Panel backplane and display having the same

Abstract

The present invention relates to a panel backplane and a display including the same. The panel backplane includes a first heat dissipation layer, a second heat dissipation layer having a circumferential side located more inward than a circumferential side of the first heat dissipation layer in a plan view, the second heat dissipation layer including a main heat dissipation pattern including a first opening formed to pass through the second heat dissipation layer entirely in a thickness direction, and a heat dissipation substrate disposed directly on the second heat dissipation layer.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2019-0094504, filed on August 2, 2019, the contents of which are incorporated herein by reference in their entirety for all purposes. Technical Field

[0003] Exemplary embodiments / implementations of the present invention generally relate to a panel base plate and a display including therewith. Background Technology

[0004] Organic light-emitting displays (OLEDs) possess excellent properties such as brightness, driving voltage, and response speed, as well as multicolor capabilities, and have been applied in a variety of products, including smartphones. OLEDs include display panels with organic light-emitting diodes (OLEDs). An OLED has a cathode electrode and an anode electrode, with an organic emitting layer connecting the anode and cathode electrodes between them. When a voltage is applied to both the anode and cathode electrodes, the organic emitting layer generates visible light.

[0005] Organic light-emitting diode (OLED) displays are commonly used in portable electronic devices such as smartphones and may be exposed to external impacts. Furthermore, there is a risk that excessive heat generated in the OLED or the driver chip that drives it could damage the OLED. To protect the OLED from such risks, a functional board with functions including heat dissipation and shock absorption is attached to the bottom surface of the display panel.

[0006] The information disclosed in this background section is only for understanding the background of the inventive concept, and therefore this background section may contain information that does not constitute prior art. Summary of the Invention

[0007] The device constructed according to an exemplary embodiment of the present invention can provide a panel substrate with improved efficiency and reduced manufacturing process costs, and a display having the panel substrate.

[0008] Further features of the inventive concept will be set forth in the following description and will become apparent in part from the description, or may be learned by practice of the inventive concept.

[0009] According to one or more exemplary embodiments of the present invention, a panel base plate includes: a first heat dissipation layer; a second heat dissipation layer, the circumferential side of which is located further inside the circumferential side of the first heat dissipation layer in a plan view, the second heat dissipation layer including: a main heat dissipation pattern including a first opening formed to completely penetrate the second heat dissipation layer in the thickness direction; and a heat dissipation substrate disposed directly on the second heat dissipation layer.

[0010] The heat dissipation substrate can directly contact the circumferential side of the second heat dissipation layer.

[0011] The panel base plate may also include a first coupling interlayer, which is disposed between the first heat dissipation layer and the second heat dissipation layer, wherein at least a portion of the top surface of the first coupling interlayer can be exposed through the second heat dissipation layer, and the exposed top surface of the first coupling interlayer directly contacts the heat dissipation substrate.

[0012] The first opening may include a through-hole that is completely surrounded by the second heat dissipation layer in the plan view.

[0013] The heat dissipation substrate can be placed in the first opening of the second heat dissipation layer, directly contacting the inner wall of the first opening.

[0014] The first coupling interlayer can be disposed in the first opening of the second heat dissipation layer, directly contacting the inner wall of the first opening.

[0015] The second heat dissipation layer may further include a plurality of sub-heat dissipation patterns spaced apart from the main heat dissipation pattern and having a linear shape extending in one direction. The second heat dissipation layer may also include a plurality of second openings formed to completely penetrate the second heat dissipation layer in the thickness direction, and the plurality of such second openings may be arranged in a plan view between the sub-heat dissipation patterns and between the main heat dissipation pattern and the sub-heat dissipation patterns.

[0016] The heat dissipation substrate may include polyamide-imide.

[0017] The first heat dissipation layer may include at least one of copper and silver, and the second heat dissipation layer may include at least one of graphite and carbon nanotubes.

[0018] The panel base plate may further include: a bottom coupling member disposed below the first heat dissipation layer; and a heat dissipation coating disposed between the bottom coupling member and the first heat dissipation layer.

[0019] Thermal coatings can include metal oxide materials.

[0020] The panel base plate may also include a digital converter mounted on a heat sink substrate.

[0021] According to one or more exemplary embodiments of the present invention, a display includes: a display panel; and a panel base plate disposed below the display panel, the panel base plate including: a first heat dissipation layer; a second heat dissipation layer, the circumferential side of which is located further inward than the circumferential side of the first heat dissipation layer in a plan view; a heat dissipation substrate disposed directly on the second heat dissipation layer; a bottom coupling member disposed below the first heat dissipation layer; and a heat dissipation coating disposed between the bottom coupling member and the first heat dissipation layer.

[0022] Thermal coatings can include metal oxide materials.

[0023] The panel base plate may also include a buffer member disposed between the heat dissipation substrate and the display panel, the buffer member being in direct contact with the heat dissipation substrate, and wherein the buffer member has a thickness of 120μm to 170μm.

[0024] The display may include: a flat area; and a curved area located around the periphery of the flat area. The display panel and the panel base may overlap with the flat area and the curved area.

[0025] The second heat dissipation layer may overlap with a portion of the bent region and the flat region, and the first heat dissipation layer may overlap with the entire surface of the bent region and the flat region.

[0026] The second heat dissipation layer may include a main heat dissipation pattern, which includes a first opening formed to completely penetrate the second heat dissipation layer in the thickness direction, and the main heat dissipation pattern may be located in a flat area.

[0027] The first opening may include a through-hole that is completely surrounded by the second heat dissipation layer in the plan view.

[0028] The heat dissipation substrate can be placed in the first opening of the second heat dissipation layer, directly contacting the inner wall of the first opening.

[0029] The second heat dissipation layer may further include a plurality of sub-heat dissipation patterns spaced apart from the main heat dissipation pattern and having a linear shape extending in one direction. The second heat dissipation layer may also include a plurality of second openings formed to completely penetrate the second heat dissipation layer in the thickness direction, and the plurality of such second openings may be arranged in a plan view between the sub-heat dissipation patterns and between the main heat dissipation pattern and the sub-heat dissipation patterns.

[0030] Sub-heat dissipation patterns can be located in the bent areas.

[0031] According to one or more exemplary embodiments of the present invention, a display includes: a display panel; and a panel base plate disposed below the display panel, the panel base plate including: a first heat dissipation layer; a second heat dissipation layer having a side surface located further inward than the side surface of the first heat dissipation layer; a heat dissipation substrate disposed directly on the second heat dissipation layer; and a buffer member disposed between the heat dissipation substrate and the display panel, the buffer member having a thickness of 120 μm to 170 μm.

[0032] It will be understood that both the general description above and the detailed description below are exemplary and illustrative, intended to provide further explanation of the claimed invention. Attached Figure Description

[0033] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the invention and, together with the following description, serve to illustrate the concept of the invention.

[0034] Figure 1 This is an exploded perspective view of a display according to an exemplary embodiment.

[0035] Figure 2 It is along Figure 1 The sectional view taken by section line II-II'.

[0036] Figure 3 This is a schematic cross-sectional view of the panel base plate according to an exemplary embodiment.

[0037] Figure 4 This is a detailed cross-sectional view of the panel base plate according to an exemplary embodiment.

[0038] Figure 5 This is a plan view of the arrangement of heat dissipation components according to an exemplary embodiment.

[0039] Figure 6 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0040] Figure 7 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0041] Figure 8 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0042] Figure 9 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0043] Figure 10 This is a plan view of the arrangement of heat dissipation components according to other exemplary embodiments.

[0044] Figure 11 It is along Figure 10 The sectional view taken by the section line X-X'.

[0045] Figure 12 This is a cross-sectional view of a bent heat dissipation member according to other exemplary embodiments.

[0046] Figure 13 This is a plan view of the arrangement of heat dissipation components according to other exemplary embodiments.

[0047] Figure 14 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0048] Figure 15 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0049] Figure 16 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0050] Figure 17 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0051] Figure 18 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0052] Figure 19 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments. Detailed Implementation

[0053] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of apparatuses or methods employing one or more inventive concepts disclosed herein. However, it will be apparent that exemplary embodiments may be practiced without these specific details or using one or more equivalent configurations. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the exemplary embodiments. Furthermore, the exemplary embodiments may differ but are not necessarily exclusive. For example, the specific shape, construction, and characteristics of one exemplary embodiment may be used or implemented in other exemplary embodiments without departing from the inventive concept.

[0054] Unless otherwise stated, the exemplary embodiments presented should be understood as exemplary features providing details of variations in some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0055] The use of shading and / or textures in the accompanying drawings is generally used to clarify the boundaries between adjacent elements. Therefore, unless otherwise stated, the presence or absence of shading or textures does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonalities between the elements shown, and / or any other characteristics, properties, or characteristics of the elements. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be enlarged for clarity and / or descriptive purposes. When exemplary embodiments can be implemented in different ways, a specific order of processes may be performed that differs from the order described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Moreover, the same reference numerals denote the same elements.

[0056] When an element or layer is referred to as being “on”, “connected to”, or “coupled to” another element or layer, the element may be directly on, directly connected to, or directly coupled to the other element or layer, or an intervening element or layer may be present. However, when an element is referred to as being “directly” on, directly connected to, or directly coupled to another element or layer, no intervening element or layer is present. Therefore, the term “connection” can refer to a physical, electrical, and / or fluid connection with or without an intervening element. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0057] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0058] Spatial relation terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., in “sidewall”) are used herein for descriptive purposes and thereby describe the relationship of one element to other elements as shown in the figures. In addition to the orientations shown in the figures, these spatial relation terms are also intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would subsequently be oriented “above” other elements or features. Thus, the exemplary term “below” can cover both the orientations above and below. Furthermore, the device can be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and therefore, the spatial relation descriptive terms used herein should be interpreted accordingly.

[0059] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context clearly indicates otherwise. Furthermore, when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “approximately,” and other similar terms are used as approximations rather than as terms of degree, and are therefore used to account for inherent deviations in the measured, calculated, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0060] This document describes various exemplary embodiments with reference to schematic cross-sectional and / or exploded views, which are intended as ideal exemplary implementations and / or intermediate structures. Therefore, variations relative to the illustrated shapes due to, for example, manufacturing techniques and / or tolerances will be anticipated. Consequently, the exemplary embodiments disclosed herein are not necessarily to be construed as limited to the specific shapes shown for the regions, but should include deviations in shape due to, for example, manufacturing processes. In this way, the regions shown in the figures may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0061] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Unless expressly defined herein, terms as defined in commonly used dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense.

[0062] The advantages and features of this disclosure, as well as methods of implementing it, will become apparent from the accompanying drawings and the embodiments described in detail below. However, this disclosure is not limited to the exemplary embodiments described below and can be implemented with many different modifications. The exemplary embodiments are provided only to enable those skilled in the art to fully understand the scope of this disclosure, and this disclosure is limited only by the scope of the appended claims.

[0063] In the following description, embodiments will be described with reference to the accompanying drawings.

[0064] Figure 1 This is an exploded perspective view of a display according to an exemplary embodiment. Figure 2 It is along Figure 1 The sectional view taken by section line II-II'.

[0065] Reference Figure 1 and Figure 2 The display 600 includes a display panel 200 and a panel bottom sheet 100 disposed below the display panel 200. The display 600 may also include a window 400 disposed above the display panel 200. In this specification, unless otherwise specified, "above," "top," and "top surface" refer to the display surface side based on the display panel 200, while "below," "bottom," and "bottom surface" refer to the opposite side based on the display surface of the display panel 200.

[0066] The display 600 can have a rectangular shape in a plan view. The display 600 can include two long sides and two short sides. The angle where the long and short sides of the display 600 intersect each other can be a right angle, but it can also form a shape like... Figure 1 The bent surface is shown in the figure. The planar shape of the display 600 is not limited to this, and circular or other shapes may also be applied to the display 600.

[0067] Display panel 200 is a panel for displaying images, and for example, an organic light-emitting display panel can be applied to display panel 200. Although the following embodiment illustrates a display panel 200 using an organic light-emitting display panel, other types of display panels, such as liquid crystal displays and electrophoretic image displays, can also be applied to display panel 200.

[0068] The display panel 200 includes a plurality of organic light-emitting diodes (OLEDs) arranged on a substrate. The substrate can be a rigid substrate formed of glass or the like, or a flexible substrate formed of polyimide or the like. When a polyimide substrate is used as the substrate, the display panel 200 can be bent, folded, rolled, or bent.

[0069] A window 400 is disposed above the display panel 200. The window 400 is disposed above the display panel 200 to protect the display panel 200 while transmitting light emitted from the display panel 200. The window 400 may be formed of glass or the like.

[0070] Window 400 can be configured to overlap with display panel 200 to cover the entire surface of display panel 200. Window 400 can be larger than display panel 200. For example, window 400 can protrude further outward at the two short sides of display 600 than display panel 200.

[0071] In one exemplary embodiment, a touch member 300 may be disposed between the display panel 200 and the window 400. The touch member 300 may be a plate-type touch member or a film-type touch member. The touch member 300 may have a size substantially equal to that of the display panel 200 and overlap with the display panel 200 such that the circumferential side surface of the touch member 300 and the circumferential side surface of the display panel 200 can be aligned, but is not limited thereto. The display panel 200 may be coupled to the touch member 300 via transparent coupling layers 520 and 530, such as optically clear adhesive (OCA), optically clear resin (OCR), etc., and the touch member 300 may be coupled to the window 400. The touch member 300 may be omitted. In this case, the display panel 200 and the window 400 may be coupled to each other via OCA, OCR, etc. In some embodiments, the display panel 200 may include touch electrode portions therein.

[0072] A panel base plate 100 is disposed below the display panel 200. A panel sheet coupling layer 510 may be disposed between the panel base plate 100 and the display panel 200. The panel base plate 100 can be attached to the bottom of the display panel 200 via the panel sheet coupling layer 510. In this exemplary embodiment, the panel sheet coupling layer 510 is configured as an additional member separate from the panel base plate 100. However, the panel sheet coupling layer 510 may also be included as a top coupling layer in the panel base plate 100. The material of the panel sheet coupling layer 510 may be selected from the exemplary materials of the first coupling layer 22 and the second coupling layer 23, which will be described below.

[0073] The panel base plate 100 may have a size substantially equal to that of the display panel 200 and overlap with the display panel 200, such that the circumferential sides of the panel base plate 100 and the circumferential sides of the display panel 200 can be aligned, but is not limited thereto. The panel base plate 100 may perform functions such as heat dissipation, electromagnetic wave blocking, grounding, buffering, reinforcement, support, and digital conversion. The panel base plate 100 will be described in detail below.

[0074] In one exemplary embodiment, the display 600 may include a flat region FA and a bent region BA, the bent region BA being connected to the flat region FA and located on the outer periphery of the flat region FA. The flat region FA is typically located in a plane. The bent region BA is not located in the same plane as the flat region FA. For example, the bent region BA may bend or flex downwards from the plane containing the flat region FA.

[0075] In one exemplary embodiment, the bending region BA may include a curved surface that bends outward in a projecting manner. In other exemplary embodiments, the bending region BA may have a flat surface located in a plane in which the flat surface of the bending region BA intersects with the flat surface of the flat region FA at a specific angle.

[0076] The bending area BA can be located on either of the two long sides or one long side of the rectangular display 600. Although not shown in the figure, the short side of the display 600 can also be bent.

[0077] The display panel 200, touch component 300, window 400, and panel base plate 100 can all be located in the flat area FA and the curved area BA.

[0078] Unlike the diagram shown, the display may be a flat display, including only the flat areas and excluding the bent areas. Except for the content particularly relevant to bent areas, the contents disclosed in this specification apply not only to bent displays but also to flat displays.

[0079] The panel base plate 100 described above will be described in detail below.

[0080] Figure 3 This is a schematic cross-sectional view of the panel base plate according to an exemplary embodiment. Figure 4 This is a detailed cross-sectional view of the panel base plate according to an exemplary embodiment. Figure 5 This is a plan view of the arrangement of heat dissipation components according to an exemplary embodiment.

[0081] exist Figure 3 , Figure 4 and Figure 5 For ease of description, a generally flat panel base is shown. When the flat panel base is attached to the bent display panel 200, they can be bent together. In this case, the area to be divided into a flat area FA and a bent area BA is shown as... Figure 3 , Figure 4 and Figure 5 The dashed lines in the diagram are used to divide the space.

[0082] Reference Figure 3 , Figure 4and Figure 5 The panel base plate 100 includes a main board 10, a bottom coupling member 20, and a release membrane 30.

[0083] The motherboard 10 includes at least one functional layer. The functional layer can perform functions such as heat dissipation, electromagnetic wave blocking, grounding, buffering, reinforcement, support, and digital conversion. The functional layer can be a board layer formed from a board, a film layer formed from a film, a thin film layer, a coating, a panel, a flat panel, etc. A functional layer can be formed as a single layer, or it can be formed from multiple stacked thin films or coatings. The functional layer can be, for example, a component, a heat dissipation layer, an electromagnetic wave blocking layer, a shock absorption layer, a digital converter, etc.

[0084] The motherboard 10 may include multiple functional layers and coupling mezzanines coupling the multiple functional layers. The functional layers may be arranged to overlap. Adjacent functional layers may be coupled via coupling mezzanines. The functional layers and coupling mezzanines may have the same dimensions in a plan view, but are not limited to this, and some or all of the layers may have different dimensions. Furthermore, any of the functional layers and coupling mezzanines may protrude relative to the other layers in a particular direction or in all directions. The external planar shape of the motherboard 10 may be defined by the largest protrusion in the connected stacked functional layers and coupling mezzanines. The detailed arrangement of the functional layers and coupling mezzanines will be described below.

[0085] The bottom coupling member 20 is disposed on the bottom surface of the motherboard 10. The bottom surface of the motherboard 10 may be formed by a single layer, or it may be formed by several layers. For example, when the bottommost layer is smaller than the layer above it, such that a portion of the layer above it is exposed downwards, the bottom surface of the motherboard 10 may include the bottom surface of the bottommost layer and the exposed bottom surface of the layer above it.

[0086] The bottom coupling member 20 is covered and protected by the release membrane 30. However, during assembly, the release membrane 30 can be separated and the surface of the bottom coupling member 20, i.e., the bottom surface, can be exposed. The assembly bracket (not shown) can be attached to the exposed surface (bottom surface) of the bottom coupling member 20.

[0087] In one exemplary embodiment, the bottom coupling member 20 may be made of, for example Figure 3 and Figure 4The double-sided tape shown is formed. The double-sided tape includes a component 21, a first coupling layer 22 disposed on the bottom surface of the component 21, and a second coupling layer 23 disposed on the top surface of the component 21. The component 21 may include polyethylene terephthalate (PET), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cyclic olefin polymer (COP), etc.

[0088] The first coupling layer 22 and the second coupling layer 23 may include an adhesive layer, an adhesive layer, or a resin layer. For example, the first coupling layer 22 and the second coupling layer 23 may include polymer materials classified as siloxane-based polymers, urethane-based polymers, SU polymers including siloxane-urethane mixed structures, acryloyl polymers, starch-based polymers, polyvinyl alcohol-based polymers, gelatin-based polymers, vinyl polymers, latex-based polymers, polyester-based polymers, waterborne polyester-based polymers, etc.

[0089] In other exemplary embodiments, the bottom coupling member 20 may include a single adhesive layer or bonding layer. For example, the bottom coupling member 20 may be formed as a single coating made of the same or similar material as the first coupling layer 22 and the second coupling layer 23.

[0090] The bottom coupling member 20 is disposed on a portion of the bottom surface of the motherboard 10 and exposes the other portions of the bottom surface of the motherboard 10. Because the bottom coupling member 20 has a specific thickness, a step appears between the area where the bottom coupling member 20 is located and the area where the bottom coupling member 20 is not located.

[0091] The bottom surface of the motherboard 10 can be divided into a covered area where the bottom coupling member 20 is disposed and an exposed area where the bottom coupling member 20 is not disposed. In an exemplary embodiment, the bottom coupling member 20 may be smaller than the motherboard 10. The bottom coupling member 20 may be disposed on the central portion of the bottom surface of the motherboard 10 and may expose the edge portion of the motherboard 10. In this case, the central portion of the bottom surface of the motherboard 10 becomes the covered area, and the peripheral portions adjacent to each edge of the bottom surface of the motherboard 10, i.e., the edge portions, become the exposed areas.

[0092] When the panel base plate 100 is attached to the bent display panel 200, the covered area can be located within the flat area FA and may not overlap with the bent area BA. The exposed area located on the long side may completely overlap with the bent area BA in the width direction and may extend additionally into a portion of the flat area FA.

[0093] A release membrane 30 is disposed on the bottom surface of the bottom coupling member 20. The release membrane 30 protects the bottom surface of the bottom coupling member 20. The release membrane 30 may contact but not fully attach to the bottom coupling member 20 so as to be peeled off during subsequent processing. The release membrane 30 may include PET, PC, PI, paper, etc. To increase the release force of the release membrane 30, the top surface of the release membrane 30 may be treated with a silicone resin liquid or coated with a release layer including a siloxane resin, but is not limited thereto.

[0094] The release film 30 can cover the entire bottom coupling member 20, including areas where the bottom coupling member 20 is not present. That is, the release film 30 can overlap with the coverage area of ​​the bottom surface of the motherboard 10 and can additionally overlap with the exposed area of ​​the bottom surface of the motherboard 10. In one exemplary embodiment, the release film 30 can completely cover the bottom surface of the motherboard 10.

[0095] The release membrane 30 may include a protrusion that does not overlap with the bottom surface of the motherboard 10. This protrusion may protrude outward from one side surface of the motherboard 10. When the protrusion protrudes from the motherboard 10, it becomes easy to selectively clamp only the release membrane 30 from the panel base plate 100 by hand, tool, etc. Therefore, it becomes easy to remove the release membrane 30 during the process of attaching the whole machine bracket to the bottom coupling member 20.

[0096] like Figure 4 As shown, the motherboard 10 may include a heat dissipation member 40 disposed on the bottom coupling member 20 and a buffer member 50 disposed on the heat dissipation member 40. The heat dissipation member 40 may include a first heat dissipation layer 41 disposed on the bottom coupling member 20 and coupled to the second coupling layer 23 of the bottom coupling member 20, a second heat dissipation layer 45 disposed on the first heat dissipation layer 41, and a heat dissipation substrate 47 disposed on the second heat dissipation layer 45. The heat dissipation member 40 may also include a heat dissipation coupling interlayer 43 disposed between the first heat dissipation layer 41 and the second heat dissipation layer 45 and coupling the first heat dissipation layer 41 and the second heat dissipation layer 45. In other words, the first heat dissipation layer 41 and the second heat dissipation layer 45 can be coupled to each other through the heat dissipation coupling interlayer 43.

[0097] The heat dissipation coupling interlayer 43 may include at least one of the exemplary materials of the first coupling layer 22 of the bottom coupling member 20 described above.

[0098] The first heat dissipation layer 41 is located at the bottommost part of the motherboard 10, and the bottom surface of the first heat dissipation layer 41 forms the bottom surface of the motherboard 10. The heat dissipation coupling layer 43 can be disposed on the top surface of the first heat dissipation layer 41, the second heat dissipation layer 45 can be disposed on the top surface of the heat dissipation coupling layer 43, and the heat dissipation substrate 47 can be disposed on the top surface of the second heat dissipation layer 45.

[0099] The first heat dissipation layer 41 may include metal foil such as copper or silver. The second heat dissipation layer 45 may include graphite, carbon nanotubes, etc. Although not shown in the figure, the first heat dissipation layer 41 and the second heat dissipation layer 45 can prevent or suppress heat generated by multiple components such as application chips, camera devices, or battery components disposed below the panel base plate 100 from reaching the display panel 200.

[0100] The first heat dissipation layer 41 can be disposed on the covered area and the exposed area. The first heat dissipation layer 41 can be disposed in the flat area FA and the bent area BA.

[0101] The second heat dissipation layer 45 may be partially disposed on the exposed area or on the covered area. The second heat dissipation layer 45 may be disposed in the flat area FA or in a portion of the bent area BA. In some embodiments, the second heat dissipation layer 45 may not be disposed in the bent area BA. The circumferential side of the second heat dissipation layer 45 may be located further outward than the circumferential side of the bottom coupling member 20, but is not limited thereto. The second heat dissipation layer 45 may expose the edge portion of the heat dissipation coupling interlayer 43.

[0102] The second heat dissipation layer 45 includes a first opening OP1. The first opening OP1 may be configured to overlap with a flat area FA of the display 600. Multiple such first openings OP1 may be provided. Although only three first openings OP1 are shown in the figure, the present disclosure is not limited thereto and two or four first openings OP1 may be provided.

[0103] The first opening OP1 may traverse the second heat dissipation layer 45 from its top surface (surface) in the thickness direction. The first opening OP1 may include a through-hole that completely penetrates the second heat dissipation layer 45 from its surface in the thickness direction. The second heat dissipation layer 45 includes the through-hole to facilitate pre-prevention or suppression of peeling from the heat dissipation coupling interlayer 43.

[0104] Reference Figure 5 The planar dimensions of the second heat dissipation layer 45 may be smaller than the planar dimensions of the first heat dissipation layer 41, the heat dissipation coupling interlayer 43, and the heat dissipation substrate 47. For example, the planar dimensions of the second heat dissipation layer 45 are not limited to this, but may be about 60% to about 70% of the planar dimensions of the first heat dissipation layer 41.

[0105] Multiple first openings OP1 can be arranged in multiple matrix directions. The multiple first openings OP1 can be arranged at predetermined intervals. However, this disclosure is not limited to this, but four first openings OP1 can be arranged along the long side (column direction) of the second heat dissipation layer 45, and three first openings OP1 can be arranged along the short side (row direction) of the second heat dissipation layer 45. However, this disclosure is not limited to this, and the multiple first openings OP1 can be arranged in a zigzag pattern along the long or short side of the second heat dissipation layer 45, or they can be arranged randomly.

[0106] The second heat dissipation layer 45 according to an exemplary embodiment may include graphite. Graphite can be reduced by coating a release film such as PET with a graphene oxide dressing and increasing the temperature. The reduced graphite can be crystallized, and the release film can be removed from the crystallized graphite, allowing the graphite to be stacked on the heat dissipation coupling interlayer 43.

[0107] The second heat dissipation layer 45 according to the exemplary embodiment can be formed not by carbonization of organic insulating materials such as PI, but by coating, reducing, crystallizing and stacking graphene oxide dressings as described above, in order to reduce costs.

[0108] The heat dissipation substrate 47 disposed on the second heat dissipation layer 45 can be disposed in the flat region FA and the bent region BA. The heat dissipation substrate 47 can be directly disposed on the second heat dissipation layer 45. Furthermore, the heat dissipation substrate 47 can contact the top surface of the heat dissipation coupling interlayer 43 exposed through the second heat dissipation layer 45. The heat dissipation substrate 47 can contact the exposed circumferential side surfaces of the second heat dissipation layer 45.

[0109] The heat dissipation substrate 47 can be formed by directly coating it onto the second heat dissipation layer 45. For example, the heat dissipation substrate 47 may include a polyamide-imide compound. The heat dissipation member 40 according to the exemplary embodiment can reduce processing costs and processing time by directly coating the heat dissipation substrate 47 onto the second heat dissipation layer 45 instead of using coupling layers such as adhesive layers, sticky layers, resin layers, etc.

[0110] When polyimide is used as the heat dissipation substrate 47, it is necessary to attach the polyimide as a film to the second heat dissipation layer 45 because polyimide is difficult to dissolve in solvents. On the other hand, when the aforementioned polyamide-imide is used as the heat dissipation substrate 47, polyamide-imide dissolves more easily in solvents than polyimide, making it easy to directly coat the second heat dissipation layer 45 with polyamide-imide. Therefore, the overall thickness of the heat dissipation member 40 can be reduced, enabling a thin display 600 to be achieved.

[0111] According to an exemplary embodiment, the buffer member 50 may include a first buffer coupling interlayer 51 disposed on a heat dissipation substrate 47, a pad layer 53 disposed on the first buffer coupling interlayer 51, a second buffer coupling interlayer 55 disposed on the pad layer 53, a buffer substrate 57 disposed on the second buffer coupling interlayer 55, and a top coupling layer 59 disposed on the buffer substrate 57. The aforementioned layers of the buffer member 50 may be disposed on the entire surface of the flat region FA and the bent region BA.

[0112] The buffer member 50 may have a first thickness t1. The first thickness t1 may be from about 180 μm to about 220 μm.

[0113] The first buffer coupling layer 51, the second buffer coupling layer 55, and the top coupling layer 59 may include the material exemplified by the first coupling layer 22. The first buffer coupling layer 51 may perform the function of coupling the pad 53 to the heat dissipation substrate 47 of the heat dissipation member 40. That is, the pad 53 and the heat dissipation substrate 47 of the heat dissipation member 40 can be coupled to each other through the first buffer coupling layer 51.

[0114] The second buffer coupling interlayer 55 can perform the function of coupling the pad 53 to the buffer substrate 57. That is, the pad 53 and the buffer substrate 57 can be coupled to each other through the second buffer coupling interlayer 55.

[0115] Although not shown in the figure, a release film can also be disposed on the top surface of the mainboard 10. An embossed shape can be formed on the surface of the release film. The embossed shape on the surface of the release film is transferred to the adjacent top coupling layer 59, such that the top surface of the top coupling layer 59 can have an embossed shape complementary to the surface shape of the release film. When the top coupling layer 59 has an embossed shape on its top surface as described above, the embossed shape on the surface is used to reduce airflow paths for air bubbles when attaching the panel base plate 100 to the bottom surface of the display panel 200. When the top coupling layer 59 is fully attached to the bottom of the display panel 200, the embossed shape on the top surface of the top coupling layer 59 can collapse to a flat surface.

[0116] The embossed shape of the release membrane and the embossed shape of the top coupling layer 59 adjacent to it in this exemplary embodiment can also be applied to the release membrane 30 and the bottom coupling member 20 in other exemplary embodiments.

[0117] The padding layer 53 performs the function of preventing or protecting the display 600 from damage by absorbing external impacts. The padding layer 53 may comprise a single layer or multiple stacked films. The padding layer 53 may comprise, for example, an elastic material, such as polyurethane, polyethylene resin, etc.

[0118] The buffer substrate 57 may be disposed between the second buffer coupling interlayer 55 and the top coupling layer 59. The buffer substrate 57 may include at least one of PET, PI, PC, PE, PP, PSF, PMMA, TAC, COP, etc.

[0119] Other exemplary embodiments will be described below. In the embodiments below, the description of components that are the same as those in the embodiments described above will be omitted or simplified, and the differences between them will be mainly described.

[0120] Figure 6 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0121] Reference Figure 6 According to this exemplary embodiment, the panel base plate 100_1 and Figure 4 The difference between the panel base plate 100 and the heat dissipation substrate 47_1 is that the heat dissipation substrate 47_1 can be disposed inward to the first opening OP1. The main board 10_1 may include a buffer member 50 and a heat dissipation member 40_1.

[0122] More specifically, in the panel base plate 100_1 according to this exemplary embodiment, a heat dissipation substrate 47_1 may be disposed inwardly to the first opening OP1. The heat dissipation substrate 47_1 of the panel base plate 100_1 may contact a portion of the inner wall of the second heat dissipation layer 45 in the first opening OP1. The heat dissipation substrate 47_1 may contact the top end of the inner wall of the second heat dissipation layer 45 in the first opening OP1, and the bottom end of the inner wall may be exposed.

[0123] Even in this exemplary embodiment, the heat dissipation component 40_1 can still reduce processing costs and processing time by using a heat dissipation substrate 47_1 directly coated onto the second heat dissipation layer 45 instead of using a coupling layer such as an adhesive layer, sticky layer, resin layer, etc. to attach a heat dissipation substrate such as PI to the second heat dissipation layer 45.

[0124] Furthermore, by employing a coating method, the overall thickness of the heat dissipation component 40_1 can be reduced, enabling the realization of a thin display.

[0125] Figure 7 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0126] Reference Figure 7 The panel base plate 100_2 according to this exemplary embodiment differs from the panel base plate 100_1 in that the heat dissipation substrate 47_2 is disposed in the first opening OP1 and contacts the entire inner wall of the second heat dissipation layer 45 in the first opening OP1. The main board 10_2 may include a buffer member 50 and a heat dissipation member 40_2.

[0127] More specifically, in the panel base plate 100_2 according to this exemplary embodiment, the heat dissipation substrate 47_2 may be disposed in the first opening OP1 and may contact the entire inner wall of the second heat dissipation layer 45 in the first opening OP1.

[0128] The heat dissipation substrate 47_2 can contact the top surface of the heat dissipation coupling interlayer 43 below it in the first opening OP1.

[0129] Even in this exemplary embodiment, the heat dissipation component 40_2 can still reduce processing costs and processing time by using a heat dissipation substrate 47_2 directly coated onto the second heat dissipation layer 45 instead of using a coupling layer such as an adhesive layer, sticky layer, resin layer, etc. to attach the heat dissipation substrate 47_2 to the second heat dissipation layer 45.

[0130] Furthermore, by employing a coating method, the overall thickness of the heat dissipation component 40_2 can be reduced, enabling the realization of a thin display.

[0131] Figure 8 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0132] Reference Figure 8 According to this exemplary embodiment, the panel base plate 100_3 and Figure 4 The difference between the panel base plate 100 and the previous one is that the heat dissipation coupling layer 43_1 can be disposed inward to the first opening OP1. The main board 10_3 may include a buffer member 50 and a heat dissipation member 40_3.

[0133] More specifically, in the panel base plate 100_3 according to this exemplary embodiment, the heat dissipation coupling interlayer 43_1 may be disposed inwardly to the first opening OP1. The heat dissipation coupling interlayer 43_1 may contact a portion of the inner wall of the second heat dissipation layer 45 in the first opening OP1. The heat dissipation coupling interlayer 43_1 may contact the bottom end of the inner wall of the second heat dissipation layer 45 in the first opening OP1, and may expose the top end of the inner wall.

[0134] Even in this exemplary embodiment, the heat dissipation component 40_3 can still reduce processing costs and processing time by using a heat dissipation substrate 47 to be directly coated onto the second heat dissipation layer 45 instead of using a coupling layer such as an adhesive layer, sticky layer, resin layer, etc. to attach the heat dissipation substrate 47 to the second heat dissipation layer 45.

[0135] Furthermore, by employing a coating method, the overall thickness of the heat dissipation component 40_3 can be reduced, enabling the realization of a thin display.

[0136] Figure 9 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0137] Reference Figure 9 According to this exemplary embodiment, the panel base plate 100_4 and Figure 4 The difference between the panel base plate 100 and the panel base plate is the application. Figure 6 The heat dissipation substrate 47_1 and Figure 8 The heat dissipation coupling layer 43_1. The motherboard 10_4 may include a buffer member 50 and a heat dissipation member 40_4.

[0138] In the heat dissipation component 40_4 of the panel base plate 100_4 according to this exemplary embodiment, the heat dissipation substrate 47_1 can directly contact the heat dissipation coupling interlayer 43_1 in the first opening OP1.

[0139] Even in this exemplary embodiment, the heat dissipation component 40_4 can still reduce processing costs and processing time by using a heat dissipation substrate 47_1 directly coated onto the second heat dissipation layer 45 instead of using a coupling layer such as an adhesive layer, sticky layer, resin layer, etc. to attach the heat dissipation substrate 47_1 to the second heat dissipation layer 45.

[0140] Furthermore, by employing a coating method, the overall thickness of the heat dissipation component 40_4 can be reduced, enabling the realization of a thin display.

[0141] Figure 10 This is a cross-sectional view of a heat dissipation component according to other exemplary embodiments. Figure 11 It is along Figure 10 The sectional view taken by the section line X-X', and Figure 12 This is a plan view of the arrangement of a bent heat dissipation component according to other exemplary embodiments.

[0142] Reference Figure 10 , Figure 11 and Figure 12 According to this exemplary embodiment, the heat dissipation component 40_5 and Figure 4 and Figure 5 The difference of the heat dissipation component 40 is that its second heat dissipation layer 45_1 includes a main heat dissipation pattern 45a generally disposed in the flat area FA and a sub-heat dissipation pattern 45b disposed in the bent area BA.

[0143] because Figure 10 , Figure 11 and Figure 12 The main heat dissipation pattern 45a is the same as the one mentioned above. Figure 4 and Figure 5 The second heat dissipation layer 45 described is essentially the same, so repeated descriptions will be omitted below.

[0144] Sub-heat dissipation pattern 45b can be disposed in the bent area BA of display 600. Sub-heat dissipation pattern 45b can be disposed separately from main heat dissipation pattern 45a. Sub-heat dissipation pattern 45b can be disposed separately from main heat dissipation pattern 45a by a second opening OP2, the second opening OP2 being located between sub-heat dissipation pattern 45b and main heat dissipation pattern 45a. The second opening OP2 can have a shape extending along the long side direction of the main heat dissipation pattern 45a of the first heat dissipation layer 41 and the second heat dissipation layer 45_1. The second opening OP2 can include a through hole that completely penetrates the second heat dissipation layer 45_1 from the surface or top surface of the second heat dissipation layer 45_1 in the thickness direction. The second opening OP2 can completely separate adjacent sub-heat dissipation patterns 45b and main heat dissipation patterns 45a from each other. The second opening OP2 can be disposed between adjacent sub-heat dissipation patterns 45b.

[0145] The sub-heat dissipation pattern 45b may have a linear shape extending along the long side of the main heat dissipation pattern 45a of the first heat dissipation layer 41 and the second heat dissipation layer 45_1.

[0146] In the heat dissipation member 40_5 according to this exemplary embodiment, the second heat dissipation layer 45_1 is configured to extend further into the bending region BA, making it easier to perform the heat dissipation function of the second heat dissipation layer 45_1.

[0147] In addition, such as Figure 12 As shown, since the second opening OP2 is provided between the adjacent main heat dissipation pattern 45a and the sub-heat dissipation pattern 45b and between adjacent sub-heat dissipation patterns 45b, the flexibility in the bending direction is still guaranteed even when the panel base plate is attached to the display and is bent in the bending direction, so as to not only reduce bending stress, but also prevent or suppress the peeling between the upper and lower structures of the second heat dissipation layer 45_1 in the bending area BA.

[0148] Furthermore, when the display is bent, adjacent sub-heat dissipation patterns 45b and adjacent main heat dissipation patterns 45a and sub-heat dissipation patterns 45b can come into contact with each other. Therefore, the heat dissipation function of the second heat dissipation layer 45_1 can be effectively provided.

[0149] Figure 13 This is a plan view of the arrangement of heat dissipation components according to other exemplary embodiments.

[0150] Reference Figure 13 According to this exemplary embodiment, the heat dissipation component 40_6 and Figure 10 , Figure 11 and Figure 12 The difference of the heat dissipation component 40_5 is that the main heat dissipation pattern 45a and the sub-heat dissipation pattern 45b_1 are physically connected to each other.

[0151] More specifically, in the heat dissipation member 40_6 according to this exemplary embodiment, the main heat dissipation pattern 45a and the sub-heat dissipation pattern 45b_1 of the second heat dissipation layer 45_2 are physically connected to each other. The second opening OP2_1 can be completely surrounded by the main heat dissipation pattern 45a and the sub-heat dissipation pattern 45b_1 in a plan view.

[0152] In the heat dissipation member 40_6 according to this exemplary embodiment, the second heat dissipation layer 45_2 is configured to extend further into the bending region BA, making it easier to perform the heat dissipation function of the second heat dissipation layer 45_2.

[0153] Furthermore, since the second opening OP2_1 is located between the adjacent main heat dissipation pattern 45a and the sub-heat dissipation pattern 45b_1, as well as between adjacent sub-heat dissipation patterns 45b_1, the flexibility in the bending direction is maintained even when the panel base plate is attached to the display and bent in the bending direction. This not only reduces bending stress but also prevents or suppresses the peeling between the upper and lower structures of the second heat dissipation layer 45_2 in the bending area BA.

[0154] Figure 14 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0155] Reference Figure 14 According to this exemplary embodiment, the panel base plate 100_5 and Figure 4 The difference between the panel base plate 100 and the mainboard 10_5 is that the buffer member 50_1 does not include layers that are distinct from each other and is formed as a single component. The mainboard 10_5 may include the buffer member 50_1 and the heat dissipation member 40.

[0156] More specifically, in the panel base plate 100_5 according to this exemplary embodiment, the buffer member 50_1 does not include layers distinct from each other and can be formed as a single component.

[0157] The buffer member 50_1 can be formed as an adhesive layer, a viscous layer, a resin layer, etc. In this exemplary embodiment, the buffer member 50_1 may include a pressure-sensitive adhesive (PSA). For example, the buffer member 50_1 may include an impact-resistant pressure-sensitive adhesive. The impact-resistant pressure-sensitive adhesive may include a PSA and a material that includes damping properties maximized in the high-frequency band (1000 to 10000 Hz).

[0158] The second thickness t2 of the buffer member 50_1 according to this exemplary embodiment can be less than [the thickness t2 of the buffer member 50_1]. Figure 4 The first thickness t1 of the buffer member 50. For example, the second thickness t2 can be from about 120 μm to about 170 μm.

[0159] The buffer member 50_1 can directly contact the display panel 200 above it and the heat dissipation substrate 47 of the heat dissipation member 40 below it. In the panel base plate 100_5 according to this exemplary embodiment, the buffer member 50_1 is formed as a single layer without separate components, so as to reduce the overall thickness of the display.

[0160] Figure 15 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0161] Reference Figure 15 According to this exemplary embodiment, the panel base plate 100_6 and Figure 14 The difference between the panel base plate 100_5 and the panel base plate 100_6 is that the panel base plate 100_6 also includes an embossed shape on the top surface of the buffer member 50_2. The motherboard 10_6 may include the buffer member 50_2 and the heat dissipation member 40.

[0162] More specifically, the panel base plate 100_6 according to this exemplary embodiment may also include an embossed shape on the top surface of the cushioning member 50_2. Since reference has been made above... Figure 4 The shape of the relief has been described, so repeated descriptions will be omitted below.

[0163] Figure 16 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0164] Reference Figure 16 According to this exemplary embodiment, the panel base plate 100_7 and Figure 4 The difference between the panel base plate 100 and the previous one is that the heat dissipation component 40_7 also includes a heat dissipation coating 49 disposed below the first heat dissipation layer 41. The motherboard 10_7 may include the heat dissipation component 40_7 and the buffer component 50.

[0165] More specifically, in the panel base plate 100_7 according to this exemplary embodiment, the heat dissipation member 40_7 may further include a heat dissipation coating 49 disposed below the first heat dissipation layer 41.

[0166] The heat-dissipating coating 49 may include a metal oxide. For example, the metal oxide may be one of aluminum oxide, zinc oxide, or zirconium oxide.

[0167] The heat dissipation coating 49 can be disposed between the first heat dissipation layer 41 and the bottom coupling member 20. The heat dissipation coating 49 can be directly disposed on the bottom surface of the first heat dissipation layer 41. The heat dissipation coating 49 can be disposed on the bottom surface of the first heat dissipation layer 41 to more easily prevent or suppress the diffusion of heat from the components diffused downward toward the display panel 200.

[0168] Figure 17This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0169] Reference Figure 17 According to this exemplary embodiment, the panel base plate 100_8 and Figure 4 The difference in the panel base plate 100 is that it also includes a digital converter 60. The motherboard 10_8 may include a heat sink 40, a buffer 50, and a digital converter 60 disposed between the heat sink 40 and the buffer 50.

[0170] More specifically, the panel base plate 100_8 according to this exemplary embodiment may also include a digital converter 60.

[0171] A digitizer 60 can be disposed between a buffer member 50 and a heat dissipation member 40. The digitizer 60 is an input device that receives positional information indicated by the user on the screen, unlike input devices such as keyboards and mice. For example, the digitizer 60 recognizes stylus movement and converts it into a digital signal. The digitizer 60 can be provided in the form of a film or a panel.

[0172] In this exemplary embodiment, the digital converter 60 may include a plurality of electrodes 63 and 65. The plurality of electrodes 63 and 65 may be configured as two or more layers. The digital converter 60 may further include a third coupling layer 61 disposed on the top surface of the heat sink substrate 47, a first insulating layer 62 disposed on the third coupling layer 61, a second insulating layer 64 disposed on the first insulating layer 62 and the first electrode 63, and a third insulating layer 66 disposed on the second electrode 65. The second insulating layer 64 may cover the first electrode 63, and the third insulating layer 66 may cover the second electrode 65. A buffer member 50 may be disposed on the top surface of the third insulating layer 66.

[0173] The first electrode 63 and the second electrode 65 can be patterned respectively. Each of the first electrode 63 and the second electrode 65 may include a metal such as copper or silver.

[0174] Each of the first insulating layer 62, the second insulating layer 64, and the third insulating layer 66 may include an organic film such as PI or an inorganic film such as silicon oxide, silicon nitride, silicon oxynitride, etc.

[0175] The material of the third coupling layer 61 may be selected from the exemplary materials of the first coupling layer 22 and the second coupling layer 23 described above.

[0176] Even in this exemplary embodiment, the heat dissipation component 40 can still reduce processing costs and processing time by using a method of attaching a heat dissipation substrate such as PI to the second heat dissipation layer 45 by directly coating the heat dissipation substrate 47 onto the second heat dissipation layer 45 instead of using a coupling layer such as an adhesive layer, sticky layer, resin layer, etc.

[0177] Figure 18 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0178] Reference Figure 18 According to this exemplary embodiment, the panel base plate 100_9 and Figure 17 The difference between the panel base plate 100_8 and the motherboard 10_9 is that the magnetic field blocking member 70 is further disposed between the digital converter 60 and the heat dissipation member 40. Figure 17 The magnetic field blocking member 70 between the heat dissipation member 40 and the digital converter 60 in the motherboard 10_8.

[0179] More specifically, in the panel base plate 100_9 according to this exemplary embodiment, a magnetic field blocking member 70 may be further disposed between the digital converter 60 and the heat dissipation member 40. The magnetic field blocking member 70 may include a fourth coupling layer 71 disposed on the top surface of the heat dissipation substrate 47 and a magnetic field blocking layer 72 disposed on the top surface of the fourth coupling layer 71. The fourth coupling layer 71 may be disposed between the magnetic field blocking layer 72 and the heat dissipation substrate 47 and performs the function of attaching the magnetic field blocking layer 72 to the heat dissipation substrate 47. The magnetic field blocking layer 72 may be disposed between the fourth coupling layer 71 and the third coupling layer 61 of the digital converter 60 and may be coupled to both the third coupling layer 61 and the fourth coupling layer 71.

[0180] The fourth coupling layer 71 may include at least one of the materials included in the first coupling layer 22 and the second coupling layer 23 described above, but is not limited thereto.

[0181] The magnetic field blocking layer 72 may include a metal such as copper or silver. The magnetic field blocking layer 72 can perform the following function: blocking magnetic fields generated by multiple underlying components such as application chips, camera devices, battery components, etc., to prevent or suppress magnetic fields from reaching the first electrode 63 and the second electrode 65 of the digital converter 60 in advance.

[0182] Figure 19 This is a detailed cross-sectional view of the panel base plate according to other exemplary embodiments.

[0183] Reference Figure 19 According to this exemplary embodiment, the panel base plate 100_10 and Figure 18 The difference between the panel base plate 100_9 and the panel base plate is that it can be applied Figure 16 Heat dissipation component 40_7. Motherboard 10_10 and Figure 18 The difference between the motherboard 10_9 and the motherboard 10_9 is that it has a heat sink 40_7 instead of a heat sink 40.

[0184] The heat dissipation coating 49 of the heat dissipation component 40_7 acts as a magnetic field blocking layer 72 and can perform the following function: blocking the magnetic field generated by multiple underlying components such as application chips, camera devices, battery components, etc., to prevent or suppress the magnetic field from reaching the first electrode 63 and the second electrode 65 of the digital converter 60 in advance.

[0185] In some embodiments, the magnetic field blocking member 70 may be omitted. Even in this case, the heat dissipation coating 49 is still provided on the bottom surface of the first heat dissipation layer 41 to perform the function of blocking magnetic fields generated by multiple underlying components such as application chips, camera devices, battery components, etc., in order to prevent or suppress the magnetic field from reaching the first electrode 63 and the second electrode 65 of the digital converter 60 in advance.

[0186] Processing efficiency can be improved by using a panel base plate according to an exemplary embodiment.

[0187] The effects of the exemplary embodiments are not limited to those illustrated above, and the specification includes a variety of effects.

[0188] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from the description. Therefore, the inventive concept is not limited to these embodiments, but is defined more broadly by the appended claims and various obvious modifications and equivalent configurations, as will be recognized by those skilled in the art.

Claims

1. A panel base plate, comprising: A first heat dissipation layer, the first heat dissipation layer including a flat region and a bent region located on the outer periphery of the flat region; A second heat dissipation layer, wherein the circumferential side of the second heat dissipation layer is located further inward than the circumferential side of the first heat dissipation layer in a plan view, the second heat dissipation layer overlaps with a portion of the bent region and the flat region, and the second heat dissipation layer comprises: The main heat dissipation pattern includes a first opening formed to completely penetrate the second heat dissipation layer in the thickness direction; and A heat dissipation substrate, which is directly disposed on the second heat dissipation layer. The heat dissipation substrate is disposed in the first opening of the second heat dissipation layer and directly contacts the inner wall of the first opening.

2. The panel chassis of claim 1, wherein, The heat dissipation substrate is in direct contact with the circumferential side surface of the second heat dissipation layer.

3. The panel base plate according to claim 2 further includes a first coupling interlayer, wherein the first coupling interlayer is disposed between the first heat dissipation layer and the second heat dissipation layer. wherein At least a portion of the top surface of the first coupling interlayer is exposed through the second heat dissipation layer, and the exposed top surface of the first coupling interlayer is in direct contact with the heat dissipation substrate.

4. The panel chassis of claim 3, wherein, The first opening includes a through-hole that is completely surrounded by the second heat dissipation layer in the plan view.

5. The panel chassis of claim 4, wherein, The first coupling interlayer is disposed in the first opening of the second heat dissipation layer and directly contacts the inner wall of the first opening.

6. The panel base plate according to claim 3, wherein The second heat dissipation layer also includes a plurality of sub-heat dissipation patterns spaced apart from the main heat dissipation pattern and having a linear shape extending in one direction. The second heat dissipation layer further includes a plurality of second openings formed to completely penetrate the second heat dissipation layer in the thickness direction, and In this configuration, a plurality of second openings are arranged in the plan view between the sub-heat dissipation patterns and between the main heat dissipation pattern and the sub-heat dissipation patterns.

7. The panel chassis of claim 1, wherein, The heat dissipation substrate comprises polyamide-imide.

8. The panel chassis of claim 1, wherein, The first heat dissipation layer comprises at least one of copper and silver, and the second heat dissipation layer comprises at least one of graphite and carbon nanotubes.

9. The panel base plate according to claim 1, further comprising: A bottom coupling member is disposed below the first heat dissipation layer; as well as A heat-dissipating coating is disposed between the bottom coupling member and the first heat-dissipating layer.

10. The panel chassis of claim 9, wherein, The heat dissipation coating includes metal oxide materials.

11. The panel base plate according to claim 9 further includes a digital converter disposed on the heat dissipation substrate.

12. A display comprising: Display panel; as well as A panel base plate, disposed below the display panel, the panel base plate comprising: First heat dissipation layer; The second heat dissipation layer has its circumferential side surface located further inside the first heat dissipation layer in the plan view. A heat dissipation substrate, wherein the heat dissipation substrate is directly disposed on the second heat dissipation layer; A bottom coupling member is disposed below the first heat dissipation layer; and A heat-dissipating coating is disposed between the bottom coupling member and the first heat-dissipating layer. The second heat dissipation layer includes: The main heat dissipation pattern includes a first opening formed to completely penetrate the second heat dissipation layer in the thickness direction. The heat dissipation substrate is disposed in the first opening of the second heat dissipation layer and directly contacts the inner wall of the first opening.

13. The display of claim 12, wherein, The heat dissipation coating includes metal oxide materials.

14. The display according to claim 13, wherein, The panel base plate further includes a buffer member disposed between the heat dissipation substrate and the display panel, the buffer member directly contacting the heat dissipation substrate, and The buffer member has a thickness of 120 μm to 170 μm.

15. The display according to claim 13, comprising: Flat area; as well as The bent region located on the outer periphery of the flat region. The display panel and the panel base plate overlap with the flat area and the bent area.

16. The display according to claim 15, wherein, The second heat dissipation layer overlaps with a portion of the bent region and the flat region, and The first heat dissipation layer overlaps with the entire surface of the bent region and the flat region.

17. The display according to claim 16, wherein, The second heat dissipation layer includes a main heat dissipation pattern, the main heat dissipation pattern including a first opening formed to completely penetrate the second heat dissipation layer in the thickness direction, and The main heat dissipation pattern is located in the flat area.

18. The display according to claim 17, wherein, The first opening includes a through-hole that is completely surrounded by the second heat dissipation layer in the plan view.

19. The display according to claim 18, wherein, The heat dissipation substrate is disposed in the first opening of the second heat dissipation layer and directly contacts the inner wall of the first opening.

20. The display according to claim 17, wherein, The second heat dissipation layer also includes a plurality of sub-heat dissipation patterns spaced apart from the main heat dissipation pattern and having a linear shape extending in one direction. The second heat dissipation layer further includes a plurality of second openings formed to completely penetrate the second heat dissipation layer in the thickness direction, and In this configuration, a plurality of second openings are arranged in the plan view between the sub-heat dissipation patterns and between the main heat dissipation pattern and the sub-heat dissipation patterns.

21. The display according to claim 20, wherein, The sub-heat dissipation pattern is located in the bending region.

22. A display, comprising: Display panel; as well as A panel base plate, disposed below the display panel, the panel base plate comprising: A first heat dissipation layer, the first heat dissipation layer including a flat region and a bent region located on the outer periphery of the flat region; A second heat dissipation layer, wherein the side surface of the second heat dissipation layer is located further inward than the side surface of the first heat dissipation layer, and the second heat dissipation layer overlaps with a portion of the bent region and the flat region; A heat dissipation substrate, wherein the heat dissipation substrate is directly disposed on the second heat dissipation layer; and A buffer member is disposed between the heat dissipation substrate and the display panel, and the buffer member has a thickness of 120μm to 170μm. The second heat dissipation layer includes: The main heat dissipation pattern includes a first opening formed to completely penetrate the second heat dissipation layer in the thickness direction. The heat dissipation substrate is disposed in the first opening of the second heat dissipation layer and directly contacts the inner wall of the first opening.

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