Light emitting module and manufacturing method thereof

Abstract

The present invention provides a light-emitting module and a manufacturing method thereof, which can configure a light-emitting device relative to a light guide plate with high position accuracy. The light-emitting module comprises: a light guide plate having a first surface, a second surface on the opposite side of the first surface, and a through portion penetrating between the first surface and the second surface; a light-emitting device configured on the second surface side of the through portion; a light-transmitting component disposed on the first surface side of the through portion and on the light-emitting device and between the light-emitting device and the side wall of the through portion; and a first light-reflecting component disposed between the upper surface of the light-emitting device and the light-transmitting component and in contact with the upper surface of the light-emitting device.

Description

Technical Field

[0001] The invention relates to a light emitting module and a manufacturing method thereof. Background Art

[0002] A light emitting module that combines a light emitting diode or other light emitting element with a light guide plate is widely used as a surface light source such as a backlight of a liquid crystal display. For example, Patent Document 1 discloses a structure in which a light guide plate having a plurality of through holes is joined to a substrate having a plurality of light sources, and the light sources are arranged in the through holes.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2011-211085 Summary of the invention

[0004] An object of the present invention is to provide a light emitting module and a manufacturing method thereof, which can arrange a light emitting device on a light guide plate with high position accuracy.

[0005] According to one aspect of the present invention, a light-emitting module comprises: a light guide plate having a first surface, a second surface on the opposite side of the first surface, and a through portion extending between the first surface and the second surface; a light-emitting device arranged on the second surface side of the through portion; a light-transmitting component disposed on the first surface side of the through portion and on the light-emitting device and between the light-emitting device and the side wall of the through portion; and a first reflective component disposed between the upper surface of the light-emitting device and the light-transmitting component and connected to the upper surface of the light-emitting device.

[0006] In addition, according to another aspect of the present invention, a method for manufacturing a light-emitting module comprises: a process of forming a reflective component on the second surface of a light guide plate having a first surface and a second surface opposite to the first surface, and forming a through hole that passes through the first surface and the second surface in the light guide plate in a manner that also passes through the reflective component; a process of gluing the second surface side of the light guide plate to a sheet material, and closing the opening of the through hole on the second surface side of the through hole with the sheet material; a process of arranging a light-emitting device having an electrode portion in the through hole, and gluing the electrode portion to the sheet material that closes the opening of the through hole; a process of forming a translucent component on the light-emitting device in the through hole and between the light-emitting device and the side wall of the through hole, and fixing the light-emitting device to the light guide plate by the translucent component; a process of separating the light guide plate to which the light-emitting device is fixed and the sheet material, and exposing the electrode portion of the light-emitting device on the second surface side.

[0007] In addition, according to another embodiment of the present invention, a method for manufacturing a light-emitting module comprises: a process of preparing a light guide plate having a first surface and a second surface opposite to the first surface and having a through hole extending between the first surface and the second surface; a process of gluing the second surface side of the light guide plate to a sheet material, and closing the opening of the through hole on the second surface side with the sheet material; a process of arranging a light-emitting device having an electrode portion in the through hole, and gluing the electrode portion to the sheet material that closes the opening of the through hole; a process of forming a translucent component on the light-emitting device in the through hole and between the light-emitting device and the side wall of the through hole, and fixing the light-emitting device to the light guide plate by the translucent component; a process of separating the light guide plate to which the light-emitting device is fixed and the sheet material, and exposing the electrode portion of the light-emitting device on the second surface side.

[0008] According to one aspect of the present invention, a light emitting module and a method for manufacturing the same can be provided, which can arrange a light emitting device on a light guide plate with high positional accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic cross-sectional view of a light emitting module according to an embodiment.

[0010] Figure 2 This is a schematic cross-sectional view of a light emitting module according to an embodiment.

[0011] Figure 3A This is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0012] Figure 3B This is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0013] Figure 4A It is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0014] Figure 4B This is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0015] Figure 5A This is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0016] Figure 5B This is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0017] Fig. 6A This is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0018] Figure 6BThis is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0019] Figure 7 This is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0020] Fig. 8A This is a schematic perspective view showing a method for manufacturing a light emitting module according to an embodiment.

[0021] Figure 8B This is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to an embodiment.

[0022] Fig. 9 It is a schematic cross-sectional view of a light emitting module according to another embodiment.

[0023] Fig. 10A It is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to another embodiment.

[0024] Fig. 10B It is a schematic cross-sectional view showing a method for manufacturing a light emitting module according to another embodiment.

[0025] Fig.11 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0026] Fig.12 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0027] Fig.13 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0028] Fig.14 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0029] Fig.15 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0030] Fig.16 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0031] Fig.17 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0032] Fig.18 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0033] Fig.19A This is a schematic cross-sectional view of a light emitting device according to still another embodiment.

[0034] Fig.19B This is a schematic cross-sectional view of a light emitting device according to still another embodiment.

[0035] Fig.19C This is a schematic cross-sectional view of a light emitting device according to still another embodiment.

[0036] Fig. 20 This is a schematic plan view of a light emitting module according to an embodiment.

[0037] Fig.21 It is an exploded perspective view showing the structure of a liquid crystal display according to an embodiment.

[0038] Marking Description

[0039] 10: Light guide plate

[0040] 11: Side 1

[0041] 12: Side 2

[0042] 13: Inclined surface

[0043] 15: Through part

[0044] 15': Through hole

[0045] 20: Light-emitting device

[0046] 21: Light-emitting element

[0047] 22: Phosphor layer

[0048] 23: First reflective component

[0049] 24: Second reflective component

[0050] 25: Electrode

[0051] 26: Rear electrode

[0052] 27: Conductive film

[0053] 30: Translucent parts

[0054] 31: concave part

[0055] 40: Fourth reflective component

[0056] 50: The third reflective component

[0057] 61: Wiring

[0058] 70: Air layer

[0059] 100: Sheet

[0060] 120: LCD panel

[0061] 200: Light emitting module

[0062] 1000: LCD display DETAILED DESCRIPTION

[0063] Hereinafter, the embodiment will be described with reference to the drawings. In addition, in each of the drawings, the same reference numerals are given to the same elements.

[0064] Figure 1 It is a schematic cross-sectional view of a light emitting module according to an embodiment of the present invention. Figure 1 The cross section cut at a position passing through the central axis of the through portion 15 formed in the light guide plate 10 is shown.

[0065] The light emitting module according to the embodiment includes a light guide plate 10 , a light emitting device 20 , and a light transmissive member 30 .

[0066] The light guide plate 10 has a transmittance to the light emitted by the light emitting device 20. As a material of the light guide plate 10, for example, a thermoplastic resin such as acryl, polycarbonate, cyclic polyolefin, polyethylene terephthalate or polyester, a thermosetting resin such as epoxy or silicon, or glass can be used. The thickness of the light guide plate 10 is preferably 100 μm to 1000 μm, and more preferably 200 μm or more and 800 μm or less.

[0067] The light guide plate 10 includes a first surface 11 that becomes a light emitting surface and a second surface 12 that is opposite to the first surface 11. The light guide plate 10 also includes a through portion 15 that penetrates between the first surface 11 and the second surface 12.

[0068] The light emitting device 20 includes a light emitting element 21 and a phosphor layer 22 as a light-transmitting member. The phosphor layer 22 is disposed on the upper surface of the light emitting element 21. The phosphor layer 22 may be in contact with the upper surface of the light emitting element 21, or may be bonded by an adhesive or the like. The light emitting element 21 includes a semiconductor stack. The semiconductor stack includes, for example, In x Al y Ga 1-x-y N(0≤x, 0≤y, x+y≤1), can emit blue light.

[0069] The phosphor layer 22 includes a base material and a phosphor dispersed in the base material. As the material of the base material of the phosphor layer 22, for example, silicone resin, epoxy resin, glass, etc. can be used. The phosphor is a wavelength conversion material that is excited by the light emitted by the light emitting element 21 and emits light of a wavelength different from the wavelength of the light emitted by the light emitting element 21. For example, as the phosphor, a yttrium-aluminum-garnet-based phosphor (e.g., Y3(Al, Ga)5O 12 :Ce), lutetium·aluminum·garnet phosphors (such as Lu3(Al,Ga)5O 12 :Ce), terbium·aluminum·garnet phosphors (such as Tb3(Al,Ga)5O 12 :Ce), β-SiAlONi ceramic phosphor (such as Si 6-z Alz O z N 8-z :Eu(0<z<4.2)), α-SiAlOxYN ceramic phosphor (such as Mz(Si,Al) 12 (O, N) 16 (wherein 0<z≤2, M is Li, Mg, Ca, Y and lanthanum elements other than La and Ce), nitride phosphors such as nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphors (e.g. (Sr, Ca)AlSiN3:Eu), fluoride phosphors such as KSF phosphors (K2SiF6:Mn) or MGF phosphors (3.5MgO·0.5MgF2·GeO2:Mn), silicate phosphors (e.g. (Ba, Sr)2SiO4:Eu), chlorosilicate phosphors (e.g. Ca8Mg(SiO4)4Cl2:Eu), etc. The phosphor layer 22 may also include multiple phosphors. In addition, multiple of the above phosphors may be stacked.

[0070] A second light-reflecting member 24 is provided on the side of the light-emitting element 21. A pair of positive and negative element electrodes are provided on the opposite sides of the upper surface of the light-emitting element 21. The element electrode may include an ohmic electrode in ohmic contact with the semiconductor layer and a columnar electrode (rear electrode 26) further connected to the ohmic electrode. A conductive film 27 is provided on the lower surface of the rear electrode 26 and the lower surface of the second light-reflecting member 24. In the following, the light-emitting element 21 provided with the rear electrode 26 is described, but the rear electrode 26 may be omitted, in which case the rear electrode 26 can be replaced as the element electrode.

[0071] The rear electrode 26 is connected to the conductive film 27. The rear electrode 26 is provided on the lower surface of the light emitting element 21, and the conductive film 27 extends from the rear electrode 26 to a region outside the lower surface (side surface) of the light emitting element 21. The rear electrode 26 and the conductive film 27 function as the electrode portion 25 of the light emitting device 20. In addition, the conductive film 27 may only cover the lower surface of the rear electrode 26. Moreover, a light emitting device without the conductive film 27 may also be provided.

[0072] The second light-reflecting member 24 is provided between the conductive film 27 and the phosphor layer 22 on the side of the light-emitting element 21. The second light-reflecting member 24 directly or indirectly covers the side of the light-emitting element 21. For example, an adhesive or the like for connecting the phosphor layer 22 and the light-emitting element 21 may also be disposed on the side of the light-emitting element 21. Moreover, the side of the light-emitting element 21 may also be covered by the second light-reflecting member 24 via the adhesive. The second light-reflecting member 24 is also provided between a pair of rear electrodes 26 on the lower surface of the light-emitting element 21. That is, at least a portion of the lower surface of the semiconductor stack of the light-emitting element 21 is covered by the second light-reflecting member 24.

[0073] The light emitting device 20 is arranged on the second surface 12 side of the through portion 15 of the light guide plate 10. That is, the light emitting device 20 is arranged at a position closer to the second surface 12 than the first surface 11. The light emitting element 21 is located on the side closer to the second surface 12 than the phosphor layer 22, and the phosphor layer 22 is located on the side closer to the first surface 11 than the light emitting element 21.

[0074] A light-transmitting component 30 is provided in the through-portion 15 of the light guide plate 10. The light-transmitting component 30 has the property of being transparent to the light emitted by the light-emitting device 20, and for example, a resin that is the same as the material of the light guide plate 10 or a resin that has a small refractive index difference with the material of the light guide plate 10 can be used. Alternatively, glass can be used as the material of the light-transmitting component 30.

[0075] The light-transmitting member 30 is disposed on the light-emitting device 20 and between the side surface of the light-emitting device 20 and the side wall of the through-portion 15. The light-emitting device 20 is fixed to the light guide plate 10 through the light-transmitting member 30. No space such as an air layer is formed between the side surface of the light-emitting device 20 and the light-transmitting member 30, between the side wall of the through-portion 15 and the light-transmitting member 30, and between the upper surface of the light-emitting device 20 and the light-transmitting member 30. However, this is not limited to this, and air may also be contained in the light-transmitting member 30.

[0076] A recess 31 may be provided on the upper surface of the light-transmitting component 30. The recess 31 may be formed into a recess in the shape of a cone such as a cone or a pyramid, or a truncated cone such as a truncated cone or a truncated pyramid. Alternatively, the recess may be formed into a triangular prism or a semi-cylindrical prism in which light can be refracted in only one direction when viewed from above. The opening diameter of the recess 31 may be equal to the opening diameter of the through portion 15. Alternatively, the opening diameter of the recess 31 may be smaller than the opening diameter of the through portion 15. In addition, the center of the recess 31 may coincide with the center of the through portion 15 when viewed from above. Furthermore, the center of the recess 31 may coincide with the center of the light-emitting device 20 when viewed from above. Alternatively, depending on the position of the through portion 15, the center of the recess 31 may not coincide with the center of the through portion 15 when viewed from above, or may not coincide with the center of the light-emitting device 20. In Figure 1 In the example shown, a concave portion 31 having a V-shaped cross section is provided. That is, an inclined surface inclined relative to the first surface 11 is provided on the upper surface of the light-transmitting member 30. By causing reflection and refraction of light at the interface between the light-transmitting member 30 and the air on the inclined surface, it is possible to suppress the concentration of brightness in the area directly above the light-emitting device 20. Alternatively, by providing a curved surface or a convex portion on the upper surface of the light-transmitting member 30, it is possible to achieve light diffusion or improve light emission efficiency.

[0077] A first light reflecting member 23 is provided between the upper surface of the light emitting device 20, i.e., the upper surface of the phosphor layer 22, and the light transmissive member 30. The first light reflecting member 23 is in contact with the upper surface of the light emitting device 20 (in this example, the upper surface of the phosphor layer 22), and directly covers the upper surface of the light emitting device 20. In addition, the first light reflecting member 23 may also be a part of the light emitting device 20.

[0078] A third light reflecting member 50 is provided around the light emitting device 20 disposed in the through portion 15 on the second surface 12 side of the light guide plate 10. The third light reflecting member 50 is provided on the side surface of the second light reflecting member 24, and is not provided on at least a portion of the side surface of the phosphor layer 22. A portion or the entire side surface of the phosphor layer 22 is covered by the light transmissive member 30. Preferably, the entire side surface of the phosphor layer 22 is in contact with the light transmissive member 30.

[0079] The second surface 12 of the light guide plate 10 has a flat surface parallel to the first surface 11 and a recessed portion with the inclined surface 13 as the inner side surface. In addition, the corner between the second surface 12 and the inclined surface 13 may also have a curvature. In addition, a straight line portion may also be included between the second surface 12 and the inclined surface 13. A fourth reflective component 40 is provided on the second surface 12 and the inclined surface 13 (i.e., the inner side surface of the recessed portion). The inclined surface 13 of the second surface 12 is provided on the inner side surface of the recessed portion of the second surface 12 in a manner of surrounding the through hole when viewed from above. When the light guide plate 10 has a plurality of through portions 15, the inclined surface 13 is, for example, Figure 2 As shown, the inner side surface of the recessed portion between the through portion 15 and the adjacent through portion 15 is arranged. When the light guide plate 10 has a plurality of through portions 15, the recessed portion of the second surface 12 is arranged in a grid shape, and a through portion 15 is provided in the area surrounded by each grid. In addition, the second surface 12 of the light guide plate 10 may not have the inclined surface 13. That is, the second surface 12 may also be a flat surface. In addition, the second surface 12 may only be an inclined surface without a flat surface. That is, the through portion 15 and the inclined surface 13 may also be in contact with each other.

[0080] The first light-reflecting member 23, the second light-reflecting member 24, the third light-reflecting member 50 and the fourth light-reflecting member 40 may be, for example, a white resin containing a light-reflecting member (or a light-scattering member). The first light-reflecting member 23, the second light-reflecting member 24, the third light-reflecting member 50 and the fourth light-reflecting member 40 may be, for example, a silicone resin or an epoxy resin containing particles such as TiO2, SiO2, Al2O3, ZnO as a light-reflecting member (or a light-scattering member). The first light-reflecting member 23 and the fourth light-reflecting member 40 may also use a reflective metal or a dielectric film (dielectric sheet) or the like. In addition, when used as the first light-reflecting member 23 and the fourth light-reflecting member 40, in addition to the resin sheet composed of the white resin mentioned above, a resin sheet recognized as white by containing bubbles may also be used.

[0081] The first light reflecting member 23 reflects part of the light emitted directly above the light emitting device 20 downward or laterally and transmits the rest. This can prevent the area directly above the light emitting device 20 from becoming brighter than other areas on the light emitting surface of the light emitting module.

[0082] Light emitted downward from the phosphor or light emitted laterally and downward from the light emitting element 21 is reflected upward by the second light reflecting member 24 and the third light reflecting member 50, thereby increasing the brightness of light extracted from the light emitting surface, namely the first surface 11.

[0083] Furthermore, the fourth light reflecting member 40 provided on the second surface 12 and the inclined surface 13 of the light guide plate 10 can reflect the light guided in the light guide plate 10 toward the first surface 11 , thereby increasing the brightness of the light taken out from the first surface 11 .

[0084] The lower surface of the fourth light-reflecting member 40, the lower surface of the third light-reflecting member 50 and the lower surface of the conductive film 27 are arranged on the same surface, and a metal-containing wiring 61 is provided on the lower surface of the fourth light-reflecting member 40, the lower surface of the third light-reflecting member 50 and the lower surface of the conductive film 27. The conductive film 27 is connected to the wiring 61. The light-emitting module is mounted on the wiring substrate via the wiring 61.

[0085] like Figure 2 As shown, a plurality of through-portions 15 can be provided on a light guide plate 10, and a plurality of light emitting devices 20 can be arranged. A light emitting device 20 is arranged in each through-portion 15, and each light emitting device 20 is fixed to the light guide plate 10 via a light-transmitting member 30. This structure realizes a wide surface light source with small brightness unevenness.

[0086] Next, refer to Figure 3A to Figure 8B A method for manufacturing a light emitting module according to an embodiment will be described.

[0087] First, if Figure 3A As shown, a light guide plate 10 is prepared. A recessed portion having a first surface 11, a second surface 12 on the opposite side of the first surface 11, and an inclined surface 13 forming an obtuse angle with the second surface 12 as inner sides is formed on the light guide plate 10. The recessed portion is formed in a lattice shape when viewed from above. Such a light guide plate 10 can be prepared, for example, by forming a flat light-transmitting component by purchase or injection molding, and forming the recessed portion using a processing tool. Alternatively, the light guide plate 10 can be prepared by purchasing a light guide plate having a recessed portion in advance, or by forming a light guide plate having a recessed portion by injection molding, etc.

[0088] Then, if Figure 3BAs shown, a fourth reflective component 40 is formed on the second surface 12 (the flat surface and the inner side surface of the concave portion, i.e., the inclined surface 13) of the light guide plate 10. When the fourth reflective component 40 is a white resin material, as a forming method, a method of forming a liquid or paste reflective resin by printing, spraying, compression molding, transfer mold, etc., and solidifying it can be cited. Alternatively, a separately formed reflective sheet can also be pasted. In addition, when the fourth reflective component 40 is a metal, the pasting or sputtering, vapor deposition, and paste printing of metal foil can be cited. When the fourth reflective component 40 is a dielectric, the pasting and sputtering formation of a dielectric sheet can be cited.

[0089] After forming the fourth light-reflecting member 40, as Figure 4A As shown, a plurality of through holes 15 ′ penetrating between the first surface 11 and the second surface 12 are formed in the light guide plate 10 so as to also penetrate the fourth light reflecting member 40 . Fig. 8A This is a perspective view of the light guide plate 10 in which the plurality of through holes 15 ′ are formed, as viewed from the first surface 11 side. Figure 4A yes Fig. 8A A cross-sectional view of the IVA-IVA line in FIG. Fig. 8A In the example shown, the planar shape of the through hole 15' may be circular, or may be triangular, quadrilateral, etc. When it is an angle, the corners may be curved or chamfered.

[0090] For example, the through hole 15' can be formed by mechanical processing such as drilling or punching. Alternatively, the through hole 15' can also be formed by etching or laser. When mechanical processing is used, Figure 8B As shown, the corners of the ends of the through hole 15' may have an arc (curvature). In addition, during machining, projections and depressions may be formed on the inner wall of the through hole 15'.

[0091] After the through hole 15' is formed, Figure 4B As shown, the second surface 12 side of the light guide plate 10 is adhered to the sheet 100. In this example, the surface of the fourth light reflecting member 40 is adhered to the sheet 100. The opening of the through hole 15' on the second surface 12 side is blocked by the sheet 100. A part of the sheet 100 forms the bottom surface of the through hole 15'.

[0092] like Figure 5A As shown, the light emitting device 20 is disposed in the through hole 15'. Figure 1 The conductive film 27 of the electrode portion 25 shown is attached to the sheet 100 that closes the opening of the through hole 15' on the second surface 12 side. A gap exists between the side surface of the light emitting device 20 and the side wall of the through hole 15'.

[0093] After the light emitting device 20 is disposed in the through hole 15', Figure 5B As shown, liquid resin 30' is supplied into through hole 15'. The resin 30' may be supplied by potting, spraying, dispensing, jet dispensing, printing, etc. The resin 30' contains a reflective member such as TiO2, SiO2, Al2O3, ZnO, or other microparticles.

[0094] Then, the reflector contained in the resin 30' is precipitated on the upper surface of the light emitting device 20 and the sheet 100 closing the opening on the second surface 12 side of the through hole 15' by centrifugation. The reflector precipitated on the sheet 100 is precipitated in a region below the phosphor layer 22.

[0095] By the sedimentation of reflective elements, e.g. Fig. 6A As shown, the first light reflecting member 23 is formed on the upper surface of the phosphor layer 22 of the light emitting device 20 , and the third light reflecting member 50 is formed around the second surface 12 side of the light emitting device 20 .

[0096] After the reflective member is allowed to settle, the resin 30' is cured. For example, the resin 30' is thermally cured at a temperature of about 150° C. The sheet 100 has heat resistance with respect to the temperature at this time.

[0097] By curing the resin 30 ′, a light-transmitting member 30 is formed on the light-emitting device 20 in the through hole 15 ′ and between the light-emitting device 20 and the side wall of the through hole 15 ′. The light-emitting device 20 is fixed to the light guide plate 10 via the light-transmitting member 30 .

[0098] The upper surface of the light-transmitting member 30 is pressed by, for example, a forming die. Figure 6B As shown, the recess 31 is formed on the upper surface of the light-transmitting member 30. Alternatively, the recess 31 can be formed by utilizing the volume reduction of the light-transmitting member 30 due to curing or by utilizing the surface tension to cause the resin 30' to climb up the inner side surface of the through hole 15'.

[0099] Afterwards, the light guide plate 10 fixed with the light emitting device 20 and the sheet 100 are separated. Figure 7 As shown, the conductive film 27 constituting the electrode portion 25 of the light emitting device 20 is exposed on the second surface 12 side. Figure 1 The wiring 61 shown is formed on the second surface 12 side so as to be connected to the exposed conductive film 27 .

[0100] According to the embodiment, since the through hole 15' is formed after the fourth light-reflecting member 40 is formed on the second surface 12, and the light-emitting device 20 is arranged in the through hole 15', the electrode portion 25 of the light-emitting device 20 is not covered by the fourth light-reflecting member 40. In addition, since the resin 30' is supplied into the through hole 15' after the electrode portion 25 of the light-emitting device 20 is attached to the sheet 100, the electrode surface of the light-emitting device 20 is not covered by the resin 30'. In this example, since the lower surface of the conductive film 27 is in contact with the sheet 100, it is not covered by the resin 30'. Moreover, after the resin 30' is cured, the sheet 100 is peeled off, thereby exposing the electrode surface of the light-emitting device 20. Therefore, there is no need to remove the fourth light-reflecting member 40 or the resin 30' covering the electrode surface of the light-emitting device 20, and the wiring 61 can be easily connected to the electrode surface.

[0101] By providing a conductive film 27 extending from the rear electrode 26 provided on the lower surface of the light emitting element 21 to the area outside the lower surface of the light emitting element 21, the connection between the electrode portion 25 of the light emitting device 20 and the wiring 61 becomes easy, and highly reliable wiring connection can be performed.

[0102] In particular, the light guide plate 10 formed with a plurality of through holes 15' is adhered to a structure in which a plurality of light emitting devices 20 are previously mounted on a wiring substrate, so that when the light emitting devices 20 are arranged in the through holes 15', high precision is required between the mounting positions of the plurality of light emitting devices 20 on the wiring substrate and the positions of the plurality of through holes 15' on the light guide plate 10.

[0103] In contrast, according to the embodiment, the light emitting device 20 is held by the light guide plate 10 instead of the wiring substrate and the light guide plate 10 and the light emitting device 20 are integrally formed, so that the light emitting device 20 can be arranged on the light guide plate 10 with high positional accuracy. The brightness unevenness within the light emitting surface of the light guide plate 10 is suppressed.

[0104] Furthermore, by attaching, for example, a flexible wiring board to the wiring 61, the entire module including the wiring board can be made thinner. Such a light emitting module is suitable for use as a direct backlight of a liquid crystal display, for example.

[0105] Fig. 9 It is a schematic cross-sectional view of a light emitting module according to another embodiment.

[0106] The fourth light-reflecting component 40 is not provided on the inclined surface 13 of the concave portion of the light guide plate 10, and the inclined surface 13 of the concave portion is in contact with the air layer 70 provided between the fourth light-reflecting component 40 and the inclined surface 13. The refractive index of the material of the light guide plate 10 is higher than the refractive index of air. The refractive index here indicates the refractive index relative to the light emitted by the light-emitting device 20. Therefore, the light guided in the light guide plate 10 can be totally reflected by the inclined surface 13 and directed toward the first surface 11, and the brightness of the light taken out from the first surface 11 can be improved.

[0107] In manufacturing Fig. 9 When the structure is Fig. 10A As shown in the figure, after the second surface 12 of the light guide plate 10 having the inclined surface 13 by processing or the like is attached to the sheet-like fourth light reflecting member 40, a through hole 15' is formed in the light guide plate 10 so as to penetrate the fourth light reflecting member 40. An air layer 70 is interposed between the inclined surface 13 and the fourth light reflecting member 40. As the sheet-like fourth light reflecting member 40, for example, a white resin containing a reflective member (or a light scattering member), a multilayer film of a resin or ceramic, a dielectric multilayer film, a metal, etc. can be used.

[0108] Moreover, if Fig. 10B As shown, the fourth light reflecting member 40 is attached to the sheet 100. Then, the light emitting device 20 is arranged in the through hole 15', and the same process as the above process is continued. Fig. 10A and Fig. 10B Similar to the schematic cross-sectional views of the other figures, a cross section through the center of the plurality of through holes 15 ′ is shown.

[0109] In addition, if Fig.11 As shown, a light-transmitting resin 71 may be provided on the inclined surface 13 of the light guide plate 10. The light-transmitting resin 71 is provided between the inclined surface 13 and the fourth light-reflecting member 40. The light-transmitting resin 71 is preferably made of a material having a smaller refractive index than that of the light guide plate.

[0110] In addition, the inclined surface 13 may not be formed on the light guide plate 10. Fig.12 As shown, the light guide plate 10 may also be in the shape of a flat plate.

[0111] In addition, the first surface 11 of the light guide plate 10 may be formed with concavo-convex portions for diffusing light or improving light extraction efficiency. Fig.13 2 shows an example in which a plurality of convex portions 16 are formed on the first surface 11 of the light guide plate 10. The plurality of convex portions 16 are formed, for example, in concentric circles around the through portion 15. Alternatively, the convex portions 16 may be dot-shaped.

[0112] For example, the height and width of the convex portion 16 on the outer peripheral side farther from the light emitting device 20 are larger than the height and width of the convex portion 16 on the inner peripheral side closer to the light emitting device 20. In addition, the density of the convex portions 16 on the outer peripheral side may be higher than the density of the convex portions 16 on the inner peripheral side. Not only the convex portions 16 but also the concave portions may be formed on the first surface 11.

[0113] In addition, the second surface 12 of the light guide plate 10 may also be formed with concavoconvex shapes. Fig.14 2 shows an example in which a plurality of recesses 17 are formed on the second surface 12 of the light guide plate 10. Not only recesses 17 but also projections may be formed on the second surface 12. The recessed and convex shapes are not limited to those having curved surfaces in cross-section, but may also be recessed and convex formed by continuous inclined surfaces.

[0114] like Fig.15 As shown, the wiring 61 may be formed on the side of the light emitting module, for example, the side of the fourth light reflecting member 40. When the side surfaces are arranged adjacent to each other, the plurality of light emitting modules may directly connect the wiring 61 formed on the side surfaces of the adjacent light emitting modules or connect them via a conductive material.

[0115] like Fig.16 As shown, a phosphor layer 122 may be provided on the second surface 12 of the light guide plate 10 around the light emitting device 20. The light guide plate 10 can diffuse the wavelength-converted light by the phosphor layer 122 in the plane direction, and the color unevenness within the plane of the light guide plate 10 can be suppressed.

[0116] like Fig.17 As shown, a reflective component 72 can be provided on the concave portion 31, for example, with a V-shaped cross section, on the upper surface of the translucent component 30. The reflective component 72 reflects a portion of the light emitted by the light-emitting device 20 and transmits the other portion. Thus, on the light-emitting surface of the light-emitting module, it is possible to prevent the area just above the light-emitting device 20 from becoming too bright compared to other areas. In addition, there is a translucent component 30 between the first reflective component 23 and the reflective component 72, so that it is possible to prevent the area just above the light-emitting device 20 from becoming darker than the surrounding area.

[0117] Fig.18 This is a schematic cross-sectional view of a light emitting module according to still another embodiment.

[0118] The fourth light reflecting member 140 is provided on the second surface 12 of the light guide plate 10 via the adhesive sheet 92. For example, acrylic resin can be used for the adhesive sheet 92. For example, polyethylene terephthalate, which is recognized as white by forming many bubbles, can be used for the fourth light reflecting member 140. The thickness of the fourth light reflecting member 140 is preferably not less than 35 μm and not more than 350 μm.

[0119] The lower surface of the light-reflecting member 140 is bonded to the wiring board 80 via an adhesive sheet 93. The adhesive sheet 93 contains, for example, an acrylic resin. The wiring board 80 includes an insulating base material 81, a wiring layer 82, and pads 83 connected to the wiring layer 82.

[0120] The light emitting device 20 includes a light emitting element 21 and a phosphor layer 22 covering the upper surface and side surfaces of the light emitting element 21. The light emitting device 20 is disposed in the through portion 15. In the through portion 15, a light transmissive member 30 is disposed on the light emitting device 20 and between the side surfaces of the light emitting device 20 and the side walls of the through portion 15.

[0121] A first light reflecting member 23 is provided between the upper surface of the light emitting device 20, i.e., the upper surface of the phosphor layer 22, and the light transmissive member 30. The first light reflecting member 23 is in contact with the upper surface of the light emitting device 20 (in this example, the upper surface of the phosphor layer 22) and directly covers the upper surface of the light emitting device 20.

[0122] A light-reflecting member 124 is provided on the lower surface of the light-emitting element 21 and the lower surface of the phosphor layer 22. A light-reflecting member 150 is provided on the surface of the wiring substrate 80 around the light-emitting device 20 in the through-hole 15. The light-reflecting member 124 and the light-reflecting member 150 are, for example, silicone resin or epoxy resin containing microparticles of TiO2, SiO2, Al2O3, ZnO, etc. as a reflector.

[0123] The electrode 26 of the light emitting element 21 is bonded to the pad 83 of the wiring substrate 80 via a bonding member (for example, solder) 91 .

[0124] As the light source of the light emitting module, only a light emitting element may be used instead of the light emitting device using a light-transmitting member such as the phosphor layer 22 as described above. Fig.19A As shown in FIG. 1 , as the light emitting device, a light emitting device including a light emitting element 21 and a first light reflecting member 23 can be used. In this case, the first light reflecting member 23 is disposed on the upper surface of the light emitting element 21.

[0125] like Fig.19B As shown, the light emitting device may also be a structure including a light emitting element 21, a light transmissive member 29 covering the upper surface and side surfaces of the light emitting element 21, and a light reflecting member 124 covering the lower surface of the light emitting element 21 and the lower surface of the light transmissive member 29. The light transmissive member 29 may be a phosphor layer containing a phosphor, or may be a layer not containing a phosphor. The first light reflecting member 23 is disposed on the upper surface of the light transmissive member 29.

[0126] like Fig.19CAs shown, as a light-emitting device, it can be a structure having a light-emitting element 21, a phosphor layer 22, a translucent component 129 that does not contain a phosphor, and a reflective component 24. The phosphor layer 22 covers the upper surface of the light-emitting element 21. The light-emitting element 21 is bonded to the phosphor layer 22 via an adhesive component 28. The reflective component 24 covers the side and lower surfaces of the light-emitting element 21 and the side surfaces of the phosphor layer 22. The translucent component 129 is arranged on the upper surface of the phosphor layer 22. The first reflective component 23 is arranged on the upper surface of the translucent component 129.

[0127] When the light emitting device does not include a phosphor, a phosphor sheet may be provided on the first surface 11 of the light guide plate 10 .

[0128] Fig. 20 The first surface 11 of the light guide plate 10 is formed into a quadrilateral shape with four corners, and the light emitting device 20 is also formed into a quadrilateral shape with four corners.

[0129] In a plan view, the quadrilateral light emitting device 20 is arranged to be rotated, for example, 45 degrees relative to the quadrilateral of the first main surface 11 of the light guide plate 10, and the diagonal connecting the corners of the first surface 11 intersects the side (or side) of the light emitting device 20. For example, when the light guide plate 10 is a square, the corners of the light emitting device 20 are not located on the diagonal connecting the corners of the first surface 11.

[0130] In a plan view, in a quadrilateral light emitting device 20 , the side surfaces have a larger area than the corners, and the brightness of light emitted from the side surfaces of the light emitting device 20 tends to be higher than the brightness of light emitted in a diagonal direction of the light emitting device 20 .

[0131] In addition, on the quadrilateral first surface 11 of the light guide plate 10, the distance between the central part of the light emitting device 20 and the corner of the first surface 11 is longer than the distance between the central part and the side of the first surface 11, and there is a tendency for light to be difficult to spread to the four corners of the first surface 11.

[0132] according to Fig. 20 In the embodiment shown, the light emitting device 20 is arranged relative to the light guide plate 10 so that the diagonal line connecting the corners of the first surface 11 intersects with the side (edge) of the light emitting device 20, and the side of the light emitting device 20 is opposite to the corner of the first surface 11, so that the light emitted from the light emitting device 20 can be easily extended to the four corners of the first surface 11 of the light guide plate 10. However, it is not limited to this, and the light emitting device 20 can also be arranged using a light guide plate 10 that is a quadrilateral when viewed from above and a light emitting device 20 that is a quadrilateral when viewed from above so that one side of the light guide plate 10 and one side of the light emitting device 20 are parallel.

[0133] Fig.21It is an exploded perspective view showing the structure of a liquid crystal display 1000 including a light emitting module 200 according to an embodiment.

[0134] The liquid crystal display 1000 includes a liquid crystal panel 120 , two lens sheets 110 a and 110 b , a diffusion sheet 110 c , and a light emitting module 200 in order from the upper side.

[0135] The light emitting module 200 has the above Figure 1 , Fig. 9 , Figures 11 to 20 Furthermore, the light emitting module 200 includes a plurality of through-holes 15 and a plurality of light emitting devices 20 disposed in the through-holes 15 .

[0136] The liquid crystal display 1000 is a so-called direct-type liquid crystal display in which a light-emitting module 200 serving as a backlight is stacked below (inside) a liquid crystal panel 120. The liquid crystal display 1000 irradiates the liquid crystal panel 120 with light irradiated from the light-emitting module 200. The diffusion sheet 110c is overlapped on the light-emitting surface of the light guide plate 10, that is, the first surface 11, and can suppress uneven brightness within the light-emitting surface. In addition to the above-mentioned components, the liquid crystal display 1000 may also include components such as a polarizing film or a color filter.

[0137] As mentioned above, the embodiments of the present invention have been described with reference to specific examples. However, the present invention is not limited to these specific examples. Based on the above-mentioned embodiments of the present invention, as long as the gist of the present invention is included, all the modes that can be appropriately designed and changed by those skilled in the art also fall within the scope of the present invention. In addition, it should be understood that within the scope of the idea of ​​the present invention, those skilled in the art can think of various variations and modifications, and these variations and modifications also fall within the scope of the present invention.

Claims

1. A light emitting module, wherein: have: A light guide plate having a first surface, a second surface opposite to the first surface, and a through portion penetrating the first surface and the second surface; a light emitting device disposed on the second surface side of the through portion; a light-transmitting member disposed on the first surface side of the through portion and on the light-emitting device and between the light-emitting device and the side wall of the through portion; a first light-reflecting component, which is disposed between the upper surface of the light-emitting device and the light-transmitting component and is in contact with the upper surface of the light-emitting device; A recess is provided on the upper surface of the light-transmitting member.

2. A light emitting module, wherein: have: A light guide plate having a first surface, a second surface opposite to the first surface, and a through portion penetrating the first surface and the second surface; a light emitting device, which is disposed on the second surface side of the through portion and has a first light reflecting component on the upper surface; a light-transmitting member disposed on the first surface side of the through-portion and on the light-emitting device and between the light-emitting device and the side wall of the through-portion, A recess is provided on the upper surface of the light-transmitting member.

3. The light emitting module according to claim 1 or 2, wherein: The light emitting device comprises: Light emitting element; A phosphor layer disposed on the light-emitting element; The second light reflecting component is arranged on the side of the light emitting element.

4. The light emitting module according to claim 1 or 2, wherein: The light emitting device comprises: Light emitting element; The phosphor layer covers the upper surface and side surfaces of the light emitting element.

5. The light emitting module according to claim 1 or 2, wherein: A third light reflecting member is further provided on the second surface side of the light guide plate and around the light emitting device disposed in the through portion.

6. The light emitting module according to claim 1 or 2, wherein: A fourth light reflecting member is further provided, which is disposed on the second surface.

7. The light emitting module according to claim 1 or 2, wherein: The light guide plate is in a flat plate shape.

8. The light emitting module according to claim 1 or 2, wherein: The light guide plate has an inclined surface which forms an obtuse angle with the second surface.

9. The light emitting module according to claim 8, wherein: A fourth light reflecting member is further provided, which is provided on the second surface and the inclined surface.

10. The light emitting module according to claim 8, wherein: The inclined surface is in contact with air.

11. The light emitting module according to claim 1 or 2, wherein: The light emitting device and the light-transmitting member are respectively arranged in the plurality of penetration portions provided in the light guide plate.

12. The light emitting module according to claim 6, wherein: The fourth light-reflecting member is a resin having bubbles and appearing white.

13. The light emitting module according to claim 12, wherein: The fourth light reflecting member is polyethylene terephthalate containing bubbles.

14. The light emitting module according to claim 12, wherein: The fourth light reflecting member has a thickness of not less than 35 μm and not more than 350 μm.

15. The light emitting module according to claim 9, wherein: The fourth light-reflecting member is a resin having bubbles and appearing white.

16. The light emitting module according to claim 15, wherein: The fourth light reflecting member is polyethylene terephthalate containing bubbles.

17. The light emitting module according to claim 15, wherein: The fourth light reflecting member has a thickness of not less than 35 μm and not more than 350 μm.

18. The light emitting module according to claim 1 or 2, wherein: A light-reflecting component is provided on the light-transmitting component.

19. A method for manufacturing a light emitting module, comprising the following steps: A light-reflecting member is formed on the second surface of a light guide plate having a first surface and a second surface opposite to the first surface, and a through hole is formed in the light guide plate so as to penetrate between the first surface and the second surface in a manner that also penetrates the light-reflecting member; Adhere the second surface of the light guide plate to a sheet material, so that the second surface of the through hole is blocked by the sheet material; Arrange a light emitting device having an electrode portion in the through hole, and adhere the electrode portion to the sheet on the second surface side that blocks the through hole; forming a light-transmitting component on the light-emitting device in the through hole and between the light-emitting device and the side wall of the through hole, and fixing the light-emitting device to the light guide plate through the light-transmitting component; The light guide plate to which the light emitting device is fixed is separated from the sheet material so that the electrode portion of the light emitting device is exposed on the second surface side.

20. A method for manufacturing a light emitting module, comprising the following steps: preparing a light guide plate having a first surface and a second surface opposite to the first surface and having a through hole penetrating between the first surface and the second surface; Adhere the second surface of the light guide plate to a sheet material, so that the second surface of the through hole is blocked by the sheet material; Arrange a light emitting device having an electrode portion in the through hole, and adhere the electrode portion to the sheet on the second surface side that blocks the through hole; forming a light-transmitting component on the light-emitting device in the through hole and between the light-emitting device and the side wall of the through hole, and fixing the light-emitting device to the light guide plate through the light-transmitting component; The light guide plate to which the light emitting device is fixed is separated from the sheet material so that the electrode portion of the light emitting device is exposed on the second surface side.

21. The method for manufacturing a light emitting module according to claim 19 or 20, wherein: The step of forming the light-transmitting member includes: supplying a liquid resin containing a reflective member to the through hole; A step of sinking the reflective member onto the upper surface of the light emitting device and the sheet material on the second surface side of the through hole; After the reflective member is allowed to settle, the resin is cured.

22. The method for manufacturing a light emitting module according to claim 19 or 20, wherein: The method further includes forming a recessed portion on the upper surface of the light-transmitting member.

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