Camera module and manufacturing method thereof

Abstract

The present invention provides a camera module and a manufacturing method thereof. The camera module is suitable for being fixed in a mounting housing, and comprises: an optical component; a filter; and a molded photosensitive component mounted below the optical component and the filter, wherein the molded photosensitive component comprises a main body, some electronic components, a photosensitive film and a circuit board, wherein the circuit board is electrically connected to the electronic components and the photosensitive film, wherein the photosensitive film is fixed and surrounded by the bottom of the main body to keep a distance from the filter, wherein the main body comprises an inclusion body and a short body, wherein the optical component is eccentrically arranged in the inclusion body to be close to at least one side of the mounting housing, wherein the filter is supported on the short upper surface of the short body.

Description

Technical Field

[0001] The present invention relates to the field of optical imaging technology, and in particular to a camera module and a manufacturing method thereof. Background Art

[0002] In recent years, electronic products, smart devices, etc. have increasingly been moving towards lighter, thinner and smaller sizes. This development trend has put forward more stringent requirements on the size (especially the height) of the camera module, which is one of the standard configurations of electronic products and smart devices.

[0003] In the assembly process of the camera module in the prior art, the chip and electronic components are usually mounted on the circuit board first, and then a lens holder is formed on the circuit board through a lens holder attachment process or a molding process. At the same time, the filter assembly is generally mounted on the lens holder, and then the optical lens is mounted on the filter assembly to keep the optical lens on the light-sensitive path of the chip.

[0004] However, the assembly method of the prior art makes the height of the camera module depend on the thickness of the circuit board, the height of the lens holder, the thickness of the filter assembly and the height of the optical lens. That is to say, according to the existing structural design method, the sum of the thickness of the circuit board, the height of the lens holder, the thickness of the filter assembly and the height of the optical lens is equal to the height of the camera module, which imposes many limitations on the lightweight camera module.

[0005] As a traditional attached mirror holder, a clearance space needs to be reserved between the upper and lower parts and the electronic components. At the same time, the color filter is installed on the support arm of the mirror holder. The support arm of the mirror holder used to install the color filter has a minimum molding thickness, which is usually more than 0.2mm. In addition, a safety distance needs to be set between the upper surface of the color filter and the lower surface of the lens. Therefore, in the traditional mirror holder assembly, the height is stacked and accumulated, making it difficult to reduce the height of the mirror holder.

[0006] In addition, similar situations also exist in the molding process.

[0007] First, in the molding process, the electronic components mounted on the circuit board are located in the molding mold, because a safe distance needs to be reserved between the electronic components and the molding mold to prevent the molding mold from squeezing the electronic components, that is, a safe distance needs to be reserved between the molding mold and the electronic components both in the horizontal direction and in the height direction, so as to cover the electronic components after the molding base is molded, so that the height of the molding base must be greater than the height of the electronic components, that is, the height of the molding base is limited by the height of the electronic components themselves, which makes the height of the molding base unable to be reduced.

[0008] Secondly, the filter assembly is composed of a filter and a support, and the support is usually made by injection molding, and the part of the support that supports the filter needs to have a certain thickness to ensure that it has sufficient strength to firmly support the filter, so that the thickness of the filter assembly must be greater than the thickness of the filter, that is, the thickness of the filter assembly is jointly limited by the support and the filter, which makes it impossible to reduce the thickness of the filter assembly.

[0009] Therefore, due to the limitations of the above factors, the assembly method of the prior art cannot reduce the height of the camera module, and thus cannot meet the market demand for thinner and smaller camera modules.

[0010] Today's smart devices must be equipped with high-quality camera film groups. For example, a smartphone uses a camera module to capture images and perceive the world. As smart devices pursue thinner and lighter, small-sized camera modules are more competitive in the market.

[0011] An existing camera module installed in a smart phone is as follows Fig.13 As disclosed in . A filter component 20P is supported above a photosensitive component 30P. An optical lens 10P is installed above the filter component 20P so that the shaped and filtered light is transmitted to a chip 300P of the photosensitive component 30P. In order to achieve better quality, the filter component 20P needs to be arranged between the optical lens 10P and the photosensitive component 30P. Then, the thickness of the existing camera module is determined from the photosensitive component 30P to the optical lens 10P. Moreover, the thickness of the camera module is difficult to reduce because of the height of the optical lens 10P, the thickness of the filter component 20P, and the height of the photosensitive component 30P. A camera module of such a size is neither suitable nor beautiful in a thin and stylish smartphone. In this example of the existing camera module, the filter assembly 20P includes a filter 21P and a filter bracket 22P, and the filter bracket 22P surrounds and supports the filter 21P between the optical lens 10P and the photosensitive assembly 30P. In addition, the height of the optical lens 10P and the thickness of the photosensitive assembly 30P are difficult to reduce due to the complex optical design and the size of the electronic devices included in the photosensitive assembly 30P. In particular, because the camera module with a short back focus is usually required to be less than 0.6 mm, it is impossible to meet the requirements with the current process level.

[0012] Some existing camera modules attempt to directly install the filter 21P at the bottom of the optical lens 10P without the filter bracket 22P to reduce the overall size of the camera module. However, the optical lens 10P has to be directly pressed on the filter 21P, and the filter 21P cannot bear the weight of the optical lens 10P or the movement of the optical lens 10P during use. Moreover, the glue used to install the optical lens 10P easily flows into the center of the filter 21P and covers the area where light is transmitted. These damaged filters 21P will cause the entire camera module to be unable to acquire images.

[0013] In some other prior arts, attempts are made to attach the optical filter 21P to the surface of the chip 300P or the bottom surface of the optical lens 10P. However, this requires more details to attach the optical filter 21P to the surface, like applying a film on glass. For example, it is difficult to ensure the flatness between the optical filter 21P and the chip 300P, and the durability of the optical filter 21P and the chip 300P will be adversely affected. Once there are bubbles or wrinkles, the filtering effect of the optical filter 21P will decrease and it will not work effectively, so that the quality and reliability of the camera module will be reduced.

[0014] In fact, the distance between the optical lens 10P and the filter 21P and the distance between the filter 21P and the chip 21P are critical to the imaging quality. After being reflected on the filter 21P, stray light will enter the chip 300P. If the distance between the filter 21P and the chip 300P is too short, the stray light will enter the center of the chip 300P, that is, the imaging sensing area. If the distance between the filter 21P and the chip 300P is slightly longer, the stray light enters the edge of the chip 300P, that is, the processing summary is easily overlooked. Therefore, if the filter 21P is attached to the surface of the chip 300P, or the bottom surface of the optical lens 10P, the thickness of the camera module can be reduced, but the efficiency of acquiring the image will be reduced, that is, the work of the filter 21P does not achieve a certain effect, which is not perfect for smart devices. Summary of the invention

[0015] An object of the present invention is to provide a camera module and a method for manufacturing the same, which can reduce the height of the camera module and help meet the development needs of lightweight and miniaturized camera module.

[0016] Another object of the present invention is to provide a camera module and a method for manufacturing the same, which can reduce the height of the camera module by reducing the distance between a filter element and a circuit board.

[0017] Another object of the present invention is to provide a camera module and a method for manufacturing the same, which can reduce the back focus of an optical lens of the camera module, thereby helping to achieve a more miniaturized camera module to meet market demand.

[0018] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, a molded base of the module's photosensitive component has a stepped peripheral groove, and a filter element of the molded photosensitive component is installed in the stepped peripheral groove of the molded base, so that the distance between the filter element and the circuit board is reduced.

[0019] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, the molded base has a stepped peripheral groove, wherein the filter element is disposed in the stepped peripheral groove to reduce the distance between the filter element and the circuit board.

[0020] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, the molded base includes a first base portion and a second base portion, wherein the second base portion extends inwardly from the first base portion along the circuit board as a whole, and a first top surface of the first base portion defines the first mounting surface, and a second top surface of the second base portion defines the second mounting surface, wherein the first mounting surface is higher than the second mounting surface, and the filter element is mounted on the second mounting surface.

[0021] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, the second mounting surface of the molded base is lower than the upper surface of the electronic components on the circuit board to further reduce the distance between the filter element and the circuit board.

[0022] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, the filter element is mounted on the first mounting surface of the molded base via a support member, and the filter element is located between the first mounting surface and the second mounting surface to reduce the distance between the filter element and the circuit board.

[0023] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, the first mounting surface and the second mounting surface of the molded base are parallel to each other, which facilitates a subsequent active calibration process.

[0024] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, the arc height of the gold wire is reduced by a reverse punching process to avoid the pressure head of the molding mold, thereby reducing the distance between the second mounting surface of the molding base and the circuit board.

[0025] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, before mounting the photosensitive element, the molded base is formed by a molding process to further reduce the distance between the second mounting surface of the molded base and the circuit board.

[0026] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, the photosensitive element is installed in a chip mounting slot of the circuit board to further reduce the distance between the second mounting surface of the molded base and the circuit board.

[0027] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, the photosensitive element is installed in a through-hole chip mounting slot of the circuit board to further reduce the distance between the second mounting surface of the molded base and the circuit board.

[0028] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, an upper surface of the filter element is not higher than the first mounting surface of the molded base, so as to effectively prevent the filter element from being hit by the downward movement of the optical lens in a dynamic focus camera module.

[0029] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein, in some embodiments of the present invention, a gap is reserved between the filter element and a first inner circumferential surface of the first base portion of the molded base to facilitate mounting of the filter element.

[0030] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the thickness of the camera module mainly depends on the height of a lens and the thickness of a molded photosensitive component, thereby saving installation space in a smart device.

[0031] Another object of the present invention is to provide a camera module and a method for manufacturing the same, so as to effectively produce a small-sized camera module without increasing the difficulty and complexity of manufacturing the lens and the molded photosensitive component.

[0032] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the filter is well supported and there is no need to support the lens, so that the lens is stably supported without worrying about damaging the filter.

[0033] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein a lens glue applied between the lens and the molded photosensitive component is away from the filter to keep the filtering area of ​​the filter from being covered.

[0034] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the distance between the filter and the lens is maintained to keep a small amount of stray light from entering the photosensitive film molded in the molded photosensitive component, so that the imaging quality is enhanced.

[0035] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the distance between the filter and the molded photosensitive component is maintained to keep a small amount of stray light from entering the center of the photosensitive film, thereby enhancing the imaging quality.

[0036] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the photosensitive sheet is hardly pressed by the filter and can have better photosensitivity.

[0037] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the lens is directly supported on the molded photosensitive component so that the lens has strong support and is easy to start or move.

[0038] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the molded photosensitive component provides a high support for the lens and a low support for the filter, so as to effectively avoid interference between the lens and the filter while stably supporting the lens and the filter at the same time.

[0039] Another object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the lens can be mounted on the molded photosensitive component to adapt to the edge shape of the smart device, so that the imaging capability is guaranteed with a better-looking appearance.

[0040] In order to achieve at least one of the above-mentioned invention objectives or other objectives and advantages, the present invention provides a molded photosensitive component, comprising:

[0041] An imaging assembly, wherein the imaging assembly comprises a circuit board and at least one photosensitive element, and each of the photosensitive elements is conductively connected to the circuit board;

[0042] a mold base, wherein the mold base has at least one stepped peripheral groove, so that a light window is defined by each of the stepped peripheral grooves, wherein the mold base covers a portion of the imaging component, and the photosensitive area of ​​each of the photosensitive elements corresponds to each of the light windows of the mold base; and

[0043] A filter assembly, wherein the filter assembly includes at least one filter element, wherein each filter element is correspondingly arranged in each stepped peripheral groove of the mold base, so that each filter element corresponds to each light window of the mold base.

[0044] In some embodiments of the present invention, the molded base includes at least one first base portion and at least one second base portion, wherein each second base portion extends inward integrally along the circuit board from an inner circumferential surface of each first base portion, and a first top surface of each first base portion is higher than a second top surface of the second base portion, so as to form each of the stepped peripheral grooves of the molded base through each first base portion and each second base portion.

[0045] In some embodiments of the present invention, the circuit board includes a chip mounting area and an edge area located around the chip mounting area, and the photosensitive element includes a photosensitive area and a non-photosensitive area located around the photosensitive area, wherein the first base portion of the molded base covers at least a portion of the edge area of ​​the circuit board, and the second base portion of the molded base covers at least a portion of the non-photosensitive area of ​​the photosensitive element.

[0046] In some embodiments of the present invention, the first base portion covers a circuit board outer portion of the edge area of ​​the circuit board, and the second base portion covers a circuit board connection portion and a circuit board inner portion of the edge area of ​​the circuit board and a chip outer portion and a chip connection portion of the non-photosensitive area of ​​the photosensitive element.

[0047] In some embodiments of the present invention, the first base portion of the molded base covers a circuit board outer portion and a circuit board connecting portion in the edge area of ​​the circuit board, and the second base portion covers a circuit board inner portion of the edge area of ​​the circuit board and a chip outer portion and a chip connecting portion in the non-photosensitive area of ​​the photosensitive element.

[0048] In some embodiments of the present invention, the first base portion of the molded base covers a circuit board outer portion, a circuit board connecting portion, and a circuit board inner portion of the edge area of ​​the circuit board, and the second base portion covers a chip outer portion, a chip connecting portion, and a portion of a chip inner portion of the non-photosensitive area of ​​the photosensitive element.

[0049] In some embodiments of the present invention, the first base portion of the molded base covers a circuit board outer portion, a circuit board connection portion, and a circuit board inner portion of the edge area of ​​the circuit board and a chip outer portion of the non-photosensitive area of ​​the photosensitive element, and the second base portion covers a chip connection portion and a portion of a chip inner portion of the non-photosensitive area of ​​the photosensitive element.

[0050] In some embodiments of the present invention, the imaging component also includes at least one group of leads to conductively connect the photosensitive element and the circuit board through each lead, wherein the height of the second base portion is greater than the arc height of each lead, and each lead of the imaging component is covered by the second base portion.

[0051] In some embodiments of the present invention, the imaging assembly also includes at least one group of electronic components, and each of the electronic components is mounted on the outer side of the circuit board in the edge area of ​​the circuit board, wherein the height of the first base portion of the molded base is greater than the height of each of the electronic components, and each of the electronic components of the imaging assembly is covered by the first base portion.

[0052] In some embodiments of the present invention, the second top surface of the second base portion is lower than a top surface of the highest electronic component.

[0053] In some embodiments of the present invention, the circuit board includes a chip mounting area and an edge area located around the chip mounting area, wherein the first base portion and the second base portion of the molded base both cover an outer portion of the circuit board of the edge area of ​​the circuit board.

[0054] In some embodiments of the present invention, the imaging assembly also includes at least one group of electronic components, and each of the electronic components is mounted on the outer side of the circuit board in the edge area of ​​the circuit board, wherein the height of the first base portion of the molded base is greater than the height of each of the electronic components, and each of the electronic components of the imaging assembly is covered by the first base portion.

[0055] In some embodiments of the present invention, the first top surface of each first base portion and the second top surface of the second base portion are parallel to each other.

[0056] In some embodiments of the present invention, the first top surface of each first base portion of the mold base and a photosensitive surface of the photosensitive element are parallel to each other.

[0057] In some embodiments of the present invention, an inclined angle of the first inner circumferential surface of each first base portion relative to a photosensitive surface of the photosensitive element is less than 30°.

[0058] In some embodiments of the present invention, an inclined angle of a second inner peripheral surface of each second base portion relative to the photosensitive surface of the photosensitive element is less than 30°.

[0059] In some embodiments of the present invention, the filter assembly further comprises at least one adhesive layer, wherein each adhesive layer is disposed between each filter element and each second base portion, so as to fix each filter element to each second base portion of the molded base through each adhesive layer.

[0060] In some embodiments of the present invention, each adhesive layer is formed by curing glue applied to the second top surface of each second base portion, and each adhesive layer is located between a lower surface of each filter element and the second top surface of each second base portion.

[0061] In some embodiments of the present invention, each second base portion is further provided with at least one glue groove, wherein each of the glue grooves is recessed downward from the second top surface of each of the second base portion to form a groove for accommodating the glue.

[0062] In some embodiments of the present invention, each adhesive layer is formed by curing glue applied to a lower surface of each filter element, and each adhesive layer is located between the lower surface of each filter element and the second top surface of each second base portion.

[0063] In some embodiments of the present invention, the molded photosensitive component further includes a mounting gap, wherein the mounting gap is located between the filter element and the first inner circumferential surface of the first base portion.

[0064] In some embodiments of the present invention, each of the adhesive layers has at least one air escape hole, wherein each of the air escape holes extends from the inner side of the adhesive layer to the outer side of the adhesive layer to connect the space between the filter element and the photosensitive element with the external space of the molded photosensitive component.

[0065] In some embodiments of the present invention, the filter assembly also includes at least one adhesive layer and at least one annular support member, wherein each adhesive layer is located between an upper surface of each filter element and each support member, so that each filter element is fixedly mounted on each support member through each adhesive layer, and each support member is correspondingly arranged on the first base portion of the molded base so that each filter element is located in each of the stepped peripheral grooves of the molded base.

[0066] In some embodiments of the present invention, each of the supporting members of the filter assembly is mounted on the first top surface of each of the first base portions, so that the upper surface of each of the filter elements is lower than the first top surface of each of the first base portions.

[0067] In some embodiments of the present invention, the circuit board is further provided with at least one chip mounting slot, wherein each of the chip mounting slots is located in a chip mounting area of ​​the circuit board, and each of the chip mounting slots is recessed downward from an upper side surface of the circuit board to form a groove for mounting the photosensitive element.

[0068] In some embodiments of the present invention, each chip mounting slot extends downward from the upper side of the circuit board to the lower side of the circuit board to form a through hole in the chip mounting area of ​​the circuit board, wherein each photosensitive element is fixedly disposed in each chip mounting slot.

[0069] According to another aspect of the present invention, the present invention also provides a camera module, comprising:

[0070] The molded photosensitive component described above; and

[0071] At least one optical lens, wherein each of the optical lenses is disposed in the light-sensitive path of each of the photosensitive elements of the imaging component of the molded photosensitive component, so as to provide a light path for each of the optical lenses and each of the photosensitive elements through each of the light windows.

[0072] According to another aspect of the present invention, the present invention also provides an electronic device, comprising:

[0073] an electronic device body; and

[0074] The above-mentioned camera module, wherein each of the camera modules is arranged on the electronic device body to acquire images.

[0075] According to another aspect of the present invention, the present invention also provides a method for manufacturing a molded photosensitive component, comprising the steps of:

[0076] Mounting a photosensitive element and at least one group of electronic components on a circuit board, and conducting the photosensitive element and the circuit board to assemble an imaging assembly;

[0077] A molding base having a stepped peripheral groove for covering a portion of the circuit board and a portion of the photosensitive element is formed by a molding process, so as to form a light window through the stepped peripheral groove, wherein a photosensitive area of ​​the photosensitive element corresponds to the light window of the molding base, so as to manufacture a molded photosensitive component semi-finished product having an integrated structure; and

[0078] A filter element of a filter assembly is correspondingly arranged in the stepped peripheral groove of the molding base of the molded photosensitive assembly semi-finished product to assemble a molded photosensitive assembly, wherein the photosensitive area of ​​the photosensitive element corresponds to the filter element.

[0079] In some embodiments of the present invention, the step of mounting a photosensitive element and at least one group of electronic components on a circuit board, and conducting the photosensitive element and the circuit board to assemble an imaging assembly comprises the steps of:

[0080] Mounting the photosensitive element on a chip mounting area of ​​the circuit board;

[0081] Mounting each of the electronic components on an outer side of a circuit board in an edge region of the circuit board; and

[0082] A lead is extended from a chip connection part of the photosensitive element to a circuit board connection part of the circuit board by a gold wire bonding process to conductively connect the photosensitive element and the circuit board.

[0083] In some embodiments of the present invention, the step of mounting a photosensitive element and at least one group of electronic components on a circuit board, and conducting the photosensitive element and the circuit board to assemble an imaging assembly comprises the steps of:

[0084] Mounting the photosensitive element on a chip mounting area of ​​the circuit board;

[0085] Mounting each of the electronic components on an outer side of a circuit board in an edge region of the circuit board; and

[0086] A lead is extended from a circuit board connector of the circuit board to a chip connector of the photosensitive element by a gold wire bonding process to conductively connect the circuit board and the photosensitive element.

[0087] In some embodiments of the present invention, the step of forming a molded base having a stepped peripheral groove for covering a portion of the circuit board and a portion of the photosensitive element by a molding process, so as to form a light window through the stepped peripheral groove, wherein a photosensitive area of ​​the photosensitive element corresponds to the light window of the molded base, so as to manufacture a molded photosensitive component semi-finished product having an integrated structure, comprises the steps of:

[0088] Placing the imaging assembly in a molding mold;

[0089] Performing a mold closing operation on an upper mold and a lower mold of the molding mold to form a molding space of the molding mold between the upper mold and the lower mold;

[0090] Adding a molding material into the molding space of the molding mold to form the molding base having the stepped peripheral groove after the molding material is solidified; and

[0091] The upper mold and the lower mold are demolded to obtain the semi-finished molded photosensitive component.

[0092] In some embodiments of the present invention, the step of performing a mold closing operation on an upper mold and a lower mold of the molding mold to form a molding space of the molding mold between the upper mold and the lower mold comprises the steps of:

[0093] Disposing a covering film on a pressing surface of the upper mold;

[0094] Applying pressure to the photosensitive element of the imaging assembly through the covering film so that the covering film is located between the pressing surface and the photosensitive element;

[0095] A first molding space of the molding space is formed between a first inner surface of the upper mold and at least a portion of the edge region of the circuit board; and

[0096] A second molding space of the molding space is formed between a second inner surface of the upper mold and at least a portion of a non-photosensitive area of ​​the photosensitive element, wherein the first inner surface of the upper mold is above the second inner surface of the upper mold.

[0097] In some embodiments of the present invention, the step of adding a molding material into the molding space of the molding mold to form the molding base having the stepped peripheral groove after the molding material is solidified comprises the steps of:

[0098] Adding the molding material into the first molding space to form a first base portion of the molding base after the molding material is solidified, wherein the first base portion covers at least a portion of the edge region of the circuit board; and

[0099] The molding material is added to the second molding space to form a second base portion of the molding base after the molding material is solidified, wherein the second base portion covers at least a portion of the non-photosensitive area of ​​the photosensitive element, and the height of the second base portion is lower than the height of the first base portion.

[0100] In some embodiments of the present invention, the step of correspondingly disposing a filter element of a filter assembly in the stepped peripheral groove of the molded base of the molded photosensitive assembly semi-finished product to assemble a molded photosensitive assembly, wherein the photosensitive area of ​​the photosensitive element corresponds to the filter element, comprises the steps of:

[0101] Applying glue to a second top surface of the second base portion of the mold base;

[0102] Correspondingly disposing the filter element on the second top surface of the second base portion; and

[0103] After the glue is cured, an adhesive layer of the filter assembly is formed between a lower surface of the filter element and the second top surface of the second base portion.

[0104] In some embodiments of the present invention, the step of correspondingly disposing a filter element of a filter assembly in the stepped peripheral groove of the molded base of the molded photosensitive assembly semi-finished product to assemble a molded photosensitive assembly, wherein the photosensitive area of ​​the photosensitive element corresponds to the filter element, comprises the steps of:

[0105] Applying glue to a lower surface of the filter element;

[0106] Correspondingly disposing the filter element on a second top surface of the second base portion; and

[0107] After the glue is cured, an adhesive layer of the filter assembly is formed between the lower surface of the filter element and the second top surface of the second base portion.

[0108] In some embodiments of the present invention, the step of correspondingly disposing a filter element of a filter assembly in the stepped peripheral groove of the molded base of the molded photosensitive assembly semi-finished product to assemble a molded photosensitive assembly, wherein the photosensitive area of ​​the photosensitive element corresponds to the filter element, comprises the steps of:

[0109] Applying glue to an annular support member of the filter assembly;

[0110] The filter element is correspondingly arranged on the support member, so that after the glue is cured, an adhesive layer of the filter assembly is formed between an upper surface of the filter element and the support member; and

[0111] The supporting member is correspondingly disposed on a first top surface of the first base portion so that the filter element is located in the stepped peripheral groove of the mold base.

[0112] According to another aspect of the present invention, the present invention also provides a method for manufacturing a molded photosensitive component, comprising the steps of:

[0113] A molding base having a stepped peripheral groove for covering an outer portion of an edge region of a circuit board is formed by a molding process, so that a light window is formed through the stepped peripheral groove, wherein a photosensitive region of the photosensitive element corresponds to the light window of the molding base, so as to manufacture a molded photosensitive component semi-finished product with an integrated structure;

[0114] Mounting a photosensitive element on a chip mounting area of ​​the circuit board, and conducting the photosensitive element and the circuit board; and

[0115] A filter element of a filter assembly is correspondingly arranged in the stepped peripheral groove of the mold base to assemble into a molded photosensitive assembly, wherein the photosensitive area of ​​the photosensitive element corresponds to the filter element.

[0116] According to another aspect of the present invention, the present invention also provides a method for manufacturing a camera module, comprising the steps of:

[0117] According to the above-mentioned method for manufacturing a molded photosensitive component, a molded photosensitive component is manufactured; and

[0118] An optical lens is correspondingly arranged on a photosensitive path of an imaging component of the molded photosensitive component to form a camera module.

[0119] Other advantages and features of the present invention will become more apparent from the following detailed description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

[0120] According to one aspect of the present invention, a camera module of the present invention that can achieve the aforementioned objectives and other objectives and advantages includes:

[0121] A camera module, characterized in that it comprises:

[0122] an optical component;

[0123] a filter; and

[0124] A molded photosensitive component is installed below the optical component and the filter, wherein the molded photosensitive component includes a main body, some electronic devices, a photosensitive film and a circuit board, wherein the circuit board is electrically connected to the electronic devices and the photosensitive film, wherein the main body covers the electronic devices and a part of the circuit board, wherein the photosensitive film is surrounded by the bottom of the main body and keeps a distance from the filter, wherein the main body includes an enclosing body supporting the optical component thereon, and a short body supporting the filter thereon, wherein the short body extends from the inner side of the enclosing body, and the distance between the short upper surface of the short body and the photosensitive film is greater than or equal to 0.15 mm.

[0125] In some embodiments of the present invention, the filter includes a filter portion for filtering imaging light and an edge portion extending outward from the filter portion, wherein the edge portion is supported on the short upper surface of the short body of the molded photosensitive component so that the filter portion corresponds to the photosensitive film.

[0126] In some embodiments of the present invention, the filter section has an incident surface and an exit surface, wherein the incident surface faces the optical component, and wherein the exit surface faces the photosensitive sheet.

[0127] In some embodiments of the present invention, the edge portion has an edge top surface, an edge side surface, and an edge bottom surface, wherein the edge top surface is coplanar with the incident surface, and the edge bottom surface is coplanar with the exit surface.

[0128] In some embodiments of the present invention, the distance between the edge side surface of the edge portion of the filter and the high inner side surface of the containing body is greater than or equal to 0.15 mm.

[0129] In some embodiments of the present invention, the width between the edge bottom surface of the edge portion of the optical filter and the short upper surface of the short body has a maximum value, which is equal to the width of the edge portion.

[0130] In some embodiments of the present invention, the width of the edge portion of the filter is greater than or equal to 0.25 mm.

[0131] In some embodiments of the present invention, the distance between each of the electronic components and the edge side of the edge portion of the filter is greater than or equal to 0.25 mm.

[0132] In some embodiments of the present invention, a short upper surface of the short body is lower than a high upper surface of the containing portion, and a relative height of the short upper surface of the short body is lower than a height of the tallest electronic device among the electronic devices.

[0133] In some embodiments of the present invention, the relative height of the high upper surface of the enclosure is higher than the height of the tallest electronic device among the electronic devices, so that at least the tallest electronic device among the electronic devices is covered by the enclosure, wherein the optical component is mounted on the high upper surface of the enclosure.

[0134] In some embodiments of the present invention, the distance between the tall upper surface of the containing body and the short upper surface of the short body is greater than 0.1 mm.

[0135] In some embodiments of the present invention, the width of the short upper surface of the short body is the distance from the tall inner side surface of the containing body to the short inner side surface of the short body, which is greater than or equal to 0.4 mm.

[0136] In some embodiments of the present invention, the containing body and the short body are shaped into a quasi-square shape with chamfers, wherein the radii of the inscribed circles of the chamfers of the containing body and the short body are both greater than or equal to 0.3 mm.

[0137] In some embodiments of the present invention, the height of the enclosure is greater than or equal to 0.5 mm.

[0138] According to another aspect of the present invention, the present invention also provides a method for manufacturing a camera module, comprising the steps of:

[0139] I connect a photosensitive film with some wiring and some electronic components on a circuit board;

[0140] II placing the connected circuit board between an upper mold and a lower mold; and

[0141] III covers the electronic device in a main body and on the circuit board to form a molded photosensitive component, wherein the main body includes an enclosing body and a short body whose height is lower than the enclosing body.

[0142] In some embodiments of the present invention, the method for manufacturing the camera module further comprises the steps of:

[0143] IV. Installing a filter on the short upper surface of the short body; and

[0144] V installs an optical component on the high upper surface of the enclosure.

[0145] In some embodiments of the present invention, in step III, the short upper surface of the short body is lower than the tall upper surface of the containing portion, and a relative height of the short upper surface of the short body is lower than a height of the tallest electronic device among the electronic devices.

[0146] In some embodiments of the present invention, the electronic device, the wiring, and the edge of the photosensitive film are all covered by the main body.

[0147] In some embodiments of the present invention, the step III further comprises the steps of:

[0148] III.1 Injecting molding material between an upper mold and a lower mold;

[0149] III.2 solidifying the molding material between the upper mold and the lower mold to form the body; and

[0150] III.3 Demolding the upper mold and the lower mold from the molded photosensitive component.

[0151] In some embodiments of the present invention, the angle between the tall inner side surface of the containing body and the short upper surface of the short body is greater than or equal to 95°.

[0152] In some embodiments of the present invention, step IV further comprises the steps of:

[0153] IV.1 Apply a filter glue in a C shape to the upper surface of the short body, so that a gap is reserved between the two ends of the filter glue;

[0154] IV.2 Install the filter on the filter glue;

[0155] IV.3 curing the filter glue; and

[0156] IV.4 Fill the gap between the two ends of the filter glue with additional filter glue to form a square-shaped filter glue.

[0157] In some embodiments of the present invention, the length of the gap is greater than or equal to 0.7 mm and less than or equal to 1.0 mm.

[0158] According to one aspect of the present invention, a camera module of the present invention that can achieve the aforementioned objects and other objects and advantages is suitable for being fixed in a mounting housing, and includes:

[0159] an optical component;

[0160] a filter; and

[0161] A molded photosensitive component is installed below the optical component and the filter, wherein the molded photosensitive component includes a main body, some electronic components, a photosensitive film and a circuit board, wherein the circuit board is electrically connected to the electronic components and the photosensitive film, wherein the photosensitive film is fixed and surrounded by the bottom of the main body to keep a distance from the filter, wherein the main body includes an enclosing body and a short body, wherein the optical component is eccentrically arranged in the enclosing body to be close to at least one side of the mounting housing, and wherein the filter is supported on the short upper surface of the short body.

[0162] In some embodiments of the present invention, the enclosure has a high upper surface and a low upper surface, wherein the height of the enclosure at the high upper surface is greater than the height of the enclosure at the low upper surface, wherein a portion of the optical component is supported on the high upper surface of the enclosure, and another portion of the optical component is supported on the low upper surface of the enclosure.

[0163] In some embodiments of the present invention, the camera module further includes a lens glue, wherein the lens glue includes a fixed glue layer, wherein the fixed glue layer is arranged between the optical component and the high upper surface of the enclosure.

[0164] In some embodiments of the present invention, the lens glue also includes a repair glue layer, wherein the repair glue layer is arranged between the optical component and the lower upper surface of the containing body, and the thickness of the repair glue layer is greater than the thickness of the fixed glue layer.

[0165] In some embodiments of the present invention, the high upper surface of the container is U-shaped to support the optical component on three sides; wherein the low upper surface of the container is linear, and the low upper surface extends from one high outer side surface of the container to another high outer side surface of the container to support the optical component on one side.

[0166] In some embodiments of the present invention, the high upper surface of the container is U-shaped to support the optical component on three sides; wherein the low upper surface of the container is linear, and the low upper surface extends from one high inner side surface of the container to another high inner side surface of the container to support the optical component on one side.

[0167] In some embodiments of the present invention, the upper surface of the enclosure is L-shaped to support the optical component on two adjacent sides; wherein the lower surface of the enclosure is also L-shaped to support the optical component on two adjacent sides.

[0168] In some embodiments of the present invention, the fixed adhesive layer is U-shaped, and the repairing adhesive layer is linear, so that the lens adhesive having a U-shaped structure is formed by the fixed adhesive layer and the repairing adhesive layer.

[0169] In some embodiments of the present invention, the fixing adhesive layer is L-shaped, and the repairing adhesive layer is L-shaped, so that the lens adhesive having a U-shaped structure is formed by the fixing adhesive layer and the repairing adhesive layer.

[0170] In some embodiments of the present invention, the optical component protrudes outward from the molded photosensitive component at the lower upper surface of the containing body.

[0171] In some embodiments of the present invention, the electronic device is enclosed by the containing body, and the electronic device is located below the high upper surface of the containing body.

[0172] In some embodiments of the present invention, the electronic device is disposed on two sides or three sides of the photosensitive film.

[0173] In some embodiments of the present invention, the lower upper surface of the containing body is flush with the lower upper surface of the lower body.

[0174] In some embodiments of the present invention, the optical component protrudes outward from the molded photosensitive component from at least one side of the containing body so that the optical component is close to at least one side of the mounting housing.

[0175] In some embodiments of the present invention, the short upper surface of the short body is lower than the tall upper surface of the containing portion, and a relative height of the short upper surface of the short body is lower than a height of the tallest electronic device among the electronic devices.

[0176] In some embodiments of the present invention, the distance between the tall upper surface of the containing body and the short upper surface of the short body is greater than 0.1 mm.

[0177] In some embodiments of the present invention, the draft angle of the high inner side surface of the containing body is between 5° and 10°.

[0178] In some embodiments of the present invention, the fillet radius between the tall inner side surface of the containing body and the short upper surface of the short body is substantially equal to 0.1 mm.

[0179] In some embodiments of the present invention, the draft angle of the high outer side surface of the containing body is between 5° and 10°.

[0180] According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, comprising the steps of:

[0181] I connect a photosensitive film with some wiring and some electronic components on a circuit board;

[0182] II. Place the connected circuit board between an upper mold and a lower mold;

[0183] III covering the electronic device in a main body and on the circuit board to form a molded photosensitive component, wherein the main body includes an enveloping body and a short body with a height lower than the enveloping body;

[0184] IV. Installing a filter on the short upper surface of the short body; and

[0185] V eccentrically arranges the optical component in the containing body so that the optical component is close to at least one side of a mounting shell.

[0186] In some embodiments of the present invention, step V comprises the steps of:

[0187] V.1 fix the optical component to the upper surface of the enclosure; and

[0188] V.2 Reinforce the optical component on the lower upper surface of the enclosure, wherein the lower upper surface is lower than the higher upper surface.

[0189] In some embodiments of the present invention, in step V.1, lens glue is applied to the upper surface of the enclosure to form a fixed glue layer between the optical component and the upper surface of the enclosure.

[0190] In some embodiments of the present invention, step V.2 comprises the steps of:

[0191] V.2.1 inverting the optical component and the molded photosensitive component so that the optical component is located on the lower side of the molded photosensitive component; and

[0192] V.2.2 Apply lens glue between the support feet of the optical component and the lower upper surface of the containing body to form a glue filling layer.

[0193] In some embodiments of the present invention, the high upper surface of the container is U-shaped to support the optical component on three sides; wherein the low upper surface of the container is linear, and the low upper surface extends from one high outer side surface of the container to another high outer side surface of the container to support the optical component on one side.

[0194] In some embodiments of the present invention, the high upper surface of the container is U-shaped to support the optical component on three sides; wherein the low upper surface of the container is linear, and the low upper surface extends from one high inner side surface of the container to another high inner side surface of the container to support the optical component on one side.

[0195] In some embodiments of the present invention, the upper surface of the enclosure is L-shaped to support the optical component on two adjacent sides; wherein the lower surface of the enclosure is also L-shaped to support the optical component on two adjacent sides.

[0196] In some embodiments of the present invention, the fixing glue layer is U-shaped, and the filling glue layer is linear.

[0197] In some embodiments of the present invention, the fixing glue layer is L-shaped, and the repairing glue layer is L-shaped.

[0198] In some embodiments of the present invention, the optical component protrudes outward from the molded photosensitive component at the lower upper surface of the containing body.

[0199] In some embodiments of the present invention, the angle between the tall inner side surface of the containing body and the short upper surface of the short body is between 95° and 100°.

[0200] According to one aspect of the present invention, a camera module of the present invention that can achieve the aforementioned objectives and other objectives and advantages includes:

[0201] an optical component;

[0202] a filter; and

[0203] A molded photosensitive component, wherein the molded photosensitive component is installed below the optical component and the filter, wherein the molded photosensitive component includes a main body, some electronic components, a photosensitive film and a circuit board, wherein the circuit board is electrically connected to the electronic components and the photosensitive film, wherein the main body covers the electronic components and a part of the circuit board, wherein the photosensitive film is fixed and surrounded by the bottom of the main body to keep a distance from the filter, wherein the main body includes an enclosure supporting the optical component thereon, and a short body, wherein the short body extends from the inner side of the enclosure, wherein at least part of the electronic components are covered under the short body, and the short body supports the filter thereon.

[0204] In one embodiment of the present invention, the electronic device includes at least one short device, wherein at least a portion of the short device is covered under the short body, and a height of each of the short devices is less than 0.3 mm.

[0205] In one embodiment of the present invention, the photosensitive film is electrically connected to the circuit board through some wiring, and the wiring is covered by the short body, wherein the wiring and the short device are both arranged around the photosensitive film, and the wiring and the short device are respectively located on different sides of the photosensitive film.

[0206] In one embodiment of the present invention, the thickness of at least one side of the containing body is smaller than the thickness of the short body, so that the optical component protrudes outward from the molded photosensitive component from the at least one side of the containing body.

[0207] In one embodiment of the present invention, the electronic device further comprises at least one tall device, wherein the tall device is covered under the containing body, and the height of each tall device is greater than or equal to 0.3 mm.

[0208] In one embodiment of the present invention, the tall device and the wiring are located on the same side of the photosensitive sheet.

[0209] In one embodiment of the present invention, the enclosure has a high upper surface and a low upper surface, wherein the height of the enclosure at the high upper surface is greater than the height of the enclosure at the low upper surface, wherein a portion of the optical component is supported on the high upper surface of the enclosure, and another portion of the optical component is supported on the low upper surface of the enclosure.

[0210] In one embodiment of the present invention, each of the tall devices in the electronic devices is covered under the tall upper surface of the enclosing body, wherein each of the short devices in the electronic devices is covered under the short upper surface of the short body, and the short devices are located on at least one side of the photosensitive film corresponding to the low upper surface of the enclosing body.

[0211] In one embodiment of the present invention, the optical component protrudes outward from the molded photosensitive component from the lower upper surface of the containing body.

[0212] In one embodiment of the present invention, the angle between the tall inner side surface of the containing body and the short upper surface of the short body is greater than or equal to 100°.

[0213] In one embodiment of the present invention, the height difference between the containing body and the short body is greater than or equal to 0.1 mm.

[0214] In one embodiment of the present invention, the filter includes a filter portion for transmitting imaging light to the photosensitive film, and an edge portion supported by the short body of the molded photosensitive component.

[0215] In one embodiment of the present invention, the molded photosensitive component further comprises an upper cover, wherein the upper cover is mounted on the upper surface of the enclosure, and the upper cover extends inwardly to cover the edge portion of the filter.

[0216] In an embodiment of the present invention, the height of the upper cover is smaller than the thickness of the filter.

[0217] According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, comprising the steps of:

[0218] I connect a photosensitive film with some wiring and some electronic components on a circuit board;

[0219] II placing the connected circuit board between an upper mold and a lower mold; and

[0220] III covers the electronic device in a main body and on the circuit board to form a molded photosensitive component, wherein the main body includes a containing body and a short body whose height is lower than the containing body, and at least part of the electronic device is covered under the short body.

[0221] In one embodiment of the present invention, the method for manufacturing the camera module further includes the steps of:

[0222] IV. Installing a filter on the short upper surface of the short body; and

[0223] V installs an optical component on the enclosure.

[0224] In one embodiment of the present invention, the electronic device includes at least one short device, wherein at least a portion of the short device is covered below the short upper surface of the short body, and the height of each short device is less than 0.3 mm.

[0225] In one embodiment of the present invention, the wiring is covered by the short body, wherein the wiring and the short device are both arranged around the photosensitive film, and the wiring and the short device are respectively located on different sides of the photosensitive film.

[0226] In one embodiment of the present invention, the thickness of at least one side of the containing body is smaller than the thickness of the short body, so that the optical component protrudes outward from the molded photosensitive component from the at least one side of the containing body.

[0227] In one embodiment of the present invention, the electronic device further comprises at least one tall device, wherein the tall device is covered under the containing body, and the height of each tall device is greater than or equal to 0.3 mm.

[0228] In one embodiment of the present invention, the tall device and the wiring are located on the same side of the photosensitive sheet.

[0229] In one embodiment of the present invention, an angle between the tall inner side surface of the containing body and the short upper surface of the short body is greater than or equal to 100°.

[0230] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0231] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0232] Figure 1 It is a three-dimensional schematic diagram of a camera module according to a first preferred embodiment of the present invention.

[0233] Figure 2 It is a schematic diagram of the decomposition of the camera module according to the above-mentioned first preferred embodiment of the present invention.

[0234] Figure 3 It is a cross-sectional schematic diagram of a molded photosensitive component of the camera module according to the above-mentioned first preferred embodiment of the present invention.

[0235] Figure 4A A first variant implementation of the molded photosensitive component according to the above-mentioned first preferred embodiment of the present invention is shown.

[0236] Figure 4BA second variant implementation of the molded photosensitive component according to the above-mentioned first preferred embodiment of the present invention is shown.

[0237] Figure 4C A third variant implementation of the molded photosensitive component according to the above-mentioned first preferred embodiment of the present invention is shown.

[0238] Figure 5A and Figure 5B It is a cross-sectional schematic diagram of the manufacturing process of the camera module according to the above-mentioned first preferred embodiment of the present invention.

[0239] Fig. 6A A first variant implementation of the camera module according to the above-mentioned first preferred embodiment of the present invention is shown.

[0240] Figure 6B A second variant implementation of the camera module according to the above-mentioned first preferred embodiment of the present invention is shown.

[0241] Figure 6C A third variant implementation of the camera module according to the above-mentioned first preferred embodiment of the present invention is shown.

[0242] Fig.6D A fourth variant implementation of the camera module according to the above-mentioned first preferred embodiment of the present invention is shown.

[0243] Fig. 6E A fifth variant implementation of the camera module according to the above-mentioned first preferred embodiment of the present invention is shown.

[0244] Fig. 6F A sixth variant implementation of the camera module according to the above-mentioned first preferred embodiment of the present invention is shown.

[0245] Figure 6G A seventh variant implementation of the camera module according to the above-mentioned first preferred embodiment of the present invention is shown.

[0246] Figure 6H An eighth variant implementation of the camera module according to the above-mentioned first preferred embodiment of the present invention is shown.

[0247] 7A to 7D They are respectively flow charts of the method for manufacturing the molded photosensitive component according to the above-mentioned first preferred embodiment of the present invention.

[0248] Figure 8 It is a flow chart of the manufacturing method of the camera module according to the above-mentioned first preferred embodiment of the present invention.

[0249] Fig. 9It is a cross-sectional schematic diagram of a camera module according to a second preferred embodiment of the present invention.

[0250] Fig. 10A and Fig. 10B It is a cross-sectional schematic diagram of the manufacturing steps of the camera module according to the above-mentioned second preferred embodiment of the present invention.

[0251] Fig.11 It is a schematic flow chart of the method for manufacturing the molded photosensitive component according to the above-mentioned second preferred embodiment of the present invention.

[0252] Fig.12 It is a schematic diagram of an electronic device with the above-mentioned camera module of the present invention.

[0253] Fig.13 It is an existing camera module in a smart device.

[0254] Fig.14 is a cross-sectional view of a camera module according to a third embodiment of the present invention.

[0255] Fig.15 It is a stereoscopic schematic diagram of the filter and molded photosensitive component of the camera module according to the third embodiment of the present invention.

[0256] Fig.16 It is a schematic top view of the filter and molded photosensitive component of the camera module according to the third embodiment of the present invention.

[0257] Fig.17 It is a cross-sectional schematic diagram of the filter and molded photosensitive component of the camera module according to the third embodiment of the present invention.

[0258] Fig.18 is a cross-sectional schematic diagram of the camera module according to the third embodiment of the present invention, illustrating a possible installation mode in a smart phone.

[0259] Fig.19A and Fig.19B It is a flow chart of the manufacturing method of the camera module according to the third embodiment of the present invention.

[0260] Fig. 20 It is a flow chart of the manufacturing method of the camera module according to the third embodiment of the present invention.

[0261] Fig.21 It is a cross-sectional schematic diagram of a feasible mode of the filter and molded photosensitive component of the camera module according to the above-mentioned third embodiment of the present invention.

[0262] Fig. 22It is a cross-sectional schematic diagram of another feasible mode of the filter and molded photosensitive component of the camera module according to the third embodiment of the present invention.

[0263] Fig.23 It is a cross-sectional schematic diagram of another feasible mode of the filter and molded photosensitive component of the camera module according to the third embodiment of the present invention.

[0264] Fig.24 It is a cross-sectional schematic diagram of the camera module according to a fourth embodiment of the present invention.

[0265] Fig.25 It is a stereoscopic schematic diagram of the camera module according to the fourth embodiment of the present invention.

[0266] Fig.26 It is a schematic top view of the filter and molded photosensitive component of the camera module according to the fourth embodiment of the present invention.

[0267] Fig. 27 It is a cross-sectional schematic diagram of the filter and molded photosensitive component of the camera module according to the fourth embodiment of the present invention, illustrating a feasible installation mode in a smart phone.

[0268] Fig.28 It is a cross-sectional schematic diagram of the camera module according to a fifth embodiment of the present invention.

[0269] Fig.29 It is a schematic exploded view of the filter and molded photosensitive component of the camera module according to the fifth embodiment of the present invention.

[0270] Fig.30 It is a schematic top view of the filter and the molded photosensitive component of the camera module according to the fifth embodiment of the present invention.

[0271] Fig.31 It is a variant implementation of the camera module according to the fifth embodiment of the present invention.

[0272] Fig.32 It is a top view schematic diagram of the filter and molded photosensitive component of the camera module according to the above-mentioned modified embodiment of the present invention.

[0273] Figures 33A to 33C It is a schematic flow chart of the manufacturing method of the camera module according to the above-mentioned variant embodiment of the present invention.

[0274] Fig.34 and Fig.35 Another variant implementation of the camera module according to the fifth embodiment of the present invention is shown. DETAILED DESCRIPTION

[0275] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0276] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0277] In the present invention, the term "one" in the claims and the specification should be understood as "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. Unless it is clearly indicated in the disclosure of the present invention that the number of the element is only one, the term "one" cannot be understood as unique or single, and the term "one" cannot be understood as a limitation on the quantity.

[0278] In the description of the present invention, it should be understood that "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through a medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0279] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0280] As electronic products, smart devices, etc. are increasingly moving towards being lighter, thinner and smaller, camera modules, as one of the standard configurations of electronic products or smart devices, have put forward more stringent requirements on the size (especially the height) of camera modules.

[0281] However, in the prior art assembly method, the chip and electronic components are usually mounted on the circuit board first, and then a molded base is formed on the circuit board through a molding process, and then the filter is mounted on the lens holder, and then the lens is mounted on the filter assembly to keep the lens on the light sensing path of the chip. However, this prior art assembly method has a great limitation on the height of the camera module.

[0282] On the one hand, although the molded base is used to replace the traditional lens base to reduce the lateral size and height of the camera module, the mold used in the molding process needs to avoid the capacitors, resistors and other electronic components on the circuit board (especially the capacitors are larger in size, and the current smallest capacitor is 0.38mm high), and a certain safety distance must be reserved between the mold and various electronic components. Therefore, the height of the molded base must be at least greater than 0.4mm; on the other hand, the filter is usually combined with a support to form a filter assembly, and then the filter assembly is mounted on the molded base. Since the support is usually made by injection molding, the thickness of the part of the support used to support the filter is required to be basically greater than 0.15mm, and the thickness of the filter itself is usually above 0.21mm. Therefore, the thickness of the filter assembly must be at least greater than 0.36mm.

[0283] In summary, the distance between the lens and the circuit board is equal to the sum of the height of the molded base and the thickness of the filter assembly (at least greater than 0.76 mm), and limited by all the above factors, the distance between the lens and the circuit board of the camera module of the prior art cannot be further reduced, that is, the height of the camera module of the prior art cannot be further reduced, thereby failing to meet the market demand for thinner and smaller camera modules. Therefore, in order to solve the above problems, the present invention provides a camera module and a manufacturing method thereof.

[0284] Referring to the accompanying drawings of the present invention Figures 1 to 8 , a camera module and a molded photosensitive component and a manufacturing method thereof according to a first preferred embodiment of the present invention are explained, wherein the camera module 1' includes at least one optical lens 10' and a molded photosensitive component 20', wherein the molded photosensitive component 20' includes an imaging component 21', a filter component 22' and a molded base 23', wherein the molded base 23' covers a portion of the imaging component 21' after molding, and has at least one stepped peripheral groove 230', wherein the filter component 22' includes at least one filter element 221', and each of the filter elements 221' is correspondingly arranged in each of the stepped peripheral grooves 230' of the molded base 23', so that each of the filter elements 221' of the filter component 22' corresponds to the photosensitive path of the imaging component 21', wherein each of the optical lenses 10' is respectively arranged in the photosensitive path of the imaging component 21' to form the camera module 1'.

[0285] It is worth mentioning that although Figures 1 to 8 In the following description, the camera module includes only one optical lens 10' as an example to illustrate the features and advantages of the camera module of the present invention. It can be understood by those skilled in the art that the attached Figures 1 to 8 The camera module disclosed in the following description is only an example and does not constitute a limitation on the content and scope of the present invention. For example, in other examples of the camera module, the number of the optical lenses 10' may exceed one to form an array camera module.

[0286] like Figure 2 As shown, the imaging component 21' of the molded photosensitive component 20' includes a circuit board 211' and at least one photosensitive element 212', and each of the photosensitive elements 212' is mounted on a different position of the circuit board 211'.

[0287] Furthermore, if Figure 3As shown, the circuit board 211' includes at least one flat chip mounting area 2111' and an edge area 2112', wherein each chip mounting area 2111' and the edge area 2112' are integrally formed, and the edge area 2112' is located around the chip mounting area 2111', and each photosensitive element 212' is mounted on each chip mounting area 2111' of the circuit board 211', so as to ensure the flatness of each photosensitive element 212' mounted on each chip mounting area 2111'. For example, in the attached Figure 3 In the specific example shown, the circuit board 211' may include a chip mounting area 2111' and an edge area 2112', wherein the chip mounting area 2111' is located in the middle of the circuit board 211' and the edge area 2112' is located outside the circuit board 211'.

[0288] Usually, if Figure 3 As shown, the circuit board 211 ' further includes at least one group of circuit board connectors 2113 ', wherein each of the circuit board connectors 2113 ' is respectively disposed at the edge region 2112 ' of the circuit board 211 '.

[0289] like Figure 3 As shown, the photosensitive element 212' includes a photosensitive area 2121', a non-photosensitive area 2122' and at least one group of chip connectors 2123'. The photosensitive area 2121' and the non-photosensitive area 2122' are integrally formed, and the non-photosensitive area 2122' is located around the photosensitive area 2121', that is, the photosensitive area 2121' is located in the middle of the photosensitive element 212', the non-photosensitive area 2122' is located outside the photosensitive element 212', and the non-photosensitive element 2122' is arranged around the photosensitive area 2121'. Each chip connector 2123' is respectively arranged in the non-photosensitive area 2122' of the photosensitive element 212'.

[0290] like Figure 3 As shown, the imaging component 21' also includes at least one group of leads 213', wherein each of the leads has a circuit board connection end and a chip connection end, wherein each of the leads 213' extends in a curved manner between the chip connection end and the circuit board connection end, and the chip connection end of each lead 213' is respectively connected to each chip connector of the photosensitive element 212', and the circuit board connection end of each lead 213' is respectively connected to each circuit board connector of the circuit board 211', accordingly, to conduct the photosensitive element 212' and the circuit board 211'.

[0291] It is worth mentioning that the type of the lead 213' may not be limited, for example, the lead 213' may be a gold wire, that is, after the photosensitive element 212' is mounted on the chip mounting area 2111' of the circuit board 211', the lead 213' can be connected to the photosensitive element 212' and the circuit board 211' through the gold wire punching process. Nevertheless, in other examples, the lead 213' may also be other types of leads, such as silver wire, copper wire, etc., to ensure that the lead 213' can connect the photosensitive element 212' and the circuit board 211'.

[0292] It is worth noting that in an example of the camera module of the present invention, each circuit board connector 2113` of the circuit board 211` and each chip connector 2123` of the photosensitive element 212` can be a connecting disk, that is, each circuit board connector 2113` of the circuit board 211` and each chip connector 2123` of the photosensitive element 212` can be a disk-shaped one, so that the circuit board connection end and the chip connection end of the lead 213` are respectively connected to the circuit board connector 2113` of the circuit board 211` and the chip connector 2123` of the photosensitive element 212`. In another example of the camera module of the present invention, the circuit board connector 2113` of the circuit board 211` and the chip connector 2123` of the photosensitive element 212` can be spherical respectively. For example, solder paste or other welding materials are applied to the edge area 2112` of the circuit board 211` and the non-photosensitive area 2122` of the photosensitive element 212` to respectively form the circuit board connector 2113` of the circuit board 211` and the chip connector 2123` of the photosensitive element 212`. Nevertheless, it will be understood by those skilled in the art that the types of the circuit board connector 2113` of the circuit board 211` and the chip connector 2123` of the photosensitive element 212` do not constitute a limitation on the type and scope of the camera module of the present invention, that is, in other examples of the camera module, the circuit board connector 2113` of the circuit board 211` and the chip connector 2123` of the photosensitive element 212` may also have other shapes not listed above.

[0293] In addition, if Figure 3As shown, the imaging assembly 21' further includes a group of electronic components 214', and each of the electronic components 214' can be mounted on the edge area 2112' of the circuit board 211' at intervals by a process such as SMT (Surface Mount Technology). It is worth mentioning that the photosensitive element 212' and each of the electronic components 214' can be located on the same side or opposite sides of the circuit board 211'. For example, in the attached Figure 3 In a specific example shown, the photosensitive element 212' and each of the electronic components 214' can be located on the same side of the circuit board 211', and the photosensitive element 212' is mounted on the chip mounting area 2111' of the circuit board 211', and each of the electronic components 214' is mounted on the edge area 2112' of the circuit board 211' at intervals from each other. It should be understood that in the camera module of the present invention, the type of the electronic component 214' may not be limited, for example, the electronic component 214' can be implemented as a resistor, a capacitor, a driver, etc.

[0294] According to the first preferred embodiment of the present invention, Figure 3 As shown, each of the stepped peripheral grooves 230' of the molded base 23' of the molded photosensitive component 20' defines a light window 2301', and each of the filter elements 221' disposed in each of the stepped peripheral grooves 230' corresponds to each of the light windows, wherein the photosensitive area 2121' of each of the photosensitive elements 212' corresponds to each of the light windows 2301', so that each of the light windows 2301' provides a light path for each of the optical lenses 10' and each of the photosensitive elements 212', and each of the filter elements 221' is correspondingly located in the light path. For example, in the attached Figure 3 In the specific example shown, the filter assembly 22' includes a filter element 221', and the molded base 23' has a stepped peripheral groove 230' to define the light window 2301', wherein the filter element 221' is located between the optical lens 10' and the photosensitive element 212', and the filter element 221', the optical lens 10' and the photosensitive element 212' all correspond to the light window 2301', so as to provide the filter element 221', the optical lens 10' and the photosensitive element 212' with the light path through the light window 2301', so that the light entering the interior of the camera module 1' from the optical lens 10' can be received by the photosensitive area 2121' of the photosensitive element 212' and photoelectrically converted only after being filtered by the filter element 221'.

[0295] Those skilled in the art can understand that, in different examples of the camera module, the filter element 221' can be implemented as different types, for example, the filter element 221' can be implemented as an infrared cutoff filter, a full-spectrum filter and other filters or a combination of multiple filters, for example, the filter element 221' can be implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located at the photosensitive element 21'. On the photosensitive path, for example, when the camera module is used in an environment with sufficient light such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive element 212', so that the infrared cutoff filter can filter the infrared rays in the light reflected by the object entering the camera module. When the camera module is used in an environment with darker light such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive element 212' to allow the infrared rays in the light reflected by the object entering the camera module to pass through.

[0296] It is worth noting that since the filter element 221` of the filter assembly 22` is arranged in the stepped peripheral groove 230` of the molded base 23`, in the camera module 1` provided by the present invention, the distance between the optical lens 10` and the circuit board 211` is no longer limited by the thickness of the filter assembly 22` itself, that is, the distance between the optical lens 10` and the circuit board 211` can be reduced to be less than the sum of the thickness of the filter assembly 22` and the height of the molded base 23`, thereby reducing the height of the camera module 1`.

[0297] Specifically, Figure 2 and Figure 3As shown, the molded base 23' includes a first base portion 231' and a second base portion 232', wherein the second base portion 232' extends inwardly as a whole along the circuit board 211' from a first inner circumferential surface 2311' of the first base portion 231', wherein the height of the first base portion 231' is greater than the height of the second base portion 232', so as to form the stepped peripheral groove 230' through the first base portion 231' and the second base portion 232', and form the light window 2301' through the first inner circumferential surface 2311' of the first base portion 231' and a second inner circumferential surface 2321' of the second base portion 232'. In other words, the first base portion 231` is located around the second base portion 232`, wherein a first bottom surface 2313` of the first base portion 231` and a second bottom surface 2323` of the second base portion 232` are both attached to the circuit board 211`, and a first top surface 2312` of the first base portion 231` is higher than a second top surface 2322` of the second base portion 232` to form the stepped peripheral groove 230` on an inner peripheral edge of the molded base 23`.

[0298] Therefore, in the first preferred embodiment according to the present invention, Figure 3 As shown, the first top surface 2312` of the first base portion 231` of the molded base 23` is defined as a first mounting surface of the molded base 23`, for mounting the optical lens 10`; the second top surface 2322` of the second base portion 232` of the molded base 23` is positioned as a second mounting surface of the molded base 23`, for mounting the filter element 221`. Since the second mounting surface is lower than the first mounting surface, the mounting height of the filter element 221` is reduced, so the back focus of the optical lens 10` of the camera module 1` is also reduced, thereby reducing the overall height of the camera module 1`, so as to meet the market demand for the development of thinner and smaller camera modules. It should be understood that compared with the camera module in the prior art, not only the support in the filter assembly is eliminated, but the filter is also directly mounted on the second mounting surface of the molded base 23', and the lens is directly mounted on the first mounting surface of the module base 23'. This not only reduces the installation height of the filter, but also reduces the distance between the lens and the circuit board, so as to reduce the overall height of the camera module.

[0299] Preferably, the first top surface 2312' of the first base portion 231' and the photosensitive surface of the photosensitive element 212' are parallel to each other, so as to facilitate the subsequent active calibration of the optical lens 10' and the photosensitive element 212' mounted on the first top surface 2312'.

[0300] In addition, if Figure 3 As shown, the second top surface 2322` of the second base portion 232` is parallel to the first top surface 2312` of the first base portion 231`, that is, the second top surface 2322` of the second base portion 232` is also parallel to the photosensitive surface of the photosensitive element 212`, so that the filter element 221` installed on the second top surface 2322` remains parallel to the photosensitive element 212`.

[0301] According to the first preferred embodiment of the present invention, Figure 2 and Figure 3 As shown, after the molded base 23' is formed by a molding process, the molded base 23' covers at least a portion of the edge area 2112' of the circuit board 211', each of the electronic components 214', each of the leads 213' and at least a portion of the non-photosensitive area 2122' of the photosensitive element 212', so as to combine the circuit board 211', the photosensitive element 212', the leads 213' and the electronic components 214' of the imaging component 21' into one, so that the imaging component 21' and the molded base 23' form an integrated structure.

[0302] For example, Figure 3 As shown, the first base portion 231' of the mold base 23' covers at least a portion of the edge region 2112' of the circuit board 211' and each of the electronic components 214', so as to isolate the adjacent electronic components 214' by the first base portion 231' of the mold base 23'. Correspondingly, the second base portion 232' of the mold base 23' covers at least a portion of the edge region 2112' of the circuit board 211', each of the leads 213', and at least a portion of the non-photosensitive region 2122' of the photosensitive element 212', so as to isolate the adjacent leads 213' by the second base portion 232' of the mold base 23'.

[0303] Specifically, Figure 3As shown, the non-photosensitive area 2122` of the photosensitive element 212` has a chip inner portion 21221`, a chip connecting portion 21222` and a chip outer portion 21223`, wherein the chip inner portion 21221` is located around the photosensitive area 2121`, the chip connecting portion 21222` extends inwardly and outwardly respectively to connect to the chip inner portion 21221` and the chip outer portion 21223`, and each chip connecting member 2123` is arranged on the chip connecting portion 21222`. In other words, in the present invention, the area of ​​the photosensitive element 212' used to set the chip connector 2123' is defined as the chip connecting portion 21222', the area of ​​the photosensitive element 212' from the chip connecting portion 21222' to the photosensitive area 2121' is defined as the chip inner portion 21221', and the area of ​​the photosensitive element 212' from the chip connecting portion 21222' to the outer edge of the photosensitive element 212' is defined as the chip outer portion 21223'. In other words, when the photosensitive element 212' is viewed from a top view, from the inside to the outside, it is the photosensitive area 2121', the chip inner portion 21221', the chip connecting portion 21222' and the chip outer portion 21223'.

[0304] Similarly, Figure 3 As shown, the edge area 2112` of the circuit board 211` has a circuit board inner portion 21121`, a circuit board connecting portion 21122` and a circuit board outer portion 21123`, wherein the circuit board inner portion 21121` is located around the chip mounting area 2111`, the circuit board connecting portion 21122` extends inwardly and outwardly respectively to connect to the circuit board inner portion 21121` and the circuit board outer portion 21123`, and the circuit board connector 2113` is arranged on the circuit board connecting portion 21122`. In other words, in the present invention, the area of ​​the circuit board 211` used to set the circuit board connector 2113` is defined as the circuit board connecting portion 21122`, the area of ​​the circuit board 211` from the circuit board connecting portion 21122` to the chip photosensitive area 2111` is defined as the circuit board inner portion 21121`, and the area of ​​the circuit board 211` from the circuit board connecting portion 21122` to the outer edge of the circuit board 211` is defined as the circuit board outer portion 21123`. In other words, when the circuit board 211` is viewed from a top view, from the inside to the outside, the chip mounting area 211`, the circuit board inner portion 21121`, the circuit board connecting portion 21122`, and the circuit board outer portion 21123` are sequentially arranged.

[0305] In this way, Figure 3As shown, the first base portion 231` of the molded base 23` is configured to cover the circuit board outer portion 21123` of the edge area 2112` of the circuit board 211`, and the second base portion 232` of the molded base 23` is configured to cover the circuit board connecting portion 21122` and the circuit board inner portion 21121` of the edge area 2112` of the circuit board 211` and the chip outer portion 21223` and the chip connecting portion 21222` of the non-photosensitive area 2122` of the photosensitive element 212`, so that each of the electronic components 214` is covered by the first base portion 231` of the molded base 23`, and each of the leads 213` is covered by the second base portion 232` of the molded base 23`. It is worth mentioning that in the present invention, the height of the first base portion 231' of the molded base 23' is limited by the height of each electronic component 214', and the height of the second base portion 232' of the molded base 23' is limited by the arc height of each lead 213'.

[0306] In order to avoid any contact between the mold used and each of the electronic components 214' and each of the leads 213' during the molding process, a certain safety gap needs to be reserved between the mold used and each of the electronic components 214' and each of the leads 213'. Therefore, the height of the first base portion 231' must be greater than the height of the highest electronic component in the electronic components 214', and the height of the second base portion 232' must be greater than the arc height of the highest lead in the leads 213'. In addition, since the height of the capacitor in the electronic component 214' is relatively high (the smallest capacitor is currently 0.38 mm high), and the height of the capacitor is also greater than the arc height of each of the leads 213', the height of the second base portion 232' can be less than the height of the first base portion 231', so as to reduce the height of the filter element 221' mounted on the second top surface 2322' of the second base portion 232'.

[0307] Preferably, if Figure 3As shown, the height of the second base portion 232' is less than the height of the electronic component 214', that is, the second top surface 2322' of the second base portion 232' is lower than the top surface of the electronic component 214', so that the lower surface 2211' of the filter element 221' is lower than the top surface of the electronic component 214'. Of course, since the heights of different electronic components 214' are different, in some other embodiments of the present invention, the height of the second base portion 232' only needs to be less than the height of the highest electronic component among the electronic components 214', that is, the first top surface 2322' of the second base portion 232' only needs to be lower than the top surface of the highest electronic component 214'.

[0308] It should be understood that the height difference between the first base portion 231` and the second base portion 232` can be designed according to the height difference between the electronic component 214` and the lead 213`, and the thickness of the filter element 221` is designed according to the filtering performance and the manufacturing process, so that an upper surface 2212` of the filter element 221` can be higher than the first top surface 2312` of the first base portion 231`, or lower than the first top surface 2312` of the first base portion 231`, or can be flush with the first top surface 2312` of the first base portion 231`. Of course, in the first preferred embodiment of the present invention, since the thickness of the filter element 221` is greater than the height difference between the first base portion 231` and the second base portion 232`, when the lower surface 2211` of the filter element 221` is mounted on the second top surface 2322` of the second base portion 232`, the upper surface 2212` of the filter element 221` is higher than the first top surface 2321` of the first base portion 231`.

[0309] Attached Figure 4AThe figure shows a first variant embodiment of the molded photosensitive component 20' according to the first preferred embodiment of the present invention, wherein the first base portion 231' of the molded base 23' is configured to cover the outer portion 21123' and the circuit board connecting portion 21122' of the edge region 2112' of the circuit board 211', and the second base portion 232' of the molded base 23' is configured to cover the inner portion 21121' and the photosensitive element 2112' of the edge region 2112' of the circuit board 211'. The chip outer portion 21223`, the chip connecting portion 21222` and a portion of the chip inner portion 21221` of the non-photosensitive area 2122` of the molded base 23` are formed so that each of the electronic components 214` is covered by the first base portion 231` of the molded base 23`, and each of the leads 213` is covered by the first base portion 231` and the second base portion 232` of the molded base 23`, so that the adjacent leads 213` are isolated from each other by the first and second base portions 231` and 232` of the molded base 23`.

[0310] In this way, since the distance between the second base portion 232` of the molding base 23` and the electronic component 214` is increased, when the electronic component 232` is closer to the lead 213`, the electronic component 232` will not affect the molding process of the second base portion 232` of the module base 23`. In other words, in the process of molding the molding base 23`, the electronic component 214` and the part of the molding mold that molds the second base portion 232` do not interfere with each other, so as to ensure the normal progress of the molding process.

[0311] Attached Figure 4BA second variant embodiment of the molded photosensitive component 20' according to the first preferred embodiment of the present invention is shown, wherein the first base portion 231' of the molded base 23' is configured to cover the circuit board outer portion 21123', the circuit board connecting portion 21122' and the circuit board inner portion 21121' of the edge region 2112' of the circuit board 211', and the second base portion 232' of the molded base 23' is configured to cover the non-photosensitive region 2112' of the photosensitive element 211'. The chip outer portion 21223`, the chip connecting portion 21222` and a portion of the chip inner portion 21221` of the molded base 23` make each of the electronic components 214` covered by the first base portion 231` of the molded base 23`, and each of the leads 213` is covered by the first base portion 231` and the second base portion 232` of the molded base 23`, so as to isolate adjacent leads 213` by the first and second base portions 231`, 232` of the molded base 23`. In other words, the first base portion 231` of the molded base 23` covers the edge area 2112` of the circuit board 211`, and the second base portion 232` of the molded base 23` covers a portion of the non-photosensitive area 2122` of the photosensitive element 212`, which is conducive to bringing the installation position of the electronic component 214` closer to the circuit board connector 2113` of the circuit board 211`, so as to reduce the overall size of the circuit board 211`.

[0312] Attached Figure 4C 1. A third variant embodiment of the molded photosensitive component 20' according to the first preferred embodiment of the present invention is shown, wherein the first base portion 231' of the molded base 23' is configured to cover the edge region 2112' of the circuit board 211' and the chip outer portion 21223' of the non-photosensitive region 2122' of the photosensitive element 212', and the second base portion 232' of the molded base 23' is configured to cover the non-photosensitive region 2122' of the photosensitive element 212'. The chip connection portion 21222` and a portion of the chip inner portion 21221` of the light area 2122` enable each of the electronic components 214` to be covered by the first base portion 231` of the molded base 23`, and each of the leads 213` to be covered by the first base portion 231` and the second base portion 232` of the molded base 23`, so as to isolate adjacent leads 213` through the first and second base portions 231`, 232` of the molded base 23`.

[0313] In other words, the first base portion 231' of the mold base 23' not only covers the edge region 2112' of the circuit board 211', but also covers a portion of the non-photosensitive region 2122' of the photosensitive element 212', so as to enhance the connection strength between the photosensitive element 212' and the circuit board 211' through the first base portion 231'. At the same time, since the second base portion 232' of the mold base 23' only covers a portion of the non-photosensitive region 2122' of the photosensitive element 212', the lateral dimension of the stepped peripheral groove 230' of the module base 23' is smaller than the lateral dimension of the photosensitive element 212', and therefore, the lateral dimension of the filter element 221' disposed in the stepped peripheral groove 230' is also smaller than the lateral dimension of the photosensitive element 212', but larger than the lateral dimension of the photosensitive region 2121' of the photosensitive element 212'. In this way, not only can the filter element 221' be ensured to achieve the corresponding filtering effect, but the size of the filter element 221' can also be reduced as much as possible. This is because the larger the size of the filter element 221', the easier it is to break, and the larger the size, the higher the cost.

[0314] Reference Figures 1 to 5B As shown, the camera module 1' also includes at least one driver 30', wherein each of the optical lenses 10' is respectively assembled to each of the drivers 30', and each of the drivers 30' is respectively assembled to the first top surface 2312' of the first base portion 231' of the molded base 23', so that each of the optical lenses 10' is respectively maintained in the photosensitive path of each of the photosensitive elements 212' of the molded photosensitive component 20'. In addition, when the camera module is in use, the driver 30' can drive the optical lens 10' to move back and forth along the photosensitive path of the photosensitive element 212', so as to adjust the focal length of the camera module by adjusting the distance between the optical lens 10' and the photosensitive element 212'. The type of the driver 30' of the camera module 1' of the present invention is not limited, and the driver 30' can be implemented as a voice coil motor, which can be electrically connected to the circuit board 211', so as to be in a working state after receiving electric energy and control signals, and drive the optical lens 10' to move back and forth along the photosensitive path of the photosensitive element 212'. Nevertheless, it can be understood by those skilled in the art that the type of the driver 30' is not limited, as long as it can drive the optical lens 10' to move back and forth along the photosensitive path of the photosensitive element 212'.

[0315] Reference Figure 5A and Figure 5BFIG. 1 shows a manufacturing process of the camera module 1′ according to the first preferred embodiment of the present invention. A person skilled in the art should understand that in the attached Figure 5A and Figure 5B The manufacturing process of the molded photosensitive component 20' and the manufacturing process of the camera module 1' shown in the figure are only used as examples to illustrate the features and advantages of the present invention, and do not constitute a limitation on the content and scope of the present invention.

[0316] Specifically, in the attached Figure 5A In the embodiment, the photosensitive element 212' is mounted on the chip mounting area 2111' of the circuit board 211', so that the chip connection end of each lead 213' is connected to each chip connection part 2123' of the photosensitive element 212', and the circuit board connection end of each lead 213' is connected to each circuit board connection part 2113' of the circuit board 211'. Each electronic component 214' is mounted on the outer side 21123' of the edge area 2112' of the circuit board 211' at intervals to assemble the imaging assembly 21'.

[0317] In the attached Figure 5A In the embodiment of the present invention, the imaging component 21' is placed in a molding mold 500', and a molding process is performed on the molding mold 500', thereby forming the molding base 23' having the stepped peripheral groove 230', and the edge area 2112' of the circuit board 211' and a portion of the non-photosensitive area 2122' of the photosensitive element 212' are covered by the molding base 23'. Those skilled in the art should understand that in other embodiments of the present invention, a plurality of the imaging components 21' may be placed in a molding mold at the same time, and a molding process is performed on the plurality of the imaging components 21' by the molding mold, thereby forming a plurality of the molding bases 23' having the stepped peripheral groove 230' at one time.

[0318] Specifically, the molding module 500' includes an upper mold 510' and a lower mold 520', wherein at least one of the upper and lower molds 510', 520' can be moved so that the upper mold 510' and the lower mold 520' can be molded and demolded, and when the molding mold 500' is in a molded state, a molding space 530' is formed between the upper mold 510' and the lower mold 520', wherein the module base 23' is formed by adding a molding material into the molding space 530' and curing it.

[0319] More specifically, the upper mold 510` has a first inner surface 511`, a second inner surface 512` and a pressing surface 513`, wherein the second inner surface 512` is located around the first inner surface 511`, and the second inner surface 512` is located between the first inner surface 511` and the pressing surface 513`, wherein the second inner surface 512` is lower than the first inner surface 511`, and the pressing surface 513` is lower than the second inner surface 512`.

[0320] In the attached Figure 5A In the process, after the imaging component 21' is placed on the upper mold 510' and / or the lower mold 520', the upper mold 510' and the lower mold 520' are operated to close the mold so that the imaging component 21' is located in the molding space 530' formed between the upper mold 510' and the lower mold 520'. At this time, the first inner surface 511` of the upper mold 510` corresponds to the outer side 21123` of the circuit board in the edge area 2112` of the circuit board 211`, so as to define a first molding space 531` between the first inner surface 511` and the circuit board 211`, and form the first base portion 231` after the molding material is added into the first molding space 531` and solidified; the second inner surface 512` of the upper mold 510` corresponds to the circuit board connecting portion 21122` and the inner side 21121` of the circuit board in the edge area 2112` of the circuit board 211`, as well as the chip outer side 21223` and the non-photosensitive element 2122` of the photosensitive element 212`. The inner side portion 21221` of the chip is used to define a second molding space 532` between the second inner surface 512` and the circuit board 211`, and the second base portion 232` is formed after the molding material is added into the second molding space 532` and solidified; the pressing surface 513` of the upper mold 510` applies pressure to the photosensitive element 212`. Since the photosensitive element 212` is located in the chip mounting area 2111` of the circuit board 211`, and the chip mounting area 2111` is located in the middle of the circuit board 211`, the circuit board 211` can be flattened by the pressing surface 513`, thereby ensuring the overall flatness of the circuit board 211`, and providing a flat molding base surface for the molding process.

[0321] It is worth noting that the first molding space 531' is connected to the second molding space 532' to form the molding space 530' with an integrated structure, so that the molding material can flow from the first molding space 531' into the second molding space 532', so as to form the molding base 23' with an integrated structure after the molding material is solidified. It should be understood that when the molding material is solidified in the molding space 530' to form the molding base 23', the first inner surface 511' of the upper mold 510' corresponds to the first top surface 2312' of the first base portion 231' of the molding base 23', and the second inner surface 512' of the upper mold 510' corresponds to the second top surface 2322' of the second base portion 232' of the molding base 23'. The first inner surface 511` of the upper mold 510` is higher than the second inner surface 512` of the upper mold 520`, so that the height of the first base portion 231` is greater than the height of the second base portion 232`, so as to form the stepped peripheral groove 230` on the inner peripheral edge of the molding base 23`.

[0322] It is worth mentioning that the first inner surface 511` and the second inner surface 512` of the upper mold 510` are parallel to the pressing surface 513` of the upper mold 510`. When the pressing surface 513` applies overlapping pressure to the photosensitive element 212`, the first inner surface 511` and the second inner surface 512` are parallel to the photosensitive element 212`, so that after the molding base 23` is formed, the first top surface 2312` and the second top surface 2322` are parallel to the photosensitive element 212`, which is convenient for active calibration in the subsequent assembly process.

[0323] Furthermore, if Figure 5AAs shown, the molding die 500' further includes a covering film 540', wherein the covering film 540' is overlappedly disposed on the pressing surface 513' of the upper die 510'. When the pressing surface 513' of the upper die 510' applies pressure to the photosensitive element 212', the covering film 540' is located between the pressing surface 513' of the upper die 510' and the photosensitive element 212', so as to prevent the pressing surface 513' of the upper die 510' from scratching the photosensitive element 212' or contaminating the photosensitive element 212'. In addition, the covering film 540' can also prevent a gap from being formed between the pressing surface 513' of the upper mold 510' and the photosensitive element 212', so as to prevent the molding material from entering between the pressing surface 513' of the upper mold 510' and the photosensitive element 212' during the molding process and contaminating the photosensitive area 2121' of the photosensitive element 212'. Of course, the covering film 540' can also absorb the impact force generated when the pressing surface 513' of the upper mold 510' contacts the photosensitive element 212' when the upper mold 510' and the lower mold 520' are closed, thereby preventing the closing of the upper mold 510' and the lower mold 520' from damaging the photosensitive element 212'.

[0324] In other embodiments of the present invention, the covering film 540` of the molding mold 500` has an annular structure, wherein the covering film 540` is arranged on the peripheral edge of the pressing surface 513` of the upper mold 510`, so that after the upper and lower molds 510` and 520` are clamped, the covering film 540` correspondingly applies pressure to the chip inner side 21221` of the non-photosensitive area 2122` of the photosensitive element 212`, so as to avoid direct contact between the covering film 540` and the pressing surface 513` and the photosensitive area 2121` of the photosensitive element 212`, so that the photosensitive area 2121` of the photosensitive element 212` will not be damaged due to external pressure.

[0325] like Figure 5BAs shown, after the molding material is solidified in the molding space 530' to form the molding base 23', a molded photosensitive component semi-finished product is made, wherein the molded photosensitive component semi-finished product includes the imaging component 21' and the molding base 23'. Next, the upper mold 510' and the lower mold 520' are operated to perform demolding to open the molding space 530' of the molding mold 500', so as to remove the molded photosensitive component semi-finished product from the molding space 530'. Then, the filter element 221' is mounted on the second top surface 2322' of the second base portion 232' of the molding base 23' to form the molded photosensitive component 20'.

[0326] In order to better perform the demolding operation, the inner peripheral surface of the molding base 23' has a certain inclination angle relative to the photosensitive surface of the photosensitive element 212'. Figure 3 and Figure 5A As shown, the first inner circumferential surface 2311` of the first base portion 231` has a first predetermined inclination angle θ1 relative to the photosensitive surface of the photosensitive element 212`, and the second inner circumferential surface 2321` of the second base portion 232` also has a second predetermined inclination angle θ2 relative to the photosensitive surface of the photosensitive element 212`, and the width of the first top surface 2312` of the first base portion 231` is smaller than the width of the first bottom surface 2313` of the first base portion 231`, and the width of the second top surface 2322` of the second base portion 232` is smaller than the width of the second bottom surface 2323` of the second base portion 232`.

[0327] However, in order to make the filter element 221` have a wider attachment surface, that is, the second base portion 232` has a wider second top surface 2322`, therefore, the first and second predetermined inclination angles θ1, θ2 are as small as possible, and even the first and second predetermined inclination angles θ1, θ2 can be zero (that is, the first inner circumferential surface 2311` and the second inner circumferential surface 2321` can be perpendicular to the photosensitive surface of the photosensitive element 212`).

[0328] Preferably, the first and second predetermined inclination angles θ1, θ2 are less than 30°, so as to increase the attachment area between the filter element 221` and the second top surface 2322` of the second base portion 232`, so as to improve the reliability of the bonding between the filter element 221` and the second base portion 232`, and prevent the filter element 221` from being offset or falling off.

[0329] According to the first preferred embodiment of the present invention, Figure 5BAs shown, the filter component 22' also includes an adhesive layer 222', wherein the adhesive layer 222' is arranged between the second top surface 2322' of the second base portion 232' and the filter element 221' to adhere the filter element 221' to the second base portion 232', thereby fixing the filter element 221' to the stepped peripheral groove 230' of the molded base 23' and making the filter element 221' correspond to the light window 2301' of the molded base 23'.

[0330] Specifically, in the attached Figure 5B In the illustrated embodiment of mounting the filter element 221`, a glue is first applied to the second top surface 2322` of the second base portion 232`, and then the filter element 221` is correspondingly arranged on the second top surface 2322` of the second base portion 232`, so that after the glue is cured, the adhesive layer 222` is formed between the second top surface 2322` of the second base portion 232` and the lower surface 2211` of the filter element 221`, so that the filter element 221` and the second base portion 232` of the molded base 23` are fixedly connected via the adhesive layer 222`.

[0331] In another embodiment of mounting the filter element 221` in the present invention, glue may be first applied to the lower surface 2211` of the filter element 221`, and then the filter element 221` may be correspondingly arranged on the second top surface 2322` of the second base portion 232`, so that after the glue is cured, the adhesive layer 222` is formed between the second top surface 2322` of the second base portion 232` and the lower surface 2211` of the filter element 221`, so that the filter element 221` and the second base portion 232` of the molded base 23` are fixedly connected through the adhesive layer 222`.

[0332] It is worth mentioning that the glue used to form the adhesive layer 222' can be a thermosetting glue or other types of glue. Preferably, the adhesive layer 222' can have good elasticity to prevent the filter element 221' from being damaged when the camera module 1' collides. More preferably, the glue forming the adhesive layer 222' has low fluidity to prevent the glue from flowing down from the second inner circumferential surface 2321' of the second base portion 232' to ensure the product yield of the camera module. The reason for choosing glue with poor fluidity is that, on the one hand, the reflectivity of the glue after curing will be greater than the reflectivity of the module base 23'. Once the glue flows to the second inner circumferential surface 2321', it may cause stray light problems for the camera module; on the other hand, if the glue is left in the photosensitive area 2121' of the photosensitive element 212', it will contaminate the photosensitive area 2121' of the photosensitive element 212'.

[0333] In addition, if Figure 5B As shown, a mounting gap 2302' is reserved between the filter element 221' and the first inner peripheral surface 2311' of the first base portion 231', that is, the lateral dimension of the stepped peripheral groove 230' of the mold base 23' is larger than the lateral dimension of the filter element 221', so that the filter element 221' can be attached to the second top surface 2322' of the second base portion 232'. In this way, since the outer periphery of the filter element 221' does not directly contact the first base portion 231', but the safety gap 2302' is reserved, it is possible to effectively prevent the first base portion 231' of the mold base 23' from transmitting the stress it is subjected to to the filter element 221', so as to prevent the filter element 221' from being damaged. Of course, the lateral dimension of the filter element 221 ′ is smaller than the lateral dimension of the stepped peripheral groove 230 ′ of the molding base 23 ′, which is also conducive to mounting the filter element 221 ′ into the stepped peripheral groove 230 ′.

[0334] Preferably, if Figure 5BAs shown, the adhesive layer 222` has at least one air escape hole 2221`, wherein the air escape hole 2221` extends from the inner side of the adhesive layer 222` to the outer side of the adhesive layer 222`, so as to connect the inner space of the adhesive layer 222` with the safety gap 2302` through the air escape hole 2221`, and further connect the inner space of the molded photosensitive component 20` with the outer space of the molded photosensitive component 20`, so that when the filter element 221` is mounted to the stepped peripheral groove 230` of the molded base 23`, the air between the filter element 221` and the photosensitive element 212` is allowed to escape to the outside through the air escape hole 2221` to prevent the mounting of the filter element 221` from being affected.

[0335] In other words, the glue is applied on the second top surface 2322' of the second base portion 232' in a discontinuous manner to form the adhesive layer 222' having the air escape holes 2221' after the glue is cured. In other words, the glue cannot be applied in a circle on the second top surface 2322' of the second base portion 232', but the glue is applied intermittently to reserve at least one gap, so that after the glue is cured, the air escape holes 2221' are formed on the adhesive layer 222'.

[0336] In the attached Figure 3 and Figure 5B In the process, the optical lens 10' is assembled to the driver 30', and the driver 30' is assembled to the first top surface 2312' of the first base portion 231' of the molded base 23', so that the optical lens 10' is maintained in the photosensitive path of the photosensitive element 212', thereby forming the camera module 1'.

[0337] Attached Fig. 6A A first variant embodiment of the camera module 1' is shown, wherein the camera module 1' is implemented as a fixed-focus camera module, that is, the driver 30' may be absent in this embodiment of the camera module of the present invention. Specifically, the camera module 1' includes at least one lens barrel 40', wherein the lens barrel 40' integrally extends to the first top surface 2312' of the first base portion 231' of the molded base 23', and each of the optical lenses 10' is respectively assembled to each of the lens barrels 40', so that each of the optical lenses 10' is maintained in the photosensitive path of each of the photosensitive elements 212' of the molded photosensitive component 20' by each of the lens barrels 40'. That is, in this embodiment of the camera module of the present invention, the lens barrel 40' and the molded base 23' can be integrally solidified and formed by the molding material through a molding process, thereby enhancing the stability and reliability of the camera module.

[0338] Attached Figure 6B A second modified embodiment of the camera module 1' is shown, wherein after the mold base 23' is formed by solidifying the molding material through a molding process, the separately manufactured lens barrel 40' is assembled to the first top surface 2312' of the first base portion 231' of the module base 23', wherein the optical lens 10' is assembled to the lens barrel 40', thereby maintaining the optical lens 10' in the photosensitive path of the photosensitive element 212' of the molded photosensitive component 20' through the lens barrel 40'. In addition, in the process of assembling the lens barrel 40' to the first top surface 2312' of the first base portion 231' of the mold base 23', the angle at which the lens barrel 40' is assembled to the first top surface 2312' of the first base portion 231' of the mold base 23' can be adjusted by a calibration device, so that the optical axis of the optical lens 10' can be perpendicular to the photosensitive surface of the photosensitive element 212' to ensure the imaging quality of the camera module 1'. It is understandable that the lens barrel 40' can be made separately, so that the lens barrel 40' can be threaded or not, and the present invention is not limited in this respect.

[0339] Attached Figure 6C A third variant embodiment of the camera module 1' is shown, wherein during the process of mounting the photosensitive element 212', the lead 213' is connected to the circuit board 211' and the photosensitive element 212' through a "reverse punching" process. In this way, the height of the upward protrusion of the lead 213` can be no more than the height of the upward protrusion of the chip connector 2123` of the photosensitive element 212`, that is, the arc height of the lead 213` is reduced to reduce the height of the second base portion 232` of the molded base 23`, thereby increasing the height difference between the first top surface 2311` of the first base portion 231` and the second top surface 2321` of the second base portion 232`, so that the upper surface 2212` of the filter element 221` is flush with the first top surface 2312` of the first base portion 231`, or even the upper surface 2212` of the filter element 221` is lower than the first top surface 2312` of the first base portion 231`, so as to prevent the optical lens 10` from hitting the filter element 221` when moving.

[0340] It is worth mentioning that the "reverse punching" process involved in the present invention refers to the process in which the lead 213' is connected to the photosensitive element 212' and the circuit board 211' through the lead 213', and the wire bonding method of the lead 213' is from the circuit board 211' to the photosensitive element 212'. Specifically, by setting the circuit board connector 2113` on the circuit board 211`, the wire bonding jig first bonds at the top of the circuit board connector 2113` to form the circuit board connection end of the lead 213` connected to the circuit board connector 2113`, then raises the preset position, and then translates toward the circuit board connector 2113` and forms the chip connection end of the lead 213` connected to the chip connector 2123` at the top of the chip connector 2123`, so that the lead 213` extends in a curved shape. In this way, the height of the lead 213` protruding upward can be basically flush with the height of the chip connector 2123`, and can even make the height of the lead 213` protruding upward lower than the height of the chip connector 2123`.

[0341] Attached Fig.6D A fourth variant embodiment of the camera module 1' is shown, wherein the second base portion 232' of the molded base 23' is further provided with a glue groove 2324', and the glue groove 2324' is recessed downward from the second top surface 2322' of the second base portion 232', wherein the glue can be applied in the glue groove 2324' of the second base portion 232', and the glue protrudes from the second top surface 2322' of the second base portion 232'. Therefore, after the filter element 221` is correspondingly arranged on the imaging component 21`, the adhesive layer 222` formed by the curing of the glue can be overlappedly arranged on the lower surface 2211` of the filter element 221`, thereby ensuring that the filter element 221` is firmly arranged on the stepped peripheral groove 230` of the molding base 23`, and preventing the glue from flowing to the second inner peripheral surface 2321` of the second base portion 232` of the molding base 23`.

[0342] Attached Fig. 6E A fifth variant embodiment of the camera module 1' is shown, wherein the filter component 22' also includes at least one annular support member 223', wherein the filter element 221' is assembled to the support member 223', and the support member 223' is arranged on the first base portion 231' of the molded base 23', so that the filter element 221' is correspondingly arranged in the stepped peripheral groove 230' of the molded base 23' through the support member 223'.

[0343] Specifically, the upper surface 2212' of the filter element 221' is fixedly attached to the lower side of the support member 223' through the adhesive layer 222', so that when the support member 223' is attached to the first top surface 2312' of the first base portion 231' of the mold base 23', the upper surface 2212' of the filter element 221' is located below the first top surface 2312'. Through this attachment method, the attachment width or attachment area between the filter element 221' and the support member 223' can be increased to enhance the bonding strength between the filter element 221' and the support member 223', so as to prevent the filter element 221' from being damaged due to impact. In addition, the driver 30' of the camera module 1' is also mounted on the first top surface 2312' of the first base portion 231' of the molded base 23', and the support member 223' is located inside the driver 30' and will not increase the overall height of the camera mold 1'.

[0344] It is worth mentioning that the support member 223' can be made of a material with a certain toughness, such as plastic, metal, etc. Since the support member 223' is made of a material with higher toughness than the material of the mold base 23', the filter element 221' is not easy to be separated from the mold base 23', thereby reducing the risk of the filter element 221' breaking.

[0345] Attached Fig. 6F A sixth variant embodiment of the camera module 1` is shown, wherein the support member 223` of the filter component 22` is arranged between the driver 30` and the first top surface 2312` of the first base portion 231`, that is, the support member 223` is mounted on the first top surface 2312` of the first base portion 231`, and the driver 30` is mounted on the support member 223`, so that the filter element 221` is correspondingly arranged in the stepped peripheral groove 230` of the molded base 23` through the support member 223`.

[0346] It should be understood that, although in this modified embodiment, the height of the camera module 1' is increased by the thickness of the support member 223', since the thickness of the support member 223' is less than the thickness of the filter element 221', the height of the camera module 1' in this modified embodiment of the present invention is still reduced compared to the camera module of the prior art. In addition, since the contact area between the support member 223' and the molded base 23' is greatly increased, the filter element 221' can be more firmly mounted on the molded base 23' through the support member 223' to prevent the filter element 221' from being damaged due to collision.

[0347] Attached Figure 6G The seventh variant embodiment of the camera module 1' is shown, wherein the chip mounting area 2111' of the circuit board 211' of the imaging component 21' of the molded photosensitive component 20' is sunken to form a chip mounting groove 2114' at the chip mounting area 2111' of the circuit board 211', wherein the photosensitive element 212' is correspondingly arranged in the chip mounting groove 2114' of the circuit board 211' to reduce the sensitivity of the photosensitive element 212'. The height of the optical surface makes the height of the second base portion 232` of the molded base 23` be further lowered, so that the upper surface 2212` of the filter element 221` can be flush with the first top surface 2312` of the first base portion 231`, or even the upper surface 2212` of the filter element 221` can be lower than the first top surface 2312` of the first base portion 231`, so as to prevent the optical lens 10` from hitting the filter element 221` when moving.

[0348] In other words, the chip mounting groove 2114` of the circuit board 211` is recessed downward from the upper side of the circuit board 211` to form a groove in the chip mounting area 2111` of the circuit board 211`, wherein the photosensitive element 212` is mounted in the groove to lower the height of the photosensitive surface of the photosensitive element 212`, thereby further reducing the arc height of the lead 213`, which helps to lower the height of the second base portion 232` of the molded base 23`.

[0349] Attached Figure 6H An eighth variant embodiment of the camera module 1` is shown, wherein the circuit board 211` of the imaging component 21` of the molded photosensitive component 20` is also provided with a through-hole chip mounting slot 2114`, wherein the chip mounting slot 2114` extends downward from the upper side surface of the circuit board 211` to the lower side surface of the circuit board 211` to form a through hole in the chip mounting area 2111` of the circuit board 211`, wherein the photosensitive element 212` is correspondingly arranged in the through hole so that the photosensitive surface of the photosensitive element 212` is lower than the upper side surface of the circuit board 211`, thereby minimizing the line arc height of the lead 213`, so as to minimize the height of the second base portion 232` of the molded base 23`.

[0350] Refer to the attached figure 7A to 7D As shown, according to another aspect of the present invention, the first preferred embodiment of the present invention further provides a method for manufacturing a molded photosensitive component and a method for manufacturing a camera module. Fig. 7AAs shown, the method for manufacturing the molded photosensitive component includes the steps of:

[0351] S1: mounting a photosensitive element 212' and at least one group of electronic components 214' on a circuit board 211', and conducting the photosensitive element 212' and the circuit board 211' to assemble an imaging assembly 21';

[0352] S2: forming a molded base 23' having a stepped peripheral groove 230' for covering a portion of the circuit board 211' and a portion of the photosensitive element 212' through a molding process, so as to form a light window 2301' through the stepped peripheral groove 230', wherein a photosensitive area 2121' of the photosensitive element 212' corresponds to the light window 2301' of the molded base 23', so as to manufacture a molded photosensitive component semi-finished product having an integrated structure; and

[0353] S3: A filter element 221` of a filter component 22` is correspondingly arranged in the stepped peripheral groove 230` of the molded base 23` of the molded photosensitive component semi-finished product to assemble a molded photosensitive component 20`, wherein the photosensitive area 2121` of the photosensitive element 212` corresponds to the filter element 221`.

[0354] It is worth noting that in one embodiment of the present invention, Figure 7B As shown, step S1 includes the steps of:

[0355] S11: Mounting the photosensitive element 212' on a chip mounting area 2111' of the circuit board 211';

[0356] S12: Mounting each of the electronic components 214' on an outer portion 21123' of a circuit board in an edge region 2112' of the circuit board 211'; and

[0357] S13: By means of a gold wire bonding process, a lead wire 213' is extended from a chip connector 2123' of the photosensitive element 212' to a circuit board connector 2113' of the circuit board 211', so as to conductively connect the photosensitive element 212' and the circuit board 21'.

[0358] In another variant embodiment of the present invention, the step S1 also includes step S13': extending a lead 213' from a circuit board connector 2113' of the circuit board 211' to a chip connector 2123' of the photosensitive element 212' through a reverse punching process to conductively connect the photosensitive element 212' and the circuit board 21'.

[0359] Furthermore, if Figure 7CAs shown, step S2 includes the steps of:

[0360] S21: placing the imaging assembly 21' in a molding mold 500';

[0361] S22: performing a mold closing operation on an upper mold 510 'and a lower mold 520 'of the molding mold 500 ', so as to form a molding space 530 'of the molding mold 500 'between the upper mold 510 'and the lower mold 520 ';

[0362] S23: adding a molding material into the molding space 103' of the molding mold 500' to form the molding base 23' having the stepped peripheral groove 230' after the molding material is solidified; and

[0363] S24: The molding die 500' is demolded to obtain the semi-finished molded photosensitive component.

[0364] More specifically, step S22 includes the steps of:

[0365] Disposing a covering film 540' on a pressing surface 513' of the upper mold 510';

[0366] The covering film 540 ′ is used to apply pressure to the photosensitive element 212 ′ of the imaging assembly 21 ′, so that the covering film 540 ′ is located between the pressing surface 513 ′ and the photosensitive element 212 ′;

[0367] A first molding space 531 ′ of the molding space 530 ′ is formed between a first inner surface 511 ′ of the upper mold 510 ′ and a circuit board outer portion 21123 ′ of the edge region 2112 ′ of the circuit board 211 ′; and

[0368] A second molding space 532` of the molding space 530` is formed between a second inner surface 512` of the upper mold 510`, a circuit board connecting portion 21122` and a circuit board inner portion 21121` of the edge area 2112` of the circuit board 211`, and a chip outer portion 21223` and a chip connecting portion 21222` of a non-photosensitive area 2122` of the photosensitive element 212`, wherein the first inner surface 511` of the upper mold 510` is above the second inner surface 512` of the upper mold 510`.

[0369] In addition, the step S23 includes the steps of:

[0370] Adding the molding material into the first molding space 531' to form a first base portion 231' of the molding base 23' for covering the outer portion 21123' of the circuit board of the edge region 2112' of the circuit board 211' after the molding material is cured; and

[0371] The molding material is added into the second molding space 532` to form, after the molding material is solidified, the circuit board connecting portion 21122` and the circuit board inner portion 21121` for covering the edge area 2112` of the circuit board 211`, as well as the chip outer portion 21223` and the chip connecting portion 21222` of the non-photosensitive area 2122` of the photosensitive element 212`, wherein the height of the second base portion 232` is lower than the height of the first base portion 231`.

[0372] In the first preferred embodiment of the present invention, Fig.7D As shown, step S3 includes the steps of:

[0373] S31: Apply glue to a second top surface 2322' of the second base portion 232' of the molding base 23';

[0374] S32: correspondingly disposing the filter element 221 ′ on the second top surface 2322 ′ of the second base portion 232 ′; and

[0375] S33: After the glue is cured, an adhesive layer 222 ′ of the filter assembly 22 ′ is formed between a lower surface 2211 ′ of the filter element 221 ′ and the second top surface 2322 ′ of the second base portion 232 ′.

[0376] In a variant embodiment of the present invention, Fig.7D As shown, step S3 includes the steps of:

[0377] S31': applying glue to a lower surface 2211' of the filter element 221';

[0378] S32': correspondingly disposing the filter element 221' on a second top surface 2322' of the second base portion 232'; and

[0379] S33 ′: After the glue is cured, an adhesive layer 222 ′ of the filter assembly 22 ′ is formed between the lower surface 2211 ′ of the filter element 221 ′ and the second top surface 2322 ′ of the second base portion 232 ′.

[0380] In another variant embodiment of the present invention, Fig.7D As shown, step S3 includes the steps of:

[0381] S31": applying glue to an annular supporting member 223' of the filter assembly 22';

[0382] S32″: correspondingly arranging the filter element 221′ on the support member 223′, so as to form an adhesive layer 222′ of the filter assembly 22′ between an upper surface 2212′ of the filter element 221′ and the support member 223′ after the glue is cured; and

[0383] S33″: The support member 223 ′ is correspondingly disposed on a first top surface 2312 ′ of the first base portion 231 ′, so that the filter element 221 ′ is located in the stepped peripheral groove 230 ′ of the mold base 23 ′.

[0384] like Figure 8 As shown, the manufacturing method of the camera module includes the steps of:

[0385] (a) mounting a photosensitive element 212' and at least one group of electronic components 214' on a circuit board 211', and conducting the photosensitive element 212' and the circuit board 211' to assemble an imaging assembly 21';

[0386] (b) forming a mold base 23' having a stepped peripheral groove 230' for covering a portion of the circuit board 211' and a portion of the photosensitive element 212' by a molding process, so as to define a light window 2301' on the mold base 23' through the stepped peripheral groove 230', wherein a photosensitive area 2121' of the photosensitive element 212' corresponds to the light window 2301' of the mold base 23', so as to manufacture a molded photosensitive component semi-finished product having an integrated structure;

[0387] (c) correspondingly disposing a filter element 221` of a filter assembly 22` in the stepped peripheral groove 230` of the molded base 23` of the molded photosensitive assembly semi-finished product to assemble a molded photosensitive assembly 20`, wherein the photosensitive area 2121` of the photosensitive element 212` corresponds to the filter element 221`; and

[0388] (d) An optical lens 10' is correspondingly arranged on a photosensitive path of the imaging component 21' of the molded photosensitive component 20' to produce a camera module 1'.

[0389] Referring to the accompanying drawings of the present invention Figures 9 to 11, a camera module and a molded photosensitive component according to a second preferred embodiment of the present invention and a method for manufacturing the same are explained. Compared with the first preferred embodiment of the present invention, the camera module 1`A according to the second preferred embodiment of the present invention is different in that: Fig. 9 As shown, a molded base 23`A of a molded photosensitive component 20`A of the camera module 1`A only covers the outer portion 21123` of the circuit board in the edge region 2112` of the circuit board 211`, but does not cover other portions of the edge region 2112` of the circuit board 211` and the non-photosensitive region 2122` of the photosensitive element 212`. In other words, the first base portion 231`A and the second base portion 232`A of the molded base 23`A are both covered on the outer portion 21123` of the circuit board in the edge area 2112` of the circuit board 211`, and the first base portion 231`A covers each of the electronic components 214`, while the second base portion 232`A covers neither the electronic components 214` nor each of the leads 213`, so that the safety gap reserved between the second base portion 232`A and the leads 213` can be further reduced, so as to further reduce the height of the second base portion 232`A.

[0390] It is worth noting that since the circuit board connector 2113` and the chip mounting area 2111` of the circuit board 211` are exposed outside the molded base 23`A, the molded base 23`A can be formed on the circuit board 211` by a molding process first, and then the photosensitive element 212` is mounted on the circuit board 211`, and finally the circuit board 211` and the photosensitive element 212` are connected.

[0391] For example, Fig. 10A and Fig. 10B As shown, the circuit board 211` is placed in a molding mold 500`A to perform a molding process by means of the molding mold 500`A, thereby forming the molding base 23`A having the stepped peripheral groove 230`, and the outer portion 21123` of the circuit board in the edge area 2112` of the circuit board 211` is covered by the molding base 23`A.

[0392] Specifically, the molding module 500`A includes an upper mold 510`A and a lower mold 520`A, wherein at least one of the upper and lower molds 510`A, 520`A can be moved so that the upper mold 510`A and the lower mold 520`A can be molded and demolded, and when the molding mold 500`A is in a molded state, a molding space 530`A is formed between the upper mold 510`A and the lower mold 520`A, wherein the module base 23`A is formed by adding a molding material into the molding space 530`A and curing it.

[0393] More specifically, the upper mold 510`A has a first inner surface 511`A, a second inner surface 512`A and a pressing surface 513`A, wherein the second inner surface 512`A is located around the first inner surface 511`A, and the second inner surface 512`A is located between the first inner surface 511`A and the pressing surface 513`A, wherein the second inner surface 512`A is lower than the first inner surface 511`A, and the pressing surface 513`A is lower than the second inner surface 512`A.

[0394] In the attached Fig. 10AIn the process, after placing the circuit board 211` on the upper mold 510`A and / or the lower mold 520`A, the upper mold 510`A and the lower mold 520`A are operated to close the mold so that the circuit board 211` is located in the molding space 530`A formed between the upper mold 510`A and the lower mold 520`A. At this time, the first inner surface 511`A of the upper mold 510`A corresponds to the outer side 21123` of the circuit board in the edge region 2112` of the circuit board 211`, so as to form a first molding space 531`A between the first inner surface 511`A and the outer side 21123` of the circuit board 211`, and the first base portion 231`A is formed after the molding material is added into the first molding space 531`A and solidified; the second inner surface 512`A of the upper mold 510`A also corresponds to the outer side 21123` of the circuit board in the edge region 2112` of the circuit board 211`, so as to form a first molding space 531`A between the second inner surface 512`A and the outer side 21123` of the circuit board 211` A second molding space 532`A is formed between the side portions 21123`, and the second base portion 232`A is formed after the molding material is added into the second molding space 532`A and solidified; the pressing surface 513`A of the upper mold 510`A applies pressure to the chip mounting area 2111` of the circuit board 211` and the inner side portion 21121` and the circuit board connecting portion 21122` of the edge area 2112` of the circuit board 211`. Since the chip mounting area 2111` is located in the middle of the circuit board 211`, the circuit board 211` can be flattened by the pressing surface 513`A, thereby ensuring the overall flatness of the circuit board 211`, and providing a flat molding base surface for the molding process.

[0395] like Fig. 10BAs shown, after the molding material is solidified in the molding space 530`A to form the molding base 23`A, a molded photosensitive component semi-finished product with an integrated structure is made, wherein the molded photosensitive component semi-finished product includes the circuit board 211` of the imaging component 21` and the molding base 23`. Next, the upper mold 510` and the lower mold 520` are operated to perform demolding to open the molding space 530` of the molding mold 500`, so as to remove the molded photosensitive component semi-finished product from the molding space 530`. Then, the photosensitive element 212` is mounted on the chip mounting area 2111` of the circuit board 211`, and the photosensitive element 21` and the circuit board 211` are connected. Finally, the filter element 221' is mounted on the second top surface 2322' of the second base portion 232'A of the molded base 23'A to form the molded photosensitive component 20'A.

[0396] It is worth noting that in the second preferred embodiment of the present invention, except for the above-mentioned structural differences, the other structures of the camera module 1`A are the same as the structures of the camera module 1` according to the first preferred embodiment of the present invention, and the camera module 1`A also has various deformation implementations that are similar to or the same as the various deformation implementations of the camera module 1` of the first preferred embodiment, which will not be repeated here.

[0397] According to another aspect of the present invention, the second preferred embodiment of the present invention further provides a method for manufacturing a molded photosensitive component. Fig.11 As shown, the manufacturing method of the molded photosensitive component 20`A includes the steps of:

[0398] (A) forming a mold base 23`A having a stepped peripheral groove 230` for covering an outer portion 21123` of an edge region 2112` of a circuit board 211` by a molding process, so as to form a light window 2301` through the stepped peripheral groove 230`, wherein a light sensing region 2121` of the light sensing element 212` corresponds to the light window 2301` of the mold base 23`A, so as to manufacture a molded photosensitive component semi-finished product having an integrated structure;

[0399] (B) mounting a photosensitive element 212' on a chip mounting area 2111' of the circuit board 211', and conducting the photosensitive element 212' and the circuit board 211'; and

[0400] (C) A filter element 221` of a filter assembly 22` is correspondingly arranged in the stepped peripheral groove 230` of the molded base 23`A to assemble into a molded photosensitive assembly 20`A, wherein the photosensitive area 2121` of the photosensitive element 212` corresponds to the filter element 221`.

[0401] Furthermore, before the step (A), the method further includes the step of mounting at least one group of electronic components 214' on the outer side 21123' of the circuit board in the edge region 2112' of the circuit board 211'.

[0402] Reference Fig.12 According to another aspect of the present invention, the present invention further provides an electronic device 600', wherein the electronic device 600' comprises an electronic device body 610' and at least one camera module 1', 1'A, wherein each of the camera modules 1', 1'A is respectively arranged on the electronic device body 610' for acquiring images. It is worth mentioning that the type of the electronic device body 610' is not limited. For example, the electronic device body 610' can be any electronic device that can be configured with the camera module, such as a smart phone, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, etc. Those skilled in the art will appreciate that, although the attached Fig.12 In the embodiment, the electronic device body 610' is implemented as a smart phone as an example, but it does not constitute a limitation on the content and scope of the present invention.

[0403] The present invention provides a camera module, such as Figures 14 to 33C As shown, it is small in size and suitable for being installed in a smart device for acquiring images. The camera module of the third embodiment of the present invention is as follows Figures 14 to 23 As shown, the camera module includes an optical component 10, a filter 20 and a molded photosensitive component 30. The thickness of the camera module depends on the height of the optical component 10 and the thickness of the molded photosensitive component 30. The molded photosensitive component 30 can receive the imaging light transmitted from the optical component 10 through the filter 20. After the imaging light is shaped by the optical component 10 and filtered by the filter 20, a photosensitive film 33 molded in the molded photosensitive component 30 obtains high-quality resources and images. The optical component 10 includes a lens, a motor lens, and the like.

[0404] The position where the filter 20 is installed on the molded photosensitive component 30 is lower than the position where the optical component 10 is installed on the molded photosensitive component 30. Figures 14 to 16As shown, the distance between the filter 20 and the molded photosensitive component 30 and the distance between the filter 20 and the optical component 10 are maintained, so that less stray light is transmitted to the center of the molded photosensitive component 30. In this preferred embodiment, the filter 20 is fixed to the molded photosensitive component 30 by a filter glue 220. And the optical component 10 is fixed to the molded photosensitive component 30 by a lens glue 110. It is worth mentioning that the filter glue 220 and the lens glue 110 are on different levels of the molded photosensitive component 30, so that the lens glue 110 maintains a certain distance from the filter glue 220 without having the opportunity to cover the filter 20.

[0405] Furthermore, in this preferred embodiment, the photosensitive film 33 is preferably fixed to the bottom of the molded photosensitive component 30, and the optical component 10 is attached to the top of the molded photosensitive component 30; and the filter 20 is attached between the optical component 10 and the photosensitive film 33 to provide stable supporting force to the optical component 10 and the filter 20 through the molded photosensitive component 30.

[0406] The optical assembly 10 includes a lens barrel 11 and some lenses 12 installed in the lens barrel 11. The lens barrel 11 includes a foot 111 to support the lenses 12 away from the filter 20. The foot 111 of the lens barrel 11 is fixed to the molded photosensitive component 30 to support the lenses 12 to keep a distance from the filter 20 and the photosensitive film 33, and to conduct imaging light as required.

[0407] The optical filter 20 includes a filter portion 21 for filtering imaging light and an edge portion 22 extending outward from the filter portion 21, wherein the edge portion 22 is supported on the molded photosensitive component 30 so that the filter portion 21 corresponds to the photosensitive film 22. It is worth mentioning that the filter glue 220 is between the edge portion 22 and the molded photosensitive component 30, without covering the filter portion 21 and the photosensitive film 33 of the molded photosensitive component 30. The edge portion 22 of the optical filter 20 is directly supported by the molded photosensitive component 30 without the need for additional supporting components. In particular, in one example of the present invention, the edge portion 22 extends outward from the filter portion 21 as a whole, and the edge portion 22 is located around the filter portion 21, so that the optical filter 20 is implemented as an integrated element, which is convenient for being fixed in the supporting cavity 300 of the molded photosensitive component 30.

[0408] Specifically, the molded photosensitive component 30 further includes a main body 31, some electronic devices 32 and a circuit board 35. The photosensitive sheet 33 is electrically connected to the electronic device 32 through the circuit board 35. The main body 31 is covered with the electronic device 32 on the circuit board 35, and the supporting cavity 300 is formed to support the filter 20 and the optical component 10 at a distance. In other words, the main body 31 covers the electronic device 32 and a part of the circuit board 35, wherein the photosensitive sheet 33 is surrounded by the bottom of the main body 31 and keeps a distance from the filter 20.

[0409] In the preferred embodiment, the photosensitive film 33 is connected to the circuit board 35 by a set of wiring 34. One end of the wiring 34 is fixed to the circuit board 35, and the other end is fixed to the photosensitive film 33. It can be understood by those skilled in the art that the photosensitive film 33 uses the electronic device 32 of the circuit board 35 to convert light into an image. The main body 31 partially covers the photosensitive film 35 inside. In other words, the wiring 34 and the edge of the photosensitive film 33 are completely covered and protected by the inside of the main body 31 of the molded photosensitive component 30. The photosensitive film 33 is surrounded by the electronic device 32, such as Figures 14 to 17 As shown, the edge of the main body 31 covering the electronic device 32 is higher than the inner part of the main body 31 covering the wiring 34.

[0410] More importantly, the top edge of the main body 31 supports the optical component 10, and the optical component 10 is away from the filter 20 and the photosensitive film 33, so that the filter 20 and the photosensitive film 33 are not subjected to the pressure of the optical component 10. Preferably, not only the positions of the electronic device 32, the photosensitive film 33 and the filter 20 are stabilized by the main body 31, but also the size of the main body 10 and the distance between the main body 10 and the filter 20 are designed accordingly to enhance the stability, reliability and compactness of the camera module. The specific design data of the main body 31 is disclosed in the following paragraphs. It is worth mentioning that the accompanying drawings only illustrate the positional relationship between the optical component 10, the filter 20 and the molded photosensitive component 30, and are not strictly illustrated according to the numerical scale.

[0411] Furthermore, if Fig.16 and 17As shown, the filter portion 21 has an incident surface 211 and an exit surface 212, wherein the incident surface 211 is arranged to face the lens 12 of the optical component 10, and the exit surface 212 is arranged to face the photosensitive film 33. After the imaging light is shaped by the lens 12 of the optical component 10, the imaging light first passes through the incident surface 211 and then passes through the exit surface 212 for filtering. Preferably, the filter portion 21 is made of infrared light filtering material. The edge portion 22 has an edge top surface 221, an edge side surface 222 and an edge bottom surface 223. In this preferred embodiment, the edge top surface 221 is coplanar with the incident surface 211, and the edge bottom surface 223 is coplanar with the exit surface 212.

[0412] It is worth mentioning that the edge bottom surface 223 of the edge portion 22 of the optical filter 20 is attached to the main body 31 of the molded photosensitive component 30 by the filter glue 220, so that the optical filter 21 conducts imaging light in a clean state. In addition, the optical filter 21 and the edge portion 22 do not need to support anything on the incident surface 211 and the edge top surface 221, providing higher reliability for the optical filter 20.

[0413] In particular, the main body 31 of the molded photosensitive component 30 includes an enclosing body 311 and a short body 312, and the short body 312 integrally extends from the inner side of the enclosing body 311. The enclosing body 311 and the short body 312 are both formed on and molded on a connecting surface 350 of the circuit board 35 to cover the electronic device 32, the wiring 34 and the photosensitive film 33. In the third preferred embodiment, the electronic device 32 is mainly covered by the enclosing body 311, and the wiring 34 and the photosensitive film 33 are mainly covered by the short body 312. In other preferred embodiments, the electronic device 32 can also be covered by the short body 312.

[0414] Specifically, the containing body 311 and the short body 312 have a certain height difference, so as to form a mouth-shaped groove inside the main body 31, so as to set the optical filter 20 in the mouth-shaped groove of the main body 31. In other words, the containing body 311 has a high upper surface 3111 and a high inner side surface 3112, wherein the high upper surface 3111 of the containing body 311 is used to support the optical component 10. The short body 312 has a short upper surface 3121 and a short inner side surface 3122, wherein the short upper surface 3121 of the short body 312 is used to support the optical filter 30, wherein the high inner side surface 3112 of the containing body 311 and the short inner side surface 3122 of the short body 312 form the supporting cavity 300 of the molded photosensitive component 30 inwardly. The distance between the high upper surface 3111 of the containing body 311 and the connecting surface 350 of the circuit board 35 is greater than the distance between the low upper surface 3121 of the low body 312 and the connecting surface 350 of the circuit board 35. In other words, the high inner side surface 3112 and the low upper surface 3121 are groove-shaped to accommodate the optical filter 20 therein, and the optical filter 20 does not need to protrude from the high upper surface 3111. It can be understood that the containing body 311 also has a high outer surface 3113 to form the outer peripheral surface of the main body 31.

[0415] In this preferred embodiment, Fig.17 As shown, the height difference J between the containing body 311 and the short body 312 is greater than 0.1 mm, that is, the distance between the high upper surface 3111 and the short upper surface 3121 is greater than 0.1 mm, so as to be suitable for the thickness of the optical filter 20 and the optical filter glue 220. More preferably, the height difference J between the containing body 311 and the short body 312 is greater than or equal to the sum of the thickness of the optical filter 20, the thickness of the optical filter glue 220 and the margin 0.04 mm (such as 0.28 mm), so that the thickness of the optical filter 20 is hidden in the main body 31 of the molded photosensitive component 30.

[0416] In addition, the thickness H of the filter glue 220 must also be considered, which is generally less than 0.03 mm. The thickness of the filter glue 220 can be appropriately reduced while ensuring that the glue has sufficient adhesion, and a thermosetting glue is used in this preferred embodiment.

[0417] It is worth noting that the width C of the short upper surface 3121 of the short body 312 (i.e., the distance from the high inner side surface 3112 to the short inner side surface 3122, or the thickness of the short body 312) is preferably greater than or equal to 0.4 mm, so that on the basis of ensuring that the containing body 311 and the short body 312 can be shaped in a groove-shaped and L-shaped manner, the value of the width C also ensures that the filter 20 has sufficient installation area on the short upper surface 3121 of the short body 312, and a certain installation deviation of the filter 20 can be allowed without causing adverse effects. The filter glue 220 can also have sufficient glue drawing area on the short upper surface 3121, thereby increasing the contact area between the filter 20 and the filter glue 220 and improving the glue adhesion.

[0418] The filter glue 220 is applied between the edge bottom surface 223 of the edge portion 22 of the filter 20 and the short upper surface 3121 of the short body 312, so as to connect the edge portion 22 of the filter 20 with the short body 312 through the filter glue 220. The filter glue 220 can be implemented as a glue having a square shape, and the size of the filter glue 220 is smaller than the size of the lens glue 110.

[0419] Preferably, the width of the filter glue 220 between the edge bottom surface 223 and the short upper surface 3121 of the short body 312 has a maximum value, and the width of the filter glue 220 is at most equal to the width B of the edge portion 22, wherein the width B of the edge portion 22 of the filter 20 is preferably greater than or equal to 0.25 mm, so that the filter 20 can be stably supported by the edge portion 22, ensuring that the filter 20 has sufficient installation area on the short upper surface 3121 of the short body 312, allowing the filter 20 to have a certain installation deviation without causing adverse effects, and the filter portion 21 is aligned with the photosensitive film 33.

[0420] Furthermore, there is a gap between the side of the filter 20 and the inner side of the containing body 311 of the main body 31. In other words, the filter 20 does not contact the containing body 311 of the main body 31, so that the vibration of the optical component 10 transmitted through the main body 31 can be weakened. In addition, since the gap between the side of the filter 20 and the inner side of the containing body 311 of the main body 31 can accommodate the excess lens glue 110 and keep the lens glue 110 away from the incident surface 211 of the filter 21, it can effectively prevent the lens glue 110 from flowing into the incident surface 211 of the filter part 21. Preferably, the distance A between the edge side surface 222 of the edge portion 22 of the filter 20 and the high inner side surface 3112 of the containing body 311 is greater than or equal to 0.15 mm, which helps to avoid space (i.e. give way) between the filter 20 and the containing body 311.

[0421] It is worth noting that the lens glue 110 connects the support 111 of the lens barrel 11 to the high upper surface 3111 of the enclosure 311 of the main body 31, so that the optical component 10 is mainly supported by the enclosure 31 to reduce the stress of the photosensitive film 33. Preferably, the height K of the enclosure 311 is greater than or equal to 0.5 mm, so that the enclosure 311 covering the electronic device 32 can be effectively molded, and the electronic device 32 can be prevented from being excessively pressed by the support 111 of the optical component 10. Moreover, because the filter 20 is supported by the short body 312, the filter 20 does not need to bear the weight and movement of the optical component 10, so as to improve reliability. In particular, the lens barrel 11 is directly on the main body 31, so that the thickness of the camera module is determined by the height of the optical component 10 and the thickness of the molded photosensitive component 30, which helps to reduce the overall thickness of the camera module.

[0422] It is worth mentioning that the size of the capacitor in the electronic device 32 is usually the largest, so the distance D between the capacitor in the electronic device 32 and the edge side 222 of the edge portion 22 of the filter 20 is preferably greater than or equal to 0.2 mm to prevent interference between the electronic device 32 and the mold, and to leave enough space between the electronic component 32 and the filter 20 for structural design optimization, which is conducive to forming a complex molding structure between the two and increasing the function of the molding structure. More preferably, the distance D between each electronic device 32 and the edge side 222 of the edge portion 22 of the filter 20 is greater than or equal to 0.25 mm.

[0423] In this preferred embodiment, the enveloping body 311 and the short body 312 of the main body 30 are preferably shaped into a quasi-square shape with chamfers, and the inscribed circle radius F of the chamfers is greater than or equal to 0.3 mm. It should be noted that the chamfers on the enveloping body 311 and the short body 312 need to be away from the filter 20 (i.e., give way) to reduce the chance of interference between the chamfers on the enveloping body 311 and the short body 312 and the filter 20. Of course, in other examples of the present invention, the chamfers on the enveloping body 311 and the short body 312 can also be designed in the same way as the chamfers of the filter 20.

[0424] As the photosensitive film 33 is fixed at the bottom of the short body 312 of the main body 31, the filter 20 can maintain a certain distance from the photosensitive film 33 through the short body 312, thereby achieving high-quality imaging. Preferably, the distance I between the short upper surface 3121 of the short body 312 and the photosensitive film 33 is preferably greater than or equal to 0.15 mm, and its main function is to ensure that the molded structure has sufficient thickness to block stray light reflected by the lens, filter or other structures, reduce the incidence of useless light, improve the imaging quality of the photosensitive film, and prevent the photosensitive film 33 from being damaged by pressure. At the same time, the distance I is greater than or equal to 0.15, which can also avoid interference between the mold and the wiring 34, and help avoid the wiring 34 from being exposed. It can be understood that if the back focus of the camera module meets the requirements, the distance I can be increased as much as possible to avoid imaging black spots caused by the dirt of the filter 20. In particular, if the distance I between the short upper surface 3121 of the short body 312 and the photosensitive film 33 is greater than 0.25 mm, the capacitor can be placed under the short body 312 to reduce the size of the camera module in the XY direction.

[0425] Therefore, in this preferred embodiment, the main body 31 not only covers the electronic device 32 and the wiring 34 to provide protection, but also provides the supporting cavity 300 to stably support the optical component 10 and the filter 20 respectively without applying excessive pressure to the electronic device 32 or the photosensitive film 33.

[0426] It is worth mentioning that, on the one hand, in order to improve the screen-to-body ratio of smart devices (such as smart phones), people have put forward higher and higher requirements for the fit between the side of the camera module and the side of the smart phone, that is, people hope that the optical component 10 of the camera module is closer to the mounting shell of the smart phone; on the other hand, in order to make the smart phone have a good grip feel, the cross-section of the mounting shell of the smart phone often has a certain curvature (i.e., a curved outer frame). The module sidewalls of the camera module are usually flush, which results in that the flush sidewalls of the camera module cannot fit well with the curved outer frame of the smart phone, so that there is a large gap between the two, which greatly limits the fit between the camera module and the smart phone. It can be understood that although the camera module of the present invention can reduce the height of the camera module by reducing the height of the enclosure 311, it is limited by the height of the electronic device 32 itself, and the reduction degree of the height of the enclosure 311 is limited. Therefore, the fit between the camera module of the above embodiment of the present invention and the smart phone is still poor.

[0427] In order to solve the above problems, Fig.18 As shown, the present invention further provides a variant implementation of the camera module according to the third embodiment of the present invention, wherein the optical component 10 of the camera module is eccentrically arranged on the molded photosensitive component 30, so that the optical component 10 can be further adjacent to a mounting housing 51. That is to say, when the camera module is fixed to the mounting housing 51, the optical component 10 can be biased toward the mounting housing 51 due to the eccentric arrangement, so that the optical component 10 can be further adjacent to the mounting housing 51, which helps to further improve the degree of fit between the camera module and the mounting housing 51.

[0428] In other words, the optical component 10 can be slightly offset from the molded photosensitive component 30 to adapt to the mounting housing 51 of the smart device. In other words, at least one side of the support leg 111 of the lens 11 slightly protrudes from the high upper surface 3111 of the enclosure 311, which not only helps to improve the fit between the camera module and the mounting housing of the smart device, but also has no effect on the stability of the filter 20.

[0429] It is worth noting that when the camera module is installed on the top side of the mounting shell 51 of the smart device, the support leg 111 of the lens 11 only needs to have one side slightly protruding from the upper surface 3111 of the housing 311; and when the camera module is installed at the corner of the mounting shell 51 of the smart device, the support leg 111 of the lens 11 needs to have two adjacent sides simultaneously protruding outward from the upper surface 3111 of the housing 311, so that the camera module fits in the corner of the mounting shell 51 of the smart device.

[0430] According to another aspect of the present invention, a method for manufacturing the camera module of the present invention is as follows Figures 19A to 20 Specifically, Fig.19A As shown, the manufacturing method of the camera module includes the steps of:

[0431] I. Connect the photosensitive sheet 33 with the wiring 34 and the electronic device 32 to the circuit board 35;

[0432] II. Placing the connected circuit board 35 between an upper mold 41 and a lower mold 42; and

[0433] III. Covering the electronic device 32 within the main body 31 and on the circuit board 35, wherein the main body 31 includes the enclosing body 311 and the short body 312 to form the molded photosensitive component 30.

[0434] Furthermore, if Fig.19B As shown, the manufacturing method of the camera module also includes the steps of:

[0435] IV. Installing the filter 20 on the short upper surface 3121 of the short body 312; and

[0436] V. Install the optical component 10 on the high upper surface 3111 of the enclosure 311.

[0437] Furthermore, in the step III, preferably, a short upper surface of the short body is lower than a high upper surface of the containing portion, and a relative height of the short upper surface of the short body is lower than a height of the tallest electronic device among the electronic devices.

[0438] In an example of the present invention, the electronic device 32 , the wiring 34 , and the edges of the photosensitive film 33 are all covered by the main body 31 .

[0439] For example, Fig.19A As shown, the step III further comprises the steps of:

[0440] III.1 Injecting molding material between the upper mold 41 and the lower mold 42;

[0441] III.2 solidifying the molding material between the upper mold 41 and the lower mold 42 to form the main body 31; and

[0442] III.3 Demolding the upper mold 41 and the lower mold 42 from the molded photosensitive component 30.

[0443] It is worth mentioning that Fig.19A As shown, the angle G between the high inner side surface 3112 of the containing body 311 and the short upper surface 3121 of the short body 312 is preferably greater than or equal to 95° for the sake of demolding operation. More preferably, the angle G between the high inner side surface 3112 and the short upper surface 3121 is also less than 100°, so as to block a certain amount of stray light while ensuring that the molded structure can be smoothly formed. In addition, in order to ensure normal molding processing, the fillet radius between the high inner side surface 3112 and the short upper surface 3121 is substantially equal to 0.1 mm. In other words, since the angle between the high inner side surface 3112 of the containing body 311 and the normal line of the short upper surface 3121 can be referred to as the demolding angle of the high inner side surface 3112, the demolding angle of the high inner side surface 3112 of the containing body 311 is between 5° and 10°.

[0444] It is worth noting that the draft angle of the short inner side surface 3112 of the short body 312 is preferably implemented between 5° and 10°. In particular, the draft angle of the outer side surface of the enveloping body 311 (i.e., the outer side surface of the main body 31) is also implemented between 5° and 10°, which helps to smoothly complete the demolding operation after molding.

[0445] like Fig. 20 As shown, the step IV further comprises the steps of:

[0446] IV.1 Apply the filter glue 220 to the short upper surface 3121 in a C shape, so that a gap is reserved between the two ends of the filter glue 220;

[0447] IV.2 Install the filter 20 on the filter glue 220;

[0448] IV.3 curing the filter glue 220; and

[0449] IV.4 Fill the gap between the two ends of the filter glue 220 with the filter glue 220 to form a square-shaped filter glue 220 .

[0450] More, such as Fig. 20As shown, in step IV.3, the excess air between the optical filter 20 and the photosensitive film 33 can be released from the gap to ensure that the air pressure in the space between the optical component 10 and the photosensitive film 33 is equal to the atmospheric pressure. Preferably, the length E of the gap is between 0.7 and 1.0 mm (i.e., greater than or equal to 0.7 mm and less than or equal to 1.0 mm), ensuring that the filter glue 220 can still retain a certain gap when being pressed by the optical filter 20 to form an air escape hole, so that the air can be released smoothly from the gap.

[0451] It is worth mentioning that the upper mold 41 is shaped to be similar to the supporting cavity 300 , so that after the upper mold 41 is demolded, the supporting cavity 300 is formed between the main body 31 and the photosensitive film 33 .

[0452] A feasible mode of this preferred embodiment is as follows Fig.21 As shown, the molded photosensitive component 30 further includes an upper cover 36. The upper cover 36 is mounted on the upper surface 3111 of the enclosure 311 and extends to cover the edge portion 22 of the filter 20, so that the filter 20 is maintained from bottom to top to enhance the stability of the filter 20. It is worth mentioning that the height of the upper cover 36 is less than the thickness of the filter 20, thereby reducing the thickness of the camera module.

[0453] Another feasible mode of this preferred embodiment is as follows Fig. 22 As shown, the difference from the above embodiment is that the short body 312 does not cover the wiring 34 of the molded photosensitive component 30, so that the thickness of the camera module is lower than that of the above embodiment. This is because the short body 312 is only required to be higher than the wiring 34, rather than completely covering the wiring 34, so the short body 312 can be lower, so that the thickness of the filter 20 can be adapted by using the lower short body 312 and the containing body 311.

[0454] Another feasible mode of this preferred embodiment is as follows Fig.23 . What is different from the above embodiment is that the photosensitive film 33 is installed at a position lower than the position of the electronic device 32 installed on the circuit board 35. For example, there is a groove at the center of the connecting surface 350 of the circuit board 35 so that the photosensitive film 33 is installed in the groove of the circuit board 35. In addition, it is reasonable that the thickness of the camera module of this mode is lower than that of the camera module of the above embodiment, because the connection 34 is lower due to the sunken photosensitive film 33.

[0455] It is worth mentioning that the fourth preferred embodiment of the present invention is Figures 24 to 27As shown, the difference from the third embodiment is that the electronic device 32A, the wiring 34A and the photosensitive film 33A are mainly covered by the short body 312A. In other words, the short body 312A is higher than at least part of the electronic device 32A to completely cover at least part of the electronic device 32A inside the main body 31A.

[0456] In this preferred embodiment, the optical filter 20A is mounted on the top of the short body 312A, and the optical assembly 10A is mounted on the top of the housing 311A. As the electronic device 32A is mainly covered by the short body 312A, the electronic device 32A is only subjected to the pressure of the optical filter 20A, and does not bear the weight and movement of the optical assembly 10A, so that the electronic device 32A can have a longer life. It can be understood that in this embodiment of the present invention, the optical filter 20A is firmly bonded to the short upper surface 3121A of the short body 312A through the filter glue 220A; the optical assembly 10A is firmly bonded to the high upper surface 3111A of the housing 311A ​​through the lens glue 110A, so as to ensure that the relative positions of the optical filter 20A and the optical assembly 10A and the photosensitive film 33A remain unchanged.

[0457] It is worth mentioning that the heights of different electronic devices 32A in the camera module of the present invention may be different, and in order to ensure that the height of the short body 312A is not too large, the height of the electronic device 32A covered in the short body 312A is preferably less than 0.3 mm. In other words, in the present invention, an electronic device with a height less than 0.3 mm is referred to as a short device 321A in the electronic device 32A, and an electronic device with a height greater than or equal to 0.3 mm is referred to as a tall device 322A in the electronic device 32A, then the short device 321A in the electronic device 32A is covered by the short body 312A, and the tall device 322A in the electronic device 32A is covered by the containing body 311A. It can be understood that the short device 321A in the electronic device 32A of the present invention can be completely covered by the short body 312A (that is, in the top view direction, the whole of the short device 321A is arranged in the short body 312A); or, the short device 321A in the electronic device 32A can be partially covered by the short body 312A (that is, in the top view direction, a part of the short device 321A is arranged in the short body 312A).

[0458] More preferably, the wiring 34A or the electronic device 32A (i.e., the short device 321A) covered in the short body 312A is arranged around the photosensitive sheet 33A, and the wiring 34A and the short device 321A are respectively located on different sides of the photosensitive sheet 33A; that is, the wiring 34A and the electronic device 32A covered in the short body 312A are not arranged sequentially around the photosensitive sheet 33A from the inside to the outside. In other words, the short devices 321A in the electronic device 32A can be distributed according to the position of the wiring 34A, and the photosensitive sheet 33A does not have wiring 34A on all sides, so the short devices 321A in the electronic device 32A can be preferably placed on one side or both sides of the photosensitive sheet 33A without wiring 34A, so that the area of ​​the circuit board can be reduced, the area of ​​the molding in the XY direction can be reduced, and the area of ​​the camera module can be reduced. It is understandable that, since the width of the short device 321A in the electronic device 32A is usually around 0.25 mm, which is similar to the thickness of the short body 312A, if it is desired that the short device 321A in the electronic device 32A be integrated into the short body 312A, the short device 321A in the electronic device 32A can only be set on the side of the photosensitive film 33A where no wiring is set, that is, the short device 321A in the electronic device 32A is incompatible with the setting position of the wiring 34A, so that the part of the short body 312A where the short device 321A is set cannot be gold wired (that is, the wiring 34A cannot be set).

[0459] It is worth noting that the tall component 322A in the electronic component 32A is preferably arranged on the side of the photosensitive film 33A where the wiring 34A is present, so that the enclosing body 311A ​​on the side of the photosensitive film 33A where the wiring 34A is not present does not need to cover the electrical component 32A. In other words, the enclosing body 311A ​​does not need to be spaced from the electronic component 32A, so the thickness of the enclosing body 311A ​​can be reduced, while the thickness of the short body 312A can be slightly increased. Preferably, the thickness of the enclosing body 311A ​​is smaller than that of the short body 312A, so that compared with the third preferred embodiment, the short body 312A can provide a larger short upper surface 3121A to support the edge portion 22A of the filter 20A, so that the filter 20A is stably mounted on the short body 312A.

[0460] In this preferred embodiment, the angle G between the high inner side surface 3112A and the short upper surface 3121A can be greater than or equal to 100°. In other words, the containing body 311A ​​extends obliquely from the top of the short body 312A, so that the containing body 311A ​​is well supported and can support the optical component 10A without affecting the filter 20A. In other words, the angle G is formed in the demolding condition in the manufacturing method, and the short inner side surface 3122A and the photosensitive film 33A are also inclined, similar to the angle G, so as to provide a stable supporting force.

[0461] In this preferred embodiment, the enclosure 311A ​​is designed to support the optical assembly 10A. Fig. 27 As shown, the high upper surface 3111A of the enclosure 311A ​​is asymmetric on the four sides, that is, the thickness of the enclosure 311A ​​on the four sides of the high upper surface 3111A is different, so that the optical component 10A protrudes outward from the enclosure 311A ​​from the portion of the enclosure 311A ​​with a smaller thickness, which helps to improve the fit between the camera module and the mounting shell 51 of the smart device. In other words, in order to adapt to the mounting shell 51 of the smart device, the thickness of the portion of the enclosure 311A ​​adjacent to the mounting shell 51 is smaller, so that the optical component 10A is slightly misaligned with the molded photosensitive component 30A, that is, the optical component 10A is biased toward the mounting shell 51, so as to improve the fit between the camera module and the mounting shell 51 of the smart device. Compared to Fig.18 In the third embodiment, since the enclosure 311A ​​does not need to consider the electronic device 32A, the height of the enclosure 311A ​​can be reduced, so that the foot 111A of the optical component 10A is supported at a lower position on the high upper surface 3111A; at the same time, the thickness of the enclosure 311A ​​can also be further reduced so that the optical component 10A is closer to the mounting housing 51 of the smart device.

[0462] According to another aspect of the present invention, the fourth embodiment of the present invention further provides a method for manufacturing the camera module, comprising the steps of:

[0463] I connects a photosensitive film 33A with some wiring 34A and some electronic components 32A on a circuit board 35A;

[0464] II placing the connected circuit board 35A between an upper mold and a lower mold; and

[0465] III covers the electronic device 32A in a main body 31A and on the circuit board 35A to form a molded photosensitive component 30A, wherein the main body 31A includes a containing body 311A ​​and a short body 312A whose height is lower than the containing body 311A, and at least part of the electronic device 32A is covered under the short body 312A.

[0466] Furthermore, the manufacturing method of the camera module further includes the steps of:

[0467] IV. Install a filter 20A on the short upper surface 3121A of the short body 312A; and

[0468] V installs an optical component 10A in the enclosure 311A.

[0469] In an example of the present invention, the electronic device 32A includes at least one short device 321A, wherein at least a portion of the short device 321 is covered under the short upper surface 3121A of the short body 312A, and the height of each short device 321 is less than 0.3 mm.

[0470] In one example of the present invention, the wiring 34A is covered by the dwarf body 312A, wherein the wiring 34A and the dwarf device 321A are both arranged around the photosensitive film 33A, and the wiring 34A and the dwarf device 321A are respectively located on different sides of the photosensitive film 33A.

[0471] In one example of the present invention, the thickness of at least one side of the containing body 311A ​​is smaller than the thickness of the short body 312A, so that the optical component 10A protrudes outward from the molded photosensitive component 30A from the at least one side of the containing body 311A.

[0472] In an example of the present invention, the electronic device 32A further includes at least one tall device 322A, wherein the tall device 322A is covered under the containing body 311A, and the height of each tall device 322A is greater than or equal to 0.3 mm.

[0473] In one example of the present invention, the high device 322A and the wiring 34A are located on the same side of the photosensitive sheet 33A.

[0474] In an example of the present invention, an angle between the high inner side surface 3112A of the containing body 311A ​​and the short upper surface 3121A of the short body 312A is greater than or equal to 100°.

[0475] It is worth mentioning that for the product structure based on IOM, although in order to improve the fit between the camera module and the mounting housing of the smart device, the present invention can be designed as follows Fig.18(or Fig. 27 ), the optical component 10 (or 10A) of the camera module is eccentrically arranged on the molded photosensitive component 30 (or 30A), so that at least one side of the optical component 10 (or 10A) protrudes outward from the main body 31 (or 31A) of the molded photosensitive component 30 (or 30A); however, the lens in the optical component 10 (or 10A) and the photosensitive film 33 (or 33A) in the molded photosensitive component 30 (or 30A) need to be optically aligned, so the only consideration is to reduce the thickness of the containing body 311 (or 311A) of the main body 31 (or 31A) on the corresponding side. However, the reduction in the thickness of the enclosure 311 (or 311A) will cause the width of the lens glue 110 (or 110A) to become narrower. Once the width of the lens glue 110 (or 110A) is too narrow, it will not only lead to insufficient bonding strength between the optical component 10 (or 10A) and the molded photosensitive component 30 (or 30A), but also easily cause the glue of the lens glue 110 (or 110A) to infiltrate and contaminate the filter 20 (or 20A).

[0476] In addition, since a certain assembly space needs to be reserved between the high inner side surface 3112 (or 3112A) of the enclosure 311 (or 311A) and the filter 20 (or 20A), the adjustable range of the thickness of the enclosure 311 (or 311A) becomes very small, making it difficult to reduce the thickness of the enclosure 311 (or 311A), which is not conducive to improving the fit between the camera module and the mounting housing of the smart device. Therefore, in order to solve the above problems, Figures 28 to 33C As shown, the fifth preferred embodiment of the present invention further provides a camera module, which is different from the third and fourth preferred embodiments in that the enclosure 311B of the main body 31B of the molded photosensitive component 30B has a high upper surface 3111B and a low upper surface 3110B, wherein the height of the enclosure 311B at the high upper surface 3111B is greater than the height of the enclosure 311B at the low upper surface 3110B, that is, the distance between the high upper surface 3111B and the circuit board 35B is greater than the distance between the low upper surface 3110B and the circuit board 35B, so that a part of the optical component 10B is supported on the high upper surface 3111B of the enclosure 311B, and another part of the optical component 10B is supported on the low upper surface 3110B of the enclosure 311B.

[0477] In other words, the enclosure 311B of the molded photosensitive component 30B is discontinuous, that is, the upper surface of the enclosure 311B is intermittent, and includes the high upper surface 3111B and the low upper surface 3110B lower than the high upper surface 3111B, so that a part of the optical component 10B can be connected to the high upper surface 3111B of the enclosure 311B through the lens glue 110B, while another part of the optical component 10B can also be connected to the low upper surface 3110B of the enclosure 311B through the lens glue 110B.

[0478] Exemplarily, the lens glue 110B of the camera module may include, but is not limited to, a fixed glue layer 1101B and a filler glue layer 1102B. The fixed glue layer 1101B is disposed between the optical component 10B and the high upper surface 3111B of the enclosure 311B, so that the optical component 10B is fixedly connected and supported on the high upper surface 3111B of the enclosure 311B through the fixed glue layer 1101B. The filler glue layer 1102B is disposed between the optical component 10B and the low upper surface 3112B of the enclosure 311B, so that the optical component 10B is reinforced and supported on the enclosure 311B through the filler glue layer 1102B.

[0479] Preferably, the lens glue 110B is applied according to the shape of the high upper surface 3111B of the housing 311B to form the fixed glue layer 1101B matching the shape of the high upper surface 3111B of the housing 311B, thereby maximizing the connection strength between the optical component 10B and the molded photosensitive component 30B. Next, after the lens glue 110B is cured to form the fixed glue layer 1101B, lens glue is applied between the optical component 10B and the lower upper surface 3112B of the housing 311B to form the repair glue layer 1102B that matches the shape of the lower upper surface 3112B of the housing 311B, so that the repair glue layer 1102B can not only reinforce and support the optical component 10B on the housing 311B, but also seal the space between the optical component 10B and the molded photosensitive component 30B to prevent external dust from entering and contaminating the optical component 10B and / or the filter 20B.

[0480] It is worth noting that since the lower upper surface 3110B of the containing body 311B is lower than the higher upper surface 3111B, the gap between the lower upper surface 3110B of the containing body 311B and the support foot 111B of the optical component 10B is greater than the gap between the higher upper surface 3111B of the containing body 311B and the support foot 111B. That is to say, the thickness of the adhesive layer 1102B between the lower upper surface 3110B of the containing body 311B and the optical component 10B is greater than the thickness of the fixed adhesive layer 1101B between the higher upper surface 3111B of the containing body 311B and the optical component 10B. This helps to ensure that there is sufficient bonding strength between the optical component 10B and the molded photosensitive component 30B, while further reducing the thickness of the containing body 311B at the lower upper surface 3110B, thereby improving the fit between the camera module and the mounting housing of the smart device.

[0481] More specifically, in this preferred embodiment, Fig.29 As shown, the high upper surface 3111B of the containing body 311B is U-shaped, wherein the low upper surface 3110B of the containing body 311B is linear, and the low upper surface 3110B of the containing body 311B extends from one high outer side surface 3113B of the containing body 311B to the other high outer side surface 3113B of the containing body 311B (that is, the length of the low upper surface 3110B of the containing body 311B is equal to the distance between the two high outer side surfaces 3113B of the containing body 311B, also known as the outer dimension of the containing body 311B) to form a U-shaped groove in the main body 31B. In other words, the high upper surface 3111B of the containing body 311B corresponds to three sides of the optical component 10B, and the low upper surface 3110B of the containing body 311B corresponds to one side of the optical component 10B, so that the optical component 10B is supported on three sides by the high upper surface 3111B of the containing body 311B, and supported on one side by the low upper surface 3110B of the containing body 311B. It can be understood that the adhesive layer 1102B on the low upper surface 3121B of the low body 312B is thicker than the fixed adhesive layer 1101B on the high upper surface 3111B of the containing body 311B, so as to maintain the optical component 10B parallel to the filter 20B.

[0482] Preferably, the fixed adhesive layer 1101B of the lens adhesive 110B may be U-shaped to match the high upper surface 3111B of the enclosure 311B. The adhesive patching layer 1102B of the lens adhesive 110B may be linear to match the low upper surface 3112B of the enclosure 312B. In this way, the fixed adhesive layer 1101B and the adhesive patching layer 1102B are combined to form the lens adhesive 110B with a U-shaped structure, so as to seal the space between the optical component 10B and the molded photosensitive component 30B, thereby preventing external dust from entering and contaminating the optical component 10B and / or the filter 20B.

[0483] It is worth noting that in some embodiments of the present invention, the electronic device 321B is suitable for being covered by the enclosure 311B of the main body 31B due to its large height, and is located below the high upper surface 3111B of the enclosure 311B. In other words, the electronic device 321B is suitable for being arranged on three sides of the photosensitive sheet 33B, and the electronic device 321B corresponds to the high upper surface 3111B of the enclosure 311B.

[0484] Furthermore, the lower upper surface 3110B of the containing body 311B is flush with the lower upper surface 3121B of the lower body 312B, that is, the height of the containing body 311B at the lower upper surface 3110B is equal to the height of the lower body 312B. In this way, the containing body 311B does not need to reserve a space for the filter 20B at the lower upper surface 3110B, so as to further reduce the thickness of the containing body 311B on the side corresponding to the lower upper surface 3110B, so that the optical component 10B protrudes outward at the lower upper surface 3110B of the containing body 311B to a greater extent, thereby further improving the fit between the camera module and the mounting housing of the smart device.

[0485] For example, Fig.28 As shown, in order to adapt to the mounting shell 51 with rounded corners in the smart device, the optical component 10B protrudes outward from the lower upper surface 3110B of the enclosure 311B (i.e., the side of the main body 31B corresponding to the lower upper surface 3110B), so that the optical component 10B of the camera module is closer to the mounting shell 51 of the smart device, so as to increase the screen-to-body ratio of the smart device.

[0486] like Figures 28 to 30As shown, the containing body 311B is shaped into a U-shaped structure, and the short body 312B extends to the inner side of the containing body 311B and is shaped into a square, so that a U-shaped groove is formed inside the main body 31B. In other words, the containing body 311B of the main body 31B has a notch at the lower upper surface 3110B, so that when the optical component 10B is bonded to the first upper surface 3110B of the containing body 311B through the lens glue 110B, an air escape channel is formed between the optical component 10B and the lower upper surface 3110B of the containing body 311B, so that when the lens glue 110B is heated and cured, the air between the optical component 10B and the optical filter 20B can escape through the air escape channel, thereby preventing the air between the optical component 10B and the optical filter 20B from expanding due to heating and damaging the optical filter 20B or the optical component 10B. It can be understood that, similar to the third embodiment and the fourth embodiment, the optical filter 20B of this embodiment of the present invention is also supported on the short upper surface 3121B of the short body 312B.

[0487] like Fig.31 As shown, the containing body 311B is shaped into another feasible mode. The lower upper surface 3110B of the containing body 311B extends from one of the higher inner side surfaces 3112B of the containing body 311B to the other higher inner side surface 3112B of the containing body 311B (i.e., the length of the lower upper surface 3110B of the containing body 311B is equal to the distance between the two higher inner side surfaces 3112B of the containing body 311B, also known as the inner dimension of the containing body 311B), so that the containing body 311B has a larger higher upper surface 3111B, so as to stably support the optical component 10B.

[0488] The manufacturing method of the camera module is as follows Figures 32 to 33C The manufacturing method comprises the steps of:

[0489] I connects the photosensitive sheet 33B, the wiring 34B and the electronic device 32B to the circuit board 35B;

[0490] II placing the connected circuit board 35B between an upper mold 41B and a lower mold 42B;

[0491] III covers the electronic device 32B in a main body 31B and on the circuit board 35B to form a molded photosensitive component 30B, wherein the main body 31B includes a containing body 311B and a short body 312B whose height is lower than the containing body 311B;

[0492] IV mounting the optical filter 20B on the short upper surface 3121B of the short body 312B; and

[0493] V The optical component 10B is eccentrically disposed in the containing body 311B so that the optical component 10B is close to at least one side of a mounting housing 51. .

[0494] Furthermore, the step V of the method for manufacturing the camera module may include the steps of:

[0495] V.1 Fix the optical component 10B to the upper surface 3111B of the enclosure 311B; and

[0496] V.2 Reinforce the optical component 10B on the lower upper surface 3110B of the enclosure 311B, wherein the lower upper surface 3110B is lower than the higher upper surface 3111B.

[0497] In one example of the present invention, the upper surface 3111B of the enclosure 311B in step III is U-shaped, so that the optical component is supported on three sides on the upper surface 3111B of the enclosure 311B and on one side on the lower upper surface 3110B of the enclosure 311B.

[0498] In an example of the present invention, the lower upper surface 3110B of the containing body 311B is flush with the lower upper surface 3121B of the lower body 312B.

[0499] In an example of the present invention, the lower upper surface 3110B of the containing body 311B extends from one of the higher outer side surfaces 3113B of the containing body 311B to another of the higher outer side surfaces 3113B of the containing body 311B.

[0500] In another example of the present invention, the lower upper surface 3110B of the containing body 311B extends from one of the higher inner side surfaces 3112B of the containing body 311B to another of the higher inner side surfaces 3112B of the containing body 311B.

[0501] It is worth mentioning that in step V.1 of the present invention, lens glue 110B is applied to the upper surface 3111B of the enclosure 311B to form a fixed glue layer 1101B between the optical component 10B and the upper surface 3111B of the enclosure 311B.

[0502] Furthermore, the step V.2 of the present invention further comprises the steps of:

[0503] V.2.1 inverting the optical component 10B and the molded photosensitive component 30B so that the optical component 10B is located on the lower side of the molded photosensitive component 30B; and

[0504] V.2.2 Apply the lens glue 110B between the support foot 111B of the optical component 10B and the lower upper surface 3110B of the enclosure 311B to form a glue filling layer 1102B.

[0505] It can be understood that, with the optical component 10B and the molded photosensitive component 30B both turned upside down, the lens glue 110B has no chance to flow into the incident surface 211B of the filter portion 21B, so that the filter 20B is maintained clean and stably supported.

[0506] In an example of the present invention, the fixing glue layer 1101B is U-shaped, and the filling glue layer 1102B is linear.

[0507] In an example of the present invention, the fixing glue layer 1101B is L-shaped, and the repairing glue layer 1102B is L-shaped.

[0508] Particularly, in one example of the present invention, an angle between the tall inner side surface 3112B of the containing body 311B and the short upper surface 3121B of the short body 312B is between 95° and 100°.

[0509] It is worth mentioning that when the high upper surface 3111B of the containing body 311B is U-shaped, the low upper surface 3110B of the containing body 311B will be linear and located on a separate side of the main body 31B, so that the optical component 10B of the camera module can protrude outward from the molded photosensitive component 30B from the side where the low upper surface 3110B is located, which helps to bring the optical component 10B extremely close to the mounting housing of the smart device on the side where the low upper surface 3110B is located, so that the camera module is suitable for being installed in a non-corner area of ​​the mounting housing to be unilaterally adjacent to the mounting housing. However, when the camera module is installed in a corner area of ​​the mounting housing of the smart device, the optical component 10B cannot be close to the mounting housing on both sides at the same time because the low upper surface 3110B is only on one side of the main body 31B, resulting in insufficient fit between the camera module and the mounting housing.

[0510] Therefore, in order to solve the above problems, the present invention further provides another variant implementation of the camera module, such as Fig.34 and Fig.35As shown, the upper surface 3111B of the containing body 311B is L-shaped, and the lower surface 3110B of the containing body 311B is also L-shaped, so that the lower surface 3110B is located on two adjacent sides of the main body 31B. In other words, in this variant embodiment of the present invention, the upper surface 3111B of the containing body 311B of the molded photosensitive component 30B of the camera module is L-shaped, so that the optical component 10B is supported on the upper surface 3111B of the containing body 311B with two adjacent sides, and is supported on the lower surface 3110B of the containing body 311B with two adjacent sides. In this way, the optical component 10B of the camera module can protrude from the molded photosensitive component 30B on both sides of the lower upper surface 3110B, which helps to bring the optical component 10B as close to the mounting housing of the smart device as possible on both sides of the lower upper surface 3110B, so that the camera module is suitable for being installed in the corner area of ​​the mounting housing, so that the optical component 10B is adjacent to the mounting housing on both sides, thereby maximizing the screen-to-body ratio of the smart device.

[0511] Preferably, the fixed adhesive layer 1101B of the lens adhesive 110B may be L-shaped to match the high upper surface 3111B of the enclosure 311B. The adhesive patching layer 1102B of the lens adhesive 110B may also be L-shaped to match the low upper surface 3112B of the enclosure 312B. In this way, the fixed adhesive layer 1101B and the adhesive patching layer 1102B are combined to form the lens adhesive 110B with a square-shaped structure, so as to seal the space between the optical component 10B and the molded photosensitive component 30B, thereby preventing external dust from entering and contaminating the optical component 10B and / or the filter 20B.

[0512] It is worth noting that in some embodiments of the present invention, the electronic device 321B is suitable for being covered by the enclosure 311B of the main body 31B due to its large height, and is located below the high upper surface 3111B of the enclosure 311B. In other words, the electronic device 321B is suitable for being arranged on both sides of the photosensitive sheet 33B, and the electronic device 321B corresponds to the high upper surface 3111B of the enclosure 311B.

[0513] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A camera module, adapted to be fixed in a mounting housing, characterized in that: include: an optical component; A filter; as well as A molded photosensitive component is installed below the optical component and the filter, wherein the molded photosensitive component includes a main body, some electronic devices, a photosensitive film and a circuit board, wherein the circuit board is electrically connected to the electronic devices and the photosensitive film, wherein the photosensitive film is fixed and surrounded by the bottom of the main body to keep a distance from the filter, wherein the main body includes an enclosure and a short body, the short body extends integrally from the inner side of the enclosure, the enclosure has a high upper surface and a low upper surface, the short upper surface of the short body is lower than the high upper surface of the enclosure, wherein the height of the enclosure at the high upper surface is greater than the height of the enclosure at the low upper surface, wherein a part of the optical component is supported on the high upper surface of the enclosure, and another part of the optical component is supported on the low upper surface of the enclosure, wherein the optical component is eccentrically arranged on the enclosure, and the optical component protrudes outward from the low upper surface of the enclosure to the molded photosensitive component to be close to at least one side of the mounting housing, wherein the filter is supported on the short upper surface of the short body.

2. The camera module as described in claim 1 further includes a lens glue, wherein the lens glue includes a fixed glue layer, wherein the fixed glue layer is arranged between the optical component and the high upper surface of the enclosure.

3. The camera module according to claim 2, wherein: The lens glue also includes a repair glue layer, wherein the repair glue layer is arranged between the optical component and the lower upper surface of the containing body, wherein the thickness of the repair glue layer is greater than the thickness of the fixed glue layer.

4. The camera module according to claim 2, wherein: The upper high surface of the container is U-shaped to support the optical component on three sides; wherein the lower upper surface of the container is linear, and the lower upper surface extends from one high outer side surface of the container to another high outer side surface of the container to support the optical component on one side.

5. The camera module according to claim 3, wherein: The upper high surface of the enclosure is U-shaped to support the optical component on three sides; wherein the lower upper surface of the enclosure is linear, and the lower upper surface extends from one high inner side surface of the enclosure to another high inner side surface of the enclosure to support the optical component on one side.

6. The camera module according to claim 3, wherein: The upper surface of the enclosure is L-shaped to support the optical component at two adjacent sides; wherein the lower surface of the enclosure is also L-shaped to support the optical component at two adjacent sides.

7. The camera module according to claim 5, wherein: The fixed adhesive layer is U-shaped, and the repairing adhesive layer is linear, so that the lens adhesive having a U-shaped structure is formed by the fixed adhesive layer and the repairing adhesive layer.

8. The camera module according to claim 6, wherein: The fixed adhesive layer is L-shaped, and the repairing adhesive layer is L-shaped, so that the lens adhesive with a square-shaped structure is formed by the fixed adhesive layer and the repairing adhesive layer.

9. The camera module according to any one of claims 1 to 8, wherein: The electronic device is covered by the enclosure, and the electronic device is located below the high upper surface of the enclosure.

10. The camera module according to claim 9, wherein: The electronic devices are arranged on two sides or three sides of the photosensitive film.

11. The camera module according to any one of claims 1 to 8, wherein: The lower upper surface of the containing body is flush with the lower upper surface of the short body.

12. The camera module according to any one of claims 1 to 8, wherein: A relative height of the short upper surface of the short body is lower than a height of the tallest electronic device among the electronic devices.

13. The camera module according to any one of claims 1 to 8, wherein: The distance between the tall upper surface of the containing body and the short upper surface of the short body is greater than 0.1 mm.

14. The camera module according to any one of claims 1 to 8, wherein: The draft angle of the high inner side of the containment body is between 5° and 10°.

15. The camera module according to any one of claims 1 to 8, wherein: The fillet radius between the tall inner side surface of the containing body and the short upper surface of the short body is substantially equal to 0.1 mm.

16. The camera module according to any one of claims 1 to 8, wherein: The draft angle of the high outer side of the containing body is between 5° and 10°.

17. A method for manufacturing a camera module, characterized in that: Includes steps: I connect a photosensitive film with some wiring and some electronic components on a circuit board; II. Place the connected circuit board between an upper mold and a lower mold; III covers the electronic device in a main body and on the circuit board to form a molded photosensitive component, wherein the main body includes an enclosure and a short body whose height is lower than the enclosure, wherein the short body integrally extends from the inner side of the enclosure, the enclosure has a high upper surface and a low upper surface, the short upper surface of the short body is lower than the high upper surface of the enclosure, wherein the height of the enclosure at the high upper surface is greater than the height of the enclosure at the low upper surface; IV. Installing a filter on the short upper surface of the short body; as well as V disposes the optical component eccentrically on the housing, and the optical component protrudes outward from the lower upper surface of the housing to the molded photosensitive component so that the optical component is close to at least one side of a mounting housing, wherein a portion of the optical component is supported on the high upper surface of the housing, and another portion of the optical component is supported on the lower upper surface of the housing.

18. The method for manufacturing a camera module according to claim 17, wherein: The step V comprises the steps of: V.1 fix the optical component to the upper surface of the enclosure; and V.2 Reinforce the optical component to the lower upper surface of the enclosure.

19. The method for manufacturing a camera module according to claim 18, wherein: In the step V.1, lens glue is applied to the upper surface of the enclosure to form a fixed glue layer between the optical component and the upper surface of the enclosure.

20. The method for manufacturing a camera module according to claim 19, wherein: The step V.2 comprises the steps of: V.2.1 inverting the optical component and the molded photosensitive component so that the optical component is located on the lower side of the molded photosensitive component; and V.2.2 Apply the lens glue between the support feet of the optical component and the lower upper surface of the enclosure to form a glue filling layer.

21. The method for manufacturing a camera module according to claim 19, wherein: The upper high surface of the container is U-shaped to support the optical component on three sides; wherein the lower upper surface of the container is linear, and the lower upper surface extends from one high outer side surface of the container to another high outer side surface of the container to support the optical component on one side.

22. The method for manufacturing a camera module according to claim 20, wherein: The upper high surface of the enclosure is U-shaped to support the optical component on three sides; wherein the lower upper surface of the enclosure is linear, and the lower upper surface extends from one high inner side surface of the enclosure to another high inner side surface of the enclosure to support the optical component on one side.

23. The method for manufacturing a camera module according to claim 20, wherein: The upper surface of the enclosure is L-shaped to support the optical component at two adjacent sides; wherein the lower surface of the enclosure is also L-shaped to support the optical component at two adjacent sides.

24. The method for manufacturing a camera module according to claim 22, wherein: The fixing glue layer is U-shaped, and the filling glue layer is linear.

25. The method for manufacturing a camera module according to claim 23, wherein: The fixing glue layer is L-shaped, and the filling glue layer is L-shaped.

26. The method for manufacturing a camera module according to any one of claims 17 to 23, wherein: The angle between the tall inner side surface of the containing body and the short upper surface of the short body is between 95° and 100°.

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