A TEC high and low temperature impact testing machine

Abstract

The present invention discloses a TEC high and low temperature impact tester, comprising a cooling and heat dissipation mechanism, a semiconductor cooling sheet and a controller, wherein the cooling and heat dissipation mechanism is used to dissipate heat from the hot surface of the semiconductor cooling sheet, and comprises a variable frequency compressor, a condenser and an evaporator, wherein the hot surface of the semiconductor cooling sheet is in contact with the evaporator, and the cold surface of the semiconductor cooling sheet is in contact with the heat conducting plate, wherein the controller is electrically connected to the semiconductor cooling sheet and the variable frequency compressor, and controls the positive and negative poles and voltage of the semiconductor cooling sheet and the cooling capacity of the variable frequency compressor through the received system parameters. The present invention is simple to operate, small in size, and low in power consumption, and can realize testing of chip performance, and during the test, both pressure and temperature can be effectively controlled.

Description

Technical Field

[0001] The invention relates to a TEC high and low temperature impact testing machine, belonging to the technical field of semiconductor refrigeration. Background Art

[0002] Most traditional mechanical refrigeration equipment uses Freon refrigeration, but Freon refrigeration is polluting. In addition, mechanical refrigeration has defects such as large size, many system parts, high power consumption, the need to add refrigerant (coolant), and limited refrigeration limit temperature. Therefore, in some high-end manufacturing fields, mechanical refrigeration can no longer meet industrial requirements.

[0003] At present, with the development of semiconductor refrigeration technology, the use of semiconductor refrigeration chips for refrigeration has gradually become widely used. Semiconductor refrigeration chips rely on direct current to absorb and release heat at both ends of the thermocouple to achieve the purpose of cooling and heating, which meets environmental protection requirements. During the operation of the semiconductor refrigeration chip, its cold end releases the cold into the refrigeration chamber of the refrigeration equipment through the cold end radiator, and the hot end needs to dissipate the heat to the outside through the hot end radiator. However, the heat dissipation capacity of the hot end radiator directly affects the cold production and refrigeration efficiency of the semiconductor during actual use. Therefore, current semiconductor refrigeration equipment has problems such as poor heat dissipation performance, low refrigeration stability and efficiency, low controllability, and cannot be directly applied in specific fields, such as chip performance testing. Summary of the invention

[0004] The object of the present invention is to provide a TEC high and low temperature impact testing machine with low power consumption, small size, energy saving and high controllability.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a TEC high and low temperature impact testing machine, including a cooling and heat dissipation mechanism, a semiconductor refrigeration plate and a controller, the cooling and heat dissipation mechanism is used to dissipate the heat of the hot surface of the semiconductor refrigeration plate, and it includes a variable frequency compressor, a condenser and an evaporator, the hot surface of the semiconductor refrigeration plate is in contact with the evaporator, and the cold surface of the semiconductor refrigeration plate is in contact with the heat conduction plate. The controller is electrically connected to the semiconductor refrigeration plate and the variable frequency compressor, and it controls the positive and negative poles and voltage of the semiconductor refrigeration plate and the cooling capacity of the variable frequency compressor through the received system parameters.

[0006] Furthermore, the refrigeration device also includes a pressure actuator, the telescopic end of the pressure actuator is connected to the evaporator, and drives the evaporator to move and then drives the semiconductor refrigeration plate and the heat conduction plate to perform telescopic movement.

[0007] Furthermore, the evaporator, the semiconductor cooling plate and the heat conducting plate are connected to each other to form a modular combination structure.

[0008] Furthermore, the refrigeration device includes a main unit and a refrigeration output end, the main unit is mainly composed of a variable frequency compressor, a condenser, a controller, a PLC board, and a power supply, and the refrigeration output end is mainly composed of a pressure actuator, an evaporator, a semiconductor refrigeration sheet and a heat conduction plate.

[0009] Furthermore, the host and the refrigeration output end are connected by an integrated hose, and a refrigerant input pipe, a refrigerant output pipe and electric wires are arranged in the integrated hose.

[0010] Furthermore, the pressure actuator includes a cylinder and a pressure transmitter, and the pressure transmitter is connected to the controller. After receiving the pressure value control signal from the controller, the pressure transmitter controls the cylinder to perform an action, and feeds back the pressure value after the action is performed to the controller.

[0011] Furthermore, a butt joint is provided at the front end of the pressure actuator, and the butt joint is clamped and fixed to a fixture for mounting the object to be tested.

[0012] Furthermore, a temperature sensor is provided on the heat conducting plate, and a mounting hole for mounting the temperature sensor is opened on the heat conducting plate.

[0013] Furthermore, the variable frequency compressor is provided with a motor, the motor is connected to the frequency converter, the frequency converter is connected to the controller, and the controller controls the rotation speed of the motor through the frequency converter.

[0014] Furthermore, a drying filter and a throttling device are provided on the pipeline between the condenser and the evaporator, and a fan is provided on the condenser to help the coolant dissipate heat.

[0015] The beneficial effects of the present invention are as follows: the TEC high and low temperature impact testing machine is simple to operate, small in size, low in power consumption, and energy-saving and environmentally friendly; it can test chip performance, and during the test process, both pressure and temperature can be effectively controlled.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural principle diagram of the present invention.

[0018] Figure 2 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 3 It is a schematic diagram of the internal structure of the host of the present invention.

[0020] Figure 4 It is a schematic diagram of the structure of the external refrigeration output end of the present invention.

[0021] The markings in the figure are: 1- frequency conversion compressor, 2- condenser, 3- drying filter, 4- throttling device evaporator, 5- evaporator, 6- semiconductor refrigeration plate, 7- heat conduction plate, 8- controller, 9- frequency converter, 10- relay, 11- PLC board, 12- air pressure proportional valve, 13- 5V power supply, 14- 24V power supply, 15- 12V power supply, 16- cylinder, 17- temperature sensor, A- host, B- refrigeration output end. DETAILED DESCRIPTION

[0022] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] like Figures 1 to 4 As shown, a TEC high and low temperature impact tester includes a cooling and heat dissipation mechanism, a pressure actuator, a semiconductor cooling sheet 6 and a controller 8. The cooling and heat dissipation mechanism is used to dissipate the heat of the hot surface of the semiconductor cooling sheet 6. The cooling and heat dissipation mechanism adopts a general mechanical refrigeration device, which is mainly composed of a variable frequency compressor 1, a condenser 2, an evaporator 5, a drying filter 3 and a throttling device 4; the hot surface of the semiconductor cooling sheet 6 is in contact with the evaporator 5, and the cold surface of the semiconductor cooling sheet 6 is in contact with the heat conducting plate 7. The telescopic end of the pressure actuator is connected to the evaporator 5, and drives the evaporator 5 to move and then drives the semiconductor cooling sheet 6 and the heat conducting plate 7 to perform telescopic movement together. Among them, the variable frequency compressor 1, the condenser 2, the controller 8, the PLC board 11, the air pressure proportional valve 12, the power supply, the display screen and other components constitute the host A of the device, the pressure actuator, the evaporator 5, the semiconductor cooling sheet 6 and the heat conducting plate 7 constitute the refrigeration output end B arranged outside the host A, and the host A and the refrigeration output end B are connected by an integrated hose, and the integrated hose is provided with a refrigerant input pipe, a refrigerant output pipe and a wire. The controller 8 is electrically connected to the semiconductor refrigeration chip 6 and the variable frequency compressor 1 , and the controller 8 controls the positive and negative poles and voltage of the semiconductor refrigeration chip 6 and the cooling capacity of the variable frequency compressor 1 through the received system parameters.

[0024] In this embodiment, the evaporator 5, the semiconductor cooling plate 6 and the heat conducting plate 7 are connected to each other to form a modular combination structure.

[0025] In this embodiment, the pressure actuator includes a cylinder 16 and a pressure transmitter, and the pressure transmitter is connected to the controller 8. The pressure transmitter controls the cylinder 16 to perform an action after receiving a pressure value control signal from the controller 8, and feeds back the pressure value after the action is performed to the controller 8. A butt joint is provided at the front end of the pressure actuator, and the butt joint is fixed to a fixture for mounting the object to be tested.

[0026] In this embodiment, a temperature sensor 17 is disposed on the heat conducting plate 7 , and a mounting hole for mounting the temperature sensor 17 is opened on the heat conducting plate 7 .

[0027] In this embodiment, the variable frequency compressor 1 is provided with a motor, the motor is connected to the frequency converter 9, the frequency converter 9 is connected to the controller 8, and the controller 8 controls the speed of the motor through the frequency converter 9. The condenser 2 is provided with a fan to help the coolant dissipate heat.

[0028] The working principle of the present invention is as follows: first, the object to be tested is installed in a specific fixture, and then the butt joint at the front end of the pressure actuator is fixed to the fixture by clamping, and then the positive and negative poles of the semiconductor refrigeration plate 6, the voltage, the cooling temperature and the pressure executed by the pressure actuator are set. The controller 8 controls which side of the semiconductor refrigeration plate 6 is heated and which side is cooled by controlling the positive and negative poles of the semiconductor refrigeration plate 6, and controls the stability of the cooling temperature of the semiconductor refrigeration plate 6 by controlling the value of the voltage. After the refrigeration plate is powered on, one side is heated and the other side is cooled. The lower the cooling temperature of the hot side, the lower the temperature produced by the cold side. In addition, the controller 8 controls the expansion and contraction of the cylinder 16 through the pressure transmitter, thereby adjusting the pressure value between the heat conduction mechanism and the object to be tested, such as the surface of the chip; and the controller 8 also controls the speed of the compressor motor through the inverter 9.

[0029] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the above embodiments do not limit the protection scope of the present invention in any form, and all technical solutions obtained by equivalent replacement and the like fall within the protection scope of the present invention.

[0030] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.

Claims

1. A TEC high and low temperature impact tester, It is characterized in that It includes a cooling and heat dissipation mechanism, a semiconductor cooling sheet and a controller. The cooling and heat dissipation mechanism is used to dissipate heat from the hot surface of the semiconductor cooling sheet. It includes a variable frequency compressor, a condenser and an evaporator. The hot surface of the semiconductor cooling sheet is in contact with the evaporator, and the cold surface of the semiconductor cooling sheet is in contact with the heat conducting plate. The controller is electrically connected to the semiconductor cooling sheet and the variable frequency compressor. It controls the positive and negative poles and voltage of the semiconductor cooling sheet and the cooling capacity of the variable frequency compressor through the received system parameters. The testing machine also includes a pressure actuator, the telescopic end of the pressure actuator is connected to the evaporator, and by driving the evaporator to move, the semiconductor refrigeration plate and the heat conduction plate are driven to perform telescopic movement; the pressure actuator includes a cylinder and a pressure transmitter, and the pressure transmitter is connected to the controller. After receiving the pressure value control signal of the controller, the pressure transmitter controls the cylinder to perform an action, and feeds back the pressure value after the action is performed to the controller; the front end of the pressure actuator is provided with a docking joint, and the docking joint is clamped and fixed to the fixture used to install the object to be tested.

2. The TEC high and low temperature impact testing machine according to claim 1, It is characterized in that The evaporator, the semiconductor refrigeration sheet and the heat conducting plate are connected to each other to form a modular combined structure.

3. The TEC high and low temperature impact testing machine according to claim 1, It is characterized in that The testing machine is mainly composed of two major components: a main unit and a refrigeration output end. The main unit is mainly composed of a variable frequency compressor, a condenser, a controller, a PLC board, and a power supply. The refrigeration output end is mainly composed of a pressure actuator, an evaporator, a semiconductor refrigeration sheet, and a heat conduction plate.

4. The TEC high and low temperature impact testing machine according to claim 3, It is characterized in that The host and the refrigeration output end are connected via an integrated hose, in which a refrigerant input pipe, a refrigerant output pipe and electric wires are arranged.

5. The TEC high and low temperature impact testing machine according to claim 1, It is characterized in that The heat conducting plate is provided with a temperature sensor, and the heat conducting plate is provided with a mounting hole for mounting the temperature sensor.

6. The TEC high and low temperature impact testing machine according to claim 1, It is characterized in that The variable frequency compressor is provided with a motor, the motor is connected to a frequency converter, the frequency converter is connected to a controller, and the controller controls the rotation speed of the motor through the frequency converter.

7. The TEC high and low temperature impact testing machine according to claim 1, It is characterized in that A drying filter and a throttling device are arranged on the pipeline between the condenser and the evaporator, and a fan is arranged on the condenser to help the coolant dissipate heat.

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