Terminal device, its display screen and application

Abstract

The present invention provides a terminal device, its display screen and an application. The terminal device includes a terminal device body, a display screen and a camera module. The display screen has a light passing hole. The camera module is located below the display screen. The camera module has a front end. The front end of the camera module is fixedly mounted on the display screen and the camera module is aligned with the light passing hole of the display screen, so that the light outside the display screen is received by the camera module through the light passing hole.

Description

Technical Field

[0001] The present invention relates to the field of electronic devices, and particularly to a terminal device with a full-screen display, its display screen, and applications. Background Art

[0002] Currently, electronic devices usually have a camera function. For this reason, in existing mobile phone terminals, there are generally front and rear camera modules. Among them, the front camera module is arranged on the same side of the display screen to meet the needs of users for selfies and the like. The front camera module occupies a relatively large screen space, which is contrary to the current trend of pursuing full-screen displays.

[0003] The current measure is to design the camera module as a telescopic camera module to hide and use the camera function. When the camera function of the electronic device needs to be used, at least part of the camera module is controlled to extend out of the housing of the electronic device. When the camera function is used up, at least part of the camera module is controlled to retract into the housing of the electronic device. However, the camera module itself is a relatively precise component, and its service life in high-frequency back-and-forth movements remains to be tested, and the camera module is easily damaged due to external force obstruction during the movement process.

[0004] Therefore, how to ensure the front camera function of the electronic device and at the same time take into account the pursuit of full-screen displays is still an urgent problem to be solved. Summary of the Invention

[0005] An object of the present invention is to provide a terminal device, its display screen, and applications, wherein the camera module of the terminal device can collect sufficient light and at the same time the screen-to-body ratio of the terminal device can be increased.

[0006] Another object of the present invention is to provide a terminal device, its display screen, and applications, wherein the camera module of the terminal device is configured as an under-display camera module and can receive sufficient light through the light-transmitting hole of the display screen.

[0007] Another object of the present invention is to provide a terminal device, its display screen, and applications, wherein the camera module of the terminal device is configured as an under-display camera module and can receive sufficient light through the light-transmitting hole located at the edge of the display screen.

[0008] Another object of the present invention is to provide a terminal device, its display screen, and applications, wherein the light passing through the light-transmitting hole can be guided along a preset path to the camera module to be received by the camera module.

[0009] Another object of the present invention is to provide a terminal device, its display screen, and applications, wherein the camera module and the display screen can be assembled together to facilitate maintaining the relative positions of the camera module and the display screen.

[0010] Another object of the present invention is to provide a terminal device, its display screen and application, wherein the camera module of the terminal device can be designed to be of a smaller size, so as to be conducive to reducing the overall height of the display screen and the camera module located below the display screen.

[0011] According to an aspect of the present invention, the present invention provides a terminal device, which includes a terminal device body, a display screen, a camera module and at least one light passing hole, wherein the display screen is mounted on the terminal device body, the camera module is held below the display screen and is aligned with the light passing hole, wherein the light passing hole passes through at least a part of the display screen in the height direction, and the light outside the display screen is conducted to the camera module below the display screen through the light passing hole, wherein the light passing hole is designed as a virtual diaphragm of the camera module.

[0012] According to an embodiment of the present invention, the terminal device further includes a housing, and one of the light passing holes penetrates from one side surface of the display screen to a bottom surface of the display screen in a gap between the housing and the display screen.

[0013] According to an embodiment of the present invention, the camera module includes a photosensitive unit, an optical mechanism and a diaphragm, wherein the diaphragm is mounted on the optical mechanism, and the optical mechanism is held in a photosensitive path of the photosensitive component and receives the light passing through the light passing hole.

[0014] According to an embodiment of the present invention, the camera module includes a photosensitive unit and an optical unit, wherein the optical unit is held in the light passing hole, and the photosensitive unit is aligned with the light passing hole.

[0015] According to an embodiment of the present invention, the optical unit includes an optical lens, wherein the optical lens includes a lens barrel and a plurality of lenses, wherein the lens barrel includes a lens barrel wall and an extension wall, the lenses are mounted on the lens barrel wall, and the extension wall extends vertically upward from an end of the lens barrel wall close to the display screen by a preset distance.

[0016] According to an embodiment of the present invention, the extension wall is arranged to extend vertically upward from the lens barrel wall and then extend inward.

[0017] According to an embodiment of the present invention, the extension wall is arranged to extend upwardly and the inner diameter of the extension arm is smaller the closer it is to the lens barrel wall.

[0018] According to an embodiment of the present invention, the inner diameter of each position of the extension wall remains consistent.

[0019] According to an embodiment of the present invention, the outer diameter of the extension wall is smaller the closer it is to the lens barrel wall; alternatively, the outer diameter of the extension wall is larger the closer it is to the lens barrel wall.

[0020] According to an embodiment of the present invention, the display screen includes a cover plate layer, a touch layer, a polarization layer, a packaging layer, a pixel layer, and a driving circuit layer. The cover plate layer, the touch layer, the polarization layer, the packaging layer, the pixel layer, and the driving circuit layer are stacked on top of each other in the height direction. The driving circuit layer is formed on the bottom side of the pixel layer and is electrically connected to the pixel layer to drive the pixel layer to operate. The packaging layer is formed on the top side of the pixel layer to package the pixel layer. The polarization layer is used to perform polarization processing on the passing light. The light passing hole passes through the touch layer, the polarization layer, the packaging layer, the pixel layer, and the driving circuit layer of the display screen except for the cover plate layer in the height direction.

[0021] According to an embodiment of the present invention, the driving circuit layer includes a substrate and a plurality of TFT structures. The TFT structures are disposed on the substrate, and the light passing hole is located between adjacent TFT structures.

[0022] According to an embodiment of the present invention, the pixel layer includes a plurality of pixels, and the light passing hole is located between adjacent pixels.

[0023] According to an embodiment of the present invention, the driving circuit layer includes a substrate and a plurality of TFT structures. The TFT structures are disposed on the substrate, and the light passing hole is located between adjacent TFT structures.

[0024] According to an embodiment of the present invention, a protective material is provided on the terminal device. The protective material is located in the light passing hole and is coated on the pixel layer and / or the driving circuit layer.

[0025] According to an embodiment of the present invention, the pixel layer includes an anode layer, a light-emitting layer, a cathode layer, and a protective layer. The anode layer is located above the driving circuit layer, the light-emitting layer is located between the anode layer and the cathode layer, and the cathode layer is located above the light-emitting layer and below the protective layer.

[0026] According to an embodiment of the present invention, a protective material is provided on the terminal device. The protective material is located in the light passing hole, and the protective material extends downward from the protective layer to the cathode layer; alternatively, the protective material extends downward from the protective layer to the light-emitting layer; or the protective material extends downward from the protective layer to the anode layer.

[0027] According to an embodiment of the present invention, the terminal device includes a backplane layer, the backplane layer is located below the driving circuit layer and is used for emitting light, the pixel layer includes a light filtering layer and liquid crystal, wherein the liquid crystal is located between the light filtering layer and the driving circuit layer, the pixel layer is provided with a sealing material, wherein the sealing material is located between the light filtering layer and the driving circuit layer, and the liquid crystal is blocked by the sealing material and thus cannot leak to the light transmission hole.

[0028] According to an embodiment of the present invention, the terminal device is provided with a protective material, wherein the protective material is located in the light transmission hole, and the protective material is coated on the pixel layer and / or the driving circuit layer.

[0029] According to an embodiment of the present invention, the terminal device further includes a light guide pipe, wherein the light guide pipe is accommodated in the light transmission hole.

[0030] According to an embodiment of the present invention, the light guide pipe is made of a transparent material.

[0031] According to an embodiment of the present invention, the light guide pipe is coated with a light-blocking material.

[0032] According to an embodiment of the present invention, the terminal device further includes a limiting mechanism, wherein one end of the limiting mechanism is connected to the camera module, the other end of the limiting mechanism is connected to the display screen, and the camera module is fixed to the display screen through the limiting mechanism. Description of the Drawings

[0033] FIG. 1 is a schematic diagram of a terminal device according to the prior art.

[0034] Figure 2 is a schematic diagram of a display screen and a camera module according to the prior art

[0035] FIG. 3 is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0036] Figure 4A is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0037] Figure 4B is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0038] Figure 5A is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0039] Figure 5B is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0040] Figure 6A It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0041] Figure 6B It is a schematic diagram of the above-mentioned display screen according to the above-mentioned preferred embodiment of the present invention.

[0042] Figure 7 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0043] Figure 8 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0044] Figure 9 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0045] Figure 10 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0046] Figure 11 It is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0047] Figure 12 It is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0048] Figure 13 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0049] Figure 14A It is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0050] Figure 14B It is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0051] Figure 15 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0052] Figure 16 It is a manufacturing schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0053] Figure 17 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0054] Figure 18A It is an application schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0055] Figure 18B It is an application schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0056] Figure 19 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0057] Figure 20 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0058] Figure 21 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0059] Figure 22 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0060] Figure 23 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0061] Figure 24 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0062] Figure 25 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0063] Figure 26 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0064] Figure 27 It is a schematic diagram of the application of a display screen according to a preferred embodiment of the present invention.

[0065] Figure 28 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0066] Figure 29 It is a schematic diagram of a display screen according to a preferred embodiment of the present invention.

[0067] Figure 30 It illustrates a specific example of a camera module according to an embodiment of the present application.

[0068] Figure 31 It illustrates another specific example of a camera module according to an embodiment of the present application.

[0069] Figure 32 It illustrates yet another specific example of a camera module according to an embodiment of the present application.

[0070] Figure 33 It illustrates yet another specific example of a camera module according to an embodiment of the present application.

[0071] Figure 34Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0072] Figure 35 Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0073] Figure 36 Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0074] Figure 37 Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0075] Figure 38 Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0076] Figure 39 Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0077] Figure 40 Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0078] Figure 41 Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0079] Figure 42 Illustrated is another specific example of the camera module according to an embodiment of the present application.

[0080] Figure 43 Illustrated is a schematic diagram of an existing camera module based on a molding process.

[0081] Figure 44 Illustrated is a specific illustration of the photosensitive chip of the camera module

[0082] Figure 45 Illustrated is another specific illustration of the photosensitive chip of the camera module.

[0083] Figure 46 Illustrated is a specific illustration of the photosensitive layer of the photosensitive chip of the camera module.

[0084] Figure 47 Illustrated is another specific illustration of the photosensitive layer of the photosensitive chip of the camera module.

[0085] Figure 48A Schematic diagram of an assembly system according to a preferred embodiment of the present invention.

[0086] Figure 48B Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0087] Figure 49 Schematic diagram of the support platform of the assembly system according to a preferred embodiment of the present invention.

[0088] Figure 50 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0089] Figure 51A Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0090] Figure 51B Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0091] Figure 51C Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0092] Figure 52 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0093] Figure 53 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0094] Figure 54 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0095] Figure 55 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0096] Figure 56 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0097] Figure 57 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0098] Figure 58 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0099] Figure 59 Schematic diagram of an assembly process according to a preferred embodiment of the present invention.

[0100] Figure 60A Schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0101] Figure 60B Schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0102] Figure 60C Schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0103] Figure 60D It is a schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0104] Figure 60E It is a schematic diagram of a lens barrel according to a preferred embodiment of the present invention.

[0105] Figure 61A It is a schematic diagram of a terminal device according to a preferred embodiment of the present invention.

[0106] Figure 61B It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0107] Figure 61C It is a partial schematic diagram of another working state of the display unit according to the above preferred embodiment of the present invention.

[0108] Figure 62A It is a partial schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0109] Figure 62B It is a partial schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0110] Figure 62C It is a partial schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0111] Figure 63 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0112] Figure 64 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0113] Figure 65 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0114] Figure 66 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0115] Figure 67 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0116] Figure 68 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0117] Figure 69 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0118] Figure 70 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention.

[0119] Figure 71 It is a schematic diagram of a display unit according to a preferred embodiment of the present invention. Detailed implementation manners

[0120] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present invention can be applied to other implementation schemes, variant schemes, improvement schemes, equivalent schemes, and other technical schemes without departing from the spirit and scope of the present invention.

[0121] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on the present invention.

[0122] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. The term "a" should not be construed as a limitation on the number.

[0123] Although ordinal numbers such as "first", "second", etc. will be used to describe various components, those components are not limited here. The term is only used to distinguish one component from another. For example, the first component can be called the second component, and similarly, the second component can also be called the first component without departing from the teachings of the inventive concept. The term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0124] The terms used here are only for the purpose of describing various embodiments and are not intended to be limiting. As used herein, the singular form is intended to also include the plural form unless the context clearly indicates otherwise. Additionally, it will be understood that the terms "comprising" and / or "having" when used in this specification specify the presence of the stated features, numbers, steps, operations, components, elements, or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements, or groups thereof.

[0125] The terms used herein, including technical and scientific terms, have the same meaning as those commonly understood by those skilled in the art, unless the term is otherwise defined. It should be understood that terms defined in commonly used dictionaries have meanings consistent with those in the prior art.

[0126] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments:

[0127] Application Overview:

[0128] In recent years, a technical solution for an under-display camera module has been proposed. The camera module is held below the display screen and installed on the main board of an electronic device such as a mobile phone. Due to manufacturing processes, a relatively large light-transmitting area is reserved on the display screen to enable the camera module to take normal pictures through the light-transmitting area. The size of the light-transmitting area is much larger than the light-receiving area of the camera module. And once the field of view angle θ of the camera module is set larger, the light-transmitting area also needs to be set larger to meet the picture-taking requirements during the back-and-forth movement of the camera module. The light-receiving area of the camera module refers to the area of the lens part of the camera module for light entry.

[0129] Reference can be made to Figure 1A and Figure 1B As shown, it is a schematic diagram of an existing under-display camera module 30P. As shown in FIG. 1, the display screen 20P has a light-transmitting area S. The light-transmitting area S is restricted by the earlier manufacturing process and is much larger than the light-receiving area P of the camera module 30P. And when the camera module 30P needs to move back and forth relative to the display screen 20P, the light-transmitting area S needs to be made larger.

[0130] Viewed from above the display screen 20P, the light-transmitting area S will occupy a relatively large area of the display screen 20P. Further, due to the prior art, in order to ensure the light entry amount of the module, the light-transmitting area S cannot be used for display, so it is not conducive to improving the screen-to-body ratio of the entire display screen 20P.

[0131] The present invention provides a display screen 20P, which can improve the screen-to-body ratio of the display screen 20P as much as possible while meeting the imaging light required by the camera module 30P provided below the display screen 20P.

[0132] Reference can be made to Figure 2 to Figure 5B As shown, it is a schematic diagram of the display screen 20 and its manufacturing method according to some embodiments of the present invention.

[0133] The display screen 20 has a light-transmitting hole 200, where the light-transmitting hole 200 serves as the light-transmitting area, and the camera module 30 is located below the display screen 20. The camera module 30 forms an image by receiving the light passing through the light-transmitting hole 200.

[0134] It is worth mentioning that the camera module 30 can be fixed to the display screen 20, so that no space needs to be reserved between the camera module 30 and the display screen 20, enabling the overall height to be reduced. And since the camera module 30 is in close contact with the display screen 20, the requirement for the area size of the light-transmitting area S by the camera module 30 can also be reduced. Of course, the camera module 30 can also be moved relative to the display screen 20, but the light-transmitting area of the display screen 20 can be made smaller.

[0135] The light-transmitting area, that is, the light-transmitting hole 200 can be designed to be smaller, which also poses higher requirements for the manufacturing process of the display screen 20.

[0136] In this example, the display screen 20 is implemented as an OLED display screen 20. The display screen 20 includes: a cover layer 21, a touch layer 22, a polarization layer 23, a packaging layer 24, a pixel layer 25, a driving circuit layer 26, and a backplane layer 27 that are distributed from top to bottom. Among them, the backplane layer 27 is located at the bottom side, the cover layer is located at the top side, the driving circuit layer 26 is formed on the bottom side of the pixel layer 25 and is electrically connected to the pixel layer 25 for driving the pixel layer 25 to work; the packaging layer 24 is formed on the top side of the pixel layer 25 for packaging the pixel layer 25; and the pixel layer 25 includes pixels distributed in an array, and there are gaps between the pixels for the light passing through the cover layer 21, the touch layer 22, the polarization layer 23, and the packaging layer 24 in sequence to pass through the pixel layer 25 through the gaps.

[0137] In particular, the display screen 20 also has the light-transmitting hole 200, where the light-transmitting hole 200 passes through the touch layer 22, the polarization layer 23, the packaging layer 24, the pixel layer 25, and the driving circuit layer 26. It should be noted that the light-transmitting hole 200 can pass through the cover layer 21 or not. The cover layer 21 is generally made of a material with good light transmittance, such as glass. Therefore, the cover layer 21 does not need to be perforated to allow light to pass through efficiently.

[0138] Further, the cover layer 21 is located above the display screen 20. If the cover layer 21 is a complete structure, the cover layer 21 located above each layer of the display screen 20 can protect other layers, such as preventing contaminants like moisture or dust from entering other layers of the display screen 20. In this example, preferably, the light passing hole 200 does not penetrate the cover layer 21.

[0139] The camera module 30 can be installed below the display screen 20 and receive sufficient light from above the display screen 20 through the light passing hole 200.

[0140] Further, the camera module 30 is fixedly installed on the display screen 20, and the size of the light passing hole 200 of the display screen 20 can be designed to be smaller.

[0141] Such as Figure 3A and attached Figure 3B As shown, in this embodiment, the display screen 20 is implemented as an OLED (Organic Light-emitting Diode) display screen 20. Those skilled in the art should know that the OLED display screen 20 has advantages such as self-luminance, wide viewing angle, high contrast, low power consumption, high response speed, and full color.

[0142] The cover layer 21 is usually implemented as a glass layer, which is located at the topmost layer of the display screen 20 and is used to protect the layers below the cover layer 21. It should be understood that the glass layer is made of glass material, and the glass material is a material with a high light transmittance.

[0143] The touch layer 22 is located below the cover layer 21. Usually, the cover layer 21 and the touch layer 22 are connected by an adhesive. Those skilled in the art should know that the touch layer 22 is an indispensable configuration for the display screen 20 to have a touch function.

[0144] The polarization layer 23 is located below the touch layer 22, and the polarization layer 23 is usually implemented as a circularly polarized light, etc.

[0145] The encapsulation layer 24 is located below the polarization layer 23. The function of the encapsulation layer 24 is to encapsulate the pixel layer 25 located below the encapsulation layer 24, so that the pixel layer 25 is in a sealed environment, preventing the organic materials in the pixel layer 25 from being contaminated or volatilized by the outside world. Specifically, there are two types of the encapsulation layer 24. When the display screen 20 is a rigid screen, the encapsulation layer 24 is made of a rigid light-transmissive material, such as glass, plastic, etc.; when the display screen 20 is a flexible screen, the encapsulation layer 24 is made of a flexible light-transmissive material, such as a PI film (Polyimide Film).

[0146] The pixel layer 25 is wrapped by the encapsulation layer 24 and located below the encapsulation layer 24. For the OLED display screen 20, the pixel units in the pixel layer 25 are implemented as OLEDs, that is, Organic Light-emitting Diode.

[0147] The driving circuit layer 26 is located below the pixel layer 25, and the driving circuit layer 26 can be electrically connected to the pixel layer 25 to drive the pixel layer 25 to work.

[0148] The backplane layer 27 is located below the driving circuit layer 26, and the backplane layer 27 can strengthen the structural strength of the entire display screen 20. The backplane layer 27 is usually made of a plastic material.

[0149] For the OLED display screen 20, it should be noted that the pixel layer 25 and the driving circuit layer 26 need to be avoided during the opening process. The driving circuit layer 26 is provided with a circuit structure, and the pixel layer 25 includes multiple pixels. Once the light-transmitting hole 200 damages the circuit structure of the driving circuit layer 26 or the pixel structure of the pixel layer 25, it is very likely to affect the working efficiency of the OLED display screen 20.

[0150] There are mainly three forms of opening the OLED display screen 20. One is to perform opening processing on all layers of the OLED display screen 20 after all layers of the OLED display screen 20 are assembled. One is to perform layer-by-layer opening processing on all layers of the OLED display screen 20. The other is to perform opening processing on some layers of the OLED display screen 20, such as the pixel layer 25 and / or the driving circuit layer 26 in advance, and then perform unified opening processing after installing other layers to form the OLED display screen 20.

[0151] It should be noted that the opening here not only refers to an actual small hole, but can also refer to an area formed on the display screen 20 that has a function similar to that of a hole. For example, the display screen 20 can be first subjected to an opening process, and then a transparent material is filled in the opening position so that this area can have a light-transmitting function similar to that of a hole.

[0152] It is worth mentioning that when obtaining the display screen 20 with a light-transmitting hole 200 by using the first method, an opening area can be reserved during the manufacturing process of the driving circuit layer 26 and the pixel layer 25. The circuit structure of the driving circuit layer 26 and the pixels of the pixel layer 25 are not within the opening area, so as to reduce the impact of the light-transmitting hole 200 on the working efficiency of the OLED display screen 20 after subsequent opening.

[0153] The pixel layer 25 is formed on the driving circuit layer 26 by evaporation. The pixel layer 25 includes an anode layer 251, a light-emitting layer 252, a cathode layer 253, and a protective layer 254. Among them, the anode layer 251 is located above the driving circuit layer 26, the light-emitting layer 252 is located between the anode layer 251 and the cathode layer 253, and the cathode layer 253 is located above the light-emitting layer 252 and below the protective layer 254.

[0154] The light-transmitting hole 200 penetrates through the pixel layer 25. Specifically, the light-transmitting hole 200 penetrates through the pixel layer 25 and the layers of the display screen 20 in the direction perpendicular to the layers of the pixel layer 25, except for the cover plate layer 21 of the display screen 20.

[0155] The pixel layer 25 can also include some other film layers, such as a planarization layer, a passivation layer, etc., which are not limited here. In this example, the light-transmitting hole 200 can be set in the display area of the display screen 20. Since the diameter of the light-transmitting hole 200 involved in the present invention is less than or equal to 3.99 mm, preferably less than or equal to 2 mm, and the light-transmitting hole 200 does not affect the normal display of the display screen 20, the camera module 30 is installed at a preset position below the display screen 20 corresponding to the light-transmitting hole 200.

[0156] It is worth mentioning that this preset position should be determined according to the diameter of the light-transmitting hole 200 and the optical path parameters of the camera module 30, that is, the camera module 30 is set at the preset position to receive light through the light-transmitting hole 200 on the display screen 20 and perform normal imaging. Since the size of the light-transmitting hole 200 is relatively small compared with the existing light-transmitting holes, the display area is increased, which is beneficial to the production of a full-screen display.

[0157] It should be noted that the shape of the light-transmitting hole 200 can be triangular, rectangular or circular. In this example, the light-transmitting hole 200 is preferably circular.

[0158] Refer to the appendix Figure 4A As shown, a specific implementation of processing the OLED display screen 20 with a single hole opening to form holes throughout the OLED display screen 20 is illustrated.

[0159] After forming the pixel layer 25 on the driving circuit layer 26, at least part of the protective layer 254 of the pixel layer 25 can be removed by means of etching or directly punching holes to form a groove. At least part of a marking substance can be filled in the groove, and the marking substance can be used to indicate the hole opening area. The marking substance can be a transparent material, and the position of the marking substance can be determined based on the difference in light transmittance between the marking substance and the surrounding materials.

[0160] Install the other layers of the OLED display screen 20 on the driving circuit layer 26 or the pixel layer 25 to obtain the complete OLED display screen 20. Based on the marking substance, the hole opening area can be determined from above the OLED display screen 20, and then the OLED display screen 20 is subjected to a hole opening process. During the hole opening process, the range of the light-transmitting hole 200 can be larger than the size of the area occupied by the marking substance, so that after the hole opening is completed, the marking substance can be completely removed.

[0161] It can be understood that the method of using the marking substance to locate the hole opening area at this time is only an example. Those skilled in the art should understand that the method of opening holes in the OLED display screen 20 and bypassing the circuit structure of the driving circuit layer 26 and / or the pixel structure of the pixel layer 25 is not limited to the above example.

[0162] Refer to the appendix Figure 4B As shown, a specific implementation of processing the OLED display screen 20 with multiple hole openings to form holes throughout the OLED display screen 20 is illustrated.

[0163] In this example, first, the driving circuit layer 26 and the pixel layer 25 are subjected to a hole opening process, and then the other layers of the OLED display screen 20 are subjected to a hole opening process to obtain the display screen 20 with the light-transmitting hole 200.

[0164] The area circled by the dashed line frame is the position of the light-transmitting hole 200. The light-transmitting hole 200 penetrates the display screen 20 in a direction perpendicular to the pixel layer 25 and the driving circuit layer 26. Those skilled in the art should know that the structure of the pixel layer 25 in the figure is only schematic, and each functional layer can be set as needed. Moreover, the specific position where the light-transmitting hole 200 penetrates can be set according to requirements and is not limited to the position shown in the figure.

[0165] Further, the driving circuit layer 26 includes a plurality of TFT structures 261 and a substrate 262. The TFT structures 261 are sequentially arranged on the substrate 262 to form a TFT array. The substrate 262 is located below the TFT structures 261, and the TFT structures 261 are located below the pixel layer 25.

[0166] The light-transmitting hole 200 penetrates from the pixel layer 25 to the substrate 262 of the driving circuit layer 26.

[0167] The pixel layer 25 further includes a planarization layer 255 and a pixel definition layer 256. The planarization layer 255 is located between the TFT structures 261 and the anode layer 251, and the pixel definition layer 256 is located between the anode layer 251 and the light-emitting layer 252. The pixel definition layer 256 has at least one pixel groove 2560, and at least part of the light-emitting layer 252 and at least part of the anode layer 251 are recessed in the pixel groove 2560, so that the pixel definition layer 256 can be used to define the pixel 257.

[0168] In this example, the light-transmitting hole 200 is formed between two of the TFT structures 261, thereby reducing the circuit impact on the driving circuit layer 26. At least part of the protective layer 254 covers the periphery of the light-transmitting hole 200, so that the anode layer 251, the light-emitting layer 252, and the cathode layer 253 near the light-transmitting hole 200 are not exposed, so as to reduce the impact caused by the outside on the anode layer 251, the light-emitting layer 252, and the cathode layer 253, such as air, moisture, or dust and other substances.

[0169] The light-transmitting hole 200 can be formed by first pre-designing a small hole during the process of manufacturing the driving circuit layer 26. The position of the small hole can be as far away from the TFT structures 261 as possible to avoid damaging the structure of the driving circuit layer 26. The small hole can be formed in the driving circuit layer 26 by directly using laser drilling or etching, etc.

[0170] After forming the small holes in the driving circuit layer 26, the driving circuit layer 26 is formed on the pixel layer 25. At this time, the small holes located in the driving circuit layer 26 are covered. Then, the positions of the small holes in the driving circuit layer 26 can be aligned, and the driving circuit layer 26 and the pixel layer 25 are perforated so that the driving circuit layer 26 and the pixel layer 25 are penetrated.

[0171] The encapsulation layer 24 is installed on the driving circuit layer 26 and the pixel layer 25, and holes can be drilled in the encapsulation layer 24 by aligning with the driving circuit layer 26 and the pixel layer 25. The polarization layer 23, the touch control layer 22, the cover plate layer 21, and the backplane layer 27 are continuously installed on the driving circuit layer 26 and the pixel layer 25, and holes are drilled layer by layer in the polarization layer 23, the touch control layer 22, and the backplane layer 27 to obtain the display screen 20 with the light passing hole 200.

[0172] According to some other embodiments of the present invention, at this time, the small holes located in the driving circuit layer 26 are covered by the pixel layer 25. Then, the encapsulation layer 24, the polarization layer 23, the touch control layer 22, the cover plate layer 21, and the backplane layer 27 are continuously installed. After obtaining the complete display screen 20, holes are drilled in the thickness direction of the display screen 20 by aligning with the small holes, so as to obtain the light passing hole 200 penetrating through the display screen 20. It can be understood that the layers of the display screen 20 can be installed first to obtain a complete display screen 20, and then the layers except the cover plate layer 21 are uniformly drilled. It can also be that the layers of the display screen 20 except the cover plate layer 21 are installed first, then drilled, and finally the cover plate layer 21 is installed to obtain the complete display screen 20.

[0173] According to other embodiments of the present invention, it can of course be understood that the light passing hole 200 can be formed by first pre - designing a small hole during the process of manufacturing the driving circuit layer 26. The position of the small hole can be as far away from the TFT structure 261 as possible to avoid damaging the structure of the driving circuit layer 26. Then, the pixel layer 25 is formed on the basis of the driving circuit layer 26. A hole can be drilled in the pixel layer 25 when it is aligned with the driving circuit layer 26, and then the encapsulation layer 24, the polarization layer 23, the touch layer 22, the cover plate layer 21, and the backplane layer 27 are installed. After obtaining the complete display screen 20, a hole is drilled in the thickness direction of the display screen 20 aligned with the small hole, so as to obtain the light passing hole 200 that penetrates through all layers of the display screen 20 except the cover plate layer 21. It can be understood that the layers of the display screen 20 can be installed first to obtain a complete display screen 20, and then holes are drilled uniformly in all layers except the cover plate layer 21. It can also be that the layers of the display screen 20 except the cover plate layer 21 are installed first, then holes are drilled, and finally the cover plate layer 21 is installed to obtain the complete display screen 20.

[0174] Refer to the attached Figure 5A and the attached Figure 5B As shown, a specific implementation manner of using multiple - hole - opening processing on the OLED display screen 20 to open holes throughout the OLED display screen 20 is schematically shown.

[0175] In this example, the driving circuit layer 26 and the pixel layer 25 are first obtained, and then hole - opening processing is performed on the driving circuit layer 26 and the pixel layer 25 simultaneously.

[0176] Specifically, the anode layer 251, the light - emitting layer 252, and the cathode layer 253 of the pixel layer 25 are formed on the driving circuit layer 26, and then at least part of the cathode layer 253 is removed by etching means to form an opening area in the cathode layer 253.

[0177] At least part of the pixel layer 25 is exposed through the opening area. Specifically, at least part of the pixel definition layer 256 of the pixel layer 25 is exposed through the opening area. Preferably, the projection of the opening area in the vertical direction between the pixel layer 25 and the driving circuit layer 26 is located between adjacent TFT structures 261 to minimize the impact on the circuit of the display screen 20.

[0178] After forming the opening region, continue to form the protective layer 254 over the cathode layer 253 and at least a part of the pixel definition layer 256, wherein the protective material of the protective layer 254 fills the opening region and the regions around the opening region are also filled with the protective material of the protective layer 254.

[0179] Then, at least a part of the light-transmitting hole 200 is formed in the opening region by drilling or cutting. For example, using a laser cutting process, at least a part of the pixel layer 25 and the driving circuit layer 26 are cut off along the height direction of the driving circuit layer 26 in the opening region, so that the light above the pixel layer 25 passes through the pixel layer 25 and the driving circuit layer 26 to reach below the driving circuit layer 26. The specific opening method can be by means of a mask plate with a central opening, and then the layers corresponding to the opening region are etched while other parts are covered.

[0180] In this example, at least a part of the cathode layer 253 needs to be removed before forming the protective layer 254. In some other embodiments of the present invention, at least a part of the cathode layer 253 and at least a part of the light-emitting layer 252 need to be removed before forming the protective layer 254. Specifically, dry etching can be adopted for removal. For example, the dry etching process can be completed by a plasma-enhanced chemical vapor deposition etching device or by an inductively coupled plasma etching device. The etching gas can be some oxygen-containing gases that can react with the organic matter in the light-emitting layer 252 or the cathode layer 253, such as oxygen, nitrous oxide, or carbon dioxide, etc.; alternatively, the etching gas is a combination of an oxygen-containing gas and an inert gas nitrogen.

[0181] It should be noted that the sizes of the opening region and the light-transmitting hole 200 may not be the same. When the opening region is larger than the light-transmitting hole 200 and the light-transmitting hole 200 is located within the opening region, the cathode layer 253 around the light-transmitting hole 200 can be protected by the protective layer 254 and thus not be exposed. When the sizes of the opening region and the light-transmitting hole 200 are the same or the light-transmitting hole 200 is larger than the opening region, the cathode layer 253 around the light-transmitting hole 200 will be exposed.

[0182] After forming the pixel layer 25 on the driving circuit layer 26, the light-transmitting hole 200 can penetrate through the driving circuit layer 26 and the pixel layer 25.

[0183] Further, the encapsulation layer 24, the polarization layer 23, the touch control layer 22, and the cover plate layer 21 can be installed on the pixel layer 25 and the driving circuit layer 26 in a certain order. After the encapsulation layer 24, the polarization layer 23, the touch control layer 22, and the cover plate layer 21 are respectively and fixedly installed on the pixel layer 25 and the driving circuit layer 26, then drilling or cutting is performed to make the light passing hole 200 penetrate through all the other layers of the display screen 20 except the cover plate layer 21.

[0184] When the display screen 20 includes the backplane layer 27, the backplane layer 27 is installed on the driving circuit layer 26, and the light passing hole 200 penetrates through the backplane layer 27 in the height direction of the display screen 20.

[0185] Of course, it can be understood that the encapsulation layer 24, the polarization layer 23, the touch control layer 22, and the backplane layer 27 can be perforated after being respectively and fixedly installed on the driving circuit layer 26 and the pixel layer 25. In other words, when the encapsulation layer 24 is installed on the pixel layer 25, the encapsulation layer 24 can be perforated by aligning it with the pixel layer 25. When the polarization layer 23 is installed on the encapsulation layer 24, the polarization layer 23 can be perforated. When the touch control layer 22 is installed on the polarization layer 23, the touch control layer 22 can be perforated. When the backplane layer 27 is installed on the driving circuit layer 26, the backplane layer 27 can be perforated.

[0186] The timing of opening holes in the display screen 20 except the driving circuit layer 26 and the pixel layer 25 is not limited to the above examples. For example, the encapsulation layer 24, the polarization layer 23, and the touch control layer 22 are on the same side of the pixel layer 25, and the opening hole treatment can be performed simultaneously. The backplane layer 27 is on the other side of the pixel layer 25, and the opening hole treatment can be performed separately, or can be performed together with the encapsulation layer 24, the polarization layer 23, and the touch control layer 22.

[0187] It is worth mentioning that before or after the pixel layer 25 is formed on the driving circuit layer 26, the other layers of the display screen 20 can be drilled layer by layer or cut, and then the relative positions of the layers are adjusted so that the small holes in each layer are aligned, so that they can penetrate each other.

[0188] Further, the inner diameters of the portions of the light-passing holes 200 corresponding to the respective layers of the display screen 20 may be different. For example, the inner diameter of the portion of the light-passing hole 200 corresponding to the touch control layer 22 located above may be larger than the inner diameter of the portion of the light-passing hole 200 corresponding to the backplane layer 27 located below. Each of the small holes corresponding to the respective layers of the display screen 20 may be independently fabricated, so that the inner diameters of the finally formed light-passing holes 200 corresponding to the respective layers may be different.

[0189] Further, for each layer of the display screen 20, taking the driving circuit layer 26 as an example, the small holes of the driving circuit layer 26 may be cylindrical, that is, the inner diameters of the small holes at different height positions of the driving circuit layer 26 are the same. The small holes of the driving circuit layer 26 may also be conical, that is, the inner diameters of the small holes at different height positions of the driving circuit layer 26 are different. For example, the inner diameter of the small hole gradually decreases from top to bottom.

[0190] Those skilled in the art should understand that the shape of the small holes is not limited to the above examples.

[0191] Refer to Att Figure 6A and Att Figure 6B as shown, and refer to Att Figure 5A and Att Figure 5B , another specific embodiment of the display screen 20 according to the present invention is illustrated. In this example, a protective material 2812 is provided near the position of the light-passing hole 200 of the display screen 20. Particularly near the positions of the light-passing holes 200 corresponding to the pixel layer 25 and the driving circuit layer 26. The protective material 2812 may be made of the same material as the protective layer 254 of the pixel layer 25, or may be made of a different material from the protective layer 254 of the pixel layer 25.

[0192] The protective material 2812 is located near the position of the light-passing hole 200 and can protect the internal structures of the respective exposed layers of the display screen 20. Especially for the pixel layer 25 and the driving circuit layer 26. The internal structures of the pixel layer 25 and the driving circuit layer 26 are exposed in the light-passing hole 200. When dust, moisture or air enters the light-passing hole 200, it may cause damage to the pixel layer 25 and the driving circuit layer 26. The protective material 2812 can cover the exposed portions of the pixel layer 25 and the driving circuit layer 26 at the position of the light-passing hole 200, thereby protecting the pixel layer 25 and the driving circuit layer 26 so that the pixel layer 25 and the driving circuit layer 26 can be in a relatively stable working environment.

[0193] After obtaining the display screen 20 with the light passing hole 200, the protective material 2812 can be poured into the light passing hole 200 of the display screen 20, and then the protective material 2812 is perforated to form the new light passing hole 200. The protective material 2812 can cover each layer of the display screen 20. Of course, the filling height of the protective material 2812 in the light passing hole 200 can be controlled according to user needs, so as to select the covering position of the protective material 2812. The protective material 2812 may not completely fill the light passing hole 200. For example, the position of the backplane layer 27 corresponding to the light passing hole 200 may not be protected by the protective material.

[0194] It should be noted that in this example, the cover plate layer 21 is not perforated. The cover plate layer 21 is generally made of glass and has good light transmission performance itself. Therefore, the cover plate layer 21 can be not perforated, and the cover plate layer 21 can also be located above to protect other layers of the display screen 20.

[0195] In this way, the original light passing hole 200 can be made larger in advance, and then the protective material 2812 is cut or drilled in the later stage to control the light passing hole 200 so that the light passing hole 200 reaches the expected size. It should be noted that the protective material 2812 around the light passing hole 200 can be the same as the material of the protective layer 254 or different from the material of the holding layer.

[0196] Reference appendix Figure 6B As shown, a specific manufacturing method of the display screen 20 is illustrated.

[0197] In this example, first, each layer constituting the display screen 20 is perforated, and then the protective material 2812 is filled. The protective material 2812 is a transparent material. That is to say, the corresponding position of the original light passing hole 200 of the display screen 20 is filled with the transparent material.

[0198] Specifically, the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the backplane layer 27 can be respectively perforated, and then the protective material 2812 is filled at the perforated positions.

[0199] Then, the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the backplane layer 27 are aligned and mounted together to form the display screen 20. At this time, the display screen 20 can be used as a display screen with a "hole". The corresponding transparent materials of the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the backplane layer 27 can act as the hole.

[0200] Further, the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the backplane layer 27 can be simultaneously perforated, and a part of the protective material 2812 is left around the light passing hole 200. Then, the cover layer 21 is installed to obtain the Figure 6A display screen 20 shown in the figure.

[0201] Refer to the attached Figure 7 figure, another specific embodiment of the display screen 20 according to the present invention is illustrated.

[0202] In this example, at least part of the protective material 2812 is formed around the light passing hole 200 of the display screen 20. The protective material 2812 can protect the key layers around the light passing hole 200, such as the cathode layer 253, the pixel definition layer 256, the TFT structure 261, etc.

[0203] The position of the protective material 2812 around the light passing hole 200 can be set as needed. For example, after obtaining the display screen 20 with the light passing hole 200, the diameter of the light passing hole 200 can be slightly larger than the desired design value, and then the protective material 2812 is filled into the light passing hole 200 until the entire light passing hole 200 is filled, and then the position where the light passing hole 200 is located is cut to obtain the light passing hole 200 with the expected size as needed.

[0204] In this example, the driving circuit layer 26 and the pixel layer 25 in the display screen 20 can be selectively protected separately.

[0205] Specifically, first, the driving circuit layer 26 is obtained. The driving circuit layer 26 can be obtained through steps such as film formation on a substrate, photoresist coating, exposure, development, etching, and stripping. After preparing the driving circuit layer 26, a small hole penetrating in the height direction can be prepared in the driving circuit layer 26 by etching or drilling. Preferably, the small hole is formed between adjacent TFT structures 261 of the driving circuit layer 26.

[0206] Then, the pixel layer 25 is formed on the driving circuit layer 26 , and the pinhole is filled in the process. The materials corresponding to the pinhole positions of the pixel layer 25 and the driving circuit layer 26 can be removed to obtain the light-through hole 200 .

[0207] The protective material 2812 is then filled toward the light-through holes 200 corresponding to the pixel layer 25 and the driving circuit layer 26. The protective material 2812 within the light-through hole 200 is then opened to create a hole slightly smaller than the original light-through hole 200. At this point, the portions of the pixel layer 25 and the driving circuit layer 26 exposed within the light-through hole 200 may be coated with the protective material 2812, thereby being protected by the protective material 2812.

[0208] The remaining layers of the display screen 20 are then mounted on the drive circuit layer 26 and the pixel layer 25. After mounting, each layer can be drilled or cut to allow the light-through hole 200 to pass through the display screen 20. Alternatively, after each layer is mounted, drilling or cutting can be performed aligned with the small hole to allow the light-through hole 200 to pass through each layer of the display screen 20.

[0209] Reference Attachment Figure 8 As shown in the attached Figure 2 To the attached Figure 5B , another specific embodiment of the display screen 20 according to the present invention is explained.

[0210] In this example, at least a portion of the light-through hole 200 of the display screen 20 corresponding to the pixel layer 25 is filled with a protective material 2812 .

[0211] The manufacturing method of the display screen 20 may include the following steps: sequentially forming the TFT structure 261, the anode layer 251, the light-emitting layer 252, and the cathode layer 253 on the base substrate 262; further, forming the planarization layer 255 after forming the TFT structure 261 and before forming the anode layer 251 on the base substrate 262; and removing at least a portion of the planarization layer 255 in the thickness direction using a single patterning process to form the light-through hole 200. The light-through hole 200 is formed through the drive circuit layer 26 and the planarization layer 255, and then forming the anode layer 251, the pixel definition layer 256, and the cathode layer 253 on the planarization layer 255.

[0212] By using an etching process, at least part of the light-emitting layer 252 and the cathode layer 253 corresponding to the opening region are removed in the thickness direction. Specifically, an etching process can be used to remove at least part of the pixel definition layer 256, the light-emitting layer 252, and the cathode layer 253 corresponding to the opening region, so that at least part of the planarization layer 255 is exposed.

[0213] Then, the pixel layer 25 is encapsulated with a protective material 2812, at least part of the planarization layer 255 is covered by the protective material 2812, and then a light-transmitting hole 200 is formed in the opening region by means of cutting or drilling, etc., so that the planarization layer 255 and the pixel definition layer 256 at the edge of the light-transmitting hole 200 can be covered by the protective material 2812.

[0214] In this way, the pixel layer 25 and the driving circuit layer 26 corresponding to the edge of the light-transmitting hole 200 can be selectively covered with the protective material 2812 according to requirements. The protective material 2812 can not only protect the pixel layer 25, but also control the size of the light-transmitting hole 200 by controlling the thickness of the protective material 2812 in the radial direction.

[0215] In this example, the position of the light-transmitting hole 200 can be preset, and is preferably set between adjacent TFT structures 261 or between adjacent pixels to avoid affecting the performance of the entire display screen 20 when setting the light-transmitting hole 200.

[0216] Furthermore, after the pixel layer 25 and the driving circuit layer 26 with the light-transmitting hole 200 are fabricated, the encapsulation layer 24, the polarization layer 23, the touch layer 22, and the cover plate layer 21 or the backplane layer 27 can be installed on the pixel layer 25 and the driving circuit layer 26 based on requirements. The encapsulation layer 24, the polarization layer 23, the touch layer 22, and the backplane layer 27 can be pre-made with holes, or can be opened after being installed on the pixel layer 25 and the driving circuit layer 26, or can be uniformly opened after the entire display screen 20 is installed.

[0217] It should be noted that the cover plate layer 21 is not opened. After the layers of the display screen 20 are installed together, the layers of the display screen 20 except the cover plate layer 21 can be uniformly opened from the backplane layer 27 side of the display screen 20.

[0218] Furthermore, partial apertures can be made in the cover plate layer 21. Specifically, apertures can be made in at least a part of the cover plate layer 21 in the thickness direction. For example, when making an aperture from the side of the backplane layer 27 of the display screen 20 towards the cover plate layer 21, at least a part of the cover plate layer 21 in the thickness direction can also be removed. However, when observing from the side of the cover plate layer 21 of the display screen 20 inwards, the cover plate layer 21 still completely covers the touch control layer 22. The cover plate layer 21 can still protect the other layers of the display screen 20.

[0219] Reference Figure 9 As shown, a specific implementation manner of the display screen 20 with the camera module 30 according to the present invention is schematically shown.

[0220] The camera module 30 is fixedly installed on the display screen 20, and the camera module 30 is aligned with the light passing hole 200.

[0221] Specifically, the display screen 20 has an installation channel 201, and at least a part of the camera module 30 can be accommodated in the installation channel 201. Taking the display screen 20 with the backplane layer 27 as an example for illustration. The installation channel 201 is formed in the backplane layer 27.

[0222] The installation channel 201 is located at the position of the light passing hole 200. The installation channel 201 is communicated with the light passing hole 200 and the installation channel 201 and the light passing hole 200 are located in the height direction of the display screen 20. Preferably, the inner diameter of the installation channel 201 is larger than the inner diameter of other positions of the light passing hole 200. At this time, the cross-sectional dimension of the light passing hole 200 of the display screen 20 is non-constant.

[0223] When the camera module 30 is installed on the display screen 20 and part of it is accommodated in the installation channel 201, the overall height of the camera module 30 and the display screen 20 can be reduced, which is beneficial to reducing the height dimension of the mobile terminal.

[0224] The installation channel 201 is slightly larger than the camera module 30. The part of the installation channel 201 not filled by the camera module 30 can be filled with colloid so that the camera module 30 can be more firmly fixed to the display screen 20.

[0225] For example, the side surface of the camera module 30 can be adhered to the backplane layer 27 by glue so that the camera module 30 is fixedly held in the installation channel 201. The top surface of the camera module 30 can also be fixed to a back surface of the driving circuit layer 26 by an adhesive substance such as glue, which is conducive to firmly holding the camera module 30 in the installation channel 201.

[0226] At least a part of the camera module 30 extends into the light passing hole 200 of the display screen 20. When the camera module 30 extends into the light passing hole 200, the size of the light passing hole 200 corresponding to each layer of the display screen 20 can control the depth of the camera module 30 entering the light passing hole 200.

[0227] In this example, at least a part of the camera module 30 is accommodated in the part of the light passing hole 200 corresponding to the backplane layer 27, and the parts of the light passing hole 200 corresponding to the layers above the backplane layer 27, such as the driving circuit layer 26 and the pixel layer 25, can be smaller than the part of the light passing hole 200 corresponding to the backplane layer 27. Thus, when viewed from the front side of the display screen 20, the light passing hole 200 occupies a smaller area of the display screen 20. Here, the front side of the display screen 20 refers to the side facing the user during normal use.

[0228] In some other embodiments of the present invention, the front end part of the camera module 30 can extend to the driving circuit layer 26, and even to the part of the light passing hole 200 corresponding to a part of the pixel layer 25. By controlling the size of the light passing hole 200 corresponding to each layer, the depth of the camera module 30 extending into the display screen 20 can be controlled. Thus, by designing the size of the light passing hole 200 corresponding to each layer of the display screen 20, the overall size of the camera module 30 and the display screen 20 can be controlled, especially the height dimension of the camera module 30 and the display screen 20.

[0229] Refer to the attached Figure 10 As shown, a display screen 20A with a light passing hole 200A according to a preferred embodiment of the present invention is illustrated.

[0230] In this example, the display screen 20A is implemented as an LCD display screen 20A. The display screen 20A includes: a cover layer 21A, a touch layer 22A, a polarization layer 23A, a packaging layer 24A, a pixel layer 25A, a driving circuit layer 26A, and a backplane layer 27A. Among them, the driving circuit layer 26A is formed on the bottom side of the pixel layer 25A and is electrically connected to the pixel layer 25A for driving the pixel layer 25A to work; the packaging layer 24A is formed on the top side of the pixel layer 25A for packaging the pixel layer 25A; and the pixel layer 25A includes pixels arranged in an array, and there are gaps between the pixels for light passing through the cover layer 21A, the touch layer 22A, the polarization layer 23A, and the packaging layer 24A in sequence to pass through the pixel layer 25A through the gaps.

[0231] For the LCD display screen 20A, the liquid crystal of the pixel layer 25A shows an orderly arrangement when powered on.

[0232] In particular, the display screen 20A further has the light passing hole 200A, where the light passing hole 200A passes through the touch layer 22A, the polarization layer 23A, the packaging layer 24A, the pixel layer 25A, and the driving circuit layer 26A.

[0233] The polarization layer 23A can be located on both sides of the pixel layer 25A and is implemented as a first polarizer and a second polarizer.

[0234] The pixel layer 25A includes a color filter layer 251A (CF) and liquid crystal 252A, and the liquid crystal 252A is located between the color filter layer 251A and the driving circuit layer 26A. Taking TFT-LCD as an example, the driving circuit layer 26A can include a plurality of TFT structures and the substrate, and the TFT structures are formed on the substrate through steps such as thin film, yellow light, etching, and stripping.

[0235] The light passing hole 200A is formed in each layer of the display screen 20A except the cover layer 21A, and penetrates through each layer of the display screen 20A except the cover layer 21A in the height direction of the display screen 20A.

[0236] Light from above the display screen 20A or outside the display screen 20A can pass through the light passing hole 200A to be received by the camera module 30 located below the display screen 20A or inside the display screen 20A.

[0237] A sealing material is provided around the light transmission hole 200A to prevent the liquid crystal 252A from flowing into the light transmission hole 200A, thereby avoiding any impact on the working performance of the camera module 30 or the display performance of the display screen 20A.

[0238] Further, the LCD display screen 20A includes a liquid crystal layer 28A, where the liquid crystal layer 28A includes the liquid crystal 252A, the light filtering layer 251A, and the driving circuit layer 26A.

[0239] There are mainly three methods for manufacturing the LCD display screen 20A with the light transmission hole 200A. One is to uniformly punch holes in the layers of the LCD display screen 20A after all the layers are assembled together. The second is to separately punch a hole in the liquid crystal layer 28A of the LCD display screen 20A, then install the other layers of the LCD display screen 20A on the liquid crystal layer 28A, and then uniformly punch holes in the other layers of the LCD display screen 20A. The third is to separately punch a hole in the liquid crystal layer 28A of the LCD display screen 20A, then layer by layer install the other layers of the LCD display screen 20A on the liquid crystal layer 28A, and punch holes in the layers of the LCD display screen 20A layer by layer.

[0240] Those skilled in the art should be aware that the above are only examples, and the manufacturing method of the LCD display screen 20A with the light transmission hole 200A is not limited to the above examples.

[0241] Refer to the attached Figure 11 As shown, a specific manufacturing method of the LCD display screen 20A with the light transmission hole 200A according to the present invention is illustrated.

[0242] In this example, the LCD display screen 20A with the light transmission hole 200A can be obtained through a single punching operation.

[0243] Specifically, during the manufacturing process of the liquid crystal layer 28A, a sealing area 281A is formed between the driving circuit layer 26A and the light filtering layer 251A of the liquid crystal layer 28A, where the sealing area 281A can be formed by surrounding it with a sealing material 2811A. The liquid crystal 252A of the liquid crystal layer 28A is mainly arranged outside the sealing area 281A.

[0244] Then, the layers of the LCD display screen 20A are assembled into a complete LCD display screen 20A. Based on the sealing area 281A, the LCD display screen 20A is subjected to a punching process.

[0245] The LCD display 20A has an opening area 282A, wherein the opening area 282A overlaps with the sealing area 281A and is no larger than the sealing area 281A. After the opening process is performed on the LCD display 20A, at least a portion of the sealing area 281A is removed, and the liquid crystal 252A located between the sealing areas 281A is blocked by the sealing material 2811A and cannot pass through the sealing material 2811A. As a result, the liquid crystal 252A cannot overflow into the light-through hole 200A.

[0246] In this way, the LCD display screen 20A can obtain the light-through hole 200A through a single hole-opening operation.

[0247] More specifically, the sealing material 2811A can be placed at a predetermined position on the driving circuit layer 26A of the liquid crystal layer 28A to form the sealing region 281A. The shape of the sealing region 281A can be circular, triangular, or rectangular. The liquid crystal 252A is then filled in the driving circuit layer 26A outside the sealing region 281A.

[0248] After the liquid crystal 252A is filled, the filter layer 251A can be installed on the driving circuit layer 26A. The liquid crystal 252A is located between the driving circuit layer 26A and the filter layer 251A and is confined to a fixed area.

[0249] After the opening process is performed on the liquid crystal layer 28A, the opening area 282A is smaller than the sealing area 281A, and at least a portion of the sealing material 2811A can be retained between the driving circuit layer 26A and the filter layer 251A, thereby preventing the liquid crystal 252A from overflowing from the sealing material 2811A. The liquid crystal 252A can still be confined within the original fixed area.

[0250] In this way, the opening process of the liquid crystal layer 28A can be completed while preventing the liquid crystal 252A in the liquid crystal layer 28A from overflowing.

[0251] It is worth noting that after the display screen 20A is installed, if a hole can be opened outside the display screen 20A aligned with the sealing area 281A, then the hole opening process can be performed directly, for example, when the sealing area 281A can be observed outside the display screen 20A.

[0252] If the sealing material 2811A is a light-impermeable material and the position of the sealing area 281A cannot be determined outside the display screen 20A, an identifier may be provided within the sealing area 281A so that the position of the sealing area 281A can be determined outside the display screen 20A.

[0253] It should be noted that the position of the sealing material 2811A can be set to avoid the circuit part corresponding to the driving circuit layer 26A in the height direction, so as to reduce the influence on the circuit of the driving circuit layer 26A.

[0254] Reference at Figure 12 As shown, a specific manufacturing method of the LCD display screen 20A with the light-passing hole 200A according to the present invention is illustrated.

[0255] In this example, first, an opening is made in the liquid crystal layer 28A, and then openings are made in the other layers of the display screen 20A.

[0256] Specifically, a sealing area 281A is provided in a preset area of the driving circuit layer 26A to prevent the liquid crystal 252A outside the sealing area 281A from flowing into the sealing area 281A during the subsequent filling of the liquid crystal 252A. After the sealing area 281A is provided, the driving circuit layer 26A may be subjected to an opening process along an opening area 282A. The opening area 282A is located within the sealing area 281A. Alternatively, after the filter layer 251A is installed on the driving circuit layer 26A, the driving circuit layer 26A and the filter layer 251A may be simultaneously subjected to an opening process along the opening area 282A.

[0257] According to some embodiments of the present invention, the order of opening the liquid crystal layer 28A may be to first perform an opening process on the driving circuit layer 26A and then perform an opening process on the filter layer 251A.

[0258] For example, based on the sealing area 281A, first perform an opening process on the driving circuit layer 26A within the sealing area 281A, then fill the liquid crystal 252A in the preset area of the driving circuit layer 26A, then install the filter layer 251A on the driving circuit layer 26A, and then perform an opening process on the filter layer 251A.

[0259] Further, after performing an opening process on the driving circuit layer 26A within the sealing area 281A, the area outside the sealing area 281A of the driving circuit layer 26A needs to be filled with the liquid crystal 252A so that the display screen 20A can operate normally in subsequent steps.

[0260] Furthermore, according to some other embodiments of the present invention, an opening process can be performed on an opening region 282A of the driving circuit layer 26A, and then a sealing material 2811A is disposed around the opening region 282A to form the sealing region 281A. The liquid crystal 252A is filled outside the sealing region 281A and is blocked by the sealing material 2811A and cannot flow into the sealing region 281A through the sealing material 2811A. That is to say, after the opening is made, the liquid crystal 252A cannot flow to the position of the light-transmitting hole 200A, which is beneficial to ensuring the light-gathering effect of the light-transmitting hole 200A in subsequent steps.

[0261] Then, the filter layer 251A is installed on the driving circuit layer 26A, and an opening is made by aligning with the opening region 282A of the driving circuit layer 26A. At this time, the liquid crystal 252A between the filter layer 251A and the driving circuit layer 26A is still kept outside the sealing region 281A and will not flow to the position of the light-transmitting hole 200A.

[0262] Then, the other layers of the display screen 20A, such as the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A, and the cover plate layer 21A, can be installed on the liquid crystal layer 28A in a certain order respectively. During the installation process of each functional layer, an opening process can be performed layer by layer for each layer, or after the installation of the other layers is completed, an opening process can be performed on each layer simultaneously.

[0263] Preferably, in this example, the opening process is not performed on the cover plate layer 21A of the display screen 20A. The way to obtain the display screen 20A with the light-transmitting hole 200A can be to first install the layers of the display screen 20A to obtain a complete display screen 20A, and then uniformly punch holes in the layers except the cover plate layer 21A. It can also be to first install the layers of the display screen 20A except the cover plate layer 21A, then punch holes, and finally install the cover plate layer 21A to obtain the complete display screen 20A.

[0264] It should be noted that the opening process can also be performed on the cover plate layer 21A of the display screen 20A, and then the cover plate layer 21A is filled with a transparent material to prevent contaminants such as dust or moisture from entering the other layers of the display screen 20A through the part of the light-transmitting hole 200A corresponding to the outermost cover plate layer 21A.

[0265] It should be noted that, before all layers are installed and waiting for unified hole opening, or before hole opening is performed layer by layer for each layer, the opening area 282A can be positioned in various ways to facilitate subsequent accurate hole opening. For example, the opening area 282A can be positioned by mechanical recognition, and then based on this data, hole opening is performed on other layers at the same position.

[0266] It should be noted that the sealing material 2811A for separating the light transmission hole 200A and the liquid crystal 252A can be disposed on the driving circuit layer 26A, or can be disposed on the light filtering layer 251A, or can be respectively disposed on the driving circuit layer 26A and the light filtering layer 251A.

[0267] According to some other embodiments of the present invention, for example, the sealing material 2811A is disposed on the light filtering layer 251A. After the liquid crystal 252A is filled in the driving circuit layer 26A, the light filtering layer 251A provided with the sealing material 2811A is covered on the driving circuit layer 26A, and the liquid crystal 252A is separated by the sealing material 2811A inside and outside the sealing area 281A. The sealing material 2811A disposed on the light filtering layer 251A is in close contact with the driving circuit layer 26A, and the liquid crystal 252A outside the sealing area 281A cannot cross the sealing material 2811A to enter the sealing area 281A. Then, hole opening is performed on the driving circuit layer 26A and the light filtering layer 251A inside the sealing area 281A to obtain the light transmission hole 200A penetrating through the driving circuit layer 26A and the light filtering layer 251A.

[0268] According to some other embodiments of the present invention, the order of hole opening in the liquid crystal layer 28A can be to first perform hole opening on the light filtering layer 251A, and then perform hole opening on the driving circuit layer 26A.

[0269] For example, hole opening can be first performed on an opening area 282A of the light filtering layer 251A, and then a sealing material 2811A is disposed around the opening area 282A to form the sealing area 281A. The liquid crystal 252A is filled outside the sealing area 281A and cannot flow into the sealing area 281A through the sealing material 2811A due to the obstruction of the sealing material 2811A. That is to say, after hole opening, the liquid crystal 252A cannot flow to the position of the light transmission hole 200A, which is beneficial to ensuring the lighting effect of the light transmission hole 200A in subsequent steps.

[0270] After the filter layer 251A is perforated, the filter layer 251A is mounted on the driving circuit layer 26A, and the sealing material 2811A disposed on the filter layer 251A closely adheres to the driving circuit layer 26A, and the sealing material 2811A forms the sealing region 281A.

[0271] Then, the driving circuit layer 26A is perforated with respect to the perforated region 282A of the filter layer 251A. After the driving circuit layer 26A is perforated, the liquid crystal 252A located in the sealing region 281A can flow to the outside.

[0272] Further, after mounting other layers of the display screen 20A, such as the encapsulation layer 24A, the polarization layer 23A, the touch control layer 22A, and the backplane layer 27A, the entire display screen 20A can be perforated so that the light transmission hole 200A of the filter layer 251A penetrates through other layers of the entire display screen 20A except the cover plate layer 21A.

[0273] It is also possible to perforate the layers that have been aligned and mounted during the process of mounting other layers of the display screen 20A. For example, after mounting the polarization layer 23A and the touch control layer 22A, the polarization layer 23A and the touch control layer 22A are perforated so that the light transmission hole 200A of the filter layer 251A penetrates through other layers of the entire display screen 20A except the cover plate layer 21A. Then, the cover plate layer 21A is mounted to obtain the complete display screen 20A.

[0274] According to other embodiments of the present invention, the order of perforating the liquid crystal layer 28A can be to perforate the filter layer 251A and the driving circuit layer 26A simultaneously.

[0275] For example, the sealing material 281A is disposed between the filter layer 251A and the driving circuit layer 26A. The sealing material 281A can be disposed on the filter layer 25IA or the driving circuit layer 26A or both the filter layer 251A and the driving circuit layer 26A.

[0276] The perforated region 282A is formed within the sealing region 281A. When the liquid crystal layer 28A is perforated, at least part of the sealing material 281A remains between the filter layer 251A and the driving circuit layer 26A to prevent the liquid crystal 252A between the filter layer 251A and the driving circuit layer 26A from flowing out.

[0277] The process of opening holes in the liquid crystal layer 28A can be as follows: First, the sealing material 2811A is disposed on the driving circuit layer 26A, and then the liquid crystal 252A material is filled in the driving circuit layer 26A. The liquid crystal 252A material is located outside the sealing region 281A formed by the sealing material 2811A.

[0278] It can be understood that the sealing material 2811A can be transparent or have a high light transmittance, which is beneficial to the propagation of light at the position of the light transmission hole 200A corresponding to the liquid crystal layer 28A. The sealing material 2811A can also be a light-shielding material to reduce the influence of stray light near the position of the light transmission hole 200A corresponding to the liquid crystal layer 28A on the light transmission effect of the light transmission hole 200A. That is to say, the type of the sealing material 2811A can be selectively set according to requirements.

[0279] Then, the filter layer 251A is installed on the driving circuit layer 26A. A sealing region 281A is formed between the sealing material 2811A, the driving circuit layer 26A, and the filter layer 251A. For the sealing region 281A, the liquid crystal 252A outside the sealing region 281A cannot flow into the sealing region 281A.

[0280] After the filter layer 251A and the driving circuit layer 26A are installed together to form the liquid crystal layer 28A, the liquid crystal layer 28A can be subjected to hole-opening treatment, or after the entire display screen 20A is installed, the entire display screen 20A can be subjected to hole-opening treatment by aligning with the sealing region 281A.

[0281] Furthermore, it can be understood that after the hole-opening treatment of the liquid crystal layer 28A, the hole-opening sequence of the other layers of the display screen 20A can be selected according to requirements. It can be to install the encapsulation layer 24A on the liquid crystal layer 28A, and then perform hole-opening treatment on the encapsulation layer 24A by aligning with the liquid crystal layer 28A. Subsequently, install the touch layer 22A on the encapsulation layer 24A, and then perform hole-opening treatment on the touch layer 22A by aligning with the liquid crystal layer 28A and the encapsulation layer 24A.

[0282] It can also be that after the layers above the liquid crystal layer 28A are installed, the layers above the liquid crystal layer 28A are uniformly subjected to hole-opening treatment. Then, after the layers below the liquid crystal layer 28A are installed, the layers below the liquid crystal layer 28A are uniformly subjected to hole-opening treatment.

[0283] The layers of the display screen 20A can also be pre-drilled and then installed by aligning with the liquid crystal layer 28A.

[0284] Furthermore, if the entire LCD display screen 20A needs to be perforated, that is, when the cover layer 21A is also perforated, when the entire LCD display screen 20A is perforated, the polarization layer 23A is made of a light-impermeable material, and the cover layer 21A and the touch layer 22A can be made of a light-transmissive material. The light-impermeable material blocks the sealing area 281A of the liquid crystal layer 28A from being observed from the outside of the display screen 20A, which is not conducive to perforating the sealing area 281A. Therefore, the polarization layer 23A can be perforated, and then the cover layer 21A can be perforated, so that the cover layer 21A can be perforated based on the light-passing hole 200A portion of the polarization layer 23A when perforating, so that the light-passing hole 200A portions of each layer can be aligned with each other.

[0285] Refer to the attached Figure 13 As shown, a specific implementation manner of the LCD display screen 20A of the present invention is schematically shown. In the above embodiment, the inner diameter sizes of the light-passing hole 200A portions corresponding to each layer of the LCD display screen 20A are the same.

[0286] In this embodiment, the inner diameter sizes of the light-passing hole 200A portions corresponding to each layer of the LCD display screen 20A are different.

[0287] After forming the liquid crystal layer 28A, the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A, and the cover layer 21A can be installed above the liquid crystal layer 28A, and another polarization layer 23A and the backplane layer 27A can be installed below the liquid crystal layer 28A. The backplane layer 27A of the LCD display screen 20A is indispensable, and the backplane layer 27A can emit light when powered on.

[0288] The liquid crystal layer 28A can be perforated in advance, and then the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A, and the cover layer 21A are installed. Among them, the encapsulation layer 24A, the polarization layer 23A, and the touch layer 22A can be perforated in advance or can be perforated uniformly after being installed together. Another polarization layer 23A installed below the liquid crystal layer 28A can also be perforated in advance or can be perforated after being installed on the liquid crystal layer 28A. The cover layer 21A can be installed on the touch layer 22A after the other layers of the display screen 20A are perforated, or after the layers including the cover layer 21A are installed together, the other layers of the display screen 20A except the cover layer 21A are perforated.

[0289] The inner diameter of the portion of the liquid crystal layer 28A corresponding to the light transmission hole 200A may be different from the inner diameters of the other layers of the display screen 20A. For example, in this example, the inner diameter of the portion of the liquid crystal layer 28A corresponding to the light transmission hole 200A is slightly smaller than that of the encapsulation layer 24A, the polarization layer 23A, and the touch layer 22A.

[0290] In some other embodiments of the present invention, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, and the liquid crystal layer 28A of the LCD display screen 20A from top to bottom can obtain the light transmission hole 200A with a consistent inner diameter through processes such as laser cutting and drilling.

[0291] Regarding the backplane layer 27A located below the liquid crystal layer 28A, the backplane layer 27A can be separately perforated, and the inner diameter of the portion of the backplane layer 27A corresponding to the light transmission hole 200A can be different from the inner diameters of the portions of the light transmission hole 200A corresponding to the liquid crystal layer 28A, the touch layer 22A, and the polarization layer 23A.

[0292] In this example, the inner diameter of the portion of the backplane layer 27A corresponding to the light transmission hole 200A is larger than the inner diameter of the portion of the light transmission hole 200A corresponding to the liquid crystal layer 28A. The portion of the light transmission hole 200A corresponding to the backplane layer 27A penetrates through the portion of the light transmission hole 200A corresponding to the liquid crystal layer 28A.

[0293] The display screen 20A has a mounting channel 201A, wherein the mounting channel 201A is formed in the backplane layer 27A and is communicated with the light transmission hole 200A.

[0294] Optionally, the portion of the light transmission hole 200A corresponding to the backplane layer 27A is larger than the sealing area 281A. At least part of the camera module 30 can be accommodated in the backplane layer 27A, which is beneficial to reducing the height dimension of the camera module 30 and the display screen 20A.

[0295] Further, reference can be made to the attached Figure 9, one mounting end of the camera module 30 includes part of the lens and the lens barrel. The light passing hole 200A of the backplane layer 27A can be designed to be large enough to accommodate the lens and the lens barrel part. For the liquid crystal layer 28A and the layers above the liquid crystal layer 28A corresponding to the light passing hole 200A part, the aperture size of the light passing hole 200A only needs to meet the light incident requirement of the camera module 30. In other words, when the camera module 30 extends into the LCD display screen 20A so that the camera module 30 is installed in the LCD display screen 20A, thereby reducing the installation height of the camera module 30 and the LCD display screen 20A, the light passing hole 200A located above can still be designed to be small enough so that the light passing hole 200A is not easily observed outside the display screen 20A. At the same time, the light passing hole 200A can provide sufficient installation space for the camera module 30.

[0296] It can be understood that the camera module 30 can not only be accommodated in the light passing hole 200A part corresponding to the backplane layer 27A, but the camera module 30 can also extend deeper into the LCD display screen 20A. For example, the camera module 30 can also be accommodated in the light passing hole 200A part corresponding to the driving circuit layer 26A.

[0297] Reference attached Figure 14A As shown, a specific implementation manner of the LCD display screen 20A of the present invention is schematically shown.

[0298] In this embodiment, the cover layer 21A of the display screen 20A is not perforated. The touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the backplane layer 27 are respectively perforated, and then the protective material 2812 is filled at the perforated positions.

[0299] The light incident quality of the camera module 30 is affected by the light passing hole 200A. Specifically, the materials of each layer of the LCD display screen 20A around the light passing hole 200A will reflect and refract the light entering the light passing hole 200A, so that the light entering the camera module 30 is affected by the materials around the light passing hole 200A.

[0300] Based on the differences in the materials of each layer and the different positions of the light passing hole 200A, it is difficult to make the materials around each light passing hole 200A reach the same level on the production line. That is to say, it is difficult to keep the light incident quality of the light passing hole 200A consistent, and debugging processing needs to be carried out in the later stage.

[0301] In this example, after obtaining the LCD display screen 20A with the light transmission hole 200A, a certain amount of protective material 2812A can be poured into the light transmission hole 200A. The protective material 2812A can protect the layers around the light transmission hole 200A. For example, for the driving circuit layer 26A, to reduce the corrosion that water and oxygen may cause to the driving circuit layer 26A.

[0302] After the protective material 2812A is filled in the light transmission hole 200A, at least part of the protective material 2812A can be removed by drilling or laser cutting, so that at least part of the positions around the light transmission hole 200A are filled with the protective material 2812A.

[0303] The protective material 2812A can be a light-transmitting material, and light can pass through the protective material 2812A. The protective material 2812A can be an opaque material, and stray light from around the light transmission hole 200A cannot be received by the imaging module 30 through the protective material 2812A. The material of the protective material 2812A can be selected based on requirements to control the light incident quality of the light transmission hole 200A by controlling the protective material 2812A in the light transmission hole 200A.

[0304] It is worth mentioning that when there are certain deviations in the light transmission hole 200A parts corresponding to each layer due to processing technology or installation technology, certain compensation can be made through the protective material 2812A.

[0305] Attached Figure 14B is another embodiment of the LCD display screen 20A of the present invention. Different from the display screen 20A shown in Attached Figure 14A in this embodiment, the layers of the display screen 20A are separately opened with holes and then filled with the protective material 2812A.

[0306] Specifically, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the backplane layer 27A can be respectively subjected to hole-opening treatment, and then the protective material 2812A is filled in the hole-opening positions.

[0307] Then, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the backplane layer 27A are aligned and mounted together to form the display screen 20A. At this time, the display screen 20A can be used as a display screen with a "hole". The corresponding transparent materials of the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the backplane layer 27A can play the role of the hole.

[0308] Further, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the backplane layer 27A can be simultaneously perforated, and a part of the protective material 2812A is left around the light-transmitting hole 200A. Then, the cover layer 21A is installed to obtain the display screen 20A.

[0309] Refer to the attached Figure 15 and the attached Figure 16 As shown, a specific embodiment of the LCD display screen 20A of the present invention is schematically shown.

[0310] The part of the light-transmitting hole 200A corresponding to the liquid crystal layer 28A, the part of the light-transmitting hole 200A corresponding to the polarization layer 23A, and the part of the light-transmitting hole 200A corresponding to the cover layer 21A are not aligned, which may be caused by various factors, such as factors related to the control of the opening position accuracy during the opening process, or factors related to the alignment accuracy during the installation process, or factors such as deviations generated during the fixing in the installation process.

[0311] The protective material 2812A is poured into the light-transmitting hole 200A, and the light-transmitting hole 200A is filled with the protective material 2812A. Then, at least part of the protective material 2812A is removed according to a certain opening area 282A to re-form the light-transmitting hole 200A. At this time, the inner diameter of the light-transmitting hole 200A can be kept consistent.

[0312] Of course, it can be understood that in this example, the entire LCD display screen 20A is re-processed for the light-transmitting hole 200A after installation. In some other embodiments of the present invention, the light-transmitting hole 200A can be adjusted after some functional layers of the LCD display screen 20A are mounted together.

[0313] For example, when the liquid crystal layer 28A, the polarization layer 23A, and the touch layer 22A are assembled together, but there are certain deviations in each part of the light passing hole 200A corresponding to the liquid crystal layer 28A, the polarization layer 23A, and the touch layer 22A, the light protection material 2812A can be filled in the part of the light passing hole 200A corresponding to the liquid crystal layer 28A, the polarization layer 23A, and the touch layer 22A, and then the light passing hole 200A is formed secondarily. Then, another polarization layer 23A and the backlight plate are installed on the liquid crystal layer 28A.

[0314] The light protection material 2812A may not cover the part of the light passing hole 200A corresponding to the polarization layer 23A and the backplane layer 27A, and reference can be made to the attached Figure 15 as shown.

[0315] In this way, the light protection material 2812A can be selectively covered on each layer of the LCD display screen 20A.

[0316] Reference can be made to the attached Figure 17 as shown, which schematically shows a specific implementation manner of the LCD display screen 20A of the present invention.

[0317] The LCD display screen 20A has a light passing hole 200A, and a light guide assembly 50A is disposed in the light passing hole 200A. The light guide assembly 50A has a light guide channel 500A, and light can pass through the LCD display screen 20A along the light guide channel 500A.

[0318] Specifically, the LCD display screen 20A includes a cover plate layer 21A, a touch layer 22A, a polarization layer 23A, a packaging layer 24A, a pixel layer 25A, a driving circuit layer 26A, and a backplane layer 27A, wherein the polarization layer 23A is respectively located on opposite sides of the pixel layer 25A.

[0319] The cover plate layer 21A is located at the top of the LCD display screen 20A. The touch layer 22A can transmit signals when touched. The packaging layer 24A is used for packaging. The pixel layer 25A includes a color filter layer 251A (CF) and liquid crystal 252A. The liquid crystal 252A is located between the color filter layer 251A and the driving circuit layer 26A. The driving circuit layer 26A includes a plurality of TFT structures and the substrate. The TFT structures are formed on the substrate through steps such as thin film, yellow light, etching, and stripping. The backplane layer 27A is used to emit light.

[0320] The LCD display screen 20A further includes a liquid crystal layer 28A, where the liquid crystal layer 28A includes the pixel layer 25A and the driving circuit layer 26A. The liquid crystal 252A is located between the light filtering layer 251A and the driving circuit layer 26A.

[0321] The light passing hole 200A passes through each layer of the LCD display screen 20A, and the light guiding component 50A is accommodated in the light passing hole 200A.

[0322] The light passing hole 200A can be formed by opening holes in each layer of the LCD display screen 20A, or by opening a hole in the liquid crystal layer 28A of the LCD display screen 20A, and then performing a sealing process on the liquid crystal layer 28A to prevent the liquid crystal 252A in the liquid crystal layer 28A from leaking to the outside, and then opening holes in the other layers of the LCD display screen 20A.

[0323] For the former method, specifically, the liquid crystal layer 28A is pre-treated during the manufacturing process to form a sealing area 281A, where the liquid crystal 252A is not filled in the sealing area 281A, and the liquid crystal 252A is located outside the sealing area 281A. For example, a sealing material 2811A can be set between the light filtering layer 251A and the driving circuit layer 26A to form the sealing area 281A.

[0324] For the latter method, specifically, the liquid crystal layer 28A is pre-treated during the manufacturing process to form a sealing area 281A, where the liquid crystal 252A is not filled in the sealing area 281A, and the liquid crystal 252A is located outside the sealing area 281A. For example, a sealing material 2811A can be set between the light filtering layer 251A and the driving circuit layer 26A to form the sealing area 281A.

[0325] Then, based on the sealing area 281A, a hole is opened in the liquid crystal layer 28A. Then, the other layers of the LCD display screen 20A are aligned with the liquid crystal layer 28A to open holes.

[0326] In this example, the inner diameter of the light passing hole 200A can be set slightly larger to accommodate the light guiding component 50A. It should be noted that when there are slight deviations in the parts of the light passing holes 200A corresponding to each layer of the LCD display screen 20A, the light guiding component 50A can, to a certain extent, compensate for the deviations between the layers caused during the installation of the LCD display screen 20A.

[0327] Specifically, when there are slight deviations in the portions of the light-transmitting holes 200A corresponding to the respective layers of the LCD display screen 20A, at least part of the light entering the light-transmitting holes 200A will be lost when propagating within the light-transmitting holes 200A. When the light guide assembly 50A is disposed in the light-transmitting holes 200A, most of the light can directly propagate along the light guide channels 500A of the light guide assembly 50A, thereby reducing the loss of light within the LCD display screen 20A due to the installation deviations between the layers.

[0328] The light guiding performance of the light guide assembly 50A can be set based on requirements. When a high requirement for the light guiding efficiency of the light guide assembly 50A exists, the light guide assembly 50A can be made of a transparent material. When it is necessary to reduce the influence of external stray light on the light within the light guide channels 500A, the outer wall of the light guide assembly 50A can be coated with a light-shielding material.

[0329] Reference is made to Figure 18A and Figure 18B As shown, an embodiment of the terminal device 1 based on the present invention is illustrated.

[0330] The terminal device 1 includes a terminal device main body 10, a display screen 20, and a camera module 30. The display screen 20 and the camera module 30 are respectively disposed on the terminal device main body 10. The display screen 20 is used for displaying images, and the camera module 30 is held below the display screen 20 to facilitate the design of the display screen 20 as a full-screen display.

[0331] The terminal device 1 further includes a housing 40 and has a light guide channel 500. The display screen 20 is mounted on the housing 40. The housing 40 is located around the display screen 20, serving as a support for the display screen 20 on the one hand and a protection for the display screen 20 on the other hand.

[0332] The light guide channel 500 is formed between the display screen 20 and the housing 40. The light guide channel 500 conducts the outside and the camera module 30, enabling the light from the outside to be conducted to the camera module 30 through the light guide channel 500.

[0333] In this way, the camera module 30 can be disposed below the display screen 20 without occupying the display area of the display screen 20, so that the display screen 20 can achieve the effect of a full-screen display.

[0334] Specifically, the terminal device 1 has at least one of the light guide channels 500, wherein at least a part of the light guide channel 500 is formed between the display screen 20 and the housing 40, and at least a part of the light guide channel 500 is formed within the display screen 20 to transmit light to the camera module 30 located below the display screen 20. Some light guide elements may be provided in the light guide channel 500 to change the propagation direction of the light propagating in a straight line, and the light is conducted from the outside of the display screen 20 through the light guide channel 500 to the camera module 30 located inside the display screen 20. The light guide element may be a reflective film or a mirror.

[0335] In some other embodiments of the present invention, at least a part of the light guide channel 500 is located between the display screen 20 and the housing 40, and the remaining at least a part may be located below the display screen 20. That is to say, the light guide channel 500 bypasses from the side of the display screen 20 to the lower part of the display screen 20, and then guides the light to the camera module 30.

[0336] In this example, taking the OLED display screen 20 as an example, the light guide channel 500 can be selectively formed in each layer of the OLED display screen 20, such as the pixel layer 25, the driving circuit layer 26 or the backplane layer 27. Preferably, when the light guide channel 500 passes through the pixel layer 25, the light guide channel 500 is arranged between adjacent pixels to reduce the influence on the imaging effect. Preferably, when the light guide channel 500 passes through the driving circuit layer 26, the light guide channel 500 is arranged in the non-circuit part of the driving circuit layer 26 to reduce the influence on the working performance of the driving circuit layer 26.

[0337] In this example, the light guide channel 500 passes through the backplane layer 27, and then transmits the light to the camera module 30 located below the display screen 20 through the light guide channel 500.

[0338] The light guide channel 500 includes a first partial light guide channel 501, a second partial light guide channel 502 and a third partial light guide channel 503, wherein the first partial light guide channel 501 is located between the display screen 20 and the housing 40. It should be noted that when the display screen 20 is installed on the housing 40, there is a natural gap between the display screen 20 and the housing 40, and the desired first partial light guide channel 501 can be obtained through the design of the edge of the display screen 20 or the edge of the housing 40.

[0339] The second part of the light guide channel 502 is located within the display screen 20, and the third part of the light guide channel 503 is located within the display screen 20. The second part of the light guide channel 502 is used to transmit the light from the outside passing through the first part of the light guide channel 501 into the display screen 20. The third part of the light guide channel 503 is used to transmit the light within the display screen 20 outward to the camera module 30.

[0340] The second part of the light guide channel 502 can conduct light along the length and width directions of the display screen 20, and the third part of the light guide channel 503 can conduct light along the height direction of the display screen 20.

[0341] Further, the first part of the light guide channel 501 of the light guide channel 500 can play a role in converging light, so that more light can enter the second part of the light guide channel 502 after passing through the first part of the light guide channel 501. The second part of the light guide channel 502 can play a role in transmitting light.

[0342] In this example, the camera module 30 is installed on the display screen 20 and is located below the display screen 20. The camera module 30 forms an image based on the light of the light guide channel 500. The third part of the light guide channel 503 can be set to be able to diffuse the light so that the diffused light matches the light receiving area of the camera module 30.

[0343] A micro convex lens can be provided in the first part of the light guide channel 501 to converge the light. At least one reflector or other modulation device can be provided in the second part of the light guide channel 502 to transmit the light along the second part of the light guide channel 502 to the third part of the light guide channel 503. A micro concave lens can be provided in the third part of the light guide channel 503 to diffuse the light.

[0344] Further, the camera module 30 includes an optical unit 31A and a photosensitive unit 32A, wherein the optical unit 31A collects light, and the photosensitive unit 32A receives the light collected by the optical unit 31A and converts the optical signal into an electrical signal based on photoelectric conversion for subsequent imaging. The optical unit 31A can include a converging member 311A, a modulating member 312A, and a diffusing member 313A. The converging member 311A can converge the light, the modulating member 312A can modulate the light, such as filtering, dispersion, collimation, etc., and the diffusing member 313A can diffuse the light.

[0345] The optical unit 31A can be disposed in the light guide channel 500, such as the first partial light guide channel 501, the second partial light guide channel 502, and the third partial light guide channel 503. The photosensitive unit 32A is directly disposed on the display screen 20 and is located below the display screen 20. After the optical unit 31A collects light, the photosensitive unit 32A converts the optical signal into an electrical signal.

[0346] Specifically, the converging member 311A can be disposed in the first partial light guide channel 501 to converge the light entering the light guide channel 500 from the outside, so that the inner diameter of the second partial light guide channel 502 can be designed to be smaller while transmitting more light. The modulating member 312A can be disposed in the second light guide channel 500. The diffusing member 313A can be disposed in the third partial light guide channel 503 to diffuse the light to a photosensitive area corresponding to the photosensitive unit 32A of the camera module 30.

[0347] In this way, the partial size of the light guide channel 500 in the display screen 20 can be set to be smaller to reduce the influence of the light guide channel 500 on the imaging of the display screen 20. The fabrication and formation of the light guide channel 500 in the display screen 20 can refer to the foregoing.

[0348] The optical unit 31A can include, but is not limited to, optical components such as concave lenses and convex lenses.

[0349] Further, in some other embodiments of the present invention, the concave lens located in the third partial light guide channel 503 can be disposed on the display screen 20. For example, taking the encapsulation layer 24 as an example, the diffusing member 313A is disposed in the encapsulation layer 24. The light from the outside is diffused after passing through the diffusing member 313A of the encapsulation layer 24, and then is transmitted to the photosensitive unit 32A of the camera module 30 through the third partial light guide channel 503, and thus is converted into an electrical signal.

[0350] The diffusing member 313A can be integrally formed with the encapsulation layer 24, and the encapsulation layer 24 generally uses a glass material. According to some embodiments of the present invention, the diffusing member 313A can be integrally formed in a recessed manner on the top surface of the encapsulation layer 24.

[0351] Refer to the appendix Figure 19 as shown, and at the same time refer to the appendix Figure 18A , another specific embodiment of the terminal device 1 according to the present invention is illustrated.

[0352] In this example, the terminal device 1 includes a terminal device main body 10, a display screen 20, and a camera module 30. The display screen 20 and the camera module 30 are respectively arranged on the terminal device main body 10. The display screen 20 is used for displaying images, and the camera module 30 is held below the display screen 20 to facilitate the design of the display screen 20 as a full-screen display.

[0353] The terminal device 1 further includes a housing 40 and has a light guide channel 500. The display screen 20 is installed on the housing 40. The housing 40 is located around the display screen 20, which plays a supporting role for the display screen 20 on the one hand and a protective role for the display screen 20 on the other hand.

[0354] At least a part of the light guide channel 500 is located between the display screen 20 and the housing 40 and extends to the display screen 20. Light from the outside reaches the display screen 20 after passing through the gap between the display screen 20 and the housing 40, and then is received by the camera module 30 located below the display screen 20.

[0355] The terminal device 1 further includes an optical unit 31A, and the optical unit 31A is arranged in the light guide channel 500. The optical unit 31A can converge, diffuse, or collimate light, etc.

[0356] The camera module 30 includes an optical mechanism 31A' and a photosensitive unit 32A. The optical mechanism 31A' is held on the light sensing path of the photosensitive unit 32A. The photosensitive unit 32A can convert an optical signal into an electrical signal based on photoelectric conversion. The optical mechanism 31A' can include elements such as an optical lens.

[0357] In this example, the camera module 30 is a separate and complete camera module 30. On the premise that the optical unit 31A is not arranged in the light guide channel 500, the camera module 30 can still image based on the light passing through the light guide channel 500.

[0358] Some light guiding elements can be arranged in the light guide channel 500 to change the propagation direction of the linearly propagating light, and the light is conducted from the outside of the display screen 20 through the light guide channel 500 to the camera module 30 located inside the display screen 20. The light guiding elements can be a reflective film or a reflector.

[0359] The light guide channel 500 may include a first partial light guide channel 501, a second partial light guide channel 502, and a third partial light guide channel 503. The first partial light guide channel 501 is located between the housing 40 and the display screen 20. The second partial light guide channel 502 guides the light of the first partial light guide channel 501 into the display screen 20. The third partial light guide channel 503 guides the light of the second partial light guide channel 502 out of the display screen 20 to be received by the camera module 30.

[0360] The optical unit 31A may be disposed in the first partial light guide channel 501, the second partial light guide channel 502, and the third partial light guide channel 503.

[0361] It can be understood that the type and installation position of the optical unit 31A can be selected according to requirements, so that when the light passes through the light guide channel 500 of the light guide assembly 50, it can be adjusted by the optical unit 31A to meet the light input requirements of the camera module 30.

[0362] Refer to the appendix Figure 20 as shown, and at the same time refer to the appendix Figure 18A , another preferred embodiment of the terminal device 1 according to the present invention is illustrated.

[0363] In this example, the terminal device 1 includes a terminal device main body 10, a display screen 20, a camera module 30, a housing 40, and a light guide assembly 50. The display screen 20 is installed on the terminal device main body 10. The display screen 20 and the terminal device main body 10 are installed in the housing 40. The camera module 30 is installed on the display screen 20 and is held below the display screen 20. The light guide assembly 50 is used to conduct the light from the outside to the camera module 30 below the display screen 20.

[0364] Specifically, the terminal device 1 has a light guide channel 500, and at least part of the light guide channel 500 is formed in the light guide assembly 50.

[0365] At least part of the light guide channel 500 is located between the display screen 20 and the housing 40 and extends to the display screen 20. The light from the outside reaches the display screen 20 after passing through the gap between the display screen 20 and the housing 40, and then is received by the camera module 30 located below the display screen 20.

[0366] The light guide assembly 50 includes a light guide pipe, where the light guide pipe has a certain shape and size. The light guide pipe can extend from outside the display screen 20 between the display screen 20 and the housing 40 towards the display screen 20.

[0367] The entire light guide pipe can be light-transmissive or light-opaque. The light guide pipe can be made of a light-transmissive material, and then in order to prevent stray light around the light guide pipe from entering the light guide channel 500, the light guide pipe can be coated with a light-shielding material to reduce the influence of surrounding stray light.

[0368] Preferably, when the light guide assembly 50 needs to pass through the pixel layer 25, the light guide assembly 50 is arranged between two adjacent pixels of the pixel layer 25.

[0369] For the same display screen 20, the number of the light guide assemblies 50 can be multiple, the corresponding light guide channels 500 can be multiple, and at least part of the multiple light guide channels 500 overlap each other.

[0370] The light guide assembly 50 can conduct to multiple positions inside and outside the display screen 20, such as in front of the display screen 20, on the left side of the display screen 20, or on the right side of the display screen 20, etc. The light guide channel 500 of the light guide assembly 50 can conduct the light passing through the gap between the display screen 20 and the housing 40 to the camera module 30.

[0371] When the number of the light guide channels 500 is multiple, the light incident amount of the camera module 30 can be increased.

[0372] Refer to the attached Figure 21 shown, and at the same time refer to the attached Figure 18A , another embodiment of the terminal device 1 according to the present invention is illustrated.

[0373] The terminal device 1 includes a terminal device main body 10, a display screen 20, a camera module 30, a housing 40, and a light guide assembly 50, where the display screen 20 is installed on the terminal device main body 10, the display screen 20 and the terminal device main body 10 are installed in the housing 40, the camera module 30 is installed on the display screen 20 and is held below the display screen 20. The light guide assembly 50 is used to conduct the light from the outside to the camera module 30 below the display screen 20.

[0374] The terminal device 1 has at least one light guide channel 500 and a light passing hole 200. The light passing hole 200 penetrates the display screen 20 of the terminal device 1 from top to bottom. The light guide channel 500 is formed in the light guide assembly 50. The light guide channel 500 extends downward from the gap between the display screen 20 and the housing 40 of the terminal device 1 to the display screen 20.

[0375] Both the light guide channel 500 and the light passing hole 200 can be used to conduct light. The light passing hole 200 penetrates the display screen 20, and the camera module 30 aligned with the light passing hole 200 of the display screen 20 can receive light from the outside of the display screen 20 through the light passing hole 200. The camera module 30 aligned with the light guide channel 500 can receive light from the outside of the display screen 20 through the light guide channel 500.

[0376] It should be noted that the light guide channel 500 and the light passing hole 200 can be independent of each other, and the light guide channel 500 and the light passing hole 200 can be respectively aligned with different camera modules 30. In other words, multiple camera modules 30 can be installed on the display screen 20 and located below the display screen 20.

[0377] In this example, at least part of the light guide channel 500 and the light passing hole 200 overlap each other, so that the light received by the light guide channel 500 and the light passing hole 200 can enter the same camera module 30 and be received by the same photosensitive unit 32A to form an image.

[0378] Specifically, at least part of the light guide channel 500 is located between the display screen 20 and the housing 40, and at least part of the light guide channel 500 is located within the display screen 20.

[0379] The light guide channel 500 may include a first partial light guide channel 501, a second partial light guide channel 502, and a third partial light guide channel 503. The first partial light guide channel 501 is located between the display screen 20 and the housing 40, and the second partial light guide channel 502 and the third partial light guide channel 503 are respectively located within the display screen 20.

[0380] The light guide channel 500 is communicated with the light passing hole 200, and the third partial light guide channel 503 and the light passing hole 200 overlap.

[0381] The first part of the light guide channel 501 is located on one side of the display screen 20, the second part of the light guide channel 502 extends inwards from the side surface of the display screen 20, and the third part of the light guide channel 503 extends from the inside of the display screen 20 towards the back side of the display screen 20.

[0382] The terminal device 1 further includes an optical unit 31A, and the optical unit 31A is disposed in the light guide channel 500. The optical unit 31A may include a converging member 311A, a modulating member 312A, and a diffusing member 313A. The converging member 311A may be disposed in the first part of the light guide channel 501 for converging light from the outside. The modulating member 312A may be disposed in the second part of the light guide channel 502 for modulating the light from the first part of the light guide channel 501. The diffusing member 313A may be disposed in the third part of the light guide channel 503 for diffusing the light and then transmitting it to the camera module 30.

[0383] It should be noted that since the paths of the light rays entering the camera module 30 through the light guide channel 500 and the light passing hole 200 are different, there is an optical path difference for the light rays of different paths when reaching the camera module 30. At the same time, the light beams reaching a photosensitive chip of the camera module 30 have different phases, and different images may be finally presented. To avoid this problem, the optical path formed by the optical unit 31A in the display screen 20 is designed in a certain way so that the light rays reaching the camera module 30 can present a consistent image.

[0384] In this example, the camera module 30 includes an optical mechanism 31A' and a photosensitive unit 32A. The optical mechanism 31A' is aligned with the light passing hole 200 and the light guide channel 500, and the optical mechanism 31A' is held in the light sensing path of the photosensitive unit 32A. At least part of the light passing hole 200 and the light guide channel 500 share each other.

[0385] In other embodiments of the present invention, the camera module 30 includes the optical unit 31A and a photosensitive unit 32A. The optical unit 31A is disposed in the light guide channel 500, and the photosensitive unit 32A is mounted on the back side of the display screen 20.

[0386] In the case where the light guide channel 500 and the light passing hole 200 coexist, since the camera module 30 can receive light through the light guide channel 500, the size of the light passing hole 200 can be designed to be smaller.

[0387] The light guide channel 500 cannot be observed from the outside of the display screen 20. For example, when the second part of the light guide channel 502 is located in the encapsulation layer 24 of the display screen 20, due to the polarizing layer above the encapsulation layer 24, the light guide channel 500 may not be observed from the outside of the display screen 20. Therefore, the inner diameter of at least part of the light guide channel 500 can be designed to be slightly larger than the inner diameter of the light passing hole 200, so that some optical elements can be placed in the light guide channel 500.

[0388] When the size of the light passing hole 200 is designed to be small, it is more difficult to observe the light passing hole 200 from the outside of the display screen 20, which is beneficial to improving the screen-to-body ratio of the display screen 20.

[0389] Furthermore, for the light passing hole 200, the inner diameter of the light passing hole 200 can be set to gradually increase from top to bottom. Some optical elements of the optical unit 31A can be arranged in the light passing hole 200, such as the diffuser 313A.

[0390] For example, when the light passing area provided by the light passing hole 200 is smaller than the light receiving area of the light sensing unit 32A of the camera module 30, a diffuser 313A can be arranged in the light passing hole 200, and the diffuser 313A can diffuse the light in the light passing hole 200 so that the light passing area provided by the light passing hole 200 matches the light receiving area of the light sensing unit 32A.

[0391] Refer to the appendix Figure 22 As shown, and at the same time refer to the appendix Figure 18A , an embodiment of a display screen assembly according to the present invention is illustrated.

[0392] In this embodiment, the present invention provides a display screen assembly, wherein the display screen assembly includes the display screen 20 and the light guide assembly 50. The display screen 20 has a light passing hole 200 that penetrates from top to bottom, and part of the light guide assembly 50 is accommodated in the light passing hole 200.

[0393] The light guide assembly 50 provides a light guide channel 500. The expected light guide channel 500 can be obtained by designing the shape and structure of the light guide assembly 50.

[0394] The light guide assembly 50 includes two light guide pipes. One of the light guide pipes is accommodated in the light passing hole 200, and the other light guide pipe extends from the gap between the display screen 20 and the housing 40 to the position of the light passing hole 200. That is to say, one light guide pipe can guide the light above the display screen 20 to pass through the display screen 20 from top to bottom and then reach the camera module 30. The other light guide pipe can guide the light between the display screen 20 and the housing 40 to reach the camera module 30. The manufacturing method of the light passing hole 200 can refer to the foregoing description.

[0395] The light guide pipe can be cylindrical, triangular prism-shaped, or quadrangular prism-shaped. The inner diameters corresponding to different positions of the light guide pipe can be different.

[0396] The light guide pipe can be made of a light-transmitting material so that it is difficult to be observed from the outside of the display screen 20. At the same time, in order to reduce the influence of stray light, for example, the influence of the light from the pixel layer 25 of the display screen 20, the light guide pipe can be coated with a light-shielding material.

[0397] Further, the light guide assembly 50 includes an optical unit 31A, and the optical unit 31A is held in the light passing path of the light passing hole 200. The optical element can be a filter, a diffuser 313A, or a modulator 312A. The optical unit 31A can preprocess the light so that the light entering the camera module 30 meets the expectation.

[0398] It should be noted that since the paths of the light entering the camera module 30 through different light guide channels 500 are different, there is an optical path difference between the lights of different paths when they reach the camera module 30. At the same time, the light beams reaching a photosensitive chip of the camera module 30 have different phases and may finally present different images. To avoid this problem, the optical path formed by the optical unit 31A in the display screen 20 is designed so that the light reaching the camera module 30 can present a consistent image.

[0399] Refer to the appendix Figure 23 as shown, and at the same time refer to the appendix Figure 18A and the appendix Figure 10 , another embodiment of the display screen assembly according to the present invention is illustrated.

[0400] In this example, the display screen 20 is implemented as an LCD display screen 20A. The LCD display screen 20A has a light guide channel 500, where the light guide channel 500 can guide the light outside the LCD display screen 20A to the inside or the inner side of the LCD display screen 20A.

[0401] Specifically, at least a part of the light guide channel 500 is located between the LCD display screen 20A and the housing 40, and at least a part of the light guide channel 500 is located inside the LCD display screen 20A.

[0402] The part of the light guide channel 500 located between the LCD display screen 20A and the housing 40 can guide the external light from the outside of the LCD display screen 20A to one side of the LCD display screen 20A, and then guide the light into the inside of the LCD display screen 20A through other parts of the light guide channel 500. After passing through the inside of the LCD display screen 20A, the light reaches the camera module 30, so that the camera module 30 located below the display screen 20A can receive the light from above the display screen 20A, enabling the camera module 30 located below the display screen 20A to use the light for imaging. Further, the camera module 30 located below the display screen 20A can obtain sufficient light for imaging through the light guide channel 500.

[0403] More specifically, the light guide channel 500 includes a first partial light guide channel 501, a second partial light guide channel 502, and a third partial light guide channel 503. The first partial light guide channel 501 is located between the LCD display screen 20A and the housing 40. The second partial light guide channel 502 is located inside the LCD display screen 20A and guides the light from the first partial light guide channel 501 into the inside of the LCD display screen 20A. The third partial light guide channel 503 is located inside the LCD display screen 20A and guides the light from the second partial light guide channel 502 to the outside of the LCD display screen 20A.

[0404] The LCD display screen 20A further includes at least one optical unit 31A, where the optical unit 31A can be arranged in the light guide channel 500 to enable the light to propagate in the light guide channel 500 along the user's expectation. The optical unit 31A can include a converging member 311A, a modulating member 312A, and a diffusing member 313A. The converging member 311A can converge the light. The modulating member 312A can modulate the light, such as filtering, dispersion, collimation, etc. The diffusing member 313A can diffuse the light.

[0405] The converging member 311A can be disposed in the first partial light guide channel 501 of the light guide channel 500, such as an incident light port of the light guide channel 500, where the converging member 311A is located at the position of the incident light port. The modulating member 312A can be disposed in the second partial light guide channel 502 of the light guide channel 500 to modulate the light passing through the second partial light guide channel 502. The diffusing member 313A can be disposed in the third partial light guide channel 503 of the light guide channel 500, such as an exit light port of the light guide channel 500. The diffusing member 313A located at the exit light port can diffuse the light so that it can adapt to a photosensitive surface of the imaging module 30. Thus, when the photosensitive surface of the imaging module 30 is relatively large, the light can be diffused through the diffusing member 313A to increase the photosensitive area of the entire photosensitive surface, which is beneficial to improving the working efficiency of the imaging module 30.

[0406] The imaging module 30 has an incident light port and includes a photosensitive unit 32A. The size of the incident light port corresponds to the photosensitive area of the photosensitive unit 32A so that the photosensitive area of the photosensitive unit 32A can receive light as much as possible and the photosensitive area of the photosensitive unit 32A can be utilized as much as possible.

[0407] Further, the LCD display screen 20A includes the cover plate layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the backplane layer 27A. The polarization layer 23A is respectively disposed on both sides of the pixel layer 25A.

[0408] The LCD display screen 20A has a side surface, a front surface, and a back surface. The front surface of the LCD display screen 20A faces the user, the back surface of the LCD display screen 20A faces away from the user, and the side surface is respectively connected to the front surface and the back surface. The light guide channel 500 extends from the gap between the LCD display screen 20A and the housing 40 to the side surface of the LCD display screen 20A, and then extends to the back surface of the LCD display screen 20A. Light can pass through the light guide channel 500 from the side surface of the LCD display screen 20A through the LCD display screen 20A to the back surface of the LCD display screen 20A.

[0409] The LCD display screen 20A is a multi-layer structure, and the light guide channel 500 can penetrate one or more of the cover plate layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the backplane layer 27A.

[0410] The light guide channel 500 can pass through the cover plate layer 21A and the back plate layer 27A. For example, from top to bottom, it passes through the cover plate layer 21A, the touch layer 22A, a polarizer of the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the other polarizer of the polarization layer 23A, and the back plate layer 27A in sequence. Those skilled in the art should understand that the arrangement of each layer of the LCD display screen 20A described here is only for illustrative purposes and does not limit the present invention.

[0411] The light guide channel 500 can pass through the touch layer 22A and the back plate layer 27A. For example, from top to bottom, the light guide channel 500 passes through the gap between the display screen 20A and the housing 40, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A in sequence. Those skilled in the art should understand that the arrangement of each layer of the LCD display screen 20A at this time is only for illustrative purposes and does not limit the present invention.

[0412] The light guide channel 500 can pass through the polarization layer 23A and the back plate layer 27A. For example, from top to bottom, the light guide channel 500 passes through the gap between the display screen 20A and the housing 40, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A in sequence. Those skilled in the art should understand that the arrangement of each layer of the LCD display screen 20A at this time is only for illustrative purposes and does not limit the present invention.

[0413] The light guide channel 500 can pass through the encapsulation layer 24A and the back plate layer 27A. For example, from top to bottom, the light guide channel 500 passes through the gap between the display screen 20A and the housing 40, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A in sequence. Those skilled in the art should understand that the arrangement of each layer of the LCD display screen 20A at this time is only for illustrative purposes and does not limit the present invention.

[0414] The light guide channel 500 can extend from the pixel layer 25A to the back plate layer 27A. For example, from top to bottom, the light guide channel 500 passes through the gap between the display screen 20A and the housing 40, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A in sequence. Those skilled in the art should understand that the arrangement of each layer of the LCD display screen 20A at this time is only for illustrative purposes and does not limit the present invention.

[0415] The light guide channel 500 can extend from the driving circuit layer 26A to the backplane layer 27A. For example, from top to bottom, the light guide channel 500 sequentially passes through the gap between the display screen 20A and the housing 40, the driving circuit layer 26A, the polarization layer 23A, and the backplane layer 27A. Those skilled in the art should understand that the layer settings of the LCD display screen 20A at this time are only for illustrative purposes and do not limit the present invention.

[0416] The light guide channel 500 can extend from the polarization layer 23A located below the pixel layer 25A to the backplane layer 27A. For example, the light guide channel 500 sequentially passes through the polarization layer 23A and the backplane layer 27A from below the pixel layer 25A.

[0417] The light guide channel 500 can pass through the backplane layer 27A. For example, the light guide channel 500 extends from the gap or the connecting medium between the backplane layer 27A and the polarization layer 23A to the backplane layer 27A and penetrates the backplane layer 27A.

[0418] Taking the light guide channel 500 passing through the pixel layer 25A as an example for illustration. The pixel layer 25A includes the color filter layer 251A and the liquid crystal 252A. The LCD display screen 20A includes a liquid crystal layer 28A, where the liquid crystal layer 28A includes the liquid crystal 252A, the color filter layer 251A, and the driving circuit layer 26A.

[0419] The liquid crystal 252A is held between the color filter layer 251A and the driving circuit layer 26A. The light guide channel 500 passes through the liquid crystal layer 28A and the liquid crystal 252A cannot leak into the light guide channel 500.

[0420] The liquid crystal layer 28A with holes can be fabricated first. The holes are at least part of the light guide channel 500, and then holes are formed at corresponding positions of each layer of the LCD display screen 20A to form at least part of the light guide channel 500.

[0421] The holes in the liquid crystal layer 28A can be in the height direction of the liquid crystal layer 28A, or the holes can be formed obliquely in the liquid crystal layer 28A along a certain inclination angle to meet the setting requirements of the light guide channel 500.

[0422] Specifically, a sealing material 2811A is disposed on the driving circuit layer 26A or the light filtering layer 251A of the liquid crystal layer 28A, so that when the driving circuit layer 26A and the light filtering layer 251A are attached to each other, the sealing material 2811A forms a sealing region 281A into which the liquid crystal 252A of the liquid crystal layer 28A cannot enter. In subsequent steps, as long as an opening is made in the liquid crystal layer 28A within the sealing region 281A, the liquid crystal 252A of the liquid crystal layer 28A will not leak outwards.

[0423] Each layer mounted on the liquid crystal layer 28A of the LCD display screen 20A can be respectively opened to form the light passing holes 200 extending from the side surface of the LCD display screen 20A towards the back surface of the LCD display screen 20A. In this way, the LCD display screen 20A can be provided with holes penetrating through the side surface and the back surface of the LCD display screen 20A.

[0424] Furthermore, part of the light guiding channels 500 are located between the display screen 20A and the housing 40, and part of the light guiding channels 500 are disposed inside the LCD display screen 20A, so that the light guiding channels 500 cannot be observed from the front side of the LCD display screen 20A, which is conducive to realizing a full screen.

[0425] Furthermore, after forming part of the light guiding channels 500 in the LCD display screen 20A, the optical unit 31A can be installed in the light guiding channels 500.

[0426] It can be understood that the optical element can be installed in the light guiding channels 500 after the entire LCD display screen 20A is manufactured, or the optical unit 31A can be installed at the preset positions of the respective layers of the LCD display screen 20A during the process of layer-by-layer installation of the LCD display screen 20A or during the formation of the corresponding light guiding channels 500 of the respective layers of the LCD display screen 20A, and then the respective functional layers are assembled to form the complete LCD display screen 20A, or at least part of the optical unit 31A can be formed during the manufacturing process of the LCD display screen 20A.

[0427] For example, first, a microlens layer is integrally formed on the encapsulation layer 24A, and then the encapsulation layer 24A is disposed above the pixel layer 25A. The microlens layer is aligned with the through-hole 200 corresponding to the pixel layer 25A. A driving circuit layer 26A is provided on the bottom side of the pixel layer 25A. The driving circuit layer 26A is electrically connected to the pixel layer 25A and is used to drive the pixel layer 25A to operate. The polarization layer 23A, the touch layer 22A, and the cover plate layer 21A are sequentially disposed on the encapsulation layer 24A.

[0428] A through light guide channel 500 is formed among the cover plate layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, and the driving circuit layer 26A. The microlens layer is held in the light guide channel 500.

[0429] The optical unit 31A can be disposed inside the LCD display screen 20A or formed on each layer of the LCD display screen 20A in other ways. Those skilled in the art should understand that the manufacturing method of the above optical unit 31A is only for illustration and is not limited to the above examples.

[0430] Refer to the attached Figure 24 As shown, another embodiment of the LCD display screen 20A according to the present invention is illustrated.

[0431] In this example, the camera module 30 includes the photosensitive unit 32A, and the photosensitive unit 32A directly receives light from the light guide channel 500. The light can be received by the photosensitive unit 32A after being processed by the optical unit 31A located in the light guide channel 500.

[0432] In this way, the optical mechanism 31A' of the camera module 30 can be disposed in the light guide channel 500, or the optical unit 31A located in the light guide channel 500 serves as the optical mechanism 31A' of the camera module 30, thereby reducing the height dimension of the camera module 30, and further facilitating reducing the height dimensions of the LCD display screen 20A and the camera module 30.

[0433] Refer to the attached Figure 25 As shown, another embodiment of the LCD display screen 20A according to the present invention is illustrated.

[0434] In this example, the LCD display screen 20A has at least one light guide channel 500 and the LCD display screen 20A further includes at least one light guide component 50, wherein the light guide channel 500 is formed in the light guide component 50.

[0435] The LCD display screen 20A provides another light passing hole 200A, and the light passing hole 200A is used for installing the light guide assembly 50.

[0436] The LCD display screen 20A is a multi-layer structure, and the light passing hole 200A can penetrate one or more of the cover plate layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the backplane layer 27A.

[0437] The light passing hole 200 can pass through the cover plate layer 21A and the backplane layer 27A. For example, from top to bottom, it passes through the cover plate layer 21A, the touch layer 22A, a polarizer of the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, another polarizer of the polarization layer 23A, and the backplane layer 27A. Those skilled in the art should understand that the settings of the layers of the LCD display screen 20A described here are only for illustrative purposes and do not limit the present invention.

[0438] The light passing hole 200A can pass through the touch layer 22A and the backplane layer 27A. For example, from top to bottom, the light passing hole 200A passes through the touch layer 22A, a polarizer of the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, another polarizer of the polarization layer 23A, and the backplane layer 27A in sequence. Those skilled in the art should understand that the settings of the layers of the LCD display screen 20A at this time are only for illustrative purposes and do not limit the present invention.

[0439] The light passing hole 200A can pass through the polarization layer 23A and the backplane layer 27A. For example, from top to bottom, the light passing hole 200A passes through a polarizer of the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, another polarizer of the polarization layer 23A, and the backplane layer 27A in sequence. Those skilled in the art should understand that the settings of the layers of the LCD display screen 20A at this time are only for illustrative purposes and do not limit the present invention.

[0440] The light passing hole 200A can pass through the encapsulation layer 24A and the backplane layer 27A. For example, from top to bottom, the light passing hole 200A passes through the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the backplane layer 27A in sequence. Those skilled in the art should understand that the settings of the layers of the LCD display screen 20A at this time are only for illustrative purposes and do not limit the present invention.

[0441] The light hole 200A can extend from the pixel layer 25A to the backplane layer 27A. For example, from top to bottom, the light hole 200A passes through the pixel layer 25A, the driving circuit layer 26A, the polarizing layer 23A, and the backplane layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display 20A is merely illustrative and does not limit the present invention.

[0442] The light hole 200A can extend from the driving circuit layer 26A to the backplane layer 27A. For example, the light hole 200A passes through the driving circuit layer 26A, the polarizing layer 23A, and the backplane layer 27A in sequence. It should be understood by those skilled in the art that the arrangement of the layers of the LCD display 20A is merely illustrative and does not limit the present invention.

[0443] The light-through hole 200A may extend from the polarization layer 23A below the pixel layer 25A to the backplane layer 27A. For example, the light-through hole 200A passes through the polarization layer 23A and the backplane layer 27A in sequence from below the pixel layer 25A.

[0444] The light-through hole 200A may pass through the backplane layer 27A. For example, the light-through hole 200A extends from the gap between the backplane layer 27A and the polarizing layer 23A or the connecting medium to the backplane layer 27A and penetrates the backplane layer 27A.

[0445] The light hole 200A passing through the pixel layer 25A is used as an example for description. The pixel layer 25A includes the liquid crystal 252A and the filter layer 251A. The LCD display 20A includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the liquid crystal 252A, the filter layer 251A, and the drive circuit layer 26A.

[0446] The liquid crystal 252A is held between the filter layer 251A and the driving circuit layer 26A. The light through hole 200 passes through the liquid crystal layer 28A and the liquid crystal 252A is prevented from leaking into the light through hole 200.

[0447] The liquid crystal layer 28A with the light-through holes 200 may be manufactured first, and then holes may be opened at corresponding positions of each layer of the LCD display screen 20A to form at least a portion of the light-through holes 200 .

[0448] The light-through hole 200 of the liquid crystal layer 28A may be located in the height direction of the liquid crystal layer 28A. The light-through hole 200A may also be formed in the liquid crystal layer 28A at a certain tilt angle to meet the setting requirements of the light-through hole 200A.

[0449] Specifically, a sealing material 2811 is provided on the driving circuit layer 26A or the light filtering layer 251A of the liquid crystal layer 28A, so that when the driving circuit layer 26A and the light filtering layer 251A are adhered to each other, the sealing material 2811A forms a sealing area 281A, and the liquid crystal 252A of the liquid crystal layer 28A cannot enter the sealing area 281A. In subsequent steps, as long as an opening is made in the liquid crystal layer 28A within the sealing area 281A, the liquid crystal 252A of the liquid crystal layer 28A will not leak outwards.

[0450] Each layer above the liquid crystal layer 28A of the LCD display screen 20A can be respectively opened with holes to form a light passing hole 200 facing the liquid crystal layer 28A of the LCD display screen 20A from the side of the LCD display screen 20A. In this way, the LCD display screen 20A can be provided with a light passing hole 200A that penetrates the side and the back of the LCD display screen 20A.

[0451] Part of the light guiding component 50 is installed between the LCD display screen 20A and the housing 40, and part of the light guiding component 50 is installed in the light passing hole 200A of the LCD display screen 20A.

[0452] The light guiding component 50 may include at least one light guiding pipe. The number of the light guiding pipes may be multiple to adapt to different shapes of the light passing hole 200A. The light passing hole 200A may be linear or curved.

[0453] When the number of the light guiding pipes is multiple, the light guiding pipes can be installed in the light passing hole 200A one by one in a certain order, or the light guiding pipes can be installed in the LCD display screen 20A one by one in a certain order. For example, when installing the liquid crystal layer 28A on the polarization layer 23A, one light guiding pipe can be installed in the corresponding part of the light passing hole 200 of the liquid crystal layer 28A and the polarization layer 23A, and then when installing the backplane layer 27A on the liquid crystal layer 28A, another light guiding pipe can be installed in the corresponding part of the light passing hole 200A of the backplane layer 27A.

[0454] The shape and position of the entire light passing hole 200A can be set on the LCD display screen 20A according to the needs of the user. The shape and position of the light guiding component 50 can be designed according to the expected requirements of the light guiding channel 500.

[0455] External light propagates along the light guide channel 500 to the camera module 30 located on the back side of the LCD display screen 20A. During this process, the light can be reflected, diffused, or collimated within the light guide channel 500 of the light guide assembly 50.

[0456] Further, the optical unit 31A can be disposed within the light guide channel 500 of the light guide assembly 50. The optical unit 31A can be integrally formed with the light guide assembly 50, and the optical unit 31A can also be disposed within the light guide channel 500 of the light guide assembly 50.

[0457] The light guide assembly 50 can be transparent, such as made of glass or resin. The light guide assembly 50 can also be opaque. For example, the outer wall of the light guide assembly 50 can be coated with an opaque material to reduce the influence of light outside the light guide assembly 50 on the light within the light guide channel 500 of the light guide assembly 50.

[0458] Reference is made to Figure 26 shown, and at the same time reference is made to Figure 18A and Figure 10 to illustrate another embodiment of the LCD display screen 20A according to the present invention.

[0459] In this example, the LCD display screen 20A has a light passing hole 200 and a light guide channel 500, where the light passing hole 200 penetrates the display screen 20A of the terminal device 1 from top to bottom. The light guide channel 500 extends downward from the gap between the display screen 20A of the terminal device 1 and the housing 40 to the display screen 20A. It can be understood that the number of the light passing holes 200 can be multiple. The light passing holes 200 can penetrate the display screen 20A from top to bottom, and the light passing holes 200 can also pass through the inside of the display screen 20A from the side of the display screen 20A to the bottom surface of the display screen 20A.

[0460] Both the light guide channel 500 and the light passing hole 200 can be used to conduct light. The camera module 30 aligned with the light passing hole 200 that penetrates the display screen 20A can receive light from the outside of the display screen 20A through the light passing hole 200. The camera module 30 aligned with the light guide channel 500 can receive light from the outside of the display screen 20A through the light passing hole 200.

[0461] It should be noted that the light guide channel 500 and the light passing hole 200 can be independent of each other, and the light guide channel 500 and the light passing hole 200 can be respectively aligned with different camera modules 30. In other words, a plurality of the camera modules 30 can be mounted on the display screen 20A and located below the display screen 20A.

[0462] In this example, at least a part of the light guide channel 500 and the light passing hole 200 overlap with each other, so that the light received by the light guide channel 500 and the light passing hole 200 can enter the same camera module 30 and be received by the same photosensitive unit 32A, thereby forming an image.

[0463] Specifically, at least a part of the light guide channel 500 is located between the display screen 20A and the housing 40, and at least a part of the light guide channel 500 is located within the display screen 20A.

[0464] The light guide channel 500 may include a first partial light guide channel 501, a second partial light guide channel 502, and a third partial light guide channel 503, wherein the first partial light guide channel 501 is located between the display screen 20A and the housing 40, and the second partial light guide channel 502 and the third partial light guide channel 503 are respectively located within the display screen 20A.

[0465] The light guide channel 500 is communicated with the light passing hole 200, and the third partial light guide channel 503 and the light passing hole 200 overlap.

[0466] The first partial light guide channel 501 is located on one side surface of the display screen 20A, the second partial light guide channel 502 extends inwards from the side surface of the display screen 20A, and the third partial light guide channel 503 extends downwards from the inside of the display screen 20A.

[0467] The terminal device 1 further includes an optical unit 31A, and the optical unit 31A is disposed in the light guide channel 500. The optical unit 31A may include a converging member 311A, a modulating member 312A, and a diffusing member 313A, wherein the converging member 311A may be disposed in the first partial light guide channel 501 for converging light from the outside, wherein the modulating member 312A may be disposed in the second partial light guide channel 502 for modulating the light from the first partial light guide channel 501, and wherein the diffusing member 313A may be disposed in the third partial light guide channel 503 for diffusing the light and then transmitting it to the camera module 30.

[0468] It should be noted that, since the paths of the light rays entering the imaging of the imaging module 30 through the light guide channel 500 and the light passing hole 200 are different, there is an optical path difference for the light rays of different paths when reaching the imaging module 30. At the same time, the light beams reaching a photosensitive chip of the imaging module 30 have different phases and may finally present different images. To avoid this problem, the optical path formed by the optical unit 31A in the display screen 20 is designed in a certain way so that the light rays reaching the imaging module 30 can present a consistent image.

[0469] In some other embodiments of the present invention, the imaging module 30 includes an optical mechanism 31A' and a photosensitive unit 32A, wherein the optical mechanism 31A' is aligned with the light passing hole 200 and the light guide channel 500 and the optical mechanism 31A' is held in the photosensitive path of the photosensitive unit 32A. At least part of the light passing hole 200 and the light guide channel 500 is shared.

[0470] In this example, the imaging module 30 includes the optical unit 31A and a photosensitive unit 32A, wherein the optical unit 31A is disposed in the light guide channel 500 and the photosensitive unit 32A is mounted on the back side of the display screen 20A.

[0471] In the case where the light guide channel 500 and the light passing hole 200 coexist, since the imaging module 30 can receive light through the light guide channel 500, the size of the light passing hole 200 can be designed to be smaller.

[0472] The light guide channel 500 may not be observable from the outside of the display screen 20A. For example, when the second part of the light guide channel 502 is located in the encapsulation layer 24A of the display screen 20A, due to the polarizing layer above the encapsulation layer 24A, the light guide channel 500 may not be observable from the outside of the display screen 20A. Therefore, the inner diameter of at least part of the light guide channel 500 can be designed to be slightly larger than the inner diameter of the light passing hole 200 so that some optical elements can be placed in the light guide channel 500.

[0473] When the size of the light passing hole 200 is designed to be small, it is more difficult to observe the light passing hole 200 from the outside of the display screen 20A, which is beneficial to improving the screen-to-body ratio of the display screen 20A.

[0474] Furthermore, for the light passing hole 200, the inner diameter of the light passing hole 200 can be set to gradually increase from top to bottom. Some optical elements of the optical unit 31A can be disposed in the light passing hole 200, such as the diffuser 313A.

[0475] For example, when the light passing area provided by the light passing hole 200 is smaller than the light receiving area of the light sensitive unit 32A of the camera module 30, one diffusion member 313A can be disposed in the light passing hole 200, and the diffusion member 313A can diffuse the light in the light passing hole 200 so that the light passing area provided by the light passing hole 200 matches the light receiving area of the light sensitive unit 32A.

[0476] Refer to the attached Figure 27 figure. Meanwhile, refer to the attached Figure 18A figure, another embodiment of the LCD display screen 20A according to the present invention is illustrated.

[0477] In this example, the LCD display screen 20A has a light passing hole 200, where the light passing hole 200 penetrates through the LCD display screen 20A in the height direction. At least a part of the light guiding component 50 is disposed in the light passing hole 200.

[0478] The light guiding component 50 provides a light guiding channel 500. The expected light guiding channel 500 can be obtained by designing the shape and structure of the light guiding component 50.

[0479] The light guiding component 50 includes two light guiding pipes. One of the light guiding pipes is accommodated in the light passing hole 200, and the other light guiding pipe extends from the gap between the display screen 20A and the housing 40 to the position of the light passing hole 200. That is to say, one light guiding pipe can guide the light above the display screen 20A to pass through the display screen 20A from top to bottom and then reach the camera module 30. The other light guiding pipe can guide the light between the display screen 20A and the housing 40 to reach the camera module 30. The manufacturing method of the light passing hole 200 can refer to the foregoing description.

[0480] The light guiding pipe can be cylindrical, triangular prism-shaped, or quadrangular prism-shaped. The inner diameters corresponding to different positions of the light guiding pipe can be different.

[0481] The light guiding pipe can be made of a light-transmitting material so that the light guiding pipe is difficult to be observed from the outside of the display screen 20A. At the same time, in order to reduce the influence of stray light, for example, the influence of the light from the pixel layer 25A of the display screen 20A, the light guiding pipe can be coated with a light-shielding material.

[0482] Further, the LCD display screen 20A includes an optical unit 31A, wherein the optical unit 31A is held in the light guide channel 500 of the light guide assembly 50, and the optical unit 31A can be a filter, a diffuser 313A or a modulator 312A. The optical unit 31A can preprocess light so that the light entering the imaging module 30 meets the expectations.

[0483] It should be noted that since the paths of the light rays entering the imaging module 30 through different light guide channels 500 are different, there is an optical path difference for the light rays of different paths when they reach the imaging module 30. At the same time, the light beams reaching a photosensitive chip of the imaging module 30 have different phases and may finally present different images. To avoid this problem, the optical path formed by the optical unit 31A in the display screen 20 is designed in a certain way so that the light rays reaching the imaging module 30 can present a consistent image.

[0484] To further reduce the overall height dimension of the terminal device 1, preferably, in the present invention, an imaging module 30 with a relatively low height dimension is adopted.

[0485] Figure 28 A specific example of the imaging module 30 according to the present invention is illustrated. The imaging module 30 includes an optical mechanism 31A' and a photosensitive unit 32A. The imaging module 30 may further include a diaphragm 33A, wherein the diaphragm 33A is located at the light passing hole 200 position, and the optical mechanism 31A' is held in the photosensitive path of the photosensitive unit 32A.

[0486] The diaphragm 33A can restrict the light rays passing through the optical mechanism 31A'. Specifically, the amount of incident light of the optical mechanism 31A' can be controlled by controlling the size of the light passing aperture of the diaphragm 33A.

[0487] The diaphragm 33A can be circular, triangular or rectangular. The size of the diaphragm 33A can limit the light rays entering the optical mechanism 31A' through the diaphragm 33A.

[0488] In this example, the display screen 20 is provided with the light passing hole 200, and the imaging module 30 is installed below the display screen 20. The light passing hole 200 allows light to pass through the display screen 20 and then reach the imaging module 30.

[0489] The light passing hole 200 can function as the diaphragm 33A of the imaging module 30. Thus, for the imaging module 30 itself, the imaging module 30 does not need to be separately provided with the diaphragm 33A. The amount of light entering the imaging module 30 can be controlled by controlling the size of the light passing hole 200 of the display screen 20, and the light passing hole 200 serves as the diaphragm 33A.

[0490] In this way, the height dimension of the imaging module 30 can be reduced, and thus the height dimensions of the display screen 20 and the imaging module 30 can also be reduced, which is beneficial to the thinning of the terminal device 1.

[0491] Furthermore, before the imaging module 30 is installed on the display screen 20, the optical path design of the imaging module 30 is fixed, and parameters such as the amount of incident light and exposure time required by the imaging module 30 can be determined. Based on these parameters, the size of the diaphragm 33A can be determined. Therefore, during the manufacturing process of forming the light passing hole 200 on the display screen 20, the light passing hole 200 that meets the requirements can be manufactured according to the requirements of the imaging module 30. The manufacturing method of the light passing hole 200 described above can be referred to, and the aperture size and position of the light passing hole 200 can be designed according to the requirements.

[0492] Furthermore, the distance between the imaging module 30 and the diaphragm 33A on the light sensing path of the light sensing unit 32A is determined based on the optical requirements of the imaging module 30 based on the optical path design. When assembling the imaging module 30 on the display screen 20, the distance between the imaging module 30 and the diaphragm 33A can be adjusted by adjusting the relative positions of the imaging module 30 and the display screen 20 according to the requirements, so as to meet the optical path requirements of the imaging module 30.

[0493] Figure 29 Schematically shows a specific embodiment of the imaging module 30 according to the present invention.

[0494] The imaging module 30 includes an optical mechanism 31A', a light sensing unit 32A, and a diaphragm 33A', wherein the diaphragm 33A' is disposed on the optical mechanism 31A', and the optical mechanism 31A' is held on the light sensing path of the light sensing unit 32A. The amount of light passing through the optical mechanism 31A' can be controlled by controlling the size of the diaphragm 33A'.

[0495] When the imaging module 30 is installed on the display screen 20, the light passing hole 200 of the display screen 20 allows light to pass through the light passing hole 200 from the outside of the display screen 20 and then reach the imaging module 30. The light passing hole 200 can affect the imaging result of the imaging module 30.

[0496] The light passing hole 200 functions similar to a diaphragm. By controlling the aperture of the light passing hole 200, the imaging light beam can be controlled. The light passing hole 200 of the display screen 20 can restrict the imaging light beam of the imaging module 30, and the diaphragm 33A' of the imaging module 30 also restricts the imaging light beam. The light passing hole 200 of the display screen 20 and the diaphragm 33A' of the imaging module 30 can cooperate.

[0497] Before the imaging module 30 is installed on the display screen 20, the optical path design of the imaging module 30 can be roughly determined, so that the size of the light passing hole 200 of the display screen 20 can be set based on the requirements of the imaging module 30. After the imaging module 30 is installed on the display screen 20, the size of the light passing hole 200 is fixed, and the relative position between the imaging module 30 and the light passing hole 200 can be fixed. The imaging light beam can be further controlled by controlling the diaphragm 33A' of the imaging module 30.

[0498] Furthermore, the light passing hole 200 of the display screen 20 can restrict the imaging light beam, and the diaphragm 33A' of the imaging module 30 can restrict the imaging light beam and can also be set as a diaphragm for eliminating stray light to perform stray light elimination processing on the light beam after passing through the light passing hole 200. In other words, the light passing hole 200 of the display screen 20 and the diaphragm 33A' of the imaging module 30 can cooperate with each other to restrict the imaging light beam. The light passing hole 200 of the display screen 20 and the diaphragm 33A' of the imaging module 30 can also play different roles and are specifically set according to the optical path requirements of the imaging module 30.

[0499] It should be noted that the diaphragm 33A' of the imaging module 30 can be a variable diaphragm, and the aperture of the diaphragm 33A' is adjustable, so as to control the light passing amount of the imaging module 30 by adjusting its aperture.

[0500] Figure 30 Illustrated is a specific example of the imaging module 30 according to the present invention. As Figure 30As shown, in this specific embodiment, the camera module 30 includes a circuit board 31, an image sensor chip 32, and a light-transmitting component 33. Among them, the circuit board 31 has a groove 310, the image sensor chip 32 is disposed in the groove 310 and electrically connected to the circuit board 31, and the light-transmitting component 33 is located on the light-sensing path of the image sensor chip 32. In this way, the imaging light passing through the display screen 20 first reaches the light-transmitting component 33, and then reaches the image sensor chip 32 to be sensed by the image sensor chip 32 for imaging reaction.

[0501] Those skilled in the art should be aware that in the existing camera modules based on the COB process, the circuit board has a flat surface, and the image sensor chip is directly attached and electrically connected to the flat surface of the circuit board. Since each camera module has a preset optical back focus requirement, the installation reference height of the image sensor chip directly determines the overall height dimension of the camera module 30.

[0502] Correspondingly, compared with the existing camera modules based on the COB process, in this specific example, the groove 310 is provided on the circuit board 31 to reduce the installation reference height of the image sensor chip 32 through the groove 310. In other words, in the present invention, the top surface of the circuit board 31 is a non-flat surface, wherein the area of the circuit board 31 for installing the image sensor chip 32 is recessed downward so that the installation reference height of the image sensor chip 32 can be reduced. It should be understood that on the premise that the optical back focus requirement remains unchanged, the installation height of the optical lens 332 relative to the circuit board 31 can be reduced, so that the overall height dimension of the camera module 30 can be reduced.

[0503] Preferably, in this specific example, the size of the groove 310 is consistent with the size of the image sensor chip 32, so that the groove 310 itself can be used to position and limit the image sensor chip 32. Specifically, during the process of installing the image sensor chip 32 in the groove 310, the image sensor chip 32 can be directly and fittingly embedded into the groove 310, without the need to continuously calibrate and position the image sensor chip at the installation position of the circuit board as in the existing camera modules based on the COB process. Further, after the image sensor chip 32 is installed in the groove 310 and electrically connected to the circuit board 31, the image sensor chip 32 is "confined" in the groove 310 to prevent the image sensor chip 32 from detaching from the groove 310 or generating an offset.

[0504] Further, the camera module 30 further includes a set of leads 34. After the photosensitive chip 32 is attached to the groove 310 of the circuit board 31, the electrical connection between the photosensitive chip 32 and the circuit board 31 is achieved through the leads 34. Since the distance between the upper surface of the photosensitive chip 32 and the upper surface of the circuit board 31 is reduced, the arc height of the gold wire between the pads connecting the photosensitive chip 32 and the circuit board 31 is also reduced, thus reducing the difficulty of wire bonding.

[0505] Specifically, each of the leads 34 extends bendably between the photosensitive chip 32 and the circuit board 31 to connect the photosensitive chip 32 to the circuit board 31 through the leads 34. Thus, the circuit board 31 can supply power to the photosensitive chip 32 according to the leads 34, and the photosensitive chip 32 can transmit the collected signals according to the leads 34.

[0506] It is worth mentioning that in this specific example, the type of the leads 34 is not limited by this application. For example, the leads 34 can be gold wires, silver wires, or copper wires. And the leads 34 can be installed between the circuit board 31 and the photosensitive chip 32 through the "wire bonding" process to achieve the electrical connection between the two.

[0507] Specifically, the "wire bonding" process is generally divided into two types: the "forward wire bonding" process and the "reverse wire bonding" process. The "forward wire bonding" process means that during the process of laying the leads 34, one end of the leads 34 is first formed on the conductive end of the circuit board 31, then the leads 34 are extended bendably, and finally the other end of the leads 34 is formed on the conductive end of the photosensitive chip 32. In this way, the leads 34 are formed between the photosensitive chip 32 and the circuit board 31. The "reverse wire bonding" process means that during the process of laying the leads 34, one end of the leads 34 is first formed on the conductive end of the photosensitive chip 32, then the leads 34 are extended bendably, and finally the other end of the leads 34 is formed on the conductive end of the circuit board 31. In this way, the leads 34 are formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the height of the leads 34 protruding upward formed by the "reverse wire bonding" process is less than the height of the leads 34 protruding upward formed by the "forward wire bonding" process. Therefore, preferably, in this specific implementation, the "reverse wire bonding" process is used to form the leads 34.

[0508] Further, the imaging module 30 further includes a base 35, which is disposed on the circuit board 31 for supporting the light-transmitting component 33. The light-transmitting component 33 includes a color filter element 331 and an optical lens 332, and the color filter element 331 and the optical lens 332 are sequentially disposed on the light-sensing path of the light-sensing chip 32. It should be noted that if the arc height of the lead 34 is reduced, the inner cavity height of the base 35 can also be appropriately reduced, and further, the height of the base 35 will also be reduced. Further, the overall height of the imaging module 30 will also be appropriately reduced.

[0509] Specifically, in this specific example, the base 35 can be implemented as a conventional plastic bracket, which is pre-formed and attached to the top surface of the circuit board 31; alternatively, the base 35 can be implemented as a molded base, which can be integrally formed at corresponding positions of the circuit board 31 and / or the light-sensing chip 32 by MOB (Molding on Board) or MOC (Molding on Chip) processes. Those skilled in the art should know that the MOB (Molding on Board) process means that the molded base is integrally formed on the circuit board 31 by a molding process. After molding, the molded base integrally covers the circuit board 31, the electronic components 312 on the circuit board 31, and the lead 34. The MOC process means that the molded base is integrally formed on the circuit board 31 by a molding process. After molding, the molded base covers at least a part of the lead 34 in addition to covering the circuit board 31 and the electronic components 312 on the circuit board 31, or covers at least a part of the lead 34 and at least a part of the light-sensing chip 32 (where at least a part of the light-sensing chip 32 is a non-light-sensing area of the light-sensing chip 32).

[0510] In this specific example, the color filter element 331 is disposed between the optical lens 332 and the light-sensing element, so that the light entering the interior of the imaging module 30 from the optical lens 332 can be received and photoelectrically converted by the light-sensing chip 32 only after being filtered by the color filter element 331, thereby improving the imaging quality of the imaging module 30. For example, the color filter element 331 can be used to filter the infrared part of the light entering the interior of the imaging module 30 from the optical lens 332.

[0511] Those skilled in the art should be aware that the color filter element 331 can be implemented in different types, including but not limited to that the color filter element 331 can be implemented as an infrared cut-off filter, a full-transmission spectrum filter, and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cut-off filter and a full-transmission spectrum filter, that is, the infrared cut-off filter and the full-transmission spectrum filter can be switched to selectively be located on the light-sensitive path of the light-sensitive chip 32. In this way, when using the camera module 30 in an environment with sufficient light such as during the day, the infrared cut-off filter can be switched to the light-sensitive path of the light-sensitive chip 32 to filter the infrared rays in the light reflected by the object entering the camera module 30 through the infrared cut-off filter. And when using the camera module 30 in an environment with dim light such as at night, the full-transmission spectrum filter can be switched to the light-sensitive path of the light-sensitive chip 32 to allow the infrared part of the light reflected by the object entering the camera module 30 to transmit light.

[0512] It is worth mentioning that the color filter element 331 can also be arranged at other positions on the light-sensitive path of the light-sensitive chip 32. For example, the color filter element 331 is arranged at the bottom of the optical lens 332, the bottom of the optical lens 332, etc. In this regard, it is not limited by this application.

[0513] In addition, it is also worth mentioning that in this specific example, the camera module 30 can be implemented as a fixed-focus module or a moving-focus module. Among them, when the camera module 30 is a moving-focus module, the camera module 30 further includes a driver 36 connected to the circuit board 31, and the driver 36 is used to controllably drive the lens to move to achieve auto-focus.

[0514] Figure 31 Another specific example of the camera module 30 according to the present invention is illustrated, in which Figure 31 the illustrated camera module 30 is Figure 30 a variant implementation of the illustrated camera module 30.

[0515] Specifically, as Figure 31As shown, in this specific example, the camera module 30 includes a circuit board 31, a photosensitive chip 32, a light-transmitting component 33, and a reinforcing plate 37. The circuit board 31 has an opening 310A formed therethrough. The reinforcing plate 37 is attached to the bottom surface of the circuit board 31. The photosensitive chip 32 is disposed at the opening 310A of the circuit board 31 and attached to the reinforcing plate 37. The photosensitive chip 32 is conductively connected to the circuit board 31. The light-transmitting component 33 is disposed on the light-sensing path of the photosensitive chip 32. In this way, the imaging light passing through the display screen 20 first reaches the light-transmitting component 33 and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for imaging reaction.

[0516] The reinforcing plate 37 can be implemented as a steel plate, which has a smoother surface than the circuit board 31. When the photosensitive chip 32 is attached thereto, it is smoother and has a better imaging effect. In addition, metal has better thermal conductivity, and the steel plate can play a role in heat dissipation.

[0517] In other words, compared to Figure 30 In the camera module 30 shown in the figure, in this specific example, the circuit board 31 has the opening 310A, which is formed through the circuit board 31, so as to lower the installation reference height of the photosensitive chip 32 through the opening 310A. In other words, in the present invention, the top surface of the circuit board 31 is a non-flat surface, wherein the area of the circuit board 31 for mounting the photosensitive chip 32 is recessed downward and penetrates the circuit board 31, so that the installation reference height of the photosensitive chip 32 can be further lowered. It should be understood that each camera module has a preset optical back focus requirement, so that under the premise of keeping the optical back focus requirement unchanged, the installation height of the optical lens 332 relative to the circuit board 31 can be further reduced, so that the overall height dimension of the camera module 30 can be further reduced.

[0518] like Figure 31 As shown, it should be noted in particular that in this specific example, the bottom surface of the photosensitive chip 32 is flush with the bottom surface of the circuit board 31, that is, the installation reference height of the photosensitive chip 32 is the height of the bottom surface of the circuit board 31. Therefore, under the premise of ensuring the preset optical back focus, the installation position of the photosensitive chip 32 can be further lowered, so that the overall height dimension of the camera module 30 can be further reduced.

[0519] Preferably, in this specific example, the size of the opening 310A is consistent with the size of the photosensitive chip 32, so that the opening 310A itself can be used to position and limit the photosensitive chip 32. Specifically, during the process of installing the photosensitive chip 32 into the opening 310A, the photosensitive chip 32 can be directly and fittingly embedded into the opening 310A and finally attached to the reinforcement plate 37, without the need to continuously calibrate and position the installation position of the photosensitive chip 32 on the circuit board 31 as in the existing COB process-based camera modules. Further, after the photosensitive chip 32 is installed in the opening 310A and electrically connected to the circuit board 31, the photosensitive chip 32 is "confined" in the opening 310A to prevent the photosensitive chip 32 from detaching from or shifting within the opening 310A.

[0520] Further, the camera module 30 further includes a set of leads 34. Among them, after the photosensitive chip 32 is installed in the opening 310A of the circuit board 31, the electrical connection between the photosensitive chip 32 and the circuit board 31 is achieved through the leads 34. Specifically, each lead 34 extends bendably between the photosensitive chip 32 and the circuit board 31 to connect the photosensitive chip 32 to the circuit board 31 through the lead 34. Thus, the circuit board 31 can supply power to the photosensitive chip 32 according to the lead 34, and the photosensitive chip 32 can transmit the collected signals according to the lead 34.

[0521] It is worth mentioning that in this specific example, the type of the lead 34 is not limited by this application. For example, the lead 34 can be a gold wire, a silver wire, or a copper wire. And the lead 34 can be installed between the circuit board 31 and the photosensitive chip 32 through the process of "wire bonding" to achieve the electrical connection between the two.

[0522] Specifically, the "gold wire bonding" process is generally divided into two types: the "positive gold wire bonding" process and the "negative gold wire bonding" process. The "positive gold wire bonding" process means that during the process of laying the lead 34, one end of the lead 34 is first formed on the conductive end of the circuit board 31, and then the lead 34 is bent and extended, and finally the other end of the lead 34 is formed on the conductive end of the photosensitive chip 32. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. The "negative gold wire bonding" process means that during the process of laying the lead 34, one end of the lead 34 is first formed on the conductive end of the photosensitive chip 32, and then the lead 34 is bent and extended, and finally the other end of the lead 34 is formed on the conductive end of the circuit board 31. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the height of the lead 34 protruding upward formed by the "negative gold wire bonding" process is less than the height of the lead 34 protruding upward formed by the "positive gold wire bonding" process. Therefore, preferably, in this specific embodiment, the "negative gold wire bonding" process is used to form the lead 34.

[0523] Furthermore, the imaging module 30 further includes a base 35, and the base 35 is disposed on the circuit board 31 for supporting the light-transmitting component 33. The light-transmitting component 33 includes a color filter element 331 and an optical lens 332, and the color filter element 331 and the optical lens 332 are sequentially disposed on the light-sensing path of the photosensitive chip 32.

[0524] Specifically, in this specific example, the base 35 can be implemented as a conventional plastic bracket, which is pre-formed and attached to the top surface of the circuit board 31; alternatively, the base 35 can be implemented as a molded base, which can be integrally formed at corresponding positions of the circuit board 31 and / or the photosensitive chip 32 through MOB (Molding on Board) or MOC (Molding on Chip) processes. Those skilled in the art should be aware that the MOB (Molding on Board) process refers to integrally forming the molded base on the circuit board 31 through a molding process, where after molding, the molded base integrally covers the circuit board 31, the electronic components 312 located on the circuit board 31, and the lead 34. The MOC process refers to integrally forming the molded base on the circuit board 31 through a molding process, where after molding, the molded base covers at least a part of the lead 34 in addition to covering the circuit board 31 and the electronic components 312 located on the circuit board 31, or covers at least a part of the lead 34 and at least a part of the photosensitive chip 32 (where at least a part of the area of the photosensitive chip 32 is a non-photosensitive area of the photosensitive chip 32).

[0525] In this specific example, the color filter element 331 is disposed between the optical lens 332 and the photosensitive element, so that the light entering the interior of the imaging module 30 from the optical lens 332 can be received and photoelectrically converted by the photosensitive chip 32 only after being filtered by the color filter element 331, thereby improving the imaging quality of the imaging module 30. For example, the color filter element 331 can be used to filter the infrared part of the light entering the interior of the imaging module 30 from the optical lens 332.

[0526] Those skilled in the art should be aware that the color filter element 331 can be implemented in different types, including but not limited to that the color filter element 331 can be implemented as an infrared cut-off filter, a full-transmission spectrum filter, and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cut-off filter and a full-transmission spectrum filter, that is, the infrared cut-off filter and the full-transmission spectrum filter can be switched to selectively be located on the light-sensitive path of the photosensitive chip 32. In this way, when using the imaging module 30 in an environment with sufficient light such as during the day, the infrared cut-off filter can be switched to the light-sensitive path of the photosensitive chip 32 to filter the infrared rays in the light reflected by the object entering the imaging module 30. And when using the imaging module 30 in an environment with dim light such as at night, the full-transmission spectrum filter can be switched to the light-sensitive path of the photosensitive chip 32 to allow the infrared part of the light reflected by the object entering the imaging module 30 to transmit through.

[0527] It is worth mentioning that the color filter element 331 can also be disposed at other positions on the light-sensitive path of the photosensitive chip 32. For example, the color filter element 331 is disposed at the bottom of the optical lens 332, the bottom of the optical lens 332, etc. In this regard, it is not limited by this application.

[0528] It is also worth mentioning that in this specific example, the imaging module 30 can be implemented as a fixed-focus imaging module or a moving-focus imaging module. Among them, when the imaging module 30 is a moving-focus imaging module, the imaging module 30 further includes a driver 36 electrically connected to the circuit board 31, and the driver 36 is used to controllably drive the lens to move to achieve auto-focus.

[0529] Figure 32 Another specific schematic diagram of the imaging module 30 according to the present invention is illustrated, in which Figure 32 The illustrated imaging module 30 is Figure 31 A variant implementation of the illustrated imaging module 30.

[0530] Specifically, compared with Figure 31 The illustrated imaging module 30, in this specific example, the base 35 is directly installed on the reinforcing plate 37. In other words, in this specific example, the installation reference height of the base 35 is reduced, so that the installation reference height of the optical lens 332 installed on the base 35 is reduced, so that the overall height dimension of the imaging module 30 can be reduced.

[0531] Accordingly, in this specific embodiment, the base 35 can be implemented as a conventional plastic bracket, which is pre-formed and attached to the top surface of the reinforcing plate 37; alternatively, the base 35 can be implemented as a molded base, which can be integrally formed at corresponding positions of the reinforcing plate 37, the circuit board 31, and / or the photosensitive chip 32 through MOB (Molding on Board) or MOC (Molding on Chip) processes. Those skilled in the art should know that the MOB (Molding on Board) process means that the molded base is integrally formed on the circuit board 31 through a molding process. After molding, the molded base integrally covers the reinforcing plate 37, the circuit board 31, the electronic components 312 on the circuit board 31, and the leads 34. The MOC process means that the molded base is integrally formed on the circuit board 31 through a molding process. After molding, the molded base covers at least a part of the leads 34 in addition to covering the reinforcing plate 37, the circuit board 31, and the electronic components 312 on the circuit board 31, or covers at least a part of the leads 34 and at least a part of the photosensitive chip 32 (where at least a part of the photosensitive chip 32 is a non-photosensitive area of the photosensitive chip 32).

[0532] Figure 33 FIG. shows still another specific example of the imaging module 30 according to the present invention, wherein, Figure 33 the illustrated imaging module 30 is Figure 31 another variant implementation of the illustrated imaging module 30.

[0533] Specifically, compared with Figure 31 the illustrated imaging module 30, in this specific example, the base 35 has at least two positioning posts 351 extending downward, the circuit board 31 has at least two openings 311, and the positioning posts 351 pass through the openings 311 and are disposed on the reinforcing plate 37. In this way, the installation reference height of the base 35 is reduced, so that the overall height of the imaging module 30 can be reduced.

[0534] Figure 34 and Figure 35 FIG. shows still another specific example of the imaging module 30 according to the present invention, wherein, Figure 34 and Figure 35 the illustrated imaging module 30 is Figure 31 still another variant implementation of the illustrated imaging module 30.

[0535] As Figure 34 and Figure 35As shown, in this specific example, the reinforcing plate 37 has a boss 371A or a groove 371 at the opening 310A of the circuit board 31 to adjust the mounting reference height of the photosensitive chip 32 through the boss 371A or the groove 371. In other words, in this specific example, the bottom surface of the photosensitive chip 32 is not flush with the bottom surface of the circuit board 31.

[0536] Specifically, as Figure 34 shown, when the reinforcing plate 37 has a groove 371 at the opening 310A of the circuit board 31, the mounting reference height of the photosensitive chip 32 is further reduced, so that the overall height dimension of the camera module 30 can be further reduced while meeting the design requirements of the preset optical back focus. It should be noted that when the reinforcing plate 37 has a groove 371 at the opening 310A of the circuit board 31, the photosensitive chip 32 is mounted on the reinforcing plate 37. At that time, the bottom surface of the photosensitive chip 32 is lower than the bottom surface of the circuit board 31.

[0537] Specifically, as Figure 35 shown, when the reinforcing plate 37 has a boss 371A at the opening 310A of the circuit board 31, compared with the existing camera module based on the COB process, the mounting reference height of the photosensitive chip 32 is reduced, so that the overall height dimension of the camera module 30 can be reduced while meeting the design requirements of the preset optical back focus. It should be noted that when the reinforcing plate 37 has a boss 371A at the opening 310A of the circuit board 31, the photosensitive chip 32 is mounted on the reinforcing plate 37. At that time, the bottom surface of the photosensitive chip 32 is higher than the bottom surface of the circuit board 31 but lower than the top surface of the circuit board 31.

[0538] Figure 36 FIG. illustrates another specific example of the camera module 30 according to the present invention, wherein, Figure 36 The camera module 30 shown is Figure 33 A variant implementation of the camera module 30 shown.

[0539] Specifically, as Figure 36As shown, in this specific example, the camera module 30 includes a circuit board 31, an image sensor chip 32, a base 35, an optical lens 332, a color filter element 331, and a reinforcing plate 37. Among them, the circuit board 31 has an opening 310A formed therethrough, the reinforcing plate 37 is attached to the bottom surface of the circuit board 31, the image sensor chip 32 is disposed at the opening 310A of the circuit board 31 and attached to the reinforcing plate 37, the image sensor chip 32 is conductively connected to the circuit board 31, and the color filter element 331 and the optical lens 332 are sequentially disposed on the light sensing path of the image sensor chip 32. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, reaches the image sensor chip 32 to be sensed by the image sensor chip 32 for imaging reaction.

[0540] Specifically, in this specific implementation, the optical lens 332 and the base 35 have an integrated structure, that is, the optical lens 332 and the base 35 have been assembled into an integral body before participating in the assembly of the camera module 30. In other words, in this specific example, the optical lens 332 is an integrated lens 333, which is assembled with the base 35 to form a component unit. Further, in this specific example, the base 35 has at least two positioning posts extending downward, the circuit board 31 has at least two openings, and the positioning posts pass through the openings and are disposed on the reinforcing plate 37. In this way, the integrated lens 333 and the image sensor chip 32 have the same mounting reference plane (that is, the top surface of the reinforcing plate 37). In this way, under the design requirements of meeting the preset optical back focus, the overall height dimension of the camera module 30 is reduced.

[0541] It is worth mentioning that in this specific example of the application, the integrated lens 333 may further include the color filter unit 331, that is, in this specific implementation, the optical lens 332, the base 35, and the color filter unit 331 have an integrated structure, that is, the optical lens 332, the base 35, and the color filter unit 331 have been assembled into an integral body before participating in the assembly of the camera module 30. In this way, the assembly method of the camera module 30 can be made more compact, so that the overall height dimension of the camera module 30 is reduced.

[0542] Figure 37 Another specific example of the camera module 30 according to the present invention is illustrated. As Figure 37As shown, in this specific example, the camera module 30 includes an optical lens 332, a base 35, a color filter element 331, an image sensor chip 32, and a circuit board 31. Among them, the image sensor chip 32 is conductively disposed on the circuit board 31, the base 35 is disposed on the circuit board 31, and the lens and the color filter element 331 are sequentially disposed on the light sensing path of the image sensor chip 32. Among them, the base 35 is used to support the color filter element 331. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, it then reaches the image sensor chip 32 to be sensed by the image sensor chip 32 for an imaging reaction.

[0543] Further, the camera module 30 further includes a set of leads 34. Among them, after the image sensor chip 32 is attached to the circuit board, the electrical connection between the image sensor chip 32 and the circuit board 31 is achieved through the leads 34. Specifically, each lead 34 extends bendably between the image sensor chip 32 and the circuit board 31 to connect the image sensor chip 32 to the circuit board 31 through the leads 34. Thus, the circuit board 31 can supply power to the image sensor chip 32 according to the leads 34, and the image sensor chip 32 can transmit the collected signals out according to the leads 34.

[0544] It is worth mentioning that in this specific example, the type of the leads 34 is not limited by this application. For example, the leads 34 can be gold wires, silver wires, or copper wires. And the leads 34 can be installed between the circuit board 31 and the image sensor chip 32 through the process of "wire bonding" to achieve the electrical connection between the two.

[0545] Specifically, the "gold wire bonding" process is generally divided into two types: the "positive gold wire bonding" process and the "negative gold wire bonding" process. The "positive gold wire bonding" process means that during the process of laying the lead 34, one end of the lead 34 is first formed on the conductive end of the circuit board 31, and then the lead 34 is bent and extended, and finally the other end of the lead 34 is formed on the conductive end of the photosensitive chip 32. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. The "negative gold wire bonding" process means that during the process of laying the lead 34, one end of the lead 34 is first formed on the conductive end of the photosensitive chip 32, and then the lead 34 is bent and extended, and finally the other end of the lead 34 is formed on the conductive end of the circuit board 31. In this way, the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the height of the lead 34 protruding upward formed by the "negative gold wire bonding" process is less than the height of the lead 34 protruding upward formed by the "positive gold wire bonding" process. Therefore, preferably, in this specific embodiment, the "negative gold wire bonding" process is used to form the lead 34.

[0546] A set of electronic components 312 are also provided on the circuit board 31. Among them, each of the electronic components 312 can be mounted on the edge area of the circuit board 31 (compared with the mounting position of the photosensitive chip 32) at intervals through processes such as SMT (Surface Mount Technology). The electronic components 312 include but are not limited to resistors, capacitors, inductors, etc. It is worth mentioning that the photosensitive chip 32 and each of the electronic components 312 can be located on the same side or opposite sides of the circuit board 31. For example, the photosensitive chip 32 and each of the electronic components 312 can be located on the same side of the circuit board 31, and each of the electronic components 312 is mounted on the edge area of the circuit board 31 at intervals.

[0547] Particularly, as Figure 37 shown, in this specific example, the base 35 is supported on the top surface of the circuit board 31, and the base 35 includes a main body 352 and side walls 353 extending downward along the main body 352. The main body 352 and the side walls 353 define an accommodation cavity 354. When the base 35 is disposed on the circuit board 31, the side walls 353 are supported on the circuit board 31, and the bottom surface of the base 35, the upper surface of the circuit board 31, and the side walls 353 together define the accommodation cavity 354, where the electronic components 312 disposed on the circuit board 31 are accommodated in the accommodation cavity 354. Preferably, the height dimension of the accommodation cavity 354 is less than 0.2 mm, for example, 0.1 mm.

[0548] Further, as Figure 37 shown, in this specific example, the base 35 further has at least one receiving hole 355, and the receiving hole 355 penetrates through the base 35 to communicate the receiving cavity 354 with the external environment. It should be understood that, in this specific embodiment, the height of the receiving cavity 354 is lower than that of the higher-sized electronic components 312, such as capacitors. Therefore, when the base 35 is disposed on the circuit board 31, since the height from the bottom surface of the main body 352 of the base 35 to the top surface of the circuit board 31 is less than that of the higher-sized electronic components 312 such as capacitors, if the receiving hole 355 is not provided, the above-mentioned electronic components 312 cannot be accommodated. That is to say, the function of the receiving hole 355 is to avoid the higher-sized electronic components 312, so that the electronic components 312 can still be accommodated in the base 35 when the height of the base 35 is reduced. In other words, by providing the receiving hole 355 on the base 35, the overall design height of the base 35 can be reduced, so that the overall height dimension of the camera module 30 can be reduced.

[0549] By way of example but not limitation, for example, the height of the capacitor in the electronic component 312 is 0.38 mm, the height of the receiving cavity 354 is 0.1 mm, and the thickness of the main body 352 of the base 35 is set to 0.4 mm, that is, the height of the receiving hole 355 is 0.4 mm. Thus, when the base 35 is disposed on the circuit board 31, the capacitor in the electronic component 312 cannot be completely accommodated in the receiving cavity 354. Correspondingly, the upper end of the capacitor in the electronic component 312 extends into the receiving hole 355 and is accommodated in the receiving hole 355. It should be understood that, in the present invention, the receiving hole 355 should be provided corresponding to the electronic component 312 on the circuit board 31, and the horizontal size of the electronic component 312 determines the size of the receiving hole 355, that is, the electronic component 312 should be ensured to be accommodated in the receiving hole 355.

[0550] Further, as Figure 37As shown, in this specific example, the base 35 further has a light-passing hole 356 formed in the main body 352 of the base 35 and corresponding to the photosensitive chip 32. Wherein, the light-passing hole 356 is used to place the color filter element 331. Correspondingly, the main body 352 of the base 35 further has a cantilever 357 integrally extending from the main body 352 and defining the size of the light-passing hole 356. Wherein, the color filter element 331 is placed on the cantilever 357 and filters the light received by the module. It should be particularly noted that, in this specific example, when the base 35 is disposed on the circuit board 31, and then the color filter element 331 is placed on the cantilever 357 of the main body 352, and at least the upper end of one of the electronic components 312 is received in the accommodating hole 355, it can be observed that the top surface of some of the electronic components 312 is higher than the bottom surface of the color filter element 331.

[0551] It is worth mentioning that, in this specific example, the color filter element 331 can be implemented in different types, including but not limited to that the color filter element 331 can be implemented as an infrared cut-off filter, a full-transmission spectrum filter, and other filters or a combination of multiple filters. Specifically, for example, when the color filter element 331 is implemented as a combination of an infrared cut-off filter and a full-transmission spectrum filter, that is, the infrared cut-off filter and the full-transmission spectrum filter can be switched to selectively be located on the light-sensing path of the photosensitive chip 32. In this way, when using the camera module 30 in an environment with sufficient light such as during the day, the infrared cut-off filter can be switched to the light-sensing path of the photosensitive chip 32 to filter the infrared rays in the light reflected by the object entering the camera module 30 through the infrared cut-off filter. And when using the camera module 30 in an environment with dim light such as at night, the full-transmission spectrum filter can be switched to the light-sensing path of the photosensitive chip 32 to allow the infrared part of the light reflected by the object entering the camera module 30 to transmit light.

[0552] Of course, the color filter element 331 can also be disposed at other positions on the light-sensing path of the photosensitive chip 32. For example, the color filter element 331 is disposed at the bottom of the optical lens 332, the bottom of the optical lens 332, etc. This is not limited by this application.

[0553] Particularly, as Figure 37As shown, in this specific example, the base 35 can be implemented as a conventional plastic bracket, which is pre-formed and attached to the top surface of the circuit board 31; alternatively, the base 35 can be implemented as a molded base, which can be integrally formed by an injection molding process and attached to the top surface of the circuit board 31. However, due to the limitations of the molding process of the base 35, the accommodation hole 355 is provided as a light-passing hole, that is, the accommodation hole 355 communicates with the accommodation cavity 354 and the external environment. It should be conceivable that when assembling the camera module 30, dirt is likely to enter through the accommodation hole 355, causing stains on the photosensitive chip 32.

[0554] Therefore, as Figure 37 shown, in this specific example, the camera module 30 further includes a protection member 38, which extends downward integrally from the main body 352. When the base 35 is disposed on the circuit board 31, the protection member 38 surrounds the photosensitive chip 32. The protection member 38, the main body 352 of the base 35, and the color filter element 331 disposed on the main body 352 form a sealed space to prevent dirt from entering the photosensitive chip 32.

[0555] In a specific implementation, the protection member 38 can be implemented as a part of the main body 352 of the base 35, which extends downward integrally from the main body 352. Wherein, when the base 35 is disposed on the circuit board 31, the protection member 38 surrounds the photosensitive chip 32. The protection member 38, the main body 352 of the base 35, and the color filter element 331 disposed on the main body 352 form a sealed space to prevent dirt from entering the photosensitive chip 32. Or, the protection member 38 and the base 35 are separately provided, as Figure 38 shown. For example, the protection member 38 is attached to the base 35 through processes such as bonding, thereby reducing the molding difficulty of the base 35.

[0556] Preferably, the upper end of the accommodation hole 355 can be sealed again by using a film or potting, etc., on the one hand, to prevent damage to the electronic component 312, and on the other hand, to further enhance the sealing effect to prevent dirt from entering the photosensitive chip 32.

[0557] It is worth mentioning that, in this specific example, the camera module 30 can be implemented as a fixed-focus module or a moving-focus module. Wherein, when the camera module 30 is a moving-focus module, the camera module 30 further includes a driver 36 (by way of example but not limitation, the driving member can be implemented as a motor, etc.) electrically connected to the circuit board 31. The driver 36 is used to controllably drive the lens to move to achieve auto-focus, as Figure 39 shown.

[0558] In particular, as Figure 39 shown, the driver 36 includes at least one positioning post 361 that extends at the lower end of the driver 36, and at least one of the positioning posts 361 is formed at a position of the driver 36 corresponding to at least one of the receiving holes 355, so that when the driver 36 is installed on the base 35, the positioning post is engaged with the receiving hole 355 in a pin insertion manner. In this way, the installation accuracy of the driving member can be improved through the cooperation of the positioning post 361 and the receiving hole 355, and at the same time, the cooperation between the positioning post and the receiving hole 355 can also improve the reliability of the driver 36.

[0559] Figure 40 FIG. illustrates still another specific example of the imaging module 30 according to the present invention, in which, Figure 40 the illustrated imaging module 30 is Figure 37 a variant implementation of the illustrated imaging module 30.

[0560] Specifically, as Figure 40 shown, in this specific example, the protective member 38 is implemented as a protective film that is attached to the upper end of the receiving hole 355 (the top surface of the main body 352), so that when the base 35 is disposed on the circuit board 31, the protective film ensures that the receiving hole 355 and the receiving cavity 354 are a closed space, and thus dirt can also be prevented from entering the photosensitive chip 32, and the protective film can also protect the electronic components 312. For example, the protective film can be implemented as a sticker, or the protective film can be formed at the upper end of the receiving hole 355 through processes such as potting to seal the receiving hole 355.

[0561] Figure 41 FIG. illustrates still another specific example of the imaging module 30 according to the present invention, in which, Figure 41 the illustrated imaging module 30 is Figure 37 a variant implementation of the illustrated imaging module 30.

[0562] Specifically, as Figure 41 shown, in this specific example, the electronic components 312 disposed on the circuit board 31 are disposed on both sides of the circuit board 31, that is, the photosensitive chip 32 is disposed on the circuit board 31, and the electronic components 312 are located on both sides of the photosensitive chip 32. Those skilled in the art should know that in existing imaging modules, most of the electronic components 312 located on the circuit board 31 are disposed around (or on the four sides of) the circuit board 31.

[0563] Furthermore, as Figure 41As shown, in this specific example, the protective member 38 is integrally formed on the main body 352 and extends downward from the main body 352. Preferably, the protective member 38 extends downward from the main body 352 parallel to the side wall 353 to form a receiving cavity 358 between the side wall 353 and the protective member 38, and the receiving hole 355 is formed between the side wall 353 and the protective member 38 and communicates with the receiving cavity 358.

[0564] Specifically, as Figure 41 shown, in this specific example, the electronic component 312 is disposed on the circuit board 31 such that when the base 35 is attached to the top surface of the circuit board 31, the electronic component 312 is received in the receiving cavity 358, and a portion of the electronic component 312 higher than the height of the receiving cavity 358 can be received in the receiving hole 355.

[0565] It should be understood that in this specific example, the positions of the side wall 353 and the protective member 38 should be determined by the layout of the electronic component 312 on the circuit board 31. For example, when the electronic components 312 are arranged in a matrix on both sides of the circuit board 31, the protective member 38 extends downward from the main body 352 parallel to the side wall 353 and is formed between the electronic component 312 and the photosensitive chip 32 to isolate the photosensitive chip 32 and prevent dirt from entering the photosensitive chip 32 through the receiving hole 355.

[0566] It is worth noting that in this specific example, the protective member 38 only needs to be formed between the photosensitive chip 32 and the electronic component 312 respectively to isolate the photosensitive chip 32, that is, the protective member 38 does not need to be provided around the photosensitive chip 32, but only needs to be formed on both sides of the photosensitive chip 32. In other words, in this specific example, the imaging module 30 has an extremely narrow side, where the extremely narrow side is formed on the side of the circuit board 31 where no electronic component 312 is arranged, and the installation positions of the photosensitive chip 32 and the optical lens 332 are both close to the edge of the circuit board 31. Specifically, the extremely narrow side enables the imaging module 30 to be disposed on the edge of a smart phone.

[0567] Figure 42 FIG. shows yet another specific example of the imaging module 30 according to the present invention. As Figure 42As shown, in this specific example, the camera module 30 includes an optical lens 332, a base 35, a color filter element 331, an image sensor chip 32, and a circuit board 31. Among them, the image sensor chip 32 is conductively disposed on the circuit board 31, the base 35 is integrally formed on the circuit board 31 through a molding process, and the optical lens 332 and the color filter element 331 are sequentially disposed on the light sensing path of the image sensor chip 32. Among them, the base 35 is used to support the color filter element 331. In this way, the imaging light passing through the display screen 20 first reaches the optical lens 332, and after being filtered by the color filter element 331, it then reaches the image sensor chip 32 to be sensed by the image sensor chip 32 for imaging reaction.

[0568] Specifically, this specific example is an optimized solution for an existing camera module based on a molding process. Those skilled in the art should know that in an existing camera module based on a molding process, usually, the image sensor chip and electronic components are first mounted on the circuit board, and then a molding base is formed on the circuit board through a molding process. Then, after the filter is mounted on the lens holder, the lens is mounted on the filter assembly so that the lens is held on the light sensing path of the chip, as Figure 42 shown. However, this assembly method of the prior art greatly limits the height of the camera module.

[0569] In detail, although using a molding base to replace the traditional lens holder can reduce the lateral size and height of the camera module, but in the molding process, the mold used needs to avoid electronic components such as capacitors and resistors on the circuit board (especially the size of capacitors is relatively large, and the height of the smallest capacitor currently is also 0.38 mm), and a certain safety distance also needs to be reserved between the mold and various electronic components. Therefore, the height of the molding base is at least greater than 0.4 mm. On the other hand, the filter usually forms a filter assembly with a support member, and then the filter assembly is mounted on the molding base. Since the support member is usually made by an injection molding process, the thickness of the part of the support member used to support the filter is basically required to be greater than 0.15 mm, and the thickness of the filter itself is usually above 0.21 mm. Therefore, the thickness of the filter assembly is at least greater than 0.36 mm.

[0570] That is to say, the distance between the lens and the circuit board 31 is equal to the sum of the height of the molding base and the thickness of the filter assembly (at least greater than 0.76 mm). Due to the limitations of all the above factors, the distance between the lens and the circuit board 31 of the camera module in the prior art cannot be further reduced. That is to say, the height of the camera module in the prior art cannot be further reduced, thus unable to meet the market's demand for the thinness, lightness, and miniaturization of the camera module.

[0571] Correspondingly, as Figure 43As shown, in this specific example, the molding base has a sunken stepped portion for mounting the color filter element 331 thereon. That is to say, compared with the existing camera module based on the molding process, in this specific example, the top surface of the molding base is a non-planar surface, which has a sunken stepped portion. Accordingly, by mounting the color filter element 331 on the sunken stepped portion of the molding base, the color filter element support can be cancelled, and the distance between the color filter element 331 and the circuit board 31 can be reduced, thereby achieving the effect of reducing the height of the module.

[0572] Specifically, as Figure 43 shown, in this specific example, the molding base has a stepped peripheral groove 350, wherein the color filter element 331 of the light-transmitting component 33 is disposed in the stepped peripheral groove 350 of the molding base. In this way, the distance between the optical lens 332 and the circuit board 31 is no longer limited by the thickness of the color filter element 331 itself. That is to say, the distance between the optical lens 332 and the circuit board 31 can be reduced to be less than the sum of the thickness of the color filter element 331 and the height of the molding base, so as to reduce the overall height dimension of the camera module 30.

[0573] Figure 44 The figure illustrates another specific implementation of the photosensitive chip 32B according to the present invention. As Figure 44 shown, in this specific example, the overall height dimension of the camera module 30 is optimized from the perspective of the structure of the photosensitive chip itself. In other words, in this specific implementation, the camera module 30 can be implemented as any one of the camera modules and their variant implementations as Figures 39 to 43 shown.

[0574] Specifically, in this specific example, the camera module 30 uses a quantum dot thin film photosensitive chip 32A to replace the traditional CMOS / CCD photosensitive chip. Compared with the traditional CMOS / CCD photosensitive chip, the quantum dot thin film photosensitive chip 32B has the dual advantages of planar size and height dimension.

[0575] First of all, using the quantum dot thin film photosensitive chip 32B can reduce the size of the photosensitive chip in the Z-axis direction. As Figure 44As shown, the quantum dot thin film photosensitive chip 32B includes a color filter 321B, a top electrode 322B, a quantum dot thin film 323B, a bottom electrode 324B, and a pixel circuit 325B from top to bottom. Among them, the top electrode 322B, the quantum dot thin film 323B, and the bottom electrode 324B form the photosensitive layer of the quantum dot thin film photosensitive chip 32B. The quantum dot thin film 323B is electrically connected to two electrodes, and the current and / or voltage between the two electrodes is related to the intensity of the light received by the quantum dot thin film 323B; the pixel circuit 325B includes a charge storage and reading circuit. In particular, the color filter can be implemented as a Bayer filter or a Mono filter, but this is not limited to the present application.

[0576] During the working process, the light passing through the color filter 321B irradiates on the photosensitive layer. The photosensitive layer generates charges between the top electrode and the bottom electrode under a given bias voltage, so that the voltage accumulates in the charge storage during the integration period. The pixel circuit 325B reads the electrical signal and transmits it to the chip. This electrical signal reflects the signal of the light intensity absorbed by the photosensitive layer during the integration period. This electrical signal is the light intensity generated by the light passing through the color filter 321B. Therefore, this electrical signal can correspond to the light passing through the color filter 321B. That is, if the color filter 321B is red, indicating that only red light can pass through, then the electrical signal generated by the photosensitive layer corresponding to the color filter 321B represents the intensity of red light in the light at that position.

[0577] Compared with the existing CMOS or CCD chips, the quantum dot thin film photosensitive chip 32B has a relatively small thickness dimension.

[0578] Figure 45 Illustrated is another specific schematic diagram of the photosensitive chip 32B of the imaging module 30 according to the present invention, where Figure 45 The illustrated photosensitive chip 32B is Figure 44 A modified implementation of the illustrated photosensitive chip.

[0579] Specifically, as Figure 45 shown, in this specific example, the quantum dot thin film 323B of the photosensitive layer is configured to respond to the light of the selected color or color group. For example, a photosensitive pixel can be formed by combining a photoconductive material and a wavelength-selective absorption material (such as the material forming the color filter 321B array) to achieve the sensitivity to the color. Correspondingly, the quantum dot thin film 323B can be respectively configured to be sensitive to three colors of red (R), green (G), and blue (B). In this way, the color filter 321B in the photosensitive chip can be directly cancelled.

[0580] During the working process, when light passes through the color-sensitive pixel, the color-sensitive pixel will absorb the corresponding light, convert the light intensity of the light of that wavelength or wavelength band into an electrical signal, and transmit it to the chip through the pixel circuit 325B for processing and imaging. The remaining light continues to propagate forward and will not affect the photoelectric conversion of this pixel point. Correspondingly, this technical solution can not only reduce the Z-direction size of the photosensitive chip, but also since there is no color filter 321B to filter the light, the photosensitive chip can receive more light, and the imaging of the photosensitive chip is clearer.

[0581] Furthermore, using the quantum dot thin film photosensitive chip 32B can reduce the size of the photosensitive chip in the XY axis direction. Specifically, since the quantum dot thin film 323B has a high light transmittance, after being configured into a material sensitive to a certain wavelength or wavelength band, the quantum dot thin film 323B can only absorb the corresponding light, while other light will pass through this layer of thin film and continue to propagate forward. Therefore, multiple quantum dot thin films 323B sensitive to a certain wavelength or wavelength band of light can be vertically arranged.

[0582] In other words, the light intensity information of multiple wavelengths or wavelength bands can be obtained simultaneously at the position of one pixel point. For example, arranging three quantum dot thin films 323B of red color-sensitive pixels, green color-sensitive pixels, and blue color-sensitive pixels vertically. When light passes through the red color-sensitive pixel, the red light is absorbed and converted into an electrical signal, and the remaining light continues to propagate forward. After passing through the green color-sensitive pixel, the green light is absorbed and converted into an electrical signal, and the remaining light continues to propagate forward. When it reaches the blue color-sensitive pixel, the blue light is also absorbed and converted into an electrical signal. Therefore, the light intensity information of multiple wavelengths or wavelength bands of light can be obtained simultaneously at a point the size of one pixel point.

[0583] It is worth mentioning that the three colors RGB introduced in this specific example of the present application are not restrictive. Each layer of quantum dot thin film 323B can absorb and convert any kind of light required, as long as the quantum dot thin film 323B is configured to be sensitive to the required light.

[0584] Moreover, in this specific example, since the traditional color filter 321B is not used, not only can a stronger light intensity be obtained, but also a higher resolution can be obtained for a photosensitive chip of the same specification. In other words, at the same resolution, the method adopted in this solution can reduce the size of the photosensitive chip in the XY direction, thereby further reducing the planar size of the imaging module 30.

[0585] Moreover, the quantum dot thin film 323B in the quantum dot thin film 323B chip involved in the present application can be prepared by the following process.

[0586] In one forming method, the quantum dot material can be processed by melt pool casting to form the quantum dot thin film 323B. Melt pool casting can include depositing the measured quantum dot material onto a substrate and allowing the solution to evaporate, and the resulting film may or may not crack.

[0587] In one forming method, the quantum dot material can be processed by electrodeposition to form the quantum dot thin film 323B.

[0588] In one forming method, the quantum dot material can be processed by vapor deposition to form the quantum dot thin film 323B.

[0589] In one forming method, the quantum dot material can be processed by spray gun spraying to form the quantum dot thin film 323B. Spray gun spraying can include gas treatment. Spray gun spraying may include entrainment in a solvent.

[0590] In one forming method, the quantum dot material can be processed by growth from a solution to form the quantum dot thin film 323B. Growth of the film from the solution can include cross-linking. The cross-linking agent can be attached to at least a portion of the substrate to cross-link the quantum dots. When the substrate with the attached cross-linking agent is immersed in the quantum dot solution, the quantum dots can become cross-linked and grow at the positions where the cross-linking agent is attached to the substrate, and the growth process can be similar to the process of seed growth. Since the growth occurs at the positions where the cross-linking agent has been attached, patterning of the film on the substrate can be achieved by depositing the cross-linking agent along a patterned substrate.

[0591] In one forming method, the quantum dot material can be processed by a hydrophobic system to form a film. The hydrophobic system can enable deposition of a single layer of the quantum dot thin film 323B, and the single layer of the quantum dot thin film 323B can be deposited in a pattern.

[0592] In one forming method, the quantum dot material can be processed by acceleration or evaporation under gas phase to form the quantum dot thin film 323B.

[0593] In one forming method, the quantum dot material can be processed by a photocopying method to form the quantum dot thin film 323B.

[0594] In one forming method, the quantum dot material can be processed by an inkjet printing method to form the quantum dot thin film 323B.

[0595] In summary, the camera module 30 disposed below the display screen can adopt but is not limited to the above-listed technical solutions and their variant implementations, so that the size of the camera module 30 in its height direction can be reduced to meet the requirements of the thinness of the smart phone.

[0596] Reference Appendix Figure 46 Shows a specific schematic diagram of the photosensitive layer of the above-mentioned photosensitive chip 32B. The photosensitive layer includes the top electrode 322B, the quantum dot film 323B, and the bottom electrode 324B.

[0597] In this example, the top electrode 322B and the bottom electrode 324B of the photosensitive layer are arranged horizontally to reduce the influence on light propagation.

[0598] Specifically, the photosensitive layer further includes a nanocrystal film 326B and a substrate 327B, where the nanocrystal film 326B is located above the top electrode 322B and the bottom electrode 324B, the nanocrystal film 326B is a transparent material, and the substrate 327B is located at the lowest end of the photosensitive layer.

[0599] The top electrode 322B and the bottom electrode 324B are located between the nanocrystal film 326B and the substrate 327B, and at least a part of the nanocrystal film 326B extends to the substrate 327B.

[0600] The entire photosensitive layer can be a horizontally stacked structure. The top electrode 322B of the photosensitive layer is located between the nanocrystal film 326B and the substrate 327B. The bottom electrode 324B of the photosensitive layer is located between the nanocrystal film 326B and the substrate 327B. The bottom electrode 324B and the top electrode 322B are respectively supported by the substrate 327B. The top electrode 322B and the bottom electrode 324B do not overlap in the height direction. The top electrode 322B and the bottom electrode 324B are horizontally arranged between the nanocrystal film 326B and the substrate 327B. The substrate 327B can be a glass substrate 327B. The top electrode 322B can be a metal contact. The bottom electrode 324B can be a metal contact.

[0601] The quantum dot film 323B covers the top of the substrate 327B and the bottom electrode 324B is located on the top of the quantum dot film 323B.

[0602] Reference Appendix Figure 47 Shows a specific schematic diagram of the photosensitive layer of the above-mentioned photosensitive chip 32B. The photosensitive layer includes the top electrode 322B, the quantum dot film 323B, and the bottom electrode 324B.

[0603] The top electrode 322B and the bottom electrode 324B overlap at least partially in the height direction.

[0604] In this example, the top electrode 322B is located at the top of the photosensitive layer, and the bottom electrode 324B is located below the top electrode 322B.

[0605] The photosensitive layer further includes a nanocrystal film 326B and a substrate 327B, where the nanocrystal film 326B is located between the top electrode 322B and the bottom electrode 324B, and the substrate 327B is located below the bottom electrode 324B.

[0606] The top electrode 322B is made of a transparent material to reduce the impact on the passage of light through the top electrode 322B.

[0607] Further, the quantum dot thin film 323B is located between the substrate 327B and the bottom electrode 324B.

[0608] Refer to the attached Figure 48A to the attached Figure 51C As shown, an assembly method of the camera module 30 according to the present invention and the display screen 20 with the light passing hole 200 is illustrated. It can be understood that the display screen 20 may also be provided with the light guide channel 500 and / or the light passing hole 200. Here, the light passing hole 200 penetrating in the height direction is taken as an example for illustration.

[0609] The present invention provides an assembly system 60, where the assembly system 60 includes a clamping device 61, a testing unit 62, and a support platform 63. The clamping device 61 is located above the support platform 63 and is used to clamp the camera module 30, and the display screen 20 is supported on the support platform 63.

[0610] The clamping device 61 can clamp the camera module 30 to drive the movement of the camera module 30, so as to change the relative position between the camera module 30 and the display screen 20 supported on the support platform 63, so as to obtain the imaging effect of the camera module 30 at various positions of the camera module 30 and the display screen 20 through the testing unit 62, and further determine the installation position of the camera module 30 and the display screen 20.

[0611] The assembly system 60 further includes a feeding unit 64. After the relative positions of the camera module 30 and the display screen 20 are determined based on the testing unit 62, the feeding unit 64 can feed the camera module 30 and / or the display screen 20, so that the camera module 30 and the display screen 20 can be fixed at a confirmed suitable installation position.

[0612] Further, the test unit 62 includes a light source 621, a reticle 622, and a sensing device 623. The light source 621 is disposed near an incident light position of the imaging module 30. The reticle 622 may be located in front of the light source 621, that is, the light source 621 is located between the reticle 622 and the imaging module 30. The reticle 622 may also be located behind the light source 621, that is, the reticle 622 is located between the light source 621 and the imaging module 30. The light source 621 may also be located on the reticle 622, and can provide uniform light to the reticle 622.

[0613] When the light source 621 emits light during operation, the sensing device 623 obtains a real-time working image of the reticle 622 from the imaging module 30, and adjusts the position of the imaging module 30 based on the working image until the imaging effect of the imaging module 30 reaches the expectation.

[0614] Specifically, the assembly method of the display screen 20 may be as follows: First, adjust the distance between the imaging module 30 and the display screen 20 to a suitable value, and then adjust the optical axis of the imaging module 30 and the center of the light passing hole 200 of the display screen 20 to make them coincide. Among them, the latter adjustment may be:

[0615] When the imaging module 30 is located at a position relative to the display screen 20, the sensing device 623 can sense the position suitability of the two, especially the coincidence of the optical axes. Then, taking one of them as a reference (such as taking the display screen 20 as a reference), calculate the relative adjustment amount of the other (the adjustment amount of the imaging module 30 relative to the display screen 20), and make corresponding adjustments according to the adjustment amount. After the adjustment, calculate the optical axis situation of the two again. If the detection result meets the expectation, assemble the module at this position; otherwise, continue to adjust until the positions of the two reach the best state, that is, the imaging of the imaging module 30 has the best state, and at the same time, the assembly of the imaging module 30 and the display screen 20 does not affect the installation and operation of other components. Of course, the adjustment of the position of the imaging module 30 relative to the display screen 20 is also adjusted within the range where the imaging module 30 can be installed.

[0616] Further, in this example, the imaging module 30 is located above the display screen 20, and the imaging module 30 is located above the support platform 63. The light source 621 and the reticle 622 are located below the display screen 20. In other words, the display screen 20 is supported on the support platform 63 with its back side facing up. The imaging module 30 is installed on the back side of the display screen 20 in subsequent steps.

[0617] The clamping device 61 and the feeding unit 64 operate above the support platform 63 so that the relative positions of the camera module 30 and the display screen 20 can be observed in a timely manner above the support platform 63, facilitating operation, especially in the case of manual operation. Of course, those skilled in the art can understand that the assembly process of the camera module 30 and the display screen 20 can be completed with the aid of a complete set of automated equipment.

[0618] In some other embodiments of the present invention, the camera module 30 is located below the display screen 20, the light source 621 and the reticle 622 are located above the display screen 20, and the camera module 30 receives light from top to bottom for photoelectric conversion. At this time, if it is necessary to observe the relative positions of the camera module 30 and the display screen 20, then it is necessary to observe from below the support platform 63.

[0619] Further, preferably, the display screen 20 is in a horizontal position. Based on the different orientations of the back side of the display screen 20, the camera module 30 can be located above or below the display screen 20.

[0620] Of course, it can be understood that the display screen 20 can be in an inclined position. For example, the support platform 63 is inclined, and the position of the camera module 30 relative to the position of the display screen 20 can be adjusted by the clamping device 61. The display screen 20 can also be in a vertical position. For example, the support platform 63 is in a vertical position, and the camera module 30 and the display screen 20 are relatively adjusted in the vertical position respectively.

[0621] Further, the support platform 63 has an installation space 630, where the installation space 630 is located in the support platform 63, and the display screen 20 can be fixedly accommodated in the installation space 630.

[0622] The support platform 63 has a test hole 6300, where the installation space 630 is communicated with the test hole 6300. When the display screen 20 is fixed in the installation space 630, the test hole 6300 corresponds to the light passing hole 200 of the display screen 20, so that light can enter the light passing hole 200 of the display screen 20 through the test hole 6300, and then reach the camera module 30 through the light passing hole 200.

[0623] The test hole 6300 penetrates the support platform 63 so that light on one side of the support platform 63 can reach the other side of the support platform 63 through the test hole 6300.

[0624] The test hole 6300 can be set into a certain shape according to the needs of the test. For example, in this example, the shape of the test hole 6300 is conical. The closer to the display screen 20, the smaller the inner diameter of the test hole 6300, and the farther from the display screen 20, the larger the inner diameter of the test hole 6300.

[0625] The test hole 6300 can play a role in converging light.

[0626] The support platform 63 includes a platform main body 631 and a fixing component 632. The fixing component 632 is arranged on the platform main body 631, and the fixing component 632 is used to fix the display screen 20.

[0627] In this example, the fixing component 632 is integrally formed on the platform main body 631. The installation space 630 is formed in the platform main body 631. The fixing component 632 is arranged on the platform main body 631 and is accommodated in the installation space 630.

[0628] The display screen 20 can be installed on the fixing component 632. With the assistance of the fixing component 632, the relative positions of the display screen 20 and the platform main body 631 are fixed. Thus, only by adjusting the position of the camera module 30 can the relative positions of the display screen 20 and the camera module 30 be adjusted until a position with a better imaging effect of the camera module 30 relative to the display screen 20 is found.

[0629] In some other embodiments of the present invention, the fixing component 632 is detachably installed on the platform main body 631. The size of the fixing component 632 can be adjusted according to the size of the display screen 20. For example, if the installation space 630 provides an area of 7 inches, then the fixing component 632 can provide an area of about 6 inches for installing the display screen 20. If it is necessary to assemble the 5 - inch display screen 20, the fixing component 632 can be replaced with a fixing component 632 that can provide an area of about 5 inches to adapt to the adjustment of the size of the display screen 20.

[0630] Furthermore, in some other embodiments of the present invention, the clamping device 61 clamps the camera module 30 and the display screen 20 respectively, and then finds a suitable assembly position by changing the relative positions of the camera module 30 and the display screen 20.

[0631] In some other embodiments of the present invention, the support platform 63 supports the imaging module 30, the clamping device 61 clamps the display screen 20, and then the clamping device 61 drives the display screen 20 to move to change the position of the display screen 20, so as to change the relative position between the imaging module 30 and the display screen 20 on the premise of keeping the imaging module 30 fixed until a satisfactory imaging effect is obtained.

[0632] Further, in this example, the assembly system 60 includes a limiting mechanism 65, wherein the limiting mechanism 65 is arranged on the display screen 20 and is near the position of the light passing hole 200 of the display screen 20.

[0633] The limiting mechanism 65 is used to limit the position of the imaging module 30 to improve the alignment accuracy between the imaging module 30 and the display screen 20.

[0634] Specifically, when the relative position between the imaging module 30 and the display screen 20 is changed to test the imaging effect, the limiting mechanism 65 can play a role in limiting the change of the position of the imaging module 30, so that the position adjustment of the imaging module 30 is controlled within a certain range, avoiding too large a single position adjustment amplitude of the imaging module 30, which is beneficial to improving the alignment accuracy between the imaging module 30 and the display screen 20.

[0635] The limiting mechanism 65 is arranged on the back side of the display screen 20 and is aligned with the light passing hole 200 of the display screen 20, so that after the imaging module 30 is installed on the limiting mechanism 65, the imaging module 30 can be aligned with the light passing hole 200 of the display screen 20.

[0636] Then the imaging module 30 is installed on the limiting mechanism 65. The imaging module 30 installed on the limiting mechanism 65 is aligned with the light passing hole 200 of the display screen 20 and the relative position between the imaging module 30 and the limiting mechanism 65 can be finely adjusted.

[0637] Then an image of the imaging of the imaging module 30 is obtained through the testing device, and the imaging module 30 and the limiting mechanism 65 are adjusted based on the imaging effect of the imaging module 30, so as to change the relative position between the imaging module 30 and the display screen 20. The adjustment space provided by the limiting mechanism 65 is limited, and the relative position adjustment between the imaging module 30 and the display screen 20 can only be adjusted within a small range, so that the position of the imaging module 30 will not deviate greatly during this adjustment process, which is beneficial to improving the alignment accuracy between the imaging module 30 and the display screen 20.

[0638] After determining the relative position between the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, the relative position between the camera module 30 and the limiting mechanism 65 is fixed, thereby fixing the relative position between the camera module 30 and the display screen 20. The camera module 30 is assembled to the display screen 20, and the camera module 30 can obtain sufficient light through the light passing hole 200 of the display screen 20 and obtain an expected imaging effect.

[0639] Further, in some other embodiments of the present invention, the limiting mechanism 65 is provided on the camera module 30. Specifically, first, the limiting mechanism 65 and the camera module 30 are installed with each other, and then the limiting mechanism 65 is fixed to the display screen 20, and the camera module 30 located on the limiting mechanism 65 can correspond to the light passing hole 200 of the display screen 20.

[0640] The limiting mechanism 65 provides a certain adjustment space for the camera module 30 installed on the limiting mechanism 65.

[0641] After the limiting mechanism 65 is installed on the display screen 20, the relative position between the camera module 30 and the limiting mechanism 65 can be adjusted based on the imaging effect of the camera module 30, so as to confirm the relative position between the camera module 30 and the display screen 20.

[0642] It is worth mentioning that when the limiting mechanism 65 is installed on the display screen 20, the camera module 30 has already been installed on the limiting mechanism 65. Therefore, the relative position between the limiting mechanism 65 and the display screen can be determined based on the imaging effect of the camera module 30, and then the limiting mechanism 65 is positioned on the display screen 20. The fixing method between the limiting mechanism 65 and the display screen 20 can adopt a gluing or welding method.

[0643] In other words, before the camera module 30 is installed on the display screen 20, the limiting mechanism 65 can be installed on the camera module 30 or the display screen 20 first. Then, based on the imaging effect of the camera module 30, the relative position between the camera module 30 and the limiting mechanism 65 is adjusted within the adjustable range of the limiting mechanism 65, so as to adjust the relative position between the camera module 30 and the display screen 20.

[0644] Further, the limiting mechanism 65 has a limiting channel 650, and at least a part of the lens assembly of the camera module 30 can be accommodated in the limiting channel 650.

[0645] When the limiting mechanism 65 is located at the display screen 20, the limiting channel 650 of the limiting mechanism 65 is aligned with the light passing hole 200 of the display screen 20.

[0646] The limiting mechanism 65 and the camera module 30 cooperate with each other so that when the camera module 30 is installed on the limiting mechanism 65, the limiting mechanism 65 can limit the camera module 30, and at the same time, the camera module 30 can make adjustments within a certain range in the limiting channel 650 provided by the limiting mechanism 65 to change the relative position between the camera module 30 and the display screen 20.

[0647] Specifically, the limiting mechanism 65 may include a sleeve 651 and a limiting component 652, wherein the sleeve 651 surrounds to form the limiting channel 650. The limiting component 652 includes a first limiting member 6521 and a second limiting member 6522, wherein the first limiting member 6521 is disposed on the inner wall of the sleeve 651, and the second limiting member 6522 is disposed on the outer wall of the lens assembly of the camera module 30.

[0648] When the camera module 30 is installed on the limiting mechanism 65, the first limiting member 6521 and the second limiting member 6522 cooperate with each other to limit the position of the camera module 30.

[0649] The first limiting member 6521 may be a directional groove, and the second limiting member 6522 may be a protrusion. When the camera module 30 is installed on the limiting mechanism 65, the second limiting member 6522 extends into the first limiting member 6521.

[0650] The first limiting member 6521 may be a protrusion, and the second limiting member 6522 may be a groove. When the camera module 30 is installed on the limiting mechanism 65, the first limiting member 6521 extends into the second limiting member 6522.

[0651] It should be noted that when the camera module 30 is installed on the limiting mechanism 65, the first limiting member 6521 and the second limiting member 6522 are not completely fixedly engaged, and there is still a certain amount of movable space between the first limiting member 6521 and the second limiting member 6522, so that while the camera module 30 is limited by the limiting component 652, its position relative to the sleeve 651 can be further adjusted.

[0652] Further, the inner wall of the sleeve 651 may be provided with a threaded structure, and at least part of the outer wall of the upper part of the camera module 30, that is, the outer wall of the lens barrel of the lens assembly, may be provided with a threaded structure.

[0653] When the camera module 30 is installed on the limiting mechanism 65, not only can the relative positions of the camera module 30 and the limiting mechanism 65 be adjusted, especially the center of the axis of the camera module 30 and the center of the light passing hole 200 of the display screen 20, but also the distance between the camera module 30 and the display screen 20 can be adjusted.

[0654] Of course, it can be understood that if the limiting mechanism 65 needs to be installed on the display screen 20, the distance between the camera module 30 and the display screen 20 can be adjusted by controlling the distance between the limiting mechanism 65 and the display screen 20 during the installation of the limiting mechanism 65 on the display screen 20.

[0655] Preferably, the center of the sleeve 651 of the limiting mechanism 65 is aligned with the center of the light passing hole 200 of the display screen 20. Further preferably, the center of the sleeve 651 of the limiting mechanism 65 is aligned with the center of the test hole 6300 of the test platform 63.

[0656] Reference attached Figures 51A to 51C As shown, a specific embodiment of the limiting mechanism 65 according to the present invention is schematically shown. In this example, the limiting mechanism 65 needs to be installed on the display screen 20. That is to say, originally the limiting mechanism 65 and the display screen 20 are independent of each other.

[0657] The assembly method of the camera module 30 includes the following steps: installing the limiting mechanism 65 on the display screen 20, installing the camera module 30 on the limiting mechanism 65, adjusting the position of the camera module 30 relative to the limiting mechanism 65 so as to achieve the purpose of adjusting the position of the camera module 30 relative to the display screen 20, confirming the relative positions of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the camera module 30 and the display screen 20 at the adjusted positions by fixing the camera module 30 to the limiting mechanism 65.

[0658] It should be noted that the limiting mechanism 65 can be installed on the display screen 20 by aligning the limiting mechanism 65 with the light passing hole 200 of the display screen 20.

[0659] It can be understood that during the installation of the limiting mechanism 65 on the display screen 20, the limiting mechanism 65 can be fixed to the display screen 20 based on the alignment degree between the limiting channel 650 of the limiting mechanism 65 and the light passing hole 200 of the display screen 20. In this way, during subsequent adjustment, the relative position between the camera module 30 and the display screen 20 only needs to adjust the relative position between the camera module 30 and the limiting mechanism 65.

[0660] The assembly method of the camera module 30 can also be implemented as the following steps: install the camera module 30 on the limiting mechanism 65, install the limiting mechanism 65 on the display screen 20, adjust the position of the camera module 30 relative to the limiting mechanism 65 so as to adjust the position of the camera module 30 relative to the display screen 20, confirm the relative position between the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fix the adjusted position of the camera module 30 and the display screen 20 by fixing the camera module 30 to the limiting mechanism 65.

[0661] It can be understood that during the installation of the limiting mechanism 65 on the display screen 20, the limiting mechanism 65 can be installed on the display screen 20 based on the imaging effect of the camera module 30.

[0662] The assembly method of the camera module 30 can also be implemented as the following steps: adjust the relative position between the camera module 30 and the display screen 20 to a relatively satisfactory position, where the limiting mechanism 65 is installed on the display screen 20, and then adjust the relative position between the camera module 30 and the limiting mechanism 65 within the adjustable range of the limiting mechanism 65 for the camera module 30, so as to adjust the relative position between the camera module 30 and the display screen 20 mechanism.

[0663] It can be understood that after installing the camera module 30 on the limiting mechanism 65, the limiting mechanism 65 can be fixed to the display screen 20 so that the camera module 30 can be adjusted within a relatively small range through the limiting mechanism 65 to improve the adjustment accuracy of the camera module 30 and the limiting mechanism 65. It can also be that after installing the camera module 30 on the limiting mechanism 65, the limiting mechanism 65 is not fixed to the display screen 20 temporarily, and the relative position between the camera module 30 and the display screen 20 is continuously changed until a relatively satisfactory imaging effect is obtained, and then the limiting mechanism 65 is fixed to the display screen 20.

[0664] Further, in this example, the back side of the display screen 20 is implemented as a planar structure, that is, the back plate of the display screen 20 is a planar structure, and the limiting mechanism 65 is installed on the back plate of the display screen 20. When the relative position between the limiting mechanism 65 and the display screen 20 needs to be adjusted, the limiting mechanism 65 freely adjusts its position on the display screen 20 until the limiting channel 650 of the limiting mechanism 65 is aligned with the light passing hole 200 of the display screen 20, or the imaging module 30 installed on the limiting mechanism 65 obtains an expected imaging effect.

[0665] Of course, it can be understood that the relative position between the imaging module 30 and the display screen 20 can also be directly adjusted. When the relative position between the imaging module 30 and the display screen 20 is determined, the imaging module 30 can be directly fixed to the display screen 20 by means of gluing or welding, etc., and the positions of both are maintained at the adjusted positions.

[0666] Furthermore, after the relative position between the limiting mechanism 65 and the imaging module 30 is confirmed based on the imaging effect of the imaging module 30, the limiting mechanism 65 and the imaging module 30 can be fixed by means of gluing or welding, etc.

[0667] For example, when the imaging module 30 is installed on the limiting mechanism 65, when adjusting the relative position between the imaging module 30 and the limiting mechanism 65, there is a gap in the limiting channel 650 of the limiting mechanism 65 for fine adjustment between the imaging module 30 and the limiting mechanism 65.

[0668] After the relative position between the imaging module 30 and the limiting mechanism 65 is confirmed, the space in the limiting channel 650 of the limiting mechanism 65 that is not occupied by the imaging module 30 can be filled with colloid to fix the relative position between the imaging module 30 and the limiting mechanism 65.

[0669] For example, when the imaging module 30 is installed on the limiting mechanism 65, when adjusting the relative position between the imaging module 30 and the limiting mechanism 65, there is a gap in the limiting channel 650 of the limiting mechanism 65 for fine adjustment between the imaging module 30 and the limiting mechanism 65.

[0670] After the relative position between the imaging module 30 and the limiting mechanism 65 is confirmed, an insert piece can be inserted between the imaging module 30 and the sleeve 651 of the limiting mechanism 65 to fix the relative position between the imaging module 30 and the limiting mechanism 65. The insert piece restricts the displacement of the imaging module 30 relative to the limiting mechanism 65.

[0671] For example, when the camera module 30 is installed on the limiting mechanism 65, when adjusting the relative position between the camera module 30 and the limiting mechanism 65, there is a gap in the limiting channel 650 of the limiting mechanism 65 for fine-tuning between the camera module 30 and the limiting mechanism 65.

[0672] After the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, a solder pad can be provided on the outer side of the lens barrel of the camera module 30 or on the inner wall of the sleeve 651 of the limiting mechanism 65, and then the camera module 30 and the limiting mechanism 65 are fixed by welding.

[0673] It can be understood that the colloid used to fix the camera module 30 and the limiting mechanism 65 can be a thermoplastic fluid. When the thermoplastic fluid fills the gap between the camera module 30 and the limiting mechanism 65, the thermoplastic fluid between the camera module 30 and the limiting mechanism 65 can be cured by heating.

[0674] Furthermore, the sleeve 651 of the limiting mechanism 65 is made of a light-tight material to reduce the influence of external light on the camera module 30 located in the limiting channel 650 of the limiting mechanism 65. Especially when the display screen 20 is an LCD display screen 20, the backplane layer 27 can emit light actively, and the light-tight limiting mechanism 65 can reduce the influence of the emitting backplane layer 27 on the camera module 30.

[0675] Refer to the attached Figure 52 As shown, a specific implementation manner of the limiting mechanism 65 according to the present invention is schematically shown. In this example, the limiting mechanism 65 further includes a connecting portion 653, and the connecting portion 653 is used to connect the sleeve 651 to the display screen 20.

[0676] Specifically, the sleeve 651 has a free end 6511 and a connecting end 6512, where the free end 6511 and the connecting end 6512 are located at both ends respectively, and the connecting portion 653 is located at the connecting end 6512 of the sleeve 651.

[0677] The connecting portion 653 can be set to extend outward from the connecting end 6512 of the sleeve 651. When the limiting mechanism 65 and the display screen 20 are installed, the connecting portion 653 of the limiting mechanism 65 can be connected to the display screen 20. At the same time, the connecting portion 653 increases the area size of the limiting mechanism 65 available for connection to the display screen 20, which is beneficial to the stable connection between the limiting mechanism 65 and the display screen 20, and thus beneficial to stably installing the camera module 30 on the display screen 20 through the limiting mechanism 65.

[0678] Reference attached Figure 53 As shown, a specific embodiment of the limiting mechanism 65 according to the present invention is schematically shown. In this example, the relative positions of the limiting mechanism 65 and the display screen 20 are fixed in advance, and only the relative positions of the camera module 30 and the limiting mechanism 65 need to be adjusted.

[0679] The limiting mechanism 65 is combined with the display screen 20 to be beneficial to enhancing the bonding strength between the limiting mechanism 65 and the display screen 20.

[0680] In this example, the limiting mechanism 65 is fitted into the display screen 20.

[0681] For example, when the display screen 20 is an OLED display screen 20, the display screen 20 includes the cover layer 21, the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the backplane layer 27. Reference can be made to the foregoing drawings here. The back side of the display screen 20 is a planar structure, that is to say, the backplane layer 27 is a planar structure, and the display screen 20 has the light through hole 200 penetrating at least part of the display screen. For example, the light through hole 200 penetrates through other layers except the cover layer 21 in the height direction. Of course, the light through hole 200 can also completely penetrate through the layers of the display screen 20 in the height direction.

[0682] At least part of the limiting mechanism 65 is fitted into the driving circuit layer 26 and the backplane layer 27.

[0683] The limiting mechanism 65 further includes at least one connecting leg 654, where the connecting leg 654 extends from the connecting end 6512 of the sleeve 651 along the length direction of the sleeve 651. Preferably, the number of the connecting legs 654 can be multiple.

[0684] The display screen 20 has at least one fitting channel 203, wherein the fitting channel 203 is located around the light-transmitting hole 200 of the display screen 20, and the fitting channel 203 matches the connecting pin 654 of the limiting mechanism 65.

[0685] The fitting channel 203 extends from the backplane layer 27 to the driving circuit layer 26. Preferably, the fitting channel 203 is arranged to avoid the circuit structure of the driving circuit layer 26 so as to reduce the influence on the working efficiency of the display screen 20.

[0686] When the limiting mechanism 65 is installed on the display screen 20, the connecting pin 654 of the limiting mechanism 65 extends into the fitting channel 203 of the display screen 20. It can be that the connecting pin 654 is fitted in the fitting channel 203. It can also be that the fitting channel 203 is slightly larger than the connecting pin 654. After the connecting pin 654 extends into the fitting channel 203, there is still a gap in the fitting channel 203. At this time, a colloid can be filled inward so that the connecting pin 654 of the limiting mechanism 65 can be fixed in the fitting channel 203 of the display screen 20, thereby facilitating the stable installation of the limiting mechanism 65 on the display screen 20.

[0687] Furthermore, the fitting channel 203 can be formed in the backplane layer 27 and the driving circuit layer 26 of the display screen 20 by means of drilling. For example, drilling from the backplane layer 27 of the display screen 20 towards the driving circuit layer 26.

[0688] Those skilled in the art should understand that the formation method of the fitting channel 203 or the position of the fitting channel 203 is not limited to the above examples.

[0689] Furthermore, according to some other embodiments of the present invention, the fitting channel 203 can be formed in the sleeve 651, and the connecting pin 654 is formed on the display screen 20.

[0690] When the limiting mechanism 65 is installed on the display screen 20, the connecting pin 654 located on the display screen 20 extends into the fitting channel 203 of the sleeve 651, thereby facilitating the fixation between the limiting mechanism 65 and the display screen 20.

[0691] The connecting pin 654 can be formed on the display screen 20 by means of deposition, evaporation coating, etc. The connecting pin 654 can be integrally formed on the display screen 20.

[0692] Further, according to some other embodiments of the present invention, the fitting channels 203 may be respectively formed in the sleeve 651 and the display screen 20, and the connecting pins 654 can be respectively fitted into the fitting channels 203 of the sleeve 651 and the display screen 20. For example, one end of the connecting pin 654 extends into the fitting channel 203 of the display screen 20, and then the other end of the connecting pin 654 extends into the fitting channel 203 of the sleeve 651, and the connecting pin 654 and the display screen 20 as well as the connecting pin 654 and the sleeve 651 are respectively fixed, so as to fix the sleeve 651 to the display screen 20.

[0693] Reference is made Figure 54 As shown, another specific embodiment of the limiting mechanism 65 according to the present invention is illustrated.

[0694] In this example, the display screen 20 has an installation channel 201, wherein the installation channel 201 is penetrated through the light transmission hole 200. The light transmission hole 200 penetrates through the layers of the display screen 20 except the cover plate layer 21 in the height direction, and the installation channel 201 is exposed on the back side of the display screen 20.

[0695] The inner diameter of the installation channel 201 is larger than the inner diameter of the light transmission hole 200. At least part of the limiting mechanism 65 can be accommodated in the installation channel 201.

[0696] For example, taking the installation channel 201 formed in the back plate layer 27 of the display screen 20 as an example for illustration.

[0697] The installation channel 201 penetrates through the back plate layer 27 and the inner diameter of the installation channel 201 is larger than the inner diameter of the light transmission hole 200. The installation channel 201 penetrates through the light transmission hole 200 of the back plate layer 27 in the height direction. The light from the outside of the display screen 20 passes through the light transmission hole 200 and the installation channel 201, and then is received by the camera module 30.

[0698] The installation channel 201 has a certain size, and the limiting mechanism 65 has a certain size. The size of the installation channel 201 is larger than the size of the limiting mechanism 65 so that at least part of the limiting mechanism 65 can be accommodated in the installation channel 201.

[0699] In this example, the limiting mechanism 65 needs to be installed on the display screen 20. That is to say, originally the limiting mechanism 65 and the display screen 20 are independent of each other.

[0700] The assembly method of the camera module 30 includes the following steps: installing the limiting mechanism 65 in the installation channel 201 of the display screen 20, installing the camera module 30 on the limiting mechanism 65, adjusting the position of the camera module 30 relative to the limiting mechanism 65 so as to adjust the position of the camera module 30 relative to the display screen 20, confirming the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the camera module 30 and the adjusted position of the display screen 20 by fixing the camera module 30 to the limiting mechanism 65.

[0701] By controlling the size of the installation channel 201 of the display screen 20, a certain limiting effect can be exerted on the limiting mechanism 65, which is beneficial to providing the positioning accuracy of the limiting mechanism 65 and the display screen 20.

[0702] It can be understood that during the process of installing the limiting mechanism 65 in the installation channel 201 of the display screen 20, the limiting mechanism 65 can be fixed to the display screen 20 based on the alignment degree between the limiting channel 650 of the limiting mechanism 65 and the light passing hole 200 of the display screen 20. In this way, during the subsequent adjustment process, the adjustment of the relative position between the camera module 30 and the display screen 20 only needs to adjust the relative position between the camera module 30 and the limiting mechanism 65.

[0703] The assembly method of the camera module 30 can also be implemented as the following steps: installing the camera module 30 on the limiting mechanism 65, installing the limiting mechanism 65 in the installation channel 201 of the display screen 20, adjusting the position of the camera module 30 relative to the limiting mechanism 65 so as to adjust the position of the camera module 30 relative to the display screen 20, confirming the relative position of the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fixing the camera module 30 and the adjusted position of the display screen 20 by fixing the camera module 30 to the limiting mechanism 65.

[0704] By controlling the size of the installation channel 201 of the display screen 20, a certain limiting effect can be exerted on the limiting mechanism 65, which is beneficial to providing the positioning accuracy of the limiting mechanism 65 and the display screen 20.

[0705] It can be understood that during the process of installing the limiting mechanism 65 on the display screen 20, the limiting mechanism 65 can be installed on the display screen 20 based on the imaging effect of the camera module 30.

[0706] The assembly method of the camera module 30 can also be implemented as the following steps: Adjust the relative positions of the camera module 30 and the display screen 20 to a relatively satisfactory position, and install the camera module 30 on the limiting mechanism 65 so that the camera module 30 can be fixed at this position, where the limiting mechanism 65 is installed in the installation channel 201 of the display screen 20. Then, within the adjustment range of the limiting mechanism 65 available for the camera module 30, adjust the relative positions of the camera module 30 and the limiting mechanism 65, so as to adjust the relative positions of the camera module 30 and the display screen 20 mechanism.

[0707] It can be understood that after installing the camera module 30 on the limiting mechanism 65, the limiting mechanism 65 can be fixed to the display screen 20, so that the camera module 30 can be adjusted within a relatively small range through the limiting mechanism 65 to improve the adjustment accuracy of the camera module 30 and the limiting mechanism 65. Alternatively, after installing the camera module 30 on the limiting mechanism 65, the limiting mechanism 65 is not temporarily fixed to the display screen 20, and the relative positions of the camera module 30 and the display screen 20 are continuously changed until a relatively satisfactory imaging effect is obtained, and then the limiting mechanism 65 is fixed to the display screen 20.

[0708] Furthermore, in this example, the back side of the display screen 20 is implemented as a planar structure, that is, the driving circuit layer 26 of the display screen 20 is a planar structure, and the limiting mechanism 65 is installed on the driving circuit layer 26 of the display screen 20. When the relative positions between the limiting mechanism 65 and the display screen 20 need to be adjusted, the adjustment of the position of the limiting mechanism 65 on the display screen 20 is restricted by the installation channel 201 of the display screen 20.

[0709] Of course, it can be understood that the relative positions of the camera module 30 and the display screen 20 can also be directly adjusted. When the relative positions between the camera module 30 and the display screen 20 are determined, the camera module 30 can be directly fixed to the display screen 20 by means of gluing or welding, etc., and the positions of both are maintained at the adjusted positions.

[0710] Furthermore, after the relative positions between the limiting mechanism 65 and the camera module 30 are confirmed based on the imaging effect of the camera module 30, the limiting mechanism 65 and the camera module 30 can be fixed by means of gluing or welding, etc.

[0711] For example, when the camera module 30 is installed on the limiting mechanism 65, when adjusting the relative position between the camera module 30 and the limiting mechanism 65, there is a gap in the limiting channel 650 of the limiting mechanism 65 for fine adjustment between the camera module 30 and the limiting mechanism 65.

[0712] After the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, the space in the limiting channel 650 of the limiting mechanism 65 that is not occupied by the camera module 30 can be filled with a colloid to fix the relative position between the camera module 30 and the limiting mechanism 65.

[0713] For example, when the camera module 30 is installed on the limiting mechanism 65, when adjusting the relative position between the camera module 30 and the limiting mechanism 65, there is a gap in the limiting channel 650 of the limiting mechanism 65 for fine adjustment between the camera module 30 and the limiting mechanism 65.

[0714] After the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, an insert can be inserted between the lens barrel of the camera module 30 and the sleeve 651 of the limiting mechanism 65 to fix the relative position between the camera module 30 and the limiting mechanism 65. The insert restricts the displacement of the camera module 30 relative to the limiting mechanism 65.

[0715] For example, when the camera module 30 is installed on the limiting mechanism 65, when adjusting the relative position between the camera module 30 and the limiting mechanism 65, there is a gap in the limiting channel 650 of the limiting mechanism 65 for fine adjustment between the camera module 30 and the limiting mechanism 65.

[0716] After the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, a solder pad can be provided on the outer side of the lens barrel of the camera module 30 or on the inner wall of the sleeve 651 of the limiting mechanism 65, and then the camera module 30 and the limiting mechanism 65 can be fixed by welding.

[0717] It can be understood that the colloid used to fix the camera module 30 and the limiting mechanism 65 can be a thermoplastic fluid. When the thermoplastic fluid fills the gap between the camera module 30 and the limiting mechanism 65, the thermoplastic fluid between the camera module 30 and the limiting mechanism 65 can be cured by heating.

[0718] Further, the sleeve 651 of the limiting mechanism 65 is made of a light-impermeable material to reduce the influence of external light on the camera module 30 located in the limiting channel 650 of the limiting mechanism 65. In particular, when the display screen 20 is an LCD display screen 20, the backplane layer 27 can emit light actively, and the light-impermeable limiting mechanism 65 can reduce the influence of the light-emitting backplane layer 27 on the camera module 30.

[0719] The limiting mechanism 65 can be fixed to the driving circuit layer 26 by means of adhesion or welding.

[0720] Reference atta Figure 55 As shown in the figure, a specific embodiment of the limiting mechanism 65 according to the present invention is schematically shown. In this example, the limiting mechanism 65 further includes a connecting portion 653 for connecting the sleeve 651 to the display screen 20.

[0721] Specifically, the sleeve 651 has a free end 6511 and a connecting end 6512, where the free end 6511 and the connecting end 6512 are located at both ends respectively, and the connecting portion 653 is located at the connecting end 6512 of the sleeve 651.

[0722] The connecting portion 653 can be set to extend outward from the connecting end 6512 of the sleeve 651. When the limiting mechanism 65 and the display screen 20 are installed, the connecting portion 653 of the limiting mechanism 65 can be connected to the display screen 20. At the same time, the connecting portion 653 increases the area size of the limiting mechanism 65 available for connection to the display screen 20, which is beneficial to the stable connection between the limiting mechanism 65 and the display screen 20, and thus beneficial to stably installing the camera module 30 on the display screen 20 through the limiting mechanism 65.

[0723] More specifically, taking the installation channel 201 formed in the backplane layer 27 as an example, at least the driving circuit layer 26 is exposed. The connecting portion 653 of the limiting mechanism 65 extends horizontally along the surface of the driving circuit layer 26, and the limiting mechanism 65 and the display screen 20 can be fixed by fixing the connecting portion 653 and the driving circuit layer 26 of the display screen 20.

[0724] The installation channel 201 can be designed to be slightly larger to accommodate the connecting portion 653.

[0725] It is worth mentioning that in this way, the height dimensions of the display screen 20 and the camera module 30 can be reduced, which is beneficial to reducing the thickness dimension of the terminal device.

[0726] Reference appendix Figure 56 As shown, a specific implementation of the limiting mechanism 65 according to the present invention is schematically illustrated. In this example, the relative positions of the limiting mechanism 65 and the display screen 20 are fixed in advance, and only the relative positions of the camera module 30 and the limiting mechanism 65 need to be adjusted.

[0727] The limiting mechanism 65 is combined with the display screen 20 to facilitate enhancing the bonding strength between the limiting mechanism 65 and the display screen 20.

[0728] In this example, the display screen 20 has an installation channel 201, where the installation channel 201 penetrates through the light passing hole 200. The light passing hole 200 penetrates through each layer of the display screen 20 in the height direction, and the installation channel 201 is exposed on the back side of the display screen 20.

[0729] The inner diameter of the installation channel 201 is larger than the inner diameter of the light passing hole 200. At least a part of the limiting mechanism 65 can be accommodated in the installation channel 201.

[0730] In this example, the limiting mechanism 65 is fitted into the display screen 20.

[0731] For example, when the display screen 20 is an OLED display screen 20, the display screen 20 includes the cover plate layer 21, the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the backplane layer 27. Taking the installation channel 201 being formed in the backplane layer 27 and at least a part of the driving circuit layer 26 being exposed in the installation channel 201 as an example.

[0732] At least a part of the limiting mechanism 65 passes through the installation channel 201 and is fitted into the driving circuit layer 26.

[0733] The limiting mechanism 65 further includes at least one connecting leg 654, where the connecting leg 654 extends from the connecting end 6512 of the sleeve 651 along the length direction of the sleeve 651. Preferably, the number of the connecting legs 654 can be multiple.

[0734] The display screen 20 has at least one fitting channel 203, where the fitting channel 203 is located around the light passing hole 200 of the display screen 20, and the fitting channel 203 matches the connecting leg 654 of the limiting mechanism 65.

[0735] The chimeric channel 203 extends through the driving circuit layer 26. Preferably, the chimeric channel 203 is arranged to avoid the circuit structure of the driving circuit layer 26, so as to reduce the influence on the working efficiency of the display screen 20.

[0736] Of course, those skilled in the art can understand that the chimeric channel 203 can continue to extend upward from the driving circuit layer 26 to other layers of the display screen 20.

[0737] When the limiting mechanism 65 is installed on the display screen 20, the connecting pin 654 of the limiting mechanism 65 extends into the chimeric channel 203 of the display screen 20. It can be that the connecting pin 654 is fitted into the chimeric channel 203. It can also be that the chimeric channel 203 is slightly larger than the connecting pin 654. After the connecting pin 654 extends into the chimeric channel 203, there is still a gap in the chimeric channel 203. At this time, a colloid can be filled inward so that the connecting pin 654 of the limiting mechanism 65 can be fixed to the chimeric channel 203 of the display screen 20, thereby facilitating the stable installation of the limiting mechanism 65 on the display screen 20.

[0738] Furthermore, when the installation channel 201 of the display screen 20 is slightly larger than the sleeve 651 of the limiting mechanism 65, the limiting mechanism 65 can be fixed to the corresponding part of the display screen 20 of the installation channel 201, such as the backplane layer 27, by filling a colloid or installing inserts or welding in the installation channel 201. In this way, the combination of the limiting mechanism 65 and the display screen 20 can be more firm, which is beneficial to the stable combination between the limiting mechanism 65 and the camera module 30.

[0739] Furthermore, the chimeric channel 203 can be formed in the driving circuit layer 26 of the display screen 20 by means of opening holes. For example, drilling holes from the installation channel 201 to the driving circuit layer 26 of the display screen 20. The chimeric channel 203 can also be formed by means of etching.

[0740] Those skilled in the art should understand that the formation method of the chimeric channel 203 or the position of the chimeric channel 203 is not limited to the above examples.

[0741] Furthermore, according to some other embodiments of the present invention, the chimeric channel 203 can be formed in the sleeve 651, and the connecting pin 654 is formed on the display screen 20.

[0742] When the limiting mechanism 65 is installed on the display screen 20, the connecting pin 654 located on the display screen 20 extends into the fitting channel 203 of the sleeve 651, which is conducive to the fixation between the limiting mechanism 65 and the display screen 20.

[0743] The connecting pin 654 can be formed on the display screen 20 by means such as deposition and evaporation. The connecting pin 654 can be integrally formed with the display screen 20. The connecting pin 654 can be formed on the part of the driving circuit layer 26 of the display screen 20 that is exposed to the installation channel 201.

[0744] Furthermore, according to some other embodiments of the present invention, the fitting channels 203 can be respectively formed on the sleeve 651 and the display screen 20, and the connecting pin 654 can be respectively fitted into the sleeve 651 and the display screen 20. For example, one end of the connecting pin 654 extends into the fitting channel 203 of the display screen 20, and then the other end of the connecting pin 654 extends into the fitting channel 203 of the sleeve 651, respectively fixing the connecting pin 654 and the display screen 20 as well as the connecting pin 654 and the sleeve 651, thereby fixing the sleeve 651 on the display screen 20.

[0745] Refer to the attached Figure 57 As shown, another specific embodiment of the limiting mechanism 65 according to the present invention is illustrated.

[0746] The mobile terminal includes a substrate 70, where the substrate 70 is used to mount the camera module 30, and the camera module 30 is located between the substrate 70 and the display screen 20.

[0747] The position between the substrate 70 and the display screen 20 can be relatively fixed, for example, through the housing 40 of the mobile terminal. The substrate 70 can be installed on the mobile terminal after installing the camera module 30 on the mobile terminal, and then the housing 40 is installed on the mobile terminal. And when installing the camera module 30, the mobile terminal can provide sufficient operating space.

[0748] The limiting mechanism 65 is located on the substrate 70, thereby restricting the relative displacement between the camera module 30 and the substrate 70, and further restricting the relative displacement between the camera module 30 and the display screen 20.

[0749] In this example, the limiting mechanism 65 needs to be installed on the display screen 20. That is to say, originally the limiting mechanism 65 and the substrate 70 are independent of each other.

[0750] The assembly method of the camera module 30 includes the following steps: Install the limiting mechanism 65 on the substrate 70, install the camera module 30 on the limiting mechanism 65, adjust the position of the camera module 30 relative to the limiting mechanism 65 so as to adjust the position of the camera module 30 relative to the display screen 20, confirm the relative position between the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fix the camera module 30 at the adjusted position on the display screen 20 by fixing the camera module 30 to the limiting mechanism 65. It can be understood that during the process of installing the limiting mechanism 65 on the substrate 70, the limiting mechanism 65 can be fixed to the substrate 70 based on the alignment degree between the limiting channel 650 of the limiting mechanism 65 and the light passing hole 200 of the display screen 20. That is, the alignment state between the limiting channel 650 of the limiting mechanism 65 and the light passing hole 200 of the display screen 20 is used to judge the installation position of the limiting mechanism 65 on the substrate 70. In this way, during the subsequent adjustment process, to adjust the relative position between the camera module 30 and the display screen 20, only the relative position between the camera module 30 and the limiting mechanism 65 needs to be adjusted.

[0751] The assembly method of the camera module 30 can also be implemented as the following steps: Install the camera module 30 on the limiting mechanism 65, install the limiting mechanism 65 on the substrate 70, adjust the position of the camera module 30 relative to the limiting mechanism 65 so as to adjust the position of the camera module 30 relative to the display screen 20, confirm the relative position between the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, and fix the camera module 30 and the display screen 20 at the adjusted position by fixing the camera module 30 to the limiting mechanism 65.

[0752] It can be understood that during the process of installing the limiting mechanism 65 on the substrate 70, the limiting mechanism 65 can be installed on the substrate 70 based on the imaging effect of the camera module 30.

[0753] The assembly method of the camera module 30 can also be implemented as the following steps: Adjust the relative position between the camera module 30 and the display screen 20 to a relatively satisfactory position, install the camera module 30 on the limiting mechanism 65 so that the camera module 30 can be fixed at this position, where the limiting mechanism 65 is installed on the substrate 70, and then adjust the relative position between the camera module 30 and the limiting mechanism 65 within the adjustable range of the limiti...

Claims

1. A terminal device, characterized in that, Comprising a terminal device body, a display screen, a camera module and having at least one light passing hole, wherein the display screen is mounted on the terminal device body, the camera module is held below the display screen and is aligned with the light passing hole, wherein the light passing hole passes through at least a part of the display screen in the height direction, and the light outside the display screen is conducted to the camera module below the display screen through the light passing hole, wherein the light passing hole is designed as a virtual diaphragm of the camera module; The display screen has a mounting channel formed in the backplane layer on the bottom side, the mounting channel is communicated with the light passing hole and the mounting channel and the light passing hole are located in the height direction of the display screen, and the inner diameter of the mounting channel is larger than the inner diameter of other positions of the light passing hole; Wherein the display screen includes a pixel layer and a driving circuit layer, the driving circuit layer is formed on the bottom side of the pixel layer, the camera module is mounted on the display screen and part of it is accommodated in the mounting channel or the front end part extends to the corresponding light passing hole part of the driving circuit layer or the pixel layer; Wherein the camera module includes an optical mechanism, the optical mechanism includes an optical lens, the optical lens includes a lens barrel and a plurality of lenses, the lens barrel includes a lens barrel wall and an extension wall, the lenses are mounted on the lens barrel wall, and the extension wall extends upward from one end of the lens barrel wall close to the display screen for a certain distance and the closer to the lens barrel wall, the smaller the inner diameter of the extension wall.

2. The terminal device according to claim 1, wherein the terminal device further includes a housing, and one of the light passing holes penetrates from one side surface of the display screen to the bottom surface of the display screen in the gap between the housing and the display screen.

3. The terminal device according to claim 1 or 2, wherein the camera module includes a photosensitive unit and a diaphragm, wherein the diaphragm is mounted on the optical mechanism, and the optical mechanism is held in the photosensitive path of the photosensitive unit and receives the light passing through the light passing hole.

4. The terminal device according to claim 1 or 2, wherein the camera module includes a photosensitive unit, wherein the optical mechanism is held in the light passing hole and the photosensitive unit is aligned with the light passing hole.

5. The terminal device according to claim 1, wherein the closer to the lens barrel wall, the smaller the outer diameter of the extension wall.

6. The terminal device according to claim 1 or 2, wherein the display screen further comprises a cover plate layer, a touch layer, a polarization layer, and a packaging layer. The cover plate layer, the touch layer, the polarization layer, the packaging layer, the pixel layer, and the driving circuit layer are stacked on top of each other in the height direction. The driving circuit layer is electrically connected to the pixel layer to drive the pixel layer to operate. The packaging layer is formed on the top side of the pixel layer for packaging the pixel layer. The polarization layer is used for polarizing the passing light. The light passing hole penetrates through the touch layer, the polarization layer, the packaging layer, the pixel layer, and the driving circuit layer of the display screen except the cover plate layer in the height direction.

7. The terminal device according to claim 6, wherein the driving circuit layer comprises a substrate and a plurality of TFT structures. The TFT structures are disposed on the substrate, and the light passing hole is located between adjacent TFT structures.

8. The terminal device according to claim 6, wherein the pixel layer comprises a plurality of pixels, and the light passing hole is located between adjacent pixels.

9. The terminal device according to claim 8, wherein the driving circuit layer comprises a substrate and a plurality of TFT structures. The TFT structures are disposed on the substrate, and the light passing hole is located between adjacent TFT structures.

10. The terminal device according to any one of claims 7 to 9, wherein a protective material is provided on the terminal device. The protective material is located in the light passing hole and is coated on the pixel layer and / or the driving circuit layer.

11. The terminal device according to claim 6, wherein the pixel layer comprises an anode layer, a light-emitting layer, a cathode layer, and a protective layer. The anode layer is located above the driving circuit layer. The light-emitting layer is located between the anode layer and the cathode layer. The cathode layer is located above the light-emitting layer and below the protective layer.

12. The terminal device according to claim 11, wherein a protective material is provided on the terminal device. The protective material is located in the light passing hole, and the protective material extends downward from the protective layer to the cathode layer; or the protective material extends downward from the protective layer to the light-emitting layer; or the protective material extends downward from the protective layer to the anode layer.

13. The terminal device according to any one of claims 7 to 9, wherein the terminal device comprises a backplane layer. The backplane layer is located below the driving circuit layer and is used for emitting light. The pixel layer comprises a filter layer and liquid crystal. The liquid crystal is located between the filter layer and the driving circuit layer. A sealing material is provided on the pixel layer. The sealing material is located between the filter layer and the driving circuit layer. The liquid crystal is blocked by the sealing material and cannot leak into the light passing hole.

14. The terminal device according to claim 13, wherein a protective material is provided on the terminal device, the protective material is located at the light passing hole, and the protective material is coated on the pixel layer and / or the driving circuit layer.

15. The terminal device according to claim 1 or 2, wherein the terminal device further comprises a light guide pipe, and the light guide pipe is accommodated in the light passing hole.

16. The terminal device according to claim 15, wherein the light guide pipe is made of a transparent material.

17. The terminal device according to claim 15, wherein the light guide pipe is coated with a light-tight material.

18. The terminal device according to claim 1 or 2, wherein the terminal device further comprises a limiting mechanism, one end of the limiting mechanism is connected to the camera module, the other end of the limiting mechanism is connected to the display screen, and the camera module is fixed to the display screen through the limiting mechanism.

Images