Evaporation mask, evaporation mask assembly, evaporation mask device and display device

Abstract

The present invention provides an evaporation mask, which is used in the evaporation of evaporation materials onto an evaporation substrate. The evaporation mask comprises: a first surface side, a second surface side and a through hole, and is characterized in that the first surface side comprises at least a plurality of first recesses, the second surface side comprises a plurality of second recesses and a plurality of second support portions, the second recess comprises a second opening and a second etched surface, two adjacent second etched surfaces intersect to form a protrusion, and the protrusion protrudes in a direction away from the first surface side; the second support portion comprises a plurality of edge portions and a plurality of tip portions, the tip portion is located between two adjacent edge portions, the edge portion is recessed inwardly, and the tip portion points to the protrusion portion and is connected to the protrusion portion, so as to improve the closeness of the evaporation mask and the evaporation substrate, reduce wrinkles when the net is stretched, and at the same time reduce shadows during evaporation, thereby improving the evaporation accuracy.

Description

[Technical field]

[0001] The present invention relates to the technical field of optical masks, and in particular to an evaporation mask, an evaporation mask assembly, an evaporation mask device and a display device. [Background technology]

[0002] In recent years, the displays used on mobile terminals such as smartphones and tablets have been required to be very fine (number of pixels: 400ppi or more). In the future, ultra high definition (UHD) will be required for mobile terminals, and OLED panels with higher resolution (number of pixels: 800ppi) are expected to be required. Evaporation masks are required in the manufacture of OLED panels. In order to correspond to the high refinement of OLED panels, the evaporation masks also need to be highly refined. If the thickness of the evaporation mask is too large, it will leave shadows that are not fully evaporated on the workpiece being evaporated, affecting the evaporation effect. Using a thinner evaporation mask is conducive to improving refinement, but if the thickness is too small, the rigidity will be reduced and wrinkles will occur when the net is stretched. Poor rigidity will cause the adhesion between the evaporation mask and the evaporation substrate to deteriorate, thereby affecting the evaporation accuracy. Therefore, it is necessary to provide an evaporation mask with high adhesion and a method for manufacturing the same. [Summary of the invention]

[0003] An object of the present invention is to provide a vapor deposition mask having high adhesion.

[0004] The technical solution of the present invention is as follows: a vapor deposition mask, which is used in vapor deposition of a vapor deposition material onto a vapor deposition substrate, and the vapor deposition mask comprises:

[0005] A first surface side, which constitutes a side of the evaporation mask facing the evaporation substrate;

[0006] A second surface side, which constitutes a side of the evaporation mask opposite to the first surface side; and

[0007] a through hole penetrating through the first surface side and the second surface side,

[0008] The first surface side includes at least a plurality of first recesses, the first recesses surround the through hole, the second surface side includes a plurality of second recesses and a plurality of second support portions, the second recesses are connected with the first recesses to form a through hole, the second support portion is a plane, and the thickness T from the second support portion to the first surface side satisfies the relationship: 10um≤T≤40um; the second recess includes a second opening and a second etched surface, the second opening is connected to the second support portion, and the second etched surface connects the second opening and the through hole, two adjacent second etched surfaces intersect to form a convex portion, and the convex portion convexes in a direction away from the first surface side; the second support portion includes a plurality of edge portions and a plurality of tip portions, the tip portion is located between two adjacent edge portions, the edge portion is recessed inwardly, and the tip portion points to the convex portion and is connected to the convex portion.

[0009] More preferably, the plurality of side portions are arranged in pairs, and the width between two opposite side portions is defined as W3, satisfying the relationship:

[0010] 2um≤W3≤10um.

[0011] More preferably, the plurality of tips are arranged in pairs, and the distance between two opposite tips is defined as W4, satisfying the relationship:

[0012] 1um≤W4-W3≤5um.

[0013] More preferably, the first surface further includes a first supporting portion, and the first supporting portion surrounds the first recess.

[0014] More preferably, the first supporting portion is a plane, and the thickness T from the second supporting portion to the first surface side is the thickness from the second supporting portion to the first supporting portion.

[0015] More preferably, the evaporation mask is made of nickel-iron alloy.

[0016] A vapor deposition mask assembly comprises any of the above-mentioned vapor deposition masks.

[0017] A vapor deposition mask device comprises the vapor deposition mask assembly.

[0018] An organic display device is obtained by performing evaporation using the evaporation mask device as described above.

[0019] The beneficial effect of the present invention is that the present invention specifies the shape of the second supporting portion of the evaporation mask to improve the closeness between the evaporation mask and the evaporation substrate, reduce wrinkles when stretching the net, reduce shadows during evaporation, and improve evaporation accuracy.

Brief Description of the Drawings

[0020] Figure 1It is a schematic structural diagram of the evaporation mask device of the present invention;

[0021] Figure 2 It is a schematic structural diagram of the evaporation mask assembly of the present invention;

[0022] Figure 3 is a schematic diagram of the first side of the evaporation mask corresponding to the green evaporation material;

[0023] Figure 4 is a schematic diagram of the first side of the evaporation mask corresponding to the red evaporation material;

[0024] Figure 5 is a schematic diagram of the first side of the evaporation mask corresponding to the blue evaporation material;

[0025] Figure 6 It is the evaporation area formed by the combination of red, green and blue evaporation materials on the glass substrate;

[0026] Figure 7 This is a schematic structural diagram of the evaporation mask of the present invention, in which the first surface of the mask faces upward;

[0027] Figure 8 This is a schematic structural diagram of the vapor deposition mask of the present invention, in which the second surface of the mask faces upward;

[0028] Fig. 9 for Figure 7 Schematic diagram of the cross section at AA;

[0029] Fig.10 for Figure 7 Schematic diagram of the cross section at BB;

[0030] Fig.11 It is a schematic diagram of the process of manufacturing a vapor deposition mask of the present invention;

[0031] Fig.12 is a schematic structural diagram of a first bonding device of the present invention;

[0032] Fig.13 It is a schematic structural diagram of the exposure device of the present invention;

[0033] Fig.14 It is a structural schematic diagram of the developing device of the present invention;

[0034] Fig.15 It is a schematic diagram of the conveying sequence of the metal coil in the manufacturing device of the present invention;

[0035] Fig.16 is a cross-sectional view of the evaporation mask structure corresponding to step S20 of the present invention;

[0036] Fig.17 is a cross-sectional view of the evaporation mask structure corresponding to step S40 of the present invention;

[0037] Fig.18 is a cross-sectional view of the evaporation mask structure corresponding to step S50 of the present invention;

[0038] Fig.19 is a cross-sectional view of the evaporation mask structure corresponding to step S60 of the present invention;

[0039] Fig. 20 It is a cross-sectional view of the evaporation mask structure corresponding to step S70 of the present invention. [Specific implementation method]

[0040] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0041] (Evaporation mask device 4000)

[0042] This embodiment provides a vapor deposition mask device 4000, see Figure 1 The evaporation mask device 4000 includes: an evaporation mask component 1000, an evaporation component 2000 and an evaporation substrate 3000. The evaporation component 2000 is heated to generate vaporized or sublimated evaporation material 2300 and evaporates it on the evaporation substrate 3000 through the evaporation mask component 1000.

[0043] Preferably, see Figure 2 The evaporation mask assembly 1000 includes an evaporation mask 100 and a frame 200, a through area 210 is provided in the middle of the frame 200, the evaporation substrate 3000 is arranged in the through area 210, the evaporation mask 100 is fixed to the frame 200 and is tightly fitted with the evaporation substrate 3000, and the evaporation material 2300 is attached to the evaporation substrate 3000 fitted with the evaporation mask 100 through the evaporation mask 100.

[0044] More preferably, the vapor deposition substrate 3000 is made of glass material. In this embodiment, the vapor deposition substrate 3000 is specifically an electrode glass provided with electrodes.

[0045] Preferably, the evaporation assembly 2000 includes a heater 2100, a crucible 2200 and an evaporation material 2300, the evaporation material 2300 is placed in the crucible 2200, and the heater 2100 is used to heat the crucible 2200. Specifically, the evaporation material 2300 is an organic light-emitting material. The heater 2100 heats the crucible 2200 to make the evaporation material 2300 vaporize or sublimate and rise, and is tightly attached to the side of the evaporation substrate 3000 facing the evaporation assembly 2000 through the evaporation mask 100. In this embodiment, the evaporation substrate 3000 is an electrode glass, and the electrode of the electrode glass adsorbs the vaporized evaporation material 2300 to improve the evaporation effect.

[0046] (Evaporation mask assembly 1000)

[0047] This embodiment provides a vapor deposition mask assembly 1000, which is used to form a part of the vapor deposition mask device 4000. Figure 2 The evaporation mask assembly 1000 includes a frame 200 and an evaporation mask 100. The number of the evaporation masks 100 is several. In this embodiment, the number of the evaporation masks 100 is 7. The 7 strip-shaped evaporation masks 100 are fixed on the frame 200 at intervals.

[0048] Preferably, the frame 200 is a rectangular structure with a through-area 210 formed inside, the evaporation mask 100 is welded to the frame 200 through a stretched net, and the effective area 110 of the evaporation mask 100 is placed in the through-area 210 of the frame 200, and the frame 200 supports the evaporation mask 100. In this embodiment, the frame 200 is made of a metal material that can be fixed by magnetic adsorption.

[0049] More preferably, the vapor deposition mask 100 includes an effective area 110, a surrounding area 120 and a fixed area 130. A plurality of effective areas 110 are arranged on a strip-shaped vapor deposition mask 100. In this embodiment, five effective areas 110 are arranged at intervals on the vapor deposition mask 100. The surrounding area 120 surrounds the effective area 110 and mainly plays a role in supporting the effective area 110. The fixed area 130 is connected to the surrounding area 120, and the fixed area 130 is fixed to the frame 200.

[0050] Preferably, see Figure 3 and Figure 4 The effective area 110 is provided with a plurality of through holes 30, through which the evaporation material 2300 is tightly attached to the evaporation substrate 3000. The through holes 30 can be designed into a plurality of arbitrary sizes and shapes according to actual needs and can be organically arranged and combined to obtain the required pattern. The process of the evaporation material 2300 adhering to the evaporation substrate 3000 can be understood as the process of transferring the actually required pattern to the evaporation substrate 3000 through the effective area 110 of the evaporation mask 100.

[0051] More preferably, when the evaporation mask 100 is stretched on the frame 200, a force is first applied to the frame 200 to produce pre-deformation, and then the evaporation mask 100 is welded to the frame 200. By matching the stretching force of the evaporation mask and the pre-tensioning force on the frame, the alignment position of the evaporation mask after stretching is prevented from shifting after the frame is welded. At the same time, when the evaporation mask 100 is in the evaporation process, even if the evaporation mask plate expands due to heat, as long as the original tension is maintained, the through hole will not have position deviation, thereby maintaining the evaporation accuracy.

[0052] Specifically, the pre-deformation force of the pre-deformation treatment and the tension force relative to the evaporation mask 100 are obtained by simulation. When the evaporation mask 100 is stretched without pre-tension, the evaporation mask 100 itself has the force to return to its original shape, which causes the frame 200 itself to be distorted, and as a result, the position of the corner alignment during welding will also deviate. At the same time, if the evaporation mask 100 is excessively bent or welded due to its own weight, the evaporation substrate 3000 and the evaporation mask 100 will be misaligned when they are attached to the evaporation mask 100 through the magnet. Therefore, the evaporation mask 100 has an optimal bending amount, and the tension force can be calculated from the most appropriate bending amount. The elongation value of the evaporation mask is calculated according to the tension force, thereby determining the shrinkage rate of the evaporation mask. Therefore, the evaporation mask 100 is stretched, aligned, and welded on the basis of giving tension to the frame 200. At this time, the frame 200 is given pre-tension to prevent them from stretching and shrinking from the state of being aligned with the stretched evaporation mask 100. Since the pre-tension is calculated by simulating the tension of the evaporation mask 100, that is to say, the tension given to each evaporation mask 100 = the pre-tension given to the frame 200. In this embodiment, multiple evaporation masks 100 are stretched on the frame in sequence. Since the pre-tension of the subsequent evaporation mask will be slowly weakened after each evaporation mask is stretched, it is difficult to accurately obtain the method of weakening the pre-tension through a single simulation. It is necessary to measure the displacement of the frame at the stretching stage of each evaporation mask, and then simulate the pre-tension weakening value twice. More specifically, in this embodiment, each evaporation mask 100 and the two ends of the frame 200 are stretched and bonded by three parts on the long side of the frame 200, so the pre-tension change analysis of these three parts needs to be added during the simulation. It can be understood that according to the actual production, the evaporation mask 100 and the frame 200 can also be stretched by other numbers of parts.

[0053] It can be understood that, regardless of whether the frame 200 is pre-deformed, the evaporation mask 100 will be stretched on the frame 200. In fact, there is a deviation between the position of the through hole 30 of the evaporation mask 100 on the frame 200 after the stretching and the position of the through hole 30 of the evaporation mask 100 on the frame 200 in theory. The position of the through hole 30 of the evaporation mask 100 on the frame 200 in theory is regarded as the position specified by the position accuracy. In this embodiment, the position of the through hole 30 of the evaporation mask 100 on the frame 200 simulated when calculating and simulating the pre-deformation amount and the locking position is defined as the offset accuracy of the position of the through hole 30 of the evaporation mask 100 stretched on the frame 200 relative to the position specified by the position accuracy as P, and the relationship is satisfied: -3um≤P≤3um. When the above accuracy is met, it can be ensured that the evaporation mask 100 can ensure a high evaporation accuracy during the evaporation process, while avoiding the influence of production efficiency due to excessive pursuit of position accuracy.

[0054] (Evaporation mask 100)

[0055] This embodiment provides a vapor deposition mask 100, which is used to form a part of the vapor deposition mask assembly 1000. Figure 2 The evaporation mask 100 includes an active area 110, a peripheral area 120 and a fixed area 130. A strip-shaped evaporation mask 100 is provided with a plurality of active areas 110, the peripheral area 120 surrounds the active area 110, and the fixed area 130 is connected to the peripheral area 120. The evaporation mask 100 is formed by etching a metal coil 40. In this embodiment, the metal coil 40 is specifically a nickel-iron alloy, also known as invar alloy, which is 36% nickel with a thermal expansion coefficient of about 1 ppm / °C.

[0056] Preferably, see Figure 7 and Figure 8 ,, the effective area 110 includes a first surface side 10, a second surface side 20 and a through hole 30, the first surface side 10 constitutes a side of the evaporation mask 100 facing the evaporation substrate 3000, and the second surface side 20 constitutes a side of the evaporation mask 100 opposite to the first surface side 10. In this embodiment, the second surface side 20 faces the evaporation component 2000, and the through hole 30 penetrates the first surface side 10 and the second surface side 20 along the thickness direction of the evaporation mask 100.

[0057] Specifically, there are multiple through holes 30, and the multiple through holes 30 are arranged at a certain interval in the effective area 110 according to actual needs. The evaporation material 2300 is evaporated on the evaporation substrate 3000 to obtain the required pattern according to the size and shape of the through holes 30 and the organic arrangement and combination of the through holes 30.

[0058] Specifically, see Figure 3 to Figure 6 , each active area 110 has a substantially quadrilateral shape in the figure, and one active area 110 corresponds to one organic display device. Figures 3 to 5 The effective areas 110 corresponding to the three different evaporation masks 100a, 100b, and 100c can be set to have the same shape and size and corresponding positions, so as to facilitate Figure 6 As shown, organic deposition materials of different colors are deposited on the glass substrate 3000 to form a high-pixel deposition area.

[0059] Specifically, see Figure 7The first surface side 10 includes a first recess 11 and a first support portion 12, the first recess 11 surrounds the through hole 30, the first support portion 12 is a plane, the first support portion 12 surrounds the first recess 11, and the first support portion 12 is used to fit with the evaporation substrate 3000.

[0060] Specifically, see Figure 8 The second surface side 20 includes a second recess 21 and a second support portion 22, the second recess 21 surrounds the through hole 30, and the number of the second recess 21 is multiple. The second support portion 22 is a plane, and the thickness from the second support portion 22 to the first surface side 10 is equal to the thickness T of the metal coil 40. The second support portion 22 is formed between the multiple second recesses 21, and the projection of the second support portion 22 on the first surface side 10 is located inside the first support portion 12. In this embodiment, four second recesses 21 surround one second support portion 22, and the second support portion 22 extends in a direction away from the first surface side 10. The thickness from the second support portion 22 to the first support portion 12 on the first surface side 10 is equal to the thickness of the metal coil 40 used for etching to form the evaporation mask 100 plate.

[0061] Specifically, the evaporation mask 100 is formed by etching the metal coil 40 . In the concept of the present invention, the thickness T of the metal coil 40 satisfies the relationship: 10um≤T≤40um.

[0062] Specifically, see Fig. 9 and Fig.10 The first concave portion 11 includes a first opening 111 and a first etched surface 112, wherein the first opening 111 is located on the first surface side 10, and the first etched surface 112 is an arc surface formed by being recessed from the first opening 111 to the second surface side 20. Moreover, the first opening 111 is connected to the first supporting portion 12, and the first etched surface 112 is bent and extended from the first opening 111 to the direction of the through hole 30, and the first etched surface 112 connects the first opening 111 and the through hole 30.

[0063] Specifically, see Fig. 9 and Fig.10 The second recess 21 includes a second opening 211 and a second etched surface 212, the second opening 211 is connected to the second support portion 22, the second etched surface 212 bends and extends from the second opening 211 toward the through hole 30, and the second etched surface 212 connects the second opening 211 and the through hole 30.

[0064] Preferably, see Fig.10The second etched surface 212 connects the second opening 211 and the through hole 30, and two adjacent second etched surfaces 212 intersect to form a protrusion 213, and the protrusion 213 protrudes in a direction away from the first surface side 10;

[0065] More preferably, the second supporting portion 22 includes a plurality of edge portions 221 and a plurality of pointed portions 222, wherein the pointed portion 222 is located between two adjacent edge portions 221, the edge portions 221 are recessed inwardly, and the pointed portion 222 points to the raised portion 213 and is connected to the raised portion 213, so that the evaporation mask 100 and the evaporation substrate 3000 have a higher degree of adhesion, which reduces wrinkles when the net is stretched, reduces shadows during evaporation, and improves the evaporation accuracy.

[0066] More preferably, the plurality of side portions are arranged in pairs, the plurality of tip portions are arranged in pairs, the width between two opposite side portions is defined as W3, the distance between two opposite tip portions is defined as W4, and the relationship is satisfied:

[0067] 2um≤W3≤10um;

[0068] 1um≤W4-W3≤5um;

[0069] When the above relationship is satisfied, the evaporation mask and the evaporation substrate have a higher degree of adhesion, which reduces wrinkles during the stretching of the net, reduces shadows during evaporation, and improves the evaporation accuracy.

[0070] (Method for Manufacturing Vapor Deposition Mask 100)

[0071] This embodiment provides a method for manufacturing an evaporation mask 100, which is used to manufacture the evaporation mask 100. Figures 11 to 20 , the manufacturing method comprises:

[0072] Step S10: providing a metal coil 40 .

[0073] Specifically, the metal coil 40 includes an upper surface 41 and a lower surface 42, the upper surface 41 is opposite to the lower surface 42, the thickness T of the metal coil 40 is the thickness from the upper surface 41 to the lower surface 42, and satisfies the relationship: 10um≤T≤40um;

[0074] Preferably, the metal coil 40 is used for etching to form the evaporation mask 100. In this embodiment, the metal coil 40 is specifically a nickel-iron alloy, also known as Invar alloy, which is a 36% nickel-containing iron alloy with a thermal expansion coefficient of about 1 ppm / °C.

[0075] Preferably, the upper surface 41 and the lower surface 42 of the metal coil 40 need to be conventionally pickled and cleaned and inspected before etching. Specifically, the upper surface 41 and the lower surface 42 of the metal coil 40 are sprayed with acid or alkali, and the metal coil 40 can be released by the reel 61 and slowly passed through the cleaning device, and then reeled after cleaning for the subsequent process. In this way, foreign matter on the surface of the metal coil 40 is removed, and metal particles in the metal surface 40 are removed, which can prevent hole shape defects.

[0076] Step S20 : ​​vacuum laminating the dry film photoresist 50 on the upper surface 41 and the lower surface 42 of the metal coil 40 .

[0077] Specifically, the dry film photoresist 50 includes a first dry film photoresist 51 and a second dry film photoresist 52 . The first dry film photoresist 51 is attached to the upper surface 41 of the metal coil 40 , and the second dry film photoresist 52 is attached to the lower surface 42 of the metal coil 40 .

[0078] Specifically, the dry film photoresist 50 is bonded to the upper surface 41 and the lower surface 42 of the metal coil 40 by heat pressing. Before heat pressing bonding, the metal coil 40 is rolled up in the winder 61, and the metal coil 40 is released by the winder 61 and slowly passes through the preheating device 623, and the preheating device 623 preheats the upper surface 41 and the lower surface 42 of the metal coil 40. The preheated metal coil 40 slowly passes through the hot pressing roller 625 to bond with the dry film photoresist 50. Before hot pressing and laminating, the dry film photoresist 50 is rolled up in another winder 61. The dry film photoresist 50 of the present embodiment is also covered with at least a substrate layer 53 for supporting and protecting the dry film photoresist 50. The dry film photoresist 50 is slowly released from the winder 61 and the substrate layer 53 is peeled off. The dry film photoresist 50 with the substrate layer 53 peeled off is laminated to the metal coil 40 through the hot pressing roller 625. The metal coil 40 laminated with the dry film photoresist 50 is rolled up in the winder 61 for easy transfer to the next process.

[0079] More preferably, the process of hot-pressing the dry film photoresist 50 to the metal coil 40 is performed in a vacuum environment to improve the adhesion between the dry film photoresist 50 and the upper surface 41 and the lower surface 42 of the metal coil 40 .

[0080] Step S30: patterning the dry film photoresist 50 by exposure and development.

[0081] Specifically, the dry film photoresist 50 is used for exposure and development to form a patterned dry film photoresist 50, and the patterned dry film photoresist 50 is used as a mask to transfer the designed pattern to the metal coil 40 for etching to form the required size and shape of the first side 10, the second side 20 and the through hole 30.

[0082] Specifically, exposure and development are performed in the exposure device 63 and the development device 64, respectively.

[0083] Specifically, the exposure device 63 at least includes a plurality of winders 61, a plurality of conveying rollers 632 and an exposure machine 633. In this embodiment, the exposure machine 633 is a vertical exposure machine 633, and the metal coil 40 attached with the dry film photoresist 50 is wound in the winder 61. The metal coil 40 is released from the winder 61 and is driven by the plurality of conveying rollers 632, thereby passing through the exposure machine 633 from top to bottom.

[0084] Specifically, the exposure machine 633 at least includes an exposure lamp 6331, an exposure machine frame 6332, a vacuum seal 6333, a first exposure mask 6334, and a second exposure mask 6335. The exposure machine frame 6332 is arranged in pairs, the first exposure mask 6334 and the second exposure mask 6335 are respectively arranged in the exposure machine frame 6332, and the first exposure mask 6334 and the second exposure mask 6335 are respectively located on both sides of the metal coil 40. Specifically, the first exposure mask 6334 is located on the side of the metal coil 40 where the first dry film photoresist 51 is attached, and the second mask is located on the side of the metal coil 40 where the second dry film photoresist 52 is attached, and the first exposure mask 6334 and the second exposure mask 6335 are opposite to each other and are arranged at a distance.

[0085] Before exposure, the first exposure mask 6334 and the second exposure mask 6335 are first aligned with each other with an alignment accuracy of less than 2 um.

[0086] During exposure, the conveying tension of the metal plate is released, and a vacuum environment is formed between the first exposure mask 6334 and the second exposure mask 6335 through the vacuum seal 6333, so that the metal coil 40 is exposed in a vacuum environment. At this time, for the evaporation mask 100, the first exposure mask 6334 faces the first surface side 10 of the evaporation mask 100, and the second exposure mask 6335 faces the second surface side 20 of the evaporation mask 100, and the ambient temperature t of the first exposure mask 6334 and the second exposure mask 6335 is controlled at: -2°C ≤ t ≤ 2°C.

[0087] Specifically, in this embodiment, the exposure mask is a glass substrate patterned with chromium, and the exposure mask is one of soda-lime glass or quartz glass. In this embodiment, the exposure mask is soda-lime glass, and the chromium is specifically a diaphragm disposed on the glass substrate and an oxide diaphragm disposed on the diaphragm. After exposure, the metal coil 40 is wound in the winder 61. In this way, the tension applied to the metal coil can be minimized, and the temperature deviation in the pattern can be minimized, the pattern size deviation in the glass pattern can be minimized, and the position deviation defect of the hole can be prevented.

[0088] Specifically, the developing device 64 adopts a well-known developing device 64, and the exposed metal coil 40 is patterned in the developing device 64 to transfer the designed pattern to the dry film photoresist 50. Specifically, the patterned first dry film photoresist 51 is used to etch the upper surface 41 of the metal coil 40 to form the first side 10 of the evaporation mask 100, and the patterned second dry film photoresist 52 is used to etch the lower surface 42 of the metal coil 40 to form the second side 20 and the through hole 30 of the evaporation mask 100.

[0089] Step S40: etching the upper surface 41 through the patterned dry film photoresist 50 to form a first surface side 10;

[0090] Specifically, the dry film photoresist 50 includes a first dry film photoresist 51 and a second dry film photoresist 52. In this step, the upper surface 41 is etched by the patterned first dry film photoresist 51 to form the first side 10. Specifically, the patterned first dry film photoresist 51 is used as an etching mask to transfer the designed pattern to the upper surface 41 of the metal coil 40 to form the designed first side 10.

[0091] Specifically, the first surface side 10 includes at least a plurality of first recesses 11, the first recesses 11 include a first opening 111 and a first etched surface 112, the first opening 111 is located on the upper surface 41, the first opening 111 is flush with the upper surface 41, and the first etched surface 112 is a curved surface formed by the first opening 111 being recessed toward the lower surface 42. It can be understood that the first opening 111 is an opening profile formed by the first recess 11 on the upper surface 41, and the first etched surface 112 is a curved surface formed during the recessing of the first recess 11 toward the lower surface 42.

[0092] Specifically, before performing step S40 , in order to obtain etching conditions during actual etching, an etching condition adjustment process is first performed.

[0093] Specifically, in order to obtain the etching conditions during actual etching, the guide plate is first passed through the etching device. In this embodiment, the guide plate is made of 0.3 mm PET material (polyethylene terephthalate), and the etching surface for the first etching is pasted under the guide plate. In this embodiment, the upper surface 41 of the metal coil 40 is the etching surface for the first etching. Various etching conditions are obtained through etching tests combined with computer simulation.

[0094] Specifically, after the etching condition extraction is completed, the metal coil 40 actually used for etching is set in the etching equipment, and the guide plate is connected to the metal coil 40 actually used for etching. In this embodiment, the upper surface 41 is facing downward and the upper surface 41 is etched, and the etching liquid etches the upper surface 41 through the patterned first dry film photoresist 51 to form the first side 10. In this embodiment, the degree of etching is controlled by limiting the structural size of the first opening 111, and the specific process parameters can be specifically set according to the actual situation, and the process parameters are debugged with the structural size of the first opening 111 finally formed as the standard. After the etching is completed, it is fully washed with pure water, dried and then rolled up. In this way, the hole size during mass production can be correctly controlled.

[0095] Step S50: vacuum laminating resin 70 on the first surface side 10 to fill the first concave portion 11;

[0096] Specifically, the first groove is filled with resin 70 under vacuum. In this embodiment, the resin 70 covers the first surface side 10 in a fitting manner and fills the first concave portion 11 of the first surface side 10. The use of a vacuum environment is conducive to improving the tightness of the resin 70 and the first groove to prevent the etching solution from entering the first concave portion 11 through the through hole 30. In this embodiment, the resin 70 is a thermoplastic acid-resistant resin 70.

[0097] Step S60: etching the lower surface 42 through the patterned dry film photoresist 50 to form the second surface side 20;

[0098] Specifically, in this step, the lower surface 42 is etched by the patterned second dry film photoresist 52 to form the second side 20. Specifically, the patterned second dry film photoresist 52 is used as an etching mask to transfer the designed pattern to the lower surface 42 of the metal coil 40 to form the designed second side 20.

[0099] Specifically, the second surface side 20 includes at least a plurality of second recesses 21, the second recesses 21 are recessed toward the upper surface 41, the second recesses 21 and the first recesses 11 penetrate each other to form a through hole 30, and the first etched surface 112 connects the first opening 111 and the through hole 30; it can be understood that a plurality of first recesses 11 correspond one-to-one to a plurality of second recesses 21, and a plurality of through holes 30 are formed through them.

[0100] Specifically, in this embodiment, the lower surface 42 is etched with the lower surface 42 facing downward, and the etching liquid etches the lower surface 42 through the patterned second dry film photoresist 52 to form the second surface side 20. In this embodiment, the degree of etching is controlled by limiting the structural size of the through hole 30, and the specific process parameters can be set according to the actual situation, and the process parameters are adjusted based on the structural size of the through hole 30 finally formed. After the etching is completed, it is fully washed with pure water, dried, and then rolled up.

[0101] Step S70: stripping the resin 70 and the dry film photoresist 50;

[0102] The metal coil 40 is released into a stripping device, the resin 70, the first dry film photoresist 51 and the second dry film photoresist 52 are stripped, and then fully washed with pure water. In this embodiment, the stripping process is achieved by using one or a combination of inorganic alkali or organic alkali.

[0103] Step S80: After stripping is completed, the metal coil 40 is cut into a plurality of metal sheets.

[0104] Specifically, the metal coil 40 is cut along a direction perpendicular to the winding direction of the metal coil 40 to form a plurality of sheet-shaped metal sheets.

[0105] Step S90: cutting the metal sheet to form a plurality of strip-shaped evaporation masks 100 .

[0106] Specifically, according to the designed evaporation mask 100 , the metal sheet is cut into strip-shaped evaporation masks 100 .

[0107] More preferably, after obtaining the strip-shaped evaporation mask 100 , a corresponding inspection process is performed according to actual needs.

[0108] Specifically, the automatic appearance inspection process automatically inspects all through holes 30 in the separated and cut evaporation mask 100 by comparing the through holes 30 on the periphery of the inspection target through hole; the average value of the peripheral through holes 30 is compared with the target through holes 30 by image processing; the comparative inspection is performed by comparing the area of ​​the through holes, as well as the shortest dimension and the longest dimension.

[0109] Specifically, the inspection process is confirmed, abnormal through-holes 30 are found, and a failure determination is performed.

[0110] Specifically, in the appearance sorting process, qualified vapor deposition masks 100 and defective vapor deposition masks 100 are sorted out according to actual requirements.

[0111] Specifically, in the dimension inspection step, a qualified vapor deposition mask 100 is placed, and the dimension parameters of the vapor deposition mask 100 are measured using a vapor deposition mask measuring machine.

[0112] Specifically, in the size sorting process, qualified vapor deposition masks 100 and defective vapor deposition masks 100 are selected according to actual requirements.

[0113] Specifically, in the visual appearance process, a qualified vapor deposition mask 100 is placed, and a vapor deposition mask visual inspection station is used to inspect the vapor deposition mask 100 for foreign matter, deformation, and the like.

[0114] Specifically, in the visual appearance sorting step, qualified vapor deposition masks 100 and defective vapor deposition masks 100 are sorted out according to actual requirements.

[0115] Specifically, in the packaging step, the qualified vapor deposition masks 100 screened through the above steps are arranged in a vacuum package according to a specified number.

[0116] In this embodiment, the key parameters involved in the evaporation mask 100 and the process are as follows:

[0117] Wherein, T is the thickness of the metal coil, W3 is the width between two opposite side portions, and W4 is the distance between two opposite tip portions.

[0118] parameter size unit T 10 um W3 2 um W4 4 um

[0119] As another example, the following parameters may also be used:

[0120] parameter size unit T 25 um W3 5 um W4 8 um

[0121] As another example, the following parameters may also be used:

[0122] parameter size unit T 40 um W3 10 um W4 15 um

[0123] (Evaporation Mask Manufacturing Apparatus 60)

[0124] This embodiment provides a vapor deposition mask manufacturing device 60 for implementing the vapor deposition mask manufacturing method 100. Figures 12 to 20 The manufacturing device 60 includes: a winder 61, a first laminating device 62, an exposure device 63, a developing device 64, a first etching device 65, a second laminating device 66, a second etching device 67, a stripping device 68, a first cutting device 691 and a second cutting device 692. The metal coil 40 is transported by the winder 61 and passes through the first laminating device 62, the exposure device 63, the developing device 64, the first etching device 65, the second laminating device 66, the second etching device 67, the stripping device 68, the first cutting device 691 and the second cutting device 692 in sequence.

[0125] Preferably, the coiler 61 is used to coil or release the metal coil 40;

[0126] Specifically, there are several winders 61, which are used in the first laminating device 62, the exposure device 63, the developing device 64, the first etching device 65, the second laminating device 66, the second etching device 67, the stripping device 68, the first cutting device 691 and the second cutting device 692. The winders 61 are used in pairs, one winder 61 releases the metal coil 40 wrapped thereon, and the other winder 61 winds up the metal coil 40 and wraps it thereon, so that the metal coil 40 slowly passes through the corresponding process equipment. The setting of the winder 61 can be flexibly used in combination with the conveying roller 632, the tensioning wheel, etc. according to actual needs.

[0127] More preferably, the first laminating device 62 is used to vacuum-laminate the dry film photoresist 50 on the upper surface 41 and the lower surface 42 of the metal coil 40 .

[0128] Specifically, the first bonding device 62 includes a vacuum chamber 621, a first winder 622, a preheating device 623, a second winder 624 and a hot pressing roller 625. The first winder 622, the preheating device 623, the second winder 624 and the hot pressing roller 625 are arranged in the vacuum chamber 621. The first winder 622 is arranged in pairs, and is used to convey the metal coil 40 so that it passes slowly through the preheating device 623 and the hot pressing roller 625 in sequence. The second winder 624 is used in conjunction with the first winder 622 and the hot pressing roller 625, and is used to convey the dry film photoresist 50 so that it is bonded to the upper surface 41 and the lower surface 42 of the metal coil 40 at the position of the hot pressing roller 625. In this embodiment, the dry film photoresist 50 is provided with a substrate layer 53 . The second winder 624 peels off the substrate layer 53 before attaching the dry film photoresist 50 to the metal coil 40 . The peeling process may adopt a known peeling method.

[0129] Specifically, before hot-pressing lamination, the metal coil 40 is rolled up in the first winder 622, and the metal coil 40 is released from the first winder 622 and slowly passes through the preheating device 623. The preheating device 623 preheats the upper surface 41 and the lower surface 42 of the metal coil 40, and the preheated metal coil 40 slowly passes through the hot-pressing roller 625 to be laminated with the dry film photoresist 50. Before hot-pressing lamination, the dry film photoresist 50 is rolled up in the second winder 624, and the dry film photoresist 50 is slowly released from the second winder 624 and peeled off the substrate layer 53. The dry film photoresist 50 peeled off the substrate layer 53 is laminated with the metal coil 40 through the hot-pressing roller 625, and the metal coil 40 laminated with the dry film photoresist 50 is rolled up in the first winder 622 to facilitate transfer to the next process.

[0130] Specifically, the vacuum chamber 621 forms a vacuum environment, and the process of hot pressing the dry film photoresist 50 to the metal coil 40 is performed in the vacuum environment, thereby improving the adhesion between the dry film photoresist 50 and the upper surface 41 and the lower surface 42 of the metal coil 40 .

[0131] Preferably, the exposure device 63 is used to expose the dry film photoresist 50. The exposure device 63 includes a third winder 631, a conveying roller 632, and an exposure machine 633. The third winder 631 is arranged in pairs, and is used to convey the metal coil 40 so that it slowly passes through the exposure machine 633. The conveying roller 632 cooperates with the third winder 631 to convey the metal coil 40. In this embodiment, the exposure machine 633 is a vertical exposure machine 633, and the tension of the metal coil 40 is first released when passing through the exposure machine 633.

[0132] Specifically, the exposure machine 633 includes an exposure lamp 6331, an exposure machine frame 6332, a vacuum seal 6333, a first exposure mask 6334, and a second exposure mask 6335. The exposure machine frame 6332 is arranged in pairs, the first exposure mask 6334 and the second exposure mask 6335 are respectively arranged in the exposure machine frame 6332, and the first exposure mask 6334 and the second exposure mask 6335 are respectively located on both sides of the metal coil 40. Specifically, the first exposure mask 6334 is located on the side of the metal coil 40 where the first dry film photoresist 51 is attached, and the second mask is located on the side of the metal coil 40 where the second dry film photoresist 52 is attached, and the first exposure mask 6334 and the second exposure mask 6335 are opposite and spaced apart.

[0133] Specifically, the developing device 64 is used to develop the dry film photoresist 50 to achieve patterning. In this embodiment, the developing device 64 includes a developing device 641 and a fourth winder 642. The fourth winder 642 is arranged in pairs and is used to convey the metal coil 40 to slowly pass through the developing device 641. The developing device 641 adopts a well-known device for achieving development.

[0134] Specifically, the first etching device 65 etches the upper surface 41 through the patterned dry film photoresist 50 to form the first surface side 10 .

[0135] Specifically, the first surface side 10 includes at least a plurality of first recesses 11, the first recess 11 includes a first opening 111 and a first etched surface 112, the first opening 111 is flush with the upper surface 41, and the first etched surface 112 is a surface that is recessed from the first opening 111 to the lower surface 42. In this embodiment, the first etched surface 112 is a curved surface.

[0136] Specifically, the second laminating device 66 is used to vacuum-laminate the resin 70 on the first surface side 10 to fill the first recess 11 .

[0137] Specifically, the second etching device 67 etches the lower surface 42 through the patterned dry film photoresist 50 to form the second surface side 20 .

[0138] Specifically, the second surface side 20 includes at least a plurality of second recesses 21, the second recesses 21 are recessed toward the upper surface 41, the second recesses 21 and the first recesses 11 penetrate each other to form a through hole 30, and the first etched surface 112 connects the first opening 111 and the through hole 30;

[0139] Specifically, the stripping device 68 is used to strip the resin 70 and the dry film photoresist 50. In this embodiment, the stripping device 68 implements the stripping process by using one or a combination of inorganic bases or organic bases;

[0140] Specifically, the first cutting device 691 is used to cut the metal coil 40 into a plurality of metal sheets.

[0141] Specifically, the second cutting device 692 is used to cut the metal sheet to form a plurality of strip-shaped evaporation masks 100 .

[0142] (Organic Display Device)

[0143] This embodiment provides an organic display device 5000 , which is manufactured by vapor deposition using the vapor deposition mask device 4000 .

[0144] Thus, the present invention specifies the shape of the second supporting portion of the evaporation mask to improve the closeness between the evaporation mask and the evaporation substrate, reduce wrinkles when stretching the net, reduce shadows during evaporation, and improve evaporation accuracy.

[0145] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not drive the essence of the corresponding technical solutions away from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vapor deposition mask, the vapor deposition mask being used in vapor deposition of a vapor deposition material onto a vapor deposition substrate, the vapor deposition mask Modules include: A first surface side, which constitutes a side of the evaporation mask facing the evaporation substrate; a second surface side constituting a side of the vapor deposition mask opposite to the first surface side; and a through hole penetrating the first surface side and the second surface side, The invention is characterized in that the first surface side includes at least a plurality of first recesses, the first recesses surround the through hole, the second surface side includes a plurality of second recesses and a plurality of second supporting portions, the second recesses are connected with the first recesses to form a through hole, the second supporting portion is a plane, and the thickness T from the second supporting portion to the first surface side satisfies the relationship: 10um≤T≤40um; the second recess includes a second opening and a second etched surface, the second opening is connected to the second supporting portion, and the second etched surface connects the second opening and the through hole, two adjacent second etched surfaces intersect to form a convex portion, and the convex portion convexes in a direction away from the first surface side; the second supporting portion includes a plurality of side portions and a plurality of tip portions, the tip portion is located between two adjacent side portions, the side portion is recessed inwardly, and the tip portion points to the convex portion and is connected to the convex portion; The method for manufacturing the evaporation mask comprises: Step S10: providing a metal coil; wherein, before etching the metal coil, the upper surface and the lower surface of the metal coil are sprayed with acid and alkali, the metal coil is released by a coiler and slowly passes through a cleaning device, and then coiled after cleaning; Step S20: vacuum laminating dry film photoresist on the upper surface and the lower surface of the metal coil respectively; The dry film photoresist includes a first dry film photoresist and a second dry film photoresist, the first dry film photoresist is attached to the upper surface of the metal coil, and the second dry film photoresist is attached to the lower surface of the metal coil; The dry film photoresist is bonded to the upper and lower surfaces of the metal coil by heat pressing; before heat pressing bonding, the metal coil is rolled up in a winder, and the metal coil is released by the winder and slowly passes through a preheating device, which preheats the upper and lower surfaces of the metal coil, and the preheated metal coil slowly passes through a heat pressing roller to bond to the dry film photoresist; before heat pressing bonding, the dry film photoresist is rolled up in another winder, The dry film photoresist is also covered with at least a substrate layer for carrying and protecting the dry film photoresist. The dry film photoresist is slowly released from the winder and the substrate layer is peeled off. The dry film photoresist peeled off from the substrate layer is bonded to the metal coil by a hot pressing roller, and the metal coil bonded with the dry film photoresist is rolled up on the winder. The process of hot pressing and laminating the dry film photoresist to the metal coil is carried out in a vacuum environment; Step S30: patterning the dry film photoresist by exposure and development; The dry film photoresist is used for exposure and development to form a patterned dry film photoresist, and the patterned dry film photoresist is used as a mask to transfer the designed pattern to the metal coil, so as to be used for etching to form the required first side, second side and through hole size and shape; The exposure device at least includes a plurality of winders, a plurality of conveying rollers and an exposure machine, wherein the metal coil with the dry film photoresist attached thereto is wound in the winder; the metal coil is released from the winder and driven by the plurality of conveying rollers, thereby passing through the exposure machine from top to bottom; The exposure machine at least comprises an exposure lamp, an exposure machine frame, a vacuum seal, a first exposure mask and a second exposure mask, the exposure machine frames are arranged in pairs, the first exposure mask and the second exposure mask are respectively arranged in the exposure machine frames, and the first exposure mask and the second exposure mask are respectively located on both sides of the metal coil; specifically, the first exposure mask is located on the side of the metal coil on which the first dry film photoresist is attached, and the second exposure mask is located on the side of the metal coil on which the second dry film photoresist is attached, and the first exposure mask and the second exposure mask are directly opposite and spaced apart; Before exposure, the first exposure mask and the second exposure mask are first aligned; the first exposure mask and the second exposure mask are aligned with an alignment accuracy of less than 2um; During exposure, the conveying tension of the metal plate is released, and a vacuum environment is formed between the first exposure mask and the second exposure mask through the vacuum seal, so that the metal coil is exposed in the vacuum environment. At this time, for the evaporation mask, the first exposure mask faces the first surface side of the evaporation mask, and the second exposure mask faces the second surface side of the evaporation mask, and the ambient temperature t of the first exposure mask and the second exposure mask is controlled at: -2°C ≤ t ≤ 2°C; Step S40: etching the upper surface through the patterned dry film photoresist to form a first side; Step S50: vacuum laminating resin on the first surface side to fill the first concave portion; Step S60: etching the lower surface through the patterned dry film photoresist to form a second side; Step S70: stripping the resin and the dry film photoresist; Step S80: After stripping is completed, cutting the metal coil into a plurality of metal sheets; Step S90: cutting the metal sheet to form a plurality of strip-shaped evaporation masks; According to the designed evaporation mask, cutting the metal sheet into strip-shaped evaporation masks; After obtaining the strip-shaped evaporation mask, a corresponding inspection process is performed according to actual needs. The inspection process includes: The automatic appearance inspection process automatically inspects all through holes in the separated and cut-out evaporation mask by comparing the through holes on the periphery of the inspection target through hole; the average value of the peripheral through holes is compared with the target through holes through image processing; the comparative inspection is performed by comparing the area of ​​the through holes, as well as the shortest and longest dimensions; Confirm the inspection process, find abnormal through holes, and make defect determinations; The dimension inspection process is to place a qualified evaporation mask and measure the dimension parameters of the evaporation mask using a evaporation mask measuring machine; In the visual appearance process, a qualified vapor deposition mask is placed and a vapor deposition mask visual inspection station is used to inspect the vapor deposition mask for foreign matter and deformation.

2. The evaporation mask according to claim 1, characterized in that: The plurality of side portions are arranged in pairs, and the width between two opposite side portions is defined as W3, satisfying the relationship: 2um≤W3≤10um.

3. The evaporation mask according to claim 2, characterized in that: The plurality of tips are arranged in pairs, and the distance between two opposite tips is defined as W4, satisfying the relationship: 1um≤W4-W3≤5um.

4. The evaporation mask according to claim 3, characterized in that: The first surface further includes a first supporting portion surrounding the first recess.

5. The evaporation mask according to claim 4, characterized in that: The first support portion is a plane, and a thickness T from the second support portion to the first surface side is a thickness from the second support portion to the first support portion.

6. The evaporation mask according to claim 1, characterized in that: The evaporation mask is made of nickel-iron alloy.

7. A vapor deposition mask assembly, characterized in that: It comprises the evaporation mask as described in any one of claims 1-6.

8. A vapor deposition mask device, characterized in that: Comprising the evaporation mask assembly as described in claim 7.

9. An organic display device, characterized in that: The organic display device is obtained by performing vapor deposition using the vapor deposition mask device as claimed in claim 8.

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