Display device

Abstract

A display device is provided. The display device includes: a first substrate having a display area, a non-display area, and a protruding area; a first sensing pad formed adjacent to the protruding area in the non-display area; a circuit element layer located in the display area; a display element layer located on the circuit element layer; a second substrate arranged to face the remaining areas except the protruding area; a second sensing pad formed on the second substrate corresponding to the first sensing pad; and a sealing member arranged along the edge of the second substrate to attach the first and second substrates to each other. The display element layer includes: a first electrode connected to a source or drain electrode of a thin-film transistor disposed on the circuit element layer; a pixel defining film defining a pixel area of ​​the display element layer, exposing the first electrode; a light-emitting layer located on the first electrode; and a second electrode located on the light-emitting layer. The first and second sensing pads are arranged between the edge of the second electrode and the sealing member.

Description

Technical Field

[0001] This invention relates to a display device. Background Technology

[0002] Electronic devices that provide images to users, such as smartphones, tablets, digital cameras, laptops, navigators, and smart TVs, include display devices for displaying images. These display devices include display panels that generate and display images, and various input devices.

[0003] Recently, touch sensors, which recognize touch input and are primarily used in smartphones and tablets, are being widely applied to display devices. Due to the convenience of touch input, touch sensors are trending towards replacing existing physical input devices such as keyboards.

[0004] An organic light-emitting display device with an in-cell touch structure has the following structure: a first substrate equipped with organic light-emitting elements and a second substrate equipped with a touch electrode array face each other and are bonded together by a sealing member. At this time, a plurality of lower pad electrodes for applying signals to the touch electrode array may be provided in the non-display area of ​​the first substrate, and an upper pad electrode connected to the touch electrodes of the touch electrode array on the second substrate is formed by bonding it together with a conductive member. Summary of the Invention

[0005] The problem that this invention aims to solve is to provide a display device with an in-cell touch structure that reduces useless space by arranging the upper pad electrode and the lower pad electrode inside the sealing component.

[0006] The subject matter of this invention is not limited to the subject matter mentioned above, and those skilled in the art will clearly understand other technical subject matter not mentioned from the following description.

[0007] A display device according to an embodiment for solving the above-mentioned technical problems includes: a first substrate having a display area, a non-display area surrounding the display area, and a protruding area extending from one side of the non-display area; a first sensing pad formed on the first substrate adjacent to the protruding area in the non-display area; a circuit element layer on the first substrate located in the display area; a display element layer located on the circuit element layer; a second substrate arranged to face the remaining areas except for the protruding area; a second sensing pad formed on the second substrate corresponding to the first sensing pad; and a sealing member arranged along the edge of the second substrate, thereby attaching the first substrate and the second substrate to each other. The display element layer includes: a first electrode connected to a source electrode or a drain electrode of a thin-film transistor disposed on the circuit element layer; a pixel defining film defining a pixel area of ​​the display element layer and exposing the first electrode; a light-emitting layer located on the first electrode; and a second electrode located on the light-emitting layer. The first sensing pad and the second sensing pad are arranged in a plane between the edge of the second electrode and the sealing member.

[0008] The first substrate, the second substrate, and the second electrode may each include a left long side and a right long side extending along a first direction, and an upper short side and a lower short side extending along a second direction intersecting the first direction. The corners where the left long side, the right long side, the upper short side, and the lower short side intersect form a curved surface.

[0009] The corner where the upper short side of the second electrode intersects the left long side and the right long side may have a first radius of curvature, and the corner where the lower short side intersects the left long side and the right long side may have a second radius of curvature that is different from the first radius of curvature.

[0010] The first radius of curvature of the second electrode can be the same as the radius of curvature of the corner where the upper short side of the first substrate and the left long side and the right long side intersect.

[0011] The first radius of curvature of the second electrode can be smaller than the second radius of curvature of the second electrode.

[0012] The first sensing pad and the second sensing pad can be arranged in a plane between the edge of the second electrode having the second radius of curvature and the sealing member.

[0013] The corner where the lower short side of the second electrode intersects the left long side and the right long side can be either a stepped boundary line or a straight boundary line on the plane.

[0014] The boundary line of the second electrode can be arranged on a plane between the edge of the display area and the edge of the second electrode when it has the first radius of curvature.

[0015] The area of ​​the second electrode can be larger than the area of ​​the display area.

[0016] The circuit element layer may include a first power supply voltage electrode and a second power supply voltage electrode, wherein the voltage flowing through the second power supply voltage electrode is lower than the voltage flowing through the first power supply voltage electrode.

[0017] The second power supply voltage electrode may be arranged to overlap with a portion of the edge of the second electrode.

[0018] The second electrode and the second power supply voltage electrode can be electrically connected.

[0019] The first sensing pad and the second sensing pad can be arranged on a plane between the second power supply voltage electrode and the sealing component.

[0020] The second substrate may include a first conductive layer, an insulating layer disposed on the first conductive layer, and a second conductive layer disposed on the insulating layer.

[0021] The first sensing pad may include a plurality of lower electrodes, and the second sensing pad may include a plurality of upper electrodes, wherein the upper electrodes are electrically connected to the lower electrodes.

[0022] It may also include: a spacer that maintains the spacing between the first substrate and the second substrate on the pixel defining film.

[0023] The insulating layer includes a plurality of first protrusions in the region overlapping with the first sensing pad. The length of the upper electrode of the second conductive layer, which is arranged overlapping with the plurality of first protrusions, along the thickness direction is the same as the length of the spacer along the thickness direction.

[0024] It may include: a third sensing pad disposed on the protruding area of ​​the first substrate and connected to the display driving substrate.

[0025] The first sensing pad can be electrically connected to the third sensing pad via sensing wiring.

[0026] The sealing component can be arranged to overlap with a region of the sensing wiring along the thickness direction.

[0027] The details of other embodiments are included in the detailed description and accompanying drawings.

[0028] According to embodiments of the present invention, a display device with an in-cell touch structure that reduces unused space by arranging an upper pad electrode and a lower pad electrode inside a sealing component can be provided.

[0029] The effects of the embodiments are not limited to those illustrated above, and more diverse effects are included in this specification. Attached Figure Description

[0030] Figure 1 This is a schematic perspective view of a display device according to one embodiment.

[0031] Figure 2 yes Figure 1 A schematic cross-sectional view of the display device shown.

[0032] Figure 3 This is a plan view of a first substrate included in a display device according to an embodiment.

[0033] Figure 4A yes Figure 3 An exemplary equivalent circuit diagram of the pixels shown.

[0034] Figure 4B yes Figure 4A A schematic cross-sectional view of the pixels shown.

[0035] Figure 5 This is a pixel circuit diagram illustrating a pixel according to an embodiment of the present invention.

[0036] Figure 6 This is a cross-sectional view of a second substrate SUB2 including a sensing sensor according to an embodiment of the present invention.

[0037] Figure 7 This is a plan view of a sensing sensor according to an embodiment of the present invention.

[0038] Figure 8 It is along Figure 7 The image shows a cross-sectional view of a sensing sensor according to an embodiment of the present invention, taken from section I-I'.

[0039] Figure 9 This is a plan view of a display device according to one embodiment.

[0040] Figure 10 It is along Figure 9 The sectional view taken from section II-II'.

[0041] Figure 11 It is Figure 9 An enlarged plan view of the first substrate in part A.

[0042] Figure 12 It is Figure 9 An enlarged plan view of the second substrate in part A.

[0043] Figures 13 to 15 According to another embodiment, along Figure 9 The sectional view taken from section II-II'.

[0044] Figures 16 to 17 It is Figure 9 An enlarged plan view of the first substrate in part A. Detailed Implementation

[0045] References and Appendix Figure 1 The advantages and features of the invention, as well as the methods for achieving them, will become clear from the detailed embodiments described below. However, the invention can take many different forms and is not limited to the embodiments disclosed below. These embodiments are provided only to complete the disclosure of the invention and to fully inform those skilled in the art of the invention of its scope. The invention is defined only by the scope of the claims.

[0046] The reference to elements or layers being "on" other elements or layers includes situations where they are immediately above or adjacent to other elements, or where other layers or elements are sandwiched in between. Throughout this specification, the same reference numerals refer to the same constituent elements.

[0047] Although terms such as first, second, third, and fourth are used to describe multiple constituent elements, these constituent elements are clearly not limited to these terms. These terms are only used to distinguish one constituent element from another. Therefore, the first constituent element mentioned below, within the technical concept of this invention, can obviously also be any one of the second, third, and fourth constituent elements.

[0048] The embodiments described in this specification are illustrated with reference to plan views and sectional views, which are ideal schematic diagrams of the invention. Therefore, the form of the schematic diagrams may vary depending on manufacturing techniques and / or allowable tolerances. Thus, the embodiments of the invention are not limited to the specific forms illustrated, but also include variations in form resulting from manufacturing processes. Therefore, the areas illustrated in the drawings are schematic in nature, and the shapes of the illustrated areas are intended to illustrate specific forms of the element areas, and are not intended to limit the scope of the invention.

[0049] The sizes and thicknesses of the various components shown in the accompanying drawings are illustrated for ease of explanation, and the present invention is not necessarily limited to the sizes and thicknesses of the illustrated components.

[0050] Hereinafter, embodiments will be described with reference to the accompanying drawings.

[0051] Figure 1This is a schematic perspective view of a display device according to one embodiment. Figure 2 yes Figure 1 A schematic cross-sectional view of the display device shown.

[0052] Reference Figure 1 and Figure 2 The display device 1 includes a display surface IS for displaying images. The display surface IS may be parallel to the surface defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface IS (i.e., the thickness direction of the display device 1) is indicated by the third direction DR3. The front (or upper surface) and back (or lower surface) of each component are distinguished by the third direction DR3. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be changed to other directions as relative concepts.

[0053] Although Figure 1 The illustration shows a display device 1 with a planar display surface IS, but it is not limited thereto. The display device 1 may also include a curved display surface or a three-dimensional display surface (polygonal display surface) having multiple display areas indicating different directions.

[0054] In several embodiments, the display device 1 may be a rigid display device or a flexible display device. Figure 1 A portable terminal is illustrated as an example of a display device 1 used in an embodiment. Portable terminals may include tablet computers, smartphones, personal digital assistants (PDAs), portable multimedia players (PMPs), game consoles, watch-type electronic devices, etc. However, the present invention is not limited to a specific type of display device 1. For example, in another embodiment of the present invention, display device 1 can be applied not only to large electronic devices such as televisions or external billboards, but also to small and medium-sized electronic devices such as personal computers, laptops, car navigation systems, smartwatches, and cameras.

[0055] In several embodiments, the display device 1 may be configured as a rectangle on a plane. The display device 1 may include two long sides extending along a first direction DR1 and two short sides extending along a second direction DR2. The corners where the long and short sides of the display device 1 intersect may be right angles, but are not limited to this; they may form curved surfaces. Alternatively, the corners of the display device 1 may be chamfered to reduce the risk of breakage. Furthermore, the planar shape of the display device 1 is not limited to the examples shown; circles or other different shapes may also be used.

[0056] The display surface IS of the display device 1 includes a display area DM-DA for displaying images and a non-display area DM-NDA adjacent to the display area DM-DA. The non-display area DM-NDA is an area where no images are displayed.

[0057] In some embodiments, the display area DM-DA may be generally quadrilateral in shape. In some embodiments, the corners of the display area DM-DA may be as follows: Figure 1 The surface is formed as shown, but it is not limited to this. The following explanation will take the case where the corners of the display area DM-DA form a surface as an example.

[0058] The non-display area DM-NDA can surround the display area DM-DA. However, it is not limited to this; the shape of the display area DM-DA and the non-display area DM-NDA can be designed relative to each other.

[0059] Unless otherwise defined, in this specification, "upper," "upper side," "upper part," "top," and "above" refer to the side pointed to by the arrow pointing to the third direction DR3, which intersects the first direction DR1 and the second direction DR2 with reference to the attached drawing. "Lower," "lower side," "lower part," "bottom," and "below" refer to the side in the opposite direction to the direction pointed to by the arrow pointing to the third direction DR3 with reference to the attached drawing.

[0060] Figure 2 This is a cross-sectional view of a display device 1 according to an embodiment of the present invention. Figure 2 The diagram illustrates the cross section defined by the second direction DR2 and the third direction DR3.

[0061] like Figure 2 As shown, the display device 1 includes a first substrate SUB1 of a display panel DP and a second substrate SUB2 of a sensor TS. The display panel DP and the sensor TS are arranged facing each other and are attached to each other by a sealing member SEAL. The display panel DP generates an image, and the sensor TS acquires coordinate information of external input (e.g., a touch event). For example, the sensor TS may include at least one of a touch sensor, a proximity sensor, a motion sensor, and a fingerprint sensor. In addition, the display device 1 disclosed in this specification can be flexibly used by combining information sensed by at least two of these sensors.

[0062] Although not shown separately, the display device 1 may also include a protective component disposed on the lower side of the display panel DP, an anti-reflective component disposed on the upper side of the sensor TS, and / or a window component.

[0063] In several embodiments, the display panel DP may be a display panel including a self-emissive element. In exemplary embodiments, the self-emissive element may include at least one of an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QD), an inorganic-based micro LED (e.g., Micro LED), and an inorganic-based nano LED (e.g., Nano LED). Hereinafter, for ease of explanation, the case where the self-emissive element is an organic light-emitting element will be described as an example.

[0064] The display panel DP may include a first substrate SUB1, a circuit element layer DP-CL, a display element layer DP-OLED, a first layer FE, a sensing element layer TC, and a second substrate SUB2, which are sequentially arranged on the first substrate SUB1. Although not shown separately, the display panel DP may also include functional layers such as an anti-reflective layer and a refractive index adjustment layer.

[0065] In several embodiments, the first substrate SUB1 may be made of insulating materials such as glass, quartz, or polymer resin. The polymer material may be, for example, polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or combinations thereof. The first substrate SUB1 may also include a metallic material.

[0066] The first substrate SUB1 can be a rigid substrate or a flexible substrate that can be bent, folded, rolled, etc. The material constituting the flexible substrate can be, for example, polyimide (PI), but is not limited to this.

[0067] Reference Figure 1The display area DM-DA and the non-display area DM-NDA can be defined similarly on the first substrate SUB1.

[0068] The circuit element layer DP-CL includes at least one intermediate insulating layer and circuit elements. The intermediate insulating layer includes at least one intermediate inorganic film and at least one intermediate organic film. The circuit elements include signal lines, pixel driving circuits, etc. The circuit element layer DP-CL can be formed by using insulating layer formation processes such as coating and deposition, and patterning processes of conductor layers and / or semiconductor layers using photolithography.

[0069] The DP-OLED display element layer includes self-emissive elements. For example, the self-emissive element may be an organic light-emitting element. The DP-OLED display element layer may also include organic films such as pixel definition films.

[0070] The first FE layer seals the DP-OLED display element layer. The first FE layer may include a capping layer. The first FE layer includes at least one inorganic film (hereinafter referred to as the encapsulating inorganic film). The first FE layer may also include at least one organic film (hereinafter referred to as the encapsulating organic film). The encapsulating inorganic film protects the DP-OLED display element layer from moisture / oxygen, while the encapsulating organic film protects the DP-OLED display element layer from foreign matter such as dust particles. The encapsulating inorganic film may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, etc. The encapsulating organic film may include, but is not limited to, acrylic-based organic layers.

[0071] In several embodiments, the first FE layer can be replaced by a packaging substrate or the like. The packaging substrate seals the display element layer of the DP-OLED with a sealant.

[0072] The sensor TS may include a second substrate SUB2 and a sensing element layer TC located on the second substrate SUB2.

[0073] The sensor TS senses at least one of the following: information within the display device, information about the surrounding environment of the display device, and user information, and generates a corresponding sensing signal. The control unit can control the driving or operation of the display device based on such sensing signals, or perform data processing, functions, or operations related to an application program set on the display device. A more detailed description will be given of representative sensors among the various sensors that can be included in the sensing unit.

[0074] First, a proximity sensor is a sensor that uses electromagnetic force or infrared light to detect objects approaching a predetermined detection surface or the presence of objects nearby without mechanical contact. Such proximity sensors can be placed inside or near the display device enclosed by the touchscreen described above.

[0075] Proximity sensors include, for example, transmissive photoelectric sensors, direct reflection photoelectric sensors, mirror reflection photoelectric sensors, high-frequency oscillation proximity sensors, capacitive proximity sensors, magnetic proximity sensors, and infrared proximity sensors. In the case of an electrostatic touchscreen, the proximity sensor can be configured to detect the approach of a conductive object by detecting changes in the electric field generated when the object approaches. In this case, the touchscreen (or touch sensor) itself can be classified as a proximity sensor.

[0076] Furthermore, for ease of explanation, the act of detecting an object approaching without touching the touchscreen, and thus placing the object on the touchscreen, is termed "proximity touch," while the act of an object actually touching the touchscreen is termed "contact touch." The position of the object approaching the touchscreen represents the vertical position of the object relative to the touchscreen when it approaches the touchscreen. The proximity sensor can sense proximity touches and proximity touch patterns (e.g., proximity touch distance, proximity touch direction, proximity touch speed, proximity touch time, proximity touch position, proximity touch movement state, etc.). Additionally, as described above, the control unit can process the data (or information) corresponding to the proximity touch operation and proximity touch pattern sensed by the proximity sensor, and then output the visual information corresponding to the processed data to the touchscreen. Furthermore, the control unit can control the display device to process different operations or data (or information) depending on whether the touch on the same point on the touchscreen is a proximity touch or a contact touch.

[0077] Touch sensors use at least one of various touch methods, such as resistive film, capacitive, infrared, ultrasonic, and magnetic field, to sense touch (or touch input) applied to a touch screen (or display).

[0078] As an example, a touch sensor can be configured to convert changes in pressure applied to a specific area of ​​the touchscreen or changes in capacitance generated at that specific area into an electrical input signal. The touch sensor can be configured to detect the position, area, pressure, and capacitance of a touch object applied to the touchscreen. Here, the touch object refers to the object that applies the touch to the touch sensor, such as a finger, a stylus pen, or an indicator.

[0079] As described above, when there is touch input to the touch sensor, the corresponding signal(s) are sent to the touch controller. The touch controller processes the signal(s) and then sends the corresponding data to the control unit. Based on this, the control unit can determine whether a certain area of ​​the display unit has been touched. Here, the touch controller can be a component separate from the control unit, or it can be the control unit itself.

[0080] Furthermore, the control unit can perform different controls or the same controls depending on the type of touch object being touched (or touch keys other than a touch screen). Whether to perform different controls or the same controls depending on the type of touch object can be determined based on the current operating state of the display device or the application being run.

[0081] In addition, the touch sensors and proximity sensors mentioned above can be used independently or in combination to achieve various touch modes, such as short touch, long touch, multi-touch, drag touch, flick touch, pinch-intouch, pinch-out touch, swype touch, and hovering touch.

[0082] For ease of explanation, the following example illustrates the case where the sensor TS is configured with mutual capacitance, but it is not limited to this.

[0083] Figure 3 This is a plan view of a first substrate included in a display device according to one embodiment. Figure 4A yes Figure 3 An exemplary equivalent circuit diagram of the pixels shown. Figure 4B yes Figure 4A A schematic cross-sectional view of the pixels shown.

[0084] Reference Figure 3 , Figure 4A and Figure 4B The first substrate SUB1 includes, on a plane, a main region MR having a display area DA, a non-display area NDA, a curved region BD connected to one side of the main region MR, and a sub-region SR overlapping the main region MR along a third direction DR3.

[0085] In this embodiment, the non-display area NDA can be defined along the edge of the display area DA. The display area DA and the non-display area NDA of the display panel DP can respectively correspond to Figure 1The display device 1 shown has a display area DM-DA and a non-display area DM-NDA. The display area DA and non-display area NDA of the display panel DP do not necessarily need to be the same as the display area DM-DA and non-display area DM-NDA of the display device 1; they can be changed according to the structure / design of the display panel DP. In some embodiments, the corners of the display area DA of the display panel DP can be configured as curved surfaces.

[0086] The curved region BD is connected to the main region MR. For example, the curved region BD can be connected via a short side of the main region MR. The width of the curved region BD can be smaller than the width of the main region MR (the width of the short side). The connection between the main region MR and the curved region BD can have an L-shaped cut.

[0087] In the bending region BD, the first substrate SUB1 can be bent with curvature in the downward direction along the thickness direction (in other words, the opposite direction of the display surface). Although the bending region BD can have a constant radius of curvature, it is not limited to this and can have different radii of curvature in intervals. As the first substrate SUB1 bends in the bending region BD, the surface of the first substrate SUB1 is reversed. That is, the side of the first substrate SUB1 facing upwards can be turned outwards through the bending region BD, and then change to face downwards.

[0088] Sub-region SR extends from the curved region BD. Sub-region SR can extend in a direction parallel to the main region MR after the curvature ends. Sub-region SR can overlap with the main region MR along the thickness direction of the first substrate SUB1. Sub-region SR overlaps with the non-display region NDA at the edge of the main region MR, and can overlap up to the display region DA of the main region MR.

[0089] The width of the sub-region SR can be the same as the width of the curved region BD, but it is not limited to this.

[0090] The display panel DP may include a driving circuit GDC, multiple signal lines SGL, and multiple pixels PX. The multiple pixels PX are arranged in the display area DA. Each pixel PX may include a self-emissive element (e.g., an organic light-emitting element) and a pixel driving circuit connected to the self-emissive element. The driving circuit GDC, multiple signal lines SGL, and pixel driving circuit may be included in... Figure 2 The circuit element layer DP-CL is shown.

[0091] The driving circuit GDC may include a scan driving circuit. The driving circuit GDC generates multiple scan signals and outputs these signals sequentially to the multiple scan lines GL described later. The driving circuit GDC may also output another control signal to the driving circuit of pixel PX.

[0092] The driving circuit GDC may include multiple thin-film transistors formed using the same process as the driving circuit of the pixel PX (e.g., Low Temperature Polycrystaline Silicon (LTPS) process or Low Temperature Polycrystalline Oxide (LTPO) process).

[0093] The multiple signal lines SGL can include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. Scan lines GL are connected to corresponding pixels PX, and data lines DL are connected to corresponding pixels PX. Power lines PL are connected to multiple pixels PX. Control signal lines CSL provide control signals to the drive circuit GDC.

[0094] The display panel (DP) includes signal pads DP-PD and PW-PD connected to the ends of signal lines SGL. Signal pads DP-PD and PW-PD can be circuit elements. The area in the non-display area (NDA) where signal pads DP-PD and PW-PD are arranged can be defined as the pad area.

[0095] The pad region in the non-display area NDA may also be provided with a lower sensing pad TS-PD1 that is electrically connected to the signal line of the sensor TS described later. In some embodiments, the lower sensing pad TS-PD1 may be formed by the same process as the signal line SGL and may be disposed on the same layer as the signal line SGL.

[0096] In some embodiments, the lower sensing pad TS-PD1 may be electrically insulated from the signal lines SGL of the display panel.

[0097] Additionally, a display driver substrate (FPCB) can be connected to the pad area. The display driver substrate (FPCB) can be a flexible printed circuit board or a film.

[0098] A chip mounting area can be defined on the display driver substrate FPCB, and driver chip ICs such as timing circuits in chip form can also be mounted in the chip mounting area.

[0099] Figure 4A The diagram illustrates an arbitrary scan line GL, an arbitrary data line DL, a power line PL, and the pixels PX connected to them. The composition of the pixels PX is not limited to... Figure 4A It can be implemented by modification.

[0100] An organic light-emitting diode (OLED) can be a front-emitting diode or a back-emitting diode. The pixel driving circuit within a pixel PX, used to drive the OLED, includes a first transistor T1 (or a switching transistor), a second transistor T2 (or a driving transistor), and a capacitor Cst. A first power supply voltage ELVDD is supplied to the second transistor T2, and a second power supply voltage ELVSS is supplied to the OLED. The second power supply voltage ELVSS can be a voltage lower than the first power supply voltage ELVDD.

[0101] The first transistor T1 outputs a data signal applied to the data line DL in response to a scan signal applied to the scan line GL. The capacitor Cst is charged with a voltage corresponding to the data signal received from the first transistor T1. The second transistor T2 is connected to the organic light-emitting element (OLED). The second transistor T2 controls the driving current flowing in the OLED according to the amount of charge stored in the capacitor Cst.

[0102] Figure 4B The diagram illustrates the relationship with Figure 4A The equivalent circuit shown is a partial cross-section of the display panel DP.

[0103] A circuit element layer DP-CL, a display element layer DP-OLED, and a first layer FE are sequentially arranged on the base layer SUB. In this embodiment, the circuit element layer DP-CL may include a buffer film BFL as an inorganic film, a first intermediate inorganic film 10, and a second intermediate inorganic film 20, and also includes an intermediate organic film 30 as an organic film. The materials of the inorganic and organic films are not particularly limited. In one embodiment of the present invention, the buffer film BFL may be selectively arranged or omitted.

[0104] A semiconductor pattern (hereinafter referred to as the first semiconductor pattern) OSP1 of a first transistor T1 and a semiconductor pattern (hereinafter referred to as the second semiconductor pattern) OSP2 of a second transistor T2 are arranged on the buffer film BFL. The first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 can be selected from amorphous silicon, polycrystalline silicon, and metal oxide semiconductor.

[0105] A first intermediate inorganic film 10 is disposed on the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2. A control electrode GE1 (hereinafter referred to as the first control electrode) of the first transistor T1 and a control electrode GE2 (hereinafter referred to as the second control electrode) of the second transistor T2 are disposed on the first intermediate inorganic film 10. The first control electrode GE1 and the second control electrode GE2 can be coupled to the scan line GL (refer to...). Figure 3 It is manufactured using the same photolithography process.

[0106] A second intermediate inorganic film 20 is disposed on the first intermediate inorganic film 10, covering the first control electrode GE1 and the second control electrode GE2. The input electrode (hereinafter referred to as the first input electrode) SE1 and the output electrode (hereinafter referred to as the first output electrode) DE1 of the first transistor T1, and the input electrode (hereinafter referred to as the second input electrode) SE2 and the output electrode (hereinafter referred to as the second output electrode) DE2 of the second transistor T2 are disposed on the second intermediate inorganic film 20.

[0107] The first input electrode SE1 and the first output electrode DE1 are respectively connected to the first semiconductor pattern OSP1 through a first through-hole CH1 and a second through-hole CH2 penetrating the first intermediate inorganic film 10 and the second intermediate inorganic film 20. The second input electrode SE2 and the second output electrode DE2 are respectively connected to the second semiconductor pattern OSP2 through a third through-hole CH3 and a fourth through-hole CH4 penetrating the first intermediate inorganic film 10 and the second intermediate inorganic film 20. In another embodiment of the invention, a portion of the first transistor T1 and the second transistor T2 can be configured as a bottom-gate structure.

[0108] An intermediate organic film 30 is disposed on the second intermediate inorganic film 20, covering the first input electrode SE1, the second input electrode SE2, the first output electrode DE1, and the second output electrode DE2. The intermediate organic film 30 can be provided with a flat surface.

[0109] A display element layer DP-OLED is disposed on the intermediate organic film 30. The display element layer DP-OLED may include a pixel definition film PDL and an organic light-emitting element OLED. The pixel definition film PDL may include organic material. A first electrode AE ​​is disposed on the intermediate organic film 30. The first electrode AE ​​is connected to the second input electrode SE2 through a fifth through hole CH5 penetrating the intermediate organic film 30. An opening OP is defined in the pixel definition film PDL. The opening OP of the pixel definition film PDL exposes at least a portion of the first electrode AE. In one embodiment of the present invention, the pixel definition film PDL may also be omitted.

[0110] Pixels PX can be arranged in the display area DA of the display panel DP. The display area DA of the display panel DP may include a light-emitting area PXA and a non-light-emitting area NPXA adjacent to the light-emitting area PXA. The non-light-emitting area NPXA may surround the light-emitting area PXA. In this embodiment, the light-emitting area PXA is defined corresponding to a portion of the area of ​​the first electrode AE ​​exposed through the opening OP.

[0111] In one embodiment of the present invention, the light-emitting region PXA may overlap at least one of the first transistor T1 and the second transistor T2. The opening OP may be wider, and the first electrode AE ​​and the light-emitting layer EML described below may also be wider.

[0112] Hole control layers (HCLs) can be co-located in the emitting region PXA and the non-emitting region NPXA. Although not illustrated separately, common layers such as the hole control layer (HCL) can be co-formed in the pixel PX (see reference). Figure 3 ).

[0113] An emissive layer (EML) is disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the opening (OP). That is, the EML can be separately formed on each pixel (PX). The EML can include organic and / or inorganic materials. The EML can generate predetermined colored light.

[0114] This embodiment exemplarily illustrates a patterned emissive layer EML, but the emissive layers EML can be arranged together on pixel PX. In this case, the emissive layers EML can also generate white light. Furthermore, the emissive layers EML can have a multi-layer structure called tandem.

[0115] An electronic control layer (ECL) is disposed on the emissive layer (EML). Although not shown separately, the ECL can be collectively formed on the pixel PX (see reference). Figure 3 A second electrode CE is arranged on the electronic control layer ECL. The second electrode CE is arranged together on the pixel PX.

[0116] A first layer of FE is disposed on the second electrode CE. The first layer of FE is disposed together on the pixel PX. In this embodiment, the first layer of FE directly covers the second electrode CE.

[0117] In several embodiments, the first layer FE may include a first encapsulated inorganic film IOL1, an encapsulated organic film OL, and a second encapsulated inorganic film IOL2, which are sequentially stacked on the second electrode CE.

[0118] In several embodiments, the first encapsulated inorganic film IOL1 and the second encapsulated inorganic film IOL2 can be made of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon nitride (SiON), lithium fluoride, etc.

[0119] In several embodiments, the encapsulating organic film OL can be composed of acrylic resins, methacrylic resins, polyisoprene, ethylene resins, epoxy resins, urethane resins, cellulose resins, and dinaphthalene-containing resins.

[0120] However, the structure of the first layer FE is not limited to the example above. In addition, the stacked structure of the first layer FE can be modified in various ways.

[0121] In one embodiment of the present invention, the organic light-emitting element (OLED) may further include a resonant structure for controlling the resonant distance of the light generated in the emissive layer (EML). The resonant structure may be disposed between the first electrode AE ​​and the second electrode CE, and the thickness of the resonant structure is determined according to the wavelength of the light generated in the emissive layer (EML).

[0122] exist Figure 4A and Figure 4B The example described above illustrates a pixel PX comprising two thin-film transistors and a storage capacitor; however, the present invention is not limited thereto. Figure 5 As shown, a pixel PX may include seven thin-film transistors and a storage capacitor.

[0123] Reference Figure 5 A pixel PX may include multiple thin-film transistors and storage capacitors. The thin-film transistors and storage capacitors may be connected to signal lines SL, SL-1, EL, DL, initialization voltage line VL, and drive voltage line PL′.

[0124] Figure 5 The illustration shows the connection of each pixel PX to signal lines SL, SL-1, EL, DL, initialization voltage line VL, and drive voltage line PL′; however, the invention is not limited thereto. As another embodiment, any one of the signal lines SL, SL-1, EL, DL, the initialization voltage line VL, and the drive voltage line PL′ can be shared by adjacent pixels.

[0125] The multiple thin-film transistors may include a driving thin-film transistor (TFT) T1′, a switching thin-film transistor (TFT) T2′, a compensation thin-film transistor T3, a first initialization thin-film transistor T4, an operation control thin-film transistor T5, a light emission control thin-film transistor T6, and a second initialization thin-film transistor T7.

[0126] The signal lines include a scan line SL that transmits the scan signal Sn, a pre-scan line SL-1 that transmits the pre-scan signal Sn-1 to the first initialization thin-film transistor T4 and the second initialization thin-film transistor T7, an emission control line EL that transmits the emission control signal En to the operation control thin-film transistor T5 and the emission control thin-film transistor T6, and a data line DL that intersects with the scan line SL and transmits the data signal Dm. The driving voltage line PL′ transmits the driving voltage ELVDD′ to the driving thin-film transistor T1′, and the initialization voltage line VL transmits the initialization voltage Vint that initializes the driving thin-film transistor T1′ and the pixel electrode.

[0127] The driving gate electrode G1 of the driving thin-film transistor T1' is connected to the first storage plate Cst1 of the storage capacitor Cst. The driving source electrode S1 of the driving thin-film transistor T1' is connected to the driving voltage line PL' via the operation control thin-film transistor T5. The driving drain electrode D1 of the driving thin-film transistor T1' is electrically connected to the pixel electrode of the organic light-emitting element OLED via the light-emitting control thin-film transistor T6. The driving thin-film transistor T1' receives the data signal Dm according to the switching operation of the switching thin-film transistor T2' and supplies the driving current I to the organic light-emitting element OLED. OLED .

[0128] The switching gate electrode G2 of the switching thin-film transistor T2′ is connected to the scan line SL, the switching source electrode S2 of the switching thin-film transistor T2′ is connected to the data line DL, and the switching drain electrode D2 of the switching thin-film transistor T2′ is connected to the driving source electrode S1 of the driving thin-film transistor T1′, and is connected to the driving voltage line PL′ via the operation control thin-film transistor T5. The switching thin-film transistor T2′ is turned on according to the scan signal Sn received through the scan line SL, thereby performing a switching operation to transmit the data signal Dm transmitted to the data line DL to the driving source electrode S1 of the driving thin-film transistor T1′.

[0129] The compensation gate electrode G3 of the compensation thin-film transistor T3 is connected to the scan line SL, and the compensation source electrode S3 of the compensation thin-film transistor T3 is connected to the driving drain electrode D1 of the driving thin-film transistor T1′. It is also connected to the pixel electrode of the organic light-emitting element (OLED) via the light-emitting control thin-film transistor T6. The compensation drain electrode D3 of the compensation thin-film transistor T3 is connected to the first storage plate Cst1 of the storage capacitor Cst, the first initialization drain electrode D4 of the first initialization thin-film transistor T4, and the driving gate electrode G1 of the driving thin-film transistor T1′. The compensation thin-film transistor T3 is turned on according to the scan signal Sn received through the scan line SL, thereby electrically connecting the driving gate electrode G1 and the driving drain electrode D1 of the driving thin-film transistor T1′, thus connecting the diode of the driving thin-film transistor T1′.

[0130] The first initialization gate electrode G4 of the first initialization thin-film transistor T4 is connected to the front scan line SL-1. The first initialization source electrode S4 of the first initialization thin-film transistor T4 is connected to the second initialization drain electrode D7 and the initialization voltage line VL of the second initialization thin-film transistor T7. The first initialization drain electrode D4 of the first initialization thin-film transistor T4 is connected to the first storage plate Cst1 of the storage capacitor Cst, the compensation drain electrode D3 of the compensation thin-film transistor T3, and the driving gate electrode G1 of the driving thin-film transistor T1'. The first initialization thin-film transistor T4 is turned on according to the front scan signal Sn-1 received through the front scan line SL-1, and then performs an initialization operation to initialize the voltage of the driving gate electrode G1 of the driving thin-film transistor T1' by transferring the initialization voltage Vint to the driving gate electrode G1 of the driving thin-film transistor T1'.

[0131] The operation control gate electrode G5 of the operation control thin film transistor T5 is connected to the light emission control line EL, the operation control source electrode S5 of the operation control thin film transistor T5 is connected to the driving voltage line PL′, and the operation control drain electrode D5 of the operation control thin film transistor T5 is connected to the driving source electrode S1 of the driving thin film transistor T1′ and the switching drain electrode D2 of the switching thin film transistor T2′.

[0132] The light-emitting control gate electrode G6 of the light-emitting control thin-film transistor T6 is connected to the light-emitting control line EL. The light-emitting control source electrode S6 of the light-emitting control thin-film transistor T6 is connected to the driving drain electrode D1 of the driving thin-film transistor T1′ and the compensation source electrode S3 of the compensation thin-film transistor T3. The light-emitting control drain electrode D6 of the light-emitting control thin-film transistor T6 is electrically connected to the second initialization source electrode S7 of the second initialization thin-film transistor T7 and the pixel electrode of the organic light-emitting element OLED.

[0133] The operation control thin-film transistor T5 and the light emission control thin-film transistor T6 are simultaneously turned on according to the light emission control signal En received through the light emission control line EL, thereby driving the voltage ELVDD′ to the organic light-emitting element OLED, and thus driving the current I. OLED Flowing in organic light-emitting elements (OLEDs).

[0134] The second initialization gate electrode G7 of the second initialization thin-film transistor T7 is connected to the front scan line SL-1. The second initialization source electrode S7 of the second initialization thin-film transistor T7 is connected to the light-emitting control drain electrode D6 of the light-emitting control thin-film transistor T6 and the pixel electrode of the organic light-emitting element OLED. The second initialization drain electrode D7 of the second initialization thin-film transistor T7 is connected to the first initialization source electrode S4 of the first initialization thin-film transistor T4 and the initialization voltage line VL. The second initialization thin-film transistor T7 is turned on according to the front scan signal Sn-1 received through the front scan line SL-1, thereby initializing the pixel electrode of the organic light-emitting element OLED.

[0135] Figure 5 The illustration shows a first initialization thin-film transistor T4 and a second initialization thin-film transistor T7 connected to the front scan line SL-1, but the invention is not limited thereto. In another embodiment, the first initialization thin-film transistor T4 may be connected to the front scan line SL-1 and driven according to the front scan signal Sn-1, and the second initialization thin-film transistor T7 may be connected to a separate signal line (e.g., a back scan line) and driven according to the signal transmitted to said signal line.

[0136] The second storage plate Cst2 of the storage capacitor Cst is connected to the driving voltage line PL′, and the opposing electrode of the organic light-emitting element (OLED) is connected to the common voltage ELVSS′. Accordingly, the OLED receives a driving current I from the driving thin-film transistor T1′. OLED It emits light, thus enabling the display of images.

[0137] Figure 5 The illustration shows the case where the compensation thin-film transistor T3 and the first initialization thin-film transistor T4 have dual gate electrodes, but the compensation thin-film transistor T3 and the first initialization thin-film transistor T4 may have a single gate electrode.

[0138] Figure 6 This is a cross-sectional view of a second substrate SUB2 including a sensor according to an embodiment of the present invention. Figure 7 This is a plan view of a sensor according to an embodiment of the present invention. Figure 8 It is along Figure 7 A cross-sectional view of a sensor according to an embodiment of the present invention, taken from line I-I'. (Refer to...) Figure 6The sensing element layer TC includes a first conductive layer TS-CL1, an insulating layer (hereinafter referred to as the sensing insulating layer) TS-IL, and a second conductive layer TS-CL2. The first conductive layer TS-CL1 can be directly disposed on the second substrate SUB2. However, it is not limited to this; a buffer layer can be disposed between the first conductive layer TS-CL1 and the second substrate SUB2, and the first conductive layer TS-CL1 can be disposed on the buffer layer on the second substrate SUB2. The buffer layer can include an inorganic layer or an organic layer.

[0139] The first conductive layer TS-CL1 and the second conductive layer TS-CL2 can each have a single-layer structure or a multilayer structure stacked along the third direction DR3. The multilayer conductive layers can include at least two of the following: a transparent conductive layer and a metal layer. The multilayer conductive layers can include metal layers containing different metals. The transparent conductive layer can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), poly(ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene, etc. The metal layer can include molybdenum, silver, titanium, copper, aluminum, and their alloys.

[0140] The first conductive layer TS-CL1 and the second conductive layer TS-CL2 each include multiple patterns. The following description addresses the case where the first conductive layer TS-CL1 includes a first conductive pattern, and the second conductive layer TS-CL2 includes a second conductive pattern. The first conductive pattern and the second conductive pattern may each include a sensing electrode and a sensing signal line.

[0141] The sensing insulating layer TS-IL may comprise inorganic or organic materials. Inorganic materials may comprise at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, zirconium oxide, and hafnium oxide. Organic materials may comprise at least one of acrylic resins, methacrylic resins, polyisoprene, ethylene resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and dinaphthalene-containing resins.

[0142] The sensing insulating layer TS-IL can have a single-layer or multi-layer structure. The sensing insulating layer TS-IL can have at least one of inorganic and organic layers. The inorganic and organic layers can be formed by chemical vapor deposition.

[0143] The sensing insulating layer TS-IL only needs to insulate the first conductive layer TS-CL1 and the second conductive layer TS-CL2, and its shape is not limited. The shape of the sensing insulating layer TS-IL can be varied according to the shapes of the first conductive pattern and the second conductive pattern. The sensing insulating layer TS-IL can completely cover the second substrate SUB2, or it can include multiple insulating patterns. Multiple insulating patterns only need to overlap with the first connection portion CP1 or the second connection portion CP2 described later.

[0144] This embodiment exemplarily illustrates a two-layer sensing element layer, but is not limited thereto. A single-layer sensing element layer includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes a sensor and a sensing signal line connected to the sensor. The single-layer sensing element layer can acquire coordinate information through self-capacitance.

[0145] Reference Figure 7 The sensing element layer TC includes a first sensing electrode TE1, a first sensing signal line TSL1 connected to the first sensing electrode TE1, a second sensing electrode TE2, a second sensing signal line TSL2 connected to the second sensing electrode TE2, and an upper sensing pad TS-PD2 connected to the first sensing signal line TSL1 and the second sensing signal line TSL2. The first sensing electrode TE1, the second sensing electrode TE2, the first sensing signal line TSL1, and the second sensing signal line TSL2 are arranged on a plane in the sensing area SA, and the upper sensing pad TS-PD2 is arranged in the surrounding area NSA.

[0146] The sensing area SA can be the area in the sensor TS that senses touch input, while the surrounding area NSA is the area in the sensor TS that cannot sense touch input. In some embodiments, the surrounding area NSA can be defined along the edge of the sensing area SA. The sensing area SA and the surrounding area NSA can respectively correspond to Figure 1 The display device 1 shown has a display area DM-DA and a non-display area DM-NDA. Alternatively, the sensing area SA and the surrounding area NSA can respectively correspond to... Figure 3 The diagram shows the display area DA and non-display area NDA of the display panel DP. In some embodiments, the sensing area SA may be substantially the same as the display area DA of the display panel DP.

[0147] Each first sensing electrode TE1 may have a grid shape defining multiple sensing openings. The first sensing electrodes TE1 extend along a first direction DR1 and are arranged along a second direction DR2. Each first sensing electrode TE1 may include multiple first sensing sensor portions SP1 and multiple first connecting portions CP1. The first sensing sensor portions SP1 are arranged along the first direction DR1.

[0148] The first sensing sensor unit SP1 can be connected to an adjacent first sensing sensor unit SP1 in the first direction DR1 via the first connecting part CP1. According to one embodiment, the first sensing sensor unit SP1 can be connected to an adjacent first sensing sensor unit SP1 via the first connecting part CP1.

[0149] Although not specifically illustrated, the first sensing signal line TSL1 can also have a grid shape.

[0150] The second sensing electrode TE2 is insulated from and intersects with the first sensing electrode TE1. Each second sensing electrode TE2 may have a grid shape defining multiple sensing openings. The second sensing electrodes TE2 extend along the second direction DR2 and are arranged along the first direction DR1. Each second sensing electrode TE2 may include multiple second sensing sensor sections SP2 and multiple second connecting sections CP2. The second sensing sensor sections SP2 are arranged along the second direction DR2.

[0151] The second sensing sensor unit SP2 can be connected to the second sensing sensor unit SP2 adjacent in the second direction DR2 via the second connecting part CP2.

[0152] Although not illustrated, the second sensing signal line TSL2 can also have a grid shape.

[0153] The first sensing electrode TE1 and the second sensing electrode TE2 are arranged alternately without overlapping each other. The first sensing electrode TE1 and the second sensing electrode TE2 are electrostatically coupled. When a sensing signal is applied to the first sensing electrode TE1, a capacitor is formed between the first sensing sensor section SP1 and the second sensing sensor section SP2.

[0154] The first sensing sensor unit SP1, the second sensing sensor unit SP2, the first connecting part CP1, the second connecting part CP2, the first sensing signal line TSL1, and the first connecting part CP1 of the second sensing signal line TSL2 can be connected via... Figure 6 The first conductive layer TS-CL1 shown is formed by patterning, and the rest are formed by... Figure 6 The second conductive layer TS-CL2 shown is formed by patterning. To electrically connect the conductive patterns arranged on other layers, it is possible to form... Figure 8 The contact hole CNT of the through-sensing insulating layer TS-IL is shown.

[0155] Figure 9 This is a plan view of a display device according to one embodiment. Figure 10 It is along Figure 9 The sectional view taken from section II-II'. Figure 11 It is Figure 9 An enlarged plan view of the first substrate in part A. Figure 12 It is Figure 9 An enlarged plan view of the second substrate in part A.

[0156] Reference Figure 4B , Figures 9 to 12 The first substrate SUB1 and the second substrate SUB2 of the display device 1 can be arranged facing each other. According to one embodiment, the upper short side SS11, the left long side LS11 and the right long side LS21 of the first substrate SUB1 can be aligned with the upper short side SS12, the left long side LS12 and the right long side LS22 of the second substrate SUB2, respectively, while the lower short side SS21 of the first substrate SUB1 and the lower short side SS22 of the second substrate SUB2 can be misaligned.

[0157] For example, the lower short side SS21 of the first substrate SUB1 may be formed to protrude more than the lower short side SS22 of the second substrate SUB2, but it is not necessarily limited to this. The purpose is to attach a display driver substrate FPCB, including a driver chip IC, to the protruding portion. Multiple signal pads DP-PD, PW-PD, and a third sensing pad TS-PD3 can be electrically connected to the display driver substrate FPCB. The driver chip IC can be bonded to the display driver substrate FPCB and connected thereto, and is then controlled by a controller provided on the display driver substrate FPCB. The driver chip IC can transmit signals for the driving circuit element layer DP-CL, the sensing element layer TC, or the display element layer DP-OLED.

[0158] The sealing component SEAL can be arranged along the edges of the first substrate SUB1 and the second substrate SUB2 on the non-display area DM-NDA of the display device 1. The sealing component SEAL can be bonded to the first substrate SUB1 of the display panel DP and the second substrate SUB2 of the sensor TS. The sealing component SEAL can be a frit adhesive layer, a UV-curable resin, or a thermosetting resin, but is not limited to these.

[0159] The first substrate SUB1 is arranged to be separated from the second substrate SUB2 by a spacer SPC formed on the pixel definition film PDL of the first substrate SUB1, with a thickness equivalent to the third-direction DR3 of the spacer SPC. Although the example illustrates a case where there is a free space between the first substrate SUB1 and the second substrate SUB2, the embodiments of the present invention are not limited thereto. For example, a filler film can be arranged between the first substrate SUB1 and the second substrate SUB2. The filler film can be an epoxy filler film or a silicon filler film.

[0160] The second electrode CE can be arranged along the edge of the display area DM-DA on the entire display area DM-DA and a portion of the non-display area DM-NDA of the display device 1. That is, the second electrode CE can be arranged to completely cover the display area DM-DA of the display device 1.

[0161] The second electrode CE can be integrally formed on the pixel definition film PDL, spacer SPC, light-emitting layer EML and the first sensing pad (i.e., the lower sensing pad mentioned above) TS-PD1 disposed on the first substrate SUB1.

[0162] The second power electrode VSS can be arranged along the edge of the main region MR, the curved region BD, and the sub-region SR of the first substrate SUB1, from the signal pad PW-PD arranged on one side of the sub-region SR to the signal pad PW-PD arranged on the other side of the sub-region SR. The second power electrode VSS can be formed simultaneously using the same material as the first input electrode SE1, the second input electrode SE2, the first output electrode DE1, and the second output electrode DE2.

[0163] At this time, the second power electrode VSS and the second electrode CE can be arranged to overlap along the third direction DR3 in a portion of the region. The second electrode CE can be electrically and / or physically connected to the second power electrode VSS arranged on the second intermediate inorganic film 20 through the sixth through-hole CH6 formed in the intermediate organic film 30 and the pixel definition film PDL. Therefore, the second electrode CE can receive the second power supply voltage ELVSS from the second power electrode VSS.

[0164] According to one embodiment, the second electrode CE may have a first radius of curvature R1 in the region near the corner where the upper short side SS12 of the second substrate SUB2 meets the left long side LS12, and in the region near the corner where the upper short side SS12 of the second substrate SUB2 meets the right long side LS22. In this case, the first radius of curvature R1 may be substantially the same as the radius of curvature of the corner regions of the first substrate SUB1 and the second substrate SUB2, and the radius of curvature of the sealing member SEAL.

[0165] Furthermore, the second electrode CE may have a second radius of curvature R2 in the region near the corner where the lower short side SS22 of the second substrate SUB2 meets the left long side LS12, and in the region near the corner where the lower short side SS22 of the second substrate SUB2 meets the right long side LS22. The second radius of curvature R2 of the second electrode CE may be different from the first radius of curvature R1. For example, the second radius of curvature R2 of the second electrode CE may be greater than the first radius of curvature R1.

[0166] The second electrode CE and the sealing component SEAL can be arranged at a predetermined distance apart on the plane. In the area near the corner where the lower short side SS22 of the second substrate SUB2 meets the left long side LS12, and in the area near the corner where the lower short side SS22 of the second substrate SUB2 meets the right long side LS22, when the second electrode CE has a second radius of curvature R2, the second radius of curvature R2 is greater than the radius of curvature of the corner areas of the first substrate SUB1 and the second substrate SUB2. Therefore, the distance between the second electrode CE and the sealing component SEAL on the plane can be greater than the corner area of ​​the second electrode CE having a first radius of curvature R1.

[0167] That is, taking a region of the curve as a reference, the region of the curve approaches a straight line as the radius of curvature of the curve increases. Therefore, the distance between the second electrode CE, which has a second radius of curvature R2 greater than the first radius of curvature R1, and the sealing component SEAL, which has a constant radius of curvature, can be increased.

[0168] A first sensing pad TS-PD1 can be arranged in the increased space between the second electrode CE and the sealing member SEAL. The first sensing pad TS-PD1 and the second sensing pad TS-PD2 (i.e., the aforementioned upper sensing pad) arranged opposite to the first sensing pad TS-PD1 can have a rectangular shape in the plane. For example, the increased space between the second electrode CE and the sealing member SEAL has its maximum width in the diagonal direction between the first direction DR1 and the second direction DR2, therefore the first sensing pad TS-PD1 and the second sensing pad TS-PD2 can have a rectangular shape extending along the diagonal direction. However, the shapes of the first sensing pad TS-PD1 and the second sensing pad TS-PD2 are not limited to this. For example, the first sensing pad TS-PD1 and the second sensing pad TS-PD2 can be formed into a curved shape following the curvature of the second electrode CE and the sealing member SEAL.

[0169] The first sensing pad TS-PD1 can be electrically connected to the third sensing pad TS-PD3 via the third sensing wiring TSL3 and the sensing connection wiring TS_Br. According to one embodiment, the third sensing wiring TSL3 can be formed simultaneously using the same material as the first control electrode GE1 and the second control electrode GE2. The sensing connection wiring TS_Br can be formed simultaneously using the same material as the first input electrode SE1, the second input electrode SE2, the first output electrode DE1, and the second output electrode DE2. The first sensing pad TS-PD1 can be formed simultaneously using the same material as the first electrode AE ​​and the second electrode CE.

[0170] The sealing component SEAL can be arranged to overlap with a region of the third sensing wiring TSL3 along the third direction DR3.

[0171] The first sensing pad TS-PD1 can be electrically and / or physically connected to the sensing connection wiring TS_Br through the seventh through-hole CH7 formed in the intermediate organic film 30. The sensing connection wiring TS_Br can be electrically and / or physically connected to the third sensing wiring TSL3 through the eighth through-hole CH8 formed in the second intermediate inorganic film 20.

[0172] The second sensing pad TS-PD2 can be formed on the second conductive layer TS-CL2, and is formed separately on two outer contours adjacent to the portion protruding from the first substrate SUB1. For the separately formed second sensing pad TS-PD2, one of the two outer contours is divided to form a plurality of upper electrodes UE for applying or detecting the voltage of the first sensing electrode TE1 in the first direction DR1 of the sensing electrode array, and the remaining one is divided to form a plurality of upper electrodes UE for applying or detecting the voltage of the second sensing electrode TE2 in the second direction DR2. Depending on the situation, unlike the illustration, the second sensing pad TS-PD2 may also be located only on the side of the first substrate SUB1 that protrudes from the first substrate.

[0173] The second conductive layer TS-CL2 of the sensing element layer TC can be formed on the sensing insulating layer TS-IL. The sensing insulating layer TS-IL may include multiple protrusions PT1 in the region overlapping with the first sensing pad portion TS-PD1 along the third direction DR3. In this case, the second conductive layer TS-CL2, which overlaps with the multiple protrusions PT1 along the third direction DR3, can be defined as multiple upper electrodes UE. The length of the protrusions PT1 along the third direction DR3 can be substantially the same as the length of the spacer SPC along the third direction DR3. Therefore, the first sensing pad portion TS-PD1 can be electrically connected to the second sensing pad portion TS-PD2.

[0174] The first conductive layer TS-CL1 and the second conductive layer TS-CL2 include a first sensing electrode TE1 and a second sensing electrode TE2 in an intersecting shape, and an upper electrode UE that transmits signals to the first sensing electrode TE1 and the second sensing electrode TE2, respectively. The upper electrode UE may be formed on the second sensing pad portion TS-PD2, and the upper electrode UE is connected to the lower electrode BE formed on the first substrate SUB1.

[0175] A first sensing signal line TSL1 and a second sensing signal line TSL2 are provided on the outside of the display area DM-DA of the display device 1, which are arranged approximately along the first direction DR1 and connect the first sensing electrode TE1 and the second sensing electrode TE2 to the second sensing pad TS-PD2.

[0176] The first conductive layer TS-CL1 can be electrically connected to the second conductive layer TS-CL2 through the ninth through-hole CH9 formed in the sensing insulating layer TS-IL. However, as described above, the first conductive layer TS-CL1 and the second conductive layer TS-CL2 are each patterned as a plurality of first sensing sensor parts SP1 and second sensing sensor parts SP2 arranged separately on a plane. Therefore, it should be noted that the first conductive layer TS-CL1 and the second conductive layer TS-CL2 are not electrically connected as a whole.

[0177] With the first sensing pad TS-PD1 arranged in the increased space between the second electrode CE and the sealing member SEAL, the first sensing pad TS-PD1 and the second sensing pad TS-PD2 that electrically connect the first substrate SUB1 of the display panel DP and the second substrate SUB2 of the sensor TS are not arranged outside the sealing member SEAL. Therefore, the effect of reducing the useless space of the display device 1 can be obtained.

[0178] The following describes other embodiments. In the embodiments described below, descriptions of configurations identical to those described in the previous embodiments are omitted or simplified, and the descriptions focus primarily on the differences.

[0179] Figures 13 to 15 According to another embodiment, along Figure 9 The sectional view taken from section II-II'.

[0180] Reference Figures 13 to 15 It can be seen that the formation methods of the first sensing pad TS-PD1 and the second sensing pad TS-PD2 can be varied in the manufacturing process.

[0181] To explain in more detail, such as Figure 13 As shown, the first sensing pad portion TS-PD11 of the first substrate SUB1 can be formed on the pixel definition film PDL. The pixel definition film PDL may include multiple protrusions PT2 in the region overlapping with the second sensing pad portion TS-PD21 along the third direction DR3. In this case, a metal layer forming any one of the first electrode AE ​​and the second electrode CE arranged overlapping with the multiple protrusions PT2 along the third direction DR3 can be defined as multiple lower electrodes BE. The length of the protrusions PT2 along the third direction DR3 can be substantially the same as the length of the spacer SPC along the third direction DR3. Therefore, the first sensing pad portion TS-PD11 can be electrically connected to the second sensing pad portion TS-PD21.

[0182] Multiple protrusions PT2 formed on the pixel definition film PDL of the first substrate SUB1 can be formed simultaneously when forming the spacer SPC.

[0183] And, as Figure 14As shown, the second conductive layer TS-CL2 of the sensing element layer TC can be formed on the sensing insulating layer TS-IL. The sensing insulating layer TS-IL may include multiple protrusions PTL1 in the region where it overlaps with the first sensing pad portion TS-PD12 along the third direction DR3. In this case, the second conductive layer TS-CL2, which overlaps with the multiple protrusions PTL1 along the third direction DR3, can be defined as multiple upper electrodes UE.

[0184] The first sensing pad portion TS-PD12 of the first substrate SUB1 can be formed on the pixel definition film PDL. The pixel definition film PDL may include multiple protrusions PT2-1 in the region where it overlaps with the second sensing pad portion TS-PD22 along the third direction DR3. At this time, a metal layer forming any one of the first electrode AE ​​and the second electrode CE arranged to overlap with the multiple protrusions PT2-1 along the third direction DR3 can be defined as multiple lower electrodes BE.

[0185] The sum of the lengths of the two protrusions PTL1 and PT2-1 formed on the first and second substrates along the third direction DR3 can be substantially the same as the length of the spacer SPC along the third direction DR3. Therefore, the first sensing pad TS-PD12 can be electrically connected to the second sensing pad TS-PD22.

[0186] And, as Figure 15 As shown, the second conductive layer TS-CL2 of the sensing element layer TC can be formed on the sensing insulating layer TS-IL. The sensing insulating layer TS-IL may include multiple protrusions PT3 in the region where it overlaps with the first sensing pad portion TS-PD13 along the third direction DR3. In this case, the second conductive layer TS-CL2, which overlaps with the multiple protrusions PT3 along the third direction DR3, can be defined as multiple upper electrodes UE.

[0187] The first sensing pad TS-PD13 can be disposed on the intermediate organic film 30. Therefore, in order to contact the first sensing pad TS-PD13, the length of the plurality of protrusions PT3 along the third direction DR3 can be greater than the length of the spacer SPC along the third direction DR3.

[0188] Figures 16 to 17 It is Figure 9 An enlarged plan view of the first substrate in part A.

[0189] Reference Figure 9 , Figure 16 and Figure 17 It can be seen that the boundary line of one corner region of the second electrode CE is not limited to a curved shape.

[0190] More specifically, the second electrode CE may have a first radius of curvature R1 in the region near the corner where the upper short side SS12 of the second substrate SUB2 meets the left long side LS12, and in the region near the corner where the upper short side SS12 of the second substrate SUB2 meets the right long side LS22. In this case, the first radius of curvature R1 may be substantially the same as the radius of curvature of the corner regions of the first substrate SUB1 and the second substrate SUB2, and the radius of curvature of the sealing member SEAL.

[0191] In addition, such as Figure 16 and Figure 17 As shown, the second electrode CE can have either a stepped boundary line or a straight boundary line in the region near the corner where the lower short side SS22 of the second substrate SUB2 meets the left long side LS12, or in the region near the corner where the lower short side SS22 of the second substrate SUB2 meets the right long side LS22. In this case, the boundary line can overlap with the boundary line of the second electrode CE (with a first radius of curvature R1) and the boundary line of the display area DM-DA of the display device 1 along a third direction DR3.

[0192] The second electrode CE and the sealing component SEAL can be arranged at a predetermined distance apart on a plane. In the region near the corner where the lower short side SS22 of the second substrate SUB2 meets the left long side LS12, and in the region near the corner where the lower short side SS22 of the second substrate SUB2 meets the right long side LS22, if the second electrode CE has either a stepped boundary line or a straight boundary line, the distance between the second electrode CE and the sealing component SEAL, which maintains a constant radius of curvature, can be increased.

[0193] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that the invention can be implemented in other specific forms without altering the technical concept or essential features of the invention. Therefore, the embodiments described above should be understood as exemplary in all respects, and not limiting.

Claims

1. A display device, comprising: The first substrate is provided with a display area, a non-display area surrounding the display area, and a protruding area extending from one side of the non-display area; A first sensing pad is formed on the first substrate in the non-display area in a manner adjacent to the protruding area; A circuit element layer is located on the first substrate in the display area; The display element layer is located on the circuit element layer; The second substrate is arranged to face the remaining areas except for the protruding area; The second sensing pad is formed on the second substrate in a manner corresponding to the first sensing pad; as well as A sealing component is arranged along the edge of the second substrate, thereby attaching the first substrate and the second substrate to each other. The display element layer includes: The first electrode is connected to the source electrode or drain electrode of the thin-film transistor equipped in the circuit element layer. A pixel definition film defines the pixel region of the display element layer and exposes the first electrode; A light-emitting layer is located on the first electrode; and The second electrode is located on the light-emitting layer. The first sensing pad and the second sensing pad are arranged in a plane between the edge of the second electrode and the sealing member. Each of the second electrode and the second substrate includes a left long side and a right long side extending along a first direction, and an upper short side and a lower short side extending along a second direction intersecting the first direction. The corners where the left long side and the right long side intersect with the upper short side and the lower short side form a curved surface. The radius of curvature of the angle at which the lower short side intersects the left long side and the right long side in the second electrode is greater than the radius of curvature of the angle at which the lower short side intersects the left long side and the right long side in the second substrate. The first sensing pad portion and the second sensing pad portion are arranged between the corner where the lower short side of the second electrode intersects the left long side and the right long side, and the corner where the lower short side of the second substrate intersects the left long side and the right long side.

2. The display device according to claim 1, wherein, The first substrate includes a left long side and a right long side extending along a first direction, and an upper short side and a lower short side extending along a second direction intersecting the first direction. The corners where the left long side, the right long side and the upper short side and the lower short side intersect form a curved surface.

3. The display device according to claim 2, wherein, The corner where the upper short side of the second electrode intersects the left long side and the right long side has a first radius of curvature, and the corner where the lower short side intersects the left long side and the right long side has a second radius of curvature that is different from the first radius of curvature.

4. The display device according to claim 3, wherein, The first radius of curvature of the second electrode is the same as the radius of curvature of the corner where the upper short side of the first substrate and the left long side and the right long side intersect.

5. The display device according to claim 3, wherein, The first radius of curvature of the second electrode is smaller than the second radius of curvature of the second electrode.

6. The display device according to claim 5, wherein, The first sensing pad and the second sensing pad are arranged in a plane between the edge of the second electrode having the second radius of curvature and the sealing member.

7. The display device according to claim 3, wherein, The corner where the lower short side of the second electrode intersects the left long side and the right long side is either a stepped boundary line or a straight boundary line on the plane.

8. The display device according to claim 7, wherein, The boundary line of the second electrode is arranged in a plane between the edge of the display area and the edge of the second electrode when it has the first radius of curvature.

9. The display device according to claim 1, wherein, The area of ​​the second electrode is larger than the area of ​​the display area.

10. The display device according to claim 1, wherein, The circuit element layer includes a first power supply voltage electrode and a second power supply voltage electrode, wherein the voltage flowing through the second power supply voltage electrode is lower than the voltage flowing through the first power supply voltage electrode.

11. The display device according to claim 10, wherein, The second power supply voltage electrode is arranged to overlap with a portion of the edge of the second electrode.

12. The display device according to claim 11, wherein, The second electrode and the second power supply voltage electrode are electrically connected.

13. The display device according to claim 10, wherein, The first sensing pad and the second sensing pad are arranged on a plane between the second power supply voltage electrode and the sealing member.

14. The display device according to claim 1, wherein, The second substrate includes a first conductive layer, an insulating layer disposed on the first conductive layer, and a second conductive layer disposed on the insulating layer.

15. The display device according to claim 14, wherein, The first sensing pad includes a plurality of lower electrodes, and the second sensing pad includes a plurality of upper electrodes, wherein the upper electrodes are electrically connected to the lower electrodes.

16. The display device according to claim 15, wherein, Also includes: A spacer is provided on the pixel definition film to maintain the spacing between the first substrate and the second substrate.

17. The display device according to claim 16, wherein, The insulating layer includes a plurality of first protrusions in the region overlapping with the first sensing pad. The length of the upper electrode of the second conductive layer, which is arranged overlapping with the plurality of first protrusions, along the thickness direction is the same as the length of the spacer along the thickness direction.

18. The display device according to claim 1, wherein, include: The third sensing pad is disposed on the protruding area of ​​the first substrate and is connected to the display driving substrate.

19. The display device according to claim 18, wherein, The first sensing pad is electrically connected to the third sensing pad via sensing wiring.

20. The display device according to claim 19, wherein, The sealing component is arranged to overlap with a region of the sensing wiring along the thickness direction.

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