Laser head module of laser lift-off device

A laser peeling and laser head technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as the increase in the price of the overall equipment, the increase in operating time, the pollution of the substrate welding liquid, etc., to prevent thermal damage from burning or melting , Improve the effect of temperature deviation

CN111531280AInactive Publication Date: 2020-08-14LASERSSEL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2020-08-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The laser head module of the laser stripping device is used for selectively melting welding positions of more than one electronic component arranged on a substrate to strip the electronic component from the substrate, and is characterized by comprising an annular shell, a laser head, a laser head and a laser head, an optical lens module which is provided inside the housing and enlarges or reducesa light beam generated from the laser oscillator; a fixing bracket coupled to the outer peripheral surface of the housing; a jig member coupled to the outer peripheral surface of the housing; a blowing unit which is provided on one side of the jig member and blows air toward the electronic component of the substrate; and a suction unit which is provided on the other side of the jig member so as toface the air blowing unit and sucks in the electronic component separated from the substrate by the air blowing unit.
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Description

technical field

[0001] The present invention relates to a laser lift-off device, and more specifically, to a laser head module of a laser lift-off device capable of removing electronic components melted at soldering sites by laser irradiation without contaminating a substrate. Background technique

[0002] In industrial laser processing, micro-laser processing is the field of application with micron (μm)-level precision, and it is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, and smartphone industry. In memory chips used in all electronic devices, in order to achieve integration, performance and ultra-high-speed communication speed, technology is developing towards the direction of minimizing the circuit line width and line width spacing. However, at present, only by reducing the circuit line width and line width A wide pitch cannot achieve the required technical level, and is only at the level of stacking a plurality of m...

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Embodiment Construction

[0031] The terms used in this specification are for describing specific embodiments only, and do not limit the present invention. Expressions in the singular include expressions in the plural unless the context clearly indicates otherwise. In this specification, terms such as "comprising", "having" or "having" are used to designate the existence of features, numbers, steps, actions, structural elements, components or combinations thereof described in this specification, rather than prior The existence or additional possibility of one or more other features or numbers, steps, actions, structural elements, parts or their combinations is excluded.

[0032] In this specification, unless otherwise defined, all terms used herein including technical or scientific terms assume the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0033] Terms having the same meaning as those defined by commonly used dictionaries should be inter...