Semiconductor air conditioner

Abstract

The present application provides a semiconductor air conditioner. The semiconductor air conditioner includes a heat exchange structure assembly of an air conditioner shell. A return air port, a cold air port and a hot air port are respectively provided on the air conditioner shell, and a hot air flow channel connected to the hot air port is formed in the air conditioner shell. The heat exchange structure assembly includes a heat dissipation heat exchange structure, a cold heat dissipation heat exchange structure and a semiconductor refrigeration plate. A heat dissipation flow channel is formed on the heat dissipation heat exchange structure, and the extension direction of the heat dissipation flow channel is consistent with the air inlet direction of the return air port. By adopting the technical solution of the present invention, the airflow entering from the return air port can be directly blown to the heat dissipation flow channel, thereby increasing the wind speed in the heat dissipation flow channel, so that the heat dissipation heat exchange structure can dissipate heat to the semiconductor refrigeration plate more efficiently, thereby improving the refrigeration efficiency of the semiconductor refrigeration plate, thereby improving the refrigeration efficiency of the semiconductor refrigeration plate, and thus improving the refrigeration efficiency of the semiconductor air conditioner.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning equipment, and in particular to a semiconductor air conditioner. Background Art

[0002] At present, air conditioners for kitchen environments have been launched on the market, including duct models, which are installed in the kitchen ceiling; single-sided air outlet patio models, which are flush with the ceiling gusset after installation, etc. These kitchen air conditioners have a characteristic that the engineering installation volume is relatively large, and they are suitable for kitchens that have not yet been decorated. If you want to install this type of kitchen air conditioner, you need to remove the ceiling, install the unit, and then restore the ceiling. The workload of installing the unit is greater, making the installation cost of the unit higher, which is difficult for users to accept.

[0003] Moreover, most of the existing units use refrigerant cooling. At this time, the unit has large mass components such as the compressor, which makes the overall unit bulky. Even if it is an integrated wall-mounted unit, there is a problem that the unit occupies a large space. As a result, the market feedback shows that the unit is too large and is heavy, making it inconvenient to disassemble and clean. Therefore, it is necessary to develop an air conditioner that is suitable for easy installation after kitchen decoration, has a small installation workload, is light, easy to place, and simple and convenient to maintain.

[0004] In order to solve the above problems, some semiconductor air conditioners that are easy to install and maintain have begun to appear on the market. However, the air duct settings of current semiconductor air conditioners are not reasonable, resulting in insufficient heat dissipation efficiency of the heat dissipation surface of the semiconductor cooling sheet. Due to the characteristics of semiconductor cooling sheets, when the heat dissipation efficiency of the heat dissipation surface is low, the cooling efficiency will be relatively low, thus affecting the performance of the semiconductor air conditioner. Summary of the invention

[0005] The embodiment of the present invention provides a semiconductor air conditioner to solve the technical problem of low cooling efficiency due to the restricted heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration plate in the prior art semiconductor air conditioner.

[0006] An embodiment of the present application provides a semiconductor air conditioner, comprising: an air conditioning shell, on which a return air inlet, a cold air outlet and a hot air outlet are respectively provided, and a hot air flow channel connected to the hot air outlet is formed in the air conditioning shell; a heat exchange structure assembly, comprising a heat dissipation heat exchange structure, a cold heat exchange structure and a semiconductor refrigeration plate installed between the heat dissipation heat exchange structure and the cold heat exchange structure, a heat dissipation fin flow channel is formed on the heat dissipation heat exchange structure, two ends of the heat dissipation fin flow channel are respectively connected to the return air inlet and the hot air flow channel, and an extension direction of the heat dissipation fin flow channel is consistent with an air inlet direction of the return air inlet.

[0007] In one embodiment, the return air port is located on a side of the air conditioning housing, and the heat dissipation fin flow channel extends in a horizontal direction.

[0008] In one embodiment, the hot air flow channels are distributed in a vertical direction.

[0009] In one embodiment, the hot air outlet is located at the top of the air conditioning housing.

[0010] In one embodiment, there are two return air vents, located on opposite sides of the air conditioning housing, and there are two heat exchange structure components, which are respectively arranged corresponding to the two return air vents. The hot air flow channel is located between the two heat exchange structure components.

[0011] In one embodiment, the two return air vents are respectively located on the left and right sides of the air conditioning housing.

[0012] In one embodiment, a cooling fin flow channel is formed on the cooling heat exchange structure, and a cold air flow channel connected to the cold air outlet is formed in the air-conditioning shell. The two ends of the cooling fin flow channel are respectively connected to the return air port and the cold air flow channel, and the cooling fin flow channel extends in a vertical direction.

[0013] In one embodiment, the cold air flow channel is located at the lower side of the air conditioning housing, and the cold air outlet is opened at the lower end of the air conditioning housing.

[0014] In one embodiment, the heat exchange structure assembly also includes an air duct plate, the heat dissipation heat exchange structure and the cold dissipation heat exchange structure are installed between the air duct plates, and a heat dissipation inlet and a heat dissipation outlet connected to the heat dissipation fin flow channel are opened on the air duct plate, the heat dissipation inlet is opposite to the return air port, and the heat dissipation outlet is connected to the hot air flow channel.

[0015] In one embodiment, a heat dissipation heat exchange structure, a cold dissipation heat exchange structure and at least one semiconductor refrigeration plate constitute a heat exchange structure unit, and there are multiple heat exchange structure units, which are arranged adjacent to each other.

[0016] In one embodiment, in the thickness direction, the cooling and heat exchanging structures of two adjacent heat exchanging structural units are arranged opposite to each other, and the heat dissipating and heat exchanging structures of two adjacent heat exchanging structural units are arranged opposite to each other.

[0017] In one embodiment, in the width direction, the cooling and heat exchanging structures of two adjacent heat exchanging structural units are arranged side by side, and the heat dissipating and heat exchanging structures of two adjacent heat exchanging structural units are arranged side by side.

[0018] In one embodiment, a hot air exhaust device is provided in the hot air flow channel, and a cold air exhaust device is provided in the cold air flow channel.

[0019] In one embodiment, the hot air exhaust device is a centrifugal fan, and the cold air exhaust device is a cross-flow fan.

[0020] In one embodiment, a wind sweeping blade is provided on the cold air outlet.

[0021] In the above embodiment, when in use, the indoor hot air enters the air conditioning housing from the return air port, part of the airflow enters the heat dissipation fin flow channel, and part of the airflow enters the cooling fin flow channel. The airflow entering the heat dissipation fin flow channel carries away the heat dissipated by the heat dissipation fins on the heat dissipation heat exchange structure and is discharged from the hot air outlet to the outside through the hot air flow channel; the airflow entering the cooling fin flow channel is cooled by the cooling heat exchange structure and then discharged from the cold air outlet to the room through the cold air flow channel. By adopting the technical solution of the present invention, the airflow entering the return air port can directly blow the heat dissipation fin flow channel, increase the wind speed in the heat dissipation fin flow channel, enable the heat dissipation heat exchange structure to dissipate heat to the semiconductor refrigeration plate more efficiently, improve the refrigeration efficiency of the semiconductor refrigeration plate, and thus improve the refrigeration efficiency of the semiconductor air conditioner. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 is a schematic diagram of a three-dimensional structure of an embodiment of a semiconductor air conditioner according to the present invention with a back shell removed;

[0024] Figure 2 yes Figure 1 A front structural schematic diagram of an embodiment of a semiconductor air conditioner;

[0025] Figure 3 yes Figure 1 A side structural schematic diagram of an embodiment of a semiconductor air conditioner;

[0026] Figure 4 yes Figure 1 A schematic diagram of the structure of the hot air flow of an embodiment of a semiconductor air conditioner;

[0027] Figure 5 yes Figure 1 A schematic diagram of the structure of cold air flow circulation of an embodiment of a semiconductor air conditioner;

[0028] Figure 6 yes Figure 1 A schematic structural diagram of a heat exchange structure assembly of an embodiment of a semiconductor air conditioner;

[0029] Figure 7 yes Figure 6 Schematic diagram of the exploded structure of the heat exchange structure assembly;

[0030] Figure 8 yes Figure 6 A schematic diagram of the three-dimensional structure of a heat exchange structure unit of a heat exchange structure assembly;

[0031] Fig. 9 yes Figure 8Schematic diagram of the decomposed structure of the heat exchange structural unit;

[0032] Fig.10 yes Figure 8 A schematic structural diagram of the heat dissipation and heat exchange structure of the heat exchange structural unit;

[0033] Fig.11 yes Figure 8 A schematic structural diagram of a heat exchange structure of a heat exchange structural unit;

[0034] Fig.12 It is a schematic diagram of the three-dimensional structure of the water cooling component of the semiconductor air conditioner according to the present invention. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and the accompanying drawings. Here, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but are not intended to limit the present invention.

[0036] The present invention adopts a semiconductor refrigeration sheet for cooling. After power is turned on, the temperature of one side of the semiconductor refrigeration sheet will decrease and the temperature of the other side will increase. By utilizing this characteristic of the refrigeration sheet, the two sides of the refrigeration sheet are pressed against the radiator so that heat or cold is transferred to the radiator. The direction of the radiator fins and the formed channels are cleverly used to form a reasonable air duct, so that the heat dissipation side of the semiconductor refrigeration sheet can be better dissipated, thereby improving the working efficiency of the semiconductor refrigeration sheet.

[0037] Specifically, Figure 1 and Figure 2 As shown, an embodiment of the semiconductor air conditioner of the present invention includes an air conditioning shell 10 and a heat exchange structure assembly 20. The air conditioning shell 10 is respectively provided with a return air port 11, a cold air outlet 12 and a hot air outlet 13. A hot air flow channel a connected to the hot air outlet 13 and a cold air flow channel b connected to the cold air outlet 12 are formed in the air conditioning shell 10. The hot air flow channel a and the cold air flow channel b are relatively independent. The heat exchange structure assembly 20 includes a heat dissipation heat exchange structure 21, a cold heat exchange structure 22 and a semiconductor refrigeration sheet 23. The semiconductor refrigeration sheet 23 is arranged between the heat dissipation heat exchange structure 21 and the cold heat exchange structure 22. The heat dissipation heat exchange structure 21 is in contact with the heat dissipation surface of the semiconductor refrigeration sheet 23, and the cold heat exchange structure 22 is in contact with the cold surface of the semiconductor refrigeration sheet 23. A heat dissipation fin flow channel 211 is formed on the heat dissipation heat exchange structure 21; a cold heat exchange fin flow channel 221 is formed on the cold heat exchange structure 22. As shown in FIG. Figure 3 and Figure 4As shown, the two ends of the heat dissipating fin flow channel 211 are respectively connected to the return air port 11 and the hot air flow channel a, and the two ends of the heat dissipating fin flow channel 221 are respectively connected to the return air port 11 and the cold air flow channel b, and the extension direction of the heat dissipating fin flow channel 211 is consistent with the air inlet direction of the return air port 11.

[0038] When in use, the indoor hot air enters the air conditioning housing 10 from the return air port 11, part of the airflow enters the heat dissipation fin flow channel 211, and part of the airflow enters the cooling fin flow channel 221. The airflow entering the heat dissipation fin flow channel 211 carries away the heat dissipated by the heat dissipation fins on the heat dissipation heat exchange structure 21 and is discharged from the hot air outlet 13 to the outside through the hot air flow channel a; the airflow entering the cooling fin flow channel 221 is cooled by the cooling heat exchange structure 22 and then discharged from the cold air outlet 12 to the room through the cold air flow channel b. By adopting the technical solution of the present invention, the airflow entering the return air port 11 can directly blow the heat dissipation fin flow channel 211, increase the wind speed in the heat dissipation fin flow channel 211, so that the heat dissipation heat exchange structure 21 can dissipate heat to the semiconductor refrigeration plate 23 more efficiently, improve the cooling efficiency of the semiconductor refrigeration plate 23, and thus improve the cooling efficiency of the semiconductor air conditioner.

[0039] It should be noted that in the technical solution of the present invention, the heat dissipation heat exchange structure 21 and the cooling heat exchange structure 22 are heat exchange structures with fins, which are different from the heat exchange structure on the traditional air conditioner. The heat exchange structure of the traditional air conditioner mainly relies on the refrigerant circulating in the heat exchange structure for heat exchange, while the heat dissipation heat exchange structure 21 and the cooling heat exchange structure 22 in the present application perform heat exchange through the fins by means of heat transfer in contact with the semiconductor refrigeration sheet 23.

[0040] like Figure 3 , Figure 4 and Fig.10 As shown, as an optional embodiment, the return air port 11 is located on the side of the air conditioning housing 10, and the heat dissipation fin flow channel 211 extends in the horizontal direction. In this way, the extension direction of the heat dissipation fin flow channel 211 is consistent with the air inlet direction of the return air port 11, which is conducive to the airflow entering the return air port 11 to blow directly on the heat dissipation fin flow channel 211. Optionally, the hot air flow channel a is distributed in the vertical direction. That is, the indoor hot air flows from the return air port 11 along the horizontal heat dissipation fin flow channel 211, and then enters the vertical hot air flow channel a from the heat dissipation fin flow channel 211 and is then discharged from the hot air outlet 13 into the room.

[0041] As a preferred embodiment, in the technical solution of this embodiment, the hot air outlet 13 is located at the top of the air conditioning housing 10. This is more in line with the principle that hot air rises, and is conducive to the hot air flow being discharged from the hot air outlet 13 into the room through the hot air flow channel a. In the technical solution of this embodiment, the hot air outlet 13 is located on the top surface of the air conditioning housing 10. As other optional embodiments, the hot air outlet 13 can also be located on the side of the top of the air conditioning housing 10.

[0042] like Figure 1 As shown, in the technical solution of this embodiment, there are two return air ports 11, which are respectively located on opposite sides of the air-conditioning housing 10, and there are also two heat exchange structure assemblies 20, which are respectively arranged corresponding to the two return air ports 11, and the hot air flow channel a is formed between the two heat exchange structure assemblies 20. In this way, the processing efficiency of indoor hot air can be improved, and the indoor air flows from the return air ports 11 on both sides of the air-conditioning housing 10 into the two heat exchange structure assemblies 20 respectively, so as to perform more efficient cooling. In the technical solution of this embodiment, the two return air ports 11 are respectively located on the left and right sides of the air-conditioning housing 10.

[0043] like Figure 3 , Figure 5 and Fig.11 As shown, as an optional implementation, in the technical solution of this embodiment, the cooling fin flow channel 221 extends in the vertical direction. In the technical solution of this embodiment, the cooling airflow direction and the heat dissipation airflow direction of the heat exchange structure assembly 20 are relatively vertical and isolated from each other. More preferably, in the technical solution of this embodiment, the cold air flow channel b is located on the lower side of the air-conditioning housing 10, and the cold air outlet 12 is opened at the lower end of the air-conditioning housing 10. In this way, it is more in line with the principle of the descent of the cold air flow, which is conducive to the cold air flow being discharged from the cold air outlet 12 into the room through the cold air flow channel b.

[0044] More preferably, in the technical solution of this embodiment, a sweeping blade is provided on the cold air outlet 12, so as to realize wide-area air supply of the cold air outlet 12 and improve the air supply angle.

[0045] like Figure 6 , Figure 7As shown, optionally, the heat exchange structure assembly 20 also includes an air duct plate 24, and the heat dissipation heat exchange structure 21 and the cooling heat exchange structure 22 are installed between the air duct plates 24. The air duct plate 24 is provided with a heat dissipation inlet 241 and a heat dissipation outlet 242 connected to the heat dissipation fin flow channel 211, the heat dissipation inlet 241 is opposite to the return air port 11, and the heat dissipation outlet 242 is connected to the hot air flow channel a. When installing and using, the heat dissipation inlet 241 on the air duct plate 24 is directly opposite to the return air port 11, and the heat dissipation outlet 242 is connected to the hot air flow channel a to complete the installation of the heat exchange structure assembly 20. In the technical solution of this embodiment, the air duct plate 24 plays the role of relatively separating the heat dissipation fin flow channel 211 of the heat dissipation heat exchange structure 21 and the cooling fin flow channel 221 of the cooling heat exchange structure 22. As another embodiment not shown in the figure, the air duct plate 24 can also cover the cooling fin flow channel 221, and a cooling inlet and a cooling outlet connected to the cooling fin flow channel 221 can also be opened on the air duct plate 24.

[0046] like Figure 7 , Figure 8 and Fig. 9 As shown, a heat dissipation heat exchange structure 21, a cooling heat exchange structure 22 and at least one semiconductor refrigeration plate 23 form a heat exchange structure unit c, and there are multiple heat exchange structure units c, and multiple heat exchange structure units c are arranged adjacent to each other. Specifically, at least one semiconductor refrigeration plate 23 is assembled between a heat dissipation heat exchange structure 21 and a cooling heat exchange structure 22, and the fins of a heat dissipation heat exchange structure 21 and a cooling heat exchange structure 22 are opposite to each other, forming a heat dissipation fin flow channel 211 and a cooling fin flow channel 221 in which the heat and cold do not interfere with each other, which cleverly utilizes the characteristics of the profile radiator and effectively utilizes the internal space of the unit. During installation, a heat dissipation heat exchange structure 21 and a cooling heat exchange structure 22 can be fastened together by bolts. It should also be noted that the advantage of using multiple heat exchange structure units c is that the operations of the multiple heat exchange structure units c are independent of each other and do not affect each other, which improves the fault tolerance rate; at the same time, when performing maintenance, only the heat exchange structure unit c of the faulty part needs to be disassembled, which reduces the difficulty of maintenance. In this way, the failure rate of the heat exchange structure of the semiconductor air conditioner can be improved. When a part of the heat exchange structure fails, it will not affect the operation of other parts of the heat exchange structure. At the same time, the maintenance is accurate and convenient.

[0047] More preferably, Figure 7As shown, in the technical solution of this embodiment, in the thickness direction, the cooling heat exchange structures 22 of two adjacent heat exchange structure units c are arranged relative to each other, and the heat dissipation heat exchange structures 21 of two adjacent heat exchange structure units c are arranged relative to each other. This has the advantage that the hot side of the two adjacent heat exchange structure units c is close to the hot side; the cold side is close to the cold side, which effectively prevents the cold and hot short circuit and neutralization of the two adjacent heat exchange structure units c. At the same time, the formation of the air duct is orderly and compact, the wind resistance becomes smaller, and it is conducive to providing air volume.

[0048] As a more preferred embodiment, in the width direction, the cooling and heat exchanging structures 22 of two adjacent heat exchanging structural units c are arranged side by side, and the heat dissipating and heat exchanging structures 21 of two adjacent heat exchanging structural units c are arranged side by side, thereby increasing the cooling capacity.

[0049] Optional, such as Figure 1 As shown, a hot air exhaust device a1 is provided in the hot air flow channel a, and a cold air exhaust device b1 is provided in the cold air flow channel b. The hot air exhaust device a1 provides power for the air flow in the hot air flow channel a, and the cold air exhaust device b1 provides power for the air flow in the cold air flow channel b. Optionally, the hot air exhaust device a1 is a centrifugal fan, and the cold air exhaust device b1 is a crossflow fan. The centrifugal fan includes a motor and centrifugal blades connected to the motor drive, and the crossflow fan includes a motor and a perfusion blade connected to the motor drive.

[0050] Since the hot air flow channel a discharges hot air from the unit, it needs to dissipate heat in time. The discharged hot air can be transported to the outside through a pipeline. The transportation distance is long, and an exhaust system with strong static pressure resistance is required. The present invention adopts centrifugal fan blades, and the centrifugal fan blades are arranged on the main exhaust air duct to generate a sufficiently large negative pressure so that the air duct on each heat exchange structure unit c can form a wind field, thereby improving the energy efficiency of the heat exchange structure unit c. The cold air flow channel b discharges cold air to adjust the indoor temperature. Since the cold air exhaust device b1 is not on the main air duct, it is necessary to satisfy that each heat exchange structure unit c air duct can form a wind field, so that the cold generated by each refrigeration plate can be discharged in time. Therefore, this exhaust system adopts cross-flow fan blades. Under the action of the cross-flow fan blades, the wind field of each air duct of the heat exchange structure on the refrigeration side is effectively balanced, so that the cold generated by each refrigeration plate is output in time, improving the working efficiency of the unit. A cross-flow fan blade is used, and a cold air outlet 12 is opened in front of the cross-flow fan blade. Under the action of the cross-flow fan blade, the cold air output is soft, and because the cross-flow fan blade has a large lateral distance, a wider area of ​​air supply is achieved under the action of the sweeping blade.

[0051] like Figure 4As shown, the hot air flow exhaust method is as follows: under the action of the centrifugal fan blades, the air flow passes through the heat dissipation inlet 241 on the air duct plate 24 from the return air outlet 11 on both sides of the air conditioning housing 10, enters the heat dissipation fin flow channel 211 of the heat exchange structure 21, and after heat exchange, enters the middle hot air flow channel a through the heat dissipation outlet 242, and then passes through the centrifugal fan blade in the direction of the centrifugal fan blade and is discharged through the hot air outlet 13. The centrifugal fan blades are arranged on the hot air flow channel a, so that each air duct of each heat exchange structure unit c can form a wind field on the small main air duct, effectively avoiding the impact of the unit performance due to uneven wind field.

[0052] like Figure 5 As shown, the cold air flow exhaust method is: under the action of the cross-flow fan blades, the air flow reaches the heat exchange structure assembly 20 from the return air outlet 11 on both sides of the air-conditioning shell 10. Due to the obstruction of the air duct plate 24, the air flow can only enter the cooling fin flow channel 221 through the opening of the cooling fin flow channel 221 at the top of the heat exchange structure assembly 20, and then gradually cools downward into the cold air flow channel b, and then passes through the cross-flow fan blades and is discharged from the cold air outlet 12.

[0053] As a preferred embodiment, the semiconductor air conditioner also includes a water receiving tray, which is arranged at the bottom of the cold air flow channel b. In this way, the condensed water condensed on the heat dissipation and heat exchange structure 22 can flow into the water receiving tray under the guidance of the cold air flow channel b. More preferably, a drainage hole is provided at the bottom of the water receiving tray, and the drainage hole is used for drainage, so as to discharge the condensed water in the water receiving tray in time to avoid overflow. More preferably, after the water receiving tray is assembled, it is sealed on all sides to prevent the air passing through the cold air flow channel b from leaking out and affecting the cooling effect. It should also be noted that when the positive and negative poles of the semiconductor refrigeration plate 23 in the above-mentioned heat exchange structure unit c are reversely connected, the cooling and heating airflows are just interchanged.

[0054] Preferably, in the technical solution of this embodiment, the semiconductor air conditioner also includes a water cooling component 30, which is connected between the water receiving tray and the heat exchange structure component 20, and the water cooling component 30 is used to absorb condensed water from the water receiving tray and spray the condensed water on the top of the heat dissipation heat exchange structure 22. In this way, in the technical solution of the present invention, the condensed water generated during operation can be transferred to the heat dissipation fins of the heat dissipation heat exchange structure 22, which assists in cooling the heat dissipation heat exchange structure 22, thereby improving the refrigeration efficiency of the heat exchange structure component 20. In addition, since the heat dissipation fins and the heat dissipation fin flow channel 221 of the heat dissipation heat exchange structure 22 extend in the vertical direction, it can help the condensed water flow down along the heat dissipation fins under the action of gravity. As an optional implementation, in the technical solution of this embodiment, the water cooling component 30 includes a water pump 31 and a drain pipe 32, the water pump 31 is installed in the water receiving tray for absorbing water from the water receiving tray, the first end of the drain pipe 32 is connected to the water pump 31, and the second end of the drain pipe 32 is located above the heat dissipation heat exchange structure 22. When in use, the water pump 31 draws water from the water receiving pan and sprays the condensed water on the top of the heat exchange structure 22 through the drain pipe 32. More preferably, the water cooling assembly 30 also includes a spray head 33, which is installed at the second end of the drain pipe 32 and is used to spray the condensed water on the top of the heat dissipation and heat exchange structure 22. By spraying water on the heat dissipation and heat exchange structure 22 through the spray head 33, the spraying of the condensed water can be made more uniform. Preferably, a plurality of small holes are provided on the spray head 33 so that the condensed water can be evenly sprinkled on the heat dissipation and heat exchange structure 2.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the embodiments of the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor air conditioner, characterized in that: include: An air conditioning housing (10), wherein the air conditioning housing (10) is respectively provided with an air return port (11), a cold air outlet (12) and a hot air outlet (13), and a hot air flow channel (a) connected to the hot air outlet (13) is formed in the air conditioning housing (10); A heat exchange structure assembly (20), comprising a heat dissipation heat exchange structure (21), a cold dissipation heat exchange structure (22), and a semiconductor refrigeration plate (23) installed between the heat dissipation heat exchange structure (21) and the cold dissipation heat exchange structure (22), wherein a heat dissipation fin flow channel (211) is formed on the heat dissipation heat exchange structure (21), and two ends of the heat dissipation fin flow channel (211) are respectively connected to the return air port (11) and the hot air flow channel (a), and an extension direction of the heat dissipation fin flow channel (211) is consistent with an air inlet direction of the return air port (11); The return air port (11) is located on a side surface of the air conditioning housing (10), and the heat dissipation fin flow channel (211) extends in a horizontal direction; The hot air outlet (13) is located at the top of the air conditioning housing (10); A cooling fin flow channel (221) is formed on the cooling heat exchange structure (22), a cold air flow channel (b) connected to the cold air outlet (12) is formed in the air conditioning housing (10), two ends of the cooling fin flow channel (221) are respectively connected to the return air port (11) and the cold air flow channel (b), and the cooling fin flow channel (221) extends in a vertical direction; The cold air flow channel (b) is located at the lower side of the air conditioning housing (10), and the cold air outlet (12) is opened at the lower end of the air conditioning housing (10); The cooling airflow direction and the cooling airflow direction of the heat exchange structure assembly (20) are relatively perpendicular and isolated from each other.

2. The semiconductor air conditioner according to claim 1, characterized in that: The hot air flow channel (a) is distributed along the vertical direction.

3. The semiconductor air conditioner according to claim 1, characterized in that: There are two return air ports (11), which are respectively located on two opposite sides of the air conditioning housing (10); there are two heat exchange structure components (20), which are respectively arranged corresponding to the two return air ports (11); and the hot air flow channel (a) is located between the two heat exchange structure components (20).

4. The semiconductor air conditioner according to claim 3, characterized in that: The two return air ports (11) are respectively located on the left and right sides of the air conditioning housing (10).

5. The semiconductor air conditioner according to claim 1, characterized in that: The heat exchange structure assembly (20) further comprises an air duct plate (24), the heat dissipation and heat exchange structure (21) and the cooling and heat exchange structure (22) are installed between the air duct plates (24), and the air duct plate (24) is provided with a heat dissipation inlet (241) and a heat dissipation outlet (242) which are connected to the heat dissipation fin flow channel (211), the heat dissipation inlet (241) is opposite to the return air port (11), and the heat dissipation outlet (242) is connected to the hot air flow channel (a).

6. The semiconductor air conditioner according to claim 1, characterized in that: One heat dissipation heat exchange structure (21), one cold dissipation heat exchange structure (22) and at least one semiconductor refrigeration plate (23) form a heat exchange structure unit (c), and there are a plurality of heat exchange structure units (c), and the plurality of heat exchange structure units (c) are arranged adjacent to each other.

7. The semiconductor air conditioner according to claim 6, characterized in that: In the thickness direction, the cooling and heat exchanging structures (22) of two adjacent heat exchanging structural units (c) are arranged opposite to each other, and the cooling and heat exchanging structures (21) of two adjacent heat exchanging structural units (c) are arranged opposite to each other.

8. The semiconductor air conditioner according to claim 6, characterized in that: In the width direction, the cooling and heat exchanging structures (22) of two adjacent heat exchanging structural units (c) are arranged side by side, and the cooling and heat exchanging structures (21) of two adjacent heat exchanging structural units (c) are arranged side by side.

9. The semiconductor air conditioner according to claim 1, characterized in that: The hot air flow channel (a) is provided with a hot air exhaust device (a1), and the cold air flow channel (b) is provided with a cold air exhaust device (b1).

10. The semiconductor air conditioner according to claim 9, characterized in that: The hot air exhaust device (a1) is a centrifugal fan, and the cold air exhaust device (b1) is a cross-flow fan.

11. The semiconductor air conditioner according to claim 1, characterized in that: The cold air outlet (12) is provided with a wind sweeping blade.

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