A hemispherical resonator flow channel constraint-shear rheological polishing method and device

Abstract

A hemispherical resonator flow channel constraint-shear rheological polishing method comprises the following steps: (1) preparing a non-Newtonian fluid polishing liquid with a shear rheological effect and adding it to a polishing liquid station; (2) transferring the hemispherical resonator to the workpiece spindle of the polishing machine through a fixture, adjusting the hemispherical resonator rotation axis to be coaxial with the workpiece spindle rotation axis; (3) adjusting the polishing head spherical surface to be concentric with the hemispherical resonator spherical surface, and starting the polishing liquid circulation system; (4) starting the workpiece spindle, making the polishing head rotate relative to the hemispherical resonator, and the polishing liquid forms two shear rheological flow fields in the constraint flow channel and the polishing head-resonator surface gap, and controlling the polishing liquid flow rate and the workpiece spindle speed to achieve efficient polishing of the hemispherical resonator. And a hemispherical resonator flow channel constraint-shear rheological polishing device is provided. The present invention can efficiently remove the grinding surface damage layer while maintaining the grinding surface shape accuracy of the hemispherical resonator, thereby achieving efficient and high-quality polishing.

Description

Technical Field

[0001] The invention belongs to precision and ultra-precision machining technology, in particular to a hemispherical resonator shear rheological polishing method and device. Background Art

[0002] The hemispherical resonator is the core component of the hemispherical resonator gyroscope, and its processing quality directly restricts the performance of the gyroscope device and system. The hemispherical resonator is a special-shaped part, made of hard and brittle materials such as high-purity fused quartz and sapphire. The main structure is a hemispherical shell with a central support rod (anchor), which is small in size and thin in wall. The main technical indicators of its processing include sphericity, coaxiality, surface quality, uniformity of circumferential distribution of thickness, etc. At present, hemispherical resonators are mostly prepared by milling, fine grinding and polishing: milling to obtain the blank, fine grinding to further improve the surface quality and control the precision indicators such as sphericity and coaxiality of the hemispherical resonator, and finally polishing to obtain a hemispherical resonator with high geometric accuracy and high surface quality.

[0003] At present, the polishing of hemispherical resonators mainly adopts magnetorheological technology, ion beam technology and chemical mechanical polishing technology. Magnetorheological polishing technology can effectively reduce the surface roughness of hemispherical resonators, reduce the damaged layer of the machined surface, and improve the surface shape accuracy. However, the miniaturized design of the polishing wheel is difficult to match the workpiece, resulting in the problem of polishing "dead angle" at the root of the hemispherical resonator anchor; when using a ball-head permanent magnet polishing tool, the magnetic induction intensity and linear speed at different positions are different, making the material removal function difficult to control. Ion beam polishing technology can achieve atomic-level material removal on the surface of the hemispherical resonator without subsurface damage, but the polishing efficiency is low and the cost is high. Traditional chemical mechanical polishing can effectively improve the material removal rate of the hemispherical resonator, but due to the interference of the center anchor of the resonator spherical surface, it is still very difficult to ensure uniform axial and radial material removal. The above polishing method adapts to the change of the curvature of the workpiece surface through a smaller polishing tool, obtains high surface shape accuracy through the optimization of the dwell function, and has low polishing efficiency. In short, the current domestic hemispherical resonator polishing technology is still immature, and there are problems such as low precision, poor surface quality and low efficiency. Summary of the invention

[0004] In order to overcome the shortcomings of low precision, poor surface quality and low efficiency of the existing hemispherical resonator polishing method, the present invention provides a hemispherical resonator flow channel constraint-shear rheological polishing method and device with higher precision, higher surface quality and higher efficiency.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A hemispherical resonator flow channel constraint-shear rheological polishing method comprises the following steps:

[0007] (1) preparing a non-Newtonian fluid polishing liquid with shear rheological effect and adding it to a polishing liquid station;

[0008] (2) The hemispherical resonator is transferred to the workpiece spindle of the polishing machine through a fixture, and the rotation axis of the hemispherical resonator is adjusted to be coaxial with the rotation axis of the workpiece spindle;

[0009] (3) Adjust the spherical surface of the polishing head to be concentric with the spherical surface of the hemispherical resonator, start the polishing liquid circulation system, and allow the polishing liquid to enter the polishing head constraint flow channel and the gap between the polishing head and the resonator surface;

[0010] (4) Start the workpiece spindle and make the polishing head rotate relative to the hemispherical resonator. The polishing liquid forms two shear rheological flow fields in the constraint flow channel and the gap between the polishing head and the resonator surface. The polishing liquid flow rate and the workpiece spindle speed are controlled by computer to achieve efficient polishing of the hemispherical resonator.

[0011] Furthermore, in step (1), the non-Newtonian fluid polishing liquid is a uniform mixture of a non-Newtonian fluid base liquid, an abrasive and an additive, wherein the non-Newtonian fluid base liquid is a non-Newtonian fluid composed of a polyhydroxy polymer and water, and the abrasive is a mixture of one or at least two of the following: aluminum oxide, diamond, silicon carbide, silicon oxide, cerium oxide, boron carbide, zirconium oxide; and the additive is a mixture of one or at least two of the following: a dispersant, a preservative, a surfactant, a pH regulator, and a chemical active agent.

[0012] Furthermore, in the step (2), the hemispherical resonator and the fixture are connected by bonding, vacuum adsorption or self-centering chuck clamping, the hemispherical resonator and the fixture, the fixture and the main shaft are connected by positioning surfaces respectively, and radial runout is eliminated to ensure that the coaxiality error between the main shaft rotation axis and the hemispherical resonator rotation axis is less than 50μm.

[0013] Furthermore, in the step (3), the polishing head is hemispherical when polishing the inner surface of the hemispherical resonator, and its radius is 0.5-3mm smaller than the spherical surface of the resonator; when polishing the outer surface, the polishing head is a concave spherical surface, and its radius is 0.5-3mm larger than the spherical surface of the resonator; the central opening of the polishing head is connected to the outlet of the polishing liquid circulation pump, and the hole radius is 2-5mm larger than the radius of the hemispherical resonator anchor; the spherical surface of the polishing head is provided with a polishing liquid flow channel constraint groove, the flow channel constraint groove is straight, oblique or spiral, the cross-sectional shape is rectangular or trapezoidal, and the number of flow channels is 1-8.

[0014] In the step (4), the linear velocity of the polishing liquid in the flow channel constraint flow field relative to the surface of the resonator is the combined velocity of the flow velocity along the flow channel and the linear velocity of the resonator rotation, and the flow velocity of the polishing liquid in the polishing head-resonator gap flow field relative to the surface of the resonator is equal to the linear velocity of the resonator rotation; during the polishing process, the polishing liquid undergoes rheological effects under the shearing action of the relative motion between the polishing head and the hemispherical resonator, including shear thickening, shear solidification or shear expansion.

[0015] Furthermore, the channel constraint-shear rheological polishing method optimizes the flow field velocity and rheological characteristics of the polishing liquid at each point on the inner surface of the hemispherical resonator by adjusting the workpiece rotation speed, polishing liquid flow rate and channel structure, thereby achieving complex polishing trajectory and uniform material removal.

[0016] A hemispherical resonator flow channel constraint-shear rheological polishing device comprises a polishing liquid station, a polishing liquid circulation pump, a workpiece spindle, a tool system and a control system. The polishing liquid station realizes polishing liquid storage, cooling and filtration. The inlet of the polishing liquid circulation pump is connected to the polishing liquid station, and the outlet is connected to the center hole of the polishing head. The workpiece spindle is connected to the hemispherical resonator fixture through a flange or a standard tool handle joint to drive the workpiece to rotate. The tool system comprises a tool clamping mechanism and a motion mechanism. The control system can control the movement of the spherical polishing head, the workpiece spindle speed and the polishing liquid circulation pump flow rate.

[0017] Furthermore, the polishing head is clamped by flange connection, threaded connection or self-centering chuck clamping, and the polishing head can achieve three-degree-of-freedom movement in the horizontal plane and vertical direction.

[0018] Furthermore, during the polishing process, the hemispherical resonator rotates, the spherical polishing head is fixed, and the polishing head and the surface of the resonator form a constrained flow channel.

[0019] The hemispherical resonator is located directly above or directly below the spherical polishing head.

[0020] The technical concept of the present invention is as follows: in view of the requirements of precision, surface quality and efficiency of the hemispherical resonator during the polishing process, the present invention proposes to use the flow channel to constrain the flow field distribution of the shear rheological polishing liquid of the non-Newtonian fluid, and cooperate with the workpiece speed control to achieve efficient and flexible polishing of the resonator, uniform material removal and thickness (mass) distribution uniformity correction. The core of the present invention is to use shear rheological polishing instead of traditional small tool head polishing to increase the polishing contact area and improve the polishing material removal efficiency of the hemispherical resonator; based on the non-contact characteristics of shear rheological polishing, flexible removal of brittle materials is achieved, and the polishing surface quality of the hemispherical resonator is improved; through the optimization of the flow channel structure, the flow field of the shear rheological polishing liquid on the surface of the hemispherical resonator is regulated to achieve circumferential uniform removal of the material on the surface of the hemispherical resonator; through the design of the flow channel distribution in conjunction with the workpiece speed control, the thickness (mass) distribution uniformity correction of the hemispherical resonator is achieved to improve the polishing precision.

[0021] The beneficial effects of the present invention are mainly manifested in:

[0022] 1) The hemispherical resonator flow channel constraint-shear rheological polishing method and device described in the present invention have high polishing efficiency. The polishing liquid forms two shear rheological flow fields in the constraint flow channel and the gap between the polishing head and the resonator surface. The rheological effect occurs during the shear movement relative to the hemispherical resonator surface, forming a fully flexible polishing mold with good fit to the entire surface, increasing the material removal area and improving the polishing efficiency. The experimental results show that the high-purity fused silica glass quartz resonator is polished with 3000# diamond and alumina mixed abrasive for 10 hours, and the surface roughness R a It can be reduced from hundreds of nanometers to less than ten nanometers.

[0023] 2) The hemispherical resonator flow channel constraint-shear rheological polishing method and device described in the present invention have good polishing surface quality. The non-Newtonian fluid shear rheological polishing liquid produces a rheological effect during the relative shear motion with the hemispherical resonator surface, and the free abrasive is flexibly held to achieve surface polishing, which can effectively avoid large particle scratches. In addition, material removal is mainly based on abrasive-surface shear action, and the normal force is small, which can achieve nearly damage-free material removal.

[0024] 3) The flow channel constraint-shear rheological polishing method and device of a hemispherical resonator described in the present invention can ensure the surface accuracy and rotational symmetry of the resonator. Based on the processing principle described in the invention, the rotational symmetry of the resonator will not be destroyed in theory. By optimizing the flow channel structure and regulating the flow field of the shear rheological polishing liquid on the surface of the hemispherical resonator, uniform circumferential removal of the material on the surface of the hemispherical resonator can be achieved; by combining the flow channel distribution design with the workpiece speed control, the uniformity of the thickness (mass) distribution of the hemispherical resonator can be corrected to improve the polishing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of a hemispherical resonator flow channel constraint-shear rheological polishing method and device;

[0026] Figure 2 This is a schematic diagram of the flow field distribution of the polishing liquid on the surface of the hemispherical resonator during the flow channel constraint-shear rheological polishing process on the inner surface of the hemispherical resonator;

[0027] Figure 3 Schematic diagram of the flow channel constraint polishing head on the inner surface of the hemispherical resonator, where (1) is a straight line, (2) is an oblique line, and (3) is a spiral;

[0028] Figure 4 Schematic diagram of the flow channel constraint polishing head on the outer surface of the hemispherical resonator, where (1) is a straight line, (2) is an oblique line, and (3) is a spiral;

[0029] Figure 5 Schematic diagram of the cross-sectional shape of the polishing liquid flow channel on the polishing head surface, where (1) is a rectangle and (2) is a trapezoid;

[0030] Figure 6 Schematic diagram of flange-adapted hemispherical resonator fixture, where (1) is the inner surface polishing fixture and (2) is the outer surface polishing fixture.

[0031] Description of Reference Numerals

[0032] 1-workpiece spindle, 2-hemispherical resonator fixture, 3-hemispherical resonator, 4-constrained flow channel, 5-polishing head, 6-hemispherical resonator center support rod (anchor), 7-shear rheological polishing liquid, 8-polishing liquid circulation pipeline, 9-polishing liquid station, 10-control system, 11-polishing liquid circulation pump, 12-flow channel constraint flow field, 13-polishing head-resonator gap flow field, 14-polishing head center hole. DETAILED DESCRIPTION

[0033] The present invention will be further described below in conjunction with the accompanying drawings.

[0034] Example 1

[0035] Reference Figure 1 to Figure 6 , a hemispherical resonator flow channel constraint-shear rheological polishing method, comprising the following steps:

[0036] (1) preparing a non-Newtonian fluid polishing liquid 7 with shear rheological effect, wherein the non-Newtonian fluid base liquid is a non-Newtonian fluid composed of a polyhydroxy polymer and water, the abrasive is a 3000# diamond and alumina mixed abrasive, the concentrations of which are 5% and 12%, respectively, and the additives are guar gum and potassium sorbate, and the prepared polishing liquid is added to the polishing liquid station 9;

[0037] (2) Using the annular plane at the edge of the hemispherical resonator thin wall as the positioning surface, glue the hemispherical resonator 3 to Figure 6 On the fixture 2 shown, the fixture flange transfer surface is required to be perpendicular to the fixture axis. The fixture 2 is transferred to the polishing machine workpiece spindle 1 through the flange. The end face of the polishing machine workpiece spindle is perpendicular to the spindle axis. The axial circular runout error of the hemispherical resonator is manually eliminated to ensure that the rotation axis of the hemispherical resonator 3 is coaxial with the rotation axis of the workpiece spindle 1.

[0038] (3) When polishing the inner surface of the hemispherical resonator 3, the polishing head 5 is selected Figure 3 (1) shows a linear constrained flow channel hemispherical polishing head, the radius of the polishing head 5 is 2 mm smaller than the spherical surface of the resonator 3, the radius of the polishing head center hole 14 is 3 mm larger than the radius of the hemispherical resonator anchor 6, the cross-sectional shape of the constrained flow channel 4 is rectangular, and the number is 4 evenly distributed; when polishing the outer surface of the hemispherical resonator 3, the polishing head 5 is selected Figure 4(1) As shown in the figure, the polishing head 5 has a radius 2 mm larger than the spherical surface of the resonator 3, the radius of the polishing head center hole 14 is 3 mm larger than the radius of the hemispherical resonator anchor 6, the cross-sectional shape of the constrained flow channel 4 is rectangular, and the number is 4 evenly distributed; the polishing liquid circulation system is started to allow the polishing liquid 7 to enter the polishing head constraint flow channel and the gap between the polishing head and the resonator surface;

[0039] (4) Start the workpiece spindle 1 and set the speed to 120 rpm, so that the polishing head 5 rotates relative to the hemispherical resonator 3, and the polishing liquid 7 forms two shear rheological flow fields in the constraint flow channel and the gap between the polishing head and the resonator surface; Figure 3 As shown, the linear velocity of the polishing liquid 7 in the flow channel constraint flow field 12 relative to the surface of the resonator 3 is the combined velocity of the flow velocity along the flow channel and the linear velocity of the resonator rotation, and the flow velocity of the polishing liquid 7 in the polishing head-resonator gap flow field 13 relative to the surface of the resonator 3 is equal to the linear velocity of the resonator rotation; the polishing liquid 7 undergoes a rheological effect under the shearing action of the relative motion of the polishing head 5 and the hemispherical resonator 3, specifically shear thickening; the flow velocity of the polishing liquid 7 and the rotation speed of the workpiece spindle 1 are controlled by a computer, and the shear rheological polishing liquid flow field on the surface of the hemispherical resonator 3 is regulated in combination with the optimization of the flow channel structure to achieve uniform circumferential removal of the material on the surface of the hemispherical resonator 3, and the uniformity of the thickness (mass) distribution of the hemispherical resonator 3 is corrected through the flow channel distribution design in combination with the workpiece rotation speed control, thereby improving the polishing accuracy.

[0040] Effects of this implementation method:

[0041] After the inner surface was polished for 5 hours, the surface roughness was measured and its roughness decreased significantly. The roughness R of the root and edge was a The values ​​are shown in Table 1. Table 1 Roughness comparison of the inner surface of the hemispherical resonator after polishing for 5 hours.

[0042]

[0043] Table 1

[0044] After the outer surface was polished for 5 hours, the surface roughness was measured and its roughness decreased significantly. The roughness R of the root and edge was a The values ​​are shown in Table 2 below. Table 2 Comparison of the roughness of the outer surface of the hemispherical resonator before and after polishing for 5 hours.

[0045]

[0046] Table 2

[0047] From the surface comparison of the inner and outer surfaces of the hemispherical resonator before and after polishing, it can be clearly seen that the surface roughness is significantly reduced after only 5 hours of polishing. a All are less than 10nm, meeting the requirements of high-efficiency and high-quality processing.

[0048] Example 2: This embodiment differs from Example 1 in that the abrasive in the shear rheological polishing liquid 7 in step (1) is one or a mixture of at least two of aluminum oxide, diamond, silicon carbide, silicon oxide, cerium oxide, boron carbide, and zirconium oxide, and the additive includes one or a mixture of at least two of a dispersant, a surfactant, a pH regulator, and a chemical active agent. The other steps and parameters are the same as those in Example 1.

[0049] Embodiment 3: This embodiment differs from Embodiment 1 or 2 in that the connection between the hemispherical resonator 3 and the fixture 2 in step (2) is by vacuum adsorption or self-centering chuck clamping. The other steps and parameters are the same as those in Embodiment 1 or 2.

[0050] Embodiment 4: This embodiment differs from Embodiments 1, 2 or 3 in that: in step (3), when the inner surface of the hemispherical resonator 3 is polished, the radius of the hemispherical polishing head 5 is 0.5-3 mm smaller than the spherical surface of the resonator, and when the outer surface is polished, the radius of the concave spherical surface of the polishing head 5 is 0.5-3 mm larger than the spherical surface of the resonator, and the radius of the central hole 14 of the polishing head is 2-5 mm larger than the radius of the hemispherical resonator anchor. The other steps and parameters are the same as those of Embodiments 1, 2 or 3.

[0051] Embodiment 5: This embodiment differs from Embodiments 1, 2, 3, and 4 in that the polishing head 5 has a linear, oblique, or spiral flow channel constraint groove ( Figure 3 , Figure 4 ), the cross-sectional shape is rectangular or trapezoidal ( Figure 5 ), the number of flow channels is 1-8. Other steps and parameters are the same as those of embodiments 1, 2, 3, and 4.

[0052] Embodiment 6: This embodiment differs from Embodiments 1, 2, 3, 4, and 5 in that the polishing liquid 7 undergoes rheological effects under the shearing action of the relative motion between the polishing head 5 and the hemispherical resonator 3, including shear thickening, shear solidification, or shear expansion. The other steps and parameters are the same as those of Embodiments 1, 2, 3, 4, and 5.

[0053] Embodiment 7: This embodiment differs from Embodiments 1, 2, 3, 4, 5, and 6 in that the rotation speed of the tool spindle 1 is set to 30-500 rpm. Other steps and parameters are the same as those of Embodiments 1, 2, 3, 4, 5, and 6.

[0054] Example 8

[0055] Reference Figure 1 to Figure 6A hemispherical resonator flow channel constraint-shear rheological polishing device includes a polishing liquid station 9, a polishing liquid circulation pump 11, a workpiece spindle 1, a tool system and a control system 10. The polishing liquid station 9 realizes polishing liquid storage, cooling and filtration. The inlet of the polishing liquid circulation pump 11 is connected to the polishing liquid station 9, and the outlet is connected to the center hole 14 of the polishing head. The workpiece spindle 1 is connected to the hemispherical resonator fixture 2 through a flange or a standard tool handle interface to drive the workpiece to rotate. The tool system includes a tool holding mechanism and a motion mechanism. The control system 10 can control the movement of the spherical polishing head, the workpiece spindle speed and the polishing liquid circulation pump flow rate.

[0056] Furthermore, the polishing head 5 is clamped by flange connection, threaded connection or self-centering chuck clamping, and the polishing head 5 can move in the vertical direction.

[0057] Furthermore, during the polishing process, the hemispherical resonator 3 rotates, the spherical polishing head 5 is fixed, and the polishing head 5 and the surface of the resonator 3 form a constrained flow channel; the hemispherical resonator 3 is directly above or below the spherical polishing head 5 .

Claims

1. A hemispherical resonator flow channel constraint-shear rheological polishing method, characterized in that: The method comprises the following steps: (1) preparing a non-Newtonian fluid polishing liquid with shear rheological effect and adding it to a polishing liquid station; (2) The hemispherical resonator is transferred to the workpiece spindle of the polishing machine through a fixture, and the rotation axis of the hemispherical resonator is adjusted to be coaxial with the rotation axis of the workpiece spindle; (3) Adjust the spherical surface of the polishing head to be concentric with the spherical surface of the hemispherical resonator, start the polishing liquid circulation system, and allow the polishing liquid to enter the polishing head constraint flow channel and the gap between the polishing head and the resonator surface; (4) Start the workpiece spindle and make the polishing head rotate relative to the hemispherical resonator. The polishing liquid forms two shear rheological flow fields in the constraint flow channel and the gap between the polishing head and the resonator surface. The polishing liquid flow rate and the workpiece spindle speed are controlled by computer to achieve efficient polishing of the hemispherical resonator.

2. A hemispherical resonator flow channel constraint-shear rheological polishing method as claimed in claim 1, characterized in that: In the step (1), the non-Newtonian fluid polishing liquid is a uniform mixture of a non-Newtonian fluid base liquid, an abrasive and an additive, wherein the non-Newtonian fluid base liquid is a non-Newtonian fluid composed of a polyhydroxy polymer and water, the abrasive is a mixture of one or at least two of the following: aluminum oxide, diamond, silicon carbide, silicon oxide, cerium oxide, boron carbide, zirconium oxide; and the additive is a mixture of one or at least two of the following: a dispersant, a preservative, a surfactant, a pH regulator, and a chemical active agent.

3. A hemispherical resonator flow channel constraint-shear rheological polishing method as claimed in claim 1 or 2, characterized in that: In the step (2), the hemispherical resonator is connected to the fixture by bonding, vacuum adsorption or self-centering chuck clamping. The hemispherical resonator and the fixture, and the fixture and the main shaft are connected respectively through positioning surfaces, and radial runout is eliminated to ensure that the coaxiality error between the main shaft rotation axis and the hemispherical resonator rotation axis is less than 50μm.

4. A hemispherical resonator flow channel constraint-shear rheological polishing method as claimed in claim 1 or 2, characterized in that: In the step (3), the polishing head is hemispherical when polishing the inner surface of the hemispherical resonator, and its radius is 0.5-3mm smaller than the spherical surface of the resonator; when polishing the outer surface, the polishing head is a concave spherical surface, and its radius is 0.5-3mm larger than the spherical surface of the resonator; the central opening of the polishing head is connected to the outlet of the polishing liquid circulation pump, and the hole radius is 2-5mm larger than the radius of the hemispherical resonator anchor; the spherical surface of the polishing head is provided with a polishing liquid flow channel constraint groove, the flow channel constraint groove is straight, oblique or spiral, the cross-sectional shape is rectangular or trapezoidal, and the number of flow channels is 1-8.

5. A hemispherical resonator flow channel constraint-shear rheological polishing method as claimed in claim 1 or 2, characterized in that: In the step (4), the linear velocity of the polishing liquid in the flow channel constraint flow field relative to the surface of the resonator is the combined velocity of the flow velocity along the flow channel and the linear velocity of the resonator rotation, and the flow velocity of the polishing liquid in the polishing head-resonator gap flow field relative to the surface of the resonator is equal to the linear velocity of the resonator rotation; during the polishing process, the polishing liquid undergoes rheological effects under the shearing action of the relative motion between the polishing head and the hemispherical resonator, including shear thickening, shear solidification or shear expansion.

6. A hemispherical resonator flow channel constraint-shear rheological polishing method as claimed in claim 1 or 2, characterized in that: The flow channel constraint-shear rheological polishing method optimizes the flow field velocity and rheological characteristics of the polishing liquid at each point on the inner surface of the hemispherical resonator by adjusting the workpiece rotation speed, polishing liquid flow rate and flow channel structure, thereby achieving complex polishing tracks and uniform material removal.

7. A device for implementing the hemispherical resonator flow channel constraint-shear rheological polishing method as claimed in claim 1, characterized in that: The device includes a polishing liquid station, a polishing liquid circulation pump, a workpiece spindle, a tool system and a control system. The polishing liquid station realizes polishing liquid storage, cooling and filtration. The inlet of the polishing liquid circulation pump is connected to the polishing liquid station, and the outlet is connected to the center hole of the polishing head. The workpiece spindle is connected to the hemispherical resonator clamp through a flange or a standard tool handle joint to drive the workpiece to rotate. The tool system includes a tool clamping mechanism and a motion mechanism. The control system can control the movement of the spherical polishing head, the speed of the workpiece spindle and the flow rate of the polishing liquid circulation pump.

8. The device according to claim 7, characterized in that The polishing head is clamped by flange connection, threaded connection or self-centering chuck clamping, and the polishing head can realize three-degree-of-freedom movement in the horizontal plane and vertical direction.

9. The device according to claim 7 or 8, characterized in that During the polishing process, the hemispherical resonator rotates, the spherical polishing head is fixed, and a constrained flow channel is formed between the polishing head and the surface of the resonator.

10. The device according to claim 9, characterized in that The hemispherical resonator is located directly above or directly below the spherical polishing head.

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