Display Devices

Abstract

The present application relates to a display device. The display device includes a display panel and a printed circuit board attached to an end portion of the display panel. The printed circuit board includes a substrate, a first driver chip module disposed on the substrate, and a second driver chip module spaced apart from the first driver chip module. The first driver chip module includes a timing controller and a data driver, and the second driver chip module includes a plurality of modular driver chips.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0088363, filed on Jul. 22, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention relate to a display device. Background Art

[0004] A display device is a device configured to visually display data. The display device includes a board divided into a display area and a non-display area. In the display area, a plurality of pixels are arranged on the board, and in the non-display area, a plurality of pads and the like are arranged on the board. A flexible film (COF film) on which a driver integrated circuit and the like are mounted is coupled to the plurality of pads to transmit a drive signal to the pixels. In addition, a printed circuit board on which a plurality of driver chips configured to control the driver integrated circuit and the like are arranged can be attached to the flexible film.

[0005] When the printed circuit board is attached to the flexible film, the printed circuit board may be attached to the flexible film through a connector, or may be attached to the flexible film through an anisotropic conductive film (ACF) interposed between the flexible film and the printed circuit board.

[0006] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the invention

[0007] Exemplary embodiments of the present invention provide a display apparatus having a simplified module structure to reduce the number of components used and having a simplified process to ensure process time.

[0008] Exemplary embodiments of the present invention also provide a display device capable of ultra-high resolution processing at an ultra-high speed.

[0009] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0010] An embodiment of the present invention provides a display device, which includes: a display panel and a printed circuit board attached to one end portion of the display panel. The printed circuit board includes a substrate, a first driver chip module disposed on the substrate, and a second driver chip module disposed to be spaced apart from the first driver chip module. The first driver chip module includes a timing controller and a data driver, and the second driver chip module includes a plurality of modular driver chips.

[0011] The plurality of driving chips may include an image data input unit and a power supply unit.

[0012] The plurality of driver chips may further include a driver controller.

[0013] The image data input unit may be configured to transmit a data signal to the timing controller, and the power supply unit may be configured to transmit a power signal to the display panel.

[0014] The timing controller may be configured to send a data signal and a data control signal to the data driver.

[0015] The printed circuit board may further include a conductive layer disposed between the substrate and the first driving chip module and a bump disposed between the conductive layer and the first driving chip module, and the first driving chip module may be electrically connected to the conductive layer through the bump.

[0016] The second driving chip module may be electrically connected to the conductive layer.

[0017] The display device may further include an insulating layer disposed on the conductive layer and not disposed in a region in which the first driving chip module and the second driving chip module are disposed.

[0018] The insulating layer may be in contact with a side surface of each of the first driving chip module and the second driving chip module.

[0019] The display device may further include a connector disposed on the substrate, and the connector may be electrically connected to the main circuit board.

[0020] The connector may overlap the second driving chip module in a thickness direction.

[0021] The second driving chip module may further include a first insulating layer disposed between the driving chip and the connector, and a first through hole configured to pass through the first insulating layer and electrically connect the driving chip and the connector.

[0022] The second driving chip module may further include a second insulating layer disposed between the driving chip and the conductive layer, and a second through hole configured to electrically connect the driving chip and the conductive layer.

[0023] The second driving chip module may further include a third through hole passing through the first insulating layer and different from the first through hole and a fourth through hole passing through the second insulating layer and different from the second through hole, and the connector may be electrically connected to the conductive layer through the third through hole and the fourth through hole.

[0024] The display device may further include a third insulating layer disposed between the first insulating layer and the second insulating layer. The third insulating layer may be disposed on the same layer as the plurality of driving chips, and the third through hole and the fourth through hole may be electrically connected to each other through a fifth through hole of the third insulating layer.

[0025] The second driving chip module may further include a frame in which the insulating layer, the through hole, and the plurality of driving chips are mounted.

[0026] The second driving chip module may further include a connection portion disposed on another surface of the frame opposite to a surface facing the second insulating layer, the connection portion may be electrically connected to the second through hole and the fourth through hole, and the connection portion may be electrically connected to the conductive layer.

[0027] The third insulating layer and the plurality of driving chips may be spaced apart from each other with a spacing space therebetween.

[0028] The connector may be disposed so as not to overlap with the second driving chip module in a thickness direction.

[0029] Another embodiment of the present invention provides a display device, which includes: a display panel and a printed circuit board attached to one end portion of the display panel. The printed circuit board includes a substrate, a first driver chip module disposed on the substrate, and a second driver chip module disposed to be spaced apart from the first driver chip module. The first driver chip module includes a data driver, the second driver chip module includes a plurality of modular driver chips, and the plurality of driver chips include an image data input unit, a power supply unit, and a timing controller.

[0030] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings illustrate exemplary embodiments of the present invention and together with the description serve to explain the inventive concept. The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0032] Figure 1 is a plan layout diagram of a display device according to an exemplary embodiment.

[0033] Figure 2 yes Figure 1Schematic cross-sectional view of a display device in FIG.

[0034] Figure 3 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached.

[0035] Figure 4 is a view showing a first driving chip module according to an exemplary embodiment.

[0036] Figure 5 is a view showing a second driving chip module according to an exemplary embodiment.

[0037] Figure 6 is a view showing a scan driver and an emission control driver provided on a display panel.

[0038] Figure 7 is a plan view showing a display apparatus according to an exemplary embodiment.

[0039] Figure 8 is a block diagram illustrating a display apparatus according to an exemplary embodiment.

[0040] Fig. 9 is along Figure 3 A cross-sectional view taken along line IX-IX'.

[0041] Fig.10 is a cross-sectional view of a second driving chip module according to an exemplary embodiment.

[0042] Fig.11 is a schematic diagram illustrating signal transmission of a display device according to an exemplary embodiment.

[0043] Fig.12 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached according to another exemplary embodiment.

[0044] Fig.13 is along Fig.12 A cross-sectional view taken along line XIII-XIII'.

[0045] Fig.14 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached according to still another exemplary embodiment.

[0046] Fig.15 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached according to still another exemplary embodiment.

[0047] Fig.16 is along Fig.15A cross-sectional view taken along line XVI-XVI'.

[0048] Fig.17 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached according to still another exemplary embodiment. DETAILED DESCRIPTION

[0049] In the following description, for the purpose of illustration, many specific details are elaborated to provide a thorough understanding of various exemplary embodiments of the present invention. As used herein, "embodiment" is a non-limiting example of one or more devices or methods using the inventive concept disclosed herein. However, it is apparent that various exemplary embodiments can be put into practice without these specific details or with one or more equivalent arrangements. In other examples, in order to avoid unnecessarily obscuring various exemplary embodiments, known structures and devices are shown in block diagram form. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0050] Unless otherwise specified, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter, individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0051] The use of cross hatching and / or shading in the drawings is generally used to make the boundaries between adjacent elements clear. Therefore, unless specified, the presence or absence of cross hatching or shading does not represent or indicate any preference or requirement for a specific material, material property, size, ratio, commonality between the illustrated elements and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the embodiments can be implemented differently, the specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0052] When an element such as a layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, directly connected to, or directly coupled to, another element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this reason, the term "connected" may represent a physical connection, an electrical connection, and / or a fluid connection with or without the presence of an intervening element. In addition, the DR1 axis, the DR2 axis, and the D3 axis are not limited to the three axes of a rectangular coordinate system (such as, the x-axis, the y-axis, and the z-axis), and may be interpreted in a broader sense. For example, the DR1 axis, the DR2 axis, and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0053] Although the terms "first", "second", etc. can be used in this article to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0054] Spatially relative terms such as "beneath," "below," "under," "lower," "above," "upper," "over," "higher," "side" (e.g., as in "sidewall"), and the like may be used herein for descriptive purposes and, thereby, to describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" may include both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and thus the spatially relative descriptors used herein should be interpreted accordingly.

[0055] The terms used herein are for the purpose of describing specific embodiments, rather than being intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" are intended to also include plural forms. In addition, when used in this specification, the terms "comprise", "comprises", "includes" and / or "includes" represent the existence of stated features, integral bodies, steps, operations, elements, components and / or their sets, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or their sets. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as degree terms, and are therefore used to allow for the inherent deviations in the measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0056] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views, which are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Therefore, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be understood as being limited to the specific illustrated regional shapes, but should include deviations in shape due to, for example, manufacturing. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0057] According to the convention in the art, for functional blocks, units and / or modules, some exemplary embodiments are described and shown in the drawings. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc., which can be formed using semiconductor-based preparation technology or other manufacturing technology. In the case where the blocks, units and / or modules are implemented by microprocessors or other similar hardware, software (e.g., microcode) can be used to program and control the blocks, units and / or modules to perform the various functions discussed herein, and optionally, they can be driven by firmware and / or software. It is also considered that each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs some functions and processors (e.g., one or more programmed microprocessors and related circuits) that perform other functions. In addition, without departing from the scope of the inventive concept, each block, unit and / or module of some exemplary embodiments can be physically divided into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0058] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. Unless explicitly defined as such herein, terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense.

[0059] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0060] Figure 1 is a plan layout diagram of a display device according to an exemplary embodiment, and Figure 2 yes Figure 1 A cross-sectional view of a display device in FIG.

[0061] The display device 1 is a device configured to display video or still images, and can be used not only as a display screen for each of portable electronic devices such as mobile phones, smart phones, tablet PCs, smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, ultra mobile personal computers (UMPCs), etc., but can also be used as a display screen for each of various products such as televisions, laptops, monitors, billboards, the Internet of Things, etc.

[0062] Reference Figure 1 and Figure 2 , the display device 1 may include a display panel 100 configured to display an image and a circuit board 300 or a flexible printed circuit film connected to the display panel 100 .

[0063] The display panel 100 may be, for example, an organic light emitting display panel. In the following exemplary embodiments, although an example in which an organic light emitting display panel is the display panel 100 is described, the inventive concept is not limited to the above, and various technologies such as a liquid crystal display (LCD), a quantum dot organic light emitting display (QD-OLED) panel, a quantum dot liquid crystal display (QD-LCD), a quantum nano light emitting display (nano LED) panel, a micro LED, etc. may be used for the display panel 100.

[0064] The display panel 100 includes a display area DA including a plurality of pixel areas and a non-display area NA disposed around the display area DA. The display area DA may have a rectangular shape with sharp edges or a rectangular shape with rounded edges in a plan view. The display area DA may have a short side and a long side. The short side of the display area DA may be a side extending in the first direction DR1. The long side of the display area DA may be a side extending in the second direction DR2. However, the planar shape of the display area DA is not limited to a rectangular shape, and the display area DA may have various shapes, such as a circular shape, an elliptical shape, etc. The non-display area NA may be disposed adjacent to two short sides and two long sides of the display area DA. In this case, the non-display area NA may surround all sides of the display area DA and configure the edge of the display area DA. However, the inventive concept is not limited to the above, and the non-display area NA may be disposed adjacent to only the two short sides of the display area DA or only the two long sides of the display area DA.

[0065] The non-display area NA of the display panel 100 further includes a panel pad area P_PA. The panel pad area P_PA may be, for example, disposed around one short side of the display area DA, but is not limited thereto, and may be disposed around two short sides of the display area DA, or around two short sides and two long sides of the display area DA.

[0066] The circuit board 300 includes a plurality of stacked structures. The stacked structures may include a substrate, a wiring layer or a conductive layer disposed on the substrate, and a plurality of driving chip modules disposed on the wiring layer. The stacked structures of the circuit board 300 will be described in detail later.

[0067] The circuit board 300 may include a first circuit area CA1 one side of which is attached to the panel pad area P_PA of the display panel 100 and a second circuit area CA2 disposed at one side of the first circuit area CA1 in the second direction DR2 .

[0068] The driving chip modules of the circuit board 300 may be electrically connected to the pads of the display panel 100 through wiring layers or conductive layers, respectively.

[0069] Reference Figure 2 The display panel 100 includes a display panel 101 disposed in the entire display area DA and the panel pad area P_PA, a circuit layer 130 disposed in the display area DA on the display panel 101, a light emitting layer 150 disposed in the display area DA on the circuit layer 130, and an encapsulation layer 170 disposed in the display area DA on the light emitting layer 150. Each of the above pixel areas may include the circuit layer 130 and the light emitting layer 150.

[0070] The circuit layer 130 may include a display line, a display electrode, and at least one transistor, and control the amount of light emitted by the light emitting layer 150. The light emitting layer 150 may include an organic light emitting material. The light emitting layer 150 may be sealed by an encapsulation layer 170. The encapsulation layer 170 may prevent moisture, etc. from being introduced from the outside by sealing the light emitting layer 150. The encapsulation layer 170 may be formed of a single-layer inorganic film or a multi-layer inorganic film or a stacked layer in which inorganic films and organic films are alternately stacked.

[0071] The display device 1 also includes a panel lower sheet 200 disposed below the display panel 100. The panel lower sheet 200 can be attached to the rear surface of the display panel 100. The panel lower sheet 200 includes at least one functional layer and a lower insulating layer. The functional layer can be a layer configured to perform a heat dissipation function, an electromagnetic shielding function, a grounding function, a buffering function, a strength enhancement function, a support function, a digitization function, etc. The functional layer can be a sheet layer formed by a sheet, a film layer formed by a film, a film layer, a coating, a panel, a board, etc. A functional layer can be formed by a single layer, but can also be formed by a plurality of stacked films or coatings. The functional layer can be, for example, a supporting substrate, a heat dissipation layer, an electromagnetic shielding layer, an impact absorbing layer, a digitizer, etc.

[0072] like Figure 2 As shown in FIG. 3 , the circuit board 300 may be bent in a downward direction in the third direction DR3 . The other side of the circuit board 300 may be located below the panel lower sheet 200 .

[0073] The display device 1 may further include an inter-module connecting member AM disposed between the panel lower piece 200 and the circuit board 300. The inter-module connecting member AM may be a pressure-sensitive adhesive (PSA). The lower surface of the panel lower piece 200 may be connected to the circuit board 300 via the inter-module connecting member AM. The inner side surface of the inter-module connecting member AM may be further recessed outward than the inner side surface of the circuit board 300. In other words, the inner side surface of the circuit board 300 may protrude further inward than the inner side surface of the inter-module connecting member AM. Therefore, since the inter-module connecting member AM protrudes to the inner side of the circuit board 300, defects caused by the attachment of internal impurities, etc. can be prevented, and the inter-module connecting member AM can be prevented from flowing downward to the side surface of the circuit board 300, etc.

[0074] A portion of the circuit board 300 that protrudes further inward than the inter-module coupling member AM may be disposed to be spaced apart from the panel lower sheet 200 thereon with a spacing space therebetween.

[0075] Figure 3 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached.

[0076] Reference Figure 3 , the circuit board 300 or the flexible printed circuit film according to the embodiment may include a substrate 310 , and a first driving chip module 330 , a second driving chip module 350 , and a connector 370 disposed on the substrate 310 .

[0077] The first driver chip module 330 and the second driver chip module 350 may be spaced apart from each other. Figure 3 As shown in FIG. 3 , the second driving chip module 350 may be located lower than the first driving chip module 330 in the second direction DR2. The connector 370 may be disposed to overlap the second driving chip module 350 in the thickness direction.

[0078] The first driver chip module 330 can be set between the second driver chip module 350 and the panel pad area P_PA, or between the second driver chip module 350 and the first circuit area CA1, and the second driver chip module 350 can be set between the first driver chip module 330 and the end of the circuit board 300 opposite to the end of the circuit board 300 attached to the display panel 100.

[0079] Figure 4 is a view showing a first driving chip module according to an exemplary embodiment; Figure 5 is a view showing a second driving chip module according to an exemplary embodiment; Figure 6 is a view showing a scan driver and an emission control driver provided on a display panel; Figure 7is a plan view showing a display device according to an exemplary embodiment; and Figure 8 is a block diagram illustrating a display apparatus according to an exemplary embodiment.

[0080] Reference Figures 4 to 8 According to an embodiment, the first driving chip module 330 may include a timing controller 331 and a data driver 335; the second driving chip module 350 may include a power supply unit 351, an image data input unit 353 and a driving controller 355; and the scan driving circuit 400 may include a scan driver 410 and an emission control driver 420.

[0081] The first driving chip module 330 may refer to a module in which a timing controller 331 and a data driver 335 are embedded together, and the second driving chip module 350 may refer to a module in which a power supply unit 351 , an image data input unit 353 , and a driving controller 355 are embedded together.

[0082] exist Figure 5 Although an example is described in which the second driving chip module 350 includes only the power supply unit 351, the image data input unit 353, and the driving controller 355, the present inventive concept is not limited to the above, and other components besides the touch driver may also be embedded.

[0083] The second driving chip module 350 may be provided on the circuit board 300 in a panel level packaging (PLP) manner. The panel level packaging manner refers to a manner in which a power supply unit 351, an image data input unit 353, a driving controller 355, etc. provided on a conventional printed circuit board (PCB) are mounted on a flexible printed circuit board (FPCB) (circuit board 300 in the specification) together with the first driving chip module 330 including a timing controller 331 and a data driver 335.

[0084] Reference Figure 7 and Figure 8 In the display panel 100, the sub-pixel SP may be formed in the display area DA to display an image, and the non-display area NDA ( Figure 1 The sub-pixel SP may be disposed around the display area DA. Not only the sub-pixel SP may be disposed in the display area DA, but also the scan line SL, the emission line EL, the data line DL, and the first drive voltage line VDDL connected to the sub-pixel SP may be disposed in the display area DA. The scan line SL and the emission line EL may be disposed in the first direction (the X-axis direction, Figure 1 The data lines DL are formed in parallel in a second direction (Y-axis direction, Figure 1The first driving voltage lines VDDL may be formed in parallel in the second direction (Y-axis direction) in the display area DA. The first driving voltage lines VDDL formed in parallel in the second direction (Y-axis direction) in the display area DA may be connected to each other in the non-display area NDA.

[0085] Each of the sub-pixels SP may be connected to at least one of the scan lines SL, one of the data lines DL, at least one of the emission lines EL, and a first driving voltage line VDDL. Figure 7 In the embodiment, although an example is described in which each sub-pixel SP is connected to two scan lines SL, one data line DL, one emission line EL and a first driving voltage line VDDL, the inventive concept is not limited to the above. For example, each sub-pixel SP may be connected to three scan lines SL instead of two scan lines SL.

[0086] Each of the sub-pixels SP may include a driving transistor, at least one switching transistor, a light emitting element, and a capacitor. When a scan signal is applied from the scan line SL, at least one switching transistor is turned on, and therefore, the data voltage of the data line DL may be applied to the gate electrode of the driving transistor. The driving transistor may provide a driving current to the light emitting element according to the data voltage applied to the gate electrode. The driving transistor and at least one switching transistor may be a thin film switching transistor (thin film transistor). The light emitting element may emit light according to the driving current of the driving transistor. The light emitting element may be an organic light emitting diode including a first electrode, an organic light emitting layer, and a second electrode. The capacitor may be used to uniformly maintain the data voltage applied to the gate electrode of the driving transistor.

[0087] The non-display area NDA may be defined as an area from the outside of the display area DA to the edge of the display panel 100. In the non-display area NDA, a scan driving circuit 400 configured to apply a scan signal to the scan line SL, a fan-out line FL, and a pad DP between the data line DL and the circuit board 300 may be disposed. The pad DP may be disposed at one edge of the display panel 100. The pad DP may be disposed in a panel pad area ( Figure 1 in P_PA).

[0088] The scan driving circuit 400 may be electrically connected to the timing controller 331 of the first driving chip module 330 through a plurality of scan control lines SCL. The scan driving circuit 400 may receive a scan control signal SCS and an emission control signal ECS from the timing controller 331 through the plurality of scan control lines SCL.

[0089] like Figure 8 As shown in , the scan driving circuit 400 may include a scan driver 410 and an emission control driver 420 .

[0090] The scan driver 410 may generate scan signals according to the scan control signals SCS and sequentially output the scan signals to the scan lines SL. The emission control driver 420 may generate emission control signals according to the emission control signals ECS and sequentially output the emission control signals to the emission lines EL.

[0091] The scan driving circuit 400 may include a plurality of thin film transistors. The scan driving circuit 400 may be formed on the same layer as the thin film transistors of the sub-pixels SP. Figure 7 , an example is described in which the scan driving circuit 400 is formed at one side of the display area DA (e.g., formed in the non-display area NDA at the left side), but the inventive concept is not limited to the above. For example, the scan driving circuit 400 may be formed at both sides of the display area DA (e.g., formed in the non-display area NDA at the left and right sides of the display area DA).

[0092] The timing controller 331 receives the digital video data DATA and the timing signal from the image data input unit 353 and the driving controller 355 in the second driving chip module 350. The timing controller 331 generates a scan control signal SCS for controlling the operation timing of the scan driver 410, an emission control signal ECS for controlling the operation timing of the emission control driver 420, and a data control signal DCS for controlling the operation timing of the data driver 335 according to the timing signal. The timing controller 331 may output the scan control signal SCS to the scan driver 410 and the emission control signal ECS to the emission control driver 420 through a plurality of scan control lines SCL. The timing controller 331 may output the digital video data DATA and the data control signal DCS to the data driver 335.

[0093] The data driver 335 converts the digital video data DATA into analog positive / negative data voltages and outputs the analog positive / negative data voltages to the data lines DL through the fan-out lines FL. The subpixel SP is selected by the scan signal of the scan driving circuit 400 and the data voltage is supplied to the selected subpixel SP.

[0094] The power supply unit 351 may generate a first driving voltage and supply the first driving voltage to the first driving voltage line VDDL. In addition, the power supply unit 351 may generate a second driving voltage and supply the second driving voltage to the cathode electrode of the organic light emitting diode of the sub-pixel SP. The first driving voltage may be a high potential voltage for driving the organic light emitting diode, and the second driving voltage may be a low potential voltage for driving the organic light emitting diode. That is, the first driving voltage may have a potential higher than that of the second driving voltage.

[0095] The first driving chip module 330 may be formed as an integrated circuit (IC) and disposed on the circuit board 300 in a chip on film (COF) manner.

[0096] The circuit board 300 may be formed by an anisotropic conductive film (see Fig. 9 The ACF1 in the circuit board 300 is attached to the pad DP. Therefore, the lead of the circuit board 300 can be electrically connected to the pad DP. The circuit board 300 can be a flexible film such as a flexible printed circuit board, a printed circuit board, or a chip on a film.

[0097] The driving controller 355 of the second driving chip module 350 may be used to control the timing controller 331 and the data driver 335 of the first driving chip module 330 .

[0098] Fig. 9 is along Figure 3 A cross-sectional view taken along line IX-IX' in FIG. Fig.10 is a cross-sectional view of a second driving chip module according to an exemplary embodiment, and Fig.11 is a schematic diagram illustrating signal transmission of a display device according to an exemplary embodiment.

[0099] Reference Figures 9 to 11 The circuit board 300 may include a substrate 310 or a base film, a conductive layer 320 or a wiring layer disposed on the substrate 310, a first driver chip module 330 disposed on the conductive layer 320, a second driver chip module 350 disposed on the conductive layer 320 to be spaced apart from the first driver chip module 330, and a connector 370 disposed on the second driver chip module 350.

[0100] Although not shown, the connector 370 may be electrically connected to a main circuit board of the display apparatus 1 .

[0101] The base film 310 may include a material that is flexible and has an insulating function, such as polyimide or the like.

[0102] The wiring layer 320 disposed on the base film 310 may include a metal material. The wiring layer 320 may include one or more metals selected from the group consisting of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu).

[0103] The wiring layer 320 may be directly disposed on one surface of the base film 310 .

[0104] The first driving chip module 330 may be electrically connected to the wiring layer 320 of the circuit board 300 through the bump BUMP. The bump BUMP and the second anisotropic conductive film ACF2 may be disposed between the first driving chip module 330 and the wiring layer 320. The bump BUMP may be disposed between the first driving chip module 330 and the second anisotropic conductive film ACF2, and the second anisotropic conductive film ACF2 may be disposed between the bump BUMP and the wiring layer 320.

[0105] The bump BUMP may be electrically connected to the wiring layer 320 through the second anisotropic conductive film ACF2 for electrically connecting the first driving chip module 330 and the circuit board 300. The second anisotropic conductive film ACF2 and the above-mentioned anisotropic conductive film ACF1 may include the same material.

[0106] exist Fig. 9 Although an example in which one bump BUMP is provided on each of one end and the other end of the first driving chip module 330 in the second direction DR2 is described, the number of the bump BUMP is not limited.

[0107] The scan control signal SCS and the emission control signal ECS of the timing controller 331 of the first driving chip module 330 may be respectively input to the scan driver 410 and the emission control driver 420 on the display panel 100 through the bumps BUMP.

[0108] The second driving chip module 350 may be disposed on the wiring layer 320 and electrically connected to the wiring layer 320. The second driving chip module 350 may be disposed to overlap the connector 370 in the thickness direction. The second driving chip module 350 may be disposed between the connector 370 and the wiring layer 320. The plurality of driving chips of the second driving chip module 350 and the connector 370 may be electrically connected to the first driving chip module 330 or the display panel 100 through the connection portion 364 of the second driving chip module 350.

[0109] An insulating layer SR may also be disposed around the first driver chip module 330 and the second driver chip module 350. The insulating layer SR may include an organic insulating material. The insulating layer SR may be disposed between the anisotropic conductive film ACF1 and the first driver chip module 330 in a plan view, and may be disposed between the first driver chip module 330 and the second driver chip module 350. The insulating layer SR may surround the first driver chip module 330 and the second driver chip module 350 in a plan view, and cover the side surfaces of the first driver chip module 330 and the second driver chip module 350 to prevent electrical short circuit of each of the first driver chip module 330 and the second driver chip module 350.

[0110] In addition, the insulating layer SR is not set in the area of ​​the wiring layer 320 connected to the display panel 100 (the area where the anisotropic conductive film ACF1 is set), the area where the first driving chip module 330 is connected to the wiring layer 320 (the area where the second anisotropic conductive film ACF2 is set), and the area where the second driving chip module 350 is connected to the wiring layer 320 (the area where the connecting portion 364 is set), and one surface of the wiring layer 320 can be exposed.

[0111] like Fig.10 As shown in , the second driving chip module 350 may include a frame 357 and a plurality of components accommodated in the frame 357. The plurality of components of the second driving chip module 350 may include a first insulating layer 358, the plurality of driving chips 351, 353 and 355 disposed on the first insulating layer 358 or the first insulating plate, and a second insulating layer 359 or a second insulating plate disposed on the plurality of driving chips 351, 353 and 355. In addition, a third insulating layer 366 may be disposed between and around the plurality of driving chips 351, 353 and 355. The third insulating layer 366 may be disposed to separate each of the plurality of driving chips 351, 353 and 355 from each other. The third insulating layer 366 and the plurality of driving chips 351, 353 and 355 may be disposed on the same layer.

[0112] Each of the first insulating layer 358 and the second insulating layer 359 may include an organic insulating material.

[0113] A plurality of first through holes 361 and a plurality of third through holes 365 may be disposed through the first insulating layer 358. Also, a fifth through hole 363 may be disposed to surround the plurality of driving chips 351, 353, and 355 in the third insulating layer 366 and may penetrate the third insulating layer 366 in a thickness direction.

[0114] The first through-hole 361 may be used to electrically connect the connector 370 and the plurality of driving chips 351 , 353 , and 355 , and the third through-hole 365 may be electrically connected to the fifth through-hole 363 .

[0115] A predetermined spacing space may be provided between the first insulating layer 358 and the plurality of driving chips 351, 353, and 355. That is, the plurality of driving chips 351, 353, and 355 and the first insulating layer 358 may be provided to be spaced apart from each other with a predetermined spacing space therebetween.

[0116] A plurality of driving chips 351, 353, and 355 may be disposed between the first insulating layer 358 and the second insulating layer 359. A plurality of second through holes 362 and fourth through holes 368 may be disposed in the second insulating layer 359. The second through holes 362 may be disposed between the plurality of driving chips 351, 353, and 355 and the connecting portion 364 for electrically connecting the plurality of driving chips 351, 353, and 355 to the connecting portion 364, and the fourth through holes 368 may be disposed between the fifth through holes 363 and the connecting portion 364 for electrically connecting the fifth through holes 363 and the connecting portion 364.

[0117] exist Fig.10 , although the frame 357 is shown as having no openings formed between the first through hole 361 and the third through hole 365 and the connector 370 and between the second through hole 362 and the fourth through hole 368 and the connection portion 364, in the frame 357, a first opening may be formed to electrically connect the first through hole 361 and the third through hole 365 to the connector 370, and a second opening may be formed to electrically connect the second through hole 362 and the fourth through hole 368 to the connection portion 364. Each of the first through hole 361 and the third through hole 365 may be electrically connected to the connector 370 through the first opening, and each of the second through hole 362 and the fourth through hole 368 may be electrically connected to the connection portion 364 through the second opening.

[0118] The number of the connection portion 364 may be plural. A plurality of connection portions 364 may be attached to the wiring layer 320 of the circuit board 300. Although not shown in the drawings, an anisotropic conductive film may be interposed between the wiring layer 320 of the circuit board 300 and the connection portion 364, and the wiring layer 320 and the connection portion 364 may be electrically connected through the anisotropic conductive film. However, the inventive concept is not limited to the above, and the wiring layer 320 and the connection portion 364 may be directly electrically connected through ultrasonic welding or the like.

[0119] The shape of the connection portion 364 is exemplified as a semicircular shape, but the inventive concept is not limited to the above shape, and a rectangular shape, an elliptical shape, or other polygonal shapes may be applied as the shape of the connection portion 364 .

[0120] Reference Fig.11In the display device 1 according to the exemplary embodiment, the power supply unit 351, the image data input unit 353, and the driving controller 355 as described above may not be attached to the other end of the circuit board 300 opposite to the end of the circuit board 300 attached to the display panel 100, and may be directly attached to the circuit board 300. When a printed circuit board (PCB) is attached to the other end of the circuit board 300 and the power supply unit 351, the image data input unit 353, and the driving controller 355 as described above are mounted on the printed circuit board (PCB), signals applied from the connector 370 and the plurality of driving chips 351, 353, and 355 may be transmitted through a connection portion between the printed circuit board (PCB) and the other end of the circuit board 300 and a connection portion between the circuit board 300 and the display panel 100 (see FIG. 1 ). Figure 1 The P_PA in the connector 370 is transmitted to the display panel 100. When the signal applied from the connector 370 and the plurality of driving chips 351, 353 and 355 passes through the two connection parts, resistance matching may not be easy. That is, resistance imbalance between the leads of the plurality of driving chips 351, 353 and 355 connected to the connector 370 and the printed circuit board (PCB) and the leads of the plurality of driving chips 351, 353 and 355 connected to the connector 370 and the circuit board 300 may occur.

[0121] Specifically, as described above, the leads of the plurality of driver chips 351, 353 and 355 connected to the connector 370 and the printed circuit board (PCB) and the leads of the plurality of driver chips 351, 353 and 355 connected to the connector 370 and the circuit board 300 are connected to each other through an anisotropic conductive film, and even when the process of bonding the leads of the plurality of driver chips 351, 353 and 355 connected to the connector 370 and the printed circuit board (PCB) and the leads of the plurality of driver chips 351, 353 and 355 connected to the connector 370 and the circuit board 300 is performed under the condition of adjusting the same resistance, the resistance of the leads of the plurality of driver chips 351, 353 and 355 connected to the connector 370 and the printed circuit board (PCB) may also change due to passing through the anisotropic conductive film. Therefore, the resistance imbalance between the leads mentioned above may occur. The resistance imbalance between the leads may cause signal transmission failures, such as signal transmission delays, signal distortions, etc.

[0122] However, in the display device 1 according to the exemplary embodiment, since the power supply unit 351, the image data input unit 353, and the driving controller 355 as described above are not mounted on a printed circuit board (PCB) different from the circuit board 300, but are directly mounted on the circuit board 300, the leads of the plurality of driving chips 351, 353, and 355 connected to the connector 370 and the printed circuit board (PCB) and the leads of the plurality of driving chips 351, 353, and 355 connected to the connector 370 and the circuit board 300 do not have to be connected through an anisotropic conductive film, and therefore, resistance unbalance can be prevented from occurring. Therefore, signal transmission failures such as signal transmission delay, signal distortion, etc. in the display device 1 can be prevented.

[0123] In addition, if Fig.11 As shown in , since the connecting portion between the printed circuit board (PCB) and the circuit board 300 is omitted, the speed of each of the signal transmission between the connector 370 and the display panel 100 and the signal transmission between the second driving chip module 350 and the display panel 100 can be increased, and thus a high-speed and high-resolution display device can be realized.

[0124] Hereinafter, a display device according to another embodiment will be described. In the following embodiment, the same components as those in the above-described embodiment will be denoted by the same reference numerals, and the description of the components will be omitted or simplified.

[0125] Fig.12 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached according to another exemplary embodiment, and Fig.13 is along Fig.12 A cross-sectional view taken along line XIII-XIII'.

[0126] Reference Fig.12 and Fig.13 The display device 2 according to the present embodiment is different from the display device 1 according to the aforementioned embodiment in that the connector 370_1 and the second driving chip module 350_1 do not overlap in the thickness direction.

[0127] More specifically, in the display device 2 according to the present exemplary embodiment, the connector 370_1 and the second driving chip module 350_1 may not overlap in the thickness direction.

[0128] like Fig.13 As shown in FIG. 1 , the connection portion of the connector 370_1 connected to the second driving chip module 350_1 may be electrically connected to the wiring layer 320. The connection portion of the connector 370_1 may be electrically connected to Fig.10 The first through hole 361 and the third through hole 365 described in FIG.

[0129] In some exemplary embodiments, at least one of the connection portions of the connector 370_1 may not be electrically connected to the first and third through holes 361 and 365 , and may be directly electrically connected to the first driving chip module 330 or the display panel 100 .

[0130] In the present exemplary embodiment, since the power supply unit 351, the image data input unit 353, and the driving controller 355 as described above are not mounted on a printed circuit board (PCB) different from the circuit board 300, but are directly mounted on the circuit board 300, the leads of the plurality of driving chips 351, 353, and 355 connected to the connector 370 and the printed circuit board (PCB) and the leads of the plurality of driving chips 351, 353, and 355 connected to the connector 370_1 and the circuit board 300 do not have to be connected through an anisotropic conductive film, and therefore, resistance unbalance can be prevented from occurring. Therefore, signal transmission failures such as signal transmission delay, signal distortion, etc. in the display device 2 can be prevented.

[0131] In addition, since the connection portion between the printed circuit board (PCB) and the circuit board 300 is omitted, the speed of each of the signal transmission between the connector 370_1 and the display panel 100 and the signal transmission between the second driving chip module 350_1 and the display panel 100 can be increased, and thus a high-speed and high-resolution display device can be realized.

[0132] Fig.14 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached according to still another exemplary embodiment.

[0133] The display device 3 according to the present embodiment is different from the display device 1 according to the first embodiment in that a plurality of first driving chip modules 330_1 are configured.

[0134] More specifically, in the display device 3 according to the present exemplary embodiment, a plurality of first driving chip modules 330_1 may be configured. The display device 3 according to the present embodiment may be, for example, a large display device such as a tablet PC, a TV, a notebook computer, a monitor, etc., but is not limited thereto.

[0135] exist Fig.14 Although an example in which the number of the first driving chip modules 330_1 is two is described, the present disclosure is not limited to the above, and the number of the first driving chip modules 330_1 may be three or more.

[0136] Since a plurality of first driving chip modules 330_1 are applied, the display device 3 according to the present embodiment can be implemented as a display device with a higher resolution.

[0137] In addition, since the power supply unit 351, the image data input unit 353, and the driving controller 355 as described above are not mounted on a printed circuit board (PCB) different from the circuit board 300, but are directly mounted on the circuit board 300, the leads of the plurality of driving chips 351, 353, and 355 connected to the connector 370 and the printed circuit board (PCB) and the leads of the plurality of driving chips 351, 353, and 355 connected to the connector 370 and the circuit board 300 do not have to be connected through an anisotropic conductive film, and therefore, resistance unbalance can be prevented from occurring. Therefore, signal transmission failures such as signal transmission delay, signal distortion, etc. in the display device 3 can be prevented.

[0138] In addition, since the connecting portion between the printed circuit board (PCB) and the circuit board 300 is omitted, the speed of each of the signal transmission between the connector 370 and the display panel 100 and the signal transmission between the second driving chip module 350 and the display panel 100 can be increased, and thus a high-speed and high-resolution display device can be realized.

[0139] Fig.15 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached according to still another exemplary embodiment, and Fig.16 is along Fig.15 A cross-sectional view taken along line XVI-XVI'.

[0140] See attached Fig.15 and Fig.16 The display device 4 according to this embodiment is different from the display device 4 according to Figure 3 The display device 1 of the embodiment shown in FIG. 1 is different in that according to Figure 3 The first driving chip module 330 is included in the second driving chip module 350_2.

[0141] More specifically, in the display device 4 according to the present exemplary embodiment, the second driving chip module 350_2 may include Figure 3 The first driving chip module 330 described in .

[0142] As described above, repeated descriptions of other descriptions will be omitted.

[0143] Fig.17 is a plan view showing a display panel and a printed circuit film having one end portion to which the display panel is attached according to still another exemplary embodiment.

[0144] refer to Fig.17 According to the display device 5 of this embodiment, Fig.15 and Fig.16The difference between the display device 4 is that Fig.15 and Fig.16 The second driving chip module 350_2 described in the embodiment is configured as a plurality of second driving chip modules 350_3.

[0145] More specifically, in the display device 5 according to the present exemplary embodiment, a plurality of second driving chip modules 350_3 may be configured. Fig.17 An example in which the number of the second driving chip modules 350_3 is two is described in , but the inventive concept is not limited to the above, and the number of the second driving chip modules 350_3 may be three or more.

[0146] According to the exemplary embodiments of the present disclosure, a display device capable of simplifying a module structure to reduce the number of components used and capable of simplifying a process to secure a process time may be configured.

[0147] Furthermore, a display device capable of ultra-high-resolution processing at ultra-high speed can be configured.

[0148] The effects according to the inventive concept are not limited to the above-mentioned contents, and more various effects are included in the specification.

[0149] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. Display equipment, including: Display panel; as well as a printed circuit board attached to one end portion of the display panel, in: The printed circuit board comprises a substrate, a first driving chip module arranged on the substrate, and a second driving chip module arranged on the substrate to be spaced apart from the first driving chip module; The first driver chip module includes a timing controller and a data driver; The second driver chip module includes a plurality of driver chips embedded together; The printed circuit board further includes a conductive layer disposed between the substrate and the first driving chip module and a bump disposed between the conductive layer and the first driving chip module; and The first driving chip module is electrically connected to the conductive layer through the bumps.

2. The display device according to claim 1, wherein: The plurality of driving chips include an image data input unit and a power supply unit.

3. The display device according to claim 2, wherein: The plurality of driving chips further include a driving controller.

4. The display device according to claim 2, wherein: The image data input unit is configured to send a data signal to the timing controller; and The power supply unit is configured to send a power signal to the display panel.

5. The display device according to claim 4, wherein: The timing controller is configured to transmit the data signal and the data control signal to the data driver.

6. The display device according to claim 1, wherein: The second driving chip module is electrically connected to the conductive layer. 7 . The display device according to claim 6 , further comprising an insulating layer disposed on the conductive layer and not disposed in a region where the first driving chip module and the second driving chip module are disposed.

8. The display device according to claim 7, wherein: The insulating layer contacts a side surface of each of the first driving chip module and the second driving chip module.

9. Display equipment, including: Display panel; as well as a printed circuit board attached to one end portion of the display panel, Wherein, the printed circuit board comprises a substrate, a first driver chip module arranged on the substrate, and a second driver chip module arranged on the substrate to be spaced apart from the first driver chip module; The first driver chip module includes a data driver; The second driver chip module includes a plurality of driver chips embedded together; The plurality of driving chips include an image data input unit, a power supply unit and a timing controller; The printed circuit board further includes a conductive layer disposed between the substrate and the first driving chip module and a bump disposed between the conductive layer and the first driving chip module; and The first driving chip module is electrically connected to the conductive layer through the bumps.

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