Ceramic heating components and electronic atomizers

Abstract

The present application provides a ceramic heating component and an electronic atomizer. The above-mentioned ceramic heating component includes a ceramic substrate and a conductive heating element; the conductive heating element includes a conductive body and a conductive bending portion, the conductive bending portion is connected to the conductive body, at least part of the conductive bending portion is embedded in the ceramic substrate, the conductive body is located outside the ceramic substrate, and the conductive body is connected to the ceramic substrate. The conductive body of the conductive heating element is arranged on the ceramic substrate, and the conductive bending portion of the conductive heating element is embedded in the ceramic substrate, so that both sides of the conductive bending portion are in contact with the ceramic substrate, so that the conductive bending portion and the ceramic substrate are clamped, and then the connection area between the conductive bending portion and the ceramic substrate is increased, and the connection stability between the conductive bending portion and the ceramic substrate is improved, thereby improving the connection stability between the conductive heating element and the ceramic substrate, and reducing the probability of warping and loosening.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomization, and in particular to a ceramic heating component and an electronic atomizer. Background Art

[0002] Electronic cigarettes, also known as virtual cigarettes and electronic cigarettes, have the same appearance as cigarettes and a similar taste to cigarettes, and even have many more flavors than ordinary cigarettes. They can also inhale smoke, taste and feel like cigarettes. They are mainly used to quit smoking and replace cigarettes. Electronic cigarettes are also a non-combustion tobacco substitute product. They are similar to some characteristics of ordinary cigarettes, and can refresh smokers and satisfy the pleasure and usage habits of smokers developed over many years. But they are essentially different from ordinary cigarettes. Electronic cigarettes do not burn, do not contain tar, and do not contain more than 460 chemical substances that cause respiratory and cardiovascular diseases when ordinary cigarettes are burned, thereby removing carcinogens in ordinary cigarettes, and will not cause "second-hand smoke" hazards to others and pollute the environment. Among them, traditional electronic cigarettes heat the smoke oil through the internal atomizer to produce harmless smoke. The heating device is a part with heating function. For example, a metal mesh for conducting electricity is set on the ceramic substrate, and heat is generated by energizing the metal mesh, and then the smoke oil is heated and atomized through the ceramic substrate.

[0003] However, the metal mesh of the traditional heating element is simply set on the surface of the substrate. When subjected to external force, the metal mesh is prone to warping and loosening, which reduces the connection area between the metal mesh and the substrate, and easily causes the metal mesh to detach from the substrate, affecting the use effect. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a ceramic heating component and an electronic atomizer with improved connection stability.

[0005] The objective of the present invention is achieved through the following technical solutions:

[0006] A ceramic heating component comprises: a ceramic substrate and a conductive heating element; the conductive heating element comprises a conductive body and a conductive bending portion, the conductive bending portion is connected to the conductive body, at least part of the conductive bending portion is embedded in the ceramic substrate, the conductive body is located outside the ceramic substrate, the conductive body is connected to the ceramic substrate, and at least one of the conductive body and the conductive bending portion is used to be electrically connected to an external power supply.

[0007] In one embodiment, the conductive bending portion is embedded in the ceramic matrix.

[0008] In one embodiment, the conductive bending portion is disposed perpendicularly to the surface of the ceramic substrate.

[0009] In one embodiment, the conductive bending portion includes an embedded sub-portion and a bent sub-portion, the bent sub-portion is connected to the conductive body, the bent sub-portion is also connected to the embedded sub-portion, the embedded sub-portion is embedded in the ceramic matrix, and the bent sub-portion has a bending structure so that an angle is formed between the embedded sub-portion and the conductive body.

[0010] In one embodiment, the surface of the ceramic substrate is disposed in contact with the conductive body.

[0011] In one embodiment, the conductive body includes a conductive part and a connecting part, the conductive part is connected to the conductive bending part, the conductive part is also connected to the connecting part, the conductive part and the connecting part are both connected to the ceramic substrate, and at least one of the conductive part and the connecting part has a curved structure.

[0012] In one embodiment, the conductive body further includes an auxiliary embedded portion, the auxiliary embedded portion is connected to the connecting portion, and the auxiliary embedded portion is embedded in the ceramic matrix, so that the connecting portion is connected to the ceramic matrix through the auxiliary embedded portion.

[0013] In one embodiment, the connecting portion includes a first connecting portion and a second connecting portion, the first connecting portion is connected to the conductive portion, the first connecting portion is also connected to the second connecting portion, and an angle is formed between the first connecting portion and the second connecting portion.

[0014] In one embodiment, the first connecting portion and the second connecting portion are arranged perpendicularly.

[0015] An electronic atomizer comprises the ceramic heating component described in any one of the above embodiments.

[0016] Compared with the prior art, the present invention has at least the following advantages:

[0017] The conductive body of the conductive heating element is arranged on the ceramic substrate, and the conductive bending part of the conductive heating element is embedded in the ceramic substrate, so that both sides of the conductive bending part are in contact with the ceramic substrate, thereby achieving a snap connection between the conductive bending part and the ceramic substrate, thereby increasing the connection area between the conductive bending part and the ceramic substrate, improving the connection stability between the conductive bending part and the ceramic substrate, thereby improving the connection stability between the conductive heating element and the ceramic substrate, and reducing the probability of warping and loosening. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is a schematic diagram of the structure of a ceramic heating component in one embodiment;

[0020] Figure 2 for Figure 1 A cross-sectional view of the ceramic heating component shown along the AA direction;

[0021] Figure 3 for Figure 1 An exploded schematic diagram of a ceramic heating component is shown;

[0022] Figure 4 for Figure 1 A schematic structural diagram of the conductive body of the ceramic heating component shown;

[0023] Figure 5 for Figure 1 A schematic structural diagram of the embedded sub-part of the ceramic heating component is shown. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] The present invention relates to a ceramic heating component. In one embodiment, the ceramic heating component includes a ceramic substrate and a conductive heating element. The conductive heating element includes a conductive body and a conductive bending portion. The conductive bending portion is connected to the conductive body, and at least part of the conductive bending portion is embedded in the ceramic substrate. The conductive body is located outside the ceramic substrate, and the conductive body is connected to the ceramic substrate. At least one of the conductive body and the conductive bending portion is used to be electrically connected to an external power supply. The conductive body of the conductive heating element is arranged on the ceramic substrate, and the conductive bending portion of the conductive heating element is embedded in the ceramic substrate, so that both sides of the conductive bending portion are in contact with the ceramic substrate, so that the conductive bending portion and the ceramic substrate are clamped, thereby increasing the connection area between the conductive bending portion and the ceramic substrate, improving the connection stability between the conductive bending portion and the ceramic substrate, thereby improving the connection stability between the conductive heating element and the ceramic substrate, and reducing the probability of warping and loosening.

[0028] See also Figure 1 , which is a schematic structural diagram of a ceramic heating component according to an embodiment of the present invention.

[0029] The ceramic heating component 10 of one embodiment includes a ceramic substrate 100 and a conductive heating element 200. Figure 2 and Figure 3 The conductive heating element 200 includes a conductive body 210 and a conductive bending portion 220. The conductive bending portion 220 is connected to the conductive body 210, and at least a portion of the conductive bending portion 220 is embedded in the ceramic substrate 100. The conductive body 210 is located outside the ceramic substrate 100, and the conductive body 210 is connected to the ceramic substrate 100. At least one of the conductive body 210 and the conductive bending portion 220 is used to be electrically connected to an external power source.

[0030] In this embodiment, the conductive body 210 of the conductive heating element 200 is arranged on the ceramic substrate 100, and the conductive bending portion 220 of the conductive heating element 200 is embedded in the ceramic substrate 100, so that both sides of the conductive bending portion 220 are in contact with the ceramic substrate 100, thereby achieving a snap connection between the conductive bending portion 220 and the ceramic substrate 100, thereby increasing the connection area between the conductive bending portion 220 and the ceramic substrate 100, improving the connection stability between the conductive bending portion 220 and the ceramic substrate 100, thereby improving the connection stability between the conductive heating element 200 and the ceramic substrate 100, and reducing the probability of warping and loosening. Moreover, in order to improve stability, the number of the conductive bending portions 220 is two, and the two conductive bending portions 220 are respectively connected to the two ends of the conductive body 210, that is, each end of the conductive body 210 is connected to a conductive bending portion 220, so that the conductive heating element 200 is evenly stressed on the ceramic substrate 100, further improving the connection stability between the conductive heating element 200 and the ceramic substrate 100.

[0031] In one of the embodiments, please also refer to Figure 1 and Figure 2 , the conductive bending portion 220 is embedded in the ceramic matrix 100. In this embodiment, the conductive bending portion 220 is used to be mutually embedded with the ceramic matrix 100, that is, the entire conductive bending portion 220 is located in the ceramic matrix 100, that is, the area of ​​the conductive bending portion 220 exposed to the outside is zero. When the conductive bending portion 220 is embedded in the ceramic matrix 100, both sides of the conductive bending portion 220 are in contact with the ceramic matrix 100, so that each surface of the conductive bending portion 220 is in contact with the ceramic matrix 100, thereby further increasing the contact area between the conductive bending portion 220 and the ceramic matrix 100, and further improving the connection stability between the conductive bending portion 220 and the ceramic matrix 100, facilitating the tight fixation of the conductive heating element 200 and the ceramic matrix 100, and reducing the probability of the conductive heating element 200 being warped and loosened.

[0032] In one of the embodiments, please also refer to Figure 1 and Figure 2, the conductive bending portion 220 is arranged perpendicular to the surface of the ceramic substrate 100. In this embodiment, the conductive bending portion 220 is embedded in the ceramic substrate 100, and the conductive bending portion 220 is stably arranged in a direction perpendicular to the surface of the ceramic substrate 100, so that the moment of the conductive bending portion 220 in the direction perpendicular to the surface of the ceramic substrate 100 tends to infinity, thereby increasing the extrusion force of the conductive bending portion 220 in the direction perpendicular to the surface of the ceramic substrate 100 and loosening, that is, a larger extrusion force is required to move the conductive bending portion 220 in the direction perpendicular to the surface of the ceramic substrate 100, reducing the shaking amplitude of the conductive bending portion 220 in the direction perpendicular to the surface of the ceramic substrate 100, thereby reducing the shaking tendency of the conductive bending portion 220 in the direction perpendicular to the surface of the ceramic substrate 100, and ensuring the stable arrangement of the conductive heating element 200 on the ceramic substrate 100.

[0033] In one embodiment, see Figure 3 The conductive bending portion 220 includes an embedded sub-portion 222 and a bent sub-portion 224. The bent sub-portion 224 is connected to the conductive body 210. The bent sub-portion 224 is also connected to the embedded sub-portion 222. The embedded sub-portion 222 is embedded in the ceramic substrate 100. The bent sub-portion 224 has a bent structure so that an angle is formed between the embedded sub-portion 222 and the conductive body 210. In this embodiment, the bent sub-portion 224 forms a bending corner with the conductive body 210. The conductive body 210 is connected to the embedded sub-portion 222 through the bent sub-portion 224. The embedded sub-portion 222 is located at a position where the bent sub-portion 224 is away from the conductive body 210, so that the embedded sub-portion 222 and the conductive body 210 are arranged obliquely, so that an oblique angle is formed between the embedded sub-portion 222 and the conductive body 210. In this way, when the embedding sub-portion 222 is embedded in the ceramic substrate 100, the contact area between the surface of the conductive body 210 and the ceramic substrate 100 increases, so that the connection area between the conductive body 210 and the ceramic substrate 100 increases, thereby making the connection between the conductive body 210 and the ceramic substrate 100 more stable. In one embodiment, the surface of the ceramic substrate 100 is arranged in contact with the conductive body 210, and the bending sub-portion 224 and the embedding sub-portion 222 are arranged perpendicular to each other, ensuring that after the embedding sub-portion 222 is embedded in the ceramic substrate 100, the conductive body 210 is parallel to the ceramic substrate 100, so that the contact area between the conductive body 210 and the ceramic substrate 100 is further increased, thereby further improving the connection stability between the conductive body 210 and the ceramic substrate 100.

[0034] In one embodiment, see Figure 3 The conductive body 210 includes a conductive portion 212 and a connecting portion 214. The conductive portion 212 is connected to the conductive bending portion 220. The conductive portion 212 is also connected to the connecting portion 214. Both the conductive portion 212 and the connecting portion 214 are connected to the ceramic substrate 100. At least one of the conductive portion 212 and the connecting portion 214 has a curved structure. In this embodiment, the conductive portion 212 is a sheet-like metal conductive plate. The conductive portion 212 is arranged in close contact with the ceramic substrate 100, that is, the conductive portion 212 is parallel to the ceramic substrate 100, that is, the connection between the conductive portion 212 and the ceramic substrate 100 is a surface-to-surface connection. The conductive part 212 is connected to the conductive bending part 220, that is, the conductive bending part 220 is connected to the side of the conductive part 212, that is, the contact method between the conductive bending part 220 and the conductive part 212 is a line-surface contact method, so that the contact area between the conductive bending part 220 and the conductive part 212 is increased, thereby improving the connection stability between the conductive bending part 220 and the conductive part 212. Moreover, the connecting portion 214 is connected to the conductive portion 212. When the connecting portion 214 has a curved structure, the connecting portion 214 is laid flat on the ceramic substrate 100, so that the connecting portion 214 has a portion in multiple directions. For example, the connecting portion 214 has parallel portions in two perpendicular directions of the plane where the ceramic substrate 100 is located, so that the connecting portion 214 has a portion to reduce shaking in any direction, thereby reducing the shaking amplitude of the conductive body 210 on the ceramic substrate 100, further improving the connection stability of the conductive heating element 200 and the ceramic substrate 100. In one embodiment, the conductive portion 212 and the connecting portion 214 are integrally formed, so that the conductive portion 212 and the connecting portion 214 are firmly connected, and the structure of the conductive body 210 is more compact. In other embodiments, the conductive portion 212 and the connecting portion 214 can also be formed separately and connected together by welding.

[0035] For further information, see Figure 3The conductive body 210 further includes an auxiliary embedded portion 216, which is connected to the connecting portion 214. The auxiliary embedded portion 216 is embedded in the ceramic substrate 100, so that the connecting portion is connected to the ceramic substrate through the auxiliary embedded portion. In this embodiment, the auxiliary embedded portion 216 is used to stably set the connecting portion 214 on the ceramic substrate 100. The auxiliary embedded portion 216 and the connecting portion 214 are arranged perpendicular to each other. When the connecting portion 214 is laid flat on the ceramic substrate 100, the auxiliary embedded portion 216 is located in the ceramic substrate 100, that is, the auxiliary embedded portion 216 is embedded in the ceramic substrate 100. By increasing the volume of the auxiliary embedded portion 216 embedded in the ceramic substrate 100, the connection area between the auxiliary embedded portion 216 and the ceramic substrate 100 is increased, thereby improving the connection stability between the connecting portion 214 and the ceramic substrate 100, thereby improving the connection stability between the conductive heating element 200 and the ceramic substrate 100. In one embodiment, the auxiliary embedded portion 216 is welded to the connecting portion 214, so that the auxiliary embedded portion 216 and the connecting portion 214 are firmly connected. In other embodiments, the auxiliary embedded portion 216 may also be integrally formed with the connecting portion 214 .

[0036] Please also refer to Figure 3 and Figure 4 The connecting portion 214 includes a first connecting portion 2142 and a second connecting portion 2144, wherein the first connecting portion 2142 is connected to the conductive portion 212, and the first connecting portion 2142 is also connected to the second connecting portion 2144, and an angle is formed between the first connecting portion 2142 and the second connecting portion 2144. In this embodiment, the first connecting portion 2142 and the second connecting portion 2144 are formed to intersect, so that the first connecting portion 2142 and the second connecting portion 2144 form the connecting portion 214 in two directions, and are laid flat on the ceramic substrate 100 in two directions. In one embodiment, the first connecting portion 2142 and the second connecting portion 2144 are arranged vertically, for example, the first connecting portion 2142 is arranged parallel to the X-axis, and the second connecting portion 2144 is arranged parallel to the Y-axis. In this way, when the connecting portion 214 abuts against the ceramic substrate 100, the first connecting portion 2142 limits the shaking of the conductive heating element 200 on the X-axis, and the second connecting portion 2144 limits the shaking of the conductive heating element 200 on the Y-axis, so that the shaking amplitude of the conductive heating element 200 on the ceramic substrate 100 is further reduced, thereby further improving the connection stability between the conductive heating element 200 and the ceramic substrate 100.

[0037] In one embodiment, the first connection portion 2142 and the second connection portion 2144 are integrally formed, so that the first connection portion 2142 and the second connection portion 2144 are firmly connected, and the structure of the connection portion 214 is more compact. In other embodiments, the first connection portion 2142 and the second connection portion 2144 can also be formed separately and connected together by welding.

[0038] It is understandable that since the ceramic heating component is formed by an injection molding process, that is, the ceramic material and the conductive heating element 200 are placed together in a mold for synthesis, and are formed after high-temperature sintering, that is, the ceramic material is poured into the mold and contacts the conductive heating element 200, thereby wrapping the conductive bending portion 220 of the conductive heating element 200, and then after the high-temperature sintering is completed, the conductive heating element 200 is embedded in the ceramic matrix 100. However, when the air bubbles are not completely removed in the injection molding process, that is, when the air between the ceramic material and the conductive bending portion 220 is not completely removed, a gap is formed between the conductive bending portion 220 and the ceramic matrix 100, which easily causes the conductive bending portion 220 to loosen in the ceramic matrix 100, thereby reducing the stability between the conductive heating element 200 and the ceramic matrix 100.

[0039] In order to further improve the connection stability between the conductive heating element 200 and the ceramic substrate 100, please refer to Figure 5The embedded sub-part 222 includes a connecting piece 2222 and a stabilizing piece 2224, the connecting piece 2222 is connected to the conductive body 210, and the connecting piece 2222 is also connected to the stabilizing piece 2224, the connecting piece 2222 and the stabilizing piece 2224 are both embedded in the ceramic matrix 100, wherein the length of the stabilizing piece 2224 in a direction parallel to the conductive body 210 is greater than the length of the connecting piece 2222 in a direction parallel to the conductive body 210. In this embodiment, the stabilizing sheet 2224 is located at one end of the connecting sheet 2222 away from the conductive body 210, and the stabilizing sheet 2224 is completely embedded in the ceramic matrix 100. In addition, the length of the stabilizing sheet 2224 is different from the length of the connecting sheet 2222, so that the stabilizing sheet 2224 partially protrudes relative to the connecting sheet 2222, that is, at least one end of the stabilizing sheet 2224 protrudes from the connecting sheet 2222, that is, for the same end, the end of the stabilizing sheet 2224 exceeds the end of the connecting sheet 2222. In this way, when the lengths of the stabilizing sheet 2224 and the connecting sheet 2222 are different, a protruding structure is formed between the stabilizing sheet 2224 and the connecting sheet 2222. When the ceramic substrate 100 is squeezed by an external force and air remains between the ceramic substrate 100 and the embedded sub-portion 222, the protruding structure of the stabilizing sheet 2224 of the embedded sub-portion 222 blocks the shaking of the embedded sub-portion 222, reduces the shaking tendency of the embedded sub-portion 222, thereby reducing the shaking amplitude of the embedded sub-portion 222 and improving the connection stability between the conductive heating element 200 and the ceramic substrate 100.

[0040] For further information, see Figure 5The stabilizing sheet 2224 is provided with a stabilizing hole 2224a, and part of the ceramic substrate 100 is inserted into the stabilizing hole 2224a. In this embodiment, since the ceramic substrate 100 and the conductive heating element 200 are formed by injection molding, the ceramic material is in a fluid state during the injection molding operation. After being placed in the mold, the ceramic material in a fluid state contacts the embedded sub-portion 222 located in the mold, so that the ceramic material in a fluid state flows through the temperature increasing hole, so that the temperature increasing hole is filled with the ceramic material in a fluid state. In this way, after high-temperature sintering, the ceramic material in the fluid state gradually takes shape, that is, it is sintered into a ceramic matrix 100 with a fixed shape, so that the ceramic material in the stabilizing hole 2224a is fixed and formed, which is convenient for partially inserting the ceramic matrix 100 into the stabilizing hole 2224a, similar to inserting a ceramic rod into the stabilizing hole 2224a, and this ceramic rod is also a part of the ceramic matrix 100, so that part of the ceramic matrix 100 is stably arranged in the stabilizing hole, thereby improving the connection stability rigidity between the ceramic matrix 100 and the conductive bending portion 220, facilitating the stable embedding sub-portion 222 in the ceramic matrix 100, and further improving the connection stability between the conductive heating element 200 and the ceramic matrix 100.

[0041] For further information, see Figure 5 The stabilizing sheet 2224 is also provided with a chamfered groove 2224b, which is located at the end of the stabilizing sheet 2224, and the opening of the chamfered groove 2224b is parallel to the extension direction of the stabilizing sheet 2224. In this embodiment, the chamfered groove 2224b accommodates part of the ceramic substrate 100, that is, part of the ceramic substrate 100 is clamped in the chamfered groove 2224b, and because the stabilizing sheet 2224 is embedded in the ceramic substrate 100, the ceramic substrate 100 is also in contact with the end of the stabilizing sheet 2224, so that the stabilizing sheet 2224 and the ceramic substrate 100 are clamped. The inner wall of the chamfered groove 2224b abuts against the ceramic substrate 100, and the inner wall of the chamfered groove 2224b clamps the ceramic substrate 100, making it easier for the stabilizing plate 2224 to be clamped on the ceramic substrate 100, further improving the connection stability between the stabilizing plate 2224 and the ceramic substrate 100.

[0042] Furthermore, when the conductive heating element 200 is powered on, the heat generated by the conductive heating element 200 is used to heat the e-liquid in the atomization chamber. The power source for the conductive heating element 200 is a battery with a relatively low voltage, in order to meet its lightweight characteristics.

[0043] However, a battery with a low voltage takes a long time to achieve the effect of atomizing the e-liquid, which reduces the atomization efficiency of the ceramic heating component. In order to increase the atomization rate of the ceramic heating component, that is, to reduce the atomization time, please refer to Figure 4 , the number of the first connection part 2142 and the second connection part 2144 are both multiple, the multiple first connection parts 2142 and the multiple second connection parts 2144 are connected in sequence, and the connection part 214 also includes a third connection part 2146, and the third connection part 2146 is detachably connected to any two of the multiple first connection parts 2142 and the multiple second connection parts 2144. In this embodiment, the connection part 214 has an "S"-shaped structure, that is, each of the second connection parts 2144 is connected to two adjacent first connection parts 2142, and the third connection part 2146 connects any two connection parts, so that the third connection part 2146 detachably connects any two of the multiple first connection parts 2142 and the multiple second connection parts 2144, so that the current flowing through the conductive body 210 passes through the third connection part 2146. In this way, after the conductive heating element 200 is powered on, when the external voltage remains unchanged, the third connecting part 2146 is connected to any two of the multiple first connecting parts 2142 and the multiple second connecting parts 2144, so that the resistance of the conductive body 210 is reduced, thereby increasing the current passing through the conductive body 210, and further increasing the heat generation of the conductive heating body per unit time, making it easier for the conductive heating element 200 to quickly generate a large amount of heat, thereby increasing the atomization rate of the ceramic heating component, thereby reducing the atomization time, and further improving the atomization efficiency of the ceramic heating component.

[0044] The present application also provides an electronic atomizer, comprising a ceramic heating component described in any of the above embodiments. In this embodiment, the ceramic heating component comprises a ceramic substrate and a conductive heating element. The conductive heating element comprises a conductive body and a conductive bending portion. The conductive bending portion is connected to the conductive body, and at least part of the conductive bending portion is embedded in the ceramic substrate. The conductive body is located outside the ceramic substrate, and the conductive body is connected to the ceramic substrate. At least one of the conductive body and the conductive bending portion is used to be electrically connected to an external power supply. The conductive body of the conductive heating element is arranged on the ceramic substrate, and the conductive bending portion of the conductive heating element is embedded in the ceramic substrate, so that both sides of the conductive bending portion are in contact with the ceramic substrate, so that the conductive bending portion and the ceramic substrate are connected, thereby increasing the connection area between the conductive bending portion and the ceramic substrate, improving the connection stability between the conductive bending portion and the ceramic substrate, thereby improving the connection stability between the conductive heating element and the ceramic substrate, and reducing the probability of warping and loosening.

[0045] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A ceramic heating component, characterized in that: include: Ceramic substrate, A conductive heating element, the conductive heating element comprising a conductive body and a conductive bending portion, the conductive bending portion being connected to the conductive body, at least a portion of the conductive bending portion being embedded in the ceramic matrix, the conductive body being located outside the ceramic matrix, the conductive body being connected to the ceramic matrix, and at least one of the conductive body and the conductive bending portion being used to be electrically connected to an external power source; Among them, the conductive bending portion includes an embedded sub-portion and a bent sub-portion, the bent sub-portion is connected to the conductive body, and the bent sub-portion is also connected to the embedded sub-portion, the embedded sub-portion is embedded in the ceramic matrix, and the bent sub-portion has a bending structure so that an angle is formed between the embedded sub-portion and the conductive body; the embedded sub-portion includes a connecting piece and a stabilizing piece, the connecting piece is connected to the conductive body, and the connecting piece is also connected to the stabilizing piece, the connecting piece and the stabilizing piece are both embedded in the ceramic matrix, the length of the stabilizing piece in a direction parallel to the conductive body is greater than the length of the connecting piece in a direction parallel to the conductive body; the stabilizing piece is provided with a stabilizing hole, and part of the ceramic matrix is ​​passed through the stabilizing hole.

2. The ceramic heating component according to claim 1, characterized in that: The conductive bending portion is embedded in the ceramic matrix.

3. The ceramic heating component according to claim 1, characterized in that: The conductive bending portion is arranged perpendicular to the surface of the ceramic substrate.

4. The ceramic heating component according to claim 1, characterized in that: The surface of the ceramic substrate is arranged in contact with the conductive body.

5. The ceramic heating component according to claim 1, characterized in that: The conductive body includes a conductive part and a connecting part, the conductive part is connected to the conductive bending part, the conductive part is also connected to the connecting part, the conductive part and the connecting part are both connected to the ceramic substrate, and at least one of the conductive part and the connecting part has a curved structure.

6. The ceramic heating component according to claim 5, characterized in that: The conductive body further includes an auxiliary embedded portion, the auxiliary embedded portion is connected to the connecting portion, and the auxiliary embedded portion is embedded in the ceramic matrix, so that the connecting portion is connected to the ceramic matrix through the auxiliary embedded portion.

7. The ceramic heating component according to claim 5, characterized in that: The connecting portion includes a first connecting portion and a second connecting portion, the first connecting portion is connected to the conductive portion, the first connecting portion is also connected to the second connecting portion, and an angle is formed between the first connecting portion and the second connecting portion.

8. The ceramic heating component according to claim 7, characterized in that: The first connection portion and the second connection portion are arranged perpendicularly.

9. An electronic atomizer, characterized in that: It comprises a ceramic heating component as described in any one of claims 1 to 8.

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