A display device and a manufacturing method thereof

Abstract

The present invention discloses a display device and a manufacturing method thereof, so as to improve the double-panel structure of the prior art, which has the problem of fragile edges and poor heat dissipation effect of the control IC at the edge. The display device comprises: a first array substrate, a first opposing substrate, a second array substrate, and a second opposing substrate stacked in sequence; the first array substrate has a first overlapping portion overlapping with the first opposing substrate, and a first extension portion extending from the first overlapping portion, the second array substrate has a second overlapping portion overlapping with the second opposing substrate, and a second extension portion extending from the second overlapping portion; a first control IC is arranged on the side of the first extension portion facing the second extension portion, and a second control IC is arranged on the side of the second extension portion facing away from the first extension portion; the space between the first extension portion and the second extension portion is filled with a heat dissipation component at least in the area where the first control IC is located.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display device and a manufacturing method thereof. Background Art

[0002] With the development of LCD TV technology, users have higher and higher requirements for picture quality. Double-layer display panel technology is a new type of LCD display technology. Compared with conventional LCD modules, it adds an additional LCD panel to increase the control ability of backlight flux, which can greatly improve the contrast of LCD TVs and thus enhance consumer experience.

[0003] However, the double-sided board structure in the prior art has the problem that the edges are fragile and the heat dissipation effect of the control IC at the edges is poor. Summary of the invention

[0004] The present invention provides a display device and a manufacturing method thereof, so as to improve the double-panel structure of the prior art, which has the problems of fragile edges and poor heat dissipation effect of a control IC at the edges.

[0005] An embodiment of the present invention provides a display device, comprising: a first array substrate, a first opposing substrate, a second array substrate, and a second opposing substrate stacked in sequence; the first array substrate has a first overlapping portion overlapping with the first opposing substrate, and a first extension portion extending from the first overlapping portion; the second array substrate has a second overlapping portion overlapping with the second opposing substrate, and a second extension portion extending from the second overlapping portion; a first control IC is disposed on a side of the first extension portion facing the second extension portion, and a second control IC is disposed on a side of the second extension portion facing away from the first extension portion;

[0006] The space between the first extension portion and the second extension portion is filled with a heat dissipation component at least in the area where the first control IC is located.

[0007] In a possible implementation manner, the entire space between the first extension portion and the second extension portion is filled with the heat dissipation component, and a shape of the heat dissipation component is complementary to a shape of the entire space.

[0008] In a possible implementation manner, the heat dissipation component has a first recessed portion that matches the shape of the first control IC at the position where the first control IC is located, and the first control IC is embedded in the first recessed portion.

[0009] In a possible implementation manner, a first flexible circuit board is provided on a side of the first extension portion facing the second extension portion, and the first flexible circuit board is located on a side of the first control IC away from the first opposing substrate;

[0010] The heat dissipation component has a second recessed portion matching the shape of the first flexible circuit board at a position where the first flexible circuit board is located, and the first flexible circuit board is embedded in the second recessed portion.

[0011] In a possible implementation manner, an optical adhesive is disposed between the first opposing substrate and the second array substrate; the first opposing substrate has a third overlapping portion overlapping with the optical adhesive, and a third extension portion extending from the third overlapping portion;

[0012] The heat dissipation component has a third recessed portion at a position corresponding to the third extension portion, the third extension portion matching the shape of the third extension portion, and the third extension portion is embedded in the third recessed portion.

[0013] In a possible implementation manner, a first polarizer is disposed between the optical adhesive and the second array substrate, and the first polarizer overlaps with the optical adhesive;

[0014] In the direction from the first extension portion to the second extension portion, the thickness of the heat dissipation component in the area where the third recessed portion is located is equal to the sum of the thicknesses of the optical adhesive and the first polarizer.

[0015] In a possible implementation, in a direction from the first extension portion to the second extension portion, the depth of the third recessed portion is greater than the depth of the first recessed portion; and the depth of the first recessed portion is greater than the depth of the second recessed portion.

[0016] In a possible implementation manner, a second polarizer is further provided on a side of the first array substrate facing away from the first opposing substrate; and a third polarizer is further provided on a side of the second opposing substrate facing away from the second array substrate.

[0017] In a possible implementation, the heat dissipation component is made of foam.

[0018] In a possible implementation manner, the foam is in a compressed state.

[0019] In a possible implementation, the heat dissipation component is made of thermal conductive silicone grease.

[0020] The embodiment of the present invention further provides a method for manufacturing the display device provided by the embodiment of the present invention, comprising:

[0021] Aligning the first array substrate with the first opposing substrate, and aligning the second array substrate with the second opposing substrate, wherein the first array substrate has a first overlapping portion overlapping with the first opposing substrate, and a first extension portion extending from the first overlapping portion, and the second array substrate has a second overlapping portion overlapping with the second opposing substrate, and a second extension portion extending from the second overlapping portion;

[0022] forming a first control IC on the first extension portion of the first array substrate, and forming a second control IC on the second extension portion of the second array substrate;

[0023] A surface of the first opposing substrate facing away from the first array substrate is aligned and bonded with a surface of the second array substrate facing away from the second opposing substrate, and a heat dissipation component is filled in the space between the first extension portion and the second extension portion.

[0024] In a possible implementation manner, the heat dissipation component is foam; the second array substrate and the first opposing substrate, which are formed between the first extension portion and the second extension portion and have the heat dissipation component and are bonded to each other, include:

[0025] Attaching the foam to the first extension;

[0026] Adhere optical adhesive to a side of the first opposing substrate away from the first array substrate;

[0027] A surface of the first opposing substrate facing away from the first array substrate is aligned and laminated with a surface of the second array substrate facing away from the second opposing substrate.

[0028] In a possible implementation, attaching the foam on the first extension portion includes: attaching the foam on the first extension portion, and making the height of the attached foam in a direction perpendicular to the first extension portion greater than the height of the optical adhesive in a direction perpendicular to the first extension portion.

[0029] In a possible implementation manner, the heat dissipation component is thermally conductive silicone grease; the second array substrate and the first opposing substrate having the heat dissipation component formed between the first extension portion and the second extension portion and attached to each other include:

[0030] Adhere optical adhesive to a side of the first opposing substrate away from the first array substrate;

[0031] Aligning and laminating a surface of the first opposing substrate that is away from the first array substrate and a surface of the second array substrate that is away from the second opposing substrate;

[0032] Thermal conductive silicone grease is injected into the space between the first extension portion and the second extension portion.

[0033] In a possible implementation manner, when the thermal conductive silicone grease is injected into the space between the first extension portion and the second extension portion, the manufacturing method further includes: scraping off excess thermal conductive silicone grease at the edge in a semi-cured state.

[0034] In a possible implementation manner, when a first control IC is formed on the first epitaxial portion of the first array substrate, and a second control IC is formed on the second epitaxial portion of the second array substrate, the manufacturing method further includes:

[0035] A first flexible circuit board is bound to the first extension portion of the first array substrate, and a second flexible circuit board is bound to the second extension portion of the second array substrate.

[0036] The beneficial effects of the embodiments of the present invention are as follows: In the embodiments of the present invention, the space between the first extension portion and the second extension portion is filled with a heat dissipation component at least in the area where the first control IC is located. On the one hand, the lower frame of the second array substrate is no longer in a suspended state, thereby enhancing the overall anti-seismic reliability of the display device. At the same time, during the transportation process, the lower frame is effectively prevented from being crushed. On the other hand, for the first control IC, since the second array substrate, the second opposing substrate, and the second control IC located on the second array substrate are arranged above the first array substrate, the heat dissipation area is limited, which increases the heat of the second control IC. In the embodiments of the present invention, the heat dissipation problem of the first control IC and the second control IC can be effectively solved by using heat dissipation glue, thereby improving the high-temperature reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic cross-sectional view of a display device provided by an embodiment of the present invention;

[0038] Figure 2 A schematic cross-sectional view of a specific display device provided by an embodiment of the present invention;

[0039] Figure 3 A schematic diagram of a top view of a first liquid crystal box provided by an embodiment of the present invention;

[0040] Figure 4 A schematic cross-sectional view of a heat dissipation component provided by an embodiment of the present invention;

[0041] Figure 5 A schematic diagram of a top view of a heat dissipation component provided by an embodiment of the present invention;

[0042] Figure 6 A schematic diagram of a manufacturing process of a display device provided by an embodiment of the present invention;

[0043] Figure 7 A schematic diagram of a specific manufacturing process of a display device provided by an embodiment of the present invention;

[0044] Figure 8 A schematic diagram of a manufacturing process of another specific display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0046] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0047] In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of well-known functions and well-known components.

[0048] See also Figure 1 The embodiment of the present invention provides a display device, comprising: a first array substrate 11, a first opposing substrate 12, a second array substrate 21, and a second opposing substrate 22 stacked in sequence; the first array substrate 11 has a first overlapping portion 111 overlapping with the first opposing substrate 12, and a first extension portion 112 extending from the first overlapping portion 111, and the second array substrate 21 has a second overlapping portion 211 overlapping with the second opposing substrate 22, and a second extension portion 212 extending from the second overlapping portion 211; a first control IC 13 is disposed on a side of the first extension portion 112 facing the second extension portion 212, and a second control IC 23 is disposed on a side of the second extension portion 212 facing away from the first extension portion 112;

[0049] The space between the first extension portion 112 and the second extension portion 212 is filled with a heat dissipation component 5 at least in the area where the first control IC 13 is located.

[0050] In the embodiment of the present invention, the space between the first extension portion 112 and the second extension portion 212 is filled with a heat dissipation component 5 at least in the area where the first control IC 13 is located. On the one hand, the lower frame of the second array substrate 21 is no longer in a suspended state, thereby enhancing the overall anti-seismic reliability of the display device. At the same time, during the transportation process, the lower frame is effectively prevented from being crushed. Another invention is that for the first control IC 13, since the second array substrate 21, the second opposing substrate 22, and the second control IC 23 located on the second array substrate 21 are arranged above the first array substrate 11, the heat dissipation area is limited, which increases the heat of the second control IC 23. In the embodiment of the present invention, the heat dissipation problem of the first control IC 13 and the second control IC 23 can be effectively solved by using heat dissipation glue, thereby improving the high-temperature reliability of the product.

[0051] In a specific implementation, the first array substrate 11 and the first opposing substrate can form a first liquid crystal cell, and the second array substrate 21 and the second opposing substrate 22 can form a second liquid crystal cell. The first liquid crystal cell can be used as a black and white display panel (Monocell), and the second liquid crystal cell can be used as a color display panel (Color cell).

[0052] In a specific implementation, the heat dissipation component 5 may be arranged only in the space where the first control IC 13 is located, or in the space where the first control IC 13 is located. Figure 2 As shown, the entire space between the first extension portion 112 and the second extension portion 212 is filled with a heat dissipation component 5, and the shape of the heat dissipation component 5 is complementary to the shape of the entire space. In the embodiment of the present invention, the entire space between the first extension portion 112 and the second extension portion 212 is filled with a heat dissipation component 5, which can enable the display device to have the best effect of preventing the frame from being easily broken and quickly dissipating heat.

[0053] In specific implementation, combined with Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, Figure 3 is a schematic top view of a first liquid crystal box, Figure 5 is a schematic top view of the heat dissipation component 5 . The heat dissipation component 5 has a first recessed portion 51 matching the shape of the first control IC 13 at the location where the first control IC 13 is located. The first control IC 13 is embedded in the first recessed portion 51 .

[0054] In specific implementation, combined with Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, a first flexible circuit board 14 is provided on one side of the first extension portion 112 facing the second extension portion 212, and the first flexible circuit board 14 is located on the side of the first control IC 13 away from the first counter substrate 12; the heat dissipation component 5 has a second recessed portion 52 matching the shape of the first flexible circuit board 14 at the position where the first flexible circuit board 14 is located, and the first flexible circuit board 14 is embedded in the second recessed portion 52. It should be understood that the shape of the second recessed portion 52 matches the shape of the first flexible circuit board 14, which should be understood as the shape of the second recessed portion 52 matches the portion of the first flexible circuit board 14 located at the first extension portion 112.

[0055] In specific implementation, combined with Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, an optical adhesive 3 is disposed between the first counter substrate 12 and the second array substrate 21; the first counter substrate 12 has a third overlapping portion 121 overlapping with the optical adhesive 3, and a third extension portion 122 extending from the third overlapping portion 121; the heat dissipation component 5 has a third recessed portion 53 matching the shape of the third extension portion 122 at a position corresponding to the third extension portion 122, and the third extension portion 122 is embedded in the third recessed portion 53. It should be understood that the shape of the third recessed portion 53 matches the shape of the third extension portion 122, which should be understood as the shape of the third recessed portion 53 matches the portion of the third extension portion 122 located on the first counter substrate 12.

[0056] In specific implementation, combined with Figure 2 As shown, a first polarizer 41 is arranged between the optical glue 3 and the second array substrate 21, and the first polarizer 41 overlaps with the optical glue 3; in the direction AB from the first extension portion 112 to the second extension portion 212, the thickness of the heat dissipation component 5 in the area where the third recessed portion 53 is located is the same as the sum of the thicknesses of the optical glue 3 and the first polarizer 41, that is, h1=h2+h3.

[0057] In specific implementation, combined with Figure 2 or Figure 4 As shown, in the direction AB from the first extension portion 112 to the second extension portion 212 , the depth h4 of the third recessed portion 53 is greater than the depth h6 of the first recessed portion 51 ; the depth h6 of the first recessed portion 51 is greater than the depth h5 of the second recessed portion 52 .

[0058] In specific implementation, combined with Figure 2 As shown, a second polarizer 42 is further disposed on the side of the first array substrate 11 facing away from the first opposing substrate 12 ; a third polarizer 43 is further disposed on the side of the second opposing substrate 22 facing away from the second array substrate 21 .

[0059] In a specific implementation, the heat dissipation component 5 may be made of foam. Specifically, the foam is in a compressed state. When the heat dissipation component 5 is made of foam, the height of the foam can be made greater than the height of the optical adhesive 3 attached to the side of the first counter substrate 12 away from the first array substrate 11, so that the foam is firmly located in the space between the first extension portion 112 and the second extension portion 212.

[0060] In a specific implementation, the heat dissipation component 5 may also be made of thermal conductive silicone grease.

[0061] Based on the same inventive concept, see Figure 6 As shown, the embodiment of the present invention further provides a method for manufacturing a display device provided by the embodiment of the present invention, comprising:

[0062] Step S100, aligning the first array substrate with the first opposing substrate, aligning the second array substrate with the second opposing substrate, the first array substrate having a first overlapping portion overlapping with the first opposing substrate, and a first extension portion extending from the first overlapping portion, and the second array substrate having a second overlapping portion overlapping with the second opposing substrate, and a second extension portion extending from the second overlapping portion;

[0063] Step S200, forming a first control IC on a first epitaxial portion of a first array substrate, and forming a second control IC on a second epitaxial portion of a second array substrate;

[0064] Step S300 , forming a second array substrate and a first opposing substrate having a heat dissipation component between the first extension portion and the second extension portion and being bonded to each other.

[0065] In the specific implementation, when the heat dissipation component is foam; for step S300, that is, forming a second array substrate and a first opposing substrate having a heat dissipation component between the first extension portion and the second extension portion and being bonded to each other, see Figure 7 As shown, it may specifically include:

[0066] Step S310, attaching foam to the first extension portion; specifically, attaching foam to the first extension portion includes: attaching foam to the first extension portion, and making the height of the attached foam in a direction perpendicular to the first extension portion greater than the height of the optical adhesive in a direction perpendicular to the first extension portion, so as to facilitate the foam to be firmly located in the space between the first extension portion 112 and the second extension portion 212;

[0067] Step S320, attaching optical adhesive to a side of the first counter substrate away from the first array substrate;

[0068] Step S330 , aligning and laminating a surface of the first opposing substrate that is away from the first array substrate and a surface of the second array substrate that is away from the second opposing substrate.

[0069] Specifically, when the heat dissipation component is foam, the manufacturing method of the display device can be specifically as follows: after the first liquid crystal box (after the first array substrate and the first counter substrate are aligned) and the second liquid crystal box (after the second array substrate and the second counter substrate are aligned) are bonded with the flexible circuit board (FPC bonding), the FPC is mounted on the glass panel (film on glass, FOG), and the two FOGs are respectively tested for production. After no obvious defects are found, the next step is the optical adhesive (COA) bonding process. Before bonding, firstly, a thermal conductive foam is attached to the lower frame position of the lower liquid crystal box. The shape of the thermal conductive foam is as follows: Figure 2 As shown, the first control IC 13 position, the first flexible circuit board 14 position and the lower polarizer POL (ie, the first polarizer 41) position of the upper liquid crystal box, the foam at the first control IC 13 position has the same shape as the first control IC 13 are exactly the same in size, ensuring good contact between the thermal conductive foam and the first control IC 13, so that heat can be smoothly dissipated, the position of the first flexible circuit board 14 is consistent with the bonding size of the first flexible circuit board 14 on the first array substrate 11, the position and size of the lower polarizer (i.e., the first polarizer 41) of the upper liquid crystal box are the same as the gap (GAP) between the first opposing substrate 12 (CF glass) of the lower liquid crystal box and the second array substrate of the upper liquid crystal box, and the overall size of the foam is consistent with the size of the lower frame of the first array substrate 11, ensuring that the entire GAP can be completely filled; after attaching the thermal conductive foam, first remove the upper protective film of the lower liquid crystal box and clean it, and at the same time remove the lower protective film of the upper liquid crystal box and clean it in the same way. After cleaning, attach optical glue to the upper surface of the lower liquid crystal box, and the attaching device picks up the upper liquid crystal box and aligns it through a charge coupled device (CCD). After the alignment is completed, the attaching device automatically attaches it.

[0070] In the specific implementation, the heat dissipation component is thermal conductive silicone grease; for step S300, that is, forming a second array substrate and a first opposing substrate having a heat dissipation component between the first extension portion and the second extension portion and being bonded to each other, see Figure 8 As shown, it may specifically include:

[0071] Step S340, attaching optical adhesive to a side of the first opposing substrate away from the first array substrate;

[0072] Step S350, aligning and laminating a surface of the first opposing substrate that is away from the first array substrate and a surface of the second array substrate that is away from the second opposing substrate;

[0073] Step S360, injecting thermal grease into the space between the first epitaxial portion and the second epitaxial portion; specifically, when injecting the thermal grease into the space between the first epitaxial portion and the second epitaxial portion, the manufacturing method further includes: scraping off excess thermal grease at the edge in a semi-cured state.

[0074] Specifically, when the heat dissipation component is thermal grease, the upper and lower liquid crystal boxes become FOG after FPC bonding. After the two FOGs are tested separately and there is no obvious defect, the COA bonding process is carried out. First, the upper protective film of the lower liquid crystal box is removed and cleaned. At the same time, the lower protective film of the upper liquid crystal box is removed and cleaned. After the cleaning is completed, OCA glue is attached to the upper surface of the lower liquid crystal box. The attachment device picks up the upper liquid crystal box and aligns it through the CCD. After the alignment is completed, the attachment device automatically attaches it. After the attachment is completed, since the opposite substrate and the array substrate are not flush, a gap (GAP) is caused in the middle of the upper and lower liquid crystal boxes. If a non-thinned double-layer liquid crystal box is used, the middle GAP is about 1.12mm. If a thinned cell is used, the middle GAP is about 0.32mm. After the upper and lower liquid crystal boxes are bonded, thermal grease is injected into the middle GAP so that the thermal grease can fill the entire GAP. After the filling is completed, the excess thermal silicone on the side is scraped off in a semi-cured state to ensure the neatness of the cell side.

[0075] In a specific implementation, during the manufacturing step S200, a first control IC is formed on a first extension portion of a first array substrate, and a second control IC is formed on a second extension portion of a second array substrate. The manufacturing method further includes: binding a first flexible circuit board to the first extension portion of the first array substrate, and binding a second flexible circuit board to the second extension portion of the second array substrate.

[0076] The beneficial effects of the embodiments of the present invention are as follows: In the embodiments of the present invention, the space between the first extension portion and the second extension portion is filled with a heat dissipation component at least in the area where the first control IC is located. On the one hand, the lower frame of the second array substrate is no longer in a suspended state, thereby enhancing the overall anti-seismic reliability of the display device. At the same time, during the transportation process, the lower frame is effectively prevented from being crushed. On the other hand, for the first control IC, since the second array substrate, the second opposing substrate, and the second control IC located on the second array substrate are arranged above the first array substrate, the heat dissipation area is limited, which increases the heat of the second control IC. In the embodiments of the present invention, the heat dissipation problem of the first control IC and the second control IC can be effectively solved by using heat dissipation glue, thereby improving the high-temperature reliability of the product.

[0077] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A display device, characterized in that: include: A first array substrate, a first opposing substrate, a second array substrate, and a second opposing substrate stacked in sequence; The first array substrate has a first overlapping portion overlapping with the first counter substrate, and a first extension portion extending from the first overlapping portion; the second array substrate has a second overlapping portion overlapping with the second counter substrate, and a second extension portion extending from the second overlapping portion; a first control IC is provided on a side of the first extension portion facing the second extension portion, and a second control IC is provided on a side of the second extension portion facing away from the first extension portion; the second array substrate and the second counter substrate form a second liquid crystal cell; The space between the first extension portion and the second extension portion is filled with a heat dissipation component at least in the area where the first control IC is located.

2. The display device according to claim 1, wherein The entire space between the first extension portion and the second extension portion is filled with the heat dissipation component, and a shape of the heat dissipation component is complementary to a shape of the entire space.

3. The display device according to claim 2, wherein The heat dissipation component has a first recessed portion at a position where the first control IC is located, the first control IC being embedded in the first recessed portion.

4. The display device according to claim 3, wherein A first flexible circuit board is provided on a side of the first extension portion facing the second extension portion, and the first flexible circuit board is located on a side of the first control IC away from the first counter substrate; The heat dissipation component has a second recessed portion at a position where the first flexible circuit board is located, the second recessed portion matching the shape of the first flexible circuit board, and the first flexible circuit board is embedded in the second recessed portion.

5. The display device according to claim 4, wherein An optical adhesive is provided between the first counter substrate and the second array substrate; the first counter substrate has a third overlapping portion overlapping with the optical adhesive, and a third extension portion extending from the third overlapping portion; The heat dissipation component has a third recessed portion at a position corresponding to the third extension portion, the third extension portion being embedded in the third recessed portion.

6. The display device according to claim 5, wherein A first polarizer is provided between the optical adhesive and the second array substrate, and the first polarizer overlaps with the optical adhesive; In a direction from the first extension portion to the second extension portion, a thickness of the heat dissipation component in a region where the third recessed portion is located is equal to a sum of thicknesses of the optical adhesive and the first polarizer.

7. The display device according to claim 6, wherein In a direction from the first extension portion to the second extension portion, the depth of the third recessed portion is greater than the depth of the first recessed portion; and the depth of the first recessed portion is greater than the depth of the second recessed portion.

8. The display device according to claim 5, wherein A second polarizer is further provided on a side of the first array substrate facing away from the first opposing substrate; and a third polarizer is further provided on a side of the second opposing substrate facing away from the second array substrate.

9. The display device according to any one of claims 1 to 8, wherein: The heat dissipation component is made of foam.

10. The display device according to claim 9, wherein The foam is in a compressed state.

11. The display device according to any one of claims 1 to 8, wherein: The heat dissipation component is made of thermal conductive silicone grease.

12. A method for manufacturing a display device according to any one of claims 1 to 11, characterized in that: include: Aligning a first array substrate with a first opposing substrate, and aligning a second array substrate with a second opposing substrate, wherein the first array substrate has a first overlapping portion overlapping with the first opposing substrate, and a first extension portion extending from the first overlapping portion, and the second array substrate has a second overlapping portion overlapping with the second opposing substrate, and a second extension portion extending from the second overlapping portion; forming a first control IC on the first extension portion of the first array substrate, and forming a second control IC on the second extension portion of the second array substrate; The second array substrate and the first counter substrate are formed so as to have a heat dissipation component between the first extension portion and the second extension portion and to be attached to each other.

13. The production method according to claim 12, characterized in that: The heat dissipation component is foam; the second array substrate and the first opposing substrate, which are formed between the first extension portion and the second extension portion and have the heat dissipation component and are bonded to each other, include: Attaching the foam to the first extension; Adhere optical adhesive to a side of the first counter substrate facing away from the first array substrate; A surface of the first counter substrate facing away from the first array substrate is aligned and laminated with a surface of the second array substrate facing away from the second counter substrate.

14. The production method according to claim 13, wherein: The step of attaching the foam to the first extension portion includes attaching the foam to the first extension portion, and making the height of the attached foam in a direction perpendicular to the first extension portion greater than the height of the optical adhesive in a direction perpendicular to the first extension portion.

15. The manufacturing method according to claim 12, wherein: The heat dissipation component is thermal grease; the second array substrate and the first opposing substrate, which are formed between the first extension portion and the second extension portion and have the heat dissipation component and are bonded to each other, include: Adhere optical adhesive to a side of the first counter substrate facing away from the first array substrate; Aligning and laminating a surface of the first counter substrate facing away from the first array substrate and a surface of the second array substrate facing away from the second counter substrate; Thermal conductive silicone grease is injected into the space between the first extension portion and the second extension portion.

16. The manufacturing method according to claim 15, wherein: When injecting thermal grease into the space between the first extension portion and the second extension portion, the manufacturing method further includes: scraping off excess thermal grease from the edge in a semi-cured state.

17. The manufacturing method according to claim 12, wherein: When forming a first control IC on the first extension portion of the first array substrate and forming a second control IC on the second extension portion of the second array substrate, the manufacturing method further includes: A first flexible circuit board is bound to the first extension portion of the first array substrate, and a second flexible circuit board is bound to the second extension portion of the second array substrate.

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