Semiconductor air conditioner

Abstract

The present application provides a semiconductor air conditioner. An embodiment of the semiconductor air conditioner includes a shell and a semiconductor heat exchanger. The shell is provided with a hot air return port, a hot air exhaust port, a cold air return port and a cold air exhaust port. The semiconductor heat exchanger is arranged in the shell. The semiconductor heat exchanger includes a heat dissipation heat exchanger, a cold heat dissipation heat exchanger and a semiconductor refrigeration plate. The heat dissipation heat exchanger includes a duct-shaped heat dissipation base and a plurality of heat dissipation ribs. The interior of the heat dissipation base forms a heat dissipation air duct, and a plurality of heat dissipation ribs are arranged in the heat dissipation air duct. The cold heat exchanger includes a cold heat dissipation base and a plurality of cold heat dissipation ribs. In the technical solution of the present invention, the heat dissipation ribs are dissipated through the heat dissipation air duct, which can ensure that the airflow in the heat dissipation air duct has sufficient wind pressure and wind speed, and increase the air volume of the heat dissipation air duct, so as to quickly take away the heat on the heat dissipation ribs, improve the heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration plate, and improve the working efficiency of the semiconductor air conditioner.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioners, and in particular to a semiconductor air conditioner. Background Art

[0002] Air conditioners can be used in many occasions. Air conditioners for kitchen environments have been launched on the market: duct type, installed in the kitchen ceiling; single-sided air outlet patio type, installed flush with the ceiling gusset. In addition, the above-mentioned air conditioners also require refrigerant pipelines to be used with outdoor units, and sometimes ducts are also required to be used with outdoor units.

[0003] However, the kitchen environment is bad and there is a lot of oil smoke. The return air frame filter needs to be replaced soon after the air conditioner is used. If oil smoke enters the fins of the internal unit, the split unit cannot be disassembled for cleaning due to the refrigerant pipe connecting the internal and external units. Over time, it will affect the normal operation of the unit. Some all-in-one units are bulky because most of them use compressors to compress the refrigerant for cooling. The internal pipes of the unit are irregular and inconvenient to disassemble and clean. The filter on the return air frame is blocked by oil soon after use, and if oil smoke enters the fins, it will be difficult to clean.

[0004] At present, there are also air conditioners developed based on semiconductor cooling chips on the market to address the technical problem of inconvenient installation and disassembly caused by the compressor refrigerant system. However, due to the characteristics of the semiconductor cooling chips, the air conditioners developed based on the semiconductor cooling chips have a relatively low cooling efficiency, which affects user use. Summary of the invention

[0005] The embodiment of the present invention provides a semiconductor air conditioner to solve the technical problem of low cooling efficiency existing in air conditioners developed based on semiconductor refrigeration sheets in the prior art.

[0006] The embodiment of the present application provides a semiconductor air conditioner, including a shell, on which a hot air return port, a hot air exhaust port, a cold air return port and a cold air exhaust port are arranged, a hot air channel and a cold air channel are formed in the shell, the hot air return port and the hot air exhaust port are respectively connected to the hot air channel, and the cold air return port and the cold air exhaust port are respectively connected to the cold air channel; a semiconductor heat exchanger is arranged in the shell, the semiconductor heat exchanger includes a heat dissipation heat exchanger, a cold heat dissipation heat exchanger and a semiconductor refrigeration sheet, and the heat dissipation heat exchanger includes a duct-shaped heat dissipation substrate and multiple heat dissipation ribs, the interior of the heat dissipation base forms a heat dissipation duct, the multiple heat dissipation ribs are arranged in the heat dissipation duct, the heat dissipation heat exchanger includes a heat dissipation base and multiple heat dissipation ribs, the first side of the heat dissipation base is in contact with the outside of the heat dissipation base, the multiple heat dissipation ribs are arranged on the second side of the heat dissipation base, and the semiconductor refrigeration plate is installed between the heat dissipation heat exchanger and the heat dissipation heat exchanger; the air inlet and the air outlet of the heat dissipation duct are respectively connected with the hot air return air outlet and the hot air exhaust outlet through the hot air channel, and the heat dissipation heat exchanger is located in the cold air channel.

[0007] In one embodiment, the air inlet of the heat dissipation air duct is opposite to the hot air return outlet, and the extension direction of the heat dissipation air duct is consistent with the air inlet direction of the hot air return outlet.

[0008] In one embodiment, the hot air channel comprises:

[0009] The hot air inlet section is connected between the air inlet and the hot air return outlet of the heat dissipation air duct;

[0010] The hot air outlet section is connected between the air outlet and the hot air exhaust port of the heat dissipation air duct.

[0011] In one embodiment, the hot air channel further includes: a hot air blower component, and the hot air blower component is installed on the hot air inlet section or the hot air outlet section.

[0012] In one embodiment, the semiconductor heat exchanger further comprises: an outer cover, which covers the outside of the cooling heat exchanger, and a cooling air duct is formed between the outer cover and the heat dissipation heat exchanger.

[0013] In one embodiment, the airflow direction in the cooling air duct is opposite to the airflow direction in the heat dissipating air duct.

[0014] In one embodiment, the semiconductor heat exchanger further comprises:

[0015] An air inlet end cover is mounted on the first end of the outer cover, a hot air inlet end connected to the air inlet of the heat dissipation air duct is formed on the air inlet end cover, the hot air inlet end forms at least a part of the hot air inlet section, and a cold air outlet end connected to the cold air dissipation air duct is also formed on the air inlet end cover;

[0016] The air outlet end cover is installed at the second end of the outer cover, and is formed with a hot air outlet end connected to the air outlet of the heat dissipation air duct. The hot air outlet end forms at least a part of the hot air outlet section. The air outlet end cover is also formed with a cold air inlet end connected to the cooling air duct.

[0017] In one embodiment, the cold air inlet and / or the cold air outlet includes a plurality of cold air openings connected to the cold air dissipation duct.

[0018] In one embodiment, a wind shielding structure matching with the interior of the shell is formed on the air inlet cover, the cold air inlet is located on a first side of the wind shielding structure, and the cold air outlet is located on a second side of the wind shielding structure.

[0019] In one embodiment, the cold air passage further includes a cold air blower component, and the cold air blower component is installed on the second side of the wind shielding structure in the shell.

[0020] In one embodiment, there are multiple cold air return vents, and the multiple cold air return vents are arranged on the housing at intervals.

[0021] In one embodiment, there are two cold air return vents, which are arranged at the top and the side of the shell respectively. A baffle opposite to the cold air return vents on the side of the shell is also provided in the shell.

[0022] In one embodiment, the hot air return port is located at the side of the shell, and the heat dissipation duct is horizontally arranged in the shell.

[0023] In one embodiment, the hot air exhaust port is located at the top of the housing.

[0024] In one embodiment, a wind sweeping component is provided on the cold air outlet.

[0025] In one embodiment, there are multiple cooling heat exchangers, and the multiple cooling heat exchangers are respectively installed outside the heat dissipation base.

[0026] In one embodiment, the heat dissipation substrate is columnar, and the cooling substrate is strip-shaped to match the heat dissipation substrate.

[0027] In one embodiment, the heat dissipation substrate is in a polygonal column shape, including a plurality of connected side surfaces, and a plurality of heat dissipation exchangers are respectively installed on the plurality of side surfaces through the heat dissipation substrate.

[0028] In one embodiment, the heat dissipation heat exchanger further includes heat conducting fins, and the heat conducting fins are used to connect with part or all of the plurality of heat dissipation fins.

[0029] In one embodiment, the heat conducting fins are supported in a first direction inside the duct-shaped heat dissipation substrate, and the semiconductor heat exchanger further includes supporting fins disposed in a second direction inside the duct-shaped heat dissipation substrate.

[0030] In one embodiment, a plurality of heat dissipation fins, heat conduction fins and support fins extend along the ventilation direction of the heat dissipation air duct.

[0031] In one embodiment, a plurality of cooling fins extend along the length direction of the cooling base.

[0032] In one embodiment, a mounting portion is formed on the exterior of the heat dissipation substrate, and the semiconductor cooling fin is mounted on the mounting portion.

[0033] In one embodiment, there are a plurality of semiconductor refrigeration sheets, and the plurality of semiconductor refrigeration sheets are arranged at intervals between the heat dissipation heat exchanger and the cooling heat exchanger.

[0034] In the above embodiment, in the working room of the semiconductor air conditioner, an airflow enters the hot air channel from the hot air return port, flows through the heat dissipation air channel, and is discharged from the hot air exhaust port. In this process, the airflow takes away the heat generated on the heat dissipation fins in the heat dissipation air channel; another airflow enters the cold air channel from the cold air return port, flows through the heat dissipation heat exchanger, and is discharged from the cold air exhaust port. In this process, the airflow takes away the cold generated on the heat dissipation heat exchanger. In the technical solution of the present invention, the semiconductor refrigeration plate is installed on the outside of the heat dissipation substrate and fits with it. Under the action of the semiconductor refrigeration plate, the airflow is absorbed and cooled by passing through the multiple heat dissipation fins of the heat dissipation heat exchanger. After that, the semiconductor refrigeration plate transfers the heat to the heat dissipation fins inside the heat dissipation air channel through the heat dissipation substrate. The heat dissipation of the heat dissipation fins through the heat dissipation air channel can ensure that the airflow in the heat dissipation air channel has sufficient wind pressure and wind speed, and increase the air volume of the heat dissipation air channel, so as to quickly take away the heat on the heat dissipation fins, improve the heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration plate, thereby improving the cooling efficiency of the semiconductor refrigeration plate and improving the working efficiency of the semiconductor air conditioner. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0036] Figure 1 is a schematic diagram of the external structure of an embodiment of a semiconductor air conditioner according to the present invention;

[0037] Figure 2 yes Figure 1 Schematic diagram of the internal structure of a semiconductor air conditioner;

[0038] Figure 3 yes Figure 1 A schematic diagram of the structure of the hot air flow direction of the semiconductor air conditioner;

[0039] Figure 4 yes Figure 1A schematic diagram of the structure of the semiconductor air conditioner showing the direction of the cold air flow;

[0040] Figure 5 yes Figure 1 A schematic diagram of the three-dimensional structure of a semiconductor heat exchanger of a semiconductor air conditioner;

[0041] Figure 6 yes Figure 5 Schematic diagram of the exploded structure of the semiconductor heat exchanger;

[0042] Figure 7 yes Figure 6 A schematic diagram of the three-dimensional structure of a heat dissipation heat exchanger and a cooling heat exchanger;

[0043] Figure 8 yes Figure 7 Schematic diagram of the exploded structure of the heat dissipation heat exchanger and the cooling heat exchanger;

[0044] Fig. 9 yes Figure 7 A schematic diagram of the three-dimensional structure of a heat dissipation heat exchanger;

[0045] Fig.10 yes Figure 7 A schematic diagram of the cross-sectional structure of a heat dissipation heat exchanger;

[0046] Fig.11 yes Figure 7 A schematic diagram of the side structure of a heat dissipation heat exchanger;

[0047] Fig.12 yes Fig.11 AA surface cross-sectional structural schematic diagram of the semiconductor heat exchanger;

[0048] Fig.13 yes Figure 5 A schematic diagram of the three-dimensional structure of a cooling heat exchanger of a semiconductor heat exchanger;

[0049] Fig.14 yes Figure 1 A structural schematic diagram of an installation method of a semiconductor air conditioner;

[0050] Fig.15 yes Figure 1 A structural schematic diagram of another installation method of a semiconductor air conditioner. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and the accompanying drawings. Here, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but are not intended to limit the present invention.

[0052] According to the research on the characteristics of semiconductor cooling chips, the main factor leading to low cooling efficiency is the heat dissipation efficiency of the heat dissipation surface of the semiconductor cooling chip. During the operation of the semiconductor cooling chip, the cooling efficiency will decrease as the temperature of the heat dissipation surface increases. Discharging heat in time will directly affect the working efficiency of the semiconductor. In order to solve the technical problem of low cooling efficiency in air conditioners developed based on semiconductor cooling chips in the prior art, such as Figure 1 and Figure 2 As shown, an embodiment of the semiconductor air conditioner of the present invention includes a housing 40 and a semiconductor heat exchanger. The housing 40 is provided with a hot air return port 41, a hot air exhaust port 42, a cold air return port 43 and a cold air exhaust port 44, and a hot air channel a and a cold air channel b are formed in the housing 40. The hot air return port 41 and the hot air exhaust port 42 are respectively connected to the hot air channel a, and the cold air return port 43 and the cold air exhaust port 44 are respectively connected to the cold air channel b. The semiconductor heat exchanger is arranged in the housing 40, and the semiconductor heat exchanger includes a heat dissipation heat exchanger 10, a cooling heat exchanger 20 and a semiconductor refrigeration sheet 30. The heat dissipation heat exchanger 10 includes a duct-shaped heat dissipation substrate 11 and a plurality of heat dissipation fins 12. The interior of the heat dissipation substrate 11 is surrounded by a heat dissipation air channel c, and a plurality of heat dissipation fins 12 are arranged in the heat dissipation air channel c. The cooling heat exchanger 20 includes a cooling base 21 and a plurality of cooling fins 22. The first side of the cooling base 21 is in contact with the outside of the heat dissipation base 11. The plurality of cooling fins 22 are arranged on the second side of the cooling base 21. The semiconductor cooling sheet 30 is installed between the heat dissipation heat exchanger 10 and the cooling heat exchanger 20. The air inlet of the heat dissipation air duct c and the air outlet of the heat dissipation air duct c are respectively connected to the hot air return port 41 and the hot air exhaust port 42 through the hot air duct a. The cooling heat exchanger 20 is located in the cold air duct b.

[0053] By applying the technical solution of the present invention, in the working room of the semiconductor air conditioner, an airflow enters the hot air channel a from the hot air return port 41, flows through the heat dissipation duct c, and is discharged from the hot air exhaust port 42. In this process, the airflow takes away the heat generated on the heat dissipation ribs 12 in the heat dissipation duct c; another airflow enters the cold air channel b from the cold air return port 43, flows through the heat dissipation heat exchanger 20, and is discharged from the cold air exhaust port 44. In this process, the airflow takes away the cold generated on the heat dissipation heat exchanger 20. In the technical solution of the present invention, the semiconductor refrigeration sheet 30 is installed on the outside of the heat dissipation base 11 and fits therewith. Under the action of the semiconductor refrigeration sheet 30, the airflow is cooled by absorbing heat through the multiple cooling fins 22 of the cooling heat exchanger 20. Then, the semiconductor refrigeration sheet 30 transfers the heat to the cooling fins 12 inside the cooling air duct c through the heat dissipation base 11. The cooling of the cooling fins 12 by the cooling air duct c can ensure that the airflow in the cooling air duct c has sufficient wind pressure and wind speed, and increase the air volume of the cooling air duct c, so as to quickly take away the heat on the cooling fins 12, improve the heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigeration sheet 30, thereby improving the cooling efficiency of the semiconductor refrigeration sheet 30 and improving the working efficiency of the semiconductor air conditioner.

[0054] like Figure 3 As shown, as a preferred embodiment, the air inlet of the heat dissipation duct c is opposite to the hot air return duct 41, and the extension direction of the heat dissipation duct c is consistent with the air inlet direction of the hot air return duct 41. In this way, the airflow entering the hot air return duct 41 can be blown directly to the heat dissipation duct c, thereby increasing the wind speed in the heat dissipation duct c, so that the heat dissipation heat exchanger 10 can dissipate heat from the semiconductor refrigeration plate 30 more efficiently. Optionally, in the technical solution of this embodiment, the hot air channel a includes a hot air inlet section a1 and a hot air outlet section a2, the hot air inlet section a1 is connected between the air inlet of the heat dissipation duct c and the hot air return duct 41, and the hot air outlet section a2 is connected between the air outlet of the heat dissipation duct c and the hot air exhaust duct 42. Optionally, the hot air inlet section a1 is arranged in the horizontal direction to be consistent with the air inlet direction. The hot air outlet section a2 is arranged in the vertical direction to meet the rising of the hot air flow and help to discharge heat.

[0055] like Figure 3 As shown, in the technical solution of this embodiment, the hot air channel a also includes a hot air blower component a3, and the hot air blower component a3 is installed on the hot air outlet section a2. As another optional implementation, the hot air blower component a3 is installed on the hot air inlet section a1.

[0056] like Figure 2 and Figure 4As shown, as a preferred embodiment, the semiconductor heat exchanger further includes an outer cover 50, which covers the outside of the cooling heat exchanger 20, and forms a cooling air duct d between the outer cover 50 and the heat dissipation heat exchanger 10. The advantage of this is that it can ensure that the airflow in the cooling air duct d has sufficient wind pressure and wind speed, and improve the cooling efficiency of the cooling air duct d.

[0057] like Figure 4 and Figure 3 As shown in FIG. 1 , as a preferred embodiment, the airflow direction in the cooling air duct d is opposite to the airflow direction in the heat dissipation air duct c. In this way, it conforms to the decreasing trend of the cooling amount in the cooling air duct d and the decreasing trend of the heat dissipation air duct c, making the overall air duct more suitable for heat transfer, thereby improving the balance of cooling performance. As an optional embodiment, as Figure 5 As shown in FIG6 , the semiconductor heat exchanger further includes an air inlet cover 60 and an air outlet cover 70. The air inlet cover 60 is mounted on the first end of the outer cover 50. A hot air inlet end connected to the air inlet of the heat dissipation air duct c is formed on the air inlet cover 60. The hot air inlet end forms a hot air inlet section a1. A cold air outlet end connected to the heat dissipation air duct d is also formed on the air inlet cover 60. The air outlet cover 70 is mounted on the second end of the outer cover 50. A hot air outlet end connected to the air outlet of the heat dissipation air duct c is formed on the air outlet cover 70. The hot air outlet end forms a hot air outlet section a2. A cold air inlet end connected to the heat dissipation air duct d is also formed on the air outlet cover 70. As another embodiment not shown in the figure, the hot air inlet end forms a part of the hot air inlet section a1, and the hot air outlet end forms a part of the hot air outlet section a2.

[0058] like Figure 6 As shown, in the technical solution of this embodiment, the cold air inlet end and / or the cold air outlet end include a plurality of cold air openings connected to the cold air duct d. The structure of the plurality of cold air openings can correspond to the structure of the plurality of cold heat exchangers 20 described below, thereby achieving effective heat exchange for each cold heat exchanger 20.

[0059] like Figure 2 and 4 As shown, in order to form a structure in which the airflow direction in the above-mentioned cooling air duct d is opposite to the airflow direction in the heat dissipation air duct c, in the technical solution of this embodiment, a wind shielding structure 61 matching the interior of the housing 40 is formed on the air inlet end cover 60, the cold air inlet end is located on the first side of the wind shielding structure 61, and the cold air outlet end is located on the second side of the wind shielding structure 61. Preferably, the cold air duct b also includes a cold air blower component b1, and the cold air blower component b1 is installed on the second side of the wind shielding structure 61 in the housing 40. In addition, other air duct designs can also be used to form the above-mentioned functional structure.

[0060] Optionally, the hot air blower component a3 and the cold air blower component b1 both include a volute and a motor and centrifugal blades installed in the volute.

[0061] like Figure 1 and Figure 2 As shown, in the technical solution of this embodiment, there are two cold air return ports 43, which are arranged at the top of the shell 40 and the side of the shell 40 respectively, and a baffle 45 is also provided in the shell 40, which is opposite to the cold air return ports 43 on the side of the shell 40. In this way, the cooling efficiency of the indoor air can be improved to a certain extent. As another optional embodiment, there can be more cold air return ports 43, and the multiple cold air return ports 43 are arranged on the shell 40 at intervals, so as to improve the cooling efficiency of the indoor air.

[0062] The advantages of the above-mentioned heat dissipation duct c structure are that it meets the shortest duct distance and has low wind resistance, effectively increases the air volume of the hot air duct, optimally reduces wind resistance, and promptly and effectively discharges the heat generated by the semiconductor refrigeration plate 30.

[0063] The cold air duct distribution of the wind field of the whole machine, the wind enters the inner cavity of the unit shell through the return air port 1 and the return air port 2. Due to the radiator end cover B and the baffle, the wind passes through the outer channel of the radiator component, enters the centrifugal fan blades at the fan component 2, and finally is discharged from the exhaust port B. This wind field is equipped with two return air ports, which on the one hand effectively increases the return air area, and on the other hand avoids the situation where only one return air port causes different wind resistance due to different wind channel path lengths, and uneven air volume distribution between each fin, affecting the performance of the unit. Furthermore, one of the return air ports 1 and 2 of the unit is connected to the outdoors through a pipe. At this time, the unit can achieve fresh air.

[0064] The unit is equipped with an optional air guide cover, which can achieve a 90° reversal of the exhaust direction of the exhaust port A. When the unit is installed on a ceiling that has been suspended or there are already ventilation system pipes on the ceiling, this air guide cover can be removed to exhaust the hot air upward and send it into the pipe. When the hot air of the unit needs to be discharged to the outside, this air guide cover can be selected to achieve the reversal of the exhaust direction, which is conducive to the discharge of the hot air of the unit to the outside.

[0065] like Figure 1 and Figure 2 As shown in FIG. 1 , as an optional embodiment, the hot air return port 41 is located at the side of the housing 40, and the heat dissipation duct c is horizontally arranged in the housing 40. Preferably, the hot air exhaust port 42 is located at the top of the housing 40 to comply with the principle that hot air flows upward, thereby effectively removing the hot air flow. More preferably, the cold air exhaust port 44 is provided with a sweeping component 441, thereby providing a wider air supply range indoors. Preferably, as Fig.15As shown, in the technical solution of this embodiment, an air guide cover is also installed on the hot air exhaust port 42, which can realize vertical upward exhaust of air and 90° turning, which is conducive to the discharge of hot air from the unit to the outside.

[0066] like Figure 7 and Figure 8 As shown, as an optional embodiment, there are multiple cooling heat exchangers 20, and the multiple cooling heat exchangers 20 are respectively installed on the outside of the heat dissipation base 11. This method only requires the multiple cooling heat exchangers 20 to be assembled with the base 11 respectively. It is convenient to disassemble and assemble, easy to clean, and the heat can also be effectively and evenly transferred and balanced with each other, so that the temperature difference of each cooling heat exchanger 20 is not too large, avoiding the situation where the temperature of the heating side corresponding to the individual cooling heat exchanger 20 is too high and the efficiency is reduced. Optionally, the installation method can be to connect the cooling heat exchanger 20 and the heat dissipation base 11 with bolts. As a preferred embodiment, the heat dissipation base 11 is in the shape of a polygonal prism, including multiple connected side surfaces, and the multiple cooling heat exchangers 20 are respectively installed on multiple side surfaces through the cooling base 21.

[0067] In the technical solution of this embodiment, the heat dissipation substrate 11 is in the shape of an octagonal prism. As other optional implementations, the heat dissipation substrate 11 may also be in the shape of a quadrangular prism, a hexagonal prism, or a decagonal prism. As other optional implementations, the heat dissipation substrate 11 may also be in the shape of a column of other structures, such as a cylindrical shape and an elliptical column shape, which is related to the shape of the semiconductor cooling sheet 30 and the shape of the cooling heat exchanger 20. The cooling substrate 21 is in the shape of a strip that matches the heat dissipation substrate 11.

[0068] As another optional embodiment, the cooling heat exchanger 20 can also be one, which is directly mounted on the outside of the heat dissipation base 11. Compared with the above embodiment, this embodiment is only more complicated to install, but can also achieve the above effect of improving the working efficiency of the semiconductor heat exchanger.

[0069] like Fig. 9 and Fig.10 As shown, the semiconductor heat exchanger also includes a heat-conducting fin 13, and the heat-conducting fin 13 is used to connect with all of the multiple heat-dissipating fins 12. When the semiconductor heat exchanger is in normal use, the area where the semiconductor heat exchanger fits with the semiconductor refrigeration sheet 30 is relatively limited. Although the heat dissipation substrate 11 can transfer heat, there will still be a situation where some of the heat in the multiple heat-dissipating fins 12 is relatively concentrated. Therefore, by connecting the heat-conducting fin 13 with all of the multiple heat-dissipating fins 12, the heat on the heat-dissipating fins 12 with relatively concentrated heat can be transferred to other heat-dissipating fins 12 with the help of the heat-conducting fins 13, so that the heat distribution is more uniform, thereby improving the uniformity of heat dissipation as a whole. It should be noted that the heat-conducting fins 13 themselves can also participate in heat dissipation.

[0070] As another optional implementation, the heat conducting fins 13 may be connected to only some of the heat dissipating fins 12 , which can also make the heat distribution more uniform and improve the heat dissipation uniformity as a whole.

[0071] like Fig.11 and Fig.12 As shown, the heat conducting fins 13 are supported in the first direction inside the heat dissipation base 11. In this way, the heat conducting fins 13 can be used to support the heat dissipation duct c. More preferably, the semiconductor heat exchanger also includes support fins 14, which are arranged in the second direction inside the heat dissipation base 11. Similarly, the support fins 14 also play a role in supporting the heat dissipation duct c. It should be noted that the support fins 14 themselves can also participate in heat dissipation. In the technical solution of this embodiment, the first direction is Figure 4 The longitudinal direction is shown, and the second direction is Figure 4 The lateral direction shown. Optionally, in the technical solution of this embodiment, a plurality of heat dissipation ribs 12 are also arranged in the lateral direction, and the support ribs 14 are located between the plurality of heat dissipation ribs 12. Preferably, there are a plurality of support ribs 14, which are arranged at intervals in the longitudinal direction. Optionally, the support ribs 14 are located between the plurality of heat dissipation ribs 12. Preferably, there are a plurality of support ribs 40, which are arranged at intervals in the longitudinal direction.

[0072] It should be noted that, in addition to Figure 4 The longitudinal direction and the transverse direction shown, the first direction and the second direction may also be directions at other angles. In the technical solution of the present invention, the description of the transverse and longitudinal directions is for the purpose of clearly and briefly explaining the present solution in conjunction with the drawings, and is not intended to limit the technical solution of the present invention in terms of the direction of use.

[0073] In the technical solution of this embodiment, multiple heat dissipation ribs 12 and / or heat conductive ribs 13 and / or support ribs 14 extend along the ventilation direction of the heat dissipation duct c to reduce the obstruction of the heat dissipation ribs 20, heat conductive ribs 30 or support ribs 40 to the air flow in the heat dissipation duct c11.

[0074] like Figure 2 As shown, optionally, on the cross section of the heat dissipation substrate 11, the heat conducting fins 13 are located in the middle of the heat dissipation duct c. Preferably, there are multiple heat conducting fins 30, and the multiple heat conducting fins 30 are arranged at intervals in the lateral direction. It should be noted that the middle is not limited to the middle position, and those skilled in the art can set it according to the shape of the heat dissipation duct c, and it is not necessarily the middle position.

[0075] like Fig.13As shown, as an optional embodiment, a mounting portion 15 is formed on the outside of the heat dissipation substrate 11, and the semiconductor cooling sheet 30 is mounted on the mounting portion 15, and then the heat dissipation heat exchanger 20 is connected to the heat dissipation substrate 11. As another optional embodiment, a mounting portion can also be opened on the heat dissipation substrate 21, and the semiconductor cooling sheet 30 can be installed between the two mounting portions.

[0076] In the technical solution of this embodiment, there are multiple semiconductor cooling sheets 30, and the multiple semiconductor cooling sheets 30 are arranged at intervals between the heat dissipation heat exchanger 10 and the cooling heat exchanger 20. This has the advantage that the multiple semiconductor cooling sheets 30 can work relatively independently. When one semiconductor cooling sheet 30 is damaged, it does not affect the work of other semiconductor cooling sheets 30, so that the semiconductor heat exchanger can still be used. As another optional implementation, a large semiconductor cooling sheet can also be used to replace the above-mentioned multiple semiconductor cooling sheets 30.

[0077] Optionally, in the technical solution of this embodiment, the semiconductor air conditioner further includes an electrical box, which is installed in the housing 40, and the functional components of the semiconductor air conditioner can be controlled through the electrical box.

[0078] like Fig.15 As shown, the semiconductor air conditioner is installed on the wall e, located below the ceiling g, and a wind guide cover is installed on the hot air exhaust port 42, which can turn the exhaust air 90 degrees, which is conducive to the exhaust of hot air outdoors and convenient for installation. Fig.14 As shown, the semiconductor air conditioner is installed on the wall e, below the ceiling f. There is no air guide cover on the hot air exhaust vent 42. The hot air exhaust vent 42 can be directly connected to the existing range hood duct in the kitchen, flush with the ceiling f, and neat and beautiful after installation.

[0079] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the embodiments of the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor air conditioner, characterized in that: include A shell (40), wherein the shell (40) is provided with a hot air return port (41), a hot air exhaust port (42), a cold air return port (43) and a cold air exhaust port (44); a hot air channel (a) and a cold air channel (b) are formed in the shell (40); the hot air return port (41) and the hot air exhaust port (42) are respectively connected to the hot air channel (a), and the cold air return port (43) and the cold air exhaust port (44) are respectively connected to the cold air channel (b); A semiconductor heat exchanger is arranged in the shell (40), the semiconductor heat exchanger comprises a heat dissipation heat exchanger (10), a cooling heat exchanger (20) and a semiconductor cooling sheet (30), the heat dissipation heat exchanger (10) comprises a duct-shaped heat dissipation substrate (11) and a plurality of heat dissipation fins (12), the interior of the heat dissipation substrate (11) forms a heat dissipation air duct (c), the plurality of heat dissipation fins (12) are arranged in the heat dissipation air duct (c), the cooling heat exchanger (20) comprises a cooling substrate (21) and a plurality of cooling fins (22), a first side of the cooling substrate (21) is in contact with the exterior of the heat dissipation substrate (11), the plurality of cooling fins (22) are arranged on a second side of the cooling substrate (21), and the semiconductor cooling sheet (30) is installed between the heat dissipation heat exchanger (10) and the cooling heat exchanger (20); The air inlet of the heat dissipation air duct (c) and the air outlet of the heat dissipation air duct (c) are respectively connected to the hot air return port (41) and the hot air exhaust port (42) through the hot air channel (a), and the heat dissipation heat exchanger (20) is located in the cold air channel (b); The hot air exhaust port (42) is located at the top of the shell (40); There are a plurality of cold air return vents (43), and the plurality of cold air return vents (43) are arranged on the housing (40) at intervals; There are two cold air return ports (43), which are arranged at the top of the shell (40) and the side of the shell (40) respectively; a baffle (45) is also provided in the shell (40) and is opposite to the cold air return ports (43) on the side of the shell (40); The semiconductor heat exchanger further comprises: an outer cover (50), the outer cover (50) covering the outside of the cooling heat exchanger (20), and forming a cooling air duct (d) between the outer cover (50) and the heat dissipation heat exchanger (10); The hot air channel (a) comprises: A hot air inlet section (a1), connected between the air inlet of the heat dissipation air duct (c) and the hot air return outlet (41); A hot air outlet section (a2) connected between the air outlet of the heat dissipation air duct (c) and the hot air exhaust port (42); The semiconductor heat exchanger also includes: An air outlet end cover (70), the air outlet end cover (70) being mounted on the second end of the outer cover (50), the air outlet end cover (70) being formed with a hot air outlet end connected to the air outlet of the heat dissipation air duct (c), the hot air outlet end forming at least a portion of the hot air outlet section (a2), and the air outlet end cover (70) being further formed with a cold air inlet end connected to the cold air dissipation air duct (d).

2. The semiconductor air conditioner according to claim 1, characterized in that: The air inlet of the heat dissipation air duct (c) is opposite to the hot air return air duct (41), and the extension direction of the heat dissipation air duct (c) is consistent with the air inlet direction of the hot air return air duct (41).

3. The semiconductor air conditioner according to claim 1, characterized in that: The hot air channel (a) further comprises: a hot air blower component (a3), wherein the hot air blower component (a3) ​​is installed on the hot air inlet section (a1) or the hot air outlet section (a2).

4. The semiconductor air conditioner according to claim 1, characterized in that: The airflow direction in the cooling air duct (d) is opposite to the airflow direction in the heat dissipating air duct (c).

5. The semiconductor air conditioner according to claim 4, characterized in that: The semiconductor heat exchanger also includes: An air inlet end cover (60), the air inlet end cover (60) being mounted on the first end of the outer cover (50), the air inlet end cover (60) being formed with a hot air inlet end connected to the air inlet of the heat dissipation air duct (c), the hot air inlet end forming at least a portion of the hot air inlet section (a1), and the air inlet end cover (60) being further formed with a cold air outlet end connected to the heat dissipation air duct (d).

6. The semiconductor air conditioner according to claim 5, characterized in that: The cold air inlet end and / or the cold air outlet end include a plurality of cold air openings connected to the cold air dissipation duct (d).

7. The semiconductor air conditioner according to claim 5, characterized in that: The air inlet end cover (60) is provided with a wind shielding structure (61) that matches the interior of the shell (40); the cold air inlet end is located on a first side of the wind shielding structure (61); and the cold air outlet end is located on a second side of the wind shielding structure (61).

8. The semiconductor air conditioner according to claim 7, characterized in that: The cold air passage (b) further comprises a cold air blower component (b1), and the cold air blower component (b1) is installed on the second side of the wind shielding structure (61) in the shell (40).

9. The semiconductor air conditioner according to claim 1, characterized in that: The hot air return port (41) is located at a side of the shell (40), and the heat dissipation duct (c) is horizontally arranged in the shell (40).

10. The semiconductor air conditioner according to claim 1, characterized in that: The cold air outlet (44) is provided with an air sweeping component (441).

11. The semiconductor air conditioner according to claim 1, characterized in that: There are a plurality of cooling heat exchangers (20), and the plurality of cooling heat exchangers (20) are respectively installed outside the cooling substrate (11).

12. The semiconductor air conditioner according to claim 11, characterized in that: The heat dissipation matrix (11) is columnar, and the cooling matrix (21) is strip-shaped and compatible with the heat dissipation matrix (11).

13. The semiconductor air conditioner according to claim 12, characterized in that: The heat dissipation base (11) is in the shape of a polygonal column and comprises a plurality of connected side surfaces, and a plurality of the heat dissipation exchangers (20) are respectively mounted on the plurality of side surfaces via the heat dissipation base (21).

14. The semiconductor air conditioner according to claim 1, characterized in that: The heat dissipation heat exchanger (10) further comprises heat-conducting fins (13), wherein the heat-conducting fins (13) are used to be connected to part or all of the plurality of heat dissipation fins (12).

15. The semiconductor air conditioner according to claim 14, characterized in that: The heat-conducting fins (13) are supported in a first direction inside the duct-shaped heat dissipation substrate (11), and the semiconductor heat exchanger further comprises support fins (14), wherein the support fins (14) are arranged in a second direction inside the duct-shaped heat dissipation substrate (11).

16. The semiconductor air conditioner according to claim 15, characterized in that: The plurality of heat dissipation fins (12), the heat conduction fins (13), and the support fins (14) extend along the ventilation direction of the heat dissipation air duct (c).

17. The semiconductor air conditioner according to claim 1, characterized in that: The plurality of cooling fins (22) extend along the length direction of the cooling base (21).

18. The semiconductor air conditioner according to claim 1, characterized in that: A mounting portion (15) is formed on the outside of the heat dissipation substrate (11), and the semiconductor cooling sheet (30) is mounted on the mounting portion (15).

19. The semiconductor air conditioner according to claim 1, characterized in that: There are a plurality of semiconductor refrigeration sheets (30), and the plurality of semiconductor refrigeration sheets (30) are arranged at intervals between the heat dissipation heat exchanger (10) and the cooling heat exchanger (20).

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