Electronic cigarette sensor with retaining wall structure

Abstract

According to the electronic cigarette sensor with the partition wall structure, a partition wall, a step and a Z-shaped air inlet channel are formed in an injection molding cavity of a lead frame, the high step is provided with an air inlet channel penetrating through the high step and the bottom wall of the lead frame, the air inlet channel is in an inverted Z shape, the high step is further provided with a micro-electro-mechanical sensor, and the micro-electro-mechanical sensor is arranged on the bottom wall of the lead frame. A low step is arranged at the position, away from the high step, in the cavity, and protective nets are arranged on the upper cover and the lower cover. The lead frame is provided with a circular cavity, the height of the bottom of the circular cavity is slightly higher than that of the star-shaped bonding pad, the circular cavity is in a concave semi-wrapping state, and good sealing performance and good mounting welding performance during mounting of the formed electronic cigarette sensor are facilitated. A partition wall is further arranged in the cavity, the ASIC chip and the micro-electro-mechanical sensor are isolated through the partition wall, the micro-electro-mechanical sensor is protected from being polluted by manufacturing procedures, tobacco tar and the like, and a sealed oil-proof air channel is provided for the oil-proof cotton.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic cigarette sensors, in particular to an electronic cigarette sensor provided with a partition wall structure. Background Art

[0002] Electret structured electronic cigarette sensors currently occupy the main market share of electronic cigarettes. With the continuous development of MEMS packaging technology, MEMS packaged electronic cigarette sensors are also growing in the market. The MEMS packaging technology currently used in the market is based on the packaging structure of PCB circuit boards. Its characteristics are that the required ASIC chips and micro-electromechanical sensors are bonded on a flat circuit board, and then the MEMS packaged electronic cigarette sensors are produced by covering the outer shell. The electret sensor structure also uses the PCB circuit board as the carrier. PCB is also called printed circuit board or printed circuit board, which is very widely used. The straight-through structure of the electret electronic cigarette sensor has the main difficulty of poor oil resistance in the two main packaging forms. The air inlet and air intake holes of the electret electronic cigarette sensor are directly aligned with the diaphragm. When smoking in the electronic cigarette, the smoke enters the interior after passing through the air intake hole, and the smoke and diaphragm are in direct contact. There is no secondary oil protection structure. When smoking in the MEMS packaged electronic cigarette, smoke enters the interior and the micro-electromechanical sensor is directly contaminated by the smoke, affecting the service life and application experience of the electronic cigarette.

[0003] The above structure also has the following disadvantages:

[0004] 1. The existing MEMS packaged electronic cigarette sensor is bonded to a flat PCB board with a micro-electromechanical sensor and an ASIC chip. When bonding the micro-electromechanical sensor and the ASIC chip, it is easy to accidentally touch the micro-electromechanical sensor, damaging the micro-electromechanical sensor and causing it to fail.

[0005] 2. In existing MEMS-packaged electronic cigarette sensors, the microelectromechanical sensor and the ASIC chip are in the same plane cavity. Smoke enters the cavity through the air intake hole and can directly contaminate the microelectromechanical sensor.

[0006] 3. During the manufacturing process of existing MEMS packaged electronic cigarette sensors, the finished MEMS sensors are extremely susceptible to contamination by particulate pollutants from the ASIC process or other processes.

[0007] 4. Due to the particularity of micro-electromechanical sensors, which are nano-level devices, they need to be protected during the production process and use. The internal structure of the electret straight-through space and the existing MEMS packaging structure on the market cannot form a partition wall structure, and cannot provide a stable and reliable safety environment for protecting micro-electromechanical sensors. Utility Model Content

[0008] (1) Technical problems solved

[0009] In order to solve the above problems, the present invention provides an electronic cigarette sensor with a partition wall structure.

[0010] (2) Technical solution

[0011] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an electronic cigarette sensor with a partition wall structure, comprising a lead frame cavity, an upper cover, a micro-electromechanical sensor, oil-proof cotton and an ASIC chip, wherein a partition wall, a high step and a Z-shaped air inlet channel are generated in the cavity, and an air inlet channel passing through the high step and the bottom wall of the lead frame is provided on the high step, and the air inlet channel is in the shape of an inverted Z, and the micro-electromechanical sensor is also provided on the high step. The cavity is away from the high step as a low step, and the upper cover and the lower cover are provided with a protective net; the lead frame cavity is provided with a circular cavity, the bottom height of which is higher than the pad height, and the pad is in an inward concave state, which is conducive to good sealing and good mounting weldability of the molded electronic cigarette sensor during mounting; a partition wall is also provided on the cavity, which isolates the ASIC chip and the micro-electromechanical sensor, protects the micro-electromechanical sensor from being contaminated by the process, smoke oil, etc., and provides a sealed oil-proof air channel for the oil-proof cotton.

[0012] The partition wall provides a barrier for the oil-proof cotton, forming a closed oil-proof space filled with oil-proof cotton.

[0013] The partition wall is a half-open door-shaped structure.

[0014] The partition wall is injection molded, and its height is matched with the height of the upper cover step.

[0015] (3) Beneficial effects

[0016] Compared with the prior art, the present invention provides an electronic cigarette sensor with a barrier wall structure, which has the following beneficial effects:

[0017] 1. A partition wall is generated in the circular cavity structure to avoid the risk of residual glue contamination during ASIC filling and encapsulation and the risk of damage to the MEMS sensor due to movement of process components, ensuring high performance and high quality output of the MEMS sensor;

[0018] 2. A barrier wall is generated in the circular cavity structure, which helps to isolate the risk of oil-proof cotton damaging the micro-electromechanical sensor. It is also conducive to the formation of a sealed oil-proof airway between the oil-proof cotton and the barrier wall, thereby improving the overall oil-proof performance of the electronic cigarette sensor.

[0019] 3. Since the solder pad is concave and lower than the plastic cavity, a sealed airway environment is formed around the air inlet at the bottom of the electronic cigarette sensor after the patch, ensuring the stable output of the electronic cigarette sensor and the consistency of the starting negative pressure;

[0020] 4. The shape generated in the mold by high-temperature heating of injection molding will not cause abnormal phenomena such as falling off and debris, which will lead to poor welding of the pad;

[0021] 5. The partition wall of the semi-open door structure is to facilitate the connection of the electrical circuit of the micro-electromechanical sensor and to form an internal airway for smoking;

[0022] 6. The raw material and production processing costs are lower than those of existing electret PCB circuit boards.

[0023] 7. A partition wall is provided to optimize the pollution of traditional sealants on MEMS sensors and fix the position of oil-proof cotton, reduce the contamination inside the MEMS sensor chip cavity, and improve the service life and user experience of the electronic cigarette sensor of this packaging structure;

[0024] 8. The MEMS package with a partition wall protects the nano-level micro-electromechanical sensor, making the quality of the produced products more reliable and stable.

[0025] 9. The MEMS package with a partition wall structure has high production efficiency and low production and processing costs, as the device processing is not affected, which greatly reduces the cost investment of back-end production. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the structural cross section of the utility model;

[0027] Figure 2 This is a schematic top view of the structure of the present utility model;

[0028] Figure 3 This is a bottom view schematic diagram of the structure of the present utility model;

[0029] Figure 4 The structure of the utility model is viewed from above Figure 2 .

[0030] In the figure: 1. Cavity; 2. Upper cover; 3. MEMS sensor; 4. ASIC chip; 5. High step; 6. Air intake channel; 7. Partition wall; 8. Sealant; 9. Protective net; 10. Air intake hole; 11. Oil-proof cotton; 12. Solder pad. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] See also Figure 1-4 , an electronic cigarette sensor with a partition wall structure, comprising a lead frame cavity 1, an upper cover 2, a micro-electromechanical sensor 3, oil-proof cotton and an ASIC chip 4, a partition wall 7, a high step 5, and a Z-shaped air inlet channel 6 are generated in the cavity, the high step is provided with an air inlet channel that passes through the high step and the bottom wall of the lead frame, the air inlet channel is in an inverted Z shape, the high step is also provided with the micro-electromechanical sensor, the cavity away from the high step is a low step, and the upper cover and the lower cover are provided with a protective net; the lead frame cavity 1 is provided with a circular cavity, the bottom height of which is higher than the height of the pad 12, and the pad is in an inward concave state, which is conducive to good sealing and good mounting weldability of the molded electronic cigarette sensor; a partition wall is also provided on the cavity, which isolates the ASIC chip and the micro-electromechanical sensor, protects the micro-electromechanical sensor from being contaminated by the process, smoke oil, etc., and provides a sealed oil-proof air channel for the oil-proof cotton.

[0033] The partition wall 7 provides a barrier for the oil-proof cotton, forming a closed oil-proof space filled with oil-proof cotton.

[0034] The partition wall 7 is in the shape of a half-open door.

[0035] The partition wall 7 is injection molded, and its height is adapted to the height of the upper cover step.

[0036] There is oil-proof cotton between the baffle wall 7 and the colloid on the upper part of the ASIC chip 4.

[0037] The micro-electromechanical sensor 3 is fixed on the high step 5 , and the ASIC chip 4 is fixed on the low step.

[0038] The packaging form of electronic cigarette sensors is constantly updated. The electronic cigarette sensor of this utility model uses the lead frame as the carrier to replace the traditional PCB board, and encapsulates the original production process form on the lead frame. The lead frame is the basic material of semiconductor packaging and the chip carrier of the integrated circuit. With the help of bonding materials, the electrical connection between the internal circuit lead end of the chip and the external lead is realized, forming a key structural component of the electrical circuit and acting as a bridge for connecting with external wires. The main functions are circuit connection, heat dissipation, mechanical support, sealing, etc. The lead frame processing flow includes: stamping, stretching, electroplating, plastic injection molding and other processes. Stamping is an important link in the lead frame production process. The metal material is processed into the required geometric shape and size through stamping equipment. First, the required metal circuit is punched out of the copper sheet, and then stretched and bent to a certain height platform to form low steps, high steps and other pads. Then, a specially designed stamping die and process are used to reversely stretch and bend the high step to the low step. After this process, all functional pads are formed, and the reverse stretching pads make Using a unique design and reverse stretching method, this technology fills a gap in the current market for package bracket technology. Electroplating forms a thin metal film on the surface of the lead frame to improve its conductivity and corrosion resistance. To ensure the surface quality and performance of the finished product, the electroplating process utilizes the principle of electrolysis to plate a thin layer of other metals or alloys on the surface of the metal circuit. This process uses electrolysis to adhere a metal film to the surface of the metal circuit, thereby preventing metal oxidation, improving wear resistance, conductivity, and corrosion resistance, and protecting the metal circuit from oxidation. Finally, the plastic package bracket is formed by injection molding. The molding process mainly includes four stages: filling - holding pressure - cooling - and demolding. These four stages directly determine the molding quality of the product, and these four stages are a complete and continuous process. The lead frame structure is equipped with a molding, including high and low fixed platforms and a barrier wall 7. The high platform 5 fixes the microelectromechanical sensor 3, and the low platform fixes the ASIC chip 4. The barrier wall 7 blocks the sealing colloid 8 and fixes the oil-proof cotton 11, providing an independent and highly sealed environment for the microelectromechanical sensor 3.

[0039] Compared with existing packaging technologies, the present invention provides an electronic cigarette sensor with a barrier wall structure, which has the following beneficial effects:

[0040] 1. A partition wall is generated in the circular cavity structure to avoid the risk of residual glue contamination during ASIC filling and encapsulation and the risk of damage to the MEMS sensor due to movement of process components, ensuring high performance and high quality output of the MEMS sensor;

[0041] 2. A barrier wall is generated in the circular cavity structure, which helps to isolate the risk of oil-proof cotton damaging the micro-electromechanical sensor. It is also conducive to the formation of a sealed oil-proof airway between the oil-proof cotton and the barrier wall, thereby improving the overall oil-proof performance of the electronic cigarette sensor.

[0042] 3. Since the solder pad is concave and lower than the plastic cavity, a sealed airway environment is formed around the air inlet at the bottom of the electronic cigarette sensor after the patch, ensuring the stable output of the electronic cigarette sensor and the consistency of the starting negative pressure;

[0043] 4. The shape generated in the mold by high-temperature heating of injection molding will not cause abnormal phenomena such as falling off and debris, which will lead to poor welding of the pad;

[0044] 5. The partition wall of the semi-open door structure is to facilitate the connection of the electrical circuit of the micro-electromechanical sensor and to form an internal airway for smoking;

[0045] 6. The raw material and production processing costs are lower than those of existing electret PCB circuit boards.

[0046] 7. A partition wall is provided to optimize the pollution of traditional sealants on MEMS sensors and fix the position of oil-proof cotton, reduce the contamination inside the MEMS sensor chip cavity, and improve the service life and user experience of the electronic cigarette sensor of this packaging structure;

[0047] 8. The MEMS package with a partition wall protects the nano-level micro-electromechanical sensor, making the quality of the produced products more reliable and stable.

[0048] 9. The MEMS package with a partition wall structure has high production efficiency and low production and processing costs, as the device processing is not affected, which greatly reduces the cost investment of back-end production.

[0049] In order to explain in detail the possible application scenarios, technical principles, specific solutions that can be implemented, and the purpose and effects of this application, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of this application and are therefore only examples and are not intended to limit the scope of protection of this application.

[0050] References to "embodiments" herein mean that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the word "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the various technical features mentioned in the embodiments can be combined in any manner to form a corresponding implementable technical solution.

[0051] Unless otherwise defined, the technical terms used herein have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms herein is only for describing specific embodiments and is not intended to limit this application.

[0052] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents. The above embodiments only express several preferred embodiments of the present invention, and their descriptions are relatively specific and detailed. It should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. Instead, it can be used in various other combinations, modifications, and environments and can be modified within the scope of the present invention through the above teachings or the technology or knowledge in the relevant field. It should not be construed as limiting the scope of the present invention. It should be pointed out that it is possible for those skilled in the art to make various variations and improvements without departing from the spirit and scope of the present invention. The changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention and are within the scope of protection of the appended claims. Therefore, the scope of protection of the present utility model patent shall be based on the appended claims.

Claims

1. An electronic cigarette sensor with a partition wall structure, characterized in that: The invention comprises a lead frame cavity (1), an upper cover (2), a micro-electromechanical sensor (3), oil-proof cotton and an ASIC chip (4); a partition wall (7), a high step (5) and a Z-shaped air inlet channel (6) are formed in the cavity; an air inlet channel penetrating the high step and the bottom wall of the lead frame is provided on the high step, and the air inlet channel is in an inverted Z shape; the micro-electromechanical sensor is also provided on the high step; a low step is provided in the cavity away from the high step; and a protective net is provided on the upper cover and the lower cover; the lead frame cavity (1) is provided with a circular cavity, the bottom height of which is higher than the height of the solder pad (12), and the solder pad is in a concave state; the partition wall isolates the ASIC chip and the micro-electromechanical sensor.

2. The electronic cigarette sensor with a barrier wall structure according to claim 1, characterized in that: The partition wall (7) provides a barrier for the oil-proof cotton, forming a closed oil-proof space filled with oil-proof cotton.

3. The electronic cigarette sensor with a barrier wall structure according to claim 2, characterized in that: The partition wall (7) is a half-open door-shaped structure.

4. The electronic cigarette sensor with a barrier wall structure according to claim 3, characterized in that: The partition wall (7) is injection-molded, and its height is adapted to the height of the upper cover step.

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