Indirect evaporative cooling refrigeration unit and heat dissipation unit for data center computer room

Abstract

The present application discloses a heat dissipation unit for a computer room of a data center, the heat dissipation unit for a computer room of a data center comprises: an evaporative cooling chiller and an indirect evaporative cooling refrigeration unit; wherein the indirect evaporative cooling refrigeration unit comprises a refrigeration module and a heat exchange module, the heat exchange module comprises a heat exchange box, a primary surface cooler arranged in the heat exchange box, a secondary surface cooler and an air supply mechanism for supplying air to the computer room; the evaporative cooling chiller comprises a cooling system and an evaporator, the inlet and outlet of the evaporator are respectively connected to the outlet and inlet of the secondary surface cooler. The present application solves the problem in the related art that the refrigeration and heat dissipation of the computer room of a data center cannot fully utilize natural cooling resources and has high energy consumption.

Description

Technical Field

[0001] The present application relates to the field of refrigeration and heat dissipation of computer rooms, and in particular to an indirect evaporative cooling refrigeration unit and a heat dissipation unit for a computer room of a data center. Background Art

[0002] At present, the construction of large data centers in my country is developing rapidly. Large data centers consume a lot of energy and have high requirements for heat dissipation. However, in some areas where power resources are scarce, power resources are very precious and cannot be used for heat dissipation in computer rooms.

[0003] Indirect evaporative cooling equipment is used in some areas for cooling and heat dissipation. Indirect evaporative cooling technology can obtain cold energy from the natural environment. Since indirect evaporative cooling cools through the evaporation of water to absorb heat, it is only possible to achieve a good cooling effect when the air used has a large dry-bulb temperature difference. When the ambient wet-bulb temperature is high, the cooling effect of the indirect evaporative cooling equipment is poor. Some places use mechanical refrigeration equipment for cooling and heat dissipation. Although mechanical refrigeration equipment can provide a relatively stable heat dissipation effect, it has a high energy consumption and cannot make full use of natural resources.

[0004] In the related technology, the cooling and heat dissipation of the computer room of the data center cannot fully utilize the natural cooling resources and has high energy consumption. At present, no effective solution has been proposed. Summary of the invention

[0005] The main purpose of the present application is to provide an indirect evaporative cooling refrigeration unit and a heat dissipation unit for a data center computer room, so as to solve the problem that the refrigeration and heat dissipation of the computer room of the data center in the related technology cannot fully utilize the natural cooling resources and has high energy consumption.

[0006] In order to achieve the above-mentioned purpose, the present application provides an indirect evaporative cooling refrigeration unit, which includes: an evaporation module, a spray system, a water tank, a heat exchange module, a primary pipeline and a secondary pipeline; wherein the heat exchange module includes a heat exchange box and a primary surface cooler arranged in the heat exchange box, a secondary surface cooler and an air supply mechanism for communicating with the evaporator of a mechanical refrigeration unit; the spray system is arranged above the evaporation module; the water tank is connected to the lower end of the evaporation module, the inlet end of the primary surface cooler is connected to the water tank through the primary pipeline, and the outlet end is connected to the spray system through the secondary pipeline.

[0007] Furthermore, the primary surface cooler, the secondary surface cooler and the air supply mechanism are arranged in sequence along the air supply direction of the machine room.

[0008] According to another aspect of the present application, a heat dissipation unit for a computer room in a data center is provided, the heat dissipation unit for a computer room in a data center comprising: an evaporative cooling chiller and an indirect evaporative cooling refrigeration unit; wherein the indirect evaporative cooling refrigeration unit comprises a refrigeration module and a heat exchange module, the heat exchange module comprises a heat exchange box, a primary surface cooler arranged in the heat exchange box, a secondary surface cooler and an air supply mechanism for supplying air to the computer room; the evaporative cooling chiller comprises a cooling system and an evaporator, the inlet and outlet ends of the evaporator are respectively connected to the outlet and inlet ends of the secondary surface cooler.

[0009] Furthermore, it also includes: a temperature monitoring module for monitoring the ambient wet-bulb temperature and / or the air supply temperature of the machine room; a control module for receiving the feedback signal from the temperature monitoring module and controlling the indirect evaporative cooling refrigeration unit and / or the evaporative cooling chiller to start.

[0010] Furthermore, the control module is used to receive the signal fed back by the temperature monitoring module, and control the indirect evaporative cooling refrigeration unit to be turned on alone or the indirect evaporative cooling refrigeration unit and the evaporative cooling chiller to be turned on together.

[0011] Furthermore, the primary surface cooler, the secondary surface cooler and the air supply mechanism are arranged in sequence along the air supply direction of the machine room.

[0012] Furthermore, the refrigeration module includes an evaporation module, a spray system, a water tank, a primary pipeline and a secondary pipeline; wherein the spray system is arranged above the evaporation module; the water tank is connected to the lower end of the evaporation module, the inlet end of the primary surface cooler is connected to the water tank through the primary pipeline, and the outlet end is connected to the spray system through the secondary pipeline.

[0013] Furthermore, both the primary surface cooler and the secondary surface cooler use coils.

[0014] According to another aspect of the present application, a heat dissipation method for a heat dissipation unit used in a computer room of a data center is provided, and the wet-bulb temperature of the outdoor air inlet is set to T1, and the specific method is as follows: when T1 is less than 19°C, the indirect evaporative cooling refrigeration unit is in an on state, and the evaporative cooling chiller is in a off state, and the cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit, and the low-temperature cooling water is sent to the primary surface cooler in the heat exchange box to cool the return air of the computer room entering the heat exchange box, and the cooled return air is sent to the computer room by the air supply mechanism, and the cooling water returns to the refrigeration module after heat exchange through the primary surface cooler, and the cycle is repeated;

[0015] When T1≥19℃, the indirect evaporative cooling refrigeration unit and the evaporative cooling chiller are both in the open state. The cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit. The low-temperature cooling water is sent to the first-level surface cooler in the heat exchange box to cool the return air from the machine room entering the heat exchange box. At the same time, the cooling system and evaporator of the evaporative cooling chiller send the cooling medium to the second-level surface cooler to cool the return air from the machine room entering the heat exchange box. The cooled return air is sent to the machine room by the air supply mechanism.

[0016] According to another aspect of the present application, a heat dissipation method for a heat dissipation unit used in a computer room of a data center is provided, wherein the air supply temperature of the computer room is set to T2, and the specific method is as follows:

[0017] When T2≤26℃, the indirect evaporative cooling refrigeration unit is in the on state, and the evaporative cooling chiller is in the off state. The cooling water is cooled by air to a temperature close to the wet bulb temperature of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit. The low-temperature cooling water is sent to the primary surface cooler in the heat exchange box to cool the return air of the machine room entering the heat exchange box. The cooled return air is sent to the machine room by the air supply mechanism. The cooling water returns to the refrigeration module after heat exchange through the primary surface cooler, and the cycle continues.

[0018] When T2>26℃, the indirect evaporative cooling refrigeration unit and the evaporative cooling chiller are both in the open state. The cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit. The low-temperature cooling water is sent to the first-level surface cooler in the heat exchange box to cool the return air from the machine room entering the heat exchange box. At the same time, the cooling system and evaporator of the evaporative cooling chiller send the cooling medium to the second-level surface cooler to cool the return air from the machine room entering the heat exchange box. The cooled return air is sent to the machine room by the air supply mechanism.

[0019] In the embodiment of the present application, a secondary surface cooler is added, and an evaporation module, a spray system, a water tank, a heat exchange module, a primary pipeline and a secondary pipeline are set. The heat exchange module includes a heat exchange box and a primary surface cooler installed in the heat exchange box, an air supply mechanism and a secondary surface cooler for connecting to the evaporator of the mechanical refrigeration unit. The spray system is arranged above the evaporation module, and the water tank is connected to the primary surface cooler, so that the purpose of connecting the mechanical refrigeration unit through the secondary surface cooler is achieved, thereby realizing the technical effect of cooperating the indirect evaporative cooling equipment with the mechanical refrigeration equipment for refrigeration, thereby solving the problem in the related technology that the indirect evaporative cooling equipment cannot effectively cooperate with the mechanical refrigeration equipment for refrigeration, resulting in greater refrigeration limitations. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings constituting a part of this application are used to provide a further understanding of this application, so that other features, purposes and advantages of this application become more obvious. The schematic embodiment drawings and their descriptions of this application are used to explain this application and do not constitute an improper limitation on this application. In the drawings:

[0021] Figure 1 is a schematic diagram of the structure according to an embodiment of the present application;

[0022] Figure 2 is a structural schematic diagram of an indirect evaporative cooling refrigeration unit according to an embodiment of the present application;

[0023] Among them, 1 spray system, 2 evaporation module, 3 water tank, 4 secondary pipeline, 5 primary surface cooler, 6 heat exchange box, 7 secondary surface cooler, 8 air supply mechanism, 9 indirect evaporative cooling refrigeration unit, 10 primary pipeline, 11 fourth-level pipeline, 12 third-level pipeline, 13 evaporator, 14 evaporative cooling chiller, 15 compressor, 16 cooling system. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so as to describe the embodiments of the present application described herein.

[0026] In this application, the terms "upper", "lower", "inner", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0027] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0028] In addition, the terms "disposed", "provided with", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0029] In addition, the term "plurality" shall mean two or more.

[0030] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0031] like Figure 1 to Figure 2 As shown, an embodiment of the present application provides an indirect evaporative cooling refrigeration unit, which includes: an evaporation module 2, a spray system 1, a water tank 3, a heat exchange module, a primary pipeline 10 and a secondary pipeline 4; wherein the heat exchange module includes a heat exchange box 6 and a primary surface cooler 5 arranged in the heat exchange box 6, a secondary surface cooler 7 and an air supply mechanism 8 for communicating with the evaporator 13 of the mechanical refrigeration unit; the spray system 1 is arranged above the evaporation module 2; the water tank 3 is connected to the lower end of the evaporation module 2, the inlet end of the primary surface cooler 5 is connected to the water tank 3 through the primary pipeline 10, and the outlet end is connected to the spray system 1 through the secondary pipeline 4.

[0032] In this embodiment, when the ambient wet-bulb temperature meets the refrigeration requirements, the cooling water in the water tank 3 is transported to the primary surface cooler 5 in the heat exchange box 6 through the primary pipeline 10 to cool the return air of the machine room entering the heat exchange box 6, and the cooled return air is sent to the machine room by the air supply mechanism 8. After the cooling water passes through the primary surface cooler 5 for heat exchange, it is transported to the spray system 1 through the secondary pipeline 4. The spray system 1 sprays the cooling water carrying heat to the evaporation module 2. The cooling water is cooled to a wet-bulb temperature close to the air on the evaporation module 2 and stored in the water tank 3. In this way, the process of refrigeration based on the ambient wet-bulb temperature is completed in a cycle. When the ambient wet-bulb temperature is high, the inlet and outlet ends of the secondary surface cooler 7 can be respectively The outlet and inlet ends of the evaporator 13 of the mechanical refrigeration unit (such as the evaporative cooling chiller 14) are connected. At this time, the primary surface cooler 5 continues to work and cools the return air from the machine room once. The cooling medium is transported to the secondary surface cooler 7 by the mechanical refrigeration unit, and the return air from the machine room in the heat exchange box 6 is cooled for a second time. Under the joint action of the primary surface cooler 5 and the secondary surface cooler 7, the return air from the machine room is effectively cooled, and the natural resources, that is, the ambient wet-bulb temperature, can be fully utilized to cool the return air from the machine room, effectively reducing energy consumption. The secondary surface cooler 7 in the heat exchange box 6 can be used to combine the mechanical refrigeration unit with the indirect evaporative cooling equipment for cooling, thereby improving the cooling efficiency.

[0033] like Figure 1 to Figure 2 As shown, the primary surface cooler 5, the secondary surface cooler 7 and the air supply mechanism 8 are arranged in sequence along the air supply direction of the machine room, that is, the secondary surface cooler 7 is located between the primary surface cooler 5 and the air supply mechanism 8. When the ambient wet-bulb temperature does not meet the cooling requirement, the return air from the machine room is first cooled by the primary surface cooler 5 whose temperature is close to the ambient wet-bulb temperature, and then secondarily cooled by the secondary surface cooler 7 with a lower temperature. The return air from the machine room after secondary cooling meets the supply air temperature of the machine room, and the air supply mechanism 8 then sends the cold air into the machine room. Here, the air supply mechanism 8 can adopt an air supply fan installed in the heat exchange box 6. To facilitate air flow, the heat exchange box 6 is provided with an air inlet for the return air from the machine room and an air outlet for the supply air to the machine room. The primary surface cooler 5 and the air supply mechanism 8 correspond to the air inlet and the air outlet, respectively, so that the primary surface cooler 5 can cool the return air from the machine room once, and the secondary surface cooler 7 can cool the return air from the machine room twice.

[0034] like Figure 1 to Figure 2As shown, the inlet and outlet ends of the secondary surface cooler 7 are respectively connected to the tertiary pipeline 12 and the quaternary pipeline 11, and the tertiary pipeline 12 and the quaternary pipeline 11 both extend out of the heat exchange box 6 and are respectively used to connect with the outlet and inlet ends of the evaporator 13 of the mechanical refrigeration unit. In order to facilitate the connection between the secondary surface cooler 7 and the mechanical refrigeration unit, the inlet and outlet ends of the secondary surface cooler 7 are respectively connected to the tertiary pipeline 12 and the quaternary pipeline 11. In order to avoid leakage of cold air, the connection between the tertiary pipeline 12 and the quaternary pipeline 11 and the heat exchange box 6 is sealed. The sealing method can be glue injection sealing or sealing with a rubber sealing ring, which will not be repeated here.

[0035] like Figure 1 to Figure 2 As shown, a first temperature sensor for monitoring the supply air temperature of the machine room is arranged in the heat exchange box 6. The first temperature sensor is located on the side wall of the heat exchange box 6 and is arranged close to the air outlet. The supply air temperature of the machine room is a set value, which can be 25±1°C. The first temperature sensor is used to monitor whether the supply air temperature of the machine room is higher than the set value. When it is higher than the set value, a signal is output and a mechanical refrigeration unit is started. The first-level surface cooler 5 and the second-level surface cooler 7 are used for cooling together. Both the first-level surface cooler 5 and the second-level surface cooler 7 use coils, which have the advantages of good cooling effect and high efficiency. A second temperature sensor for monitoring the ambient wet-bulb temperature is also included. The second temperature sensor is used to determine whether the ambient wet-bulb temperature meets the cooling requirements. If not, the second-level surface cooler 7 needs to be used for cooling.

[0036] like Figure 1 to Figure 2 As shown, according to another aspect of the present application, a heat dissipation unit for a computer room in a data center is provided, the heat dissipation unit for a computer room in a data center comprises: an evaporative cooling chiller 14 and an indirect evaporative cooling refrigeration unit 9; wherein the indirect evaporative cooling refrigeration unit 9 comprises a refrigeration module and a heat exchange module, the heat exchange module comprises a heat exchange box 6, a primary surface cooler 5 arranged in the heat exchange box 6, a secondary surface cooler 7 and an air supply mechanism 8 for supplying air to the computer room; the evaporative cooling chiller 14 comprises a cooling system 16 and an evaporator 13, the inlet and outlet ends of the evaporator 13 are respectively connected to the outlet and inlet ends of the secondary surface cooler 7.

[0037] In this embodiment, the evaporative cooling chiller 14 and the indirect evaporative cooling refrigeration unit 9 are combined as the refrigeration and heat dissipation unit of the data center computer room. The evaporative cooling chiller 14 uses a secondary surface cooler 7 installed in the heat exchange box 6 of the indirect evaporative cooling refrigeration unit 9, and the outlet and inlet ends of the secondary surface cooler 7 are respectively connected to the inlet and outlet ends of the evaporator 13 of the evaporative cooling chiller 14. When the ambient wet-bulb temperature meets the cooling requirement, the indirect evaporative cooling refrigeration unit 9 works alone. The cooling water in the water tank 3 is transported to the primary surface cooler 5 in the heat exchange box 6 through the primary pipeline 10 to cool the return air of the machine room entering the heat exchange box 6. The cooled return air is sent to the machine room by the air supply mechanism 8. The cooling water is transported to the spray system 1 through the secondary pipeline 4 after heat exchange in the primary surface cooler 5. The spray system 1 sprays the cooling water carrying heat to the evaporation module 2. The cooling water is cooled to a wet-bulb temperature close to the air on the evaporation module 2 and stored in the water tank 3. In this way, the process of refrigeration based on the ambient wet-bulb temperature is completed in a cycle.

[0038] When the ambient wet-bulb temperature is high, the evaporative cooling chiller 14 and the indirect evaporative cooling refrigeration unit 9 work together. When the primary cooler 5 cools the return air from the machine room, the evaporative cooling chiller 14 uses the compressor 15 and the evaporator 13 and other components to cool the cooling medium and transport it to the secondary cooler 7, and performs secondary cooling on the return air from the machine room in the heat exchange box 6. Under the joint action of the primary cooler 5 and the secondary cooler 7, the return air from the machine room is effectively cooled, and natural resources, namely the ambient wet-bulb temperature, are fully utilized to cool the return air from the machine room, effectively reducing energy consumption. The secondary cooler 7 in the heat exchange box 6 can be used to cool the return air from the machine room. The mechanical refrigeration unit and the indirect evaporative cooling device are combined for refrigeration to improve the refrigeration efficiency. The cooling medium here can be cooling water. The evaporative cooling chiller 14 and the indirect evaporative cooling refrigeration unit 9 can be installed separately and independently. It is only necessary to connect the secondary surface cooler 7 and the evaporator 13. The equipment can be installed in more installation environments, which simplifies the structure of the refrigeration unit, reduces the maintenance difficulty and maintenance cost, and forms independent spaces for the outside wind system and the computer room air treatment system to prevent the outside wind and outside evaporated water from leaking into the computer room air treatment system through the heat exchange core, affecting the cleanliness and humidity of the computer room.

[0039] like Figure 1 to Figure 2 As shown, it also includes: a temperature monitoring module for monitoring the ambient wet bulb temperature and / or the room supply air temperature; a control module for receiving the feedback signal from the temperature monitoring module and controlling the indirect evaporative cooling refrigeration unit 9 and / or the evaporative cooling chiller 14 to start.

[0040] Specifically, it should be noted that the temperature monitoring module can monitor the ambient wet-bulb temperature and the machine room supply air temperature, or it can only monitor the ambient wet-bulb temperature. Any of the two monitoring results can be used to determine whether the machine room supply air temperature meets the requirements. When the ambient wet-bulb temperature or the machine room supply air temperature is higher than the set threshold, it indicates that the indirect evaporative cooling refrigeration unit 9 cannot meet the refrigeration and heat dissipation requirements. At this time, the evaporative cooling chiller 14 needs to be turned on for mechanical refrigeration. When the ambient wet-bulb temperature meets the refrigeration requirements again, the evaporative cooling chiller 14 can be turned off. The control module is used to receive the signal fed back by the temperature monitoring module. The control module compares the signal input by the temperature monitoring module with the set threshold, and controls the indirect evaporative cooling refrigeration unit 9 to be turned on alone or the indirect evaporative cooling refrigeration unit 9 and the evaporative cooling chiller 14 to be turned on together.

[0041] like Figure 1 to Figure 2 As shown, the primary surface cooler 5, the secondary surface cooler 7 and the air supply mechanism 8 are arranged in sequence along the air supply direction of the machine room.

[0042] Specifically, it should be noted that the secondary surface cooler 7 is located between the primary surface cooler 5 and the air supply mechanism 8. When the ambient wet-bulb temperature does not meet the cooling requirement, the return air from the computer room is first cooled by the primary surface cooler 5 whose temperature is close to the ambient wet-bulb temperature, and then cooled by the secondary surface cooler 7 with a lower temperature. The return air from the computer room after secondary cooling meets the supply air temperature of the computer room, and the air supply mechanism 8 then delivers the cold air into the computer room. The air supply mechanism 8 here can adopt an air supply fan installed in the heat exchange box 6. To facilitate air flow, the heat exchange box 6 is provided with an air inlet for return air from the computer room and an air outlet for supply air to the computer room. The primary surface cooler 5 and the air supply mechanism 8 correspond to the air inlet and the air outlet, respectively, so that the primary surface cooler 5 can cool the return air from the computer room once, and the secondary surface cooler 7 can cool the return air from the computer room twice. Both the primary surface cooler 5 and the secondary surface cooler 7 adopt coils.

[0043] like Figure 1 to Figure 2 As shown, the refrigeration module includes an evaporation module 2, a spray system 1, a water tank 3, a primary pipeline 10 and a secondary pipeline 4; wherein the spray system 1 is arranged above the evaporation module 2; the water tank 3 is connected to the lower end of the evaporation module 2, the inlet end of the primary surface cooler 5 is connected to the water tank 3 through the primary pipeline 10, and the outlet end is connected to the spray system 1 through the secondary pipeline 4.

[0044] In this embodiment, a first mounting ring and a second mounting ring for mounting the first-stage surface cooler 5 and the second-stage surface cooler 7, respectively, may be further provided on the bottom plate of the heat exchange box 6, so as to facilitate the initial positioning of the first-stage surface cooler 5 and the second-stage surface cooler 7 during the installation process. A plurality of load-bearing blocks may be arranged along the circumference of the first-stage surface cooler 5 and the second-stage surface cooler 7, and the first-stage surface cooler 5 and the second-stage surface cooler 7 are both placed on corresponding load-bearing blocks, so as to increase the contact area between the first-stage surface cooler 5 and the second-stage surface cooler 7 and the air, thereby facilitating heat exchange.

[0045] like Figure 1 to Figure 2 As shown, according to another aspect of the present application, a heat dissipation method for a heat dissipation unit used in a computer room of a data center is provided, and the wet-bulb temperature of the outdoor air inlet is set to T1, and the specific method is as follows: when T1 is less than 19°C, the indirect evaporative cooling refrigeration unit 9 is in an on state, and the evaporative cooling chiller 14 is in a off state, and the cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit 9, and the low-temperature cooling water is sent to the primary surface cooler 5 in the heat exchange box 6 to cool the return air of the computer room entering the heat exchange box 6, and the cooled return air is sent to the computer room by the air supply mechanism 8, and the cooling water returns to the refrigeration module after heat exchange through the primary surface cooler 5, and this cycle is repeated;

[0046] When T1≥19℃, the indirect evaporative cooling refrigeration unit 9 and the evaporative cooling chiller 14 are both in the on state, and the cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit 9. The low-temperature cooling water is sent to the primary surface cooler 5 in the heat exchange box 6 to cool the return air from the machine room entering the heat exchange box 6. At the same time, the cooling system 16 and the evaporator 13 of the evaporative cooling chiller 14 send the cooling medium to the secondary surface cooler 7 to cool the return air from the machine room entering the heat exchange box 6, and the cooled return air is sent to the machine room by the air supply mechanism 8.

[0047] In this embodiment, compared with the common variable frequency centrifugal chiller + end precision air conditioner, the scheme has a significant energy-saving effect on the host evaporative cooling chiller 14. The selected high-efficiency evaporative cooling chiller 14 has a COP value of 8.2 under design conditions and a COP value of 8.2 under full load, which is about 15% higher than the energy efficiency of the first-level energy-efficient variable frequency centrifugal chiller (COP value of 6.30 under full load). The use of an indirect evaporative refrigeration unit at the end can reduce the start-up time of the host, and can use a natural cold source when the wet bulb temperature is ≤19°C, extending the utilization time of the natural cold source and reducing the operation time of the energy-consuming refrigeration host by 1881 hours. In addition, the indirect evaporative refrigeration unit can use a natural cold source all year round, and the evaporative cooling chiller 14 can be used as an auxiliary (supplementary) cooling, which can reduce the load of the evaporative cooling chiller by 1450%, and save 50% energy compared with the conventional variable frequency centrifugal chiller + plate exchanger + end precision air conditioner.

[0048] In this embodiment, the air supply temperature of the machine room can also be set to T2. When T1≥19°C, there are two situations, namely, when T2>T1≥19°C and when T1≥T2. The cooling and heat dissipation methods in both situations are the same as when T1≥19°C. The difference is that when T2>T1≥19°C, the energy consumption of the evaporative cooling chiller 14 will be lower than that of the other situation. Therefore, the entire unit can be set to three modes. Under different temperature conditions, different cooling and heat dissipation modes are selected to ensure that the unit always runs in the most efficient and energy-saving mode. The start and stop control of the indirect evaporative cooling refrigeration unit 9 and the evaporative cooling chiller 14 can be uniformly controlled through the control module to improve the intelligence of the heat dissipation unit. When the ambient wet-bulb temperature is higher than 19°C, the cooling capacity of the indirect evaporative cooling refrigeration unit 9 gradually decreases, and the cooling capacity of the evaporative cooling chiller 14 gradually increases until each accounts for 50%.

[0049] like Figure 1 to Figure 2 As shown, according to another aspect of the present application, a heat dissipation method for a heat dissipation unit used in a data center computer room is provided, and the air supply temperature of the computer room is set to T2, and the specific method is as follows:

[0050] When T2≤26℃, the indirect evaporative cooling refrigeration unit 9 is in the on state, and the evaporative cooling chiller 14 is in the off state. The cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit 9. The low-temperature cooling water is sent to the primary surface cooler 5 in the heat exchange box 6 to cool the return air from the machine room entering the heat exchange box 6. The cooled return air is sent to the machine room by the air supply mechanism 8. The cooling water returns to the refrigeration module after heat exchange through the primary surface cooler 5, and the cycle continues.

[0051] When T2>26℃, the indirect evaporative cooling refrigeration unit 9 and the evaporative cooling chiller 14 are both in the on state, and the cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit 9. The low-temperature cooling water is sent to the primary surface cooler 5 in the heat exchange box 6 to cool the return air from the machine room entering the heat exchange box 6. At the same time, the cooling system 16 and the evaporator 13 of the evaporative cooling chiller 14 send the cooling medium to the secondary surface cooler 7 to cool the return air from the machine room entering the heat exchange box 6, and the cooled return air is sent to the machine room by the air supply mechanism 8.

[0052] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipation method, using a heat dissipation unit for a data center computer room, the heat dissipation unit for a data center computer room comprising: Evaporative cooling chillers and indirect evaporative cooling refrigeration units; The indirect evaporative cooling refrigeration unit includes a refrigeration module and a heat exchange module, wherein the heat exchange module includes a heat exchange box, a primary surface cooler arranged in the heat exchange box, a secondary surface cooler, and an air supply mechanism for supplying air to the machine room; The evaporative cooling chiller comprises a cooling system and an evaporator, wherein the inlet and outlet of the evaporator are respectively connected to the outlet and inlet of the secondary surface cooler; It is characterized in that The heat dissipation method includes: setting the outdoor air inlet wet bulb temperature to T1, specifically in the following manner: When T1 is less than 19℃, the indirect evaporative cooling refrigeration unit is in the on state, and the evaporative cooling chiller is in the off state. The cooling water is cooled by air to a temperature close to the wet bulb temperature of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit. The low-temperature cooling water is sent to the primary surface cooler in the heat exchange box to cool the return air of the machine room entering the heat exchange box. The cooled return air is sent to the machine room by the air supply mechanism. The cooling water returns to the refrigeration module after heat exchange through the primary surface cooler, and the cycle continues. When T1≥19℃, the indirect evaporative cooling refrigeration unit and the evaporative cooling chiller are both in the open state. The cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit. The low-temperature cooling water is sent to the first-level surface cooler in the heat exchange box to cool the return air from the machine room entering the heat exchange box. At the same time, the cooling system and evaporator of the evaporative cooling chiller send the cooling medium to the second-level surface cooler to cool the return air from the machine room entering the heat exchange box. The cooled return air is sent to the machine room by the air supply mechanism.

2. A heat dissipation method, using a heat dissipation unit for a data center computer room, the heat dissipation unit for a data center computer room comprising: Evaporative cooling chillers and indirect evaporative cooling refrigeration units; The indirect evaporative cooling refrigeration unit includes a refrigeration module and a heat exchange module, wherein the heat exchange module includes a heat exchange box, a primary surface cooler arranged in the heat exchange box, a secondary surface cooler, and an air supply mechanism for supplying air to the machine room; The evaporative cooling chiller comprises a cooling system and an evaporator, wherein the inlet and outlet of the evaporator are respectively connected to the outlet and inlet of the secondary surface cooler; It is characterized in that The heat dissipation method includes: setting the air supply temperature of the computer room to T2, and the specific method is as follows: When T2≤26℃, the indirect evaporative cooling refrigeration unit is in the on state, and the evaporative cooling chiller is in the off state. The cooling water is cooled by air to a temperature close to the wet bulb temperature of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit. The low-temperature cooling water is sent to the primary surface cooler in the heat exchange box to cool the return air of the machine room entering the heat exchange box. The cooled return air is sent to the machine room by the air supply mechanism. The cooling water returns to the refrigeration module after heat exchange through the primary surface cooler, and the cycle continues. When T2>26℃, the indirect evaporative cooling refrigeration unit and the evaporative cooling chiller are both in the open state. The cooling water is cooled by the air to a wet-bulb temperature close to that of the air through the refrigeration module of the indirect evaporative cooling refrigeration unit. The low-temperature cooling water is sent to the first-level surface cooler in the heat exchange box to cool the return air from the machine room entering the heat exchange box. At the same time, the cooling system and evaporator of the evaporative cooling chiller send the cooling medium to the second-level surface cooler to cool the return air from the machine room entering the heat exchange box. The cooled return air is sent to the machine room by the air supply mechanism.

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