Sensor unit, display device including the same, and method for measuring moisture using the same

Abstract

A sensor unit, a display device including the same, and a method for measuring moisture using the same are provided. The sensor unit includes: a driving electrode and a sensing electrode; a driving line connected to the driving electrode; a sensing line connected to the sensing electrode; a driving signal output unit configured to sequentially apply a driving signal to every P driving lines in a first driving mode; and a detector configured to receive a detection signal from every Q sensing lines in the first driving mode, where P and Q are positive integers.

Description

Technical Field

[0001] Exemplary embodiments of the invention generally relate to a sensor unit, a display device including the sensor unit, and a method for measuring moisture using the sensor unit. Background Art

[0002] With the development of the information society, various demands for display devices are increasing. For example, display devices are being used in various electronic devices such as smartphones, digital cameras, laptop computers, navigation devices, and smart TVs.

[0003] As display devices are incorporated into various electronic devices, they are increasingly being equipped with various features. For example, many skin moisture meters capable of measuring skin moisture have recently become available. However, since these meters include exposed electrodes that come into contact with the user's skin, it is difficult to directly apply these meters to display devices.

[0004] The above information disclosed in this Background section is only for understanding the background of the inventive concept and therefore it may contain information that does not constitute the prior art. Summary of the Invention

[0005] A display device constructed according to an exemplary embodiment of the invention includes a sensor unit capable of measuring skin moisture of a person.

[0006] Exemplary embodiments also provide a display device including a sensor unit capable of measuring skin moisture and a method of measuring moisture through the sensor unit.

[0007] Additional features of the inventive concepts will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concepts.

[0008] According to an exemplary embodiment, a sensor unit includes: a driving electrode and a sensing electrode; a driving line connected to the driving electrode; a sensing line connected to the sensing electrode; a driving signal output unit configured to sequentially apply a driving signal to every P driving lines in a first driving mode, where P is a positive integer; and a detector configured to receive a detection signal from every Q sensing lines in the first driving mode, where Q is a positive integer.

[0009] P can be greater than Q.

[0010] P can be equal to Q.

[0011] In the first driving mode, the driving signal output unit may be configured to apply the driving signal to each of the P driving lines simultaneously.

[0012] In the first driving mode, the driving signal output unit may be configured to repeatedly apply the driving signal sequentially to every P driving lines for 1 second to 1.5 seconds.

[0013] In the first driving mode, the detector may be configured to convert the detection signal into digital detection data and output the digital detection data.

[0014] In the first driving mode, the frequency of the driving signal may be in the range of about 50 kHz to about 500 kHz.

[0015] The driving signal output unit can be configured to sequentially apply a driving signal to every R driving lines in the second driving mode, where R is a positive integer less than P; and the detector can be configured to receive detection signals from S sensing lines in the second driving mode, where S is a positive integer less than Q.

[0016] R can be smaller than P, and S can be smaller than Q.

[0017] A time period during which the driving signal is sequentially applied to each of the P driving lines in the first driving mode may be longer than a time period during which the driving signal is sequentially applied to each of the R driving lines in the second driving mode.

[0018] The frequency of the driving signal in the first driving mode may be different from the frequency of the driving signal in the second driving mode.

[0019] The frequency of the driving signal in the first driving mode may be equal to the frequency of the driving signal in the second driving mode, the first driving mode may be a moisture measurement mode, and the second driving mode may be a touch sensing mode.

[0020] According to another exemplary embodiment, a display device includes: a display panel, including a display unit configured to display an image and a sensor unit configured to measure skin moisture content, the sensor unit including: sensor electrodes, including drive electrodes and sensing electrodes; drive lines connected to the drive electrodes; sensing lines connected to the sensing electrodes; a drive signal output unit configured to sequentially apply a drive signal to every P drive lines in a first drive mode, where P is a positive integer; and a detector configured to receive a detection signal from every Q sensing lines in the first drive mode, where Q is a positive integer.

[0021] The display device may further include a main processor, wherein the detector may be configured to convert the detection signal into digital detection data and output the digital detection data in the first driving mode; and the main processor may be configured to calculate the skin moisture content based on the digital detection data.

[0022] The main processor may be configured to output skin moisture data including skin moisture content information based on the digital detection data.

[0023] The main processor may be configured to correct the digital detection data prior to calculating the skin moisture content therefrom.

[0024] The main processor may be configured to correct the digital detection data when at least one of the temperature is not within a predetermined temperature range and the humidity is not within a predetermined humidity range.

[0025] The corrected digital detection data may have a value greater than the digital detection data when the temperature is lower than a lower limit of the predetermined temperature range, and may have a value lower than the digital detection data when the temperature is higher than an upper limit of the predetermined temperature range.

[0026] The main processor may be configured to increase the digital detection data when the protective film is disposed on the display panel.

[0027] The main processor may be configured to increment the digital detection data upon determining that the display panel is stationary.

[0028] According to another exemplary embodiment, a method for measuring moisture by a sensor unit includes the following steps: sequentially applying a drive signal to every P drive lines and receiving a detection signal from every Q sensing lines, wherein P and Q are positive integers; converting the detection signal into digital detection data; and calculating the skin moisture content based on the digital detection data, wherein the skin moisture content increases as the digital detection data increases.

[0029] The steps may further include correcting the digital detection data when at least one of the temperature is not within a predetermined temperature range and the humidity is not within a predetermined humidity range.

[0030] When the temperature is lower than a lower limit of a predetermined temperature range, the digital detection data may be corrected to have a larger value, and when the temperature is higher than an upper limit of the predetermined temperature range, the digital detection data may be corrected to have a smaller value.

[0031] The steps may further include increasing the digital detection data when a protective film is provided on the display panel.

[0032] The steps may further include increasing the digital detection data if it is determined that the display panel is supported by a base mass such as the ground and an object.

[0033] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings illustrate exemplary embodiments of the invention and together with the description serve to explain the inventive concept. The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification.

[0035] Figure 1 is a perspective view of a display device according to an exemplary embodiment.

[0036] Figure 2 is an exploded perspective view of a display device according to an exemplary embodiment.

[0037] Figure 3 is a plan view illustrating a display panel according to an exemplary embodiment.

[0038] Figure 4 and Figure 5 is a cross-sectional view illustrating a display device according to an exemplary embodiment.

[0039] Figure 6 It is along Figure 3 A cross-sectional view taken along line II'.

[0040] Figure 7 According to an exemplary embodiment Figure 6 A floor plan of the display unit.

[0041] Figure 8 According to an exemplary embodiment Figure 6 A plan view of the sensor unit.

[0042] Figure 9 It shows Figure 8 Block diagram of the sensor unit.

[0043] Figure 10 is a diagram of a first driving electrode, a first sensing electrode, a driving signal output unit, and a detector for mutual capacitance sensing according to an exemplary embodiment.

[0044] Figure 11 According to an exemplary embodiment Figure 8 An enlarged plan view of area A.

[0045] Figure 12 According to an exemplary embodiment Figure 11 An enlarged plan view of area A-1.

[0046] Figure 13 It is along Figure 12 A sectional view taken along line II-II'.

[0047] Figure 14 is a flowchart for illustrating a touch sensing scheme of a sensor unit in a second driving mode according to an exemplary embodiment.

[0048] Figure 15 is a diagram illustrating driving signals applied to driving lines in a second driving mode according to an exemplary embodiment.

[0049] Figure 16 is a flowchart for illustrating a touch sensing scheme of a sensor unit in a first driving mode according to an exemplary embodiment.

[0050] Figure 17 is a diagram illustrating driving signals applied to driving lines in a first driving mode according to an exemplary embodiment.

[0051] Figure 18 is a graph showing a change in total mutual capacitance according to the frequency of a driving signal in a first driving mode.

[0052] Figure 19 is a graph showing the changes in total mutual capacitance of different experimenters over time under the first driving mode.

[0053] Figure 20 is a graph showing capacitance of skin moisture content relative to total mutual capacitance.

[0054] Figure 21 is an exemplary diagram of human skin structure.

[0055] Figure 22 yes Figure 21 Magnified image of the stratum corneum shown in .

[0056] Figure 23 is a flowchart for illustrating a touch sensing scheme of a sensor unit in a first driving mode according to an exemplary embodiment.

[0057] Figure 24 is a diagram showing a method according to an exemplary embodiment Figure 23 Flowchart of step S303.

[0058] Figure 25 is a diagram showing a method according to another exemplary embodiment Figure 23 Flowchart of step S303.

[0059] Figure 26 According to yet another exemplary embodiment Figure 23 Flowchart of step S303. DETAILED DESCRIPTION

[0060] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of the various exemplary embodiments or implementations of the invention. As used herein, "embodiment" and "implementation" are interchangeable terms that are non-limiting examples of devices or methods that employ one or more of the inventive concepts disclosed herein. However, it is apparent that the various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other cases, in order to avoid making the various exemplary embodiments unnecessarily vague, well-known structures and devices are shown in block diagram form. In addition, the various exemplary embodiments may be different, but need not be exclusive. For example, without departing from the inventive concept, the specific shape, construction, and characteristics of an exemplary embodiment may be used or implemented in another exemplary embodiment.

[0061] Unless otherwise indicated, the exemplary embodiments shown will be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise indicated, the features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments (hereinafter, individually or collectively referred to as "elements" or "elements") may be further combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0062] The use of cross hatching and / or shading in the drawings is generally provided to make the boundaries between adjacent elements clear. As such, unless otherwise specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or need for the specific materials, material properties, dimensions, proportions, commonalities between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the sizes and relative sizes of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, a specific process sequence can be performed in a different order than described. For example, two continuously described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0063] When an element or layer is referred to as being "on" another element or layer, "connected to" or "bound to" another element or layer, the element or layer may be directly on, directly connected to or directly bound to the other element or layer, or there may be intermediate elements or intermediate layers. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly bound to" another element or layer, there are no intermediate elements or intermediate layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection and / or a fluid connection with or without intermediate elements. In addition, the D1 axis, the D2 axis and the D3 axis are not limited to the three axes of a rectangular coordinate system (such as the x-axis, the y-axis and the z-axis) and may be interpreted in a broader sense. For example, the D1 axis, the D2 axis and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ for example. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0064] Although the terms "first," "second," etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be named a second element without departing from the teachings of the disclosure.

[0065] For descriptive purposes, spatially relative terms such as "under," "beneath," "beneath," "down," "over," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc., may be used herein to describe the relationship of one element to another (other) element as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the drawings is turned over, an element described as "under" or "beneath" other elements or features would then be positioned "over" the other elements or features. Thus, the exemplary term "under" can include both above and below orientations. Furthermore, the device can be positioned otherwise (e.g., rotated 90 degrees or at other orientations), with the spatially relative descriptors used herein interpreted accordingly.

[0066] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular "one", "one (kind / person)" and "said (the)" are also intended to include plural forms. In addition, when using the terms "comprise" and / or "include" and their variations in this manual, the description includes the presence of stated features, integral bodies, steps, operations, elements, components and / or their groups, but does not exclude the presence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or their groups. It is also noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, and are used to explain the inherent deviation of measured values, calculated values ​​and / or provided values ​​that those of ordinary skill in the art will recognize.

[0067] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views that are schematic representations of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the exemplary embodiments disclosed herein should not be construed as limited to the specific illustrated shapes of the regions, but rather are to include deviations in shape due to, for example, manufacturing. In this manner, the regions illustrated in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and as such, are not necessarily intended to be limiting.

[0068] As is customary in the art, some exemplary embodiments are described and shown in the accompanying drawings using functional blocks, units and / or modules. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits, discrete components, microprocessors, hard-wired circuits, storage elements, wiring connections, etc., such as logic circuits, which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and they can be optionally driven by firmware and / or software. It is also contemplated that each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs certain functions and a processor (e.g., one or more programmed microprocessors and associated circuits) that performs other functions. In addition, without departing from the scope of the inventive concept, each block, unit and / or module of some exemplary embodiments can be physically separated into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the inventive concept.

[0069] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms (such as those defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless clearly defined herein.

[0070] Figure 1 is a perspective view of a display device according to an exemplary embodiment. Figure 2 is an exploded perspective view of a display device according to an exemplary embodiment.

[0071] Reference Figures 1 to 2 The display device 10 according to the exemplary embodiment can display moving images or still images. The display device 10 can be used as a display screen of a portable electronic device (such as a mobile phone, a smart phone, a tablet PC, a smart watch, a watch phone, a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player (PMP), a navigation device, and an ultra-mobile PC (UMPC)), as well as a display screen of various products (such as a television, a notebook, a monitor, a billboard, and the Internet of Things).

[0072] The display device 10 according to an exemplary embodiment includes a cover window 100 , a display panel 300 , a display circuit board 310 , a display driving circuit 320 , a sensor driver 330 , a bracket 600 , a main circuit board 700 , a battery 790 , and a bottom cover 900 .

[0073] As used herein, the term "upper side" refers to the side of the display panel 300 in the Z-axis direction where the cover window 100 is provided, and the term "lower side" refers to the side of the display panel 300 opposite to the side where the bracket 600 is provided in the Z-axis direction. As used herein, the terms "left," "right," "upper," and "lower" refer to relative positions when viewing the display panel 300 from the top. For example, "left side" refers to the direction opposite to the arrow indicated by the X-axis, "right side" refers to the direction indicated by the arrow indicated by the X-axis, "upper side" refers to the direction indicated by the arrow indicated by the Y-axis, and "lower side" refers to the direction opposite to the arrow indicated by the Y-axis.

[0074] When viewed from the top, the display device 10 may have a generally rectangular shape. Figure 1 and Figure 2As shown in , when viewed from the top, the display device 10 may have a generally rectangular shape having a shorter side in a first direction (e.g., the X-axis direction) and a longer side in a second direction (e.g., the Y-axis direction). Each corner where the shorter side in the first direction (e.g., the X-axis direction) meets the longer side in the second direction (e.g., the Y-axis direction) may be rounded with a predetermined curvature or may be a right angle. However, the inventive concept is not limited to a specific shape of the display device 10 when viewed from the top, and in some exemplary embodiments, the display device may have another polygonal shape, a circular shape, or an elliptical shape.

[0075] The display device 10 may include a first region DR1 formed to be flat and a second region DR2 extending from the right and left sides of the first region DR1. The second region DR2 may be formed to be flat or may be curved. When the second region DR2 is formed to be flat, the angle formed by the first region DR1 and the second region DR2 may be an obtuse angle. When the second region DR2 is formed as a curved surface, the surface may have a constant curvature or a varying curvature.

[0076] Despite Figure 1 The second region DR2 is described as extending from both the left and right sides of the first region DR1, however, the inventive concept is not limited thereto. Specifically, the second region DR2 may extend from only one of the right and left sides of the first region DR1. Alternatively, the second region DR2 may extend from at least one of the upper and lower sides and the left and right sides of the first region DR1. Hereinafter, according to exemplary embodiments, the second region DR2 will be described as being disposed at the left and right edges of the display device 10, respectively.

[0077] The cover window 100 may be disposed on the display panel 300 to cover an upper surface of the display panel 300. Thus, the cover window 100 may protect the upper surface of the display panel 300.

[0078] The cover window 100 may include a transmissive portion DA100 corresponding to the display panel 300 and a non-transmissive portion NDA100 corresponding to an area other than the display panel 300. The cover window 100 may be disposed in a first region DR1 and a second region DR2. The transmissive portion DA100 may be disposed in a portion of each of the first region DR1 and the second region DR2. The non-transmissive portion NDA100 may be opaque. Alternatively, the non-transmissive portion NDA100 may be formed as a decorative layer having a pattern that can be displayed to a user when an image is not displayed.

[0079] The display panel 300 may be disposed under the cover window 100. The display panel 300 may be disposed to overlap the transmissive portion DA100 of the cover window 100. The display panel 300 may be disposed in the first region DR1 and the second region DR2. Therefore, an image on the display panel 300 may be viewed not only in the first region DR1 but also in the second region DR2.

[0080] The display panel 300 may be a light-emitting display panel including a light-emitting element. For example, the display panel 300 may be an organic light-emitting display panel using an organic light-emitting diode including an organic emission layer, a micro light-emitting diode display panel using micro-LEDs, a quantum dot light-emitting display panel including a quantum dot light-emitting diode having a quantum dot emission layer, or an inorganic light-emitting display panel using an inorganic light-emitting element including an inorganic semiconductor. Hereinafter, according to exemplary embodiments, the display panel 300 will be described with reference to an organic light-emitting display panel.

[0081] The display circuit board 310 and the display driving circuit 320 may be attached to one side of the display panel 300. One side of the display circuit board 310 may be attached to a pad (also called a "pad") provided on one side of the display panel 300 using an anisotropic conductive film or the like. The display circuit board 310 may be a flexible printed circuit board (FPCB) that is capable of bending, a rigid printed circuit board (PCB) that is rigid and non-bendable, or a hybrid printed circuit board including a rigid printed circuit board and a flexible printed circuit board.

[0082] The display driver circuit 320 receives control signals and a power supply voltage through the display circuit board 310 and outputs signals and voltages for driving the display panel 300. The display driver circuit 320 may be implemented as an integrated circuit (IC). The display driver circuit 320 may be provided on the display panel 300. For example, the display driver circuit 320 may be attached to the display panel 300 using chip-on-glass (COG) technology, chip-on-plastic (COP) technology, or ultrasonic bonding. Alternatively, the display driver circuit 320 may be provided on the display circuit board 310.

[0083] The sensor driver 330 may be provided on the display circuit board 310. The sensor driver 330 may be implemented as an integrated circuit. The sensor driver 330 may be attached to the display circuit board 310. The sensor driver 330 may be electrically connected to the sensor electrodes of the sensor electrode layer of the display panel 300 through the display circuit board 310. The sensor driver 330 may apply a drive signal to a drive electrode among the sensor electrodes, and sense a change in mutual capacitance between the drive electrode and the sensing electrode through the sensing electrode among the sensor electrodes (hereinafter referred to as "mutual capacitance"). In this way, it is possible to determine whether the user has touched the display panel, and to measure the user's skin moisture. The user's touch may include physical contact and proximity. The user's physical contact refers to a situation when an object such as a user's finger or pen contacts the cover window 100 of the display device 10 provided on the sensor electrode layer. Proximity refers to a situation when an object such as a user's finger or pen is close to the surface of the display device 10 but is spaced apart from the surface of the display device 10, such as hovering above the display device 10.

[0084] On the display circuit board 310, a power supply for supplying a driving voltage may be further provided. The driving voltage is used to drive the pixels P of the display panel 300, the scan driver 340 (see FIG. Figure 7 ) and the display driver circuit 320. Alternatively, the power supply may be integrated with the display driver circuit 320, in which case the display driver circuit 320 and the power supply may be implemented as a single integrated circuit.

[0085] The bracket 600 may be provided below the display panel 300. The bracket 600 may include plastic, metal, or both. The bracket 600 may include a first camera hole CMH1 into which the camera device 720 is inserted, a battery hole BH into which the battery 790 is provided, and a cable hole CAH through which the cable 314 connected to the display circuit board 310 passes.

[0086] The main circuit board 700 and the battery 790 may be disposed under the bracket 600. The main circuit board 700 may be a printed circuit board or a flexible printed circuit board.

[0087] The main circuit board 700 may include a main processor 710, a camera device 720, a main connector 730, an acceleration sensor 740, a gyroscope sensor 750, etc. The main processor 710, the acceleration sensor 740, and the gyroscope sensor 750 may be implemented as integrated circuits. In some exemplary embodiments, the acceleration sensor 740 and the gyroscope sensor 750 may be implemented as a single integrated circuit.

[0088] The camera device 720 may be provided on both the upper and lower surfaces of the main circuit board 700. The main processor 710, the acceleration sensor 740, and the gyro sensor 750 may be provided on the upper surface of the main circuit board 700, and the main connector 730 may be provided on the lower surface of the main circuit board 700.

[0089] The main processor 710 can control the functions of the display device 10. For example, the main processor 710 can output digital video data to the display driver circuit 320 via the display circuit board 310, so that the display panel 300 displays an image. In addition, the main processor 710 receives detection data from the sensor driver 330. The main processor 710 can determine whether there is a user's touch based on the detection data in the touch sensing mode, and can perform operations associated with the user's physical contact or the user's proximity. For example, the main processor 710 can calculate the user's touch coordinates by analyzing the detection data in the touch sensing mode, and then can run an application or perform an operation indicated by the icon touched by the user. The main processor 710 can calculate the user's skin moisture by analyzing the detection data in the moisture measurement mode.

[0090] Hereinafter, the moisture measurement mode may also be referred to as a first driving mode, and the touch sensing mode may also be referred to as a second driving mode.

[0091] The main processor 710 may be an application processor, a central processing unit, or a system chip implemented as an integrated circuit.

[0092] The camera device 720 processes image frames, such as still images and videos obtained by an image sensor in a camera mode, and outputs them to the main processor 710 .

[0093] The cable 314 having passed through the cable hole CAH of the bracket 600 may be connected to the main connector 730. Thus, the main circuit board 700 may be electrically connected to the display circuit board 310.

[0094] The acceleration sensor 740 can detect acceleration in a first direction (e.g., X-axis direction), a second direction (e.g., Y-axis direction), and a third direction (e.g., Z-axis direction). The acceleration sensor 740 can output acceleration data including acceleration information in the first direction (e.g., X-axis direction), the second direction (e.g., Y-axis direction), and the third direction (e.g., Z-axis direction) to the main processor 710.

[0095] The gyro sensor 750 can detect angular velocity in a first direction (e.g., X-axis direction), a second direction (e.g., Y-axis direction), and a third direction (e.g., Z-axis direction). The gyro sensor 750 can output angular velocity data including angular velocity information in the first direction (e.g., X-axis direction), the second direction (e.g., Y-axis direction), and the third direction (e.g., Z-axis direction) to the main processor 710.

[0096] The main processor 710 can determine the tilt of the display device 10 and the rotation direction of the display device 10 based on the acceleration data from the acceleration sensor 740 and the angular velocity data from the gyro sensor 750. In this way, the main processor 710 can determine whether the display device 10 is stationary based on the acceleration data and the angular velocity data.

[0097] The battery 790 may be disposed so as not to overlap the main circuit board 700 in the third direction (eg, the Z-axis direction). The battery 790 may overlap the battery hole BH of the bracket 600.

[0098] In some exemplary embodiments, a mobile communication module capable of transmitting / receiving radio signals to / from at least one of a base station, an external terminal, and a server through a mobile communication network may be further mounted on the main circuit board 700. The wireless signal may include various types of data according to transmission / reception of a voice signal, a video call signal, or a text / multimedia message.

[0099] The bottom cover 900 may be disposed under the main circuit board 700 and the battery 790. The bottom cover 900 may be fastened and fixed to the bracket 600. The bottom cover 900 may form an outer side of the lower surface of the display device 10. The bottom cover 900 may include plastic, metal, or plastic and metal.

[0100] The second camera hole CMH2 may be formed in the bottom cover 900, and the lower surface of the camera device 720 is exposed through the second camera hole CMH2. The positions of the camera device 720 and the first and second camera holes CMH1 and CMH2 aligned with the camera device 720 are not limited to Figure 2 Those shown in .

[0101] Figure 3 is a plan view of a display panel according to an exemplary embodiment. Figure 4 and Figure 5 is a cross-sectional view of a display device according to an exemplary embodiment.

[0102] Reference Figures 3 to 5According to an exemplary embodiment, the display panel 300 may be an organic light-emitting display panel, a liquid crystal display panel, a plasma display panel, a field emission display panel, an electrophoretic display panel, an electrowetting display panel, a quantum dot light-emitting display panel, an inorganic light-emitting display panel, and a micro-LED display panel. Hereinafter, the display panel 300 will be described with reference to an organic light-emitting display panel. However, the inventive concept is not limited thereto.

[0103] The display panel 300 may include a main area MA and a protrusion area PA protruding from one side of the main area MA.

[0104] The main area MA can be formed as a rectangular plane having a shorter side in a first direction (e.g., X-axis direction) and a longer side in a second direction (e.g., Y-axis direction) intersecting the first direction (e.g., X-axis direction). Each corner where the shorter side in the first direction (e.g., X-axis direction) meets the longer side in the second direction (e.g., Y-axis direction) can be rounded with a predetermined curvature or can be a right angle. In some exemplary embodiments, the shape of the display device 10 when viewed from the top is not limited to a quadrilateral shape, but can be formed into another polygonal shape, a circular shape, or an elliptical shape. The main area MA can be, but is not limited to, formed to be flat. The main area MA may include curved portions formed at its left and right ends. The curved portion may have a constant curvature or a varying curvature.

[0105] The main area MA may include a display area DA in which pixels are formed to display an image and a non-display area NDA around the display area DA.

[0106] In addition to the pixels, scan lines, data lines, and power lines connected to the pixels may be provided in the display area DA. When the main area MA includes a curved portion, the display area DA may be provided on the curved portion. In this case, the image of the display panel 300 may also be visible on the curved portion.

[0107] The non-display area NDA may be defined as a region from the outside of the display area DA to the edge of the display panel 300. In the non-display area NDA, a scan driver for applying a scan signal to the scan line and a connection line connecting the data line with the display driving circuit 320 may be provided.

[0108] The protruding area PA may protrude from one side of the main area MA. For example, the protruding area PA may be as follows: Figure 3 The protruding area PA may protrude from the lower side of the main area MA as shown in FIG. The length of the protruding area PA in the first direction (eg, X-axis direction) may be smaller than the length of the main area MA in the first direction (eg, X-axis direction).

[0109] The protruding area PA may include a bending area BA and a pad area PDA. In this case, the pad area PDA may be provided on one side of the bending area BA, and the main area MA may be provided on the opposite side of the bending area BA. For example, the pad area PDA may be provided on the lower side of the bending area BA, and the main area MA may be provided on the upper side of the bending area BA.

[0110] The display panel 300 may be formed to be flexible so as to bend, curve, fold or curl. As such, the display panel 300 may be bent at the bending area BA in the thickness direction. Figure 4 As shown in , one surface of the pad area PDA of the display panel 300 may face upward before the display panel 300 is bent. Figure 5 As shown in , the one surface of the pad area PDA of the display panel 300 may face downward after the display panel 300 is bent. In this case, since the pad area PDA is disposed under the main area MA, the pad area PDA may overlap the main area MA.

[0111] Pads electrically connected to the display driving circuit 320 and the display circuit board 310 may be provided in the pad area PDA of the display panel 300 .

[0112] The cover panel sheet 301 may be disposed under the display panel 300. The cover panel sheet 301 may be attached to the lower surface of the display panel 300 by an adhesive member or the like. The adhesive member may be a pressure sensitive adhesive (PSA).

[0113] The cover panel sheet 301 may include a light absorbing member for absorbing light incident from the outside, a buffering member for absorbing external impact, and a heat dissipating member for effectively discharging heat from the display panel 300 .

[0114] A light absorbing member may be provided under the display panel 300. The light absorbing member blocks transmission of light to prevent elements disposed therebelow (such as the display circuit board 310) from being seen from above the display panel 300. The light absorbing member may include a light absorbing material such as black pigment and black dye.

[0115] A buffer member may be provided below the light absorbing member. The buffer member absorbs external impact to prevent damage to the display panel 300. The buffer member may have a single-layer structure or a multi-layer structure. For example, the buffer member may be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, and polyethylene, or may be formed of an elastic material such as rubber and a sponge obtained by foaming a urethane or acrylic material. The buffer member may be a cushion layer.

[0116] The heat dissipation member may be disposed below the buffer member. The heat dissipation member may include: a first heat dissipation layer including graphite or carbon nanotubes; and a second heat dissipation layer formed of a thin metal film such as copper, nickel, ferrite, and silver, which can block electromagnetic waves and has high thermal conductivity.

[0117] In order to make the display panel 300 easy to bend, as Figure 4 As shown in FIG, the cover panel sheet 301 may not be disposed in the bending area BA of the display panel 300. Since the display panel 300 is bent in the bending area BA, the pad area PDA is disposed below the main area MA, and thus the pad area PDA may overlap the main area MA. Therefore, the cover panel sheet 301 disposed in the main area MA of the display panel 300 and the cover panel sheet 301 disposed in the pad area PDA of the display panel 300 may be attached together by an adhesive member 302. The adhesive member 302 may be a pressure-sensitive adhesive.

[0118] The display driver circuit 320 outputs signals and voltages for driving the display panel 300. For example, the display driver circuit 320 can apply data voltages to the data lines. In addition, the display driver circuit 320 can apply power voltages to the power lines and can apply scan control signals to the scan driver. The display driver circuit 320 can be implemented as an integrated circuit (IC) and can be attached to the display panel 300 in the pad area PDA using chip-on-glass (COG) technology, chip-on-plastic (COP) technology, or ultrasonic bonding. Alternatively, the display driver circuit 320 can be mounted on the display circuit board 310.

[0119] The pads may include a display pad electrically connected to the display driving circuit 320 and a sensor pad electrically connected to the sensor line.

[0120] The display circuit board 310 can be attached to the pad using an anisotropic conductive film or the like. In this way, the leads of the display circuit board 310 can be electrically connected to the pad. The display circuit board 310 can be a flexible printed circuit board, a printed circuit board, or a flexible film (such as a chip on film).

[0121] The sensor driver 330 may be connected to the sensor electrode layer SEL (refer to Figure 6) sensor electrodes of the sensor electrode layer SEL. The sensor driver 330 applies a drive signal to the sensor electrodes of the sensor electrode layer SEL and measures the mutual capacitance of the sensor electrodes. The drive signal may include a drive pulse. The sensor driver 330 may determine whether there is a user's touch or proximity based on the mutual capacitance. As described above, a user's touch may refer to a situation when an object such as a user's finger or a pen comes into contact with the surface of the display device 10 provided on the sensor electrode layer SEL, and a user's proximity may refer to a situation when an object such as a user's finger or a pen hovers above the surface of the display device 10.

[0122] The sensor driver 330 may be provided on the display circuit board 310. The sensor driver 330 may be implemented as an integrated circuit (IC) and may be mounted on the display circuit board 310.

[0123] Figure 6 It is along Figure 3 A cross-sectional view taken along line II'. Figure 6 The display panel 300 may include a display unit DU and a sensor unit SU. The display unit DU may include a substrate SUB, a thin film transistor layer TFTL disposed on the substrate SUB, an emission material layer (also referred to as a light emitting element layer) EML, and a thin film encapsulation layer TFEL. The sensor unit SU may include a sensor electrode layer SEL.

[0124] The substrate SUB may be made of an insulating material such as glass, quartz, and polymer resin. The polymer material may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl (polyacrylate), polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof. Alternatively, the substrate SUB may include a metal material.

[0125] The substrate SUB may be a rigid substrate or a flexible substrate capable of being bent, folded, rolled, etc. When the substrate SUB is a flexible substrate, the substrate SUB may include polyimide (PI), but is not limited thereto.

[0126] The thin film transistor layer TFTL may be disposed on the substrate SUB. In the thin film transistor layer TFTL, scan lines, data lines, power lines, scan control lines, wiring connecting the pads to the data lines, and thin film transistors in the pixels may be formed. Each thin film transistor may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode. Figure 7 When the scan driver 340 is formed in the non-display area NDA of the display panel 300 as shown in FIG, the scan driver 340 may include a thin film transistor.

[0127] The thin film transistor layer TFTL may be disposed in the display area DA and the non-display area NDA. More specifically, the thin film transistors in the pixels, scan lines, data lines, and power lines in the thin film transistor layer TFTL may be disposed in the display area DA. The scan control lines and connection lines in the thin film transistor layer TFTL may be disposed in the non-display area NDA.

[0128] The emission material layer (EML) may be disposed on the thin film transistor layer (TFTL). The light emitting element layer (EML) may include pixels, each pixel comprising a first electrode, an emission layer, a second electrode, and a pixel defining layer. The emission layer may be an organic emission layer comprising an organic material. The emission layer may include a hole transport layer, an organic light emitting layer, and an electron transport layer. When a voltage is applied to the first electrode and a cathode voltage is applied to the second electrode via a thin film transistor (TFTL) disposed in the thin film transistor layer (TFTL), holes and electrons move through the hole transport layer and the electron transport layer, respectively, to the organic light emitting layer, where they combine to emit light. The pixels on the light emitting element layer (EML) may be disposed in the display area (DA).

[0129] The thin film encapsulation layer TFEL can be provided on the light emitting element layer EML. The thin film encapsulation layer TFEL can prevent oxygen or moisture from penetrating into the light emitting element layer EML. In this way, the thin film encapsulation layer TFEL may include at least one inorganic layer. The inorganic layer may be, but is not limited to, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. In addition, the thin film encapsulation layer TFEL protects the light emitting element layer EML from foreign matter (such as dust). To this end, the thin film encapsulation layer TFEL may include at least one organic layer. The organic layer may be formed of, but is not limited to, acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0130] The thin film encapsulation layer TFEL may be disposed in the display area DA and the non-display area NDA. More specifically, the thin film encapsulation layer TFEL may cover the display area DA and the emission material layer EML, and may cover the thin film transistor layer TFTL in the non-display area NDA.

[0131] The sensor electrode layer SEL may be disposed on the thin film encapsulation layer TFEL. Since the sensor electrode layer SEL is directly disposed on the thin film encapsulation layer TFEL, the thickness of the display device 10 may be reduced compared to when the sensor electrode layer SEL is disposed on a separate touch panel to be attached to the thin film encapsulation layer TFEL.

[0132] The sensor electrode layer SEL may include sensor electrodes for capacitive sensing and sensor wires connecting sensor pads with the sensor electrodes. Figure 8As shown in FIG, the sensor electrodes of the sensor electrode layer SEL may be provided in the sensor area TSA overlapping the display area DA. Figure 8 As shown in FIG, the sensor lines of the sensor electrode layer SEL may be disposed in the sensor peripheral area TPA overlapping the non-display area NDA.

[0133] A polarizing film may be provided on the sensor electrode layer SEL. The polarizing film may include a linear polarizer and a phase retardation film (such as a λ / 4 (quarter wavelength) plate). In this case, the phase retardation film may be provided on the sensor electrode layer SEL, and the linear polarizer may be provided on the phase retardation film. Furthermore, a cover window 100 may be provided on the polarizing film. The cover window 100 may be attached to the polarizing film using a transparent adhesive member such as an optically clear adhesive (OCA) film.

[0134] Figure 7 According to an exemplary embodiment Figure 6 A plan view of the display unit.

[0135] Figure 7 Only the pixels P, the scan lines SL, the data lines DL, the scan control lines SCL, the fan-out lines DLL, the scan driver 340, the display driving circuit 320, and the display pad DP of the display unit DU are exemplarily shown.

[0136] Reference Figure 7 Scan lines SL, data lines DL, and pixels P are arranged in the display area DA. The scan lines SL may be arranged in a first direction (e.g., an X-axis direction), and the data lines DL may be arranged in a second direction (e.g., a Y-axis direction) that intersects the first direction (e.g., the X-axis direction).

[0137] Each of the pixels P can be connected to at least one of the scan lines SL and at least one of the data lines DL. Each pixel P may include a thin film transistor including a driving transistor and at least one switching transistor, a light-emitting element, and a capacitor. When a scan signal is applied from the scan line SL, each pixel P receives the data voltage of the data line DL and supplies a driving current to the light-emitting element according to the data voltage applied to the gate electrode to cause light emission. Although the light-emitting element is described with reference to an organic light-emitting element including a first electrode, an organic emission layer, and a second electrode, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the light-emitting element may be implemented as a quantum dot light-emitting element including a first electrode, a quantum dot emission layer, and a second electrode, as an inorganic light-emitting element including a first electrode, an inorganic emission layer having an inorganic semiconductor, and a second electrode, or as a micro light-emitting element including a micro light-emitting diode.

[0138] The scan driver 340 is connected to the display driving circuit 320 through a plurality of scan control lines SCL. Therefore, the scan driver 340 can receive a scan control signal from the display driving circuit 320. The scan driver 340 generates a scan signal according to the scan control signal and supplies the scan signal to the scan line SL.

[0139] Despite Figure 7 The scan driver 340 is shown as being formed in the non-display area NDA on the left side of the display area DA, however, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the scan driver 340 may be formed in the non-display area NDA on the left side of the display area DA and in the non-display area NDA on the right side of the display area DA.

[0140] The display driver circuit 320 is connected to the display pad DP and receives digital video data and timing signals. The display driver circuit 320 converts the digital video data into analog positive / negative data voltages and supplies the analog positive / negative data voltages to the data lines DL via the fan-out lines DLL. In addition, the display driver circuit 320 generates a scan control signal for controlling the scan driver 340 and supplies the scan control signal for controlling the scan driver 340 via the scan control lines SCL. The pixel P to which the data voltage is supplied is selected by the scan signal of the scan driver 340, and the data voltage is supplied to the selected pixel P. The display driver circuit 320 can be implemented as an integrated circuit (IC) and can be attached to the substrate SUB via chip-on-glass (COG) technology, chip-on-plastic (COP) technology, or ultrasonic bonding. However, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the display driver circuit 320 can be mounted on the display circuit board 310.

[0141] like Figure 7 As shown in FIG, the display panel 300 may include a display pad DP electrically connected to the display driving circuit 320 and sensor pads TP1 and TP2 electrically connected to the sensor lines. The display pad area DPA in which the display pad DP is disposed may be disposed between a first sensor pad area TPA1 in which the first sensor pad TP1 is disposed and a second sensor pad area TPA2 in which the second sensor pad TP2 is disposed. Figure 7 As shown in , the display pad area DPA may be disposed at the center of one end of the protruding area PA, the first sensor pad area TPA1 may be disposed at the left side of the one end of the protruding area PA, and the second sensor pad area TPA2 may be disposed on the right side of the one end of the protruding area PA.

[0142] The display circuit board 310 may be attached to the display pad DP and the sensor pads TP1 and TP2 using an anisotropic conductive film or the like. Thus, the leads of the display circuit board 310 may be electrically connected to the display pad DP and the sensor pads TP1 and TP2. The display circuit board 310 may be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip on film.

[0143] The sensor driver 330 may be connected to the sensor electrodes of the sensor unit of the display panel 300. The sensor driver 330 applies a driving signal to the sensor electrodes and senses the mutual capacitance of the sensor electrodes. The driving signal may include a driving pulse. The sensor driver 330 may be provided on the display circuit board 310. The sensor driver 330 may be implemented as an integrated circuit and may be mounted on the display circuit board 310.

[0144] Figure 8 is a diagram showing a method according to an exemplary embodiment Figure 6 A plan view of the sensor unit.

[0145] Reference Figure 8 The sensor electrode of the sensor unit SU according to the exemplary embodiment includes two electrodes, for example, connected via connecting portions BE1 and BE2 (see Figure 11 ) connected driving electrodes TE and sensing electrodes RE. The sensor unit SU may be formed in two layers and perform capacitive sensing by applying a driving signal to the driving electrode TE and then sensing the change in mutual capacitance through the sensing electrode RE. However, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the sensor electrodes TE and RE of the sensor unit SU may include the driving electrode TE and the sensing electrode RE without the connecting portions BE1 and BE2, and may be formed as one layer for capacitive sensing. Alternatively, the sensor unit SU may be driven in one layer for self-capacitive sensing, which uses one electrode to sense the change in self-capacitance.

[0146] Figure 8 The sensor electrodes TE and RE, the conductive pattern DE, the sensor lines TL and RL, the sensor pads TP1 and TP2 , the guard lines GL1 to GL5 , and the ground lines GRL1 to GRL3 are only exemplarily shown.

[0147] Reference Figure 8 The sensor unit SU includes a sensor area TSA for sensing a user's touch and a sensor peripheral area TPA disposed around the sensor area TSA. The sensor area TSA may overlap the display area DA of the display panel 300, and the sensor peripheral area TPA may overlap the non-display area NDA of the display panel 300.

[0148] The sensor electrodes TE and RE may include a first sensor electrode TE and a second sensor electrode RE. Figure 8 In the exemplary embodiment shown in FIG, the first sensor electrode is the drive electrode TE and the second sensor electrode is the sense electrode RE. Figure 8 , the driving electrodes TE, the sensing electrodes RE, and the conductive patterns DE each have a diamond shape when viewed from the top, but the inventive concept is not limited thereto.

[0149] The sensing electrodes RE may be arranged in a first direction (e.g., X-axis direction) and electrically connected to each other. The driving electrodes TE may be arranged in a second direction (e.g., Y-axis direction) that intersects the first direction (e.g., X-axis direction) and may be electrically connected to each other. The driving electrodes TE may be electrically separated from the sensing electrodes RE. The driving electrodes TE may be spaced apart from the sensing electrodes RE. The driving electrodes TE may be arranged in parallel in the second direction (e.g., Y-axis direction). In order to electrically separate the sensing electrodes RE from the driving electrodes TE at their intersection, as shown in FIG. Figure 11 As shown in , driving electrodes TE adjacent to each other in the second direction (eg, Y-axis direction) may be connected by a first connection portion BE1, and sensing electrodes RE adjacent to each other in the first direction (eg, X-axis direction) may be connected by a second connection portion BE2.

[0150] The conductive pattern DE can be electrically separated from the drive electrode TE and the sensing electrode RE. The drive electrode TE, the sensing electrode RE, and the conductive pattern DE can be arranged separately from each other. The conductive pattern DE can be surrounded by the drive electrode TE and the sensing electrode RE, respectively. The parasitic capacitance between the second electrode of the emission material layer EML and the drive electrode TE or the sensing electrode RE can be reduced due to the conductive pattern DE. When the parasitic capacitance is reduced, the mutual capacitance between the drive electrode TE and the sensing electrode RE can be charged faster. However, when the area of ​​the drive electrode TE and the sensing electrode RE is reduced due to the conductive pattern DE, the mutual capacitance between the drive electrode TE and the sensing electrode RE is reduced and may become more susceptible to noise. In this way, the area of ​​the conductive pattern DE can be determined taking into account the trade-off between parasitic capacitance and mutual capacitance.

[0151] The sensor lines TL and RL may be disposed in the sensor peripheral area TPA and may include a sensing line RL connected to the sensing electrode RE and first and second driving lines GTL1 and GTL2 connected to the driving electrode TE.

[0152] The sensing electrode RE disposed on one side of the sensor area TSA may be connected to the sensing line RL. Figure 8As shown in FIG, some of the sensing electrodes RE disposed at the right end among the sensing electrodes RE electrically connected in the first direction (e.g., the X-axis direction) may be connected to the sensing line RL. The sensing line RL may be connected to the second sensor pad TP2. As such, the sensor driver 330 may be electrically connected to the sensing electrodes RE.

[0153] The driving electrodes TE disposed near one side of the sensor area TSA may be connected to the first group of driving lines GTL1, and the driving electrodes TE disposed near the other side of the sensor area TSA may be connected to the second group of driving lines GTL2. Figure 8 As shown in FIG, some of the lowermost drive electrodes TE among the drive electrodes TE electrically connected to each other in the second direction (e.g., the Y-axis direction) can be connected to the first group of drive lines GTL1, while some of the uppermost drive electrodes TE among the drive electrodes TE can be connected to the second group of drive lines GTL2. The second group of drive lines GTL2 can be connected to the drive electrodes TE on the upper side of the sensor area TSA via the left outer side of the sensor area TSA. The first group of drive lines GTL1 and the second group of drive lines GTL2 can be connected to the first sensor pad TP1. In this way, the sensor driver 330 can be electrically connected to the drive electrodes TE.

[0154] The first protection line GL1 may be disposed on the outer side of the outermost one of the sensing lines RL. In addition, the first ground line GRL1 may be disposed on the outer side of the first protection line GL1. Figure 8 As shown in , the first guard line GL1 may be disposed on the right side of the rightmost one of the sensing lines RL, and the first ground line GRL1 may be disposed on the right side of the first guard line GL1 .

[0155] The second protection line GL2 may be disposed between the innermost one of the sensing lines RL and the rightmost one of the first group of driving lines GTL1. Figure 8 As shown in , the innermost one of the sensing lines RL may be the leftmost one of the sensing lines RL. In addition, the second protection line GL2 may be disposed between the rightmost one of the first group of driving lines GTL1 and the second ground line GRL2.

[0156] The third guard line GL3 may be disposed between the innermost one of the sensing lines RL and the second ground line GRL2 . The second ground line GRL2 may be connected to the rightmost one of the first sensor pads TP1 and the leftmost one of the second sensor pads TP2 .

[0157] The fourth protection line GL4 may be disposed on the outer side of the outermost one of the second group of driving lines GTL2. Figure 8 As shown in FIG, the fourth guard line GL4 may be disposed on the left side of the leftmost one of the second group of driving lines GTL2.

[0158] In addition, the third ground line GRL3 may be provided on the outer side of the fourth guard line GL4. Figure 8 As shown in FIG, the fourth guard line GL4 may be disposed on the left and upper sides of the leftmost and uppermost one of the second group driving lines GTL2, and the third ground line GRL3 may be disposed on the left and upper sides of the fourth guard line GL4.

[0159] The fifth protection line GL5 may be disposed on the inner side of the innermost one of the second group of driving lines GTL2. Figure 8 As shown in FIG, the fifth guard line GL5 may be disposed between the rightmost one of the second group of driving lines GTL2 and the sensing electrode RE.

[0160] A ground voltage may be applied to the first, second, and third ground lines GRL1, GRL2, and GRL3. In addition, a ground voltage may be applied to the first, second, third, fourth, and fifth shield lines GL1, GL2, GL3, GL4, and GL5.

[0161] according to Figure 8 In the exemplary embodiment shown in FIG, the drive electrodes TE adjacent to each other in the second direction (e.g., the Y-axis direction) are electrically connected to each other, while the drive electrodes TE adjacent to each other in the first direction (e.g., the X-axis direction) are electrically insulated from each other. In addition, the sensing electrodes RE adjacent to each other in the first direction (e.g., the X-axis direction) are electrically connected to each other, while the sensing electrodes RE adjacent to each other in the second direction (e.g., the Y-axis direction) are electrically insulated from each other. In this way, mutual capacitance can be formed at the intersection of the drive electrodes TE and the sensing electrodes RE.

[0162] In addition, according to Figure 8In the exemplary embodiment shown in FIG, a first guard line GL1 is provided between the outermost one of the sensing lines RL and the first ground line GRL1, thereby reducing the impact of voltage changes in the first ground line GRL1 on the outermost one of the sensing lines RL. A second guard line GL2 is provided between the innermost one of the sensing lines RL and the outermost one of the first group of drive lines GTL1. In this manner, the second guard line GL2 can reduce the impact of voltage changes on the innermost one of the sensing lines RL and the outermost one of the first group of drive lines GTL1. A third guard line GL3 is provided between the innermost one of the sensing lines RL and the second ground line GRL2, thereby reducing the impact of voltage changes in the second ground line GRL2 on the innermost one of the sensing lines RL. A fourth guard line GL4 is provided between the outermost one of the second group of drive lines GTL2 and the third ground line GRL3, thereby reducing the impact of voltage changes in the third ground line GRL3 on the second group of drive lines GTL2. The fifth guard line GL5 is disposed between the innermost one of the second group of driving lines GTL2 and the sensor electrodes TE and RE to suppress mutual influence between the innermost one of the second group of driving lines GTL2 and the sensor electrodes TE and RE.

[0163] Figure 9 According to an exemplary embodiment Figure 8 Block diagram of the sensor unit. Figure 9 The sensor area TSA and the sensor driver 330 are shown only for exemplary purposes. The sensor driver 330 may include a driving signal output unit 331 , a detector 332 , and a sensor controller 333 .

[0164] In addition, Figure 9 、 Figure 15 and Figure 17 The kth driving line TLk refers to the driving line in the second group GTL2 and is set in Figure 8 The driving electrodes in the kth column of the sensor area TSA are connected to one or a first group of driving lines GTL1 and are arranged in Figure 8 The driving electrode in the kth column of the sensor area TSA is connected to one of the electrodes, where 1≤k≤n. Figure 9 、 Figure 15 and Figure 17 In the embodiment, the first driving line TL1 refers to the driving line in the second group GTL2 and is set in Figure 8 The driving electrodes in the first column of the sensor area TSA are connected to one or a first group of driving lines GTL1 and are arranged in Figure 8 The driving electrodes in the first column of the sensor area TSA are connected to one of the Figure 9 The nth driving line TLn refers to the driving line in the second group GTL2 and is set in Figure 8The driving electrodes in the nth column of the sensor area TSA are connected to one or a first group of driving lines GTL1 and are arranged in Figure 8 The driving electrodes arranged in the first column of the sensor area TSA may be the driving electrodes arranged in the leftmost column of the sensor area TSA, and the driving electrodes arranged in the nth column of the sensor area TSA may be the driving electrodes arranged in the rightmost column of the sensor area TSA.

[0165] Reference Figure 9 The driving signal output unit 331 outputs the driving signal to the driving lines TL1 to TLn under the control of the sensor controller 333. The driving signal output unit 331 may select a driving line for outputting the driving signal from the driving lines TL1 to TLn and may output the driving signal to the selected driving line.

[0166] In the second driving mode, the driving signal output unit 331 applies the driving signal to the first R driving lines, then to the second R driving lines, and so on, where R is a positive integer less than P. Mutual capacitances formed at the intersections of the R driving electrodes and the S sensing electrodes may be defined as a first unit sensor, where S is a positive integer less than Q.

[0167] For example, Figure 15 As shown in , in the second driving mode, the driving signal output unit 331 can apply the driving signals to the driving lines one by one (or one by one) in sequence. The driving signal output unit 331 can apply the driving signal to the first driving line TL1, then apply the driving signal to the second driving line TL2, then apply the driving signal to the third driving line TL3, and then apply the driving signal to the fourth driving line TL4. In this case, the unit sensor may include a mutual capacitance formed at the intersection of one driving line and one sensing line. A mutual capacitance formed at the intersection of one driving electrode and one sensing electrode may be defined as a "first unit sensor."

[0168] In the first driving mode, the driving signal output unit 331 applies the driving signal to the first P driving lines, then to the second P driving lines, and so on, where P is a positive integer. The mutual capacitances formed at the intersections of the P driving electrodes and the Q sensing electrodes can be defined as a second unit sensor. P may be equal to or different from Q, for example, P may be greater than Q.

[0169] For example, Figure 17As shown in , in the first driving mode, the driving signal output unit 331 can apply driving signals to the driving lines in pairs (or two by two) sequentially. The driving signal output unit 331 can apply driving signals to the first driving line TL1 and the second driving line TL2 at the same time, and then can apply driving signals to the third driving line TL3 and the fourth driving line TL4 at the same time. In this case, the unit sensor can include four mutual capacitors formed at the intersection of two driving lines and two sensing lines. The four mutual capacitors formed at the intersection of two driving electrodes and two sensing electrodes can be defined as a "second unit sensor."

[0170] Under the control of the sensor controller 333, the detector 332 receives the voltage of the mutual capacitance of the sensor electrodes through the sensing line. The detector 332 converts the voltage of the mutual capacitance of the sensor electrodes received through the sensing line into detection data DD as digital data. The detector 332 can output the detection data DD to the main processor 710.

[0171] The sensor controller 333 may output a drive signal control signal VCS for setting the first drive line TL1 and the second drive line TL2 to which the drive signal is output to the drive signal output unit 331. The sensor controller 333 may output a sensing control signal DCS to the detector 332 to notify the reception time of the change amount of the mutual capacitance of the sensor electrode.

[0172] The main processor 710 receives detection data DD from the detector 332. The main processor 710 can analyze the detection data DD and calculate the change in mutual capacitance under the second driving mode. The main processor 710 can calculate the user's touch coordinates based on the change in capacitance, and then execute the application or perform the operation indicated by the icon touched by the user. For example, when the change in mutual capacitance of the first unit sensor is greater than the first threshold, the main processor 710 sets the coordinates of the first unit sensor in the second driving mode to the coordinates touched by the user. For example, the main processor 710 can control the display device 10 so that the application corresponding to the icon displayed at the touch coordinates is executed.

[0173] The main processor 710 receives detection data DD from the detector 332. The main processor 710 can determine the user's skin moisture by analyzing the detection data DD in the first driving mode. For example, the main processor 710 can calculate the change in the mutual capacitance of the second unit sensor based on the detection data DD. The main processor 710 can calculate a representative value obtained by adding the change in the mutual capacitance of the second unit sensor. The main processor 710 may include a first lookup table storing moisture data, which includes information about the user's skin moisture related to the representative value. When the main processor 710 outputs the representative value to the first lookup table, the main processor 710 can receive moisture data related to the representative value from the first lookup table. The main processor 710 can control the display device 10 so that information about the user's skin moisture is displayed based on the moisture data.

[0174] Figure 10 is a circuit diagram of a first driving electrode, a first sensing electrode, a driving signal output unit, and a detector for mutual capacitance sensing according to an exemplary embodiment. Figure 10 Only one mutual capacitance Cm formed between one of the driving electrodes TE connected to the driving line and one of the sensing electrodes RE connected to the sensing line is exemplarily shown.

[0175] Reference Figure 10 The sensor driver 330 may include a driving signal output unit 331 and a detector 332 . The detector 332 may include a voltage detector 3321 and an analog-to-digital converter 3322 .

[0176] The driving signal output unit 331 outputs a driving signal to the driving electrode through the driving line. The driving signal may include a plurality of pulses.

[0177] The voltage detector 3321 detects the voltage charged into the mutual capacitance via the sensing line. The voltage detector 3321 may include an operational amplifier OA1, a feedback capacitor Cfb1, and a reset switch RSW1. The operational amplifier OA1 may include a first input terminal (-), a second input terminal (+), and an output terminal (out). The first input terminal (-) of the operational amplifier OA1 may be connected to the first sensing line RL1, the second input terminal (+) may be connected to the initialization voltage line VREFL from which the initialization voltage is supplied, and the output terminal (out) may be connected to the storage capacitor Cs1. The storage capacitor Cs1 is connected between the output terminal (out) and ground to store the output voltage Vout1 from the operational amplifier OA1. The feedback capacitor Cfb1 and the reset switch RSW1 may be connected in parallel between the first input terminal (-) and the output terminal (out) of the operational amplifier OA1. The reset switch RSW1 controls the connection between the two ends of the feedback capacitor Cfb1. When the reset switch RSW1 is turned on, connecting the two ends of the feedback capacitor Cfb1, the feedback capacitor Cfb1 may be reset.

[0178] The output voltage Vout1 from the operational amplifier OA1 can be defined as in the following formula 1:

[0179] [Formula 1]

[0180]

[0181] In this case, Vout1 represents an output voltage from the operational amplifier OA1 , Vcm represents a mutual capacitance, Cfb1 represents a capacitance of the feedback capacitor Cfb1 , and Vt1 represents a voltage charged in the mutual capacitance Cm.

[0182] The analog-to-digital converter 3322 can be connected to the storage capacitor Cs1 via the switch SW1. The switch SW1 controls the connection between the analog-to-digital converter 3322 and the storage capacitor Cs1. Since the analog-to-digital converter 3322 is connected to the storage capacitor Cs1 when the switch SW1 is turned on, the analog-to-digital converter 3322 can convert the output voltage Vout1 stored in the storage capacitor Cs1 into digital data and output the digital data.

[0183] Figure 11 According to an exemplary embodiment Figure 8 An enlarged plan view of area A.

[0184] Reference Figure 11 , the sensing electrodes RE may be arranged in a first direction (e.g., the X-axis direction) and electrically connected to each other. The driving electrodes TE may be arranged in a second direction (e.g., the Y-axis direction) and electrically connected to each other. The conductive pattern DE may be surrounded by the driving electrodes TE and the sensing electrodes RE, respectively.

[0185] The driving electrodes TE, the sensing electrodes RE, and the conductive patterns DE may be electrically separated from each other.The driving electrodes TE, the sensing electrodes RE, and the conductive patterns DE may be disposed separately from each other.

[0186] like Figure 11 As shown in FIG, the driving electrode TE and the sensing electrode RE may have substantially the same size. The size of the driving electrode TE may be larger than the size of the conductive pattern DE. The size of the sensing electrode RE may be larger than the size of the conductive pattern DE. Although Figure 11 Each of the driving electrodes TE, the sensing electrodes RE, and the conductive patterns DE has a diamond shape when viewed from the top, however, the inventive concept is not limited thereto, and the shape of each of the driving electrodes TE, the sensing electrodes RE, and the conductive patterns DE may vary.

[0187] In order to electrically separate the sensing electrodes RE and the driving electrodes TE at their intersections, the driving electrodes TE adjacent to each other in the second direction (e.g., the Y-axis direction) may be connected by a first connection portion BE1, and the sensing electrodes RE adjacent to each other in the first direction (e.g., the X-axis direction) may be connected by a second connection portion BE2.

[0188] The first connection portion BE1 may be formed on a different layer from the driving electrode TE and may be connected to the driving electrode TE through the first contact hole CNT1. Figure 13 As shown in FIG, the first sensor electrode layer TSL1 is formed, and the driving electrode TE can be formed as shown in FIG. Figure 13 As shown in FIG, the second sensor electrode layer TSL2 is formed in the second sensor electrode layer TSL2. The second sensor electrode layer TSL2 may be provided on the first sensor electrode layer TSL1.

[0189] Each of the first connection parts BE1 may be bent at least once. Figure 11 In the embodiment, the first connection portion BE1 is bent into a shape of "<" or ">", but the shape of the first connection portion BE1 is not limited thereto. In addition, since the driving electrodes TE adjacent to each other in the second direction (for example, the Y-axis direction) are connected by a plurality of first connection portions BE1, even if any one of the first connection portions BE1 is disconnected, the driving electrodes TE can still be stably connected to each other. Figure 11 Two adjacent driving electrodes TE are shown as being connected by two first connection portions BE1 , however, the inventive concept is not limited thereto, and the number of first connection portions BE1 between adjacent driving electrodes TE may vary.

[0190] The second connection portion BE2 is formed on the same layer as the sensing electrode RE and may have a shape extending from the sensing electrode RE. The sensing electrode RE and the second connection portion BE2 may be formed of substantially the same material. Figure 13 As shown in FIG, the sensing electrode RE and the second connection part BE2 may be formed in the second sensor electrode layer TSL2.

[0191] according to Figure 11 In the exemplary embodiment shown in FIG, the first connection portion BE1 connecting the drive electrodes TE adjacent to each other in the second direction (e.g., the Y-axis direction) can be formed in the first sensor electrode layer TSL1, while the drive electrodes TE, the sensing electrodes RE, the conductive pattern DE, and the second connection portion BE2 can be formed in the second sensor electrode layer TSL2 different from the first sensor electrode layer TSL1. In this way, the drive electrodes TE and the sensing electrodes RE can be electrically separated from each other at their intersections, while the sensing electrodes RE can be electrically connected to each other in the first direction (e.g., the X-axis direction), and the drive electrodes TE can be electrically connected to each other in the second direction (e.g., the Y-axis direction).

[0192] Figure 12 According to an exemplary embodiment Figure 11 An enlarged plan view of area A-1.

[0193] Reference Figure 12 , the driving electrodes TE, the sensing electrodes RE, the first connection parts BE1 and the second connection parts BE2 may be formed in a grid pattern. The conductive pattern DE may also be formed in a grid pattern. When the sensor electrode layer SEL including the driving electrodes TE and the sensing electrodes RE is as shown in FIG. Figure 6 When the second electrode of the emission material layer EML is formed directly on the thin film encapsulation layer TFEL as shown in , the distance between the second electrode of the emission material layer EML and each of the drive electrode TE and sensing electrode RE of the sensor electrode layer SEL can be close. In this way, because parasitic capacitance is proportional to the area over which the second electrode of the emission material layer EML overlaps with each of the drive electrode TE and sensing electrode RE of the sensor electrode layer SEL, a very large parasitic capacitance is formed between the second electrode of the emission material layer EML and the drive electrode TE and sensing electrode RE of the sensor electrode layer SEL. To reduce the parasitic capacitance, each of the drive electrode TE and sensing electrode RE can be formed in a grid pattern.

[0194] The driving electrode TE, the sensing electrode RE, the conductive pattern DE and the second connection portion BE2 are formed on the same layer and may be spaced apart from each other. Gaps may exist between the driving electrode TE and the sensing electrode RE, between the driving electrode TE and the second connection portion BE2, between the driving electrode TE and the conductive pattern DE, and between the sensing electrode RE and the conductive pattern DE. Figure 12In FIG. 1 , the boundary between the driving electrode TE and the sensing electrode RE and the boundary between the driving electrode TE and the second connecting portion BE2 are indicated by dotted lines.

[0195] The first connection portion BE1 can be connected to the drive electrode TE through a first contact hole CNT1. One end of each first connection portion BE1 can be connected to one of the drive electrodes TE adjacent to each other in the second direction (e.g., the Y-axis direction) through a 1-1 contact hole CNT1-1. The other end of each first connection portion BE1 can be connected to another of the drive electrodes TE adjacent to each other in the second direction (e.g., the Y-axis direction) through a 1-2 contact hole CNT1-2. The first connection portion BE1 can overlap the drive electrode TE and the sensing electrode RE. Alternatively, the first connection portion BE1 can overlap the second connection portion BE2 without overlapping the sensing electrode RE. Still alternatively, the first connection portion BE1 can overlap the sensing electrode RE and the second connection portion BE2. Because the first connection portion BE1 is formed on a different layer from the drive electrode TE, the sensing electrode RE, and the second connection portion BE2, short circuits in the sensing electrode RE and / or the second connection portion BE2 can be prevented even when the first connection portion BE1 overlaps the sensing electrode RE and / or the second connection portion BE2.

[0196] The second connection portion BE2 may be provided between the sensing electrodes RE. The second connection portion BE2 is formed on the same layer as the sensing electrodes RE and may extend from each sensing electrode RE. As such, the second connection portion BE2 may be connected to the sensing electrodes RE without requiring a separate contact hole.

[0197] The sub-pixels R, G, and B may include a first sub-pixel (red sub-pixel) R that emits light of a first color, a second sub-pixel (green sub-pixel) G that emits light of a second color, and a third sub-pixel (blue sub-pixel) B that emits light of a third color. Figure 12 In FIG, the first sub-pixel R is shown as a red sub-pixel, the second sub-pixel G is shown as a green sub-pixel, and the third sub-pixel B is shown as a blue sub-pixel, however, the inventive concept is not limited thereto. Figure 12 In the embodiment of the present invention, the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B are shown as having a hexagonal shape when viewed from the top, but the inventive concept is not limited thereto. For example, in some exemplary embodiments, the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B may have a polygonal shape other than a hexagonal shape, or a circular shape, or an elliptical shape when viewed from the top. In addition, although each of the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B is Figure 12, the third subpixel B may have the largest size, and the second subpixel G may have the smallest size. Alternatively, the size of the first subpixel R may be substantially equal to the size of the third subpixel B, and the size of the second subpixel G may be smaller than the size of each of the first subpixel R and the third subpixel B.

[0198] A pixel P is a group of sub-pixels that can represent grayscale. Figure 12 In the exemplary embodiment shown in FIG, a pixel P includes a first subpixel R, two second subpixels G, and a third subpixel B. However, the inventive concept is not limited thereto. For example, in some exemplary embodiments, a pixel P may include a first subpixel R, a second subpixel G, and a third subpixel B.

[0199] Since the drive electrodes TE, the sensing electrodes RE, the conductive pattern DE, the first connection portion BE1, and the second connection portion BE2 are formed in a grid pattern, the sub-pixels R, G, and B may not overlap with the drive electrodes TE, the sensing electrodes RE, the conductive pattern DE, the first connection portion BE1, and the second connection portion BE2. Therefore, the paths of light output from the sub-pixels R, G, and B may be prevented from being covered by the drive electrodes TE, the sensing electrodes RE, the conductive pattern DE, the first connection portion BE1, and the second connection portion BE2, which would reduce the brightness of the light.

[0200] Figure 11 The region A-2 shown in FIG. 1 is substantially symmetrical to the region A-1, and therefore, repeated description of the region A-2 will be omitted.

[0201] Figure 13 It is along Figure 12 A sectional view taken along line II-II'.

[0202] Reference Figure 13 The thin film transistor layer TFTL is formed on the substrate SUB. The thin film transistor layer TFTL includes a thin film transistor 120, a gate insulating layer 130, an interlayer dielectric layer 140, a protective layer 150, and a planarization layer 160.

[0203] A buffer film BF may be formed on a surface of the substrate SUB. The buffer film BF may be formed on one surface of the substrate SUB to protect the thin film transistor 120 and the organic emission layer 172 of the light-emitting element layer EML from moisture that may penetrate the substrate SUB. The buffer film BF may be formed of a plurality of inorganic layers stacked on top of each other. For example, the buffer film BF may include one or more inorganic layers, such as silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers stacked alternately on top of each other. In some exemplary embodiments, the buffer film BF may be omitted.

[0204] The thin film transistors 120 are provided on the buffer film BF. Each of the thin film transistors 120 includes an active layer 121, a gate electrode 122, a source electrode 123, and a drain electrode 124. Figure 14 In the embodiment, the thin film transistor 120 is implemented as a top-gate transistor in which the gate electrode 122 is located above the active layer 121. However, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the thin film transistor 120 may be implemented as a bottom-gate transistor in which the gate electrode 122 is located below the active layer 121, or as a dual-gate transistor in which the gate electrode 122 is provided above and below the active layer 121.

[0205] The active layer 121 is formed on the buffer film BF. The active layer 121 may include polycrystalline silicon, single crystal silicon, low temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor. For example, the oxide semiconductor may include a binary compound (AB) containing indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. x ), ternary compound (AB x C y ) and quaternary compounds (AB x C y D z ). For example, the active layer 121 may include an oxide containing indium, tin, and zinc (ITZO) or an oxide containing indium, gallium, and zinc (IGZO). In some exemplary embodiments, a light blocking layer for blocking external light incident on the active layer 121 may be formed between the buffer film BF and the active layer 121.

[0206] The gate insulating layer 130 may be formed on the active layer 121. The gate insulating layer 130 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. Figure 13 , the gate insulating layer 130 is shown as being formed on the entire buffer film BF regardless of the gate electrode 122 , however, the inventive concept is not limited thereto. For example, in some exemplary embodiments, the gate insulating layer 130 may be formed only over the gate electrode 122 .

[0207] The gate electrode 122 and the gate line may be formed on the gate insulating layer 130. The gate electrode 122 and the gate line may be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0208] An interlayer dielectric layer 140 may be formed over the gate electrode 122 and the gate line. The interlayer dielectric layer 140 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0209] The source electrode 123 and the drain electrode 124 may be formed on the interlayer dielectric layer 140. Each of the source electrode 123 and the drain electrode 124 may be connected to the active layer 121 through a contact hole penetrating the gate insulating layer 130 and the interlayer dielectric layer 140. The source electrode 123 and the drain electrode 124 may be composed of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0210] Protective layer 150 may be formed on source electrode 123 and drain electrode 124 to insulate thin film transistor 120. Protective layer 150 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0211] The planarization layer 160 may be formed on the protective layer 150 to provide a flat surface for the step difference of the thin film transistor 120. The planarization layer 160 may be formed of an organic layer such as acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin.

[0212] The emission material layer EML is formed on the thin film transistor layer TFTL and includes a light emitting element 170 and a dam layer 180 .

[0213] The light emitting elements 170 and the dam layer 180 are formed on the planarization layer 160. Each of the light emitting elements 170 may include a first electrode 171, an organic emission layer 172, and a second electrode 173.

[0214] The first electrode 171 may be formed on the planarization layer 160. Figure 13 The first electrode 171 is shown as being connected to the drain electrode 124 of the thin film transistor 120 through a contact hole penetrating the protective layer 150 and the planarization layer 160, however, the inventive concept is not limited thereto. The first electrode 171 may be connected to the source electrode 123 of the thin film transistor 120 through a contact hole penetrating the protective layer 150 and the planarization layer 160.

[0215] In a top-emission organic light-emitting diode that emits light from the organic emission layer 172 toward the second electrode 173, the first electrode 171 may be made of a metal material having high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy may be an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0216] In a bottom-emitting organic light-emitting diode that emits light from the organic emission layer 172 toward the first electrode 171, the first electrode 171 may be formed of a transparent conductive material (TCP) such as ITO and IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), and an alloy of magnesium (Mg) and silver (Ag). In this case, when the first electrode 171 is made of a semi-transmissive metal material, light extraction efficiency can be increased by using a microcavity.

[0217] In order to define sub-pixels R, G, and B, a dam layer 180 may be formed to separate the first electrodes 171 from each other on the planarization layer 160. The dam layer 180 may be formed to cover edges of the first electrodes 171. The dam layer 180 may be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0218] In each of the sub-pixels R, G, and B, a first electrode 171, an organic emission layer 172, and a second electrode 173 are sequentially stacked on each other so that holes from the first electrode 171 and electrons from the second electrode 173 can be combined with each other in the organic emission layer 172 to emit light. The second sub-pixel G and the third sub-pixel B can be formed to be the same as Figure 13 The first sub-pixel R shown in FIG is substantially the same.

[0219] An organic emission layer 172 is formed on the first electrode 171 and the dam layer 180. The organic emission layer 172 may include an organic material and emit light of a specific color. For example, the organic emission layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. In this case, the organic emission layer 172 of the red sub-pixel R may emit red light, the organic emission layer 172 of the green sub-pixel G may emit green light, and the organic emission layer 172 of the blue sub-pixel B may emit blue light.

[0220] Alternatively, the organic emission layer 172 of the sub-pixels R, G, and B may be formed as a single layer that emits white light, ultraviolet light, or blue light. In this case, the red sub-pixel R may be stacked with a red color filter layer that transmits red light, the green sub-pixel G may be stacked with a green color filter layer that transmits green light, and the blue sub-pixel B may be stacked with a blue color filter layer that transmits blue light. The red color filter layer, the green color filter layer, and the blue color filter layer may be disposed on the thin film encapsulation layer TFEL. In addition, in other exemplary embodiments, the red sub-pixel R may be stacked with a red wavelength conversion layer that converts ultraviolet light or blue light into red light, the green sub-pixel G may be stacked with a green wavelength conversion layer that converts ultraviolet light or blue light into green light, and the blue sub-pixel B may be stacked with a blue wavelength conversion layer that converts ultraviolet light or blue light into blue light. The red wavelength conversion layer, the green wavelength conversion layer, and the blue wavelength conversion layer may be disposed on the thin film encapsulation layer TFEL. For example, the red wavelength conversion layer can be set between the thin film encapsulation layer TFEL and the red color filter layer, the green wavelength conversion layer can be set between the thin film encapsulation layer TFEL and the green color filter layer, and the blue wavelength conversion layer can be set between the thin film encapsulation layer TFEL and the blue color filter layer.

[0221] The second electrode 173 is formed on the organic emission layer 172 . The second electrode 173 may be formed to cover the organic emission layer 172 . The second electrode 173 may be a common layer formed across the pixels P. A capping layer may be formed on the second electrode 173 .

[0222] In a top-emission organic light-emitting diode, the second electrode 173 may be formed of a transparent conductive material (TCP) such as ITO and IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), and an alloy of magnesium (Mg) and silver (Ag). When the second electrode 173 is formed of a semi-transmissive metal material, light extraction efficiency can be increased by using a microcavity.

[0223] In a bottom-emitting organic light-emitting diode, the second electrode 173 may be made of a metal material having high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). As described above, the APC alloy may be an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0224] The thin film encapsulation layer TFEL is formed on the light emitting element layer EML. The thin film encapsulation layer TFEL is arranged on the second electrode 173. The thin film encapsulation layer TFEL may include at least one inorganic layer to prevent oxygen or moisture from penetrating into the organic emission layer 172 and the second electrode 173. In addition, the thin film encapsulation layer TFEL may include at least one organic layer to protect the emission material layer EML from particles (such as dust). For example, the thin film encapsulation layer TFEL may include a first inorganic layer arranged on the second electrode 173, an organic layer arranged on the first inorganic layer, and a second inorganic layer arranged on the organic layer. The first inorganic layer and the second inorganic layer may be formed of, but not limited to, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may be formed of, but not limited to, acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0225] The sensor electrode layer SEL is formed on the thin film encapsulation layer TFEL. A buffer layer may be formed between the thin film encapsulation layer TFEL and the sensor electrode layer SEL. The sensor electrode layer SEL may include a first sensor electrode layer TSL1 and a second sensor electrode layer TSL2. Figure 13 Only the drive electrodes TE, the sensing electrodes RE and the first connection BE1 of the sensor electrode layer SEL are shown.

[0226] The first sensor electrode layer TSL1 is formed on the thin film encapsulation layer TFEL. The first sensor electrode layer TSL1 may include a first connection portion BE1. The first sensor electrode layer TSL1 may be formed of, but is not limited to, a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0227] The first touch insulating layer TINS1 is formed on the first sensor electrode layer TSL1. The first touch insulating layer TINS1 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. Alternatively, the first touch insulating layer TINS1 may be formed of an organic layer, such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0228] The second sensor electrode layer TSL2 is formed on the first touch insulation layer TINS1. The second sensor electrode layer TSL2 may include drive electrodes TE, sense electrodes RE, conductive patterns DE, second connection portions BE2, a first group of drive lines GTL1, a second group of drive lines GTL2, sense lines RL, guard lines GL1, GL2, GL3, GL4, and GL5, and ground lines GRL1, GRL2, and GRL3. The second sensor electrode layer TSL2 may be formed of, but is not limited to, a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0229] The first contact hole CNT1 may be formed through the first touch insulating layer TINS1, and the first connection part BE1 may be exposed through the first contact hole CNT1. The driving electrode TE may be connected to the first connection part BE1 through the first contact hole CNT1.

[0230] The second touch insulating layer TINS2 is formed on the second sensor electrode layer TSL2. The second touch insulating layer TINS2 can provide a flat surface for the height difference generated by the first sensor electrode layer TSL1 and the second sensor electrode layer TSL2. The second touch insulating layer TINS2 can be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0231] according to Figure 13 In the exemplary embodiment shown in FIG, the first connection portion BE1 connecting the drive electrodes TE adjacent to each other in the second direction (e.g., the Y-axis direction) can be formed in the first sensor electrode layer TSL1, while the drive electrodes TE, the sensing electrodes RE, and the second connection portion BE2 can be formed in the second sensor electrode layer TSL2 different from the first sensor electrode layer TSL1. In this way, the drive electrodes TE and the sensing electrodes RE can be electrically separated from each other at their intersections, while the sensing electrodes RE can be electrically connected to each other in the first direction (e.g., the X-axis direction), and the drive electrodes TE can be electrically connected to each other in the second direction (e.g., the Y-axis direction).

[0232] Figure 14 is a flowchart for illustrating a touch sensing scheme of a sensor unit in a second driving mode according to an exemplary embodiment.

[0233] Reference Figure 14, the driving signal output unit 331 applies the driving signal to the first R driving lines, to the second R driving lines, and so on. The detector 332 detects the voltage charged in the mutual capacitance through the sensing line RL, and converts the voltage charged in the mutual capacitance sensed by the first S sensing lines, the second S sensing lines, and so on into detection data as digital data. As used herein, the voltage of the mutual capacitance detected by the detector 332 may be referred to as a detection signal ( Figure 14 Step S101 and step S102).

[0234] The driving signal output unit 331 applies the driving signal to the first R driving lines, the second R driving lines, etc. according to the driving signal control signal VCS in the second driving mode. Figure 15 As shown in , in the second driving mode, the driving signal output unit 331 may apply a driving signal to the first driving line TL1, then to the second driving line TL2, then to the third driving line TL3, and then to the fourth driving line TL4.

[0235] The detector 332 detects the voltage charged in the mutual capacitance of each S sensing line according to the sensing control signal DCS in the second driving mode. The detector 332 converts the detection voltage charged in the mutual capacitance received through the sensing line into detection data DD as digital data. In this case, the mutual capacitance formed at the intersection of the R driving electrodes and the S sensing electrodes can be defined as a first unit sensor. Specifically, the detector 332 can calculate the (multiple) voltages charged in the R×S (multiple) mutual capacitances of the first unit sensor as one detection data DD.

[0236] For example, Figure 15 As shown in , the driving signal output unit 331 can apply the driving signal to the driving lines one by one in the second driving mode. The detector 332 can detect the voltage charged in the mutual capacitance of the sensing lines one by one in the second driving mode. In this case, the mutual capacitance formed at the intersection of a driving electrode and a sensing electrode can be defined as a first unit sensor. Specifically, the detector 332 can calculate the voltage charged in a mutual capacitance of the first unit sensor as a detection data DD. Figure 15 , each of the first to sixteenth mutual capacitances Cm1 to Cm16 may be defined as a unit sensor.

[0237] Then, the detection data DD is analyzed to determine whether there is a user's touch ( Figure 14 Step S103).

[0238] The main processor 710 receives detection data DD from the detector 332. The main processor 710 can analyze the detection data DD and calculate the change in mutual capacitance in the second driving mode. The main processor 710 can calculate the user's touch coordinates based on the change in mutual capacitance, and then execute the application indicated by the icon touched by the user or perform the operation. For example, when the change in mutual capacitance of the first unit sensor calculated based on the detection data DD is greater than the first threshold, the main processor 710 sets the coordinates of the first unit sensor to the user's touch coordinates in the second driving mode. For example, the main processor 710 can control the display device 10 so that the application indicated by the icon displayed on the touch coordinates is executed.

[0239] Figure 16 is a flowchart for illustrating a touch sensing scheme of a sensor unit in a first driving mode according to an exemplary embodiment.

[0240] Reference Figure 16 , the driving signal output unit 331 applies a driving signal to each P driving line. The detector 332 detects the voltage charged in the mutual capacitance of each Q sensing line through the sensing line RL, and converts the voltage charged in the mutual capacitance into detection data which may be digital data. As used herein, the voltage of the mutual capacitance detected by the detector 332 may be referred to as a detection signal ( Figure 16 Steps S201 and S202).

[0241] The driving signal output unit 331 applies a driving signal to each of the P driving lines according to the driving signal control signal VCS in the first driving mode. For example, in the first driving mode, the driving signal output unit 331 may apply a driving signal to the first driving line TL1 and the second driving line TL2 at the same time, and then may apply a driving signal to the third driving line TL3 and the fourth driving line TL4 at the same time.

[0242] The detector 332 detects the voltage charged in the mutual capacitance of each Q sensing line according to the sensing control signal DCS in the first driving mode. The detector 332 converts the voltage charged in the detected mutual capacitance received through the sensing line into detection data DD, which can be digital data. In this case, the (multiple) mutual capacitances formed at the (multiple) intersections of the P driving electrodes and the Q sensing electrodes can be defined as a second unit sensor. Specifically, the detector 332 can calculate the change in the P×Q (multiple) mutual capacitances of the second unit sensor as one detection data DD.

[0243] When the mutual capacitance of the second unit sensor is larger, the change in mutual capacitance of the second unit sensor may also be larger depending on the moisture content of a person's skin. Thus, the mutual capacitance of the second unit sensor may be larger than the mutual capacitance of the first unit sensor. Consequently, the detection data DD calculated from the mutual capacitance of the second unit sensor may be larger than the detection data DD calculated from the mutual capacitance of the first unit sensor.

[0244] For example, Figure 17 As shown in , the drive signal output unit 331 can sequentially apply drive signals to the drive lines in pairs in the first drive mode. The detector 332 can receive the change in mutual capacitance of each two sensing lines in the first drive mode. In this case, the mutual capacitance formed at the intersection of two drive electrodes and two sensing electrodes can be defined as a second unit sensor. Specifically, the detector 332 can calculate the change in the four mutual capacitances of the second unit sensor as one detection data DD.

[0245] Then, the detection data DD is analyzed to calculate the user's skin moisture ( Figure 16 Step S203).

[0246] The main processor 710 receives detection data DD from the detector 332. The main processor 710 can determine the user's skin moisture by analyzing the detection data DD in the first driving mode. For example, the main processor 710 can calculate the change in the mutual capacitance of the second unit sensor based on the detection data DD. The main processor 710 can calculate a representative value obtained by adding the change in the mutual capacitance of the second unit sensor. The main processor 710 may include a first lookup table storing moisture data, which includes information about the user's skin moisture related to the representative value. When the main processor 710 outputs the representative value to the first lookup table, the main processor 710 can receive moisture data related to the representative value from the first lookup table. The main processor 710 can control the display device 10 so that information about the user's skin moisture is displayed based on the moisture data.

[0247] according to Figure 16 In the exemplary embodiment shown in FIG, the mutual capacitance of the second unit sensor in the first driving mode is greater than the mutual capacitance of the first unit sensor in the second driving mode, so that the mutual capacitance of the second unit sensor can be greater than the mutual capacitance of the first unit sensor. In this way, the difference between the changes in the mutual capacitance of the second unit sensor can be larger according to the skin moisture of a person, so that the skin moisture can be measured.

[0248] Figure 18 is a graph showing a change in total mutual capacitance according to the frequency of a driving signal in a first driving mode.

[0249] exist Figure 18 In the graph shown in , the x-axis represents the frequency (kHz) of the driving signal, and the y-axis represents the representative value ΔCap calculated based on the detection data DD. The representative value ΔCap is proportional to the detection data DD. The representative value may be the sum of the changes in the mutual capacitance of the second unit sensor.

[0250] Reference Figure 18 When the frequency of the driving signal in the first driving mode is within a range of approximately 50 kHz to approximately 500 kHz, there may be a difference in the representative value ΔCap between dry skin and wet skin. On the other hand, when the frequency of the driving signal is greater than approximately 500 kHz, there is almost no difference in the representative value ΔCap between dry skin and wet skin. Thus, in the first driving mode, the frequency of the driving signal output from the driving signal output unit 331 may range from approximately 50 kHz to approximately 500 kHz.

[0251] The driving signal output unit 331 can output the driving signal at the first frequency in the second driving mode, and can output the driving signal at the second frequency in the first driving mode. For example, the first frequency can be about 200kHz, and the second frequency can be about 50kHz to about 500kHz.

[0252] Since the first frequency is within the range of the second frequency, the driving signal output unit 331 may output the driving signal at the same frequency in the second driving mode and the first driving mode, so that the driving method is simplified.

[0253] Furthermore, when the second frequency is between about 50 kHz and about 100 kHz, the difference in the representative value ΔCap between dry skin and wet skin is greater than the difference in the representative value ΔCap between dry skin and wet skin when the second frequency is between about 100 kHz and about 500 kHz. Thus, to increase the accuracy of measuring skin moisture, the drive signal output unit 331 may output a drive signal at a frequency of between about 50 kHz and about 100 kHz in the first drive mode. In this case, the drive signal output unit 331 may output a drive signal at a different frequency between the second drive mode and the first drive mode.

[0254] Figure 19 is a graph showing the changes in total mutual capacitance of different experimenters over time under the first driving mode.

[0255] exist Figure 19 In the graph shown in , the x-axis represents the frequency (kHz) of the driving signal, and the y-axis represents the representative value ΔCap calculated based on the detection data DD. The representative value may be the sum of the changes in the mutual capacitance of the second unit sensors.

[0256] Reference Figure 19The time period until the representative value ΔCap reaches saturation may vary depending on the person's skin. For example, for subject A, the representative value ΔCap hardly changes, while for subjects B and C, the representative value ΔCap may reach saturation after approximately 1,500 ms (approximately 1.5 seconds).

[0257] The time period until the representative value ΔCap reaches 90% saturation can be approximately 1,000ms (i.e., approximately 1 second). Even when the representative value ΔCap is 90% saturated, skin moisture can be calculated based on the representative value ΔCap. Therefore, the time period over which the drive signal is applied in the first drive mode can be approximately 1 second to 1.5 seconds. Therefore, in the first drive mode, the drive signal output unit 331 can repeatedly apply the drive signal sequentially to the first P drive lines, the second P drive lines, etc. for approximately 1 second or 1.5 seconds. In this way, the time period over which the drive signal is sequentially applied to the first P drive lines, the second P drive lines, etc. in the first drive mode can be longer than the time period over which the drive signal is sequentially applied to the first R drive lines, the second R drive lines, etc. in the second drive mode.

[0258] Figure 20 is a graph showing capacitance of skin moisture content relative to total mutual capacitance.

[0259] exist Figure 20 In the graph shown in , the x-axis represents the representative value ΔCap, and the y-axis represents the skin moisture content (%). The skin moisture content can be represented as 0 to 100%. The representative value can be the sum of the changes in the mutual capacitance of the second unit sensor.

[0260] Reference Figure 20 , the representative value ΔCap is proportional to the skin moisture content. Specifically, the larger the representative value ΔCap is, the higher the skin moisture content is, and vice versa. Since the representative value ΔCap is proportional to the detection data DD, the detection data DD is proportional to the skin moisture content.

[0261] like Figure 21 As shown in Figure 1, human skin consists of the stratum corneum, epidermis, and dermis. The stratum corneum is exposed to the outside. The epidermis is located below the stratum corneum. The dermis is located below the epidermis. Figure 22 As shown in , the stratum corneum includes keratinocytes and intercellular lipids. Keratinocytes may include natural moisturizing factors. Intercellular lipids may include ceramides, fatty acids, cholesterol, etc. The moisture content of the stratum corneum may vary depending on the natural moisturizing factors.

[0262] Since the dielectric constant of water is greater than that of cholesterol, ceramide, etc., the higher the water content of the stratum corneum, the greater the capacitance value of the person, and vice versa. Figure 20As shown in , the capacitance value of a person increases as the moisture content of the person's skin increases, and therefore, the representative value ΔCap may increase.

[0263] according to Figure 20 In the exemplary embodiment shown in FIG. 3 , the representative value ΔCap may be calculated based on the detection data DD in the first driving mode, and the skin moisture content of a person may be calculated based on the representative value ΔCap.

[0264] Figure 23 is a flowchart for illustrating a touch sensing scheme of a sensor unit in a first driving mode according to an exemplary embodiment.

[0265] Figure 23 The touch sensing scheme shown in Figure 16 The difference of the touch sensing scheme shown in FIG is that step S303 is added. Figure 23 Steps S301, S302 and S304 are the same as Figure 16 Step S201, step S202 and step S203 are basically the same, so their repeated description will be omitted.

[0266] Reference Figure 23 , the main processor 710 can receive the detection data DD from the detector 332 in the first driving mode, and can determine the user's skin moisture by analyzing the detection data DD. In doing so, after correcting the detection data DD according to the use environment of the display device 10 in step S303, the user can determine the user's skin moisture by analyzing the detection data DD. For example, Figure 24 As shown in , the main processor 710 can correct the detection data DD in consideration of temperature and humidity. Figure 25 As shown in , the main processor 710 can correct the detection data DD based on whether the protective film is present. Alternatively, as shown in Figure 26 As shown in , the main processor 710 may correct the detection data DD by determining whether the display device 10 is in contact with a base block such as the ground and an object.

[0267] Figure 24 is a diagram showing a method according to an exemplary embodiment Figure 23 Flowchart of step S303.

[0268] Reference Figure 24 , the main processor 710 can obtain temperature information and humidity information. For example, when the skin moisture measurement application is running, the temperature information and humidity information of the current location can be automatically sent from the weather bureau through wireless communication using the global positioning system (GPS). Alternatively, when the skin moisture measurement application is running, the user can manually input the temperature information and humidity information of the current location ( Figure 24 , step S401 in the process.

[0269] The main processor 710 then determines whether the temperature is within a predetermined temperature range. For example, the predetermined temperature range may be approximately 5°C to approximately 35°C, which is room temperature. When the temperature exceeds the predetermined temperature range, the main processor 710 corrects the sensed detection data DD. For example, when the temperature is below the lower limit of the predetermined temperature range, the detection data DD may be smaller than the detection data DD when the temperature is within the predetermined temperature range. Therefore, the main processor 710 may correct the detection data DD by increasing it. In addition, when the temperature is above the upper limit of the predetermined temperature range, the detection data DD may be larger than the detection data DD when the temperature is within the predetermined temperature range. Therefore, the main processor 710 may correct the detection data DD by decreasing the detection data DD.

[0270] The main processor 710 may include a second lookup table that stores the detection data corrected based on the temperature and the detection data. The main processor 710 may use the second lookup table to correct the sensed detection data DD ( Figure 24 Step S402 and step S403).

[0271] The main processor 710 then determines whether the humidity is within a predetermined humidity range. For example, the predetermined humidity range may be approximately 40% to approximately 60%. If the humidity exceeds the predetermined humidity range, the main processor 710 corrects the detection data DD. For example, if the humidity is below the lower limit of the predetermined humidity range, the detection data DD may be smaller than the detection data DD when the humidity is within the predetermined humidity range. Therefore, the main processor 710 may correct the detection data DD by increasing the detection data DD. Alternatively, if the humidity is above the upper limit of the predetermined humidity range, the detection data DD may be larger than the detection data DD when the humidity is within the predetermined humidity range. Therefore, the main processor 710 may correct the detection data DD by decreasing the detection data DD.

[0272] The main processor 710 may include a third lookup table that stores the detection data corrected based on the humidity and the detection data. The main processor 710 may use the third lookup table to correct the detection data DD( Figure 24 Step S404 and step S405).

[0273] according to Figure 24 According to the exemplary embodiment shown in FIG. 3 , the skin moisture of a user may be determined more accurately by correcting the detection data DD based on temperature and humidity according to the position of the user.

[0274] Figure 25 is a diagram showing a method according to another exemplary embodiment Figure 23 Flowchart of step S303.

[0275] Reference Figure 25, the main processor 710 can obtain information about whether the protective film is attached to the cover window 100. For example, when running the skin moisture measurement application, the user can manually input whether the protective film is attached ( Figure 25 Step S501).

[0276] If a protective film is attached to the cover window 100, the main processor 710 corrects the detection data DD. For example, when the protective film is attached to the cover window 100, the moisture of the user's skin is blocked by the protective film, and therefore, the detection data DD may be smaller than the detection data DD when the protective film is not attached. Therefore, when the protective film is attached to the cover window 100, the main processor 710 can correct the detection data DD by increasing the detection data DD.

[0277] The main processor 710 may include a fourth lookup table storing corrected detection data related to the detection data. The main processor 710 may use the fourth lookup table to correct the detection data DD( Figure 25 Step S502).

[0278] according to Figure 25 According to the exemplary embodiment shown in FIG. 1 , by correcting the detection data DD based on whether the protection film is attached to the cover window 100 , the user's skin moisture can be determined more accurately.

[0279] Figure 26 is a diagram showing a method according to another exemplary embodiment Figure 23 Flowchart of step S303.

[0280] Reference Figure 26 , the main processor 710 can determine whether the display device 10 is in contact with a base block such as the ground and an object. The main processor 710 can determine the inclination of the display device 10 and the rotation direction of the display device 10 based on the acceleration data from the acceleration sensor 740 and the angular velocity data from the gyroscope sensor 750. Therefore, the main processor 710 can determine whether the display device 10 is stationary based on the acceleration data and the angular velocity data. When the user measures the skin moisture when the display device 10 is stationary, the main processor 710 can determine that the display device 10 is supported by a base block such as the ground and an object ( Figure 26 S601 in ).

[0281] Then, when it is determined that the display device 10 is supported by a base block, such as the ground or an object, the main processor 710 corrects the detection data DD. For example, when it is determined that the display device 10 is supported by a base block, such as the ground or an object, the capacitance of the sensor electrode is affected by the base block. As a result, the detection data DD may be smaller than the detection data DD when the display device 10 is not supported by the base block. In this way, when the display device 10 is supported by the base block, the main processor 710 can correct the detection data DD by increasing the detection data DD.

[0282] The main processor 710 may include a fifth lookup table storing corrected detection data associated with the detection data. The main processor 710 may use the fifth lookup table to correct the detection data DD( Figure 26 Step S602).

[0283] according to Figure 26 The exemplary embodiment shown in FIG. 1 can more accurately determine the skin moisture of a user by correcting the detection data DD according to whether the display device 10 is supported by a base block such as the ground or an object.

[0284] In a sensor unit, a display device including the sensor unit, and a method for measuring moisture using the sensor unit constructed according to one or more exemplary embodiments, the amount of mutual capacitance of the second unit sensor in a first driving mode may be greater than the amount of mutual capacitance of the first unit sensor in a second driving mode, so that the capacitance of the mutual capacitance of the second unit sensor may be greater than the capacitance of the mutual capacitance of the first unit sensor. In this manner, the difference between the amount of change in the mutual capacitance of the second unit sensor may be greater depending on the moisture content of a person's skin, so that the skin moisture content may be measured more accurately.

[0285] In a sensor unit, a display device including the sensor unit, and a method for measuring moisture using the sensor unit according to one or more exemplary embodiments, the frequency of the driving signal is controlled within a range of approximately 50 kHz to approximately 500 kHz, so that in a first driving mode, the difference between the amount of change in mutual capacitance of the second unit sensor for dry skin and the amount of change in mutual capacitance of the second unit sensor for wet skin can be larger. In this way, a person's skin moisture can be measured more accurately.

[0286] In a sensor unit, a display device including the sensor unit, and a method for measuring moisture using the sensor unit according to one or more exemplary embodiments, in a first driving mode, a driving signal is repeatedly applied sequentially to each P driving lines for approximately 1 to 1.5 seconds, thereby increasing the difference in mutual capacitance changes between the second unit sensors for different people's skin. In this manner, the moisture content of a person's skin can be measured more accurately.

[0287] In a sensor unit, a display device including the sensor unit, and a method of measuring moisture using a sensor unit constructed according to one or more exemplary embodiments, a user's skin moisture can be determined more accurately by correcting detection data based on temperature and humidity according to the user's position.

[0288] In a sensor unit, a display device including the sensor unit, and a method of measuring moisture using a sensor unit constructed according to one or more exemplary embodiments, the user's skin moisture can be more accurately determined by correcting detection data based on whether a protective film is attached to a cover window.

[0289] In a sensor unit, a display device including the sensor unit, and a method of measuring moisture using the sensor unit constructed according to one or more exemplary embodiments, the user's skin moisture can be more accurately determined by correcting detection data based on whether the display device is supported by a base block such as the ground and an object.

[0290] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those skilled in the art.

Claims

1. A sensor unit, comprising: drive electrodes and sense electrodes; a driving line connected to the driving electrode; a sensing line connected to the sensing electrode; a driving signal output unit configured to sequentially apply a driving signal to every P driving lines in a first driving mode, where P is a positive integer; and a detector configured to receive a detection signal from every Q sensing lines in the first driving mode, wherein Q is a positive integer, Wherein, the first driving mode is used to calculate the skin moisture content, and Wherein, in the first driving mode, the frequency of the driving signal is in the range of 50 kHz to 500 kHz.

2. The sensor unit according to claim 1, wherein P is greater than Q.

3. The sensor unit according to claim 1, wherein P equals Q. The sensor unit according to claim 1 , wherein: In the first driving mode, the driving signal output unit is configured to apply the driving signal to each of the P driving lines simultaneously.

5. The sensor unit according to claim 4, wherein In the first driving mode, the driving signal output unit is configured to repeatedly apply the driving signal sequentially to every P driving lines for 1 second to 1.5 seconds. The sensor unit according to claim 1 , wherein: In the first driving mode, the detector is configured to convert the detection signal into digital detection data and output the digital detection data.

7. The sensor unit according to claim 1, wherein: The driving signal output unit is configured to sequentially apply a driving signal to every R driving lines in a second driving mode, wherein R is a positive integer less than P; and The detector is configured to receive detection signals from S sensing lines in the second driving mode, wherein S is a positive integer less than Q, The second driving mode is used to detect touch. The sensor unit according to claim 7 , wherein: A time period over which the driving signal is sequentially applied to each of the P driving lines in the first driving mode is longer than a time period over which the driving signal is sequentially applied to each of the R driving lines in the second driving mode.

9. The sensor unit according to claim 8, wherein The frequency of the driving signal in the first driving mode is different from the frequency of the driving signal in the second driving mode.

10. The sensor unit according to claim 8, wherein: The frequency of the driving signal in the first driving mode is equal to the frequency of the driving signal in the second driving mode; The first driving mode includes a moisture measurement mode; and The second driving mode includes a touch sensing mode.

11. A display device, comprising: The display panel includes a display unit configured to display an image and a sensor unit configured to measure skin moisture content, the sensor unit including: sensor electrodes, including drive electrodes and sensing electrodes; a driving line connected to the driving electrode; a sensing line connected to the sensing electrode; a driving signal output unit configured to sequentially apply a driving signal to every P driving lines in a first driving mode, where P is a positive integer; and a detector configured to receive a detection signal from every Q sensing lines in the first driving mode, wherein Q is a positive integer, Wherein, the first driving mode is used to calculate the skin moisture content, and Wherein, in the first driving mode, the frequency of the driving signal is in the range of 50 kHz to 500 kHz.

12. The display device according to claim 11, further comprising a main processor, wherein: The detector is configured to convert the detection signal into digital detection data in the first driving mode and output the digital detection data; and The main processor is configured to calculate skin moisture content based on the digital detection data.

13. The display device according to claim 12, wherein: The main processor is configured to output skin moisture data including skin moisture content information based on the digital detection data.

14. The display device according to claim 12, wherein: The main processor is configured to correct the digital detection data before calculating the skin moisture content based on the digital detection data.

15. The display device according to claim 12, wherein: The main processor is configured to correct the digital detection data when at least one of temperature is not within a predetermined temperature range and humidity is not within a predetermined humidity range.

16. The display device according to claim 15, wherein: When the temperature is lower than a lower limit of the predetermined temperature range, the corrected digital detection data has a value greater than the digital detection data; and When the temperature is higher than an upper limit of the predetermined temperature range, the corrected digital detection data has a value lower than the digital detection data.

17. The display device according to claim 12, wherein: The main processor is configured to increase the digital detection data when a protective film is disposed on the display panel.

18. The display device according to claim 12, wherein: The main processor is configured to increment the digital detection data when the display panel is determined to be stationary.

19. A method for measuring moisture by a sensor unit, the method comprising: sequentially applying a driving signal to every P driving lines and receiving a detection signal from every Q sensing lines, where P and Q are positive integers; converting the detection signal into digital detection data; and Calculating skin moisture content based on the digital detection data, wherein the skin moisture content increases as the digital detection data increases, and The frequency of the driving signal is in the range of 50 kHz to 500 kHz. 20 . The method of claim 19 , further comprising correcting the digital detection data when at least one of the temperature is not within a predetermined temperature range and the humidity is not within a predetermined humidity range.

21. The method according to claim 20, wherein When the temperature is lower than a lower limit of the predetermined temperature range, the digital detection data is increased, and when the temperature is higher than an upper limit of the predetermined temperature range, the digital detection data is decreased. 22 . The method of claim 19 , further comprising increasing the digital detection data when a protection film is provided on the display panel.

23. The method according to claim 19, further comprising increasing the digital detection data if it is determined that the display panel is supported by the base block, wherein The base block is the ground or an object.

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