A pressing, heat-pressing and curing device and assembly line system for the adhesive part of a packaging box

Abstract

The present invention discloses a pressure application, hot stamping and curing device and an assembly line system for the adhesive part of a packaging box. The pressure application, hot stamping and curing device includes a hot stamping assembly and a vacuum generator. The hot stamping assembly includes a hot stamping plate and a heat insulation plate overlappingly arranged at the bottom of the hot stamping plate. A plurality of heating tubes are arranged inside the hot stamping plate. A plurality of vacuum adsorption holes A are formed on the hot stamping surface of the hot stamping plate. A vacuum extraction tube connected to the vacuum adsorption holes A is connected to the hot stamping plate, and the vacuum extraction tube is connected to the vacuum generator. The present invention is mainly used after the color surface of the packaging box is pasted with glue and the grey board is positioned, and can realize the pressure application operation while performing hot stamping glue curing on the packaging box panel to be hot stamping and cured. Under the combined action of its pressure and temperature, the best bonding quality can be achieved within 3 seconds. The present invention improves the glue curing quality of the adhesive part of the packaging box while also improving the glue curing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesive curing and forming for packaging boxes, and particularly to a pressing, heat ironing and curing device and an assembly line system for the adhesive part of a packaging box. Background Art

[0002] A packaging box is generally composed of a packaging box panel, and the packaging box panel is generally formed by bonding a grey board and a color surface with an adhesive. The color surface is coated with glue by a glue applicator and then bonded to the grey board. After the coated color surface and the grey board are combined and positioned, it takes a long time for the glue to cure and achieve a firm bond between the color surface and the grey board. Also, when applying glue to the color surface, in order to apply the glue to the color surface more quickly and evenly, water-based glue is often used for the color surface. Although it has good fluidity and good bonding effect after curing, its glue curing requires more time. In the prior art, glue application and glue curing have formed technical problems that are difficult to solve in the adhesive operations of packaging box panels and other assembly lines.

[0003] When solving the above problems, the initial solution technology was to add a 10-meter-long conveyor line after the color surface was coated with glue by a glue applicator and positioned with the grey board to allow the glue to dry and cure naturally. The disadvantage of this traditional technology is that the conveyor line is too long, occupying a large area, and the temperature in summer and winter has a great impact on the bonding quality. After the packaging box is formed later, the bonding performance of the glue does not reach the best, and there are situations of peeling and bulging in some parts, resulting in defective products and rework. Later, a conveyor line with a baking channel for heating was added after the color surface was coated with glue by a glue applicator to position the grey board, so that the grey board and the color surface could be quickly bonded. The advantage of this method compared with the initial technology is that the occupied area of the conveyor line is smaller, about 3 to 4 meters. Due to the effect of the baking channel, the temperature of the glue-coated surface of the color surface is directly increased, accelerating the glue curing and distilling the moisture content of the glue, thereby reducing the bonding time of the glue. However, its disadvantages are as follows: Since the form of adding a baking channel on the assembly line is adopted, the temperature can be raised to 60 to 70 degrees Celsius to accelerate the glue curing time, but the length of the assembly line still needs to be about 4 to 5 meters, and a certain amount of floor space is still required; it uses the baking channel for heating, and the baking channel is heated by heating tubes. The baking channel indirectly heats and raises the temperature of the packaging box panel to be adhesively bonded, and the heat utilization rate is low, which results in high energy consumption and low glue heating and curing efficiency. The glue curing time is generally more than 6 seconds. At the same time, the baking channel requires a long time for the first heat-up, which further increases the energy consumption. At the same time, there will be a serious technical defect as follows: Since the baking channel directly heats and raises the temperature of the belt on the assembly line, this also simultaneously accelerates the aging and crack generation of the belt, and regular maintenance, regular upkeep and regular belt replacement are required. Using the above two traditional technologies, there are some positions on the adhesive-bonded packaging box panel where the adhesive is not firm, and the assembled packaging box will be affected by temperature and humidity during later storage and there will be local glue peeling, and even some adhesive-bonded parts will fall off. Summary of the Invention

[0004] Aiming at the deficiencies existing in the prior art, the purpose of the present invention is to provide a pressure application heat-sealing and curing device and a production line system for the adhesive part of the packaging box, which are mainly used for applying glue to the colored surface of the packaging box and positioning the gray board. After that, it can realize the heat-sealing glue curing of the packaging box panel to be heat-sealed and cured while applying pressure. Under the combined action of its pressure and temperature, the best bonding quality can be achieved within 3 seconds. The present invention improves the glue curing quality of the adhesive part of the packaging box while also improving the glue curing efficiency.

[0005] The purpose of the present invention is achieved through the following technical solutions:

[0006] A pressure application heat-sealing and curing device for the adhesive part of the packaging box, the pressure application heat-sealing and curing device includes a heat-sealing component and a vacuum generator. The heat-sealing component includes a heat-sealing plate and a heat-insulating plate overlappingly arranged at the bottom of the heat-sealing plate. A plurality of heating tubes are arranged inside the heat-sealing plate. A plurality of vacuum adsorption holes A are opened on the heat-sealing surface of the heat-sealing plate. A vacuum extraction tube connected to the vacuum adsorption holes A is connected to the heat-sealing plate, and the vacuum extraction tube is connected to the vacuum generator.

[0007] In order to better implement the pressure application heat-sealing and curing device of the present invention, the present invention also includes a coolant tank. The heat-sealing component is installed on the coolant tank. A vacuum negative pressure copper tube is also connected between the vacuum extraction tube and the vacuum generator, and a part of the vacuum negative pressure copper tube is placed in the coolant tank.

[0008] Preferably, the heat-sealing component further includes a fixing plate, the fixing plate is overlappingly arranged at the bottom of the heat-insulating plate, and both sides of the fixing plate are respectively connected and fixed to the coolant tank through fixing columns.

[0009] Preferably, a temperature probe is inserted into the heat-sealing plate; a vacuum extraction channel A connected to the vacuum adsorption holes A and the vacuum extraction tube is arranged inside the heat-sealing plate.

[0010] Preferably, the number of vacuum generators is two. Two rows of vacuum adsorption holes A are respectively arranged along the length direction of the heat-sealing surface of the heat-sealing plate. One group of vacuum extraction tubes is respectively arranged on both sides of the heat-sealing plate in the length direction. The two groups of vacuum extraction tubes are in one-to-one correspondence and communication with the two rows of vacuum adsorption holes A. The two vacuum generators are respectively in one-to-one correspondence and communication with the two groups of vacuum extraction tubes.

[0011] A pressure application, hot stamping and curing pipeline system for the adhesive part of a packaging box, comprising a pressure application, hot stamping and curing device and a pipeline transmission device. The pipeline transmission device includes a horizontal guide rail mechanism. A horizontal guide rail is provided on the front of the horizontal guide rail mechanism, and a connecting seat is provided on the back of the horizontal guide rail mechanism. A packaging box adsorption device A and a packaging box adsorption device B are slidably installed on the horizontal guide rail. A linkage optical axis is connected between the packaging box adsorption device A and the packaging box adsorption device B. A driving mechanism is provided on the horizontal guide rail mechanism for driving the packaging box adsorption device A or the packaging box adsorption device B to slide horizontally on the horizontal guide rail. The packaging box adsorption device A and the packaging box adsorption device B have the same structure. The packaging box adsorption device A includes an installation back plate. A slider matching with the horizontal guide rail is provided on the back of the installation back plate. A lifting device is vertically provided in the middle of the installation back plate. The lifting device has a lifting rod, and a packaging box adsorption plate is fixed at the end of the lifting rod. A plurality of vacuum adsorption holes B are opened on the adsorption bottom surface of the packaging box adsorption plate. A vacuum pumping nozzle corresponding to the vacuum adsorption holes B is provided on the side of the packaging box adsorption plate. A vacuum pumping channel B communicating with the vacuum pumping nozzle and the vacuum adsorption holes B is provided inside the packaging box adsorption plate. The pressure application, hot stamping and curing device is arranged corresponding to the packaging box adsorption device A and the packaging box adsorption device B. The pressure application, hot stamping and curing device includes a hot stamping assembly and a vacuum generator. The hot stamping assembly includes a hot stamping plate and a heat insulation plate overlappingly arranged at the bottom of the hot stamping plate. A plurality of heating tubes are provided inside the hot stamping plate. A plurality of vacuum adsorption holes A are opened on the hot stamping surface of the hot stamping plate. A vacuum pumping tube connected to the vacuum adsorption holes A is connected to the hot stamping plate. The vacuum pumping tube is connected to the vacuum generator.

[0012] Preferably, the heating tube is an electric heating tube, and the heating tube is electrically connected to an external power supply. Lifting guide mechanisms are respectively fixed on both sides of the lifting device on the installation back plate. The lifting device is a lifting cylinder, and the vacuum pumping nozzle is hermetically connected to a vacuum pumping device.

[0013] Preferably, the pressure application, hot stamping and curing device further includes a coolant tank. The hot stamping assembly is installed on the coolant tank. A vacuum negative pressure copper tube is further communicated between the vacuum pumping tube and the vacuum generator, and a part of the vacuum negative pressure copper tube is placed in the coolant tank.

[0014] Preferably, the hot stamping assembly further includes a fixing plate, and the fixing plate is overlappingly arranged at the bottom of the heat insulation plate. Both sides of the fixing plate are respectively connected and fixed to the coolant tank through fixing columns. A temperature probe is inserted on the hot stamping plate.

[0015] Preferably, a vacuum pumping channel A communicating with the vacuum adsorption holes A and the vacuum pumping tube is provided inside the hot stamping plate.

[0016] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0017] (1) In the present invention, the hot stamping plate is used to assist in adsorbing the packaging box panel to be hot stamping and cured under negative pressure. At the same time, the heating tube in the hot stamping plate heats up to directly heat the packaging box panel to be hot stamping and cured, achieving the effect of rapid curing and bonding of the glue. The temperature probe can monitor the heating temperature of the hot stamping plate, facilitating timely heating adjustment.

[0018] (2) In the present invention, the hot stamping plate is evacuated and the negative pressure adsorption purpose is achieved through the vacuum negative pressure copper tube, the vacuum pumping tube, and the vacuum generator. Since the temperature of the hot stamping plate is relatively high, the air temperature in the vacuum negative pressure copper tube will also be too high. Placing most of the vacuum negative pressure copper tube in the coolant tank can cool the air in the vacuum negative pressure copper tube, preventing the vacuum generator from being damaged due to high temperature and improving the service life of the vacuum generator.

[0019] (3) The present invention is mainly used after the color surface of the packaging box is pasted with glue and the gray board is positioned. It can achieve hot stamping and glue curing of the packaging box panel to be hot stamping and cured, and at the same time, perform pressing operations. Under the combined action of its pressure and temperature, the best bonding quality can be achieved within 3 seconds. The present invention improves the glue curing quality of the glued part of the packaging box while also improving the glue curing efficiency.

[0020] (4) The present invention can achieve assembly line operations between the glue application assembly line of the packaging box and the forming station through the assembly line transmission device. Two packaging box adsorption devices are loaded on the assembly line transmission device. One packaging box adsorption device realizes negative pressure adsorption and grasping of the packaging box panel to be hot stamping and cured, and the other packaging box adsorption device realizes pressing and hot stamping and curing operations on the packaging box panel to be hot stamping and cured, achieving standardized and assembly line operations of pressing and hot stamping and curing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of the pressing and hot stamping and curing device of the present invention;

[0022] Figure 2 is Figure 1 a schematic structural diagram of removing the coolant tank in;

[0023] Figure 3 is a schematic structural diagram of the pressing and hot stamping and curing assembly line system of the present invention;

[0024] Figure 4 is Figure 3 a schematic structural diagram of the assembly line transmission device in;

[0025] Figure 5 is a schematic structural diagram of the hot stamping surface of the hot stamping plate;

[0026] Figure 6Schematic layout of the vacuum pumping channel A for the hot stamping plate

[0027] Figure 7 Schematic structure of the adsorption plate for the packaging box

[0028] Among them, the names corresponding to the reference numerals in the drawings are as follows:

[0029] 1 - Hot stamping plate, 2 - Heat insulation plate, 3 - Fixed plate, 4 - Fixed column, 5 - Vacuum negative pressure copper pipe, 51 - Vacuum pumping pipe, 6 - Vacuum generator, 7 - Heating pipe, 8 - Temperature probe, 9 - Cooling liquid tank, 10 - Horizontal guide rail mechanism, 101 - Horizontal guide rail, 102 - Connecting seat, 11 - Vacuum adsorption hole A, 12 - Vacuum pumping channel A, 13 - Packaging box adsorption device A, 14 - Packaging box adsorption device B, 15 - Installation back plate, 16 - Lifting device, 17 - Lifting guide mechanism, 18 - Packaging box adsorption plate, 181 - Vacuum adsorption hole B, 182 - Vacuum pumping channel B, 19 - Packaging box panel to be hot stamped and cured Detailed implementation manners

[0030] The present invention will be further described in detail below in conjunction with the embodiments:

[0031] Embodiment 1

[0032] As shown in Figure 1 、 Figure 2 、 Figure 5 、 Figure 6 A hot stamping and curing device for pressing the adhesive part of a packaging box, the hot stamping and curing device includes a hot stamping assembly and a vacuum generator 6. The hot stamping assembly includes a hot stamping plate 1 and a heat insulation plate 2 overlapped at the bottom of the hot stamping plate 1. A plurality of heating pipes 7 are arranged inside the hot stamping plate 1. As shown in Figure 5 As shown, a plurality of vacuum adsorption holes A11 are opened on the hot stamping surface of the hot stamping plate 1. A vacuum pumping pipe 51 communicating with the vacuum adsorption holes A11 is connected to the hot stamping plate 1. The vacuum pumping pipe 51 is connected to the vacuum generator 6. The vacuum generator 6 is a vacuum pumping device. The vacuum generator 6 pumps vacuum for the hot stamping plate 1 through the vacuum pumping pipe 51, and makes the vacuum adsorption holes A11 of the hot stamping plate 1 form a continuous vacuum negative pressure adsorption force, so that the hot stamping plate 1 can realize the negative pressure adsorption effect on the packaging box panel 19 to be hot stamped and cured, and play a positioning role for the packaging box panel 19 to be hot stamped and cured.

[0033] As shown in Figure 1 The hot stamping and curing device of the present invention further includes a cooling liquid tank 9. The hot stamping assembly is installed on the cooling liquid tank 9. A vacuum negative pressure copper pipe 5 is also communicated between the vacuum pumping pipe 51 and the vacuum generator 6. Part of the vacuum negative pressure copper pipe 5 is placed in the cooling liquid tank 9. The hot stamping assembly further includes a fixed plate 3. The fixed plate 3 is overlapped at the bottom of the heat insulation plate 2. Both sides of the fixed plate 3 are connected and fixed to the cooling liquid tank 9 through fixed columns 4.

[0034] As Figure 1 , Figure 2 shown, a temperature probe 8 is inserted and provided on the hot ironing plate 1. The temperature probe 8 can monitor the internal heating temperature of the hot ironing plate 1 to prompt whether the heating temperature of the hot ironing plate 1 meets the requirements or is too high; As Figure 6 shown, a vacuum pumping channel A12 communicating with the vacuum adsorption holes A11 and the vacuum pumping tube 51 is provided inside the hot ironing plate 1.

[0035] Preferably, the number of vacuum generators 6 in this embodiment is two. Two rows of vacuum adsorption holes A11 are respectively provided along the length direction of the hot ironing surface of the hot ironing plate 1. One set of vacuum pumping tubes 51 is respectively provided on both sides of the hot ironing plate 1 in the length direction. The two sets of vacuum pumping tubes 51 are in one-to-one correspondence and communication with the two rows of vacuum adsorption holes A11. The two vacuum generators 6 are in one-to-one correspondence and communication with the two sets of vacuum pumping tubes 51 respectively; As Figure 2 shown, in this embodiment, a set of vacuum pumping systems are respectively provided on both sides of the hot ironing plate 1 in the length direction, which respectively cooperate with the two rows of vacuum adsorption holes A11 on the hot ironing plate 1 to realize the negative pressure adsorption effect of the hot ironing plate 1 on the panel 19 of the packaging box to be hot ironed and cured before or at the same time of pressing and hot ironing and curing the glue at the glue-bonding part of the packaging box, so as to prevent the problem of movement of the panel 19 of the packaging box to be hot ironed and cured.

[0036] Embodiment Two

[0037] As Figure 3 , Figure 4 shown, a pressure application and hot ironing and curing pipeline system for the glue-bonding part of a packaging box includes a pressure application and hot ironing and curing device and a pipeline transmission device. The pipeline transmission device includes a transverse guide rail mechanism 10. A transverse guide rail 101 is provided on the front of the transverse guide rail mechanism 10. A connecting seat 102 is provided on the back of the transverse guide rail mechanism 10. A packaging box adsorption device A13 and a packaging box adsorption device B14 are slidably installed on the transverse guide rail 101. A linkage optical axis is connected between the packaging box adsorption device A13 and the packaging box adsorption device B14. A driving mechanism for driving the packaging box adsorption device A13 or the packaging box adsorption device B14 to slide horizontally on the transverse guide rail 101 is provided on the transverse guide rail mechanism 10. The packaging box adsorption device A13 and the packaging box adsorption device B14 have the same structure. The packaging box adsorption device A13 includes a mounting back plate 15. A slider cooperating with the transverse guide rail 101 is provided on the back of the mounting back plate 15. A lifting device 16 is vertically provided in the middle of the mounting back plate 15. The lifting device 16 has a lifting rod. A packaging box adsorption plate 18 is fixed at the end of the lifting rod. As Figure 7 shown, a plurality of vacuum adsorption holes B181 are opened on the adsorption bottom surface of the packaging box adsorption plate 18. A vacuum pumping nozzle corresponding to the vacuum adsorption holes B181 is provided on the side of the packaging box adsorption plate 18. A vacuum pumping channel B182 communicating with the vacuum pumping nozzle and the vacuum adsorption holes B181 is provided inside the packaging box adsorption plate 18.

[0038] The pressure hot stamping and curing device of the present invention is correspondingly arranged with the packaging box adsorption device A13 and the packaging box adsorption device B14. As Figure 1 , Figure 2 shown, the pressure hot stamping and curing device includes a hot stamping assembly and a vacuum generator 6. The hot stamping assembly includes a hot stamping plate 1 and a heat insulation plate 2 overlapping and arranged at the bottom of the hot stamping plate 1. A plurality of heating tubes 7 are arranged inside the hot stamping plate 1. A plurality of vacuum adsorption holes A11 are opened on the hot stamping surface of the hot stamping plate 1. A vacuum extraction tube 51 connected to the vacuum adsorption holes A11 is connected to the hot stamping plate 1, and the vacuum extraction tube 51 is connected to the vacuum generator 6.

[0039] The heating tube 7 of the present invention is an electric heating tube, and the heating tube 7 is electrically connected to an external power supply. Lifting guide mechanisms 17 are respectively fixed on both sides of the lifting device 16 on the installation backboard 15. The lifting device 16 is a lifting cylinder, and the vacuum extraction nozzle is hermetically connected to a vacuum extraction device.

[0040] As Figure 1 , Figure 2 shown, the pressure hot stamping and curing device further includes a coolant tank 9. The hot stamping assembly is installed on the coolant tank 9. A vacuum negative pressure copper tube 5 is also communicated between the vacuum extraction tube 51 and the vacuum generator 6, and a part of the vacuum negative pressure copper tube 5 is placed in the coolant tank 9. The hot stamping assembly further includes a fixing plate 3. The fixing plate 3 overlaps and is arranged at the bottom of the heat insulation plate 2. Both sides of the fixing plate 3 are respectively connected and fixed to the coolant tank 9 through fixing columns 4. A temperature probe 8 is inserted on the hot stamping plate 1. A vacuum extraction channel A12 communicated with the vacuum adsorption holes A11 and the vacuum extraction tube 51 is arranged inside the hot stamping plate 1.

[0041] The pipeline transmission device of the present invention is arranged between the glue coating pipeline of the packaging box and the forming station. The pressure hot stamping and curing device is correspondingly arranged at a corresponding position below the pipeline transmission device. The packaging box panel 19 to be hot stamped and cured is adhesively bonded and positioned by coating glue on the colored surface and the gray board, as Figure 1As shown in the figure, at the very beginning, the packaging box adsorption device B14 on the pipeline transmission device sucks and grabs the packaging box panel 19 to be thermally ironed and cured from the glue-applying pipeline by negative pressure. Driven by the driving mechanism, the pipeline transmission device drives the packaging box adsorption device A13 and the packaging box adsorption device B14 to move synchronously. The packaging box adsorption plate 18 of the packaging box adsorption device B14 transports the packaging box panel 19 to be thermally ironed and cured above the thermal ironing plate 1 of the pressure-applying thermal ironing and curing device. At the same time, the lifting device 16 of the packaging box adsorption device B14 drives the packaging box adsorption plate 18 to move downward, so that the packaging box panel 19 to be thermally ironed and cured is closely located between the packaging box adsorption plate 18 and the thermal ironing plate 1. At the same time, the thermal ironing plate 1 also assists in sucking the bottom of the packaging box panel 19 to be thermally ironed and cured by negative pressure. The thermal ironing plate 1 performs thermal ironing and curing on the packaging box panel 19 to be thermally ironed and cured. At the same time, the packaging box adsorption plate 18 of the packaging box adsorption device B14 vertically presses the packaging box panel 19 to be thermally ironed and cured under the drive of the lifting device 16. In this way, the comprehensive effect of pressure-applying thermal ironing and curing can be achieved on the packaging box panel 19 to be thermally ironed and cured, and pressure application, thermal ironing assistance, and acceleration of glue curing are carried out on the packaging box panel 19 to be thermally ironed and cured. Under the combined action of its pressure and temperature, the bonding time is greatly shortened to 3 seconds to complete, and the best glue curing effect is achieved within 3 seconds. The bonding quality of the packaging box panel 19 to be thermally ironed and cured is better, and there will be no problem of glue detachment affected by temperature and humidity during later storage. While the packaging box adsorption device B14 performs pressure-applying thermal ironing and curing on the first packaging box panel 19 to be thermally ironed and cured, the packaging box adsorption device A13 sucks and grabs the second packaging box panel 19 to be thermally ironed and cured by negative pressure. After the first packaging box panel 19 to be thermally ironed and cured is subjected to pressure-applying thermal ironing and curing, the packaging box adsorption device B14 transports the first packaging box panel 19 to be thermally ironed and cured to the forming station. At the same time, the packaging box adsorption device A13 transports the second packaging box panel 19 to be thermally ironed and cured above the pressure-applying thermal ironing and curing device and realizes the pressure-applying thermal ironing and curing of the second packaging box panel 19 to be thermally ironed and cured. By circulating in this way, the pipeline operation of the packaging box panel 19 to be thermally ironed and cured can be realized. The average time for pressure-applying thermal ironing and curing a packaging box panel 19 to be thermally ironed and cured is 3 seconds, which improves the glue curing quality of the glue-bonding part of the packaging box and also improves the glue curing efficiency.

[0042] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A pressure application, heat transfer and curing production line system for the adhesive part of a packaging box, characterized in that: It includes a pressure hot stamping and curing device and a pipeline transmission device. The pipeline transmission device is arranged between the glue - applying pipeline of the packaging box and the forming station, and the pressure hot stamping and curing device is correspondingly arranged below the pipeline transmission device. The pipeline transmission device includes a transverse guide rail mechanism (10). The front of the transverse guide rail mechanism (10) is provided with a transverse guide rail (101), and the back of the transverse guide rail mechanism (10) is provided with a connecting seat (102). A packaging box adsorption device A (13) and a packaging box adsorption device B (14) are slidably installed on the transverse guide rail (101). A linkage optical axis is connected between the packaging box adsorption device A (13) and the packaging box adsorption device B (14). The transverse guide rail mechanism (10) is provided with a driving mechanism for driving the packaging box adsorption device A (13) or the packaging box adsorption device B (14) to slide horizontally on the transverse guide rail (101). The packaging box adsorption device A (13) and the packaging box adsorption device B (14) have the same structure. The packaging box adsorption device A (13) includes an installation back plate (15). The back of the installation back plate (15) is provided with a slider that cooperates with the transverse guide rail (101). A lifting device (16) is vertically arranged in the middle of the installation back plate (15). The lifting device (16) has a lifting rod, and a packaging box adsorption plate (18) is fixed at the end of the lifting rod. A number of vacuum adsorption holes B (181) are opened on the adsorption bottom surface of the packaging box adsorption plate (18). A vacuum extraction air nozzle corresponding to the vacuum adsorption holes B (181) is arranged on the side of the packaging box adsorption plate (18). A vacuum extraction channel B (182) communicating with the vacuum extraction air nozzle and the vacuum adsorption holes B (181) is arranged inside the packaging box adsorption plate (18). The pressure hot stamping and curing device includes a hot stamping assembly and a vacuum generator (6). The hot stamping assembly includes a hot stamping plate (1) and a heat insulation plate (2) overlappingly arranged at the bottom of the hot stamping plate (1). A number of heating tubes (7) are arranged inside the hot stamping plate (1). A number of vacuum adsorption holes A (11) are opened on the hot stamping surface of the hot stamping plate (1). A vacuum extraction tube (51) communicating with the vacuum adsorption holes A (11) is connected to the hot stamping plate (1), and the vacuum extraction tube (51) is connected to the vacuum generator (6). The number of vacuum generators (6) is two. Two rows of vacuum adsorption holes A (11) are respectively arranged along the length direction of the hot stamping surface of the hot stamping plate (1). One set of vacuum extraction tubes (51) is respectively arranged on both sides of the hot stamping plate (1) in the length direction. The two sets of vacuum extraction tubes (51) are in one - to - one correspondence and communication with the two rows of vacuum adsorption holes A (11). The two vacuum generators (6) are respectively in one - to - one correspondence and communication with the two sets of vacuum extraction tubes (51).

2. The pressure application, heat transfer and curing production line system for the adhesive part of a packaging box according to claim 1, characterized in that: Lifting guide mechanisms (17) are respectively fixed on both sides of the installation back plate (15) where the lifting device (16) is located. The lifting device (16) is a lifting cylinder, and the vacuum extraction air nozzle is hermetically connected to a vacuum extraction device.

3. The pressure application, heat transfer and curing production line system for the adhesive part of a packaging box according to claim 1 or 2, characterized in that: The pressure hot stamping and curing device further includes a coolant tank (9), the hot stamping assembly is installed on the coolant tank (9), a vacuum negative pressure copper pipe (5) is also communicated between the vacuum pumping pipe (51) and the vacuum generator (6), and a part of the vacuum negative pressure copper pipe (5) is placed in the coolant tank (9).

4. The pressure application, heat transfer and curing production line system for the adhesive part of a packaging box according to claim 3, characterized in that: The hot stamping assembly further includes a fixing plate (3), the fixing plate (3) is overlapped and arranged at the bottom of the heat insulation plate (2), and both sides of the fixing plate (3) are respectively connected and fixed to the coolant tank (9) through fixing columns (4); a temperature probe (8) is inserted on the hot stamping plate (1).

5. The pressure application, heat transfer and curing production line system for the adhesive part of a packaging box according to claim 4, characterized in that: A vacuum pumping channel A (12) communicated with the vacuum adsorption hole A (11) and the vacuum pumping pipe (51) is arranged inside the hot stamping plate (1).

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