Button module

By setting the top part in the lifting mechanism of the key module to interfere with the thin-film switch layer, the problem of noise interference during operation of the existing key module is solved, and the noise is effectively reduced and the user experience is improved.

CN111739753BActive Publication Date: 2025-04-11LITE ON ELECTRONICS (GUANGZHOU) LTD +1
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Patent Information

Application Number
CN202010693338.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-07-17
Filing Date
2020-07-17
Publication Date
2025-04-11
Estimated Expiration
2040-07-17

AI Technical Summary

Technical Problem

During operation, the existing key modules cause noise interference due to assembly gaps, high-frequency oscillation and low-frequency knocking. How to reduce noise is the goal pursued by the industry.

Method used

A key module including a base plate, a film switch layer, a lifting mechanism and a key cap is designed. By providing a top member in the lifting mechanism, it frequently interferes with the film switch layer during the lifting process, thereby absorbing vibration energy and reducing noise.

Benefits of technology

It effectively reduces the noise level during operation of the key module, reduces the noise generated by high-frequency oscillation and low-frequency knocking, and provides a better user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

One embodiment of the present invention provides a key module. The key module includes a bottom plate, a membrane switch layer and a lifting mechanism. The membrane switch layer is disposed on the bottom plate. The lifting mechanism is pivotally connected to the bottom plate relative to the membrane switch layer and can be lifted and lowered. The lifting mechanism has a resisting member. The resisting member can interfere with the membrane switch layer to absorb the vibration (or impact) energy generated during the lifting process of the lifting mechanism, thereby improving the noise generated when the key module is operated.
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Description

Technical Field

[0001] The invention relates to a key module. Background Art

[0002] It is known that the key module will make noise when operating due to factors such as assembly clearance, high-frequency vibration, and low-frequency knocking. The noise is a disturbance to the user and the surrounding environment. Therefore, how to reduce the noise generated when the key module is operated is one of the goals of the industry in this field. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a key module which can reduce the noise generated when the key module is operated.

[0004] In order to achieve the above object, the present invention provides a key module, which includes:

[0005] a bottom plate;

[0006] A membrane switch layer, disposed on the bottom plate;

[0007] a key cap, disposed on the membrane switch layer; and

[0008] A lifting mechanism is disposed between the bottom plate and the key cap, and two ends of the lifting mechanism are movably connected to the bottom plate and the key cap, respectively. The lifting mechanism has a resisting member, and the resisting member interferes with the membrane switch layer;

[0009] During the lifting process of the lifting mechanism, the abutting member frequently interferes with the membrane switch layer.

[0010] In order to achieve the above object, the present invention further provides a key module, which includes:

[0011] A bottom plate having a bottom plate hollow portion;

[0012] A membrane switch layer, disposed on the bottom plate and having a membrane hollow portion;

[0013] A lifting mechanism is pivotally connected to the bottom plate so as to be liftable relative to the membrane switch layer;

[0014] a keycap, disposed on the lifting mechanism and comprising a skirt portion and a connecting portion, the skirt portion surrounding the connecting portion, the skirt portion and the connecting portion respectively having a first bottom surface and a second bottom surface facing the membrane switch layer, the second bottom surface being closer to the membrane switch layer than the first bottom surface, the second bottom surface being projected onto a substantial portion of the membrane switch layer along a pressing direction of the lifting mechanism, and the second bottom surface interfering with the membrane switch layer occassionally; and

[0015] a rod, pivotally connected to the connecting portion;

[0016] Wherein, the width of the hollow portion of the bottom plate along a long side direction of the key cap is greater than the width of the hollow portion of the film along the long side direction.

[0017] In order to achieve the above object, the present invention further provides a key module, which includes:

[0018] A bottom plate having a bottom plate hollow portion;

[0019] A membrane switch layer, disposed on the bottom plate and having a membrane hollow portion, the membrane switch layer includes a plurality of layer structures, one of the layer structures has a penetration portion, and another of the layer structures includes an interference portion;

[0020] A lifting mechanism pivotally connected to the bottom plate so as to be liftable relative to the membrane switch layer; and

[0021] A key cap is arranged on the lifting mechanism and includes a main body, a skirt and a connecting portion, wherein the skirt is arranged along the periphery of the main body and extends toward the bottom plate, the connecting portion is arranged on the bottom surface of the main body facing the bottom plate and has a third bottom surface, and the connecting portion has a resisting member, the resisting member protrudes relative to the third bottom surface and is projected onto the penetration portion and the interference portion along a pressing direction of the lifting mechanism;

[0022] Wherein, the width of the hollow portion of the bottom plate along a long side direction of the key cap is greater than the width of the hollow portion of the film along the long side direction.

[0023] In order to achieve the above object, the present invention further provides a key module, which includes:

[0024] a bottom plate;

[0025] A membrane switch layer, disposed on the bottom plate;

[0026] a key cap, disposed on the membrane switch layer;

[0027] a lifting mechanism disposed between the base plate and the key cap, wherein two ends of the lifting mechanism are movably connected to the base plate and the key cap respectively; and

[0028] An elastic body is disposed between the key cap and the membrane switch layer, and includes a top surface, a groove sunken relative to the top surface, and a top-pushing structure, the top-pushing structure is located at the bottom surface of the groove, the top-pushing structure has a height, the height is less than the depth of the groove, when the key module is in a pressed state, the top-pushing structure interferes with the key cap, the elastic member further includes:

[0029] a bottom surface, located on the membrane switch layer opposite to the top surface;

[0030] a side wall connecting the top surface and the bottom surface, wherein the top surface, the side wall and the bottom surface define an inner space; and

[0031] A conductive column is arranged in the internal space and is located below the groove, wherein the conductive column has a bottom surface facing the membrane switch layer and a push piece, the push piece and the push structure are aligned on a central axis, and the push piece protrudes relative to the bottom surface to interfere with the membrane switch layer when the key module is in a pressed state.

[0032] In order to achieve the above object, the present invention further provides a key module, which includes:

[0033] a bottom plate;

[0034] A membrane switch layer, disposed on the bottom plate;

[0035] a key cap, disposed on the membrane switch layer; and

[0036] A lifting mechanism is disposed between the base plate and the key cap, and two ends of the lifting mechanism are movably connected to the base plate and the key cap respectively.

[0037] The membrane switch layer has a resisting member, which is disposed on a surface of the membrane switch layer facing the lifting mechanism to interfere with the lifting mechanism;

[0038] The abutting member is an integrally formed part of the topmost film arranged in the film switch layer.

[0039] The beneficial effect of the present invention is that the above-mentioned key module can reduce the noise generated when the key module is operated.

[0040] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 FIG. 4 is a schematic diagram of a key module according to an embodiment of the present invention.

[0042] Figure 2 for Figure 1 Exploded view of the button module.

[0043] Figure 3 for Figure 1 A top view of the key module.

[0044] Figure 4 for Figure 3 A cross-sectional view of the key module (in a free state) along direction 4-4'.

[0045] Figure 5 for Figure 3 A cross-sectional view of the key module along direction 5-5'.

[0046] Figure 6 for Figure 2 Schematic diagram of the lifting mechanism.

[0047] Figure 7 for Figure 4 A cross-sectional view of the key module changing to a pressed state.

[0048] Fig. 8A for Figure 4 Cross-sectional view of an elastomer.

[0049] Figure 8B FIG. 4 is a cross-sectional view of an elastic body according to another embodiment of the present invention.

[0050] Fig. 9 FIG. 4 is a cross-sectional view of a key module according to another embodiment of the present invention.

[0051] Fig.10 FIG. 4 is a schematic diagram of a key module according to an embodiment of the present invention.

[0052] Fig.11 and 12 for Fig.10 Exploded view of the button module.

[0053] Fig.13 for Fig.10 A top view of the key module.

[0054] Fig.14 for Fig.13 A cross-sectional view of the key module (in a free state) along direction 14-14'.

[0055] Fig.15 for Fig.13 A cross-sectional view of the key module along direction 15-15'.

[0056] Fig.16 for Fig.14 A cross-sectional view of the key module changing to a pressed state.

[0057] Fig.17 FIG. 4 is a partial cross-sectional view of a key module in a pressed state according to another embodiment of the present invention. DETAILED DESCRIPTION

[0058] The structural principle and working principle of the present invention are described in detail below in conjunction with the accompanying drawings:

[0059] Please refer to Figure 1 to Figure 7 , Figure 1 is a schematic diagram of a key module 100 according to an embodiment of the present invention, Figure 2 for Figure 1 An exploded view of the key module 100, Figure 3 for Figure 1 A top view of the key module 100 is shown in FIG. Figure 4 for Figure 3 A cross-sectional view of the key module 100 (in a free state) along the direction 4-4', Figure 5 for Figure 3 A cross-sectional view of the key module 100 along direction 5-5', Figure 6 for Figure 2 Schematic diagram of the lifting mechanism 130, and Figure 7 for Figure 4 A cross-sectional view of the key module 100 changing to a pressed state.

[0060] The key module 100 can be applied to an electronic device, such as a keyboard, home appliance or other various devices that require input commands / signals, wherein the keyboard can be selectively connected to an external device, such as a desktop computer, home appliance or other electronic device, or the keyboard is a laptop keyboard.

[0061] like Figure 1 and Figure 2 As shown, the key module 100 includes a base plate 110 , a membrane switch layer 120 , a lifting mechanism 130 , an elastic body 140 and a key cap 150 .

[0062] like Figure 2 As shown, the membrane switch layer 120 is disposed on the bottom plate 110. The lifting mechanism 130 is pivotally connected to the bottom plate 110 in a lifting direction + / -Z relative to the membrane switch layer 120, and the lifting mechanism 130 has at least one abutting member 131. In this embodiment, the abutting member 131 protrudes relative to the bottom surface to interfere with (or contact) the membrane switch layer 120 when the key module is in a pressed state, so as to absorb the vibration (or impact) energy generated during the lifting process of the lifting mechanism 130 to reduce the noise during the lifting process of the lifting mechanism 130. The aforementioned vibration may be caused by the assembly clearance between the bottom plate 110 and the lifting mechanism 130 or by an external high-frequency vibration. In addition, since the abutting member 131 interferes with the membrane switch layer 120, the noise generated by the key module 100 under a high-frequency vibration between 300KHz and 2000KHz can be effectively improved, such as generating a noise lower than 20 decibels (dBA), and the noise can even be lower than 15 decibels (dBA) to provide a better user experience. The high frequency oscillation is generated by, for example, a speaker disposed under or around the keyboard or an oscillator in a high frequency test.

[0063] like Figure 2As shown, the bottom plate 110 includes a plate body 111, at least one pivoting portion 112 and at least one pivoting portion 113. The plate body 111 is, for example, a metal plate, such as an iron plate, a copper plate, an aluminum plate, a stainless steel plate, a galvanized steel plate, an aluminum-magnesium alloy plate, etc.; the plate body 111 can also be made of a non-metallic plate, such as a plastic plate, a carbon fiber plate or a glass fiber plate. The plate body 111 is thin and therefore lightweight, which can reduce the overall mass of the key module 100 and the overall thickness T1 of the key module 100 (the thickness T1 is shown in FIG. 1 ). Figure 1 ). In one embodiment, the plate body 111 has a thickness t1, and the thickness t1 is, for example, between 0.1 millimeters (mm) and 0.5 mm. This thickness range can provide the plate body 111 with the technical effect of being light and having sufficient strength. The bottom plate 110 has a hollow portion 110a, which is formed on the plate body 111. The hollow portion 110a can reduce the overall mass of the bottom plate 110, or the light emitted from the backlight module (not shown) below the bottom plate 110 can pass through the hollow portion 110a and be incident on the keycap 150, thereby enhancing the visual effect when the user operates the keyboard 100. In another embodiment, the bottom plate 110 can omit the hollow portion 110a.

[0064] like Figure 2 As shown, the pivotal parts 112 and the pivotal parts 113 are connected to the plate body 111. In one embodiment, the pivotal parts 112 and the pivotal parts 113 of the bottom plate 110 and the plate body 111 are, for example, an integrally formed structure. In a process of manufacturing the bottom plate 110, an injection molding technique may be used to form the pivotal parts 112 and the pivotal parts 113 in the plate body 111. In detail, even if the thickness t1 of the plate body 111 is very thin and it is difficult to stamp or bend the pivotal parts 112 and the pivotal parts 113, the pivotal parts 112 and the pivotal parts 113 can still be formed in the plate body 111 by the injection molding technique, wherein the combination of the pivotal parts 112, 113 and the plate body 111 is, for example, the joining of heterogeneous materials. In another manufacturing process of the bottom plate 110 , when the thickness t1 of the plate body 111 is thicker, a stamping and bending process may be performed on a plate to form the plate body 111 , the pivoting portion 112 , and the pivoting portion 113 on the plate.

[0065] In terms of the injection molding process, the pivoting parts 112, the pivoting parts 113 and the plate body 111 can be combined together by, for example, embedding injection molding technology. For example, the plate body 111 can be first embedded in a mold cavity of a mold (not shown), and then the injection molding technology is used to provide a fluid material (such as a high-temperature molten material) in the mold cavity to combine with the plate body 111, and the pivoting parts 112 and the pivoting parts 113 are formed after the fluid material is solidified. In terms of materials, the pivoting parts 112 and the pivoting parts 113 are made of, for example, insulating materials, such as plastic, resin or rubber materials. In terms of material properties, the melting points of the pivoting parts 112 and the pivoting parts 113 can be lower than the melting point of the base material of the plate body 111, so that in the embedding injection molding process, the materials of the pivoting parts 112 and the pivoting parts 113 can be controlled to be fluid while the plate body 111 remains in a solid state (without affecting the function of the plate body 111). The fluid pivot material can flow into the embedding hole 111 a of the plate body 111 and the mold cavity, and form the pivot parts 112 and 113 after solidification.

[0066] like Figure 2 and Figure 5 As shown, the membrane switch layer 120 is disposed on the bottom plate 110. The membrane switch layer 120 has at least one hollow portion 120a. The pivoting portion 112 and the pivoting portion 113 can pass through the hollow portion 120a to be pivotally connected to the lifting mechanism 130. In addition, the membrane switch layer 120 can have a multi-layer structure similar to or the same as the membrane switch layer 220 described later, which will not be described in detail.

[0067] The lifting mechanism 130 is pivotally connected to the pivoting portion 112 and the pivoting portion 113. In this embodiment, the lifting mechanism 130 is, for example, a scissor-leg mechanism, but the embodiment of the present invention is not limited thereto. The lifting mechanism 130 can be other types of lifting mechanisms, such as a wing-shaped bracket or a bracket actuated by magnetic force. Taking the scissor-leg mechanism as an example, Figure 2 and Figure 5 As shown, the lifting mechanism 130 includes an outer support 132 and an inner support 133 that are pivotally connected, so that the outer support 132 and the inner support 133 can rotate relative to each other. The outer support 132 includes a free end rod 132A and a pivot rod 132B. The pivot shaft 132B1 of the pivot rod 132B is pivotally connected to the pivot portion 112, and one end of the inner support 133 can be pivotally connected to the pivot portion 113, so that the lifting mechanism 130 can be lifted and lowered relative to the pivot portions 112 and 113. Figure 2 and Figure 6 As shown, the abutting member 131 is located on the outer bracket 132. For example, the abutting member 131 is located on the pivot rod 132B of the outer bracket 132.

[0068] like Figure 4 and Figure 5 As shown, the position of the push member 131 is along the pressing direction -Z (shown in Figure 1) corresponds to the hollow portion 110a of the bottom plate 110. For example, the projection area of ​​the abutting member 131 projected on the membrane switch layer 120 along the pressing direction -Z at least partially overlaps the hollow portion 110a. For example, the projection area of ​​the abutting member 131 projected on the membrane switch layer 120 along the pressing direction -Z may be completely within the range of the hollow portion 110a (from Figure 2 As can be seen), the stress applied by the push-up member 131 to the bottom plate 110 can be further reduced. In this way, the bottom plate 110 directly below the push-up member 131 has a hollow portion 110a, so the stress applied by the push-up member 131 to the bottom plate 110 can be reduced. In addition, since the position of the push-up member 131 corresponds to the hollow portion 110a, the portion of the membrane switch layer 120 corresponding to the hollow portion 110a protrudes slightly toward the hollow portion 110a, which can reduce the amount of interference between the push-up member 131 and the membrane switch layer 120, so that the interference resistance between the push-up member 131 and the membrane switch layer 120 is appropriate. When the key module 100 changes to the pressing state (such as Figure 7 ) and the free state (as shown Figure 4 As shown in FIG. 1 , since the position of the abutting member 131 corresponds to the hollow portion 110a, the interference resistance between the abutting member 131 and the membrane switch layer 120 is also small. The "free state" herein refers to the state when the key module 100 is not subjected to a pressing force, and the "pressed state" refers to the triggered state when the key module 100 is subjected to a pressing force.

[0069] In this embodiment, if Figure 4 and Figure 7 As shown, the abutting member 131 frequently (normally) interferes with (or contacts) the membrane switch layer 120. For example, the key module 100 is in a pressed state (such as Figure 7 as shown) or free state (as Figure 4 As shown in FIG. 1 , the resisting member 131 interferes with the membrane switch layer 120. In other words, during the lifting process of the lifting mechanism 130, the resisting member 131 and the membrane switch layer 120 maintain a considerable degree of interference.

[0070] In terms of geometric features, Figure 4 and Figure 6 As shown, the push member 131 has a curved surface 131s at the junction with the membrane switch layer 120, and the push member 131 interferes with the membrane switch layer 120 with the curved surface 131s. In this way, during the pressing process of the key module 100, the interference amount h1 between the push member 131 and the membrane switch layer 120 can be maintained approximately (or substantially) equal. In the embodiment, the curved surface 131s is, for example, a part of a cylindrical surface, such as a semi-cylindrical surface, but it can also be a part of a spherical surface, such as a semi-spherical surface. However, this is not used to limit the embodiments of the present invention, and the curved surface 131s can be any curved surface of other geometric shapes, or a composite surface composed of a plane and a curved surface.

[0071] like Figure 5 and Figure 6 As shown, the outer bracket 132 of the lifting mechanism 130 further includes a recessed portion 132r that is recessed relative to the rod body 132B2, the recessed portion 132r and the rod body 132B2 are disposed in the pivot rod 132B of the lifting mechanism 130, and the pivot 132B1 is located at two opposite outer sides of the rod body 132B2. In this embodiment, the recessed portion 132r is located at the lower center of the rod body 132B2, and the abutting member 131 is located in the recessed portion 132r. The lifting mechanism 130 further includes a surface facing the membrane switch layer 120, and the rod body 132B2 and the abutting member 131 protrude relative to the surface. For example, the recessed portion 132r of the lifting mechanism 130 has a recessed portion bottom surface 132s that faces the membrane switch layer 120, wherein the rod body 132B2 and the abutting member 131 protrude relative to the recessed portion bottom surface 132s.

[0072] like Figure 2 and Figure 5 As shown, the recess 132r allows the membrane switch layer 120 to pass therethrough, thereby avoiding excessive interference between the lifting mechanism 130 and the membrane switch layer 120 (except for the abutting member 131), thereby reducing the interference resistance between the lifting mechanism 130 and the membrane switch layer 120 and affecting the pressing feel.

[0073] like Figure 5 As shown, the rod body 132B2 is correspondingly disposed in the hollow portion 120a of the aforementioned membrane switch layer 120, which can avoid excessive interference between the lifting mechanism 130 and the membrane switch layer 120, thereby reducing the interference resistance between the lifting mechanism 130 and the membrane switch layer 120. In the embodiment, as Figure 5 As shown, the protruding height L1 of the rod body 132B2 relative to the bottom surface 132s of the recess is greater than the protruding height L2 of the abutting member 131 relative to the bottom surface 132s of the recess. The protruding height of the rod body 132B2 can increase the structural strength of the pivot rod 132B on both sides of the recess 132r, thereby improving the overall strength of the lifting mechanism 130.

[0074] like Figure 5As shown, the recess 132r has a recess height H1, and the recess height H1 is, for example, the distance between the recess bottom surface 132s and the outer surface of the rod body 132B2. By designing / matching the size of the recess height H1 and the protruding height L2 of the abutting member 131, an appropriate interference amount h1 (the height of the abutting member 131 pressing down the membrane switch layer 120) between the abutting member 131 and the membrane switch layer 120 can be obtained, and an appropriate interference resistance between the abutting member 131 and the membrane switch layer 120 can be obtained and the noise reduction effect can be achieved. In one embodiment, the interference amount h1 can be between 0.01mm and 0.1mm. By selecting an appropriate interference amount h1, the dual technical effects of "not negatively affecting (not excessively changing) the pressing curve (characteristic curve of pressing force and pressing stroke, also called FD curve) of the key module 100" and "noise reduction" can be taken into account. In one embodiment, the interference amount h1 is preset to be between 0.04 mm and 0.06 mm, that is, the resisting member 131 presses down the membrane switch layer 120 by about 0.04 mm to about 0.06 mm, which can effectively reduce the assembly gap caused by the tolerance between the components without sacrificing the pressing feel.

[0075] In addition, if Figure 5 and Figure 6 As shown, the abutting member 131 is approximately located at the middle position of the lifting mechanism 130. For example, the abutting member 131 is located at the middle position of the pivot rod 132B of the lifting mechanism 130. The recess 132r has a length L3 along the extension direction + / -Y of the pivot rod 132B, and the abutting member 131 has a length L4 along the extension direction + / -Y, wherein the length L4 is less than the length L3.

[0076] The greater the length L3 of the recess 132r, the lower the strength of the lifting mechanism 130, and the smaller the length L3, the greater the probability of interference between the lifting mechanism 130 and the membrane switch layer 120. In addition, the greater the length L4 of the abutting member 131, the greater the interference resistance between the lifting mechanism 130 and the membrane switch layer 120 and the negative impact (or excessive change) of the pressing curve of the key module 100 may be, and the smaller the length L4, the smaller the noise reduction effect. In addition, the lifting mechanism 130 may also have a plurality of abutting members 131, and the plurality of abutting members 131 are, for example, symmetrically or evenly distributed in the recess 132r. In one embodiment, the ratio of the length L4 to the length L3 of the single resisting member 131 (L4 / L3) or the ratio of the sum of the lengths L4 of the plurality of resisting members 131 to the length L3 may be between 1 / 15 and 1 / 3, so as to provide sufficient strength to the lifting mechanism 130 and avoid interference with the membrane switch layer 120, and to achieve the dual technical effects of "not negatively affecting the pressing curve of the key module 100" and "noise reduction".

[0077] like Figure 2 , Figure 4 and Figure 7As shown, the elastic body 140 is located between the key cap 150 and the membrane switch layer 120. Figure 4 ) changes to the pressed state (such as Figure 7 ), the elastic body 140 deforms and stores elastic potential energy. When the key module 100 in the pressed state is released, the elastic body 140 releases the elastic potential energy and drives the key module 100 to return to the free state. When the key module 100 is in the pressed state, the elastic body 140 triggers a circuit switch (not shown) of the membrane switch layer 120, and a processor (not shown) electrically connected to the key module 100 can execute a corresponding function accordingly. The material of the elastic body 140 is, for example, rubber or metal.

[0078] Please refer to Fig. 8A , which is Figure 4 The elastic body 140 includes a top surface 140s1, a bottom surface 140s2 opposite to the top surface 140s1, a side wall 140w connecting the top surface 140s1 and the bottom surface 140s2, a conductive column 141, and a groove 140r. The top surface 140s1 is the elastic body 140 close to the key cap 150 (the key cap 150 is shown in FIG. Figure 4 ) side, and the bottom surface 140s2 is the elastic body 140 close to the membrane switch layer 120 (the membrane switch layer 120 is shown in FIG. Figure 4 ) side. The conductive column 141 is disposed in the internal space defined by the top surface 140s1, the side wall 140w and the bottom surface 140s2. In one embodiment, the conductive column 141 may have a resisting member 1411, which is located at the bottom of the conductive column 141 facing the membrane switch layer 120, so as to interfere with the membrane switch layer 120 when the key module 100 is pressed. The groove 140r is located on the top surface 140s1 and above the conductive column 141. The groove 140r, for example, has a groove bottom surface 140r1 and a groove side surface 140r2, which define a accommodating space recessed from the top surface 140s1. The elastomer 140 also includes a resisting structure 142, and the resisting structure 142 and the resisting member 1411 are, for example, aligned on a central axis. The resisting structure 142 is, for example, a protrusion located at the groove 140r, and the resisting structure 142 protrudes from the groove bottom surface 140r1. In one embodiment, the abutting structure 142 has a surface 142s, which is, for example, a cylindrical surface or a spherical surface, and can provide point contact between the key cap 150 and the groove 140r. Figure 7 and Fig. 8AAs shown, when the keycap 150 is pressed to deform the elastic body 140, the protruding abutting structure 142 interferes with the keycap 150, which can reduce the contact area between the groove bottom surface 140r1 of the groove 140r and the keycap 150, and prevent the groove bottom surface 140r1 from being adsorbed on the surface of the keycap 150, thereby reducing the noise (the sound of air squeezing in) generated by the separation of the elastic body 140 and the keycap 150 when the keycap 150 is released. Further, in order to avoid affecting the pressing feel of the elastic body 140, the height h2 of the abutting structure 142 is less than the depth of the groove 140r (e.g., the distance S2 between the top surface 140s1 and the groove bottom surface 140r1 along the pressing direction), and is, for example, less than about 10% of the overall pressing stroke of the elastic body 140. The aforementioned pressing stroke is, for example, the sum of the distance S1 and the distance S2 between the abutting member 1411 and the bottom surface 140s2 along the pressing direction.

[0079] Please refer to Figure 8B , which is a cross-sectional view of an elastic body 140' according to another embodiment of the present invention. The structure of the elastic body 140' is different from that of the elastic body 140 in that the elastic body 140' further includes a protrusion 143. The protrusion 143 is located in the groove 140r and protrudes from the bottom surface 140r1 of the groove. The abutment structure 142 is located on the protrusion 143 and protrudes from the top surface 143s of the protrusion 143. In one embodiment, Figure 8B When viewed from above, the protrusion 143 may be polygonal, circular or elliptical, wherein the polygon is, for example, a triangle, a square or a rectangle.

[0080] also, Fig. 8A and Figure 8B The groove bottom surface 140r1 is, for example, a plane, but may also be a non-plane, such as a curved surface.

[0081] like Figure 2 and Figure 5 As shown, the key cap 150 is pivotally connected to the lifting mechanism 130 , so the key cap 150 can be lifted and lowered along with the lifting mechanism 130 .

[0082] Although the resisting member 131 in the above embodiment is provided on the lifting mechanism 130 and interferes with the membrane switch layer 120 (to achieve a noise reduction effect), the embodiment of the present invention is not limited thereto. In another embodiment, the lifting mechanism 130 may not be provided with the resisting member 131, but at least one resisting member may be provided on the surface of the membrane switch layer 120 facing the lifting mechanism 130. Fig. 9 Give an example.

[0083] Please refer to Fig. 9, which is a cross-sectional view of a key module 100' according to another embodiment of the present invention. The key module 100' is different from the key module 100 in that the membrane switch layer 120' of the key module 100' further includes a resisting member 121, while the lifting mechanism 130' of the key module 100' can omit (but is not limited to) the resisting member 131.

[0084] Specifically, the resisting member 121 is, for example, disposed on the topmost film connected to the elastic body 140 in the membrane switch layer 120'. The resisting member 121 may protrude from the upper surface of the membrane switch layer 120' and contact the outer bracket 132 of the lifting mechanism 130'. The resisting member 121 may interfere with the outer bracket 132 in a similar manner to the configuration of the resisting member 131 in the above-mentioned embodiment. For example, the resisting member 121 may be formed on the membrane switch layer 120' at the concave portion 132r of the outer bracket 132, so that the protruding resisting member 121 contacts the concave portion 132r, for example, contacts the concave bottom surface 132s of the concave portion 132r. The resisting member 121 may be formed in a block or strip pattern on the upper surface of the membrane switch layer 120 using an insulating buffer material, such as a light-curing material, a thermosetting material, a high molecular polymer, foam, epoxy resin, grease, etc. In this way, the push-up member 121 can provide an elastic interference effect between the lifting mechanism 130' and the membrane switch layer 120', which can not only compensate for the assembly gap and reduce the noise during high-frequency vibration, but also do not affect the pressing feel. In other embodiments, multiple (e.g., a pair) push-up members 121 can also be provided on the surface of the membrane switch layer 120', thereby providing a more stable interference effect between the membrane switch layer 120' and the recessed portion 132r of the outer bracket 132.

[0085] Please refer to Figures 10 to 16 , Fig.10 is a schematic diagram of a key module 200 according to an embodiment of the present invention, Fig.11 and Fig.12 for Fig.10 An exploded view of the key module 200, Fig.13 for Fig.10 A top view of the key module 200, Fig.14 for Fig.13 A cross-sectional view of the key module 200 (in a free state) along the direction 14-14', Fig.15 for Fig.13 The key module 200 is a cross-sectional view along the direction 15-15', and Fig.16 for Fig.14 A cross-sectional view of the key module 200 changing to a pressed state.

[0086] The key module 200 includes a base plate 210, a membrane switch layer 220, at least one lifting mechanism 230, an elastic body 240, a key cap 250, at least one rod 260 and at least one reinforcing member 270. Figure 1 The key module 100 is similar to the key module 100, wherein the base plate 210, the lifting mechanism 230, and the elastic body 240 respectively have structures, materials, and / or processes similar to or the same as those of the aforementioned base plate 110, the lifting mechanism 130, and the elastic body 140, which will not be described in detail.

[0087] like Fig.10 , Fig.11 and Fig.15 As shown, the membrane switch layer 220 is disposed on the bottom plate 210. The lifting mechanism 230 is pivotally connected to the bottom plate 210 so as to be able to be lifted and lowered relative to the lifting direction + / -Z of the membrane switch layer 220. The key cap 250 is disposed on the lifting mechanism 230 and pivotally connected to the lifting mechanism 230, so that the key cap 250 can be lifted and lowered relative to the bottom plate 210 along with the lifting mechanism 230.

[0088] The keycap 250 includes a body 254, a skirt 251 and at least one first connection portion 252. The body 254 is, for example, a thin plate structure substantially parallel to the base plate 210 and can serve as a pressing surface. The skirt 251 is disposed along the periphery of the body 254 and extends toward the base plate 210. The first connection portion 252 is disposed on the bottom surface of the body 254 facing the base plate 210 and is located on the inner side of the skirt 251. The skirt 251 surrounds the first connection portion 252. The skirt 251 and the first connection portion 252 respectively have a first bottom surface 251s and a second bottom surface 252s1 facing the membrane switch layer 220. The second bottom surface 252s1 is projected onto a physical portion of the membrane switch layer 220 (e.g., the interference portion 2231, which will be described later) along the pressing direction -Z of the lifting mechanism 230. The second bottom surface 252s1 is closer to the membrane switch layer 220 than the first bottom surface 251s. That is, the distance between the second bottom surface 252s1 and the upper surface of the membrane switch layer 220 is smaller than the distance between the first bottom surface 251s and the upper surface of the membrane switch layer 220. Fig.16 As shown in FIG. 2 , the first connection portion 252 may interfere with the solid portion of the membrane switch layer 220 .

[0089] In addition, the first connection portion 252 and the membrane switch layer 220 are selectively interfered with each other, that is, the first connection portion 252 and the membrane switch layer 220 do not interfere with each other regularly. Fig.14 As shown, when the key module 200 is in a free state, the first connection portion 252 and the membrane switch layer 220 are spaced apart from each other, that is, the second bottom surface 252s1 does not interfere with the membrane switch layer 120. Fig.16As shown, when the key module 200 is in the pressed state, the first connection portion 252 and the membrane switch layer 220 interfere with each other. Fig.14 ) to a pressed state (as shown) Fig.16 When the key cap 250 is pressed against the membrane switch layer 220, the second bottom surface 252s1 of the first connection portion 252 first contacts the membrane switch layer 220 to produce a slow contact effect. The membrane switch layer 220 can absorb the impact energy of the key cap 250, thereby achieving a technical effect of noise reduction.

[0090] The membrane switch layer 220 includes a plurality of layer structures, one of which has a through portion, and another of which includes an interference portion. Fig.15 and Fig.16 As shown, the membrane switch layer 220 includes a first circuit layer 221, a spacer layer 222 and a second circuit layer 223. The spacer layer 222 is located between the first circuit layer 221 and the second circuit layer 223, and the first circuit layer 221 is closer to the key cap 250 than the second circuit layer 223. The spacer layer 222 has a first through portion 222a. One of the first circuit layer 221 and the second circuit layer 223 has a second through portion, and the other of the first circuit layer 221 and the second circuit layer 223 includes an interference portion. The key module 200 of this embodiment is described by taking the first circuit layer 221 having the second through portion 221a and the second circuit layer 223 including the interference portion 2231 as an example. Fig.13 , Fig.15 and Fig.16 As shown, the first through portion 222a, the second through portion 221a and the interference portion 2231 substantially overlap along the pressing direction -Z.

[0091] In addition, the second bottom surface 252s1 is projected onto the penetration portion and the interference portion along the pressing direction -Z. Fig.13 The enlarged image and Fig.16 As shown, the second bottom surface 252s1 is projected onto the first through portion 222a, the second through portion 221a and the interference portion 2231 along the pressing direction -Z. Fig.16 When the first connection portion 252 is pressed against the keycap 250, the second bottom surface 252s1 of the first connection portion 252 hits one or more layers of the multiple layer structures of the membrane switch layer 220. Since the first connection portion 252 does not hit all the layer structures of the membrane switch layer 220, the impact sound of the keycap 250 is reduced and the negative impact on the pressing curve of the key module 200 can be avoided.

[0092] like Fig.15 and Fig.16 As shown, the second circuit layer 223 of the membrane switch layer 220 has a thickness t2, for example, between 0.05 mm and 0.1 mm, such as 0.075 mm. Fig.15 As shown, if the distance H2 between the position P1 (drawn by dotted line) of the second bottom surface 252s1 in the pressed state and the upper surface 223u of the second circuit layer 223 before pressing is too small, the noise reduction effect is poor; if it is too large, the interference resistance is too large (which may affect the pressing curve). In one embodiment, the distance H2 is, for example, greater than the thickness t2 of the second circuit layer 223, but it can also be less than or approximately equal to the thickness t2. In one embodiment, the distance H2 is, for example, between about 0.05 mm and about 0.2 mm, including 0.05 mm, 0.1 mm, 0.15 mm and 0.2 mm, and the thickness t2 is, for example, about 0.07 mm. In this way, adjusting the interference degree between the first connection portion 252 and the membrane switch layer 220 to this range can take into account the technical effects of "noise reduction" and "avoiding negative impact on the pressing curve".

[0093] like Figures 14 to 16 As shown, the first connection portion 252 of the key cap 250 further has a third bottom surface 252s2 facing the membrane switch layer 220, and the second bottom surface 252s1 is closer to the membrane switch layer 220 than the third bottom surface 252s2. Specifically, the first connection portion 252 has a resisting member 2521, which protrudes relative to the third bottom surface 252s2 and has the aforementioned second bottom surface 252s1, and the second bottom surface 252s1 is, for example, the end surface of the resisting member 2521. When the ratio of the area of ​​the second bottom surface 252s1 of the resisting member 2521 to the area of ​​the third bottom surface 252s2 is larger, it means that the interference resistance between the resisting member 2521 and the membrane switch layer 220 is larger, which may excessively change or negatively change the pressing curve of the key module 200; when the ratio is smaller, the noise reduction effect may not be obvious. The ratio of the area of ​​the second bottom surface 252s1 to the area of ​​the third bottom surface 252s2 is between 40% and 70%, which can take into account the dual technical effects of "not negatively affecting (not excessively changing) the pressing curve of the key module 200" and "noise reduction".

[0094] like Figures 11 to 13As shown, the bottom plate 210 has at least one hollow portion 210a. The projection area of ​​the resisting member 2521 projected on the membrane switch layer 220 along the pressing direction -Z of the lifting mechanism 230 at least partially overlaps the hollow portion 210a of the bottom plate 210. In this way, when the resisting member 2521 (or the second bottom surface 252s1) hits the membrane switch layer 220, since the bottom plate 210 directly below the resisting member 2521 has the hollow portion 210a, the stress applied by the resisting member 2521 to the bottom plate 210 can be reduced, and the noise of the resisting member 2521 indirectly hitting the bottom plate 210 can be reduced. In this embodiment, the projection area of ​​the resist 2521 projected onto the membrane switch layer 220 along the pressing direction -Z is completely located within the range of the hollow portion 210a, so that the stress applied by the resist 2521 to the bottom plate 210 is smaller or minimized, and the noise caused by the resist 2521 hitting the bottom plate 210 is smaller or minimized.

[0095] The number of the first connection parts 252 of the embodiment of the present invention is multiple. Depending on the actual situation, at least one of these first connection parts 252 may have a push-up member 2521. The push-up member 2521 may interfere with (or contact) at least one layer of the membrane switch layer 220, so that the vibration or impact energy generated during the operation of the key module 200 can be absorbed by the membrane switch layer 220, thereby reducing noise. For example, when the keycap 250 moves up and down with the lifting mechanism 230, the push-up member 2521 of the keycap 250 contacts the membrane switch layer 220 in advance, which can greatly reduce the impact and collision sound generated when pressing the keycap 250, and is more helpful to avoid the vibration generated when the key module 200 is operated. Furthermore, the cushioning effect provided by the abutting member 2521 when interfering with the membrane switch layer 220 can effectively improve the noise generated by the key module 200 when subjected to low-frequency vibrations (less than 100KHz) such as knocking or pressing, for example, to less than 60 decibels (dBA), or even less than 45 decibels (dBA).

[0096] In some embodiments, the key module 200 is a multiple key, that is, compared to a standard key of a general size, such as Fig.13 As shown, the length W1 of the keycap 250 of the key module 200 is substantially greater than the width W2 of the keycap 250. Since the length W1 of the keycap 250 of the present embodiment is substantially greater than the width W2 of the keycap 250, the keycap 250 is prone to shaking during the process of pressing the key module 200; even more, if the corner of the keycap 250 is pressed, it may not be possible to meet the downward stroke to conduct the circuit. In view of this, the rod 260 is extended along the length direction of the keycap 250 to alleviate the shaking of the keycap 250 when it moves, and provide stability of the keycap 250 in the length direction.

[0097] like Fig.11 and Fig.15As shown, the rod 260 can be pivoted to the first connection portion 252 and movably disposed between the keycap 250 and the base plate 210. For example, one end of the rod 260 can be pivoted to the first connection portion 252 of the keycap 250, and the other end can be pivoted to the base plate 210. The rod 260 can increase the stability of the keycap 250 during the process of changing from a free state to a pressed state. In this way, even if the keycap 250 is a long strip keycap, the rod 260 can increase the stability of the long strip keycap during the process of changing from a free state to a pressed state. The rod 260 can also be called a balance bar. In another embodiment, when the stability of the keycap is not considered or does not need to be considered, the key module 200 can omit the rod 260.

[0098] In addition, if Fig.11 As shown, the keycap 250 further includes at least one second connection portion 253, which is disposed on the bottom surface of the main body 254 facing the bottom plate 210, and is located on the inner side of the skirt 251 and the first connection portion 252, and the skirt 251 further surrounds the second connection portion 253. Depending on the actual situation, at least one of the second connection portions 253 may have the same or similar bottom surface features and / or abutment features as the first connection portion 252, which will not be described in detail.

[0099] The reinforcing member 270 is disposed on the bottom surface of the main body 254 of the keycap 250 and connected to the second connecting portion 253 of the keycap 250. The reinforcing member 270 can increase the strength and mechanical stability of the keycap 250. The reinforcing member 270 is, for example, a rod-shaped or plate-shaped metal structure, which is fixedly disposed in a relatively central area of ​​the keycap 250 and is not connected to the bottom plate 210, that is, the rod 260 surrounds the outer side of the reinforcing member 270. In this way, even if the keycap 250 is a long strip-shaped keycap (the longer the length, the greater the flexibility), the sufficient strength of the keycap 250 can still be maintained. The reinforcing member 270 is located in the middle area of ​​the keycap 250 to provide additional support, which can strengthen the strength of the middle area of ​​the keycap 250 and reduce the deformation of the middle position of the keycap 250 when the middle position of the keycap 250 is pressed.

[0100] Please refer to Fig.17 , which is a partial cross-sectional view of a key module 300 in a pressed state according to another embodiment of the present invention. The key module 300 is similar to the key module 200 of the aforementioned embodiment, so the present embodiment uses the component numbers and some contents of the aforementioned embodiment, wherein the same numbers are used to represent the same or similar components, and the differences between the key module 300 and the key module 200 will be described below.

[0101] The key module 300 is different from the key module 200 in that the structure of the membrane switch layer 320 of the key module 300 is different from that of the membrane switch layer 220 of the key module 200. The membrane switch layer 320 includes a first circuit layer 321, a spacer layer 322, and a second circuit layer 323. The spacer layer 322 is located between the first circuit layer 321 and the second circuit layer 323, and the first circuit layer 321 is closer to the key cap 250 than the second circuit layer 323. The spacer layer 322 has a first through-portion 322a. One of the first circuit layer 321 and the second circuit layer 323 has a second through-portion, and the other of the first circuit layer 321 and the second circuit layer 323 includes an interference portion. The key module 300 of this embodiment is described by taking the second circuit layer 323 having the second through-portion 323a and the second circuit layer 321 including the interference portion 3211 as an example.

[0102] In addition, if Fig.17 As shown, the second bottom surface 252s1 is projected onto the first through portion 322a, the second through portion 323a and the interference portion 3211 along the pressing direction -Z. When the key module 300 is in a pressed state, the second bottom surface 252s1 of the first connecting portion 252 hits at least one layer of the membrane switch layer 320 as a buffer, thereby reducing the knocking sound of the key cap 250 and avoiding negative impact on the pressing curve of the key module 300.

[0103] It is explained here that an embodiment of the present invention provides a key module, which includes at least one of the following features:

[0104] (1) In one embodiment, the push member is disposed on the lifting mechanism, which can reduce the noise during high-frequency vibration without affecting the pressing feel.

[0105] (2) In one embodiment, the abutment member is disposed on the keycap to provide a soft contact effect when interfering with the membrane switch layer, thereby effectively improving the noise generated by the key module under low-frequency vibration.

[0106] (3) In one embodiment, a supporting structure is disposed in the groove of the elastic body to provide a further noise reduction effect.

[0107] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A key module, characterized in that: include: a bottom plate; A membrane switch layer, disposed on the bottom plate; a key cap, disposed on the membrane switch layer; as well as A lifting mechanism is disposed between the bottom plate and the key cap, and two ends of the lifting mechanism are movably connected to the bottom plate and the key cap, respectively. The lifting mechanism has a resisting member, and the resisting member interferes with the membrane switch layer; The lifting mechanism includes an outer bracket and an inner bracket which are cross-pivoted, the outer bracket includes a pivot rod and a concave portion, the concave portion is formed on the pivot rod, the pivot rod is pivoted to the bottom plate, the membrane switch layer passes through the bottom of the concave portion, and the abutting member is disposed on a concave bottom surface of the concave portion; In which, the recess further has two opposite side surfaces, and the two opposite side surfaces are respectively connected to the outer surface of the pivot rod. The length of the recess along the extension direction of the pivot rod is greater than the length of the resist along the extension direction. The resist is arranged between the two opposite side surfaces of the recess and protrudes relative to the bottom surface of the recess. The protruding height of the pivot rod relative to the bottom surface of the recess is greater than the protruding height of the resist relative to the bottom surface of the recess.

2. The key module according to claim 1, characterized in that: During the lifting process of the lifting mechanism, the interference amount between the abutting member and the membrane switch layer is maintained equal.

3. The key module according to claim 1, characterized in that: The bottom plate has a bottom plate hollow portion, and a projection area of ​​the abutting member projected onto the membrane switch layer along a pressing direction of the lifting mechanism at least partially overlaps with the bottom plate hollow portion.

4. The key module according to claim 1, characterized in that: The abutting component has a curved surface, and the curved surface interferes with the membrane switch layer.

5. The key module according to claim 1, characterized in that: The key module further includes: An elastic body is located between the key cap and the membrane switch layer, and includes a top surface, a groove sunken relative to the top surface, and a top-pushing structure. The top-pushing structure is located at the bottom surface of the groove. When the key module is in a pressed state, the top-pushing structure interferes with the key cap.

6. A key module, characterized in that: include: A bottom plate having a bottom plate hollow portion; A membrane switch layer, disposed on the bottom plate and having a membrane hollow portion; A lifting mechanism is pivotally connected to the bottom plate so as to be liftable relative to the membrane switch layer; a keycap, disposed on the lifting mechanism and comprising a skirt portion and a connecting portion, the skirt portion surrounding the connecting portion, the skirt portion and the connecting portion respectively having a first bottom surface and a second bottom surface facing the membrane switch layer, the second bottom surface being closer to the membrane switch layer than the first bottom surface, the second bottom surface being projected onto a substantial portion of the membrane switch layer along a pressing direction of the lifting mechanism, and the second bottom surface interfering with the membrane switch layer occassionally; and a rod, pivotally connected to the connecting portion; The thin film hollow portion has a larger hollow portion and a smaller hollow portion that are connected to each other, the smaller hollow portion overlaps with the bottom plate hollow portion along the pressing direction, and the width of the bottom plate hollow portion along a long side direction of the key cap is greater than the width of the smaller hollow portion of the thin film hollow portion along the long side direction; The connecting portion has a first side and a second side opposite to each other, the first side faces a solid material of the membrane switch layer, and the second side is directly below the membrane hollow portion and the bottom plate hollow portion, and the corresponding edges of the membrane hollow portion and the bottom plate hollow portion have a spacing.

7. The key module according to claim 6, characterized in that: When the key module is in a pressed state, the second bottom surface interferes with the membrane switch layer; when the key module is in a free state, the second bottom surface does not interfere with the membrane switch layer.

8. The key module according to claim 6, characterized in that: The membrane switch layer includes a plurality of layer structures, one of the layer structures has a penetration portion, another of the layer structures includes an interference portion, and the second bottom surface is projected onto the penetration portion and the interference portion along the pressing direction.

9. The key module according to claim 6, characterized in that: The membrane switch layer includes a first circuit layer, a spacer layer and a second circuit layer, the spacer layer is located between the first circuit layer and the second circuit layer, the spacer layer has a first through-portion, one of the first circuit layer and the second circuit layer has a second through-portion, the other of the first circuit layer and the second circuit layer includes an interference portion, and the second bottom surface is projected onto the first through-portion, the second through-portion and the interference portion along the pressing direction.

10. The key module according to claim 6, characterized in that: The connecting portion further has a third bottom surface facing the membrane switch layer, the second bottom surface is closer to the membrane switch layer than the third bottom surface, and the ratio of the area of ​​the second bottom surface to the area of ​​the third bottom surface is between 40% and 70%.

11. The key module according to claim 6, characterized in that: The connecting portion has a resisting member, and the resisting member has the second bottom surface.

12. The key module according to claim 6, characterized in that: The bottom plate has a bottom plate hollow portion; the connecting portion has a resisting member having the second bottom surface, and a projection area of ​​the resisting member projected onto the membrane switch layer along the pressing direction of the lifting mechanism at least partially overlaps with the bottom plate hollow portion.

13. The key module according to claim 6, characterized in that: The key module further includes: An elastic body is located between the key cap and the membrane switch layer, and includes a top surface, a groove sunken relative to the top surface, and a top-pushing structure. The top-pushing structure is located at the bottom surface of the groove. When the key module is in a pressed state, the top-pushing structure interferes with the key cap.

14. A key module, characterized in that: include: A bottom plate having a bottom plate hollow portion; A membrane switch layer, disposed on the bottom plate and having a membrane hollow portion, the membrane switch layer includes a plurality of layer structures, one of the layer structures has a penetration portion, and another of the layer structures includes an interference portion; A lifting mechanism pivotally connected to the bottom plate so as to be liftable relative to the membrane switch layer; and A key cap is arranged on the lifting mechanism and includes a main body, a skirt and a connecting portion, wherein the skirt is arranged along the periphery of the main body and extends toward the bottom plate, the connecting portion is arranged on the bottom surface of the main body facing the bottom plate and has a third bottom surface, and the connecting portion has a resisting member, the resisting member protrudes relative to the third bottom surface and is projected onto the penetration portion and the interference portion along a pressing direction of the lifting mechanism; The thin film hollow portion has a larger hollow portion and a smaller hollow portion that are connected to each other, the smaller hollow portion overlaps with the bottom plate hollow portion along the pressing direction, and the width of the bottom plate hollow portion along a long side direction of the key cap is greater than the width of the smaller hollow portion of the thin film hollow portion along the long side direction; The connecting portion has a first side and a second side opposite to each other, the first side faces a solid material of the membrane switch layer, and the second side is directly below the membrane hollow portion and the bottom plate hollow portion, and the corresponding edges of the membrane hollow portion and the bottom plate hollow portion have a spacing.

15. The key module according to claim 14, characterized in that: The key module further includes: A rod is movably disposed between the key cap and the bottom plate and is pivotally connected to the connecting portion.

16. The key module according to claim 14, characterized in that: The key module further includes: A reinforcing piece is correspondingly arranged in the middle area of ​​the key cap and connected to the connecting portion.

17. A key module, characterized in that: include: a bottom plate; A membrane switch layer, disposed on the bottom plate; a key cap, disposed on the membrane switch layer; as well as A lifting mechanism is disposed between the base plate and the key cap, and two ends of the lifting mechanism are movably connected to the base plate and the key cap respectively. The membrane switch layer has a resisting member, which is disposed on a surface of the membrane switch layer facing the lifting mechanism to interfere with the lifting mechanism; Wherein, the abutment member is an integrally formed part of the topmost film disposed in the film switch layer; The lifting mechanism comprises an outer bracket and an inner bracket which are pivotally connected, the outer bracket has a recess, the membrane switch layer passes through the bottom of the recess, the abutment protrudes from the upper surface of the membrane switch layer corresponding to the recess and contacts the outer bracket; Wherein, a recessed portion height of the recessed portion is greater than a protruding height of the abutting member.

18. The key module according to claim 17, characterized in that: The abutting piece is an insulating buffer material with a block or strip pattern.

Citation Information

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