Electronic Devices

Abstract

An electronic device is provided, comprising a window, a display module, a pressure sensor and a bracket. The window comprises a flat area and a curved area. The display module is arranged on a lower surface of the window to overlap with the flat area and the curved area. The pressure sensor is arranged on a lower surface of the display module to overlap with the flat area and the curved area. The bracket is arranged on a lower surface of the display module and is coupled to at least one of the window and the display module. The pressure sensor is spaced apart from an upper surface of the bracket. The lower surface of the window and the lower surface of the display module face the same direction.

Description

Technical Field

[0001] Exemplary embodiments of the invention relate generally to an electronic device, and more particularly, to an electronic device having an input sensor. Background Art

[0002] Electronic devices such as smart phones, tablet computers, notebook computers, and smart TVs have been developed. The electronic devices include display devices for providing information. In addition to the display devices, the electronic devices also include various electronic modules.

[0003] The electronic device is manufactured by assembling a display device and an electronic module. In this case, the electronic module is arranged in an organized manner using a housing and a bracket of the electronic device. The display device includes a display panel and an electronic component coupled to the display panel.

[0004] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute the prior art. Summary of the invention

[0005] A device constructed according to an exemplary embodiment of the invention can provide an electronic device having improved sensitivity with respect to external pressure.

[0006] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0007] According to one or more exemplary embodiments of the invention, an electronic device includes a window, a display module, a pressure sensor, and a bracket. The window includes a flat area and a curved area. The display module is arranged on the lower surface of the window to overlap with the flat area and the curved area. The pressure sensor is arranged on the lower surface of the display module to overlap with the flat area and the curved area. The bracket is arranged on the lower surface of the display module and is coupled to at least one of the window and the display module. The pressure sensor is spaced apart from the upper surface of the bracket. The lower surface of the window and the lower surface of the display module face the same direction.

[0008] The electronic device may further include an adhesive tape overlapping the bending region, the adhesive tape bonding the bracket and the display module to each other.

[0009] The pressure sensor may be positioned closer to the center of the window than the tape.

[0010] The pressure sensor may overlap at least a portion of the bent area, overlap at least a portion of the flat area, and overlap at least a portion of the display module, and the pressure sensor may be spaced apart from the tape in a plan view.

[0011] The display module may include an optical film, an input sensor disposed under the optical film, a display panel disposed under the input sensor, and a protection panel disposed under the display panel, and the tape may be coupled to the protection panel.

[0012] A recess may be defined in the bracket corresponding to the pressure sensor.

[0013] The electronic device may further include an adhesive tape overlapping the bending region, the adhesive tape bonding the bracket and the display module to each other, and a thickness of the adhesive tape may be smaller than a thickness of the pressure sensor.

[0014] The pressure sensor may include a first substrate layer, a second substrate layer defining a gap together with the first substrate layer, a first electrode arranged on an inner surface of the first substrate layer or an inner surface of the second substrate layer, a second electrode arranged on an inner surface of the first substrate layer or an inner surface of the second substrate layer, and a sensing layer including a substrate resin and conductive particles mixed with the substrate resin, wherein the inner surface of the first substrate layer and the inner surface of the second substrate layer may face each other.

[0015] The pressure sensor may include: a first electrode, which is arranged in each of a first pressure sensing region, a second pressure sensing region, and a temperature compensation region, the temperature compensation region being arranged between the first pressure sensing region and the second pressure sensing region; a second electrode, which is arranged in each of the first pressure sensing region, the second pressure sensing region, and the temperature compensation region; and a sensing layer, which is arranged in each of the first pressure sensing region and the second pressure sensing region to be spaced apart from at least one of the first electrode and the second electrode and not arranged in the temperature compensation region.

[0016] The electronic device may further include a sub sensing layer which may be disposed in each of the first pressure sensing region, the second pressure sensing region, and the temperature compensation region, the sub sensing layer being in contact with the first electrode and the second electrode.

[0017] According to one or more exemplary embodiments of the invention, the electronic device may include a window, a display module, a pressure sensor, and a support layer. The window may include a flat area and a peripheral area arranged outside the flat area. The display module is arranged on the lower surface of the window to overlap with the flat area and the peripheral area. The pressure sensor is arranged on the lower surface of the display module to overlap with at least the peripheral area. The support layer is arranged on the lower surface of the pressure sensor and may have a Young's modulus greater than that of the pressure sensor. The lower surface of the window, the lower surface of the display module, and the lower surface of the pressure sensor face the same direction.

[0018] The electronic device may further include a bracket disposed on a lower surface of the display module and coupled to at least one of the window and the display module, and the support layer may be spaced apart from an upper surface of the bracket.

[0019] The electronic device may further include an adhesive tape overlapping the peripheral area, the adhesive tape bonding the bracket and the display module to each other.

[0020] A recess may be defined in the bracket corresponding to the support layer.

[0021] The support layer may be inserted into the recess.

[0022] The peripheral region may include a curved region extending from the flat region and a side region extending from the curved region, and the pressure sensor may be provided at least in the side region.

[0023] The pressure sensor may include a first substrate layer, a second substrate layer defining a gap together with the first substrate layer, a first electrode arranged on an inner surface of the first substrate layer or an inner surface of the second substrate layer, a second electrode arranged on an inner surface of the first substrate layer or an inner surface of the second substrate layer, and a sensing layer including a quantum tunneling complex, wherein the inner surface of the first substrate layer and the inner surface of the second substrate layer may face each other.

[0024] The support layer may have a Young's modulus greater than a Young's modulus of the first base layer.

[0025] The first base layer may include a single polymer film.

[0026] The support layer may include a plurality of stacked prepreg layers.

[0027] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept.

[0029] Figure 1A is a perspective view illustrating an electronic device according to an exemplary embodiment of the present disclosure.

[0030] Figure 1B is an exploded perspective view illustrating an electronic device according to an exemplary embodiment of the present disclosure.

[0031] Figure 2 is a block diagram illustrating an electronic device according to an exemplary embodiment of the present disclosure.

[0032] Figure 3A and Figure 3B is a cross-sectional view showing a display device according to an exemplary embodiment of the present disclosure.

[0033] Figure 4A is an exploded perspective view illustrating a display device according to an exemplary embodiment of the present disclosure.

[0034] Figure 4B is a rear view showing a display device according to an exemplary embodiment of the present disclosure.

[0035] Figure 4C is a cross-sectional view showing a display device according to an exemplary embodiment of the present disclosure.

[0036] Figure 5A is a plan view showing a pressure sensor according to an exemplary embodiment of the present disclosure.

[0037] Figure 5B is a cross-sectional view illustrating a pressure sensor according to an exemplary embodiment of the present disclosure.

[0038] Figure 5C is a plan view showing a pressure sensor according to an exemplary embodiment of the present disclosure.

[0039] Fig. 6A is a cross-sectional view illustrating a pressure sensor according to an exemplary embodiment of the present disclosure.

[0040] Figure 6B and Figure 6C is a cross-sectional view illustrating a pressure sensor according to an exemplary embodiment of the present disclosure.

[0041] Fig. 7A is an exploded perspective view illustrating an electronic device according to an exemplary embodiment of the present disclosure.

[0042] Figure 7B , Figure 7C , Fig.7D , Fig. 7E , Figure 7F and Figure 7G are cross-sectional views respectively illustrating electronic devices according to exemplary embodiments of the present disclosure.

[0043] Figure 8 is a perspective view illustrating an electronic device according to an exemplary embodiment of the present disclosure.

[0044] Fig.9A and Fig. 9B are cross-sectional views respectively illustrating a display device according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0045] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of various exemplary embodiments or implementations of the invention. "Embodiment" and "implementation" as used herein are interchangeable words and are non-limiting examples of devices or methods using one or more of the inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other examples, well-known structures and devices are shown in block diagram form to avoid unnecessary obscurity of various exemplary embodiments. In addition, various exemplary embodiments may be different, but need not be exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0046] Unless otherwise specified, the illustrated exemplary embodiments will be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be further combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0047] The use of cross hatching and / or shading is usually provided in the drawings to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or demand for the specific material, material properties, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments may be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described in succession may be performed substantially simultaneously or two processes described in succession may be performed in an order opposite to the order described. In addition, the same reference numerals represent the same elements.

[0048] When an element or layer is referred to as being "on," "connected to," or "bonded to" another element or layer, the element or layer may be directly on, directly connected to, or directly bonded to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly bonded to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without intervening elements. In addition, the DR1 axis, the DR2 axis, and the DR3 axis are not limited to the three axes of a rectangular coordinate system (such as the x-axis, the y-axis, and the z-axis), and may be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the DR3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as any combination of only X, only Y, only Z, or two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0049] Although the terms "first," "second," etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be named a second element without departing from the disclosed teachings.

[0050] For descriptive purposes, spatially relative terms such as "under," "below," "below," "down," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as "under" or "beneath" other elements or features would subsequently be positioned as "above" the other elements or features. Thus, the exemplary term "under" can include both above and below orientations. In addition, the device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein interpreted accordingly.

[0051] The terms used herein are for the purpose of describing a particular embodiment, and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular "one (kind / person)" and "the (described)" are also intended to include plural forms. In addition, when the terms "comprising" and / or "including" are used in this specification, it is indicated that there are stated features, integral bodies, steps, operations, elements, components and / or their groups, but one or more other features, integral bodies, steps, operations, elements, components and / or their groups are not excluded from existence or addition. It is also noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, and are used to explain the inherent deviations of measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0052] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views as schematic diagrams of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the diagrams due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be interpreted as being limited to the specific illustrated shapes of the regions, but will include deviations in shapes due to, for example, manufacturing. In this manner, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and thus need not be intended to be limiting.

[0053] According to the convention in the art, some exemplary embodiments are described and shown in the drawings according to functional blocks, functional units and / or functional modules. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc., and electronic (or optical) circuits can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform various functions discussed herein, and they can be selectively driven by firmware and / or software. It can also be expected that each block, unit and / or module can be implemented by dedicated hardware, or can be implemented as a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed microprocessors and associated circuits) for performing other functions. In addition, without departing from the scope of the inventive concept, each block, unit and / or module of some exemplary embodiments can be physically separated into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0054] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which this disclosure is a part. Terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0055] Figure 1A is a perspective view illustrating an electronic device ED according to an exemplary embodiment of the present disclosure. Figure 1B is an exploded perspective view illustrating an electronic device ED according to an exemplary embodiment of the present disclosure. Figure 2 is a block diagram illustrating an electronic device ED according to an exemplary embodiment of the present disclosure.

[0056] In the exemplary embodiment, a smart phone is shown as a representative example of the electronic device ED. However, the electronic device ED should not be limited to a smart phone. In the exemplary embodiment of the present disclosure, the electronic device ED may be a tablet computer, a laptop computer, a smart watch, or a smart TV.

[0057] Reference Figure 1A , when viewed in a front view, the electronic device ED includes a display area DA and a non-display area NDA disposed adjacent to the display area DA. The non-display area NDA surrounds the display area DA. In an exemplary embodiment of the present disclosure, the non-display area NDA may be disposed only in two areas facing each other on the first direction axis DR1, or only in two areas facing each other on the second direction axis DR2.

[0058] A portion of the display area DA may be defined as a pressure sensing area PSA The pressure sensing area PSA may sense pressure applied thereto from a front surface of the electronic device ED.

[0059] The display surface IS through which the image IM is displayed may include a flat area FA and a curved area CA. A window WM described later may provide the display surface IS. The flat area FA is substantially parallel to a surface defined by the first direction axis DR1 and the second direction axis DR2. In an exemplary embodiment, the display surface IS has a structure in which the curved areas CA are disposed on both sides of the flat area FA in the first direction DR1.

[0060] The third direction axis DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the electronic device ED. The front surface (or upper surface, or first surface) and the rear surface (or lower surface, or second surface) of each component are defined to be distinguished from each other relative to the direction in which the image IM is displayed. However, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 are relative to each other and can be changed to other directions. In the following, the first direction, the second direction, and the third direction correspond to the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, respectively, and are assigned with the same reference numerals as the reference numerals of the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3.

[0061] Reference Figure 1A and Figure 1B The electronic device ED includes a display device DD, an electronic module EM, a power module PM, a bracket BRK and a housing EDC. Figure 1A and Figure 1B The construction of the components is simply shown in FIG.

[0062] The display device DD includes a window WM and a display module DM. The window WM provides a display surface IS of the electronic device ED. The display module DM is disposed on the rear surface of the window WM and generates an image. In addition, the display module DM senses a user's input, such as a user's touch / hover of a stylus. The display module DM is electrically connected to the electronic module EM via a flexible circuit board or a connector.

[0063] In an exemplary embodiment, each of the window WM and the display module DM includes a flat area FA and two curved areas CA extending from the flat area FA and facing each other in the first direction DR1. However, the shapes of the window WM and the display module DM should not be limited thereto or thereby.

[0064] The power module PM supplies power necessary for the overall operation of the electronic device ED. The power module PM may include a general battery module.

[0065] The bracket BRK is coupled to the display device DD and / or the housing EDC to partition an inner space of the electronic device ED. The bracket BRK may be a supporting member disposed on a lower surface of the display module DM and coupled to at least one of the window WM and the display module DM.

[0066] The bracket BRK provides a space in which other components are arranged. In addition, the bracket BRK supports the display device DD so that the display device DD is fixed without shaking. A coupling groove corresponding to the shape of the electronic module EM is defined in the bracket BRK so that the electronic module EM is fixed. The bracket BRK includes a metal member or a plastic member. In the exemplary embodiment, one bracket BRK is shown as a representative example, however, the electronic device ED may include a plurality of brackets BRK.

[0067] The housing EDC is coupled to the bracket BRK and / or the display device DD. The housing EDC provides the exterior of the electronic device ED. In the exemplary embodiment, the housing EDC formed with one body is shown as a representative example, however, the housing EDC may include a plurality of bodies assembled to each other. The housing EDC may include a plurality of frames and / or plates formed of a glass material, a plastic material, or a metal material.

[0068] The electronic module EM includes a motherboard and various functional modules mounted on the motherboard to operate the electronic device ED. The motherboard is electrically connected to the display device DD via a common connector. Here, the motherboard may include a rigid circuit board.

[0069] Reference Figure 2 , the electronic module EM may include a control module 10, a wireless communication module 20, an image input module 30, a sound input module 40, a sound output module 50, a memory 60, an external interface module 70, a light emitting module 80, a light receiving module 90, and a camera module 100. Some of the modules may be electrically connected to the motherboard through a flexible circuit board or a connector without being mounted on the motherboard.

[0070] The control module 10 controls the overall operation of the electronic device ED. The control module 10 may be, but is not limited to, a microprocessor. For example, the control module 10 activates or deactivates the display device DD. The control module 10 controls the image input module 30, the sound input module 40, and the sound output module 50 based on a user input signal provided from the display device DD.

[0071] The wireless communication module 20 can use Bluetooth or WiFi links to send wireless signals to other terminals / receive wireless signals from other terminals. The wireless communication module 20 can use universal communication lines to send / receive voice signals. The wireless communication module 20 may include a transmitter 22 that modulates a signal to be sent and sends the modulated signal and a receiver 24 that demodulates the signal applied thereto.

[0072] The image input module 30 processes the image signal and converts the image signal into image data that can be displayed by the display device DD. The sound input module 40 receives an external sound signal through a microphone in a recording mode or a voice recognition mode and converts the external sound signal into electronic voice data. The sound output module 50 converts the sound data provided from the wireless communication module 20 or the sound data stored in the memory 60, and outputs the converted sound data to the outside.

[0073] The external interface module 70 serves as an interface between the control module 10 and external devices such as an external charger, a wired / wireless data port, a card socket (eg, a memory card and a SIM / UIM card), and the like.

[0074] The light emitting module 80 generates light and outputs light. The light emitting module 80 may emit infrared rays. The light emitting module 80 may include an LED element. The light receiving module 90 may sense infrared rays. When infrared rays having a predetermined level or a higher level are sensed, the light receiving module 90 may be activated. The light receiving module 90 may include a complementary metal oxide semiconductor (CMOS). The infrared rays generated by the light emitting module 80 and output from the light emitting module 80 may be reflected by an external object (e.g., a finger or face of a user), and the reflected infrared rays may be incident into the light receiving module 90. Based on the purpose, the light emitting module 80 and the light receiving module 90 may be set to multiple. The camera module 100 captures an image of an external object. Based on the purpose and position of the camera module 100 installed in the electronic device ED, the camera module 100 may be set to multiple.

[0075] The display module DM includes a display panel DP, an input sensor FM-1, and a pressure sensor PS. The display panel DP should not be particularly limited and may be a light-emitting display panel such as an organic light-emitting display panel or a quantum dot light-emitting display panel.

[0076] The input sensor FM-1 obtains coordinate information of the external input. The input sensor FM-1 can sense various types of inputs provided from outside the electronic device ED. For example, the input sensor FM-1 can sense inputs caused by the user's body and can sense various types of external inputs such as light, heat, or pressure. In addition, the input sensor FM-1 can sense not only inputs in contact with the sensing surface, but also inputs occurring near the sensing surface.

[0077] The input sensor FM-1 may be an electrostatic capacitance type sensing panel or an electromagnetic induction type sensing panel. The sensing panel may include a base layer, sensor electrodes, and signal lines connected to the sensor electrodes.

[0078] The pressure sensor PS senses the intensity of an external input (ie, pressure) and measures resistance, current, or capacitance that changes based on pressure applied thereto from the outside.

[0079] Figure 3A and Figure 3B is a cross-sectional view showing a display device DD according to an exemplary embodiment of the present disclosure. Figure 3A and Figure 3B Shown along Figure 1B The section line II' of FIG. 1 is a section taken along the section line II' of FIG. 1. In the following, the reference Figure 1A , Figure 1B and Figure 2 Detailed description of the same elements as those described.

[0080] Reference Figure 3A and Figure 3B The display device DD includes a display panel DP, an input sensor FM-1, an optical film FM-2, a window WM, a protection panel LM, and a pressure sensor PS. In an exemplary embodiment, the stacked structure from the protection panel LM to the optical film FM-2 may be defined as a display module DM.

[0081] like Figure 3A and Figure 3B As shown in , the window WM and the optical film FM-2 may be attached to each other by an adhesive layer OCA. The adhesive layer OCA may be a pressure-sensitive adhesive film, an optically transparent adhesive film, or an optically transparent resin.

[0082] The window WM includes a base substrate WM-BS and a frame pattern WM-BZ. The base substrate WM-BS includes a transparent substrate such as a glass substrate, however, the base substrate WM-BS should not be limited thereto or thereby. The base substrate WM-BS may include a plastic material. The base substrate WM-BS has a single-layer structure, however, it should not be limited thereto or thereby. The base substrate WM-BS may include a glass substrate or a plastic substrate and a polymer film attached to the glass substrate or the plastic substrate by an adhesive layer.

[0083] The frame pattern WM-BZ may be directly disposed on the rear surface of the base substrate WM-BS. The frame pattern WM-BZ may have a multilayer structure of a coloring layer and a black light blocking layer. The coloring layer and the black light blocking layer may be formed by a deposition process, a printing process, or a coating process.

[0084] The window WM according to an exemplary embodiment of the present disclosure may further include a functional coating layer disposed on the entire surface of the base substrate WM-BS. The functional coating layer may include an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer.

[0085] The window WM may include a flat area WM-FA and a curved area WM-CA. The curved area WM-CA may be an area curved from the flat area WM-FA. The curved area WM-CA may have a predetermined curvature. The curved area WM-CA may include a plurality of areas having different curvatures from each other.

[0086] The optical film FM-2 has a single-layer structure, however, the optical film FM-2 may have a multi-layer structure, and the multi-layer structure may include an adhesive layer. The optical film FM-2 may be attached to the upper surface of the input sensor FM-1 through the adhesive layer. The optical film FM-2 may include a polarizer and a retarder. The polarizer and the retarder may be a stretch type or a coating type.

[0087] Figure 3A The input sensor FM-1 shown in the figure can be directly disposed on the substrate surface provided by the display panel DP. In the present disclosure, the expression that the component "B" is directly disposed on the component "A" means that there is no intermediate element such as an adhesive layer or a pressure-sensitive adhesive layer between the component "B" and the component "A". The component "B" is formed on the substrate surface provided by the component "A" by a continuous process after the component "A" is formed.

[0088] like Figure 3B As shown in FIG. 1 , the input sensor FM- 1 may be bonded to the display panel DP after being separately manufactured. An adhesive layer OCA may be provided between the input sensor FM- 1 and the display panel DP. Figure 3A Compared to the "layer type" input sensor FM-1 shown in Figure 3B The “panel type” input sensor FM-1 shown in FIG. 1 may also include a base film.

[0089] like Figure 3A and Figure 3B As shown in , the protection panel LM is disposed on the rear surface of the display panel DP to support the display panel DP. The protection panel LM may have a multilayer structure. For example, the protection panel LM may include a shading member and an elastic member. The shading member may prevent or inhibit external light from entering the display panel DP through the rear surface of the display panel DP. The shading member may be a black polymer film, for example, a PET film.

[0090] The light shielding member may have a double-sided tape form further including adhesive layers provided on both sides thereof. Therefore, the light shielding member has a function of a tape that adheres the elastic member to the rear surface of the display panel DP.

[0091] The elastic member absorbs external impact to protect the display panel DP from external impact. The elastic member may include a foamed polymer, for example, a foamed polyurethane sheet. In addition, the protection panel LM may also include a metal plate having a higher rigidity than the reference. The protection panel LM may be a stainless steel plate. In an exemplary embodiment of the present disclosure, the protection panel LM may be omitted.

[0092] like Figure 3A and Figure 3B As shown in FIG. 1 , the pressure sensor PS may be disposed on the rear surface of the protection panel LM. The pressure sensor PS may be attached to the rear surface of the protection panel LM by an adhesive layer (not shown). The display panel DP, the input sensor FM-1, the optical film FM-2, and the protection panel LM may overlap the flat area WM-FA and the curved area WM-CA. Since the pressure sensor PS is only attached to the pressure sensing area PSA (refer to FIG. 1 ), the pressure sensor PS may be attached to the rear surface of the protection panel LM by an adhesive layer (not shown). Figure 1A and Figure 1B ) are sufficient to be overlapped, so the area of ​​the pressure sensor PS is smaller than the areas of the display panel DP, the input sensor FM-1, the optical film FM-2 and the protection panel LM.

[0093] Figure 4A is an exploded perspective view showing a display device DD according to an exemplary embodiment of the present disclosure. Figure 4B is a rear view showing a display device DD according to an exemplary embodiment of the present disclosure. Figure 4C is a cross-sectional view showing a display device DD according to an exemplary embodiment of the present disclosure. Figure 4A Not shown Figure 3A and Figure 3B The adhesive layer OCA. Figure 4C Shown along Figure 4A A sectional view taken along section line II-II'.

[0094] exist Figure 4A , the display panel DP, the input sensor FM-1, and the optical film FM-2 are shown in a flat state before being bonded to the window WM. According to an exemplary embodiment, the display panel DP may be, but is not limited to, an organic light-emitting display panel. When viewed in a plan view, the display panel DP includes a pixel area PXA in which pixels PX are disposed and a non-pixel area NPXA adjacent to the pixel area PXA. The pixels PX are not disposed in the non-pixel area NPXA, and peripheral structures such as signal lines and storage bodies are disposed in the non-pixel area NPXA. The pixel area PXA and the non-pixel area NPXA may be respectively connected to the display area DA (refer to Figure 1A and Figure 1B ) and non-display area NDA (refer to Figure 1A and Figure 1B However, the corresponding regions (e.g., shapes or areas) do not need to be exactly the same.

[0095] The pixel PX is disposed in the pixel area PXA. The pixel PX is disposed in plural and the pixels PX are respectively connected to signal lines. The pixel PX includes a first thin film transistor TR1, a second thin film transistor TR2, a capacitor CP, and a light emitting device ELD.

[0096] The first thin film transistor TR1 is connected to the gate line GL and the data line DL. The light emitting device ELD receives a power supply voltage provided through the power line PL. A pad (also called a "pad" or "pad") PDD connected to a signal line (e.g., the data line DL and the power line PL) is provided in the non-pixel area NPXA. The pad PDD may have an integral shape with the signal line, or may be provided on a layer different from the signal line and connected to the end of the signal line via a contact hole defined by an insulating layer.

[0097] The driving control module DCM includes a first circuit board FPCB connected to the display panel DP, a second circuit board MPCB connected to the first circuit board FPCB, a first driving chip D-IC mounted on the first circuit board FPCB, and a second driving chip M-IC mounted on the second circuit board MPCB. The first driving chip D-IC may provide a data signal and / or a gate signal to the display panel DP, and may provide a control signal. The second driving chip M-IC may include a timing controller that converts an image signal into a data signal.

[0098] Although not shown separately, a plurality of passive devices and a plurality of active devices may be mounted on the second circuit board MPCB. A driving chip controlling the input sensor FM-1 and the pressure sensor PS may be mounted on the second circuit board MPCB. The second circuit board MPCB may be a rigid circuit board or a flexible circuit board, and the first circuit board FPCB may be a flexible circuit board. Although not shown separately, the second circuit board MPCB may be electrically connected to the electronic module EM (refer to Figure 1B ) motherboard.

[0099] A circuit board may also be provided to connect the input sensor FM-1 to the second circuit board MPCB. The signal line of the input sensor FM-1 may be connected to the second circuit board MPCB through the first circuit board FPCB that connects the display panel DP to the signal line. When the first circuit board FPCB is bent, the second circuit board MPCB may be provided on the rear surface of the display module DM (i.e., the rear surface of the protection panel LM).

[0100] like Figure 4A and Figure 4BAs shown in FIG, the pressure sensor PS provided on the rear surface of the protection panel LM may be connected to the second circuit board MPCB through the third circuit board PCB-P. The pressure sensor PS and the second circuit board MPCB may be connected to each other via a connector.

[0101] like Figure 4C As shown in , in a state where the bracket BRK is coupled to the display module DM and / or the window WM, the pressure sensor PS is spaced apart from the upper surface BRK-US of the bracket BRK. The distance between the rear surface of the pressure sensor PS and the upper surface BRK-US of the bracket BRK may be in the range of tens of microns to hundreds of microns. The distance between the rear surface of the pressure sensor PS and the upper surface BRK-US of the bracket BRK may be in the range of about 50 μm to about 300 μm. The distance between the rear surface of the pressure sensor PS and the upper surface BRK-US of the bracket BRK may be about 100 μm and may have an error of + / - 10%.

[0102] Since the pressure sensor PS is spaced apart from the upper surface BRK-US of the bracket BRK, the defect of the bracket BRK pressing the pressure sensor PS does not occur during the assembly process. Therefore, the malfunction of the pressure sensor PS can be prevented or suppressed.

[0103] The pressure sensor PS may overlap the flat area WM-FA and the curved area WM-CA. The pressure sensor PS may replace the input key module of the electronic device ED. When the user presses the flat area WM-FA or the curved area WM-CA of the window WM, the electronic device ED may recognize the user's pressing operation as the user's input.

[0104] Figure 5A is a plan view showing a pressure sensor PS according to an exemplary embodiment of the present disclosure. Figure 5B is a cross-sectional view illustrating a pressure sensor PS according to an exemplary embodiment of the present disclosure. Figure 5C is a plan view showing a pressure sensor PS according to an exemplary embodiment of the present disclosure. Fig. 6A is a cross-sectional view illustrating a pressure sensor PS according to an exemplary embodiment of the present disclosure. Figure 6B and Figure 6C is a cross-sectional view showing pressure sensors PS-S, PS according to an exemplary embodiment of the present disclosure.

[0105] Reference Figure 5A and Figure 5BThe pressure sensor PS includes a first base layer SB1, a second base layer SB2 defining a gap GP together with the first base layer SB1, a first electrode TE and a second electrode RE disposed on an inner surface of the first base layer SB1 or an inner surface of the second base layer SB2, and a sensing layer PLM disposed between the first base layer SB1 and the second base layer SB2. The inner surface of the first base layer SB1 and the inner surface of the second base layer SB2 face each other. The pressure sensor PS may further include a sealing member SP to seal the gap GP. The sealing member SP may be an organic adhesive member or an inorganic adhesive member.

[0106] Each of the first and second base layers SB1 and SB2 may be a polymer film, for example, a polyimide film, a polyamide film, or a polyethylene terephthalate film (PET film). Each of the first and second base layers SB1 and SB2 may have a single layer structure of a polyethylene terephthalate film.

[0107] The first electrode TE and the second electrode RE may include a metal pattern or a transparent conductive oxide. In an exemplary embodiment, the first electrode TE and the second electrode RE are disposed on the upper surface of the first base layer SB1, however, they should not be limited thereto or thereby. In an exemplary embodiment, the first electrode TE and the second electrode RE may be formed by the same process and may include the same material. In an exemplary embodiment of the present disclosure, one of the first electrode TE and the second electrode RE may be disposed on the upper surface of the first base layer SB1, and the other of the first electrode TE and the second electrode RE may be disposed on the lower surface of the second base layer SB2.

[0108] Each of the first electrode TE and the second electrode RE may be divided into a plurality of portions. Each of the first electrode TE and the second electrode RE may include a line portion LP and a plurality of branch portions BP.

[0109] When viewed in a plan view, the line portion LP of each of the first electrode TE and the second electrode RE is disposed outside the pressure sensor PS. The line portion LP of the first electrode TE and the line portion LP of the second electrode RE may face each other in one direction. In an exemplary embodiment, the one direction is a second direction DR2. The branch portions BP of each of the first electrode TE and the second electrode RE extend from a corresponding line portion LP of the line portion LP. The branch portions BP of the first electrode TE and the branch portions BP of the second electrode RE are alternately arranged along a direction different from and intersecting the one direction. The ends of the line portions LP of each of the first electrode TE and the second electrode RE may be connected to a third circuit board PCB-P (refer to Figure 4B ).

[0110] The sensing layer PLM may include a quantum tunneling composite (QTC). The sensing layer PLM may include a base resin and conductive particles mixed with the base resin. The base resin may include a polymer, and the conductive particles may include titanium particles or nickel particles.

[0111] In a state where no external pressure is applied, the sensing layer PLM may be spaced apart from at least one of the first electrode TE and the second electrode RE. In an exemplary embodiment, the sensing layer PLM disposed on the lower surface of the second base layer SB2 and spaced apart from the first electrode TE and the second electrode RE is illustrated.

[0112] The pressure sensing area PSA corresponding to the pressure sensor PS may include a first sensing area CSA and a second sensing area BSA. The first sensing area CSA may be defined as an area in which the sensing layer PLM is disposed. The area of ​​the first sensing area CSA may be greater than that of the second sensing area BSA.

[0113] The second sensing area BSA may be defined as a region in which the sub-sensing layer PLS is disposed. The sub-sensing layer PLS may contact the first electrode TE and the second electrode RE. The sub-sensing layer PLS may include a conductive material or a quantum tunneling complex (QTC).

[0114] When pressure is applied from the outside, the sensing layer PLM contacts the first electrode TE and the second electrode RE. Therefore, the resistance value formed by the first electrode TE, the second electrode RE and the sensing layer PLM is changed (hereinafter, referred to as "measured resistance value"). The driving chip (or pressure sensing circuit) senses the change in the measured resistance value to determine whether pressure is applied.

[0115] Although no pressure is applied externally, the first electrode TE and the second electrode RE may be electrically connected to each other through the sub-sensing layer PLS. Therefore, the driving chip may sense the resistance value (hereinafter referred to as "initial resistance value") formed by the first electrode TE, the second electrode RE and the sub-sensing layer PLS. The driving chip senses the initial resistance value to determine whether the first electrode TE and the second electrode RE are damaged, that is, whether a disconnection occurs between the first electrode TE and the second electrode RE. Specifically, when the initial resistance value is measured to be within a predetermined range, the driving chip determines that no disconnection occurs, and when the initial resistance value is measured to be infinity or higher than a predetermined value, the driving chip determines that a disconnection occurs. The pressure sensor PS according to an exemplary embodiment of the present disclosure may not include a second sensing area BSA.

[0116] Figure 5C Shown with Figure 5A and Figure 5B The pressure sensor PS shown in FIG. is different from the pressure sensor PS shown in FIG. Figure 5CAs shown in FIG. 1 , the pressure sensor PS includes a first pressure sensing area PSA1, a second pressure sensing area PSA2, and a temperature compensation area PSA3 disposed between the first pressure sensing area PSA1 and the second pressure sensing area PSA2. The first pressure sensing area PSA1 and the second pressure sensing area PSA2 can be connected to Figure 5A and Figure 5B The pressure sensing area PSA shown in is substantially the same.

[0117] The first electrode TE and the second electrode RE are disposed in the temperature compensation area PSA3, however, the sensing layer PLM is not disposed in the temperature compensation area PSA3. The sub-sensing layer PLS may be disposed in the temperature compensation area PSA3.

[0118] Reference Figure 5A and Figure 5B The measured resistance value described is affected not only by the external pressure but also by the external temperature. Figure 5C Since the sensing layer PLM is not provided in the temperature compensation area PSA3, the measured resistance value affected only by the temperature can be calculated. By comparing the measured resistance values ​​calculated from the first pressure sensing area PSA1 and the second pressure sensing area PSA2 with the measured resistance value calculated from the temperature compensation area PSA3, the measured resistance value affected only by the external pressure can be accurately calculated.

[0119] With reference Figure 5A and Figure 5B The pressure sensor PS described is compared to Fig. 6A The pressure sensor PS shown in FIG. 1 may be supported by a support layer SPL. Although not shown separately, the pressure sensor PS shown in FIG. 1 may be supported by a support layer SPL. Figure 5C Compared with the pressure sensor PS shown in , the pressure sensor PS according to the exemplary embodiment of the present disclosure may further include a supporting layer SPL.

[0120] Young's modulus of support layer SPL is compared with Figure 5A and Figure 5B The Young's modulus of the pressure sensor PS described is larger. The support layer SPL may have a greater Young's modulus than the reference Figure 5A and Figure 5B The described pressure sensor PS has a more rigid nature. The Young's modulus of the support layer SPL may be greater than the Young's modulus of the first substrate layer SB1 or the second substrate layer SB2.

[0121] The support layer SPL may have a multi-layer structure. The support layer SPL may include a plurality of stacked prepreg layers. The prepreg layer may refer to a structure including a thermosetting resin layer and reinforcing fibers impregnated in the thermosetting resin layer. In addition, the support layer SPL may include a metal material and a synthetic resin.

[0122] The Young's modulus of the support layer SPL may be four times greater than that of the first base layer SB1. The first base layer SB1 of the PET film may have a Young's modulus of about 4 GPa, and the support layer SPL of the prepreg layer may have a Young's modulus of about 18 GPa to about 22 GPa.

[0123] The elongation (or stretching ratio) of the support layer SPL may be smaller than that of the first base layer SB1. The elongation of the support layer SPL of the prepreg layer may correspond to about 1 / 60 to about 1 / 34 of the elongation of the first base layer SB1 of the PET film.

[0124] The bending strength of the support layer SPL may be greater than that of the first base layer SB1. The bending strength of the support layer SPL of the prepreg layer may be three times greater than that of the first base layer SB1 of the PET film.

[0125] like Figure 6B As shown in , when external pressure OP is applied to the pressure sensor PS-S, the pressure sensor PS-S having a small Young's modulus may be bent together with the first substrate layer SB1 and the second substrate layer SB2. The sensing layer PLM may be applied with a force that is small relative to the applied pressure. This phenomenon may easily occur in a structure in which the upper surface of the bracket BRK is spaced apart from other components. In this case, the driving chip may calculate a pressure that is lower than the actual pressure applied to the sensing layer PLM. This calculation may cause an input error.

[0126] like Figure 6C As shown in , when external pressure OP is applied, the supporting layer SPL supports the pressure sensor PS to suppress bending of the pressure sensor PS. Therefore, a force corresponding to the applied pressure can be applied to the sensing layer PLM. When the supporting layer SPL supports the pressure sensor PS, a fine user input can be sensed.

[0127] Fig. 7A is an exploded perspective view illustrating an electronic device ED according to an exemplary embodiment of the present disclosure. Figure 7B , Figure 7C , Fig.7D , Fig. 7E , Figure 7F and Figure 7G are diagrams respectively showing the exemplary embodiments according to the present disclosure. Fig. 7A The cross-sectional view of the electronic device ED shown in FIG. 1 is taken along the section line III-III'. Figure 1A , Figure 1B , Figure 2 , Figure 3A , Figure 3B , Figure 4A , Figure 4B , Figure 4C, Figure 5A , Figure 5B , Figure 5C , Fig. 6A , Figure 6B and Figure 6C Detailed description of the elements described.

[0128] According to an exemplary embodiment, the electronic device ED may further include an adhesive tape AL overlapping the bending area WM-CA and combining the bracket BRK with the display module DM. The adhesive tape AL may be attached to Figure 4A The lower surface of the protection panel LM is shown in FIG.

[0129] The adhesive tape AL may combine the bracket BRK with the window WM. The adhesive tape AL may prevent or inhibit external moisture from penetrating into a gap between the bracket BRK and the display module DM.

[0130] The adhesive tape AL may be provided along the edge of the display module DM or the edge of the window WM. The adhesive tape AL may be provided in one main body, or may include a plurality of separate parts.

[0131] like Figure 7B As shown in , the pressure sensor PS is arranged to be closer to or closer to the center of the window WM than the tape AL. When viewed in a plan view, the pressure sensor PS is arranged inside the tape AL. The pressure sensor PS is arranged to be spaced apart from the tape AL. The pressure sensor PS does not overlap with the tape AL.

[0132] like Figure 7C As shown in , a recess GV may be defined in the bracket BRK to correspond to the pressure sensor PS. The recess GV may overlap the pressure sensor PS. When viewed in a plan view, the pressure sensor PS may be disposed inside the recess GV. In this case, the upper surface BRK-US of the bracket BRK may directly support the display module DM. The pressure sensor PS inserted into the recess GV may be spaced apart from the upper surface of the recess GV. In this case, the thickness of the tape AL may be less than the thickness of the pressure sensor PS.

[0133] like Fig.7D As shown in , the support layer SPL may overlap the flat area WM-FA and the curved area WM-CA of the window WM. Fig. 7E As shown in , the support layer SPL may overlap only the curved area WM-CA of the window WM. Figure 7F As shown in , the support layer SPL may overlap only the flat area WM-FA of the window WM. Figure 7G As shown in , the supporting layer SPL may be inserted into the recess GV.

[0134] Figure 8 is a perspective view illustrating an electronic device ED according to an exemplary embodiment of the present disclosure. Figure 8 A smartphone is shown as a representative example.

[0135] Reference Figure 8 , the electronic device ED may include a plurality of pressure sensing areas PSA-1, PSA-2, PSA-3, and PSA-4 spaced apart from each other. The pressure sensing area PSA-1 set at the first position may replace the volume key of a smart phone. The pressure sensing area PSA-2 set at the second position may replace the function key of a smart phone. The function key may be a key for executing a specific application. The pressure sensing area PSA-3 set at the third position may replace the power key of a smart phone. The pressure sensing area PSA-4 set at the fourth position may have the function of a main button of a smart phone.

[0136] The pressure sensor PS is disposed under the display module DM to correspond to each of the pressure sensing areas PSA-1, PSA-2, PSA-3, and PSA-4. Figure 5C The described dual-channel type pressure sensor PS may be disposed in the pressure sensing area PSA-1 disposed at the first position. Figure 5A and Figure 5B The described single channel type pressure sensor PS may be provided in the pressure sensing areas PSA-2, PSA-3, and PSA-4 provided at the second position, the third position, and the fourth position, respectively.

[0137] Fig.9A and Fig. 9B are diagrams respectively showing the exemplary embodiments according to the present disclosure. Figure 4A 0 is a cross-sectional view taken along section line II-II′ of the display device DD shown in FIG. Fig.9A and Fig. 9B Shown with Figure 4C The corresponding cross section.

[0138] The window WM includes a flat area WM-FA and a peripheral area WM-PA extending from the flat area WM-FA. The peripheral area WM-PA includes a first curved area WM-CA1 extending from the flat area WM-FA, a side area WM-SA extending from the first curved area WM-CA1, and a second curved area WM-CA2 extending from the side area WM-SA. According to an exemplary embodiment, the second curved area WM-CA2 may be omitted.

[0139] The display module DM overlaps the flat area WM-FA and the peripheral area WM-PA. The display module DM may overlap at least the first bending area WM-CA1 and the side area WM-SA. The display module DM may overlap the second bending area WM-CA2.

[0140] The pressure sensor PS is attached to the lower surface of the display module DM. Fig.9A As shown in FIG, the pressure sensor PS may be disposed to overlap the flat area WM-FA, the first bending area WM-CA1, and the side area WM-SA. Fig. 9B As shown in FIG, the pressure sensor PS may be disposed to overlap only the side area WM-SA.

[0141] In the exemplary embodiment, the electronic device ED to which the tape AL is attached is shown, however, the tape AL may be omitted. Fig. 7A ) can be defined in the bracket BRK, and the support layer SPL (refer to Fig. 6A ) can also be set under the pressure sensor PS.

[0142] According to the above, the pressure sensor can replace the input key module of the electronic device. When the user presses the flat surface or the curved surface of the window, the electronic device can recognize the user's operation as the user's input.

[0143] The pressure sensor is disposed to be spaced apart from the bracket, so that a defect that the bracket presses the pressure sensor during the assembly process can be prevented or suppressed. Therefore, a malfunction of the pressure sensor can be prevented or suppressed.

[0144] Because the support layer supports the pressure sensor, fine user input can be sensed. The support layer can prevent or inhibit bending of the entire pressure sensor spaced apart from the bracket.

[0145] Although exemplary embodiments of the present disclosure have been described, it is understood that the present disclosure should not be limited to these exemplary embodiments, but a person skilled in the art may make various changes and modifications within the spirit and scope of the present disclosure as claimed.

[0146] Accordingly, the disclosed subject matter should not be limited to any single embodiment described herein, and the scope of the inventive concept should be determined in accordance with the following claims.

[0147] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. An electronic device, comprising: windows, including flat and curved areas; a display module disposed on a lower surface of the window to overlap the flat area and the curved area; a pressure sensor disposed on a lower surface of the display module to overlap the flat area and the curved area; as well as a bracket disposed on a lower surface of the pressure sensor and coupled to at least one of the window and the display module, the pressure sensor being spaced apart from an upper surface of the bracket, Wherein, the lower surface of the window, the lower surface of the display module and the lower surface of the pressure sensor face the same direction. 2 . The electronic device according to claim 1 , further comprising an adhesive tape overlapping the bending area, the adhesive tape combining the bracket and the display module with each other.

3. The electronic device according to claim 2, wherein: The pressure sensor is disposed closer to the center of the window than the tape.

4. The electronic device according to claim 3, wherein: The pressure sensor overlaps at least a portion of the curved area, overlaps at least a portion of the flat area, and overlaps at least a portion of the display module, and is spaced apart from the tape in a plan view.

5. The electronic device according to claim 2, wherein: The display module comprises: Optical films; An input sensor, disposed below the optical film; A display panel disposed below the input sensor; and A protection panel is disposed under the display panel, and the adhesive tape is coupled to the protection panel.

6. The electronic device according to claim 1, wherein: A recess is defined in the bracket corresponding to the pressure sensor.

7. The electronic device according to claim 6, further comprising an adhesive tape overlapping the bending area, the adhesive tape combining the bracket and the display module with each other, wherein: The thickness of the adhesive tape is smaller than the thickness of the pressure sensor.

8. The electronic device according to claim 1, wherein: The pressure sensor comprises: a first substrate layer; a second base layer, defining a gap together with the first base layer; A first electrode is disposed on an inner surface of the first substrate layer or an inner surface of the second substrate layer; a second electrode disposed on the inner surface of the first substrate layer or the inner surface of the second substrate layer; and A sensing layer comprising a base resin and conductive particles mixed with the base resin, wherein the inner surface of the first base layer and the inner surface of the second base layer face each other.

9. The electronic device according to claim 1, wherein: The pressure sensor comprises: a first electrode disposed in each of a first pressure sensing region, a second pressure sensing region, and a temperature compensation region, the temperature compensation region being disposed between the first pressure sensing region and the second pressure sensing region; a second electrode disposed in each of the first pressure sensing region, the second pressure sensing region, and the temperature compensation region; and A sensing layer is provided in each of the first pressure sensing region and the second pressure sensing region to be spaced apart from at least one of the first electrode and the second electrode and is not provided in the temperature compensation region. 10 . The electronic device according to claim 9 , further comprising a sub-sensing layer disposed in each of the first pressure sensing region, the second pressure sensing region, and the temperature compensation region, the sub-sensing layer contacting the first electrode and the second electrode.

11. An electronic device, comprising: a window comprising a flat region and a peripheral region disposed outside the flat region; a display module disposed on a lower surface of the window to overlap the flat area and the peripheral area; a pressure sensor disposed on a lower surface of the display module to overlap at least the peripheral area; as well as Support layer, The pressure sensor comprises a first substrate layer and an electrode arranged on the first substrate layer. wherein the support layer is disposed on the lower surface of the first base layer and has a Young's modulus greater than that of the pressure sensor, and Wherein, the lower surface of the window, the lower surface of the display module and the lower surface of the pressure sensor face the same direction.

12. The electronic device according to claim 11, further comprising a bracket disposed on a lower surface of the display module and coupled to at least one of the window and the display module, in, The support layer is spaced apart from an upper surface of the bracket. 13 . The electronic device according to claim 12 , further comprising an adhesive tape overlapping the peripheral area, the adhesive tape combining the bracket and the display module with each other.

14. The electronic device according to claim 12, wherein: A recess is defined in the bracket corresponding to the support layer.

15. The electronic device according to claim 14, wherein: The supporting layer is inserted into the recess.

16. The electronic device according to claim 11, wherein: The peripheral region includes a curved region extending from the flat region and a side region extending from the curved region, and the pressure sensor is provided at least in the side region.

17. The electronic device according to claim 11, wherein: The pressure sensor comprises: a second base layer defining a gap together with the first base layer; and A sensing layer, including a quantum tunneling complex, Wherein, the electrode comprises: A first electrode is disposed on an inner surface of the first substrate layer or an inner surface of the second substrate layer; a second electrode disposed on the inner surface of the first substrate layer or the inner surface of the second substrate layer, and wherein the inner surface of the first base layer and the inner surface of the second base layer face each other.

18. The electronic device according to claim 17, wherein: The Young's modulus of the support layer is greater than the Young's modulus of the first base layer.

19. The electronic device according to claim 17, wherein: The first substrate layer includes a single polymer film.

20. The electronic device according to claim 17, wherein: The support layer includes a plurality of stacked prepreg layers.

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