Board for measuring parallelism between surfaces of upper and lower surface plates, system for measuring parallelism between surfaces of upper and lower surface plates, and method for adjusting distan

A measuring system and parallelism technology, which is applied in the field of adjusting the surface distance of the upper and lower die bases, can solve the problems of troublesome compensation operations, inability to measure parallelism, etc., and achieve the effect of simple processing.

CN100470195CInactive Publication Date: 2009-03-18TAKAHASHI KEISEI
6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2009-03-18
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A board (3) for accurately and easily measuring a parallelism between the surfaces of upper and lower surface plates. A plurality of mounting parts for measuring units (32) are formed on a board body (31). Each of the measuring units (32) comprises a displacement mechanism part having an upward biased displacement element displacing according to the distance between the surface of an upper surface plate (21) and the surface of a lower surface plate (22), a distance-between-upper-and-lower-surface-plates measuring part for digitally measuring a displacement value A of the displacement element equivalent to a minimum distance between the surfaces of the upper surface plate (21) and the lower surface plate (22), and a measured result output part outputting the measured results by the distance-between-upper-and-lower-surface-plates measuring part (122).
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a plate for measuring the parallelism of the surface of the upper and lower die bases, a system for measuring the parallelism of the surface of the upper and lower die bases, and the upper and lower die bases Adjustment method for surface spacing. Background technique

[0002] For example, most sheet products, sheet / film material products, such as synthetic resin sheets / films made of horse manure paper (thick paper) and synthetic resins used for packaging boxes, liquid crystal screens, etc. ) is formed by stamping raw materials (sheet products, sheet / film materials). usually as Figure 14 As shown, this ejector device 90 places the ejector blade 80 on the lower mold base 902, and the raw material F ( Figure 14 (middle is a film) is placed on the ejector blade 80, press the upper die holder 901 to the height of the cutting edge (Thomson blade) 801 formed on the ejector blade 80, and perform the ejection of the raw mate...

Examples

Embodiment Construction

[0053] The present invention will be described with reference to the accompanying drawings. figure 1 - Fig. 4 is an explanatory view showing a first embodiment of the plate for measuring the parallelism of the upper and lower die base surfaces of the present invention. figure 1 Fig. 2 is an explanatory view showing a plate for measuring the parallelism of the upper and lower die base surfaces (Fig. 2(A) is a side explanatory view, and Fig. 2(B) is a top view explanatory view); Fig. 3 It is an enlarged explanatory diagram of the measurement unit (Fig. 3(A) is a side explanatory diagram, and Fig. 3(B) is a top view explanatory diagram); Fig. 4 is an explanatory diagram of the action of the measurement unit (Fig. Figure 4 (B) is the figure after the displacement of the displacement member).

[0054] The plate 1 for measuring the parallelism of the upper and lower mold base surfaces is used to measure the parallelism between the upper mold base 21 and the lower mold base 22 of ...