Ultrasonic transducer

Abstract

The present invention discloses an ultrasonic transducer, comprising a housing; a piezoelectric chip, wherein the piezoelectric chip is a self-focusing structure, wherein a plurality of piezoelectric chips of different radius sizes are installed on the housing adjacent to each other in sequence and with gaps therebetween, wherein the piezoelectric chips are divided into at least two groups, wherein each group of the piezoelectric chips has the same focus, and the piezoelectric chips of different groups have different focuses, and at least some of the piezoelectric chips can be independently controlled. The present invention adopts grouped self-focusing piezoelectric chips, wherein the piezoelectric chips of different groups have different focuses and can be driven and controlled separately, and multiple focuses can be superimposed when treating large lesions, thereby increasing power and speeding up treatment. When treating smaller lesions, a single focus can be used to achieve precise treatment, thereby achieving different methods for lesions of different volumes, and having greater applicability.

Description

Technical Field

[0001] The present invention relates to the technical field of power transducers, and in particular to an ultrasonic transducer. Background Art

[0002] At present, ultrasonic transducers are gradually being used in more and more occasions as a non-invasive minimally invasive treatment method. However, existing single ultrasonic transducers have fixed power and single focus, and use the same treatment method for different lesions, which is inflexible. Therefore, new ultrasonic transducers need to be developed. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an ultrasonic transducer that can stimulate ultrasonic cavitation mechanical damage, realize multi-focus accumulation regulation when treating lesions, and is suitable for treating lesions of different volumes.

[0004] An embodiment of the present invention provides an ultrasonic transducer, comprising:

[0005] shell;

[0006] A piezoelectric chip, wherein the piezoelectric chip is a self-focusing structure, wherein a plurality of piezoelectric chips with different radii are installed on the housing adjacent to each other with gaps therebetween, wherein the piezoelectric chips are divided into at least two groups, wherein each group of piezoelectric chips has the same focal point, and different groups of piezoelectric chips have different focal points, and at least some of the piezoelectric chips can be independently controlled.

[0007] The ultrasonic transducer of the embodiment of the present invention has at least the following beneficial effects:

[0008] By adopting grouped self-focusing piezoelectric chips, different groups of piezoelectric chips have different focal points and can be driven and controlled separately. When treating large lesions, multiple focal points can be superimposed to increase power and speed up treatment. When treating smaller lesions, a single focus can be used to achieve precise treatment, thereby achieving different methods for lesions of different sizes and having greater applicability. The sound pressures of each piezoelectric chip at the focus are superimposed on each other to ensure that ultrasonic cavitation mechanical damage can be stimulated.

[0009] According to the ultrasonic transducer of some other embodiments of the present invention, each piezoelectric chip can be independently controlled.

[0010] According to some other embodiments of the ultrasonic transducer of the present invention, a through exploration hole is opened at the middle bottom position of the shell, the piezoelectric chip is in the shape of an annular concave surface and is arranged around the exploration hole as the center, and the curvature radius of the shell is the same as the curvature radius of the piezoelectric chip.

[0011] According to some other embodiments of the ultrasonic transducer of the present invention, the value of the focal length / double curvature radius of the piezoelectric chip is between 0.75 and 1.05.

[0012] In the ultrasonic transducer according to some other embodiments of the present invention, a positive electrode and a negative electrode are provided on a side of the piezoelectric chip close to the housing.

[0013] According to some other embodiments of the ultrasonic transducer of the present invention, the ultrasonic transducer further includes a positive electrode lead, a negative electrode lead and a wire. Each piezoelectric chip is silver-plated as a whole. An insulating area is provided on a side of the piezoelectric chip close to the shell, and the silver-plated area is divided into two parts, the positive electrode and the negative electrode. The positive electrode is connected to the positive electrode lead, the negative electrode is electrically connected to the shell through the wire, and the shell is connected to the negative electrode lead.

[0014] According to some other embodiments of the ultrasonic transducer of the present invention, two annular insulating areas are provided on a side of the piezoelectric chip close to the shell, and the insulating area divides the silver-plated area into two parts, the positive electrode and the negative electrode; or the insulating area on the piezoelectric chip is a ring, the part inside the insulating area is the positive electrode, and the part outside the insulating area is the negative electrode.

[0015] According to some other embodiments of the ultrasonic transducer of the present invention, a common port and a plurality of lead holes are provided on the shell, each of the lead holes passes through the shell and corresponds to the positive electrode of each piezoelectric chip, and the common port is electrically connected to each negative electrode lead.

[0016] According to some other embodiments of the ultrasonic transducer of the present invention, an annular groove is provided on the housing at a position corresponding to the positive electrode of each piezoelectric chip, and the lead hole is located in the annular groove.

[0017] According to some other embodiments of the ultrasonic transducer of the present invention, the piezoelectric chip is insulated and adhered to the housing, and an insulating layer is formed between the piezoelectric chip and the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional schematic diagram of an ultrasonic transducer according to an embodiment of the present invention;

[0019] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the ultrasonic transducer from another angle;

[0020] Figure 3 yes Figure 1 A top view of the ultrasonic transducer;

[0021] Figure 4 yes Figure 3 Sectional view of the middle section AA;

[0022] Figure 5 yes Figure 4 Schematic diagram of two radii of the medium piezoelectric chip;

[0023] Figure 6 is a top view of a piezoelectric wafer according to an embodiment of the present invention;

[0024] Figure 7 FIG. 4 is a top view of a piezoelectric chip according to another embodiment of the present invention. DETAILED DESCRIPTION

[0025] The following will be combined with the embodiments to clearly and completely describe the concept of the present invention and the technical effects produced, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0026] In the description of the embodiments of the present invention, if orientation descriptions are involved, the orientations or positional relationships indicated by “up”, “down”, “front”, “back”, “left”, “right”, etc. are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0027] In the description of the embodiments of the present invention, if a feature is referred to as being "set", "fixed", "connected", or "installed" on another feature, it may be directly set, fixed, or connected to the other feature, or it may be indirectly set, fixed, connected, or installed on the other feature. In the description of the embodiments of the present invention, if "several" is involved, it means more than one, if "multiple" is involved, it means more than two, if "greater than", "less than", or "exceeds" is involved, it should be understood as not including the number itself, and if "above", "below", or "within" is involved, it should be understood as including the number itself. If "first" or "second" is involved, it should be understood as being used to distinguish technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0028] The present invention will be further described below in conjunction with the accompanying drawings.

[0029] Reference Figure 1, showing a three-dimensional schematic diagram of an ultrasonic transducer according to an embodiment of the present invention. This embodiment provides an ultrasonic transducer, including a housing 1 and a plurality of piezoelectric chips 2, each of which is a self-focusing structure with an annular concave surface. In this embodiment, eight piezoelectric chips 2 are used, and other different numbers of piezoelectric chips 2 can also be set according to specific circumstances, and the size radius 24 of each piezoelectric chip 2 is different (such as Figure 5 As shown in , 24 is the size radius of the piezoelectric chip 2, and 25 is the curvature radius of the piezoelectric chip 2. Eight piezoelectric chips 2 are installed adjacent to each other on the housing 1 in sequence, and there are gaps between them to prevent short circuits. The curvature radius 25 of all piezoelectric chips 2 are the same. The eight piezoelectric chips 2 are divided into two groups, the four piezoelectric chips 2 close to the center of the ring are the first group, and the four piezoelectric chips 2 away from the center are the second group. Each group of piezoelectric chips 2 has the same focus, and different groups of piezoelectric chips 2 have different focuses. The grouping method is not limited to the number of groups and the combination method of the piezoelectric chips 2 in this embodiment. As long as the piezoelectric chips 2 are grouped, the number of focuses can also be set according to the situation.

[0030] Each piezoelectric chip 2 is independently controlled. When in use, the number of piezoelectric chips 2 to be used can be selected according to the actual situation of the lesion. When treating small lesions, only a number of piezoelectric chips 2 with the same focus can be driven on to achieve single-focus treatment. According to the situation of the lesion and the required sound pressure value, the number of piezoelectric chips 2 used can be increased or decreased to generate sufficient sound pressure at the focus to produce cavitation effect and achieve the purpose of treatment. At the same time, it can prevent harm caused by excessive power or slow treatment speed due to insufficient power. When treating large lesions, piezoelectric chips 2 with different focuses can be turned on at the same time, and dual focus or more focuses can be used for treatment to speed up the treatment.

[0031] The focal length / double radius of curvature of all piezoelectric chips 2 is between 0.75 and 1.05. The piezoelectric chips 2 within this range of focal length / double radius of curvature have a strong focusing function. The sound pressures of multiple piezoelectric chips 2 at the focus are superimposed on each other, ensuring that the focus in the sound field has sufficient sound pressure to stimulate the ultrasonic cavitation mechanical damage effect, thereby producing the effect of treating lesions.

[0032] Reference Figure 2 , Figure 3 and Figure 4, showing a three-dimensional schematic diagram, a top view and a cross-sectional view of the AA section of the ultrasonic transducer of the present invention from another angle. The housing 1 is provided with a through-hole 11, which can accommodate detection devices such as a B-ultrasound probe, and is used for guiding treatment and real-time monitoring during treatment. The piezoelectric chip 2 is in the shape of an annular concave surface, and is arranged around the hole 11 as the center, ensuring that the centers of the radii 24 of the annular piezoelectric chips 2 are at the same point, so as to facilitate the alignment of the focus of the piezoelectric chip 2. Of course, the centers of the radii 24 of the annular piezoelectric chips 2 may not be at the same point, as long as the piezoelectric chips 2 can be divided into multiple groups with different focal points.

[0033] All piezoelectric chips 2 are adhered to the housing by insulating glue, forming an insulating layer between the piezoelectric chip 2 and the housing 1, thereby achieving an insulating effect between the piezoelectric chip and the housing 1. The piezoelectric chip 2 may also be fixed by other means such as screws, clamps or buckles, as long as the piezoelectric chip 2 can be fixed while achieving an insulating effect between the piezoelectric chip and the housing 1.

[0034] Reference Figure 6 , shows a top view of a piezoelectric chip 2 in one embodiment of the present invention. The surface of each piezoelectric chip 2 is silver-plated as a whole. Two annular insulating areas 21 are provided on the side where the piezoelectric chip 2 is mounted in conjunction with the housing 1. The annular insulating area 21 divides the silver-plated area into two parts, a positive electrode 22 and a negative electrode 23. The positive electrode 22 is connected to the positive electrode of the external driving device through the positive electrode lead 3, and the negative electrode 23 is electrically connected to the housing 1 through a wire. The housing 1 is connected to the negative electrode of the external driving device through the negative electrode lead 4 as a common terminal, thereby forming a complete circuit.

[0035] An annular groove 14 is provided at a position corresponding to each positive electrode 22 on the housing 1 to prevent the housing 1 from being connected to the positive electrode 22, causing a short circuit between the negative electrode 23 and the positive electrode 22. A common port 13 is provided at the rear of the housing 1, which is electrically connected to the negative electrode lead 4. A plurality of lead holes 12 are also provided on the housing 1. The lead holes 12 are located in the annular groove 14 and penetrate the housing 1. Each lead hole 12 corresponds to a positive electrode 22 on a piezoelectric chip 2. The positive electrode lead 3 is inserted into the lead hole 12 and connected to the positive electrode 22 of the piezoelectric chip 2. This arrangement avoids the lead wires occupying a large space, and an additional interlayer is provided for placing the lead wires.

[0036] In some embodiments, all piezoelectric chips 2 have the same focus, and power is controlled by starting different numbers of piezoelectric chips 2 to treat lesions of different sizes.

[0037] In some embodiments, the piezoelectric wafer 2 is divided into three or more groups with three or more different focal points to accommodate the treatment of lesions with a larger volume.

[0038] In some embodiments, several piezoelectric chips 2 are driven and controlled together, which reduces the number of driving devices used and saves costs and space.

[0039] In some embodiments, the focus of the piezoelectric wafer 2 can be adjusted to treat lesions in different locations.

[0040] In some embodiments, the surface of the housing 1 on which the piezoelectric chip 2 is mounted is a spherical crown surface, which has the same curvature radius as the piezoelectric chip 2 , which is conducive to the adhesion of the self-focusing annular piezoelectric chip 2 and can ensure the alignment of the focus of the piezoelectric chip 2 .

[0041] In some embodiments, a sandwich layer is provided between the piezoelectric wafer 2 and the housing 1 , in which a relevant curing material is filled, and the leads are embedded in the sandwich layer.

[0042] In some embodiments, the insulating region 21 on the piezoelectric wafer 2 is an annular shape, the positive electrode 22 is a circular portion located inside the annular insulating region 21, and the outside of the annular insulating region 21 is the negative electrode 23. Figure 7 shown.

[0043] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. An ultrasonic transducer, characterized in that: include: A housing, wherein a common port and a plurality of lead holes are provided on the housing; A piezoelectric chip, wherein the piezoelectric chip is a self-focusing structure, wherein a plurality of piezoelectric chips with different radii are installed on the housing in sequence adjacent to each other with gaps left, wherein the piezoelectric chips are divided into at least two groups, wherein each group of piezoelectric chips has the same focus, and different groups of piezoelectric chips have different focuses, and each piezoelectric chip can be controlled independently; The piezoelectric chip is provided with a positive electrode and a negative electrode on one side close to the shell; It also includes a positive lead, a negative lead and a wire. Each piezoelectric chip is silver-plated as a whole. An insulating area is provided on one side of the piezoelectric chip close to the shell, and the silver-plated area is divided into two parts, the positive electrode and the negative electrode. An annular groove is provided on the shell at a position corresponding to the positive electrode of each piezoelectric chip, the lead hole is located in the annular groove, each lead hole passes through the shell and corresponds to the positive electrode of each piezoelectric chip; The positive electrode lead is inserted into the lead hole and connected to the positive electrode of the piezoelectric chip, the negative electrode is electrically connected to the shell through the wire, and the common port is electrically connected to each of the negative electrode leads.

2. The ultrasonic transducer according to claim 1, characterized in that: A through exploration hole is opened at the middle bottom of the shell. The piezoelectric chip is in the shape of an annular concave surface and is arranged around the exploration hole as the center. The curvature radius of the shell is the same as the curvature radius of the piezoelectric chip.

3. The ultrasonic transducer according to claim 1, characterized in that: The value of focal length / twice the radius of curvature of the piezoelectric wafer is between 0.75 and 1.

05.

4. The ultrasonic transducer according to claim 1, characterized in that: Two annular insulating areas are provided on one side of the piezoelectric chip close to the shell, and the insulating areas divide the silver-plated area into two parts, the positive electrode and the negative electrode; or the insulating area on the piezoelectric chip is a ring, the part inside the insulating area is the positive electrode, and the part outside the insulating area is the negative electrode.

5. The ultrasonic transducer according to claim 1, characterized in that: The piezoelectric wafer is insulated and adhered to the housing, and an insulating layer is formed between the piezoelectric wafer and the housing.

Images