Shock Absorption Module

Abstract

The present application relates to a shock absorbing module. The shock absorbing module includes a shock absorbing layer and a base layer, wherein the shock absorbing module can be attached to a display panel at the shock absorbing layer, the shock absorbing layer includes a cushion layer and an embossed adhesive layer, wherein the cushion layer includes an adhesive polymer resin and hollow particles located in the adhesive polymer resin, and the shock absorbing layer can be attached to the display panel through the embossed adhesive layer. The shock absorbing module attached to the display panel has the shock absorbing layer disposed between the display panel and the base layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2019-0043142, filed on Apr. 12, 2019, and all rights arising therefrom, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a shock absorbing module and a display device including the same. Background Art

[0004] Various display devices are being developed for multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, game consoles, and the like.

[0005] A display device including a shock absorbing module has been developed in order to absorb shock to the display device that may occur when the display device falls during use. Summary of the invention

[0006] In the case where the impact absorbing module of the display device includes a plurality of layers, it may be difficult to reduce the overall thickness of the display device, and separation may occur at interfaces between the layers.

[0007] One or more embodiments of the present invention provide a shock absorbing module having a relatively thin structure and high durability, and a display apparatus including the shock absorbing module.

[0008] According to an embodiment of the present invention, the shock absorbing module includes a shock absorbing layer and a base layer, wherein the shock absorbing module can be attached to the display panel at the shock absorbing layer, the shock absorbing layer includes a cushion layer and an embossed adhesive layer, wherein the cushion layer includes an adhesive polymer resin and hollow particles located in the adhesive polymer resin, and the shock absorbing layer can be attached to the display panel through the embossed adhesive layer. The shock absorbing module attached to the display panel has the shock absorbing layer disposed between the display panel and the base layer.

[0009] In an embodiment, the impact absorbing module may further include a light blocking layer. The impact absorbing module attached to the display panel may have the embossed adhesive layer disposed between the display panel and the light blocking layer.

[0010] In an implementation, the adhesive polymer resin may include at least one of an acrylic polymer, a urethane polymer, an olefin polymer, an imide polymer, an amide polymer, an ester polymer, an isocyanate polymer, an epoxy polymer, and a silicone polymer.

[0011] In an embodiment, the shell of the hollow particle may include polymerized acrylic acid monomers or polymerized vinyl chloride monomers. The density of the hollow particle may be from about 0.08 g / cm3 to about 0.1 g / cm4. 3 ) to about 0.40g / cm 3 within the range.

[0012] In an embodiment, the weight percentage of the hollow particles relative to the total weight of the mat layer may range from about 0.5 wt % to about 20.0 wt %.

[0013] In embodiments, the hollow particles may include an average diameter from about 10 micrometers (μm) to about 40 μm or an average diameter from about 40 μm to about 80 μm.

[0014] In an embodiment, the embossed adhesive layer may include a base portion and a pattern protruding from the base portion, and the embossed adhesive layer may be attached to the display panel through the pattern.

[0015] The underlayer may further include a light blocking material. The light blocking material may be carbon black nanoparticles. The weight percentage of the carbon black nanoparticles relative to the total weight of the underlayer may range from about 0.5 weight percent (wt%) to about 5.0 wt%.

[0016] The impact absorbing layer may further include a first film layer including polyimide. The impact absorbing module attached to the display panel may have the embossed adhesive layer disposed between the display panel and the first film layer.

[0017] The base layer may include a film layer, a metal layer and a graphite layer, and the film layer, the metal layer and the graphite layer are stacked in sequence in a direction toward the impact absorbing layer. The film layer may include polyethylene terephthalate. The metal layer may include copper.

[0018] According to an embodiment of the present invention, the impact absorbing layer includes a cushion layer and an embossed adhesive layer, wherein the cushion layer includes an adhesive polymer resin, hollow particles and carbon black nanoparticles, the hollow particles are located in the adhesive polymer resin, the hollow particles include polymerized acrylic monomers or polymerized vinyl chloride monomers, and the carbon black nanoparticles are located in the adhesive polymer resin; the embossed adhesive layer is directly located on the cushion layer, and the impact absorbing layer can be attached to the display panel at the embossed adhesive layer.

[0019] In an embodiment, the weight percentage of the carbon black nanoparticles relative to the total weight of the cushion layer may be in the range of from about 0.5 wt % to about 5.0 wt %, and the weight percentage of the hollow particles relative to the total weight of the binding polymer resin and the hollow particles may be in the range of from about 0.5 wt % to about 20 wt %.

[0020] The embossed adhesive layer may be defined by a plurality of protrusions spaced apart from one another, and the extended portion of the cushion layer may define the plurality of protrusions.

[0021] The hollow particles may have an average diameter ranging from about 10 μm to about 80 μm.

[0022] According to an embodiment of the present invention, a display device may include a display panel and an impact absorbing layer that can be attached to the display panel. The impact absorbing layer includes: a cushion layer including an acrylic resin and hollow particles located in the acrylic resin; a light blocking layer directly located on the cushion layer; and an embossed adhesive layer, and the impact absorbing layer can be attached to the display panel through the embossed adhesive layer. The hollow particles in the cushion layer include polymerized acrylic monomers or polymerized vinyl chloride monomers, and the hollow particles have an average diameter of from about 10 μm to about 80 μm.

[0023] The display panel may include a light emitting device, a thin encapsulation layer, and an input sensing sensor directly on the thin encapsulation layer. The thin encapsulation layer may be disposed on the light emitting device. The input sensing sensor may be directly on the thin encapsulation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Embodiments will be more clearly understood from the following brief description taken in conjunction with the accompanying drawings.The accompanying drawings illustrate non-limiting embodiments as described herein.

[0025] Figure 1 is a perspective view showing an embodiment of a display device.

[0026] Figure 2 It is shown along Figure 1 An enlarged cross-sectional view of an embodiment of a portion of a display device taken along line II'.

[0027] Figure 3 is an enlarged cross-sectional view showing an embodiment of a shock absorbing module.

[0028] Figure 4 It is shown Figure 3 An enlarged cross-sectional view of an embodiment of an impact absorbing layer.

[0029] Figure 5 is an enlarged cross-sectional view showing an embodiment of hollow particles.

[0030] 6A to 6F is an enlarged cross-sectional view showing a modified embodiment of the impact absorbing layer.

[0031] Figures 7 to 9 This is an enlarged cross-sectional view showing another embodiment of the impact absorbing layer.

[0032] Fig.10 yes Figure 3 An enlarged cross-sectional view of an embodiment of a base layer.

[0033] Fig.11 yes Figure 2 An enlarged cross-sectional view of an embodiment of a display panel.

[0034] Fig. 12A and Fig. 12B is a cross-sectional view showing a structure of a display device in an embodiment of a method of manufacturing a display device.

[0035] It should be noted that these drawings are intended to illustrate the general characteristics of the methods, structures and / or materials used in certain exemplary embodiments, and are intended to supplement the written description provided below. However, these drawings are not drawn to scale and may not accurately reflect the precise structure or performance characteristics of any given embodiment, and should not be interpreted as defining or limiting the range or nature of values ​​covered by the embodiments. For example, the relative thickness and position of molecules, layers, regions and / or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numerals in the various drawings is intended to indicate the presence of similar or identical elements or features. DETAILED DESCRIPTION

[0036] Embodiments of the present invention will now be described more fully with reference to the accompanying drawings in which embodiments are shown. However, exemplary embodiments of the present invention may be implemented in many different forms and should not be construed as being limited only to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the embodiments to those of ordinary skill in the art. In the accompanying drawings, the thickness of layers and regions is exaggerated for clarity. The same reference numerals in the drawings refer to the same elements, and therefore, their descriptions will be omitted.

[0037] It will be understood that when an element is referred to as being "connected to" or "coupled to" another element, it may be directly connected to or directly coupled to the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly connected to" or "directly coupled to" another element, there are no intervening elements. Throughout the specification, like reference numerals refer to like elements.

[0038] It will be understood that when an element is referred to as being in relation to another element (such as, "on," "between," "adjacent," etc.), the element can be directly on the other element or intervening elements may be present therebetween. Conversely, when an element is referred to as being in relation to another element (such as, "directly on," "directly between," "directly adjacent," etc.), there are no intervening elements therebetween.

[0039] It will be understood that although the terms "first", "second", etc. can be used in this article to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the exemplary embodiments, the first element, first component, first region, first layer or first part discussed below can be referred to as the second element, second component, second region, second layer or second part.

[0040] For ease of description, spatially relative terms such as "below," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of an element or feature to another element (or elements) or feature (or features) as shown in the figures. It should be understood that, in addition to the orientation depicted in the drawings, spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being "below" or "below" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "below" may encompass both above and below orientations. The device may have additional orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0041] The terms used herein are only used for the purpose of describing specific embodiments, and are not intended to limit exemplary embodiments. As used herein, the singular forms "a", "an" and "the" are intended to also include plural forms, unless the context clearly states otherwise. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items. "At least one" should not be interpreted as limiting "a" or "an". "Or" means "and / or". It will be further understood that when used in this article, the terms "comprises", "comprising", "includes" and / or "including" specify the existence of the features, wholes, steps, operations, elements and / or components set forth, but do not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0042] Exemplary embodiments of the invention are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments (and intermediate structures) of exemplary embodiments. As such, variations in the shapes illustrated, such as due to manufacturing techniques and / or tolerances, are contemplated. Therefore, exemplary embodiments of the invention should not be construed as limited to the specific regional shapes shown herein, but rather should include deviations in shapes such as those caused by manufacturing.

[0043] As used herein, "about" or "approximately" includes the stated value and the mean within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0044] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the exemplary embodiments of the present invention belong. It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0045] Figure 1 is a perspective view showing an embodiment of a display device DD. Figure 1 As shown in , the display device DD may include a display surface IS that displays an image IM. The display surface IS may be defined in a plane parallel to a plane defined by a first direction DR1 and a second direction DR2 that intersect each other. A normal direction of the display surface IS (e.g., a thickness direction of the display device DD) will be referred to as a third direction DR3.

[0046] In the following description, the third direction DR3 may be used to distinguish the front surface or top surface of each element from its rear surface or bottom surface. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be merely examples or relative concepts, and may not be limited to the above examples, and in some embodiments, they may be changed to indicate other directions. Hereinafter, the first direction to the third direction may be the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3, respectively, and will be identified with the same reference numerals.

[0047] exist Figure 1In the embodiment, the display device DD is shown as having a flat display surface IS, but the present invention is not limited thereto. The display surface IS of the display device DD may have a curved shape or a three-dimensional shape. In the case where the display surface IS of the display device DD has a three-dimensional shape, the display surface IS may include a plurality of display areas or display regions oriented in different directions. In an embodiment, for example, the display device DD may have a display surface IS shaped like a polygonal column.

[0048] The display device DD according to one or more embodiments may be a flexible display device DD. However, the present invention is not limited to this example, and in an embodiment, the display device DD may be a relatively rigid (eg, flat or unbendable) display device DD. Figure 1 exemplarily shows a display device DD that can be used for a portable electronic terminal. Although not shown, the portable electronic terminal may further include an electronic module, a camera module, a power module, etc. mounted on a mainboard and disposed in a housing member (not shown). The display device DD may be used for relatively large-sized electronic devices (e.g., televisions and monitors) or relatively small-sized or medium-sized electronic devices (e.g., tablet computers, car navigation systems, game consoles, and smart watches).

[0049] like Figure 1 As shown in , the display surface IS may include a display area DA that generates and / or displays an image IM and a non-display area NDA adjacent to the display area DA. The non-display area NDA may not be used to display the image IM. As an example of the image IM, Figure 1 However, the present invention is not limited to this example, and in an embodiment, the display surface IS may include only the display area DA.

[0050] like Figure 1 As shown in , the display area DA may have a rectangular shape. The non-display area NDA may surround the display area DA in a plan view. However, the present invention is not limited to this example, and the shapes of the display area DA and the non-display area NDA may be variously changed in a complementary manner.

[0051] Figure 2 It is shown along Figure 1 An enlarged cross-sectional view of an embodiment of a portion of a display device DD taken along line II′. Figure 3 is an enlarged cross-sectional view showing an embodiment of a shock absorbing module SAM. Figure 3 The shock absorbing module SAM shown in FIG. Figure 2 The shock absorbing module SAM shown in FIG.

[0052] Reference Figure 2The display device DD may include a display panel DP and a shock absorbing module SAM. The shock absorbing module SAM may be disposed below the display panel DP. Since it is located below the display panel DP, the shock absorbing module SAM may be disposed along a third direction DR3 in a direction opposite to a direction in which an image IM is displayed.

[0053] Reference Figure 3 , the shock absorbing module SAM may include a base layer BSL and a shock absorbing layer SAL. The base layer BSL may be disposed below the shock absorbing layer SAL. The base layer BSL may face the display panel with the shock absorbing layer SAL therebetween. Although not shown, an additional adhesive member may be disposed between the base layer BSL and the shock absorbing layer SAL.

[0054] Figure 4 It is shown Figure 3 An enlarged cross-sectional view of an embodiment of a shock absorbing layer SAL. Figure 5 is an enlarged cross-sectional view showing an embodiment of hollow particles of the impact absorbing layer SAL.

[0055] Reference Figure 4 , the impact absorbing layer SAL may include a cushion layer CSL, an embossed adhesive layer EM and a first film layer FL1. In the present specification, the base film layer FL1 may refer to the first film layer FL1.

[0056] The first film layer FL1 may include a synthetic resin film. The first film layer FL1 may include a thermosetting resin. In an embodiment, the first film layer FL1 may be a polyimide resin layer, but the present invention is not limited to a specific material of the first film layer FL1. The first film layer FL1 may be formed of or include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin.

[0057] The cushion layer CSL may be disposed on the first film layer FL1. The cushion layer CSL may include a resin layer RS ​​(e.g., an adhesive polymer resin RS) and hollow particles CP. The adhesive polymer resin RS may be a homopolymer obtained by polymerizing any one of a monomer group selected from acrylic monomers, urethane monomers, olefin monomers, imide monomers, amide monomers, ester monomers, isocyanate monomers, epoxy monomers, and silicone monomers.

[0058] The adhesive polymer resin RS may be a copolymer of a first monomer and a second monomer. The first monomer and the second monomer may be of different types, and each monomer type may be a monomer selected from the above monomer group.

[0059] However, the present invention is not limited to this example, and the second monomer may be a monomer not included in the above monomer group. In an embodiment, for example, the second monomer may be a diamine monomer or a diol monomer. The diamine monomer or the diol monomer may be used as a crosslinking agent.

[0060] The olefin monomer may be, for example, an ethylene monomer, a propylene monomer or a butene monomer. The epoxy monomer may be, for example, a bisphenol epoxy monomer.

[0061] In an embodiment, the adhesive polymer resin RS may be an acrylic polymer obtained by polymerizing an acrylic monomer (e.g., a polymerized acrylic monomer). In an embodiment, for example, the adhesive polymer resin RS may include at least one of polyacrylates (e.g., polymethyl acrylate ("PMA") and polyethyl acrylate ("PEA")), polymethyl methacrylate ("PMMA"), polyacrylonitrile ("PAN"), and polyacrylamide ("PAA"). However, the present invention is not limited to this example, and the adhesive polymer resin RS may include various types of acrylic polymers.

[0062] In a conventional display device, in which an additional adhesive layer is provided on the top or bottom surface of the cushion layer CSL, the number of layers constituting the shock absorbing module SAM may increase, which may result in an increase in stress applied to each layer. Therefore, adhesive failure and layer separation problems may occur at edge portions of each layer constituting the shock absorbing layer SAL of the conventional display device.

[0063] According to one or more embodiments of the present invention, since the cushion layer CSL includes an adhesive polymer resin RS (e.g., self-adhesive), the cushion layer CSL can also be adhered to other elements even when there is no additional adhesive layer on the top and bottom surfaces of the cushion layer CSL. Therefore, the above-mentioned problems of conventional display devices may not occur. Therefore, the durability of the shock absorbing module SAM in one or more embodiments of the present invention can be improved. In addition, since the additional adhesive layer is omitted in the display device DD, a shock absorbing module SAM with a relatively small thickness can be achieved.

[0064] In the shock absorbing layer SAL according to the embodiment of the present invention, since an additional adhesive layer is not disposed on or under the cushion layer CSL, the shock absorbing layer SAL may be manufactured through a relatively simple manufacturing process, and the cost of the manufacturing process may be reduced.

[0065] Hollow particles CP can be dispersed in the adhesive polymer resin RS. A plurality of hollow particles CP (e.g., a plurality of hollow particles CP) can be uniformly or non-uniformly dispersed in the adhesive polymer resin RS to improve the elastic properties of the cushion layer CSL. A plurality of hollow particles CP can be uniformly dispersed in the adhesive polymer resin RS.

[0066] The hollow particle CP may include a void portion HP (e.g., an empty portion HP) and a shell SP surrounding the void portion HP. The shell SP of the hollow particle CP may include an organic polymer material. In an embodiment, for example, the shell SP of the hollow particle CP may be formed of or include a polymer material obtained by polymerizing at least one of an acrylic acid monomer and a vinyl chloride monomer (e.g., a polymerized acrylic acid monomer or a polymerized vinyl chloride monomer). In an embodiment, the hollow particle CP may be formed of a copolymer obtained by copolymerizing acrylonitrile monomers and acrylic acid monomers (e.g., a copolymer of acrylonitrile monomers and acrylic acid monomers) or a copolymer obtained by copolymerizing vinylidene chloride monomers and acrylic acid monomers (e.g., a copolymer of vinylidene chloride monomers and acrylic acid monomers), or include the above copolymers.

[0067] The density of the hollow particles CP can be from about 0.08 g / cm3 (g / cm 3 ) to about 0.40g / cm 3 In the range of, and specifically, can be about from 0.12g / cm 3 To about 0.30g / cm 3 The density of the hollow particles CP is less than 0.08g / cm 3 In the case where the density of the hollow particles CP is greater than 0.40 g / cm 3 In this case, the thickness of the shell SP of the hollow particle CP may increase, and this may result in deterioration of the elastic force and impact absorption rate of the hollow particle CP.

[0068] Reference Figure 5 , the hollow particle CP may include a void portion HP and a shell SP. The shell SP may surround the void portion HP. The hollow particle CP may have a spherical shape. However, the present invention is not limited to this example, and the hollow particle CP may have a quasi-spherical shape (e.g., an elliptical surface or a spherical surface having at least one uneven portion).

[0069] The average diameter of the hollow particles CP may be in the range of about 10 micrometers (μm) to about 80 μm, and specifically, in the range of about 20 μm to about 70 μm. In the case where the hollow particles CP do not have a spherical shape, the average diameter of the hollow particles CP may represent the average value of the lengths of segments, each segment passing through the center of mass of the hollow particles CP and connecting two opposite points on the outer surface of the hollow particles CP.

[0070] When the average diameter of the hollow particles CP is less than 10 μm, the elastic force and impact absorption rate of the hollow particles CP may be reduced. In this case, the impact absorption module SAM may not effectively protect the display device DD from external impact. When the average diameter of the hollow particles CP is greater than 80 μm, the interface roughness of the cushion layer CSL may increase. In this case, the interface bonding strength of the cushion layer CSL may be reduced, and thus the failure rate may increase.

[0071] According to an embodiment of the present invention, since the shock absorbing module SAM includes the cushion layer CSL in which the hollow particles CP having an average diameter of about 10 μm to about 80 μm are disposed, the shock absorbing module SAM can have sufficiently high interface adhesive strength and can reduce the force applied to the display device DD due to external impact.

[0072] The hollow particles CP may include or define a first hollow particle CP having an average diameter in a range from about 10 μm to about 40 μm and a second hollow particle CP having an average diameter in a range from about 40 μm to about 80 μm. The cushion layer CSL may include at least one of the first hollow particle CP and the second hollow particle CP. In other words, the cushion layer CSL may include the first hollow particle CP or the second hollow particle CP, or may include both the first hollow particle CP and the second hollow particle CP. In the case where the cushion layer CSL includes both the first hollow particle CP and the second hollow particle CP, the impact absorption rate and the interface bonding strength may be more appropriately adjusted.

[0073] The weight percentage of the hollow particles CP relative to the total weight of the cushion layer CSL may range from about 0.5 wt % to about 20.0 wt %.The weight percentage of the adhesive polymer resin RS relative to the total weight of the cushion layer CSL may range from about 80.0 wt % to about 99.5 wt %.

[0074] In an embodiment, the weight percentage of the hollow particles CP relative to the total weight of the cushion layer CSL may be in the range from about 5.0 wt % to about 10.0 wt %, and the weight percentage of the adhesive polymer resin RS relative to the total weight of the cushion layer CSL may be in the range from about 90.0 wt % to about 95.0 wt %.

[0075] In the case where the weight percentage of the hollow particles CP is less than 0.5wt%, the impact absorption rate of the cushion layer CSL may be reduced, and thus, the display device DD may be easily damaged by external impact. In the case where the weight percentage of the hollow particles CP is greater than 20.0wt%, the cushion layer CSL may not have a sufficiently high interface bonding strength, and thus, layer separation or detachment problems may occur at the interface of the cushion layer CSL.

[0076] The embossed adhesive layer EM may be disposed on the cushion layer CSL. The present invention is not limited to a specific material of the embossed adhesive layer EM, and various adhesive materials well known to those skilled in the art may be used for the embossed adhesive layer EM. In an embodiment, for example, at least one of various polymer resins may be used as a material for the embossed adhesive layer EM.

[0077] The pattern PT may be defined in or by a portion of the embossed adhesive layer EM. The embossed adhesive layer EM may include a base portion BP including or defining a first surface DS and a second surface US that are opposite to each other. The first surface DS may be adjacent to the cushion layer CSL and disposed in a plane parallel to a plane defined by the first direction DR1 and the second direction DR2. The pattern PT may be defined at the second surface US of the base portion BP of the embossed adhesive layer EM. The second surface US may define a reference surface or reference plane from which the pattern PT protrudes.

[0078] The pattern PT may be provided as a plurality of protrusions each extending from the second surface US. The protrusions may be spaced apart from each other along the base portion BP (e.g., along the first direction DR1), and portions of the second surface US may be exposed between protrusions adjacent to each other. In an embodiment, the pattern PT and the embossed adhesive layer EM may constitute a single object. As a single object, an extension of the base portion BP may define the pattern PT, or the pattern PT may define an extension of the base portion BP. Figure 4 , the pattern PT is shown to have a protruding rectangular shape, however, the present invention is not limited to a specific shape of the pattern PT. In an embodiment, for example, the pattern PT may have a semicircular shape, a semi-elliptical shape, or a polygonal shape.

[0079] Since the embossed adhesive layer EM includes the patterns PT disposed to protrude from the second surface US of the base portion BP, the adhesive area and adhesive strength between the shock absorbing module SAM and the display panel DP in the adhesive process may be increased.

[0080] 6A to 6F is an enlarged cross-sectional view showing a modified embodiment of the impact absorbing layer SAL including impact absorbing layers SAL-1a, SAL-1b, SAL-1c, SAL-1d, SAL-1e, and SAL-1f (hereinafter referred to as SAL-1a to SAL-1f). Figures 7 to 9 is an enlarged cross-sectional view showing another embodiment of the impact absorbing layer SAL including the impact absorbing layers SAL- 2 , SAL- 3 , and SAL- 4 .

[0081] 6A to 6F Each of the impact absorbing layers SAL-1a to SAL-1f shown in FIG. Figures 7 to 9 Each of the impact absorbing layers SAL-2, SAL-3 and SAL-4 may be Figure 4 The impact absorbing layer SAL shown in FIG. 1 corresponds to the impact absorbing layer SAL shown in FIG. 1 , and therefore, the following description will focus on the impact absorbing layer SAL shown in FIG. Figure 4 The difference between the impact absorbing layer SAL described in .

[0082] Reference 6A to 6F , each of the impact absorbing layers SAL-1a to SAL-1f may further include a light blocking layer BLL. The light blocking layer BLL may include a base resin BR and light blocking particles NCB (e.g., carbon black nanoparticles NCB). The present invention is not limited to a specific material of the base resin BR, and in an embodiment, materials known in the art (e.g., polymer resins) may be used for the base resin BR. The carbon black nanoparticles NCB may have a nanoscale size and may include a carbonaceous material that is produced by incomplete combustion of hydrocarbons and has the shape of colloidal particles. The carbon black nanoparticles NCB may have an average diameter in a range from about 1 nanometer (nm) to about 1000 nm, and may absorb light in the visible light wavelength range.

[0083] Since each of the impact absorbing layers SAL-1a to SAL-1f includes the light blocking layer BLL, external light incident into the display device DD from the outside of the display device DD can be absorbed by the light blocking layer BLL. Therefore, reflection of external light can be reduced. Therefore, visibility of the display device DD can be improved.

[0084] Reference 6A to 6F , the stacking positions of the first film layer FL1 and the light blocking layer BLL may be changed differently. In other words, the first film layer FL1 and the light blocking layer BLL may be stacked on the base layer BSL (eg, see Figure 3 Here, the present invention is not limited to a specific stacking order of the first film layer FL1 and the light blocking layer BLL.

[0085] The cushion layer CSL can be directly attached to the element, which is disposed on the cushion layer CSL or disposed below the cushion layer CSL, without any intervening additional adhesive layer. In other words, the element on the cushion layer CSL can be directly disposed on the top portion of the cushion layer CSL, and the element below the cushion layer CSL can be directly disposed on the bottom portion of the cushion layer CSL. In an embodiment, for example, referring to Fig. 6A , the light blocking layer BLL may be directly disposed on the cushion layer CSL, and the first film layer FL1 may be directly disposed under the cushion layer CSL. When two elements are “directly disposed” or “directly connected” to each other, an interface may be formed between the elements.

[0086] 6A to 6FThe impact absorbing layers SAL-1a to SAL-1f which are different from each other in terms of the stacking order of the first film layer FL1, the cushion layer CSL, and the light blocking layer BLL are shown.

[0087] exist Fig. 6A In the impact absorbing layer SAL-1a shown in FIG. 4 , the cushion layer CSL may be directly disposed on the first film layer FL1 , and the light blocking layer BLL may be directly disposed on the cushion layer CSL.

[0088] exist Figure 6B In the impact absorbing layer SAL-1b shown in FIG. 4 , the light blocking layer BLL may be directly disposed on the cushion layer CSL, and the first film layer FL1 may be disposed on the light blocking layer BLL.

[0089] exist Figure 6C In the impact absorbing layer SAL-1c shown in FIG. 4 , the first film layer FL1 may be disposed on the light blocking layer BLL, and the cushion layer CSL may be directly disposed on the first film layer FL1 .

[0090] exist Fig.6D In the impact absorbing layer SAL-1d shown in FIG. 4 , the first film layer FL1 may be directly disposed on the cushion layer CSL, and the light blocking layer BLL may be disposed on the first film layer FL1 .

[0091] exist Fig. 6E In the impact absorbing layer SAL-1e shown in FIG. 4 , the light blocking layer BLL may be disposed on the first film layer FL1 , and the cushion layer CSL may be directly disposed on the light blocking layer BLL.

[0092] exist Fig. 6F In the impact absorbing layer SAL-1f shown in FIG. 4 , the first film layer FL1 may be directly disposed on the cushion layer CSL, and the cushion layer CSL may be directly disposed on the light blocking layer BLL.

[0093] Even though Figures 7 to 9 An example in which the impact absorbing layers SAL-2, SAL-3, and SAL-4 have a specific stacking structure is shown, but the stacking structure of the layers within the impact absorbing layers SAL-2, SAL-3, and SAL-4 may be as follows: 6A to 6F Make various changes as shown in .

[0094] Reference Figure 7 , the impact absorbing layer SAL-2 may include a first film layer FL1, a cushion layer CSL-1 and an embossed adhesive layer EM which are stacked sequentially.

[0095] Reference Figure 7 , the cushion layer CSL-1 may further include carbon black nanoparticles NCB. Since the cushion layer CSL-1 includes the carbon black nanoparticles NCB, the cushion layer CSL-1 may have a light blocking function.

[0096] The weight percentage of the carbon black nanoparticles NCB relative to the total weight of the cushion layer CSL-1 may be in the range of about 0.5 wt % to about 5.0 wt %. In the cushion layer CSL-1, the weight percentage of the hollow particles CP relative to the total weight of the binding polymer resin RS and the hollow particles CP may be in the range of about 0.5 wt % to about 20.0 wt %, and specifically, in the range of about 5.0 wt % to about 10.0 wt %.

[0097] In the case where the cushion layer CSL-1 satisfies the above-mentioned ratio conditions, the cushion layer CSL-1 may have desired characteristics in terms of light blocking function, impact absorption rate, and interface adhesive strength.

[0098] Since the cushion layer CSL-1 has a light blocking function, the light blocking layer BLL can be omitted from the shock absorbing layer SAL-2. Therefore, the shock absorbing layer SAL-2 can be manufactured to have a relatively thin structure. In addition, since the number of layers constituting the shock absorbing layer SAL-2 is reduced, the stress applied to the edge portion of each layer constituting the shock absorbing layer SAL-2 can be reduced. Therefore, the layer separation or detachment problem at the interface of the edge portion of each layer can be reduced or effectively prevented.

[0099] Figure 8 The impact absorbing layer SAL-3 may further include a light blocking layer BLL disposed directly between the cushion layer CSL-1 and the embossed adhesive layer EM. Since the impact absorbing layer SAL-3 further includes the light blocking layer BLL disposed on the cushion layer CSL-1 including the carbon black nanoparticles NCB, reflection of external light may be reduced and visibility of the display device DD may be further improved.

[0100] Reference Fig. 9 In the impact absorbing layer SAL-4, the cushion layer CSL-2 and the embossed adhesive layer EM may be configured to be formed as a single object. That is, the embossed adhesive layer EM is defined by a plurality of protrusions (e.g., patterns PT) spaced apart from each other, and an extended portion of the cushion layer CSL-2 defines a plurality of protrusions. In this case, the pattern PT may be defined in or at the second surface US of the cushion layer CSL-2. Fig. 9 The second surface US of the cushion layer CSL-2 may be Figure 4 The second surface US of the embossed adhesive layer EM corresponds to the surface. Since the cushion layer CSL-2 and the embossed adhesive layer EM are provided as a single object, the number of layers constituting the impact absorbing layer SAL-4 can be further reduced. Therefore, the layer separation or detachment problem at the edge portion of each layer can be further reduced or effectively prevented.

[0101] Fig.10 yes Figure 3 An enlarged cross-sectional view of an embodiment of a base layer BSL. The base layer BSL may include a second film layer FL2, a metal layer MTL, and a graphite layer GRP sequentially stacked in a direction toward the shock absorbing layer SAL. The first adhesive layer ADH1 may be disposed between the graphite layer GRP and the metal layer MTL, and the second adhesive layer ADH2 may be disposed between the metal layer MTL and the second film layer FL2. The base layer BSL may be disposed below the shock absorbing layer SAL to protect the shock absorbing module SAM from external temperature changes or external shocks. The graphite layer GRP may be disposed closest to the shock absorbing layer SAL.

[0102] The second film layer FL2 may have substantially the same features as those of the first film layer FL1 described above. The second film layer FL2 may be formed of, for example, a polyethylene terephthalate resin or include, for example, a polyethylene terephthalate resin. The metal layer MTL may be formed of, for example, at least one of a plurality of metal materials (eg, copper, etc.) or include at least one of a plurality of metal materials.

[0103] Fig.11 It is shown Figure 2 FIG. 1 is an enlarged cross-sectional view of the display panel DP shown in FIG. Fig.11 , the display panel DP may include a substrate BL, a circuit layer CL, a light emitting device layer ODL, a thin encapsulation layer TFE, an input sensing sensor ISS (eg, an input sensing layer ISS), and a window WD.

[0104] The substrate BL may include a synthetic resin film. The substrate BL may include a thermosetting resin. The substrate BL may be a polyimide resin layer, but the present invention is not limited to a specific material of the substrate BL. The substrate BL may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin.

[0105] The circuit layer CL may be disposed on the substrate BL. The circuit layer CL may include a plurality of insulating layers and a plurality of circuit devices (not shown). The insulating layer may include an organic layer and / or an inorganic layer. The circuit device (not shown) may include a signal line, a pixel driving circuit, etc. The circuit layer CL may be formed by disposing an insulating layer, a semiconductor layer, and a conductive layer using a coating or deposition process and then patterning the insulating layer, the semiconductor layer, and the conductive layer using a photolithography process.

[0106] The light emitting device layer ODL may include a plurality of light emitting devices OD (e.g., a plurality of light emitting devices OD) and a pixel defining layer PDL. The light emitting devices OD may each include a first electrode EL1, a hole transport region HTR, a light emitting layer EML, an electron transport region ETR, and a second electrode EL2. The light emitting device OD may be connected to the circuit layer CL to be controlled and / or driven, thereby generating light, displaying an image IM (see Figure 1 )wait.

[0107] The first electrode EL1 may have a conductive property. The first electrode EL1 may include or be formed of a metal alloy or a conductive compound. The first electrode EL1 may be an anode. In an embodiment, the first electrode EL1 may be a pixel electrode. The present invention is not limited to a specific material of the first electrode EL1, and the first electrode EL1 may include at least one of materials known in the art.

[0108] The hole transport region HTR may be disposed on the first electrode EL1. The hole transport region HTR may include at least one of a hole injection layer, a hole transport layer, a hole buffer layer, and an electron blocking layer. The hole transport region HTR may have a single-layer structure formed of a single material or a plurality of different materials, or may have a multilayer structure including a plurality of layers, and the plurality of layers are formed of a plurality of different materials. The present invention is not limited to a specific material of the hole transport region HTR, and in an embodiment, the hole transport region HTR may include at least one of the materials known in the art.

[0109] The light-emitting layer EML may be disposed on the hole transport region HTR. The light-emitting layer EML may include an organic compound as its light-emitting material. However, the present invention is not limited to this example, and in an embodiment, the light-emitting layer EML may include a quantum dot material as its light-emitting material. In an embodiment, the core of the quantum dot may be selected from II-VI compounds, III-V compounds, IV-VI compounds, IV elements, IV compounds, and combinations thereof, but the present invention is not limited to this example.

[0110] The electron transport region ETR may be disposed on the light emitting layer EML. The electron transport region ETR may include at least one of a hole blocking layer, an electron transport layer, and an electron injection layer, but the present invention is not limited to this example. The electron transport region ETR may have a single-layer structure provided or formed by a single material or by a plurality of different materials, or may have a multilayer structure including a plurality of layers, the plurality of layers including a plurality of different materials or being formed by a plurality of different materials. The present invention is not limited to a specific material of the electron transport region ETR, and in an embodiment, the electron transport region ETR may include at least one of the materials known in the art.

[0111] The second electrode EL2 may be disposed on the electron transport region ETR. The second electrode EL2 may be a common electrode or a cathode. The present invention is not limited to a specific material of the second electrode EL2, and in an embodiment, the second electrode EL2 may include at least one of materials known in the art.

[0112] The pixel defining layer PDL may define an opening in which a portion of the light emitting device OD is disposed. The opening of the pixel defining layer PDL may define a light emitting region of a pixel of the display panel DP, but is not limited thereto.

[0113] In an embodiment, the thin encapsulation layer TFE may directly cover the second electrode EL2. In an embodiment, a capping layer (not shown) may be further provided to cover the second electrode EL2. Here, the thin encapsulation layer TFE may directly cover the capping layer. The thin encapsulation layer TFE may include at least one of an organic layer and an inorganic layer.

[0114] The input sensing sensor ISS may be disposed on the thin encapsulation layer TFE. The input sensing sensor ISS may be disposed directly on the thin encapsulation layer TFE. The input sensing sensor ISS may sense a change in electrostatic capacitance or a change in pressure caused by an external object applied to the display panel DP, and information obtained by the sensing may be used to determine whether there is an external input to the display panel DP or the display device DD.

[0115] The window WD may be provided on the input sensing sensor ISS. The window WD may be a plastic substrate, a glass substrate, or a substrate including an organic / inorganic combination material. The window WD may include a synthetic resin film. The window WD may be a synthetic resin film including at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin.

[0116] exist Fig.11 In the description of FIG. 1 , the light emitting device OD of the display panel DP is described as a self-luminous device, but the present invention is not limited to this example. In an embodiment, for example, the display panel DP may be one of a liquid crystal display panel, a plasma display panel, an electrophoretic display panel, a micro-electromechanical system (“MEMS”) display panel, and an electrowetting display panel.

[0117] Fig. 12A and Fig. 12B is an enlarged cross-sectional view showing a layer structure of a display device DD in an embodiment of a method of adhering a display panel DP to a shock absorbing module SAM. Specifically, Fig. 12A and Fig. 12B The structures of the display device DD before and after an embodiment of a process of adhering the display panel DP and the shock absorbing module SAM to each other are respectively shown. Fig. 12A and Fig. 12B The display panel DP and the shock absorbing module SAM may have substantially the same features as those in the aforementioned embodiments.

[0118] Reference Fig. 12A and Fig. 12B , the display panel DP and the shock absorbing module SAM may be adhered to each other through the embossed adhesive layer EM in the shock absorbing module SAM. In the process of adhering the display panel DP to the shock absorbing module SAM, the pattern PT defined in the embossed adhesive layer EM may be flattened by pressure. That is, the protrusions of the pattern PT are compressed to conform to the second surface US in the shock absorbing module SAM and define the following Fig. 12B Therefore, the embossed adhesive layer EM included in the display device DD and coupled to the display panel DP may not include the pattern PT.

[0119] Hereinafter, according to an embodiment of the present invention, technical effects of a shock absorbing module SAM and a display device DD including the same may be described with reference to embodiments and comparative embodiments.

[0120] 1. Measure the impact absorption rate

[0121] (1) Manufacturing the shock absorbing layer SAL

[0122] The first film layer FL1 including polyimide is disposed on the metal support layer made of copper using an adhesive layer. Thereafter, the impact absorbing layer SAL according to exemplary embodiment 1 is provided by directly disposing a cushion layer CSL on the first film layer FL1 without interposing any adhesive layer. In the impact absorbing layer SAL of exemplary embodiment 1, the cushion layer CSL is provided by combining an adhesive acrylic polymer resin and hollow particles CP.

[0123] The comparative impact absorbing layer of Comparative Embodiment 1 was provided by the same method as that of the impact absorbing layer SAL of Exemplary Embodiment 1, except that the comparative cushion layer was formed only of a non-adhesive acrylic polymer resin and an adhesive member was additionally provided between the comparative cushion layer and the comparative first film layer.

[0124] (2) Measuring the impact absorption rate

[0125] The impact absorbing layer SAL of exemplary embodiment 1 is fixedly disposed on the test substrate, and then, a 13.8 gram (g) stainless steel ("SUS") ball is dropped from a height of 10 centimeters (cm) to measure the impulse (S1) applied to the cushion layer CSL. Then, the impact absorbing layer SAL is removed, and a 13.8 g SUS ball is dropped from the same height of 10 cm onto an empty test substrate to measure the impulse (S0) applied to the test substrate. This process is repeated three times. Thereafter, the impact absorption rate of the cushion layer CSL is calculated using the following formula.

[0126] Impact absorption rate (%)=(S0-S1) / (S0×100), where S0 is the impulse applied to the test substrate, and S1 is the impulse applied to the cushion layer CSL.

[0127] The impact absorption rate in Comparative Embodiment 1 was measured by the same method as that in Exemplary Embodiment 1, except that the comparative impact absorption layer according to Comparative Embodiment 1 was used.

[0128] Table 1 below summarizes the impact absorption capabilities of the impact absorption layers according to Exemplary Embodiment 1 and Comparative Embodiment 1.

[0129] [Table 1]

[0130]

[0131] Referring to Table 1, the shock absorption rate per impact and the average shock absorption rate of the shock absorption layer SAL according to Exemplary Embodiment 1 are higher than those of the comparative shock absorption layer according to Comparative Embodiment 1. This result indicates that the shock absorption layer SAL according to Exemplary Embodiment 1 has an improved shock absorption effect.

[0132] In the impact absorbing layer SAL according to an embodiment of the present invention, the cushion layer CSL may include an adhesive polymer resin RS and hollow particles CP, and an additional adhesive layer may be omitted, thereby resulting in such an improved impact absorbing effect.

[0133] The impact absorbing layer SAL in Exemplary Embodiment 1 is composed of a metal support layer made of copper, a first film layer FL1 made of polyimide, and a cushion layer CSL, but does not include a light blocking layer BLL and an embossed adhesive layer EM. However, since the light blocking layer BLL and the embossed adhesive layer EM are used as a light blocking element and an adhesive element, respectively, their contribution to impact absorption is small. Therefore, if the light blocking layer BLL and the embossed adhesive layer EM provided in the impact absorbing layer SAL in Exemplary Embodiment 1 and Comparative Embodiment 1 have the same structure, it is expected that a result in which the difference in impact absorption rate is similar to the difference in impact absorption rate in Table 1 will be obtained.

[0134] According to one or more embodiments of the present invention, the shock absorbing module SAM may include a cushion layer CSL including a binder polymer resin RS and hollow particles CP dispersed in the binder polymer resin RS and including a void portion HP and a shell SP surrounding the void portion HP. Therefore, separation or detachment of layers constituting the shock absorbing module SAM due to stress may be reduced or effectively prevented.

[0135] The display device DD according to one or more embodiments of the present invention may include the above-described shock absorbing module SAM. Therefore, the display device DD may have relatively high durability against a force generated thereto from an external impact, and may have a relatively thin overall thickness.

[0136] According to one or more embodiments of the present invention, the shock absorbing module SAM may have relatively high durability and reduced overall thickness, which provides a relatively thin structure.

[0137] According to one or more embodiments of the present invention, the display device DD including the shock absorbing module SAM may have a relatively high durability and a thin structure.

[0138] While embodiments of the present invention have been particularly shown and described, it will be understood by those skilled in the art that changes in form and details may be made in the embodiments of the present invention without departing from the spirit and scope of the invention.

Claims

1. Impact absorption module, including: A shock absorbing layer at which the shock absorbing module can be attached to the display panel, the shock absorbing layer comprising: A cushion layer comprising a binding polymer resin and hollow particles in the binding polymer resin, and Base layer, wherein the shock absorbing module attached to the display panel has the shock absorbing layer disposed between the display panel and the base layer, and The cushion layer has extending portions spaced apart from each other, the extending portions of the cushion layer define an embossed adhesive layer, and the impact absorbing layer is attached to the display panel through the extending portions of the cushion layer.

2. The impact absorbing module according to claim 1, further comprising a light blocking layer, The impact absorbing module attached to the display panel has the embossed adhesive layer disposed between the display panel and the light blocking layer.

3. The shock absorbing module according to claim 1, wherein: The adhesive polymer resin in the cushion layer includes at least one of an acrylic polymer, a urethane polymer, an olefin polymer, an imide polymer, an amide polymer, an ester polymer, an isocyanate polymer, an epoxy polymer, and a silicone polymer.

4. The shock absorbing module according to claim 1, wherein: The hollow particles in the cushion layer include a void portion and a shell surrounding the void portion, and the shell of the hollow particles includes a polymerized acrylic acid monomer or a polymerized vinyl chloride monomer.

5. The shock absorbing module according to claim 1, wherein: The hollow particles in the mat layer have an average diameter of from 10 μm to 40 μm or an average diameter of from 40 μm to 80 μm.

6. The shock absorbing module according to claim 1, wherein: The underlayer also includes a light blocking material disposed in the adhesive polymer resin.

7. The shock absorbing module according to claim 6, wherein The light blocking material is carbon black nanoparticles, and The weight percentage of the carbon black nanoparticles relative to the total weight of the mat layer ranges from 0.5 wt % to 5.0 wt %.

8. The shock absorbing module according to claim 1, wherein The impact absorbing layer further comprises a film layer comprising polyimide, and The impact absorbing module is attached to the display panel with the embossed adhesive layer disposed between the display panel and the film layer.

9. The shock absorbing module according to claim 1, wherein: The base layer includes a film layer, a metal layer and a graphite layer, and the film layer, the metal layer and the graphite layer are sequentially stacked in a direction toward the impact absorbing layer.

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