A binding tape, a display panel and a manufacturing method thereof, and a display device

Abstract

The application provides a binding adhesive tape, a display panel and a manufacturing method thereof, and a display device, and relates to the technical field of display. The application aims at solving the problem of yield loss of a display module caused by a binding process of the display module. The binding adhesive tape comprises an adhesive base and conductive particles. A first surface of the adhesive base is provided with a plurality of first protruding structures arranged at intervals, and the conductive particles are distributed in each first protruding structure. The binding adhesive tape provided by the application is used for binding a display panel and a circuit board.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a bonding tape, a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Currently, in the manufacturing of display products, the panel structure is generally formed first, and then flexible circuit boards or flip-chip films are bonded to the edge areas of the panel structure to form a display module. However, in large-size display products, the bonding process of the display module requires bonding a large number of flexible circuit boards or flip-chip films, resulting in a lower bonding yield for the display module. Summary of the Invention

[0003] The purpose of this invention is to provide a bonding tape, a display panel, a method for manufacturing the same, and a display device, to solve the problem of module yield loss caused by the bonding process of display modules.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A first aspect of the present invention provides a bonding tape comprising an adhesive substrate and conductive particles; wherein a first surface of the adhesive substrate has a plurality of spaced-apart first protrusions, and the conductive particles are distributed in each of the first protrusions.

[0006] Optionally, the second surface of the adhesive substrate has a plurality of spaced-apart second protrusions, the second surface being opposite to the first surface, and the first protrusions being offset from the second protrusions in a direction perpendicular to the adhesive substrate.

[0007] Optionally, the bonding tape includes a first protective film located on a first surface of the adhesive substrate and a second protective film located on a second surface of the adhesive substrate;

[0008] The first protective film has a first protective groove on its surface facing the adhesive substrate, which corresponds to the first protrusion structure, and the first protrusion structure is filled in the corresponding first protective groove; the second protective film has a second protective groove on its surface facing the adhesive substrate, which corresponds to the second protrusion structure, and the second protrusion structure is filled in the corresponding second protective groove.

[0009] Optionally, alignment marks are provided on the adhesive substrate.

[0010] Based on the above-described adhesive tape technical solution, this embodiment of the invention also provides a display module, including the adhesive tape provided in the above embodiment, and further including a first component and a second component bonded by the adhesive tape; wherein...

[0011] The first component includes a bonding area, the bonding area is provided with a plurality of first bonding pins, and a first insulating portion is provided between adjacent first bonding pins. In a direction perpendicular to the first base of the first component, the height of the surface of the first bonding pin facing away from the first base relative to the first base is lower than the height of the surface of the first insulating portion facing away from the first base relative to the first base. Each first bonding pin and its adjacent first insulating portion together form a first groove structure.

[0012] The second component includes a plurality of second bonding pins, each of which corresponds to a first bonding pin, and a second insulating portion is provided between adjacent second bonding pins;

[0013] The first bonding pin and the second bonding pin are disposed opposite to each other, and the bonding tape is located between the first bonding pin and the second bonding pin. The first protrusion structure in the bonding tape corresponds one-to-one with the first bonding pin. The first protrusion structure fills the first groove structure formed by its corresponding first bonding pin. The first bonding pin is coupled to the corresponding second bonding pin through conductive particles located in the corresponding first protrusion structure.

[0014] Optionally, in a direction perpendicular to the second base of the second component, the height of the surface of the second bonding pin facing away from the second base relative to the second base is higher than the height of the surface of the second insulating portion facing away from the second base relative to the second base. A second groove structure is formed between adjacent second bonding pins and the second insulating portion located between the adjacent second bonding pins. The second groove structure corresponds one-to-one with the second protrusion structure on the bonding tape, and the second protrusion structure fills the corresponding second groove structure.

[0015] Optionally, the first component includes a display panel, and the second component includes a circuit board.

[0016] The optional second component includes a display panel, and the first component includes a circuit board.

[0017] Based on the above-described display module technical solution, a third aspect of the present invention also provides a display device including the above-described display module.

[0018] Based on the above-described technical solution for the display module, a fourth aspect of the present invention also provides a method for manufacturing a display module, used to manufacture the display module provided in the above embodiments, the method comprising:

[0019] A first component, a bonding tape, and a second component are provided. The first component includes a bonding area with multiple first bonding pins. A first insulating portion is provided between adjacent first bonding pins. In a direction perpendicular to a first base of the first component, the height of the surface of the first bonding pin facing away from the first base relative to the first base is lower than the height of the surface of the first insulating portion facing away from the first base relative to the first base. Each first bonding pin and its adjacent first insulating portion together form a first groove structure. The second component includes multiple second bonding pins, each corresponding to one of the first bonding pins. A second insulating portion is provided between adjacent second bonding pins. The bonding tape includes an adhesive base and conductive particles. The first surface of the adhesive base has multiple spaced-apart first protrusions, and the conductive particles are distributed in each of the first protrusions.

[0020] The bonding tape is applied to the bonding area of ​​the first component in the display module, so that the first protrusions in the bonding tape are filled into the first grooves one by one.

[0021] The second component is bonded to the first component by the bonding tape, the first bonding pin and the second bonding pin are arranged opposite to each other, the bonding tape is located between the first bonding pin and the second bonding pin, and the first bonding pin is coupled to the corresponding second bonding pin through conductive particles located in the corresponding first protrusion structure.

[0022] In the technical solution provided by this invention, a first protruding structure is formed on the adhesive substrate, and conductive particles are distributed in the first protruding structure. When bonding the display panel and the circuit board using the bonding tape, a groove structure matching the first protruding structure can be set on the display panel (or circuit board). The bottom of the groove structure is the bonding pin on the display panel (or circuit board). In this way, the first protruding structure with conductive particles distributed during bonding can be confined in the groove structure. When the bonding pin on the display panel and the bonding pin on the circuit board are bonded together by the conductive particles in the first protruding structure, the conductive particles can be confined between the corresponding bonding pins. This not only ensures the conductivity between the pins to be bonded together, but also avoids short circuits between adjacent pins, thereby ensuring a good bonding yield between the display panel and the circuit board. Therefore, when the technical solution provided by this invention is applied to the bonding process of display modules, it can effectively solve the problem of module yield loss caused by the bonding process.

[0023] Furthermore, when bonding the display panel and circuit board using the technical solution provided by this invention, the conductive particles in the bonding tape are evenly distributed between each of the first and second bonding pins, thereby effectively reducing the bonding resistance between the display panel and the circuit board and reducing the power consumption of the display module formed after bonding. Moreover, because the conductive particles in the bonding tape are evenly distributed, the bonding resistance between the display panel and the circuit board is more uniform, thus effectively improving the screen uniformity of the display panel and addressing the problem of poor display quality. Attached Figure Description

[0024] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0025] Figure 1 This is a schematic diagram of the structure of the bonding tape provided in an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of the structure of the first protective film provided in an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the structure of the second protective film provided in an embodiment of the present invention;

[0028] Figure 4 This is a first schematic diagram of a bonding tape with a protective film attached, provided in an embodiment of the present invention;

[0029] Figure 5 This is a second schematic diagram showing the bonding tape with a protective film attached, provided in an embodiment of the present invention.

[0030] Figure 6 A schematic diagram of the structure of the first component provided in an embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of the second component provided in an embodiment of the present invention;

[0032] Figure 8 This is a schematic diagram of the bonding tape used to bond the first component and the second component according to an embodiment of the present invention. Detailed Implementation

[0033] To further illustrate the bonding tape, display panel, manufacturing method, and display device provided in the embodiments of the present invention, a detailed description is provided below with reference to the accompanying drawings.

[0034] Please see Figure 1This invention provides a bonding tape, including an adhesive substrate 10 and conductive particles 11; wherein, the first surface of the adhesive substrate 10 has a plurality of spaced-apart first protrusions 101, and the conductive particles 11 are distributed in each of the first protrusions 101.

[0035] Specifically, the bonding tape is an anisotropic conductive adhesive (ACF adhesive), and the material of the adhesive substrate 10 includes an adhesive, for example, a resin adhesive. The adhesive substrate 10 can be formed into a sheet-like structure with a certain thickness. The adhesive substrate 10 includes a first surface and a second surface disposed opposite to each other. A plurality of first protrusions 101 are provided on the first surface of the adhesive substrate 10, and the plurality of first protrusions 101 are spaced apart.

[0036] The conductive particles 11 can be of various types, including, for example, metal powder or polymer plastic balls coated with metal; the metal powder may include nickel (Ni), gold (Au), nickel plated with gold, silver and tin alloys, etc.

[0037] For example, when manufacturing the bonding tape, an adhesive substrate 10 with a first raised structure 101 on the first surface can be formed firstly using a specific mold, and then conductive particles 11 can be uniformly printed in the plurality of first raised structures 101 using an inkjet printing process. It is worth noting that one or more conductive particles 11 can be printed in each raised structure.

[0038] It needs to be explained that, Figure 1 In each of the first protruding structures, only one conductive particle 11 is drawn as an example, but the actual number of conductive particles 11 in each first protruding structure can be set to multiple.

[0039] When the aforementioned bonding tape is applied to the bonding process of a display panel, the circuit board (which may specifically include: flexible printed circuit board (FPC) or chip-on-film (COF)) can be bonded to the bonding pins located in the bonding area of ​​the display panel using the bonding tape.

[0040] More specifically, since the first surface of the adhesive substrate 10 in the aforementioned bonding tape is provided with a first protrusion structure 101, and conductive particles 11 are distributed in each of the first protrusion structures 101, the structure of the bonding surface of the display panel or the circuit board can be improved simultaneously when the display panel is bonded to the circuit board using this bonding tape. For example, grooves corresponding to the first protrusion structures 101 are provided on the display panel or the circuit board, and corresponding bonding pins are provided in the grooves. During bonding, the first protrusion structures 101 on the bonding tape can fill the corresponding grooves, and the conductive particles 11 distributed in the first protrusion structures 101 make good contact with the bonding pins in the grooves. In this way, the bonding pins on the display panel and the bonding pins on the circuit board can be bonded together one-to-one through the conductive particles 11 in the first protrusion structures 101. After bonding, the bonding yield between the bonding pins on the display panel and the bonding pins on the circuit board can be guaranteed.

[0041] For example, such as Figures 6-8 As shown, one of the display panel and the circuit board is designated as a first component 2, and the other of the display panel and the circuit board is designated as a second component 3. The first component 2 may be configured to include a bonding area, which is provided with a plurality of first bonding pins 20. A first insulating portion 21 is provided between adjacent first bonding pins 20. In a direction perpendicular to the first base of the first component 2, the height of the surface of the first bonding pin 20 facing away from the first base relative to the first base is lower than the height of the surface of the first insulating portion 21 facing away from the first base relative to the first base. Each first bonding pin 20 and its adjacent first insulating portion 21 together form a first groove structure 22. The second component 3 includes a plurality of second bonding pins 30, which correspond one-to-one with the first bonding pins 20. A second insulating portion 31 is provided between adjacent second bonding pins 30.

[0042] When the first component 2 and the second component 3 are bonded using the bonding tape, the first bonding pin 20 and the second bonding pin 30 are positioned opposite each other, and the bonding tape is located between the first bonding pin 20 and the second bonding pin 30. The first protrusion structure 101 in the bonding tape corresponds one-to-one with the first bonding pin 20. The first protrusion structure 101 fills the first groove structure 22 formed by its corresponding first bonding pin 20. The first bonding pin 20 is coupled to the corresponding second bonding pin 30 through the conductive particles 11 located in the corresponding first protrusion structure 101.

[0043] According to the specific structure and actual application of the bonding tape described above, in the bonding tape provided by the embodiments of the present invention, a first protrusion structure 101 is formed on the adhesive substrate 10, and conductive particles 11 are distributed in the first protrusion structure 101. When using the bonding tape to bond the display panel and the circuit board, a groove structure matching the first protrusion structure 101 can be provided on the display panel (or circuit board). The bottom of the groove structure is the bonding pin on the display panel (or circuit board). In this way, the first protrusion structure 101 with conductive particles 11 distributed therein can be confined in the groove structure during bonding. When the bonding pin on the display panel and the bonding pin on the circuit board are bonded together by the conductive particles 11 in the first protrusion structure 101, the conductive particles 11 can be confined between the corresponding bonding pins. This not only ensures the conductivity between the pins to be bonded together, but also avoids short circuits between adjacent pins, thereby ensuring the bonding yield between the display panel and the circuit board. Therefore, when the bonding tape provided by the embodiments of the present invention is applied to the bonding process of the display module, the problem of module yield loss caused by the bonding process can be effectively solved.

[0044] Furthermore, when using the bonding tape provided in this embodiment of the invention to bond the display panel and the circuit board, the conductive particles 11 in the bonding tape are evenly distributed between each of the first bonding pins 20 and the second bonding pins 30, thereby effectively reducing the bonding resistance between the display panel and the circuit board and reducing the power consumption of the display module formed after bonding. Moreover, because the conductive particles in the bonding tape are evenly distributed, the bonding resistance between the display panel and the circuit board is more uniform, thereby effectively improving the screen uniformity of the display panel and the problem of poor display quality.

[0045] like Figure 5 As shown, in some embodiments, the second surface of the adhesive substrate 10 may be configured as a flat surface, that is, the second surface of the adhesive substrate 10 does not include protruding structures.

[0046] like Figure 1 As shown, in some embodiments, the second surface of the adhesive substrate 10 has a plurality of spaced second protrusions 102, the second surface being opposite to the first surface, and the first protrusions 101 and the second protrusions 102 being offset in a direction perpendicular to the adhesive substrate 10.

[0047] Specifically, a plurality of second protrusion structures 102 are provided on the second surface of the adhesive substrate 10, and the plurality of second protrusion structures 102 are spaced apart. It is worth noting that the first protrusion structure 101 and the second protrusion structure 102 are both integrally formed with the adhesive substrate 10.

[0048] When using the aforementioned bonding tape to bond the circuit board to the bonding area of ​​the display panel, if a first groove structure 22 corresponding to the first protrusion structure 101 is provided on one of the display panel and the circuit board, a second groove structure 32 corresponding to the second protrusion structure 102 can be provided on the other of the display panel and the circuit board at the same time. There is a protruding portion between adjacent second groove structures 32, and the protruding portion can be set as a bonding pin on the other of the display panel and the circuit board.

[0049] When the bonding tape is used to bond the display panel and the circuit board, the second protrusion 102 on the bonding tape can fill the corresponding second groove. The bonding pins next to the second groove can be coupled to the bonding pins in the first groove through the conductive particles 11 in the first protrusion 101 on the bonding tape. This achieves one-to-one bonding between the bonding pins on the display panel and the bonding pins on the circuit board through the conductive particles 11 in the first protrusion 101. After bonding, the bonding yield between the bonding pins on the display panel and the bonding pins on the circuit board can be guaranteed.

[0050] For example, such as Figures 6-8 As shown, one of the display panel and the circuit board is designated as the first component 2, and the other of the display panel and the circuit board is designated as the second component 3. The components can be arranged in a direction perpendicular to the second base of the second component 3. The height of the surface of the second bonding pin 30 facing away from the second base relative to the second base is higher than the height of the surface of the second insulating part 31 facing away from the second base relative to the second base. A second groove structure 32 is formed between adjacent second bonding pins 30 and the second insulating part 31 located between the adjacent second bonding pins 30. The second groove structure 32 corresponds one-to-one with the second protrusion structure 102 on the bonding tape. The second protrusion structure 102 fills the corresponding second groove structure 32.

[0051] When the first component 2 and the second component 3 are bonded using the bonding tape, the first bonding pin 20 and the second bonding pin 30 are positioned opposite each other, and the bonding tape is located between the first bonding pin 20 and the second bonding pin 30. The first protrusion structure 101 in the bonding tape corresponds one-to-one with the first bonding pin 20, and the first protrusion structure 101 fills the first groove structure 22 formed by its corresponding first bonding pin 20. Similarly, the second protrusion structure 102 in the bonding tape is filled one-to-one with the second groove structure 32. The first bonding pin 20 is coupled to the corresponding second bonding pin 30 through the conductive particles 11 located in the corresponding first protrusion structure 101.

[0052] In the bonding tape provided in the above embodiments, a first protrusion structure 101 and a second protrusion structure 102 are formed on the adhesive substrate 10, and conductive particles 11 are distributed in the first protrusion structure 101. When using this bonding tape to bond the display panel and the circuit board, a first groove structure 22 matching the first protrusion structure 101 can be provided on the display panel (or circuit board). The bottom of the groove structure 22 is the bonding pin on the display panel (or circuit board), and a second groove structure 32 matching the second protrusion structure 102 is provided on the circuit board (or display panel). The protruding portion next to the second groove structure 32 is the bonding pin on the circuit board (or display panel), thus distributing the bonding particles during bonding. The first protrusion structure 101 with conductive particles 11 can be confined in the first groove structure 22, and the second protrusion structure 102 can be confined in the second groove structure 32, so that the bonding pins on the display panel are aligned with the bonding pins on the circuit board. In this way, after bonding, the conductive particles 11 can be confined between the corresponding bonding pins, which not only ensures the conductivity between the pins to be bonded together, but also avoids short circuits between adjacent pins, thereby ensuring the bonding yield between the display panel and the circuit board. Therefore, when the bonding tape provided in this embodiment of the invention is applied to the bonding process of the display module, it can effectively solve the problem of module yield loss caused by the bonding process.

[0053] like Figures 2-4 As shown, in some embodiments, the bonding tape includes a first protective film 12 located on a first surface of the adhesive substrate 10 and a second protective film 13 located on a second surface of the adhesive substrate 10; the first protective film 12 has a first protective groove 120 corresponding to the first protrusion 101 on the surface facing the adhesive substrate 10, and the first protrusion 101 is filled in the corresponding first protective groove 120; the second protective film 13 has a second protective groove 130 corresponding to the second protrusion 102 on the surface facing the adhesive substrate 10, and the second protrusion 102 is filled in the corresponding second protective groove 130.

[0054] Specifically, the first and second surfaces of the bonding tape may be provided with protective films, which are used to protect the first and second surfaces of the bonding tape when the bonding tape is not in use, and the protective films can be removed when the bonding tape is in use.

[0055] The specific structures of the first protective film 12 and the second protective film 13 vary. For example, the first protective film 12 has a first protective groove 120 corresponding to the first protruding structure 101 on the surface facing the adhesive substrate 10, and the second protective film 13 has a second protective groove 130 corresponding to the second protruding structure 102 on the surface facing the adhesive substrate 10. When the first protective film 12 is attached to the first surface of the bonding tape, the first protruding structure 101 on the first surface can fill the corresponding first protective groove 120, so that the first protective film 12 is completely attached to the first surface. When the second protective film 13 is attached to the second surface of the bonding tape, the second protruding structure 102 on the second surface can fill the corresponding second protective groove 130, so that the second protective film 13 is completely attached to the second surface.

[0056] It should be noted that the specific structures of the first protective film 12 and the second protective film 13 can be set according to actual needs, as long as they can completely adhere to the first and second surfaces. For example, such as Figure 5 As shown, when the second surface is a plane without the second protrusion structure 102, the second protective film 13 can also be a planar structure without the second protective groove 130.

[0057] like Figure 1 As shown, in some embodiments, alignment marks 14 are provided on the adhesive substrate 10.

[0058] Specifically, since the first protrusion 101 formed on the bonding tape needs to be filled into the first groove structure 22, and the second protrusion 102 needs to be filled into the second groove structure 32, an alignment operation is required when bonding the display panel and the circuit board using the bonding tape. The alignment mark 14 is set on the adhesive substrate 10 so that during the bonding process, the first protrusion 101 and the second protrusion 102 included in the bonding tape can be filled into the corresponding groove structure, thereby better ensuring the bonding effect.

[0059] For example, the alignment mark 14 may be a cross-shaped mark or a T-shaped mark, but is not limited to these.

[0060] like Figures 6-8As shown, this embodiment of the invention also provides a display module, including the bonding tape provided in the above embodiment, and further including a first component 2 and a second component 3 bonded by the bonding tape; wherein, the first component 2 includes a bonding area, the bonding area is provided with a plurality of first bonding pins 20, and a first insulating portion 21 is provided between adjacent first bonding pins 20. In a direction perpendicular to a first base of the first component 2, the height of the surface of the first bonding pin 20 facing away from the first base relative to the first base is lower than the height of the surface of the first insulating portion 21 facing away from the first base relative to the first base. Each first bonding pin 20 and its adjacent first insulating portion 21 together form a first groove structure 22. The second component 3 includes a plurality of second bonding pins 30, each of which corresponds to a first bonding pin 20. A second insulating portion 31 is provided between adjacent second bonding pins 30. The first bonding pin 20 and the second bonding pin 30 are arranged opposite to each other. The bonding tape is located between the first bonding pin 20 and the second bonding pin 30. The first protrusion structure 101 in the bonding tape corresponds to a first bonding pin 20. The first protrusion structure 101 fills the first groove structure 22 formed by its corresponding first bonding pin 20. The first bonding pin 20 is coupled to the corresponding second bonding pin 30 through conductive particles 11 located in the corresponding first protrusion structure 101.

[0061] Specifically, the plurality of first bonding pins 20 in the first component 2 may be gold finger structures, but are not limited thereto. For example, the plurality of first bonding pins 20 may be arranged in an array, with the plurality of first bonding pins 20 spaced apart, and a first insulating portion 21 provided between adjacent first bonding pins 20.

[0062] The specific material of the first insulating part 21 can be set according to actual needs. For example, the first insulating part 21 is made of organic insulating material and / or inorganic insulating material. When the first component 2 includes a display panel, the first insulating part 21 can be formed in the same process as the organic insulating layer and / or inorganic insulating layer in the display panel.

[0063] The above-described arrangement, in a direction perpendicular to the first substrate of the first component 2, ensures that the height of the surface of the first bonding pin 20 facing away from the first substrate relative to the first substrate is lower than the height of the surface of the first insulating portion 21 facing away from the first substrate relative to the first substrate. This results in each first bonding pin 20 and its adjacent first insulating portion 21 forming a first groove structure 22, with the first bonding pin 20 serving as the bottom of the formed first groove structure 22. This arrangement causes the first bonding pin 20 in the first component 2 to form a concave bonding gold finger structure.

[0064] It is worth noting that when the first component 2 includes a display panel, the first bonding pin 20 can be disposed on the same layer and with the same material as a portion of the conductive structure in the display panel, so that the first bonding pin 20 can be formed in the same patterning process as the portion of the conductive structure in the display panel. For example, the display panel includes a first source / drain metal layer, which adopts a Ti / Al / Ti metal stack structure, and the first bonding pin 20 is disposed on the same layer and with the same material as the first source / drain metal layer.

[0065] The display panel also includes an anode layer, which adopts an ITO / Ag / ITO stacked structure. Since the anode layer is located on the side of the first source / drain metal layer facing away from the first substrate, when the anode layer is formed by etching with an etchant, if the side of the first bonding pin 20 is exposed, the etchant will react with the Al in the first bonding pin 20 on the side of the first bonding pin 20, causing the metal Ag to be deposited. The deposited Ag can easily enter the display area of ​​the display panel, resulting in poor display of dark spots when the display panel is displayed.

[0066] In the display panel provided in the above embodiment, since the first bonding pin 20 is formed as a bonding gold finger with a concave structure, the side of the first bonding pin 20 is covered by the first insulating part 21, which avoids the etching solution reacting with Al on the side of the first bonding pin 20 during the wet etching process of the anode layer, thereby avoiding display dark spots in the display panel and effectively improving the display yield of the display module.

[0067] The plurality of second bonding pins 30 in the second component 3 may be gold finger structures, but are not limited thereto. For example, the plurality of second bonding pins 30 may be arranged in an array, with the plurality of second bonding pins 30 spaced apart, and a second insulating portion 31 provided between adjacent second bonding pins 30, and the second bonding pins 30 corresponding one-to-one with the first bonding pins 20.

[0068] The specific material of the second insulating part 31 can be set according to actual needs. For example, the first insulating part 21 is made of organic insulating material and / or inorganic insulating material. For example, the remaining surfaces of the second component 3, except for the location of the second bonding pin 30, can be covered with organic insulating material.

[0069] After the first component 2 and the second component 3 are bonded together by the bonding tape, the first bonding pin 20 and the second bonding pin 30 are positioned opposite each other, and the bonding tape is located between the first bonding pin 20 and the second bonding pin 30. The first protrusion structure 101 in the bonding tape corresponds one-to-one with the first bonding pin 20. The first protrusion structure 101 fills the first groove structure 22 formed by its corresponding first bonding pin 20. The first bonding pin 20 is coupled to the corresponding second bonding pin 30 through the conductive particles 11 located in the corresponding first protrusion structure 101.

[0070] like Figure 6 and Figure 8 As shown, along the first direction, before bonding with the bonding tape, the width of each of the first protrusions 101 is slightly smaller than the width of the first bonding pin 20. Similarly, along the first direction, the width of each of the second protrusions 102 is slightly larger than the width of the first insulating portion 21. The width of the first protrusion 101 needs to satisfy the bonding process tolerance to ensure that the first protrusion 101 can fill the first groove structure 22.

[0071] The display module provided in this embodiment of the invention includes the first component 2 and the second component 3, which are bound together using the aforementioned bonding tape. When using the bonding tape to bond the first component 2 and the second component 3 in the above embodiments, a first groove structure 22 matching the first protrusion structure 101 can be provided on the first component 2. The bottom of the groove structure 22 is the first bonding pin 20. In this way, the first protrusion structure 101 with conductive particles 11 distributed thereon can be confined in the first groove structure 22 during bonding. When the first bonding pin 20 on the first component 2 and the second bonding pin 30 on the second bonding component are bonded together by the conductive particles 11 in the first protrusion structure 101, the conductive particles 11 can be confined between the corresponding bonding pins, avoiding the sliding of the conductive particles 11 during the bonding process. This not only ensures the conductivity between the pins to be bonded together, but also avoids short circuits between adjacent pins, thereby ensuring the bonding yield between the display panel and the circuit board. Therefore, the display module provided by the embodiments of the present invention can effectively solve the problem of module yield loss caused by the bonding process, even for medium and large-sized display modules, and reduce the production cost of the display module.

[0072] Furthermore, in the display module provided by this embodiment, the conductive particles 11 in the bonding tape are evenly distributed between each of the first bonding pins 20 and the second bonding pins 30, thereby effectively reducing the bonding resistance between the first component 2 and the second component 3 and reducing the power consumption of the display module. Moreover, because the conductive particles in the bonding tape are evenly distributed, the bonding resistance between the display panel and the circuit board is more uniform, thus effectively improving the screen uniformity of the display panel and addressing the problem of poor display quality.

[0073] In some embodiments, in a direction perpendicular to the second base of the second component 3, the height of the surface of the second bonding pin 30 facing away from the second base relative to the second base is higher than the height of the surface of the second insulating portion 31 facing away from the second base relative to the second base. A second groove structure 32 is formed between adjacent second bonding pins 30 and the second insulating portion 31 located between the adjacent second bonding pins 30. The second groove structure 32 corresponds one-to-one with the second protrusion structure 102 on the bonding tape, and the second protrusion structure 102 fills the corresponding second groove structure 32.

[0074] Specifically, in the direction perpendicular to the second base of the second component 3, the height of the surface of the second bonding pin 30 facing away from the second base relative to the second base is higher than the height of the surface of the second insulating portion 31 facing away from the second base relative to the second base, so that the second bonding pin 30 protrudes from the second insulating portion 31, and the second bonding pin 30 is formed as an outwardly protruding bonding gold finger structure.

[0075] like Figure 7 and Figure 8 As shown, along the first direction, before bonding with the bonding tape, the width of each of the second protrusion structures 102 is slightly smaller than the width of the second insulating portion 31, and similarly, the width of each of the second bonding pins 30 is slightly larger than the width of the first protrusion structure 101. The width of the second protrusion structure 102 needs to satisfy the bonding process tolerance to ensure that the second protrusion structure 102 can fill the second groove structure 32.

[0076] In the display module provided in the above embodiment, when the first component 2 and the second component 3 are bonded using the bonding tape, a first groove structure 22 matching the first protrusion structure 101 can be provided on the first component 2. The bottom of the groove structure 22 is the first bonding pin 20 on the first component 2, and a second groove structure 32 matching the second protrusion structure 102 is provided on the second component 3. The protruding part next to the second groove structure 32 is the second bonding pin 30 on the second component 3. In this way, the first protrusion structure 101 with conductive particles 11 distributed during bonding can be confined in the first groove structure 22, and the second protrusion structure 102 can be confined in the second groove structure 32, so that the first bonding pin 20 on the first component 2 and the second bonding pin 30 on the second component 3 are directly opposite each other. After bonding, the conductive particles 11 can be confined between the corresponding bonding pins, which not only ensures the conductivity between the bonding pins to be bonded together, but also avoids short circuits between adjacent pins, thereby ensuring the bonding yield between the display panel and the circuit board and reducing production costs.

[0077] In addition, in the display module provided in the above embodiments, by setting the first bonding pin 20 in the first component 2 to be a concave bonding gold finger and the second bonding pin 30 to be a convex bonding gold finger structure, the good bonding effect between the first component 2 and the second component 3 is better guaranteed, so that the bonded first component 2 and the second component 3 have good conductivity.

[0078] In some embodiments, the second bonding pin 30 may be configured to be flush with the second insulating portion 31, so that the second bonding pin 30 is formed as a flush bonding gold finger structure.

[0079] In some embodiments, the first component 2 may include a display panel, and the second component 3 may include a circuit board.

[0080] In some embodiments, the second component 3 may include a display panel, and the first component 2 may include a circuit board.

[0081] This invention also provides a display device, including the display module provided in the above embodiments.

[0082] The display module provided in the above embodiments includes the first component 2 and the second component 3, which are bound together using the aforementioned adhesive tape. When using the bonding tape in the above embodiments to bond the first component 2 and the second component 3, a first groove structure 22 matching the first protrusion structure 101 can be provided on the first component 2. The bottom of the groove structure 22 is the first bonding pin 20. In this way, the first protrusion structure 101 with conductive particles 11 distributed thereon can be confined in the first groove structure 22 during bonding. When the first bonding pin 20 on the first component 2 and the second bonding pin 30 on the second bonding component are bonded together by the conductive particles 11 in the first protrusion structure 101, the conductive particles 11 can be confined between the corresponding bonding pins, avoiding the sliding of the conductive particles 11 during the bonding process. This not only ensures the conductivity between the pins to be bonded together, but also avoids short circuits between adjacent pins, thereby ensuring the bonding yield between the display panel and the circuit board. Therefore, even if the display module provided in the above embodiments is a medium or large-sized display module, it can effectively solve the problem of module yield loss caused by the bonding process and reduce the production cost of the display module.

[0083] Furthermore, in the display module provided in the above embodiments, the conductive particles 11 in the bonding tape are evenly distributed between each of the first bonding pins 20 and the second bonding pins 30, thereby effectively reducing the bonding resistance between the first component 2 and the second component 3 and reducing the power consumption of the display module. Moreover, because the conductive particles in the bonding tape are evenly distributed, the bonding resistance between the display panel and the circuit board is more uniform, thus effectively improving the screen uniformity of the display panel and addressing the problem of poor display quality.

[0084] Therefore, the display device provided in the embodiments of the present invention, when including the display module provided in the above embodiments, also has the above-mentioned beneficial effects, which will not be repeated here.

[0085] It should be noted that the display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer.

[0086] This invention also provides a method for manufacturing a display module, used to manufacture the display module provided in the above embodiments, the method comprising:

[0087] A first component 2, a bonding tape, and a second component 3 are provided. The first component 2 includes a bonding area with multiple first bonding pins 20. A first insulating portion 21 is provided between adjacent first bonding pins 20. In a direction perpendicular to a first base of the first component 2, the height of the surface of the first bonding pin 20 facing away from the first base relative to the first base is lower than the height of the surface of the first insulating portion 21 facing away from the first base relative to the first base. Each first bonding pin 20 and its adjacent first insulating portion 21 together form a first groove structure 22. The second component 3 includes multiple second bonding pins 30, each corresponding to one of the first bonding pins 20. A second insulating portion 31 is provided between adjacent second bonding pins 30. The bonding tape includes an adhesive base 10 and conductive particles 11. The first surface of the adhesive base 10 has multiple spaced-apart first protrusions 101, and the conductive particles 11 are distributed in each of the first protrusions 101.

[0088] The bonding tape is applied to the bonding area of ​​the first component 2 in the display module, so that the first protrusion structure 101 in the bonding tape is filled into the first groove structure 22 in a one-to-one correspondence.

[0089] The second component 3 is bound to the first component 2 by the binding tape. The first binding pin 20 and the second binding pin 30 are arranged opposite to each other. The binding tape is located between the first binding pin 20 and the second binding pin 30. The first binding pin 20 is coupled to the corresponding second binding pin 30 through the conductive particles 11 located in the corresponding first protrusion structure 101.

[0090] Specifically, a first protective film 12 may be attached to the first surface of the bonding tape, and a second protective film 13 may be attached to the second surface of the bonding tape. When using the bonding tape to bond the first component 2 and the second component 3, the first protective film 12 can be removed first, and then the first surface of the bonding tape can be attached to the bonding area of ​​the first component 2, so that the first protrusions 101 in the bonding tape are filled one-to-one in the first groove structure 22. Then, the second protective film 13 is removed, and then the second component 3 is attached to the second surface of the bonding tape. After the bonding process, the second component 3 is bonded to the first component 2 by the bonding tape. The first bonding pin 20 and the second bonding pin 30 are arranged opposite to each other, and the bonding tape is located between the first bonding pin 20 and the second bonding pin 30. The first bonding pin 20 is coupled to the corresponding second bonding pin 30 through the conductive particles 11 located in the corresponding first protrusions 101.

[0091] The display module manufactured using the manufacturing method provided in the embodiments of the present invention includes the first component 2 and the second component 3, which are bound together using the aforementioned bonding tape. When using the bonding tape to bond the first component 2 and the second component 3 in the above embodiments, a first groove structure 22 matching the first protrusion structure 101 can be provided on the first component 2. The bottom of the groove structure 22 is the first bonding pin 20. In this way, the first protrusion structure 101 with conductive particles 11 distributed thereon can be confined in the first groove structure 22 during bonding. When the first bonding pin 20 on the first component 2 and the second bonding pin 30 on the second bonding component are bonded together by the conductive particles 11 in the first protrusion structure 101, the conductive particles 11 can be confined between the corresponding bonding pins, avoiding the sliding of the conductive particles 11 during the bonding process. This not only ensures the conductivity between the pins to be bonded together, but also avoids short circuits between adjacent pins, thereby ensuring the bonding yield between the display panel and the circuit board. Therefore, the display module manufactured by the manufacturing method provided in the embodiments of the present invention, even if it is a medium or large-sized display module, can effectively solve the problem of module yield loss caused by the bonding process and reduce the production cost of the display module.

[0092] Furthermore, in the display module manufactured using the method provided in this embodiment of the invention, the conductive particles 11 in the bonding tape are evenly distributed between each of the first bonding pins 20 and the second bonding pins 30, thereby effectively reducing the bonding resistance between the first component 2 and the second component 3 and reducing the power consumption of the display module. Moreover, because the conductive particles in the bonding tape are evenly distributed, the bonding resistance between the display panel and the circuit board is more uniform, thus effectively improving the screen uniformity of the display panel and addressing the problem of poor display quality.

[0093] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments are basically similar to the product embodiments, so the description is relatively simple, and the relevant parts can be referred to the description of the product embodiments.

[0094] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connection,” “coupled,” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0095] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0096] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0097] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, It includes bonding tape, and also includes a first component and a second component bonded by the bonding tape; wherein, The bonding tape includes an adhesive substrate and conductive particles; the first surface of the adhesive substrate has a plurality of spaced-apart first protrusions, and the conductive particles are distributed in each of the first protrusions; the bonding tape is an anisotropic conductive adhesive. The first component includes a bonding area, the bonding area is provided with a plurality of first bonding pins, and a first insulating portion is provided between adjacent first bonding pins. In a direction perpendicular to the first base of the first component, the height of the surface of the first bonding pin facing away from the first base relative to the first base is lower than the height of the surface of the first insulating portion facing away from the first base relative to the first base. Each first bonding pin and its adjacent first insulating portion together form a first groove structure. The second component includes a plurality of second bonding pins, each of which corresponds to a first bonding pin, and a second insulating portion is provided between adjacent second bonding pins; The first bonding pin and the second bonding pin are disposed opposite to each other, and the bonding tape is located between the first bonding pin and the second bonding pin. The first protrusion structure in the bonding tape corresponds one-to-one with the first bonding pin. The first protrusion structure fills the first groove structure formed by its corresponding first bonding pin. The first bonding pin is coupled to the corresponding second bonding pin through conductive particles located in the corresponding first protrusion structure.

2. The display module according to claim 1, characterized in that, The second surface of the adhesive substrate has a plurality of spaced-apart second protrusions, the second surface being opposite to the first surface, and the first protrusions and the second protrusions being offset in a direction perpendicular to the adhesive substrate; In the direction perpendicular to the second base of the second component, the height of the surface of the second bonding pin facing away from the second base relative to the second base is higher than the height of the surface of the second insulating portion facing away from the second base relative to the second base. A second groove structure is formed between an adjacent second bonding pin and a second insulating portion located between the adjacent second bonding pins. The second groove structure corresponds one-to-one with the second protrusion structure on the bonding tape, and the second protrusion structure fills the corresponding second groove structure.

3. The display module according to claim 1, characterized in that, Alignment marks are provided on the adhesive substrate.

4. The display module according to claim 1 or 2, characterized in that, The first component includes a display panel, and the second component includes a circuit board.

5. The display module according to claim 1 or 2, characterized in that, The second component includes a display panel, and the first component includes a circuit board.

6. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 5.

7. A method for manufacturing a display module, characterized in that, The method for manufacturing a display module as described in any one of claims 1 to 5 includes: A first component, a bonding tape, and a second component are provided. The first component includes a bonding area with multiple first bonding pins. A first insulating portion is provided between adjacent first bonding pins. In a direction perpendicular to a first base of the first component, the height of the surface of the first bonding pin facing away from the first base relative to the first base is lower than the height of the surface of the first insulating portion facing away from the first base relative to the first base. Each first bonding pin and its adjacent first insulating portion together form a first groove structure. The second component includes multiple second bonding pins, each corresponding to one of the first bonding pins. A second insulating portion is provided between adjacent second bonding pins. The bonding tape includes an adhesive base and conductive particles. The first surface of the adhesive base has multiple spaced-apart first protrusions, and the conductive particles are distributed in each of the first protrusions. The bonding tape is applied to the bonding area of ​​the first component in the display module, so that the first protrusions in the bonding tape are filled into the first grooves one by one. The second component is bonded to the first component by the bonding tape, the first bonding pin and the second bonding pin are arranged opposite to each other, the bonding tape is located between the first bonding pin and the second bonding pin, and the first bonding pin is coupled to the corresponding second bonding pin through conductive particles located in the corresponding first protrusion structure.

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