An antenna module including a printed circuit board and a base station including the antenna module

Abstract

The disclosure relates to a communication method and system for fusing a fifth generation (5G) communication system supporting a higher data rate than a fourth generation (4G) system with Internet of Things (IoT) technology. The disclosure can be applied to intelligent services, such as smart homes, smart buildings, smart cities, smart cars, interconnected cars, healthcare, digital education, smart retail, and security and safety services, based on 5G communication technology and IoT-related technology. The disclosure provides an antenna module including a printed circuit board and a base station including the same. The antenna module includes a printed circuit board in which at least one layer is stacked, a feeding unit disposed at one surface of the printed circuit board, and a first antenna spaced apart from the feeding unit by a predetermined first length.

Description

TECHNICAL FIELD

[0001] The present disclosure provides an antenna module including a printed circuit board and a base station including the same. BACKGROUND

[0002] To meet increasing demand with respect to wireless data traffic after deployment of 4G communication systems, efforts have been made to develop an improved 5G communication system or a pre-5G communication system. Therefore, the 5G communication system or the pre-5G communication system is also called a "beyond 4G network" or a "post LTE system." The 5G communication system is considered to be implemented in higher frequency (mmWave) bands, e.g., 60 GHz bands, so as to accomplish higher data rates beyond those of the 4G communication system. To decrease propagation loss of the radio waves and increase the transmission distance, the beamforming, massive multiple-input multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, an analog beam forming, and large scale antenna techniques are discussed for use in 5G communication systems. In addition, in 5G communication systems, development for improving network systems is under way based on advanced small cells, cloud radio access networks (RANs), ultra-dense networks, a technology for coordination between cells, an interference mitigation, a network-based intelligent transport system (ITS), and the like. In the 5G system, hybrid FSK and QAM modulation (FQAM) and sliding window superposition coding (SWSC) as an advanced coding modulation (ACM), and filter bank multi carrier (FBMC), a non-orthogonal multiple access (NOMA), and a sparse code multiple access (SCMA) as an advanced access technology have been developed.

[0003] The Internet is evolving into an Internet of things (IoT), where distributed entities, such as things, exchange and process information without human intervention. The Internet of everything (IoE), which is a combination of the Internet of things (IoT) and the big data processing technology, has emerged as a new paradigm for the IoT. Technology elements, such as "sensing technology," "wired / wireless communication and network infrastructure," "service interface technology," and "security technology" have been demanded for IoT implementation, and therefore, a sensor network, machine-to-machine (M2M) communication, machine type communication (MTC), and the like have been researched. Such an IoT environment can provide intelligent Internet technology services that create a new value through the collection and analysis of data generated from connected things. The IoT can be applied to a variety of fields including smart home, smart building, smart city, smart car or connected cars, smart grid, health care, smart appliances, and advanced medical services through convergence and combination between the existing information technology (IT) and various industrial applications.

[0004] In view of this, various attempts have been made to apply the 5G communication system to IoT networks. For example, technologies such as a sensor network, machine type communication (MTC), and machine-to-machine (M2M) communication can be implemented by beamforming, MIMO, and array antennas. The application of a cloud radio access network (RAN) as the above-described big data processing technology can also be considered as an example of convergence of the 5G technology with the IoT technology.

[0005] In the case where the antenna module includes a printed circuit board, the performance of the antenna module can be affected by the manufacturing process of the printed circuit board. For example, as the number of stacks of layers required to manufacture the printed circuit board increases, the performance of the antenna module can decrease, and the failure rate of the antenna module can increase when the antenna module is manufactured. SUMMARY

[0006] In view of the above-described problems, the present disclosure is proposed, and the present disclosure provides an antenna module including a printed circuit board and a base station including the same.

[0007] According to various embodiments of the present disclosure, an antenna module including a printed circuit board can include a printed circuit board in which at least one layer is stacked, a feeding unit disposed on one surface of the printed circuit board, and a first antenna spaced apart from the feeding unit by a predetermined first length.

[0008] According to various embodiments of the present disclosure, a base station is provided, the base station including an antenna module, wherein the antenna module includes a printed circuit board in which at least one layer is stacked, a feeding unit disposed on one surface of the printed circuit board, and a first antenna spaced apart from the feeding unit by a predetermined first length. BRIEF DESCRIPTION OF DRAWINGS

[0009] In the drawings, identical or similar reference numerals can be used for identical or similar components.

[0010] Figure 1 FIG. 1 is a schematic diagram illustrating an antenna module structure according to an embodiment.

[0011] Figure 2 FIG. 2 is a side view illustrating an antenna module structure according to an embodiment.

[0012] Figure 3 FIG. 3 is a side view illustrating an antenna module structure according to the present disclosure.

[0013] Figure 4 FIG. 4 is an exploded view illustrating an antenna module structure according to the present disclosure.

[0014] Figure 5Ais a diagram showing a length of a gap between a first antenna and a second antenna in an antenna module structure according to the present disclosure.

[0015] Figure 5B is a diagram showing a size of a first antenna in an antenna module structure according to the present disclosure.

[0016] Figure 5C is a diagram showing a size of a second antenna in an antenna module structure according to the present disclosure.

[0017] Figure 5D is a diagram showing a length of a gap between a feeding unit and a first antenna in an antenna module structure according to the present disclosure.

[0018] Figure 5E is a diagram showing a length of a feeding unit solder pad in an antenna module structure according to the present disclosure.

[0019] Figure 5F is a diagram showing a distance between a center of an antenna and a center of a feeding unit in an antenna module structure according to the present disclosure.

[0020] Figure 5G is a diagram showing a length of a feeding unit in an antenna module structure according to the present disclosure.

[0021] Figure 6A is a diagram showing an antenna module manufacturing process according to a first embodiment disclosed in the present disclosure.

[0022] Figure 6B is a diagram showing an antenna module manufacturing process according to a second embodiment disclosed in the present disclosure.

[0023] Figure 6C is a diagram showing an antenna module manufacturing process according to a third embodiment disclosed in the present disclosure.

[0024] Figure 7A is a graph showing gain values of an antenna module including 16 antenna arrays according to an embodiment of the present disclosure.

[0025] Figure 7B is a graph showing gain values of an antenna module including 256 antenna arrays according to an embodiment of the present disclosure.

[0026] Figure 8 is a diagram showing an antenna module structure according to an embodiment.

[0027] Figure 9 is a diagram showing an antenna module structure according to another embodiment.

[0028] Figure 10is a diagram illustrating an antenna module structure according to an embodiment.

[0029] Figure 11 is a diagram illustrating a derived structure of an antenna module according to various embodiments.

[0030] Figure 12 is a diagram illustrating an antenna structure according to an embodiment.

[0031] Figure 13 is a diagram illustrating a change in a gain value according to an embodiment. DETAILED DESCRIPTION

[0032] When describing embodiments in the present specification, a description of technical contents well-known in the field of the disclosure and not directly related to the disclosure will be omitted. This is to clearly describe the subject matter of the disclosure without obscuring the subject matter by omitting any unnecessary description.

[0033] Similarly, in the drawings, some constituent elements are shown in an exaggerated or schematic form or are omitted. Also, the size of each constituent element does not completely reflect the actual size. In the drawings, like reference numerals denote like elements.

[0034] These advantages and features of the present disclosure, as well as the method for achieving them, will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. However, the present disclosure is not limited to the following embodiments and can be implemented in different forms. The present embodiments enable the present disclosure to be fully disclosed, and are provided to enable those skilled in the art to completely understand the scope of the present disclosure, which is defined by the scope of claims. Throughout the specification, like reference numerals denote like elements.

[0035] In this document, each block and combinations thereof can be means for performing the functions described in the block and combinations thereof. To perform the functions of the blocks, the computer program instructions implementing the blocks can be installed on a processor of a general use computer, a special purpose computer, or other programmable data processing apparatus. Thus, the instructions executed by the processor of the computer or other programmable data processing apparatus generate means for performing the functions described in the blocks. To implement the functions in a specific manner, the computer program instructions can be stored in a computer usable or computer readable storage medium that can direct the computer or other programmable data processing apparatus. Thus, the instructions stored in the computer usable or computer readable storage medium can generate a product item including an instruction means for performing the functions described in the blocks. Because the computer program instructions can be installed on the computer or other programmable data processing apparatus, a series of operation steps are performed on the computer or other programmable data processing apparatus, and a process executed by the computer is generated, and the instructions that direct the computer or other programmable data processing apparatus can provide steps for performing the functions described in the blocks.

[0036] Further, each block can represent a module, a segment, or a portion of code, which includes at least one executable instruction for performing a specific logical function. Further, it should be noted that in several alternative execution examples, the functions described in the blocks can be performed regardless of the order. For example, two blocks shown in succession can be executed substantially simultaneously, or at times, the blocks can be executed in reverse order according to corresponding functions.

[0037] In this case, the term "unit" used in the present embodiment refers to a software or hardware component such as a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC) and performs any function. However, the "unit" is not limited to software or hardware. The "unit" can be configured so as to be stored in a storage medium that can be addressed, and can be configured so as to reproduce at least one processor. Accordingly, the "unit" includes, for example, components such as software components, object-oriented software components, class components, and task components, processes, functions, attributes, procedures, sub-routines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functions provided within components and "units" can be performed by coupling a smaller number of components and "units" or by subdividing a component and a "unit" into additional components and "units." Further, components and "units" can be implemented in the manner of at least one CPU within a reproduction device or a secure multimedia card. Further, in an embodiment, the "unit" can include at least one processor.

[0038] Figure 1 FIG. 1 is a schematic diagram illustrating an antenna module structure according to an embodiment.

[0039] According to an embodiment, the antenna module can include a first substrate layer 101 in which at least one substrate is stacked, at least one first antenna 131 disposed at an upper end surface of the first substrate layer 101, a second substrate layer 111 having an upper end surface coupled with a lower end surface of the first substrate layer 101 and in which at least one substrate is stacked, and a wireless communication chip 121 coupled to a lower end surface of the second substrate layer 111.

[0040] According to an embodiment, the first substrate layer 101 and the second substrate layer 111 refer to substrates in which circuits are formed, and can generally include a printed circuit board (PCB) and a printed wiring board (PWB). According to various embodiments, the first substrate layer 101 and the second substrate layer 111 can form a circuit for connecting each circuit component of a surface or an inside of a substrate based on a designed circuit.

[0041] According to an embodiment, the first substrate layer 101 to which the at least one first antenna 131 is coupled can be a main board of the antenna module according to the disclosure. The at least one first antenna 131 and another circuit component (for example, a wireless communication chip) can be electrically connected to each other by a wiring formed in the first substrate layer 101.

[0042] According to an embodiment, at the upper end surface of the first substrate layer 101, the at least one first antenna 131 can be disposed. For example, as shown in FIG. 1A, four first antennas 131 can be spaced apart at regular intervals to be disposed at the upper end surface of the first substrate layer 101. Figure 1

[0043] In an embodiment, a cover 191 can be disposed at the upper end surface of the first substrate layer 101. For example, the cover 191 can be made of plastic and surround the at least one first antenna disposed at the upper end surface of the first substrate layer 101. According to various embodiments, the at least one second antenna 141 can be disposed on one surface of the cover 191 facing the at least one first antenna 131. For example, the at least one second antenna 141 can be disposed to correspond to the at least one first antenna 131.

[0044] According to an embodiment, the at least one first antenna 131 and the at least one second antenna 141 can be configured as patch antennas. According to various embodiments, the antenna module can include the at least one first antenna 131 and the at least one second antenna 141, thereby improving a gain value or a coverage range.

[0045] According to an embodiment, the second substrate layer 111 is a substrate layer for circuit wiring between the wireless communication chip 121 and other circuit components. According to various embodiments, a plurality of substrates can also be stacked on the second substrate layer 111. According to an embodiment, the number of substrates stacked on the second substrate layer 111 can be less than the number of substrates stacked on the first substrate layer 101. ​

[0046] According to an embodiment, a grid array can be formed at a lower end surface of the first substrate layer 101, and the first substrate layer 101 and the second substrate layer 111 can be electrically connected through the grid array. According to various embodiments, the grid array can include a land grid array (LGA) or a ball grid array (BGA).

[0047] According to an embodiment, at least one capacitor 151 can be disposed at a lower end surface of the second substrate layer 111. Noise generated in a circuit disposed at the second substrate layer 111 can be removed through the at least one capacitor 151, thereby improving stability of the antenna module. For example, the at least one capacitor 151 can be a surface mount device (SMD) type capacitor.

[0048] According to an embodiment, the antenna module can include a shield 171 coupled to a lower end surface of the first substrate layer 101 to enclose the second substrate layer 111 and the wireless communication chip 121. According to various embodiments, the shield 171 can shield electromagnetic waves generated in the second substrate layer 111 and the wireless communication chip 121. For example, the shield 171 can be coupled to the lower end surface of the first substrate layer 101 through a shield jig.

[0049] According to an embodiment, the wireless communication chip 121 can be a wireless communication chip that implements a wireless communication circuit on one semiconductor chip by using active elements and passive elements. According to various embodiments, an operation of the wireless communication chip 121 can generate heat, and the heat generation can cause a performance of the wireless communication chip 121 to degrade. According to an embodiment, a thermal interface material 161 (TIM) can be disposed between the wireless communication chip 121 and the shield 171 to radiate heat generated in the wireless communication chip 121 to the outside of the antenna module.

[0050] According to an embodiment, heat generated in the wireless communication chip 121 can be transferred to the shield 171 through the thermal interface material 161, and the heat transferred to the shield 171 can be transferred to a heat spreader 181 coupled to a lower end surface of the first substrate layer 101 and a lower end surface of the shield 171 to be radiated to the outside of the antenna module.

[0051] Figure 2 FIG. 1 is a perspective view illustrating an antenna module structure according to an embodiment.

[0052] According to an embodiment, the antenna module can include a printed circuit board 201 in which a plurality of layers are stacked. For example, the printed circuit board 201 can be formed by stacking 18 layers. According to various embodiments, a through hole can be formed in each layer of the printed circuit board 201. For example, the printed circuit board 201 can include a through hole generated through a laser process and a through hole 241 generated through a plated through hole (PTH) process.

[0053] According to an embodiment, a first antenna 211 for radiating radio waves can be provided on one surface of the printed circuit board 201. For example, at a first layer stacked on an upper end surface of the printed circuit board 201, the first antenna 211 can be provided. According to various embodiments, a via hole can be formed in the first layer through a laser process, and the first antenna 211 can receive an electrical signal for radiating radio waves through the via hole.

[0054] According to an embodiment, via holes can be formed in a second layer and a third layer, which are disposed below the first layer provided at the upper end surface of the printed circuit board 201, through a laser process. In an embodiment, according to various embodiments, a ground can be provided at one surface of the third layer.

[0055] According to an embodiment, an electrical signal for generating a radio frequency can be provided to the other surface of the printed circuit board 201. For example, in order to generate a radio frequency, a base signal for generating a radio frequency, an intermediate frequency signal, and an oscillator frequency signal for changing the frequency of the base signal can be required, and the base signal, the intermediate frequency signal, and the oscillator frequency signal can be provided to the other surface of the printed circuit board 201.

[0056] According to an embodiment, a base signal can be provided through A provided at the other surface of the printed circuit board 201. According to various embodiments, the base signal provided through A can be transmitted to the first antenna 211 provided at one surface of the printed circuit board 201 through a via hole formed in the printed circuit board.

[0057] According to an embodiment, an intermediate frequency signal can be provided through B provided at the other surface of the printed circuit board 201. According to various embodiments, the intermediate frequency signal provided through B can be transmitted to the printed circuit board through a via hole formed in the printed circuit board. For example, the intermediate frequency signal can be transmitted to one surface of the third layer through a via hole formed in a second layer provided at the other surface of the printed circuit board and a third layer disposed above the second layer. According to an embodiment, the base signal provided through A can also be transmitted to one surface of the third layer through a via hole formed in the second layer and the third layer. According to various embodiments, a power supply line for electrically connecting the via hole 241 formed through a PTH process and the via hole formed through a laser process can be formed at one surface of the third layer.

[0058] According to an embodiment, an oscillator frequency signal can be provided through C provided at the other surface of the printed circuit board 201. According to various embodiments, the oscillator frequency signal provided through C can be transmitted to the printed circuit board through a via hole formed in the printed circuit board. For example, the oscillator frequency signal can be transmitted to one surface of the fifth layer through a via hole provided in a fourth layer and a fifth layer disposed above the third layer.

[0059] According to an embodiment, a feed line for a middle frequency signal and a feed line for a local frequency signal can be formed in different layers. Referring to the aforementioned example, the feed line for the middle frequency signal can be formed at one surface of the third layer, and the feed line for the local frequency signal can be formed at one surface of the fifth layer.

[0060] According to an embodiment, a cover 231 for protecting the first antenna 211 from external impact can be provided at one surface of the printed circuit board 201. According to various embodiments, the cover 231 can be plastic and have a shape that encloses the first antenna 211. According to an embodiment, the second antenna 221 can be disposed at one surface of the cover 231 that faces the first antenna 211. According to various embodiments, by controlling the interval distance between the first antenna 211 and the second antenna 221, the performance of the antenna module can be improved.

[0061] Figure 3 is a side view illustrating an antenna module structure according to the present disclosure.

[0062] According to an embodiment, the antenna module can include a printed circuit board 301 in which a plurality of layers are stacked. For example, the printed circuit board 301 can be formed by stacking 18 layers. According to various embodiments, each layer of the printed circuit board 301 can have a via hole. For example, the printed circuit board 301 can include a via hole formed through a laser process and a via hole 351 formed through a PTH process.

[0063] According to an embodiment, on one surface of the printed circuit board 301, a feed unit 341 for providing an electrical signal for radiating radio waves can be provided. For example, the feed unit 341 can be provided at a first layer stacked on an upper end surface of the printed circuit board 301. According to various embodiments, a via hole can be formed in the first layer through a laser process, and the feed unit 341 can receive an electrical signal for radiating radio waves through the via hole.

[0064] According to an embodiment, via holes can be formed in a second layer and a third layer arranged below (in a stacking direction) the first layer provided at the upper end surface of the printed circuit board 301 through a laser process. According to various embodiments, a ground can be provided at one surface of the third layer.

[0065] According to an embodiment, an electrical signal for generating a radio frequency can be provided to the other surface of the printed circuit board 301. For example, in order to generate a radio frequency, a base signal for generating a radio frequency, a middle frequency signal, and a local frequency signal for changing the frequency of the base signal can be required, and the base signal, the middle frequency signal, and the local frequency signal can be provided to the other surface of the printed circuit board 301.

[0066] According to an embodiment, a base signal can be provided through A provided at the other surface of the printed circuit board 301. According to various embodiments, the base signal provided through A can be transmitted to the feeding unit 341 provided at one surface of the printed circuit board 301 through a via formed in the printed circuit board 301.

[0067] According to an embodiment, an intermediate frequency signal can be provided through B provided at the other surface of the printed circuit board 301. According to various embodiments, the intermediate frequency signal provided through B can be transmitted to the printed circuit board 301 through a via formed in the printed circuit board 301. For example, the intermediate frequency signal can be transmitted to one surface of the third layer through a via formed in the second layer provided at the other surface of the printed circuit board 301 and the third layer provided above the second layer. According to an embodiment, the base signal provided through A can also be transmitted to one surface of the third layer through a via formed in the second layer and the third layer.

[0068] According to an embodiment, a local frequency signal can be provided through C provided at the other surface of the printed circuit board 301. According to various embodiments, the local frequency signal provided through C can be transmitted to the printed circuit board 301 through a via formed in the printed circuit board 301. For example, the local frequency signal can be transmitted to one surface of the third layer through a via formed in the second layer and the third layer in the same manner as the intermediate frequency signal.

[0069] According to an embodiment, a feeding line for an intermediate frequency signal and a feeding line for a local frequency signal can be formed in the same layer. Referring to the above example, the feeding line for the intermediate frequency signal and the feeding line for the local frequency can be formed at one surface of the third layer.

[0070] According to an embodiment, according to the antenna module structure shown in Figure 3 , the number of layer stacks can be triple when manufacturing the printed circuit board 301. For example, in the antenna module structure shown in Figure 3 , the printed circuit board 301 can be manufactured by stacking the layers from the third layer to the sixteenth layer once in the direction of the upper end surface of the printed circuit, by stacking the second layer and the seventeenth layer once in the direction of the upper end surface of the printed circuit, and by stacking the first layer and the eighteenth layer in the direction of the upper end surface of the printed circuit board. According to the above antenna module structure shown in Figure 2 , the number of layer stacks can be five when manufacturing the printed circuit board 301. Accordingly, according to the present disclosure, the manufacturing process of the printed circuit board constituting the antenna module can be simplified.

[0071] According to an embodiment, a cover 331 for protecting an antenna can be coupled to one surface of the printed circuit board 301. According to various embodiments, a first antenna 311 for receiving an electric signal from the feeding unit 341 to radiate radio waves can be disposed at one surface of the cover 331 facing the feeding unit 341. That is, according to the antenna module structure disclosed in the present disclosure, the first antenna 311 and the feeding unit 341 can have a coupling structure not directly connected.

[0072] According to an embodiment, because the feeding unit 341 and the first antenna 311 are not directly connected, the antenna can be freely disposed in the antenna module. That is, according to the antenna module structure disclosed in the present disclosure, the design freedom of the antenna module can be improved.

[0073] According to an embodiment, a second antenna 321 can be disposed at the other surface of the cover 331. According to various embodiments, the first antenna 311 and the second antenna 321 can be spaced apart by a predetermined length through the cover 331 made of a non-metallic material. According to an embodiment, the performance of the antenna module can be determined based on the spaced distance between the first antenna 311 and the second antenna 321.

[0074] Figure 4 is an exploded view illustrating an antenna module structure according to the present disclosure.

[0075] According to an embodiment, the antenna module can include a first printed circuit board 401 on which at least one layer is stacked. According to various embodiments, at least one feeding unit 461 and 463 can be disposed at an upper end surface of the first printed circuit board 401. Figure 4 is illustrated a case where a first feeding unit 461 and a second feeding unit 463 are disposed at the upper end surface of the first printed circuit board 401.

[0076] According to an embodiment, the first feeding unit 461 and the second feeding unit 463 can receive an electric signal for radiating radio waves from a wireless communication chip (not shown) disposed at a lower end surface of the first printed circuit board 401 through a through-hole formed in each layer of the first printed circuit board 401. According to various embodiments, the electric signal can be an electric signal for transmitting radio waves of a millimeter wave band used in 5G mobile communication. For example, the electric signal can be an electric signal for radiating radio waves having a frequency of 28 GHz or 39 GHz.

[0077] According to an embodiment, a second printed circuit board 411 including a first antenna 441 can be disposed at the upper end surface of the first printed circuit board 401. According to various embodiments, the second printed circuit board 411 can include a flexible printed circuit board (FPCB).

[0078] According to an embodiment, the first antenna 441 can be disposed at an upper end surface of the second printed circuit board 411. According to various embodiments, the first antenna 441 can be spaced apart from the first feeding unit 461 and the second feeding unit 463 by the second printed circuit board 411.

[0079] According to an embodiment, a structure 421 having a specific shape can be disposed at an upper end surface of the second printed circuit board 411. According to various embodiments, the structure 421 can have a blocker shape and be made of a non-metallic material. For example, the structure 421 can be made of plastic.

[0080] According to an embodiment, a third printed circuit board 431 including a second antenna 451 can be disposed at an upper end surface of the structure 421. According to various embodiments, the third printed circuit board 431 can include an FPCB. According to an embodiment, the third printed circuit board 431 can be spaced apart from the second printed circuit board 411 by the structure 421. According to various embodiments, the structure 421, the second printed circuit board 411, and the third printed circuit board 431 can be coupled to each other by an adhesive.

[0081] Figure 5A FIG. 4 is a diagram illustrating a spacing length between a first antenna and a second antenna in an antenna module structure according to the present disclosure.

[0082] According to an embodiment, an antenna module can include a first printed circuit board 501 having a feeding unit 511. According to various embodiments, at an upper end surface of the first printed circuit board 501, a second printed circuit board 541 including a first antenna 521 can be disposed. According to an embodiment, a third printed circuit board 551 including a second antenna 531 can be spaced apart from the second printed circuit board 541 by a structure 561 made of a non-metallic material.

[0083] According to an embodiment, an impedance value of the antenna module can be changed based on a spacing length d between the first antenna 521 and the second antenna 531. According to various embodiments, the spacing length d between the first antenna 521 and the second antenna 531 can be determined based on a wavelength of a radio wave to be emitted through the antenna module. For example, the spacing distance d between the first antenna 521 and the second antenna 531 can have a value of 0.05λ to 0.08λ (λ is a wavelength of a radio wave radiated through the antenna module).

[0084] Figure 5B FIG. 5 is a diagram illustrating a size of a first antenna in an antenna module structure according to the present disclosure.

[0085] According to an embodiment, the antenna module can include a first printed circuit board 501 having a feeding unit 511. According to various embodiments, a second printed circuit board 541 including a first antenna 521 can be disposed at an upper end surface of the first printed circuit board 501. According to an embodiment, a third printed circuit board 551 including a second antenna 531 can be spaced apart from the second printed circuit board 541 by a structure 561 made of a non-metallic material.

[0086] According to an embodiment, an impedance value of the antenna module can be changed based on a size w1 of the first antenna 521. According to various embodiments, the size w1 of the first antenna 521 can be determined based on a wavelength of a radio wave to be emitted through the antenna module. For example, when the first antenna 521 and the second antenna 531 are circular and a diameter of the second antenna 531 is 0.273λ, a diameter w1 of the first antenna 521 can have a value of 0.23λ to 0.34λ (λ is a wavelength of a radio wave radiated through the antenna module).

[0087] Figure 5C FIG. 4 is a diagram illustrating a size of a second antenna in an antenna module structure according to the present disclosure.

[0088] According to an embodiment, the antenna module can include a first printed circuit board 501 having a feeding unit 511. According to various embodiments, a second printed circuit board 541 including a first antenna 521 can be disposed at an upper end surface of the first printed circuit board 501. According to an embodiment, a third printed circuit board 551 including a second antenna 531 can be spaced apart from the second printed circuit board 541 by a structure 561 made of a non-metallic material.

[0089] According to an embodiment, an impedance value of the antenna module can be changed based on a size w2 of the second antenna 531. According to various embodiments, the size w2 of the second antenna 531 can be determined based on a wavelength of a radio wave to be emitted through the antenna module. For example, when the first antenna 521 and the second antenna 531 are circular and a diameter of the first antenna 521 is 0.273λ, a diameter w2 of the second antenna 531 can have a value of 0.2λ to 0.32λ (λ is a wavelength of a radio wave radiated through the antenna module).

[0090] Figure 5D FIG. 4 is a diagram illustrating a size of a second antenna in an antenna module structure according to the present disclosure.

[0091] According to an embodiment, the antenna module can include a first printed circuit board 501 having a feed unit 511. According to various embodiments, a second printed circuit board 541 including a first antenna 521 can be disposed at an upper end surface of the first printed circuit board 501. According to an embodiment, a third printed circuit board 551 including a second antenna 531 can be spaced apart from the second printed circuit board 541 by a structure 561 made of a non-metallic material.

[0092] According to an embodiment, an impedance value of the antenna module can be changed based on a length h of a gap between the first antenna 521 and the feed unit 511. According to various embodiments, the length h of the gap between the first antenna 521 and the feed unit 511 can be determined based on a wavelength of a radio wave to be emitted through the antenna module. For example, the length h of the gap between the first antenna 521 and the feed unit 511 can have a value of 0.2λ to 0.32λ (λ is a wavelength of a radio wave radiated through the antenna module).

[0093] Figure 5E FIG. 7 is a diagram illustrating a length of a feed unit reverse land in an antenna module structure according to the present disclosure.

[0094] According to an embodiment, the antenna module can include a first printed circuit board 501 having a feed unit 511. According to various embodiments, a second printed circuit board 541 including a first antenna 521 can be disposed at an upper end surface of the first printed circuit board 501. According to an embodiment, a third printed circuit board 551 including a second antenna 531 can be spaced apart from the second printed circuit board 541 by a structure 561 made of a non-metallic material.

[0095] According to an embodiment, an impedance value of the antenna module can be changed based on a size r1 of a reverse land of the feed unit 511. According to various embodiments, the size r1 of the reverse land of the feed unit 511 can be determined based on a wavelength of a radio wave to be emitted through the antenna module. For example, when the reverse land of the feed unit 511 is circular, a radius r1 of the reverse land of the feed unit 511 can have a value of 0.02λ to 0.08λ (λ is a wavelength of a radio wave radiated through the antenna module).

[0096] Figure 5F FIG. 8 is a diagram illustrating a distance between a center of an antenna and a center of a feed unit in an antenna module structure according to the present disclosure.

[0097] According to an embodiment, the antenna module can include a first printed circuit board 501 having a feeding unit 511. According to various embodiments, a second printed circuit board 541 including a first antenna 521 can be disposed at an upper end surface of the first printed circuit board 501. According to an embodiment, a third printed circuit board 551 including a second antenna 531 can be spaced apart from the second printed circuit board 541 by a structure 561 made of a non-metallic material.

[0098] According to an embodiment, an impedance value of the antenna module can be changed based on a length i of a space between a center of the first antenna 521 and a center of the feeding unit 511. According to various embodiments, the length i of the space between the center of the first antenna 521 and the center of the feeding unit 511 can be determined based on a wavelength of a radio wave to be emitted through the antenna module. For example, the length i of the space between the center of the first antenna 521 and the center of the feeding unit 511 can have a value of 0.07λ to 1.7λ (λ is a wavelength of a radio wave radiated through the antenna module).

[0099] Figure 5G is a diagram illustrating a length of a feeding unit in an antenna module structure according to the present disclosure.

[0100] According to an embodiment, the antenna module can include a first printed circuit board 501 having a feeding unit 511. According to various embodiments, a second printed circuit board 541 including a first antenna 521 can be disposed at an upper end surface of the first printed circuit board 501. According to an embodiment, a third printed circuit board 551 including a second antenna 531 can be spaced apart from the second printed circuit board 541 by a structure 561 made of a non-metallic material.

[0101] According to an embodiment, an impedance value of the antenna module can be changed based on a length r2 of the feeding unit 511. According to various embodiments, the length r2 of the feeding unit 511 can be determined based on a wavelength of a radio wave to be emitted through the antenna module. For example, when the feeding unit 511 is circular, a radius r2 of the feeding unit 511 can have a value of 0.01λ to 0.08λ (λ is a wavelength of a radio wave radiated through the antenna module).

[0102] Figure 6A is a diagram illustrating an antenna module manufacturing process according to a first embodiment disclosed in the present disclosure.

[0103] According to an embodiment, the antenna module can be configured to have a first region including a printed circuit board 601 and a second region including a first antenna 641 and a second antenna 691. According to various embodiments, the first region can include the printed circuit board 601 and a power supply pad 611 disposed at an upper end surface of the printed circuit board 601.

[0104] According to an embodiment, the first region can be coupled to the second region through a first adhesive layer 621 disposed at a lower end surface of the second region. According to various embodiments, the first adhesive layer 621 can be disposed at the lower end surface of the second region, and a first layer 631 including the first antenna 641 can be disposed above the first adhesive layer 621. For example, the first layer 631 can include a layer made of a dielectric body.

[0105] According to an embodiment, a structure 661 manufactured in a predetermined shape can be disposed at an upper end surface of the first layer 631. According to various embodiments, at the upper end surface of the structure 661, a second layer 681 including a second antenna 691 can be disposed. According to an embodiment, a spaced distance between the first antenna 641 included in the first layer 631 and the second antenna 691 included in the second layer 681 can be maintained by the structure 661. According to various embodiments, the structure 661 and the first layer 631 can be coupled through a second adhesive layer 651 disposed at an upper end surface of the first layer 631, and the structure 661 and the second layer 681 can be coupled through a third adhesive layer 671 disposed at a lower end surface of the second layer 681.

[0106] According to an embodiment, an antenna module manufacturing process can be performed in such a manner that a first region and a second region are respectively manufactured, and the first region and the second region are coupled to each other through a first adhesive layer 621 disposed at a lower end surface of the second region.

[0107] Figure 6B is a diagram illustrating an antenna module manufacturing process according to a second embodiment disclosed in the present disclosure.

[0108] According to an embodiment, an antenna module can be configured to have a first region including a first antenna 641 and a second region including a second antenna 691. According to various embodiments, the first region can include a printed circuit board 601, a power pad 611 disposed at an upper end surface of the printed circuit board 601, and a first layer 631 disposed at the upper end surface of the printed circuit board 601.

[0109] According to an embodiment, the printed circuit board 601 and the first layer 631 can be coupled to each other through a first adhesive layer 621 disposed at a lower end surface of the first layer 631. According to various embodiments, the first layer 631 can include a layer made of a dielectric body.

[0110] According to an embodiment, the second region can include a structure 661 and a second layer 681 disposed at an upper end surface of the structure 661 and including a second antenna 691. According to various embodiments, the structure 661 can be made of a non-insulating material, and the structure 661 and the second layer 681 can be coupled through a third adhesive layer 671 disposed at a lower end surface of the second layer 681.

[0111] According to an embodiment, the first region and the second region can be coupled by a second adhesive layer 651 disposed at an upper end surface of the first layer 631. According to various embodiments, when the first region and the second region are coupled, a spaced distance between the first antenna 641 included in the first layer 631 and the second antenna 691 included in the second layer 681 can be maintained by the structure 661.

[0112] According to an embodiment, an antenna module manufacturing process can be performed in such a manner that a first region and a second region are respectively manufactured, and the first region and the second region are coupled to each other by a second adhesive layer 651 disposed at an upper end surface of the first region.

[0113] Figure 6C FIG. 7 is a diagram illustrating an antenna module manufacturing process according to a third embodiment disclosed in the present disclosure.

[0114] According to an embodiment, an antenna module can be configured to have a first region including a printed circuit board 601 and a second region including a first antenna 641 and a second antenna 691. According to various embodiments, the first region can include the printed circuit board 601 and a power pad 611 disposed at an upper end surface of the printed circuit board 601.

[0115] According to an embodiment, a first layer 631 disposed at a lower end surface of the second region can be stacked on an upper end surface of the printed circuit board 601 constituting the first region. According to various embodiments, the first layer 631 can include the first antenna 641, and the first layer 631 can include a layer made of a dielectric body.

[0116] According to an embodiment, a structure 661 manufactured in a predetermined shape can be disposed at an upper end surface of the first layer 631. According to various embodiments, a second layer 681 including the second antenna 691 can be disposed at an upper end surface of the structure 661. According to an embodiment, a spaced distance between the first antenna 641 included in the first layer 631 and the second antenna 691 included in the second layer 681 can be maintained by the structure 661. According to various embodiments, the structure 661 and the first layer 631 can be coupled by a first adhesive layer 651 disposed at an upper end surface of the first layer 631, and the structure 661 and the second layer 681 can be coupled by a second adhesive layer 671 disposed at a lower end surface of the second layer.

[0117] Figure 7A FIG. 8 is a diagram illustrating a gain value of an antenna module including 16 antenna arrays according to an embodiment of the present disclosure.

[0118] According to an embodiment, when the antenna module includes 16 antenna arrays, the gain value of the antenna (the gain value of a radio wave having a radiation angle of 0°) can be about 16.8 dB. According to various embodiments, when the antenna module includes 16 antenna arrays, it can be determined that the gain value of a radio wave radiated in the direction of a side lobe or back lobe of the antenna module is 3 dB or less. That is, according to the antenna module structure disclosed in the present disclosure (in the case of including 16 antenna arrays), the antenna module can ensure a sufficient gain value in the main lobe direction, and a radio wave radiated in the direction of a side lobe or back lobe can be minimized.

[0119] Figure 7B FIG. 17 is a diagram illustrating a gain value of an antenna module including 256 antenna arrays according to an embodiment of the present disclosure.

[0120] According to an embodiment, when the antenna module includes 256 antenna arrays, the gain value of the antenna (the gain value of a radio wave having a radiation angle of 0°) can be about 28.7 dB. According to various embodiments, when the antenna module includes 256 antenna arrays, it can be determined that the gain value of a radio wave radiated in the direction of a side lobe or back lobe of the antenna module is 7 dB or less. That is, according to the antenna module structure disclosed in the present disclosure (in the case of including 256 antenna arrays), the antenna module can ensure a sufficient gain value in the main lobe direction, and a radio wave radiated in the direction of a side lobe or back lobe can be minimized.

[0121] Figure 8 FIG. 17 is a diagram illustrating a gain value of an antenna module including 256 antenna arrays according to an embodiment of the present disclosure.

[0122] According to an embodiment, the antenna module can include a printed circuit board 801 in which a plurality of layers are stacked. According to various embodiments, a via hole can be formed in each layer of the printed circuit board 801. For example, the printed circuit board 801 can include a via hole formed through a laser process and a via hole formed through a PTH process.

[0123] According to an embodiment, a first antenna 811 for radiating a radio wave can be disposed on one surface of the printed circuit board 801. For example, the first antenna 811 can be disposed at a first layer stacked on an upper end surface of the printed circuit board 801. According to various embodiments, a via hole can be formed in the first layer through a laser process, and through the via hole, the first antenna 811 can receive an electrical signal for radiating a radio wave.

[0124] According to an embodiment, a second antenna 821 can be disposed on one surface facing the first antenna 811. According to various embodiments, by controlling the interval distance between the first antenna 811 and the second antenna 821, the performance of the antenna module can be improved.

[0125] Figure 9 is a schematic diagram illustrating an antenna module structure according to another embodiment.

[0126] According to an embodiment, the antenna module can include a printed circuit board 901 in which a plurality of layers are stacked. According to various embodiments, a via hole can be formed in each layer of the printed circuit board 901. For example, the printed circuit board 901 can include a via hole formed through a laser process and a via hole formed through a PTH process.

[0127] According to an embodiment, on one surface of the printed circuit board 901, a first antenna 911 can be disposed at a laminated flexible printed circuit board (FPCB) 910 to radiate radio waves. For example, the laminated flexible printed circuit board 910 can include the first antenna 911, a via hole 912, and a coupling pad 913.

[0128] According to an embodiment, a bonding tab 920 can be included between the printed circuit board 901 and the flexible printed circuit board 911. The bonding tab 920 can include a feeding portion 921. According to various embodiments, a coupling pad 931 for receiving an electrical signal from the feeding portion 921 to radiate radio waves can be provided. That is, according to the antenna module structure disclosed in the present disclosure, the coupling pad 913 and the feeding portion 921 can have a coupling structure that is not directly connected. Further, according to the antenna module structure disclosed in the present disclosure, the coupling pad 913 and the feeding portion 921 are a coupling structure that is not directly connected, but the flexible printed circuit board 910 can be laminated in the printed circuit board 901 to maintain a uniform distance between the coupling pad 913 and the feeding portion 921.

[0129] According to an embodiment, a second antenna 930 can be provided. According to various embodiments, the first antenna 911 and the second antenna 930 can be separated by a predetermined length by a cover made of a non-metallic material. According to an embodiment, the performance of the antenna module can be determined based on the interval distance between the first antenna 911 and the second antenna 930.

[0130] Figure 10 is a detailed schematic diagram illustrating an antenna module structure according to an embodiment.

[0131] According to an embodiment, on one surface of the printed circuit board 1001, the first antenna 1011 can be disposed at a laminated flexible printed circuit board (FPCB) 1010 to radiate radio waves. For example, the laminated flexible printed circuit board 1010 can include the first antenna 1011, a via 1012, and a coupling pad 1013. For example, the via 1012 can include a via formed through a laser process and a via formed through a PTH process. According to various embodiments, the via 1012 can be implemented with a single polyimide instead of lamination. The dielectric constant of the coupling pad 1013 can have a value between 2 and 10, and the higher the dielectric constant, the higher the coupling performance.

[0132] According to an embodiment, a bonding sheet 1020 can be included between the printed circuit board 1001 and the flexible printed circuit board 1010. The bonding sheet 1020 can include a feeding portion 1021. According to various embodiments, the coupling pad 1013 for receiving an electrical signal from the feeding portion 1021 to radiate radio waves can be disposed. That is, according to the antenna module structure disclosed in the present disclosure, the coupling pad 1013 and the feeding portion 1021 can have a coupling structure that is not directly connected. Further, according to the antenna module structure disclosed in the present disclosure, the coupling pad 1013 and the feeding portion 1021 are a coupling structure that is not directly connected, but the flexible printed circuit board 1010 can be laminated in the printed circuit board to maintain a uniform distance between the coupling pad 1013 and the feeding portion 1021. The performance of the antenna module can be improved by maintaining the uniform distance.

[0133] According to various embodiments, the coupling performance can vary according to the dielectric constant, the thickness of the bonding material, the area of the coupling pad, etc.

[0134] According to an embodiment, a second antenna 1030 can be disposed. According to various embodiments, the first antenna 1011 and the second antenna 1030 can be spaced apart by a predetermined length by a cover made of a non-metallic material. According to an embodiment, the performance of the antenna module can be determined based on the spaced distance between the first antenna 1011 and the second antenna 1030.

[0135] Figure 11 is a schematic diagram illustrating a derived structure of an antenna module according to various embodiments.

[0136] Referring to Figure 11 The derived structure of the antenna module can be derived according to a combination of the thickness, the number of platings, and the kind of vias. Structure (a) is a basic antenna structure, and is a structure of one plating. Structure (b) is manufactured by a method of inserting ink into a via, and can prevent deformation of the structure of the via by structure (b). Structure (c) can prevent deformation of the via using a metal as well as ink. Structure (d) is a structure of repeated plating based on structure (a).

[0137] Structures (e) and (f) are structures derived from a multi-layer structure. The structure can vary depending on the number of plating, including a via formed through a laser process, and including a via formed through certain PTH processes.

[0138] Figure 12 is a diagram illustrating an antenna structure according to an embodiment.

[0139] Referring to Figure 12 , antenna performance can be affected by misalignment of a coupling pad 1201 of a flexible printed circuit board and a feeding portion 1202 of a land. When the coupling pad 1201 and the feeding portion 1202 are misaligned, a gain value can change. According to various embodiments, as misalignment increases, coupling performance can decrease. According to various embodiments, the gain value can start to deteriorate at 0.15 mm or more. Specifically, in the present disclosure, it is characterized that misalignment of the coupling pad 1201 and the feeding portion 1202 of the land is 2 mm or less.

[0140] Figure 13 is a diagram illustrating a change in a gain value according to an embodiment.

[0141] Referring to Figure 13 , when misalignment as shown in Figure 12 occurs, the gain value can change. That is, when misalignment is 20 µm or less, there is no significant change in performance, but when misalignment is 150 µm, the gain value can start to deteriorate.

[0142] According to an embodiment, an antenna module including a printed circuit board can include the printed circuit board in which at least one layer is stacked, a feeding unit disposed at one surface of the printed circuit board, and a first antenna spaced apart from the feeding unit by a predetermined first length.

[0143] According to an embodiment, the antenna module can further include a dielectric layer stacked on one surface of the printed circuit board on which the feeding unit is disposed, and a first flexible printed circuit board (FPCB) stacked on one surface of the dielectric layer, wherein the first antenna can be disposed on one surface of the first FPCB.

[0144] According to an embodiment, the antenna module can further include a second FPCB spaced apart from one surface of the first FPCB by a predetermined second length, a second antenna disposed at one surface of the second FPCB, and a structure disposed at one surface of the first FPCB to enable the first FPCB to be spaced apart from the second FPCB by the second length.

[0145] According to an embodiment, the printed circuit board may include: a first layer disposed on one surface of the printed circuit board; a second layer stacked below the first layer in a stacking direction; a third layer disposed on another surface of the printed circuit board; a fourth layer stacked above the third layer in a stacking direction; and at least one layer disposed between the second and fourth layers, wherein laser vias may be formed in the first, second, third, and fourth layers, and plated vias (PTHs) may be formed in at least one layer.

[0146] According to an embodiment, the antenna module may further include a wireless communication chip disposed on another surface of the printed circuit board, wherein electrical signals provided from the wireless communication chip can be transmitted to the feed unit.

[0147] According to an embodiment, electrical signals provided from the wireless communication chip can be transmitted to the feed unit via laser vias formed in the first, second, third, and fourth layers, as well as via PTHs formed in at least one layer.

[0148] According to an embodiment, in order to generate radio frequency radiated through the first antenna, an intermediate frequency signal and a local oscillator frequency signal provided from another surface of the printed circuit board can be transmitted to a surface of the third layer through laser vias formed in the third and fourth layers.

[0149] According to an embodiment, the antenna module may further include a fifth layer stacked below the second layer, wherein laser vias may be formed in the fifth layer, and a ground may be provided on one surface of the fifth layer.

[0150] According to an embodiment, one surface of the structure and the first FPCB can be coupled through a first adhesive layer, and the other surface of the structure and the second FPCB can be coupled through a second adhesive layer.

[0151] According to an embodiment, the first length can be determined based on the wavelength of the radio waves radiated through the first antenna.

[0152] According to an embodiment, a base station may include: an antenna module, wherein the antenna module may include a printed circuit board having at least one layer stacked on top of it; a feed unit disposed on a surface of the printed circuit board; and a first antenna spaced apart from the feed unit by a predetermined first length.

[0153] According to an embodiment, the antenna module may further include: a dielectric layer stacked on a surface of a printed circuit board on which a feed unit is disposed; and a first flexible printed circuit board (FPCB) stacked on a surface of the dielectric layer, wherein the first antenna may be disposed on a surface of the first FPCB.

[0154] According to an embodiment, the antenna module can further include a second FPCB spaced apart from one surface of the first FPCB by a predetermined second length, a second antenna disposed at one surface of the second FPCB, and a structure disposed at one surface of the first FPCB to enable the first FPCB to be spaced apart from the second FPCB by the second length.

[0155] According to an embodiment, the printed circuit board can include a first layer disposed at one surface of the printed circuit board, a second layer stacked below the first layer in a stacking direction, a third layer disposed at another surface of the printed circuit board, a fourth layer stacked above the third layer in the stacking direction, and at least one layer disposed between the second layer and the fourth layer, wherein a laser via can be formed in the first layer, the second layer, the third layer, and the fourth layer, and a plated through hole (PTH) can be formed in the at least one layer.

[0156] According to an embodiment, the antenna module can further include a wireless communication chip disposed at another surface of the printed circuit board, wherein an electrical signal provided from the wireless communication chip can be transmitted to the feeding unit.

[0157] According to an embodiment, the electrical signal provided from the wireless communication chip can be transmitted to the feeding unit through the laser via formed in the first layer, the second layer, the third layer, and the fourth layer and through the PTH formed in the at least one layer.

[0158] According to an embodiment, in order to generate a radio frequency radiated through the first antenna, an intermediate frequency signal and a local oscillation frequency signal provided from another surface of the printed circuit board can be transmitted to one surface of the third layer through the laser via formed in the third layer and the fourth layer.

[0159] According to an embodiment, the antenna module can further include a fifth layer stacked below the second layer, wherein a laser via can be formed in the fifth layer, and a ground can be disposed at one surface of the fifth layer.

[0160] According to an embodiment, one surface of the structure can be coupled with the first FPCB through a first adhesive layer, and another surface of the structure can be coupled with the second FPCB through a second adhesive layer.

[0161] According to an embodiment, the first length can be determined based on a wavelength of a radio wave radiated through the first antenna.

[0162] According to the embodiments disclosed in the disclosure, by reducing the number of layers stacked in a manufacturing process of a printed circuit board constituting an antenna module, the performance of the antenna module can be improved, the failure rate of the antenna module can be reduced, and the time and cost taken to manufacture the antenna module can be reduced.

[0163] Further, according to the embodiments disclosed in the present disclosure, by indirectly providing an electrical signal to the antennas constituting the antenna module as in the coupling scheme, design freedom of the antenna module can be improved.

[0164] The embodiments of the present disclosure disclosed in the present specification and drawings merely present specific examples in order to easily describe technical contents according to the embodiments of the present disclosure and help understand the embodiments of the present disclosure, and they are not intended to limit the scope of the embodiments of the present disclosure. That is, it is obvious to those skilled in the art that other modifications based on the technical idea of the present disclosure can be implemented. Further, each of the above-described embodiments can be operated in combination with each other as needed. For example, some of the methods proposed in the present disclosure can be combined with each other, so that a base station and a terminal can be operated.

Claims

1. An antenna module including a printed circuit board, the antenna module comprising: the printed circuit board in which a plurality of layers are stacked; a feeding unit provided at one surface of the printed circuit board; a first antenna physically electrically coupled to a coupling pad for receiving an electrical signal for radiating radio waves from the feeding unit, wherein the first antenna is spaced apart from the feeding unit by a predetermined first length, the coupling pad is physically disconnected from the feeding unit, and the coupling pad and the feeding unit have a capacitive coupling structure; a dielectric layer stacked on the one surface of the printed circuit board on which the feeding unit is provided; a second flexible printed circuit board spaced apart from a first flexible printed circuit board by a predetermined second length; a second antenna provided on the second flexible printed circuit board; and a structure provided on the first flexible printed circuit board to space apart the first flexible printed circuit board from the second flexible printed circuit board by the second length, wherein the first antenna is provided on the first flexible printed circuit board, the first flexible printed circuit board is provided on an upper surface of the printed circuit board, wherein the first flexible printed circuit board is stacked on the dielectric layer, wherein the feeding unit receives the electrical signal for radiating radio waves through a via hole formed in the plurality of layers of the printed circuit board, and wherein the printed circuit board comprises: a first layer provided at a first surface of the printed circuit board; a second layer stacked below the first layer; a third layer provided at a second surface of the printed circuit board; a fourth layer stacked above the third layer; and at least one intermediate layer provided between the second layer and the fourth layer, wherein the first layer, the second layer, the third layer, and the fourth layer each include a laser via hole, and the at least one intermediate layer includes a via hole formed by a plating via process.

2. The antenna module of claim 1, further comprising: a wireless communication chip provided at the second surface of the printed circuit board, wherein an electrical signal provided from the wireless communication chip is transmitted to the feeding unit, and wherein the electrical signal provided from the wireless communication chip is transmitted to the feeding unit through the laser via hole formed in the first layer, the second layer, the third layer, and the fourth layer and through the via hole formed by the plating via process.

3. The antenna module of claim 1, wherein, an intermediate frequency signal and a local oscillation frequency signal provided from the second surface of the printed circuit board are transmitted to one surface of the third layer through the laser via hole formed in the third layer and the fourth layer to generate a radio frequency, and the radio frequency is radiated through the first antenna.

4. The antenna module of claim 1, further comprising: a fifth layer stacked below the second layer, wherein the fifth layer includes a laser via hole, and a ground is provided at one surface of the fifth layer.

5. The antenna module of claim 1, wherein, the first length is determined based on a wavelength of radio waves radiated through the first antenna.

6. A base station comprising an antenna module, wherein, The antenna module includes: a printed circuit board in which a plurality of layers are stacked; a feeding unit provided at one surface of the printed circuit board; a first antenna physically electrically coupled to a coupling pad for receiving an electrical signal for radiating radio waves from the feeding unit, wherein the first antenna is spaced apart from the feeding unit by a predetermined first length, the coupling pad is physically disconnected from the feeding unit, and the coupling pad and the feeding unit have a capacitive coupling structure; a dielectric layer stacked on the one surface of the printed circuit board provided with the feeding unit; a second flexible printed circuit board spaced apart from the first flexible printed circuit board by a predetermined second length; a second antenna provided on the second flexible printed circuit board; and a structure provided on the first flexible printed circuit board to space apart the first flexible printed circuit board from the second flexible printed circuit board by the second length, wherein the first antenna is provided on the first flexible printed circuit board, the first flexible printed circuit board is provided on an upper surface of the printed circuit board, wherein the first flexible printed circuit board is stacked on the dielectric layer, wherein the feeding unit receives the electrical signal for radiating radio waves through a via hole formed in the plurality of layers of the printed circuit board, and wherein the printed circuit board includes: a first layer provided at a first surface of the printed circuit board; a second layer stacked below the first layer; a third layer provided at a second surface of the printed circuit board; a fourth layer stacked above the third layer; and at least one intermediate layer provided between the second layer and the fourth layer, wherein the first layer, the second layer, the third layer, and the fourth layer each include a laser via hole, and the at least one intermediate layer includes a via hole formed by a plating via process.

7. The base station of claim 6, wherein, The antenna module further includes a wireless communication chip provided at the second surface of the printed circuit board, and wherein an electrical signal provided from the wireless communication chip is transmitted to the feeding unit, and wherein the electrical signal provided from the wireless communication chip is transmitted to the feeding unit through the laser via hole formed in the first layer, the second layer, the third layer, and the fourth layer, and through the via hole formed by the plating via process.

8. The base station of claim 6, wherein, An intermediate frequency signal and a local oscillation frequency signal provided from the second surface of the printed circuit board are transmitted to one surface of the third layer through the laser via hole formed in the third layer and the fourth layer to generate a radio frequency, and the radio frequency is radiated through the first antenna, and wherein: The antenna module further includes a fifth layer stacked below the second layer, the fifth layer includes a laser via hole, and a ground is provided at one surface of the fifth layer.

9. The base station of claim 6, wherein, The first length is determined based on a wavelength of radio waves radiated through the first antenna.

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