesive.

[0068] In the dummy film DF, a groove line GL configured to overlap the first cutting line CL1 may be defined. The dummy film DF may include polyimide or polyethylene terephthalate as a plastic material.

[0069] Reference Figure 5 , the dummy film DF, the display panel DP and the polarizing film POL may be placed on the stage STG. The dummy film DF may be safely placed on the stage STG.

[0070] In the stage STG, an opening portion OP may be defined, and the opening portion OP may overlap the first cutting area CA1. Since the opening portion OP is located under the first cutting area CA1, the stage STG does not support the first cutting area CA1, but may play a role of supporting the main body portion BP. The opening portion OP may be larger than the first cutting area CA1. For example, the first width WT1 of the opening portion OP may be greater than the second width WT2 of the first cutting area CA1.

[0071] The reason why the opening portion OP is defined in the stage STG will be described below in conjunction with the Fig.17 A more detailed description will be given by comparing it with STG'.

[0072] Reference Figure 6The laser unit LU is placed above the polarizing film POL, and the laser unit LU can irradiate the laser LAR toward the polarizing film POL and the display panel DP. The laser LAR can be irradiated toward the sub-cutting line SCL and the first cutting line CL1 from above the display panel DP.

[0073] The laser LAR may be irradiated along the sub-cutting line SCL and the first cutting line CL1 while moving in a clockwise or counterclockwise direction. The starting point and the end point of the laser LAR irradiation may be the same. The laser LAR may be irradiated along the sub-cutting line SCL and the first cutting line CL1 to cut the sub-cutting area SCA and the first cutting area CA1.

[0074] After cutting the sub-cutting area SCA and the first cutting area CA1, the laser LAR may be irradiated to the groove line GL of the dummy film DF. The laser LAR may be irradiated along the groove line GL, thereby defining a groove G in the dummy film DF along the groove line GL.

[0075] The laser LAR may remove a portion (eg, a predetermined or specific portion) of the dummy film DF along the groove line GL without cutting the dummy film DF. Thus, a groove G recessed from the top surface toward the bottom portion of the dummy film DF may be defined along the groove line GL.

[0076] Reference Figure 7 , after the dummy film DF securely placed on the stage STG is separated from the stage STG, the polarizing film POL, the display panel DP, and the dummy film DF may be turned upside down. Figure 7 The stage STG is not shown in the figure. The display panel DP is located under the dummy film DF, and the polarizing film POL may be located under the display panel DP.

[0077] Reference Figure 8 , the dummy film DF may be separated upward from the main body portion BP of the display panel DP. The first cutting area CA1 is attached to the dummy film DF, and the first cutting area CA1 and the sub-cutting area SCA are cut from the main body portion BP and the sub-main body portion SBP, respectively. Therefore, when the dummy film DF is separated from the main body portion BP, the first cutting area CA1 and the sub-cutting area SCA may be separated upward from the main body portion BP and the sub-main body portion SBP, respectively, along with the dummy film DF.

[0078] Reference Fig. 9 , the first cutting area CA1 attached to the dummy film DF may be separated from the dummy film DF. Therefore, the first cutting area CA1 and the sub-cutting area SCA may be separated from the dummy film DF and discarded.

[0079] Fig. 9 The process shown in can be omitted. For example, Figure 8As shown, the first cutting area CA1 and the sub-cutting area SCA may not be separated from the dummy film DF but may be discarded together with the dummy film DF.

[0080] When the dummy film DF is not attached to the display panel DP, the opening portion OP may be located under the first cutting area CA1. When the laser LAR moves along the first cutting line CL1 from the starting point, there may be a portion of the first cutting area CA1 that has been cut earlier. Since there is an unused space below the first cutting area CA1, the portion of the first cutting area CA1 that has been cut earlier may sag due to gravity. In this case, the first cutting area CA1 may not be accurately cut.

[0081] In an embodiment of the inventive concept, the first cutting area CA1 is cut in a state where the dummy film DF supports the first cutting area CA1, and then the dummy film DF is removed. Therefore, the first cutting area CA1 can be cut more accurately. The second cutting area CA2 and the third cutting area CA3 can also be cut in a state where the dummy film DF supports the first cutting area CA1. Figures 4 to 9 The process shown in the figure is cut more precisely.

[0082] Therefore, according to the method for manufacturing the display device according to some example embodiments of the inventive concept, the cutting areas CA1, CA2, and CA3 may be more accurately cut, thereby improving the yield rate of the display device.

[0083] Return to reference Figure 1 , the laser LAR may be irradiated to the first cutting line CL1, the second cutting line CL2, and the third cutting line CL3, and the first cutting area CA1, the second cutting area CA2, and the third cutting area CA3 may be cut. Fig.10 Then, the first cutting area CA1, the second cutting area CA2, and the third cutting area CA3 are removed, thereby defining the first hole H1, the second hole H2, and the third hole H3 in the display panel DP.

[0084] Although shown as a plan view, the polarizing film POL may be substantially located on the display panel DP. Sub-cut areas of the polarizing film POL corresponding to the first, second, and third cutting areas CA1, CA2, and CA3 are removed, thereby defining the first, second, and third holes H1, H2, and H3.

[0085] In the first hole H1 defined by removing the first cutting area CA1, the camera CAM may be placed. In the second hole H2 defined by removing the second cutting area CA2, the speaker SPK may be placed. In the third hole H3 defined by removing the third cutting area CA3, the function button BTO may be placed. Therefore, a display device DD in which the camera CAM, the speaker SPK, and the function button BTO are placed may be manufactured.

[0086] Figures 11 to 15 is a diagram for explaining a method for manufacturing a display device according to another embodiment of the inventive concept.

[0087] In addition to the position of the dummy film DF, Figures 11 to 15 The method for manufacturing a display device shown in Figures 4 to 10 The method for manufacturing a display device shown in FIG. 1 is substantially the same as that shown in FIG. 1 . Therefore, in the following, Figures 11 to 15 The method for manufacturing a display device shown in the Figures 4 to 10 In addition, the same reference numerals are used to indicate the same configuration.

[0088] Reference Fig.11 , so that the polarizing film POL is located under the display panel DP, the dummy film DF may be attached to the bottom surface of the polarizing film POL. The display panel DP, the polarizing film POL, and the dummy film DF may be placed on the stage STG, and the dummy film DF may be safely placed on the stage STG.

[0089] The display panel DP, the polarizing film POL, the dummy film DF and the stage STG may have Figure 5 The display panel DP, the polarizing film POL, and the dummy film DF shown in FIG. 5 have the same structure as those of the stage STG.

[0090] Reference Fig.12 The laser LAR may be irradiated toward the first cutting line CL1 and the sub-cutting line SCL from above the display panel DP. The laser LAR may be irradiated along the first cutting line CL1 and the sub-cutting line SCL to cut the first cutting area CA1 and the sub-cutting area SCA.

[0091] After cutting the first cutting area CA1 and the sub-cutting area SCA, the laser LAR may be irradiated to the groove line GL of the dummy film DF. The laser LAR may be irradiated along the groove line GL, thereby defining a groove G in the dummy film DF along the groove line GL.

[0092] Reference Fig.13 After the dummy film DF safely placed on the stage STG is separated from the stage STG, the display panel DP, the polarizing film POL, and the dummy film DF may be inverted. The polarizing film POL may be located under the dummy film DF, and the display panel DP may be located under the polarizing film POL.

[0093] Reference Fig.14, the dummy film DF can be separated upward from the sub-body part SBP of the polarizing film POL. The sub-cutting area SCA is attached to the dummy film DF, and the sub-cutting area SCA and the first cutting area CA1 are cut from the sub-body part SBP and the body part BP, respectively. Therefore, when the dummy film DF is separated from the sub-body part SBP, the sub-cutting area SCA and the first cutting area CA1 can be separated upward from the body part BP and the sub-body part SBP along with the dummy film DF.

[0094] Reference Fig.15 , the sub-cut area SCA attached to the dummy film DF may be separated from the dummy film DF. Therefore, the sub-cut area SCA and the first cut area CA1 may be separated from the dummy film DF and discarded.

[0095] Fig.15 The process shown in can be omitted. For example, Fig.14 As shown in FIG. 8 , the sub-cut area SCA and the first cut area CA1 may not be separated from the dummy film DF but may be discarded together with the dummy film DF.

[0096] According to some example embodiments, Fig.10 As shown in FIG. 1 , the functional element may be placed in the first hole H1 , the second hole H2 , and the third hole H3 defined in the polarizing film POL.

[0097] Fig.16 and Fig.17 are diagrams for explaining a method for manufacturing a display device according to some example embodiments of the inventive concept.

[0098] In addition to the structure of the STG, Figure 16 to Figure 17 The method for manufacturing a display device shown in Figures 4 to 10 The method for manufacturing the display device shown in FIG. 1 is basically the same. Hereinafter, the configuration of the stage STG will be mainly described, and the same configurations are denoted by the same reference numerals.

[0099] Reference Fig.16 ,and Figure 5 Unlike the stage STG shown in FIG. 1 , the opening portion OP may not be defined in the stage STG′. Therefore, the stage STG′ may support the first cutting area CA1 and the body portion BP.

[0100] The positions and structures of the display panel DP, the dummy film DF and the polarizing film POL may be Figure 5 The positions and structures of the display panel DP, the dummy film DF, and the polarizing film POL shown in FIG.

[0101] Reference Fig.17 ,and Figure 6Similar to the process shown in FIG. 1 , the laser LAR is irradiated to cut the first cutting area CA1 and the sub-cutting area SCA, and a groove G may be defined in the dummy film DF along the groove line GL. The subsequent process is similar to the process shown in FIG. Figures 7 to 10 The processes shown in are basically the same, so the description thereof will be omitted.

[0102] According to some exemplary embodiments of the inventive concept, Figure 5 and Figure 6 As shown in FIG. 1 , an opening portion OP may be defined in the stage STG, or as Fig.16 and Fig.17 As shown in FIG. 1 , the opening portion OP may not be defined in the stage STG′. This is because, as described in more detail below, regardless of the presence or absence of the opening portion OP, damage to the bottom of the display panel DP by the laser light LAR may be prevented or reduced.

[0103] The dummy film DF is not attached to the bottom of the display panel DP, the opening portion OP is not defined in the stage STG, and the display panel DP can be directly and safely placed on the stage STG. Since the opening portion OP is not defined in the stage STG, the laser light LAR reaches the stage STG after cutting the first cutting area CA1. In this case, the laser light LAR is reflected by the stage STG to damage the bottom of the display panel DP.

[0104] However, if Fig.16 and Fig.17 As shown in , because the dummy film DF is placed under the display panel DP, the laser LAR defines a groove G in a specific portion of the dummy film DF without reaching the stage STG'. Even when the laser LAR cuts the dummy film DF and reaches the stage STG', the laser LAR reflected by the stage STG' irradiates the dummy film DF and does not reach the bottom of the display panel DP. In other words, the dummy film DF can function as a protective film and can protect the bottom of the display panel DP from damage.

[0105] like Figure 5 and Figure 6 As shown in FIG. 1 , when the opening portion OP is defined in the stage STG, even if the laser LAR cuts the dummy film DF, the laser LAR passes through the opening portion OP. Therefore, the laser LAR is not provided to the bottom of the display panel DP. In other words, in order to prevent reflection due to the stage STG, the opening portion OP may be defined in a portion of the stage STG located under the first cutting area CA1.

[0106] However, as described above, since the dummy film DF may protect the display panel DP from the laser light LAR reflected by the stage STG′, the opening portion OP may not be defined in the stage STG′.

[0107] According to some example embodiments of the inventive concept, the method for manufacturing a display device includes a process of placing a dummy film configured to support a cutting area in the bottom of a display panel, cutting the cutting area, and then removing the dummy film. Therefore, the cutting area can be cut more accurately, thereby improving the yield rate of the display device.

[0108] Although various aspects of some exemplary embodiments of the present invention have been described, it is to be understood that the present invention should not be limited to these exemplary embodiments, but various changes and modifications can be made by a person of ordinary skill in the art within the spirit and scope of the claimed invention. In addition, the embodiments disclosed in the inventive concept are not intended to limit the technical spirit of the inventive concept, but the protection scope of the present invention should be interpreted based on the claims, and it should be understood that all technical spirits included in the scope equivalent thereto are included in the protection scope of the present invention.

Claims

1. A method for manufacturing a display device, the method comprising: providing a display panel divided into a cutting area and a main body portion surrounding the cutting area; attaching a dummy film to the bottom surface of the display panel; cutting the cutting area by irradiating a laser toward a cutting line, the cutting line being defined as a boundary between the cutting area and the main body portion; irradiating a laser to a groove line of the dummy film overlapping the cut line, thereby defining a groove in the dummy film along the groove line; as well as The dummy film is separated from the main body portion.

2. The method according to claim 1, further comprising: The cutting area is separated from the dummy film.

3. The method according to claim 1, wherein: The cut region is not separated from the dummy film.

4. The method according to claim 1, wherein: The display panel comprises: substrate; a pixel layer, located on the substrate and comprising a plurality of pixels; and a protective substrate, located below the substrate, Wherein, the dummy film is attached to the bottom surface of the protection substrate.

5. The method according to claim 1, wherein: The planar area of ​​the display panel includes: display area; and a non-display area surrounding the display area, Wherein, the cutting area is located in the non-display area.

6. The method according to claim 1, wherein: The dummy film is attached to the bottom surface of the display panel by a pressure-sensitive adhesive.

7. The method according to claim 1, wherein: The dummy film includes polyimide or polyethylene terephthalate.

8. The method according to claim 1, wherein: The cutting area is defined as a single closed curve.

9. The method according to claim 1, wherein: The separation comprises: inverting the display panel and the dummy film so that the display panel is located under the dummy film; and The dummy film is separated upward from the main body portion.

10. The method according to claim 1, further comprising: placing a polarizing film on the display panel, wherein the polarizing film is divided into a sub-cutting area and a sub-main body portion surrounding the sub-cutting area; as well as irradiating a laser toward a sub-cutting line over the polarizing film to cut the sub-cutting area, the sub-cutting line being defined as a boundary between the sub-cutting area and the sub-body portion, Wherein, the sub-cutting line overlaps with the cutting line.

11. The method according to claim 1, further comprising: Before said cutting said cutting area, said dummy film and said display panel are placed on a stage, Wherein, the dummy film is located on the stage.

12. The method according to claim 11, wherein: The table does not support the cutting area, but rather supports the main body portion.

13. The method according to claim 12, wherein: An opening portion overlapping the cutting area is defined in the stage, and the opening portion has a greater width than the cutting area.

14. The method according to claim 11, wherein: The table supports the cutting area and the body portion.

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