Laminated board, surface plating-free three-dimensional packaging structure and method

Abstract

The application discloses a laminated plate and a three-dimensional packaging structure without surface plating layer and a method. The laminated plate is provided with positioning holes on at least one corner and is provided with grooves on at least one side, and a plurality of half pads are arranged in the grooves at intervals. The three-dimensional packaging structure without surface plating layer comprises a laminated plate stacking structure and a pouring layer. The laminated plate stacking structure is formed by stacking a plurality of laminated plates in the above manner from top to bottom, and a plurality of pins are arranged on the laminated plate at the lowermost layer of the laminated plate stacking structure. A plurality of lead wires are arranged between the laminated plates, and two ends of each lead wire are welded to a half pad on different laminated plates. The pouring layer is used to pour the laminated plate stacking structure, and one end of the pin extends to the surface of the pouring layer. According to the three-dimensional packaging structure without surface plating layer of the technical scheme, the laminated plate is used, the lead wires are used for electrically connecting the laminated plates, and the surface of the pouring layer does not need to be plated with a metal plating layer, so that the production process is simplified, and the material cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of three-dimensional chip packaging, and particularly to a multilayer board, and also to a three-dimensional packaging structure and method without surface plating formed by the multilayer board. Background Technology

[0002] With the development of semiconductor technology and the upgrading of integrated circuit processes, the size of integrated chips is getting smaller and smaller. Packaging several chips into modules in three dimensions to save installation space and reduce wiring difficulty has become a common technical means.

[0003] In existing 3D packaging technology, the laminated boards are connected to the surface metal plating via lead bridges. Lines are then etched into the metal plating to divide it into several independent regions, enabling electrical connections between the laminated boards. Since the metal plating is exposed, it may be damaged during production, requiring rework or scrapping. Furthermore, the metal plating typically uses gold or silver, which have good conductivity, resulting in higher costs. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a laminated board, in which the laminated boards can be internally connected by leads, thereby reducing the manufacturing difficulty and material cost of three-dimensional packaging structures using this laminated board.

[0005] The present invention also proposes a three-dimensional packaging structure and method with the above-mentioned laminated plate without surface coating.

[0006] In a first aspect, according to an embodiment of the present invention, the laminated board has positioning holes at least one pair of diagonal locations and a groove on at least one side, wherein a plurality of half-side pads are spaced apart in the groove.

[0007] The multilayer board according to embodiments of the present invention has at least the following advantages: the diagonal positioning holes facilitate positioning during stacking; the half-pads within the grooves allow for lead soldering to achieve electrical connections between the multilayer boards. The half-pads within the grooves provide some protection for the leads, and also facilitate direct connection to testing equipment to test the electrical performance of the assembled multilayer board. Using the three-dimensional packaging structure formed by the aforementioned multilayer board, electrical connections between the multilayer boards are achieved through lead soldering via half-pads, eliminating the need for metal plating on the potting layer surface, reducing process complexity, and saving material costs.

[0008] According to some embodiments of the present invention, the groove depth is greater than or equal to 2 mm.

[0009] According to some embodiments of the present invention, the aperture of the half pad is greater than or equal to 0.2 mm, and the outer width of the half pad is greater than or equal to 0.4 mm.

[0010] According to some embodiments of the present invention, the spacing between adjacent half pads is greater than or equal to 0.5 mm.

[0011] Secondly, according to an embodiment of the present invention, a three-dimensional packaging structure without surface plating includes: a stacked structure comprising multiple stacked boards according to any one of claims 1 to 4 stacked from top to bottom, wherein a plurality of pins are provided on the bottommost stacked board of the stacked structure; a plurality of leads, wherein the two ends of each lead are respectively soldered to a half-pad on a different stacked board for electrical connection between the stacked boards; and a potting layer encapsulating the stacked structure therein, wherein one end of each pin extends to the outside of the surface of the potting layer.

[0012] The three-dimensional encapsulation structure without surface plating according to embodiments of the present invention has at least the following advantages: internal electrical connection between the laminates, no metal plating on the surface of the potting layer, simple manufacturing process, and low material cost.

[0013] According to some embodiments of the present invention, the leads electrically connect the half-pads located on the same column on adjacent laminates.

[0014] According to some embodiments of the present invention, the spacing between adjacent laminates is greater than or equal to 0.4 mm.

[0015] According to some embodiments of the present invention, the lead wire has an arc, and the arc height of the lead wire is less than or equal to 2 mm.

[0016] Thirdly, according to an embodiment of the present invention, a three-dimensional packaging method without surface plating includes:

[0017] Electro-assembly of multilayer boards: assembling chips and / or components onto a multilayer board, electrically connecting the chips and components to corresponding half-pads on the multilayer board, and performing electrical performance testing on the assembled multilayer board through the half-pads;

[0018] Laminate stacking: Multiple laminates are vertically stacked by inserting positioning pins into positioning holes on the laminates to form a laminate stacking structure.

[0019] Layer interconnection: The two ends of the lead are respectively soldered to two half pads located in the same column on adjacent laminates to achieve electrical connection between the laminates;

[0020] Encapsulation: The laminated plate stack structure is encapsulated in encapsulating material, and then the encapsulating material is dried and cured.

[0021] The surface-plating-free stereolithography method according to embodiments of the present invention has at least the following advantages: it saves the surface metallization step, reduces the process difficulty, and reduces material costs.

[0022] According to some embodiments of the present invention, the positioning pin is a metal positioning pin or a resin positioning pin.

[0023] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a top view of the laminated plate according to an embodiment of the present invention;

[0026] Figure 2 This is a side view of the laminated plate according to an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the internal structure of a three-dimensional packaging structure without surface coating according to an embodiment of the present invention;

[0028] Figure 4 This is a side view of a three-dimensional packaging structure without surface coating according to an embodiment of the present invention;

[0029] Figure 5 This is a flowchart of a three-dimensional packaging method without surface coating according to an embodiment of the present invention.

[0030] Figure label:

[0031] 100mm laminate, 110mm positioning hole, 120mm half-side solder pad.

[0032] Lead wire 200,

[0033] 300mm potting layer

[0034] Pin 400. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0037] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0038] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0039] Reference Figure 1 and Figure 2 According to an embodiment of the present invention, the laminate 100 has at least a pair of diagonally opposite positioning holes 110 and at least one side has a groove, within which a plurality of half-pads 120 are spaced apart. With the laminate 100 according to the above technical solution, chips or devices on the laminate 100 can be electrically connected to the half-pads 120. The half-pads 120, being semi-open, facilitate the connection of testing instruments for electrical testing. Positioning pins can be inserted into the diagonally opposite positioning holes 110, facilitating vertical positioning between the upper and lower laminates 100 during stacking. Using the above-described three-dimensional packaging structure of the laminate 100, electrical connections between different laminates 100 can be achieved by soldering leads 200 onto the half-pads 120. The open structure of the half-pads 120 also facilitates the soldering of leads 200. The half-pads 120, positioned within the grooves between the positioning holes 110, can protect the leads 200 to some extent, preventing breakage during production. The three-dimensional packaging structure of the laminate 100 using the above technical solution has the laminates 100 electrically connected to each other via leads 200 and half-side pads 120. The surface of the three-dimensional packaging structure does not need to be plated with a metal coating, which reduces the difficulty of the process and saves material costs.

[0040] In some embodiments, to better protect the lead 200, the groove depth of the laminate 100 is 2 mm or more. To make the lead 200 soldering more secure, the aperture of the half pad 120 is 0.2 mm or more, and the outer width of the half pad 120 is 0.4 mm or more.

[0041] Reference Figure 3 and Figure 4 According to an embodiment of the present invention, a three-dimensional packaging structure without surface plating includes a stacked structure of laminated boards and a potting layer 300. The stacked structure of laminated boards includes multiple laminated boards 100 stacked vertically from top to bottom, with a plurality of pins 400 provided on the bottommost laminated board 100. The laminated boards 100 are electrically connected to each other by leads 200, with both ends of the leads 200 respectively soldered to a half-pad 120 on a different laminated board 100. The potting layer 300 encapsulates the stacked structure of laminated boards, with one end of the pins 400 extending beyond the surface of the potting layer 300 for electrical connection with external circuitry. It is understood that the leads 200 can be flexible conductors such as copper wire or enameled wire.

[0042] In some embodiments, in order to allow the potting material to flow sufficiently between the laminates 100, the spacing between the laminates 100 needs to be greater than 0.4 mm. To ensure that the lead wire 200 does not break in the event of slight misalignment between the laminates 100, the lead wire 200 needs to have a certain curvature, and the arc height of the lead wire 200 needs to be less than 2 mm.

[0043] Reference Figure 5 According to embodiments of the present invention, the surface-plated-free three-dimensional packaging structure can be manufactured by the following surface-plated-free three-dimensional packaging method, specifically including the following steps:

[0044] Electro-assembly of multilayer board: assembling chips and / or components onto multilayer board 100, electrically connecting the chips and components to half-pads 120 on multilayer board 100, and performing electrical performance testing on the multilayer board 100 after electro-assembly through the half-pads 120.

[0045] Stacking of laminated plates: Multiple laminated plates 100 are vertically stacked by inserting positioning pins into positioning holes 110 on the laminated plate 100 to form a stacked plate structure.

[0046] Interconnection of stacked layers: The two ends of the lead 200 are respectively soldered to two half pads 120 located in the same column on the adjacent stacked boards 100 to realize the electrical connection between the stacked boards 100; it can be understood that the lead 200 can be soldered to the half pads 120 by wave soldering or laser soldering.

[0047] Encapsulation: The laminated plate stack structure is encapsulated in encapsulating material, and then the encapsulating material is dried and cured.

[0048] In some embodiments, the locating pins can be metal locating pins or resin locating pins. With metal locating pins, after potting, the metal locating pins can be removed from the potting layer 300, forming four through holes at the locating holes 110, which can be used for mechanical fixation of the three-dimensional packaging structure, enhancing the stability of the module installation. With resin locating pins, the resin locating pins will fuse with the potting layer 300 during potting, suitable for three-dimensional packaging of smaller modules.

[0049] The following is for reference. Figures 1 to 5 The laminate 100 and the three-dimensional packaging structure without surface plating according to an embodiment of the present invention are described in detail with reference to a specific example. It is to be understood that the following description is merely illustrative and not intended to limit the invention in any specific way.

[0050] Reference Figure 1 and Figure 2 In this embodiment, the laminate 100 has a rectangular structure. Circular positioning holes 110 are provided at the four corners of the laminate 100, and a rectangular groove is provided between each pair of positioning holes 110, meaning that rectangular grooves are provided on all four sides of the laminate 100. Multiple half-pads 120 are evenly spaced inside each groove, forming a sawtooth shape. The diameter of each half-pad 120 is 0.2 mm, the outer width of each half-pad 120 is 0.4 mm, and the spacing between adjacent half-pads 120 is 0.5 mm. In this embodiment, the depth of the rectangular groove is 2 mm.

[0051] Reference Figure 3 and Figure 4 In this embodiment, the stacked structure consists of four stacked boards 100 stacked vertically. The top three stacked boards 100 are used to support chips and / or other devices, while the bottom stacked board 100 has an array of pin-shaped leads 400. In this embodiment, the leads 200 are made of enameled wire and are laser-welded to the half-pads 120. The two half-pads 120 of adjacent stacked boards 100 located in the same column are electrically connected by leads 200, ensuring that the leads 200 do not cross each other, facilitating soldering. The arc height of the leads 200 is 2mm. In this embodiment, the potting layer 300 uses epoxy resin as the potting material.

[0052] The three-dimensional encapsulation structure without surface plating according to an embodiment of the present invention uses a laminated board according to an embodiment of the present invention. The laminated boards are internally electrically connected by leads. No metal plating is required outside the potting layer, which simplifies the manufacturing process and reduces material costs.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0054] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A three-dimensional packaging structure without surface coating, characterized in that, The application relates to a laminated plate stack structure, which comprises a plurality of laminated plates stacked from top to bottom, and a plurality of pins arranged on the laminated plate at the bottom layer of the laminated plate stack structure; wherein at least one pair of diagonal positions of each laminated plate is provided with a positioning hole, at least one side is provided with a groove, a plurality of half pads are arranged in the groove at intervals, and the groove depth is greater than or equal to 2 mm; the hole diameter of the half pad is greater than or equal to 0.2 mm, the outer pad width of the half pad is greater than or equal to 0.4 mm, and the interval between adjacent half pads is greater than or equal to 0.5 mm; a plurality of lead wires, two ends of each lead wire are respectively welded with a half pad on different laminated plates, and the lead wires are used for electrically connecting the half pads on adjacent laminated plates in the same column; a potting layer, the laminated plate stack structure is filled in the potting layer, and one end of the pin extends to the surface outside the potting layer; the interval between adjacent laminated plates is greater than or equal to 0.4 mm; and the lead wire has an arc, and the arc height of the lead wire is less than or equal to 2 mm. ​ ​ ​ ​ ​

Images