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Temperature-measuring member, temperature-measuring device, and method for measuring temperature

A technology of temperature measurement and components, applied in the direction of measuring devices, thermometers, thermometers with physical/chemical changes, etc.

Inactive Publication Date: 2009-01-14
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] In the above-mentioned existing temperature measurement tool and the temperature measurement device and temperature measurement method using the temperature measurement tool, there is no need for external A tool capable of measuring the maximum attainable temperature in a wide temperature range from low temperature to high temperature without the generation of impurities and dust even in wiring.

Method used

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  • Temperature-measuring member, temperature-measuring device, and method for measuring temperature
  • Temperature-measuring member, temperature-measuring device, and method for measuring temperature
  • Temperature-measuring member, temperature-measuring device, and method for measuring temperature

Examples

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Embodiment 1

[0141] By sputtering, the vacuum degree is 1.2×10 -6 Torr, the distance between substrate and target is 100mm, the argon gas pressure during film formation is 2mTorr, and the film formation power is 2W / cm 2 Under the conditions of 0.35 mm thick and 2 inches thick, an aluminum thin film with a thickness of 300 nm and a purity of 99.99 was formed to form a metal thin film substrate. Using this metal thin film-coated substrate, it was heated in an argon atmosphere at a temperature increase temperature of 5°C / min. The surface shape of protrusions formed on the surface of the heated metal thin film substrate with metal thin film was observed with a microscope, and the surface shape was processed with a CCD camera constituting a surface information collection unit to obtain a simulated image signal. This image signal is digitized with an IO board serving as an AD conversion section to obtain image data. Next, the image data is binarized by the number calculation unit, and only the...

Embodiment 2

[0147] Hereinafter, the temperature measuring apparatus and the temperature measuring method of the maximum attained temperature briefly described in Example 1 will be described. FIG. 2 is a block diagram for explaining the temperature measuring apparatus in this embodiment.

[0148] In FIG. 2 , 1 is a temperature measuring member comprising a thin metal substrate with a thermal history, which is an object to be measured, which is set in a vacuum heat treatment furnace shown in Example 1, and 2 is a holding table supporting the temperature measuring member. , 3 is an optical microscope for observing the shape of protrusions on the surface of the metal thin film, 4 is a CCD camera mounted on the optical microscope 3 and used to output an analog image signal, 5 is an output signal of the CCD camera 4 that digitizes and is used to output an image IO board for data, 6 is an arithmetic processing device connected to the IO board, 7 is a binarization process for the digitized image ...

Embodiment 3

[0151] By sputtering, the vacuum degree is 1.2×10 -6 Torr, the distance between substrate and target is 100mm, the argon gas pressure during film formation is 3mTorr, and the film formation power is 2.8W / cm 2 Under the conditions of 0.625 mm thick and 6 inches thick, an aluminum thin film with a thickness of 300 nm and a purity of 99.99 was formed to form a metal thin film substrate.

[0152] Next, the above-mentioned metal thin film-coated substrate is heat-treated in a vacuum heat-treatment furnace. The rate of temperature increase at this time was 5°C / min, and the temperature was raised to a predetermined temperature, held for 10 minutes, and then naturally cooled. At this time, the temperature of the central portion of the metal thin film-attached substrate was measured using a temperature measuring wafer with a thermocouple manufactured by Sensa Reichi Co., Ltd., and the highest reached temperature was recorded. In addition, the number of protrusions formed on the surfa...

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Abstract

The invention provides a temperature-measuring member, a temperature-measuring device, and a method for measuring temperature, wherein maximum temperature can be reached in a wide temperature range from low temperature to high temperature without external wirings, and impurities dust are not provided. The surface density of projections formed on a thin metal film of a temperature-measuring member having the metal film having been subjected to a temperature profile is calculated with a number-calculating section 7 according to image data fed into an arithmetic processing unit through a CCD camera 4, and an I / O board 5. The maximum temperature of the object is determined with the temperature-calculating unit according to the surface density and data on the maximum temperature and surface density previously stored in a memory 8. Furthermore, a temperature-measuring member 9 constituted by a thin aluminum film arranged on a substrate is used. A reduction in the reflectivity of the film due to projections formed on the film surface according to a temperature profile to which the member has been subjected is measured. The maximum temperature in the temperature profile is estimated according to the reduction in reflectivity.

Description

technical field [0001] The present invention relates to a technique for measuring the temperature of a temperature-measured object such as a substrate in the fields of semiconductor and liquid crystal production, for example. Specifically, the present invention relates to a temperature measurement member, a temperature measurement device, and a temperature measurement method for measuring the maximum temperature reached during the temperature received by an object to be measured. Background technique [0002] Typical examples of measuring tools for measuring the temperature of the object to be measured include: tools utilizing changes in thermal expansion coefficients of gases and liquids, tools for measuring temperature changes in electrical impedance of metals (platinum impedance temperature sensors), A tool for measuring temperature changes in semiconductor properties (thermistor), a tool for measuring thermoelectromotive force (thermocouple) generated at the contact poin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K11/00
Inventor 水野雅夫平野贵之富久胜文
Owner KOBE STEEL LTD
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