Data acquisition module with internal communication and burning functions

Abstract

The present invention discloses a data acquisition module with internal communication and burning functions, comprising a main control module, a communication extension module, a communication isolation module, a high-voltage side data acquisition module, a high-voltage side battery current equalization module, a high-voltage side program burning module, a low-voltage side data acquisition module, a low-voltage side battery current equalization module and a low-voltage side program burning module; the present invention can save resources of the communication interface in the main control module, and in addition, through the setting of the communication isolation module, the communication isolation module can realize isolation between the high-voltage side data acquisition module and the communication extension module, and further, it can bring convenience to the burning of the programs of the high-voltage side data acquisition module and the low-voltage side data acquisition module.

Description

Technical Field

[0001] The invention relates to the technical field of lithium battery management systems, and in particular to a data acquisition module with internal communication and burning functions. Background Art

[0002] The low-voltage side data acquisition module and the high-voltage side data acquisition module in the current lithium battery management system communicate independently with the main control module through the IIC bus. As a result, the low-voltage side data acquisition module and the high-voltage side data acquisition module will occupy more communication interfaces in the main control module, thereby wasting the resources of the communication interface in the main control module; in addition, the low-voltage side data acquisition module and the high-voltage side data acquisition module in the current lithium battery management system need to be burned independently when burning the program, which has the disadvantage of being troublesome in program burning. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a data acquisition module with internal communication and burning functions. Through the setting of a communication extension module, the high-voltage side data acquisition module and the low-voltage side data acquisition module are both electrically connected to the communication extension module, and the communication extension module is electrically connected to the main control module. In this way, the high-voltage side data acquisition module and the low-voltage side data acquisition module can achieve the purpose of time-sharing communication between the communication extension module and the main control module, thereby saving the resources of the communication interface in the main control module. In addition, through the setting of a communication isolation module, the communication isolation module can achieve isolation between the high-voltage side data acquisition module and the communication extension module, that is, it can improve the security of the internal communication module. Furthermore, when the programmer burns the program into the main control module, the main control module can automatically burn the corresponding program into the high-voltage side data acquisition module and the low-voltage side data acquisition module respectively through the high-voltage side program burning module and the low-voltage side program burning module. In this way, it can bring convenience to the burning of the programs of the high-voltage side data acquisition module and the low-voltage side data acquisition module.

[0004] The data acquisition module with internal communication and burning functions of the present invention comprises a main control module, a communication extension module, a communication isolation module, a high-voltage side data acquisition module, a high-voltage side battery current equalizing module, a high-voltage side program burning module, a low-voltage side data acquisition module, a low-voltage side battery current equalizing module and a low-voltage side program burning module, the communication extension module, the high-voltage side program burning module and the low-voltage side program burning module are all electrically connected to the main control module, the high-voltage side data acquisition module is electrically connected to the communication extension module through the communication isolation module, the low-voltage side data acquisition module is electrically connected to the communication extension module, the high-voltage side battery current equalizing module and the high-voltage side program burning module are both electrically connected to the high-voltage side data acquisition module, and the low-voltage side battery current equalizing module and the low-voltage side program burning module are both electrically connected to the low-voltage side data acquisition module.

[0005] The data acquisition module with internal communication and burning functions of the present invention comprises an IIC expansion chip U14, resistors R218, R280, R281, R283, R291, R292, R279, R217, R282, and a capacitor C128; pins 2, 1, and 7 of the IIC expansion chip U14 are electrically connected to a ground terminal GND_M, pins 13, 12, 11, and 3 of the IIC expansion chip U14 are respectively connected in series with resistors R283, R280, R218, and R281, and then electrically connected to a power supply terminal V3.3; pins 13, 12, and 3 of the IIC expansion chip U14 are respectively connected in series with resistors R283, R280, R218, and R281, and then electrically connected to a power supply terminal V3.3; pins 13, 12, and All 3 pins are electrically connected to the main control module, the 14th pin of the IIC expansion chip U14 is electrically connected to the power supply terminal V3.3, the 14th pin of the IIC expansion chip U14 is electrically connected to the ground terminal GND_M after being connected in series with capacitor C128, the 13th pin and the 12th pin of the IIC expansion chip U14 are respectively connected in series with resistors R291 and R292, and then electrically connected to the 9th pin and the 10th pin of the IIC expansion chip U14, the 9th pin, the 10th pin and the 8th pin of the IIC expansion chip U14 are respectively connected in series with resistors R279, resistors R217 and resistor R282, and then electrically connected to the power supply terminal V3.3, and the low-voltage side data acquisition module is electrically connected to the 9th pin and the 10th pin of the IIC expansion chip U14.

[0006] The data acquisition module with internal communication and burning functions of the present invention comprises an IIC isolation chip U4, resistors R86, R84, R87, R85, R286, capacitors C25, C7, pins 7 and 6 of the IIC isolation chip U4 are electrically connected to the high-voltage side data acquisition module, pins 7 and 6 of the IIC isolation chip U4 are respectively connected in series with resistors R84 and R86 and then electrically connected to a power supply terminal C3V3, pin 8 of the IIC isolation chip U4 is electrically connected to the power supply terminal C3V3, pin 8 of the IIC isolation chip U4 is connected in series with capacitor C25 and then electrically connected to a ground terminal GND_S, and pin 5 of the IIC isolation chip U4 is connected to a ground terminal GND_S. The pin 1 of the IIC isolation chip U4 is electrically connected to the power supply terminal V3.3, the pin 1 of the IIC isolation chip U4 is electrically connected to the ground terminal GND_M after being connected in series with the capacitor C7, the pins 2 and 3 of the IIC isolation chip U4 are electrically connected to the power supply terminal V3.3 after being connected in series with the resistor R87 and the resistor R85, the pins 2 and 3 of the IIC isolation chip U4 are electrically connected to the pins 5 and 6 of the IIC extension chip U14 respectively, one end of the resistor R286 is electrically connected to the power supply terminal V3.3, and the other end of the resistor R286 is electrically connected to the pin 4 of the IIC extension chip U14.

[0007] The data acquisition module with internal communication and burning functions of the present invention, wherein the high-voltage side program burning module includes field effect tubes Q4, Q41, triode Q30, optical coupler U21, diode D27, voltage regulator diode ZD3, resistors R336, R330, R215, R1, R272, R271, R173, R273, capacitors C207, C206, C118; the positive electrode of the diode D27 is electrically connected to the main control module, and the negative electrode of the diode D27 is electrically connected to the main control module. The first pin is connected in series with the resistor R336 and then electrically connected to the 1st pin of the optocoupler U21. The 2nd pin of the optocoupler U21 is electrically connected to the ground terminal GND_M. The two ends of the capacitor C207 are electrically connected to the 1st and 2nd pins of the optocoupler U21 respectively. The 4th pin of the optocoupler U21 is electrically connected to the power supply terminal C3V3. The 3rd pin of the optocoupler U21 is electrically connected to the ground terminal GND_S. The two ends of the capacitor C206 are electrically connected to the 4th and 3rd pins of the optocoupler U21 respectively. The 3rd pin of the optocoupler U21 is connected in series with the resistor R215 and then electrically connected to the field effect The gate of the field effect transistor Q4 is electrically connected, the gate of the field effect transistor Q4 is connected in series with the resistor R1 and then electrically connected to the ground terminal GND_S, the drain of the field effect transistor Q4 is electrically connected to the ground terminal GND_S, the source of the field effect transistor Q4 is electrically connected to the gate of the field effect transistor Q41, the source of the field effect transistor Q4 is connected in series with the resistor R271 and then electrically connected to the high-voltage side data acquisition module, the source of the field effect transistor Q41 and the collector of the transistor Q30, the base of the transistor Q30 is connected in series with the resistor R173 and then electrically connected to the field effect transistor Q41. The drain of transistor Q41 is electrically connected, the base of transistor Q30 is connected in series with resistor R272 and then electrically connected to the ground terminal GND_S, the emitter of transistor Q30 is connected in series with capacitor C118 and then electrically connected to the ground terminal GND_S, both ends of resistor R273 are electrically connected to the emitter of transistor Q30 and the high-voltage side data acquisition module respectively, the cathode of Zener diode ZD3 is electrically connected to the high-voltage side data acquisition module, and the anode of Zener diode ZD3 is electrically connected to the ground terminal GND_S.

[0008] The data acquisition module with internal communication and burning functions of the present invention, wherein the low-voltage side program burning module includes field effect tubes Q43, Q44, triode Q46, voltage stabilizing diode ZD4, resistors R216, R123, R182, R179, R176, R274, and capacitor C119; the gate of the field effect tube Q43 is connected in series with the resistor R216 and then electrically connected to the main control module, the gate of the field effect tube Q43 is connected in series with the resistor R123 and then electrically connected to the ground terminal GND_M, the drain of the field effect tube Q43 is connected in series with the ground terminal GND_M, the source of the field effect tube Q43 is connected in series with the resistor R179 and then electrically connected to the low-voltage side The data acquisition module, the source of the field effect transistor Q44 and the collector of the transistor Q46 are electrically connected, the base of the transistor Q46 is connected in series with the resistor R176 and then electrically connected to the drain of the field effect transistor Q44, the base of the transistor Q46 is connected in series with the resistor R182 and then electrically connected to the ground terminal GND_M, the emitter of the transistor Q46 is connected in series with the capacitor C119 and then electrically connected to the ground terminal GND_M, the emitter of the transistor Q46 is connected in series with the resistor R274 and then electrically connected to the low-voltage side data acquisition module, the cathode of the Zener diode ZD4 is electrically connected to the low-voltage side data acquisition module, and the anode of the Zener diode ZD4 is electrically connected to the ground terminal GND_M.

[0009] The present invention sets a communication extension module, and the high-voltage side data acquisition module and the low-voltage side data acquisition module are both electrically connected to the communication extension module, and the communication extension module is electrically connected to the main control module. In this way, the high-voltage side data acquisition module and the low-voltage side data acquisition module can achieve the purpose of time-sharing communication between the communication extension module and the main control module, thereby saving the resources of the communication interface in the main control module. In addition, through the setting of the communication isolation module, the communication isolation module can achieve isolation between the high-voltage side data acquisition module and the communication extension module, that is, it can improve the security of the internal communication module. Furthermore, when the programmer burns the program into the main control module, the main control module can automatically burn the corresponding program into the high-voltage side data acquisition module and the low-voltage side data acquisition module respectively through the high-voltage side program burning module and the low-voltage side program burning module. In this way, it can bring convenience to the burning of the programs of the high-voltage side data acquisition module and the low-voltage side data acquisition module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0011] Figure 1 It is a circuit principle block diagram of the present invention;

[0012] Figure 2 This is the circuit schematic diagram of the main control module;

[0013] Figure 3 This is the circuit schematic diagram of the communication expansion module;

[0014] Figure 4 This is the circuit schematic diagram of the high-voltage side data acquisition module;

[0015] Figure 5 This is the circuit schematic diagram of the communication isolation module;

[0016] Figure 6 This is the circuit schematic diagram of the low-voltage side data acquisition module;

[0017] Figure 7 This is the circuit schematic diagram of the high-voltage side program burning module;

[0018] Figure 8 This is the circuit schematic diagram of the low-voltage side program burning module. DETAILED DESCRIPTION

[0019] The following will disclose multiple embodiments of the present invention with drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these practical details are not necessary. In addition, for the purpose of simplifying the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0020] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0021] The data acquisition module with internal communication and burning functions of the present invention comprises a main control module 1, a communication expansion module 2, a communication isolation module 3, a high-voltage side data acquisition module 4, a high-voltage side battery current equalization module 5, a high-voltage side program burning module 6, a low-voltage side data acquisition module 7, a low-voltage side battery current equalization module 8 and a low-voltage side program burning module 9, wherein the communication expansion module 2, the high-voltage side program burning module 6 and the low-voltage side program burning module 9 are all electrically connected to the main control module 1, the high-voltage side data acquisition module 4 is electrically connected to the communication expansion module 2 through the communication isolation module 3, the low-voltage side data acquisition module 7 is electrically connected to the communication expansion module 2, the high-voltage side battery current equalization module 5 and the high-voltage side program burning module 6 are all electrically connected to the high-voltage side data acquisition module 4, and the low-voltage side battery current equalization module 8 and the low-voltage side program burning module 9 are all electrically connected to the low-voltage side data acquisition module 7; the present invention adopts the setting of the communication expansion module, the high-voltage side The data acquisition module and the low-voltage side data acquisition module are both electrically connected to the communication extension module, and the communication extension module is electrically connected to the main control module. In this way, the high-voltage side data acquisition module and the low-voltage side data acquisition module can achieve the purpose of time-sharing communication between the communication extension module and the main control module, thereby saving the resources of the communication interface in the main control module. In addition, through the setting of the communication isolation module, the communication isolation module can achieve isolation between the high-voltage side data acquisition module and the communication extension module, that is, it can improve the security of the internal communication module. Furthermore, when the programmer burns the program into the main control module, the main control module can automatically burn the corresponding program into the high-voltage side data acquisition module and the low-voltage side data acquisition module through the high-voltage side program burning module and the low-voltage side program burning module respectively. In this way, it can bring convenience to the burning of the programs of the high-voltage side data acquisition module and the low-voltage side data acquisition module.

[0022] The communication expansion module 2 includes an IIC expansion chip U14, resistors R218, R280, R281, R283, R291, R292, R279, R217, R282, and a capacitor C128; pins 2, 1, and 7 of the IIC expansion chip U14 are electrically connected to the ground terminal GND_M, and pins 13, 12, 11, and 3 of the IIC expansion chip U14 are electrically connected to the power supply terminal V3.3 after being connected in series with resistors R283, R280, R218, and R281, respectively. Pins 13, 12, and 3 of the IIC expansion chip U14 are electrically connected to the main control module 1. Pin 14 of the IIC expansion chip U14 is electrically connected to the power supply terminal V3.3, pin 14 of the IIC expansion chip U14 is connected in series with capacitor C128 and then electrically connected to the ground terminal GND_M, pins 13 and 12 of the IIC expansion chip U14 are respectively connected in series with resistors R291 and R292 and then electrically connected to pins 9 and 10 of the IIC expansion chip U14, pins 9, 10 and 8 of the IIC expansion chip U14 are respectively connected in series with resistors R279, R217 and R282 and then electrically connected to the power supply terminal V3.3, and the low-voltage side data acquisition module 7 is electrically connected to pins 9 and 10 of the IIC expansion chip U14.

[0023] The communication isolation module 3 includes an IIC isolation chip U4, resistors R86, R84, R87, R85, R286, capacitors C25, C7, and the 7th and 6th pins of the IIC isolation chip U4 are electrically connected to the high-voltage side data acquisition module 4. The 7th and 6th pins of the IIC isolation chip U4 are respectively connected in series with resistors R84 and R86 and then electrically connected to the power supply terminal C3V3. The 8th pin of the IIC isolation chip U4 is electrically connected to the power supply terminal C3V3. The 8th pin of the IIC isolation chip U4 is connected in series with capacitor C25 and then electrically connected to the ground terminal GND_S. The 5th pin of the IIC isolation chip U4 is electrically connected to the ground terminal GND_S. II Pin 4 of the C isolation chip U4 is electrically connected to the ground terminal GND_M, pin 1 of the IIC isolation chip U4 is electrically connected to the power supply terminal V3.3, pin 1 of the IIC isolation chip U4 is electrically connected to the ground terminal GND_M after being connected in series with capacitor C7, pins 2 and 3 of the IIC isolation chip U4 are respectively connected in series with resistors R87 and resistor R85 and are electrically connected to the power supply terminal V3.3, pins 2 and 3 of the IIC isolation chip U4 are respectively electrically connected to pins 5 and 6 of the IIC extension chip U14, one end of the resistor R286 is electrically connected to the power supply terminal V3.3, and the other end of the resistor R286 is electrically connected to pin 4 of the IIC extension chip U14.

[0024] The high-voltage side program burning module 6 includes field effect transistors Q4, Q41, transistor Q30, optical coupler U21, diode D27, voltage regulator diode ZD3, resistors R336, R330, R215, R1, R272, R271, R173, R273, capacitors C207, C206, C118; the positive electrode of the diode D27 is electrically connected to the main control module 1, and the negative electrode of the diode D27 is connected in series with the resistor R336 and then connected to the 1 of the optical coupler U21 Pin 1 of the optocoupler U21 is electrically connected to the ground terminal GND_M, both ends of the capacitor C207 are electrically connected to pin 1 and pin 2 of the optocoupler U21 respectively, pin 4 of the optocoupler U21 is electrically connected to the power supply terminal C3V3, pin 3 of the optocoupler U21 is electrically connected to the ground terminal GND_S, both ends of the capacitor C206 are electrically connected to pin 4 and pin 3 of the optocoupler U21 respectively, pin 3 of the optocoupler U21 is connected in series with resistor R215 and then electrically connected to the gate of the field effect tube Q4, and the field effect The gate of the transistor Q4 is connected in series with the resistor R1 and then electrically connected to the ground terminal GND_S. The drain of the field effect transistor Q4 is electrically connected to the ground terminal GND_S. The source of the field effect transistor Q4 is electrically connected to the gate of the field effect transistor Q41. The source of the field effect transistor Q4 is connected in series with the resistor R271 and then electrically connected to the high-voltage side data acquisition module 4, the source of the field effect transistor Q41 and the collector of the transistor Q30. The base of the transistor Q30 is connected in series with the resistor R173 and then electrically connected to the drain of the field effect transistor Q41. The base of the transistor Q30 is electrically connected to the transistor Q30, the base of the transistor Q30 is connected in series with the resistor R272 and then electrically connected to the ground terminal GND_S, the emitter of the transistor Q30 is connected in series with the capacitor C118 and then electrically connected to the ground terminal GND_S, the two ends of the resistor R273 are electrically connected to the emitter of the transistor Q30 and the high-voltage side data acquisition module 4 respectively, the cathode of the Zener diode ZD3 is electrically connected to the high-voltage side data acquisition module 4, and the anode of the Zener diode ZD3 is electrically connected to the ground terminal GND_S.

[0025] The low-voltage side program burning module 9 includes field effect tubes Q43, Q44, a triode Q46, a voltage regulator diode ZD4, resistors R216, R123, R182, R179, R176, R274, and a capacitor C119; the gate of the field effect tube Q43 is connected in series with the resistor R216 and then electrically connected to the main control module 1, the gate of the field effect tube Q43 is connected in series with the resistor R123 and then electrically connected to the ground terminal GND_M, the drain of the field effect tube Q43 is connected in series with the ground terminal GND_M, the source of the field effect tube Q43 is connected in series with the resistor R179 and then electrically connected to the low-voltage side data acquisition module 7, the field effect tube Q The source of 44 is electrically connected to the collector of the transistor Q46, the base of the transistor Q46 is connected in series with the resistor R176 and then electrically connected to the drain of the field effect transistor Q44, the base of the transistor Q46 is connected in series with the resistor R182 and then electrically connected to the ground terminal GND_M, the emitter of the transistor Q46 is connected in series with the capacitor C119 and then electrically connected to the ground terminal GND_M, the emitter of the transistor Q46 is connected in series with the resistor R274 and then electrically connected to the low-voltage side data acquisition module 7, the cathode of the Zener diode ZD4 is electrically connected to the low-voltage side data acquisition module 7, and the anode of the Zener diode ZD4 is electrically connected to the ground terminal GND_M.

[0026] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. Data acquisition module with internal communication and burning functions, characterized by: The invention comprises a main control module (1), a communication expansion module (2), a communication isolation module (3), a high-voltage side data acquisition module (4), a high-voltage side battery current equalization module (5), a high-voltage side program burning module (6), a low-voltage side data acquisition module (7), a low-voltage side battery current equalization module (8) and a low-voltage side program burning module (9), wherein the communication expansion module (2), the high-voltage side program burning module (6) and the low-voltage side program burning module (9) are all electrically connected to the main control module (1), the high-voltage side data acquisition module (4) is electrically connected to the communication expansion module (2) through the communication isolation module (3), the low-voltage side data acquisition module (7) is electrically connected to the communication expansion module (2), the high-voltage side battery current equalization module (5) and the high-voltage side program burning module (6) are both electrically connected to the high-voltage side data acquisition module (4), and the low-voltage side battery current equalization module (8) and the low-voltage side program burning module (9) are both electrically connected to the low-voltage side data acquisition module (7); The communication expansion module (2) comprises an IIC expansion chip U14, resistors R218, R280, R281, R283, R291, R292, R279, R217, R282, and a capacitor C128; pins 2, 1, and 7 of the IIC expansion chip U14 are all electrically connected to the ground terminal GND_M, pins 13, 12, 11, and 3 of the IIC expansion chip U14 are respectively connected in series with resistor R283, resistor R280, resistor R218, and resistor R281, and then electrically connected to the power supply terminal V3.3; pins 13, 12, and 3 of the IIC expansion chip U14 are all electrically connected to the main control module (1), The pin 14 of the IIC expansion chip U14 is electrically connected to the power supply terminal V3.3, the pin 14 of the IIC expansion chip U14 is connected in series with a capacitor C128 and then electrically connected to the ground terminal GND_M, the pins 13 and 12 of the IIC expansion chip U14 are connected in series with a resistor R291 and a resistor R292 respectively and then electrically connected to the pins 9 and 10 of the IIC expansion chip U14, the pins 9, 10 and 8 of the IIC expansion chip U14 are connected in series with a resistor R279, a resistor R217 and a resistor R282 respectively and then electrically connected to the power supply terminal V3.3, and the low-voltage side data acquisition module (7) is electrically connected to the pins 9 and 10 of the IIC expansion chip U14; The communication isolation module (3) comprises an IIC isolation chip U4, resistors R86, R84, R87, R85, R286, capacitors C25, C7, pin 7 and pin 6 of the IIC isolation chip U4 are both electrically connected to the high-voltage side data acquisition module (4), pin 7 and pin 6 of the IIC isolation chip U4 are respectively connected in series with resistor R84 and resistor R86 and then electrically connected to the power supply terminal C3V3, pin 8 of the IIC isolation chip U4 is electrically connected to the power supply terminal C3V3, pin 8 of the IIC isolation chip U4 is connected in series with capacitor C25 and then electrically connected to the ground terminal GND_S, pin 5 of the IIC isolation chip U4 is electrically connected to the ground terminal GND_S, and the Pin 4 of the IIC isolation chip U4 is electrically connected to the ground terminal GND_M, pin 1 of the IIC isolation chip U4 is electrically connected to the power supply terminal V3.3, pin 1 of the IIC isolation chip U4 is electrically connected to the ground terminal GND_M after being connected in series with capacitor C7, pins 2 and 3 of the IIC isolation chip U4 are electrically connected to the power supply terminal V3.3 after being connected in series with resistors R87 and resistor R85, respectively, pins 2 and 3 of the IIC isolation chip U4 are electrically connected to pins 5 and 6 of the IIC extension chip U14, respectively, one end of the resistor R286 is electrically connected to the power supply terminal V3.3, and the other end of the resistor R286 is electrically connected to pin 4 of the IIC extension chip U14.

2. The data acquisition module with internal communication and burning functions according to claim 1 is characterized in that: The high-voltage side program burning module (6) comprises field effect transistors Q4 and Q41, a transistor Q30, an optical coupler U21, a diode D27, a voltage stabilizing diode ZD3, resistors R336, R330, R215, R1, R272, R271, R173, R273, and capacitors C207, C206, and C118; the positive electrode of the diode D27 is electrically connected to the main control module (1), and the negative electrode of the diode D27 is connected in series with the resistor R336 and then electrically connected to the 1st pin of the optical coupler U21. The 2nd foot of the optical coupler U21 is electrically connected to the ground terminal GND_M, the two ends of the capacitor C207 are electrically connected to the 1st foot and the 2nd foot of the optical coupler U21 respectively, the 4th foot of the optical coupler U21 is electrically connected to the power supply terminal C3V3, the 3rd foot of the optical coupler U21 is electrically connected to the ground terminal GND_S, the two ends of the capacitor C206 are electrically connected to the 4th foot and the 3rd foot of the optical coupler U21 respectively, the 3rd foot of the optical coupler U21 is connected in series with the resistor R215 and then is electrically connected to the gate of the field effect tube Q4, the field effect The gate of the transistor Q4 is connected in series with a resistor R1 and then electrically connected to the ground terminal GND_S; the drain of the field effect transistor Q4 is electrically connected to the ground terminal GND_S; the source of the field effect transistor Q4 is electrically connected to the gate of the field effect transistor Q41; the source of the field effect transistor Q4 is connected in series with a resistor R271 and then electrically connected to the high-voltage side data acquisition module (4), the source of the field effect transistor Q41 and the collector of the triode Q30; the base of the triode Q30 is connected in series with a resistor R173 and then electrically connected to the drain of the field effect transistor Q41. The base of the transistor Q30 is connected in series with the resistor R272 and then electrically connected to the ground terminal GND_S. The emitter of the transistor Q30 is connected in series with the capacitor C118 and then electrically connected to the ground terminal GND_S. The two ends of the resistor R273 are respectively electrically connected to the emitter of the transistor Q30 and the high-voltage side data acquisition module (4). The cathode of the voltage zener diode ZD3 is electrically connected to the high-voltage side data acquisition module (4), and the anode of the voltage zener diode ZD3 is electrically connected to the ground terminal GND_S.

3. The data acquisition module with internal communication and burning functions according to claim 1 is characterized in that: The low-voltage side program burning module (9) comprises field effect transistors Q43, Q44, a triode Q46, a voltage stabilizing diode ZD4, resistors R216, R123, R182, R179, R176, R274, and a capacitor C119; the gate of the field effect transistor Q43 is connected in series with the resistor R216 and then electrically connected to the main control module (1); the gate of the field effect transistor Q43 is connected in series with the resistor R123 and then electrically connected to the ground terminal GND_M; the drain of the field effect transistor Q43 is connected in series with the ground terminal GND_M; the source of the field effect transistor Q43 is connected in series with the resistor R179 and then electrically connected to the low-voltage side data acquisition module (7), the field effect transistor Q The source of transistor Q44 is electrically connected to the collector of transistor Q46, the base of transistor Q46 is connected in series with resistor R176 and then electrically connected to the drain of field effect transistor Q44, the base of transistor Q46 is connected in series with resistor R182 and then electrically connected to the ground terminal GND_M, the emitter of transistor Q46 is connected in series with capacitor C119 and then electrically connected to the ground terminal GND_M, the emitter of transistor Q46 is connected in series with resistor R274 and then electrically connected to the low-voltage side data acquisition module (7), the cathode of voltage stabilizing diode ZD4 is electrically connected to the low-voltage side data acquisition module (7), and the anode of voltage stabilizing diode ZD4 is electrically connected to the ground terminal GND_M.

Images