Display device and method of manufacturing the same

Abstract

Disclosed are a display apparatus and a method of manufacturing the display apparatus, the display apparatus including: a substrate including a display area, an opening area formed in the display area, and a non-display area surrounding at least a portion of the opening area; a pixel definition layer formed on the substrate and including at least one opening; an intermediate layer disposed in the at least one opening; a counter electrode covering the intermediate layer and the pixel definition layer; and a cover layer covering the counter electrode. An end portion of at least one of the intermediate layer, the counter electrode, and the cover layer is formed on the pixel definition layer and has a thickness that decreases away from the at least one opening.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0055167, filed on May 10, 2019, and Korean Patent Application No. 10-2020-0015835, filed on February 10, 2020, in the Korean Intellectual Property Office, the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0002] One or more embodiments relate to a device and a method, and more particularly, to a display device and a method of manufacturing the display device. BACKGROUND

[0003] Recently, display devices have been used for various purposes. In addition, display devices tend to be more widely used due to their reduced thickness and lighter weight.

[0004] As the area of a display area in a display device increases, more and more functions are added to or linked to the display device. SUMMARY

[0005] One or more embodiments include a display device and a method of manufacturing the display device, the display device including a display panel having a display area in which various components can be disposed.

[0006] According to one or more embodiments, a display device includes a substrate including a display area, an opening area located in the display area, and a non-display area surrounding at least a portion of the opening area; a pixel definition layer located on the substrate and including at least one opening; an intermediate layer disposed in the at least one opening; a counter electrode covering the intermediate layer and the pixel definition layer; a cover layer covering the counter electrode, wherein an end portion of at least one of the intermediate layer, the counter electrode, and the cover layer is disposed on the pixel definition layer and has a thickness that decreases away from the at least one opening.

[0007] In the present embodiment, the intermediate layer includes at least one of a first functional layer and a second functional layer.

[0008] In the present embodiment, the intermediate layer, the counter electrode, and the cover layer are sequentially stacked on the pixel definition layer.

[0009] In the present embodiment, the display device further includes an encapsulation substrate disposed on and spaced apart above the substrate.

[0010] In the present embodiment, the display device further includes a thin film encapsulation layer disposed on the cover layer.

[0011] In the present embodiment, a through-hole is formed in the opening area.

[0012] According to one or more embodiments, a method of manufacturing a display apparatus includes forming a pixel-defining layer on a substrate, wherein the substrate includes an opening area and a non-display area at least partially surrounding the opening area; forming a shield unit covering a portion of the pixel-defining layer, the opening area, and the non-display area; and forming an intermediate layer, a counter electrode, and a cover layer on the pixel-defining layer and the shield unit.

[0013] In this embodiment, the shield unit includes a first shield unit shielding the opening area, and a second shield unit connected to the first shield unit and spaced above an upper surface of the pixel-defining layer.

[0014] In this embodiment, the first shield unit and the second shield unit are formed at different heights, respectively.

[0015] In this embodiment, the shield unit further includes a bonding unit formed below the first shield unit.

[0016] In this embodiment, at least a portion of the bonding unit is formed in the non-display area.

[0017] In this embodiment, the method further includes removing the shield unit from the substrate.

[0018] In this embodiment, the method further includes forming an encapsulation substrate above and separately from the substrate, and attaching the encapsulation substrate to the substrate.

[0019] In this embodiment, the method further includes forming a thin film encapsulation layer on the pixel-defining layer.

[0020] In this embodiment, the method further includes forming a through-hole in the substrate.

[0021] According to one or more embodiments, a method of manufacturing a display apparatus includes forming a pixel-defining layer on a substrate, wherein the substrate includes a display area, an opening area in the display area, and a non-display area at least partially surrounding the opening area; and attaching a shield unit to the opening area or the non-display area, the shield unit shielding a portion of the pixel-defining layer, the opening area, and the non-display area. A portion of the shield unit is spaced apart from the pixel-defining layer, and a first portion of the shield unit is formed at a different height than a second portion of the shield unit.

[0022] In this embodiment, the method includes forming an intermediate layer, a counter electrode, and a cover layer on the pixel-defining layer and the shield unit.

[0023] In this embodiment, the shield unit is attached to the display area and / or the non-display area.

[0024] In this embodiment, the shielding unit is attached to the display area or the non-display area at a plurality of locations in the display area or the non-display area, wherein the plurality of locations are spaced apart from each other.

[0025] In this embodiment, the shielding unit is attached to the non-display area and covers the opening area.

[0026] In this embodiment, the method further includes removing the shielding unit from the base.

[0027] In this embodiment, the method further includes forming an encapsulation base spaced apart from the base over the base, and combining the encapsulation base with the base.

[0028] In this embodiment, the method further includes forming a thin film encapsulation layer on the pixel defining layer.

[0029] In this embodiment, the method further includes forming a through hole in the base.

[0030] These general and specific aspects can be implemented using a system, a method, a computer program, or a combination of system, method, and computer program. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a perspective view of a display apparatus according to an embodiment.

[0032] Figure 2 is a cross-sectional view of a display apparatus according to an embodiment taken along Figure 1 cutting line A-A’ of

[0033] Figure 3 is a cross-sectional view of a display apparatus according to an embodiment taken along Figure 1 cutting line A-A’ of

[0034] Figure 4 is a top plan view of a display panel according to an embodiment.

[0035] Figure 5 is an equivalent circuit diagram of a pixel in a display panel according to an embodiment.

[0036] Figure 6 is a cross-sectional view of a display panel according to an embodiment.

[0037] Figure 7 is a cross-sectional view of Figure 6 a display panel shown in

[0038] Figures 8-10 is a cross-sectional view showing a method of manufacturing Figure 6 a display panel shown in

[0039] Figure 11is a cross-sectional view of a display panel according to an embodiment.

[0040] Figure 12 is a cross-sectional view showing a part of a method of manufacturing a display panel shown in Figure 11

[0041] Figure 13 is a cross-sectional view of a display panel according to another embodiment.

[0042] Figure 14 is a cross-sectional view showing a part of a method of manufacturing a display panel shown in Figure 13

[0043] Figure 15 is a cross-sectional view of a display panel according to another embodiment.

[0044] Figures 16-22 is a cross-sectional view showing a part of a method of manufacturing a display panel shown in Figure 15

[0045] Figure 23 is a cross-sectional view of a display panel according to another embodiment.

[0046] Figure 24 is a cross-sectional view of a display panel according to another embodiment.

[0047] Figure 25 is a perspective view of a shielding unit used when manufacturing a display panel according to an embodiment.

[0048] Figure 26 is a perspective view of another shielding unit used when manufacturing a display panel according to an embodiment.

[0049] Figure 27 is a perspective view of another shielding unit used when manufacturing a display panel according to an embodiment. DETAILED DESCRIPTION

[0050] Reference will now be made in detail embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals can be used throughout the detailed description to refer to the same or similar components. In this regard, the present embodiments can have different forms and should not be construed as being limited to the descriptions set forth herein.

[0051] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Identical components can be given the same reference numerals throughout the description, and a repeated description thereof will be omitted.

[0052] It will be understood that when a layer, region, or component is referred to as being "on" another layer, region, or component, it can be directly or indirectly on the other layer, region, or component.

[0053] ​​​For convenience of explanation, the sizes of components in the drawings can be exaggerated.

[0054] Figure 1 is a perspective view of a display apparatus 1 according to an embodiment.

[0055] Referring to Figure 1 , according to an embodiment, the display apparatus 1 includes an opening area OP and a display area DA at least partially surrounding the opening area OP. The display apparatus 1 displays an image by using light emitted from a plurality of pixels arranged in the display area DA. In Figure 1 , one opening area OP is provided in the display area DA, and the opening area OP is completely surrounded by the display area DA. The opening area OP accommodates components described below with reference to Figure 2 .

[0056] According to an embodiment, a second non-display area NDA2 is disposed between the opening area OP and the display area DA, and the display area DA is surrounded by a first non-display area NDA1. The second non-display area NDA2 and the first non-display area NDA1 are non-display areas in which pixels are not disposed. The second non-display area NDA2 is completely surrounded by the display area DA, and the display area DA is completely surrounded by the first non-display area NDA1.

[0057] Hereinafter, an organic light emitting display is described as an example of the display apparatus 1 according to an embodiment, but the embodiment is not limited thereto. In other embodiments, the display apparatus 1 can be another type of display apparatus (such as a quantum dot light emitting display).

[0058] Figure 1 One approximately circular opening area OP is illustrated, but the embodiment is not limited thereto. In other embodiments, the number of opening areas OP can be two or more, and the shape of each opening area OP can be variously modified to, for example, a circular shape, an elliptical shape, a polygonal shape, a star shape, a lozenge shape, etc.

[0059] Figure 2 is a cross-sectional view of the display apparatus 1 taken along the cross-sectional line A-A' of Figure 1 according to an embodiment. Figure 3 is a cross-sectional view of the display apparatus 1 taken along the cross-sectional line A-A' of Figure 1 according to another embodiment.

[0060] Referring to Figure 2 and Figure 3According to an embodiment, the display device 1 includes a display panel 10, an input sensing layer 40 disposed on the display panel 10, and an optical functional layer 50 disposed on the input sensing layer 40. The display panel 10, the input sensing layer 40, and the optical functional layer 50 are covered by a window 60. The display device 1 can be one of various electronic devices such as a mobile phone, a laptop computer, or a smart watch, etc.

[0061] According to an embodiment, the display panel 10 displays an image. The display panel 10 includes pixels disposed in a display area DA. Each pixel includes a display element and a pixel circuit connected to the display element. The display element can include an organic light emitting diode, a quantum dot organic light emitting diode, etc.

[0062] According to an embodiment, the input sensing layer 40 acquires an external input such as coordinate information according to a touch event. The input sensing layer 40 includes a sensing electrode or a touch electrode and a trace connected to the sensing electrode or the touch electrode. The input sensing layer 40 is disposed on the display panel 10. The input sensing layer 40 can sense an external input by using a mutual capacitance method or a self-capacitance method.

[0063] According to an embodiment, the input sensing layer 40 can be directly formed on the display panel 10 or separately formed and then combined with the display panel 10 by using an adhesive layer such as an optically transparent adhesive. For example, the input sensing layer 40 can be continuously formed after the display panel 10 is formed. In an embodiment, the input sensing layer 40 is a part of the display panel 10, and an adhesive layer does not need to be disposed between the input sensing layer 40 and the display panel 10. Although Figure 2 An embodiment in which the input sensing layer 40 is located between the display panel 10 and the optical functional layer 50 is illustrated, but in another embodiment, the input sensing layer 40 is disposed on the optical functional layer 50.

[0064] According to an embodiment, the optical functional layer 50 includes an anti-reflection layer. The anti-reflection layer reduces reflectance of external light incident on the display panel 10 through the window 60. The anti-reflection layer includes a retarder and a polarizer. The retarder can be a film type or a liquid crystal coating type, and can include a λ / 2 retarder or a λ / 4 retarder. The polarizer can also be a film type or a liquid crystal coating type. The polarizer includes a stretched synthetic resin film, and the liquid crystal coating type polarizer includes liquid crystals in a predetermined initial alignment. The retarder and the polarizer further include a protective film. The retarder and the polarizer or the protective film form a base layer of the anti-reflection layer.

[0065] In another embodiment, the anti-reflection layer includes a black matrix and a color filter. The color filter is arranged to correspond to a color of light emitted from each pixel of the display panel 10. In another embodiment, the anti-reflection layer includes a destructive interference structure. The destructive interference structure includes a first reflection layer and a second reflection layer located on different layers, respectively. First reflected light and second reflected light respectively reflected from the first reflection layer and the second reflection layer undergo destructive interference, which reduces reflectance of external light.

[0066] According to an embodiment, the optical functional layer 50 includes a lens layer. The lens layer improves light emission efficiency of light emitted from the display panel 10 or reduces color shift. The lens layer includes a layer of concave lenses or a layer of convex lenses or a plurality of layers each having a different refractive index. The optical functional layer 50 can include both the anti-reflection layer and the lens layer or any one of the anti-reflection layer and the lens layer.

[0067] In an embodiment, the optical functional layer 50 is formed continuously after the display panel 10 and the input sensing layer 40 are formed. In this case, the adhesive layer does not need to be positioned between the optical functional layer 50 and the display panel 10 or between the optical functional layer 50 and the input sensing layer 40.

[0068] According to an embodiment, the display panel 10, the input sensing layer 40, and the optical functional layer 50 each include an opening. In this regard, Figure 2 An embodiment is shown in which the display panel 10, the input sensing layer 40, and the optical functional layer 50 each include first, second, and third openings 10H, 40H, and 50H, respectively, which are stacked on each other. The first, second, and third openings 10H, 40H, and 50H correspond to the opening region OP. In another embodiment, one or more of the display panel 10, the input sensing layer 40, and the optical functional layer 50 do not include an opening. For example, one or two of the display panel 10, the input sensing layer 40, and the optical functional layer 50 will not include an opening. Alternatively, as shown in Figure 3 None of the display panel 10, the input sensing layer 40, and the optical functional layer 50 include an opening, as shown in

[0069] As described above, according to an embodiment, the opening region OP is a component region (such as a sensor region, a camera region, a speaker region, etc.) that can accommodate a component 30 that adds various functions to the display device 1. As shown in Figure 2 The component 30 extends in the first, second, and third openings 10H, 40H, and 50H, as shown in Figure 3 The component 30 is disposed under the display panel 10, as shown in

[0070] According to an embodiment, the assembly 30 includes an electronic element. For example, the assembly 30 includes an electronic element using light or sound. For example, the electronic element includes a sensor outputting or receiving light such as an infrared sensor, a camera receiving light and capturing an image, a sensor identifying a fingerprint or measuring a distance by outputting and sensing light or sound, a small-sized lamp outputting light, a speaker outputting sound, etc. The electronic element can use various wavebands of light such as visible light, infrared light, ultraviolet light, etc. In some embodiments, the open region OP is a transmissive region through which light or sound is transmitted from or received by the assembly 30.

[0071] In another embodiment, when the display apparatus 1 is used as a smart watch or a dashboard of a vehicle, the assembly 30 can be a member such as a pointer or a needle of a watch providing certain information such as a speed of the vehicle. When the display apparatus 1 includes a clock or a dashboard of a vehicle, the assembly 30 is exposed to the outside through the window 60, and the window 60 includes an opening corresponding to the open region OP.

[0072] As described above, according to an embodiment, the assembly 30 includes an element related to a function of the display panel 10 or an element such as an accessory improving an aesthetic function of the display panel 10. Although not shown in Figure 2 and Figure 3 , a layer including an optically transparent adhesive or the like can be disposed between the window 60 and the optically functional layer 50.

[0073] Figure 4 is a top plan view of the display panel 10 according to an embodiment. Figure 5 is an equivalent circuit diagram of a pixel P in the display panel 10 according to an embodiment.

[0074] Referring to Figure 4 and Figure 5 , according to an embodiment, the display panel 10 includes an open region OP, a display region DA, a second non-display region NDA2, and a first non-display region NDA1.

[0075] According to an embodiment, the display panel 10 includes a plurality of pixels P disposed in the display region DA. As shown in Figure 5 , each of the plurality of pixels P includes a pixel circuit PC and an organic light emitting diode OLED as a display element connected to the pixel circuit PC. The pixel circuit PC includes a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel P can emit one of red light, green light, and blue light or one of red light, green light, blue light, and white light from the organic light emitting diode OLED.

[0076] According to an embodiment, a second thin-film transistor T2, which is a switching thin-film transistor, is connected to a scan line SL and a data line DL, and transmits a data voltage received from the data line DL to a first thin-film transistor T1 based on a switching voltage received from the scan line SL. A storage capacitor Cst is connected to the second thin-film transistor T2 and a driving voltage line PL, and stores a voltage corresponding to a difference between a voltage received from the second thin-film transistor T2 and a first power voltage ELVDD received from the driving voltage line PL.

[0077] According to an embodiment, a first thin-film transistor T1, which is a driving thin-film transistor, is connected to a driving voltage line PL and a storage capacitor Cst, and controls a driving current flowing from the driving voltage line PL to an organic light-emitting diode OLED to correspond to a voltage value stored in the storage capacitor Cst. The organic light-emitting diode OLED emits light having a certain brightness in response to the driving current. A counter electrode (such as a cathode) of the organic light-emitting diode OLED receives a second power voltage ELVSS.

[0078] According to an embodiment, referring to Figure 5 The pixel circuit PC is described as including two thin-film transistors and one storage capacitor, but embodiments are not limited thereto. In other embodiments, the number of transistors and the number of storage capacitors can be variously modified according to the design of the pixel circuit PC. For example, the pixel circuit PC can include four or more thin-film transistors in addition to the two thin-film transistors described above.

[0079] According to an embodiment, a scan driver 1100 that transmits a scan signal to each of the pixels P, a data driver 1200 that transmits a data signal to each of the pixels P, and a main power line that transmits a first power voltage ELVDD and a second power voltage ELVSS are disposed in the first non-display area NDA1. Although the data driver 1200 is shown as being disposed adjacent to one side of the substrate 100 in Figure 4 In another embodiment, the data driver 1200 is arranged on a flexible printed circuit board (FPCB) that is in electrical contact with pads (or "bonding pads") disposed at one side of the display panel 10.

[0080] In addition, according to an embodiment, a wiring part that transmits various signals / power to the display area DA is disposed in the first non-display area NDA1. In an embodiment, the wiring part includes a driving circuit. For example, the driving circuit can include at least one of a scan driving circuit, a terminal part, a driving power line, and a second wiring, and can further include a thin-film transistor that controls an electrical signal transmitted to the display area DA. In addition, a partition or a trench that interrupts the flow of an organic material used when manufacturing the display apparatus 1 can be disposed in the first non-display area NDA1.

[0081] Referring toFigure 4 According to an embodiment, the second non-display area NDA2 surrounds the opening area OP on the plane. The second non-display area NDA2 and the opening area OP both lack display elements (such as organic light-emitting diodes) that emit light, and a signal line that transmits a signal to the pixels P arranged around the opening area OP can pass through the second non-display area NDA2.

[0082] According to an embodiment, in addition to the signal line, an additional groove is formed in the second non-display area NDA2. In an embodiment, a plurality of grooves spaced apart from each other are provided in the second non-display area NDA2.

[0083] Figure 6 is a cross-sectional view of the display panel 10 according to an embodiment. Figure 7 is Figure 6 is a cross-sectional view of the display panel 10 shown in Figure 7 In

[0084] Referring to Figure 6 and Figure 7 According to an embodiment, the display panel 10 includes a display layer 200 provided on a substrate 100. The substrate 100 can include glass or a polymer resin. The substrate 100 can include multiple layers. For example, as shown in the enlarged view of Figure 6 , the substrate 100 includes a first base layer 100-1, a first barrier layer 100-2, a second base layer 100-3, and a second barrier layer 100-4.

[0085] According to an embodiment, the first base layer 100-1 and the second base layer 100-3 each include a polymer resin. For example, the first base layer 100-1 and the second base layer 100-3 each include a polymer resin such as polyether sulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate, etc. The above-mentioned polymer resins are transparent.

[0086] According to an embodiment, the first barrier layer 100-2 and the second barrier layer 100-4 that prevent the penetration of external foreign substances can each include a single layer or multiple layers including an inorganic material such as silicon nitride (SiN x ) or silicon oxide (SiO x ).

[0087] According to an embodiment, the display layer 200 includes a plurality of pixels. The display layer 200 includes a display element layer 200A including a display element located in each pixel, and a pixel circuit layer 200B including a pixel circuit and an insulating layer located in each pixel. In this case, the insulating layer of the pixel circuit layer 200B can include at least one of the buffer layer 101, the first gate insulating layer 103, the second gate insulating layer 105, the interlayer insulating layer 107, and the planarization layer 109, which will be described later. Each of the pixel circuits includes a thin film transistor and a storage capacitor, and each of the display elements includes an organic light emitting diode. Figure 7 A first thin film transistor T1, a second thin film transistor T2, a storage capacitor Cst, and an OLED 300 are shown.

[0088] According to an embodiment, the display elements in the display layer 200 are covered with an encapsulating member such as a thin film encapsulation layer 500 including at least one inorganic encapsulation layer and at least one organic encapsulation layer. When the display panel 10 includes the polymer resin substrate 100 and the thin film encapsulation layer 500 includes the inorganic encapsulation layer and the organic encapsulation layer, the flexibility of the display panel 10 can be enhanced.

[0089] According to an embodiment, the display panel 10 includes a first opening 10H that penetrates the display panel 10. The first opening 10H is located in the opening region OP. In Figure 6 In an embodiment, the substrate 100 and the thin film encapsulation layer 500 each include a penetration hole 100H and 500H corresponding to the first opening 10H of the display panel 10. The display layer 200 also includes a penetration hole 200H corresponding to the opening region OP.

[0090] According to an embodiment, the display panel 10 includes a substrate 100 including a display region DA and a non-display region, and a thin film encapsulation layer 500 sealing the display region DA and the non-display region. In an embodiment, as described above, the display panel 10 includes the display layer 200 and the thin film encapsulation layer 500.

[0091] According to an embodiment, the buffer layer 101 provided on the substrate 100 can reduce or prevent penetration of foreign matter, moisture, or external air from a lower portion of the substrate 100, and provide a planarized surface on the substrate 100. The buffer layer 101 can include an inorganic material such as an oxide or a nitride, an organic material, or an organic-inorganic composite material, and can include a single layer or multiple layers of inorganic materials and organic materials.

[0092] According to an embodiment, the first thin film transistor T1 includes a semiconductor layer A1, a first gate electrode G1, a source electrode S1, and a drain electrode D1, and the second thin film transistor T2 includes a semiconductor layer A2, a second gate electrode G2, a source electrode S2, and a drain electrode D2.

[0093] Hereinafter, an embodiment in which the first thin film transistor T1 and the second thin film transistor T2 are top-gate transistors is shown. However, the embodiment is not limited thereto, and in other embodiments, various other types of thin film transistors (such as bottom-gate transistors) are used.

[0094] Hereinafter, an embodiment in which two transistors (a first thin film transistor T1 and a second thin film transistor T2) are provided is described, but the embodiment is not limited thereto. In other embodiments, the display device 1 may use two or more thin film transistors for one pixel. The number of thin film transistors may be variously modified. In some embodiments, six to seven thin film transistors are used in one pixel.

[0095] According to an embodiment, semiconductor layers A1 and A2 may include amorphous silicon or polycrystalline silicon. In another embodiment, semiconductor layers A1 and A2 include an oxide of at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). Semiconductor layers A1 and A2 each include a channel region and a source region and a drain region having a higher carrier concentration than the channel region.

[0096] According to an embodiment, the first gate electrode G1 is provided on the semiconductor layer A1, and the first gate insulating layer 103 is interposed between the semiconductor layer A1 and the first gate electrode G1. The first gate electrode G1 includes one or more of molybdenum (Mo), aluminum (Al), copper (Co), and titanium (Ti), and may include a single layer or multiple layers. For example, the first gate electrode G1 includes a single Mo layer.

[0097] According to an embodiment, the first gate insulating layer 103 insulates the semiconductor layer A1 from the first gate electrode G1 and includes silicon dioxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium dioxide (TiO2), tantalum oxide (Ta2O5), hafnium dioxide (HfO2) and zinc oxide (ZnO2).

[0098] According to an embodiment, the second gate electrode G2 is provided on the semiconductor layer A2, and the first gate insulating layer 103 and the second gate insulating layer 105 are interposed between the semiconductor layer A2 and the second gate electrode G2. The second gate electrode G2 includes a conductive material (such as Mo, Al, Cu, or Ti), and may include a multilayer or a single layer including one or more of the above-mentioned materials. For example, the second gate electrode G2 may include a single Mo layer or a multilayer having a Mo / Al / Mo structure.

[0099] According to an embodiment, the second gate insulating layer 105 includes an inorganic material including an oxide or a nitride. For example, the second gate insulating layer 105 includes one of SiO2, SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, and ZnO2, and the like.

[0100] According to an embodiment, the source electrodes S1 and S2 and the drain electrodes D1 and D2 are provided on the interlayer insulating layer 107. The source electrodes S1 and S2 and the drain electrodes D1 and D2 each include an electrically conductive material such as Mo, Al, Cu, or Ti, and can include a single layer or a plurality of layers including one or more of the above-mentioned materials. For example, the source electrodes S1 and S2 and the drain electrodes D1 and D2 each include a plurality of layers of Ti / Al / Ti.

[0101] According to an embodiment, the interlayer insulating layer 107 includes one of SiO x , SiN x , SiON, Al2O3, TiO2, Ta2O5, HfO2, and ZnO2, and the like.

[0102] As described above, according to an embodiment, the first gate electrode G1 of the first thin film transistor T1 and the second gate electrode G2 of the second thin film transistor T2 are provided on different layers, respectively. Thus, the driving ranges of the first thin film transistor T1 and the second thin film transistor T2 can be adjusted differently.

[0103] According to an embodiment, the storage capacitor Cst includes a first electrode CE1 and a second electrode CE2. The first electrode CE1 of the storage capacitor Cst is provided on the same layer as the first gate electrode G1 and includes the same material as the first gate electrode G1. The second electrode CE2 of the storage capacitor Cst is superposed with the first electrode CE1 with the second gate insulating layer 105 interposed therebetween. The second electrode CE2 is provided on the same layer as the second gate electrode G2 and includes the same material as the second gate electrode G2.

[0104] In Figure 7 , according to an embodiment, the storage capacitor Cst is not superposed with the first thin film transistor T1 or the second thin film transistor T2. However, embodiments of the storage capacitor Cst are not limited thereto. For example, the storage capacitor Cst can be superposed with the first thin film transistor T1. In some embodiments, the first electrode CE1 of the storage capacitor Cst is integrally formed with the first gate electrode G1. That is, the first gate electrode G1 of the first thin film transistor T1 serves as the first electrode CE1 of the storage capacitor Cst.

[0105] According to an embodiment, a planarization layer 109 is disposed on the source electrodes S1 and S2 and the drain electrodes D1 and D2, and an organic light emitting diode (OLED) 300 is disposed on the planarization layer 109. The planarization layer 109 can include a single layer or multiple layers, and includes a film including an organic material. The organic material can include a common commercial polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an arylether polymer, an amide polymer, a fluorine polymer, a p-xylyl polymer, a vinylalcohol polymer, or a blend thereof. In addition, the planarization layer 109 includes a composite stack of an inorganic insulating layer and an organic insulating layer.

[0106] According to an embodiment, the organic light emitting diode 300 is disposed on the planarization layer 109 in the display area DA of the substrate 100. The organic light emitting diode 300 includes a pixel electrode 310, a counter electrode 330, and an intermediate layer 320 interposed between the pixel electrode 310 and the counter electrode 330.

[0107] According to an embodiment, the pixel electrode 310 contacts and is electrically connected to any one of the source electrode S2 and the drain electrode D2 of the second thin film transistor T2 through an opening formed in the planarization layer 109. The pixel electrode 310 includes a reflective electrode. For example, the pixel electrode 310 includes a reflective film including at least one of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), and chromium (Cr), or a mixture thereof, etc., and a transparent or semi-transparent electrode layer disposed on the reflective film. The transparent or semi-transparent electrode layer includes at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO).

[0108] According to an embodiment, a pixel defining layer 112 is disposed on the planarization layer 109. The pixel defining layer 112 defines a pixel by having an opening corresponding to each sub-pixel, i.e., an opening exposing at least a central portion of the pixel electrode 310. In addition, the pixel defining layer 112 prevents an arc or the like from occurring at an edge of the pixel electrode 310 by increasing a distance between the edge of the pixel electrode 310 and the counter electrode 330 located above the pixel electrode 310. The pixel defining layer 112 includes an organic layer such as polyimide or hexamethyldisiloxane (HMDSO).

[0109] According to an embodiment, the intermediate layer 320 includes an emission layer 322. The emission layer 322 includes a fluorescent or phosphorescent organic material emitting red, green, or blue light and is patterned to correspond to the pixels P in the display area DA (see FIG. 1). The emission layer 322 includes a red emission layer 322R, a green emission layer 322G, and a blue emission layer 322B. Figure 4). The intermediate layer 320 includes at least one functional layer, such as a first functional layer 321 located between the emission layer 322 and the pixel electrode 310 and a second functional layer 323 located between the emission layer 322 and the counter electrode 330.

[0110] According to an embodiment, the first functional layer 321 is any one of a hole injection layer (HIL) and a hole transport layer (HTL).

[0111] According to an embodiment, the HIL receives holes released from the anode, and the HTL transports holes of the HIL to the emission layer 322.

[0112] According to an embodiment, the HIL includes at least one of phthalocyanine compounds such as copper phthalocyanine, N-N'-diphenyl-N,N'-bis-[4-(phenyl-m-tolyl-amino)-phenyl]- biphenyl-4,4] diamine (DNTPD), 4,4',4"-tris(3-methylphenylphenylamino)triphenylamine (m-MTDATA), 4,4',4"-tris(N,N-diphenylamino)triphenylamine (TDATA), 4,4',4"-tris[N,-(2-naphthyl)-N-phenylamino]triphenylamine (2T-NATA), poly(3,4- ethylenedioxythiophene) (PEDOT) / poly(4-styrenesulfonate) (PSS), polyaniline (Pani) / dodecylbenzenesulfonic acid (DBSA), Pani / camphor sulfonic acid (CSA), and Pani / PSS, but embodiments of the HIL are not limited thereto.

[0113] According to an embodiment, the HTL includes at least one of carbazole derivatives such as N-phenylcarbazole or polyvinylcarbazole and triphenylamine-based materials such as N-N'-bis(3-methylphenyl)-N,N'-diphenyl-(1,1-biphenyl)-4,4'-diamine (TPD), N,N'-di(1-naphthyl)-N,N'-diphenylbenzidine (NPB), or 4,4',4'-tris(N-carbazolyl)triphenylamine (TCTA), etc., but embodiments of the HTL are not limited thereto.

[0114] According to an embodiment, the second functional layer 323 is any one of an electron transport layer (ETL) and an electron injection layer (EIL).

[0115] According to an embodiment, the EIL receives electrons released from the cathode, and the ETL transports electrons of the EIL to the emission layer 322.

[0116] According to an embodiment, the ETL includes at least one of Alq3, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline (BCP), 4,7-diphenyl-1,10-phenanthroline (Bphen), 3-(4-biphenyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole (TAZ), 4-(naphthalen-1-yl)-3,5-diphenyl-4H-1,2,4-triazole (NTAZ), 2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole (tBu-BPD), bis(2-methyl-8)-quinolinolato-N1,O8-(1,1'-biphenyl-4-yl)aluminum (BAlq), beryllium bis(benzochinolate) beryllium (Bebq2), and 9,10-di(naphthalen-2-yl)anthracene (ADN), but embodiments of the ETL are not limited thereto.

[0117] According to an embodiment, the EIL includes at least one of lithium fluoride (LiF), sodium chloride (NaCl), cesium fluoride (CsF), lithium oxide (Li2O), barium oxide (BaO), and lithium quinolate (Liq), but embodiments of the EIL are not limited thereto.

[0118] The intermediate layer 320 is not limited to the above embodiment, and can have various structures in other embodiments. The intermediate layer 320 can include a layer integrally formed over the plurality of pixel electrodes 310, or include a layer patterned to correspond to each of the plurality of pixel electrodes 310. Hereinafter, for convenience of explanation, an embodiment in which the emission layer 322 is patterned to correspond to each of the plurality of pixel electrodes 310 and the first functional layer 321 and the second functional layer 323 are integrally disposed on the substrate 100 over the plurality of pixel electrodes 310 will be described in detail.

[0119] According to an embodiment, as shown in FIG. 1A, the cathode 330 is disposed in the display area DA and covers the display area DA. That is, the cathode 330 is integrally formed with respect to the plurality of organic light emitting diodes 300 and corresponds to the plurality of pixel electrodes 310. In another embodiment, the cathode 330 covers an upper portion of the display area DA and an upper portion of a portion of the non-display area NDA (see FIG. 1A). Hereinafter, for convenience of explanation, an embodiment in which the cathode 330 covers an upper portion of the display area DA and an upper portion of a portion of the non-display area NDA will be described in detail. Figure 7 Figure 1 ) of the display area DA. Hereinafter, for convenience of explanation, an embodiment in which the cathode 330 covers an upper portion of the display area DA and an upper portion of a portion of the non-display area NDA will be described in detail.

[0120] ​According to an embodiment, the counter electrode 330 includes a transmissive electrode. For example, the counter electrode 330 includes a transparent or semi-transparent electrode and includes a metal thin film having a small work function, the metal thin film including one or more of Li, calcium (Ca), LiF / Ca, LiF / Al, Al, Ag, Mg, and mixtures thereof. In addition, a transparent conductive oxide film such as ITO, IZO, ZnO, or In2O3 is also provided on the metal thin film.

[0121] According to the embodiment, since the pixel electrode 310 is a reflective electrode and the counter electrode 330 is a transmissive electrode, the display device 1 is a top emission type in which light emitted from the intermediate layer 320 is emitted toward the counter electrode 330. However, the embodiment is not limited thereto, and in other embodiments, the display device 1 is a bottom emission type in which light emitted from the intermediate layer 320 is emitted toward the substrate 100. In this case, the pixel electrode 310 includes a transparent or semi-transparent electrode, and the counter electrode 330 includes a reflective electrode. In addition, the display device 1 of this embodiment may be a dual emission type that emits light in two directions (both top and bottom).

[0122] According to an embodiment, the cover layer 400 is provided on the opposite electrode 330. In this case, the cover layer 400 is in direct contact with the opposite electrode 330. The cover layer 400 has a refractive index lower than that of the opposite electrode 330 and higher than that of the first inorganic encapsulating layer 510. The cover layer 400 reduces the ratio of light emitted from the intermediate layer 320 to be reflected, thereby improving light efficiency.

[0123] According to the embodiment, Figure 7 As shown in FIG, the thickness of at least one end of the first functional layer 321, the emissive layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 gradually decreases toward the opening region OP. The flat upper surface of the pixel defining layer 112 has a region where the thickness of at least one end of the first functional layer 321, the emissive layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 changes. Specifically, the region where the thickness of at least one end of the first functional layer 321, the emissive layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 changes is a flat portion of the upper surface of the pixel defining layer 112.

[0124] According to an embodiment, the thin film encapsulation layer 500 covers the display area DA and the non-display area NDA to prevent penetration of external moisture and oxygen. The thin film encapsulation layer 500 includes at least one organic encapsulation layer and at least one inorganic encapsulation layer. Figure 7 An example is shown in which the thin film encapsulation layer 500 includes two inorganic encapsulation layers (such as a first inorganic encapsulation layer 510 and a second inorganic encapsulation layer 530) and one organic encapsulation layer 520, but the stacking order and number of layers are not limited to Figure 7The embodiment shown in FIG. 1.

[0125] According to an embodiment, the first inorganic encapsulation layer 510 covers the counter electrode 330 and includes one or more of SiO x , SiN x , and SiON, etc. Other layers, such as the cover layer 400, are placed between the first inorganic layer encapsulation layer 510 and the counter electrode 330 as needed. Since the first inorganic encapsulation layer 510 is formed along the structure located thereunder as shown in FIG. 1, the upper surface of the first inorganic encapsulation layer 510 is not flat. Figure 7

[0126] According to an embodiment, the organic encapsulation layer 520 covers the first inorganic encapsulation layer 510, and unlike the first inorganic encapsulation layer 510, the upper surface of the organic encapsulation layer 520 is substantially flat. Specifically, the upper surface of the organic encapsulation layer 520 is substantially flat in a portion corresponding to the display area DA. The organic encapsulation layer 520 includes at least one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyether sulfone, polyformal, polyarylate, and hexamethyldisiloxane. The second inorganic encapsulation layer 530 covers the organic encapsulation layer 520 and includes one of SiO x , SiN x , and SiON, etc.

[0127] As described above, according to an embodiment, the thin film encapsulation layer 500 includes the first inorganic encapsulation layer 510, the organic encapsulation layer 520, and the second inorganic encapsulation layer 530, and by using this multi-layer structure, a crack occurring in the thin film encapsulation layer 500 does not form a connection between the first inorganic encapsulation layer 510 and the organic encapsulation layer 520 or between the organic encapsulation layer 520 and the second inorganic encapsulation layer 530. By doing so, it is possible to prevent or minimize the formation of a path through which moisture or oxygen can penetrate into the display area DA and the non-display area NDA. The second inorganic encapsulation layer 530 is in contact with the first inorganic encapsulation layer 510 at an edge located outside the display area DA, thereby preventing the organic encapsulation layer 520 from being exposed to the outside.

[0128] According to an embodiment, the partition 120 is formed in the non-display area NDA of the substrate 100.

[0129] According to an embodiment, the partition 120 prevents the organic material from flowing toward the edge of the substrate 100 when the organic encapsulation layer 520 that seals the display area DA and the non-display area NDA is formed, thereby preventing the formation of an edge tail of the organic encapsulation layer 520.

[0130] ​According to an embodiment, one or more partitions 120 are provided. In an embodiment, when a plurality of partitions 120 are provided, the plurality of partitions 120 include at least a first partition 120A and a second partition 120B that are separated from each other.

[0131] According to an embodiment, at least one of the first partition 120A and the second partition 120B includes multiple layers. Figure 7 The first partition 120A is illustrated as including a first layer 121A and a second layer 123A stacked together, the first layer 121A including the same material as the planarization layer 109, and the second layer 123A including the same material as the pixel definition layer 112, and the second partition 120B is illustrated as including a first layer 121B and a second layer 123B stacked together, the first layer 121B including the same material as the planarization layer 109, and the second layer 123B including the same material as the pixel definition layer 112. However, embodiments of the first partition 120A and the second partition 120B are not limited thereto. In other embodiments, various modifications can be made to the structure of the first partition 120A and the second partition 120B; one of the first partition 120A and the second partition 120B can include a single layer, both of the first partition 120A and the second partition 120B can have a two-layer structure, or both of the first partition 120A and the second partition 120B can have a three-layer structure. In addition, the plurality of partitions 120 can further include an additional partition spaced apart from the first partition 120A and the second partition 120B.

[0132] In addition, a spacer is provided in the flat portion of the pixel definition layer 112, the spacer protruding from the flat portion of the pixel definition layer 112 into the thin film encapsulation layer 500. The spacer includes an organic material such as polyimide or hexamethyldisiloxane.

[0133] According to an embodiment, since the partition 120 includes a plurality of partitions, overflow of an organic material when the organic encapsulation layer 520 is formed can be more effectively prevented.

[0134] Figures 8-10 is a cross-sectional view illustrating a method of manufacturing the display panel 10 illustrated in Figure 6 In Figures 8-10 In Figures 8-10 In Figure 6 In Figure 7 In Figure 6 In Figure 7 In

[0135] Referring to Figures 8-10According to an embodiment, the organic light emitting diode 300 is formed after the insulating layer, the pixel circuit, etc. are formed on the substrate 100 when the display panel 10 is manufactured.

[0136] According to an embodiment, the shielding unit 20 is formed on the substrate 100 to shield at least a portion of the second non-display area NDA2 and the opening area OP before or after the pixel electrode 310 is formed. Hereinafter, for convenience of explanation, an embodiment in which the shielding unit 20 is formed on the substrate 100 to shield the opening area OP and the entire portion of the second non-display area NDA2 after the pixel electrode 310 is formed will be described in detail.

[0137] According to an embodiment, the above-described shielding unit 20 includes the first shielding unit 21, the second shielding unit 22, and the adhesive unit 23. The first shielding unit 21 and the second shielding unit 22 can be integrally or separately formed. For example, the first shielding unit 21 and the second shielding unit 22 include a heat-resistant material having a melting point in a range of 350 degrees Celsius or more to 450 degrees Celsius or less. Specifically, the first shielding unit 21 and the second shielding unit 22 are manufactured by using a polyimide resin by an injection method, etc.; alternatively, the first shielding unit 21 and the second shielding unit 22 are formed as a film and attached or bonded to each other. In another embodiment, the first shielding unit 21 and the second shielding unit 22 are integrally formed in a process of extruding or compressing plastic or metal, etc. including a thermosetting material. In another embodiment, the first shielding unit 21 and the second shielding unit 22 are formed by using a mold from synthetic resin or metal, etc.

[0138] According to an embodiment, the above-described first shielding unit 21 and the second shielding unit 22 are formed at different heights. In an embodiment, a portion of the first shielding unit 21 is bent and connected to the second shielding unit 22. In an embodiment, the first shielding unit 21 and the second shielding unit 22 shield different portions of the substrate 100, respectively. For example, the first shielding unit 21 shields a portion of the second non-display area NDA2 and the opening area OP. The second shielding unit 22 shields at least a portion of the second non-display area NDA2. In addition, the second shielding unit 22 does not contact the uppermost layer of the layers stacked on the substrate 100 which are shielded by the second shielding unit 22. That is, the lower surface of the second shielding unit 22 is spaced apart from and located above the uppermost surface of the pixel defining layer 112 in the second non-display area NDA2. In an embodiment, when an additional spacer is disposed on the pixel defining layer 112, the lower surface of the second shielding unit 22 can or can not contact the uppermost surface of the spacer.

[0139] According to an embodiment, the bonding unit 23 includes a bonding member. For example, the bonding unit 23 includes micro-sized vacuum grease. In another embodiment, the bonding unit 23 includes a heat-resistant silicone-based adhesive that does not degenerate due to high temperatures.

[0140] Depending on the embodiment, the adhesive unit 23 described above can be provided in various forms on the lower surface of the first shielding unit 21. For example, the adhesive unit 23 can be formed into a ring on the lower surface of the first shielding unit 21. In one embodiment, the opening area OP is located inside the ring-shaped adhesive unit 23. In another embodiment, multiple adhesive units 23 are provided separately from each other on the lower surface of the first shielding unit 21. In another embodiment, the adhesive unit 23 has a plate shape that completely shields the opening area OP. For ease of explanation, the embodiment in which the adhesive unit 23 is ring-shaped will be described in detail.

[0141] According to an embodiment, the adhesive unit 23 is provided at multiple locations. The adhesive unit 23 may be provided outside the opening area OP or provided to completely shield the opening area OP. In an embodiment, the adhesive unit 23 has various forms at multiple locations in the second non-display area NDA2.

[0142] According to an embodiment, after forming the pixel electrode 310, the substrate 100 and the shielding unit 20 are aligned, and the shielding unit 20 is placed on the substrate 100 by using a robot arm, etc. In an embodiment, an additional alignment mark is formed on the substrate 100 to accurately position the shielding unit 20. In an embodiment, the shielding unit 20 includes an alignment mark corresponding to the alignment mark of the substrate 100.

[0143] According to an embodiment, the shielding unit 20 is provided on the substrate 100 and then fixed by using the adhesive unit 23. In an embodiment, the adhesive unit 23 is fixed by adhering the adhesive unit 23 to the substrate 100 or an insulating layer, etc.

[0144] According to the embodiment, Figure 9 As shown in FIG, after the shielding unit 20 is fixed, a first functional layer 321, an emission layer 322, a second functional layer 323, an opposite electrode 330, and a cover layer 400 are sequentially formed on the substrate 100 and the shielding unit 20. In an embodiment, the first functional layer 321, the second functional layer 323, the opposite electrode 330, and the cover layer 400 are formed on the top surface of the substrate 100 in at least a portion of the non-display area NDA and the display area DA. The plurality of emission layers 322 are patterned to be spaced apart from each other on the substrate 100 and below the cover layer 400.

[0145] In the embodiment described above, the first functional layer 321A, the emission layer 322A, the second functional layer 323A, the counter electrode 330A, and the cover layer 400A are formed on the shielding unit 20. In the embodiment, the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 are not formed in a portion of the non-display area NDA and the opening area OP of the substrate 100.

[0146] In an embodiment, at least one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 is included in Figure 8 The deposition material evaporates or sublimates in a direction opposite to the Z direction shown in FIG. At least one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 is formed by depositing the deposition material on the substrate 100. In an embodiment, a deposition source for spraying the deposition material is provided in the display area DA. At least a portion of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 formed by spraying the deposition material has a different thickness on the pixel defining layer 112 due to the end portion 22-1 of the second shielding unit 22. In this case, the thickness of at least one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 decreases away from the end portion 22-1 of the second shielding unit 22.

[0147] According to an embodiment, when the above-described process is completed, the shielding unit 20 is removed from the substrate 100. At this time, the first functional layer 321A, the emission layer 322A, the second functional layer 323A, the counter electrode 330A, and the cover layer 400A formed on the shielding unit 20 are removed together with the shielding unit 20. In addition, the adhesive unit 23 can be easily removed from the insulating layer. In an embodiment, when the adhesive unit 23 is removed, the insulating layer is not damaged.

[0148] According to an embodiment, as described above, the thin film encapsulation layer 500 is formed after the shielding unit 20 is removed. The thin film encapsulation layer 500 may be formed after the shielding unit 20 is removed and before the substrate 100 and the buffer layer 101 are removed from the opening region OP, or after the substrate 100 and the buffer layer 101 are removed from the opening region OP. Hereinafter, for convenience of explanation, an embodiment in which the thin film encapsulation layer 500 is formed after the shielding unit 20 is removed and before the substrate 100 and the buffer layer 101 are removed from the opening region OP is described in detail.

[0149] Next, according to the embodiment, the base 100 and the buffer layer 101 are removed by using a removing unit L. In the embodiment, the removing unit L applies heat or light, such as laser light, to remove the base 100 and the buffer layer 101 from the opening area OP. In another embodiment, the removing unit L applies mechanical energy by using a drill bit or the like to remove the base 100 and the buffer layer 101 from the opening area OP.

[0150] In the above-described embodiment, since the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 do not extend into the opening area OP, separation of the layers when penetrating the opening area OP can be prevented.

[0151] Specifically, in the related art, when the opening area OP is penetrated by laser light, the distance between the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 increases due to heat from the laser light. In addition, when an additional film is attached to the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400, and laser light is irradiated to remove some layers of the opening area OP or to form a hole, due to the attachment of the thin film, a part of the adhesive member of the film can remain on the uppermost layer, and a part of the uppermost layer is removed together with the film, or separation occurs between the uppermost layer and the layer located below the uppermost layer. Furthermore, in the above-described embodiment, burrs due to the laser light can occur in the counter electrode 330 and contaminate the adjacent area or increase the roughness of the uppermost layer. In this case, since the thin film encapsulation layer 500 can not be firmly attached to the uppermost layer to prevent penetration of oxygen or moisture, the lifespan of the organic light emitting diode 300 can be reduced.

[0152] However, in the display panel 10 according to the embodiment, the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 do not extend into the opening area OP, and the above-mentioned phenomenon does not occur around the opening area OP.

[0153] In addition, according to the embodiment, the display panel 10 is manufactured by using the above-described method, and it is not necessary to remove the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 in the opening area OP. Therefore, not only the manufacturing period of the manufactured display panel 10 can be reduced, but also the defect rate of the manufactured display panel 10 can be reduced.

[0154] Figure 11 is a cross-sectional view of a display panel 10 according to another embodiment. Figure 12 is a cross-sectional view showing a part of a method of manufacturing the display panel 10 shown in FIG. 1. Figure 11 is a cross-sectional view showing a part of a method of manufacturing the display panel 10 shown in FIG. 1. Figure 11and Figure 12 In the figure, reference sign C denotes an imaginary straight line passing through the center of the opening region OP, Figure 11 and Figure 12 the same as those of Figure 6 and Figure 7 the same as those of Figure 6 and Figure 7 the same as those of

[0155] With reference to Figure 11 and Figure 12 According to the embodiment, the substrate 100 does not include a through hole corresponding to the opening region OP. The display layer 200 includes a through hole 200H corresponding to the opening region OP. The thin film encapsulation layer 500 does not include a through hole corresponding to the opening region OP. In this case, the above-described insulating layer is not provided in the opening region OP. In this case, when each insulating layer is formed, the insulating layer of the pixel circuit layer 200B can not be formed in the opening region OP, or alternatively, the shielding unit 20 can be arranged to perform a subsequent operation, and then the insulating layer of the pixel circuit layer 200B can be removed in the opening region OP. Hereinafter, for the convenience of description, the case in which the insulating layer of the pixel circuit layer 200B is not formed in the opening region OP when each insulating layer is formed will be mainly described in detail.

[0156] In the above-described case, the shielding unit 20 is fixed by forming the adhesive unit 23 on the insulating layer in the second non-display region NDA2. Since the shielding unit 20 is the same as or similar to the shielding unit 20 described with reference to Figures 8-10 a detailed description thereof will be omitted.

[0157] According to the embodiment, the display panel 10 can be manufactured the same as or similarly to the display panel 10 described with reference to Figures 8-10

[0158] According to the embodiment, after the pixel electrode 310 is formed and the shielding unit 20 covering the opening region OP and the second non-display region NDA2 is formed, the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 are sequentially formed. In the embodiment, the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 are sequentially stacked on the shielding unit 20. Further, in the embodiment, the second shielding unit 22 is spaced apart above the display panel 10 and does not contact the upper layer of the display panel 10, and does not damage the layers of the display panel 10 when the display panel 10 is manufactured. Next, the shielding unit 20 is removed.

[0159] The display panel 10 according to the embodiment can be manufactured by forming the thin film encapsulation layer 500 on the substrate 100 after the shielding unit 20 is removed.​

[0160] According to the embodiment, therefore, in the display panel 10, separation of layers when forming a hole can be minimized by not forming an additional hole in the opening region OP. In addition, since at least one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 does not extend into the opening region OP, the opening region OP of the display panel 10 can have an increased light transmittance.

[0161] According to the embodiment, the display panel 10 can be quickly manufactured by the above-described method, and the manufactured display panel 10 has a high light transmittance in the opening region OP.

[0162] Figure 13 is a cross-sectional view of a display panel 10 according to another embodiment. Figure 14 is a cross-sectional view showing a part of a method of manufacturing a display panel 10 shown in Figure 13 is a cross-sectional view showing a part of a method of manufacturing a display panel 10 shown in Figure 13 and Figure 14 In Figures 13-14 , the reference sign C denotes an imaginary straight line passing through the center of the opening region OP, Figure 6 , the reference signs in Figure 7 and Figure 6 denote the same members as those in Figure 7 and

[0163] Referring to Figure 13 and Figure 14 , according to the embodiment, the display layer 200 does not include a through-hole 200H corresponding to the opening region OP, and a display element layer 200A is not formed in the opening region OP. In this case, a pixel circuit layer 200B of the display layer 200 or an insulating layer of the pixel circuit layer 200B is formed in the opening region OP.

[0164] The method of manufacturing the display panel 10 according to the embodiment as described above is similar to the method described with reference to Figure 11 and Figure 12 . Specifically, after the pixel electrode 310 is formed, the shielding unit 20 is formed, and the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 are sequentially stacked on the substrate 100 and the shielding unit 20. In the embodiment, the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 are formed in the display region DA and on the shielding unit 20 but not in the opening region OP. In addition, the adhesive unit 23 completely shields the opening region OP and adheres the first shielding unit 21 to the insulating layer, thereby preventing the shielding unit 20 from moving. Next, the shielding unit 20 is removed and the thin film encapsulation layer 500 is formed.

[0165] According to the embodiment, therefore, in the display panel 10, separation between layers when forming a hole can be minimized by not forming an additional hole in the opening region OP. In addition, since at least one of the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 does not extend into the opening region OP, the opening region OP of the display panel 10 has an increased light transmittance.

[0166] The display panel 10 according to the embodiment can be manufactured quickly in the above-described method, and the manufactured display panel 10 has a high light transmittance in the opening region OP.

[0167] Figure 15 is a cross-sectional view of a display panel 10' according to another embodiment. In Figure 15 In the Figure 15 In the Figure 6 The same reference numerals as those of Figure 7 The same reference numerals as those of Figure 6 The same reference numerals as those of Figure 7 The same reference numerals as those of

[0168] Referring to Figure 15 According to the embodiment, unlike the display panel 10 described above including the thin film encapsulation layer 500, the display panel 10' to be described below includes an encapsulation substrate 500A and a sealing unit 700.

[0169] According to the embodiment, one or more of the substrate 100, the display layer 200, and the encapsulation substrate 500A include through-holes 100H, 200H, and 500AH each corresponding to the opening region OP. The display layer 200 is not formed in the opening region OP.

[0170] According to the embodiment, the substrate 100 includes glass or a polymer resin. The polymer resin includes one of polyether sulfone, polyacrylate, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate, etc. The substrate 100 has a multi-layer structure including an inorganic layer and the above-described polymer resin. Hereinafter, for convenience of explanation, an embodiment in which the substrate 100 includes glass will be described in detail.

[0171] According to the embodiment, the sealing unit 700 is formed between the substrate 100 and the encapsulation substrate 500A. In the embodiment, the sealing unit 700 is not formed over the opening region OP. However, the embodiment of the sealing unit 700 is not limited thereto, and in another embodiment, the sealing unit 700 is formed in the opening region OP and the second non-display region NDA2. In this case, the sealing unit 700Figure 4 SAR) completely covers the opening region OP in a plan view.

[0172] According to an embodiment, the packaging substrate 500A is disposed opposite to the substrate 100. In an embodiment, the packaging substrate 500A includes a material identical to or similar to that of the substrate 100. Specifically, the packaging substrate 500A includes glass. In another embodiment, the packaging substrate 500A includes plastic. In this case, the packaging substrate 500A includes at least one layer including at least one resin.

[0173] In the above-described embodiment, the sealing unit 700 firmly bonds the substrate 100 and the packaging substrate 500A.

[0174] Figures 16-22 is a cross-sectional view showing a method of manufacturing the display panel 10' shown in Figure 15 In Figures 16-22 , the reference sign C denotes an imaginary straight line passing through the center of the opening region OP, Figures 16-22 In Figure 6 and Figure 7 , those reference signs identical to those of Figure 6 and Figure 7 denote members identical to those of

[0175] Referring to Figures 16-22 , according to an embodiment, after the pixel electrode 310 is formed on the substrate 100, the shielding unit 20 corresponding to the opening region OP and the second non-display region NDA2 is formed. In this case, the above-described insulating layer can or can not be formed in the opening region OP. Hereinafter, for convenience of explanation, an embodiment in which the insulating layer is not formed in the opening region OP will be described in detail.

[0176] According to an embodiment, dummy wires 220 are formed in the first non-display region NDA1 and the second non-display region NDA2 when the source electrodes S1 and S2 and the drain electrodes D1 and D2 are manufactured. Specifically, the dummy wires 220 are formed in a portion of the substrate 100 in which the sealing unit 700 is to be formed.

[0177] According to an embodiment, the adhesive unit 23 is formed outside the dummy wiring 220. For example, the adhesive unit 23 is formed closer to the line C in the X direction than the dummy wiring 220 to shield the opening region OP. In this case, the adhesive unit 23 has a form of a ring or a plurality of bumps spaced apart from each other. In another embodiment, the adhesive unit 23 has a form of a plate or a flat film. In another embodiment, the adhesive unit 23 is formed between the dummy wiring 220 and the OLED 300. In this case, the adhesive unit 23 has a form of a ring or bumps spaced apart from each other as described above. Hereinafter, for convenience of explanation, an embodiment in which the adhesive unit 23 is formed outside the dummy wiring 220 will be described in detail.

[0178] Now, referring to Figure 17 , according to an embodiment, when the shielding unit 20 is formed, the first functional layer 321 is formed on the substrate 100 and the first functional layer 321A is formed on the shielding unit 20. In this case, the thickness of the end portion 321-1 of the first functional layer 321 decreases toward the dummy wiring 220.

[0179] Now, referring to Figure 18 , according to an embodiment, a plurality of emission layers 322 are patterned on the first functional layer 321 and formed to be spaced apart from each other. In this case, the emission layers 322 are formed in the display region DA, and the emission layers 322A are formed in the shielding unit 20.

[0180] Now, referring to Figure 19 , according to an embodiment, like the first functional layer 321, the second functional layer 323 is formed in a part of the second non-display region NDA2 and the entire part of the display region DA, and the second functional layer 323A is formed in a part of the second non-display region NDA2 and the opening region OP. In this case, the second functional layer 323 shields the emission layers 322. Further, due to the shielding unit 20, the second functional layer 323 is not formed in at least a part of the opening region OP and the second non-display region NDA2 of the substrate 100.

[0181] Now, referring to Figure 20 , according to an embodiment, the counter electrode 330 and the cover layer 400 are sequentially formed on the second functional layer 323 after the second functional layer 323 is formed.

[0182] In the above-described embodiment, the thickness of the end portion of the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 decreases toward the dummy wiring 220 similarly to the thickness of the end portion 321-1 of the first functional layer 321.

[0183] According to an embodiment, the shielding unit 20 is removed after the first functional layer 321, the emission layer 322, the second functional layer 323, the counter electrode 330, and the cover layer 400 are formed as described above. In this case, a part of the bonding unit 23 remains in the opening region OP.

[0184] Now, referring to Figure 21 , according to an embodiment, the sealing unit 700 is formed on the dummy wiring 220 after the shielding unit 20 is removed. Next, the package substrate 500A is formed to be opposite to the substrate 100, and a voltage is applied to the dummy wiring 220, and the package substrate 500A and the substrate 100 are bonded to each other by the sealing unit 700. Embodiments of the sealing unit 700 are not limited thereto, and when the dummy wiring 220 is not provided, the sealing unit 700 is cured by laser or external light. Next, as shown in Figure 22 , portions of the package substrate 500A and the substrate 100 corresponding to the opening region OP are removed by using the removing unit L.

[0185] Figure 23 is a cross-sectional view of a display panel 10' according to another embodiment. In Figure 23 , the reference sign C denotes an imaginary straight line passing through the center of the opening region OP, Figure 23 , those reference signs shown in Figure 6 and Figure 7 that are the same as those of Figure 6 and Figure 7 denote the same members as those of

[0186] Referring to Figure 23 , according to an embodiment, in the display panel 10', the through-hole 500AH is formed in the package substrate 500A. In addition, the display element layer 200A and the pixel circuit layer 200B are not formed in the opening region OP.

[0187] According to an embodiment, the above-described display panel 10' can be manufactured similarly to the display panel 10' shown in Figures 16-21 . In this case, the through-hole 500AH of the package substrate 500A is formed by using the removing unit L.

[0188] Figure 24 is a cross-sectional view of a display panel 10' according to another embodiment. In Figure 24 , the reference sign C denotes an imaginary straight line passing through the center of the opening region OP, Figure 24 , those reference signs shown in Figure 6 and Figure 7 that are the same as those of Figure 6 and Figure 7 denote the same members as those of

[0189] Referring to Figure 24 , according to the embodiment, in the display panel 10', a through-hole is not formed in the opening region OP. In this case, although the display element layer 200A is not formed in the opening region OP, the pixel circuit layer 200B is formed in the opening region OP. In addition, the sealing unit 700 is formed in the first non-display region NDA1.

[0190] In the embodiment, the display panel 10' can be manufactured similarly to the display panel 10' described with reference to Figures 16-22 .

[0191] Figure 25 is a perspective view of the shielding unit 20 used when manufacturing the display panel 10 according to the embodiment.

[0192] Referring to Figure 25 , according to the embodiment, the shielding unit 20 includes the first shielding unit 21, the second shielding unit 22, and the adhesive unit 23. In this case, the first shielding unit 21 and the second shielding unit 22 are illustrated as having a three-dimensional shape. For example, the first shielding unit 21 protrudes from the second shielding unit 22. In this case, an internal space is provided in the first shielding unit 21. Specifically, a cross section of the shielding unit 20 in a height direction (such as the Z direction illustrated in Figure 25 , has an uneven shape.

[0193] The first shielding unit 21 described above can have various shapes. For example, a cross-sectional shape of the first shielding unit 21 perpendicular to the height direction of the first shielding unit 21 can be semicircular, circular, elliptical, polygonal, or crescent. In this case, the cross section of the first shielding unit 21 perpendicular to the height direction of the first shielding unit 21 corresponds to the shape of the opening region OP.

[0194] According to the embodiment, the second shielding unit 22 has a larger circumference than the first shielding unit 21. In this case, the second shielding unit 22 protrudes from the first shielding unit 21.

[0195] According to the embodiment, the adhesive unit 23 is formed in the first shielding unit 21. In this case, the adhesive unit 23 has the form of a ring, and the internal space of the first shielding unit 21 is surrounded by the adhesive unit 23 in a plan view.

[0196] In the embodiment, the opening region OP described above is formed in the internal space surrounded by the adhesive unit 23. In this case, the adhesive unit 23 is formed in the second non-display region NDA2 described above.

[0197] In another embodiment, the adhesive unit 23 is formed in the opening area OP. In this case, when a hole is formed in the opening area OP, the portion of the adhesive unit 23 remaining in the opening area OP is removed when the hole is formed in the opening area OP.

[0198] In another embodiment, the adhesive unit 23 is formed in both the opening area OP and the second non-display area NDA2. In this case, a portion of the opening area OP is formed in the inner space of the adhesive unit 23.

[0199] Figure 26 is a perspective view of another shielding unit 20' used when manufacturing the display panel 10' according to an embodiment.

[0200] Referring to Figure 26 According to an embodiment, the shielding unit 20' includes a first shielding unit 21, a second shielding unit 22, and an adhesive unit 23.

[0201] According to an embodiment, no inner space is formed in the first shielding unit 21. In this case, the first shielding unit 21 has the form of a column, and the second shielding unit 22 has a planar shape.

[0202] According to an embodiment, a plurality of adhesive units 23 spaced apart from each other are disposed along a circle in the first shielding unit 21. In this case, the plurality of adhesive units 23 are arranged on the same circumference. In another embodiment, the plurality of adhesive units 23 are disposed in a line from the center of the first shielding unit 21 to the outer surface of the first shielding unit 21. Embodiments of the plurality of adhesive units 23 are not limited thereto, and in other embodiments, the adhesive units 23 can be arranged to form a pattern or be randomly arranged on the first shielding unit 21.

[0203] According to an embodiment, the plurality of adhesive units 23 are arranged at a plurality of locations.

[0204] In an embodiment, when the plurality of adhesive units 23 form an inner space, the above-described opening area OP substantially corresponds to the inner space formed by the plurality of adhesive units 23. In addition, the plurality of adhesive units 23 are arranged in the above-described second non-display area NDA2.

[0205] In another embodiment, the plurality of adhesive units 23 can be spaced apart from each other in the opening area OP. In this case, when a hole is formed in the opening area OP, the portion of the adhesive unit 23 remaining in the opening area OP is removed when the hole is formed in the opening area OP.

[0206] In another embodiment, the plurality of adhesive units 23 are spaced apart from each other in the opening area OP and the second non-display area NDA2.

[0207] Figure 27 is a perspective view of another shielding unit 20" used when manufacturing a display panel according to an embodiment.

[0208] Referring to Figure 27 , according to an embodiment, the shielding unit 20" includes a first shielding unit 21, a second shielding unit 22, and an adhesive unit 23.

[0209] According to an embodiment, the adhesive unit 23 is formed on a surface of the first shielding unit 21. In this case, the adhesive unit 23 is formed as one body.

[0210] According to an embodiment, the adhesive unit 23 can be disposed at a plurality of positions.

[0211] In an embodiment, the shielding unit 20" is disposed in the opening area OP to shield the opening area OP. In this case, the adhesive unit 23 remaining in the opening area OP is removed when the shielding unit 20 is removed and when the through-hole is formed in the opening area OP.

[0212] In another embodiment, the adhesive unit 23 is also disposed in the opening area OP. In this case, the adhesive unit 23 is removed when the hole is formed in the opening area OP.

[0213] In another embodiment, the adhesive unit 23 is formed in the opening area OP and the second non-display area NDA2. In this case, the adhesive unit 23 shields the opening area OP.

[0214] The display apparatus according to an embodiment has a flat surface, and the lifespan of the display apparatus is increased due to prevention of permeation of oxygen and moisture.

[0215] The method of manufacturing a display apparatus according to an embodiment can minimize defects in the display apparatus. In addition, a display apparatus having an increased lifespan can be manufactured by the method of manufacturing a display apparatus according to an embodiment.

[0216] It should be understood that the exemplary embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each exemplary embodiment should typically be considered as being applicable to other similar features or aspects in other exemplary embodiments. While one or more exemplary embodiments have been described above with various features and / or benefits in mind, no element, component, or method or combination thereof, from any of the exemplary embodiments is intended to be mandatory in all embodiments, and one or more from a exemplary embodiment can be combined with or subtracted from exemplary embodiments without departing from the scope of the claims.

Claims

1. A display device, comprising: a substrate comprising a display area, an opening area in the display area, and a non-display area surrounding at least a portion of the opening area; a pixel defining layer, located on the substrate and comprising at least one opening; an intermediate layer disposed in the at least one opening; a counter electrode, covering the intermediate layer and the pixel defining layer; as well as a covering layer covering the counter electrode, In which, at least one of the intermediate layer, the counter electrode and the covering layer is only arranged in the display area and the portion of the non-display area adjacent to the display area, and is not arranged in the portion of the non-display area adjacent to the opening area, and the end of the at least one of the intermediate layer, the counter electrode and the covering layer is arranged on the upper surface of the pixel defining layer, and has a thickness that decreases toward the opening area of ​​the substrate on the upper surface of the pixel defining layer.

2. The display device according to claim 1, wherein The intermediate layer includes at least one of a first functional layer and a second functional layer.

3. The display device according to claim 1, wherein The intermediate layer, the counter electrode, and the cover layer are sequentially stacked on the pixel defining layer. 4 . The display device of claim 1 , further comprising an encapsulation substrate disposed on and spaced above the substrate. 5 . The display device according to claim 1 , further comprising a thin film encapsulation layer disposed on the cover layer. The display device according to claim 1 , wherein: A penetration hole is formed in the opening region.

7. A method for manufacturing a display device, the method comprising: forming a pixel defining layer on a substrate, wherein the substrate comprises an opening area and a non-display area at least partially surrounding the opening area; forming a shielding unit, the shielding unit covering a portion of the pixel defining layer, the opening area, and the non-display area; and forming an intermediate layer, a counter electrode and a covering layer on the pixel defining layer and the shielding unit, Wherein, the shielding unit includes: a first shielding unit, shielding the opening area; and A second shielding unit is spaced above the upper surface of the pixel defining layer, and a portion of the first shielding unit is bent in a direction away from the substrate and connected to the second shielding unit.

8. The method according to claim 7, wherein: The first shielding unit and the second shielding unit are formed at different heights, respectively. 9 . The method of claim 7 , further comprising removing the shielding unit from the substrate.

10. A method for manufacturing a display device, the method comprising: forming a pixel defining layer on a substrate, wherein the substrate comprises an opening area and a non-display area at least partially surrounding the opening area; forming a shielding unit, the shielding unit covering a portion of the pixel defining layer, the opening area, and the non-display area; forming an intermediate layer, a counter electrode, and a covering layer on the pixel defining layer and the shielding unit; and removing the shielding unit from the substrate, The shielding unit includes an adhesive unit formed between the shielding unit and the substrate.

11. The method according to claim 10, wherein: At least a portion of the adhesive unit is formed in the non-display area. 12 . The method according to claim 7 , further comprising forming a packaging substrate over and separately from the substrate, and attaching the packaging substrate to the substrate. 13 . The method according to claim 7 , further comprising forming a thin film encapsulation layer on the pixel defining layer.

14. The method according to claim 7 or 10, further comprising forming a through-hole in the substrate.

15. A method for manufacturing a display device, the method comprising: forming a pixel defining layer on a substrate, wherein the substrate includes a display area, an opening area located in the display area, and a non-display area at least partially surrounding the opening area; and attaching a shielding unit to the opening area or the non-display area, the shielding unit shielding a portion of the pixel defining layer, the opening area, and the non-display area, wherein the first portion of the shielding unit is spaced apart from the pixel defining layer, and A portion of the second portion of the shielding unit is bent in a direction away from the substrate and connected to the first portion of the shielding unit, so that the first portion of the shielding unit is formed at a height different from that of the second portion of the shielding unit.

16. The method according to claim 15, further comprising: An intermediate layer, a counter electrode, and a covering layer are formed on the pixel defining layer and the shielding unit.

17. The method according to claim 15, wherein: The shielding unit is attached to the display area or the non-display area.

18. The method according to claim 15, wherein The shielding unit is attached to the display area or the non-display area at a plurality of locations in the display area or the non-display area, wherein the plurality of locations are spaced apart from each other.

19. The method according to claim 15, wherein The shielding unit is attached to the non-display area and covers the opening area.

20. The method of claim 15, further comprising removing the shielding unit from the substrate. 21 . The method according to claim 15 , further comprising forming a packaging substrate over the substrate to be spaced apart from the substrate, and combining the packaging substrate with the substrate. 22 . The method of claim 15 , further comprising forming a thin film encapsulation layer on the pixel defining layer.

23. The method of claim 15, further comprising forming a through-hole in the substrate.

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