Board for measuring parallelism between surfaces of upper and lower surface plates, system for measuring parallelism between surfaces of upper and lower surface plates, and method for adjusting distan

Abstract

A board (3) for accurately and easily measuring a parallelism between the surfaces of upper and lower surface plates. A plurality of mounting parts for measuring units (32) are formed on a board body (31). Each of the measuring units (32) comprises a displacement mechanism part having an upward biased displacement element displacing according to the distance between the surface of an upper surface plate (21) and the surface of a lower surface plate (22), a distance-between-upper-and-lower-surface-plates measuring part for digitally measuring a displacement value A of the displacement element equivalent to a minimum distance between the surfaces of the upper surface plate (21) and the lower surface plate (22), and a measured result output part outputting the measured results by the distance-between-upper-and-lower-surface-plates measuring part (122).

Description

technical field [0001] The present invention relates to a plate for measuring the parallelism of the surface of the upper and lower die bases, a system for measuring the parallelism of the surface of the upper and lower die bases, and the upper and lower die bases Adjustment method for surface spacing. Background technique [0002] For example, most sheet products, sheet / film material products, such as synthetic resin sheets / films made of horse manure paper (thick paper) and synthetic resins used for packaging boxes, liquid crystal screens, etc. ) is formed by stamping raw materials (sheet products, sheet / film materials). usually as Figure 14 As shown, this ejector device 90 places the ejector blade 80 on the lower mold base 902, and the raw material F ( Figure 14 (middle is a film) is placed on the ejector blade 80, press the upper die holder 901 to the height of the cutting edge (Thomson blade) 801 formed on the ejector blade 80, and perform the ejection of the raw mate...

AI Technical Summary

Problems solved by technology

This compensation work is quite troublesome and takes a long time even for skilled personnel

Moreover, this operation must be carried out every time the configuration of the punching die is changed and the punching die is replaced.

[0005] There is also a mechanism that can correct the inclination of the upper mold base 901 in the mold ejecting device 90, but this mold ejecting device 90 also needs to adjust the parallelism when the parallelism of the upper and lower mold bases is low (poor). But can't measure parallelism itself, compensation operation is still quite troublesome, even skilled personnel also need a long time, and change the configuration of punching die every time, and must carry out when changing punching die, in upper die base 901 or lower If the surface of the mold base 902 has unevenness, it is necessary to perform the work of pasting the metal foil H as described above.

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