Rotating wheel, electroplating spraying mechanism and rotary electroplating device
By using rotating wheels and electroplating spraying mechanisms in electroplating technology, the balance between the potion flow rate and the electroplating area is achieved, and the problems of uneven boundaries of the gold area and waste of gold are solved, reducing costs and increasing production capacity.
Patent Information
- Application Number
- CN202010440625.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-05-22
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2040-05-22
AI Technical Summary
The existing brush plating technology is difficult to balance the flow rate of the potion with the electroplating area, resulting in uneven boundaries of the gold area, and there are problems of waste of gold and high costs.
The rotating wheel is used to limit the fluid flow and adjust the injection position. The electroplating area of the potion is accurately controlled through the flow limiting holes on the rotating wheel. Combined with the electroplating spraying mechanism and the rotating electroplating device, large-flow electroplating and potion reflux are achieved, saving potion.
The balance between the potion flow rate and the electroplating area is achieved, reducing gold waste, reducing costs, increasing production capacity, and neatly connecting the gold area.
Smart Images

Figure CN111455422B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of electroplating, and in particular to a rotating wheel, an electroplating liquid spraying mechanism and a rotary electroplating device. Background Art
[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics. The outer layer of many coins is also electroplated. The development of electroplating technology has become a very important modern processing technology today. It has long been more than just a means of metal surface protection and decoration, although protective and decorative electroplating still accounts for a large proportion of electroplating processing. The functional uses of electroplating are becoming more and more extensive, especially in the fields of electronics, communications, military industry, aerospace, etc., where functional electroplating technology is widely used.
[0003] When electroplating terminal products, different product customers have different requirements for the gold-plated area. The existing technology uses a brush station for brush plating. The brush station includes a cover head and a brush cloth. During the electroplating process, the cover head is wrapped with a brush cloth, and the solution is applied from the cover head. The cover head is used as the anode and the terminal is used as the cathode for electroplating. During the brush plating process, in order to meet the customer's requirement for sufficient film thickness at the gold measuring point, the customer originally only needs a 1mm gold measuring point film thickness, but the gold area must be plated with more than 2mm to meet the requirement of sufficient film thickness at the gold measuring point, resulting in a waste of gold and greatly increasing the cost. In addition, in order to control the electroplating area by brush plating, it is necessary to control the flow of the solution. If the flow of the solution is too large, the gold area becomes larger and the cost increases. If the flow is too small, the exchange of the electroplating solution is not good, causing the gold to burn and the efficiency is low. In order to control the gold cost, electroplating is often carried out in a small flow and low production speed, with low production capacity. In addition, for customers with appearance requirements, complaints are often received about the uneven boundaries of the gold area. Summary of the invention
[0004] In view of the above-mentioned deficiencies of the prior art, the present invention aims to solve the problem that the existing brush plating is difficult to achieve a balance between the flow rate of the chemical solution and the electroplating area; and the boundary of the gold area is not neat.
[0005] In order to solve this technical problem, on the one hand, the present invention proposes:
[0006] A rotating wheel is used to limit fluid flow and adjust the fluid injection position, including a rotating mold body and a first spacer ring, a fixed ring, a second spacer ring, a water outlet ring, and a water retaining ring sequentially mounted thereon, the rotating mold body is provided with flow holes in the radial direction, the water outlet ring is provided with flow limiting holes, the flow holes are aligned with the flow limiting holes, the first spacer ring adjusts the position of the fixed ring, the second spacer ring adjusts the position of the water outlet ring, the second spacer ring and the water retaining ring block the fluid on both sides of the water outlet ring.
[0007] The above-mentioned rotating wheel holds the material strip tightly against the flow limiting hole of the rotating wheel, and the ejected fluid is electroplated on the material strip through the flow limiting hole, which accurately defines the electroplating area of the fluid, does not cause waste of gold, and saves gold costs; and the rotating wheel is used to control the electroplating area, and there is no need to control the electroplating area by flow rate, so a large flow of fluid can be used for electroplating, which solves the balance problem between the fluid flow rate and the electroplating area and greatly improves production capacity; the material strip is tightly against the flow limiting hole, and the distance from the fluid ejected from the flow limiting hole to the material strip for electroplating is very short, and the divergence is very small, so that the boundary of the gold area is very neat.
[0008] Furthermore, sealing rings are provided on both sides of the flow limiting hole on the water outlet ring, so that the fluid is not easy to leak out from the gap between the water outlet ring and the material belt, and the sealing ring is made of room temperature vulcanized silicone rubber.
[0009] Furthermore, the fixing ring is provided with protruding particles, which are used to be stuck in the grooves or holes of the material belt, so that the material belt is not easy to slip on the rotating wheel.
[0010] On the other hand, the present invention also proposes an electroplating liquid spraying mechanism for spraying liquid onto the material strip, comprising: the rotating wheel as described above, further comprising an anode water bag, a liquid spraying block and a reflux tank, the liquid spraying block is provided with a liquid spraying port, the liquid spraying block is fixedly mounted on the anode water bag, the anode water bag is fixedly provided with a shaft, the rotating wheel is rotatably sleeved on the shaft and covers the liquid spraying port, the rotating wheel can rotate around the liquid spraying port, the liquid spraying port is used to spray liquid onto the material strip; the liquid that is not sprayed onto the material strip flows back to the reflux tank through the inner wall of the rotating wheel, and the liquid in the reflux tank flows back into the anode water bag. The liquid that is not sprayed onto the material strip is collected by the reflux tank and flows into the anode water bag, which saves liquid and does not generate waste, thereby greatly reducing the cost of electroplating.
[0011] Furthermore, the spray block is fan-shaped. The fan-shaped structure allows the sprayed medicine to be at a relatively even distance from the material belt.
[0012] On the other hand, the present invention also proposes a rotary electroplating device, including the electroplating liquid spraying mechanism as described above, and also including a base and a material belt tensioning device, wherein the electroplating liquid spraying mechanism is fixedly mounted on the base, and the material belt tensioning device is fixedly mounted on the base, and the material belt is pressed against the circumferential surface of the rotating wheel through the material belt tensioning device. The material belt tensioning device makes the material belt press against the flow limiting hole of the rotating wheel, so that the liquid can be plated on the material belt evenly and uniformly.
[0013] Furthermore, the material belt tensioning device includes a plurality of material belt guide wheels, the central axes of which are fixed on the base, and the material belt is pressed against the circumferential surface of the rotating wheel through the plurality of material belt guide wheels.
[0014] Furthermore, the rotary electroplating device further comprises a belt pressing mechanism, the belt pressing mechanism comprises a belt and a belt guide wheel, the central axes of the plurality of belt guide wheels are fixed on the base, the belt passes over the belt guide wheel and presses the material belt against the circumferential surface of the rotating wheel. The belt presses the material belt against the circumferential surface of the rotating wheel, so that the material belt can be close to the rotating wheel without slipping, thereby making the electroplating layer uniform, and the belt can also prevent the liquid medicine from being sprayed out from the hole of the material belt.
[0015] Furthermore, the belt pressing mechanism comprises a belt tensioning wheel which can be slidably adjusted in a direction perpendicular to the belt to adjust the tightness of the belt so that the belt can maintain a tight state on the material belt.
[0016] The rotating mold body is rotationally connected to the shaft on the anode water bag through a bearing, and the positional relationship between the rotating mold body and the spray water block remains fixed. The fixed ring is used to fix the material strip on the rotating wheel. The position of the fixed ring is adjusted by first spacer rings of different specifications to meet the fixation of different material strips on the fixed ring. The position of the water outlet ring is adjusted by second spacer rings of different specifications to ensure that the position of the water outlet ring is always aligned with the flow limiting hole on the rotating mold body. The size of the water outlet area is adjusted by water outlet rings of different specifications to electroplate areas of different sizes on the material strip. The first spacer ring, the second spacer ring and the water outlet ring are used in coordination to meet the electroplating needs of different material strips.
[0017] Compared with the prior art, the present invention has the following beneficial effects:
[0018] 1. The rotary electroplating device is used to accurately control the flow rate through the flow-limiting holes on the rotating wheel. Compared with the existing technology of using a brush table for brush plating with a small flow rate and low production speed, it greatly improves work efficiency and saves manpower and time.
[0019] 2. The material strip is close to the current limiting hole. After the solution is sprayed out from the current limiting hole, the distance from electroplating to the material strip is very short, and the divergence is very small, making the boundary of the gold area very neat.
[0020] 3. The belt presses the material belt against the circumferential surface of the rotating wheel so that the material belt can stick to the rotating wheel without slipping, and the belt can also prevent the medicine from spraying out from the holes of the material belt.
[0021] 4. The reflux tank collects the liquid medicine that has not been sprayed onto the material belt and flows it into the anode water bag, which saves the liquid medicine, avoids waste and greatly reduces the cost of electroplating.
[0022] 5. The first spacer ring, the second spacer ring and the water outlet ring are used in combination to meet the electroplating requirements of different material strips.
[0023] 6. The entire mechanism has a simple and reliable structure and strong applicability, which has greatly promoted the development of electroplating technology. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a schematic diagram of the planar structure of the present invention;
[0025] Figure 2 It is a cross-sectional view of the electroplating liquid spraying mechanism of the present invention;
[0026] Figure 3 It is a schematic diagram of the three-dimensional structure of the rotating wheel of the present invention.
[0027] Reference numerals:
[0028] 1- Base;
[0029] 2-electroplating water spraying mechanism, 2a-water spraying port, 21-rotating wheel, 211-rotating mold body, 2111-positioning step, 212-first spacer ring, 213-fixing ring, 2131-protruding particles, 214-second spacer ring, 215-water outlet ring, 216-water retaining ring, 217-sealing ring, 21a-limiting hole, 21b-circulation hole, 22-anode water bag, 23-water spraying block, 24-reflow groove, 25-axis;
[0030] 3- belt tensioning device, 31- belt guide wheel;
[0031] 4-belt pressing mechanism, 41-belt, 42-belt guide wheel, 43-belt tensioning wheel;
[0032] 100-Tape. DETAILED DESCRIPTION
[0033] The embodiments of the technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and are therefore only used as examples, and the protection scope of the present invention cannot be limited thereto. In the description of the present invention application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred parts or structures must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0034] See also Figure 1 The rotary electroplating device provided in this embodiment performs electroplating by using the material strip 100 as the cathode and the chemical solution as the anode, and includes: a base 1, an electroplating chemical solution spraying mechanism 2 and a material strip tensioning device 3.
[0035] Please also read Figure 2 and Figure 3 The electroplating water spraying mechanism 2 is fixed on the base 1, and the electroplating water spraying mechanism 2 has a water spraying port 2a for spraying water onto the material strip 100; a rotating wheel 21 rotating around the water spraying port 2a is provided outside the water spraying port 2a, and a flow limiting hole 21a is provided on the rotating wheel 21, and the water can be sprayed onto the material strip 100 through the flow limiting hole 21a. In this embodiment, the electroplating water spraying mechanism 2 further includes an anode water bag 22, a water spraying block 23 and a reflux groove 24, a water spraying port 2a is provided on the water spraying block 23, the water spraying block 23 is fixedly provided on the anode water bag 22, the anode water bag 22 is fixedly provided on the base 1 and a shaft 25 is fixedly provided on the anode water bag 22, a rotating wheel 21 is rotatably sleeved on the shaft 25 and covers the water spraying port 2a, the water that is not sprayed onto the material belt 100 flows back to the reflux groove 24 through the inner wall of the rotating wheel 21, and the water in the reflux groove 24 flows back into the anode water bag 22. Specifically, the water spraying block 23 is fan-shaped, and the fan-shaped structure makes the distance between the sprayed water and the material belt 100 relatively uniform. The water that is not sprayed onto the material belt 100 is collected by the reflux groove 24 and flows into the anode water bag 22, which saves the water and does not generate waste, thereby greatly reducing the cost of electroplating.
[0036] See also Figure 3 The rotating wheel 21 includes a rotating mold body 211 and a first spacer ring 212, a fixing ring 213, a second spacer ring 214, a water outlet ring 215, and a water retaining ring 216 which are sequentially sleeved thereon.
[0037] The rotating mold body 211 is provided with flow holes 21b in the radial direction. Specifically, the flow holes 21b are arranged in the radial direction of the rotating mold body 211 and are evenly distributed on the circumference of the rotating mold body 211. The rotating mold body 211 is rotatably connected to the shaft 25 on the anode water bag 22 through a bearing, and the positional relationship between the rotating mold body 211 and the spray water block 23 remains fixed. A positioning step 2111 is provided on the rotating mold body 211 away from the flow holes 21b.
[0038] The first spacer ring 212 is used to adjust the position of the fixing ring 213. The position of the fixing ring 213 is adjusted by first spacer rings 212 of different specifications to meet the fixation of different material strips 100 on the fixing ring 213. Specifically, the first spacer ring 212 is sleeved on the rotating mold body 211 and one end surface of the first spacer ring 212 abuts against the positioning step 2111 on the rotating mold body 211.
[0039] The fixing ring 213 is used to fix the material strip 100 on the rotating wheel 21. Specifically, the fixing ring 213 is provided with protruding particles 2131, and the protruding particles 2131 on the fixing ring 213 are used to be stuck in the grooves or holes of the material strip 100, so that the material strip 100 is not easy to slip on the rotating wheel 21. The fixing ring 213 is sleeved on the rotating mold body 211 and one end face of the fixing ring 213 abuts against the other end face of the first spacer ring 212.
[0040] The second spacer ring 214 is used to adjust the position of the water outlet ring 215, and the water outlet ring 215 is provided with a limited flow hole 21a. The position of the water outlet ring 215 is adjusted by second spacer rings 214 of different specifications to ensure that the position of the limited flow hole 21a on the water outlet ring 215 is always aligned with the flow hole 21b on the rotating mold body 211. The second spacer ring 214 is sleeved on the rotating mold body 211 and one end face of the second spacer ring 214 abuts against the other end face of the fixed ring 213.
[0041] The flow limiting holes 21a are arranged along the radial direction of the water outlet ring 215 and are evenly distributed on the circumference of the water outlet ring 215. Sealing rings 217 are also provided on both sides of the flow limiting holes 21a of the water outlet ring 215. The sealing rings 217 are provided on both sides of the flow limiting holes 21a so that the liquid medicine is not easy to seep out from the gap between the water outlet ring 215 and the material strip 100. The material of the sealing ring 217 is room temperature vulcanized silicone rubber. The flow hole 21b is aligned with the flow limiting hole 21a. The size of the liquid medicine outlet area is adjusted by using water outlet rings 215 of different specifications to electroplate areas of different sizes on the material strip 100. The water outlet ring 215 is sleeved on the rotating mold body 211 and one end face of the water outlet ring 215 abuts against the other end face of the second spacing ring 214.
[0042] The water retaining ring 216 and the second spacer ring 214 retain the liquid on both sides of the water outlet ring 215. The water retaining ring 216 is sleeved on the rotating mold body 211 and one end surface of the water retaining ring 216 abuts against the other end surface of the water outlet ring 215.
[0043] The first spacer ring 212 , the second spacer ring 214 and the water outlet ring 215 are used in coordination to meet the electroplating requirements of different material strips 100 .
[0044] The above-mentioned rotating wheel 21 is not limited to the field of electroplating technology, but can also be widely used in the field of fluid spraying technology, such as air spraying and atomization spraying. When using this rotating wheel 21, it is only necessary to fix the spray port in the rotating wheel 21, and place the material to be sprayed close to the flow limiting hole 21a. The material to be sprayed drives the rotating wheel 21 to rotate, and the spray port sprays the paint at the same time, so that the spraying line can be uniform and neat, and there is no need to control the spraying area by controlling the flow rate, which greatly improves the spraying efficiency.
[0045] The material belt tensioning device 3 includes a plurality of material belt guide wheels 31, the central axes of which are fixed on the base 1. The material belt 100 is pressed against the circumferential surface of the rotating wheel 21 through the plurality of material belt guide wheels 31, so that the area to be plated on the material belt 100 is aligned with the flow limiting hole 21a. During electroplating, the material belt 100 moves forward under the guidance of the material belt guide wheels 31, and the rotating wheel 21 is driven to rotate with the assistance of the fixing ring 213, so that the liquid sprayed from the flow limiting hole 21a is evenly sprayed on the area to be plated on the material belt 100.
[0046] The rotary electroplating device further includes a belt pressing mechanism 4, which includes a belt 41 and a belt guide wheel 42. The central axes of the plurality of belt guide wheels 42 are fixed on the base 1. The belt 41 passes over the belt guide wheel 42 and presses the material belt 100 against the circumferential surface of the rotating wheel 21. The belt 41 presses the material belt 100 against the circumferential surface of the rotating wheel 21, so that the material belt 100 can be close to the rotating wheel 21 without slipping, thereby making the electroplating layer uniform, and the belt 41 can also prevent the liquid medicine from being ejected from the hole or groove of the material belt 100, and make the liquid medicine flow back to the reflux groove 24 along the inner wall of the rotating wheel 21, and then flow back to the anode water bag 22, so that the liquid medicine is not wasted.
[0047] The belt pressing mechanism may also be provided with a belt tensioning wheel 43. Specifically, the belt tensioning wheel 43 can be slidably adjusted in a direction perpendicular to the belt 41 to adjust the tightness of the belt 41, so that the belt 41 always maintains a tight state on the material belt 100, so that the material belt 100 always closely rests on the rotating wheel 21.
[0048] Please also read Figure 1-Figure 3 The working process of the above rotary electroplating device is specifically as follows:
[0049] Assemble the rotating wheel 21: Check the electroplating drawing, find the gold-plated measuring point according to the electroplating drawing, and assemble the rotating wheel 21 according to the gold-plated measuring point. During the assembly process, it is necessary to select a suitable water outlet ring 215, and adjust the first spacer ring 212 and the second spacer ring 214 at the same time, so that the material strip 100 can be easily fixed on the fixing ring 213, and the gold-plated measuring point is aligned with the flow limiting hole 21a of the water outlet ring 215, and the flow limiting hole 21a of the water outlet ring 215 is not covered, and finally cover the water retaining ring 216 and lock the screws.
[0050] Electroplating: Insert the assembled rotating wheel 21 onto the shaft 25 of the anode water bag 22, select the material belt guide wheel 31 suitable for the width of the material belt 100 and install it on the base 1, and lift it into the gold groove of the machine to connect the medicine pipe. Use the material belt guide wheel 31 to tightly attach the material belt 100 to the circumferential surface of the rotating wheel 21 facing the medicine spraying port 2a, so that the material belt 100 is close to the flow limiting hole 21a, and then press the belt 41 against the outside of the material belt 100, adjust the belt tensioning wheel 43, so that the belt 41 always keeps the material belt 100 in a tight state, and adjust the tightness of the belt 41 to prevent the medicine from leaking. Then turn on the pump in the anode water bag 22, and turn on the current of the material belt 100 and the medicine, and then drive the material belt 100 to move at a constant speed, and the material belt 100 drives the rotating wheel 21 to rotate, and at the same time drives the belt 41 to move. The medicine is sprayed out from the medicine spray port 2a of the medicine spray block 23, passes through the flow hole 21b, and is precisely controlled by the flow limiting hole 21a to electroplate a certain amount of the medicine sprayed onto the material belt 100. The medicine that is not sprayed onto the material belt 100 flows back to the reflux groove 24 through the inner wall of the rotating wheel 21, and the medicine in the reflux groove 24 flows back to the anode water bag 22.
[0051] The liquid medicine sprayed by the electroplating liquid medicine spraying mechanism 2 is electroplated on the material strip 100 through the flow limiting hole 21a, and the flow rate of the liquid medicine is accurately controlled, and the coating is uniform and beautiful. Compared with the prior art that uses a brush table for brush plating with a small flow rate and a low production speed, the rotary electroplating device performs electroplating in a large flow rate. Due to the fast liquid medicine exchange speed, the electroplating efficiency is improved, which saves manpower and time, solves the problem of product burning, and improves production capacity. Moreover, in the products of the rotary electroplating method, if the customer needs a 1mm gold measuring point film thickness, only a 1.5mm gold area is needed to meet the requirement of the gold measuring point film thickness, which greatly saves gold costs; the material strip 100 is close to the flow limiting hole 21a, and the liquid medicine is sprayed out from the flow limiting hole 21a The distance from the material strip 100 to the electroplating strip 100 is very short, and the divergence is very small, so that the boundary of the gold zone is very neat; the belt 41 presses the material strip 100 against the circumferential surface of the rotating wheel 21, so that the material strip 100 can be close to the rotating wheel 21 without slipping, and the belt 41 can also prevent the liquid medicine from being sprayed out from the holes of the material strip 100; the reflux groove 24 collects the liquid medicine that is not sprayed onto the material strip 100 and flows it into the anode water bag 22, which saves the liquid medicine, does not generate waste, and greatly reduces the cost of electroplating; through the coordinated use of the first spacer ring 212, the second spacer ring 214 and the water outlet ring 215, the electroplating of different material strips 100 can be met; the entire device has a simple and reliable structure and strong applicability, which greatly promotes the development of electroplating technology.
[0052] It should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some or all of the technical features thereof may be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and specification of the present invention.
Claims
1. A rotating wheel for limiting fluid flow and adjusting fluid injection position, characterized in that: It includes a rotating mold body and a first spacer ring, a fixed ring, a second spacer ring, a water outlet ring, and a water retaining ring which are sequentially mounted thereon. The rotating mold body is provided with a flow hole in the radial direction, the water outlet ring is provided with a flow limiting hole, the flow hole is aligned with the flow limiting hole, sealing rings are provided on both sides of the flow limiting hole on the water outlet ring, the first spacer ring adjusts the position of the fixed ring, the second spacer ring adjusts the position of the water outlet ring, the second spacer ring and the water retaining ring block the fluid on both sides of the water outlet ring; the fixed ring is provided with protruding particles, the protruding particles are used to be stuck in the grooves or holes of the material belt, so that the material belt is not easy to slip on the rotating wheel.
2. An electroplating liquid spraying mechanism, used to spray liquid onto a material strip, characterized in that: include: The rotating wheel as claimed in claim 1, further comprising an anode water bag, a spraying water block and a reflux tank, the spraying water block is provided with a spraying water port, the spraying water block is fixedly mounted on the anode water bag, the anode water bag is fixedly provided with a shaft, the rotating wheel is rotatably sleeved on the shaft and covers the spraying water port, the rotating wheel can rotate around the spraying water port, and the spraying water port is used to spray medicine onto the material belt; The liquid medicine that is not sprayed onto the material belt flows back to the reflux groove through the inner wall of the rotating wheel, and the liquid medicine in the reflux groove flows back to the anode water bag.
3. The electroplating water spraying mechanism according to claim 2, characterized in that: The spray water block is fan-shaped.
4. A rotary electroplating device, characterized in that: It comprises the electroplating spray mechanism as described in claim 2 or 3, and also comprises a base and a material belt tensioning device, wherein the electroplating spray mechanism is fixed on the base, and the material belt tensioning device is fixed on the base, and the material belt is abutted against the circumferential surface of the rotating wheel through the material belt tensioning device.
5. The rotary electroplating device according to claim 4, characterized in that: The material belt tensioning device includes a plurality of material belt guide wheels, the central axes of which are fixed on the base, and the material belt is pressed against the circumferential surface of the rotating wheel through the plurality of material belt guide wheels.
6. The rotary electroplating device according to claim 4, characterized in that: It also includes a belt pressing mechanism, which includes a belt and a belt guide wheel. The central axes of the multiple belt guide wheels are fixed on the base. The belt passes around the belt guide wheels and presses the material belt against the circumferential surface of the rotating wheel.
7. The rotary electroplating device according to claim 6, characterized in that: The belt pressing mechanism comprises a belt tensioning wheel.
Citation Information
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