A camera

Abstract

The present invention provides a camera, comprising: a main housing, a heat dissipation air duct is arranged inside the main housing, an air inlet hole and an air outlet hole which are both communicated with the heat dissipation air duct are arranged on the outer wall of the main housing; a heat dissipation fan, arranged on the main housing, and used for generating an air flow flowing from the air inlet hole to the air outlet hole in the heat dissipation air duct; at least one first circuit board, arranged in the heat dissipation air duct, and the air flow generated by the heat dissipation fan can pass through the first circuit board; an imaging device, arranged on the main housing. In the present invention, the heat dissipation fan can generate an air flow so as to quickly take away the heat generated when the first circuit board works, effectively improve the heat dissipation efficiency, reduce the influence on the imaging device, avoid the camera temperature from being too high and affecting the performance of the imaging device, effectively extend the service life of the present camera, and ensure the use performance of the present camera.

Description

Technical Field

[0001] The present invention belongs to the field of camera equipment, and more specifically, relates to a camera. Background Art

[0002] At present, cameras, especially thermal imaging cameras, etc., have incorporated more and more various intelligent algorithm modules, greatly increasing the number and power consumption of circuit boards, and correspondingly generating much more heat. On the other hand, the volume of cameras is getting smaller and smaller according to market needs, with the surface area and internal space both becoming smaller and smaller. As a result, it has become increasingly difficult for cameras to dissipate heat. When the temperature of the camera is too high, it will affect the performance and lifespan of imaging modules and temperature measurement modules, etc. in the camera module. Existing cameras usually directly conduct the heat of the circuit board to the metal shell through heat conduction, and then radiate the heat to the outside air through the shell. This heat dissipation method has low efficiency and is increasingly difficult to meet the heat dissipation requirements of cameras. Summary of the Invention

[0003] An object of the present invention is to solve at least one of the technical problems existing in the prior art, and provide a camera that can improve the heat dissipation efficiency, ensure the imaging performance, and extend the service life.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] A camera is provided, including:

[0006] A main housing, in which a heat dissipation air duct is provided, and an air inlet hole and an air outlet hole that are both communicated with the heat dissipation air duct are provided on the outer wall of the main housing;

[0007] A heat dissipation fan, arranged on the main housing, for generating an air flow flowing from the air inlet hole to the air outlet hole in the heat dissipation air duct;

[0008] An imaging device, arranged on the main housing;

[0009] At least one first circuit board, arranged in the heat dissipation air duct, and the air flow generated by the heat dissipation fan can pass through the first circuit board.

[0010] Preferably, the number of the first circuit boards is two or more, including at least one front circuit board and at least one rear circuit board; the heat dissipation air duct is divided into a front cavity and a rear cavity, the front circuit board is located in the front cavity, and the rear circuit board is located in the rear cavity; one of the front cavity and the rear cavity is communicated with the air inlet hole, the other is communicated with the air outlet hole, the front cavity and the rear cavity are communicated through a ventilation hole, and the heat dissipation fan is located between the front cavity and the rear cavity and is aligned with the ventilation hole.

[0011] Preferably, the front circuit board is closely attached to the inner wall of the front cavity or is used to enclose the front cavity and serve as the inner wall of the front cavity.

[0012] Preferably, a fan bracket is provided inside the main housing. The fan bracket divides the heat dissipation air duct into the front cavity and the rear cavity. The heat dissipation fan and the ventilation holes are provided on the fan bracket. The rear cavity is enclosed by the fan bracket, the rear circuit board and the inner wall of the main housing together or is enclosed by the fan bracket and the rear circuit board.

[0013] Preferably, the fan bracket is vertical. The front cavity and the rear cavity are respectively located in front of and behind the fan bracket. The front circuit board is vertically arranged at the front end of the front cavity. The number of the rear circuit boards is one or two and they are horizontally arranged at the rear end of the fan bracket.

[0014] Preferably, the imaging device is located in front of the front cavity. The air inlet holes are provided on the side wall of the front cavity. The air outlet holes are provided on the side wall and / or the rear wall of the rear cavity.

[0015] Preferably, at least one horizontal second circuit board is further provided inside the main housing. The second circuit board is located outside the rear circuit board and can conduct heat to the rear circuit board by means of heat conduction. And the heat generated when the second circuit board works is greater than the heat generated when the rear circuit board works.

[0016] Preferably, at least one side wall of the main housing is a heat-conductive side wall. The rear circuit board and the second circuit board are both connected to the heat-conductive side wall and can conduct heat through the heat-conductive side wall. The air outlet holes are provided on the heat-conductive side wall.

[0017] Preferably, the imaging device is separated from the main housing by a heat-insulating member.

[0018] Preferably, the imaging device includes an imaging module and a temperature measurement module.

[0019] The beneficial effects of the camera provided by the present invention are as follows: Since a heat dissipation air duct is provided inside the main housing of this camera and the first circuit board is arranged inside the heat dissipation air duct, the heat dissipation fan can generate an air flow to quickly take away the heat generated when the first circuit board works, which can effectively improve the heat dissipation efficiency, reduce the influence on the imaging device, avoid the performance of the camera being affected due to excessive temperature of the camera, can effectively extend the service life of this camera, and ensure the use performance of this camera. Description of the Drawings

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 It is the overall structure diagram of the preferred embodiment of the present invention;

[0022] Figure 2 It is the internal structure after the main housing of the preferred embodiment of the present invention is cut in half;

[0023] Figure 3 It is the sectional structure diagram of the preferred embodiment of the present invention;

[0024] Figure 4 It is the exploded structure diagram of the preferred embodiment of the present invention.

[0025] Among them, the reference numerals in the figure:

[0026] 10 - main housing; 11 - air inlet hole; 12 - air outlet hole; 13 - fan bracket; 14 - ventilation hole; 151 - power connector; 152 - network connector; 153 - signal line connector; 20 - cooling fan; 30 - imaging device; 41 - front circuit board; 42 - rear circuit board; 51 - front cavity; 52 - rear cavity; 60 - second circuit board; 70 - heat insulation member. Specific embodiments

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0028] Refer to Figures 1 to 4, a preferred embodiment of the present invention, a camera, comprising: a main housing 10, a cooling fan 20, an imaging device 30 and three first circuit boards. A cooling air duct is provided inside the main housing 10. An air inlet hole 11 and an air outlet hole 12, both of which are communicated with the cooling air duct, are provided on the outer wall of the main housing 10. The cooling fan 20 is arranged on the main housing 10 and is used to generate an air flow flowing from the air inlet hole 11 to the air outlet hole 12 in the cooling air duct; the first circuit board is arranged in the cooling air duct, and the air flow generated by the cooling fan 20 can pass through the first circuit board; the imaging device 30 is arranged on the main housing 10. Since the cooling air duct is provided inside the main housing 10 of this camera, the first circuit board is arranged in the cooling air duct, and the cooling fan 20 can generate an air flow to quickly take away the heat generated when the first circuit board works, which can effectively improve the heat dissipation efficiency, reduce the influence on the imaging device 30, avoid the performance of the imaging device 30 being affected due to the overheating of the camera, can effectively extend the service life of this camera, and ensure the use performance of this camera.

[0029] The imaging device 30 is used to receive external optical signals. It can be equipped with corresponding sensors to convert the received optical signals into electrical signals for corresponding circuit boards to process, or directly transmit the optical signals to the circuit board for the circuit board to process. Its structure and principle are well known to those skilled in the art and will not be described in detail herein.

[0030] In other embodiments, the number of the first circuit boards can also be selected as one, two, four or any other arbitrary number according to needs, and is not limited thereto.

[0031] As a preferred embodiment of the present invention, it may also have the following additional technical features:

[0032] In this embodiment, the three first circuit boards are a front circuit board 41 and two rear circuit boards 42 respectively; the heat dissipation air duct is divided into a front cavity 51 and a rear cavity 52, the front circuit board 41 is located in the front cavity 51, and the rear circuit board 42 is located in the rear cavity 52; the front cavity 51 is communicated with the air inlet hole 11, the rear cavity 52 is communicated with the air outlet hole 12, the front cavity 51 and the rear cavity 52 are communicated through a ventilation hole 14, and the heat dissipation fan 20 is located between the front cavity 51 and the rear cavity 52 and aligned with the ventilation hole 14, so that the incoming air flow and the outgoing air flow can be separated, the interference between the incoming air flow and the outgoing air flow can be avoided, the air flow intensity in the front cavity 51 and the rear cavity 52 can be ensured, and the three first circuit boards can be dispersed, and the incoming air flow and the outgoing air flow can be fully utilized to take away the heat generated when the front circuit board 41 and the rear circuit board 42 work respectively, and the heat dissipation efficiency can be effectively improved. In other embodiments, the numbers of the front circuit board 41 and the rear circuit board 42 can be flexibly adjusted according to needs. For example, two front circuit boards 41 are arranged in the front cavity 51, and one or three rear circuit boards 42 are arranged in the rear cavity 52, etc. Those skilled in the art can flexibly adjust according to needs. In other embodiments, the heat dissipation air duct may not be divided, and the heat dissipation fan 20 may be directly arranged at the air inlet hole 11 or the air outlet hole 12 or other positions of the main housing 10, and it is not limited thereto.

[0033] In this embodiment, the front circuit board 41 is used to enclose the front cavity 51 as the inner wall of the front cavity 51, which helps to simplify the structure of this camera, can reduce the product cost, is also convenient for processing and manufacturing, and can also avoid the front cavity 51 dividing the front cavity 51 into several spaces, resulting in eddy currents in the air flow generated by the heat dissipation fan 20 in the front cavity 51 and then affecting the heat dissipation efficiency, and can control the air flow in a predetermined direction, which helps to improve the heat dissipation efficiency. In other embodiments, a plate can also be separately arranged in the main housing 10 as the inner wall of the front cavity 51 and the front circuit board 41 is closely attached to the inner wall of the front cavity 51, which can also effectively reduce the generation of eddy currents and ensure the heat dissipation efficiency. Of course, the front circuit board 41 can also be arranged at other positions such as the center of the front cavity 51. Those skilled in the art can flexibly select the installation position of the front circuit board 41 according to needs.

[0034] In this embodiment, a fan bracket 13 is disposed in the inner cavity of the main housing 10. The fan bracket 13 divides the heat dissipation air duct into a front cavity 51 and a rear cavity 52. The heat dissipation fan 20 and the ventilation holes 14 are disposed on the fan bracket 13, facilitating the installation of the heat dissipation fan 20. The rear cavity 52 is formed by the fan bracket 13, the rear circuit board 42, and the inner wall of the main housing 10 together. In this way, it is also possible to avoid further partitioning of the rear cavity 52, effectively reducing the generation of eddy currents, contributing to improving the heat dissipation efficiency, and also helping to simplify the structure of the main housing 10, reducing the product cost, and facilitating processing and manufacturing. In this embodiment, the two rear circuit boards 42 are parallel to each other and together with the fan bracket 13 and the left inner wall, right inner wall, and rear inner wall of the main housing 10 form the rear cavity 52. In other embodiments, the structure of the rear cavity 52 can be flexibly adjusted according to needs. For example, when the number of rear circuit boards 42 is one, the rear cavity 52 can be formed by the fan bracket 13, the rear circuit board 42, and the left inner wall, right inner wall, rear inner wall, and lower inner wall of the main housing 10. When the number of rear circuit boards 42 is three, the rear cavity 52 can be formed by the fan bracket 13, the rear circuit boards 42, and the right inner wall and rear inner wall of the main housing 10, and so on. Those skilled in the art can flexibly adjust according to needs, or a plate member can also be disposed in the main housing 10 to form the rear cavity 52 and the rear circuit board 42 can be disposed in the rear cavity 52. In addition, in other embodiments, the heat dissipation fan 20 may not be installed using the fan bracket 13. For example, the heat dissipation fan 20 can be directly installed on the main housing 10, with the left and right side walls of the heat dissipation fan 20 closely attached to the inner wall of the main housing 10, and the upper and lower walls of the heat dissipation fan 20 closely attached to or close to the two rear circuit boards 42, thereby directly using the heat dissipation fan 20 to divide the heat dissipation air duct into the front cavity 51 and the rear cavity 52. In other embodiments, a partition can also be additionally disposed in the main housing 10 or the front circuit board 41 or the rear circuit board 42, etc. can be directly used to divide the heat dissipation air duct into the front cavity 51 and the rear cavity 52, and it is not limited thereto.

[0035] In this embodiment, the fan bracket 13 is vertical. The front cavity 51 and the rear cavity 52 are respectively located in front of and behind the fan bracket 13. The front circuit board 41 is vertically disposed at the front end of the front cavity 51, and the two rear circuit boards 42 are horizontally disposed at the rear end of the fan bracket 13. Such an arrangement can make the internal structure of this camera more compact, facilitating the dispersive arrangement of each first circuit board in the commonly used rectangular parallelepiped main housing 10, contributing to reducing the volume of this camera, and at the same time facilitating positioning, processing, and assembly. In other embodiments, the positions and angles of the fan bracket 13, the front circuit board 41, and the rear circuit board 42 can be flexibly adjusted according to needs, such as being inclined, etc., and it is not limited thereto.

[0036] In this embodiment, the imaging device 30 is located in front of the front cavity 51. The air inlet holes 11 are provided on the side wall of the front cavity 51, and the air outlet holes 12 are provided on the side wall of the rear cavity 52. In this way, it can be avoided that the hot air discharged from the air outlet holes 12 flows to the imaging device 30, resulting in an increase in the temperature of the imaging device 30, which helps to ensure the working performance of the imaging device 30 and extend the service life of the imaging device 30. In this embodiment, air inlet holes 11 are provided on both the upper wall and the lower wall of the front cavity 51, and air outlet holes 12 are provided on both the left wall and the right wall of the rear cavity 52. On the one hand, it can increase the air intake and air outlet volume. On the other hand, staggering the directions of the air inlet holes 11 and the air outlet holes 12 can prevent the hot air discharged from the air outlet holes 12 from being sucked in by the air inlet holes 11 and affecting heat dissipation, which helps to improve the heat dissipation efficiency. In this embodiment, on the rear wall of the main housing 10, there are provided connector structures such as a power supply connector 151, a network connector 152, and a signal line connector 153, which meet the general installation and use requirements and facilitate wiring. In other embodiments, these connector structures can also be provided on the side of the main housing 10. Correspondingly, the air outlet holes 12 can be provided at the rear end of the rear cavity 52, or air outlet holes 12 can be provided on both the side wall and the rear end of the rear cavity 52. Similarly, when the imaging device 30 is provided on the side of the main housing 10, the air inlet holes 11 can also be provided at the front end of the front cavity 51 and other positions, and the positions of the air inlet holes 11 and the air outlet holes 12 can also be interchanged, etc. Those skilled in the art can flexibly adjust according to needs and are not limited thereto.

[0037] In this embodiment, two horizontal second circuit boards 60 are further provided in the inner cavity of the main housing 10. The two second circuit boards 60 are respectively located outside the two rear circuit boards 42 and can conduct heat to the rear circuit boards 42 through heat conduction. Moreover, the heat generation amount of the second circuit boards 60 during operation is greater than that of the rear circuit boards 42 during operation. With such a layout, it can increase the number of circuit boards that the main housing 10 of this camera can accommodate, have a wider application range, and the structure is more compact, which helps to reduce the volume of this camera. At the same time, it can control the direction of heat conduction between the first circuit board and the rear circuit boards 42, and utilize the airflow in the heat dissipation air duct to improve the heat dissipation efficiency of the second circuit boards 60, thereby improving the overall heat dissipation efficiency of this camera. In other embodiments, the number and position of the second circuit boards 60 can be flexibly adjusted according to needs and are not limited thereto.

[0038] The first circuit board and the second circuit boards 60 can be connected to each other or connected to the imaging device 30, and their connection relationship can be adjusted accordingly according to their functions. These connection methods are well-known to those skilled in the art and will not be described in detail here.

[0039] In this embodiment, the left and right side walls of the main housing 10 are heat-conductive side walls that can conduct heat. The rear circuit board 42 and the second circuit board 60 are both connected to the heat-conductive side walls and can conduct heat through the heat-conductive side walls, eliminating the need to additionally provide a heat-conductive structure, which helps simplify the structure of this camera. At the same time, part of the heat can be dissipated to the outside through the heat-conductive side walls, improving the heat dissipation efficiency. Air outlet holes 12 are provided on the heat-conductive side walls, enabling the air flow to carry away the heat absorbed by the heat-conductive side walls simultaneously, further improving the heat dissipation efficiency. In this embodiment, both ends of the rear circuit board 42 and the second circuit board 60 are respectively close to the left and right inner walls of the main housing 10. At the same time, heat-conductive silica gel is filled between the rear circuit board 42 and the left and right inner walls of the main housing 10, and between the second circuit board 60 and the left and right inner walls of the main housing 10, facilitating the installation of the rear circuit board 42 and the second circuit board 60. At the same time, it can also improve the heat conduction efficiency between the rear circuit board 42 and the second circuit board 60 and the heat-conductive side walls, as well as the outer surface area of the heat-conductive side walls, effectively improving the heat dissipation efficiency. In this embodiment, the two heat-conductive side walls of the main housing 10 are made of common metal materials, which can provide excellent heat conduction performance. In addition, in this embodiment, the upper and lower walls of the main housing 10 are also made of metal materials and are connected to the left and right side walls of the main housing 10, enabling the upper and lower walls of the main housing 10 to also dissipate heat to the outside, further improving the heat dissipation efficiency. In other embodiments, only one heat-conductive side wall may be provided on the main housing 10, or the rear circuit board 42 and the second circuit board 60 may also be directly in contact or connected by using heat-conductive components, etc., so that the heat generated when the second circuit board 60 works can be conducted to the rear circuit board 42. The heat-conductive side wall can also be made of other heat-conductive materials, and the rear circuit board 42 and the second circuit board 60 can also be connected to the heat-conductive side wall by direct contact, etc., to achieve heat conduction, etc. Those skilled in the art can adjust flexibly according to needs.

[0040] The imaging device 30 is separated from the main housing 10 by a heat-insulating member 70, which can effectively prevent the heat of each circuit board in the main housing 10 from being conducted to the imaging device 30, effectively reducing the temperature of the imaging device 30 and ensuring the service performance and service life of the imaging device 30. In this embodiment, the heat-insulating member 70 is made of a plastic spacer. In other embodiments, the heat-insulating member 70 can also be made of other common heat-insulating materials such as wood and rubber, as well as other suitable shapes, and is not limited thereto.

[0041] In this embodiment, the imaging device 30 includes an imaging module and a temperature measurement module. The working performance of the temperature measurement module is greatly affected by temperature. Since this camera can provide excellent heat dissipation performance, it can meet the working requirements of the temperature measurement module. Of course, in other embodiments, the imaging device 30 may also only include a forming module or may also include other common imaging structures, and is not limited thereto.

[0042] On the premise of no conflict, those skilled in the art can freely combine and superimpose the above additional technical features.

[0043] It should be noted that the orientations such as front, back, left, right, up, down, horizontal, and vertical in the present invention are only for facilitating the description of the relative positions of various components, and should not be construed as a limitation on the present invention. In actual use, with the change of the installation angle and orientation of the present camera, the orientations of various components will change accordingly.

[0044] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A camera, characterized in that, Comprising: A main housing, within which a heat dissipation air duct is provided. An air inlet hole and an air outlet hole, both communicating with the heat dissipation air duct, are provided on the outer wall of the main housing. A heat dissipation fan, provided on the main housing, for generating an air flow flowing from the air inlet hole to the air outlet hole within the heat dissipation air duct. An imaging device, provided on the main housing. At least one first circuit board, provided within the heat dissipation air duct, and the air flow generated by the heat dissipation fan can pass through the first circuit board. The number of the first circuit boards is two or more, including at least one front circuit board and at least one rear circuit board; the heat dissipation air duct is divided into a front cavity and a rear cavity. The front circuit board is located within the front cavity, and the rear circuit board is located within the rear cavity; one of the front cavity and the rear cavity communicates with the air inlet hole, and the other communicates with the air outlet hole. The front cavity and the rear cavity are communicated through a ventilation hole. The heat dissipation fan is located between the front cavity and the rear cavity and is aligned with the ventilation hole. The directions of the air inlet hole and the air outlet hole are offset.

2. The camera according to claim 1, characterized in that, The front circuit board is closely attached to the inner wall of the front cavity or is used to enclose the front cavity and serve as the inner wall of the front cavity.

3. A camera according to claim 1, characterized in that, A fan bracket is provided within the main housing. The fan bracket divides the heat dissipation air duct into the front cavity and the rear cavity. The heat dissipation fan and the ventilation hole are provided on the fan bracket; the rear cavity is enclosed by the fan bracket, the rear circuit board, and the inner wall of the main housing together or is enclosed by the fan bracket and the rear circuit board.

4. The camera according to claim 3, characterized in that, The fan bracket is vertical. The front cavity and the rear cavity are respectively located in front of and behind the fan bracket. The front circuit board is vertically provided at the front end of the front cavity, and the number of the rear circuit boards is one or two and is horizontally provided at the rear end of the fan bracket.

5. A camera according to claim 4, characterized in that, The imaging device is located in front of the front cavity. The air inlet hole is provided on the side wall of the front cavity, and the air outlet hole is provided on the side wall and / or the rear wall of the rear cavity.

6. A camera according to claim 4, characterized in that, At least one horizontal second circuit board is further provided within the main housing. The second circuit board is located outside the rear circuit board and can conduct heat to the rear circuit board through heat conduction, and the heat generation amount of the second circuit board during operation is greater than that of the rear circuit board during operation.

7. A camera according to claim 6, wherein At least one side wall of the main housing is a heat-conductive side wall. The rear circuit board and the second circuit board are both connected to the heat-conductive side wall and can conduct heat through the heat-conductive side wall; the air outlet hole is provided on the heat-conductive side wall.

8. A camera according to any one of claims 1 to 7, characterized in that, The imaging device is separated from the main housing by a heat insulation member.

9. A camera according to any one of claims 1 to 7, characterized in that, The imaging device includes an imaging module and a temperature measurement module.

Images