Microcomputer electrohydrodynamic device module

Abstract

A microelectrofluidic device module includes a packaging carrier, a plurality of microelectrofluidic device chips, and a plurality of wires. The packaging carrier is in a cuboid shape, has a long side of the carrier and a short side of the carrier, and includes a plurality of carrier electrodes. The microelectrofluidic device chips are disposed on the packaging carrier. Each microelectrofluidic device chip is in a cuboid shape, has a long side of the chip and a short side of the chip, and includes a chip body and a plurality of microelectrofluidic devices. The microelectrofluidic devices are disposed on the chip body and respectively have a plurality of chip electrodes. Two ends of each wire are respectively connected to a corresponding carrier electrode and a corresponding chip electrode.

Description

Technical Field

[0001] This case is about a microelectromechanical module, especially a microelectrohydrodynamic device module that uses a novel packaging method to improve the efficiency of microelectrohydrodynamic devices. Background Art

[0002] With the rapid development of technology, traditional fluid delivery devices have been moving towards miniaturization and maximizing flow rate. Their applications have also become more diverse, and they can be found in industrial applications, biomedical applications, healthcare, electronic heat dissipation, and recently popular wearable devices.

[0003] In recent years, microelectromechanical related processes have achieved chip integration of fluid delivery devices in a one-piece molding manner. As Figure 1A and Figure 1B shown, traditional microelectrohydrodynamic device chips 10a, 10b respectively include a plurality of microelectrohydrodynamic devices 11. However, for the above-mentioned chip-integrated fluid delivery devices, their flow rate, head, and pressure are all inferior to those of traditional fluid delivery devices. In addition, when the traditional microelectrohydrodynamic device chips 10a, 10b are operating, the corner parts will deform due to vibration, resulting in poor production yield and increased production cost.

[0004] Therefore, how to use a novel packaging method to improve the flow rate, head, and pressure of chip-integrated fluid delivery devices and reduce production costs is an issue that needs to be solved currently. Summary of the Invention

[0005] The main purpose of this case is to provide a microelectrohydrodynamic device module that uses a novel packaging method to improve the flow rate, head, and pressure of the microelectrohydrodynamic device module and reduce production costs.

[0006] To achieve the above purpose, a more general implementation aspect of this case is to provide a microelectrohydrodynamic device module, which includes a packaging carrier, a plurality of microelectrohydrodynamic device chips, and a plurality of wires. The packaging carrier is in a cuboid shape, has a long side of the carrier and a short side of the carrier, and includes a plurality of carrier electrodes. The microelectrohydrodynamic device chips are arranged on the packaging carrier. Each microelectrohydrodynamic device chip is in a cuboid shape, has a long side of the chip and a short side of the chip, and includes a chip body and a plurality of microelectrohydrodynamic devices. The microelectrohydrodynamic devices are arranged on the chip body and respectively have a plurality of chip electrodes. Both ends of each wire are respectively connected to the corresponding carrier electrode and the corresponding chip electrode. Brief Description of the Drawings

[0007] Figure 1A It is a schematic diagram of a traditional microelectrohydrodynamic device chip.

[0008] Figure 1BAnother schematic diagram of the traditional microcomputer electrohydrodynamic device chip.

[0009] Figure 2 Schematic diagram of the first embodiment of the microcomputer electrohydrodynamic device module in this case.

[0010] Figure 3 Schematic diagram of the second embodiment of the microcomputer electrohydrodynamic device module in this case.

[0011] Figure 4 Schematic diagram of the third embodiment of the microcomputer electrohydrodynamic device module in this case.

[0012] Figure 5 Schematic diagram of the fourth embodiment of the microcomputer electrohydrodynamic device chip in this case.

[0013] Figure 6 Schematic diagram of the fifth embodiment of the microcomputer electrohydrodynamic device module in this case.

[0014] Figure 7 Schematic diagram of the sixth embodiment of the microcomputer electrohydrodynamic device module in this case.

[0015] Explanation of reference numerals

[0016] 1a, 1b, 2a, 2b, 1a', 2a': Microcomputer electrohydrodynamic device module

[0017] A1, A2, A3, B1, B2, B3, 10a, 10b: Microcomputer electrohydrodynamic device chip

[0018] 21: Encapsulation carrier

[0019] 21a: Long side of the carrier

[0020] 21b: Short side of the carrier

[0021] 21p: Carrier electrode

[0022] 211p: Carrier auxiliary electrode

[0023] 22: Chip body

[0024] 22a: Long side of the chip

[0025] 22b: Short side of the chip

[0026] 22p: Chip electrode

[0027] 221p: Chip auxiliary electrode

[0028] 11, 23: Microcomputer electrohydrodynamic device

[0029] 24: Conducting wire

[0030] 25: Auxiliary conducting wire Detailed implementation manners

[0031] Examples embodying the features and advantages of the present case will be described in detail in the following description. It should be understood that the present case can have various variations in different aspects, all of which do not depart from the scope of the present case, and the descriptions and illustrations therein are for illustrative purposes in essence and not for limiting the present case.

[0032] Please refer to Figure 2 In the first embodiment of the present case, the microfluidic device module 1a includes a packaging carrier 21, a plurality of microfluidic device chips A1, A2, A3, and a plurality of wires 24. The packaging carrier 21 is in the form of a cuboid, having a carrier long side 21a and a carrier short side 21b, and includes a plurality of carrier electrodes 21p. The carrier electrodes 21p are arranged on opposite sides of the microfluidic device chips A1, A2, A3 and are arranged along the extending direction of the carrier long side 21a of the packaging carrier 21. In the first embodiment of the present case, the microfluidic device module 1a includes three microfluidic device chips A1, A2, A3, but this is not a limitation, and the number of microfluidic device chips can be changed according to design requirements. In the first embodiment of the present case, the microfluidic device chips A1, A2, A3 are arranged on the packaging carrier 21 and are arranged in series along the extending direction of the carrier long side 21a of the packaging carrier 21. Each microfluidic device chip A1, A2, A3 is in the form of a cuboid, having a chip long side 22a and a chip short side 22b, and includes a chip body 22 and a plurality of microfluidic devices 23. In the first embodiment of the present case, the chip long sides 22a of the microfluidic device chips A1, A2, A3 are arranged parallel to the carrier long side 21a of the packaging carrier 21. The microfluidic devices 23 are arranged on the chip body 22, are arranged along the extending direction of the chip long side 22a of the microfluidic device chips A1, A2, A3, and respectively have a plurality of chip electrodes 22p. The chip electrodes 22p are arranged on opposite sides of the microfluidic devices 23 and are arranged along the extending direction of the chip long side 22a of the microfluidic device chips A1, A2, A3. The two ends of each wire 24 are respectively connected to the corresponding carrier electrode 21p and the corresponding chip electrode 22p. It should be noted that in the first embodiment of the present case, the configuration of the microfluidic device chips A1, A2, A3 can not only improve the flow rate, head, and pressure of the microfluidic device module 1a, but also increase the space utilization rate and reduce the volume of the packaging carrier 21.

[0033] Please refer to Figure 3, in the second embodiment of this case, the micro electrohydrodynamic device module 1b includes a packaging carrier 21, micro electrohydrodynamic device chips A1, A2, A3, and wires 24. The packaging carrier 21 is in the shape of a rectangular parallelepiped, having a carrier long side 21a and a carrier short side 21b, and includes carrier electrodes 21p. The carrier electrodes 21p are disposed on opposite sides of the micro electrohydrodynamic device chips A1, A2, A3 and are arranged along the extending direction of the carrier long side 21a of the packaging carrier 21. In the second embodiment of this case, the micro electrohydrodynamic device module 1b includes three micro electrohydrodynamic device chips A1, A2, A3, but is not limited thereto, and the number of micro electrohydrodynamic device chips can be changed according to design requirements. In the second embodiment of this case, the micro electrohydrodynamic device chips A1, A2, A3 are disposed on the packaging carrier 21 and are arranged staggered along the extending direction of the carrier long side 21a of the packaging carrier 21. Each micro electrohydrodynamic device chip A1, A2, A3 is in the shape of a rectangular parallelepiped, having a chip long side 22a and a chip short side 22b, and includes a chip body 22 and a micro electrohydrodynamic device 23. In the second embodiment of this case, the chip long sides 22a of the micro electrohydrodynamic device chips A1, A2, A3 are arranged parallel to the carrier long side 21a of the packaging carrier 21. The micro electrohydrodynamic device 23 is disposed on the chip body 22, is arranged along the extending direction of the chip long side 22a of the micro electrohydrodynamic device chips A1, A2, A3, and respectively has a plurality of chip electrodes 22p. The chip electrodes 22p are disposed on opposite sides of the micro electrohydrodynamic device 23 and are arranged along the extending direction of the chip long side 22a of the micro electrohydrodynamic device chips A1, A2, A3. Both ends of each wire 24 are respectively connected to the corresponding carrier electrode 21p and the corresponding chip electrode 22p. It should be noted that in the second embodiment of this case, the configuration of the micro electrohydrodynamic device chips A1, A2, A3 can not only improve the flow rate, head, and pressure of the micro electrohydrodynamic device module 1b, but also reduce the total length of the packaging carrier 21 because there are overlapping parts at the intersections of the micro electrohydrodynamic device chips A1, A2, A3.

[0034] Please refer to Figure 4, in the third embodiment of this case, the microfluidic device module 2a includes a packaging carrier 21, a plurality of microfluidic device chips B1, B2, B3, and wires 24. The packaging carrier 21 is in a rectangular parallelepiped shape, having a carrier long side 21a and a carrier short side 21b, and includes a carrier electrode 21p. The carrier electrode 21p is disposed on opposite sides of the microfluidic device chips B1, B2, B3 and is arranged along the extending direction of the carrier long side 21a of the packaging carrier 21. In the third embodiment of this case, the microfluidic device module 2a includes three microfluidic device chips B1, B2, B3, but is not limited thereto, and the number of microfluidic device chips can be changed according to design requirements. In the third embodiment of this case, the microfluidic device chips B1, B2, B3 are disposed on the packaging carrier 21 and are connected in series along the extending direction of the carrier long side 21a of the packaging carrier 21. Each microfluidic device chip B1, B2, B3 is in a rectangular parallelepiped shape, having a chip long side 22a and a chip short side 22b, and includes a chip body 22 and a microfluidic device 23. In the third embodiment of this case, the chip long sides 22a of the microfluidic device chips B1, B2, B3 are arranged parallel to the carrier short side 21b of the packaging carrier 21. The microfluidic device 23 is disposed on the chip body 22, arranged along the extending direction of the chip long side 22a of the microfluidic device chips B1, B2, B3, and respectively has a plurality of chip electrodes 22p. The chip electrodes 22p are disposed on opposite sides of the microfluidic device 23 and are arranged along the extending direction of the chip short side 22b of the microfluidic device chips B1, B2, B3. Both ends of each wire 24 are respectively connected to the corresponding carrier electrode 21p and the corresponding chip electrode 22p. It should be noted that in the third embodiment of this case, the configuration of the microfluidic device chips B1, B2, B3 can not only improve the flow rate, head, and pressure of the microfluidic device module 2a, but also increase the space utilization rate and reduce the volume of the packaging carrier 21.

[0035] Please refer to Figure 5, in the fourth embodiment of this case, the microcomputer electrohydrodynamic device module 2b includes a packaging carrier 21, microcomputer electrohydrodynamic device chips B1, B2, B3, and wires 24. The packaging carrier 21 is in the shape of a cuboid, has a long side 21a and a short side 21b of the carrier, and includes a carrier electrode 21p. The carrier electrode 21p is disposed on opposite sides of the microcomputer electrohydrodynamic device chips B1, B2, B3 and is arranged along the extending direction of the long side 21a of the packaging carrier 21. In the fourth embodiment of this case, the microcomputer electrohydrodynamic device module 2b includes three microcomputer electrohydrodynamic device chips B1, B2, B3, but is not limited thereto, and the number of microcomputer electrohydrodynamic device chips can be changed according to design requirements. In the fourth embodiment of this case, the microcomputer electrohydrodynamic device chips B1, B2, B3 are disposed on the packaging carrier 21 and are arranged staggered along the extending direction of the long side 21a of the packaging carrier 21. Each microcomputer electrohydrodynamic device chip B1, B2, B3 is in the shape of a cuboid, has a long side 22a and a short side 22b of the chip, and includes a chip body 22 and a microcomputer electrohydrodynamic device 23. In the fourth embodiment of this case, the long side 22a of the microcomputer electrohydrodynamic device chips B1, B2, B3 is arranged parallel to the short side 21b of the packaging carrier 21. The microcomputer electrohydrodynamic device 23 is disposed on the chip body 22, is arranged along the extending direction of the long side 22a of the microcomputer electrohydrodynamic device chips B1, B2, B3, and respectively has a chip electrode 22p. The chip electrode 22p is disposed on opposite sides of the microcomputer electrohydrodynamic device 23 and is arranged along the extending direction of the short side 22b of the microcomputer electrohydrodynamic device chips B1, B2, B3. Both ends of each wire 24 are respectively connected to the corresponding carrier electrode 21p and the corresponding chip electrode 22p. It should be noted that in the fourth embodiment of this case, the configuration of the microcomputer electrohydrodynamic device chips B1, B2, B3 can not only improve the flow rate, head, and pressure of the microcomputer electrohydrodynamic device module 2b, but also increase the flexibility of the configuration of the microcomputer electrohydrodynamic device chips B1, B2, B3.

[0036] It should be noted that the configuration methods of the first to fourth embodiments of this case have different application levels, and the configuration methods used in actual production are not limited thereto and can be changed according to actual needs.

[0037] Please refer to Figure 6, the fifth embodiment of this case extends from the first embodiment of this case, but is not limited thereto. Different from the first embodiment of this case, the microcomputer electrohydrodynamic device module 1a' of the fifth embodiment of this case further includes a plurality of auxiliary wires 25, the encapsulation carrier 21 further includes a plurality of carrier auxiliary electrodes 211p, and the microcomputer electrohydrodynamic device chips A1, A2, and A3 further include a plurality of chip auxiliary electrodes 221p. The carrier auxiliary electrodes 211p are respectively connected to the chip auxiliary electrodes 221p through the auxiliary wires 25. In the fifth embodiment of this case, the carrier auxiliary electrodes 211p and the chip auxiliary electrodes 221p are disposed at the corners of the encapsulation carrier 21. In this way, when the microcomputer electrohydrodynamic device chips A1, A2, and A3 are operating, the corner portions thereof will not be deformed due to vibration by the fixation of the carrier auxiliary electrodes 211p and the chip auxiliary electrodes 221p, thereby improving the production yield and reducing the production cost.

[0038] Please refer to Figure 7 , the sixth embodiment of this case extends from the third embodiment of this case, but is not limited thereto. Different from the third embodiment of this case, the microcomputer electrohydrodynamic device module 2a' of the sixth embodiment of this case further includes auxiliary wires 25, the encapsulation carrier 21 further includes carrier auxiliary electrodes 211p, and the microcomputer electrohydrodynamic device chips B1, B2, and B3 further include chip auxiliary electrodes 221p. The carrier auxiliary electrodes 211p are respectively connected to the chip auxiliary electrodes 221p through the auxiliary wires 25. In the sixth embodiment of this case, the carrier auxiliary electrodes 211p and the chip auxiliary electrodes 221p are disposed at the corners of the encapsulation carrier 21. In this way, when the microcomputer electrohydrodynamic device chips B1, B2, and B3 are operating, the corner portions thereof will not be deformed due to vibration by the fixation of the carrier auxiliary electrodes 211p and the chip auxiliary electrodes 221p, thereby improving the production yield and reducing the production cost.

[0039] It should be noted that the carrier auxiliary electrodes 211p and the chip auxiliary electrodes 221p can be disposed in cooperation with various configurations of the microcomputer electrohydrodynamic device chips, and are not limited to the manner disclosed above.

[0040] Please return to Figure 2, in each embodiment of the present case, the microcomputer electrohydrodynamic device modules 1a, 1b, 1a', 2a' further include a control unit (not shown in the figure) for driving the microcomputer electrohydrodynamic device chips A1, A2, A3, B1, B2, B3. Among them, the microcomputer electrohydrodynamic device chips A1, A2, A3, B1, B2, B3 can be driven in different ways. Taking the first embodiment as an example, the control unit can drive the microcomputer electrohydrodynamic device chips A1, A2, A3 simultaneously, and the control unit can also drive any one of the microcomputer electrohydrodynamic device chips A1, A2, A3 individually. Or, the microcomputer electrohydrodynamic device chips A1, A2, A3 can be divided into a driving group and a standby group. The control unit can drive the driving group of the microcomputer electrohydrodynamic device chips A1, A2, A3 simultaneously, but not limited thereto. The driving mode of the microcomputer electrohydrodynamic device chips A1, A2, A3 can be changed according to the required total flow rate and required flow rate. In each embodiment of the present case, the control unit is a microcontroller (Microcontroller Unit, MCU) or an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), but not limited thereto. The application of the control unit can be changed according to the design requirements.

[0041] In summary, the present case provides a microcomputer electrohydrodynamic device module, which uses a novel packaging method to improve the flow rate, head and pressure of the microcomputer electrohydrodynamic device module, and reduce the production cost.

[0042] This case can be modified by those skilled in the art in various ways, but all are not beyond the scope of protection as claimed in the attached patent application.

Claims

1. A microcomputer electrohydrodynamic device module, characterized in that, Comprising: An encapsulation carrier, which is in the shape of a cuboid, has a long side of the carrier and a short side of the carrier, and includes a plurality of carrier electrodes; A plurality of micro electrohydrodynamic device chips, which are arranged on the encapsulation carrier. Each of the micro electrohydrodynamic device chips is in the shape of a cuboid, has a long side of the chip and a short side of the chip, and includes a chip body and a plurality of micro electrohydrodynamic devices. The plurality of micro electrohydrodynamic devices are arranged on the chip body and respectively have a plurality of chip electrodes; A plurality of wires, with both ends of each wire respectively connected to the corresponding carrier electrode and the corresponding chip electrode; And A plurality of carrier auxiliary electrodes, a plurality of chip auxiliary electrodes and a plurality of auxiliary wires. The plurality of carrier auxiliary electrodes are respectively connected to the plurality of chip auxiliary electrodes through the plurality of auxiliary wires. The plurality of carrier auxiliary electrodes and the plurality of chip auxiliary electrodes are arranged at corners adjacent to the encapsulation carrier, and the plurality of chip auxiliary electrodes are not connected to the micro electrohydrodynamic devices.

2. The microcomputer electrohydrodynamic device module according to claim 1, wherein The plurality of micro electrohydrodynamic device chips are arranged in series along the extending direction of the long side of the carrier of the encapsulation carrier; the plurality of micro electrohydrodynamic devices of each micro electrohydrodynamic device chip are arranged along the extending direction of the long side of the chip of the micro electrohydrodynamic device chip; the plurality of chip electrodes are arranged on opposite sides of the plurality of micro electrohydrodynamic devices and also along the extending direction of the long side of the chip of the micro electrohydrodynamic device chip; and the plurality of carrier electrodes are arranged on opposite sides of the plurality of micro electrohydrodynamic device chips and also along the extending direction of the long side of the carrier of the encapsulation carrier.

3. The microcomputer electrohydrodynamic device module according to claim 1, characterized in that, The plurality of micro electrohydrodynamic device chips are arranged staggeredly along the extending direction of the long side of the carrier of the encapsulation carrier; the plurality of micro electrohydrodynamic devices of each micro electrohydrodynamic device chip are arranged along the extending direction of the long side of the chip of the micro electrohydrodynamic device chip; the plurality of chip electrodes are arranged on opposite sides of the plurality of micro electrohydrodynamic devices and also along the extending direction of the long side of the chip of the micro electrohydrodynamic device chip; and the plurality of carrier electrodes are arranged on opposite sides of the plurality of micro electrohydrodynamic device chips and also along the extending direction of the long side of the carrier of the encapsulation carrier.

4. The microcomputer electrohydrodynamic device module according to claim 1, wherein The plurality of micro electrohydrodynamic device chips are arranged in series along the extending direction of the long side of the carrier of the encapsulation carrier; the plurality of micro electrohydrodynamic devices of each micro electrohydrodynamic device chip are arranged along the extending direction of the long side of the chip of the micro electrohydrodynamic device chip; the plurality of chip electrodes are arranged on opposite sides of the plurality of micro electrohydrodynamic devices and along the extending direction of the short side of the chip of the micro electrohydrodynamic device chip; and the plurality of carrier electrodes are arranged on opposite sides of the plurality of micro electrohydrodynamic device chips and also along the extending direction of the long side of the carrier of the encapsulation carrier.

5. The microcomputer electrohydrodynamic device module according to claim 1, characterized in that, The multiple microfluidic device chips are arranged in a staggered manner along the extending direction of the long side of the carrier of the package carrier; the multiple microfluidic devices of each microfluidic device chip are arranged along the extending direction of the long side of the chip of the microfluidic device chip; the multiple chip electrodes are arranged on opposite sides of the multiple microfluidic devices and are arranged along the extending direction of the short side of the microfluidic device chip; and the multiple carrier electrodes are arranged on opposite sides of the multiple microfluidic device chips and are also arranged along the extending direction of the long side of the package carrier.

6. The microcomputer electrohydrodynamic device module according to claim 1, characterized in that, It further includes a control unit for driving the multiple microfluidic device chips, and the control unit drives the multiple microfluidic device chips simultaneously.

7. The microcomputer electrohydrodynamic device module according to claim 1, wherein It further includes a control unit for driving the multiple microfluidic device chips, and the control unit individually drives one of the multiple microfluidic device chips.

8. The microcomputer electrohydrodynamic device module according to claim 1, characterized in that, It further includes a control unit for driving the multiple microfluidic device chips, and the multiple microfluidic device chips are divided into a driving group and a standby group, and the control unit simultaneously drives the driving group of the multiple microfluidic device chips.

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