Automatic polishing equipment for metal bracket

Abstract

The present invention provides an automatic polishing device for metal stents, comprising a device base, an industrial computer, and a current and temperature control unit. The device base is provided with a motion control unit, a fixture unit, a polishing unit, a cleaning unit, and a support base. The motion control unit is connected to the fixture unit, and the motion control unit, fixture unit, polishing unit, cleaning unit, and current and temperature control unit are each connected to the industrial computer. The fixture unit and polishing unit are each connected to the current and temperature control unit. Under the action of the industrial computer and the current and temperature control unit, the motion control unit causes the fixture unit to move between the polishing unit, cleaning unit, and support base to complete the removal, polishing, and cleaning of the metal stent. The present invention has a simple structure and is easy to operate. It solves the technical problems of existing metal stent polishing devices, such as complex operation, uneven polishing, and low efficiency, and can be widely used in the field of medical device technology.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and in particular to an automatic polishing device for a metal bracket. Background Art

[0002] Percutaneous coronary intervention is one of the main means of treating cardiovascular diseases. It has the characteristics of less trauma, faster recovery and fewer side effects. Metal stents have been widely used in this field to expand the lesion site, thereby restoring the lumen diameter and improving blood circulation.

[0003] Currently, the electrochemical polishing methods and equipment for metal stents mostly use a single molding method, that is, each time the metal stent is clamped on a guide wire, one end of the guide wire is connected to the anode of a DC power supply, and the other end is placed in the middle position of the cathode ring in a polishing tank containing polishing liquid. After power is turned on, the metal stent is polished. The polishing process requires manual replacement of the clamping position multiple times to ensure polishing uniformity and avoid fixture marks. The entire process needs to be repeated by the operator, the steps are cumbersome, and the efficiency is low. Summary of the Invention

[0004] The purpose of the present invention is to solve the deficiencies of the above-mentioned technology and provide an automatic polishing device for a metal bracket.

[0005] To this end, the present invention provides an automatic polishing device for a metal bracket, which includes an equipment base, an industrial computer and a current and temperature control unit. The interior of the equipment base is provided with a motion control unit, a clamp unit, a polishing unit, a cleaning unit and a support base. The motion control unit is connected to the clamp unit. The motion control unit, the clamp unit, the polishing unit, the cleaning unit and the current and temperature control unit are respectively connected to the industrial computer. The clamp unit and the polishing unit are respectively connected to the current and temperature control unit. Under the action of the industrial computer and the current and temperature control unit, the motion control unit causes the clamp unit to move between the polishing unit, the cleaning unit and the support base to complete the picking up, polishing and cleaning of the metal bracket.

[0006] Preferably, the motion control unit includes a pillar, a first guide rail is provided above the pillar, a first cylinder is provided at one end of the first guide rail, the telescopic rod of the first cylinder is fixedly connected to the connecting bracket, and the connecting bracket is slidably connected to the first guide rail; the connecting bracket is fixedly connected to a second guide rail, a second cylinder is provided at the top end of the second guide rail, the telescopic rod of the second cylinder is fixedly connected to the clamp unit, and the clamp unit is slidably connected to the second guide rail, and the first cylinder and the second cylinder are respectively connected to the industrial computer.

[0007] Preferably, the clamp unit includes a clamp bracket, a clamp platform surface is connected below the clamp bracket, and several polishing clamps are connected below the clamp platform surface. The polishing clamp includes a third cylinder, a double-rod arm and a petal wire. The double-rod arm and the petal wire are used to clamp the metal bracket. The third cylinder is connected to the industrial computer, and the petal wire is connected to the current temperature control unit.

[0008] Preferably, the material of the double-bar arm is polyetheretherketone, and the material of the petal wire is platinum-iridium alloy.

[0009] Preferably, the polishing unit includes a polishing tank, a tank inner lining is provided in the polishing tank, a heating ring and several cathode rings are provided in the tank inner lining, and the heating ring and the cathode ring are connected to the current temperature control unit.

[0010] Preferably, the cleaning unit includes a cleaning tank, a supporting cylinder is provided in the cleaning tank, a telescopic rod of the supporting cylinder is connected to a base platform, a cleaning base is provided on the base platform, a plurality of hollow cleaning bases are provided on the cleaning base, and the supporting cylinder is connected to the industrial computer.

[0011] Preferably, the support base comprises a support base plate, a plurality of hollow support bases are provided on the support base plate, and a metal bracket is provided in the cavity of the support base.

[0012] Preferably, a third guide rail is further provided below the support base, and the support base is slidably connected to the third guide rail.

[0013] Preferably, an exhaust duct is provided on the top side of the device base.

[0014] The beneficial effects of the present invention are:

[0015] The present invention is provided with an equipment base, an industrial computer and a current and temperature control unit. The interior of the equipment base is provided with a motion control unit, a clamp unit, a polishing unit, a cleaning unit and a support base. Under the action of the industrial computer and the current and temperature control unit, the motion control unit enables the clamp unit to move between the polishing unit, the cleaning unit and the support base to complete the removal, polishing and cleaning of the metal bracket.

[0016] The present invention has a simple structure and is easy to operate. Through a series of continuous position transmission and current control, it achieves continuous automated production of electrochemical polishing of metal stents, reducing operator labor intensity and improving production efficiency. Furthermore, the polished metal stents achieved by this method have a uniform appearance, excellent polishing effect, and strong stability, making them widely applicable in the field of medical device technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural diagram of the main view of the present invention;

[0018] Figure 2 It is a schematic structural diagram of a top view of the present invention;

[0019] Figure 3 It is a structural schematic diagram of a stereogram of the present invention;

[0020] Figure 4 It is a structural schematic diagram of the polishing fixture of the present invention;

[0021] Figure 5 It is a structural schematic diagram of the cleaning unit of the present invention.

[0022] Markings in the figure: 1. Equipment base, 11. Exhaust pipe, 2. Industrial computer, 3. Current and temperature control unit, 4. Motion control unit, 41. Support, 42. First guide rail, 43. First cylinder, 44. Position sensor, 45. Connecting bracket, 46. Second guide rail, 47. Second cylinder, 5. Fixture unit, 51. Fixture bracket, 52. Fixture platform, 53. Polishing fixture, 531. Third cylinder, 532. Intake pipe, 5 33. Fixture base, 534. Double-bar arm, 535. Petal wire, 6. Polishing unit, 61. Polishing tank, 62. Tank lining, 63. Heating ring, 64. Cathode ring, 65. Fixed frame, 7. Cleaning unit, 71. Support cylinder, 72. Base platform, 73. Cleaning tank, 74. Cleaning base, 75. Cleaning base, 8. Support base, 81. Support base, 82. Support base, 83. Third guide rail, 9. Metal bracket. DETAILED DESCRIPTION

[0023] The present invention is further described below with reference to the accompanying drawings and specific examples to facilitate understanding of the present invention. The methods used in the present invention are conventional methods unless otherwise specified; the raw materials and devices used are conventional commercially available products unless otherwise specified.

[0024] Depend on Figure 1-Figure 3As shown, the present invention provides an automatic polishing device for a metal bracket, which includes a device base 1, an industrial computer 2 and a current and temperature control unit 3. The device base 1 is a frame structure, which is sealed on all sides to form a cavity, and a motion control unit 4, a clamp unit 5, a polishing unit 6, a cleaning unit 7 and a support base 8 are provided in the cavity. An exhaust pipe 11 is provided on the top side of the device base 1 to facilitate the treatment of the waste gas generated after electrochemical polishing. The motion control unit 4 is connected to the clamp unit 5, and the polishing unit 6, the cleaning unit 7 and the support base 8 are arranged in sequence in front of the motion control unit 4 and connected to the bottom of the device base 1. When the clamp unit 5 moves left and right under the action of the motion control unit 4, it passes directly above the polishing unit 6, the cleaning unit 7 and the support base 8 in sequence. The motion control unit 4, the clamp unit 5, the polishing unit 6, the cleaning unit 7, and the current and temperature control unit 3 are respectively connected to the industrial computer 2, and the clamp unit 5 and the polishing unit 6 are respectively connected to the current and temperature control unit 3. Under the action of the industrial computer 2 and the current and temperature control unit 3, the motion control unit 4 makes the clamp unit 5 move between the polishing unit 6, the cleaning unit 7, and the support base 8 to complete the removal, polishing and cleaning of the metal bracket 9.

[0025] The motion control unit 4 includes two pillars 41, each of which is fixedly connected to the bottom of the device base 1. A first guide rail 42 is provided above the pillars 41. The first guide rail 42 is arranged horizontally. A first cylinder 43 is provided at one end of the first guide rail 42. A position sensor 44 is provided at the other end of the first guide rail 42. The position sensor 44 is connected to the industrial computer 2. The telescopic rod of the first cylinder 43 is fixedly connected to a connecting bracket 45. The connecting bracket 45 is slidably connected to the first guide rail 42. When the telescopic rod of the first cylinder 43 is extended or retracted, the connecting bracket 45 moves left and right along the first guide rail 42. A second guide rail 46 is fixedly connected to the connecting bracket 45. The second guide rail 46 is arranged vertically. A second cylinder 47 is provided at the top of the second guide rail 46. The telescopic rod of the second cylinder 47 is fixedly connected to the clamp unit 5. The clamp unit 5 is slidably connected to the second guide rail 46. When the telescopic rod of the second cylinder 47 is extended or retracted, the clamp unit 5 moves up and down. The first cylinder 43 and the second cylinder 47 are respectively connected to the industrial computer 2. Under the program control of the industrial computer 2, the first cylinder 43 and the second cylinder 47 move the clamp unit 5 horizontally or vertically between the polishing unit 6, the cleaning unit 7, and the support base 8 to complete the positioning of the clamp unit 5.

[0026] Depend on Figure 4As shown, the fixture unit 5 includes a fixture bracket 51, with a fixture platform 52 connected below the fixture bracket 51. Several polishing fixtures 53 are connected below the fixture platform 52 and are distributed circumferentially below the fixture platform 52. The polishing fixtures 53 include a third air cylinder 531, an air inlet pipe 532, a fixture base 533, a double-lever arm 534, and petal wires 535. The third air cylinder 531 and the air inlet pipe 532 are located above and fixedly connected to the fixture base 533. The double-lever arm 534 and petal wires 535 are located below and fixedly connected to the fixture base 533. The horizontal wires and petal wires 535 provided below the double-lever arm 534 are used to clamp the metal bracket 9. To achieve automated control, the third air cylinder 531 is connected to the industrial computer 2, and the petal wires 535 are connected to the current and temperature control unit 3. When clamping the metal bracket 9, the industrial computer 2 controls the third air cylinder 531 through a preset program to pressurize or depressurize the air inlet pipe 532, pushing the push rod in the clamp base 533. This opens and closes the double-arm 534 and the petal wire 535, completing the clamping of the metal bracket 9. The industrial computer 2 controls the current flow to the petal wire 535, and the current and temperature control unit 3 controls the current output to the petal wire 535.

[0027] The double-bar arm 534 is made of polyetheretherketone, and the petal filament 535 is made of platinum-iridium alloy. The distance between the double-bar arm 534 and the petal filament 535 can be adjusted by adjusting the screws on the polishing fixture 53 according to the outer diameter of the metal stent 9 to be polished, thereby completing the clamping function for metal stents 9 of different diameters and lengths. This operation avoids the problem of being unable to clamp metal stents 9 of different diameters due to excessive spacing or deformation of the metal stent 9 due to insufficient spacing. The diameter range of the metal stent 9 that can be clamped is 1.0mm to 10mm, and the length range of the metal stent 9 is 5mm to 50mm.

[0028] It should be noted that the structure and working principle of the polishing fixture 53 belong to the prior art and will not be described here one by one. For details, please refer to our company's invention patent: A new type of bracket polishing fixture, patent number 201620137223.7.

[0029] The polishing unit 6 includes a polishing tank 61, which is connected to the bottom of the equipment base 1 and is equipped with a tank lining 62. The tank lining 62 is equipped with a heating coil 63 and several cathode coils 64. The cathode coils 64 are evenly distributed along the circumference of the tank lining 62 and fixed by a fixing frame 65. During polishing, the cathode coils 64 correspond one-to-one with the polishing fixtures 53 of the fixture unit 5. To achieve automated control, the heating coils 63 are connected to the power supply included in the current and temperature control unit 3. The industrial computer 2 controls the power supply of the heating coils 63. The current and temperature control unit 3 controls the heating temperature of the heating coils 63 to heat the electrochemical polishing liquid in the tank lining 62 to a set temperature. A temperature sensor is also provided at the bottom of the tank lining 62. The temperature sensor is connected to the industrial computer 2 to facilitate heating the electrochemical polishing liquid in the tank lining 62 to a precise temperature. During polishing, the electrochemical polishing liquid in the tank lining 62 is heated to a set temperature. The metal stent 9, held by the polishing fixture 53, enters the cathode ring 64 under the control of the motion control unit 4, positioned slightly above the center of the cathode ring 64 and completely immersed in the electrochemical polishing liquid. The cathode ring 64 is connected to the cathode power supply of the current and temperature control unit 3, and the petal wire 535 is connected to the anode power supply of the current and temperature control unit 3, completing the electrochemical polishing of the metal stent 9. The start and end of polishing are controlled by the industrial computer 2, which connects and disconnects the current of the cathode ring 64 and the petal wire 535. The output current of each petal wire 535, that is, the output current of each metal stent 9, is regulated and controlled by the current regulator of the current and temperature control unit 3.

[0030] Depend on Figure 5 As shown, the cleaning unit 7 includes a cleaning tank 73, in which a supporting cylinder 71 is provided. The cylinder body of the supporting cylinder 71 is fixedly connected to the bottom of the tank body of the cleaning tank 73. The telescopic rod of the supporting cylinder 71 is connected to a base platform 72. A cleaning base 74 is connected above the base platform 72. The cleaning base 74 has several hollow cleaning bases 75 evenly arranged along its circumference. The cleaning bases 75 correspond one-to-one with the polishing fixtures 53 of the fixture unit 5 and are used to support the metal bracket 9. Under the extension and retraction of the telescopic rod of the supporting cylinder 71, the cleaning base 75 moves up and down to clean the metal bracket 9 after electrochemical polishing. The supporting cylinder 71 is also connected to the industrial computer 2. During cleaning, the clamp unit 5 clamps the metal bracket 9 and runs to the top of the cleaning base 75 under the action of the motion control unit 4. The industrial computer 2 program controls the pressure relief of the air inlet pipe 532, opens the double-arm 534 and the petal wire 535, opens the polishing clamp 53, and places the metal bracket 9 into the cleaning base 75; the industrial computer 2 program controls the operation of the supporting cylinder 71 to descend, and completely submerges the metal bracket 9 into the clean water in the cleaning tank 73 for cleaning. After cleaning, the industrial computer 2 program controls the operation of the supporting cylinder 71 to rise so that the metal bracket 9 is exposed to the water surface.

[0031] The support base 8 comprises a support base 81, which is connected to the bottom of the device base 1. Several hollow support bases 82 are evenly distributed along the circumference of the support base 81. Each of the support bases 82 houses a metal bracket 9, which corresponds to a polishing fixture 53 of the fixture unit 5. When polishing the metal bracket 9, the fixture unit 5, under the control of the motion control unit 4, moves above the support base 82, positioning the metal bracket 9 between the double-bar arm 534 and the petal wire 535. Under program control from the industrial computer 2, the fixture unit 5 presses against the air inlet pipe 532, closing the polishing fixture 53 and clamping the metal bracket 9. Under the action of the motion control unit 4, the metal bracket 9 is transported to the polishing unit 6 for the electrochemical polishing process. After the polishing is completed, under the program control of the industrial computer 2, the motion control unit 4 brings the clamp unit 5 back to the top of the support base 8. The industrial computer 2 program controls the pressure relief of the air inlet pipe 532 to open the polishing clamp 53, and the metal bracket 9 is placed back on the support base 82. After the clamp unit 5 is lowered a certain distance under the action of the second cylinder 47, the industrial computer 2 program controls the closing of the polishing clamp 53, changes the clamping position, re-clamps the metal bracket 9, and then restarts the polishing process to ensure that the metal bracket 9 is polished evenly. After the polishing cycle is completed, the motion control unit 4 controls the polishing clamp 53 to enter the cleaning tank 73, and the metal bracket 9 is placed in the cleaning base 75 for cleaning. After the cleaning is completed, the polishing clamp 53 re-clamps the metal bracket 9 and is placed back on the support base 8 through the motion control unit 4, completing the automatic polishing process of the metal bracket 9.

[0032] In order to facilitate the taking of the metal bracket 9 , a third guide rail 83 may be further provided below the support base 8 , and the support base 81 is slidably connected to the third guide rail 83 .

[0033] The use process of the present invention is:

[0034] First, insert the metal supports 9 one by one into the cavities of the support base 82 and secure the support base 8 at the right end of the cleaning unit 7. The industrial computer 2 program controls the heating coil 63 to power on, and the current and temperature control unit 3 controls the electrochemical polishing liquid to the set temperature. The industrial computer 2 program controls the extension of the telescopic rod of the first cylinder 43, causing the clamp unit 5 to move to the right end of the first guide rail 42 and contact the position sensor 44. The position sensor 44 transmits the sensing signal to the industrial computer 2 via the control circuit. After receiving the signal, the industrial computer 2 program controls the first cylinder 43 to stop. The industrial computer 2 then program controls the extension of the telescopic rod of the second cylinder 47, causing the clamp unit 5 to move downward to the position of the metal support 9 and then stop. The metal support 9 is located between the double-arm 534 and the petal wire 535. Under the program control of the industrial computer 2, the third cylinder 531 presses the air inlet pipe 532, closing the polishing clamp 53 and clamping the metal support 9. The IPC 2 program then controls the telescopic rod of the second cylinder 47 to retract, causing the clamp unit 5 to rise a certain distance and then stop. The IPC 2 program then controls the telescopic rod of the first cylinder 43 to retract, causing the clamp unit 5 to move leftward to the top of the polishing unit 6 and then stop. The IPC 2 program then controls the telescopic rod of the second cylinder 47 to extend, causing the clamp unit 5 to descend. The polishing fixture 53 clamps the metal bracket 9 into the polishing tank 61, with the metal bracket 9 positioned slightly above the center of the cathode ring 64 and completely immersed in the electrochemical polishing solution. The IPC 2 program controls the connection of current between the petal wire 535 and the cathode ring 64, starting the electrochemical polishing process of the metal bracket 9. The output current on each metal bracket 9 is adjusted by the current and temperature control unit 3. After a polishing cycle is complete, the industrial computer 2 program controls the fixture unit 5 to return to the top of the support base 82, aligning the metal bracket 9 with the support base 82. The industrial computer 2 program controls the third cylinder 531 to release pressure from the air inlet pipe 532, opening the polishing fixture 53 and placing the metal bracket 9 back onto the support base 82. The industrial computer 2 program controls the telescopic rod of the second cylinder 47 to extend, lowering the polishing fixture 53 a certain distance. The industrial computer 2 program controls the closing of the polishing fixture 53, changing the clamping position, and re-clamping the metal bracket 9 to continue the polishing process. This ensures that the metal bracket 9 is polished evenly and avoids fixture marks.

[0035] After the polishing cycle is complete, the industrial computer 2 program controls the polishing fixture 53 to enter the top of the cleaning unit 7, aligning the metal bracket 9 with the cleaning base 75. The industrial computer 2 program controls the opening of the polishing fixture 53 and the placement of the metal bracket 9 into the cleaning base 75. The industrial computer 2 program controls the expansion rod of the support cylinder 71 to retract, lowering the cleaning base 75. The metal bracket 9 is completely immersed in the clean water in the cleaning tank 73 for cleaning. After the cleaning cycle is complete, the industrial computer 2 program controls the polishing fixture 53 to re-clamp the metal bracket 9 back onto the support base 8, completing the automatic polishing process for the metal bracket 9.

[0036] In the description of the present invention, it should be understood that the terms "left", "right", "up", "down", "top", "bottom", "front", "back", "inside", "outside", "back", "middle", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] However, the above description is merely a specific embodiment of the present invention and should not be used to limit the scope of implementation of the present invention. Therefore, the replacement of equivalent components, or equivalent changes and modifications made according to the scope of protection of the present invention should still fall within the scope covered by the claims of the present invention.

Claims

1. An automatic polishing device for metal stents, characterized in that: The device comprises an equipment base, an industrial computer and a current and temperature control unit. The equipment base is internally provided with a motion control unit, a fixture unit, a polishing unit, a cleaning unit and a support base. The motion control unit is connected to the fixture unit, and the motion control unit, the fixture unit, the polishing unit, the cleaning unit and the current and temperature control unit are respectively connected to the industrial computer. The fixture unit and the polishing unit are respectively connected to the current and temperature control unit. Under the action of the industrial computer and the current and temperature control unit, the motion control unit enables the fixture unit to move between the polishing unit, the cleaning unit and the support base to complete the removal, polishing and cleaning of the metal bracket. The motion control unit includes a pillar, a first guide rail is provided above the pillar, a first cylinder is provided at one end of the first guide rail, a telescopic rod of the first cylinder is fixedly connected to a connecting bracket, and the connecting bracket is slidably connected to the first guide rail; a second guide rail is fixedly connected to the connecting bracket, a second cylinder is provided at the top end of the second guide rail, a telescopic rod of the second cylinder is fixedly connected to the clamp unit, and the clamp unit is slidably connected to the second guide rail, and the first cylinder and the second cylinder are respectively connected to the industrial computer; The clamp unit includes a clamp bracket, a clamp platform surface is connected below the clamp bracket, and a plurality of polishing clamps are connected below the clamp platform surface. The polishing clamp includes a third cylinder, a double-bar arm and a petal wire. The double-bar arm and the petal wire are used to clamp the metal bracket. The third cylinder is connected to the industrial computer, and the petal wire is connected to the current and temperature control unit. The polishing unit includes a polishing tank, a tank lining is provided in the polishing tank, a heating coil and several cathode coils are provided in the tank lining, and the heating coil and the cathode coil are connected to the current temperature control unit; The support base comprises a support base plate, a plurality of hollow support bases are arranged on the support base plate, and a metal bracket is arranged in the cavity of the support base.

2. The automatic polishing device for metal stents according to claim 1, characterized in that: The material of the double-bar arm is polyetheretherketone, and the material of the petal wire is platinum-iridium alloy.

3. The automatic polishing device for metal stents according to claim 1, characterized in that: The cleaning unit includes a cleaning tank, a supporting cylinder is provided in the cleaning tank, a telescopic rod of the supporting cylinder is connected to a base platform, a cleaning base is provided on the base platform, a plurality of hollow cleaning bases are provided on the cleaning base, and the supporting cylinder is connected to the industrial computer.

4. The automatic polishing device for metal stents according to claim 1, characterized in that: A third guide rail is further provided below the support base, and the support base is slidably connected to the third guide rail.

5. The automatic polishing device for metal stents according to claim 1, characterized in that: An exhaust pipe is provided on the top side of the equipment base.

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