Modular speaker

Abstract

The present invention discloses a modular loudspeaker, which includes a first housing and a sound generating module; the sound generating module has a first sound outlet hole and a sound outlet cavity, and the first sound outlet hole communicates with the sound outlet cavity; the first housing has a second sound outlet hole and an installation cavity, the sound generating module is installed in the installation cavity, and the first sound outlet hole of the sound generating module communicates with the second sound outlet hole so that the gas in the sound outlet cavity directly enters the outside through the first sound outlet hole and the second sound outlet hole in sequence; on the one hand, it enables all the gas to be output outside the first housing, ensuring that the sound will not be distorted and improving the sound effect. On the other hand, it is convenient to assemble, replace and repair, improving the assembly efficiency. It can be sold as a whole or the sound generating module can be sold separately, with high market flexibility and good social value and economic benefits.

Description

Technical Field

[0001] The present invention relates to the technical field of speakers, and in particular to a modular speaker. Background Art

[0002] At present, the number of components of speakers on the market is relatively large, the assembly process of a speaker is cumbersome, the assembly is inconvenient, and the assembly efficiency is low. If you want to replace one of the components, it is also relatively troublesome, which is not conducive to subsequent maintenance and replacement. At the same time, for different parameter requirements of the same product, traditionally, it can only be completed by assembling the entire speaker, and the flexibility is poor.

[0003] In addition, existing speakers generally include a housing and a sound generating component installed in the housing. The gas generated by the sound generating component needs to pass through the inner cavity of the housing to be discharged outside the housing, resulting in sound distortion and affecting the sound effect.

[0004] Therefore, it is necessary to research a new technical solution to solve the above problems. Summary of the Invention

[0005] In view of this, in view of the deficiencies of the existing technology, the main purpose of the present invention is to provide a modular speaker. On the one hand, all the gas is output outside the first housing, ensuring that the sound will not be distorted, improving the sound effect. On the other hand, the assembly is convenient, easy to replace and repair, improving the assembly efficiency. It can be sold as a whole or the sound module can be sold separately, with high market flexibility and having good social value and economic benefits.

[0006] To achieve the above purpose, the present invention adopts the following technical solutions:

[0007] A modular speaker includes a first housing and a sound module; the sound module has a first sound outlet hole and a sound outlet cavity, and the first sound outlet hole communicates with the sound outlet cavity;

[0008] The first housing has a second sound outlet hole and an installation cavity, the sound module is installed in the installation cavity, and the first sound outlet hole of the sound module communicates with the second sound outlet hole so that the gas in the sound outlet cavity directly enters the outside through the first sound outlet hole and the second sound outlet hole in sequence.

[0009] As a preferred solution, the first housing includes a first upper housing and a first lower housing assembled up and down. Among the first upper housing and the first lower housing, one is convexly provided with a clamping protrusion, and the other is concavely provided with a clamping groove. The first upper housing and the first lower housing are connected, and the clamping protrusion is adapted to be within the clamping groove.

[0010] As a preferred solution, the sound module includes a speaker unit, a second upper housing and a second lower housing, and the second upper housing and the second lower housing are assembled to form a sound outlet cavity;

[0011] A first relief hole that penetrates the upper and lower sides of the second lower housing and the sound output cavity is formed in the second lower housing. A second relief hole that penetrates the upper and lower sides of the first housing and the installation cavity is formed in the first housing. The speaker unit is installed in the first relief hole, and the upper end of the speaker unit extends into the sound output cavity. At the same time, the speaker unit is installed at the second relief hole.

[0012] As a preferred solution, a first annular convex edge protrudes from the upper end surface of the second lower housing, and a second annular convex edge protrudes downward from the peripheral edge of the lower end of the second upper housing. The upper end surface of the second lower housing and the outer side surface of the first annular convex edge form a first installation position, and the second annular convex edge is installed in the first installation position.

[0013] As a preferred solution, a second installation position is formed on the inner bottom wall of the installation cavity, and the second lower housing is installed in the second installation position.

[0014] As a preferred solution, a positioning portion protrudes upward from the inner bottom wall of the installation cavity. The second lower housing is provided with a positioning hole corresponding to the positioning portion. The second lower housing is connected to the first housing, and the positioning portion is fitted into the positioning hole.

[0015] As a preferred solution, a first through hole that penetrates the upper side of the positioning portion, the lower side of the first housing, and the sound output cavity is formed in the positioning portion. The first through hole is completely open, or a first damping member is covered at the first through hole.

[0016] As a preferred solution, the speaker unit includes a frame, a magnetic circuit assembly, a vibration diaphragm, and an isolation cover. The magnetic circuit assembly is disposed at the central position of the frame. A hollow structure is disposed on the frame around the magnetic circuit assembly. An isolation ring is formed on the frame, and the isolation ring divides the hollow structure into at least one high-frequency area and one low-frequency area. The high-frequency area is close to the magnetic circuit assembly, and the low-frequency area is far from the magnetic circuit assembly. The vibration diaphragm is disposed on the frame and covers the magnetic circuit assembly, the high-frequency area, and the low-frequency area.

[0017] The isolation cover is connected to the upper part of the isolation ring and is located above the magnetic circuit assembly. The isolation cover encloses a high-frequency chamber below the magnetic circuit assembly below the magnetic circuit assembly, and a second through hole that communicates the high-frequency chamber and the sound cavity is provided on the isolation cover.

[0018] As a preferred solution, the second through hole is completely open, or a second damping member is covered at the second through hole.

[0019] As a preferred solution, the isolation cover has a cover body portion and an annular side plate portion integrally extending upward from the outer peripheral edge of the cover body portion, and the aforementioned second through hole is provided on the cover body portion and / or the annular side plate portion.

[0020] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical scheme that the sound-emitting component adopts a modular structure. On the one hand, the gas generated in the sound-emitting component does not need to enter the installation cavity of the first shell, but is directly discharged out of the first shell through the first sound outlet hole and the second sound outlet hole in sequence, so that all the gas is output to the outside of the first shell, ensuring that the sound will not be distorted and improving the sound effect. On the other hand, it is easy to assemble, replace and repair, and improves the assembly efficiency. It can be sold as a whole or as a separate sound module, with high market flexibility and good social value and economic benefits.

[0021] Secondly, by using the corresponding through-holes to fine-tune the audio, the sound quality of the subsequent earphone products can be further improved, and the corresponding through-holes can be flexibly selected to cover with corresponding damping parts according to actual design requirements;

[0022] In addition, the overall structural design is ingenious and reasonable, and the various parts are easy and firm to assemble, ensuring the stability and reliability of the subsequent finished earphones during use.

[0023] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of a three-dimensional assembly structure of a preferred embodiment of the present invention;

[0025] Figure 2 It is a schematic diagram of a three-dimensional assembly structure from another angle of a preferred embodiment of the present invention;

[0026] Figure 3 It is a schematic diagram of the decomposed structure of a preferred embodiment of the present invention;

[0027] Figure 4 It is a schematic diagram of the decomposition structure of the sound module of a preferred embodiment of the present invention;

[0028] Figure 5 It is a schematic diagram of the decomposed structure of a speaker unit according to a preferred embodiment of the present invention;

[0029] Figure 6 It is a schematic cross-sectional structure diagram of a preferred embodiment of the present invention;

[0030] Figure 7 It is a schematic diagram of the general gas movement path structure of a preferred embodiment of the present invention.

[0031] Description of the accompanying drawings:

[0032] 10. First housing 101, second sound outlet

[0033] 102. Installation cavity 103. Second installation position

[0034] 104. Positioning part 105. First through hole

[0035] 11. First upper housing 111. Snap protrusion

[0036] 112. Circuit board installation position 113. Wiring hole

[0037] 12. First lower housing 121. Card slot

[0038] 122. Second relief hole

[0039] 20. Sound generating module

[0040] 201. First sound outlet hole 202. Sound outlet cavity

[0041] 21. Speaker unit 211. Frame

[0042] 2111. Hollow installation position 2112. Isolation ring

[0043] 2113. High - frequency area 2114. Low - frequency area

[0044] 212. Diaphragm 213. Isolation cover

[0045] 2131. Cover body part 2132. Annular side plate part

[0046] 2133. Second through hole

[0047] 214. Cover plate 2141. Third sound outlet hole

[0048] 22. Second upper housing 221. Second annular rib

[0049] 23. Second lower housing 231. First relief hole

[0050] 232. First annular rib 233. First installation position

[0051] 234. Positioning hole 235. Cylindrical part

[0052] 236. Limiting step part

[0053] 241. Yoke 242. Magnet

[0054] 243. Washer 244. Voice coil

[0055] 245. Third through hole

[0056] 31. First EVA gasket 32. Second EVA gasket

[0057] 33. The third EVA gasket 34. The fourth EVA gasket

[0058] 41. The first damping member 42. The second damping member

[0059] 43. The third damping member 44. The fourth damping member

[0060] 45. The substrate

[0061] 50. The circuit board. Detailed implementation manners

[0062] As Figures 1 to 7 shown, a modular loudspeaker includes a first housing 10, a circuit board 50 and a sound generating module 20; the sound generating module 20 has a first sound outlet hole 201 and a sound outlet cavity 202, and the first sound outlet hole 201 communicates with the sound outlet cavity 202;

[0063] The first housing 10 has a second sound outlet hole 101 and an installation cavity 102, the sound generating module 20 is installed in the installation cavity 102, and the first sound outlet hole 201 of the sound generating module 20 communicates with the second sound outlet hole 101 so that the gas in the sound outlet cavity 202 directly passes through the first sound outlet hole 201 and the second sound outlet hole 101 in sequence and enters the outside world. At the same time, the gas in the sound outlet cavity 202 will not enter the installation cavity 102, effectively ensuring the sound quality.

[0064] In this embodiment, the first housing 10 includes a first upper housing 11 and a first lower housing 12 which are assembled up and down. Among the first upper housing 11 and the first lower housing 12, one is convexly provided with a clamping protrusion 111, and the other is concavely provided with a clamping groove 121. The first upper housing 11 and the first lower housing 12 are connected, and the clamping protrusion 111 is adapted to be within the clamping groove 121.

[0065] The upper end of the second upper housing 22 is provided with a circuit board installation position 112, and the circuit board 50 is installed on the circuit board installation position 112. The second upper housing 11 is also provided with a wire passing hole 113 communicating with the sound outlet cavity 202. After the wires of the circuit board 50 pass through this wire passing hole 113, a sealing treatment is performed to prevent the gas in the sound outlet cavity 202 from entering the installation cavity 102.

[0066] In this embodiment, the sound generating module 20 includes a speaker unit 21, a second upper housing 22, and a second lower housing 23. The second upper housing 22 and the second lower housing 23 are assembled to form a sound output cavity 202. In this embodiment, the second sound output hole 101 is opened on the inner side of the first upper housing 11, and the first sound output hole 201 is opened on the outer side of the second upper housing 22. The inner side of the first upper housing 11 is connected to the outer side of the second upper housing 22 through a fourth EVA gasket 34 to ensure the airtightness at the connection between the first upper housing 11 and the second upper housing 22.

[0067] A first relief hole 231 is opened on the second lower housing 23, which penetrates through the upper and lower sides of the second lower housing 23 and the sound output cavity 202. A second relief hole 122 is opened on the first lower housing 12 of the first housing 10, which penetrates through the upper and lower sides of the first lower housing 12 of the first housing 10 and the installation cavity 102. The speaker unit 21 is installed in the first relief hole 231, and the upper end of the speaker unit 21 extends into the sound output cavity 202. At the same time, the speaker unit 21 is installed at the second relief hole 122 and the speaker unit 21 is not exposed outside the first housing 10.

[0068] The upper end surface of the second lower housing 23 protrudes with a first annular convex edge 232. The lower periphery of the second upper housing 22 protrudes downward with a second annular convex edge 221. The upper end surface of the second lower housing 23 and the outer side surface of the first annular convex edge 232 form a first installation position 233. The second annular convex edge 221 is installed on the first installation position 233. The lower end surface of the second annular convex edge 221 is connected to the upper end surface of the second lower housing 23 where the first installation position 233 is located through a first EVA gasket 31. A second installation position 103 is formed on the inner bottom wall of the installation cavity 102. The second lower housing 23 is installed on the second installation position 103. Preferably, the second lower housing 23 is installed on the second installation position 103 after being connected to a second EVA gasket 32.

[0069] In this embodiment, a positioning portion 104 protrudes upward from the inner bottom wall of the installation cavity 102. The second lower housing 23 is provided with a positioning hole 234 corresponding to the positioning portion 104. The second lower housing 23 is connected to the first housing 10, and the positioning portion 104 is adapted to be within the positioning hole 234. Preferably, the positioning portion 104 is provided with a first through hole 105 that penetrates through the upper side of the positioning portion 104, the lower side of the first housing 10, and the sound output cavity 202. The first through hole 105 is completely open, or a first damping member 41 is covered at the first through hole 105. A plurality of the first through holes 105 are arranged in the front-rear direction, and the first damping member 41 covers all the first through holes 105 at the same time.

[0070] In this embodiment, the speaker unit 21 includes a frame 211, a magnetic circuit component, a vibration membrane 212, an isolation cover 213 and a cover plate 214; the frame 211 is disc-shaped, and a hollow mounting position 2111 is provided at the center of the frame 211. The magnetic circuit component is provided at the center of the frame 211 and is located in the hollow mounting position 2111. A hollow structure is provided on the frame 211 at the periphery of the magnetic circuit component, and an isolation ring 2112 is formed on the frame 211. Figure 7 As shown, the isolation ring 2112 separates the hollow structure into at least one high-pitched area 2113 and one low-pitched area 2114. Preferably, the height of the upper opening of the high-pitched area 2113 is lower than the height of the upper opening of the low-pitched area 2114. The high-pitched area 2113 is close to the magnetic circuit assembly, and the low-pitched area 2114 is far away from the magnetic circuit assembly; in this embodiment, the high-pitched area 2113 is completely open, or the high-pitched area 2113 is covered with a fourth damping member 44; the low-pitched area 2114 is completely open, or the low-pitched area 2114 is covered with a substrate 45.

[0071] The vibration membrane 212 is arranged on the frame 211 and covers the magnetic circuit assembly, the high-pitched area 2113 and the low-pitched area 2114; the cover plate 214 is fixed on the frame 211 and covers the bottom of the vibration membrane 212, and the cover plate 214 is provided with a third sound outlet 2141. Preferably, the upper end surface of the second lower shell 23 is integrally convexly formed upwardly to form a cylinder part 235 corresponding to the outer periphery of the first clearance hole 231, and the inner side of the cylinder part 235 forms a limited step part 236, and the upper end periphery of the frame 211 is pressed against the limited step part 236 through the third EVA gasket 33.

[0072] The isolation cover 213 is connected to the upper part of the isolation ring 2112 and is located above the magnetic circuit assembly. The isolation ring 2112 and the isolation cover 213 can be connected by bonding, snap assembly or welding. The isolation cover 213 is surrounded by a tweeter chamber located below the magnetic circuit assembly, and the isolation cover 213 is provided with a second through hole 2133 that passes through the tweeter chamber and the sound output cavity 202.

[0073] It should be noted that the arrangement and number of the second through holes 2133 are not limited here; the second through holes 2133 are completely open, or the second through holes 2133 are covered with a second damping member 42. The second damping member 42 is disposed on the inner side or the outer side of the second through holes 2133;

[0074] It should be noted that there may be more than two second through holes 2133 ; all second through holes 2133 are completely open, or all second through holes 2133 are covered with second damping members 42 , or more than one second through holes 2133 are completely open and the remaining second through holes 2133 are covered with second damping members 42 .

[0075] The isolation cover 213 comprises a cover body 2131 and an annular side plate 2132 integrally extending upward from the outer periphery of the cover body 2131. The second through hole 2133 is disposed on the cover body 2131 and / or the annular side plate 2132. Figure 7 As shown, the gas generated in the magnetic circuit assembly can enter the sound outlet cavity 202 through the second through hole 2133, and the gas in the sound outlet cavity 202 can enter the outside through the first sound outlet hole 201 and the second sound outlet hole 101 in turn, and the gas in the sound outlet cavity 202 can also enter the outside through the first through hole 105.

[0076] In this embodiment, the magnetic circuit assembly includes a yoke 241, a magnet 242, a washer 243 and a voice coil 244. The yoke 241, the magnet 242 and the washer 243 all have third through holes 245 that are sequentially through the center, and the third through holes 245 are completely open, or at least one of the third through holes 245 is covered with a third damping member 43; preferably, the lower side of the third through hole 245 on the yoke 241 is covered with a third damping member 43. The first damping member 41, the second damping member 42, the third damping member 43, the fourth damping member 44 and the substrate 45 can be damping mesh, damping paper or metal mesh, etc., which are not listed here one by one.

[0077] The design focus of the present invention is that: the sound-generating component adopts a modular structure. On the one hand, the gas generated in the sound-generating component does not need to enter the installation cavity of the first shell, but is directly discharged to the outside of the first shell through the first sound outlet hole and the second sound outlet hole in sequence, so that all the gas is output to the outside of the first shell, ensuring that the sound will not be distorted and improving the sound effect. On the other hand, it is easy to assemble, replace and repair, and improves the assembly efficiency. It can be sold as a whole or as a separate sound module, with high market flexibility and good social value and economic benefits.

[0078] Secondly, by using the corresponding through-holes to fine-tune the audio, the sound quality of the subsequent earphone products can be further improved, and the corresponding through-holes can be flexibly selected to cover with corresponding damping parts according to actual design requirements;

[0079] In addition, the overall structural design is ingenious and reasonable, and the various parts are easy and firm to assemble, ensuring the stability and reliability of the subsequent finished earphones during use.

[0080] As described above, it is only the preferred embodiment of the present invention, and does not impose any limitation on the technical scope of the present invention. Therefore, any minor modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A modular loudspeaker, characterized in that: it includes a first housing and a sound generating module; the sound generating module has a first sound outlet hole and a sound outlet cavity, and the first sound outlet hole communicates with the sound outlet cavity; the first housing has a second sound outlet hole and an installation cavity, the sound generating module is installed in the installation cavity, and the first sound outlet hole of the sound generating module communicates with the second sound outlet hole so that the gas in the sound outlet cavity directly passes through the first sound outlet hole and the second sound outlet hole in sequence and enters the outside; the first housing includes a first upper housing and a first lower housing assembled up and down. Among the first upper housing and the first lower housing, one is convexly provided with a clamping protrusion, and the other is concavely provided with a clamping groove. The first upper housing and the first lower housing are connected, and the clamping protrusion is adapted to be within the clamping groove; the sound generating module includes a speaker unit, a second upper housing and a second lower housing, and the second upper housing and the second lower housing are assembled to form a sound outlet cavity; a first relief hole is formed in the second lower housing and penetrates through the upper and lower sides of the second lower housing and the sound outlet cavity up and down. A second relief hole is formed in the first housing and penetrates through the upper and lower sides of the first housing and the installation cavity up and down. The speaker unit is installed in the first relief hole and the upper end of the speaker unit extends into the sound outlet cavity. At the same time, the speaker unit is installed at the second relief hole; a positioning portion protrudes upward from the inner bottom wall of the installation cavity. The second lower housing is correspondingly provided with a positioning hole for the positioning portion. The second lower housing is connected to the first housing, and the positioning portion is adapted to be within the positioning hole; a first through hole is formed in the positioning portion and penetrates through the upper side of the positioning portion, the lower side of the first housing and the sound outlet cavity up and down. The first through hole is completely open, or a first damping member is covered at the first through hole.

2. The modular loudspeaker according to claim 1, characterized in that: a first annular convex edge protrudes from the upper end surface of the second lower housing, and a second annular convex edge protrudes downward from the peripheral edge of the lower end of the second upper housing. The upper end surface of the second lower housing and the outer side surface of the first annular convex edge form a first installation position, and the second annular convex edge is installed on the first installation position.

3. The modular loudspeaker according to claim 1, characterized in that: a second installation position is formed on the inner bottom wall of the installation cavity, and the second lower housing is installed on the second installation position.

4. The modular loudspeaker according to claim 1, characterized in that: the speaker unit includes a frame, a magnetic circuit assembly, a diaphragm and an isolation cover; the magnetic circuit assembly is arranged at the central position of the frame. A hollow structure is arranged on the frame at the periphery of the magnetic circuit assembly, and an isolation ring is formed on the frame. The isolation ring divides the hollow structure into at least one high-frequency area and a low-frequency area. The high-frequency area is close to the magnetic circuit assembly, and the low-frequency area is far from the magnetic circuit assembly; the diaphragm is arranged on the frame and covers the magnetic circuit assembly, the high-frequency area and the low-frequency area; the isolation cover is connected to the upper part of the isolation ring and is located above the magnetic circuit assembly. The isolation cover encloses a high-frequency chamber located below the magnetic circuit assembly below the magnetic circuit assembly, and a second through hole communicating the high-frequency chamber and the sound cavity is arranged on the isolation cover.

5. The modular loudspeaker according to claim 4, characterized in that: The second through hole is completely open, or a second damping member is provided at the second through hole.

6. The modular speaker according to claim 4, wherein: The isolation cover has a cover body portion and an annular side plate portion integrally extending upward from the outer peripheral edge of the cover body portion, and the aforementioned second through hole is provided on the cover body portion and / or the annular side plate portion.

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