Display device and method of manufacturing the same

Abstract

A display device and a method for manufacturing the same are provided. The display device includes: a display panel including an opening area, a non-display area, and a display area, light passes through the opening area, the non-display area includes an opening peripheral area around the periphery of the opening area, the display area includes at least one pixel, and the display area is located around the periphery of the opening peripheral area; an optical film layer is provided on the display panel; and a cover window is provided on the optical film layer. The display panel includes: a base substrate; a light emitting structure is provided on the base substrate; a planarization insulating layer is provided on the base substrate in the opening peripheral area; and a light blocking pattern is provided on the planarization insulating layer and in the opening peripheral area.

Description

Technical Field

[0001] Embodiments of the inventive concept relate to a display device and a method of manufacturing the same. More particularly, embodiments of the inventive concept relate to a display device capable of improving display quality and a method of manufacturing the same. Background Art

[0002] Flat panel display devices, such as plasma display devices, liquid crystal display devices, and organic light emitting display devices, have smaller sizes, lighter weights, and use less power than conventional cathode ray tube (CRT) display devices.

[0003] As an attempt to expand the display area of ​​a display device, a borderless display device and a display device with a notch have been developed. A borderless display device may have extremely thin borders on three sides of a display panel and a thin border on a top side to accommodate a sensor such as a camera. A display device with a notch may have thin borders on three sides of a display panel, a thick border (i.e., a notch) for a sensor in the middle portion of the top side, and thin borders in the left and right portions of the top side adjacent to the middle portion. Recently, a display device with a thin border has been developed that includes a hole in the active area of ​​the display panel to accommodate a sensor. However, a display device with a hole may reduce the display quality compared to other types of displays. Summary of the invention

[0004] At least one embodiment of the inventive concept provides a display device having improved display quality and an enlarged display area.

[0005] At least one embodiment of the inventive concepts provides a method of manufacturing the display device.

[0006] According to an embodiment of the inventive concept, a display device includes a display panel, an optical film layer and a cover window. The display panel includes an opening area, a non-display area and a display area, light passes through the opening area, the non-display area includes an opening peripheral area located around the periphery of the opening area, and the display area includes at least one pixel. The display area is located around the periphery of the opening peripheral area. The optical film is disposed on the display panel. The cover window is disposed on the optical film layer. The display panel includes: a base substrate; a light emitting structure disposed on the base substrate; a planarization insulating layer disposed on the base substrate in the opening peripheral area; and a light blocking pattern disposed on the planarization insulating layer and in the opening peripheral area.

[0007] In an embodiment, the display device further includes an optical module disposed to overlap the opening area.

[0008] In an embodiment, the light blocking pattern includes a photoresist composition.

[0009] In an embodiment, the base substrate includes at least one polyimide layer and at least one barrier layer alternately stacked on each other.

[0010] In an embodiment, the base substrate includes a groove in the opening peripheral region around a periphery of the opening region.

[0011] In an embodiment, the optical film layer includes a polarizing film layer and an adhesive layer disposed between the polarizing film layer and the cover window.

[0012] In an embodiment, the display device also includes a dam and a thin film encapsulation layer, the dam is arranged on the base substrate in the opening peripheral area and is located around the periphery of the opening area, the thin film encapsulation layer includes a first inorganic layer arranged on the light emitting structure, an organic layer arranged on the first inorganic layer, and a second inorganic layer arranged on the organic layer, wherein the organic layer is arranged in the display area and between the dam and the display area adjacent to the dam.

[0013] In an embodiment, the display panel and the optical film layer include a through hole, and the optical module includes a lens portion and a main body portion, wherein a portion of the lens portion is disposed in the through hole, and the main body portion is disposed below the display panel.

[0014] In an embodiment, a distance between an upper surface of the lens part and the cover window is smaller than a distance between the light blocking pattern and the cover window.

[0015] In an embodiment, the base substrate and the light blocking pattern include a hole, and the light blocking pattern contacts the hole.

[0016] According to an embodiment of the inventive concept, a method for manufacturing a display device includes the following steps: forming a thin film transistor on a base substrate in a display area, wherein the base substrate includes an opening area, an opening peripheral area located around the periphery of the opening area, and a display area located around the periphery of the opening peripheral area; forming a light-emitting structure electrically connected to the thin film transistor; forming a thin film encapsulation layer on the light-emitting structure; forming a planarization layer on the thin film encapsulation layer in the opening peripheral area; and forming a light blocking pattern on the planarization layer in the opening peripheral area.

[0017] In an embodiment, the step of forming the light blocking pattern includes the steps of: forming a light blocking pattern layer by coating a photoresist composition on the planarization layer; and exposing and developing the light blocking pattern layer to form the light blocking pattern.

[0018] In an embodiment, the light blocking pattern layer includes a negative photoresist composition in which an unexposed portion is developed, and the light blocking pattern layer is exposed using a mask having an opening corresponding to the open region.

[0019] In an embodiment, the method further includes, after forming the light blocking pattern, forming a hole corresponding to the open area by removing a portion of the light blocking pattern, a portion of the planarization layer, a portion of the thin film encapsulation layer, and a portion of the base substrate.

[0020] In an embodiment, the method further includes forming a dam on the base substrate disposed in the opening peripheral region before forming the thin film encapsulation layer so that the dam is located around the periphery of the opening region in a plan view.

[0021] In an embodiment, the step of forming a thin film encapsulation layer includes the steps of: forming a first inorganic layer on the light emitting structure and the dam; forming an organic layer on the first inorganic layer outside the dam in a plan view; and forming a second inorganic layer on the organic layer and the first inorganic layer.

[0022] In an embodiment, the method further includes forming a groove on the base substrate before forming the thin film encapsulation layer, the groove being located around a periphery of the opening area in the opening peripheral area.

[0023] In an embodiment, the step of forming the light emitting structure includes the steps of: forming a first electrode electrically connected to the thin film transistor; forming a light emitting layer on the first electrode; and forming a second electrode on the light emitting layer.

[0024] In an embodiment, the method further comprises the steps of: forming an optical film layer on the light blocking pattern and the thin film encapsulation layer; and forming a cover window on the optical film layer.

[0025] In an embodiment, the method further comprises forming an optical module to overlap the opening area.

[0026] According to an embodiment of the inventive concept, a display device includes a display panel, a polarizer, and a cover window. The display panel includes an opening area, a non-display area, and a display area, light passes through the opening area, the non-display area includes an opening peripheral area around the periphery of the opening area, and the display area includes at least one pixel. The display area is located around the periphery of the opening peripheral area. The polarizer is disposed on the display panel. The cover window is disposed on the polarizer. The display panel includes a light blocking pattern disposed between the polarizer and the display panel in the opening peripheral area, and the light blocking pattern is located around the periphery of the opening in the opening area.

[0027] In an embodiment, the display panel further comprises a camera including a main body portion and a lens portion, the camera is disposed below the display panel, the main body portion is disposed in the opening peripheral area, wherein the lens portion is positioned in the opening area.

[0028] In an embodiment, an upper surface of the lens portion is located below the light blocking pattern.

[0029] In an embodiment, an upper surface of the lens portion is located above the polarizer.

[0030] According to at least one embodiment of the inventive concept, a display device includes a light blocking pattern. The light blocking pattern is formed to contact a hole of a display panel forming an opening area. Even considering the assembly tolerance between an optical module (e.g., an optical sensor or a camera) and the hole of the opening area, the distance between the light blocking pattern and the edge of the lens portion of the optical module in a plan view can be minimized.

[0031] In addition, the light blocking pattern can be formed to correspond to the peripheral area of ​​the opening. Since the vertical distance between the light emitting structure of the pixel closest to the peripheral area of ​​the opening and the light blocking pattern is relatively small, the light emitting range is not limited by the light blocking pattern. Therefore, the distance between the light blocking pattern and the light emitting structure of the closest pixel in the plan view can be minimized. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The inventive concept will become more apparent by describing in detail embodiments of the inventive concept with reference to the accompanying drawings, in which:

[0033] Figure 1 is a plan view showing a display panel of a display device according to an embodiment of the inventive concept;

[0034] Figure 2 It is shown Figure 1 A cross-sectional view of an opening area and an opening peripheral area of ​​a display device;

[0035] Figure 3 It is shown Figure 1 A cross-sectional view of a pixel of a display device;

[0036] Figure 4 It is shown Figure 1 A cross-sectional view of an opening area and an opening peripheral area of ​​a display panel of a display device;

[0037] Figure 5 is a cross-sectional view showing an opening area and an opening peripheral area of ​​a display device according to an embodiment of the inventive concept;

[0038] FIG. 6A to FIG. 6E It shows the manufacturing Figure 1 A cross-sectional view of a display panel of a display device;

[0039] Figure 7 is a block diagram illustrating an electronic device according to an example embodiment;

[0040] Fig. 8A It shows that Figure 7 FIG. 1 is a diagram of an example in which the electronic device is implemented as a television; and

[0041] Figure 8B It shows that Figure 7FIG. 1 is a diagram of an example in which the electronic device is implemented as a smart phone. DETAILED DESCRIPTION

[0042] Hereinafter, embodiments of the inventive concept will be explained in detail with reference to the accompanying drawings.

[0043] Figure 1 is a plan view illustrating a display panel 10 of a display device according to an embodiment of the inventive concept. Figure 2 It is shown Figure 1 A cross-sectional view of an opening area H and an opening peripheral area BA of a display device.

[0044] Reference Figure 1 and Figure 2 , the display panel 10 of the display device includes a display area DA, an opening area H, and a non-display area including an opening peripheral area BA around the periphery of the opening area H. The opening peripheral area BA may be surrounded by the display area DA. Although not shown, a peripheral area as a non-display area in which an image is not displayed may be formed along one or more edges of the display area DA. For example, there may be a very thin frame around the periphery of the display area DA.

[0045] A plurality of pixels PX may be arranged in the display area DA to display an image. The display area DA may have a rectangular shape in a plane formed by a first direction D1 and a second direction D2 perpendicular to the first direction D1. In addition, a corner of the display area DA may have a rounded shape. Each of the pixels PX may include a thin film transistor (see FIG. 1 ) for displaying an image. Figure 3 TFT in) and light-emitting structure (see Figure 3 180 in the figure).

[0046] The opening area H may transmit light. For example, a circular hole penetrating the base substrate 100 of the display panel 10 of the display device may be formed in the opening area H. Alternatively, a transparent window formed of a material capable of transmitting light may be formed in the opening area H. For example, the transparent window may be formed of glass or plastic.

[0047] The optical module CM (e.g., optical sensor) may be disposed to overlap the opening area H. For example, the optical module CM may include a camera module for capturing (or recognizing) an image of an object, a facial recognition sensor module for sensing a user's face, a pupil recognition sensor module for sensing a user's pupil, an acceleration and geomagnetic sensor module for determining movement of the display device, a proximity and infrared sensor module for detecting proximity to the display device, and a light intensity sensor module for measuring a degree of brightness. For example, when the display device is left in a pocket or a bag, the light intensity sensor module may detect that the degree of brightness has decreased.

[0048] In the present embodiment, the optical module CM is a camera module (eg, a camera). In the embodiment, the camera module includes a body portion BD disposed under the display panel 10 and a lens portion LS disposed in the opening area H and connected to the body portion BD.

[0049] Reference Figure 2 The display device includes a display panel 10 in which pixels PX are formed, a cover window 230 disposed on the display panel 10 , and an optical film layer disposed between the display panel 10 and the cover window 230 .

[0050] The display panel 10 may include a plurality of pixels for displaying an image, and each of the pixels may include a thin film transistor and a light emitting structure 180 .

[0051] In an embodiment of the inventive concept, the display panel 10 further includes a light blocking pattern BM. In an embodiment, the light transmittance of the light blocking pattern BM is significantly lower than the light transmittance of the display panel 10, the optical film layer, and the cover window 230. In an embodiment, the thickness of the light blocking pattern BM in a plan view is smaller than the thickness of the display panel 10 in a plane. In an embodiment, in a plan view, the light blocking pattern BM has a certain degree of annular shape. The light blocking pattern BM may be disposed in the opening peripheral area BA to surround the periphery of the opening area H. Because the pixels PX for displaying an image are not formed in the opening peripheral area BA as a non-display area, when the light blocking pattern BM does not exist, the structure in the opening peripheral area BA may be viewed by the user. Therefore, the light blocking pattern BM may be formed to cover the structure.

[0052] In an embodiment, the light blocking pattern BM is formed to contact the hole of the display panel 10 forming the opening area H. Even considering the assembly tolerance between the optical module CM and the hole of the opening area H, the distance d2 between the light blocking pattern BM and the edge of the lens portion LS of the optical module CM in a plan view can be minimized. Figure 2 As shown in FIG. 4 , the lens portion LS extends into the opening area H but does not extend beyond the light blocking pattern BM.

[0053] In addition, the light blocking pattern BM is formed on the uppermost layer of the display panel 10 and is disposed below the optical film layer. Therefore, the distance between the light blocking pattern BM and the lens portion LS of the optical module CM in a direction perpendicular to the light blocking pattern BM (i.e., a direction perpendicular to the first direction D1 and the second direction D2) may be smaller than a case where the light blocking pattern BM is formed closer to the cover window 230. Therefore, interference with the viewing angle of the lens portion LS is reduced, and as a result, the size of the opening area H can be reduced.

[0054] The light blocking pattern BM may be formed to correspond to the opening peripheral area BA. Since the vertical distance between the light emitting structure 180 of the pixel closest to the opening peripheral area BA and the light blocking pattern BM is relatively small, the light emitting range is not limited by the light blocking pattern BM. Therefore, the distance d1 between the light blocking pattern BM and the light emitting structure 180 of the closest pixel in a plan view can be minimized.

[0055] In an embodiment, the optical film layer includes a polarizing film layer 210 and an adhesive layer 220 .

[0056] The polarizing film layer 210 may include a polarizing layer and an adhesive layer (not shown). The polarizing layer may change the characteristics of light transmitted therethrough. The polarizing film layer 210 may be attached to the display panel 10 through the adhesive layer.

[0057] The adhesive layer 220 may combine the cover window 230 and the polarizing film layer 210 with each other. The adhesive layer 220 may include at least one of a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), and an optically clear resin (OCR).

[0058] The cover window 230 may be disposed on the adhesive layer 220. The cover window 230 may be formed of a glass material or a plastic material, but is not limited thereto. Meanwhile, the cover window 230 may be formed as a single layer or may be a laminate in which a plurality of functional layers are stacked.

[0059] The optical film layer includes a hole corresponding to the opening area H. Therefore, the display panel 10 and the optical film layer have a hole corresponding to the opening area H except for the cover window 230 .

[0060] Figure 3 The present invention is a diagram showing an embodiment of the present invention. Figure 1 sectional view of a pixel PX of a display device.

[0061] Reference Figure 3 The display panel 10 includes a base substrate 100 , a buffer layer 110 , an active pattern ACT, a gate insulating layer 120 , a gate pattern, an interlayer insulating layer 130 , a data pattern, a through hole insulating layer 140 , a pixel defining layer PDL, a light emitting structure 180 , and a thin film encapsulation layer 190 .

[0062] The base substrate 100 can be made of a transparent material or an opaque material. For example, the base substrate 100 can be a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped quartz substrate, a soda-lime glass substrate or an alkali-free non-alkali glass substrate. Alternatively, the base substrate 100 can be made of a transparent resin substrate. An example of a transparent resin substrate that can be used for the base substrate 100 is a polyimide resin. For example, the base substrate 100 can have a structure in which at least one polyimide layer and at least one barrier layer are alternately stacked.

[0063] The buffer layer 110 may be completely disposed on the base substrate 100. The buffer layer 110 may prevent metal atoms or impurities from diffusing from the base substrate 100 into the active pattern ACT and may control a heat transfer rate during a crystallization process to form the active pattern ACT, thereby obtaining a substantially uniform active pattern ACT.

[0064] The active pattern ACT of the thin film transistor TFT may be disposed on the buffer layer 110. The active pattern ACT may include amorphous silicon or may include polycrystalline silicon. In some embodiments, the active pattern ACT may include at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Cr), titanium (Ti), and zinc (Zn). The active pattern ACT may include a drain region and a source region doped with impurities and a channel region between the drain region and the source region.

[0065] The gate insulating layer 120 may be disposed on the buffer layer 110. The gate insulating layer 120 may cover the active pattern ACT on the buffer layer 110 and may be disposed with substantially the same thickness along the contour of the active pattern ACT. The gate insulating layer 120 may include a silicon compound or a metal oxide. The gate insulating layer 120 may be formed of a plurality of layers.

[0066] The gate pattern may be disposed on the gate insulating layer 120. The gate pattern may include a gate electrode GE of the thin film transistor TFT and a signal wiring such as a scan line. The gate electrode GE may overlap the active pattern ACT. For example, the gate electrode GE may overlap the active pattern ACT in a plan view, and a portion of the gate insulating layer 120 is disposed between the gate electrode GE and the active pattern ACT. The gate pattern may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material.

[0067] The interlayer insulating layer 130 may be disposed on the gate insulating layer 120 on which the gate pattern is disposed. For example, the interlayer insulating layer 130 may fully cover the gate pattern on the gate insulating layer 120, and may have a substantially flat upper surface without forming a step around the gate pattern. Alternatively, the interlayer insulating layer 130 may cover the gate pattern on the gate insulating layer 120, and may be disposed with substantially the same thickness along the contour of the gate pattern. The interlayer insulating layer 130 may be formed of a plurality of layers. For example, the gate electrode GE may be disposed between the interlayer insulating layer 130 and the gate insulating layer 120.

[0068] The data pattern may be disposed on the interlayer insulating layer 130. The data pattern may include a source electrode SE and a drain electrode DE of the thin film transistor TFT, and a signal wiring such as a data line, wherein the source electrode SE and the drain electrode DE of the thin film transistor TFT are connected to the active pattern ACT through a contact hole formed through the interlayer insulating layer 130 and the gate insulating layer 120. The data pattern may be formed using a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material.

[0069] The through hole insulating layer 140 may be disposed on the interlayer insulating layer 130 on which the data pattern is disposed. The through hole insulating layer 140 may have a single-layer structure, but is not limited thereto. For example, in an optional embodiment, the through hole insulating layer 140 has a multilayer structure including at least two insulating layers. The through hole insulating layer 140 may be formed using an organic material such as a photoresist, an acrylic resin, a polyimide resin, a polyamide resin, or a siloxane-based resin. According to other embodiments, the through hole insulating layer 140 may be formed using an inorganic material such as a silicon compound, a metal, or a metal oxide.

[0070] In the embodiment, the light emitting structure 180 includes a first electrode 181 , a light emitting layer 182 , and a second electrode 183 .

[0071] The first electrode 181 may be disposed on the through-hole insulating layer 140. Depending on the emission type of the display device, the first electrode 181 may include a reflective material or a transmissive material. For example, the first electrode 181 may be formed using materials such as aluminum, an alloy containing aluminum, aluminum nitride, silver, an alloy containing silver, tungsten, tungsten nitride, copper, an alloy containing copper, nickel, an alloy containing nickel, chromium, chromium nitride, molybdenum, an alloy containing molybdenum, titanium, titanium nitride, platinum, tantalum, tantalum nitride, neodymium, scandium, strontium ruthenium oxide, zinc oxide, indium tin oxide, tin oxide, indium oxide, gallium oxide, indium zinc oxide, etc. These materials may be used alone or in combination thereof. In an example embodiment, the first electrode 181 may have a single-layer structure or a multilayer structure that may include a metal film, an alloy film, a metal nitride film, a conductive metal oxide film, and / or a transparent conductive film.

[0072] The pixel defining layer PDL may be disposed on the through-hole insulating layer 140 on which the first electrode 181 is disposed. The pixel defining layer PDL may be formed using an organic material. For example, the pixel defining layer PDL may include a photoresist, an acryl resin, a polyimide resin, a polyamide resin, a siloxane resin, and the like. In some example embodiments, an opening of the pixel defining layer PDL exposing the first electrode 181 may be formed by etching the pixel defining layer PDL. The emission region and the non-emission region of the display device may be defined by the opening of the pixel defining layer PDL. For example, a portion where the opening of the pixel defining layer PDL is positioned may correspond to the emission region, and the non-emission region may correspond to a portion adjacent to the opening of the pixel defining layer PDL.

[0073] The light emitting layer 182 may be disposed on the first electrode 181 exposed by the opening of the pixel defining layer PDL. In addition, the light emitting layer 182 may extend on the sidewall of the opening of the pixel defining layer PDL. For example, the light emitting layer 182 may be substantially uniform but extends upward to cover the left and right sides of the pixel defining layer PDL. In some example embodiments, the light emitting layer 182 may include an organic light emitting layer (EL), a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer (EIL), and the like. In some example embodiments, in addition to the organic light emitting layer, the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer may be formed to correspond to a plurality of pixels in common. In some example embodiments, a plurality of organic light emitting layers may be formed using light emitting materials for generating light of different colors such as red light, green light, and blue light according to the color pixels of the display device. In some example embodiments, the organic light emitting layer of the light emitting layer 182 may include a plurality of stacked light emitting materials for generating red light, green light, and blue light, thereby emitting white light. Here, elements of the light emitting layer 182 are commonly formed to correspond to a plurality of pixels, and each pixel may be divided by a color filter layer.

[0074] The second electrode 183 may be disposed on the pixel defining layer PDL and the light emitting layer 182. For example, the second electrode 183 may cover the pixel defining layer PDL and the light emitting layer 182. The second electrode 183 may include a transmissive material or a reflective material according to the emission type of the display device. For example, the second electrode 183 may be formed using materials such as aluminum, an alloy containing aluminum, aluminum nitride, silver, an alloy containing silver, tungsten, tungsten nitride, copper, an alloy containing copper, nickel, an alloy containing nickel, chromium, chromium nitride, molybdenum, an alloy containing molybdenum, titanium, titanium nitride, platinum, tantalum, tantalum nitride, neodymium, scandium, strontium ruthenium oxide, zinc oxide, indium tin oxide, tin oxide, indium oxide, gallium oxide, indium zinc oxide, etc. These materials may be used alone or in combination thereof. In an example embodiment, the second electrode 183 may also have a single-layer structure or a multilayer structure that may include a metal film, an alloy film, a metal nitride film, a conductive metal oxide film, and / or a transparent conductive film.

[0075] The thin film encapsulation layer 190 may be disposed on the second electrode 183. For example, the thin film encapsulation layer 190 may cover the second electrode 183. The thin film encapsulation layer 190 may prevent moisture and oxygen from penetrating from the outside. The thin film encapsulation layer 190 may include at least one organic layer and at least one inorganic layer. At least one organic layer and at least one inorganic layer may be alternately stacked with each other. In the present embodiment, the thin film encapsulation layer 190 includes a first inorganic layer 191, a second inorganic layer 193, and an organic layer 192 between the first inorganic layer 191 and the second inorganic layer 193.

[0076] In an embodiment, the display device further includes a polarizing film layer 210, an adhesive layer 220, and a cover window 230 disposed on the display panel 10. The polarizing film layer 210 may be bonded to the thin film encapsulation layer 190. The adhesive layer 220 may be disposed between the cover window 230 and the polarizing film layer 210, and bonded to the cover window 230 and the polarizing film layer 210.

[0077] Figure 4 The present invention is a diagram showing an embodiment of the present invention. Figure 1 sectional view of an opening area H and an opening peripheral area BA of a display panel 10 of a display device.

[0078] Reference Figures 1 to 4 , the display panel 10 includes a base substrate 100 , a buffer layer 110 , a dam DAM, first and second inorganic layers 191 and 193 of a thin film encapsulation layer 190 , a planarization layer OC, and a light blocking pattern BM.

[0079] In an embodiment, in the opening peripheral area BA, a plurality of grooves TC around the periphery of the opening area H in a plan view are formed in the base substrate 100. The grooves TC may be formed by removing a portion of the buffer layer 110 and a portion of the base substrate 100 after forming the buffer layer 110. In an embodiment, in a plan view, each groove TC has a somewhat annular shape surrounding the opening area H and one or more other grooves TC.

[0080] The first inorganic layer 191 and the second inorganic layer 193 of the thin film encapsulation layer 190 having excellent step coverage can be formed along the side surface of the groove TC. In this case, it is possible to ensure a long inflow path and / or crack extension path of water and oxygen through the first inorganic layer 191 and the second inorganic layer 193. Therefore, it is possible to provide a display device that improves reliability and stability by ensuring a long time for moisture, oxygen and cracks to flow into internal elements along the first inorganic layer 191 and the second inorganic layer 193. The first inorganic layer 191 can be formed in the groove TC to partially fill in the groove TC. The second inorganic layer 193 can be formed on the first inorganic layer 191, and the groove TC is located between the dam DAM and the opening area H.

[0081] The dam DAM located around the periphery of the opening area H in the plan view may be formed in the opening peripheral area BA. The dam DAM may prevent the formation of an organic edge tail by controlling the formation position of the organic layer 192 of the thin film encapsulation layer 190. The dam DAM may be formed using layers such as a through-hole insulating layer 140 and a pixel defining layer PDL. In an embodiment, the cross section of the dam DAM has a trapezoidal shape. In an embodiment, the bottom side of the dam DAM contacts the buffer layer 110 and the first inorganic layer 191 covers the outside, inside and top side of the dam DAM. In addition, the second inorganic layer 193 may cover a portion of the first inorganic layer 191 covering the dam DAM. In an embodiment, the dam DAM is disposed between a pair of grooves TC, one of which is not covered by the second inorganic layer 193, and the other groove TC in the pair of grooves TC is covered by the second inorganic layer 193. In an embodiment, in a plan view, the dam DAM has a certain degree of annular shape surrounding the opening area H and one or more grooves TC.

[0082] The planarization layer OC may be formed on the second inorganic layer 193 in the open peripheral area BA to compensate for the overall height of the display device. The planarization layer OC may have a flat upper surface.

[0083] In an embodiment, the light blocking pattern BM is disposed on the planarization layer OC. In an embodiment, the light blocking pattern BM is disposed in the opening peripheral area BA to be located around the periphery of the opening area H. The light blocking pattern BM may include a photoresist composition used as a light blocking material. For example, the light blocking pattern BM may include a photoresist composition including a binder resin, a polymerizable monomer, a polymerizable oligomer, a pigment, a dispersant, or a photoinitiator. The pigment may be a black pigment, or a black resin may be used.

[0084] Figure 5 is a cross-sectional view illustrating an opening area H and an opening peripheral area BA of a display device according to an embodiment of the inventive concept.

[0085] Reference Figure 5 , except for the shape of the lens portion LS' of the optical module CM, the display device is Figures 1 to 4 The display devices are substantially the same. Therefore, repeated explanations are omitted.

[0086] The display device includes a display panel 10, a cover window 230, and an optical film layer, the display panel 10 includes a light emitting structure 180 and a light blocking pattern BM, the cover window 230 is disposed on the display panel 10, and the optical film layer is disposed between the display panel 10 and the cover window 230. The optical film layer may include a polarizing film layer 210 and an adhesive layer 220.

[0087] The optical module CM may be a camera module. The camera module includes a body portion BD under the display panel 10 and a lens portion LS′ connected to the body portion BD and disposed in the opening region H.

[0088] Here, the upper surface of the lens portion LS' is set to be higher than the light blocking pattern BM. That is, the upper surface of the lens portion LS' may be set closer to the cover window 230 than the light blocking pattern BM. Therefore, the viewing angle of the lens portion LS' is not blocked by the light blocking pattern BM, so that the size of the opening area H of the lens portion LS' in which the optical module CM is positioned can be minimized. For example, the lens portion LS' may extend through the light blocking pattern BM, or may extend through the light blocking pattern BM and the polarizing film layer 210. In addition, the upper surface of the lens portion LS' may be higher than the lower surface of the adhesive layer 220. For example, the distance between the upper surface of the lens portion LS' and the cover window 230 may be smaller than the distance between the light blocking pattern BM and the cover window 230.

[0089] FIG. 6A to FIG. 6E The invention is a diagram showing the manufacturing method of an embodiment according to the invention. Figure 1 A cross-sectional view of a display panel 10 of a display device is shown in FIG.

[0090] Reference Fig. 6A, a buffer layer 110 is formed on a base substrate 100. An active pattern ACT may be formed on the buffer layer 110. A gate insulating layer 120 may be formed on the buffer layer 110 on which the active pattern ACT is formed. A gate pattern including a gate electrode GE may be formed on the gate insulating layer 120. An interlayer insulating layer 130 may be formed on the gate insulating layer 120 on which the gate pattern is formed. A data pattern including a source electrode SE and a drain electrode DE may be formed on the interlayer insulating layer 130. A through-hole insulating layer 140 may be formed on the interlayer insulating layer 130 on which the data pattern is formed. A first electrode 181 may be formed on the through-hole insulating layer 140. A pixel defining layer PDL may be formed on the through-hole insulating layer 140 on which the first electrode 181 is formed. A light emitting layer 182 may be formed on the first electrode 181. A second electrode 183 may be formed on the light emitting layer 182.

[0091] In an embodiment, the groove TC is formed by removing a portion of the buffer layer 110 and a portion of the base substrate 100 in the opening peripheral area BA, which will be described later. For example, the present process may be repeated to form a plurality of grooves TC spaced apart from each other. The first pair of grooves TC may be spaced apart by a first distance, and the remaining grooves TC in the grooves TC may be spaced apart by a second distance, wherein the first distance may be greater than the second distance to accommodate the dam DAM. Although Fig. 6A Two grooves TC are shown between the dam DAM and the opening area H, but the inventive concept is not limited thereto. For example, in an alternative embodiment, there may be no groove TC, only one groove TC, or more than two grooves TC between the dam DAM and the opening area H.

[0092] In addition, a dam DAM is formed in the opening peripheral area BA. The dam DAM may be formed using layers such as the via insulating layer 140 and the pixel defining layer PDL. For example, the dam DAM may be formed after forming the groove TC. The dam DAM may be formed on the buffer layer 110 between the first pair of grooves TC.

[0093] Reference Figure 6B , a first inorganic layer 191 is formed on the base substrate 100 on which the second electrode 183 and the dam DAM are formed. The first inorganic layer 191 may be formed to correspond to the entirety of the base substrate 100. For example, the first inorganic layer 191 may be formed to cover the groove TC and the dam DAM. For example, the first inorganic layer 191 may be formed to contact the inside of the groove TC and to contact the outside, inside, and top side of the dam DAM.

[0094] Reference Figure 6C, an organic layer 192 is formed on the first inorganic layer 191. In an embodiment, the organic layer 192 is formed only in the display area DA and outside the dam DAM (ie, toward the display area DA relative to the dam DAM). That is, the dam DAM can prevent the formation of an organic edge tail by controlling the formation position of the organic layer 192.

[0095] Subsequently, the second inorganic layer 193 is formed on the organic layer 192 and the first inorganic layer 191. The second inorganic layer 193 may be formed to correspond to the entirety of the base substrate 100. For example, the second inorganic layer 193 may be formed on the organic layer 192 between the display area DA and the dam DAM and a portion of the first inorganic layer 191 that covers the dam DAM and the groove TC positioned between the dam DAM and the opening area H.

[0096] Reference Fig.6D , a planarization layer OC is formed on the second inorganic layer 193. The planarization layer OC may be formed on the second inorganic layer 193 in the opening peripheral area BA to compensate for the overall height of the display device. That is, the planarization layer OC may be formed inside the dam DAM and at the periphery of the dam DAM where the organic layer 192 is not formed, and the planarization layer OC may have a flat upper surface.

[0097] Reference Fig. 6E A light blocking pattern BM is formed on the planarization layer OC. In an embodiment, the light blocking pattern BM is formed in the opening peripheral area BA and is formed up to at least a portion of the opening area H.

[0098] The light blocking pattern BM may be formed by coating a photoresist composition on the planarization layer OC, forming a light blocking pattern layer, and then exposing and developing the light blocking pattern layer. For example, the light blocking pattern layer may be formed of a negative photoresist composition, wherein the unexposed portion is developed. The light blocking pattern BM may be formed by exposing and developing the light blocking pattern layer using a mask (not shown) having openings corresponding to the opening area H and the opening peripheral area BA.

[0099] Subsequently, portions of the light blocking pattern BM, the planarization layer OC, the second inorganic layer 193, the first inorganic layer 191, the buffer layer 110, and the base substrate 100 may be cut to form a hole (see the dotted line in the drawing) corresponding to the opening area H. For example, a portion of the light blocking pattern BM after the dotted line and the underlying layers may be removed to form the hole, and thus the optical module CM may be placed in the hole.

[0100] Thus, the display panel 10 including the gate insulating layer 120 , the gate pattern, the interlayer insulating layer 130 , the data pattern, the via insulating layer 140 , the pixel defining layer PDL, the light emitting structure 180 , the thin film encapsulation layer 190 , the dam DAM, and the planarization layer OC may be manufactured.

[0101] Then, the display device may be manufactured by forming an optical film layer and a cover window 230 on the display panel 10 (see FIG. Figure 2 ). For example, an optical film layer may be formed to cover the display panel 10 and the light blocking pattern BM, and a cover window 230 may be formed to cover the optical film layer. An area of ​​the optical film layer may cover the first hole, the first hole being cut through a portion of the light blocking pattern BM, a portion of the planarization layer OC, a portion of the second inorganic layer 193, a portion of the first inorganic layer 191, a portion of the buffer layer 110, and a portion of the base substrate 100, and the area may be cut to produce a second hole that coincides with the first hole through the optical film layer. According to at least one embodiment of the present inventive concept, it is possible to prevent the structure of the opening peripheral area BA from being visible to the user by a process of forming the light blocking pattern BM without a separate design change. In addition, since a hole corresponding to the opening area H is formed after the light blocking pattern BM is formed, the light blocking pattern BM may be disposed to contact the hole. Therefore, the size of the opening area H and the size of the opening peripheral area BA can be minimized.

[0102] Figure 7 is a block diagram illustrating an electronic device 500 according to an embodiment of the inventive concept. Fig. 8A It shows that Figure 7 The electronic device 500 is a diagram of an example in which it is implemented as a television. Figure 8B It shows that Figure 7 The electronic device 500 is implemented as an example of a smart phone.

[0103] Reference Figures 7 to 8B , the electronic device 500 includes a processor 510, a memory device 520, a storage device 530, an input / output (I / O) device 540, a power supply 550, and a display device 560. Here, the display device 560 may be connected to Figure 1 In addition, the electronic device 500 may also include a plurality of ports for communicating with a graphics card, a sound card, a memory card, a universal serial bus (USB) device, other electronic devices, etc. In an embodiment, as Fig. 8A As shown in , the electronic device 500 is implemented as a television. In another embodiment, as Figure 8BAs shown in , the electronic device 500 is implemented as a smart phone. However, the electronic device 500 is not limited thereto. For example, the electronic device 500 can be implemented as a cellular phone, a video phone, a smart board, a smart watch, a tablet personal computer (PC), a vehicle navigation system, a computer monitor, a laptop computer, a head mounted display (HMD), etc.

[0104] The processor 510 may perform various computing functions. The processor 510 may be a microprocessor, a central processing unit (CPU), an application processor (AP), etc. The processor 510 may be coupled to other components via an address bus, a control bus, a data bus, etc. In addition, the processor 510 may be coupled to an expansion bus such as a peripheral component interconnect (PCI) bus. The memory device 520 may store data for the operation of the electronic device 500. For example, the memory device 520 may include at least one non-volatile memory device such as an erasable programmable read-only memory (EPROM) device, an electrically erasable programmable read-only memory (EEPROM) device, a flash memory device, a phase change random access memory (PRAM) device, a resistive random access memory (RRAM) device, a nano floating gate memory (NFGM) device, a polymer random access memory (PoRAM) device, a magnetic random access memory (MRAM) device, a ferroelectric random access memory (FRAM) device, etc., and / or at least one volatile memory device such as a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, a mobile DRAM device, etc. The storage device 530 may include a solid state drive (SSD) device, a hard disk drive (HDD) device, a CD-ROM device, etc. The I / O device 540 may include an input device such as a keyboard, a keypad, a mouse device, a touch pad, a touch screen, etc. and an output device such as a printer, a speaker, etc. The power supply 550 may provide power for the operation of the electronic device 500.

[0105] The display device 560 may be coupled to other components via a bus or other communication links. In an embodiment of the inventive concept, the display device 560 is included in the I / O device 540.

[0106] In addition, the display device 560 of the electronic device 500 may be a device in which a hole is formed in a display area so that Fig. 8A and Figure 8B The optical module CM (ie, camera) shown in FIG. 1 is disposed in the display device in the hole.

[0107] As described above, since the display device 560 includes a display panel, the display panel includes a base substrate and a planarization insulating layer (i.e., a planarization layer) arranged on the base substrate and in the opening peripheral area and a light blocking pattern arranged in the opening peripheral area and on the planarization insulating layer, it is possible to provide a display device in which the display area is expanded even if the non-display area is reduced.

[0108] The foregoing is an illustration of the inventive concept and is not to be construed as a limitation of the inventive concept. Although some embodiments of the inventive concept have been described, it will be readily appreciated by those skilled in the art that many modifications can be made to the embodiments without departing substantially from the inventive concept. Therefore, all such modifications are intended to be included within the scope of the inventive concept.

Claims

1. A display device, comprising: The display panel comprises an opening area, a non-display area and a display area, light passes through the opening area, the non-display area comprises an opening peripheral area around the periphery of the opening area, the display area comprises at least one pixel, and the display area is around the periphery of the opening peripheral area; An optical film layer, disposed on the display panel; A cover window, disposed on the optical film layer; as well as an optical module, arranged to overlap the opening area, The display panel includes: a base substrate; a light emitting structure disposed on the base substrate; a planarization insulating layer disposed on the base substrate in the opening peripheral region; and a light blocking pattern disposed on the planarization insulating layer and in the opening peripheral region. wherein the light blocking pattern is disposed in the opening peripheral region so as to surround the periphery of the opening region, The display panel and the optical film layer include a through hole, the optical module includes a lens part and a main body part, a portion of the lens part is arranged in the through hole, and the main body part is arranged below the display panel, and Wherein, a distance between an upper surface of the lens portion and the cover window is smaller than a distance between the light blocking pattern and the cover window.

2. The display device according to claim 1, wherein: The light blocking pattern includes a photoresist composition.

3. The display device according to claim 1, wherein: The base substrate includes at least one polyimide layer and at least one barrier layer which are alternately stacked on each other. 4 . The display device according to claim 1 , the base substrate comprising a groove in the opening peripheral region around a periphery of the opening region.

5. The display device according to claim 1, wherein: The optical film layer includes a polarizing film layer and an adhesive layer disposed between the polarizing film layer and the cover window.

6. The display device according to claim 1, further comprising: a dam disposed on the base substrate in the peripheral region of the opening and located around the periphery of the opening region; as well as a thin film encapsulation layer, comprising a first inorganic layer disposed on the light emitting structure, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer, and The organic layer is disposed in the display area and between the dam and the display area adjacent to the dam.

7. The display device according to claim 1, wherein: The base substrate and the light blocking pattern include a hole, and the light blocking pattern contacts the hole.

8. A method for manufacturing a display device, the method comprising the following steps: Forming a thin film transistor on a base substrate in a display area, wherein the base substrate comprises an opening area, an opening peripheral area and a display area, the opening peripheral area is located around the periphery of the opening area, and the display area is located around the periphery of the opening peripheral area; forming a light emitting structure electrically connected to the thin film transistor; forming a thin film encapsulation layer on the light emitting structure; forming a planarization layer on the thin film encapsulation layer in the opening peripheral area; and forming a light blocking pattern on the planarization layer in the opening peripheral region, The step of forming the light blocking pattern includes: forming a light blocking pattern layer by coating a photoresist composition on the planarization layer; and exposing and developing the light blocking pattern layer to form the light blocking pattern.

9. The method according to claim 8, wherein: The light blocking pattern layer includes a negative photoresist composition in which an unexposed portion is developed, and The light blocking pattern layer is exposed using a mask having an opening corresponding to the opening region.

10. The method according to claim 8, further comprising: After forming the light blocking pattern, a hole corresponding to the open area is formed by removing a portion of the light blocking pattern, a portion of the planarization layer, a portion of the thin film encapsulation layer, and a portion of the base substrate.

11. The method according to claim 8, further comprising: Before forming the thin film encapsulation layer, a dam disposed on the base substrate in the opening peripheral region is formed so that the dam is located around the periphery of the opening region in a plan view.

12. The method according to claim 11, wherein: The step of forming the thin film encapsulation layer comprises the following steps: forming a first inorganic layer on the light emitting structure and the dam; forming an organic layer on the first inorganic layer outside the dam in a plan view; and A second inorganic layer is formed on the organic layer and the first inorganic layer.

13. The method according to claim 11, further comprising: Before forming the thin film encapsulation layer, a groove is formed on the base substrate, the groove being located around the periphery of the opening area in the opening peripheral area.

14. The method according to claim 8, wherein: The step of forming the light emitting structure comprises the following steps: forming a first electrode electrically connected to the thin film transistor; forming a light-emitting layer on the first electrode; and A second electrode is formed on the light emitting layer.

15. The method according to claim 8, further comprising: forming an optical film layer on the light blocking pattern and the thin film encapsulation layer; as well as A cover window is formed on the optical film layer.

16. The method according to claim 15, further comprising: An optical module is formed to overlap the opening area.

17. A display device, comprising: The display panel comprises an opening area, a non-display area and a display area, light passes through the opening area, the non-display area comprises an opening peripheral area around the periphery of the opening area, the display area comprises at least one pixel, and the display area is around the periphery of the opening peripheral area; a polarizer, disposed on the display panel; a cover window disposed on the polarizer; as well as a camera, arranged to overlap the opening area, wherein the display panel includes a light blocking pattern disposed between the polarizer and the display panel in the opening peripheral region, the light blocking pattern being located around the periphery of the opening in the opening region, wherein the display panel and the polarizer include through holes, the camera includes a lens portion and a body portion, a portion of the lens portion is disposed in the through hole, and the body portion is disposed below the display panel, and Wherein, a distance between an upper surface of the lens portion and the cover window is smaller than a distance between the light blocking pattern and the cover window.

18. The display device according to claim 17, wherein: The body portion is disposed in the opening peripheral region, and the lens portion is positioned in the opening region.

19. The display device according to claim 18, wherein: An upper surface of the lens portion is located above the polarizer.

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