LED patch bracket unit, patch bracket and lamp bead

Abstract

The present invention provides a novel product, including a bracket, a patch bracket, and a lamp bead, with a new process and new structure. The bracket base includes a bracket base, the bracket base including a first base and a second base. The first base has a first platform at a higher level than both ends of the first base in the middle, and the second base has a second platform at a higher level than both ends of the second base in the middle. The present invention provides a novel product, including a bracket, a patch bracket, and a lamp bead with a new process and new structure. The bracket base is formed in a shape similar to an arch bridge, which can better withstand pressure and enhance the overall strength of the bracket base. The bracket base also increases its longitudinal depth to accommodate more solder and prevent product displacement after tinning.

Description

Technical field

[0002] The present invention relates to the technical field of LED patch brackets, and in particular to an LED patch bracket unit, a patch bracket and a lamp bead. [Background Technology]

[0004] Currently, traditional small-sized LED lamp beads are manufactured by die-bonding and wire bonding on a BT board, followed by mold-top encapsulation, and finally cut into individual finished lamp beads. As surface-mount brackets, they are commonly used in indicator lights and are also suitable for light strips. As light strips, small-sized LED products have a small back soldering surface, which can easily cause product shifting after tinning. Furthermore, the brackets are weak, which can easily cause lamp failure. [Summary of the invention]

[0006] The present invention solves the technical problems of easy product displacement after tinning and easy lamp failure caused by low bracket strength. The present invention provides an LED patch bracket unit with simple structure and reasonable design.

[0007] The present invention is achieved through the following technical solutions:

[0008] An LED patch bracket unit includes a bracket base, which includes a first base and a second base. The first base is provided with a first height platform in the middle that is higher than the two ends of the first base, and the second base is provided with a second height platform in the middle that is higher than the two ends of the second base.

[0009] In the LED patch bracket unit as described above, pins are provided on both ends of the first base and both ends of the second base.

[0010] In the LED patch bracket unit as described above, the bracket base further includes a connecting portion for connecting the first height platform and the second height platform.

[0011] In the LED patch bracket unit as described above, the first base and the second base are arranged parallel to each other, and the angle between the connecting portion and the first base and the second base is an acute angle.

[0012] In the LED patch bracket unit as described above, the height distance a between the bottom of the first height platform and the bottoms of both ends of the first base is greater than 0.5 mm.

[0013] In the LED patch bracket unit as described above, first grooves arranged along the width direction of the first base are respectively provided at both ends of the first base and both ends of the second base.

[0014] In the LED patch bracket unit as described above, a second groove parallel to the first groove is provided on the first base and the second base.

[0015] The LED patch bracket unit as described above also includes a plastic body arranged around the peripheral side of the bracket base to form a soldering pad, and the plastic body includes an insulating groove arranged around the outer periphery of the connecting portion to form an insulating groove that separates the soldering pad into a large soldering pad and a small soldering pad.

[0016] The present invention further discloses a patch bracket, comprising an LED patch bracket body, wherein the LED patch bracket body is provided with a plurality of LED patch bracket units as described above that are arranged and connected.

[0017] The present invention also discloses a lamp bead, comprising the LED patch bracket unit described above.

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] 1. The present invention provides an LED patch bracket unit, comprising a bracket base, the bracket base comprising a first base and a second base. The first base has a central portion provided with a first platform at a height higher than both ends of the first base, and the second base has a central portion provided with a second platform at a height higher than both ends of the second base. The bracket base is shaped like an arch bridge, which can better withstand pressure and enhance the overall strength of the bracket base. Furthermore, the bracket base has an increased longitudinal depth, accommodating more solder and preventing product displacement after soldering.

[0020] 2. The original patch bracket structure requires a mold top cutting process, which has many processes, resulting in high costs and large investments. The patch bracket of the present invention adopts patch-type hardware stamping, electroplating, injection molding, and bending processes to reduce costs, optimize processes, and improve efficiency. The bracket base is made of hardware stamping, and the manufacturing process is simple and the cost is low. The solder pads of an LED patch bracket unit of the present invention are large and separated by PPA insulating glue at a large distance in the middle, which improves the airtightness of the product, solves the problem of easy migration of tin, and improves quality.

Brief Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a structural schematic diagram of the present invention;

[0024] Figure 2 It is a schematic diagram of the structural decomposition of the present invention;

[0025] Figure 3is a top view of the present invention;

[0026] Figure 4 It is a structural diagram of the patch bracket. [Specific implementation method]

[0028] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] When ordinal numbers such as "first" and "second" are mentioned in the embodiments of the present invention, unless they actually express the meaning of order according to the context, they should be understood as being merely for the purpose of distinction.

[0030] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0031] An LED patch bracket unit includes a bracket base 1, wherein the bracket base 1 includes a first base 11 and a second base 12. A first height platform 2 is provided in the middle of the first base 11 and is higher than the two ends of the first base 11. A second height platform 3 is provided in the middle of the second base 12 and is higher than the two ends of the second base 12.

[0032] This embodiment provides an LED patch bracket unit, including a bracket base, wherein the bracket base includes a first base and a second base, wherein the middle portion of the first base is provided with a first height platform higher than the two ends of the first base, and the middle portion of the second base is provided with a second height platform higher than the two ends of the second base. The bracket base is formed into a shape similar to an arch bridge, which can better withstand pressure, strengthen the overall strength of the bracket base, and increase the longitudinal depth of the bracket base to accommodate more solder, thereby preventing the product from shifting after tinning. The first height platform and the second height platform make the bracket base arch bridge-shaped, which can withstand pressure from above, and the area above is relatively large, so the top is also the direction most susceptible to pressure. Therefore, enhancing the strength of the bracket base from the direction where the lamp beads are susceptible to pressure is quite effective in protecting the bracket base.

[0033] The original patch bracket structure requires a mold top cutting process, which has many processes and results in high costs and large investments. The patch bracket of the present invention adopts patch-type hardware stamping, electroplating, injection molding, and bending processes to reduce costs, optimize processes, and improve efficiency. The bracket base is made of metal stamping, and the manufacturing process is simple and the cost is low. The solder pads of an LED patch bracket unit of the present invention are large and separated by PPA insulating glue at a large distance in the middle, which improves the air tightness of the product, solves the problem of easy migration of tin, and improves quality.

[0034] Furthermore, as a preferred embodiment of this solution but not limiting, pins 4 are provided at both ends of the first base 11 and the second base 12. Pins are provided at both ends of the first base and the second base, and the pins are used to connect the LED lamp beads to the circuit board. The pin setting method is simple and reliable.

[0035] Furthermore, as a preferred embodiment of the present invention but not a limitation thereof, the support base 1 further includes a connecting portion 50 for connecting the first height platform 2 and the second height platform 3. The support base further includes a connecting portion for connecting the first height platform and the second height platform. The connecting portion connects the first height platform and the second height platform, thereby strengthening the strength of the support base composed of the first base and the second base. Not only does it play a role in mutual support, but the connecting portion can also be used to distinguish the positive and negative poles of the soldering pad, thereby preventing the positive and negative poles from being connected and causing damage to the LED lamp beads. In this embodiment, the connecting portion is covered by an insulating groove made of PPA insulating plastic.

[0036] Furthermore, as a preferred embodiment of this solution but not a limitation, the first base 11 and the second base 12 are arranged parallel to each other, and the angle between the connecting portion 50 and the first base 11 and the second base 12 is an acute angle. The first base and the second base are arranged parallel to each other, and the angle between the connecting portion and the first base 11 and the second base 12 is an acute angle, that is, the connecting portion is inclined relative to the first base and the second base. When the connecting portion is arranged at an angle, the contact area with the plastic body can be increased compared to when the connecting portion is arranged perpendicular to the first base and the second base, thereby increasing the force points, preventing the bracket base from breaking, and strengthening the bracket base.

[0037] Furthermore, as a preferred embodiment of this solution, but not limiting, the first base 11 and the second base 12 are arranged parallel to each other, and the angle between the connecting portion 50 and the first base 11 is 70°, and the angle between the connecting portion 50 and the second base 12 is 70°. The first and second bases are arranged parallel to each other, and the angle between the connecting portion and the first base is 70°, and the angle between the connecting portion and the second base is 70°. If the angle between the connecting portion and the first base is too large, the increased area of ​​the inclined connecting portion compared to the vertically arranged connecting portion is insufficient, resulting in insufficient reinforcement. If the angle between the connecting portion and the first base is too small, the corners of the solder pads formed by the connecting portion and the plastic body are too sharp, making it difficult to fill with solder. A 70° angle between the connecting portion and the first base achieves both the strength of the bracket base and the uniform filling of the solder pads. Furthermore, when the connecting portion is arranged vertically, it is difficult to distinguish the left and right sides of the bracket base. In contrast, an inclined connecting portion makes it easier to distinguish the orientation of the bracket base.

[0038] Furthermore, as a preferred embodiment of this solution but not a limitation, the height distance a between the bottom of the first height platform 2 and the bottoms of both ends of the first base 11 is greater than 0.5 mm. This height distance a between the bottom of the first height platform and the bottoms of both ends of the first base is greater than 0.5 mm, which can effectively solve the problem of solder paste connecting after tinning, thereby preventing short circuits.

[0039] Furthermore, as a preferred embodiment of the present invention but not a limitation, both ends of the first base 11 and both ends of the second base 12 are respectively provided with a first groove 6 arranged along the width direction of the first base 11. Both ends of the first base and both ends of the second base are respectively provided with a first groove arranged along the width direction of the first base. The first groove is arranged along the width of the first base, which is beneficial to increase the contact area between the plastic body and the bracket base, improve the fixed connection effect, and improve the air tightness of the product. At the same time, when the plastic body is subjected to a force along the length direction of the first base, the cooperation between the first groove and the plastic body can reduce the force along the length direction of the first base received by the first height platform and the second height platform, and can also achieve the effect of strengthening the bracket base. The first groove can enhance the overall adhesion effect between the plastic body and the bracket base, and prevent local deformation caused by force.

[0040] Furthermore, as a preferred embodiment of this solution but not limiting, the first base 11 and the second base 12 are provided with a second groove 7 arranged parallel to the first groove 6. The first base and the second base are provided with a second groove arranged parallel to the first groove. The second groove can further increase the contact area between the plastic body and the bracket base on the basis of the first groove, improving the fixed connection effect, and forming a double-layer sealing structure to improve the airtightness of the product.

[0041] Furthermore, as a preferred embodiment of the present invention but not a limitation thereof, it further includes a plastic body 8 arranged around the side of the bracket base 1 to form a soldering pad 80, and the plastic body 8 includes an insulating groove 5 arranged around the outer periphery of the connecting portion 50 to form the soldering pad 80 and to separate the soldering pad 80 into a large soldering pad 81 and a small soldering pad 82. The plastic body arranged around the side of the bracket base to form a soldering pad, the plastic body includes an insulating groove arranged around the outer periphery of the connecting portion to separate the soldering pad into a large soldering pad and a small soldering pad. The insulating groove is used to separate the soldering pad into a large soldering pad and a small soldering pad with a smaller area than the large soldering pad. Since unstable welding often occurs when the soldering pad area is small, and the product is easily displaced after tinning, it is beneficial to fix the chip by dividing it into large soldering pads with a larger area using the connecting portion to achieve a good fixing effect. The small soldering pad can be used for soldering wires to connect the chip to the bracket base.

[0042] This embodiment also discloses a patch holder, including an LED patch holder body 9, which is provided with a plurality of connected and arranged LED patch holder units, as described above. This new product, with its new process and new structure, features 50 rows and 80 lines of 3mm spacing, capable of producing 4,000 pieces at a time, significantly improving productivity and reducing costs.

[0043] This embodiment also discloses a lamp bead, including an LED patch bracket unit as described above.

[0044] In this embodiment, the bracket base, the connecting portion, the first groove and the second groove are formed by stamping at one time.

[0045] The working principle of this embodiment is as follows:

[0046] This embodiment provides an LED patch bracket unit, including a bracket base, wherein the bracket base includes a first base and a second base, wherein the middle portion of the first base is provided with a first height platform higher than the two ends of the first base, and the middle portion of the second base is provided with a second height platform higher than the two ends of the second base. The bracket base is formed into a shape similar to an arch bridge, which can better withstand pressure, strengthen the overall strength of the bracket base, and increase the longitudinal depth of the bracket base to accommodate more solder, thereby preventing the product from shifting after tinning. The first height platform and the second height platform make the bracket base arch bridge-shaped, which can withstand pressure from above, and the area above is relatively large, so the top is also the direction most susceptible to pressure. Therefore, enhancing the strength of the bracket base from the direction where the lamp beads are susceptible to pressure is quite effective in protecting the bracket base.

[0047] The original patch bracket structure requires a mold top cutting process, which has many processes and results in high costs and large investments. The patch bracket of the present invention adopts patch-type hardware stamping, electroplating, injection molding, and bending processes to reduce costs, optimize processes, and improve efficiency. The bracket base is made of metal stamping, and the manufacturing process is simple and the cost is low. The solder pads of an LED patch bracket unit of the present invention are large and separated by PPA insulating glue at a large distance in the middle, which improves the air tightness of the product, solves the problem of easy migration of tin, and improves quality.

[0048] The connecting portion connects the first and second platforms, strengthening the support base formed by the first and second bases. Not only does this provide mutual support, but the connecting portion also distinguishes the positive and negative terminals of the solder pads, preventing damage to the LEDs caused by contact between the positive and negative terminals. In this embodiment, the connecting portion is covered by an insulating groove made of PPA insulating plastic.

[0049] When the connecting portion is tilted, the contact area with the plastic body can be increased compared to when the connecting portion is perpendicular to the first base and the second base, thereby increasing the stress point, preventing the bracket base from breaking, and strengthening the bracket base.

[0050] The first groove, arranged along the width of the first base, increases the contact area between the plastic body and the bracket base, enhancing the secure connection and improving the product's airtightness. Furthermore, when the plastic body is subjected to forces along the length of the first base, the first groove, in conjunction with the plastic body, reduces the forces exerted on the first and second height platforms along the length of the first base, thereby strengthening the bracket base. The first groove improves the overall adhesion between the plastic body and the bracket base, preventing localized deformation caused by stress.

[0051] Insulation slots are used to separate the pads into larger pads and smaller pads. Since smaller pads often result in unstable soldering and can easily shift the product after tinning, using the connection section to create larger pads facilitates securing the chip and achieves a good fixation effect. The smaller pads can be used for wire bonding, connecting the chip to the bracket base.

[0052] The above are implementation methods provided in conjunction with specific content, and the specific implementation of this application is not limited to these descriptions. Any method structure that is similar to the method structure of this application, or any technical deduction or replacement based on the concept of this application, should be considered as the scope of protection of this application.

Claims

1. An LED patch bracket unit, characterized by: The invention comprises a support base (1), wherein the support base (1) comprises a first base (11) and a second base (12), wherein a first height platform (2) higher than both ends of the first base (11) is provided in the middle of the first base (11), and a second height platform (3) higher than both ends of the second base (12) is provided in the middle of the second base (12), and the first height platform (2) and the second height platform (3) make the support base (1) have an arch bridge shape; Pins (4) are provided at both ends of the first base (11) and at both ends of the second base (12); The support base (1) further comprises a connecting portion (50) connecting the first height platform (2) and the second height platform (3); The first base (11) and the second base (12) are arranged parallel to each other, and the angle between the connecting portion (50) and the first base (11) and the second base (12) is an acute angle; The height distance a between the bottom of the first height platform (2) and the bottoms of both ends of the first base (11) is greater than 0.5 mm; Both ends of the first base (11) and both ends of the second base (12) are respectively provided with first grooves (6) arranged along the width direction of the first base (11); A second groove (7) arranged parallel to the first groove (6) is provided on the first base (11) and the second base (12).

2. The LED patch bracket unit according to claim 1, characterized in that: The invention also includes a plastic body (8) arranged around the peripheral side of the bracket base (1) to form a soldering pad (80), and the plastic body (8) includes an insulating groove (5) arranged on the outer periphery of the connecting portion (50) to form an isolation groove (5) for separating the soldering pad (80) into a large soldering pad (81) and a small soldering pad (82).

3. Patch bracket, characterized by: The invention comprises an LED patch bracket body (9), wherein the LED patch bracket body (9) is provided with a plurality of LED patch bracket units according to any one of claims 1 to 2 which are arranged and connected.

4. Lamp beads, characterized by: It comprises an LED patch bracket unit as described in any one of claims 1-2.

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