Semiconductor module with package expansion frame

Abstract

The present invention discloses a semiconductor package, which includes a semiconductor module, a first package expansion frame, a second package expansion frame and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first main surface and a second main surface on a side of the semiconductor module opposite to the first main surface. The first package expansion frame is configured to be attached to the first side surface. The second package expansion frame is configured to be attached to the second side surface. The plurality of fasteners are configured to mechanically couple the first package expansion frame and the second package expansion frame to one or more of a circuit board arranged on the first main surface and / or a heat sink arranged on the second main surface.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor package configured for connection to a circuit board. Background Art

[0002] Some semiconductor packages include a semiconductor module having a power transistor and pins for connecting the power transistor to a circuit. Such a semiconductor module is typically mounted to a circuit board so that the pins are electronically coupled to the circuit board to form a circuit. In this manner, the semiconductor module can represent a cost-effective, compact design for mounting with a circuit board. Summary of the invention

[0003] In general, the present disclosure is directed to simplifying semiconductor package design for mounting a semiconductor module on a circuit board. For example, a semiconductor package may include a package extension frame that can be attached to a semiconductor module to mount the semiconductor module to a circuit board. In some examples, the semiconductor module and the package extension frame include alignment holes that help ensure that pins of the semiconductor module are aligned with the circuit board when aligned.

[0004] In one example, a semiconductor package includes: a semiconductor module including a first side surface, a second side surface, a first main surface, and a second main surface on a side of the semiconductor module opposite to the first main surface; a first package extension frame configured to be attached to the first side surface; a second package extension frame configured to be attached to the second side surface; and a plurality of fasteners configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first main surface and / or a heat sink arranged on the second main surface.

[0005] In another example, a method includes: attaching a first packaging expansion frame to a first side surface of a semiconductor module; attaching a second packaging expansion frame to a second side surface of the semiconductor module; arranging the first packaging expansion frame and the second packaging expansion frame together with a circuit board so that the first main surface of the semiconductor module faces the circuit board; arranging the first packaging expansion frame and the second packaging expansion frame together with a heat sink so that the second main surface of the semiconductor module faces the heat sink; mechanically coupling the first packaging expansion frame to one or more of the circuit board and / or the heat sink with one or more fasteners; and mechanically coupling the second packaging expansion frame to one or more of the circuit board and / or the heat sink with one or more fasteners.

[0006] In another example, a semiconductor package includes: a semiconductor module including a first side surface, a second side surface, a first main surface, and a second main surface on a side of the semiconductor module opposite to the first main surface; a first package extension frame attached to the first side surface; a second package extension frame attached to the second side surface; a circuit board arranged on the first main surface; a heat sink arranged on the second main surface; and a plurality of fasteners mechanically coupling the first package extension frame and the second package extension frame to one or more of the circuit board and / or the heat sink.

[0007] The details of these and other examples are set forth in the following drawings and description. Other details, objects, and advantages will be apparent from the description and drawings, and from the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1A is a conceptual diagram illustrating a first cross-sectional view of a semiconductor package for simplified mounting according to one or more techniques of the present disclosure.

[0009] Figure 1B is a diagram showing one or more techniques according to the present disclosure Figure 1A A conceptual diagram of a second cross-sectional view of a semiconductor package.

[0010] Figure 2 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B A conceptual diagram of a cross-sectional view of a first example of a semiconductor package in more detail.

[0011] Figure 3 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B A conceptual diagram of a cross-sectional view of a second example of a semiconductor package in more detail.

[0012] Figure 4 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B A conceptual diagram of a cross-sectional view of a third example of a semiconductor package in more detail.

[0013] Figure 5 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B A conceptual diagram of a cross-sectional view of a fourth example of a semiconductor package in more detail.

[0014] Figure 6 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1BA conceptual diagram of a cross-sectional view of a fifth example of a semiconductor package with more details.

[0015] Figure 7 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B A conceptual diagram of a top view of an example of a semiconductor package with greater detail.

[0016] Figure 8A-8C is a diagram showing a method for forming a Figure 1A and Figure 1B A conceptual diagram of an exemplary method of semiconductor packaging.

[0017] Fig. 9 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B A conceptual diagram of a side view of an exemplary semiconductor module of a semiconductor package.

[0018] Fig.10 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B A conceptual diagram of a side view of an exemplary package extension frame of a semiconductor package.

[0019] Figures 11A-11D is a diagram showing a method for converting Fig.10 The package extension frame is attached to Fig. 9 A conceptual diagram of an exemplary method of manufacturing a semiconductor module.

[0020] Fig.12 is a flow chart of a first method for providing a semiconductor package for simplified mounting in accordance with one or more techniques of this disclosure.

[0021] Fig.13 is a flow chart of a second method for providing a semiconductor package for simplified mounting in accordance with one or more techniques of this disclosure.

[0022] Fig.14 is a flow chart of a third method for providing a semiconductor package for simplified mounting in accordance with one or more techniques of this disclosure. DETAILED DESCRIPTION

[0023] In some systems, a semiconductor package may include metal wings that hold a semiconductor module to a circuit board and / or a heat sink. However, the addition of the metal wings increases processing steps and, therefore, increases the cost of package manufacturing. In addition, compared to semiconductor packages that omit the metal wings, the package manufacturing cost for semiconductor packages using metal wings may increase to accommodate the presence of dedicated holes for the metal wings, to accommodate additional package features (e.g., gaps, grooves, etc.) and / or special assembly steps manipulated by automatic robots. In addition, compared to semiconductor packages that omit the metal wings, the package manufacturing complexity for semiconductor packages using metal wings may increase to accommodate electrical coupling steps used to help ensure proper alignment of the module, and to accommodate a specific installation sequence during the assembly process to avoid stress on the circuit board (e.g., a printed circuit board (PCB)) and the semiconductor module (e.g., the pins of the semiconductor module). In addition, the metal wings fix the position of the mounting screws, which may result in a lack of flexibility and customizability in the installation of the circuit board and / or heat sink.

[0024] The examples described herein may not rely on metal wings, but may use a package extension frame. The package extension frame may facilitate manipulation and assembly. For example, compared to semiconductor packages that rely on metal wings, the package extension frame may help: (1) provide easy coupling and / or decoupling for robotic manipulation and optical inspection; (2) eliminate the order constraints of the current installation process; (3) help pre-alignment; and (4) reduce the number of fasteners (e.g., screws) in the semiconductor package. In addition, compared to semiconductor packages that rely on metal wings, the package extension frame may reduce assembly costs. In another example, compared to semiconductor packages that rely on metal wings, the package extension frame may reduce the number of mounting holes. In applications where the space or position of the holes is limited and inlet protection is required, reducing the number of mounting holes may be an important advantage. In addition, the package extension frame may help eliminate the need for having pre-defined mounting holes (e.g., holes defined by the semiconductor manufacturer through metal wings) and provide sufficient mounting force to ensure mechanical and thermal connections. In addition, the package extension frame may help evenly distribute the mounting force.

[0025] Figure 1A 1 is a conceptual diagram showing a first cross-sectional view of a semiconductor package 100 for simplified installation according to one or more techniques of the present disclosure. As shown in this example of FIG. 1 , the semiconductor package 100 may include a semiconductor module 102 and package extension frames 104A and 104B (collectively referred to as “package extension frames 104”), a circuit board 106, a heat sink 108, and fasteners 110A-110B (collectively referred to as “fasteners 110”). Although Figure 1A The semiconductor package 100 is shown with two package expansion frames 104 , and in some examples, the semiconductor package 100 may include three or four package expansion frames 104 .

[0026] The semiconductor module 102 may include a switching element. Examples of switching elements may include, but are not limited to, a silicon controlled rectifier (SCR), a field effect transistor (FET), and a bipolar junction transistor (BJT). Examples of FETs may include, but are not limited to, a junction field effect transistor (JFET), a metal oxide semiconductor FET (MOSFET), a dual gate MOSFET, an insulated gate bipolar transistor (IGBT), any other type of FET, or any combination thereof. Examples of MOSFETs may include, but are not limited to, PMOS, NMOS, DMOS, or any other type of MOSFET, or any combination thereof. Examples of BJTs may include, but are not limited to, PNP, NPN, heterojunction, or any other type of BJT, or any combination thereof. It should be understood that the switching element may be a high-side switch or a low-side switch. In addition, the switching element may be voltage-controlled and / or current-controlled. Examples of current-controlled switching elements may include, but are not limited to, gallium nitride (GaN) MOSFETs, BJTs, or other current-controlled elements.

[0027] The semiconductor module 102 may include one or more passive components. Examples of passive components may include, but are not limited to, resistors, capacitors, inductors, transformers, or other passive components. The semiconductor module 102 may include a processing circuit. For example, the semiconductor module 102 may include a microcontroller on a single integrated circuit including a processor core, a memory, an input terminal, and an output terminal. For example, the semiconductor module 102 may include one or more processors, including one or more microprocessors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or any other equivalent integrated or discrete logic circuits, and any combination of such components. The term "processor" or "processing circuit" may generally refer to any of the aforementioned logic circuits, either alone or in combination with other logic circuits, or any other equivalent circuit.

[0028] Semiconductor module 102 may include a multi-chip module. The multi-chip module may include, for example, a plurality (e.g., two or more) of individual integrated circuits. In some examples, the individual integrated circuits may be electronically coupled together and / or coupled to one or more pins of semiconductor module 102. In some examples, the multi-chip module may include one or more passive components electronically coupled to the individual integrated circuits.

[0029] The package expansion frame 104 may be configured to be attached to side surfaces 120A-120B (collectively referred to as “side surfaces 120 ”) of the semiconductor module 102 . For example, the package expansion frame 104A may be configured to be attached to the side surface 120A of the semiconductor module 102 . In some examples, the package expansion frame 104B may be configured to be attached to the side surface 120B of the semiconductor module 102 . Figure 1A Not shown in the figure, the third package expansion frame may be configured to be attached to the third side surface of the semiconductor module 102 and / or the fourth package expansion frame may be configured to be attached to the fourth side surface of the semiconductor module 102. The package expansion frame 104 may be formed of any suitable material, such as but not limited to a polymer, a metal, a combination of a polymer and a metal, or other materials.

[0030] Circuit board 106 may be configured with components for a circuit. In some examples, circuit board 106 is a PCB. For example, circuit board 106 may include one or more traces, one or more vias (also referred to as vertical interconnect access), pin sockets for connecting to devices external to circuit board 106, embedded components, and / or other components for a circuit. Circuit board 106 may include a single layer. In some examples, circuit board 106 may include multiple layers.

[0031] The heat sink 108 may include any suitable heat exchanger that transfers the heat generated by the semiconductor module 102 to another medium. The heat sink 108 may include a thermally conductive material (e.g., copper, aluminum, etc.). The heat sink 108 may include a surface exposed to air. In some examples, the heat sink 108 may be fan-cooled. The heat sink 108 may include a surface exposed to a liquid coolant. Although not shown, a thermal adhesive or thermal grease may be formed between the heat sink 108 and the semiconductor module 102 to fill the air gap and help transfer the heat generated by the semiconductor module 102 away from the semiconductor package 100.

[0032] The fasteners 110 may be configured to mechanically couple the package extension frame 104 to one or more of the circuit board 106 and / or the heat sink 108. For example, the fasteners 110A may be configured to mechanically couple the package extension frame 104A to one or more of the circuit board 106 and / or the heat sink 108. Similarly, the fasteners 110B may be configured to mechanically couple the package extension frame 104B to one or more of the circuit board 106 and / or the heat sink 108. Although Figure 1A108, and / or the fourth fastener may be configured to mechanically couple the fourth package extension frame to one or more of the circuit board 106 and / or the heat sink 108. The fastener 110 may be formed of any suitable material, such as, but not limited to, a polymer, a metal, a combination of a polymer and a metal, or other materials. The fastener 110 may include, for example, but not limited to, nuts, bolts, screws, rivets, hooks, clips, pins, wedges, nails, anchors, staples, and other fasteners.

[0033] According to one or more techniques described herein, the semiconductor module 102 may include a first side surface 120A, a second side surface 120B, a first main surface 122, and a second main surface 124. The circuit board 106 may be disposed on the first main surface 122. As shown, the second main surface 124 is on a side of the semiconductor module 102 opposite the first main surface 122. The heat sink 108 may be disposed on the second main surface 124. Figure 1A and Figure 1B In the example of FIG. 1 , the semiconductor package 100 is arranged such that the side surfaces 120A- 120B extend along a vertical direction 134 . In this example, the semiconductor package 100 is arranged such that the first main surface 122 and the second main surface 124 extend along a horizontal direction 136 .

[0034] In this example, the first package extension frame 104A is configured to be attached to the first side surface 120A. For example, the first package extension frame 104A and the first side surface 120A form a fishhook coupling that is mechanically coupled when pressed together. In some examples, the first package extension frame 104A and the first side surface 120A form a threaded coupling that is mechanically coupled when the first package extension frame 104A is rotated relative to the first side surface 120A. Similarly, the second package extension frame 104B is configured to be attached to the second side surface 120B. For example, the second package extension frame 104B and the second side surface 120B form a fishhook coupling that is mechanically coupled when pressed together. In some examples, the second package extension frame 104B and the second side surface 120B form a threaded coupling that is mechanically coupled when the second package extension frame 104B is rotated relative to the second side surface 120B.

[0035] In this example, the fastener 110 is configured to mechanically couple the first package expansion frame 104A and the second package expansion frame 104B to one or more of the circuit board 106 and / or the heat sink 108. For example, the fastener 110 may be configured to mechanically couple the first package expansion frame 104A and the second package expansion frame 104B to the circuit board 106 and the heat sink 108. In some examples, the fastener 110 may be configured to mechanically couple the first package expansion frame 104A and the second package expansion frame 104B to the circuit board 106. In some examples, the fastener 110 may be configured to mechanically couple the first package expansion frame 104A and the second package expansion frame 104B to the heat sink 108.

[0036] The package extension frame 104 can assist in handling and assembly. For example, the package extension frame 104 can help eliminate the need to have predefined mounting holes (e.g., defined by a semiconductor manufacturer via metal wings). For example, the package extension frame 104A may not rely on predefined mounting holes adjacent to the semiconductor module 102 to mount the semiconductor module 102 to the circuit board 106, but may allow the mounting holes to be positioned anywhere within the area 130. Similarly, the package extension frame 104B may allow the mounting holes to be positioned anywhere within the area 132. In this way, the design constraints for positioning the mounting holes for the semiconductor package 100 may be relaxed compared to semiconductor packages using metal wings. In this way, the package extension frame 104 can simplify the design of the circuit board 106 and / or the heat sink 108, which can reduce the cost for manufacturing the semiconductor package 100.

[0037] Figure 1B is a diagram showing one or more techniques according to the present disclosure Figure 1A 1. As shown, the side surface 120 may further include side surfaces 120C and 120D. As shown, the semiconductor package 100 is arranged such that the side surfaces 120C-120D extend along the second horizontal direction 136.

[0038] In some examples, the semiconductor package 100 may optionally include a third package expansion frame 104C configured to be attached to a third side surface 120C of the semiconductor module 102. Similarly, the semiconductor package 100 may optionally include a fourth package expansion frame 104D configured to be attached to a fourth side surface 120D of the semiconductor module 102. The fastener 110 may optionally include a fastener 110C to mechanically couple the package expansion frame 104C to one or more of the circuit board 106 and / or the heat sink 108. Additionally or alternatively, the fastener 110 may optionally include a fastener 110D to mechanically couple the package expansion frame 104D to one or more of the circuit board 106 and / or the heat sink 108.

[0039] Figure 2 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B 1 is a conceptual diagram of a cross-sectional view of a first example of a semiconductor package 100 in more detail. As shown, the semiconductor package 200 includes a semiconductor module 202, and package expansion frames 204A and 204B (collectively referred to as "package expansion frames 204"), a circuit board 206, a heat sink 208, and fasteners 210A-210B (collectively referred to as "fasteners 210"). Although Figure 2 The semiconductor package 200 is shown to have two package expansion frames 204. In some examples, the semiconductor package 200 may include three or four package expansion frames 204. The semiconductor module 202 may be Figure 1A and Figure 1B The package extension frame 204 may be an example of a semiconductor module 102. Figure 1A and Figure 1B An example of a package extension frame 104. The circuit board 206 may be Figure 1A and Figure 1B The heat sink 208 may be an example of a circuit board 106. Figure 1A and Figure 1B The fastener 210 may be an example of a heat sink 108. Figure 1A and Figure 1B 2. The fastener 210B may include a mounting screw 250 and a mounting washer 252. As shown, thermal grease 244 may be applied to the second major surface 224 of the semiconductor module 202.

[0040] The first side surface 220A of the semiconductor module 202 includes a mechanical coupling, and the first package extension frame 204A includes a complementary mechanical coupling. More specifically, for example, the first side surface 220A of the semiconductor module 202 includes a mechanical coupling, and the first package extension frame 204A includes a complementary mechanical coupling, which form a fishhook coupling 240A. Similarly, the semiconductor module 202 and the second package extension frame 204B can be used to form a fishhook coupling 240B. In this example, the first package extension frame 204A is pressed into the first side surface 220A, causing the fishhook coupling 240 to couple the first package extension frame 204A to the first side surface 220A.

[0041] Pin 242 can extend away from the first main surface 222 of semiconductor module 202 and enter the pin socket of circuit board 206. Pin 242 can include any suitable conductive material, such as but not limited to one or more conductive elements or one or more conductive alloys. The example of conductive element can include but is not limited to aluminum (Al), copper (Cu), nickel (Ni), titanium (Ti), tungsten (W), another conductive element. Conductive alloy can include, for example, but not limited to aluminum (Al), copper (Cu), nickel (Ni), titanium (Ti), tungsten (W) or two or more of another conductive element.

[0042] Figure 3 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B 1 is a conceptual diagram of a cross-sectional view of a second example of a semiconductor package 100 in more detail. As shown, the semiconductor package 300 includes a semiconductor module 302, and package expansion frames 304A and 304B (collectively referred to as "package expansion frames 304"), a circuit board 306, a heat sink 308, and fasteners 310A-310B (collectively referred to as "fasteners 310"). Although Figure 3 The semiconductor package 300 is shown to have two package expansion frames 304. In some examples, the semiconductor package 300 may include three or four package expansion frames 304. The semiconductor module 302 may be Figure 1A and Figure 1B The package extension frame 304 may be Figure 1A and Figure 1B An example of a package extension frame 104. The circuit board 306 may be Figure 1A and Figure 1B The heat sink 308 may be Figure 1A and Figure 1B The fastener 310 may be an example of a heat sink 108. Figure 1A and Figure 1B An example of a fastener 110 .

[0043] exist Figure 3 In an example of the first package extension frame 304A, the first package extension frame 304A includes a frame portion 360 formed of a material different from the material of the complementary mechanical coupling. For example, the frame portion 360 can be formed of a metal and other portions of the first package extension frame 304A can be formed of a polymer. The frame portion 360 can help allow greater tolerance and less material fatigue throughout the life cycle of the semiconductor package 300 compared to a semiconductor package that omits the frame portion 360. In addition, the frame portion 360 can allow and / or provide an alternative coupling technique of the package extension frame 304 to the semiconductor module 302.

[0044] Figure 4 is an illustration of one or more techniques according to the present disclosure Figure 1A and Figure 1B 4 is a conceptual diagram of a cross-sectional view of a third example of a semiconductor package in more detail. As shown, semiconductor package 400 includes semiconductor module 402, package expansion frames 404A and 404B (collectively referred to as "package expansion frames 404"), circuit board 406, heat sink 408, and fasteners 410A-410C (collectively referred to as "fasteners 410"). Although Figure 4 The semiconductor package 400 is shown to have two package expansion frames 404. In some examples, the semiconductor package 400 may include three or four package expansion frames 404. The semiconductor module 402 may be Figure 1A and Figure 1B The package extension frame 404 may be an example of a semiconductor module 102. Figure 1A and Figure 1B An example of a package extension frame 104. The circuit board 406 may be Figure 1A and Figure 1B The heat sink 408 may be an example of a circuit board 106. Figure 1A and Figure 1B The fastener 410 may be an example of a heat sink 108. Figure 1A and Figure 1B An example of a fastener 110 .

[0045] exist Figure 4 In the example of FIG. 4 , the fastener 410A is configured to mechanically couple the first package extension frame 404 to the circuit board 406 . In this example, the fastener 410C is configured to mechanically couple the first package extension frame 404 to the heat sink 408 .

[0046] Figure 5 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B1 is a conceptual diagram of a cross-sectional view of a fourth example of a semiconductor package 100 in more detail. As shown, the semiconductor package 500 includes a semiconductor module 502, and package expansion frames 504A and 504B (collectively referred to as "package expansion frames 504"), a circuit board 506, a heat sink 508, and fasteners 510A-510C (collectively referred to as "fasteners 510"). Although Figure 5 The semiconductor package 500 is shown to have two package expansion frames 504. In some examples, the semiconductor package 500 may include three or four package expansion frames 504. The semiconductor module 502 may be Figure 1A and Figure 1B The package extension frame 504 may be Figure 1A and Figure 1B An example of a package extension frame 104. The circuit board 506 may be Figure 1A and Figure 1B The heat sink 508 may be Figure 1A and Figure 1B The fastener 510 may be an example of a heat sink 108. Figure 1A and Figure 1B An example of a fastener 110 .

[0047] exist Figure 5 In the example of FIG. 5 , fastener 510A is configured to mechanically couple first package extension frame 504A to heat sink 508. Similarly, fastener 510B is configured to mechanically couple second package extension frame 504B to heat sink 508. In this example, fastener 510C is configured to mechanically couple circuit board 506 to mounting base 512. Mounting base 512 can be configured for printed circuit board mounting. As shown, mounting base 512 can be formed of a different material than package extension frame 504 and / or heat sink 508.

[0048] Figure 6 To illustrate one or more techniques according to the present disclosure Figure 1A and Figure 1B 1 is a conceptual diagram of a cross-sectional view of a fifth example of a semiconductor package 100 in more detail. As shown, the semiconductor package 600 includes a semiconductor module 602, and package expansion frames 604A and 604B (collectively referred to as "package expansion frames 604"), a circuit board 606, a heat sink 608, and fasteners 610A-610C (collectively referred to as "fasteners 610"). Although Figure 6 The semiconductor package 600 is shown to have two package expansion frames 604. In some examples, the semiconductor package 600 may include three or four package expansion frames 604. The semiconductor module 602 may be Figure 1A and Figure 1BThe package extension frame 604 may be Figure 1A and Figure 1B An example of a package extension frame 104. The circuit board 606 may be Figure 1A and Figure 1B The heat sink 608 may be Figure 1A and Figure 1B The fastener 610 may be an example of a heat sink 108. Figure 1A and Figure 1B An example of a fastener 110 .

[0049] exist Figure 6 In the example of FIG. 6 , the fastener 610A is configured to mechanically couple the first package extension frame 604A to the heat sink 608. Similarly, the fastener 610B is configured to mechanically couple the second package extension frame 604B to the heat sink 608. In this example, the fastener 610C is configured to mechanically couple the circuit board 606 to the heat sink 608.

[0050] Figure 7 To illustrate one or more techniques according to the present disclosure Figure 1A and Figure 1B 1 is a conceptual diagram of a top view of an example of semiconductor package 100 with more details. As shown, semiconductor package 700 includes semiconductor module 702 and package expansion frames 704A-704D (collectively referred to as “package expansion frames 704”). Figure 7 The semiconductor package 700 is shown to have four package expansion frames 704. In some examples, the semiconductor package 700 may include two or three package expansion frames 704. The semiconductor module 702 may be Figure 1A and Figure 1B The package extension frame 704 may be an example of a semiconductor module 102. Figure 1A and Figure 1B An example of a package extension frame 104. Pin 742 may be Figure 2 Example of pin 242.

[0051] exist Figure 7 In the example of FIG. 7 , the semiconductor package 700 includes semiconductor module alignment holes 770A-770D (collectively referred to as “semiconductor module alignment holes 770 ”). Figure 8A-8C As further discussed, semiconductor module alignment holes 770 may extend through semiconductor module 702. Aligning semiconductor module alignment holes 770 with alignment holes of the circuit board may help ensure that pins 742 are aligned with pin receptacles of the circuit board. In some examples, semiconductor module alignment holes 770 may be omitted and alignment may be performed using only package extension frame (PEF) and PCB alignment holes.

[0052] The semiconductor package 700 may include PEF alignment holes 754A-754D (collectively referred to as "PEF alignment holes 754"). The PEF alignment holes 754A-754D may extend through the package extension frame 704A. As shown, the PEF alignment holes 754C, 754D may be spaced apart from the semiconductor module 702 such that the PEF alignment holes 754C, 754D extend through the outer surface of the semiconductor package 700 without passing through the corresponding alignment holes of the semiconductor module 702. Aligning the PEF alignment holes 754 with the alignment holes of the circuit board and / or with the semiconductor module alignment holes 770 may help ensure that the pins 742 are aligned with the pin receptacles of the circuit board. As shown, two or more package extension frames (e.g., package extension frames 704A-704B) may each include one or more PEF alignment holes. Furthermore, in some examples, three or four package extension frames (e.g., package extension frames 704A-704D) may each include one or more PEF alignment holes.

[0053] FIG. 8A to FIG. 8C is a diagram showing a method for forming a Figure 1A and Figure 1B A conceptual diagram of an exemplary method of semiconductor packaging 100 is shown. Fig. 8A A semiconductor module 802 and package expansion frames 804A-804B (collectively referred to as "package expansion frames 804") are shown. Although FIG. 8 shows two package expansion frames 804 attached, some examples may include attaching three or four package expansion frames 804. The semiconductor module 802 may be Figure 1A and Figure 1B The package extension frame 804 may be an example of a semiconductor module 102. Figure 1A and Figure 1B An example of a package extension framework 104 is shown.

[0054] exist Fig. 8A , the first packaging extension frame 804A is attached to the first side surface 820A of the semiconductor module 802. For example, the first packaging extension frame 804A is pressed into the first side surface 820A. In some examples, the first packaging extension frame 804A is rotated relative to the first side surface 820A. Similarly, the second packaging extension frame 804A is attached to the second side surface 820B of the semiconductor module 802. For example, the second packaging extension frame 804B is pressed into the second side surface 820B. In some examples, the second packaging extension frame 804B is rotated relative to the second side surface 820B.

[0055] exist Figure 8BIn the embodiment, the first package extension frame 804A and the second package extension frame 804B are arranged together with the circuit board 806 so that the first main surface 822 of the semiconductor module 802 faces the circuit board 806. For example, the circuit board 806 includes one or more alignment holes 872A and one or more alignment holes 872B (collectively referred to as alignment holes 872). In this example, the first package extension frame 804A includes one or more PEF alignment holes 874A, or just one or more alignment holes 874A. Similarly, the second package extension frame 804B may include one or more alignment holes 874B. In this example, the alignment hole 874A can be aligned with the alignment hole 872A. Similarly, the alignment hole 874B can be aligned with the alignment hole 872B. Aligning the alignment hole 874A with the alignment hole 872A and / or aligning the alignment hole 874B with the alignment hole 872B can help ensure that the pin 842 is aligned with the pin socket 875. Once aligned, the first major surface 822 of the semiconductor module 802 is assembled (e.g., press-fit, soldered, etc.) into the circuit board 806 using the first package extension frame 804A and the second package extension frame 804B. In some examples, the semiconductor module 802 can omit the alignment holes. However, in some examples, the semiconductor module 802 can include alignment holes.

[0056] exist Figure 8C , the first package expansion frame 804A and the second package expansion frame 804B are arranged together with the heat sink 808 so that the second main surface 824 of the semiconductor module 802 faces the heat sink 808. In addition, the first package expansion frame 804A is mechanically coupled to one or more of the circuit board 806 and / or the heat sink 808. For example, the first package expansion frame 804A is mechanically coupled to the circuit board 806 and the heat sink 808. Similarly, the second package expansion frame 804B is mechanically coupled to one or more of the circuit board 806 and / or the heat sink 808. For example, the second package expansion frame 804B is mechanically coupled to the circuit board 806 and the heat sink 808.

[0057] Fig. 9 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B 1 is a conceptual diagram of a side view of an exemplary semiconductor module of the semiconductor package 100. The semiconductor module 902 may be Figure 1A and Figure 1B In this example, the semiconductor module 902 includes a protrusion 980 for a mechanical coupling relative to Fig.10 and Figures 11A-11D This protrusion is discussed further.

[0058] Fig.10 is a diagram showing one or more techniques according to the present disclosure Figure 1A and Figure 1B 1004 is a conceptual diagram of a side view of an exemplary package extension frame of a semiconductor package. The package extension frame 1004 may be Figure 1A and Figure 1B In this example, the encapsulation extension framework 1004 includes a Fig. 9 The protrusion 980 of the semiconductor module 902 is mechanically coupled to the groove 1082. In this way, the groove 1082 can represent a complementary mechanical coupling member for the protrusion 980, so that the groove 1082 contacts (eg, rotates) with the protrusion 980 to couple the semiconductor module 902 and the package expansion frame 1004.

[0059] Figures 11A-11D is a diagram showing a method for converting Fig.10 The package extension frame 1004 is attached to Fig. 9 A conceptual diagram of an exemplary method of a semiconductor module 902. Fig.11A In the embodiment, the protrusion 980 of the semiconductor module 902 is aligned with the groove 1082 of the package expansion frame 1004. Fig. 11B In the embodiment, the semiconductor module 902 is placed in contact with the package expansion frame 1004. Fig. 11C In the embodiment, the package expansion frame 1004 is rotated relative to the semiconductor module 902 . Fig.11D The package expansion frame 1004 is shown mechanically coupled to the semiconductor module 902 .

[0060] Fig.12 is a flowchart of a first method for providing a semiconductor package for simplified installation according to one or more techniques of the present disclosure. Figure 1A-1B , Figure 2-Figure 7 , Figure 8A-8C , Fig. 9 , Fig.10 and Figures 11A-11D Described in the context of Fig.12 .

[0061] First, the method includes attaching the package expansion frame to the semiconductor module (1202). For example, the package expansion frame 804 can be attached using a fishhook coupling by pressing the package expansion frame 804 into the corresponding side surface 820 of the semiconductor module 802. In some examples, the package expansion frame 1004 is rotated relative to the semiconductor module 902.

[0062] The method includes aligning the pins of the semiconductor module with the circuit board (1204). For example, the alignment hole 874A can be aligned with the alignment hole 872A, and the alignment hole 874B can be aligned with the alignment hole 872B. In this example, aligning the alignment hole 874A with the alignment hole 872A and / or aligning the alignment hole 874B with the alignment hole 872B can help ensure that the pin 842 is aligned with the pin receptacle 875.

[0063] The method includes arranging the package extension frame with the circuit board (1206). For example, the first main surface 822 of the semiconductor module 802 is press-fitted into the circuit board 806 using the first package extension frame 804A and the second package extension frame 804B. The method includes applying thermal grease to the semiconductor module (1208). The method includes arranging the package extension frame with the heat sink (1210). For example, the first package extension frame 804A and the second package extension frame 804B are arranged with the heat sink 808 so that the second main surface 824 of the semiconductor module 802 faces the heat sink 808.

[0064] The method includes mechanically coupling the package extension frame to one or more of the circuit board and / or the heat sink (1212). For example, the fastener 110 can be configured to mechanically couple the first package extension frame 104A and the second package extension frame 104B to the circuit board 106 and the heat sink 108. In some examples, the fastener 410A is configured to mechanically couple the first package extension frame 404 to the circuit board 406. In this example, the fastener 410C is configured to mechanically couple the first package extension frame 404 to the heat sink 408. In some examples, the fastener 510A is configured to mechanically couple the first package extension frame 504 to the heat sink 508. In this example, the fastener 510C is configured to mechanically couple the circuit board 506 to the heat sink 508. In some examples, the fastener 610A is configured to mechanically couple the first package extension frame 604 to the heat sink 608. In this example, fastener 610C is configured to mechanically couple circuit board 606 to heat sink 608 .

[0065] Fig.13 is a flow chart of a second method for providing a semiconductor package for simplified installation according to one or more techniques of the present disclosure. Figure 1A-1B , Figure 2-Figure 7 , Figure 8A-8C , Fig. 9 , Fig.10 and Figures 11A-11D Described in the context of Fig.13 .

[0066] First, the method includes aligning the pins of the semiconductor module with the circuit board (1302). For example, the alignment hole of the semiconductor module 802 can be aligned with the alignment hole 872A, and the alignment hole of the semiconductor module 802 can be aligned with the alignment hole 872B. In this example, aligning the alignment hole of the semiconductor module 802 with the alignment hole 872A and / or the alignment hole 872B can help ensure that the pin 842 is aligned with the pin receptacle 875.

[0067] The method includes attaching the package expansion frame to the semiconductor module (1304). For example, the package expansion frame 804 can be attached using a fishhook coupling by pressing the package expansion frame 804 into the corresponding side surface 820 of the semiconductor module 802. In some examples, the package expansion frame 1004 is rotated relative to the semiconductor module 902.

[0068] The method includes arranging the package extension frame with the circuit board (1306). For example, the first main surface 822 of the semiconductor module 802 is press-fitted into the circuit board 806 using the first package extension frame 804A and the second package extension frame 804B. The method includes applying thermal grease to the semiconductor module (1308). The method includes arranging the package extension frame with the heat sink (1310). For example, the first package extension frame 804A and the second package extension frame 804B are arranged with the heat sink 808 so that the second main surface 824 of the semiconductor module 802 faces the heat sink 808.

[0069] The method includes mechanically coupling the package extension frame to one or more of the circuit board and / or the heat sink (1312). For example, the fastener 110 can be configured to mechanically couple the first package extension frame 104A and the second package extension frame 104B to the circuit board 106 and the heat sink 108. In some examples, the fastener 410A is configured to mechanically couple the first package extension frame 404 to the circuit board 406. In this example, the fastener 410C is configured to mechanically couple the first package extension frame 404 to the heat sink 408. In some examples, the fastener 510A is configured to mechanically couple the first package extension frame 504 to the heat sink 508. In this example, the fastener 510C is configured to mechanically couple the circuit board 506 to the heat sink 508. In some examples, the fastener 610A is configured to mechanically couple the first package extension frame 604 to the heat sink 608. In this example, fastener 610C is configured to mechanically couple circuit board 606 to heat sink 608 .

[0070] Fig.14 is a flowchart of a third method for providing a semiconductor package for simplified installation according to one or more techniques of the present disclosure. Figure 1A-1B, Figure 2-Figure 7 , Figure 8A-8C , Fig. 9 , Fig.10 and Figures 11A-11D Described in the context of Fig.14 .

[0071] First, the method includes attaching a package expansion frame to a semiconductor module (1402). For example, a fishhook coupling can be used to attach the package expansion frame 804 by pressing the package expansion frame 804 into a corresponding side surface 820 of the semiconductor module 802. In some examples, the package expansion frame 1004 is rotated relative to the semiconductor module 902. The method includes applying thermal grease to the semiconductor module (1404).

[0072] The method includes arranging the package extension frame with the heat sink ( 1406 ). For example, the first package extension frame 804A and the second package extension frame 804B are arranged with the heat sink 808 so that the second main surface 824 of the semiconductor module 802 faces the heat sink 808 .

[0073] The method includes aligning the pins of the semiconductor module with the circuit board (1408). For example, the alignment hole 874A can be aligned with the alignment hole 872A, and the alignment hole 874B can be aligned with the alignment hole 872B. In this example, aligning the alignment hole 874A with the alignment hole 872A and / or aligning the alignment hole 874B with the alignment hole 872B can help ensure that the pin 842 is aligned with the pin receptacle 875.

[0074] The method includes arranging a package expansion frame with a circuit board ( 1410 ).For example, the first main surface 822 of the semiconductor module 802 is press-fitted into the circuit board 806 using the first package expansion frame 804A and the second package expansion frame 804B.

[0075] The method includes mechanically coupling the package extension frame to one or more of the circuit board and / or the heat sink (1414). For example, the fastener 110 can be configured to mechanically couple the first package extension frame 104A and the second package extension frame 104B to the circuit board 106 and the heat sink 108. In some examples, the fastener 410A is configured to mechanically couple the first package extension frame 404 to the circuit board 406. In this example, the fastener 410C is configured to mechanically couple the first package extension frame 404 to the heat sink 408. In some examples, the fastener 510A is configured to mechanically couple the first package extension frame 504 to the heat sink 508. In this example, the fastener 510C is configured to mechanically couple the circuit board 506 to the heat sink 508. In some examples, the fastener 610A is configured to mechanically couple the first package extension frame 604 to the heat sink 608. In this example, fastener 610C is configured to mechanically couple circuit board 606 to heat sink 608 .

[0076] Although the semiconductor package has been described with reference to the illustrative embodiments, the description is not intended to be interpreted in a limiting sense. Various modifications and combinations of the illustrative embodiments and other embodiments of the invention will be apparent to those skilled in the art upon reference to the specification. Therefore, it is intended that the appended claims cover any such modifications or embodiments.

[0077] The following examples may illustrate one or more aspects of the present invention.

[0078] Example 1. A semiconductor package comprises: a semiconductor module comprising a first side surface, a second side surface, a first main surface, and a second main surface on a side of the semiconductor module opposite to the first main surface; a first package extension frame configured to be attached to the first side surface; a second package extension frame configured to be attached to the second side surface; and a plurality of fasteners configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first main surface and / or a heat sink arranged on the second main surface.

[0079] Example 2. The semiconductor package of Example 1, wherein the plurality of fasteners are configured to mechanically couple the first package expansion frame and the second package expansion frame to a circuit board.

[0080] Example 3. The semiconductor package of any combination of Examples 1-2, wherein the plurality of fasteners are configured to mechanically couple the first package expansion frame and the second package expansion frame to the heat sink.

[0081] Example 4. The semiconductor package of any combination of Examples 1-3, wherein the plurality of fasteners are configured to mechanically couple the first package expansion frame and the second package expansion frame to the circuit board and the heat sink.

[0082] Example 5. The semiconductor package of any combination of Examples 1-4, wherein the circuit board includes a first plurality of alignment holes; and wherein the semiconductor module includes a second plurality of alignment holes arranged to correspond to the first plurality of alignment holes.

[0083] Example 6. A semiconductor package according to any combination of Examples 1-5, wherein the first package extension frame includes a third plurality of alignment holes arranged to correspond to two or more corresponding alignment holes in the first plurality of alignment holes; and wherein the second package extension frame includes a fourth plurality of alignment holes arranged to correspond to two or more corresponding alignment holes in the first plurality of alignment holes.

[0084] Example 7. A semiconductor package according to any combination of Examples 1-6, wherein the first side surface includes a mechanical coupling; and wherein the first package extension frame includes a complementary mechanical coupling that couples the first package extension frame to the first side surface when in contact with the mechanical coupling.

[0085] Example 8. The semiconductor package of any combination of Examples 1-7, wherein the first package extended frame includes a frame portion formed of a material different than a material of the complementary mechanical coupling.

[0086] Example 9. The semiconductor package of any combination of Examples 1-8, wherein the circuit board includes a first plurality of alignment holes; and wherein the first package extension frame includes a second plurality of alignment holes arranged to correspond to the first plurality of alignment holes.

[0087] Example 10. The semiconductor package according to any combination of Examples 1-9, wherein the semiconductor module comprises only two package expansion frames, the two package expansion frames comprising a first package expansion frame and a second package expansion frame.

[0088] Example 11. A semiconductor package according to any combination of Examples 1-10, wherein the semiconductor module further includes a third side surface and a fourth side surface, and the semiconductor package further includes: a third package extension frame configured to be attached to the third side surface; and / or a fourth package extension frame configured to be attached to the fourth side surface.

[0089] Example 12. A method comprising: attaching a first packaging expansion frame to a first side surface of a semiconductor module; attaching a second packaging expansion frame to a second side surface of the semiconductor module; arranging the first packaging expansion frame and the second packaging expansion frame together with a circuit board so that the first main surface of the semiconductor module faces the circuit board; arranging the first packaging expansion frame and the second packaging expansion frame together with a heat sink so that the second main surface of the semiconductor module faces the heat sink; mechanically coupling the first packaging expansion frame to one or more of the circuit board and / or the heat sink with one or more fasteners; and mechanically coupling the second packaging expansion frame to one or more of the circuit board and / or the heat sink with one or more fasteners.

[0090] Example 13. A method according to Example 12, wherein the semiconductor module includes a plurality of pins extending away from the first main surface, and the method further includes: aligning the plurality of pins with a plurality of pin sockets of a circuit board before arranging the first package extension frame and the second package extension frame with a circuit board and / or a heat sink.

[0091] Example 14. A method according to any combination of Examples 12-13, wherein the circuit board includes a first plurality of alignment holes; wherein the first package extension frame includes a second plurality of alignment holes; and wherein aligning the plurality of pins with the plurality of pin sockets includes aligning the second plurality of alignment holes with two or more corresponding alignment holes in the first plurality of alignment holes.

[0092] Example 15. A device according to any combination of Examples 12-14, wherein the semiconductor module includes a third plurality of alignment holes; and wherein aligning the plurality of pins with the plurality of pin receptacles further comprises aligning the third plurality of alignment holes with the first plurality of alignment holes.

[0093] Example 16. A method according to any combination of Examples 12-15, wherein attaching the first packaging extension frame to the first side surface includes pressing the first packaging extension frame into the first side surface or rotating the first packaging extension frame relative to the semiconductor module; and wherein attaching the second packaging extension frame to the second side surface includes pressing the second packaging extension frame into the second side surface or rotating the second packaging extension frame relative to the semiconductor module.

[0094] Example 17. A method according to any combination of Examples 12-16, further comprising: attaching a third packaging expansion frame to a third side surface of the semiconductor module; attaching a fourth packaging expansion frame to a fourth side surface of the semiconductor module, wherein arranging the first packaging expansion frame and the second packaging expansion frame together with the circuit board comprises: arranging the first packaging expansion frame, the second packaging expansion frame, the third packaging expansion frame and the fourth packaging expansion frame together with the circuit board so that the first main surface of the semiconductor module faces the circuit board.

[0095] Example 18. The method of any combination of Examples 12-17, wherein arranging the first package expansion frame and the second package expansion frame with the circuit board comprises: mounting the first main surface of the semiconductor module into the circuit board using the first package expansion frame and the second package expansion frame.

[0096] Example 19. The method of any combination of Examples 12-18, further comprising: applying thermal grease to the second main surface of the semiconductor module before arranging the first package expansion frame and the second package expansion frame with the heat sink.

[0097] Example 20. A circuit packaging system, comprising: a semiconductor module, comprising a first side surface, a second side surface, a first main surface, and a second main surface on a side of the semiconductor module opposite to the first main surface; a first packaging extension frame attached to the first side surface; a second packaging extension frame attached to the second side surface; a circuit board arranged on the first main surface; a heat sink arranged on the second main surface; and a plurality of fasteners mechanically coupling the first packaging extension frame and the second packaging extension frame to one or more of the circuit board or the heat sink.

[0098] Various aspects have been described in this disclosure. These and other aspects are within the scope of the following claims.

Claims

1. A semiconductor package, comprising: a semiconductor module comprising a first side surface, a second side surface, a first main surface, and a second main surface on a side of the semiconductor module opposite to the first main surface; a first package extension frame configured to be attached to the first side surface; a second package extension frame configured to be attached to the second side surface; as well as a plurality of fasteners configured to mechanically couple the first package extension frame and the second package extension frame to a circuit board disposed on the first main surface and / or a heat sink disposed on the second main surface, wherein the first side surface comprises a mechanical coupling member; and Wherein, the first package extension frame includes a complementary mechanical coupling member, and the complementary mechanical coupling member couples the first package extension frame to the first side surface when in contact with the mechanical coupling member.

2. The semiconductor package according to claim 1, in, The circuit board includes a first plurality of alignment holes; and Wherein, the semiconductor module includes a second plurality of alignment holes arranged to correspond to the first plurality of alignment holes.

3. The semiconductor package according to claim 2, in, the first package extension frame comprising a third plurality of alignment holes arranged to correspond to two or more corresponding alignment holes of the first plurality of alignment holes; and Wherein, the second package extension frame includes a fourth plurality of alignment holes arranged to correspond to two or more corresponding alignment holes of the first plurality of alignment holes.

4. The semiconductor package according to claim 1, wherein: The first package extension frame includes a frame portion formed from a material different from a material of the complementary mechanical coupling.

5. The semiconductor package according to claim 1, in, The circuit board includes a first plurality of alignment holes; and Wherein, the first package extension frame includes a third plurality of alignment holes arranged to correspond to the first plurality of alignment holes.

6. The semiconductor package according to claim 1, wherein The semiconductor module includes only two packaging expansion frames, and the two packaging expansion frames include the first packaging expansion frame and the second packaging expansion frame.

7. The semiconductor package according to claim 1, wherein: The semiconductor module further includes a third side surface and a fourth side surface, and the semiconductor package further includes: a third package extension frame configured to be attached to the third side surface; and / or A fourth package extension frame is configured to be attached to the fourth side surface.

8. A method comprising: attaching a first package expansion frame to a first side surface of the semiconductor module; attaching a second package expansion frame to a second side surface of the semiconductor module; arranging the first package expansion frame and the second package expansion frame together with a circuit board so that the first main surface of the semiconductor module faces the circuit board; arranging the first package expansion frame and the second package expansion frame together with a heat sink so that the second main surface of the semiconductor module faces the heat sink; mechanically coupling the first package extension frame to the circuit board and / or the heat sink with one or more fasteners; as well as mechanically coupling the second package extension frame to the circuit board and / or the heat sink with the one or more fasteners, wherein attaching the first packaging expansion frame to the first side surface comprises pressing the first packaging expansion frame into the first side surface or rotating the first packaging expansion frame relative to the semiconductor module; and Wherein, attaching the second packaging expansion frame to the second side surface includes pressing the second packaging expansion frame into the second side surface or rotating the second packaging expansion frame relative to the semiconductor module.

9. The method according to claim 8, wherein: The semiconductor module includes a plurality of pins extending away from the first main surface, and the method further includes: aligning the plurality of pins with a plurality of pin sockets of the circuit board before arranging the first package extension frame and the second package extension frame with the circuit board and / or the heat sink.

10. The method according to claim 9, in, The circuit board includes a first plurality of alignment holes; wherein the first package extension frame comprises a third plurality of alignment holes; and Wherein, aligning the plurality of pins with the plurality of pin receptacles comprises aligning the third plurality of alignment holes with two or more corresponding alignment holes of the first plurality of alignment holes.

11. The method according to claim 10, in, The semiconductor module includes a second plurality of alignment holes; and Wherein, aligning the plurality of pins with the plurality of pin insertion holes further comprises aligning the second plurality of alignment holes with the first plurality of alignment holes.

12. The method according to claim 8, further comprising: attaching a third package expansion frame to a third side surface of the semiconductor module; Attaching a fourth packaging expansion frame to a fourth side surface of the semiconductor module, wherein arranging the first packaging expansion frame and the second packaging expansion frame together with a circuit board includes: arranging the first packaging expansion frame, the second packaging expansion frame, the third packaging expansion frame, and the fourth packaging expansion frame together with the circuit board so that the first main surface of the semiconductor module faces the circuit board.

13. The method according to claim 8, wherein: Arranging the first package expansion frame and the second package expansion frame together with the circuit board includes mounting the first main surface of the semiconductor module into the circuit board using the first package expansion frame and the second package expansion frame.

14. The method according to claim 8, further comprising: Thermal grease is applied to the second main surface of the semiconductor module before arranging the first package expansion frame and the second package expansion frame together with the heat sink.

15. A circuit packaging system, comprising: A semiconductor module comprising a first side surface, a second side surface, a first main surface, and a second main surface on a side of the semiconductor module opposite to the first main surface; a first package expansion frame attached to the first side surface; a second package expansion frame attached to the second side surface; a circuit board disposed on the first major surface; a heat sink disposed on the second major surface; as well as a plurality of fasteners that mechanically couple the first package extension frame and the second package extension frame to the circuit board and / or the heat sink, wherein the first side surface comprises a mechanical coupling member; and Wherein, the first package extension frame includes a complementary mechanical coupling member, and the complementary mechanical coupling member couples the first package extension frame to the first side surface when in contact with the mechanical coupling member.

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