Cooling device, battery pack and vehicle

Abstract

A cooling device, a battery pack and a vehicle, relating to the technical field of battery cooling; the cooling device, the battery pack and the vehicle include a first sealing plate, a second sealing plate and a flow channel plate; the flow channel plate includes a corresponding first flow channel surface and a second flow channel surface; the first flow channel surface has a first flow channel groove, and the second flow channel surface has a second flow channel groove; the flow channel plate is arranged between the first sealing plate and the second sealing plate, and the first sealing plate and the first flow channel groove form a first flow channel, and the second sealing plate and the second flow channel groove form a second flow channel; the flow channel plate is provided with a flow channel through hole communicating the first flow channel and the second flow channel; the first sealing plate is provided with a first interface communicating the first flow channel, and the second sealing plate is provided with a second interface communicating the second flow channel. The purpose of the present invention is to provide a cooling device, a battery pack and a vehicle to solve to a certain extent the technical problems of poor heat exchange efficiency, uneven heat distribution and local high temperature phenomena existing in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of battery cooling, and in particular, to a cooling device, a battery pack, and a vehicle. Background Art

[0002] When the battery of an electric vehicle is charged and discharged, heat is generated. If the battery temperature is too high, it will lead to a reduction in battery life and performance, and also pose a great safety hazard. Therefore, it is necessary to cool the battery. Currently, for the cooling device used to cool the battery, its heat exchange efficiency is poor, the heat distribution is uneven, and local high-temperature phenomena occur. Summary of the Invention

[0003] The purpose of the present invention is to provide a cooling device, a battery pack, and a vehicle, so as to solve to a certain extent the technical problems of poor heat exchange efficiency, uneven heat distribution, and local high-temperature phenomena existing in the prior art.

[0004] To achieve the above purpose, the present invention provides the following technical solutions:

[0005] A cooling device includes a first sealing plate, a second sealing plate, and a flow channel plate;

[0006] The flow channel plate includes a corresponding first flow channel surface and a second flow channel surface; the first flow channel surface has a first flow channel groove, and the second flow channel surface has a second flow channel groove;

[0007] The flow channel plate is disposed between the first sealing plate and the second sealing plate, and the first sealing plate and the first flow channel groove form a first flow channel, and the second sealing plate and the second flow channel groove form a second flow channel;

[0008] The flow channel plate is provided with a flow channel through hole communicating the first flow channel and the second flow channel;

[0009] The first sealing plate is provided with a first interface communicating the first flow channel, and the second sealing plate is provided with a second interface communicating the second flow channel.

[0010] In any of the above technical solutions, optionally, the flow rate of the cooling medium in the second flow channel is higher than the flow rate of the cooling medium in the first flow channel.

[0011] In any of the above technical solutions, optionally, the first interface is a liquid inlet, and the second interface is a liquid outlet;

[0012] The number of the first flow channels is greater than the number of the second flow channels.

[0013] In any of the above technical solutions, optionally, the number of the first flow channels is two, and the number of the second flow channels is one;

[0014] The two first flow channels are parallel to each other;

[0015] In the projection on the first flow channel surface, the second flow channel is located between the two first flow channels.

[0016] In any of the above technical solutions, optionally, both the first interface and the second interface are provided at one end of the cooling device, and the flow channel through hole is provided at the other end of the cooling device;

[0017] And / or, one end of the first flow channel communicates with the first interface, and the other end communicates with the flow channel through hole; one end of the second flow channel communicates with the second interface, and the other end communicates with the flow channel through hole.

[0018] In any of the above technical solutions, optionally, the projection of the second flow channel on the first flow channel surface does not coincide with the first flow channel.

[0019] In any of the above technical solutions, optionally, the first flow channel is in a "Ji" shape, and the second flow channel is in a "Ji" shape;

[0020] And / or, the first sealing plate is a flat plate, and the second sealing plate is a flat plate.

[0021] In any of the above technical solutions, optionally, the first sealing plate is provided with mounting holes, and / or the second sealing plate is provided with mounting holes;

[0022] The first interface is connected with a first connecting pipe, and the second interface is connected with a second connecting pipe;

[0023] The materials of the first sealing plate and the second sealing plate are respectively aluminum, aluminum alloy, copper or stainless steel, and the material of the flow channel plate is aluminum, aluminum alloy, copper or stainless steel;

[0024] The flow channel plate is formed by pressing a plate, and forms the first flow channel groove and the second flow channel groove;

[0025] The first sealing plate, the flow channel plate and the second sealing plate are welded to form the cooling device.

[0026] A battery pack includes a cooling device.

[0027] A vehicle includes a cooling device.

[0028] The beneficial effects of the present invention mainly lie in:

[0029] The cooling device, battery pack and vehicle provided by the present invention include a first sealing plate, a second sealing plate and a flow channel plate. The flow channel plate is arranged between the first sealing plate and the second sealing plate. The first sealing plate and the first flow channel groove form a first flow channel, the second sealing plate and the second flow channel groove form a second flow channel, and there are a flow channel through hole connecting the first flow channel and the second flow channel, a first interface connecting the first flow channel, and a second interface connecting the second flow channel. That is, the first interface, the first flow channel, the flow channel through hole, the second flow channel and the second interface are connected in sequence. This cooling device adopts a three-layer plate-type cooling plate, which effectively improves the heat exchange efficiency between the first flow channel and the second flow channel. Its structure is simple, the heat distribution is more uniform, and the heat exchange efficiency is relatively high, which can effectively avoid the phenomenon of local high temperature.

[0030] To make the above objects, features and advantages of the present application more obvious and understandable, the following specifically gives preferred embodiments and, in conjunction with the accompanying drawings, makes a detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0032] Figure 1 Structural schematic diagram of the cooling device provided for the embodiment of the present invention;

[0033] Figure 2 For Figure 1 A-A cross-sectional view of the cooling device shown;

[0034] Figure 3 For Figure 2 Enlarged view of area B of the cooling device shown;

[0035] Figure 4 For Figure 1 Left view of the cooling device shown;

[0036] Figure 5 For Figure 4 C-C cross-sectional view of the cooling device shown;

[0037] Figure 6 For Figure 4 D-D cross-sectional view of the cooling device shown;

[0038] Figure 7 Stereogram of the cooling device provided for the embodiment of the present invention;

[0039] Figure 8 Another stereogram of the cooling device provided for the embodiment of the present invention;

[0040] Figure 9 This is a schematic diagram of heat conduction provided by an embodiment of the present invention.

[0041] Icons: 100 - First sealing plate; 110 - First interface; 200 - Second sealing plate; 210 - Second interface; 300 - Runner plate; 310 - First runner surface; 320 - Second runner surface; 330 - Runner through-hole; 400 - First runner; 410 - First connecting pipe; 500 - Second runner; 510 - Second connecting pipe; 600 - Mounting hole. Detailed implementation manners

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. Generally, the components of the embodiments of the present invention described and illustrated in the drawings here can be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0044] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0045] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0046] In addition, the terms "horizontal", "vertical", "overhanging", etc. do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0047] In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0048] The following will describe in detail some embodiments of the present invention with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0049] Embodiment

[0050] Please refer to Figures 1 - 9 , this embodiment provides a cooling device, a battery pack, and a vehicle. Figure 1 is the front view of the cooling device provided in this embodiment. Figure 2 is Figure 1 the sectional view taken along the A-A direction of the cooling device shown in Figure 4 is Figure 1 the left view of the cooling device shown in ; for a clearer display of the structure, Figure 3 is Figure 2 the enlarged view of area B of the cooling device shown in Figure 5 is Figure 4 the sectional view taken along the C-C direction of the cooling device shown in Figure 6 is Figure 4 the sectional view taken along the D-D direction of the cooling device shown in ; Figure 7 and Figure 8 are the perspective views of two angles of the cooling device provided in this embodiment. Figure 9 is the schematic diagram of heat conduction provided in this embodiment.

[0051] The cooling device provided in this embodiment is used to cool a battery or a heat-generating object similar to a battery, especially used to cool the battery or battery module of an electric vehicle.

[0052] Referring to Figures 1 - 8 shown, the cooling device includes a first sealing plate 100, a second sealing plate 200, and a flow channel plate 300.

[0053] The flow channel plate 300 includes a corresponding first flow channel surface 310 and a second flow channel surface 320; the first flow channel surface 310 has a first flow channel groove, and the second flow channel surface 320 has a second flow channel groove. Optionally, the first flow channel surface 310 is parallel to the second flow channel surface 320.

[0054] The flow channel plate 300 is disposed between the first sealing plate 100 and the second sealing plate 200. The first flow channel 400 is formed by the first sealing plate 100 and the first flow channel groove of the flow channel plate 300, and the second flow channel 500 is formed by the second sealing plate 200 and the second flow channel groove of the flow channel plate 300. By providing the first flow channel groove and the second flow channel groove on two surfaces of the flow channel plate 300 and forming the first flow channel 400 and the second flow channel 500 with the first sealing plate 100 and the second sealing plate 200, the heat of the first flow channel 400 and the second flow channel 500 can be exchanged through the flow channel plate 300, further improving the heat exchange capacity of the cooling device, making the heat distribution of the cooling device more uniform, and effectively avoiding the phenomenon of local high temperature.

[0055] The flow channel plate 300 is provided with a flow channel through hole 330 communicating the first flow channel 400 and the second flow channel 500. Through the flow channel through hole 330, the cooling medium in the first flow channel 400 can flow into the second flow channel 500, or the cooling medium in the second flow channel 500 can flow into the first flow channel 400.

[0056] The first sealing plate 100 is provided with a first interface 110 communicating the first flow channel 400, and the second sealing plate 200 is provided with a second interface 210 communicating the second flow channel 500.

[0057] Optionally, the first interface 110 is a liquid inlet, and the second interface 210 is a liquid outlet. The flow direction of the cooling medium is to flow into the cooling device from the first interface 110, sequentially pass through the first flow channel 400, the flow channel through hole 330, the second flow channel 500, and flow out of the cooling device from the second interface 210.

[0058] Optionally, the first interface 110 is a liquid outlet, and the second interface 210 is a liquid inlet. The flow direction of the cooling medium is to flow into the cooling device from the second interface 210, sequentially pass through the second flow channel 500, the flow channel through hole 330, the first flow channel 400, and flow out of the cooling device from the first interface 110.

[0059] Specifically, the liquid inlet is the first interface 110 or the second interface 210, which can be determined according to factors such as the installation environment of the cooling device and the battery.

[0060] See Figures 3 - 5 As shown, optionally, the first interface 110 of the first sealing plate 100 is connected with a first connecting pipe 410, and the second interface 210 of the second sealing plate 200 is connected with a second connecting pipe 510. Through the first connecting pipe 410 and the second connecting pipe 510, it is convenient to connect the liquid inlet pipe and the liquid outlet pipe of the cooling medium.

[0061] In this embodiment, the cooling device includes a first sealing plate 100, a second sealing plate 200, and a flow channel plate 300. The flow channel plate 300 is disposed between the first sealing plate 100 and the second sealing plate 200. The first sealing plate 100 and the first flow channel groove form a first flow channel 400, the second sealing plate 200 and the second flow channel groove form a second flow channel 500, and there are a flow channel through hole 330 connecting the first flow channel 400 and the second flow channel 500, a first interface 110 connecting the first flow channel 400, and a second interface 210 connecting the second flow channel 500. That is, the first interface 110, the first flow channel 400, the flow channel through hole 330, the second flow channel 500, and the second interface 210 are connected in sequence. This cooling device uses a three-layer plate-type cooling plate, which effectively improves the heat exchange efficiency between the first flow channel 400 and the second flow channel 500. Its structure is simple and compact, the heat distribution is more uniform, and the heat exchange efficiency is high, which can effectively avoid the phenomenon of local high temperature.

[0062] At present, a water-cooled plate heat exchanger is generally used to cool the battery. In the existing plate heat exchanger, the coolant circuit in the sealed cavity formed by two plates is usually used to cool the battery. In the existing technology for cooling the battery, although the cooling plate has been disclosed; however, since the welding or bonding of the two plates with the coolant circuit requires a certain area, the coolant circuits are not closely adjacent to each other, resulting in the battery not being able to come into good contact with the coolant for heat exchange, and thus local high temperature of the battery will occur. In addition, the heat exchange area utilization rate of the existing cooler is poor, resulting in low heat exchange efficiency of the cooler. When the existing cooler cools the battery, the cooling capacity at the welding position is weak, the battery temperature distribution is uneven, which may cause low battery life or even spontaneous combustion. The cooling device described in this embodiment uses a three-layer plate-type cooling plate, which can effectively solve this problem. The front and back grooves are connected through the communication holes of the flow channel plate 300 to make full use of the flow channel plate 300, maximize the cooling medium flow rate per unit battery module area, and reduce the temperature of the battery module; at the same time, the cold and hot flows of the cooling medium can exchange heat with each other, reduce the temperature difference of the battery module, improve the heat exchange capacity, and ensure the battery temperature safety.

[0063] In an alternative solution of this embodiment, the flow rate of the cooling medium in the second flow channel 500 is higher than that in the first flow channel 400. By making the flow rates of the cooling medium in the first flow channel 400 and the second flow channel 500 different, the heat exchange performance of the cooling device is improved, so that the temperature of the cooling medium in the first flow channel 400 is closer to the temperature of the cooling medium in the second flow channel 500, and further the uniformity of the heat distribution of the cooling device is improved.

[0064] Optionally, the first interface 110 is an inlet, and the second interface 210 is an outlet. The number of the first flow channels 400 communicated with the first interface 110 is greater than the number of the second flow channels 500 communicated with the second interface 210. By making the number of the first flow channels 400 as the inlet flow channels greater than the number of the second flow channels 500 as the outlet flow channels, it is convenient for the flow rate of the cooling medium in the second flow channel 500 to be higher than the flow rate of the cooling medium in the first flow channel 400.

[0065] In addition to changing the number of the first flow channels 400 and the second flow channels 500 as described above to change the flow rate of the cooling medium in the first flow channel 400 and the flow rate of the cooling medium in the second flow channel 500, those skilled in the art can also change the cross-sectional areas of the first flow channels 400 and the second flow channels 500 to achieve the change of the flow rate of the cooling medium in the first flow channel 400 and the flow rate of the cooling medium in the second flow channel 500.

[0066] See Figures 1 - 8 As shown, in the optional solution of this embodiment, the number of the first flow channels 400 is two, and the number of the second flow channels 500 is one; the first interface 110 communicating with the first flow channels 400 is an inlet, and the second interface 210 communicating with the second flow channels 500 is an outlet. The two first flow channels 400 are parallel to each other; in the projection on the first flow channel surface 310, the second flow channel 500 is located between the two first flow channels 400; the flow rate of the cooling medium in the second flow channel 500 is higher than the flow rate of the cooling medium in the first flow channel 400.

[0067] In this embodiment, the heat transfer process is a process in which heat is transferred from the hot fluid to the cold fluid through the wall surface. In the steady state process, the heat transferred through each heat exchange link is equal; see Figure 9 As shown, Q1 is the heat transferred by the battery module (i.e., the heat source), Q W is the heat transferred by the first sealing plate 100 or the second sealing plate 200, and Q2 is the heat transferred by the cooling medium in the first flow channel 400 or the second flow channel 500; in the steady state process, Q = Q1 = Q2 = Q W .

[0068] According to the heat transfer principle, formula one can be obtained:

[0069]

[0070] In the formula:

[0071] Q: Total heat - the heat released by the battery module (i.e., the heat source) in the steady state, which is a fixed quantity.

[0072] R: Thermal resistance.

[0073] ΔT: Heat transfer temperature difference between the hot and cold media - the target to be reduced in this embodiment (i.e., this embodiment can reduce the temperature lower under the same heat).

[0074] A: Heat transfer area - Since the size of the battery module is fixed, the heat transfer area it can provide is a fixed quantity.

[0075] δ: Thickness of the heat-conducting wall - The thickness of the heat-conducting wall is determined according to the process capabilities. In this embodiment, it is assumed to be the same as that of other types of products, so it is controlled as a fixed quantity.

[0076] λ: Thermal conductivity of the solid wall - Different materials have different thermal conductivities. In this embodiment, it is assumed to be the same as that of other types of products, so it is controlled as a fixed quantity.

[0077] h 1 : Convective heat transfer coefficient on the hot side - In this embodiment, it is assumed to be the same as that of other types of products, so it is controlled as a fixed quantity.

[0078] h 2 : Convective heat transfer coefficient on the cold side - The variable to be improved in this embodiment.

[0079] Convective heat transfer coefficient h [unit: W / (m2·K)] - A proportionality coefficient describing the heat transfer ability between the fluid and the solid surface, generally depending on the physical properties of the fluid, the shape, size of the heat transfer surface, and the fluid flow rate.

[0080] Physical properties of the fluid (thermal conductivity, viscosity, density, specific heat, etc.): The fluid is generally a cooling medium. In this embodiment, it is assumed to be the same as that of other types of products, so it is controlled as a fixed quantity.

[0081] Shape and size of the heat transfer surface: The shape of the heat transfer surface is close to the heat source, and the size is greater than or equal to the wall surface of the heat source, so it is controlled as a fixed quantity.

[0082] Fluid flow rate: In this embodiment, the cooling medium in the low-temperature state flows from the liquid inlet of the cooling device to the flow channel plate 300 and continuously exchanges heat. As a result, the temperature of the cooling medium gradually increases, and its heat transfer ability gradually decreases. When passing through the flow channel through-hole 330 of the flow channel plate 300, the flow rate of the cooling medium is increased at the flow channel through-hole 330 to increase the convective heat transfer coefficient, that is, to increase the convective heat transfer coefficient h on the cold side. 2, so that the temperature can be lowered further under the same amount of heat, and then the temperature difference of the cooling medium in the flow channels before and after the flow channel through-hole 330 is smaller, making the heat distribution of the cooling device more uniform. For example, the number of the first flow channels 400 is two, the number of the second flow channels 500 is one, the first interface 110 connecting the first flow channels 400 is the liquid inlet, and the second interface 210 connecting the second flow channels 500 is the liquid outlet. The cooling medium in the low-temperature state flows from the liquid inlet of the cooling device through the two first flow channels 400 in parallel to the flow channel plate 300 and continuously exchanges heat. As a result, the temperature of the cooling medium gradually rises and its heat exchange capacity gradually decreases. After the two first flow channels 400 pass through the flow channel through-hole 330 of the flow channel plate 300, they become one second flow channel 500. Compared with the cooling medium in the first flow channels 400, the flow rate of the cooling medium in the second flow channel 500 is increased by nearly one time, increasing the convective heat transfer coefficient h on the cold side. 2 , so that the temperature can be lowered further under the same amount of heat, and then the temperature difference of the cooling medium in the first flow channels 400 and the second flow channels 500 is smaller, making the heat distribution of the cooling device more uniform.

[0083] Rearranging Formula 1 to Formula 2 gives:

[0084]

[0085] When h increases, the entire denominator decreases. Since Q is a constant value, ΔT decreases accordingly. Thus, under the same amount of heat, the flow rate of the cooling medium in the second flow channel 500 is higher than that in the first flow channels 400, and the temperature of the cooling medium in the second flow channel 500 can be lowered further.

[0086] In an alternative solution of this embodiment, the material of the first sealing plate 100 is aluminum, aluminum alloy, copper, stainless steel, or other materials.

[0087] In an alternative solution of this embodiment, the material of the second sealing plate 200 is aluminum, aluminum alloy, copper, stainless steel, or other materials.

[0088] In an alternative solution of this embodiment, the material of the flow channel plate 300 is aluminum, aluminum alloy, copper, stainless steel, or other materials.

[0089] Optionally, the first sealing plate 100, the second sealing plate 200, and the flow channel plate 300 are made of the same material. For example, the first sealing plate 100, the second sealing plate 200, and the flow channel plate 300 are all made of aluminum. Aluminum has good thermal conductivity and welding performance, making the welding of the first sealing plate 100, the second sealing plate 200, and the flow channel plate 300 easier, thus simplifying the processing technology of the cooling device to a certain extent.

[0090] Optionally, the first sealing plate 100, the flow channel plate 300, and the second sealing plate 200 are welded together to simplify the processing technology of the cooling device and reduce the processing cost of the cooling device.

[0091] See Figures 1 - 7 As shown, in an alternative embodiment of the present embodiment, the projection of the second flow channel 500 on the first flow channel surface 310 of the flow channel plate 300 does not coincide with the first flow channel 400; or, the projection of the first flow channel 400 on the second flow channel surface 320 of the flow channel plate 300 does not coincide with the second flow channel 500. By making the first flow channel 400 and the second flow channel 500 not coincide, the utilization rate of the cooling area is improved, the flow rate of the cooling medium in the unit battery module area is maximally increased, the heat exchange capacity is improved, and the battery temperature safety is ensured.

[0092] In an alternative embodiment of the present embodiment, the flow channel plate 300 is formed by pressing a plate and forms a first flow channel groove and a second flow channel groove; for example, the flow channel plate 300 is formed by stamping a plate and has a first flow channel groove and a second flow channel groove at the same time. By forming the flow channel plate 300 by pressing a plate, the processing technology of the flow channel plate 300 is simplified, thereby reducing the processing cost of the flow channel plate 300 to a certain extent, and further reducing the processing cost of the cooling device to a certain extent.

[0093] See Figures 1 - 8 As shown, in an alternative embodiment of the present embodiment, both the first interface 110 and the second interface 210 are provided at one end of the cooling device, and the flow channel through hole 330 is provided at the other end of the cooling device; by setting the liquid outlet and the liquid inlet of the cooling device at the same end and the flow channel through hole 330 at the other end, the heat exchange efficiency between the first flow channel 400 communicating with the first interface 110 and the second flow channel 500 communicating with the second interface 210 is higher, and heat exchange can be directly performed through the flow channel plate 300, greatly improving the heat exchange efficiency.

[0094] See Figures 1 - 8 As shown, in an alternative embodiment of the present embodiment, one end of the first flow channel 400 communicates with the first interface 110, and the other end of the first flow channel 400 communicates with the flow channel through hole 330; one end of the second flow channel 500 communicates with the second interface 210, and the other end of the second flow channel 500 communicates with the flow channel through hole 330. By setting the first interface 110 and the flow channel through hole 330 at both ends of the first flow channel 400 and setting the second interface 210 and the flow channel through hole 330 at both ends of the second flow channel 500, the heat exchange efficiency between the first flow channel 400 communicating with the first interface 110 and the second flow channel 500 communicating with the second interface 210 is further improved.

[0095] See Figures 1 - 7As shown, in an alternative solution of this embodiment, the first flow channel 400 is in a "ji" shape, and the second flow channel 500 is in a "ji" shape. By having the first flow channel 400 and the second flow channel 500 in a "ji" shape, the utilization rate of the unit area is increased, and thus the heat exchange efficiency of the unit area is improved.

[0096] See Figures 1 - 8 As shown, in an alternative solution of this embodiment, the first sealing plate 100 is a flat plate, and the second sealing plate 200 is a flat plate. By using flat plates for the first sealing plate 100 and the second sealing plate 200, the first sealing plate 100 and the second sealing plate 200 can better fit with the battery or the battery module, and thus it is convenient to better dissipate heat from the battery or the battery module.

[0097] See Figure 1 、 Figure 7 and Figure 8 As shown, in an alternative solution of this embodiment, the first sealing plate 100 is provided with mounting holes 600, and / or the second sealing plate 200 is provided with mounting holes 600; that is, both the first sealing plate 100 and the second sealing plate 200 are provided with mounting holes 600, or the first sealing plate 100 is provided with mounting holes 600, or the second sealing plate 200 is provided with mounting holes 600. Through the mounting holes 600, it is convenient to fix the cooling device on the battery or the battery module.

[0098] Optionally, the number of the mounting holes 600 is one or more.

[0099] This embodiment provides a battery pack, which includes the above-mentioned cooling device and also includes a battery module. This cooling device can be placed between two battery modules to cool the two battery modules, or the cooling device can be placed under one battery module to cool one battery module. This battery pack adopts a cooling device with a three-layer plate-type cooling plate, which effectively improves the heat exchange efficiency between the first flow channel 400 and the second flow channel 500. Its structure is simple and compact, the heat distribution is more uniform, the heat exchange efficiency is relatively high, and the phenomenon of local high temperature can be effectively avoided.

[0100] The battery pack provided in this embodiment includes the above-mentioned cooling device. The technical features of the above-disclosed cooling device are also applicable to this battery pack, and the technical features of the above-disclosed cooling device will not be described repeatedly. In this embodiment, the battery pack has the advantages of the above-mentioned cooling device, and the advantages of the above-disclosed cooling device will not be described repeatedly here.

[0101] This embodiment provides a vehicle, which includes the above-mentioned battery pack and also includes the above-mentioned cooling device. This vehicle adopts a cooling device with a three-layer plate-type cooling plate, which effectively improves the heat exchange efficiency between the first flow channel 400 and the second flow channel 500. Its structure is simple and compact, the heat distribution is more uniform, the heat exchange efficiency is relatively high, and the phenomenon of local high temperature can be effectively avoided.

[0102] The vehicle provided in this embodiment includes the above-mentioned battery pack. The technical features of the publicly disclosed battery pack also apply to this vehicle, and the technical features of the publicly disclosed battery pack will not be described repeatedly. The vehicle in this embodiment has the advantages of the above-mentioned battery pack, and the advantages of the publicly disclosed battery pack will not be described repeatedly here.

[0103] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A cooling device, characterized in that, it includes a first sealing plate, a second sealing plate and a flow channel plate; the flow channel plate includes a corresponding first flow channel surface and a second flow channel surface; the first flow channel surface has a first flow channel groove, and the second flow channel surface has a second flow channel groove; the flow channel plate is arranged between the first sealing plate and the second sealing plate, and the first sealing plate and the first flow channel groove form a first flow channel, and the second sealing plate and the second flow channel groove form a second flow channel; the flow channel plate is provided with a flow channel through hole communicating the first flow channel and the second flow channel; the first sealing plate is provided with a first interface communicating the first flow channel, and the second sealing plate is provided with a second interface communicating the second flow channel; the first interface is a liquid inlet, and the second interface is a liquid outlet; the flow direction of the cooling medium is to flow into the cooling device from the first interface, sequentially pass through the first flow channel, the flow channel through hole, the second flow channel, and flow out of the cooling device from the second interface; or, the first interface is a liquid outlet, and the second interface is a liquid inlet; the flow direction of the cooling medium is to flow into the cooling device from the second interface, sequentially pass through the second flow channel, the flow channel through hole, the first flow channel, and flow out of the cooling device from the first interface.

2. The cooling device according to claim 1, characterized in that, the flow velocity of the cooling medium in the second flow channel is higher than the flow velocity of the cooling medium in the first flow channel.

3. The cooling device according to claim 2, characterized in that, the first interface is a liquid inlet, and the second interface is a liquid outlet; the number of the first flow channels is greater than the number of the second flow channels.

4. The cooling device according to claim 3, characterized in that, the number of the first flow channels is two, and the number of the second flow channels is one; the two first flow channels are parallel to each other; in the projection on the first flow channel surface, the second flow channel is located between the two first flow channels.

5. The cooling device according to any one of claims 1-4, characterized in that, both the first interface and the second interface are arranged at one end of the cooling device, and the flow channel through hole is arranged at the other end of the cooling device; one end of the first flow channel communicates with the first interface, and the other end communicates with the flow channel through hole; one end of the second flow channel communicates with the second interface, and the other end communicates with the flow channel through hole.

6. The cooling device according to any one of claims 1-4, characterized in that, the projection of the second flow channel on the first flow channel surface does not coincide with the first flow channel.

7. The cooling device according to any one of claims 1-4, characterized in that, the first flow channel is in a "Ji" shape, and the second flow channel is in a "Ji" shape; the first sealing plate is a flat plate, and the second sealing plate is a flat plate.

8. The cooling device according to any one of claims 1-4, characterized in that, the first sealing plate is provided with mounting holes, and / or the second sealing plate is provided with mounting holes; the first interface is connected with a first connecting pipe, and the second interface is connected with a second connecting pipe; The materials of the first sealing plate and the second sealing plate are aluminum, aluminum alloy, copper or stainless steel respectively, and the material of the flow channel plate is aluminum, aluminum alloy, copper or stainless steel; The flow channel plate is formed by pressing a plate and forms the first flow channel groove and the second flow channel groove; The first sealing plate, the flow channel plate and the second sealing plate are welded to form the cooling device.

9. A battery pack, Characterized in that, It includes the cooling device according to any one of claims 1-8.

10. A vehicle, Characterized in that, It includes the battery pack according to claim 9.

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