Photosensitive component and camera module and manufacturing method thereof

Abstract

The present application discloses a photosensitive component and a camera module and a manufacturing method thereof. The photosensitive component includes a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping component arranged on the circuit board. The lower surface of the photosensitive chip is attached to the shaping component to form a housing space with the shaping component and the circuit board. The housing space is configured so that the photosensitive chip bends downward during the assembly of the photosensitive component. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process to improve the imaging quality.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and in particular to a photosensitive component and a camera module and a method for manufacturing the same, which, through a specific structural design, bends a planar photosensitive chip into a shape that is adapted to an actual focal imaging surface, thereby improving the imaging quality of the camera module. Background Art

[0002] Camera modules are important image sensing devices. As consumers have higher and higher requirements for the imaging quality of terminal devices (e.g., smartphones), the size of the photosensitive chips collected by camera modules has gradually increased, which has caused a series of technical problems, such as chip deformation and poor chip heat dissipation. These technical problems cannot be properly solved in the existing camera module preparation process.

[0003] Therefore, an improved camera module structure and manufacturing scheme are needed to provide a camera module that meets the requirements. Summary of the invention

[0004] The main purpose of the present application is to provide a photosensitive component and a camera module and a method for manufacturing the same, which can bend a planar photosensitive chip into a shape that is adapted to an actual focal imaging surface, thereby improving the imaging quality of the camera module.

[0005] Another object of the present application is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the photosensitive chip of the camera module remains planar during transportation so that it can still be transported in a mosaic-like manner.

[0006] Another object of the present application is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the chip manufacturer does not need to change the existing photosensitive chip manufacturing process, that is, the photosensitive component manufacturing process provided in the present application can be implemented based on the existing planar photosensitive chip.

[0007] Another object of the present application is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein a heat sink for enhancing the heat dissipation of the photosensitive chip is included in the accommodating space below the photosensitive chip to enhance the heat dissipation performance of the camera module.

[0008] In order to achieve at least one of the above purposes or advantages, the present application is proposed. An embodiment of the present application provides a photosensitive component, which includes:

[0009] Circuit board;

[0010] a photosensitive chip electrically connected to the circuit board; and

[0011] A shaping component is arranged on the circuit board, wherein the lower surface of the photosensitive chip is attached to the shaping component to form a accommodating space together with the shaping component and the circuit board, and the accommodating space is configured so that the photosensitive chip bends downward during the assembly of the photosensitive component.

[0012] In the photosensitive component according to the present application, the shaping component includes a first shaping piece and a second shaping piece, the first shaping piece and the photosensitive chip and the circuit board form the accommodating space, the second shaping piece is arranged on the circuit board and located in the accommodating space, and the height of the second shaping piece is lower than that of the first shaping piece.

[0013] In the photosensitive component according to the present application, the upper surface of at least one of the first shaping member and the second shaping member includes an arcuate surface that is concave downward and inward, and the arcuate surface is configured so that when the photosensitive chip is bent downward, a lower surface that is adapted to the focal imaging surface of the photosensitive component is formed.

[0014] In the photosensitive component according to the present application, the circuit board has at least one opening formed therethrough and connected to the accommodating space, and the at least one opening is configured to discharge the gas in the accommodating space during the process of assembling the photosensitive component so that the photosensitive chip bends downward.

[0015] In the photosensitive component according to the present application, the position where the opening is formed on the circuit board corresponds to the central area of ​​the photosensitive chip.

[0016] In the photosensitive component according to the present application, the second shaping member is arranged symmetrically relative to the center of the photosensitive chip.

[0017] In the photosensitive component according to the present application, the second shaping member is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip.

[0018] In the photosensitive component according to the present application, the cross-sectional shape of the first shaping member is a closed ring.

[0019] In the photosensitive component according to the present application, the opening is formed in the circuit board at a position between the first shaping member and the second shaping member.

[0020] In the photosensitive component according to the present application, some of the openings are formed on the circuit board at positions corresponding to the central area of ​​the photosensitive chip, and another part of the openings are formed on the circuit board at positions between the first shaping member and the second shaping member.

[0021] In the photosensitive component according to the present application, the opening is formed on the circuit board in a position symmetrically arranged relative to the center of the photosensitive chip.

[0022] In the photosensitive component according to the present application, another part of the openings are formed on the circuit board and are arranged symmetrically relative to the center of the photosensitive chip.

[0023] In the photosensitive component according to the present application, the second shaping member is arranged symmetrically relative to the center of the photosensitive chip.

[0024] In the photosensitive component according to the present application, the second shaping member is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip.

[0025] In the photosensitive component according to the present application, the shaping component also includes an adhesive applied between the first shaping piece and the second shaping piece, wherein the height of the adhesive is higher than the upper surface of the second shaping piece.

[0026] In the photosensitive component according to the present application, the first shaping member includes a first shaping member body and an adhesive applied to the first shaping member body, and the second shaping member includes a second shaping member body and an adhesive applied to the second shaping member body.

[0027] In the photosensitive component according to the present application, the first shaping member body and the second shaping member body are integrally formed on the top surface of the circuit board.

[0028] In the photosensitive component according to the present application, the first shaping member body and the second shaping member body are prefabricated and installed on the circuit board. In an embodiment of the present application, the first shaping member body and the second shaping member body are made of metal material.

[0029] In the photosensitive component according to the present application, the first shaping member body and the second shaping member body are integrally formed on the top surface of the circuit board through an electroplating process.

[0030] In the photosensitive component according to the present application, the photosensitive component further includes a heat sink, which is formed in the accommodating space and attached to at least a portion of the lower surface of the photosensitive chip.

[0031] In the photosensitive component according to the present application, the heat sink is formed by heat dissipation material entering the accommodating space through the at least one opening.

[0032] In the photosensitive component according to the present application, at least one of the openings forms the vent hole.

[0033] In the photosensitive component according to the present application, the photosensitive component further includes at least one electronic component arranged in a non-photosensitive area of ​​the photosensitive chip.

[0034] In the photosensitive component according to the present application, the photosensitive component further includes a bracket arranged on the circuit board, wherein the bracket forms a light-through hole corresponding to the photosensitive area of ​​the photosensitive chip.

[0035] In the photosensitive assembly according to the present application, the bracket is integrally formed with the circuit board through a molding process to integrally cover at least a portion of the circuit board and at least a portion of the at least one electronic component.

[0036] In the photosensitive assembly according to the present application, the bracket is integrally formed on the circuit board through a molding process to integrally cover at least a portion of the circuit board, the at least one electronic component, and at least a portion of the non-photosensitive area of ​​the photosensitive chip.

[0037] In the photosensitive assembly according to the present application, the inner side surface of the bracket is perpendicular to the upper surface of the photosensitive chip.

[0038] In the photosensitive assembly according to the present application, the inner side surface of the bracket extends outwardly at an angle.

[0039] In the photosensitive component according to the present application, the bracket includes a mounting platform recessedly formed on the top surface of the bracket for supporting the filter element thereon.

[0040] In the photosensitive component according to the present application, the photosensitive component further includes a side encapsulation that wraps the photosensitive chip and the outer side of the shaping component to prevent the position of the photosensitive chip from shifting during the molding process.

[0041] In the photosensitive component according to the present application, the photosensitive component further includes a filter element maintained in the photosensitive path of the photosensitive component.

[0042] In the photosensitive assembly according to the present application, the filter element is stacked on the photosensitive element, and after the bracket is integrally formed on the circuit board through a molding process, the bracket integrally covers at least a portion of the circuit board, the at least one electronic component, at least a portion of the non-photosensitive area of ​​the photosensitive chip, and at least a portion of the filter element.

[0043] In the photosensitive component according to the present application, the filter element is supported on the top of the bracket.

[0044] In the photosensitive assembly according to the present application, the filter element is mounted on the mounting platform of the bracket.

[0045] In the photosensitive component according to the present application, the photosensitive component further includes a filter element bracket, which is installed on the bracket and is used to install the filter element.

[0046] According to another aspect of the present application, the present application also provides a camera module, which includes:

[0047] Optical lenses; and

[0048] The photosensitive component as described above, wherein the optical lens is maintained in the photosensitive path of the photosensitive component.

[0049] In the camera module according to the present application, the curved shape of the lower surface of the photosensitive chip is adapted to the shape of the actual focal imaging surface of the camera module.

[0050] In the camera module according to the present application, the optical lens is mounted on the bracket.

[0051] In the camera module according to the present application, the camera module further includes a driving element, wherein the driving element is supported by the bracket, and the optical lens is installed on the driving element.

[0052] According to another aspect of the present application, a method for manufacturing a photosensitive component is also provided, comprising:

[0053] A circuit board, a photosensitive chip, a first shaping member and a second shaping member are provided, wherein the circuit board includes at least one opening;

[0054] The first shaping member and the second shaping member are arranged on the circuit board, wherein the height of the second shaping member is smaller than that of the first shaping member;

[0055] Attaching the lower surface of the photosensitive chip to the first shaping member to form a containing space with the shaping member and the circuit board, wherein the at least one opening is connected to the containing space, and wherein the second shaping member is located in the containing space; and

[0056] The gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip bends downward.

[0057] In the manufacturing method of the photosensitive component according to the present application, the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface that is concave downward and inward, wherein the gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip bends downward, comprising:

[0058] The photosensitive chip is bent until the lower surface of the photosensitive chip is attached to the arc surface, so that when the photosensitive chip is bent downward, a lower surface that matches the focal imaging surface of the photosensitive component is formed.

[0059] In the method for manufacturing a photosensitive component according to the present application, the position where the opening is formed on the circuit board corresponds to the central area of ​​the photosensitive chip.

[0060] In the manufacturing method of the photosensitive component according to the present application, it further includes:

[0061] A heat dissipation material is injected into the accommodating space through the opening to form the heat dissipation element in the accommodating space, wherein the heat dissipation element is attached to at least a portion of the lower surface of the photosensitive chip.

[0062] According to another aspect of the present application, a method for manufacturing a photosensitive component is also provided, which includes:

[0063] A circuit board and a photosensitive chip are provided, wherein the circuit board includes at least one opening;

[0064] Integrally forming a first shaping member and a second shaping member on the circuit board, wherein the height of the second shaping member is smaller than that of the first shaping member;

[0065] Attaching the lower surface of the photosensitive chip to the first shaping member to form a containing space with the shaping member and the circuit board, wherein the at least one opening is connected to the containing space, and wherein the second shaping member is located in the containing space; and

[0066] The gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip bends downward.

[0067] In the manufacturing method of the photosensitive component according to the present application, a first shaping member and a second shaping member are integrally formed on the circuit board, including:

[0068] Integrally forming a first shaping member body and a second shaping member body on the circuit board by an electroplating process; and

[0069] Adhesive is applied to the first shaping member body and the second shaping member body respectively.

[0070] In the manufacturing method of the photosensitive component according to the present application, the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface that is concave downward and inward, wherein the gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip bends downward, comprising:

[0071] The photosensitive chip is bent until the lower surface of the photosensitive chip is attached to the arc surface, so that when the photosensitive chip is bent downward, a lower surface that matches the focal imaging surface of the photosensitive component is formed.

[0072] In the method for manufacturing a photosensitive component according to the present application, the position where the opening is formed on the circuit board corresponds to the central area of ​​the photosensitive chip.

[0073] In the manufacturing method of the photosensitive component according to the present application, it further includes:

[0074] A heat dissipation material is injected into the accommodating space through the opening to form the heat dissipation element in the accommodating space, wherein the heat dissipation element is attached to at least a portion of the lower surface of the photosensitive chip.

[0075] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0076] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0078] Figure 1 The figure shows a schematic diagram of the picking process of the photosensitive chip in the existing COB assembly process.

[0079] Figure 2 The figure shows a schematic diagram of the imaging optical path of the camera module.

[0080] Figure 3 A schematic diagram of a photosensitive component according to an embodiment of the present application is illustrated.

[0081] Figure 4A and Figure 4B A schematic diagram of the manufacturing process of the photosensitive component according to an embodiment of the present application is illustrated.

[0082] Figure 5 A top view of the photosensitive component according to an embodiment of the present application is illustrated.

[0083] Figure 6 The diagram shows an enlarged schematic diagram of the upper surface of the shaping component in the photosensitive component according to an embodiment of the present application.

[0084] Figure 7 The figure shows a top view schematic diagram of a deformed implementation of the photosensitive component according to an embodiment of the present application.

[0085] Figure 8 The figure shows a top view schematic diagram of another modified implementation of the photosensitive component according to the embodiment of the present application.

[0086] Fig. 9 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0087] Fig.10 A schematic diagram of another modified embodiment of the photosensitive component according to an embodiment of the present application is illustrated.

[0088] Fig.11 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0089] Fig.12 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0090] Fig.13 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0091] Fig.14 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0092] Fig.15 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0093] Fig.16 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0094] Fig.17 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0095] Fig.18 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0096] Fig.19 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0097] Fig. 20 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0098] Fig.21 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0099] Fig.22A and Fig. 22B A schematic diagram of another manufacturing process of the photosensitive component according to an embodiment of the present application is illustrated.

[0100] Fig.23 A schematic diagram of a camera module according to an embodiment of the present application is illustrated, wherein the camera module is a fixed-focus camera module.

[0101] Fig.24 A schematic diagram of another variant implementation of the camera module according to an embodiment of the present application is illustrated.

[0102] Fig.25 The figure shows a schematic diagram of another modified implementation of the camera module according to the embodiment of the present application.

[0103] Fig.26 The figure shows a schematic diagram of another modified implementation of the camera module according to the embodiment of the present application.

[0104] Fig. 27 A schematic diagram illustrating another variant implementation of the camera module according to an embodiment of the present application is shown.

[0105] Fig.28 The figure shows a schematic diagram of a camera module according to an embodiment of the present application, wherein the camera module is a dynamic focus camera module. DETAILED DESCRIPTION

[0106] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described here.

[0107] Application Overview

[0108] As mentioned above, as consumers have higher and higher requirements for the imaging quality of terminal devices, the size of the photosensitive chip collected by the camera module has gradually increased, which has caused a series of technical problems. Moreover, these technical problems cannot be properly solved in the existing camera module preparation process. Therefore, an improved camera module structure and its manufacturing scheme are needed to produce photosensitive components and camera modules that meet the performance requirements.

[0109] Specifically, existing camera modules are usually assembled using the COB (Chip on Board) process: pick up the photosensitive chip → attach it to the circuit board → mount the plastic bracket on the circuit board. However, as the size continues to increase, the photosensitive chip is prone to deformation during the picking process.

[0110] Figure 1The figure shows a schematic diagram of the picking process of the photosensitive chip in the existing COB assembly process. Figure 1 As shown in the figure, in the existing COB assembly process, the photosensitive chip is picked up by adsorption, and because the photosensitive area of ​​the photosensitive chip cannot be touched, the nozzle of the pickup can only be attached to the non-photosensitive area of ​​the photosensitive chip. During the picking process, due to the suction effect of the nozzle, the photosensitive chip will bend towards the photosensitive surface of the photosensitive chip due to adsorption, and present an upward convex shape (as shown in the figure). Figure 1 Judging from the effect presented, figuratively speaking, the curved shape of the photosensitive chip can be defined as a "crying face").

[0111] Those skilled in the art should know that even if the photosensitive chip does not undergo a "crying face"-shaped deformation (i.e., the photosensitive chip is flat), due to the different optical path differences between the edge and center of the photosensitive chip relative to the optical lens, the optical center is prone to distortion, corner light loss, and sharp angle drop when it reaches the edge of the photosensitive chip, resulting in poor imaging effects. After the "crying face"-shaped deformation occurs, these undesirable phenomena will be further aggravated, further affecting the imaging quality.

[0112] Specifically, Figure 2 The figure shows the imaging optical path schematic diagram of the camera module. Figure 2 As shown, during the imaging process of the camera module, (generally, the side where the optical lens is located is defined as the object side, and the side where the photosensitive chip is located is defined as the image side) the actual focal plane (actual focal imaging plane) forms an arc that bulges toward the image side, that is, the actual focal plane is an arc-shaped surface. Those skilled in the art should know that the imaging quality is best when the plane where the photosensitive chip is located coincides with the focal plane. However, in actual situations, even if multiple lenses are used to modulate the optical system of the camera module, the focal plane will still appear as an arc-shaped surface. This is why even if the photosensitive chip is not deformed during the picking process, it will still produce distortion, light loss at corners, and sharp angle reduction. However, due to the "crying face"-shaped deformation of the photosensitive chip during the picking process, compared to Figure 2 It can be seen from the shape of the actual focal plane that the "crying face"-shaped deformation is exactly opposite to the deformation of the actual focal plane, which leads to aggravated distortion, light loss at corners, and sharp angle drop, which more seriously affects the imaging quality of the camera module.

[0113] In order to solve the problem of the photosensitive chip bending in a "crying face" shape, there is currently a technical direction to provide a photosensitive chip that is bent in a "smiley face" shape (for related technology, please refer to the patent application document CN201480052226.4). Although the curved photosensitive chip can alleviate the above technical problems, it brings a series of new problems, and some technical problems are difficult to overcome in the actual industry.

[0114] Specifically, first of all, how to install the curved photosensitive chip in the camera module is an urgent problem to be solved, because the existing camera module assembly process is aimed at planar photosensitive chips. Secondly, compared with planar photosensitive chips, the manufacturing process of curved photosensitive chips is more complicated and more difficult. In addition, most of the photosensitive chip manufacturers and camera module manufacturers are currently separated. Compared with flat photosensitive chips, the transportation of curved photosensitive chips has become a major problem: flat photosensitive chips can be transported by plate assembly, but curved photosensitive chips are difficult to transport by plate assembly.

[0115] In addition to the imaging problem, as the size of the photosensitive chip continues to increase (or, the frame rate increases), the photosensitive chip will generate a lot of heat during operation, and how to achieve heat dissipation is also an urgent problem that needs to be solved.

[0116] In view of the above technical problems, the basic concept of this application is to bend the planar photosensitive chip into a shape that is suitable for the actual focal imaging surface through a special manufacturing process, thereby improving the imaging quality of the camera module. In addition, a heat sink for enhancing heat dissipation is formed on the back of the photosensitive chip to solve the heat dissipation problem.

[0117] Based on this, the present application proposes a photosensitive component, which includes: a circuit board, a photosensitive chip and a shaping component, wherein the circuit board has at least one opening formed therethrough, the photosensitive chip is electrically connected to the circuit board, and the lower surface of the photosensitive chip is attached to the shaping component to form a housing space with the shaping component and the circuit board, wherein the housing space is connected to the at least one opening and is configured so that the photosensitive chip bends downward during the assembly of the photosensitive component. In this way, the planar photosensitive chip is bent into a shape that is adapted to the actual focal imaging surface through a special manufacturing process to improve the imaging quality of the camera module.

[0118] After introducing the basic principles of the present application, various non-limiting embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0119] Exemplary photosensitive components and methods of manufacturing the same

[0120] like Figures 3 to 4B As shown, the photosensitive component and its manufacturing process according to the embodiment of the present application are explained. Figure 3As shown, the photosensitive component 10 includes a circuit board 11, a photosensitive chip 12 electrically connected to the circuit board 11, and a shaping component 13, wherein the lower surface 122 of the photosensitive chip 12 is attached to the shaping component 13 to form an accommodating space 100 with the shaping component 13 and the circuit board 11, and the accommodating space 100 is configured so that the photosensitive chip 12 is bent downward during the assembly of the photosensitive component 10. In particular, in the embodiment of the present application, the photosensitive chip 12 is bent into a shape that matches the actual focal plane, so as to improve the imaging quality in this way.

[0121] like Figure 3 and 4B As shown, in the embodiment of the present application, the shaping component 13 is fixed on the top surface of the circuit board 11, wherein the top surface of the shaping component 13 is attached to the lower surface 122 of the photosensitive chip 12 to form the accommodation space 100 with the photosensitive chip 12 and the circuit board 11. It should be understood that the accommodation space 100 located below the photosensitive chip 12 provides a deformation space for the photosensitive chip 12 to bend downward under the action of a specific force. In addition, in the embodiment of the present application, the shaping component 13 sets a shaping surface 130, wherein the shaping surface 130 is configured to limit the shape of the downward bending of the photosensitive chip 12, so that the shape of the lower surface 122 of the photosensitive chip 12 after bending is adapted to the actual focal plane, thereby improving the imaging quality.

[0122] More specifically, in the embodiment of the present application, the shaping component 13 includes a first shaping member 131 and a second shaping member 132, wherein the first shaping member 131 is fixed to the circuit board 11, and the lower surface 122 of the photosensitive chip 12 is attached to the first shaping member 131, and in this way, an accommodation space 100 is formed between the first shaping member 131, the photosensitive chip 12 and the circuit board 11. The second shaping member 132 is fixed to the circuit board 11 and is located in the accommodation space 100, and the height of the second shaping member 132 is lower than that of the first shaping member 131. In other words, in the embodiment of the present application, the first shaping member 131 and the second shaping member 132 are arranged in a step-like manner. In particular, in the embodiment of the present application, the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arcuate surface that is concave downward and inward, and the arcuate surface is configured so that when the photosensitive chip 12 is bent downward, a lower surface 122 that is adapted to the focal imaging surface of the photosensitive component 10 is formed, so that the shaping surface 130 that is bent downward is formed by the upper surfaces of the first shaping member 131 and the second shaping member 132. Preferably, in the embodiment of the present application, the upper surfaces of both the first shaping member 131 and the second shaping member 132 include an arcuate surface that is concave downward and inward, such as Figure 6 shown.

[0123] Furthermore, the shaping component 13 also includes at least one opening 133 formed through the circuit board 11 and connected to the accommodating space 100, wherein after the photosensitive chip 12 is attached to the first shaping piece 131 to form the accommodating space 100, the gas in the accommodating space 100 can be discharged through the opening 133 to form a pressure difference between the upper and lower surfaces 121, 122 of the photosensitive chip 12 to force the photosensitive chip 12 to bend downward until it is attached to the shaping surface 130 formed by the first shaping piece 131 and the second shaping piece 132.

[0124] In order to form the accommodation space 100, in the embodiment of the present application, the first shaping member 131 has a closed shape. Figure 5 As shown, preferably, the shape of the first shaping member 131 is adapted to the shape of the circuit board 11 and the photosensitive chip 12. Those skilled in the art should know that the shapes of the existing circuit board 11 and the photosensitive chip 12 are usually rectangular, and accordingly, the shape of the first shaping member 131 is preferably implemented as a closed "mouth" shape. Of course, those skilled in the art should understand that with the development of camera module technology and the expansion of its application scenarios, the shapes of the circuit board 11 and the photosensitive chip 12 will change, and correspondingly, the shape of the first shaping member 131 can also be adaptively adjusted, which is not limited to this application.

[0125] It should be understood that the first shaping member 131 of the square shape has an opening. Accordingly, after the first shaping member 131 is fixed to the circuit board 11, the opening is shielded by the photosensitive chip 12 attached to the first shaping member 131, so that the photosensitive chip 12, the circuit board 11 and the first shaping member 131 surround and form the accommodating space 100. Preferably, the size of the first shaping member 131 is adapted to the size of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the first shaping member 131 is supported on the edge of the photosensitive chip 12. Those skilled in the art should know that the upper surface 121 of the photosensitive chip 12 includes a photosensitive area 1211 and a non-photosensitive area 1212 located around the photosensitive area 1211, wherein the photosensitive area 1211 is a sensitive area and is usually located at the central portion of the upper surface 121 of the photosensitive chip 12, and the non-photosensitive area 1212 is located at the edge of the upper surface 121 and surrounds the photosensitive area 1211. In other words, the size of the first shaping member 131 is adapted to the photosensitive chip 12, so that the first shaping member 131 is supported on the non-photosensitive area 1212 of the photosensitive chip 12, thereby ensuring that the photosensitive area 1211 of the photosensitive chip 12 will not be damaged during the subsequent bending of the photosensitive chip 12. It is worth noting that the center line of the photosensitive chip 12 mentioned in the present invention is based on the premise that the photosensitive chip is of a regular shape, that is, the photosensitive area 1211 and the non-photosensitive area 1212 of the photosensitive chip 12 are symmetrically distributed about the center. When the photosensitive chip 12 is of an irregular shape, the center line of the photosensitive chip 12 in the present invention refers to the center line of the photosensitive area 1211.

[0126] More preferably, the shape and size of the first shaping member 131 are adapted to the size and shape of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the first shaping member 131 is supported on the non-photosensitive area 1212 of the photosensitive chip 12, and the center of the first shaping member 131 is coaxial with the center of the photosensitive chip 12. In other words, the photosensitive chip 12 is coaxially attached to the first shaping member 131.

[0127] like Figure 3As shown, in the embodiment of the present application, the first shaping member 131 includes a first shaping member body 1311 and an adhesive 1340 applied to the first shaping member body, wherein the first shaping member body 1311 is arranged on the circuit board 11, and the adhesive 1340 is used to bond the photosensitive chip 12. It should be understood that the role of the adhesive 1340 is to bond the first shaping member body 1311 and the photosensitive chip 12, and its thickness and material do not constitute a limitation to the present application. Moreover, in other examples of the present application, the photosensitive chip 12 can also be directly arranged on the first shaping member body 1311 by ultrasonic welding or other processes without the adhesive 1340. That is to say, in other examples of the present application, the adhesive is a non-essential element 1340. Preferably, in the embodiment of the present application, the adhesive 1340 has a certain flexibility and high viscosity.

[0128] In particular, before forming the accommodating space 100 , the second shaping member 132 should be preset at a preset position of the circuit board 11 , so that after the photosensitive chip 12 is bonded to the first shaping member 131 to form the accommodating space 100 , the second shaping member 132 can be accommodated in the accommodating space 100 .

[0129] As mentioned above, the height of the second shaping member 132 is less than the height of the first shaping member 131. In particular, in the embodiment of the present application, the height setting of the second shaping member 132 is related to the relative positional relationship between the second shaping member 132 and the first shaping member 131. Specifically, the shape of the shaping surface 130 formed by the first shaping member 131 and the second shaping member 132 is set based on the shape of the actual focal plane. That is, the relative positional relationship between the first shaping member 131 and the second shaping member 132 and the setting of the height difference between the two should match the shape of the actual focal plane. More specifically, when the second shaping member 132 is close to the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be reduced, that is, the height of the second shaping member 132 should be increased; when the second shaping member 132 is away from the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be increased, that is, the height of the second shaping member 132 should be reduced. It is worth mentioning that in the embodiment of the present application, the shape of the shaping surface 130 matches the shape of the actual focal plane, which does not mean that the shape of the shaping surface 130 is completely consistent with or completely overlaps with the shape of the actual focal plane. It only means that the shape of the shaping surface 130 tends to be consistent with the shape of the actual focal plane.

[0130] Preferably, in the embodiment of the present application, the second shaping member 132 is arranged symmetrically relative to the center of the photosensitive chip 12. In this way, when the lower surface 122 of the photosensitive chip 12 is attached to the second shaping member 132 under the action of the pressure difference, the bonding points between the second shaping member 132 and the photosensitive chip 12 are also symmetrically distributed relative to the center of the photosensitive chip 12, so as to form a uniform bonding force on the opposite sides or around the photosensitive chip 12, so as to ensure that the photosensitive chip 12 can be shaped more stably. More specifically, in the embodiment of the present application, the second shaping member 132 is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip 12. Of course, those skilled in the art should understand that in other examples of the present application, the second shaping member 132 can also be arranged symmetrically relative to the center of the photosensitive chip 12 in other ways. It is worth mentioning that in the embodiment of the present application, the shape of the second shaping member 132 is not limited by the present application, and includes but is not limited to a slender shape, a columnar shape, etc.

[0131] Similar to the first shaping member 131, in the embodiment of the present application, the second shaping member 132 includes a second shaping member body 1321 and an adhesive 1340 applied to the second shaping member body 1321. It should be understood that the photosensitive chip 12 is bonded to the upper surface of the second shaping member 132 by the adhesive 1340 to prevent the photosensitive chip 12 from being suspended in the middle and breaking, and to prevent the photosensitive chip 12 from deforming during use (for example, gradually tending to a planar photosensitive chip). It is worth noting that in the embodiment of the present application, the adhesive 1340 applied to the first shaping member body 1311 and the adhesive 1340 applied to the second shaping member body 1321 can be implemented as the same adhesive 1340 or different types of adhesives 1340, and the application amount or thickness of the adhesive 1340 is not limited by the present application.

[0132] Preferably, in the embodiment of the present application, the first shaping member body 1311 and the second shaping member body 1321 are made of a material with high hardness and high thermal conductivity, for example, a metal material (including pure metal material, metal and non-metal alloy material, metal and metal alloy material). It should be noted that in the embodiment of the present application, the first shaping member body 1311 and the second shaping member body 1321 extend between the photosensitive chip 12 and the circuit board 11 respectively, so that when the first shaping member body 1311 and the second shaping member body 1321 are implemented as being made of a metal material with high thermal conductivity, the heat generated by the operation of the photosensitive chip 12 can be efficiently conducted to the circuit board 11 through the first shaping member body 1311 and the second shaping member body 1321 and finally dissipated to the outside. The heat dissipation part will be further described in the subsequent description and will not be expanded here.

[0133] When the photosensitive chip 12 is bonded to the first shaping member 131 to define the accommodation space 100, there is a certain distance between the lower surface 122 of the photosensitive chip 12 and the adhesive 1340 of the second shaping member 132. Accordingly, as the gas in the accommodation space 100 is sucked out through the opening 133, the photosensitive chip 12 is continuously bent downward under the action of the pressure difference so that the distance between the lower surface 122 of the photosensitive chip 12 and the second shaping member 132 is continuously reduced until the lower surface 122 of the photosensitive chip 12 contacts the adhesive 1340 of the second shaping member 132, so that the photosensitive chip 12 is also bonded to the second shaping member 132 through the adhesive 1340. When the photosensitive chip 12 is bonded to the first shaping member 131 and the second shaping member 132 at the same time, the shape of the photosensitive chip 12 is shaped into the shape of the shaping surface 130 so that the shape of the lower surface 122 of the photosensitive chip 12 is adapted to the actual focal plane.

[0134] like Figure 5As shown, in the embodiment of the present application, the opening 133 is formed at a position on the circuit board 11 corresponding to the central area of ​​the photosensitive chip 12. In this way, when the gas in the accommodating space 100 is discharged through an air suction device such as an air pump, the gas in the accommodating space 100 can flow out of the opening 133 from all sides in a specific manner (the flow rate of other gases near the center of the photosensitive chip 12 is fast, and the flow rate of gases near the edge of the photosensitive chip 12 is slow). Based on the relationship between pressure and flow rate, it can be known that the pressure difference formed at various positions between the upper and lower surfaces 121, 122 of the photosensitive chip 12 gradually increases from the edge position to the central area of ​​the photosensitive chip 12, so that under the action of the increasing pressure difference, the deformation degree of the photosensitive chip 12 gradually increases from the edge of the photosensitive chip 12 to the center of the photosensitive chip 12 to bend and deform downward in a manner tending to the shaping surface 130. That is to say, in the embodiment of the present application, the position of the opening 133 formed on the circuit board 11 is set to correspond to the central area of ​​the photosensitive chip 12, which is conducive to the deformation mode of the photosensitive chip 12 being more inclined to the shape of the actual focal plane, and the gradual pressure difference (no stress mutation) is conducive to preventing the photosensitive chip 12 from suddenly breaking during the deformation process. It is worth mentioning that in the embodiment of the present application, the number of the openings 133 can be set to one or more, which is not limited by the present application.

[0135] Of course, it should be understood that in other examples of the embodiment of the present application, the opening 133 can also be formed at other positions on the circuit board 11.

[0136] Figure 7 FIG. 1 is a top view schematic diagram of a modified implementation of the photosensitive component according to an embodiment of the present application. Figure 7 As shown, in this variant embodiment, the position where the opening 133 is formed on the circuit board 11 is located between the first shaping member 131 and the second shaping member 132. Preferably, in this variant embodiment, the position where the opening 133 is formed on the circuit board 11 is symmetrically arranged relative to the center of the photosensitive chip 12, so that when the gas in the accommodating space 100 is discharged through an air suction device such as an air pump, the gas in the accommodating space 100 can be discharged relatively evenly and symmetrically along the opening 133, thereby forming a relatively consistent pressure difference at each position symmetrical relative to the center of the photosensitive chip 12, so that the photosensitive chip 12 can be bent downward more symmetrically and gently in a manner tending to the shape of the shaping surface 130.

[0137] Figure 8 FIG. 2 is a schematic diagram showing another variant implementation of the photosensitive component according to an embodiment of the present application. Figure 8As shown, in this variant embodiment, the positions where part of the openings 133 are formed on the circuit board 11 correspond to the central area of ​​the photosensitive chip 12, and the positions where another part of the openings 133 are formed on the circuit board 11 are located between the first shaping member 131 and the second shaping member 132. In particular, in this variant embodiment, the positions where another part of the openings 133 are formed on the circuit board 11 are symmetrically arranged relative to the center of the photosensitive chip 12.

[0138] In order to facilitate the positioning and installation of the first shaping member 131 and the second shaping member 132, as shown in FIG. Fig. 9 As shown, in some examples of the embodiments of the present application, the circuit board 11 also includes a first positioning groove 111 and a second positioning groove 112 recessedly formed on the top surface of the circuit board 11, wherein the first positioning groove 111 is used to position so as to adaptively install the first shaping member 131 therein, and the second positioning groove 112 is used to position so as to adaptively install the second shaping member 132 therein.

[0139] In some other examples of the present application, in order to facilitate the positioning and installation of the first shaping member 131 and the second shaping member 132, as shown in FIG. Fig.10 As shown, the circuit board 11 also includes a first positioning through hole 111A and a second positioning through hole 112A formed through the circuit board 11, wherein the first positioning through hole 111A is used for positioning so as to adaptably install the first shaping member 131 therein, and the second positioning through hole 112A is used for positioning so as to adaptably install the second shaping member 132 therein. In addition, the photosensitive component 10 also includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11. Preferably, the reinforcing plate 18 is made of a metal material with high thermal conductivity, so that the heat generated by the photosensitive chip 12 can be directly conducted to the reinforcing plate 18 through the first shaping member 131 and the second shaping member 132 to achieve the purpose of heat dissipation.

[0140] It is worth mentioning that in the embodiment of the present application, the first shaping member 131 and the second shaping member 132 are prefabricated members, that is, the first shaping member body 1311 and the second shaping member body 1321 are attached to the preset position of the circuit board 1 after prefabrication. Alternatively, the first shaping member 131 and the second shaping member 132 can also be integrally formed at the preset position of the circuit board 11. For example, when the first shaping member body 1311 and the second shaping member body 1321 are made of metal materials, the first shaping member body 1311 and the second shaping member body 1321 can be integrally formed at the preset position of the circuit board 11 through an electroplating molding process. Of course, it should be easy to understand that when the first shaping member body 1311 and the second shaping member body 1321 are made of other materials with higher hardness and higher thermal conductivity, the first shaping member 131 and the second shaping member 132 can be integrally formed at the preset position of the circuit board 11 by a corresponding integral molding process. This is not limited to the present application.

[0141] It is also worth mentioning that in other examples of the embodiments of the present application, the shaping component 13 may also include more or fewer shaping pieces. Fig.11 As shown, the shaping component 13 further includes a third shaping member 134 (including a third shaping member 134 body and an adhesive 1340 applied on the top surface of the third shaping member 134 body), wherein the third shaping member 134 is disposed between the first shaping member 131 and the second shaping member 132, so that the shaping surface 130 is formed by the first shaping member 131, the second shaping member 132 and the third shaping member 134. For example, Fig.12 As shown, in another example of the present application, the shaping component 13 only includes the first shaping piece 131, wherein the upper surface of the first shaping piece 131 includes an arcuate surface that is concave downward and inward, and the arcuate surface is configured so that when the photosensitive chip 12 is bent downward, a lower surface 122 that is adapted to the focal imaging surface of the photosensitive component 10 is formed.

[0142] Fig.13 FIG. 2 is a schematic diagram showing another variant implementation of the photosensitive component according to an embodiment of the present application. Fig.13As shown, in this variant embodiment, both the first shaping member 131 and the second shaping member 132 have a closed ring shape to form a receiving cavity between the first shaping member 131 and the second shaping member 132. In particular, in this variant embodiment, the shaping component 13 further includes an adhesive 1340 disposed between the first shaping member 131 and the second shaping member 132, wherein the highest point of the upper surface of the adhesive 1340 is higher than the upper surface of the second shaping member 132. It should be understood that in this variant embodiment, the adhesive 1340 should have a high viscosity to prevent the adhesive 1340 from flowing out from the upper surface of the second shaping member 132. In this way, when the photosensitive chip 12 is attached to the first shaping member 131, the pressure difference generated by the gas in the receiving space 100 through suction can force the photosensitive chip 12 to bend downward until it is bonded to the adhesive 1340 disposed between the first shaping member 131 and the second shaping member 132. It is worth mentioning that in this modified embodiment, the adhesive 1340 may not be provided on the upper surface of the second shaping member 132. It is worth noting that since the adhesive 1340 is higher than the second shaping member 132, the adhesive 1340 may flow to the upper surface of the second shaping member 132 during inhalation, so that the photosensitive chip 12 is bent downward and then adhered to the second shaping member 132 through the adhesive 1340, so as to achieve better adhesion and improve reliability. Furthermore, the adhesive 1340 may not be higher than the second shaping member 132, for example, the upper surface of the adhesive 1340 is flush with the upper surface of the second shaping member 132.

[0143] In order to improve the heat dissipation performance of the photosensitive component, Figures 3 to 4B As shown, in the embodiment of the present application, the photosensitive component 10 also includes a heat sink 19 formed in the accommodating space 100, wherein the heat sink 19 is attached to at least a portion of the lower surface 122 of the photosensitive chip 12, so that the heat generated by the photosensitive chip 12 can be conducted to the outside through the heat sink 19 in contact with the photosensitive chip 12.

[0144] Preferably, in the embodiment of the present application, the heat sink 19 fills the entire accommodation space 100, so that the lower surface 122 of the photosensitive chip 12 is completely in contact with the heat sink 19, so as to maximize the heat dissipation area and improve the heat dissipation performance. It is worth mentioning that the formation position and filling ratio of the heat sink 19 in the accommodation space 100 depend on the shape of the second shaping member 132 and the position setting of the at least one opening 133.

[0145] Specifically, when the second shaping member 132 is implemented as a closed "mouth" shape, and the at least one opening 133 is formed at a position of the circuit board 11 corresponding to the central area of ​​the photosensitive chip 12, the heat sink 19 can only occupy the cavity surrounded by the second shaping member 132, the photosensitive chip 12 and the circuit board 11 at most. Fig.14 Of course, even if the second shaping member 132 is implemented as a closed "mouth" shape, the heat sink 19 can also occupy the entire accommodating space 100, and it is only necessary to set the position where part of the openings 133 are formed on the circuit board 11 to correspond to the central area of ​​the photosensitive chip 12, and at the same time, set the position where another part of the openings 133 are formed on the circuit board 11 to be located between the first shaping member 131 and the second shaping member 132.

[0146] In a specific implementation, the heat dissipation material 190 used to make the heat dissipation element 19 can enter the accommodating space 100 through the opening 133 to form the heat dissipation element 19 in the accommodating space 100 .

[0147] For example, when the heat dissipation material 190 is implemented as a fluid heat dissipation material 190, the fluid heat dissipation material 190 can be injected into the accommodating space 100 through the opening 133 to form the heat dissipation member 19 after curing. For ease of operation, when performing the injection process, the photosensitive component 10 can be inverted to prevent the fluid heat dissipation material 190 from flowing out of the opening 133. In particular, when there is only one opening 133, in order to balance the internal and external pressures so that the fluid heat dissipation material 190 can be smoothly injected into the accommodating space 100, a vent hole 135 can be further opened on the circuit board 11, such as Fig.15 Of course, when the number of the openings 133 exceeds one, the air intake hole, in addition to being used to inject the heat dissipation material 190, functions as the vent hole 135. That is, when the number of the openings 133 exceeds one, at least one of the openings forms the vent hole 135.

[0148] It is worth mentioning that when the heat sink 19 is solidified by the fluid heat sink material 190, preferably, the heat sink material 190 can fill the entire accommodating space 100, so that after solidification, on the one hand, the heat sink 19 is attached to the entire lower surface 122 of the photosensitive chip 12 (corresponding to the portion of the accommodating space 100) to increase the heat dissipation area; on the other hand, the heat sink 19 extends from the lower surface 122 of the photosensitive chip 12 to the opening 133, that is, the heat sink 19 extends directly to the outside to facilitate heat dissipation. Of course, in other examples of the embodiments of the present application, the photosensitive component 10 also includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11. Preferably, the reinforcing plate 18 is made of a metal material with high thermal conductivity, so as to further enhance the heat dissipation performance of the photosensitive component 10.

[0149] Of course, in other examples of the embodiment of the present application, the heat dissipation material 190 can also be implemented in other forms, for example, a granular heat dissipation material 190, such as Fig.16 As shown. Accordingly, the granular heat dissipation material 190 can be filled into the accommodating space 100 to form the heat dissipation member 19. In order to prevent the granular heat dissipation material 190 from leaking out of the opening 133, in this example of the embodiment of the present application, the photosensitive component 10 also includes a reinforcing plate 18 for sealing the opening 133, and, preferably, the reinforcing plate 18 is made of a metal material with high thermal conductivity, so as to further enhance the heat dissipation performance of the photosensitive component 10 while sealing the opening 133.

[0150] Furthermore, if Figure 3 As shown, in an embodiment of the present application, the photosensitive component 10 also includes at least one electronic component 14, which is used to electrically connect the photosensitive chip 12 to the leads of the circuit board 11, a filter element 15 and a bracket 16, wherein the at least one electronic component 14 is arranged on the circuit board 11 and located around the photosensitive chip 12, including but not limited to capacitors, resistors, inductors, etc.

[0151] After the photosensitive chip 12 is attached to the first shaping member 131 and bent into shape, the electrical connection between the photosensitive chip 12 and the circuit board 11 is achieved through the leads 123. Specifically, each of the leads 123 extends between the photosensitive chip 12 and the circuit board 11 in a bent manner, so as to electrically connect the photosensitive chip 12 to the circuit board 11 through the leads 123, so that the circuit board 11 can supply power to the photosensitive chip 12 based on the leads 123, and the photosensitive chip 12 can transmit the collected signals based on the leads 123.

[0152] It is worth mentioning that in this specific example, the type of the lead 123 is not limited by the present application, for example, the lead 123 can be a gold wire, a silver wire, or a copper wire. Moreover, the lead 123 can be installed between the circuit board 11 and the photosensitive chip 12 by a "gold wire" process to achieve electrical connection between the two.

[0153] Specifically, the "gold wire punching" process is generally divided into two types: "positive gold wire punching" process and "reverse gold wire punching" process. The "positive gold wire punching" process refers to the process of laying out the lead 123, first forming one end of the lead 123 on the conductive end of the circuit board 11, then extending the lead 123 in a curved manner, and finally forming the other end of the lead 123 on the conductive end of the photosensitive chip 12. In this way, the lead 123 is formed between the photosensitive chip 12 and the circuit board 11. The "reverse gold wire punching" process refers to the process of laying out the lead 123, first forming one end of the lead 123 on the conductive end of the photosensitive chip 12, then extending the lead 123 in a curved manner, and finally forming the other end of the lead 123 on the conductive end of the circuit board 11. In this way, the lead 123 is formed between the photosensitive chip 12 and the circuit board 11. It is worth mentioning that the upward protrusion height of the lead 123 formed by the “reverse gold wire punching” process is relative to the upward protrusion height of the lead 123 formed by the “forward gold wire punching” process. Therefore, preferably, in this specific implementation, the lead 123 is formed by the “reverse gold wire punching” process.

[0154] Of course, those skilled in the art should know that in other examples of the embodiments of the present application, the photosensitive chip 12 and the circuit board 11 can be connected in other ways (without using the lead 123), such as using a back-connection technical solution. This is not limited to the present application.

[0155] like Figure 3 As shown, in the embodiment of the present application, the bracket 16 is arranged on the circuit board 11 to support the filter element 15. Specifically, in the embodiment of the present application, the bracket 16 is implemented as a traditional plastic bracket 16, which is prefabricated and attached to the top surface of the circuit board 11, wherein the filter element 15 is installed on the top of the bracket 16 and corresponds to at least the photosensitive area 1211 of the photosensitive chip 12, so as to filter the light entering the photosensitive chip 12 to improve the imaging quality. That is to say, in the embodiment of the present application, the photosensitive component 10 is based on the traditional COB process.

[0156] Those skilled in the art should know that the filter element 15 can be implemented in different types, including but not limited to the filter element 15 can be implemented as an infrared cut-off filter, a full-spectrum filter, and other filters or a combination of multiple filters. Specifically, for example, when the filter element 15 is implemented as a combination of an infrared cut-off filter and a full-spectrum filter, that is, the infrared cut-off filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 12, so that when used in an environment with sufficient light such as daytime, the infrared cut-off filter can be switched to the photosensitive path of the photosensitive chip 12, so as to filter the infrared rays in the light reflected by the object entering the photosensitive chip 12 by the infrared cut-off filter, and when used in an environment with dark light such as night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 12 to allow the infrared rays in the light reflected by the object entering the photosensitive chip 12 to be partially transparent.

[0157] Fig.17 FIG. 2 is a schematic diagram showing another variant implementation of the photosensitive component according to an embodiment of the present application. Fig.17 As shown, in this variant implementation, the photosensitive component 10 is prepared based on the MOB (Molding on Board) process. Specifically, in this variant embodiment, the bracket 16 is implemented as a molded bracket 16A, which is integrally formed on the circuit board 11 through a molding process to integrally cover at least a portion of the circuit board 11 and at least a portion of the electronic components 14.

[0158] In a specific preparation process, the circuit board 11 can be placed in a lower mold, and then an upper mold matched with the lower mold is provided to form a molding cavity between the upper and lower molds after the upper and lower molds are molded together, wherein the upper mold includes a pressing block pressed against the circuit board 11 when the molds are closed. Then, a molding material is injected into the molding cavity, and after solidification and molding, the molding bracket 16A integrally covering at least a portion of the circuit board 11 and at least a portion of the electronic components 14 is obtained.

[0159] It is worth mentioning that the shape of the inner side surface of the molded support 16A is determined by the shape of the pressing block. For example, when the side surface of the pressing block is perpendicular to the circuit board 11, the inner side surface of the molded support 16A is perpendicular to the upper surface 121 of the photosensitive chip 12. For another example, when the inner side surface of the pressing block is inclined to the circuit board 11, the inner side surface of the molded support 16A extends outwardly at an angle.

[0160] It is worth mentioning that when the photosensitive component 10 is manufactured based on the MOB process, preferably, the first shaping member 131 and the second shaping member 132 of the shaping component are installed at the preset position of the circuit board 11 after the mold bracket 16A is integrally formed at the preset position of the circuit board 11. Such a manufacturing sequence is conducive to engineering implementation.

[0161] Fig.18 FIG. 2 is a schematic diagram showing another variant implementation of the photosensitive component according to an embodiment of the present application. Fig.18 As shown, in this variant implementation, the photosensitive component 10 is prepared based on the MOC (Molding on Chip) process. Specifically, in this variant embodiment, the bracket 16 is implemented as a molded bracket 16B, which is integrally formed on the circuit board 11 through a molding process to integrally cover at least a portion of the circuit board 11, the at least one electronic component 14, and at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12.

[0162] In a specific preparation process, after the photosensitive chip 12 is attached to the first shaping piece 131 and bent to be attached to the second shaping piece 132 (for ease of description, this state is positioned as a semi-finished component), the semi-finished component is placed in a lower mold, and an upper mold that matches the lower mold is provided to form a molding cavity between the upper and lower molds after the upper and lower molds are closed. The upper mold includes a pressing block, wherein the pressing block is pressed against the non-photosensitive area 1212 of the photosensitive chip 12 when the molds are closed. Then, the molding material is injected into the molding cavity, and after solidification and demolding, the molding bracket 16B that integrally covers at least a portion of the circuit board 11, the at least one electronic component 14, and at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12 is obtained, wherein the area occupied by the pressing block corresponds to the light-through hole of the photosensitive chip 12.

[0163] It is worth mentioning that the shape of the inner side surface of the molding support 16B is determined by the shape of the pressing block. For example, when the side surface of the pressing block is perpendicular to the upper surface 121 of the photosensitive chip 12, the inner side surface of the molding support 16B is perpendicular to the upper surface 121 of the photosensitive chip 12. For another example, when the inner side surface of the pressing block is inclined to the upper surface 121 of the photosensitive chip 12, the inner side surface of the molding support 16B extends outwardly at an angle. In particular, when the inner side surface of the pressing block has a stepped shape, the inner side surface of the molding support 16B also has a stepped shape to form a mounting platform 160 on the top surface of the molding support 16B for mounting the filter element 15. For the sake of convenience, this technical solution is defined as the IOM solution (IR Filter on Molding) in the application, such as Fig.19shown.

[0164] It is worth mentioning that when the photosensitive component 10 is manufactured based on the MOC process, the first shaping member 131 and the second shaping member 132 of the shaping component are pre-installed or integrally formed at a preset position of the circuit board 11 before the molded bracket 16B is integrally formed at a preset position of the circuit board 11 and the photosensitive chip 12. Such a manufacturing sequence is conducive to engineering implementation.

[0165] It is worth mentioning that in order to prevent the photosensitive chip 12 from being impacted by the injected molding material and causing positional displacement during the MOC process, in some examples of this modified embodiment of the present application, the photosensitive component 10 also includes a side encapsulation 161 that wraps the photosensitive chip 12 and the side of the first shaping member 131, which is used to prevent the position of the photosensitive chip 12 from being displaced during the molding process. Fig. 20 It should be understood that the side encapsulation glue 161 can not only prevent the position of the photosensitive chip 12 from shifting, but also effectively reduce the stress generated by the molded bracket 16B from being transmitted to the photosensitive chip 12 .

[0166] Fig.21 FIG. 2 is a schematic diagram showing another variant implementation of the photosensitive component according to an embodiment of the present application. Fig.21 As shown, in this modified implementation, the filter element 15 is stacked on the photosensitive chip 12, and the bracket 16 is implemented as a molded bracket 16C, which is integrally formed by a molding process to cover at least a portion of the circuit board 11, the at least one electronic component 14, at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12, and at least a portion of the filter element 15.

[0167] In a specific preparation process, after the photosensitive chip 12 is attached to the first shaping piece 131 and bent to be attached to the second shaping piece 132, the filter element 15 is stacked on the photosensitive chip 12 to form a semi-finished component. Then, the semi-finished component is placed in a lower mold, and an upper mold matching the lower mold is provided to form a molding cavity between the upper and lower molds after the upper and lower molds are closed. The upper mold includes a pressing block, wherein the pressing block is pressed against the filter element 15 when the molds are closed. Then, the molding material is injected into the molding cavity, and after solidification and demolding, the molding bracket 16C is obtained, which integrally covers at least a portion of the circuit board 11, the at least one electronic component 14, and at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12, wherein the area occupied by the pressing block corresponds to the light-through hole of the photosensitive chip 12.

[0168] It is worth mentioning that the shape of the inner side surface of the molded support 16C is determined by the shape of the pressing block. For example, when the side surface of the pressing block is perpendicular to the filter element 15, the inner side surface of the molded support 16C is perpendicular to the filter element 15. For another example, when the inner side surface of the pressing block is inclined to the filter element 15, the inner side surface of the molded support 16C extends outwardly. For the convenience of explanation, this technical solution is defined as IOC solution (IR Filter on Chip) in the application.

[0169] It is worth mentioning that in the embodiment of the present application, in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, the molded bracket 16A, 16B, 16C) and the photosensitive chip 12, the filter element 15 can also be installed in other ways, and the filter element 15 only needs to be kept in the photosensitive path of the photosensitive component 10. For example, in other examples of the embodiment of the present application, the photosensitive component 10 further includes a filter element bracket 17, and the filter element bracket 17 is installed on the bracket 16 and is used to install the filter element 15. For another example, when the photosensitive component 10 cooperates with the optical lens 20 to form a camera module, the filter element 15 can also be supported in the optical lens 20, or formed on the surface of the lens in the optical lens 20 in the form of a coating. This is not limited to the present application.

[0170] In summary, the photosensitive component based on the embodiment of the present application is explained, which uses a special manufacturing process to bend the planar photosensitive chip into a shape that is adapted to the actual focal imaging surface, so as to improve the imaging quality of the camera module.

[0171] The following describes the manufacturing process of the photosensitive component 10 from the perspective of manufacturing technology.

[0172] like Figure 4A and Figure 4B As shown, the manufacturing process of the photosensitive component 10 based on the embodiment of the present application is explained, which is used to prepare the photosensitive component as described above and its deformation implementation.

[0173] Specifically, the method for manufacturing the photosensitive component 10 according to the embodiment of the present application includes the following steps:

[0174] First, a circuit board 11 , a photosensitive chip 12 , a first shaping member 131 and a second shaping member 132 are provided, wherein the circuit board 11 includes at least one opening 133 .

[0175] Next, the first shaping member 131 and the second shaping member 132 are fixedly mounted at preset positions of the circuit board 11 .

[0176] Then, the photosensitive chip 12 is attached to the first shaping member 131 to define a accommodating space 100 between the first shaping member 131, the circuit board 11 and the photosensitive chip 12, wherein the opening 133 formed on the circuit board 11 is connected to the accommodating space 100, wherein the second shaping member 132 is located in the accommodating space 100, and the height of the second shaping member 132 is lower than that of the first shaping member 131, wherein the upper surface of at least one of the first shaping member and the second shaping member includes an arcuate surface that is recessed downward and inward.

[0177] Then, the gas in the accommodating space 100 is sucked out through the opening 133 to generate a pressure difference between the upper surface 121 and the lower surface of the photosensitive chip 12, thereby forcing the photosensitive chip 12 to bend downward until it is attached to the second shaping member 132, so that the lower surface 122 of the photosensitive chip 12 is adaptively attached to the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132.

[0178] It is worth mentioning that the opening 133 on the circuit board 11 can also be formed by a punching process after the accommodating space 100 is formed, which is not limited to the present application.

[0179] Preferably, in the embodiment of the present application, the first shaping member 131 should have a closed shape (for example, implemented as a "mouth" shape), the second shaping member 132 is arranged symmetrically with respect to the center of the photosensitive chip 12, and the position where the opening 133 is formed on the circuit board 11 corresponds to the central area of ​​the photosensitive chip 12. Alternatively, the position where the opening 133 is formed on the circuit board 11 is located between the first shaping member 131 and the second shaping member 132, and the position where the opening 133 is formed on the circuit board 11 is arranged symmetrically with respect to the center of the photosensitive chip 12.

[0180] It is worth mentioning that the height setting of the second shaping member 132 is related to the relative positional relationship between the second shaping member 132 and the first shaping member 131. Specifically, the shape of the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132 for defining the curved shape of the photosensitive chip 12 is set based on the shape of the actual focal plane. More specifically, when the second shaping member 132 is close to the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be reduced (i.e., the height of the second shaping member 132 should be increased); when the second shaping member 132 is away from the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be increased (i.e., the height of the second shaping member 132 should be reduced). It is worth mentioning that in the embodiment of the present application, the shape of the shaping surface 130 matches the shape of the actual focal plane, which does not mean that the shape of the shaping surface 130 is completely consistent with or completely overlaps with the shape of the actual focal plane. It only means that the shape of the shaping surface 130 tends to be consistent with the shape of the actual focal plane.

[0181] In particular, in the embodiment of the present application, the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arcuate surface that is concave downward and inward, and the arcuate surface is configured so that when the photosensitive chip 12 is bent downward, a lower surface 122 that matches the focal imaging surface of the photosensitive component 10 is formed, so that the shaping surface 130 that is bent downward is formed by the upper surfaces of the first shaping member 131 and the second shaping member 132. Preferably, in the embodiment of the present application, the upper surfaces of both the first shaping member 131 and the second shaping member 132 include an arcuate surface that is concave downward and inward.

[0182] Accordingly, the process of bending the photosensitive chip 12 includes:

[0183] The photosensitive chip 12 is bent until the lower surface 122 of the photosensitive chip 12 is attached to the arc surface, so that the photosensitive chip 12 forms a lower surface that matches the focal imaging surface of the photosensitive component 10 when bent downward.

[0184] like Figure 4B As shown, the manufacturing method further comprises the steps of:

[0185] A heat sink 19 is formed in the accommodating space 100 defined by the first shaping member 131 , the photosensitive chip 12 , and the circuit board 11 , wherein the heat sink 19 is attached to at least a portion of the lower surface 122 of the photosensitive chip 12 .

[0186] Preferably, in the embodiment of the present application, the heat sink 19 occupies the entire accommodating space 100 so that the lower surface 122 of the photosensitive chip 12 (the portion corresponding to the accommodating space 100) is completely in contact with the heat sink 19. In this way, the heat dissipation area is maximized and the heat dissipation performance is improved.

[0187] In a specific implementation, when the heat dissipation material 190 is implemented as a fluid-like heat dissipation material 190, the process of forming the heat dissipation element 19 in the accommodating space 100 includes: injecting the fluid-like heat dissipation material 190 into the accommodating space 100 through the opening 133 to form the heat dissipation element 19 after curing.

[0188] For ease of operation, when performing the injection process, the photosensitive component 10 can be inverted to prevent the fluid heat dissipation material 190 from flowing out of the opening 133. In particular, when the number of the opening 133 is only one, in order to balance the internal and external pressures so that the fluid heat dissipation material 190 can be smoothly injected into the accommodating space 100, a vent hole 135 can be further opened on the circuit board 11. Of course, when the number of the openings 133 exceeds one, the air intake hole, in addition to being used to inject the heat dissipation material 190, serves as the vent hole 135. That is to say, when the number of the openings 133 exceeds one, at least one of the air intake holes forms the vent hole 135.

[0189] After the heat sink 19 is formed, a reinforcing plate 18 may be further attached to the bottom surface of the circuit board 11 , wherein preferably, the reinforcing plate 18 is made of a metal material with high thermal conductivity, thereby further enhancing the heat dissipation performance of the photosensitive component 10 .

[0190] In a specific implementation, when the heat dissipation material 190 is implemented as a granular heat dissipation material 190. The process of forming the heat dissipation member 19 in the accommodation space 100 includes: filling the granular heat dissipation material 190 into the accommodation space 100 through the opening 133, and attaching a reinforcing plate 18 to the bottom surface of the circuit board 11 to seal the opening 133 through the reinforcing plate 18. Preferably, the reinforcing plate 18 is made of a metal material with a high thermal conductivity, so as to further enhance the heat dissipation performance of the photosensitive component 10 while sealing the opening 133.

[0191] Furthermore, the manufacturing process of the photosensitive component 10 also includes: setting the bracket 16 on the circuit board 11, and installing the filter element 15 on the bracket 16.

[0192] Specifically, in the COB process, the bracket 16 is implemented as a traditional plastic bracket 16. Accordingly, the process of setting the bracket 16 on the circuit board 11 is specifically performed as follows: mounting the plastic bracket 16 on the circuit board 11. Then, mounting the filter element 15 on the bracket 16.

[0193] In the MOB process, the bracket 16 is implemented as a molded bracket 16A. Accordingly, the process of arranging the bracket 16 on the circuit board 11 includes: integrally forming the molded bracket 16A on the circuit board 11 through a molding process, wherein the molded bracket 16A covers at least a portion of the circuit board 11 and at least a portion of the at least one electronic component 14. Then, the filter element 15 is mounted on the molded bracket 16A.

[0194] It is worth mentioning that in the MOB process, the first shaping member 131 and the second shaping member 132 are installed at the preset position of the circuit board 11 after the module bracket 16 is integrally formed at the preset position of the circuit board 11. Such a manufacturing sequence is conducive to engineering implementation.

[0195] In the MOC process, the bracket 16 is implemented as a molded bracket 16B. Accordingly, the process of setting the bracket 16 on the circuit board 11 includes: integrally forming the molded bracket 16B on the circuit board 11 through a molding process, wherein the molded bracket 16B covers at least a portion of the circuit board 11, the at least one electronic component 14, and at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12. Then, the filter element 15 is mounted on the molded bracket 16B.

[0196] In order to prevent the photosensitive chip 12 from being impacted by the injected molding material and causing positional displacement during the MOC process, before the MOC process is performed to form the molding bracket 16B, side encapsulation 161 is applied to the sides of the photosensitive chip 12 and the first shaping member 131, so that the side encapsulation 161 wraps the sides of the photosensitive chip 12 and the first shaping member 131. In this way, the position of the photosensitive chip 12 is prevented from being displaced during the molding process.

[0197] In the IOC process, the bracket 16 is implemented as a molded bracket 16C. Accordingly, the process of setting the bracket 16 and the circuit board 11 includes: stacking the filter element 15 on the photosensitive chip 12, and integrally forming the molded bracket 16C on the circuit board 11, wherein the integral body covers at least a portion of the circuit board 11, the at least one electronic component 14, at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12, and at least a portion of the filter element 15.

[0198] It is worth mentioning that in the MOB, MOC and IOC processes, the shape of the inner side surface of the mold support 16 is determined by the shape of the pressing block. In particular, when the inner side surface of the pressing block has a step shape, the inner side surface of the mold support 16 also has a step shape to form a mounting platform 160 for mounting the filter element 15 on the top surface of the mold support 16. Accordingly, in these examples, the filter element 15 is mounted on the mounting platform 160.

[0199] It is also worth mentioning that in the embodiment of the present application, in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, the molded bracket 16A, 16B, 16C) and the photosensitive chip 12, the filter element 15 can also be installed in other ways, and the filter element 15 only needs to be kept in the photosensitive path of the photosensitive component 10. For example, in other examples of the embodiment of the present application, the photosensitive component 10 further includes a filter element bracket 17, and the filter element bracket 17 is installed on the bracket 16 and is used to install the filter element 15. For another example, when the photosensitive component 10 cooperates with the optical lens 20 to form a camera module, the filter element 15 can also be supported in the optical lens 20, or formed on the surface of the lens in the optical lens 20 in the form of a coating. This is not limited to the present application.

[0200] like Fig.22A and 22B As shown, a second manufacturing process of the photosensitive component based on an embodiment of the present application is illustrated, which is used to prepare the photosensitive component as described above and its modified implementation.

[0201] Specifically, if Fig.22A As shown, the manufacturing process of the photosensitive component 10 according to the embodiment of the present application includes the following steps:

[0202] First, a circuit board 11 and a photosensitive chip 12 are provided, wherein the circuit board 11 includes at least one opening 133. It is worth mentioning that the opening 133 on the circuit board 11 can also be formed by a punching process after forming the accommodating space 100, which is not limited by the present application.

[0203] Next, a first shaping piece 131 and a second shaping piece 132 are integrally formed on the circuit board 11 , wherein the height of the second shaping piece 132 is lower than that of the first shaping piece 131 . In this way, the first shaping piece and the second shaping piece 132 define a concave shaping surface 130 .

[0204] Then, the photosensitive chip 12 is attached to the first shaping member 131 . In this way, a containing space 100 is defined between the first shaping member 131 , the circuit board 11 and the photosensitive chip 12 , wherein the opening 133 is connected to the containing space 100 .

[0205] Then, the gas in the accommodating space 100 is sucked out through the opening 133 to generate a pressure difference between the upper surface 121 and the lower surface of the photosensitive chip 12, thereby forcing the photosensitive chip 12 to bend downward until it is attached to the second shaping member 132, so that the lower surface 122 of the photosensitive chip 12 is adaptively attached to the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132.

[0206] That is to say, compared with the first preparation process, in the second preparation process, the first shaping member 131 and the second shaping member 132 are integrally formed on the circuit board 11 rather than being prefabricated and then mounted.

[0207] Specifically, in the embodiment of the present application, the process of integrally forming a first shaping member 131 and a second shaping member 132 on the circuit board 11 includes:

[0208] Integrally forming a first shaping member body 1311 and a second shaping member body 1321 on the circuit board 11 by an electroplating molding process; and

[0209] Adhesive 1340 is applied to the first shaping member body 1311 and the second shaping member body 1321 , respectively, so that the first shaping member 131 is formed by the first shaping member body 1311 and the adhesive 1340 , and the second shaping member 132 is formed by the second shaping member body 1321 and the adhesive 1340 .

[0210] Preferably, in the embodiment of the present application, the first shaping member 131 should have a closed shape (for example, implemented as a "mouth" shape), the second shaping member 132 is arranged symmetrically with respect to the center of the photosensitive chip 12, and the position where the opening 133 is formed on the circuit board 11 corresponds to the central area of ​​the photosensitive chip 12. Alternatively, the position where the opening 133 is formed on the circuit board 11 is located between the first shaping member 131 and the second shaping member 132, and the position where the opening 133 is formed on the circuit board 11 is arranged symmetrically with respect to the center of the photosensitive chip 12.

[0211] It is worth mentioning that the height setting of the second shaping member 132 is related to the relative positional relationship between the second shaping member 132 and the first shaping member 131. Specifically, the shape of the shaping surface 130 defined by the first shaping member 131 and the second shaping member 132 for defining the curved shape of the photosensitive chip 12 is set based on the shape of the actual focal plane. More specifically, when the second shaping member 132 is close to the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be reduced (i.e., the height of the second shaping member 132 should be increased); when the second shaping member 132 is away from the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be increased (i.e., the height of the second shaping member 132 should be reduced). Preferably, the top surface of the second shaping member body 1321 is bent inward and downward.

[0212] It is worth mentioning that in the embodiment of the present application, the shape of the shaping surface 130 matches the shape of the actual focal plane, which does not mean that the shape of the shaping surface 130 is completely consistent with or completely overlaps with the shape of the actual focal plane. It only means that the shape of the shaping surface 130 tends to be consistent with the shape of the actual focal plane.

[0213] In particular, in the embodiment of the present application, the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arcuate surface that is concave downward and inward, and the arcuate surface is configured so that when the photosensitive chip 12 is bent downward, a lower surface 122 that matches the focal imaging surface of the photosensitive component 10 is formed, so that the shaping surface 130 that is bent downward is formed by the upper surfaces of the first shaping member 131 and the second shaping member 132. Preferably, in the embodiment of the present application, the upper surfaces of both the first shaping member 131 and the second shaping member 132 include an arcuate surface that is concave downward and inward.

[0214] Accordingly, the process of bending the photosensitive chip 12 includes:

[0215] The photosensitive chip 12 is bent until the lower surface 122 of the photosensitive chip 12 is attached to the arc surface, so that the photosensitive chip 12 forms a lower surface that matches the focal imaging surface of the photosensitive component 10 when bent downward.

[0216] like Fig. 22B As shown, the preparation process of the photosensitive component 10 further includes the steps of:

[0217] A heat sink 19 is formed in the accommodating space 100 defined by the first shaping member 131 , the photosensitive chip 12 , and the circuit board 11 , wherein the heat sink 19 is attached to at least a portion of the lower surface 122 of the photosensitive chip 12 .

[0218] Preferably, in the embodiment of the present application, the heat sink 19 occupies the entire accommodating space 100 so that the lower surface 122 of the photosensitive chip 12 (the portion corresponding to the accommodating space 100) is completely in contact with the heat sink 19. In this way, the heat dissipation area is maximized and the heat dissipation performance is improved.

[0219] In a specific implementation, when the heat dissipation material 190 is implemented as a fluid-like heat dissipation material 190, the process of forming the heat dissipation element 19 in the accommodating space 100 includes: injecting the fluid-like heat dissipation material 190 into the accommodating space 100 through the opening 133 to form the heat dissipation element 19 after curing.

[0220] For ease of operation, when performing the injection process, the photosensitive component 10 can be inverted to prevent the fluid heat dissipation material 190 from flowing out of the opening 133. In particular, when the number of the opening 133 is only one, in order to balance the internal and external pressures so that the fluid heat dissipation material 190 can be smoothly injected into the accommodating space 100, a vent hole 135 can be further opened on the circuit board 11. Of course, when the number of the openings 133 exceeds one, the air intake hole, in addition to being used to inject the heat dissipation material 190, serves as the vent hole 135. That is to say, when the number of the openings 133 exceeds one, at least one of the air intake holes forms the vent hole 135.

[0221] After the heat sink 19 is formed, a reinforcing plate 18 may be further attached to the bottom surface of the circuit board 11 , wherein preferably, the reinforcing plate 18 is made of a metal material with high thermal conductivity, thereby further enhancing the heat dissipation performance of the photosensitive component 10 .

[0222] In a specific implementation, when the heat dissipation material 190 is implemented as a granular heat dissipation material 190. The process of forming the heat dissipation member 19 in the accommodation space 100 includes: filling the granular heat dissipation material 190 into the accommodation space 100 through the opening 133, and attaching the reinforcing plate 18 to the bottom surface of the circuit board 11 to seal the opening 133 through the reinforcing plate 18. Preferably, the reinforcing plate 18 is made of a metal material with high thermal conductivity, so as to further enhance the heat dissipation performance of the photosensitive component 10 while sealing the opening 133.

[0223] Furthermore, the manufacturing process of the photosensitive component 10 also includes: setting the bracket 16 on the circuit board 11, and installing the filter element 15 on the bracket 16.

[0224] Specifically, in the COB process, the bracket 16 is implemented as a traditional plastic bracket 16. Accordingly, the process of setting the bracket 16 on the circuit board 11 is specifically performed as follows: mounting the plastic bracket 16 on the circuit board 11. Then, mounting the filter element 15 on the bracket 16.

[0225] In the MOB process, the bracket 16 is implemented as a molded bracket 16A. Accordingly, the process of arranging the bracket 16 on the circuit board 11 includes: integrally forming the molded bracket 16A on the circuit board 11 through a molding process, wherein the molded bracket 16A covers at least a portion of the circuit board 11 and at least a portion of the at least one electronic component 14. Then, the filter element 15 is mounted on the molded bracket 16A.

[0226] It is worth mentioning that in the MOB process, the first shaping member 131 and the second shaping member 132 are installed at the preset position of the circuit board 11 after the module bracket 16 is integrally formed at the preset position of the circuit board 11. Such a manufacturing sequence is conducive to engineering implementation.

[0227] In the MOC process, the bracket 16 is implemented as a molded bracket 16B. Accordingly, the process of setting the bracket 16 on the circuit board 11 includes: integrally forming the molded bracket 16B on the circuit board 11 through a molding process, wherein the molded bracket 16B covers at least a portion of the circuit board 11, the at least one electronic component 14, and at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12. Then, the filter element 15 is mounted on the molded bracket 16B.

[0228] In order to prevent the photosensitive chip 12 from being impacted by the injected molding material and causing positional displacement during the MOC process, before performing the MOC process to form the molding bracket 16B, a side encapsulation glue 161 is applied to the side of the photosensitive chip 12 and the first shaping member 131, so that the side encapsulation glue 161 wraps the side of the photosensitive chip 12 and the first shaping member 131, thereby preventing the position of the photosensitive chip 12 from being displaced during the molding process. Furthermore, the side encapsulation glue 161 can also play a buffering role, reducing the stress transmitted to the photosensitive chip 12 by the molding bracket 16B.

[0229] In the IOC process, the bracket 16 is implemented as a molded bracket 16C. Accordingly, the process of setting the bracket 16 and the circuit board 11 includes: stacking the filter element 15 on the photosensitive chip 12, and integrally forming the molded bracket 16C on the circuit board 11, wherein the integral body covers at least a portion of the circuit board 11, the at least one electronic component 14, at least a portion of the non-photosensitive area 1212 of the photosensitive chip 12, and at least a portion of the filter element 15.

[0230] It is worth mentioning that in the MOB, MOC and IOC processes, the shape of the inner side surface of the mold support 16 is determined by the shape of the pressing block. In particular, when the inner side surface of the pressing block has a step shape, the inner side surface of the mold support 16 also has a step shape to form a mounting platform 160 for mounting the filter element 15 on the top surface of the mold support 16. Accordingly, in these examples, the filter element 15 is mounted on the mounting platform 160.

[0231] It is also worth mentioning that in the embodiment of the present application, in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, the molded bracket 16A, 16B, 16C) and the photosensitive chip 12, the filter element 15 can also be installed in other ways, and the filter element 15 only needs to be kept in the photosensitive path of the photosensitive component 10. For example, in other examples of the embodiment of the present application, the photosensitive component 10 further includes a filter element bracket 17, and the filter element bracket 17 is installed on the bracket 16 and is used to install the filter element 15. For another example, when the photosensitive component 10 cooperates with the optical lens 20 to form a camera module, the filter element 15 can also be supported in the optical lens 20, or formed on the surface of the lens in the optical lens 20 in the form of a coating. This is not limited to the present application.

[0232] In summary, the photosensitive component manufacturing method based on the embodiment of the present application is explained, which uses a special manufacturing process to bend the planar photosensitive chip into a shape that is suitable for the actual focal imaging surface to improve the imaging quality of the camera module. In addition, a heat sink for enhancing heat dissipation is formed on the lower surface of the photosensitive chip to improve heat dissipation performance.

[0233] Schematic camera module

[0234] The following specifically introduces the application of the above-mentioned photosensitive component 10 to a camera module. Those skilled in the art know that the camera module includes a dynamic focus camera module and a fixed focus camera module.

[0235] When the camera module is implemented as a fixed-focus camera module, the camera module includes the photosensitive component and the optical lens 20 as described above, wherein the optical lens 20 is held in the photosensitive path of the photosensitive component 10. Specifically, the optical lens 20 is usually mounted on the bracket 16 to hold the optical lens 20 in the photosensitive component of the photosensitive component 10. The specific effect can be seen in FIG. Fig.23 As Fig. 27 It is worth mentioning that the drawings only illustrate several typical photosensitive components in the embodiments of the present application, and their corresponding deformation implementations are not listed one by one, which should be fully understood by those skilled in the art.

[0236] During the imaging process, the external light first passes through the optical lens 20, is filtered by the filter element 15, and is then collected by the photosensitive chip 12. In particular, in the embodiment of the present application, the photosensitive chip 12 is bent based on the shape of the actual focal plane, so that the imaging quality of the camera module is improved in this way.

[0237] When the camera module is implemented as a dynamic focus camera module, Fig.28 As shown, the camera module includes the photosensitive component, optical lens 20 and driving element 30 as described above, wherein the driving element 30 is mounted on the bracket 16, and the optical lens 20 is mounted on the driving element 30, so that the driving element 30 can carry the optical lens 20 to move along the photosensitive path of the photosensitive component 10 to achieve the dynamic focus function. It is worth mentioning that the accompanying drawings only illustrate a typical photosensitive component in the embodiment of the present application, and the corresponding deformation implementations are not listed one by one, which should be fully understood by those skilled in the art.

[0238] In summary, the camera module based on the embodiment of the present application is explained, which uses a special manufacturing process to bend the planar photosensitive chip 12 into a shape that is adapted to the actual focal imaging surface, thereby improving the imaging quality of the camera module.

[0239] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A photosensitive component, characterized in that: include: Circuit board; A photosensitive chip electrically connected to the circuit board; as well as a shaping component disposed on the circuit board, wherein the lower surface of the photosensitive chip is attached to the shaping component to form a receiving space with the shaping component and the circuit board, and the receiving space is configured so that the photosensitive chip bends downward during the process of assembling the photosensitive component; and Heat sink; The shaping component includes a first shaping member and a second shaping member, wherein the first shaping member, the photosensitive chip and the circuit board form the accommodation space, the cross-sectional shape of the first shaping member is a closed ring, the second shaping member is arranged on the circuit board and located in the accommodation space, and the height of the second shaping member is lower than that of the first shaping member; The circuit board has at least one opening formed therein and connected to the accommodation space, and the at least one opening is configured to discharge gas in the accommodation space during the process of assembling the photosensitive component so that the photosensitive chip bends downward; The heat sink is formed in the accommodating space and is attached to at least a portion of the lower surface of the photosensitive chip; the heat sink is formed by allowing the heat dissipation material to enter the accommodating space through the at least one opening, wherein the heat dissipation material used to make the heat sink fills the entire accommodating space and extends from the lower surface of the photosensitive chip to the opening, so that the heat sink finally formed extends from the photosensitive chip to the outside.

2. The photosensitive component according to claim 1, wherein: The upper surface of at least one of the first shaping member and the second shaping member includes an arcuate surface that is concave downward and inward, and the arcuate surface is configured so that when the photosensitive chip is bent downward, a lower surface that is compatible with the focal imaging surface of the photosensitive component is formed.

3. The photosensitive component according to claim 1, wherein: The position where the opening is formed on the circuit board corresponds to the central area of ​​the photosensitive chip.

4. The photosensitive component according to claim 2, wherein: The second shaping member is arranged symmetrically relative to the center of the photosensitive chip.

5. The photosensitive component according to claim 4, wherein: The second shaping member is symmetrically arranged on both sides of a center line set by a longer side of the photosensitive chip.

6. The photosensitive component according to claim 2, wherein: The shaping member further includes an adhesive applied between the first shaping member and the second shaping member, wherein a height of the adhesive is higher than an upper surface of the second shaping member.

7. The photosensitive component according to claim 2, wherein: The first shaping member includes a first shaping member body and an adhesive applied to the first shaping member body, and the second shaping member includes a second shaping member body and an adhesive applied to the second shaping member body.

8. The photosensitive component according to claim 7, wherein: The first shaping member body and the second shaping member body are integrally formed on the top surface of the circuit board.

9. The photosensitive component according to claim 7, wherein: The first shaping member body and the second shaping member body are prefabricated and mounted on the circuit board.

10. A camera module, characterized in that: include: Optical lens; as well as A photosensitive component according to any one of claims 1 to 9, wherein the optical lens is maintained in the photosensitive path of the photosensitive component.

11. The camera module according to claim 10, wherein: The curved shape of the lower surface of the photosensitive chip is adapted to the shape of the actual focal imaging surface of the camera module.

12. A method for manufacturing a photosensitive component, characterized in that: include: A circuit board, a photosensitive chip and a shaping component are provided, wherein the shaping component comprises a first shaping component and a second shaping component; the circuit board comprises at least one opening; the cross-sectional shape of the first shaping component is a closed ring; The first shaping member and the second shaping member are arranged on the circuit board, wherein the height of the second shaping member is smaller than that of the first shaping member; Attaching the lower surface of the photosensitive chip to the first shaping member to form a containing space with the shaping member and the circuit board, wherein the at least one opening is connected to the containing space, wherein the second shaping member is located in the containing space; and discharging gas in the containing space through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip bends downward; Heat dissipation material is injected into the accommodating space through the opening to form a heat sink in the accommodating space, wherein the heat dissipation material used to make the heat sink fills the entire accommodating space, and the heat sink is attached to at least a portion of the lower surface of the photosensitive chip and extends from the lower surface of the photosensitive chip to the opening, so that the heat sink extends from the photosensitive chip to the outside.

13. The method for manufacturing a photosensitive component according to claim 12, wherein: The upper surface of at least one of the first shaping member and the second shaping member includes an arcuate surface that is concave downward and inward, wherein the gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip so that the photosensitive chip bends downward, including: bending the photosensitive chip until the lower surface of the photosensitive chip adheres to the arcuate surface so that the photosensitive chip forms a lower surface that matches the focal imaging surface of the photosensitive component when it bends downward.

14. The method for manufacturing a photosensitive component according to claim 12, wherein: The position where the opening is formed on the circuit board corresponds to the central area of ​​the photosensitive chip.

15. A method for manufacturing a photosensitive component, characterized in that: include: A circuit board and a photosensitive chip are provided, wherein the circuit board includes at least one opening; A shaping component is integrally formed on the circuit board, wherein the shaping component includes a first shaping component and a second shaping component; the cross-sectional shape of the first shaping component is a closed ring; the height of the second shaping component is smaller than that of the first shaping component; Attaching the lower surface of the photosensitive chip to the first shaping member to form a containing space with the shaping member and the circuit board, wherein the at least one opening is connected to the containing space, wherein the second shaping member is located in the containing space; and discharging gas in the containing space through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip, so that the photosensitive chip bends downward; Heat dissipation material is injected into the accommodating space through the opening to form a heat sink in the accommodating space, wherein the heat dissipation material used to make the heat sink fills the entire accommodating space, and the heat sink is attached to at least a portion of the lower surface of the photosensitive chip and extends from the lower surface of the photosensitive chip to the opening, so that the heat sink extends from the photosensitive chip to the outside.

16. The method for manufacturing a photosensitive component according to claim 15, wherein: Integrally forming a first shaping member and a second shaping member on the circuit board includes: integrally forming a first shaping member body and a second shaping member body on the circuit board by electroplating process; and applying adhesive on the first shaping member body and the second shaping member body respectively.

17. The method for manufacturing a photosensitive component according to claim 15, wherein: The upper surface of at least one of the first shaping member and the second shaping member includes an arcuate surface that is concave downward and inward, wherein the gas in the accommodating space is discharged through the at least one opening to generate a pressure difference between the upper surface and the lower surface of the photosensitive chip so that the photosensitive chip bends downward, including: bending the photosensitive chip until the lower surface of the photosensitive chip adheres to the arcuate surface so that the photosensitive chip forms a lower surface that matches the focal imaging surface of the photosensitive component when it bends downward.

18. The method for manufacturing a photosensitive component according to claim 15, wherein: The position where the opening is formed on the circuit board corresponds to the central area of ​​the photosensitive chip.

Images