System and method for measuring thickness distribution of semiconductor chips, grinding system and grinding method, and thickness allowance distirbution measuring method

Abstract

Herein, a thickness distribution measurement system, which can easily and high-precisely measure the thickness distribution of a semiconductor chip when a manipulator holds the semiconductor chip and can easily measures a semiconductor chip that is expanded towards a plurality of devices, is provided. The thickness distribution measurement system (100) includes a moving-in part (10), a storage part (30), a measuring part (50) and a moving part (70). The moving part (70) is provided with a manipulator (72), a bench (74) dipsosed on an end portion thereof, a manipulator (76) holding the semiconductor chip (W) and a moving control aprt (78). The measuring part (50) is provided with a measuring sensor (52), a linear scale (54), and a measuring control portion (56) that synchronizes the measurement values of moving distance of a rod (54R) and the thickness of the semiconductor chip (W), which is measured by the measuring sensor (52), in every time unit.

Description

technical field [0001] The present invention relates to a semiconductor wafer thickness distribution measurement system, a semiconductor wafer grinding system, a semiconductor wafer thickness distribution measurement method, a semiconductor wafer thickness margin distribution measurement method, and a semiconductor wafer grinding method. Background technique [0002] Semiconductor wafers such as silicon wafers are widely used as substrates of semiconductor devices. For example, a silicon wafer starts with the pulling process of a silicon single crystal ingot, goes through a slicing process, a surface grinding process, an etching process, and a grinding process, and is finally cleaned and processed into a polished wafer. In addition, silicon wafers are generally polished in multiple stages such as rough grinding and finish grinding, and semiconductor wafer polishing technology and semiconductor wafer thickness margin distribution measurement technology for confirming polishin...

AI Technical Summary

Problems solved by technology

Unlike the shape measurement performed by a commercially available semiconductor wafer flatness inspection device and other dedicated machines, in this measurement, the shape of the semiconductor wafer is measured while holding the semiconductor wafer, so the thickness distribution of the semiconductor wafer can be measured in a simple way (shape), this point is preferred, but according to the research of the present inventors, it can be seen that there is room for improvement in this point of measurement accuracy

Images