Manufacturing system with coolant supply system and related methods

Abstract

The present application relates to manufacturing systems with coolant supply systems and related methods. A manufacturing system includes an additive manufacturing (AM) component, a milling component, and a coolant supply system. The AM component includes a support assembly that supports a build part and is in thermal communication with the build part. The coolant supply system is configured to remove heat from the support assembly by flowing a coolant through at least a portion of the support assembly. A method of operating a manufacturing system during a manufacturing process includes: detecting a manufacturing mode of the manufacturing system; forming a build part via the manufacturing process; and selectively supplying a coolant to the support assembly and / or a milling cutter at least partially simultaneously with forming the build part. Selectively supplying the coolant is based at least in part on detecting the manufacturing mode.

Description

Technical Field

[0001] The present disclosure relates to manufacturing systems having coolant supply systems and related methods. Background Art

[0002] Additive manufacturing processes typically utilize an energy source to add thermal energy to a bulk material, thereby causing the bulk material to melt or sinter to form a build component. During the formation of the build component, it may be desirable to control and / or regulate the temperature of the build component. For example, if the build component reaches a sufficiently high temperature, it may be difficult to control the dimensional stability of the build component, and / or the build component may exhibit undesirable microstructural properties. Alternatively, regulating the build component temperature by intermittently interrupting the energy source may introduce undesirable delays in the additive manufacturing process. Summary of the invention

[0003] Disclosed herein are manufacturing systems with coolant supply systems and related methods. A manufacturing system according to the present disclosure may include: an additive manufacturing (AM) component configured to at least partially form a first building part via an AM process; a milling component configured to at least partially form a second building part via a milling process; and a coolant supply system configured to selectively supply coolant to each of the AM component and the milling component. The AM component may include a support component that supports the first building part and is in thermal communication with the first building part when manufacturing the first building part. The coolant supply system may be configured to remove heat from the support component by flowing a coolant through at least a portion of the support component when manufacturing the first building part to regulate the temperature of the building part.

[0004] A method of operating a manufacturing system during a manufacturing process according to the present disclosure may include: detecting a manufacturing mode of the manufacturing system; and forming a build part via the manufacturing process. The method may additionally include: selectively supplying a coolant to a support assembly supporting the build part and / or a milling cutter at least partially forming the build part during a milling process at least partially simultaneously with forming the build part. Selectively supplying a coolant may be based at least in part on detecting the manufacturing mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 is a schematic side elevation view showing an example of a manufacturing system according to the present disclosure.

[0006] Figure 2 is a schematic side elevation view showing an example of a support assembly according to the present disclosure.

[0007] Figure 3 is an exploded top isometric view showing an example of a baseplate according to the present disclosure.

[0008] Figure 4 Yes means Figure 3 A top plan view of a portion of a substrate.

[0009] Figure 5 is a flow chart depicting a method of operating a manufacturing system according to the present disclosure. DETAILED DESCRIPTION

[0010] Figures 1 to 5 Exemplary, non-exclusive examples of manufacturing systems 10 and / or methods 300 of operating manufacturing systems 10 for manufacturing first building components 20 and / or second building components 22 according to the present disclosure are provided. Figures 1 to 5 In each of the examples, elements serving similar or at least substantially similar purposes are labeled with the same numerals, and these elements may not be referred to herein. Figures 1 to 5 Each of is described in detail herein. Similarly, Figures 1 to 5 Each of the components may not be labeled, but for consistency, reference numerals associated therewith may be used herein. Without departing from the scope of the present disclosure, reference numerals may be used herein to identify the components. Figures 1 to 5 One or more of the elements, components and / or features discussed herein may be included in Figures 1 to 5 Any one of and / or Figures 1 to 5 Generally, in the figures, elements that may be included in a given example are shown in solid lines, while elements that are optional for a given example are shown in dashed lines. However, elements shown in solid lines are not necessary for all examples of the present disclosure, and elements shown in solid lines may be omitted from a given example without departing from the scope of the present disclosure.

[0011] Figure 1 An example of a manufacturing system 10 according to the present disclosure is schematically shown. Figure 1 , the manufacturing system 10 includes: an additive manufacturing (AM) assembly 50 configured to at least partially form a first build part 20 via an AM process; a milling assembly 70 configured to at least partially form a second build part 22 via a milling process; and a coolant supply system 200 configured to selectively supply coolant 210 to each of the AM assembly 50 and the milling assembly 70. As discussed in more detail herein, the manufacturing system 10 is generally configured such that the coolant supply system 200 selectively supplies coolant 210 to the AM assembly 50 or the milling assembly 70 depending on the operating mode of the manufacturing system 10. In this manner, the manufacturing system 10 may also be referred to as a dual-use manufacturing system 10. As used herein, the first build part 20 and the second build part 22 may refer to different components, or may refer to individual portions of a given component.

[0012] like Figure 1As schematically shown in FIG. 1 , AM assembly 50 generally includes a support assembly 100 that supports first building component 20 and is in thermal communication with first building component 20 during manufacture of first building component 20. Figure 1 As further schematically shown in FIG. 1 , support assembly 100 may also support second building component 22. Therefore, references and descriptions herein describing support assembly 100 supporting first building component 20 may also be understood to describe support assembly 100 supporting second building component 22. Figure 2 An example of a support assembly 100 is schematically shown in more detail, as discussed herein. Figure 1 , coolant supply system 200 is generally configured to remove heat from support assembly 100 by flowing coolant 210 through at least a portion of support assembly 100 when manufacturing first building part 20. In this manner, coolant supply system 200 is configured to regulate the temperature of first building part 20 when manufacturing first building part 20. That is, because support assembly 100 is in thermal communication with first building part 20, removing heat from support assembly 100 with coolant 210 serves to indirectly cool first building part 20.

[0013] As discussed, the AM component 50 is generally configured to at least partially form the first build part 20 via an AM process. As used herein, an AM process may refer to any suitable manufacturing process, and generally refers to a process that includes adding thermal energy to a feed material to form the first build part 20 from the feed material. As an example, the AM process may include a powder feed process, a directed energy deposition (DED) process, a direct laser deposition (DLD) process, a direct metal deposition process, a large melt pool process, and / or a powder bed process. Therefore, and as Figure 1 As schematically shown in , AM assembly 50 may include a material supply source 52 configured to supply bulk material 54 to form a first building part 20 and / or a directed energy source 56 configured to provide energy to the bulk material 54 to at least partially form the first building part 20. In such an example, the bulk material 54 may include and / or be any suitable feed material, such as metal, powdered metal and / or wire. Similarly, the material supply source 52 may include and / or be any suitable corresponding structure for transporting and / or supplying bulk material 54, such as a powder feeder, a wire feeder, a nozzle and / or a powder bed. Specifically, Figure 1 Such an example is schematically shown, where material supply source 52 takes the form of a nozzle that supplies bulk material 54 in the form of a powder stream. Directed energy source 56 may include and / or be any suitable device for adding thermal energy to bulk material 54, thereby causing bulk material 54 to melt and / or sinter to at least partially form first building component 20. For example, and as Figure 1As schematically shown, the directed energy source 56 may be configured to emit a directed energy beam 58 to provide energy to the bulk material 54. As more specific examples, the directed energy beam 58 may include and / or be a laser, a plasma source, and / or an electron beam.

[0014] like Figure 1 As further schematically shown in , the manufacturing system 10 may additionally include a support assembly positioning system 104 configured to selectively position the support assembly 100 relative to at least a portion of the AM component 50, thereby moving the first building component 20 relative to the AM component 50 and / or adjusting the position of the first building component 20 relative to the AM component 50. As an example, the support assembly positioning system 104 may be configured to translate at least a portion of the support assembly 100 with one, two, or three translational degrees of freedom. Additionally or alternatively, the support assembly positioning system 104 may be configured to rotate at least a portion of the support assembly 100 with one, two, or three rotational degrees of freedom. As a more specific example, the support assembly positioning system 104 may be configured to move and / or position the support assembly 100 with six degrees of freedom.

[0015] As discussed, the AM component 50 is generally configured to at least partially form the first building part 20 by adding thermal energy to the bulk material 54 so that the bulk material 54 selectively sinters into the first building part 20. In this manner, adding material to the first building part 20 generally includes continuously adding thermal energy to the first building part 20, which in turn can cause the temperature of the first building part 20 to increase to a desired level. For example, if the first building part 20 reaches and / or is maintained at a sufficiently high temperature, the dimensional stability of the first building part 20 may be impaired, resulting in difficulty maintaining the desired geometry and / or shape of the first building part 20. Additionally or alternatively, if the first building part 20 reaches and / or is maintained at a sufficiently high temperature, even when the directed energy source 56 stops supplying thermal energy to the first building part 20, the first building part 20 may still exhibit undesirable mechanical properties and / or microstructural features. Therefore, a conventional AM process may include intermittently removing the directed energy beam 58 from the first building part 20, thereby allowing the first building part 20 to cool to the desired temperature before adding more bulk material 54 (and therefore more thermal energy). However, incorporating such a cooling step may introduce undesirable delays into the AM process. Therefore, the manufacturing system 10 according to the present disclosure is generally configured to regulate the temperature of the first building part 20 during the formation of the first building part, thereby enabling the first building part 20 to be continuously formed without delay and with the desired geometric shape and structural properties.

[0016] The support assembly 100 may include and / or be any suitable structure for supporting at least a portion of the first building component 20 and / or the coolant supply system 200. For example, and as Figure 1 to Figure 2As schematically shown in FIG. 1 , support assembly 100 may include base plate 120 configured to support first building component 20 when manufacturing first building component 20. More specifically, base plate 120 may be configured to support first building component 20 such that first building component 20 is in thermal communication with at least a portion of support assembly 100 when manufacturing first building component 20.

[0017] like Figure 1 to Figure 2 , support assembly 100 can further include an anvil 110 that supports base plate 120. In such an example, base plate 120 can be directly and / or selectively coupled to anvil 110. In this manner, in this example, anvil 110 can be configured for use with a plurality of different base plates 120 and / or first building components 20, while base plate 120 can be specifically configured and / or customized for a given first building component 20.

[0018] Base plate 120 may be configured to support first building component 20 in any suitable manner. For example, manufacturing system 10 may be configured to manufacture first building component 20 directly on base plate 120. Alternatively, and as Figure 1 As schematically shown in FIG. 1 , support assembly 100 may additionally include a matrix blank 150 configured to be selectively and operatively coupled to base plate 120 such that manufacturing system 10 manufactures first building component 20 directly on matrix blank 150. In such an example, the completed first building component 20 may include at least a portion of matrix blank 150. In such an example, matrix blank 150 may be operatively coupled to base plate 120 in any suitable manner. For example, and as Figure 1 , the support assembly 100 may additionally include one or more clamps 152 configured to selectively hold the matrix blank 150 against the base plate 120. In such an example, the base plate 120 may include one or more fixtures 124 configured to selectively receive and engage each clamp 152.

[0019] The substrate 120 may be a unitary structure, or may include two or more distinct and / or separate components. Figure 1 to Figure 2 As schematically shown in FIG. 1 , the substrate 120 may include an upper substrate member 122 and a lower substrate member 126 supporting the upper substrate member 122. In such an embodiment, the upper substrate member 122 and the lower substrate member 126 may be configured to selectively and repeatedly engage with and separate from each other. For example, and as Figure 1 to Figure 2As schematically shown in FIG. 1 , the substrate 120 may include a substrate engagement structure 130 configured to hold the upper substrate member 122 and the lower substrate member 126 in a fixed position relative to each other when the upper substrate member 122 and the lower substrate member 126 are operatively engaged with each other. In such an example, the substrate engagement structure 130 may include and / or be any suitable structure and / or mechanism. For example, and as Figure 2 , the substrate engagement structure 130 may include one or more engagement bosses 132 and one or more engagement holes 134, such that each engagement hole 134 receives a corresponding engagement boss 132 when the upper substrate member 122 is operatively coupled to the lower substrate member 126. As a more specific example, the upper substrate member 122 may include each engagement boss 132, and the lower substrate member 126 may include each engagement hole 134. Alternatively, the upper substrate member 122 may include each engagement hole 134, and the lower substrate member 126 may include each engagement boss 132.

[0020] As used herein, positional terms such as "upper," "lower," "above," "below," "top," "bottom," "under," "underside," and the like may be used to describe the spatial relationships between components of the manufacturing system 10, the support assembly 100, and / or the coolant supply system 200 in an exemplary, non-limiting manner, and generally refer to a configuration in which the upper base member 122 is positioned above the lower base member 126 such that the upper base member 122 and the lower base member 126 engage one another at an interface that is substantially parallel to the floor surface. Such terms are provided merely as a matter of context and do not limit the components of the manufacturing system 10, the support assembly 100, and / or the coolant supply system 200 to always be in a particular orientation relative to the ground.

[0021] The substrate 120 can be operatively coupled to the anvil 110 in any suitable manner. Figure 1 to Figure 2 As schematically shown in FIG. 1 , the support assembly 100 may additionally include a substrate mounting structure 140 for operatively coupling the substrate 120 to the anvil 110. As a more specific example, and as shown in FIG. Figure 2 As schematically shown in , the substrate mounting structure 140 may include one or more substrate mounting holes 142 defined by the substrate 120 and / or the anvil 110 and one or more substrate mounting fasteners 144 configured to extend through the substrate mounting holes 142. That is, each substrate mounting fastener 144 may be configured to extend through a corresponding substrate mounting hole 142 to operatively couple the substrate 120 to the anvil 110. More specifically, and as shown in Figure 2, each base plate mounting hole 142 may extend completely through each of the upper base plate member 122 and the lower base plate member 126 and may further extend at least partially into the anvil 110. In this manner, a base plate mounting fastener 144 may be inserted into the base plate mounting hole 142 from above to couple the lower base plate member 126 to the anvil 110, such as via a threaded connection. The base plate mounting fastener 144 may include and / or be any suitable fastener, such as a bolt.

[0022] As discussed, the coolant supply system 200 is generally configured to selectively adjust the temperature of the support assembly 100 and / or the first building component 20 by flowing the coolant 210 through at least a portion of the support assembly 100. In this manner, the coolant 210 absorbs thermal energy from the support assembly 100 and removes thermal energy from the support assembly 100. The coolant 210 may include and / or be any suitable fluid for transporting thermal energy, such as may be known in the art of manufacturing and / or controlling processes. As an example, the coolant 210 may include and / or be water, machining coolant, mineral oil, and / or ethylene glycol.

[0023] As in Figure 1 to Figure 2 , the coolant supply system 200 generally includes one or more coolant channels 170 configured to receive a coolant 210 such that the coolant 210 flows through each coolant channel 170 to remove heat from the support assembly 100. Each coolant channel 170 may extend through and / or be defined by any suitable portion of the support assembly 100. As an example, each coolant channel 170 may be at least partially defined by the anvil 110, the base plate 120, the upper base plate member 122, the lower base plate member 126, and / or the matrix blank 150. In some examples, the coolant channel 170 may be defined by each of two or more components of the support assembly 100. As an example, and as shown in Figure 2 As schematically shown in FIG. 1 , the coolant passage 170 may be partially defined by each of the upper base member 122 and the lower base member 126. More specifically, in Figure 2 In the example of , coolant passage 170 is generally defined by lower base member 126 and covered by the underside of upper base member 122 such that when coolant 210 flows through coolant passage 170 , a portion of the underside of upper base member 122 contacts coolant 210 .

[0024] As in Figure 1 to Figure 2As schematically shown in FIG. 1 , each coolant passage 170 generally includes a coolant inlet 162 and a coolant outlet 164 such that the coolant 210 flows through the coolant passage 170 from the coolant inlet 162 to the coolant outlet 164. In this manner, the coolant passage 170 may be described as extending between the coolant inlet 162 and the coolant outlet 164. Figure 1 As schematically shown in , the coolant inlet 162 and / or the coolant outlet 164 may be defined on an outer surface and / or side of the support assembly 100, such as a generally vertically extending surface and / or side of the support assembly 100. However, this is not required for all embodiments of the coolant supply system 200, and further within the scope of the present disclosure, the coolant inlet 162 and / or the coolant outlet 164 may be positioned on any suitable side and / or face of the support assembly 100 and / or the base plate 120. For example, and as Figure 2 , the coolant inlet 162 and / or the coolant outlet 164 may be positioned on a lower surface of the lower base member 126, such as at a location coplanar with an interface between the anvil 110 and the lower base member 126. In such an example, the anvil 110 may be engaged with the lower base member 126 across only a portion of the lower surface of the lower base member 126, thereby exposing the coolant inlet 162 and / or the coolant outlet 164 to be operatively coupled to one or more other components of the coolant supply system 200.

[0025] Continue to refer Figure 1 , and as discussed, the manufacturing system 10 includes a milling assembly 70 for at least partially forming the second building component 22 via a milling process. As used herein, a milling process may also be referred to as a subtractive manufacturing process. As an example, the milling process may include milling, cutting, drilling, turning, and / or finishing. The milling assembly 70 generally includes a milling cutter 72 for performing the milling process. As discussed herein, the coolant supply system 200 is generally configured to selectively regulate the temperature of the milling cutter 72 with a coolant 210. Specifically, the coolant supply system 200 is generally configured to selectively flow the coolant 210 through the milling cutter 72 to regulate the temperature of the milling cutter 72 during the milling process. As an example, and as discussed in Figure 1 As schematically shown in FIG. 1 , the coolant supply system 200 may include a milling cutter coolant conduit 180 configured to supply a coolant 210 to the milling cutter 72 to cool the milling cutter 72 when manufacturing the second build component 22 .

[0026] Continue to refer Figure 1 , the manufacturing system 10 and / or the coolant supply system 200 may include any suitable components for flowing the coolant 210 through the coolant supply system 200 and / or through another component of the manufacturing system 10, and / or for removing heat from the coolant 210. For example, and as in Figure 1 , the coolant supply system 200 may include one or more coolant conduits 212 configured to supply coolant 210 to the coolant passage 170 and / or the milling cutter coolant conduit 180. In this manner, the milling cutter coolant conduit 180 may be described as an example of a coolant conduit 212. In such an example, the coolant supply system 200 may additionally include a coolant pump 224 configured to pump the coolant 210 through the support assembly 100 and / or through the milling cutter coolant conduit 180 (such as via the coolant conduit 212 and / or the coolant passage 170). Additionally or alternatively, and as described in Figure 1 , the coolant supply system 200 may further include a closed coolant loop 160, such as may be at least partially defined by a coolant conduit 212 and a coolant channel 170, such that the coolant 210 repeatedly flows through the closed coolant loop 160. For example, each coolant conduit 212 may extend to the exterior of the support assembly 100, such that each coolant conduit 212 is in fluid communication with one or more coolant channels 170. In such an example, one or more coolant conduits 212 may be configured to selectively and repeatedly attach to and detach from a corresponding coolant inlet 162 and / or a corresponding coolant outlet 164. In an embodiment including a coolant pump 224 and the closed coolant loop 160, the coolant pump 224 may be configured to repeatedly pump the coolant 210 through the coolant closed loop 160.

[0027] like Figure 1 As further schematically shown in , the coolant supply system 200 generally includes a coolant supply system controller 230 configured to generate and transmit a control signal 232 to at least partially control the flow of the coolant 210 through the coolant supply system 200. More specifically, the coolant supply system controller 230 is generally configured to selectively direct the coolant 210 to the AM component 50 or the milling component 70 according to the manufacturing mode of the manufacturing system 10. For example, the manufacturing system 10 may be configured to operate in either an AM manufacturing mode, in which the AM component 50 is operated to at least partially form the first build part 20, or a milling manufacturing mode, in which the milling component 70 is operated to at least partially form the second build part 22. In such an example, the coolant supply system controller 230 may be configured to selectively direct the coolant 210 to the AM component 50 (thereby flowing through the support assembly 100) when the manufacturing system 10 is in the AM manufacturing mode. Similarly, the coolant supply system controller 230 may be configured to selectively direct the coolant 210 to the milling assembly 70 (and thereby flow through the milling cutter coolant conduit 180 and / or the milling cutter 72) when the manufacturing system 10 is in the milling manufacturing mode. Figure 1 , the coolant supply system 200 may include one or more coolant valves 222 configured to selectively restrict the flow of the coolant 210 through at least a portion of the coolant supply system 200. In such an example, the coolant supply system controller 230 may be configured to actuate the coolant valve 222 to selectively direct the coolant 210 to the AM component 50 or the milling component 70 according to the manufacturing mode of the manufacturing system 10.

[0028] The coolant supply system controller 230 may be configured to detect and / or receive the manufacturing mode of the manufacturing system 10 in any suitable manner. As an example, the coolant supply system controller 230 may be configured to receive manual input from a user corresponding to the manufacturing mode. Additionally or alternatively, and as Figure 1 As further schematically shown in FIG. 1 , the manufacturing system 10 may include a manufacturing mode sensor 270 configured to automatically detect a manufacturing mode and generate a manufacturing mode signal 272 and transmit the manufacturing mode signal 272 to the coolant supply system controller 230, such that the manufacturing mode signal 272 indicates the manufacturing mode. In such an example, the manufacturing mode sensor 270 may be configured to detect the manufacturing mode in any suitable manner, such as by detecting whether the material supply source 52, the directed energy source 56, and / or the milling cutter 72 is installed and / or activated.

[0029] The coolant supply system 200 can be configured to remove heat energy from the coolant 210, such as before and / or after the coolant 210 flows through the support assembly 100, and / or before and / or after the coolant 210 flows through the milling cutter 72. For example, and as in Figure 1 , the coolant supply system 200 may include a heat exchanger 220 configured to remove heat from the coolant 210. In such an example, the coolant conduit 212 may be configured to carry the coolant 210 between the heat exchanger 220 and the support assembly 100, such as by being pumped by a coolant pump 224. Similarly, the coolant conduit 212 may be configured to carry the coolant 210 between the heat exchanger 220 and the milling cutter 72, such as by being pumped by a coolant pump 224, such as via the milling cutter coolant conduit 180.

[0030] The heat exchanger 220 may include and / or be any suitable device and / or mechanism for removing thermal energy from the coolant 210, examples of which include a plate heat exchanger, a fluid heat exchanger, a shell and tube heat exchanger, a passive heat exchanger, an active heat exchanger, an electric heat exchanger, and / or a chiller. When present, the heat exchanger 220 may be configured to remove heat from the coolant 210 at any suitable location relative to the support assembly 100, the milling cutter coolant conduit 180, and / or the closed coolant loop 160. In addition, the heat exchanger 220 may be configured to bring the coolant 210 to any suitable temperature, such as a temperature close to or below the ambient temperature surrounding the support assembly 100. For example, the heat exchanger 220 may be configured to remove heat from the coolant 210 after the coolant 210 flows through the support assembly 100, thereby returning the coolant 210 to a temperature close to or below the ambient temperature before the coolant 210 is recirculated through the support assembly 100 via the closed coolant loop 160. Additionally or alternatively, the heat exchanger 220 may be configured to remove heat from the coolant 210 before the coolant 210 flows through the support assembly 100. For example, the heat exchanger 220 may be configured to cool the coolant 210 to a coolant temperature that is below the ambient temperature surrounding the support assembly 100 before the coolant 210 flows through the support assembly 100. As another example, the heat exchanger 220 may be configured to remove heat from the coolant 210 after the coolant 210 flows through the milling cutter coolant conduit 180 and / or flows through the milling cutter 72, thereby returning the coolant 210 to a temperature that is close to or below the ambient temperature surrounding the milling cutter 72 before the coolant 210 returns to the milling assembly 70 via the closed coolant loop 160. Additionally or alternatively, the heat exchanger 220 may be configured to remove heat from the coolant 210 before the coolant 210 flows through the milling cutter coolant conduit 180 and / or flows through the milling cutter 72. For example, the heat exchanger 220 may be configured to cool the coolant 210 to a coolant temperature that is lower than an ambient temperature surrounding the milling cutter 72 before the coolant 210 flows through the milling cutter 72 .

[0031] The coolant supply system 200 may be configured to regulate the flow of the coolant 210 through the support assembly 100 in any suitable manner. For example, the coolant supply system 200 may be configured to selectively pump the coolant 210 through the support assembly 100 using a coolant pump 224. Additionally or alternatively, and as Figure 1 , the coolant supply system 200 may further include one or more coolant valves 222 configured to selectively restrict the flow of the coolant 210 through the support assembly 100. Thus, for example, in an embodiment of the coolant supply system 200 including the coolant valve 222 and the coolant pump 224, the flow of the coolant 210 through the support assembly 100 may be regulated via selective actuation of the coolant valve 222 while maintaining the coolant pump 224 in a pumping operation mode.

[0032] like Figure 1 As further schematically shown in , the coolant supply system 200 may additionally include a coolant reservoir 226 containing a volume of coolant 210. When present, the coolant reservoir 226 may facilitate the coolant supply system 200 to maintain a steady supply of coolant 210 flowing within the coolant conduit 212 while allowing for fluctuations in the volume of coolant 210 contained in the coolant reservoir 226. Additionally or alternatively, the coolant reservoir 226 may be configured to collect the coolant 210 after the coolant 210 flows through the support assembly 100 and / or is used to cool the milling cutter 72. In such an example, the coolant reservoir 226 may also be referred to as a coolant tank 226. In such an embodiment, the coolant 210 may be configured to be reused by the coolant supply system 200 after flowing through the milling cutter 72. As a more specific example, the manufacturing system 10 may be configured such that the coolant 210 flows into the coolant reservoir 226 after flowing through the milling cutter 72 so that the coolant 210 may be recirculated through the closed coolant loop 160 and then flow through the support assembly 100 and / or through the milling cutter 72 again.

[0033] As used herein, the coolant closed loop 160 may be described as including any component of the coolant supply system 200 that forms a part of the closed coolant loop 160 and / or through which the coolant 210 flows when passing through the closed coolant loop 160. Thus, as an example, the coolant closed loop 160 may be described as including the coolant passage 170, the milling cutter coolant conduit 180, the coolant inlet 162, the coolant outlet 164, the heat exchanger 220, the coolant conduit 212, the coolant pump 224, and / or the coolant reservoir 226. The closed coolant loop 160 may include and / or be any suitable path and / or collection of paths along which the coolant 210 flows. As an example, the closed coolant loop 160 may be substantially and / or completely self-contained, or may be configured to allow the coolant 210 to enter and / or leave the closed coolant loop 160. Typically, the closed coolant loop 160 is configured such that the coolant 210 may repeatedly pass through the closed coolant loop 160 multiple times without leaving the closed coolant loop 160 .

[0034] The coolant supply system 200 may be configured to actively regulate the temperature of the support assembly 100, the first building component 20, and / or the milling cutter 72. For example, the coolant supply system controller 230 may be configured to at least partially actively regulate the temperature of the support assembly 100, the first building component 20, and / or the milling cutter 72. Specifically, the coolant supply system controller 230 may be configured to generate and transmit a control signal 232 to control the heat exchanger 220, the coolant valve 222, and / or the coolant pump 224 to control the flow rate and / or temperature of the coolant 210 flowing through the coolant supply system 200. The coolant supply system controller 230 may be configured to operate at least substantially automatically, and / or may be configured to generate and transmit the control signal 232 at least partially in response to user input.

[0035] The coolant supply system controller 230 may be configured to generate the control signal 232 based on any suitable factors and / or considerations, such as may be based on a measured temperature of a component of the manufacturing system 10. For example, and as Figure 1 , the coolant supply system 200 may include a building part temperature sensor 240 configured to measure the temperature of at least a portion of the first building part 20 when manufacturing the first building part 20. In such an example, the building part temperature sensor 240 may be configured to generate a building part temperature signal 242 representing the temperature of the first building part 20 and transmit the building part temperature signal 242 to the coolant supply system controller 230, so that the coolant supply system controller 230 generates a control signal 232 at least partially in response to the building part temperature signal 242. For example, the coolant supply system controller 230 may be configured to generate a control signal 232 in response to the building part temperature signal 242 indicating that the temperature of at least a portion of the first building part 20 is above a predetermined threshold temperature and / or a predetermined set point temperature to reduce the temperature of the coolant 210 and / or increase the flow rate of the coolant 210. The building part temperature sensor 240 may include and / or be any suitable temperature sensor, such as a non-contact temperature sensor and / or an infrared temperature sensor. In this manner, building part temperature sensor 240 may be configured to measure the temperature of first building part 20 without requiring a direct and / or physical connection to first building part 20 .

[0036] Building component temperature sensor 240 may be configured to measure the temperature of any suitable portion of first building component 20. For example, building component temperature sensor 240 may be configured to measure a characteristic temperature, an average temperature, and / or an overall temperature of first building component 20. Additionally or alternatively. Building component temperature sensor 240 may be configured to measure the temperature of a localized area of ​​first building component 20, such as an area of ​​first building component 20 adjacent to directed energy beam 58 and / or an area of ​​first building component 20 most recently formed by AM assembly 50. For example, building component temperature sensor 240 may be mounted to and / or supported by a component of AM assembly 50, such as material supply source 52 and / or directed energy source 56. In such an example, building component temperature signal 242 may correspond to a maximum temperature of first building component 20. In other examples, building component temperature sensor 240 may be independently movable relative to first building component 20 and / or AM assembly 50.

[0037] As another example, and if Figure 1 As further schematically shown in FIG. 2 , coolant supply system 200 may additionally include a support assembly temperature sensor 250 configured to measure a temperature of at least a portion of support assembly 100 when manufacturing first building component 20. In such an example, support assembly temperature sensor 250 may be configured to generate a support assembly temperature signal 252 representing the temperature of support assembly 100 and transmit support assembly temperature signal 252 to coolant supply system controller 230, such that coolant supply system controller 230 generates control signal 232 at least partially in response to support assembly temperature signal 252. For example, coolant supply system controller 230 may be configured to generate control signal 232 in response to support assembly temperature signal 252 indicating that the temperature of support assembly 100 is above a predetermined threshold temperature and / or a predetermined set point temperature to reduce the temperature of coolant 210 and / or increase the flow rate of coolant 210. Support assembly temperature sensor 250 may include and / or be any suitable temperature sensor, such as a non-contact temperature sensor, an infrared temperature sensor, and / or a thermocouple.

[0038] As another example, and if Figure 1As further schematically shown in FIG. 2 , the coolant supply system 200 may additionally include a coolant temperature sensor 260 configured to measure the temperature of the coolant 210. In such an example, the coolant temperature sensor 260 may be configured to generate a coolant temperature signal 262 representing the temperature of the coolant 210 and transmit the coolant temperature signal 262 to the coolant supply system controller 230, so that the coolant supply system controller 230 generates a control signal 232 at least partially in response to the coolant temperature signal 262. For example, the coolant supply system controller 230 may be configured to generate the control signal 232 in response to the coolant temperature signal 262 indicating that the temperature of the coolant 210 is above a predetermined threshold temperature and / or a predetermined set point temperature to reduce the temperature of the coolant 210 and / or increase the flow rate of the coolant 210. The coolant temperature sensor 260 may include / or be any suitable temperature sensor, such as a thermocouple and / or a flow-through temperature sensor. When present, the coolant temperature sensor 260 may be incorporated into and / or associated with any suitable component of the coolant supply system 200. For example, and as Figure 1 , the heat exchanger 220 may include a coolant temperature sensor 260. However, this is not required for all examples of the coolant supply system 200, and further within the scope of the present disclosure, the coolant temperature sensor 260 may be positioned at any suitable location, such as any suitable location within the closed coolant loop 160.

[0039] As another example, and if Figure 1 As further schematically shown in , the coolant supply system 200 may additionally include a milling cutter temperature sensor 280 configured to measure the temperature of the milling cutter 72. In such an example, the milling cutter temperature sensor 280 may be configured to generate a milling cutter temperature signal 282 representing the temperature of the milling cutter 72 and transmit the milling cutter temperature signal 282 to the coolant supply system controller 230, so that the coolant supply system controller 230 generates a control signal 232 at least partially in response to the milling cutter temperature signal 282. For example, the coolant supply system controller 230 may be configured to generate a control signal 232 in response to the milling cutter temperature signal 282 indicating that the temperature of the milling cutter 72 is above a predetermined threshold temperature and / or a predetermined set point temperature to reduce the temperature of the coolant 210 and / or increase the flow rate of the coolant 210.

[0040] Figure 3 to Figure 4 An example of a substrate 120 is shown less schematically, such as may be employed in manufacturing system 10 and / or support assembly 100. Specifically. Figure 3 is an exploded view showing the substrate 120 with the upper substrate member 122 removed from the lower substrate member 126, and Figure 4 is a top plan view of the lower substrate member 126 . Figure 3 to Figure 4 An example of a substrate 120 including a substrate bonding structure 130 is shown, which is formed by an upper substrate member 122 ( Figure 3 As shown in FIG. 1 , the plurality of engagement bosses 132 defined by the lower substrate member 126 and the corresponding plurality of engagement holes 134 defined by the lower substrate member 126 are formed. Figure 3 As shown, each engagement boss 132 occupies a volume that includes a corresponding fixture 124 . Figure 3 to Figure 4 The example of the base plate 120 additionally includes a plurality of base plate mounting holes 142 extending through each of the upper base plate member 122 and the lower base plate member 126 .

[0041] Figure 3 to Figure 4 An example of a base plate 120 is shown in which a coolant channel 170 is partially defined by each of an upper base plate member 122 and a lower base plate member 126. More specifically, Figure 3 to Figure 4 The coolant passages 170 of the example are generally defined by the lower base member 126 such that a lower surface of the upper base member 122 receives the coolant 210 within the coolant passages 170 . Figure 3 to Figure 4 An example is additionally shown in which the coolant inlet 162 and the coolant outlet 164 are defined on the lower surface of the lower base member 162 .

[0042] Figure 3 to Figure 4 Additionally, an example is shown in which the coolant passage 170 exhibits a serpentine (ie, non-linear) configuration. Figure 3 to Figure 4 As illustrated, each coolant passage 170 of the coolant supply system 200 according to the present disclosure may include and / or be characterized as a passage length 172 that is equal to the shortest distance between the coolant inlet 162 and the coolant outlet 164 through the coolant passage 170. Figure 3 to Figure 4 As further shown in , the support assembly 100 may additionally include and / or be characterized as a support assembly lateral dimension 102 such that a channel length 172 is greater than the support assembly lateral dimension 102. As a more specific example, the ratio between the channel length 172 and the support assembly lateral dimension 102 may be at least 1.1:1, at least 2:1, at least 3:1, at least 4:1, at least 5:1, and / or at most 10:1. In this manner, relative to embodiments in which the coolant channel 170 extends generally linearly through the support assembly 100, the coolant 210 may be in direct thermal contact with a larger surface area of ​​the support assembly 100 as the coolant 210 flows through the support assembly 100. The support assembly lateral dimension 102 may correspond to any suitable dimension of the support assembly 100 and / or the substrate 120. For example, and as shown in Figure 3 to Figure 4As shown in FIG. 1 , the coolant passages 170 may generally extend within a coolant passage plane 174 , and the support assembly transverse dimension 102 may correspond to an outer dimension of the support assembly 100 extending within the coolant passage plane 174 .

[0043] Figure 5 1 is a flow chart depicting a method 300 of utilizing a manufacturing system (such as manufacturing system 10) during a manufacturing process to at least partially manufacture a build component (such as first build component 20 and / or second build component 22) in accordance with the present disclosure. Figure 5 In the embodiment, some steps are shown in dashed boxes, indicating that these steps may be optional or may correspond to optional versions of the method according to the present disclosure. That is, it is not required that all methods according to the present disclosure include the steps shown in the solid boxes. Figure 5 The methods and steps shown in are not limiting, and other methods and steps fall within the scope of the present disclosure, including methods having more or less than the number of steps shown, as will be understood from the discussion herein.

[0044] like Figure 5 As shown, method 300 includes: detecting a manufacturing mode of a manufacturing system at 310; and forming a build part via a manufacturing process at 320. Method 300 additionally includes: selectively supplying a coolant (such as coolant 210) to a support assembly (such as support assembly 100) supporting and in thermal communication with the build part and / or a milling cutter (such as milling cutter 72) at least partially forming the build part in a milling process at 330, at least partially simultaneously with the forming at 320. The selective supply at 330 is based at least in part on the detected manufacturing mode at 310, as described herein.

[0045] Forming the building component at 320 may include forming via any suitable manufacturing process. For example, and as in Figure 5 As shown, the forming at 320 may include forming the build component via an AM process at 322. As a more specific example, the forming of the build component via an AM process at 322 may include forming the build component via a powder feed process, a directed energy deposition (DED) process, a direct laser deposition (DLD) process, a direct metal deposition process, a large melt pool process, and / or a powder bed process. Additionally or alternatively, and as Figure 5 As shown, the forming at 320 may include forming the building part via a milling process, such as using a milling cutter, at 324. As a more specific example, the milling process may include milling, cutting, turning, drilling, and / or finishing the building part.

[0046] Detecting the manufacturing mode at 310 may include detecting whether the build component is formed via an AM process or via a milling process, such that supplying coolant at 330 includes supplying coolant to a corresponding portion of the manufacturing system. For example, the detecting at 310 may include detecting that the manufacturing system is in an AM mode, such that forming the build component at 320 includes at least partially forming the build component via an AM process. In such an example, and as Figure 5 As shown, supplying coolant at 330 may include flowing coolant through the support assembly at 334 to regulate the temperature of the build part. As another example, detecting at 310 may include detecting that the manufacturing system is in a milling mode, such that forming the build part at 320 includes at least partially forming the build part via a milling process. In such an example, and as Figure 5 As shown, supplying coolant at 330 may include cooling the milling cutter with the coolant at 336 , such as by flowing the coolant through the milling cutter.

[0047] Selectively supplying coolant at 330 may include controlling the flow of coolant in any suitable manner. For example, and as Figure 5 As shown, the selective supply at 330 may include, at 332, activating one or more coolant valves (such as coolant valve 222) to selectively direct coolant to one or more coolant passages (such as coolant passage 170) extending through the support assembly or to a milling cutter coolant conduit (such as milling cutter coolant conduit 180) that directs coolant to the milling cutter. In such an example, activating the coolant valve at 332 may be performed with a coolant supply system controller (such as coolant supply system controller 230), such as in response to a control signal (such as control signal 232) transmitted by the coolant supply system controller. For example, detecting the manufacturing mode at 310 may include, with the coolant supply system controller, detecting the manufacturing mode, and the selective supply of coolant at 330 may include, at 332, activating the coolant valve in response to the coolant supply system controller generating a control signal and transmitting the control signal to the coolant valve. In such an example, detecting the manufacturing mode at 310 may be performed in any suitable manner. For example, detecting the manufacturing mode at 310 may include, with the coolant supply system controller, receiving a manual input corresponding to the operating mode. Additionally or alternatively, detecting the manufacturing mode at 310 may include generating and transmitting a manufacturing mode signal (such as manufacturing mode signal 272 ) corresponding to the manufacturing mode with a manufacturing mode sensor (such as manufacturing mode sensor 270 ) and receiving the manufacturing mode signal with a coolant supply system controller.

[0048] As described herein, the manufacturing system may be a dual-purpose manufacturing machine configured to perform each of forming a build part via an AM process at 322 and forming a build part via a milling process at 324. In such an example, the build part at least partially formed during forming via the AM process at 322 may be referred to as a first build part (such as first build part 20), and the build part at least partially formed during forming via the milling process at 324 may be referred to as a second build part (such as second build part 22). More specifically, in such an example, in addition to forming the first build part via the AM process at 322, method 300 may additionally include: performing detection at 310 to detect that the manufacturing system is in a milling mode at 310; and performing forming at 324 to at least partially form the second build part via the milling process. In such an example, selectively supplying a coolant at 330 may include cooling the milling cutter with the coolant at 336.

[0049] In the example of method 300 that includes forming a first build part via an AM process at 322 and forming a second build part via a milling process at 324, the forming at 322 and the forming at 324 can be performed in any suitable order and / or sequence. As an example, at least partially forming the first build part via an AM process at 322 can be performed before, after, and / or at least partially simultaneously with at least partially forming the second build part via a milling process at 324.

[0050] In examples where supplying coolant at 330 includes flowing coolant through the support assembly at 334, the flow at 334 may be configured to regulate the temperature of the build component in any suitable manner. As an example, and as described herein, the flow at 334 may be configured to maintain the temperature of the build component below a predetermined maximum temperature and / or may be configured to maintain the temperature of the build component at least substantially at a predetermined set point temperature.

[0051] Flowing coolant through the support assembly at 334 typically includes flowing coolant through the support assembly such that the coolant removes heat from the support assembly, thereby indirectly cooling the build part. Similarly, cooling the milling cutter with coolant at 336 typically includes flowing coolant through the milling cutter such that the coolant removes heat from the milling cutter, thereby directly cooling the milling cutter. Thus, and as Figure 5 As shown, method 300 may additionally include removing heat from the coolant at 350. Additionally or alternatively, and as Figure 5As further shown, the method 300 may include, after selectively supplying coolant at 330, recirculating the coolant at 360. As an example, supplying coolant at 330 may include flowing the coolant through (or may be a portion of) a closed coolant loop, such as the closed coolant loop 160, and recirculating at 360 may include recirculating the coolant through the closed coolant loop. In an example where supplying coolant at 330 includes flowing the coolant through a support assembly at 334 and cooling the milling cutter with the coolant at 336, recirculating the coolant at 360 may include, after cooling the milling cutter with the coolant at 336, flowing the coolant through the support assembly at 334. Additionally or alternatively, recirculating the coolant at 360 may include, after selectively supplying coolant at 330, collecting the coolant in a coolant reservoir, such as the coolant reservoir 226.

[0052] Removing heat from the coolant at 350 can be performed in any suitable manner. For example, removing heat at 350 can be performed before and / or after flowing the coolant through the support assembly at 334. As a more specific example, in an example of method 300 that includes recirculating at 360, removing heat at 350 can include bringing the coolant to a temperature that is close to or below the ambient temperature surrounding the support assembly prior to recirculating at 360. Additionally or alternatively, removing heat at 350 can include cooling the coolant to a coolant temperature that is below the ambient temperature surrounding the support assembly prior to flowing the coolant through the support assembly at 334. Figure 5 As shown, and as discussed herein, removing heat at 350 may include flowing the coolant through a heat exchanger, such as heat exchanger 220 , at 352 , thereby reducing a coolant temperature of the coolant.

[0053] Removing heat from the coolant at 350 may include adjusting the temperature of the coolant based on the measured temperature of one or more components of the manufacturing system. For example, the removal heat at 350 may be based at least in part on the measured temperature of the build component. In such an example, the measured temperature of the build component may correspond to a build component temperature signal (such as build component temperature signal 242) such as may be generated by a build component temperature sensor (such as build component temperature sensor 240). Additionally or alternatively, the removal heat at 350 may be based at least in part on the measured temperature of the support assembly. In such an example, the measured temperature of the support assembly may correspond to a support assembly temperature signal (such as support assembly temperature signal 252) such as may be generated by a support assembly temperature sensor (such as support assembly temperature sensor 250). Additionally or alternatively, the removal heat at 350 may be based at least in part on the measured temperature of the coolant. In such an example, the measured temperature of the coolant may correspond to a coolant temperature signal (such as coolant temperature signal 262) such as may be generated by a coolant temperature sensor (such as coolant temperature sensor 260). Additionally or alternatively, the heat removal at 350 may be based at least in part on the measured temperature of the milling cutter. In such an example, the measured temperature of the milling cutter may correspond to a milling cutter temperature signal (such as milling cutter temperature signal 282) such as may be generated by a milling cutter temperature sensor (such as milling cutter temperature sensor 280). In such an example, the build component temperature signal, the support assembly temperature signal, the milling cutter temperature signal, and / or the coolant temperature signal may be received by a coolant supply system controller, and the heat removal at 350 may include transmitting a control signal (such as control signal 232) from the coolant supply system controller to the heat exchanger. As a more specific example, if the build component temperature signal, the support assembly temperature signal, the milling cutter temperature signal, and / or the coolant temperature signal indicate that the temperature is at or above a threshold temperature and / or a predetermined set point temperature, the control signal may command the heat exchanger to reduce the coolant temperature of the coolant. Similarly, if the build component temperature signal, the support assembly temperature signal, the milling cutter temperature signal, and / or the coolant temperature signal indicate that the temperature is below a threshold temperature and / or a predetermined set point temperature, the control signal may command the heat exchanger to stop reducing the coolant temperature. In such an example, removing heat at 350 may include generating a control signal according to any suitable control system routine, such as a proportional-integral-derivative (PID) algorithm.

[0054] As discussed, method 300 may include regulating the temperature of the build component and / or the milling cutter by adjusting the temperature of a coolant flowing in thermal communication with the build component and / or the milling cutter. Additionally or alternatively, method 300 may include regulating the temperature of the build component and / or the milling cutter by adjusting the flow rate of the coolant through the coolant supply system. That is, and as Figure 5As shown, supplying coolant at 330 may include selectively adjusting the flow rate of coolant such as flowing through the support assembly and / or flowing through the milling cutter at 338. The selective adjustment at 338 may include adjusting in any suitable manner. As an example, and as Figure 5 As shown, the selective adjustment at 338 may include pumping coolant with a coolant pump (such as coolant pump 224 ) at 340 and / or may include actuating one or more coolant valves at 332 to selectively restrict and allow flow of coolant.

[0055] Selectively adjusting the flow rate of the coolant at 338 may include adjusting the flow rate of the coolant based on the measured temperature of one or more components of the manufacturing system. For example, the selective adjustment at 338 may be based at least in part on the measured temperature of the build component, such as corresponding to the build component temperature signal. Additionally or alternatively, the selective adjustment at 338 may be based at least in part on the measured temperature of the support assembly, such as corresponding to the support assembly temperature signal. Additionally or alternatively, the selective adjustment at 338 may be based at least in part on the measured temperature of the milling cutter, such as corresponding to the milling cutter temperature signal. Additionally or alternatively, the selective adjustment at 338 may be based at least in part on the measured temperature of the coolant, such as corresponding to the coolant temperature signal. In such an example, the selective adjustment at 338 may include transmitting a control signal from the coolant supply system controller to the coolant pump and / or the coolant valve. As a more specific example, if the build component temperature signal, the support assembly temperature signal, the milling cutter temperature signal, and / or the coolant temperature signal indicate that the temperature is at or above a threshold temperature and / or a predetermined set point temperature, the control signal may command the coolant pump to pump coolant, and / or command the coolant valve to allow coolant to flow through the support assembly and / or the milling cutter. Similarly, if the build component temperature signal, the support assembly temperature signal, the milling cutter temperature signal, and / or the coolant temperature signal indicate that the temperature is below a threshold temperature and / or a predetermined set point temperature, the control signal may command the coolant pump to stop pumping coolant, and / or command the coolant valve to prevent coolant from flowing through the support assembly and / or the milling cutter. In such an example, the selective adjustment at 338 may include generating the control signal according to any suitable control system routine, such as a proportional-integral-derivative (PID) algorithm.

[0056] Exemplary, non-exclusive examples of the inventive subject matter according to the present disclosure are described in the following enumerated paragraphs:

[0057] A1. A manufacturing system (10), comprising:

[0058] an additive manufacturing (AM) assembly (50) configured to at least partially form a first build component (20) via an AM process;

[0059] a milling assembly (70) configured to at least partially form the second building component (22) via a milling process; and

[0060] A coolant supply system (200) is configured to selectively supply a coolant (210) to each of the AM assembly (50) and the milling assembly (70).

[0061] A2. A manufacturing system (10) according to paragraph A1, wherein the AM component (50) includes a support component (100) that supports the first building part (20) and is thermally connected to the first building part (20) when manufacturing the first building part (20), and wherein the coolant supply system (200) is configured to remove heat from the support component (100) by flowing the coolant (210) through at least a portion of the support component (100) when manufacturing the first building part (20) to adjust the temperature of the first building part (20) when manufacturing the first building part (20).

[0062] A3. A manufacturing system (10) according to any of paragraphs A1 to A2, wherein the milling assembly (70) includes a milling cutter (72) configured to at least partially form the second building part (22), and wherein the coolant supply system (200) includes a milling cutter coolant conduit (180) configured to supply the coolant (210) to the milling cutter (72) to cool the milling cutter (72) when manufacturing the second building part (22).

[0063] A4. A manufacturing system (10) according to any of paragraphs A1 to A3, wherein the coolant supply system (200) further includes a coolant supply system controller (230) configured to generate and transmit a control signal (232) to at least partially control the flow of the coolant (210) through the coolant supply system (200).

[0064] A5. A manufacturing system (10) according to paragraph A4, wherein the manufacturing system (10) is configured to operate in a manufacturing mode of one of an AM manufacturing mode and a milling manufacturing mode, in which the AM component (50) is operated to at least partially form the first building part (20), and in the milling manufacturing mode, the milling component (70) is operated to at least partially form the second building part (22), and wherein the coolant supply system controller (230) is configured to selectively direct the coolant (210) to one of the AM component (50) and the milling component (70) based at least in part on the manufacturing mode of the manufacturing system (10).

[0065] A6. A manufacturing system (10) according to paragraph A5, wherein the coolant supply system (200) further includes one or more coolant valves (222) configured to selectively restrict the flow of the coolant (210) through at least a portion of the coolant supply system (200), and wherein the coolant supply system controller (230) is configured to actuate at least one of the one or more coolant valves (222) to selectively direct the coolant (210).

[0066] A7. A manufacturing system (10) according to any of paragraphs A5 to A6, wherein the coolant supply system controller (230) is configured to receive manual input from a user corresponding to a manufacturing mode of the manufacturing system (10).

[0067] A8. The manufacturing system (10) described in any of paragraphs A5 to A7 further includes a manufacturing mode sensor (270), which is configured to automatically detect the manufacturing mode of the manufacturing system (10) and generate a manufacturing mode signal (272) indicating the manufacturing mode and transmit the manufacturing mode signal to the coolant supply system controller (230).

[0068] A9. A manufacturing system (10) according to any one of paragraphs A6 to A8, when subordinate to paragraph A2, wherein the coolant supply system controller (230) is configured such that, when the manufacturing system is in the AM manufacturing mode, the coolant supply system controller (230) actuates at least one of the one or more coolant valves (222) to direct the coolant (210) to the support assembly (100), thereby regulating the temperature of the first building component (20).

[0069] A10. A manufacturing system (10) according to any one of paragraphs A6 to A9, when subordinate to paragraph A3, wherein the coolant supply system controller (230) is configured such that, when the manufacturing system is in the milling manufacturing mode, the coolant supply system controller (230) actuates at least one of the one or more coolant valves (222) to guide the coolant (210) to the milling cutter coolant conduit (180), thereby adjusting the temperature of the milling cutter (72).

[0070] A11. A manufacturing system (10) according to any of paragraphs A1 to A10, wherein the AM process includes one or more of a powder feeding process, a directed energy deposition (DED) process, a direct laser deposition (DLD) process, a direct metal deposition process, a large melt pool process and a powder bed process.

[0071] A12. A manufacturing system (10) according to any of paragraphs A1 to A11, wherein the AM component (50) includes a material supply source (52) configured to supply bulk material (54) to form the first building part (20).

[0072] A13. A manufacturing system (10) according to paragraph A12, wherein the bulk material (54) includes one or more of metal, powdered metal, and wire.

[0073] A14. A manufacturing system (10) according to any of paragraphs A12 to A13, wherein the material supply source (52) includes one or more of a powder feeder, a wire feeder, a nozzle, and a powder bed.

[0074] A15. A manufacturing system (10) according to any of paragraphs A12 to A14, wherein the AM component (50) includes a directed energy source (56) configured to provide energy to the bulk material (54) to at least partially form the first building component (20).

[0075] A16. A manufacturing system (10) according to paragraph A15, wherein the directed energy source (56) is configured to melt and sinter one or more of the bulk materials (54) to at least partially form the first building part (20).

[0076] A17. A manufacturing system (10) according to any of paragraphs A15 to A16, wherein the directed energy source (56) is configured to emit a directed energy beam (58) comprising one or more of a laser, a plasma source, and an electron beam.

[0077] A18. A manufacturing system (10) according to any one of paragraphs A2 to A17, wherein the support assembly (100) includes a base plate (120) and an anvil (110) supporting the base plate (120), wherein the base plate (120) is configured to support the first building part (20) when manufacturing the first building part (20).

[0078] A19. A manufacturing system (10) according to paragraph A18, wherein the substrate (120) is configured to support the first building component (20) so that the first building component (20) is thermally connected to at least a portion of the support assembly (100) when the first building component (20) is manufactured.

[0079] A20. The manufacturing system (10) of any of paragraphs A18 to A19, wherein the substrate (120) is directly coupled to the anvil (110).

[0080] A21. A manufacturing system (10) according to any of paragraphs A18 to A20, wherein the manufacturing system (10) is configured to manufacture the first building component (20) directly on the substrate (120).

[0081] A22. A manufacturing system (10) according to any of paragraphs A18 to A20, wherein the support assembly (100) further includes a matrix blank (150), which is configured to be selectively and operationally coupled to the substrate (120), and wherein the manufacturing system (10) is configured to manufacture the first building component (20) directly on the matrix blank (150).

[0082] A23. A manufacturing system (10) according to paragraph A22, wherein the support assembly (100) further includes one or more clamps (152) configured to selectively hold the matrix blank (150) against the base plate (120), and wherein the base plate (120) includes one or more fixtures (124) configured to selectively receive and engage the one or more clamps (152).

[0083] A24. A manufacturing system (10) according to any one of paragraphs A18 to A23, wherein the substrate (120) includes an upper substrate member (122) and a lower substrate member (126) supporting the upper substrate member (122).

[0084] A25. The manufacturing system (10) of paragraph A24, wherein the upper substrate member (122) and the lower substrate member (126) are configured to selectively and repeatedly engage with and disengage from each other.

[0085] A26. A manufacturing system (10) according to any of paragraphs A24 to A25, wherein the substrate (120) further includes a substrate engaging structure (130) configured to maintain the upper substrate member (122) and the lower substrate member (126) in a fixed position relative to each other when the upper substrate member (122) and the lower substrate member (126) are operatively engaged with each other.

[0086] A27. A manufacturing system (10) according to paragraph A26, wherein the substrate joining structure (130) includes one or more joining bosses (132) and one or more joining holes (134), and when the upper substrate member (122) is operably coupled to the lower substrate member (126), the one or more joining holes receive corresponding joining bosses (132) among the one or more joining bosses (132), wherein one of the upper substrate member (122) and the lower substrate member (126) includes the one or more joining bosses (132), and wherein the other of the upper substrate member (122) and the lower substrate member (126) includes the one or more joining holes (134).

[0087] A28. A manufacturing system (10) according to any of paragraphs A24 to A27, when dependent on paragraph A23, wherein the upper substrate member (122) includes each of the one or more fixtures (124).

[0088] A29. A manufacturing system (10) according to any of paragraphs A18 to A28, wherein the support assembly (100) further includes a substrate mounting structure (140) for operatively coupling the substrate (120) to the anvil (110).

[0089] A30. The manufacturing system (10) of paragraph A29, wherein the substrate mounting structure (140) comprises:

[0090] (i) one or more base plate mounting holes (142) defined by one or more of the base plate (120) and the anvil (110); and

[0091] (ii) one or more baseplate mounting fasteners (144), each baseplate mounting fastener (144) configured to extend through a corresponding baseplate mounting hole (142) to operatively couple the baseplate (120) to the anvil (110).

[0092] A31. The manufacturing system (10) described in any of paragraphs A2 to A30, when subordinate to paragraph A15, further includes a support component positioning system (104) configured to selectively position the support component (100) relative to at least a portion of the AM component (50).

[0093] A32. A manufacturing system (10) according to paragraph A31, wherein the support assembly positioning system (104) is configured to enable at least a portion of the support assembly (100) to translate in one or more of one translational degree of freedom, two translational degrees of freedom, and three translational degrees of freedom.

[0094] A33. A manufacturing system (10) according to any of paragraphs A31 to A32, wherein the support assembly positioning system (104) is configured to rotate at least a portion of the support assembly (100) in one or more of one rotational degree of freedom, two rotational degrees of freedom, and three rotational degrees of freedom.

[0095] A34. A manufacturing system (10) according to any of paragraphs A1 to A33, wherein the milling process includes one or more of milling, cutting, turning, drilling and finishing.

[0096] A35. A manufacturing system (10) according to any of paragraphs A1 to A34, wherein the coolant (210) includes one or more of water, machining coolant, mineral oil and ethylene glycol.

[0097] A36. A manufacturing system (10) according to any of paragraphs A2 to A35, wherein the coolant supply system (200) includes one or more coolant channels (170) configured to receive the coolant (210), and wherein the coolant (210) is configured to flow through the one or more coolant channels (170) to remove heat from the support assembly (100).

[0098] A37. A manufacturing system (10) according to paragraph A36, wherein each of the coolant channels (170) is at least partially defined by one or more of the anvil (110), the base plate (120), the upper base plate member (122), the lower base plate member (126) and the matrix blank (150).

[0099] A38. A manufacturing system (10) according to paragraph A37, wherein the one or more coolant channels (170) are at least partially defined by each of two or more of the anvil (110), the base plate (120), the upper base plate member (122), the lower base plate member (126), and the matrix blank (150).

[0100] A39. The manufacturing system (10) of paragraph A38, wherein the one or more coolant channels (170) are at least partially defined by each of the upper substrate member (122) and the lower substrate member (126).

[0101] A40. A manufacturing system (10) according to any of paragraphs A36 to A39, wherein each coolant channel (170) includes a coolant inlet (162) and a coolant outlet (164), wherein the coolant (210) is configured to flow from the coolant inlet (162) to the coolant outlet (164) through the coolant channel (170).

[0102] A41. The manufacturing system (10) of paragraph A40, wherein each coolant channel (170) extends between the coolant inlet (162) and the coolant outlet (164).

[0103] A42. A manufacturing system (10) according to any of paragraphs A36 to A41, wherein each coolant channel (170) has a channel length (172) equal to the shortest distance between the corresponding coolant inlet (162) and the corresponding coolant outlet (164) through the coolant channel (170), wherein the support assembly (100) has a support assembly transverse dimension (102), and wherein the channel length (172) is greater than the support assembly transverse dimension (102).

[0104] A43. A manufacturing system (10) according to paragraph A42, wherein the ratio between the channel length (172) and the lateral dimension (102) of the support assembly is one or more of at least 1.1:1, at least 2:1, at least 3:1, at least 4:1, at least 5:1 and at most 10:1.

[0105] A44. A manufacturing system (10) according to any of paragraphs A42 to A43, wherein the channel length (172) extends generally within the coolant channel plane (174), and wherein the support assembly lateral dimension (102) corresponds to an external dimension of the support assembly (100) extending within the coolant channel plane (174).

[0106] A45. The manufacturing system (10) of any of paragraphs A1 to A44, wherein the coolant supply system (200) further comprises a heat exchanger (220) configured to remove heat from the coolant (210).

[0107] A46. A manufacturing system (10) according to paragraph A45, wherein the heat exchanger (220) includes one or more of a plate heat exchanger, a fluid heat exchanger, a shell and tube heat exchanger, a passive heat exchanger, an active heat exchanger, an electric heat exchanger and a refrigerator.

[0108] A47. A manufacturing system (10) according to any of paragraphs A45 to A46, when subordinate to paragraph A2, wherein the heat exchanger (220) is configured to remove heat from the coolant (210) after the coolant (210) flows through the support assembly (100).

[0109] A48. A manufacturing system (10) according to any of paragraphs A45 to A47, when subordinate to paragraph A2, wherein the heat exchanger (220) is configured to remove heat from the coolant (210) before the coolant (210) flows through the support assembly (100).

[0110] A49. A manufacturing system (10) according to paragraph A48, wherein the heat exchanger (220) is configured to cool the coolant (210) to a coolant temperature that is lower than the ambient temperature surrounding the support assembly (100) before the coolant (210) flows through the support assembly (100).

[0111] A50. A manufacturing system (10) according to any of paragraphs A45 to A49, when subordinate to paragraph A3, wherein the heat exchanger (220) is configured to remove heat from the coolant (210) after the coolant (210) flows through the milling cutter coolant conduit (180).

[0112] A51. A manufacturing system (10) according to any of paragraphs A45 to A50, when subordinate to paragraph A3, wherein the heat exchanger (220) is configured to remove heat from the coolant (210) before the coolant (210) flows through the milling cutter coolant conduit (180).

[0113] A52. A manufacturing system (10) according to paragraph A51, wherein the heat exchanger (220) is configured to cool the coolant (210) to a coolant temperature that is lower than the ambient temperature surrounding the milling cutter (72) before the coolant (210) flows through the milling cutter coolant conduit (180).

[0114] A53. A manufacturing system (10) according to any of paragraphs A36 to A52, wherein the coolant supply system (200) further includes one or more coolant conduits (212) configured to supply the coolant (210) to each coolant channel (170).

[0115] A54. The manufacturing system (10) of paragraph A53, wherein the one or more coolant conduits (212) are configured to transport the coolant (210) between the heat exchanger (220) and the support assembly (100).

[0116] A55. The manufacturing system (10) of any of paragraphs A53 to A54, wherein each coolant conduit (212) extends outside of the support assembly (100).

[0117] A56. A manufacturing system (10) according to any of paragraphs A53 to A55, wherein at least one of the one or more coolant conduits (212) is configured to be selectively and repeatedly attached to and detached from a corresponding coolant inlet (162) and a corresponding coolant outlet (164).

[0118] A57. A manufacturing system (10) according to any of paragraphs A1 to A56, wherein the coolant supply system (200) further includes a coolant pump (224) configured to pump the coolant (210) through the coolant supply system (200).

[0119] A58. A manufacturing system (10) according to paragraph A57, wherein the coolant pump (224) is configured to pump the coolant (210) between the heat exchanger (220) / the heat exchanger (220) and the support assembly (100) / the support assembly (100).

[0120] A59. The manufacturing system (10) of any one of paragraphs A1 to A58, wherein the coolant supply system (200) further comprises a coolant reservoir (226) containing a volume of the coolant (210).

[0121] A60. A manufacturing system (10) according to paragraph A59, when subordinate to paragraph A50, wherein the coolant reservoir (226) is configured to facilitate maintaining a steady supply of the coolant (210) within one or more of the coolant conduits (212) while allowing fluctuations in the volume of the coolant (210) contained in the coolant reservoir (226).

[0122] A61. A manufacturing system (10) according to any of paragraphs A59 to A60, wherein the coolant reservoir (226) is configured to collect the coolant (210) after the coolant (210) flows through the support assembly (100) or after the coolant (210) cools the milling cutter (72).

[0123] A62. A manufacturing system (10) according to any of paragraphs A1 to A61, wherein the coolant supply system (200) further includes a closed coolant loop (160), wherein the coolant (210) is configured to repeatedly flow through the closed coolant loop (160).

[0124] A63. The manufacturing system (10) of paragraph A62, wherein the coolant pump (224) / the coolant pump (224) is configured to repeatedly pump the coolant (210) through the closed coolant loop (160).

[0125] A64. The manufacturing system (10) of any of paragraphs A62 to A63, wherein the closed coolant loop (160) includes one or more of the following:

[0126] (i) one or more coolant channels (170) / the one or more coolant channels (170);

[0127] (ii) one or more coolant inlets (162) / the one or more coolant inlets (162);

[0128] (iii) one or more coolant outlets (164) / the one or more coolant outlets (164);

[0129] (iv) a heat exchanger (220) / the heat exchanger (220);

[0130] (v) one or more coolant conduits (212) / the one or more coolant conduits (212);

[0131] (vi) one or more coolant valves (222) / the one or more coolant valves (222);

[0132] (vii) a coolant pump (224) / the coolant pump (224);

[0133] (viii) a coolant reservoir (226) / the coolant reservoir (226); and

[0134] (ix) Milling cutter coolant conduit (180) / the milling cutter coolant conduit (180).

[0135] A65. A manufacturing system (10) according to any of paragraphs A4 to A64, wherein the coolant supply system controller (230) is configured to generate and transmit the control signal (232) to automatically control one or more of the heat exchanger (220) / the heat exchanger (220), the coolant valve (222) / the coolant valve (222) and the coolant pump (224) / the coolant pump (224) to at least partially regulate the temperature of one or more of the support assembly (100), the first building component (20) and the milling cutter (72).

[0136] A66. A manufacturing system (10) according to paragraph A65, wherein the coolant supply system (200) further includes a building component temperature sensor (240) configured to measure the temperature of at least a portion of the first building component (20) when manufacturing the first building component (20), wherein the building component temperature sensor (240) is configured to generate a building component temperature signal (242) representing the temperature of the first building component (20) and transmit the building component temperature signal (242) to the coolant supply system controller (230), and wherein the coolant supply system controller (230) is configured to generate the control signal (232) at least partially in response to the building component temperature signal (242).

[0137] A67. A manufacturing system (10) according to paragraph A64, wherein the building part temperature sensor (240) includes one or more of a non-contact temperature sensor and an infrared temperature sensor.

[0138] A68. A manufacturing system (10) according to any of paragraphs A66 to A67, wherein the building part temperature sensor (240) is configured to measure the temperature of a region of the first building part (20) that was most recently formed by the AM component (50) / the AM component (50).

[0139] A69. The manufacturing system (10) of any of paragraphs A66 to A68, wherein the building part temperature sensor (240) is configured to measure a maximum temperature of the first building part (20).

[0140] A70. The manufacturing system (10) of any of paragraphs A66 to A69, wherein the build part temperature sensor (240) is mounted to at least a portion of the AM component (50).

[0141] A71. A manufacturing system (10) according to any of paragraphs A66 to A70, wherein the building part temperature sensor (240) moves independently relative to the first building part (20) and the AM component (50) / one or more of the AM components (50).

[0142] A72. A manufacturing system (10) according to any of paragraphs A65 to A71, wherein the coolant supply system (200) further includes a support assembly temperature sensor (250) configured to measure the temperature of at least a portion of the support assembly (100) when manufacturing the first building component (20), wherein the support assembly temperature sensor (250) is configured to generate a support assembly temperature signal (252) representing the temperature of the support assembly (100) and transmit the support assembly temperature signal (252) to the coolant supply system controller (230), and wherein the coolant supply system controller (230) is configured to generate the control signal (232) at least partially in response to the support assembly temperature signal (252).

[0143] A73. A manufacturing system (10) according to paragraph A72, wherein the support assembly temperature sensor (250) includes one or more of a non-contact temperature sensor, an infrared temperature sensor, and a thermocouple.

[0144] A74. A manufacturing system (10) according to any of paragraphs A65 to A73, wherein the coolant supply system (200) further includes a coolant temperature sensor (260) configured to measure the temperature of the coolant (210), wherein the coolant temperature sensor (260) is configured to generate a coolant temperature signal (262) representing the temperature of the coolant (210) and transmit the coolant temperature signal (262) to the coolant supply system controller (230), and wherein the coolant supply system controller (230) is configured to generate the control signal (232) at least partially in response to the coolant temperature signal (262).

[0145] A75. A manufacturing system (10) according to paragraph A74, wherein the coolant temperature sensor (260) includes one or more of a thermocouple and a flow-through temperature sensor.

[0146] A76. A manufacturing system (10) according to any of paragraphs A65 to A75, wherein the coolant supply system (200) further includes a milling cutter temperature sensor (280) configured to measure the temperature of at least a portion of the milling cutter (72), wherein the milling cutter temperature sensor (280) is configured to generate a milling cutter temperature signal (282) representing the temperature of the milling cutter (72) and transmit the milling cutter temperature signal (282) to the coolant supply system controller (230), and wherein the coolant supply system controller (230) is configured to generate the control signal (232) at least partially in response to the milling cutter temperature signal (282).

[0147] A77. A manufacturing system (10) according to any of paragraphs A1 to A76, wherein the first building component (20) and the second building component (22) are different components.

[0148] A78. A manufacturing system (10) according to any of paragraphs A1 to A76, wherein the first building component (20) and the second building component (22) correspond to respective portions of a single component.

[0149] B1. A method (300) of operating a manufacturing system (10) during a manufacturing process, the method (300) comprising:

[0150] Step (310), detecting a manufacturing mode of the manufacturing system (10);

[0151] Step (320), forming the building component (20) through a manufacturing process; and

[0152] A step (330), at least partially concurrently with the step (320) of forming the build component (20), selectively supplies a coolant (210) to one or more of:

[0153] (i) a support assembly (100) supporting the building component (20) and being in thermal communication with the building component (20); and

[0154] (ii) a milling cutter (72) for at least partially forming the building component (20) during a milling process;

[0155] wherein the step (330) of selectively supplying the coolant (210) is based at least in part on the step (310) of detecting a manufacturing mode.

[0156] B2. The method (300) of paragraph B1, wherein the step (310) of detecting the manufacturing mode includes: step (310) of detecting that the manufacturing system (10) is in AM mode, wherein the step (320) of forming the building part (20) includes: step (322) of at least partially forming the building part (20) via an AM process, and wherein the step (330) of selectively supplying the coolant (210) includes: step (334) of causing the coolant (210) to flow through the support assembly (100) to adjust the temperature of the building part (20).

[0157] B3. The method (300) according to paragraph B2, wherein the AM process includes one or more of a powder feeding process, a directed energy deposition (DED) process, a direct laser deposition (DLD) process, a direct metal deposition process, a large melt pool process and a powder bed process.

[0158] B4. The method (300) of any of paragraphs B2 to B3, wherein the step (334) of flowing the coolant (210) through the support assembly (100) is configured to maintain the temperature of the building component (20) below a predetermined maximum temperature.

[0159] B5. The method (300) of any of paragraphs B2 to B4, wherein the step (334) of flowing the coolant (210) through the support assembly (100) is configured to maintain the temperature of the building component (20) at least substantially at a predetermined set point temperature.

[0160] B6. The method (300) of any of paragraphs B2 to B5, wherein the step (334) of flowing the coolant (210) through the support assembly (100) includes flowing the coolant (210) through a closed coolant loop (160).

[0161] B7. The method (300) of paragraph B1, wherein the step (310) of detecting the manufacturing mode includes detecting that the manufacturing system (10) is in a milling mode, wherein the step (320) of forming the building part (20) includes: a step (324) of at least partially forming the building part (20) by a milling process, and wherein the step (330) of selectively supplying the coolant (210) includes: a step (336) of cooling the milling cutter (72) with the coolant (210).

[0162] B8. The method (300) of paragraph B2, wherein the building part (20) is a first building part (20), wherein the method (300) further comprises: a step (310) of detecting that the manufacturing system (10) is in a milling mode, wherein the forming step (320) comprises: a step (324) of at least partially forming a second building part (22) via a milling process, and wherein the step (330) of selectively supplying the coolant (210) comprises: a step (336) of cooling the milling cutter (72) with the coolant (210).

[0163] B9. The method (300) according to paragraph B8, wherein the step (322) of at least partially forming the first building part (20) using an AM process is performed before the step (324) of at least partially forming the second building part (22) using a milling process.

[0164] B10. The method (300) according to paragraph B8, wherein the step (322) of at least partially forming the first building part (20) using an AM process is performed after the step (324) of at least partially forming the second building part (22) using a milling process.

[0165] B11. The method (300) according to paragraph B8, wherein the step (322) of at least partially forming the first building part (20) using an AM process and the step (324) of at least partially forming the second building part (22) using a milling process are performed at least partially simultaneously.

[0166] B12. The method (300) of any one of paragraphs B7 to B11, wherein the step (336) of cooling the milling cutter (72) with the coolant (210) includes flowing the coolant (210) through the milling cutter (72).

[0167] B13. The method (300) of any of paragraphs B1 to B12, wherein the step (310) of detecting the manufacturing mode includes detecting the manufacturing mode using a coolant supply system controller (230).

[0168] B14. The method (300) of paragraph B13, wherein the step (310) of detecting a manufacturing mode includes receiving a manual input corresponding to an operating mode using the coolant supply system controller (230).

[0169] B15. The method (300) according to any one of paragraphs B13 to B14, wherein the step (310) of detecting the manufacturing mode includes generating and transmitting a manufacturing mode signal (272) corresponding to the manufacturing mode using a manufacturing mode sensor (270) and receiving the manufacturing mode signal (272) using the coolant supply system controller (230).

[0170] B16. The method (300) according to any one of paragraphs B1 to B15, wherein the step (330) of supplying the coolant (210) includes: a step (332) of actuating one or more coolant valves (222) to selectively direct the coolant (210) to one or more coolant channels (170) extending through the support assembly (100) or to a milling cutter coolant conduit (180) of the milling cutter (72).

[0171] B17. The method (300) according to any of paragraphs B1 to B16, further comprising:

[0172] Step (350), removing heat from the coolant (210).

[0173] B18. The method (300) of paragraph B17, wherein the step (350) of removing heat from the coolant (210) includes: a step (352) of flowing the coolant (210) through a heat exchanger (220).

[0174] B19. The method (300) according to paragraph B18, when subordinate to any of paragraphs B2 to B6, wherein the step (352) of causing the coolant (210) to flow through the heat exchanger (220) is performed after the step (334) of causing the coolant (210) to flow through the support assembly (100).

[0175] B20. The method (300) described in any of paragraphs B18 to B19, when subordinate to any of paragraphs B2 to B6, wherein the step (352) of causing the coolant (210) to flow through the heat exchanger (220) is performed before the step (334) of causing the coolant (210) to flow through the support assembly (100).

[0176] B21. The method (300) of any of paragraphs B17 to B20, wherein the step (350) of removing heat from the coolant (210) includes bringing the coolant (210) to a coolant temperature that is close to or below the ambient temperature surrounding the support assembly (100).

[0177] B22. The method (300) of any of paragraphs B17 to B21, when subordinate to any of paragraphs B2 to B6, wherein the step (350) of removing heat from the coolant (210) includes cooling the coolant (210) to a coolant temperature / the coolant temperature that is lower than the ambient temperature surrounding the support assembly (100) / the ambient temperature prior to the step (334) of flowing the coolant (210) through the support assembly (100).

[0178] B23. A method (300) according to any of paragraphs B17 to B22, wherein the step (350) of removing heat from the coolant (210) is at least partially based on one or more of a measured temperature of the building component (20), a measured temperature of the support assembly (100), and a measured temperature of the coolant (210).

[0179] B24. The method (300) of paragraph B23, wherein the step (350) of removing heat from the coolant (210) includes generating a control signal (232) based at least in part on one or more of a build component temperature signal (242), a support assembly temperature signal (252), a coolant temperature signal (262), and a milling cutter temperature signal (282).

[0180] B25. The method (300) of any one of paragraphs B17 to B24, wherein the step (350) of removing heat from the coolant (210) includes generating a control signal (232) / the control signal (232) according to a proportional-integral-derivative (PID) algorithm.

[0181] B26. The method (300) according to any one of paragraphs B1 to B25 further includes: a step (360) of recirculating the coolant (210) after the step (330) of selectively supplying the coolant (210).

[0182] B27. The method (300) according to paragraph B26, when subordinate to any of paragraphs B2 to B6 and subordinate to any of paragraphs B7 to B12, wherein the step (360) of recirculating the coolant (210) includes: step (334), after the step (336) of cooling the milling cutter (72) with the coolant (210), allowing the coolant (210) to flow through the support assembly (100).

[0183] B28. The method (300) of any of paragraphs B26 to B27, when subordinate to any of paragraphs B2 to B6, wherein the step (360) of recirculating the coolant (210) includes the step (336) of cooling the milling cutter (72) with the coolant (210) after the step (334) of flowing the coolant (210) through the support assembly (100).

[0184] B29. The method (300) according to any one of paragraphs B26 to B28, wherein the step (360) of recirculating the coolant (210) includes collecting the coolant (210) in a coolant reservoir (226) after the step (330) of selectively supplying the coolant (210).

[0185] B30. The method (300) according to any one of paragraphs B1 to B29, wherein the step (330) of selectively supplying the coolant (210) includes: a step (338) of selectively adjusting the flow rate of the coolant (210).

[0186] B31. The method (300) according to paragraph B30, wherein the step (338) of selectively adjusting the flow rate includes: a step (340) of selectively pumping the coolant (210) with a coolant pump (224).

[0187] B32. The method (300) of any of paragraphs B30 to B31, wherein the step (338) of selectively adjusting the flow rate includes the step (332) of actuating one or more coolant valves (222) to selectively control the flow of the coolant (210).

[0188] B33. A method (300) according to any of paragraphs B30 to B32, wherein the step (338) of selectively adjusting the flow rate is at least partially based on one or more of a measured temperature of the building component (20), a measured temperature of the support assembly (100), and a measured temperature of the coolant (210).

[0189] B34. A method (300) according to paragraph B33, wherein the step (338) of selectively adjusting the flow rate includes generating a control signal (232) / the control signal (232) based at least in part on one or more of a build component temperature signal (242) / the build component temperature signal (242), a support assembly temperature signal (252) / the support assembly temperature signal (252), a coolant temperature signal (262) / the coolant temperature signal (262) and a milling cutter temperature signal (282) / the milling cutter temperature signal (282).

[0190] B35. The method (300) according to any one of paragraphs B30 to B34, wherein the step (338) of selectively adjusting the flow rate includes generating a control signal (232) / the control signal (232) according to a proportional-integral-derivative (PID) algorithm.

[0191] B36. A method (300) according to any one of paragraphs B1 to B35, using a manufacturing system (10) as described in any one of paragraphs A1 to A78.

[0192] As used herein, the phrase "at least substantially" when modifying a degree or relationship includes not only the "substantially" degree or relationship described, but also the full range of the degree or relationship described. The majority of the degree or relationship described may include at least 75% of the degree or relationship described. For example, a first direction at least substantially parallel to a second direction includes a first direction within an angular deviation of 22.5° relative to the second direction and also includes a first direction that is the same as the second direction.

[0193] As used herein, the terms "selective" and "selectively" when modifying the action, motion, configuration or other behavior of one or more components or features of a device, mean that the particular action, motion, configuration or other behavior is the direct or indirect result of a user operating on that aspect of the device or one or more components.

[0194] As used herein, the terms "adaptation" and "construction" mean that an element, component or other subject is designed and / or intended to perform a given function. Therefore, the use of the terms "adaptation" and "construction" should not be interpreted as meaning that a given element, component or other subject is only "capable" of performing a given function, but rather specifically selects, creates, implements, utilizes, programs and / or designs the element, component and / or other subject for the purpose of performing the function. It is also within the scope of the present disclosure that elements, components and / or other stated subjects stated as being suitable for performing a specific function may be additionally or alternatively described as being configured to perform the function, and vice versa. Similarly, a subject stated as being configured to perform a specific function may be additionally or alternatively described as being operated to perform the function.

[0195] As used herein, the term "and / or" placed between a first entity and a second entity means one of the following: (1) the first entity; (2) the second entity; and (3) the first entity and the second entity. Multiple entities listed with "and / or" should be interpreted in the same manner, that is, "one or more" entities are so connected. There may be entities other than the entities explicitly identified by the "and / or" clause, whether related or unrelated to those specifically identified entities. Thus, as a non-limiting example, when used in conjunction with open language (such as "including"), a reference to "A and / or B" may refer to only A (optionally including entities that are not B) in one example; to only B (optionally including entities that are not A) in another example; and to both A and B (optionally including other entities) in yet another example. These entities may refer to elements, actions, structures, steps, operations, values, etc.

[0196] As used herein, the phrase "at least one" referring to a list of one or more entities should be understood to mean at least one entity selected from any one or more entities in the list of entities, but does not necessarily include at least one entity and every entity specifically listed in the list of entities, and does not exclude any combination of entities in the list of entities. This definition also allows for the optional presence of entities in addition to the entities specifically identified within the list of entities to which the phrase "at least one" refers, whether related or unrelated to those specifically identified entities. Thus, as a non-limiting example, "at least one of A and B" (or equivalently, "at least one of A or B", or equivalently, "at least one of A and / or B") may refer to at least one (optionally including more than one) A without B (and optionally including entities that are not B) in one embodiment; to at least one (optionally including more than one) B without A (and optionally including entities that are not A) in another example; to at least one (optionally including more than one) B without A (and optionally including entities that are not A) in yet another example, to at least one (optionally including more than one) A and at least one (optionally including more than one) B (and optionally including other entities). In other words, the phrases "at least one", "one or more", and "and / or" are open-ended expressions that are both conjunctions and transitions in operation. For example, each of the expressions "at least one of A, B, and C", "at least one of A, B, or C", "one or more of A, B, and C", "one or more of A, B, or C", and "A, B, and / or C" may mean A alone, B alone, C alone, A and B together, A and C together, B and C together, A, B, and C together, and optionally any of the foregoing in combination with at least one other entity.

[0197] As used herein, the phrase "for example", the phrase "as an example", and / or the term "example" alone, when referring to one or more components, features, details, structures, embodiments, and / or methods according to the present disclosure, is intended to convey that the described components, features, details, structures, embodiments, and / or methods are exemplary, non-exclusive examples of components, features, details, structures, embodiments, and / or methods according to the present disclosure. Therefore, the described components, features, details, structures, embodiments, and / or methods are not intended to be limiting, requiring, or exclusive / exhaustive; and other components, features, details, structures, embodiments, and / or methods that are similar and / or equivalent in structure and / or function also fall within the scope of the present disclosure.

[0198] In the present disclosure, several illustrative, non-exclusive examples have been discussed and / or presented in the context of a flow chart or a flow chart, in which a method is shown and described as a series of boxes or steps. Unless specifically set forth in the attached description, it is within the scope of the present disclosure that the order of the boxes may be different from the order shown in the flow chart, including two or more boxes (or steps) appearing simultaneously and / or repeatedly in different orders. It is also within the scope of the present disclosure that the boxes or steps may be implemented as logic, which may also be described as implementing the boxes or steps as logic. In some applications, the boxes or steps may represent expressions and / or actions to be performed by functionally equivalent circuits or other logic devices. The boxes shown may, but need not, represent executable instructions that cause a computer, a processor, and / or other logic device to respond, perform actions, change states, generate outputs or displays, and / or make decisions.

[0199] According to all devices, systems and methods disclosed herein, not all require the various disclosed elements of the devices and systems disclosed herein and the steps of the methods, and the disclosure includes all novel and non-obvious combinations and sub-combinations of the various elements and steps disclosed herein. In addition, one or more of the various elements and steps disclosed herein may define the subject matter of the invention that is different and independent from all of the disclosed devices, systems or methods. Therefore, such subject matter of the invention does not require to be associated with the specific devices, systems and methods clearly disclosed herein, and such subject matter of the invention may find practicality in devices, systems and / or methods not clearly disclosed herein.

Claims

1. A manufacturing system (10), the manufacturing system (10) comprising: an additive manufacturing assembly (50) configured to at least partially form a first build component (20) via an additive manufacturing process; a milling assembly (70) configured to at least partially form the second building component (22) via a milling process; as well as a coolant supply system (200) configured to selectively supply a coolant (210) to each of the additive manufacturing assembly (50) and the milling assembly (70); wherein the additive manufacturing assembly (50) includes a support assembly (100) that supports the first building part (20) and is in thermal communication with the first building part (20) when the first building part (20) is manufactured, and wherein the coolant supply system (200) is configured to remove heat from the support assembly (100) when the first building part (20) is manufactured by flowing the coolant (210) through at least a portion of the support assembly (100) to regulate the temperature of the first building part (20) when the first building part (20) is manufactured, wherein the milling assembly (70) comprises a milling cutter (72) configured to at least partially form the second building component (22), Wherein, the coolant supply system (200) further comprises: a coolant supply system controller (230) configured to generate and transmit a control signal (232) to at least partially control the flow of the coolant (210) through the coolant supply system (200); one or more coolant valves (222) configured to selectively restrict the flow of the coolant (210) through at least a portion of the coolant supply system (200); a milling cutter coolant conduit (180) configured to supply the coolant (210) to the milling cutter (72) to cool the milling cutter (72); and one or more coolant passages (170) configured to receive the coolant and extending through the support assembly (100), wherein the coolant supply system controller (230) is configured to actuate at least one of the one or more coolant valves (222) to selectively direct the coolant (210), and wherein at least one of the one or more coolant valves is configured to selectively direct the coolant to the milling cutter coolant conduit or the one or more coolant channels.

2. The manufacturing system (10) according to claim 1, wherein: The manufacturing system (10) is configured to operate in one of an additive manufacturing mode and a milling manufacturing mode, wherein the additive manufacturing assembly (50) is operated to at least partially form the first build part (20) and the milling manufacturing mode is operated to at least partially form the second build part (22), and wherein the coolant supply system controller (230) is configured to selectively direct the coolant (210) to one of the additive manufacturing assembly (50) and the milling assembly (70) based at least in part on the manufacturing mode of the manufacturing system (10).

3. The manufacturing system (10) according to claim 1, wherein: The coolant supply system controller (230) is configured such that, when the manufacturing system (10) is in an additive manufacturing mode, the coolant supply system controller (230) actuates at least one of the one or more coolant valves (222) to direct the coolant (210) toward the support assembly (100) to regulate the temperature of the first build part (20).

4. The manufacturing system (10) according to claim 1, wherein: The coolant supply system controller (230) is configured such that, when the manufacturing system (10) is in a milling manufacturing mode, the coolant supply system controller (230) actuates at least one of the one or more coolant valves (222) to direct the coolant (210) to the milling cutter coolant conduit (180) to adjust the temperature of the milling cutter (72).

5. The manufacturing system (10) of claim 2, further comprising a manufacturing mode sensor (270), the manufacturing mode sensor (270) being configured to automatically detect a manufacturing mode of the manufacturing system (10) and generate a manufacturing mode signal (272) indicating the manufacturing mode and transmit the manufacturing mode signal (272) to the coolant supply system controller (230).

6. The manufacturing system (10) according to claim 2, wherein: The coolant supply system (200) further includes a build part temperature sensor (240) configured to measure a temperature of the first build part (20) when manufacturing the first build part (20), wherein the build part temperature sensor (240) is configured to transmit a build part temperature signal (242) representing the temperature of the first build part (20) to the coolant supply system controller (230), and wherein the coolant supply system controller (230) is configured to transmit the control signal (232) at least partially in response to the build part temperature signal (242).

7. The manufacturing system (10) according to claim 1, wherein: The support assembly (100) comprises a base plate (120) and an anvil (110) supporting the base plate (120), wherein the base plate (120) is configured to support the first building component (20) when manufacturing the first building component (20), so that the first building component (20) is in thermal communication with at least a portion of the support assembly (100).

8. The manufacturing system (10) according to claim 1, wherein: The coolant (210) is configured to flow through the one or more coolant channels (170) to remove heat from the support assembly (100), wherein the one or more coolant channels (170) are at least partially defined by each of the upper baseboard member (122) and the lower baseboard member (126).

9. A method (300) of operating a manufacturing system (10) as claimed in any one of claims 1 to 8 during a manufacturing process, the method (300) comprising: Step (310), detecting a manufacturing mode of the manufacturing system (10); Step (320), forming a building component through a manufacturing process; as well as Step (330), at least partially concurrently with said step (320) of forming said build component, selectively supplying a coolant (210) to one or more of: (i) a support assembly (100) supporting the building component and being in thermal communication with the building component; and (ii) a milling cutter (72) for at least partially forming the building component during a milling process; wherein the step (330) of selectively supplying the coolant (210) is based at least in part on the step (310) of detecting a manufacturing mode.

10. The method (300) according to claim 9, wherein: The step (310) of detecting a manufacturing mode comprises: a step (310) of detecting that the manufacturing system (10) is in an additive manufacturing mode, wherein the step (320) of forming the build part comprises: a step (322) of at least partially forming the build part via an additive manufacturing process, and wherein the step (330) of selectively supplying the coolant (210) comprises: a step (334) of flowing the coolant (210) through the support assembly (100) to adjust the temperature of the build part.

11. The method (300) according to claim 9, wherein: The building part is a first building part (20), wherein the method (300) further includes: a step (310) of detecting that the manufacturing system (10) is in a milling mode, wherein the step (320) of forming includes: a step (324) of at least partially forming a second building part (22) via a milling process, and wherein the step (330) of selectively supplying the coolant (210) includes: a step (336) of cooling the milling cutter (72) with the coolant (210).

12. The method (300) of claim 9, wherein: The step (330) of supplying the coolant (210) includes a step (332) of selectively actuating one or more coolant valves (222) to selectively direct the coolant (210) to one or more coolant passages (170) extending through the support assembly (100) or to a milling cutter coolant conduit (180) of the milling cutter (72).

13. The method (300) of claim 9, wherein: The step (330) of selectively supplying the coolant (210) is configured to include one or more of the following: (i) maintaining the temperature of the building component below a predetermined maximum temperature; as well as (ii) maintaining the temperature of the build component at least substantially at a predetermined set point temperature.

14. The method (300) of claim 9, further comprising: Step (350), removing heat from the coolant (210); as well as Step (360), recirculating the coolant (210) through the coolant supply system (200).

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