Zinc oxide piezoelectric film for SAW (Surface Acoustic Wave) device and manufacturing method thereof
A technology of surface acoustic wave devices and piezoelectric films, applied in the direction of electrical components, impedance networks, etc., can solve problems affecting device performance, processing difficulties, surface acoustic wave scattering, etc., achieve simple and easy preparation process, and improve electromechanical coupling coefficient , The effect of high c-axis orientation
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Embodiment 1
[0024] A preparation method for a zinc oxide piezoelectric thin film for a surface acoustic wave device, the steps are as follows:
[0025] 1) Put the monocrystalline silicon substrate Si(100) into acetone or alcohol, and use an ultrasonic cleaning machine to perform ultrasonic cleaning for 15 minutes, and dry it with cold air;
[0026] 2) Put the cleaned single crystal silicon substrate on the substrate table in the vacuum growth chamber of the excimer pulsed laser system with a wavelength of 250nm, and use a mechanical pump and a molecular pump to evacuate the vacuum growth chamber to the background vacuum degrees equal to 3×10 -4 Pa;
[0027] 3) With graphite as the target material, the working gas argon gas is introduced into the vacuum chamber, the pressure of the argon gas is 15Pa, the distance between the graphite target material and the single crystal silicon substrate is adjusted to 70mm, and the temperature of the single crystal silicon substrate is 400°C. The auto...
Embodiment 2
[0034] A preparation method for a zinc oxide piezoelectric thin film for a surface acoustic wave device, the steps are as follows:
[0035] 1) Put the monocrystalline silicon substrate Si(100) into acetone or alcohol, and use an ultrasonic cleaning machine to perform ultrasonic cleaning for 15 minutes, and dry it with cold air;
[0036]2) Put the cleaned single crystal silicon substrate on the substrate table in the vacuum growth chamber of the excimer pulsed laser system with a wavelength of 250nm, and use a mechanical pump and a molecular pump to evacuate the vacuum growth chamber to the background vacuum degrees equal to 3×10 -4 Pa;
[0037] 3) With graphite as the target material, the working gas argon gas is passed into the vacuum chamber, the pressure of the argon gas is 25Pa, the distance between the graphite target material and the single crystal silicon substrate is adjusted to 65mm, and the temperature of the single crystal silicon substrate is 400°C. The autopropa...
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