Display device

Abstract

A display device is provided. The display device includes: a display panel including a display area including a plurality of pixels and a pad area arranged around the display area; and a printed circuit board on which a plurality of lead wirings attached to the pad area of ​​the display panel are arranged, wherein the display panel includes a plurality of signal wirings arranged on the pad area of ​​the display panel and connected to the pixels and an inorganic pattern arranged between each signal wiring and each lead wiring.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0025220, filed on Mar. 5, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0002] Exemplary embodiments of the invention relate generally to a display device, and more particularly, to a display device having an internal structure that facilitates testing to determine whether a bond between a signal wiring and a PCB connection pad (also referred to as a "pad") is defective. Background Art

[0003] A display device is a device for visually displaying data. The display device includes a substrate divided into a display area and a non-display area. In the display area, a plurality of pixels are arranged on the substrate. In the non-display area, a plurality of pads and the like are arranged on the substrate. A flexible film (COF film) provided with a driving circuit and the like is bonded to the plurality of pads to transmit a driving signal to the pixels.

[0004] The flexible film may include a plurality of leads bonded to a plurality of pads, and each lead may be individually bonded to the pad. The bonding may be performed by an anisotropic conductive film or an ultrasonic bonding process in which the pad and the leads are directly surface-bonded to each other.

[0005] However, when the pad and the lead are directly surface-bonded to each other in the ultrasonic bonding process, since the mark does not remain unlike a bonding process using an anisotropic conductive film (ACF), it is difficult to determine whether the bonding is acceptable or defective through an image of the mark.

[0006] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute prior art. Summary of the invention

[0007] A display device constructed according to the principles and exemplary embodiments of the invention includes a pad having a mark in the form of a recessed pattern caused by an ultrasonic bonding process. The mark can be visible during an inspection process for testing whether the bonding between a lead for signal wiring of a display and a pad for connecting to a circuit board is defective.

[0008] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0009] According to one aspect of the invention, a display device includes: a display panel including a display area including a plurality of pixels and a pad area at least partially arranged around the display area; and a printed circuit board having a plurality of lead wirings attached to the pad area of ​​the display panel, wherein the display panel includes a plurality of signal wirings arranged in the pad area of ​​the display panel and connected to the pixels and a pattern arranged between at least some of the signal wirings and at least some of the lead wirings, the pattern including a material with higher rigidity than the signal wirings and the lead wirings.

[0010] The display panel may further include: a connection wiring, which is arranged below the signal wiring and has a planar size smaller than a planar size of the signal wiring; and an insulating pattern, which is arranged between the connection wiring and the signal wiring, wherein the insulating pattern exposes a portion of the connection wiring, and the exposed connection wiring is electrically connected to the signal wiring.

[0011] The high rigidity pattern may be surrounded by the insulating pattern.

[0012] The signal wiring may include a pad pressing portion overlapping the high rigidity pattern and a pad bonding portion not overlapping the high rigidity pattern, and the pad pressing portion of the signal wiring contacts the high rigidity pattern.

[0013] The pad bonding portion may be bonded to the lead wiring, and a thickness of the pad bonding portion from a surface of the connection wiring may be greater than a thickness of the pad pressing portion from the surface of the connection wiring.

[0014] The pad bonding portion may be directly connected to the lead wiring.

[0015] The pad bonding portion may be ultrasonically connected to the lead wiring.

[0016] The lead wiring may include a lead pressing portion overlapping the high rigidity pattern and a wire bonding portion not overlapping the high rigidity pattern, and the lead pressing portion is in contact with the high rigidity pattern.

[0017] The lead wiring may include a first lead surface facing the signal wiring and a second lead surface opposite to the first lead surface, and the thickness from the second lead surface of the lead bonding portion to the first lead surface is greater than the thickness from the second lead surface of the lead pressing portion to the first lead surface.

[0018] The high rigidity pattern may include a plurality of inorganic cells arranged in a direction from an end of the pad region toward the display region, and the insulating pattern includes a main pattern portion covering an edge of the connection wiring and a bridge pattern portion disposed between adjacent inorganic cells.

[0019] The plurality of inorganic cells may define a plurality of contact holes disposed between the main pattern portion and the bridge pattern portion, and each of the contact holes is disposed to overlap the plurality of inorganic cells.

[0020] Each signal wiring may include a pad pressing portion overlapping each of the multiple inorganic units, a first pad bonding portion not overlapping each of the multiple inorganic units and not overlapping the insulating pattern, and a second pad bonding portion not overlapping each of the multiple inorganic units and overlapping the insulating pattern, and the pad pressing portion of the signal wiring is in contact with each of the multiple inorganic units.

[0021] Each of the first pad bonding portion and the second pad bonding portion may be bonded to each lead wiring, and a thickness of the second pad bonding portion from a surface of the connection wiring is greater than a thickness of the first pad bonding portion from the surface of the connection wiring.

[0022] The high rigidity pattern may include an inorganic region.

[0023] The inorganic region may include an inorganic insulating material, and the inorganic insulating material includes silicon oxide or silicon nitride.

[0024] Each of the high-rigidity patterns may include a metal material.

[0025] According to one aspect of the invention, a display device includes: a display substrate having a display area including a plurality of pixels and a pad area at least partially arranged around the display area; a plurality of signal wirings arranged in the pad area of ​​the display substrate and connected to the pixels; a plurality of lead wirings attached to the pads in the pad area; a connecting wiring arranged below the signal wiring and having a planar size smaller than a planar size of the signal wiring; an insulating pattern arranged between the connecting wiring and the signal wiring; and an inorganic pattern arranged on each signal wiring, wherein the insulating pattern exposes a portion of the connecting wiring and the exposed connecting wiring is electrically connected to the signal wiring, wherein each of the signal wirings includes a first surface facing the connecting wiring and a second surface opposite to the first surface, and wherein the inorganic pattern is arranged on the second surface of at least some of the signal wirings.

[0026] The inorganic pattern may be surrounded by the insulating pattern, the signal wiring includes a pad pressing portion overlapping the inorganic pattern and a pad bonding portion not overlapping the inorganic pattern, and the pad pressing portion of the signal wiring contacts the inorganic pattern.

[0027] The pad bonding portion may be bonded to the lead wiring, a thickness of the pad bonding portion from a surface of the connection wiring being greater than a thickness of the pad pressing portion from the surface of the connection wiring, and the pad bonding portion being directly connected to the lead wiring.

[0028] The pad bonding portion may be ultrasonically connected to the lead wiring.

[0029] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept, wherein the accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. In the drawings:

[0031] Figure 1 is a plan view of a display device constructed according to an exemplary embodiment of the invention;

[0032] Figure 2 yes Figure 1 A partially cut-away cross-sectional view of a display device;

[0033] Figure 3 It is schematically shown Figure 1 The layout of the panel pad area of ​​the display panel and Figure 1 a plan view of a partial layout of a first circuit board;

[0034] Figure 4 is a plan view showing a schematic layout of a panel pad area and a first circuit board attached to the panel pad area;

[0035] Figure 5 yes Figure 4 an enlarged plan view of a portion of

[0036] Figure 6 is along Figure 5 A cross-sectional view taken along line VI-VI';

[0037] Figure 7 is along Figure 5 A cross-sectional view taken along line VII-VII';

[0038] Figure 8 is along Figure 5 A cross-sectional view taken along line VIII-VIII';

[0039] Fig. 9 yes Figure 6 an enlarged cross-sectional view of region A;

[0040] Fig.10 is a cross-sectional view showing an inspection process of determining whether a bond between a signal wiring and a lead wiring is acceptable or defective by irradiating the signal wiring with a bond inspection light;

[0041] Fig.11A and Fig. 11Bis a plan view showing a schematic layout of a panel pad area of ​​a display panel attached to a first circuit board according to another exemplary embodiment;

[0042] Fig.12 is a plan view showing a schematic layout of a panel pad area of ​​a display panel attached to a first circuit board according to yet another exemplary embodiment;

[0043] Fig.13 is a plan view showing a schematic layout of a panel pad area of ​​a display panel attached to a first circuit board according to yet another exemplary embodiment;

[0044] Fig.14 is along Fig.13 A sectional view taken along line XIV-XIV';

[0045] Fig.15 is along Fig.13 A sectional view taken along line XV-XV';

[0046] Fig.16 is along Fig.13 A sectional view taken along line XVI-XVI';

[0047] Fig.17 is a plan view showing a layout of a display device constructed according to another exemplary embodiment; and

[0048] Fig.18 yes Fig.17 sectional view of . DETAILED DESCRIPTION

[0049] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, "embodiment" and "implementation" are interchangeable words as non-limiting examples of devices or methods using one or more inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, known structures and devices are shown in block diagram form to avoid unnecessarily obscuring various exemplary embodiments. In addition, various exemplary embodiments may be different, but need not be exclusive. For example, without departing from the inventive concept, the specific shape, construction and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0050] Unless otherwise specified, the illustrated exemplary embodiments will be understood as providing exemplary features of different details of some of the ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter individually or collectively referred to as "elements") of the various embodiments may be further combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0051] The use of cross hatching and / or shading is usually provided in the drawings to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for a specific material, material property, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments may be implemented differently, a specific process sequence may be performed in a sequence different from that described. For example, two processes described in succession may be performed substantially simultaneously or in an order opposite to that described. In addition, the same reference numerals represent the same elements.

[0052] When an element or layer is referred to as being "on" another element or layer, "connected to" or "bonded to" another element or layer, the element may be directly on, directly connected to or directly bonded to the other element or layer, or there may be an intermediate element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly bonded to" another element or layer, there is no intermediate element or layer. For this reason, the term "connection" may refer to a physical connection, an electrical connection and / or a fluid connection with or without an intermediate element. In addition, the D1 axis, the D2 axis and the D3 axis are not limited to the three axes of a rectangular coordinate system (such as an x-axis, a y-axis and a z-axis), but may be interpreted in a broader sense. For example, the D1 axis, the D2 axis and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as any combination of only X, only Y, only Z, or two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ for example. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0053] Although the terms "first", "second", etc. can be used to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, the first element discussed below can be named as the second element without departing from the disclosed teachings.

[0054] For descriptive purposes, spatially relative terms such as "under", "below", "below", "down", "above", "up", "above", "higher", "side" (e.g., as in "sidewall"), etc. may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. In addition to the orientation depicted in the accompanying drawings, the spatially relative terms are also intended to include different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is turned over, the elements described as "under" or "beneath" other elements or features will subsequently be positioned as "above" the other elements or features. Thus, the exemplary term "under" can include both above and below orientations. In addition, the device can be positioned otherwise (e.g., rotated 90 degrees or at other orientations), so the spatially relative descriptors used herein are interpreted accordingly.

[0055] The term used herein is for the purpose of describing specific embodiments, and is not intended to be limited. As used herein, unless the context clearly indicates otherwise, the singular forms "one", "one (kind / person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise", "include" and / or their variations are used in this specification, it is explained that there are stated features, integral bodies, steps, operations, elements, components and / or their groups, but one or more other features, integral bodies, steps, operations, elements, components and / or their groups are not excluded from existence or addition. It should also be noted that, as used herein, the terms "substantially (substantially)", "approximately (about)" and other similar terms are used as approximate terms and are not used as degree terms, so that they are used to explain the inherent deviations of measured values, calculated values ​​and / or provided values ​​recognized by those of ordinary skill in the art.

[0056] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views that are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances, are expected to occur. Therefore, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the shapes of the specifically illustrated regions, but rather will include deviations in shapes due to, for example, manufacturing. In this manner, the regions illustrated in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of the device, and as such, no limitation is necessarily intended.

[0057] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure is a part. Terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0058] Figure 1 is a plan view of a display device according to an exemplary embodiment. Figure 2 yes Figure 1 A cross-sectional view of a display device. Figure 3 is a plan view showing the layout of the panel pad area and a partial layout of the first circuit board. Figure 4 is a plan view showing a schematic layout of a panel pad area of ​​a display panel and a first circuit board attached to the panel pad area.

[0059] The display device 1 is a device for displaying moving images or still images. The display device 1 can be used as a display screen for various products such as televisions, laptop computers, monitors, billboards, and the Internet of Things, and portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, ultra mobile PCs (UMPCs), etc.

[0060] Reference Figures 1 to 4 The display device 1 may include a display panel 100 for displaying an image, a first circuit board 300 connected to the display panel 100 , and a second circuit board 500 connected to the first circuit board 300 .

[0061] The display panel 100 may be a light-emitting display panel including a plurality of light-emitting elements. For example, the display panel 100 may be an organic light-emitting display panel using an organic light-emitting diode (LED), a micro LED display panel using a micro LED, a quantum dot light-emitting display panel including a quantum dot LED, or any other known display panel. In the following description, for convenience, the case where the display panel 100 is an organic light-emitting display panel will be mainly described.

[0062] The display panel 100 includes a display area DA including a plurality of pixel areas and a non-display area NA disposed around the display area DA. The display area DA may be in a rectangular shape having vertical edges or rounded edges in a plan view. The display area DA may have short sides and long sides. The short sides of the display area DA may extend in a first direction DR1. The long sides of the display area DA may extend in a second direction DR2. However, the planar shape of the display area DA is not limited to a rectangular shape, but may have various other shapes such as a circular shape, an elliptical shape, and the like. The non-display area NA may be disposed adjacent to two short sides and two long sides of the display area DA. In this case, the non-display area NA may constitute a boundary of the display area DA to surround all sides of the display area DA. However, exemplary embodiments are not limited thereto, and the non-display area NA may be disposed adjacent to only two short sides or two long sides of the display area DA.

[0063] The non-display area NA of the display panel 100 further includes a panel pad area P_PA. The panel pad area P_PA may be disposed, for example, on the periphery of one short side of the display area DA, but exemplary embodiments are not limited thereto. The panel pad area P_PA may be disposed on the periphery of two short sides of the display area DA or on the periphery of two short sides and two long sides of the display area DA.

[0064] like Figure 2 As shown in FIG. 1 , the first circuit board 300 may include a printed base film 310 and a driving integrated circuit 390 disposed on the printed base film 310. The printed base film 310 may include an insulating material.

[0065] Return to reference Figure 1, the first circuit board 300 may include: a first circuit area CA1 having a side attached to the panel pad area P_PA of the display panel 100; a second circuit area CA2 disposed on one side of the first circuit area CA1 in the second direction DR2; and a third circuit area CA3 disposed on one side of the second circuit area CA2 in the second direction DR2, and the second circuit board 500 is attached to the third circuit area CA3. The second circuit area CA2 extends between the first circuit area CA1 and the third circuit area CA3. The driving integrated circuit 390 may be disposed on one surface of the second circuit area CA2 of the first circuit board 300. The driving integrated circuit 390 may be, for example, a data driving integrated circuit, and a chip on film (COF) method implemented by a data driving chip may be applied to the driving integrated circuit 390.

[0066] The second circuit board 500 may include a circuit pad area attached to the third circuit area CA3 of the first circuit board 300. A plurality of circuit pads may be provided in the circuit pad area of ​​the second circuit board 500 and connected to lead wiring provided in the third circuit area CA3 of the first circuit board 300.

[0067] Reference Figure 2 , the display device 1 also includes a panel lower sheet 200 disposed below the display panel 100. The panel lower sheet 200 can be attached to the back surface of the display panel 100. The panel lower sheet 200 includes at least one functional layer. The functional layer can be a layer that performs a heat dissipation function, an electromagnetic shielding function, a grounding function, a buffering function, a stiffness enhancement function, a support function and / or a digitization function. The functional layer can be a sheet layer, a film layer, a thin layer, a coating, a panel, a board, etc. The functional layer can be formed by a single layer, but can also be formed by a plurality of stacked films or coatings. The functional layer can be, for example, a supporting substrate, a heat dissipation layer, an electromagnetic shielding layer, an impact absorbing layer, a digitizer, etc.

[0068] like Figure 2 As shown in FIG. 1 , the first circuit board 300 may be bent downward in the third direction DR3. The other side of the first circuit board 300 and the second circuit board 500 may be located below the panel lower sheet 200. The lower surface of the panel lower sheet 200 may be bonded to the second circuit board 500 by an adhesive layer, but exemplary embodiments are not limited thereto.

[0069] The display panel 100 may include a display substrate 101 , a plurality of conductive layers, a plurality of insulating layers for electrically isolating the conductive layers, and an organic light emitting layer EL.

[0070] The display substrate 101 is substantially completely disposed throughout the display area DA and the non-display area NA. The display substrate 101 can support various components arranged thereon. In an exemplary embodiment, the display substrate 101 can be a rigid substrate including a rigid material such as glass or quartz. However, without limitation thereto, the display substrate 101 can be a flexible substrate including a flexible material such as polyimide (PI).

[0071] The buffer layer 102 may be disposed on the display substrate 101. The buffer layer 102 may prevent moisture and oxygen from penetrating from the outside through the display substrate 101. The buffer layer 102 may include silicon nitride (SiN x ) film, silicon oxide (SiO 2 ) film and silicon oxynitride (SiO x N y ) membrane.

[0072] The semiconductor layer 105 may be disposed on the buffer layer 102. The semiconductor layer 105 forms a channel of a thin film transistor. The semiconductor layer 105 is disposed in each pixel of the display area DA, and may be disposed in the non-display area NA in some cases. The semiconductor layer 105 may include a source / drain region and an active region. The semiconductor layer 105 may include polycrystalline silicon.

[0073] The first insulating layer 111 may be disposed on the semiconductor layer 105. The first insulating layer 111 may be disposed substantially over the entire surface of the display substrate 101. The first insulating layer 111 may be a gate insulating film having a gate insulating function. The first insulating layer 111 may include a silicon compound, a metal oxide, and the like. For example, the first insulating layer 111 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, and titanium oxide, alone or in combination with each other.

[0074] The first conductive layer 120 may be disposed on the first insulating layer 111. The first conductive layer 120 may include a gate electrode GE of a thin film transistor (TFT), a first electrode CE1 of a storage capacitor (Cst), and a connection wiring GSL. The connection wiring GSL may pass through the display area DA and the panel pad area P_PA. The first conductive layer 120 may include at least one metal selected from the group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The first conductive layer 120 may be a single film or a stacked film made of the above materials.

[0075] The second insulating layers 112a and 112b may be disposed on the first conductive layer 120. The second insulating layers 112a and 112b may electrically isolate the first conductive layer 120 and the second conductive layer 130 from each other. The second insulating layer 112a may be substantially disposed in the display area DA, and the second insulating layer 112b may be substantially disposed in the panel pad area P_PA. Materials of the second insulating layers 112a and 112b may be selected from among the above-mentioned materials of the first insulating layer 111. In the panel pad area P_PA, the second insulating layer 112b may include a plurality of contact holes CNT partially exposing the connection wiring GSL.

[0076] The second conductive layer 130 may be disposed on the second insulating layers 112a and 112b. The second conductive layer 130 may include a second electrode CE2 of the storage capacitor (Cst). The material of the second conductive layer 130 may be selected from the above-mentioned materials of the first conductive layer 120. The first electrode CE1 of the storage capacitor (Cst) and the second electrode CE2 of the storage capacitor (Cst) may form a capacitor through the second insulating layers 112a and 112b.

[0077] The third insulating layer 113 may be disposed on the second conductive layer 130. The third insulating layer 113 may include at least one of the above materials of the first insulating layer 111. In some exemplary embodiments, the third insulating layer 113 may include an organic insulating material. The organic insulating material may be selected from exemplary materials of the first via layer VIA1 to be described later.

[0078] The third conductive layer 140 may be disposed on the third insulating layer 113. The third conductive layer 140 may include a source electrode SE, a drain electrode DE, a high potential voltage electrode ELVDDE, and a signal wiring PAD. The third conductive layer 140 may include at least one selected from the group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The third conductive layer 140 may be a single film made of the above materials. However, it is not limited thereto, and the third conductive layer 140 may be a stacked film. For example, the signal wiring PAD may be formed by a stacked structure of Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, Ti / Cu, etc. In an exemplary embodiment, the third conductive layer 140 may be formed to include Ti / Al / Ti.

[0079] The signal wiring PAD of the third conductive layer 140 may be disposed to overlap the connection wiring GSL of the first conductive layer 120 in the thickness direction and may be electrically connected to the connection wiring GSL through the contact hole CNT of the second insulating layer 112 b .

[0080] The first via layer VIA1 may be disposed on the third conductive layer 140. The first via layer VIA1 may include an organic insulating material. The organic insulating material may include at least one of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin, and benzocyclobutene (BCB).

[0081] The upper structure of the third conductive layer 140 and the third insulating layer 113 may be removed or omitted from a partial region of the signal wiring PAD in the panel pad area P_PA. Therefore, the omitted or removed structure may expose the signal wiring PAD disposed in the panel pad area P_PA.

[0082] The first circuit board 300 may further include: a lead wiring LE on one surface of the first circuit area CA1 of the printed base film 310; and a circuit lead wiring C_LE on one surface of the third circuit area CA3. The lead wiring LE is connected to the signal wiring PAD. In an exemplary embodiment, the lead wiring LE may be directly connected to the upper surface of the exposed signal wiring PAD. For example, the lead wiring LE may be ultrasonically bonded to the signal wiring PAD.

[0083] Ultrasonic bonding may be performed by the ultrasonic device 700. The ultrasonic device 700 may include a vibration generating unit 710, a vibration unit 720 connected to the vibration generating unit 710, a pressing unit 730 for amplifying the vibration amplitude of the vibration unit 720, and a vibration transmission unit 740 connected to the vibration unit 720.

[0084] The vibration generating unit 710 may convert electrical energy into vibration energy. The vibration unit 720 may vibrate using the vibration energy converted by the vibration generating unit 710. The vibration unit 720 may vibrate with a predetermined amplitude in a predetermined vibration direction. The vibration unit 720 may amplify the amplitude in a direction parallel to the vibration direction by a pressing unit 730 connected to the vibration unit 720. The vibration transmission unit 740 may transmit the vibration of the vibration unit 720 to the ultrasonic bonding target. The support member 750 may fix the upper and lower surfaces of the vibration unit 720 to prevent the vibration unit 720 and the vibration transmission unit 740 from moving up and down due to vibration.

[0085] In an exemplary embodiment, the ultrasonic device 700 contacts the other surface of the first circuit board 300 and maintains a constant pressure state in a downward direction so that the vibration transmission unit 740 effectively transmits the vibration to the first circuit board 300. In this case, Figure 2As shown in , the ultrasonic bonding may be performed while the vibration transmission unit 740 of the ultrasonic device 700 overlaps the entire region of the first circuit board 300 disposed below the vibration transmission unit 740 .

[0086] The ultrasonic device 700 can vibrate in a predetermined vibration direction to make the lead wiring LE vibrate in the predetermined vibration direction. However, in this case, the signal wiring PAD may vibrate in the vibration direction due to the vibration transmitted through the lead wiring LE, but the amplitude of the vibration will be small. Therefore, the vibration amplitude of the vibration transmission unit 740 in the vibration direction can be regarded as being substantially equal to the distance that the lead wiring LE has moved along the vibration direction on the signal wiring PAD. In an exemplary embodiment, the vibration direction can be a second direction DR2. That is, the vibration direction can extend in the direction along the long sides of the signal wiring PAD and the lead wiring LE.

[0087] When the lead wiring LE ultrasonically vibrates on one surface of the signal wiring PAD, a predetermined friction force is generated at the interface between one surface of the signal wiring PAD and one surface of the lead wiring LE, and friction heat may be generated due to the friction force. Figure 2 As shown in , if the friction heat is sufficient to melt the materials of the signal wiring PAD and the lead wiring LE, the pad melting region PADb of the signal wiring PAD adjacent to the lead wiring LE and the lead melting region LEb of the lead wiring LE adjacent to the signal wiring PAD are fused together during melting. In other words, the signal wiring PAD may include a pad non-melting region PADa and a pad melting region PADb. In addition, the lead wiring LE may include a lead non-melting region LEa and a lead melting region LEb.

[0088] The pad non-melting region PADa may be a region including only the material of the signal wiring PAD. The lead non-melting region LEa may be a region including only the material of the lead wiring LE.

[0089] The pad melting region PADb may be a region where the material of the lead wiring LE is dispersed and the material of the signal wiring PAD is mixed. The lead melting region LEb may be a region where the material of the signal wiring PAD is dispersed and the material of the lead wiring LE is mixed.

[0090] In the pad melting region PADb and the lead melting region LEb, the signal wiring PAD and the lead wiring LE may be bonded to each other by solidification. The interface between the signal wiring PAD and the lead wiring LE (ie, the interface between the pad melting region PADb and the lead melting region LEb) may have an irregular shape such as unevenness.

[0091] For example, the lead wiring LE may include a metal material. The lead wiring LE may include at least one metal selected from the group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W) and copper (Cu). In the exemplary embodiment shown, the lead wiring LE may include copper (Cu) and gold (Au). That is, the lead wiring LE may be made of copper (Cu) disposed on the printed base film 310 and gold (Au) disposed on the copper (Cu), but is not limited thereto.

[0092] In the display device 1, in order to leave a mark for checking whether the surface bonding force between the signal wiring PAD and the lead wiring LE is acceptable after the ultrasonic bonding process, as shown in FIG. Figure 5 As shown in FIG. 1 , a plurality of inorganic patterns 180 are provided on one surface of the signal wiring PAD facing the lead wiring LE. A detailed description thereof will be given later.

[0093] The fourth conductive layer 150 may be disposed on the first via layer VIA1. The fourth conductive layer 150 may include a data line DL, a connection electrode CNE, and a high potential voltage wiring ELVDDL. The data line DL may be electrically connected to a source electrode SE of a thin film transistor (TFT) through a contact hole passing through the first via layer VIA1. The connection electrode CNE may be electrically connected to a drain electrode DE of a thin film transistor (TFT) through a contact hole passing through the first via layer VIA1. The high potential voltage wiring ELVDDL may be electrically connected to the high potential voltage electrode ELVDDE through a contact hole passing through the first via layer VIA1. The fourth conductive layer 150 may include a material selected from the materials exemplified above for the third conductive layer 140.

[0094] The second via layer VIA2 is disposed on the fourth conductive layer 150. The second via layer VIA2 may include at least one of the above-exemplified materials of the first via layer VIA1.

[0095] The anode electrode ANO is disposed on the second via layer VIA2 . The anode electrode ANO may be electrically connected to the connection electrode CNE through a contact hole passing through the second via layer VIA2 .

[0096] The bank layer BANK may be disposed on the anode electrode ANO. The bank layer BANK may include a contact hole exposing the anode electrode ANO. The bank layer BANK may be formed of an organic insulating material or an inorganic insulating material. For example, the bank layer BANK may include at least one of a photoresist, a polyimide resin, an acrylic resin, a silicon compound, a polyacrylic resin, and the like.

[0097] The organic light emitting layer EL may be disposed on the upper surface of the anode electrode ANO and in the opening of the bank layer BANK. The cathode electrode CAT is disposed on the organic light emitting layer EL and the bank layer BANK. The cathode electrode CAT may be a common electrode disposed throughout a plurality of pixels.

[0098] The thin film encapsulation layer 170 is disposed on the cathode electrode CAT. The thin film encapsulation layer 170 may cover the cathode electrode CAT and may protect the organic light emitting layer EL disposed thereunder. The thin film encapsulation layer 170 may be a laminated film in which an inorganic film and an organic film are alternately laminated. For example, the thin film encapsulation layer 170 may include a first inorganic encapsulation film 171, an organic encapsulation film 172, and a second inorganic encapsulation film 173 that are sequentially stacked.

[0099] The stacking structure and shape of the connection wiring GSL and the signal wiring PAD in the panel pad area P_PA may be modified.

[0100] For example, in some exemplary embodiments, the connection wiring GSL may include a plurality of patterns, and the signal wiring PAD disposed on the connection wiring GSL may have surface irregularities due to height differences of the patterns of the connection wiring GSL.

[0101] In some exemplary embodiments, the auxiliary signal wiring of the second conductive layer 130 may also be disposed between the connection wiring GSL and the signal wiring PAD. In this case, the plane size of the auxiliary signal wiring may be smaller than the plane size of the signal wiring PAD. The signal wiring PAD, the auxiliary signal wiring, and the connection wiring GSL may overlap each other in the thickness direction to be electrically connected.

[0102] Furthermore, in some exemplary embodiments, the connection wiring GSL may be formed of the second conductive layer 130 , and the signal wiring PAD may be formed of the fourth conductive layer 150 .

[0103] Reference Figure 3 , the signal wiring PAD is provided as a plurality, and the plurality of signal wirings PAD may be arranged to extend in the second direction DR2. The plurality of signal wirings PAD may include, for example, power signal wiring, data signal wiring, panel dummy signal wiring, etc. The second direction DR2 may be a direction from the end of the panel pad area P_PA toward the display area DA. The first direction DR1 refers to a direction intersecting with the second direction DR2.

[0104] In addition, the lead wiring LE arranged in the first circuit region CA1 may be provided in plurality and may be arranged to extend in the second direction DR2 . The plurality of lead wirings LE may include power lead wiring, data lead wiring, dummy lead wiring, and the like.

[0105] Reference Figure 4, a plurality of signal wiring PADs can be connected to a plurality of lead wirings LE. For example, the signal wiring PAD can be directly connected to the lead wiring LE and can be ultrasonically bonded. Figure 4 The first circuit area CA1 is attached to the Figure 3 The panel pad area P_PA.

[0106] Hereinafter, the configuration of the panel pad area P_PA including the plurality of inorganic patterns 180 disposed on the signal wirings PAD will be described in detail.

[0107] Figure 5 yes Figure 4 An enlarged plan view of a portion of Figure 6 is along Figure 5 A cross-sectional view taken along line VI-VI'. Figure 7 is along Figure 5 A cross-sectional view taken along line VII-VII', Figure 8 is along Figure 5 A cross-sectional view taken along line VIII-VIII'. Fig. 9 yes Figure 6 An enlarged cross-sectional view of region A, Fig.10 is a cross-sectional view showing whether the bonding between the signal wiring and the lead wiring is acceptable or defective by irradiating the signal wiring with bonding inspection light.

[0108] Reference Figures 5 to 10 The connection wiring GSL may be provided from the display area DA to the panel pad area P_PA, and may have a width increasing in the first direction DR1 in a plan view in a region overlapping with the signal wiring PAD of the panel pad area P_PA.

[0109] The second insulating layer 112b may include a contact hole CNT covering an edge portion of the connection wiring GSL and exposing a central portion of the connection wiring GSL. Figure 5 It is shown that the contact hole CNT of the second insulating layer 112 b has a rectangular shape in a plan view, but exemplary embodiments are not limited thereto, and the plan shape of the contact hole CNT may be variously modified.

[0110] The signal wiring PAD may be disposed on the second insulating layer 112b and the connection wiring GSL. The signal wiring PAD may be electrically connected to the connection wiring GSL through the contact hole CNT.

[0111] The plane size of the signal wiring PAD can be larger than the plane size of the connection wiring GSL. Figure 5As shown in, the signal wiring PAD may include: a first short side edge located above the short side edge located at the upper end of the connecting wiring GSL in the second direction DR2; a second short side edge located below the short side edge located at the lower end of the connecting wiring GSL in the second direction DR2; a first long side edge located on the left side of the long side edge located at the left end of the connecting wiring GSL in the first direction DR1; and a second long side edge located on the right side of the long side edge located at the right end of the connecting wiring GSL in the first direction DR1.

[0112] The signal wiring PAD may include a first surface facing the connection wiring GSL and a second surface opposite to the first surface. The first surface of the signal wiring PAD may be in direct contact with the second insulating layer 112b and the connection wiring GSL. The second surface of the signal wiring PAD may be in direct contact with the lead wiring LE and the inorganic pattern 180.

[0113] The second surface of the signal wiring PAD disposed to overlap the second insulating layer 112 b may protrude further in the thickness direction than the second surface of the signal wiring PAD disposed not to overlap the second insulating layer 112 b .

[0114] A plurality of inorganic patterns 180 may be disposed on the second surface of the signal wiring PAD. The inorganic pattern 180 may be disposed between the lead wiring LE and the signal wiring PAD. The inorganic pattern 180 may be located within the signal wiring PAD in a plan view and may be surrounded by the second insulating layer 112b in a plan view. The inorganic pattern 180 may be completely surrounded by the second insulating layer 112b in a plan view and may be disposed to overlap the contact hole CNT of the second insulating layer 112b in a thickness direction.

[0115] A plurality of inorganic patterns 180 may be arranged along the second direction DR2 . Figure 5 It is shown that the plurality of inorganic patterns 180 are arranged in a row along the second direction DR2. However, exemplary embodiments are not limited thereto. For example, the plurality of inorganic patterns 180 may be arranged in a row, arranged in a zigzag manner along the second direction DR2, or may be randomly arranged.

[0116] The planar shape of the inorganic pattern 180 may be circular or elliptical. The planar shape of the inorganic pattern 180 may differ according to the pattern shape of a mask used in a deposition process of the inorganic pattern 180.

[0117] The inorganic pattern 180 may include a material having a higher rigidity than the signal wiring PAD disposed thereunder and the lead wiring LE disposed thereon. For example, the inorganic pattern 180 may include an inorganic material. The inorganic material may include, for example, an inorganic insulating material or a metal material. Examples of inorganic insulating materials may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, and titanium oxide. As an example of a metal material, tungsten (W) may be mentioned.

[0118] Since the inorganic pattern 180 includes a material having higher rigidity than the signal wiring PAD disposed thereunder and the lead wiring LE disposed thereon, as will be described later, the lead wiring LE and the signal wiring PAD in a region overlapping the inorganic pattern 180 may be recessed in a direction opposite to the inorganic pattern 180 after the ultrasonic bonding process. Whether bonding of the signal wiring PAD and the lead wiring LE is acceptable or defective can be checked through the recessed shape of the signal wiring PAD.

[0119] The lead wiring LE may be disposed on the signal wiring PAD and the inorganic pattern 180. The lead wiring LE may directly contact the second surface of the signal wiring PAD and the inorganic pattern 180. The lead wiring LE may include a third surface facing the display surface and a fourth surface opposite to the third surface and facing the signal wiring PAD.

[0120] The shapes of the signal wiring PAD and the lead wiring LE according to the inorganic pattern 180 will be described in detail. The signal wiring PAD may include a pad pressing portion PPR overlapping the inorganic pattern 180 in the thickness direction and a pad bonding portion BR not overlapping the inorganic pattern 180 in the thickness direction. In a plan view, the pad pressing portion PPR of the signal wiring PAD may be completely surrounded by the pad bonding portion BR of the signal wiring PAD.

[0121] In addition, the lead wiring LE may include a lead pressing portion L_PPR overlapping the inorganic pattern 180 in the thickness direction and a lead bonding portion L_BR not overlapping the inorganic pattern 180 in the thickness direction.

[0122] The pad bonding portion BR of the signal wiring PAD may be bonded to the wire bonding portion L_BR of the lead wiring LE. The pad bonding portion BR of the signal wiring PAD may be directly surface-bonded to the wire bonding portion L_BR of the lead wiring LE. In other words, the pad bonding portion BR of the signal wiring PAD and the wire bonding portion L_BR of the lead wiring LE may be ultrasonically bonded.

[0123] On the other hand, since the pad pressing portion PPR of the signal wiring PAD and the lead pressing portion L_PPR of the lead wiring LE are spaced apart from each other with the inorganic pattern 180 interposed therebetween, they are not bonded together.

[0124] Through the ultrasonic bonding process, the second surface of the pad pressing portion PPR of the signal wiring PAD and the fourth surface of the lead pressing portion L_PPR of the lead wiring LE may be recessed in the direction opposite to the inorganic pattern 180 by the inorganic pattern 180 having higher rigidity than them.

[0125] Reference Figure 6 , during the ultrasonic bonding process, when the above reference Figure 2 When the described ultrasonic device 700 contacts the upper portion of the lead wiring LE to apply ultrasonic vibration, both the lead pressing portion L_PPR and the lead bonding portion L_BR of the lead wiring LE receive a downward force and can apply force to the signal wiring PAD in a downward direction. However, due to the inorganic pattern 180 positioned below the lead pressing portion L_PPR of the lead wiring LE, the pad pressing portion PPR of the signal wiring PAD overlapping with the inorganic pattern 180 can be recessed further downward than the pad bonding portion BR of the signal wiring PAD. That is, the pad pressing portion PPR of the signal wiring PAD can have a recessed pattern that can serve as a mark in the area overlapping with the inorganic pattern 180.

[0126] Reference Fig. 9 , the height of the second surface of the pad bonding portion BR of the signal wiring PAD may be greater than the height of the second surface of the pad pressing portion PPR of the signal wiring PAD. That is, the first thickness t1 from the first surface of the signal wiring PAD to the second surface of the pad bonding portion BR may be greater than the second thickness t2 from the first surface of the signal wiring PAD to the second surface of the pad pressing portion PPR.

[0127] In addition, the height of the fourth surface of the lead bonding portion L_BR of the lead wiring LE may be greater than the height of the fourth surface of the lead pressing portion L_PPR of the lead wiring LE. That is, the third thickness t3 from the third surface of the lead wiring LE to the fourth surface of the lead bonding portion L_BR may be greater than the fourth thickness t4 from the third surface of the lead wiring LE to the fourth surface of the lead pressing portion L_PPR.

[0128] The sum of the difference between the first thickness t1 and the second thickness t2 and the difference between the third thickness t3 and the fourth thickness t4 may be equal to the thickness of the inorganic pattern 180 .

[0129] After the ultrasonic device 700 described above applies appropriate force to the lead wiring LE and signal wiring PAD arranged thereunder, it can be determined whether the bonding between the signal wiring PAD and the lead wiring LE is acceptable or defective through the degree of bonding between the pad bonding portion BR of the signal wiring PAD and the lead bonding portion L_BR of the lead wiring LE.

[0130] In other words, when the ultrasonic device 700 applies a larger force to the lead wiring LE and the signal wiring PAD disposed thereunder, the area in which the pad bonding portion BR surface of the signal wiring PAD is bonded to the lead bonding portion L_BR of the lead wiring LE can be increased. At the same time, the difference between the first thickness t1 from the first surface of the signal wiring PAD to the second surface of the pad bonding portion BR and the second thickness t2 from the first surface of the signal wiring PAD to the second surface of the pad pressing portion PPR can be increased.

[0131] However, it is difficult to visually observe the area where the pad bonding portion BR of the signal wiring PAD is surface-bonded to the wire bonding portion L_BR of the lead wiring LE, and even when observed with the naked eye, the criteria for determining whether the bonding is acceptable or defective may not be clear.

[0132] In the display device 1 according to the exemplary embodiment, when the inorganic pattern 180 having higher rigidity than the lead wiring LE and the signal wiring PAD is provided between the lead wiring LE and the signal wiring PAD, the ultrasonic bonding process is performed. When the difference between the first thickness t1 from the first surface of the signal wiring PAD to the second surface of the pad bonding portion BR and the second thickness t2 from the first surface of the signal wiring PAD to the second surface of the pad pressing portion PPR is equal to or greater than the reference thickness difference, it can be determined that the pad bonding portion BR of the signal wiring PAD and the lead bonding portion L_BR of the lead wiring LE have secured a surface bonding area having a reference value or more of acceptable bonding.

[0133] Reference Fig.10 , by irradiating the bonding inspection light LBT to the second surface of the signal wiring PAD, it is possible to inspect whether the bonding between the signal wiring PAD and the lead wiring LE is acceptable or defective.

[0134] The bonding inspection light LBT is irradiated from the bonding inspection device. The bonding inspection device may be a differential camera or a differential scope for emitting the bonding inspection light LBT or the like.

[0135] The bonding inspection apparatus may irradiate the bonding inspection light LBT onto the second surface of the signal wiring PAD, may receive the bonding inspection light LBT reflected from the second surface, and may observe the overall surface roughness of the second surface of the signal wiring PAD.

[0136] like Fig. 9 and Fig.10 As shown in, the bonding inspection equipment can calculate the difference between the first thickness t1 from the first surface of the signal wiring PAD to the second surface of the pad bonding part BR and the second thickness t2 from the first surface of the signal wiring PAD to the second surface of the pad pressing part PPR by observing the overall surface roughness of the second surface of the signal wiring PAD, and can determine that the pad bonding part BR of the signal wiring PAD and the lead bonding part L_BR of the lead wiring LE have ensured a surface bonding area with a reference value or greater of acceptable bonding when the calculated difference between the first thickness t1 and the second thickness t2 is equal to or greater than the reference thickness difference.

[0137] In other words, in the display device 1, by setting an inorganic pattern 180 having higher rigidity than the lead wiring LE and the signal wiring PAD between the lead wiring LE and the signal wiring PAD, it is possible to easily determine whether the connection between the lead wiring LE and the signal wiring PAD is acceptable or defective, and it is also possible to clarify the standard for determining whether the connection between the lead wiring LE and the signal wiring PAD is acceptable or defective.

[0138] Hereinafter, other exemplary embodiments will be described. In the following exemplary embodiments, the same components as those of the exemplary embodiments described above are denoted by the same reference numerals, and descriptions thereof will be omitted or simplified to avoid redundancy.

[0139] Fig.11A and Fig. 11B is a plan view illustrating a schematic layout of a panel pad area of ​​a display panel and a first circuit board attached to the panel pad area according to another exemplary embodiment.

[0140] Fig.11A and Fig. 11B It is shown that the planar shapes of the inorganic patterns 180_1 and 180_2 may be variously changed.

[0141] More specifically, if Fig.11A As shown in FIG, the planar shape of the inorganic pattern 180_1 may be a quadrilateral or a rectangle. Fig. 11B As shown in FIG. 1 , the planar shape of the inorganic pattern 180_2 may be a triangle, for example, an equilateral triangle.

[0142] According to the illustrated embodiment, similar to the exemplary embodiment described above, by setting inorganic patterns 180_1 and 180_2 having higher rigidity than the lead wiring LE and the signal wiring PAD between the lead wiring LE and the signal wiring PAD, it is possible to easily determine whether the bonding between the lead wiring LE and the signal wiring PAD is acceptable or defective, and it is also possible to clarify the standard for determining whether the bonding between the lead wiring LE and the signal wiring PAD is acceptable or defective.

[0143] Fig.12 is a plan view showing a schematic layout of a panel pad area of ​​a display panel and a first circuit board attached to the panel pad area according to still another exemplary embodiment.

[0144] Reference Fig.12 , the plurality of inorganic patterns 180_3 according to the exemplary embodiment is different from the plurality of inorganic patterns 180 according to the exemplary embodiment described above in that the inorganic patterns 180_3 are arranged in a plurality of rows.

[0145] More specifically, the plurality of inorganic patterns 180_3 according to the exemplary embodiment may be arranged in a plurality of rows. Fig.12 As shown in FIG. 1 , the plurality of inorganic patterns 180_3 may include two rows separated from each other in the first direction DR1 . However, exemplary embodiments are not limited thereto, and the plurality of inorganic patterns 180_3 may include three or more rows separated from each other in the first direction DR1 .

[0146] According to the illustrated embodiment, similar to the exemplary embodiment described above, by setting a plurality of inorganic patterns 180_3 having a higher rigidity than the lead wiring LE and the signal wiring PAD between the lead wiring LE and the signal wiring PAD, it is possible to easily determine whether the bonding between the lead wiring LE and the signal wiring PAD is acceptable or defective, and it is also possible to clarify the standard for determining whether the bonding between the lead wiring LE and the signal wiring PAD is acceptable or defective.

[0147] Fig.13 is a plan view illustrating a schematic layout of a panel pad area of ​​a display panel and a first circuit board attached to the panel pad area according to still another exemplary embodiment. Fig.14 is along Fig.13 A cross-sectional view taken along line XIV-XIV'. Fig.15 is along Fig.13 A cross-sectional view taken along line XV-XV' of Fig.16 is along Fig.13 A cross-sectional view taken along line XVI-XVI'.

[0148] Reference Figures 13 to 16, the panel pad area P_PA_1 according to the illustrated embodiment is different from the panel pad area P_PA according to the exemplary embodiments described above in that the second insulating layer 112 b_1 includes a plurality of patterns.

[0149] More specifically, in the panel pad area P_PA_1 according to the illustrated embodiment, the second insulating layer 112b_1 may include a plurality of patterns. That is, the second insulating layer 112b_1 may include Figure 5 The second insulating layer 112 b shown in FIG. 1 is substantially identical to the main insulating patterns 112 b_1 a and the bridging insulating patterns 112 b_1 b connecting the main insulating patterns 112 b_1 a disposed on two long sides.

[0150] The main insulating pattern 112b_1a may cover an edge portion of the connection wiring GSL. That is, the main insulating pattern 112b_1a may include a first portion covering the left long side edge of the connection wiring GSL in the first direction DR1, a second portion covering the right long side edge of the connection wiring GSL in the first direction DR1, a third portion covering the upper short side edge of the connection wiring GSL in the second direction DR2, and a fourth portion covering the lower short side edge of the connection wiring GSL in the second direction DR2. The bridging insulating pattern 112b_1b may physically connect the first portion and the second portion. That is, the bridging insulating pattern 112b_1b may be disposed between the first portion and the second portion.

[0151] although Fig.13 It is shown that two bridge insulation patterns 112 b_1 b are arranged in the second direction DR2 , but exemplary embodiments are not limited thereto, and the number of the bridge insulation patterns 112 b_1 b may be one, three, or four or more.

[0152] The second insulating layer 112b_1 may include contact holes CNT_1 respectively located in the following portions: a portion surrounded by a third portion of the main insulating pattern 112b_1a, a bridge insulating pattern 112b_1b adjacent to the third portion, a second portion, and a first portion; a portion surrounded by a fourth portion of the main insulating pattern 112b_1a, a bridge insulating pattern 112b_1b adjacent to the fourth portion, a second portion, and a first portion; and a portion surrounded by a bridge insulating pattern 112b_1b adjacent to the third portion, a bridge insulating pattern 112b_1b adjacent to the fourth portion, a second portion, and a first portion. Because according to Fig.13 The contact hole CNT_1 of the illustrated embodiment has Figure 5 The contact holes CNT according to the exemplary embodiments have the same function, so repeated description will be omitted to avoid redundancy.

[0153] The plurality of inorganic patterns 180 may be disposed to overlap the contact holes CNT_1 , respectively, in a thickness direction, and may be respectively disposed in the contact holes CNT_1 in a plan view.

[0154] The signal wiring PAD_1 may include: a first subpad bonding portion BRa disposed in a region not overlapping the inorganic pattern 180 and the bridge insulating pattern 112b_1b in the thickness direction; and a second subpad bonding portion BRb overlapping the bridge insulating pattern 112b_1b of the second insulating layer 112b_1 in the thickness direction. A first surface of the second subpad bonding portion BRb may be in direct contact with the bridge insulating pattern 112b_1b of the second insulating layer 112b_1.

[0155] The second surface of the second subpad bonding portion BRb of the signal wiring PAD_1 may protrude from the second surface of the first subpad bonding portion BRa of the signal wiring PAD_1 toward the display surface.

[0156] The lead wiring LE_1 may include: a first sub-lead bonding portion L_BRa disposed in a region not overlapping the inorganic pattern 180 and the bridging insulating pattern 112b_1b in the thickness direction; and a second sub-lead bonding portion L_BRb overlapping the bridging insulating pattern 112b_1b of the second insulating layer 112b_1 in the thickness direction.

[0157] The height of the fourth surface of the first sub-lead bonding portion L_BRa of the lead wiring LE_1 may be greater than the height of the fourth surface of the second sub-lead bonding portion L_BRb of the lead wiring LE_1. That is, the third thickness t3 from the third surface of the lead wiring LE_1 to the fourth surface of the first sub-lead bonding portion L_BRa may be greater than the fifth thickness t5 from the third surface of the lead wiring LE_1 to the fourth surface of the second sub-lead bonding portion L_BRb.

[0158] According to the illustrated embodiment, similar to the exemplary embodiment described above, by setting a plurality of inorganic patterns 180 having higher rigidity than the lead wiring LE_1 and the signal wiring PAD_1 between the lead wiring LE_1 and the signal wiring PAD_1, it is possible to easily determine whether the bonding between the lead wiring LE_1 and the signal wiring PAD_1 is acceptable or defective, and it is also possible to clarify the criteria for determining whether the bonding between the lead wiring LE_1 and the signal wiring PAD_1 is acceptable or defective.

[0159] Fig.17 is a plan view showing a layout of a display device according to another exemplary embodiment, Fig.18 yes Fig.17 sectional view of .

[0160] Reference Fig.17 and Fig.18 , the display panel 100_4 of the display device 2 according to the exemplary embodiment may further include a bending area BA.

[0161] The display substrate of the display panel 100_4 may be formed of an insulating material such as a polymer resin. Examples of polymer resins may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof. The display substrate may be a flexible substrate that can be bent, folded, or curled. As an example of a material for a flexible substrate, polyimide (PI) may be mentioned, but exemplary embodiments are not limited thereto.

[0162] The bending area BA may be disposed between the array of the plurality of pixels and the panel pad area P_PA_2. The bending area BA may be positioned in the non-display area NA. The display panel 100_4 may be folded in one direction with respect to a bending line as a reference line disposed in the bending area BA. The bending line may be a straight line parallel to the lower side (or upper side) of the display panel 100_4. Fig.18 As shown in FIG. 1 , the bending area BA of the display panel 100_4 may be bent downward in the third direction DR3 .

[0163] However, exemplary embodiments are not limited thereto, and the display area DA and the panel pad area P_PA_2 may be connected to each other without the bending area BA. That is, in the display panel 100_4, the display area DA and the non-display area NA may be completely flat without the bending area BA.

[0164] In the panel pad area P_PA_2, the above reference Figure 5 The driving integrated circuit 900 may be attached to the plurality of signal wiring PADs.

[0165] In an exemplary embodiment, the driver integrated circuit 900 may be applied as a chip on plastic (COP) or a chip on glass (COG). The driver integrated circuit 900 may include a plurality of bumps connected to a plurality of signal wirings PAD. The bumps may be formed of at least one of gold (Au), nickel (Ni), and tin (Sn).

[0166] In the illustrated embodiment, the bumps of the driver integrated circuit 900 can be bonded to the corresponding signal wiring PAD in a direct contact manner without the intermediary of other layers or structures. The direct bonding between the signal wiring PAD and the bumps of the driver integrated circuit 900 can be performed by ultrasonic bonding. In the illustrated embodiment, the second circuit board 500_1 is attached to the display panel 100_4 in the panel pad area P_PA_3 located at the lower side of the non-display area NA. In the illustrated embodiment, as shown in Fig.18 As shown in FIG. 1 , the panel pad area P_PA_2 is an area overlapping the driving integrated circuit 900 , and the panel pad area P_PA_3 is an area overlapping the second circuit board 500_1 .

[0167] Although some exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. A display device, comprising: a display panel having a display area including a plurality of pixels and a pad area at least partially disposed around the display area; as well as a printed circuit board having a plurality of lead wirings attached to the pad area of ​​the display panel, Wherein, the display panel comprises: a plurality of signal wirings disposed in the pad region of the display panel and connected to the plurality of pixels; and A pattern is provided between at least some of the plurality of signal wirings and at least some of the plurality of lead wirings, the pattern including a material having a higher rigidity than the plurality of signal wirings and the plurality of lead wirings.

2. The display device according to claim 1, wherein: The display panel further includes: a connection wiring disposed below the plurality of signal wirings and having a planar size smaller than a planar size of the plurality of signal wirings; and an insulating pattern disposed between the connection wiring and the plurality of signal wirings, and The insulating pattern exposes a portion of the connection wiring, and the exposed connection wiring is electrically connected to the plurality of signal wirings.

3. The display device according to claim 2, wherein: The pattern of high rigidity is surrounded by the insulating pattern.

4. The display device according to claim 3, wherein: The plurality of signal wirings include pad pressing portions overlapping the pattern of high rigidity and pad engaging portions not overlapping the pattern of high rigidity, and the pad pressing portions of the plurality of signal wirings are in contact with the pattern of high rigidity.

5. The display device according to claim 4, wherein: The pad bonding portion is bonded to the plurality of lead wirings, and a thickness of the pad bonding portion from a surface of the connection wiring is greater than a thickness of the pad pressing portion from the surface of the connection wiring.

6. The display device according to claim 5, wherein: The pad bonding portion is directly connected to the plurality of lead wirings.

7. The display device according to claim 6, wherein: The pad bonding portion is ultrasonically connected to the plurality of lead wirings.

8. The display device according to claim 5, wherein: The plurality of lead wirings include a lead pressing portion overlapping the pattern with high rigidity and a lead bonding portion not overlapping the pattern with high rigidity, and the lead pressing portion is in contact with the pattern with high rigidity.

9. A display device, comprising: a display substrate having a display area including a plurality of pixels and a pad area at least partially disposed around the display area; a plurality of signal wirings disposed in the pad region of the display substrate and connected to the plurality of pixels; a plurality of lead routings attached to pads in the pad region; a connection wiring disposed below the plurality of signal wirings and having a planar size smaller than a planar size of the plurality of signal wirings; an insulating pattern, provided between the connection wiring and the plurality of signal wirings; as well as an inorganic pattern disposed on each of the plurality of signal wirings, wherein the insulating pattern exposes a portion of the connection wiring, and the exposed connection wiring is electrically connected to the plurality of signal wirings, Each of the plurality of signal wirings includes a first surface facing the connection wiring and a second surface facing away from the first surface, and The inorganic pattern is disposed on the second surface of at least some of the plurality of signal wirings.

10. The display device according to claim 9, wherein: The inorganic pattern is surrounded by the insulating pattern, The plurality of signal wirings include a pad pressing portion overlapping the inorganic pattern and a pad bonding portion not overlapping the inorganic pattern, and The pad pressing portions of the plurality of signal wirings are in contact with the inorganic pattern.

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