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247 results about "Aluminum thin film" patented technology

Silicon-based heterojunction solar cell and preparation method thereof

The invention discloses a silicon-based heterojunction solar cell which comprises grid electrodes, a transparent conductive film, a boron-doped amorphous silicon, an intrinsic amorphous silicon, an N-type monocrystalline and a back electrode in sequence, wherein the back electrode is formed by a distributed Bragg reflector and an aluminum thin film, the distributed Bragg reflector is formed by arranging niobium-doped titanium dioxide thin films and aluminum-doped zinc oxide thin films at intervals, and the aluminum thin film is arranged on the surface layer of the aluminum-doped zinc oxide thin film on the outermost layer of the distributed Bragg reflector. The distributed Bragg reflector used as the back electrode consists of two transparent conductive films with different refraction indexes, so that the resistance of the cell device connected in series is reduced, the collection of current carriers is facilitated, and the photoelectric conversion efficiency of the cell is high; and by adopting the back-reflecting electrode formed by combining the distributed Bragg reflector and the aluminum anode, the long wave band of the near infrared part with characteristic wavelength can be reflected to the inside of the crystalline silicon wafer to be reabsorbed through the two layers of conductive films with different refractive indexes, so that both the current and the photoelectric conversion efficiency of the cell are improved.
Owner:(CNBM) BENGBU DESIGN & RES INST FOR GLASS IND CO LTD +1

Collecting electrode used in super capacitor and its surface treating method

The invention discloses a collector of super capacitor and the surface processing method, which is characterized in that a collector body film can be an aluminum film, a copper foil, a foam nickel film, a stainless steel film or punching nickel film; the purity of aluminum is over 99.9%; the thickness of the corrosion aluminum foil is 15 to 50 Mum; the roughness is 1.5 to 3.0 Mum; the collector body is spongy under 20000X electronic microscope; the average diameter of the corrosion hole is 0.05 to 0.2 Mum; 5 to 10 billion holes are arranged in the area of 1 cm2; the tensile strength is 1.0 to3.0 kg/cm. The invention has the advantages that chromic acid mixture is adopted for chemical treatment for the surface of the current collector; dust on the surface of aluminum foil of the current collector during storage and transportation can be removed; anti-septic oil and anti-sticking agent on the aluminum foil during machining process are also effectively removed; active functional groups are added, enabling even and consistent distribution of coated electrode material; the adhesion strength of the electrode film is improved; internal resistance of the electrode is reduced, the specificsurface area is increased; the collector is applicable to large scale production.
Owner:NINGBO FUDA ELECTRIC APPLIANCE

Laser electrolytic aluminum film regeneration coating and preparation method thereof

InactiveCN102585648AImprove poor temperature resistanceHigh surface brightnessCoatingsThermographyButyl acetateFoaming agent
The invention relates to a holographic anti-counterfeiting printing industrial material, in particular to a laser electrolytic aluminum film regeneration coating and a preparation method thereof, and provides a method for overcoming product defects and improving the die pressing property of a half-finished die belt, a laser electrolytic aluminum film regeneration coating for reusing a half-finished product which is difficult for die pressing, and a preparation method thereof. A regeneration zone of which the temperature resistance range is 200-225 DEG C is coated between an imaging layer and an aluminum-plated layer; and the coating consists of the following components in parts by weight: 100 parts of acrylic resin, 0.1-1 part of nano silica, 0.3 parts of anti-foaming agent, 0.2 parts of flatting agent, 0.5 parts of pH value adjusting agent, and a solvent consisting of 37-118 parts of ethyl acetate and 37-118 parts of butyl acetate in the mixture ratio of 1:1. According to different components of a coating composition, the defects of poor temperature resistance and high rejection rate of a film coating are overcome, the problems of peeling and plate adhering are solved, the operation is easy, the production yield is increased, and the die pressing fie belt has high surface brightness and excellent representation.
Owner:HUBEI LHTC ANTI COUNTERFEITING TECH CO LTD

Human and mirror interaction method and system based on facial expression recognition and color emotion feedback

The invention relates to a human and mirror interaction method based on facial expression recognition and color emotion feedback. The human and mirror interaction method comprises the following steps that firstly, when approaching of the human body is detected, a facial expression image is obtained; secondly, the facial expression image is processed and subjected to expression recognition, and a recognized expression is obtained; thirdly, according to preset expression and color matching rules, a display color corresponding to the recognized expression is determined, and corresponding light display is carried out. The structure is simple, the making material of an intelligent mirror is similar to that of a common mirror, and it is only needed to plate an aluminum thin film on common glass so as to ensure that the resolution of the intelligent mirror is high enough; the facial expression recognition function is achieved, and the intelligent mirror can be used for recognizing the facial expression with the assistance of the existing expression recognition technology; the LED color light feedback function is achieved, and the recognized expression and the emotion corresponding to the recognized expression can be fed back through different light emitting conditions of external LED lamps.
Owner:CHINA UNIV OF GEOSCIENCES (WUHAN)

Aluminum-induced crystallization polycrystalline silicon thin-film solar cell and preparation method thereof

The invention discloses an aluminum-induced crystallization polycrystalline silicon thin-film solar cell and a preparation method of the aluminum-induced crystallization polycrystalline silicon thin-film solar cell and belongs to the field of silicon thin-film solar cells. A structure of the aluminum-induced crystallization polycrystalline silicon thin-film solar cell comprises a glass substrate, a metallic aluminum back reflecting layer, a P+ type back surface field layer, a P type absorption layer and a N+ type transmission layer. Metal electrodes are arranged on the P+ type back surface field layer and the N+ type transmission layer. The preparation method includes the following steps of sequentially depositing an amorphous silicon thin film and an aluminum film through an aluminum-induced crystallization technology, wherein the thickness range is between 100 nm-150nm and 100nm-120nm, conducting annealing process for 1-5 hours at a temperature of 450DEG C-500DEG C, wherein positions of a silicon layer and an aluminum layer can exchange and amorphous silicon is changed into polycrystalline silicon with a grain size of 5mu-10mu, and preparing the P type absorption layer, the N+ type transmission layer and the metal electrodes. The aluminum-induced crystallization polycrystalline silicon thin-film solar cell and the preparation method of the aluminum-induced crystallization polycrystalline silicon thin-film solar cell can theoretically reduce the thickness of an original cell by 50% and greatly save cost of raw materials.
Owner:JIANGSU LONGBAO ELECTRONICS SCI & TECH CO LTD

Metal aluminum base aluminum nitride package substrate and preparation method thereof

The invention discloses a metal aluminum base aluminum nitride package substrate and a preparation method thereof, and belongs to the field of microelectronic materials. The package substrate comprises a metal aluminum base, a porous anodic alumina film formed on the surface of the metal aluminum base, and an aluminum nitride film formed on the surface of the anodic alumina film, wherein the porosity of the anodic alumina film is reduced gradually along the direction from the metal aluminum base to the aluminum nitride film. According to the preparation method of the package substrate, metal aluminum is used as the base, anodic oxidation is carried out on one surface of aluminum to generate a layer of the porous anodic alumina film, and then the aluminum nitride film is deposited on the anodic alumina film in a vacuum mode. According to the metal aluminum base aluminum nitride package substrate, the anodic oxidation is carried out on the metal aluminum base, an anodic alumina thermal stress buffer layer with a coefficient of thermal expansion gradually varied is formed between the aluminum base and the aluminum nitride film, thermal shock resistance is improved obviously, cracking does not occur under 300 DEG C thermal shock, and therefore the metal aluminum base aluminum nitride package substrate can be applied in a subsequent process of semiconductor chip package well.
Owner:WUHAN BOOYEN TECH

Vacuum brazing method for aluminum alloy solderless piece

InactiveCN104400169ASuccessful implementation of vacuum brazingAvoid designSoldering apparatusRoom temperatureSilicon thin film
The invention provides a vacuum brazing method for an aluminum alloy solderless piece. The method comprises the following steps that (1) a high-purity pure aluminum target material and a pure silicon target material are selected; (2) acetone and ethyl alcohol are sequentially adopted to wipe the target materials and a to-be-soldered part so as to remove oil contamination; (3) a magnetron sputtering method is utilized for depositing a pure aluminum thin film and a pure silicon thin film on the surface of the to-be-soldered part; (4) the to-be-soldered part with the thin films deposited on the surface is taken out of a vacuum chamber; (5) the to-be-soldered part is assembled; (6) the assembled the to-be-soldered part is conveyed to a vacuum brazing furnace to be heated and soldered; and (7) the to-be-soldered part is cooled to the room temperature and is taken out. The vacuum brazing method has the advantages that a solder piece is not adopted; the requirement that according to an existing vacuum brazing technology, a soldering face of a to-be-soldered workpiece must be a plane is avoided; vacuum brazing of structures of a slope, a curved surface and the like is smoothly achieved; and processes of solder piece design, solder piece cutting, solder piece cleaning and the like are avoided.
Owner:CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST

Intelligent RFID medicine plate system suitable for medicine plate management

ActiveCN103413206ALow costOvercoming Difficulty Reading SituationsSensing record carriersResourcesRelevant informationThe Internet
The invention relates to an intelligent RFID medicine plate system suitable for medicine plate management. The intelligent RFID medicine plate system for medicine plate management comprises a medicine existence detection thin film, a medicine plate and an intelligent medicine box. An RFID chip and an aluminum film antenna form a built-in RFID label on the medicine plate, and therefore the problems produced when an existing RFID label is adhered to the medicine plate aluminum thin film are solved. Relevant information such as authentication security information, production logistics information and use method information of medicine are written on the chip through a matched RFID card reader, the intelligent medicine box can read information in the medicine plate RFID chip and conduct information verification by being connected with a server through the internet, and the intelligent medicine box can further read data of the medicine existence detection thin film arranged on the medicine plate, record the dosage and the time each time a patient takes medicine and upload the dosage and the time to the server so that the patient or other guardians can conveniently look up the dosage and the time through a personal mobile terminal.
Owner:SHANGHAI AISINOCHIP ELECTRONICS TECH

Preparation method of high-quality scandium-doped aluminum nitride film template

The invention provides a preparation method of a high-quality scandium-doped aluminum nitride film template. The preparation method includes the following steps of: S1, preparing a substrate; S2, depositing a film transition layer on the substrate by adopting a coating technology; S3, thermally treating the film transition layer at a high temperature in a pure nitrogen atmosphere by adopting a high-temperature face-to-face heat treatment technology to form a high-quality buffer layer; and S4, depositing a scandium-doped aluminum nitride film on the buffer layer by adopting a reactive magnetron sputtering deposition method. The preparation method provided by the invention can be used for preparing a scandium-doped aluminum nitride thin film with a high crystallization property, solves the problem that the orientation of the aluminum nitride thin film is seriously deteriorated due to doping of a high Sc concentration, and achieve results of far exceeding the level of the prior art under different film thicknesses, and lays a solid foundation for application of SAW / BAW devices with a higher frequency, enhanced piezoelectric response, a higher electromechanical coupling coefficient and a higher Q value.
Owner:ULTRATREND TECH INC

Pipe wall bonding and molding method of air-inflation stretching arm

The invention discloses a pipe wall bonding and molding method of an air-inflation stretching arm, relating to the pipe wall bonding and molding method and aiming to solve the problem that the traditional common planar worktable can not be used for bonding arc-shaped reinforcing strips and planar hook and loop fasteners at the same time. The pipe wall bonding and molding method comprises the steps of: 1, grinding a laminated aluminum thin-film hasp bonding area, a pipe-molding bonding area A, a reinforcing strip bonding area and a pipe-molding bonding area B, and cleaning with acetone; 2, coating an adhesive, standing at room temperature for 30 min, bonding nylon hasps firstly and then bonding the reinforcing strips; and (3) increasing pressure in a cylindrical thin-film air bag to 20kPa, coating a laminated aluminum thin film on the air bag, winding bandages uniformly, increasing the pressure to 50kPa, standing at room temperature for 96h, reducing the pressure, removing bandages to complete the bonding and molding of the pipe wall. According to the invention, the average peel strength between the hook and loop fastener and the pipe wall of the air-inflation stretching arm is 0.25KN / m and is in increased by two times compared with that of the traditional bonding process. The pipe wall bonding and molding method is applied to the field of pipe walls of the air-inflation stretching arms.
Owner:HARBIN INST OF TECH
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