Display device

Abstract

The present application relates to a display device, which includes a substrate, a packaging portion, a sealing portion, an intermediate wiring and a connecting wiring, wherein the substrate includes a first substrate portion having a first area, a second substrate portion having a second area and a bending area located between the first substrate portion and the second substrate portion, the substrate is capable of bending around a bending axis extending in a first direction, the packaging portion is located above the first substrate portion, the sealing portion is located between the first substrate portion and the packaging portion to combine the first substrate portion to the packaging portion, the intermediate wiring includes a first intermediate wiring portion located in the first area and a second intermediate wiring portion located in the second area, the intermediate wiring is covered by at least one inorganic layer, and the connecting wiring includes at least a portion located in the bending area and connects the first intermediate wiring portion to the second intermediate wiring portion.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] Korean Patent Application No. 10-2018-0111602, filed on September 18, 2018 in the Korean Intellectual Property Office and entitled “DISPLAY DEVICE,” is hereby incorporated by reference in its entirety. Technical Field

[0003] One or more embodiments relate to a display device. Background Art

[0004] Typically, a display device may be used in an electronic device such as a smart phone, a laptop, a digital camera, a camcorder, a personal digital assistant, a notebook computer, a desktop personal computer, or an electronic device such as a desktop computer, a television, an outdoor billboard, an exhibition display device, a car dashboard, a head-mounted display (HUD). Summary of the invention

[0005] An embodiment relates to a display device, which includes a substrate, a packaging portion, a sealing portion, an intermediate wiring and a connecting wiring, wherein the substrate includes a first substrate portion having a first area, a second substrate portion having a second area and a bending area located between the first substrate portion and the second substrate portion, at the bending area the substrate can be bent around a bending axis extending in a first direction, the packaging portion is located above the first substrate portion, the sealing portion is located between the first substrate portion and the packaging portion to combine the first substrate portion to the packaging portion, the intermediate wiring includes a first intermediate wiring portion located in the first area and a second intermediate wiring portion located in the second area, the intermediate wiring is covered by at least one inorganic layer, and the connecting wiring includes at least a portion located in the bending area and connects the first intermediate wiring portion to the second intermediate wiring portion.

[0006] The second substrate portion may be separately located below the first substrate portion in a vertical direction of the substrate. The first substrate portion may be connected to the second substrate portion through a bent region.

[0007] The curved region may be located in a space between the first substrate portion and the second substrate portion. The curved material may fill the space.

[0008] The curved material may include an organic material.

[0009] A height of the bent material may correspond to a sum of a first thickness of the at least one inorganic layer and a second thickness of the intermediate wiring in a vertical direction of the substrate.

[0010] The support material may support the substrate. The support material may be located in a portion of the space between the first substrate portion and the second substrate portion below the bending material.

[0011] The connection wiring may extend across the first region, the bending region and the second region. The connection wiring may be bendable in the bending region.

[0012] The connection wiring may be connected to the first intermediate wiring portion and the second intermediate wiring portion through corresponding contact portions within the contact hole in the at least one inorganic layer.

[0013] The connection wiring may be exposed above the substrate. An upper organic layer covering the connection wiring may be located on the connection wiring.

[0014] The connection wiring may be surrounded by the bending material and the upper organic layer in the bending region.

[0015] The sealing part may be spaced apart from the upper organic layer. There may be a space between the sealing part and the upper organic layer.

[0016] The sealing portion may at least partially overlap the first intermediate wiring portion in a vertical direction of the substrate.

[0017] A pad terminal electrically connected to the connection wiring may be located in the second substrate portion. A driving terminal of a driver may be connected to the pad terminal.

[0018] The display area may be located in the first area. The intermediate wiring may be electrically connected to the device in the display area.

[0019] Embodiments relate to a display device, which includes a substrate, an encapsulation portion, a sealing portion, an intermediate wiring, and a connecting wiring, wherein the substrate includes a first substrate portion having a display area, a second substrate portion having a pad terminal, and a bending area connecting the first substrate portion to the second substrate portion, the encapsulation portion is located above the first substrate portion, the sealing portion is located between the first substrate portion and the encapsulation portion to bond the first substrate portion to the encapsulation portion, the intermediate wiring is covered by at least one inorganic layer and includes a first intermediate wiring portion electrically connected to a device in the display area and a second intermediate wiring portion electrically connected to the pad terminal, the connecting wiring is located above the substrate, and the connecting wiring connects the first intermediate wiring portion to the second intermediate wiring portion. The bending area may be located in a gap between the first substrate portion and the second substrate portion. The bending area may be filled with a bending material including an organic material.

[0020] A height of the bent material may correspond to a sum of a first thickness of the at least one inorganic layer and a second thickness of the intermediate wiring in a vertical direction of the substrate.

[0021] A support material supporting the substrate may be located in a portion of the space between the first substrate portion and the second substrate portion below the curved material.

[0022] The connection wiring may extend across the first substrate portion, the bending region and the second substrate portion. The connection wiring may be bendable in the bending region.

[0023] The connection wiring may be connected to the first intermediate wiring portion and the second intermediate wiring portion through contact portions disposed in contact holes in the at least one inorganic layer, respectively.

[0024] The connection wiring may be exposed above the substrate. An upper organic layer covering the connection wiring may be located on the connection wiring. The connection wiring may be surrounded by the bending material and the upper organic layer in the bending region. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Features will become apparent to those skilled in the art by describing in detail exemplary embodiments with reference to the accompanying drawings, in which:

[0026] Figure 1 shows an isolated perspective view of a display device according to an embodiment;

[0027] Figure 2 Shows Figure 1 An enlarged cross-sectional view of a display device;

[0028] Figure 3 Shows Figure 2 An enlarged cross-sectional view of a state in which a portion of the display device is unfolded; and

[0029] Figure 4 Shows Figure 3 An enlarged cross-sectional view of a state in which a portion of a display device is bent. DETAILED DESCRIPTION

[0030] Exemplary embodiments will now be described more fully below with reference to the accompanying drawings; however, the embodiments may be implemented in different forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey exemplary implementations to those skilled in the art.

[0031] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity. It should also be understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be an intermediate layer. In addition, it should be understood that when a layer is referred to as being "below" another layer, the layer may be directly below, or there may be one or more intermediate layers. In addition, it should also be understood that when a layer is referred to as being "between" two layers, the layer may be the only layer between the two layers, or there may be one or more intermediate layers. Throughout the specification, the same reference numerals indicate the same elements.

[0032] In the following examples, the X-axis, Y-axis, and Z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.

[0033] Figure 1 An exploded perspective view of a display device 100 according to an embodiment is shown.

[0034] Reference Figure 1 , the display device 100 may include a display panel 200. In an embodiment, the display device 100 may be an organic light emitting display device. In some implementations, the display device 100 may be a liquid crystal display, a field emission display, or an electronic paper display device.

[0035] The display panel 200 may include a substrate 201 and an encapsulation part 202 disposed over the substrate 201. A sealing part 203 may be disposed between the substrate 201 and the encapsulation part 202. The sealing part 203 may be disposed on a surface faced by the substrate 201 and the encapsulation part 202. The sealing part 203 may be disposed along edges of the substrate 201 and the encapsulation part 202.

[0036] One of the substrate 201 and the encapsulation part 202 may be exposed by extending to the outside of the other. For example, one region 204 of the substrate 201 may be exposed to the outside of the region where the substrate 201 overlaps with the encapsulation part 202 in the second direction (Y direction) of the display panel 200. The exposed region 204 includes a non-display area NDA. In an embodiment, one region 204 of the substrate 201 may not be exposed, and one region of the encapsulation part 202 may be exposed.

[0037] A pad area PA in which a plurality of pad terminals 205 are patterned and a fan-out area FA in which a plurality of wirings 206 are patterned may be arranged in the non-display area NDA.

[0038] The pad terminal 205 may be electrically connected to the wiring 206, and may also be electrically connected to the driving terminal 151 of the driver 150 such as a chip on film (COF). The wiring 206 may be electrically connected to a device within the display area DA that displays an image.

[0039] The touch sensing unit 120 may be disposed above the encapsulation unit 202. The touch sensing unit 120 may be an on-cell touch sensing unit disposed on the encapsulation unit 202. The on-cell touch sensing unit may include a touch screen pattern. The touch sensing unit 120 may be formed integrally with the encapsulation unit 202, for example.

[0040] The polarizing layer 130 may be disposed above the touch sensing unit 120. The polarizing layer 130 may block external light reflection.

[0041] A window cover 140 configured to protect the display panel 200, the touch sensing unit 120, and the polarizing layer 130 may be disposed over the polarizing layer 130. The window cover 140 may include rigid glass or a flexible film.

[0042] In an implementation, a bending area BA in which the substrate 201 is bent in one direction may be disposed in the display panel 200 .

[0043] Figure 2 Shows Figure 1 FIG. 1 is an enlarged cross-sectional view of a portion of the display device 100 . Figure 3 Shows Figure 2 An enlarged cross-sectional view of a state in which a portion of the display device 100 is unfolded. Figure 4 yes Figure 3 An enlarged cross-sectional view of a state in which a portion of the display device 100 is bent.

[0044] Reference Figures 2 to 4 , the display panel 200 may include a substrate 201. The substrate 201 may include a first substrate portion 207, a second substrate portion 208, and a bending area BA, wherein a first area 1A is arranged in the first substrate portion 207, a second area 2A is arranged in the second substrate portion 208, and the bending area BA is located between the first area 1A and the second area 2A. The bending area BA may extend in a first direction (X direction) of the substrate 201. The bending area BA may be located between the first area 1A and the second area 2A in a second direction (Y direction) intersecting the first direction (X direction). The substrate 201 may be bent around a virtual bending axis extending in the first direction (X direction).

[0045] The substrate 201 including the first substrate portion 207 and the second substrate portion 208 may include a rigid substrate. The first substrate portion 207 and the second substrate portion 208 may be substrates including the same material. In an embodiment, the first substrate portion 207 and the second substrate portion 208 may be glass substrates. In some implementations, the first substrate portion 207 and the second substrate portion 208 may be polymer substrates, metal substrates, or composite substrates thereof.

[0046] The first region 1A includes a display area DA. In an embodiment, the first region 1A may further include a portion of a non-display area NDA in addition to the display area DA.

[0047] The thin film transistor TFT may be arranged in the display area DA and may be electrically connected to the organic light emitting diode 220 as a display element. The electrical connection between the organic light emitting diode 220 and the thin film transistor TFT may include an electrical connection between a pixel electrode 221 of the organic light emitting diode 220 and the thin film transistor TFT.

[0048] The thin film transistor TFT may also be disposed in a peripheral area outside the display area DA. The thin film transistor TFT disposed in the peripheral area may be a part of a circuit unit configured to control an electrical signal applied to the display area DA.

[0049] The thin film transistor TFT may include a semiconductor layer 210, a gate electrode 215, a source electrode 217, and a drain electrode 218. The semiconductor layer 210 may include amorphous silicon, polycrystalline silicon, or an organic semiconductor material.

[0050] The first inorganic layer 209 may be disposed on the substrate 201. The first inorganic layer 209 may be a barrier layer. The first inorganic layer 209 may include an inorganic material such as silicon oxide, silicon nitride and / or silicon oxynitride. The first inorganic layer 209 may planarize the surface of the substrate 201 and reduce or prevent the penetration of moisture or external air. The first inorganic layer 209 may be in the form of a single layer or multiple layers.

[0051] The semiconductor layer 210 may be disposed on the first inorganic layer 209. The semiconductor layer 210 may include a channel region 211, a source region 212, and a drain region 213. The source region 212 and the drain region 213 may be disposed on opposite sides of the channel region 211 and may be doped with impurities.

[0052] The semiconductor layer 210 may be covered by a second inorganic layer 214. The second inorganic layer 214 may include a gate insulating layer. The second inorganic layer 214 may include an inorganic material such as silicon oxide, silicon nitride and / or silicon oxynitride. The second inorganic layer 214 may be in the form of a single layer or multiple layers.

[0053] The gate electrode 215 may be disposed on the second inorganic layer 214. The gate electrode 215 may include a metal material having conductivity. For example, the gate electrode 215 may include one of Mo, Al, Cu, and Ti. The gate electrode 215 may be in the form of a single layer or a multilayer.

[0054] The gate electrode 215 may be covered by a third inorganic layer 216. The third inorganic layer 216 may be an interlayer insulating layer. The third inorganic layer 216 may include an inorganic material such as silicon oxide, silicon nitride and / or silicon oxynitride. The third inorganic layer 216 may be in the form of a single layer or multiple layers.

[0055] The source electrode 217 and the drain electrode 218 may be arranged on the third inorganic layer 216. The source electrode 217 and the drain electrode 218 may include a metal material having conductivity. For example, the source electrode 217 and the drain electrode 218 may include one of Mo, Al, Cu, and Ti. The source electrode 217 and the drain electrode 218 may be in the form of a single layer or a multilayer. For example, each of the source electrode 217 and the drain electrode 218 may have a stacked structure of Ti / Al / Ti.

[0056] The first inorganic layer 209 , the second inorganic layer 214 , and the third inorganic layer 216 may be deposited by a deposition process. The first inorganic layer 209 , the second inorganic layer 214 , and the third inorganic layer 216 may extend on the first substrate portion 207 and the second substrate portion 208 .

[0057] The planarization layer 219 may be disposed on the thin film transistor TFT. For example, in the case where the organic light emitting diode 220 is disposed above the thin film transistor TFT, the planarization layer 219 may planarize a portion located on the thin film transistor TFT. The planarization layer 219 may include an organic material. For example, the planarization layer 219 may include acrylic acid, benzocyclobutene (BCB), or hexamethyldisiloxane (HMDSO).

[0058] The pixel defining layer 224 may be disposed on the planarization layer 219. The pixel defining layer 224 may include an opening corresponding to each sub-pixel, and each sub-pixel may be defined by the opening. For example, the pixel defining layer 224 may include an opening that exposes a portion of the surface of the pixel electrode 221. The pixel defining layer 224 may include an organic material such as polyimide or HMDSO.

[0059] The planarization layer 219 and the pixel definition layer 224 may have a single-layer stack structure of organic material layers. In some implementations, the planarization layer 219 may have a two-layer structure, or another organic material layer may be further disposed between the planarization layer 219 and the pixel definition layer 224.

[0060] The organic light emitting diode 220 may be disposed on the planarization layer 219. The organic light emitting diode 220 may include a pixel electrode 221, an opposing electrode 223, and an intermediate layer 222 disposed between the pixel electrode 221 and the opposing electrode 223. The intermediate layer 222 may include an emission layer.

[0061] The pixel electrode 221 may contact one of the source electrode 217 and the drain electrode 218 through a contact hole provided in the planarization layer 219. The pixel electrode 221 may include a transparent electrode or a reflective electrode. In the case where the pixel electrode 221 includes a transparent electrode, the pixel electrode 221 includes a transparent conductive layer. In the case where the pixel electrode 221 includes a reflective electrode, the pixel electrode 221 includes a reflective layer and a transparent conductive layer located on the reflective layer.

[0062] The intermediate layer 222 may include an organic emission layer.

[0063] In another embodiment, the intermediate layer 222 may include an organic emission layer, and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0064] In an implementation, the intermediate layer 222 may include an organic emission layer, and may additionally further include various functional layers according to a purpose of use of the display device 100 .

[0065] The intermediate layer 222 may have a suitable structure. For example, the intermediate layer 222 may include a layer that is integral over the plurality of pixel electrodes 221 , or may include a layer that is patterned to correspond to each of the plurality of pixel electrodes 221 .

[0066] The opposing electrode 223 may cover the display area DA. The opposing electrode 223 may extend as a whole on the plurality of organic light emitting diodes 220 and correspond to the plurality of pixel electrodes 221. The opposing electrode 223 may be a common electrode. The opposing electrode 223 may be a transparent electrode or a reflective electrode. When the opposing electrode 223 is a transparent electrode, the opposing electrode 223 may include a metal layer and a transparent conductive layer disposed on the metal layer. When the opposing electrode 223 is a reflective electrode, the opposing electrode 223 may include a metal layer.

[0067] In an implementation, a plurality of sub-pixels may be arranged over the first substrate portion 207. As an example, each sub-pixel may implement red, green, blue, or white.

[0068] The second area 2A includes a non-display area NDA. In an embodiment, the second area 2A may further include a display area DA.

[0069] A plurality of inorganic layers, for example, the first inorganic layer 209, the second inorganic layer 214, and the third inorganic layer 216 may be stacked on the second substrate portion 208. Similar to the first substrate portion 207, the first inorganic layer 209, the second inorganic layer 214, and the third inorganic layer 216 may be stacked on the second substrate portion 208.

[0070] In some implementations, another inorganic layer may be further disposed on the second substrate portion 208, or some inorganic layers may be omitted. For example, in addition to the first inorganic layer 209, the second inorganic layer 214, and the third inorganic layer 216, another inorganic layer may be independently disposed on the second substrate portion 208.

[0071] The encapsulation part 202 may be coupled over the substrate 201. The encapsulation part 202 may protect the organic light emitting diode 220 and other devices from moisture or external air. In an embodiment, the encapsulation part 202 may be a rigid glass substrate. In an embodiment, the encapsulation part 202 may include a polymer substrate, a metal substrate, or a composite substrate thereof.

[0072] The sealing part 203 may be arranged between the substrate 201 and the encapsulation part 202. The sealing part 203 may be arranged on surfaces of the first substrate part 207 and the encapsulation part 202 facing each other. The sealing part 203 may surround the display area DA above the first substrate part 207. The sealing part 203 may include fritted glass. The fritted glass may include glass powder and oxide powder. The sealing part 203 may bond the first substrate part 207 to the encapsulation part 202.

[0073] The first substrate portion 207 may be spaced apart from the second substrate portion 208 to reduce a dead zone, which is an area that does not directly participate in light emission, for example, an area outside the display area DA. The first substrate portion 207 and the second substrate portion 208 spaced apart from each other may be connected by a bending area BA. The first substrate portion 207 and the second substrate portion 208 may be positioned vertically relative to each other.

[0074] The intermediate wiring 225 may be arranged above the substrate 201. The intermediate wiring 225 may be electrically connected to the devices within the display area DA. The intermediate wiring 225 may include a first intermediate wiring portion 226 and a second intermediate wiring portion 227. In some implementations, the intermediate wiring 225 may include a plurality of spaced-apart intermediate wiring portions.

[0075] The first intermediate wiring portion 226 may be disposed in the first region 1A. The first end 226a of the first intermediate wiring portion 226 may extend to one edge 207a of the first substrate portion 207. The second end 226b of the first intermediate wiring portion 226 may overlap the sealing portion 203 in the vertical direction (Z direction) of the substrate 201.

[0076] The second intermediate wiring portion 227 may be disposed in the second region 2A. One end 227a of the second intermediate wiring portion 227 may extend to one edge 208a of the second substrate portion 208. One edge 207a of the first substrate portion 207 may face one edge 208a of the second substrate portion 208.

[0077] The first intermediate wiring portion 226 and the second intermediate wiring portion 227 may be disposed on the same layer as the gate electrode 215. The first intermediate wiring portion 226 and the second intermediate wiring portion 227 may be formed by using the same material as the gate electrode 215 during the same process of forming the gate electrode 215. The first intermediate wiring portion 226 and the second intermediate wiring portion 227 may be covered by the third inorganic layer 216.

[0078] In an embodiment, the first intermediate wiring portion 226 and the second intermediate wiring portion 227 may be covered by an inorganic layer independently disposed over the second substrate portion 208. In some implementations, a plurality of inorganic layers may be stacked on the first intermediate wiring portion 226 and the second intermediate wiring portion 227.

[0079] The connection wiring 233 may be disposed above the intermediate wiring 225. The connection wiring 233 may connect the first intermediate wiring portion 226 to the second intermediate wiring portion 227. At least a portion of the connection wiring 233 may be disposed in the bending area BA.

[0080] The connection wiring 233 may extend across the first region 1A, the bending region BA, and the second region 2A. The connection wiring 233 may be bent in the bending region BA. During the same process of forming the source electrode 217 and the drain electrode 218, the connection wiring 233 may include the same material as the source electrode 217 and the drain electrode 218. The connection wiring 233 may include one of Mo, Al, Cu, and Ti. In an embodiment, the connection wiring 233 may have a stacked structure of Ti / Al / Ti. The connection wiring 233 may be electrically connected to the wiring 206 arranged in the fan-out region FA and the pad terminal 205 arranged in the pad region PA. The pad terminal 205 may be connected to the driving terminal 151 of the driver 150.

[0081] The connection wiring 233 may be electrically connected to the first intermediate wiring portion 226 through the first contact portion 234 filling the first contact hole 1CTH passing through the third inorganic layer 216. The connection wiring 233 may be electrically connected to the second intermediate wiring portion 227 through the second contact portion 235 filling the second contact hole 2CTH passing through the third inorganic layer 216.

[0082] As described above, the first intermediate wiring portion 226 disposed over the first substrate portion 207 may be electrically connected to the second intermediate wiring portion 227 disposed over the second substrate portion 208 through the connection wiring 233 .

[0083] As described above, the first substrate portion 207 may be spaced apart from the second substrate portion 208. The second substrate portion 208 may be arranged below the first substrate portion 207 in the vertical direction of the substrate 201. The first substrate portion 207 may be connected to the second substrate portion 208 through the bending area BA. The bending area BA may be arranged in the interval d between the first substrate portion 207 and the second substrate portion 208. The interval d may correspond to a space between one edge 207a of the first substrate portion 207 and one edge 208a of the second substrate portion 208. The interval d may extend in the first direction (the X direction of the substrate 201).

[0084] The bent material 231 may be arranged in the interval d.

[0085] The bending material 231 may include an organic material. For example, the bending material 231 may include one of acrylic, BCB, HMDSO, and polyimide.

[0086] Regarding the curved material 231, an organic material prepared separately from the planarization layer 219 in the first region 1A may be arranged in the interval d. In an embodiment, the curved material 231 may be formed using the same material as that of the planarization layer 219 during the same process of forming the planarization layer 219. When the curved material 231 is an organic material that may be arranged in the interval d between the first substrate portion 207 and the second substrate portion 208, the organic material may be formed simultaneously with one of the organic materials provided to the display panel 200, or may be formed by a separate process.

[0087] The height h of the curved material 231 may correspond to the sum of the first thickness t1 of the plurality of inorganic layers including the first inorganic layer 209, the second inorganic layer 214, and the third inorganic layer 216 disposed on the substrate 201 and the second thickness t2 of the intermediate wiring 225. For example, the first thickness t1 of the plurality of inorganic layers including the first inorganic layer 209, the second inorganic layer 214, and the third inorganic layer 216 may be the total thickness of the stacked first inorganic layer 209, the second inorganic layer 214, and the third inorganic layer 216. The second thickness t2 of the intermediate wiring 225 may be the thickness of one of the first intermediate wiring portion 226 and the second intermediate wiring portion 227.

[0088] A support material 232 configured to support the substrate 201 may be further disposed in a portion of the interval d between the first substrate portion 207 and the second substrate portion 208 under the bending material 231. The support material 232 may be a material having flexibility to support the substrate 201 when the substrate 201 is bent.

[0089] The connection wiring 233 may be exposed on the first substrate portion 207 and the second substrate portion 208. In order to prevent oxidation of the connection wiring 233, an upper organic layer 236 may be disposed on the connection wiring 233.

[0090] The upper organic layer 236 may be made of a suitable material. For example, during the same process as the process of forming the planarization layer 219, the upper organic layer 236 may be formed by using the same material as the planarization layer 219. When the upper organic layer 236 is an organic material covering the connection wiring 233, the upper organic layer 236 may be formed simultaneously with one of the organic materials provided to the display panel 200, or may be formed by a separate process.

[0091] In the bending area BA, the connection wiring 233 may be surrounded by the bending material 231 and the upper organic layer 236. For example, a first surface 233a of the connection wiring 233 may be covered by the bending material 231, and a second surface 233b of the connection wiring 233 may be covered by the upper organic layer 236. The first surface 233a and the second surface 233b of the connection wiring 233 may be two opposing surfaces.

[0092] The sealing part 203 may be spaced apart from the upper organic layer 236. For example, a space S may be formed between the sealing part 203 and the upper organic layer 236. Due to the space S, the upper organic layer 236 may be spaced apart from the sealing part 203. The space S may be formed to help prevent damage to the upper organic layer 236 including an organic material that may be relatively susceptible to heat when laser energy is irradiated onto the sealing part 203 for bonding of the first substrate part 207 with the encapsulation part 202.

[0093] The sealing portion 203 and the first intermediate wiring portion 226 may include an overlapping region OL in which the sealing portion 203 at least partially overlaps the first intermediate wiring portion 226 in the vertical direction (Z direction) of the substrate 201. The overlapping region OL may be formed to help prevent damage to the first substrate portion 207 during the laser irradiation process. The first intermediate wiring portion 226 may block the laser beam from being irradiated onto the first substrate portion 207.

[0094] The manufacturing process of the display panel 200 having the above configuration is briefly described below.

[0095] The substrate 201 may be prepared. The substrate 201 may have a structure in which the first substrate portion 207, the second substrate portion 208, and the bending area BA are connected as one body. The substrate 201 at the initial stage may be a single glass substrate in which the first substrate portion 207 is not separated from the second substrate portion 208. The same glass material as that of the first substrate portion 207 and the second substrate portion 208 may be arranged in the bending area BA to connect the first substrate portion 207 to the second substrate portion 208. In an embodiment, the first substrate portion 207, the second substrate portion 208, and the bending area BA may constitute one body.

[0096] The first inorganic layer 209, the second inorganic layer 214, and the third inorganic layer 216 are formed on the first substrate portion 207, the second substrate portion 208, and the bending area BA. The first intermediate wiring portion 226 may be patterned on the first substrate portion 207, and the second intermediate wiring portion 227 may be patterned on the second substrate portion 208. The first intermediate wiring portion 226 and the second intermediate wiring portion 227 may be formed on the second inorganic layer 214.

[0097] Through the etching process, the first contact hole 1CTH may be formed in the first region 1A, and the second contact hole 2CTH may be formed in the second region 2A. The first contact hole 1CTH and the second contact hole 2CTH may be formed by removing a portion of the third inorganic layer 216 .

[0098] A connection wiring 233 may be formed over the intermediate wiring 225. The connection wiring 233 may extend across the first region 1A, the bending region BA, and the second region 2A. The connection wiring 233 may be electrically connected to the first intermediate wiring portion 226 through a first contact portion 234 filling the first contact hole 1CTH. The connection wiring 233 may be electrically connected to the second intermediate wiring portion 227 through a second contact portion 235 filling the second contact hole 2CTH.

[0099] When forming the first contact hole 1CTH and the second contact hole 2CTH, the space d may be formed in the bending area BA by the same etching process. The space d may include a region passing through the first inorganic layer 209 , the second inorganic layer 214 , and the third inorganic layer 216 .

[0100] The curved material 231 including an organic material may fill the space d.

[0101] The support material 232 may be disposed under the curved material 231. For example, the region under the curved material 231 may be etched a predetermined depth from the bottom surface 201a of the substrate 201 in the vertical direction (Z direction) of the substrate 201. The support material 232 may fill the etched region.

[0102] Through the above process, the first substrate portion 207 may be separated from the second substrate portion 208. The bending material 231 and the support material 232 may fill the interval d between the first substrate portion 207 and the second substrate portion 208. When the bending area BA is bent in one direction, as shown in FIG. Figure 4 As shown in , the second substrate portion 208 may be located below the first substrate portion 207 in the vertical direction (Z direction) of the substrate 201 .

[0103] By way of summary and review, a display unit may be arranged above a substrate of a display device. Wiring may be arranged in an area of ​​the substrate, and a driver may be connected to a pad terminal. In addition to an area where a display unit configured to display an image is arranged, the display device may further include a dead zone as an area that is not directly involved in light emission. The dead zone may include an area where wiring such as a fan-out unit is arranged and an area where a driver such as a chip-on-film (COF) is connected to a pad terminal.

[0104] In order to achieve full screen display, it is desirable that the display device reduce the area of ​​the dead zone. One or more embodiments include a display device that minimizes the dead zone. For example, in a display device according to an embodiment, a plurality of substrate portions may be bent and vertically repositioned. Thus, the dead zone may be minimized.

[0105] Exemplary embodiments have been disclosed herein, and although specific terms are employed, they are used and interpreted in a general and descriptive sense only, and not for purposes of limitation. In some cases, as will be apparent to one of ordinary skill in the art as this application is submitted, unless otherwise expressly indicated, features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Accordingly, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention as set forth in the appended claims.

Claims

1. A display device, comprising: A substrate, the substrate comprising: a first substrate portion, the first substrate portion comprising a first region; a second substrate portion including a second region; and a bending region located between the first substrate portion and the second substrate portion, wherein the substrate is bendable about a bending axis extending in a first direction; a packaging portion, the packaging portion being located above the first substrate portion; a sealing portion located between the first substrate portion and the packaging portion to bond the first substrate portion to the packaging portion; an intermediate wiring including a first intermediate wiring portion located in the first region and a second intermediate wiring portion located in the second region, the intermediate wiring being covered by at least one inorganic layer; and a connecting wiring including at least a portion located in the bending region and connecting the first intermediate wiring portion to the second intermediate wiring portion, The second substrate portion is separately located below the first substrate portion in a vertical direction of the substrate.

2. The display device according to claim 1, wherein: The first substrate portion is connected to the second substrate portion through the bending region.

3. The display device according to claim 2, wherein: The bending region is located in a space between the first substrate portion and the second substrate portion, and The space is filled with a curved material.

4. The display device according to claim 3, wherein: The curved material includes an organic material.

5. The display device according to claim 3, wherein: The height of the curved material corresponds to the sum of a first thickness of the at least one inorganic layer and a second thickness of the intermediate wiring in the vertical direction of the substrate.

6. The display device according to claim 5, wherein: A support material is provided in a portion of the space between the first substrate portion and the second substrate portion below the bending material, the support material supporting the substrate.

7. The display device according to claim 3, wherein: The connection wiring extends across the first region, the bending region, and the second region and is bendable in the bending region.

8. The display device according to claim 7, wherein: The connection wiring is connected to the first intermediate wiring portion and the second intermediate wiring portion through corresponding contacts in the contact holes in the at least one inorganic layer.

9. The display device according to claim 3, wherein: The connection wiring is exposed above the substrate, and An upper organic layer covering the connection wiring is disposed on the connection wiring.

10. The display device according to claim 9, wherein: The connection wiring is surrounded by the bending material and the upper organic layer in the bending region.

11. The display device according to claim 9, wherein: The sealing portion is spaced apart from the upper organic layer, and A space is provided between the sealing portion and the upper organic layer.

12. The display device according to claim 1, wherein: The sealing portion at least partially overlaps the first intermediate wiring portion in a vertical direction of the substrate.

13. The display device according to claim 1, wherein: The second substrate portion is provided with a pad terminal electrically connected to the connection wiring, and The pad terminals are connected to driving terminals of a driver.

14. The display device according to claim 1, wherein: A display area is provided in the first area, and The intermediate wiring is electrically connected to devices within the display area.

15. A display device comprising: A substrate, the substrate comprising: a first substrate portion, the first substrate portion comprising a display area; a second substrate portion including a pad terminal; and a flex region connecting the first substrate portion to the second substrate portion; a packaging portion, the packaging portion being located above the first substrate portion; a sealing portion located between the first substrate portion and the packaging portion to bond the first substrate portion to the packaging portion; an intermediate wiring including a first intermediate wiring portion and a second intermediate wiring portion and covered by at least one inorganic layer, wherein the first intermediate wiring portion is electrically connected to the device in the display area and the second intermediate wiring portion is electrically connected to the pad terminal; and a connecting wiring, the connecting wiring being located above the substrate, the connecting wiring connecting the first intermediate wiring portion to the second intermediate wiring portion, wherein the second substrate portion is separately located below the first substrate portion in a vertical direction of the substrate, and The bending area is located in a space between the first substrate portion and the second substrate portion and is filled with a bending material including an organic material.

16. The display device according to claim 15, wherein: The height of the curved material corresponds to the sum of a first thickness of the at least one inorganic layer and a second thickness of the intermediate wiring in a vertical direction of the substrate.

17. The display device according to claim 16, wherein: A support material is provided in a portion of the space between the first substrate portion and the second substrate portion below the bending material, the support material supporting the substrate.

18. The display device according to claim 16, wherein: The connection wiring extends across the first substrate portion, the bending region, and the second substrate portion and is bendable in the bending region.

19. The display device according to claim 18, wherein: The connection wiring is connected to the first intermediate wiring portion and the second intermediate wiring portion through contact portions arranged in contact holes in the at least one inorganic layer, respectively.

20. The display device according to claim 19, wherein: The connection wiring is exposed above the substrate, An upper organic layer covering the connection wiring is disposed on the connection wiring, and The connection wiring is surrounded by the bending material and the upper organic layer in the bending region.

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