LPDDR chip test device
By designing the LPDDR chip test device, the problem of lack of an LPDDR chip test platform in the prior art is solved, and the functions, timing parameters and electrical performance tests of the LPDDR chip are realized, compatible with different packaging types, and real-time test data output is provided.
Patent Information
- Application Number
- CN202011464576.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-12-11
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2040-12-11
AI Technical Summary
There is a lack of a test platform for LPDDR chips in the prior art, and it is impossible to effectively conduct functional testing, timing parameter testing and electrical performance testing of LPDDR chips.
A LPDDR chip test device is designed, including a test bench, a test motherboard and a test seat. The test voltage is switched through the test button, compatible with the LPDDR test in EMCP and UMCP, and the test data is output in real time through the display interface.
Testing of different models of LPDDR chips (such as LPDDR4 and LPDDR4X) is realized, and is compatible with the test of LPDDR chips in EMCP and UMCP. It can output test data in real time, helping operators determine whether the chip is normal.
Smart Images

Figure CN112509630B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of chip testing, and in particular to a LPDDR chip testing device. Background Art
[0002] Low Power Double Data Rate (LPDDR) is a communication standard developed by the JEDEC Solid State Technology Association of the United States for low-power memory, which is specifically used in mobile electronic products.
[0003] LPDDR chips need to be tested before leaving the factory. The LPDDR chip tests specified in the standard are mainly divided into three aspects: functional test, timing parameter test and electrical performance test. LPDDR chip testing includes not only independent LPDDR chip testing, but also LPDDR, EMCP and UMCP LPDDR chip testing. EMCP is a combination of EMMC and LPDDR packaging, and UMCP is a combination of UFS and LPDDR packaging.
[0004] Currently, there is no test platform for LPDDR chips on the market, so there is an urgent need for an LPDDR chip testing device that can test LPDDR chips. Summary of the invention
[0005] The present invention solves the technical problem raised in the above background technology by proposing a LPDDR chip testing device.
[0006] Specifically, the present invention proposes an LPDDR chip testing device, which includes a test bench, a test mainboard arranged in the test bench, and a test socket arranged on the test bench, wherein the test mainboard is located in an inner cavity of the test socket, and the test bench is also provided with a display interface for outputting test data to a display, a power interface for supplying power to the test mainboard, and a plurality of test buttons, wherein the display interface, the power interface, and the plurality of test buttons are electrically connected to the test mainboard, respectively.
[0007] Preferably, the test seat includes a mounting table and a plurality of test fixtures arranged on the mounting table, the test fixture includes a pressure cover hinged to the mounting table and a plurality of chip seats for accommodating LPDDR chips, the plurality of chip seats are arranged side by side and located below the pressure cover, and a plurality of pressure heads for supporting the LPDDR chip in the chip seat are provided on one side of the pressure cover facing the chip seat.
[0008] Preferably, a mounting plate for mounting the plurality of pressing heads is provided under the pressure cover, a plurality of guide columns are provided through the circumference of the mounting plate, a first elastic member is sleeved on the guide column, one end of the guide column is connected to the pressure cover, and a accommodating cavity for the mounting plate and the plurality of pressing heads to move up and down is provided in the pressure cover.
[0009] Preferably, a rotating shaft is provided on the other side of the pressure cover relative to its hinged side, and a locking member for fixing the pressure cover is sleeved on the rotating shaft. A second elastic member is provided between the locking member and the pressure cover, and the locking member includes a pressing part and a hooking part connected to the pressing part, and a hook plate is provided on the mounting platform corresponding to the hooking part.
[0010] Preferably, a threaded hole is penetrated through the pressure cover, a threaded column is provided in the threaded hole, a rotating seat located above the pressure cover is provided at one end of the threaded column, the rotating seat is provided with a recessed portion located on its side wall, and the recessed portion extends a preset length along the rotation direction of the rotating seat, and the locking member also includes an abutment portion connected to the pressing portion and extending toward the rotating seat.
[0011] Preferably, the other end of the threaded column is provided with an abutment plate located on the mounting plate, the mounting plate is provided with a positioning groove corresponding to the abutment plate, and the abutment plate is embedded in the positioning groove.
[0012] Preferably, the abutment plate is provided with a plurality of through holes, the plurality of through holes are distributed around the center of the abutment plate, and a rotatable roller is provided in the through holes.
[0013] Preferably, a limiting groove is provided on one side of the rotating seat facing the threaded hole, the limiting groove extends a preset length along the rotating direction of the rotating seat, and a limiting column located on the pressure cover is correspondingly provided below the limiting groove.
[0014] Preferably, a circuit board is provided between the mounting plate and the pressing head, a heating module for heating the LPDDR chip in the chip seat is provided in the pressing head, and the heating module is electrically connected to the circuit board.
[0015] Preferably, the test bench is also provided with a temperature controller for controlling the heating module.
[0016] Compared with the prior art, the beneficial technical effects of the embodiments of the present invention are:
[0017] The LPDDR chip testing device proposed in the embodiment of the present invention can test different types of LPDDR, such as LPDDR4 and LPDDR4X, by switching the test voltage through the test button. It is also compatible with the test of LPDDR in EMCP and UMCP. When testing, first place the LPDDR chip to be tested in the test socket. Since the bottom of the test socket is connected to the test motherboard, the LPDDR chip to be tested can be placed in the test socket to electrically connect it to the test motherboard. Then, the LPDDR chip can be tested by operating the test button on the test bench. The test data will be transmitted to the display connected to it in real time through the display interface, so that the operator can judge whether the LPDDR chip to be tested is normal based on the feedback test data. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a structural schematic diagram of an embodiment of a LPDDR chip testing device of the present invention;
[0019] Figure 2 A schematic diagram of the structure of a test socket of an LPDDR chip test device of the present invention;
[0020] Figure 3 A schematic diagram of the internal structure of the pressure cover of the LPDDR chip testing device of the present invention at a certain viewing angle;
[0021] Figure 4 A schematic diagram of the internal structure of the pressure cover of the LPDDR chip testing device of the present invention from another viewing angle;
[0022] Figure 5 This is a schematic structural diagram of a gland of a LPDDR chip testing device of the present invention;
[0023] Figure 6 A partial exploded view of the rotating seat, threaded column and gland of the LPDDR chip testing device of the present invention;
[0024] Figure 7 It is a schematic diagram of the structure of the locking member and the rotating shaft of the LPDDR chip testing device of the present invention;
[0025] Figure 8 It is a schematic diagram of the assembly structure of the rotating base, threaded column and mounting plate of the LPDDR chip testing device of the present invention;
[0026] Fig. 9 It is a schematic diagram of the structure of the rotating base of the LPDDR chip testing device of the present invention. DETAILED DESCRIPTION
[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention. All other embodiments obtained by ordinary technicians in the field without creative work based on the embodiments of the present invention are within the scope of protection of the present invention.
[0028] Embodiment 1
[0029] The present invention proposes a LPDDR chip testing device, see Figure 1-4 The LPDDR chip testing device includes a test bench 1, a test mainboard 2 arranged in the test bench 1 and a test socket 3 arranged on the test bench 1. The test mainboard 2 is located in the inner cavity of the test socket 3. The test bench 1 is also provided with a display interface 4 for outputting test data to a display, a power interface 5 for supplying power to the test mainboard 2 and a plurality of test buttons 6. The display interface 4, the power interface 5 and the plurality of test buttons 6 are electrically connected to the test mainboard 2 respectively.
[0030] The test bench 1 proposed in the embodiment of the present invention is arranged in a rectangular shape, and includes a base for installing a test motherboard 2, a display interface 4, a power interface 5 and a test button 6, and a support foot arranged below the base, so that the base is placed on the table surface through the support foot. Due to the existence of the support foot, there will be a certain gap between the base and the table surface, and the gap can be used for the user's palm to extend partly, so as to facilitate the user to grab the base part, thereby transferring the LPDDR chip test device. At the same time, the test motherboard 2 will generate heat during operation, and the heat will be dissipated to its side wall in the test bench 1. If there is no support foot between the bottom of the test bench 1 and the table surface, the bottom of the test bench 1 will be attached to the table surface, which will cause the heat at the bottom of the test bench 1 to dissipate very slowly, thereby causing the temperature in the test bench 1 to rise, which may affect the normal operation of the test motherboard 2. For this reason, the embodiment of the present invention is provided with a plurality of support feet below the base, so that there is a gap between the base and the table surface, and the existence of the gap will make the air flow at the bottom of the test bench 1 faster, thereby accelerating the heat dissipation in the test bench 1, and then ensuring that the test motherboard 2 operates within a normal temperature range.
[0031] The test program of the LPDDR chip test device proposed in the embodiment of the present invention can be stored in a solid state drive SSD, can be stored in a USB flash drive, or can be stored in a network server. Specifically, a USB data port and a network interface will be provided on the test bench 1, and a USB flash drive storing the test program can be plugged into the USB data port to start the test program of the LPDDR chip in the form of a USB flash drive. In addition, the LPDDR chip test device can be connected to the network server through the network interface to test the LPDDR chip through the test program stored in the network server. A power supply interface 5 for power supply and a display interface 4 for transmitting test data are also provided on the test bench 1. The USB data interface, network interface, display interface 4 and power supply interface 5 proposed in the embodiment of the present invention are arranged side by side in the upper right corner of the test bench 1, and from left to right are two USB data interfaces, one network interface, one display interface 4 and one power supply interface 5 respectively.
[0032] The test motherboard 2 proposed in the embodiment of the present invention is designed based on the CPU of Intel Ice Lake, which is located on the test bench 1 and extends to the bottom of the test socket 3, and a protective cover is provided above the test motherboard 2, and the protective cover extends from the location of the above-mentioned interface toward the location of the test socket 3. A through hole is provided on the protective cover for exposing the above-mentioned data interface to the outside, an opening is provided at one end of the protective cover close to the test socket 3, and a heat dissipation hole is also provided on the protective cover. A heat dissipation fan located on the test motherboard 2 is provided below the heat dissipation hole. The heat generated by the test motherboard 2 during operation can be discharged by the heat dissipation fan, and the generated heat can be discharged specifically from the heat dissipation hole, the through hole and the opening, thereby ensuring that the heat generated by the test motherboard 2 during operation can be quickly discharged, thereby ensuring that the test motherboard 2 operates within a normal temperature range.
[0033] The test button 6 proposed in the embodiment of the present invention includes a power button, a voltage switching button, a power button and a restart button. After the power interface 5 is connected to the external power supply, the power button can be used to control the power-on and power-off states of the test motherboard 2. After the LPDDR chip to be tested is placed in the test socket 3, the power button can be pressed to test the LPDDR chip. For different types of LPDDR chips, such as LPDDR4 and LPDDR4X, different test voltages (1.1V / 0.6V) can be switched through the voltage switching button to test different types of LPDDR chips.
[0034] Embodiment 2
[0035] See also Figure 2The test seat 3 proposed in the embodiment of the present invention includes a mounting platform 31 and a plurality of test fixtures arranged on the mounting platform 31. The test fixture includes a pressure cover 321 hinged to the mounting platform 31 and a plurality of chip seats 322 for accommodating LPDDR chips. The plurality of chip seats 322 are arranged side by side and located below the pressure cover 321. The pressure cover 321 is provided with a plurality of pressure heads 323 for resisting the LPDDR chips in the chip seats 322 on one side facing the chip seats 322. In this embodiment, the mounting platform 31 is a rectangular frame structure, and hinge seats are arranged at intervals on the long sides of the rectangular frame. A hinge shaft is arranged between the two hinge seats, and a torsion spring is sleeved on the hinge shaft. The pressure cover 321 is rotatably arranged on the hinge shaft. A plurality of chip seats 322 for accommodating the LPDDR chips to be tested are arranged in the inner cavity of the rectangular frame, and the shape of the chip seats 322 is adapted to the shape of the LPDDR chips to be tested. In order to ensure that the LPDDR chip to be tested is stably connected to the test mainboard 2 during the test, a plurality of pressure heads 323 are provided on the side of the pressure cover 321 facing the chip seat 322, and the plurality of pressure heads 323 are respectively provided corresponding to the plurality of chip seats 322. Specifically, before the test, the pressure cover 321 is opened first, and then the LPDDR chip to be tested is placed in the chip seat 322, and then the pressure cover 321 is rotated toward the direction of the chip seat 322, so that the pressure head 323 on the pressure cover 321 abuts against the LPDDR chip to be tested, thereby ensuring the stable connection between the LPDDR chip to be tested and the test mainboard 2. A plurality of test fixtures are provided on the mounting table 31, and a plurality of chip seats 322 are provided in each test fixture, that is, each test fixture can test a plurality of LPDDR chips at the same time, thereby improving the test efficiency of the LPDDR chip. Each test fixture can correspond to LPDDR chips of different sizes. Preferably, the test fixtures proposed in this embodiment are set to two, and the two test fixtures correspond to LPDDR chips of 200 balls and 254 balls respectively. Most LPDDR chips on the market are packaged with 200 balls and 254 balls. Of course, those skilled in the art can design test fixtures of different sizes according to actual conditions, including test fixtures that can accommodate the above-mentioned LPDDR chips of 200 balls and 254 balls, but not limited to this.
[0036] Embodiment 3
[0037] See also Figure 3 and Figure 4, a mounting plate 324 for mounting a plurality of pressing heads 323 is provided below the pressure cover 321 proposed in the embodiment of the present invention, a plurality of guide posts 325 are provided through the peripheral side of the mounting plate 324, a first elastic member 326 is sleeved on the guide posts 325, one end of the guide posts 325 is connected to the pressure cover 321, and a receiving cavity for the mounting plate 324 and the plurality of pressing heads 323 to move up and down is provided in the pressure cover 321. In this embodiment, after the LPDDR chip to be tested is placed on the chip seat 322, the pressing head 323 is required to be supported on the surface of the LPDDR chip to be tested to ensure that the LPDDR chip to be tested is stably connected to the test motherboard 2. However, since the pressing head 323 is in rigid contact with the LPDDR chip to be tested, that is, after the pressure cover 321 is covered, the LPDDR chip to be tested will be subjected to the downward pressure of the pressing head 323, so there is a phenomenon of damaging the LPDDR chip to be tested. To this end, in this embodiment, an elastic buffer device is provided between the pressure head 323 and the pressure cover 321, so that the pressure head 323 and the LPDDR chip to be tested are in elastic contact, thereby avoiding the problem of damaging the LPDDR chip to be tested due to rigid contact. Specifically, a mounting plate 324 is provided below the pressure cover 321, and guide posts 325 are provided at the four corners of the mounting plate 324. The guide posts 325 are provided with a first elastic member 326, and the mounting plate 324 can move up and down along the guide posts 325. When the pressure cover 321 is rotated toward the chip seat 322, the pressure head 323 on the pressure cover 321 will contact the LPDDR chip to be tested. When the two are in contact, if the pressure head 323 continues to press down toward the chip seat 322, the LPDDR chip to be tested will be subjected to the downward force of the pressure head 323, and the pressure head 323 will be subjected to the upward reaction force of the LPDDR chip to be tested. The reaction force will drive the mounting plate 324 to move upward along the guide column 325, thereby driving the pressure head 323 to move upward, so as to ensure that when the pressure head 323 contacts the LPDDR chip to be tested, the LPDDR chip to be tested will not be subjected to downward pressure, thereby ensuring that the LPDDR chip to be tested will not be damaged during the test. When the pressure head 323 moves upward along the guide column 325, the first elastic member 326 will generate a deformation force, and the deformation force is used to reset the pressure head 323 after the pressure cover 321 is opened.
[0038] Embodiment 4
[0039] See also Figure 6 and Figure 7The gland 321 according to the embodiment of the present invention is provided with a rotating shaft 327 on the other side of the hinged side, a locking member 328 for fixing the gland 321 is sleeved on the rotating shaft 327, a second elastic member 329 is provided between the locking member 328 and the gland 321, the locking member 328 includes a pressing portion 328A and a hooking portion 328B connected to the pressing portion 328A, and a hooking plate 311 is provided on the mounting platform 31 corresponding to the hooking portion 328B. In this embodiment, the gland 321 is provided with a U-shaped structure on the other side of the hinged side, a rotating shaft 327 is provided on two opposite side walls of the U-shaped structure, and a locking member 328 for fixing the gland 321 is sleeved on the rotating shaft 327. It is understandable that after the pressure cover 321 is covered on the chip holder 322, in order to prevent the pressure cover 321 from being opened or shaken during the test, a locking member 328 is provided on the pressure cover 321. The locking member 328 is arranged in the vertical direction and includes a pressing portion 328A located in the upper middle portion and a hooking portion 328B located in the lower middle portion. In the locked state, the hooking portion 328B is hooked on the hooking plate 311, and when it needs to be opened, a force can be applied to the pressure portion 328A to make the pressure portion 328A rotate toward the pressure cover 321, and the rotation of the pressure portion 328A will drive the hooking portion 328B to rotate, so that the hooking portion 328B is separated from the hooking plate 311.
[0040] Embodiment 5
[0041] See also Figure 6 and Figure 7The gland 321 according to the embodiment of the present invention is provided with a threaded hole 321A, a threaded column 321B is provided in the threaded hole 321A, a rotating seat 321C is provided at one end of the threaded column 321B and is located above the gland 321, the rotating seat 321C is provided with a recessed portion 321D located on its side wall, the recessed portion 321D extends along the rotation direction of the rotating seat 321C by a preset length, and the locking member 328 also includes an abutting portion 328C connected to the pressing portion 328A and extending toward the rotating seat 321C. In this embodiment, after the gland 321 is fixed by the locking member 328, in order to avoid the locking member 328 being accidentally touched during the test, the locking member 328 can also be restricted from being accidentally touched by the rotating seat 321C. It should be noted that when the recessed portion 321D is located in front of the abutting portion 328C, the hooking portion 328B below the pressing portion 328A can be fully opened by pressing the pressing portion 328A to detach from the hooking plate 311 provided on the mounting platform 31. When the recessed portion 321D on the rotating seat 321C is rotated to another position, that is, the recessed portion 321D is not located in front of the abutting portion 328C, when the pressing portion 328A is pressed, the abutting portion 328C will be blocked by the side wall of the rotating seat 321C to limit the rotation angle of the abutting portion 328C, so that the hooking portion 328B cannot be fully opened, thereby ensuring that the pressure cover 321 cannot be opened by only pressing the pressing portion 328A without twisting the rotating seat 321C, thereby preventing the locking member 328 from being accidentally touched when testing the LPDDR chip.
[0042] Embodiment 6
[0043] See also Figure 6 and Figure 8The other end of the threaded column 321B proposed in the embodiment of the present invention is provided with an abutment plate 321E located on the mounting plate 324, and the mounting plate 324 is provided with a positioning groove 324A corresponding to the abutment plate 321E, and the abutment plate 321E is embedded in the positioning groove 324A. In this embodiment, when the rotating seat 321C is screwed, the threaded column 321B will rotate in the threaded hole 321A, and because the threaded section on the circumferential side wall of the threaded hole 321A is shorter, the threaded column 321B will be unstable in rotation when threadedly mating with the threaded sections on both sides of the threaded hole 321A. For this reason, in this embodiment, an abutment plate 321E is provided at the bottom end of the threaded column 321B, and the abutment plate 321E is embedded in the positioning groove 324A, and the positioning groove 324A is located at a position on the mounting plate 324 corresponding to the abutment plate 321E. That is, when the threaded column 321B is screwed by the rotating seat 321C, the lower end of the threaded column 321B will be restricted by the positioning groove 324A to rotate therein, and will not move left and right, thereby improving the rotation stability of the threaded column 321B. Preferably, the abutment plate 321E proposed in the embodiment of the present invention is a circular plate, and the positioning groove 324A is a circular groove. This is only exemplary and not restrictive, and those skilled in the art can design it according to actual conditions.
[0044] Embodiment 7
[0045] See also Figure 8 , the abutment plate 321E proposed in the embodiment of the present invention is provided with a plurality of through holes 324B, and the plurality of through holes 324B are distributed around the center of the abutment plate 321E, and a rotatable roller 324C is provided in the through hole 324B. In this embodiment, when the threaded column 321B rotates, it will drive the abutment plate 321E connected to its lower end to rotate. In order to reduce the friction between the abutment plate 321E and the positioning groove 324A during rotation, a plurality of rollers 324C are provided in the circumferential direction of the abutment plate 321E. Specifically, when the threaded column 321B drives the abutment plate 321E to rotate, the roller 324C converts the plane friction between the abutment plate 321E and the positioning groove 324A into rolling friction, thereby reducing the friction between the abutment plate 321E and the positioning groove 324A, so that the rotation of the rotating seat 321C is easier, and there is no need to apply a large force on the rotating seat 321C.
[0046] Embodiment 8
[0047] See also Figure 5 , Figure 6 and Fig. 9The rotating seat 321C of the embodiment of the present invention is provided with a limiting groove 321F on one side facing the threaded hole 321A, and the limiting groove 321F extends along the rotating direction of the rotating seat 321C by a preset length, and a limiting column 321G located on the pressure cover 321 is correspondingly provided below the limiting groove 321F. In this embodiment, during the process of twisting the rotating seat 321C, the two ends of the limiting groove 321F will respectively abut against the limiting column 321G below it, that is, after the rotating seat 321C rotates a certain angle, it will be limited to the first preset position by the limiting column 321G; when the rotating seat 321C is rotated in the opposite direction, it will be limited to the second preset position after rotating a certain angle. The first preset position corresponds to pressing the locking member 328 to open the pressure cover 321, while the second preset position corresponds to pressing the locking member 328 and still failing to open the pressure cover 321. At this time, the recessed portion 321D of the rotating seat 321C is far away from the opposite position of the pressing portion 328A, and the rotating seat 321C needs to be rotated to the second preset position to open the pressure cover 321.
[0048] Embodiment 9
[0049] See also Figure 3 , a circuit board 7 is provided between the mounting plate 324 and the pressure head 323 proposed in the embodiment of the present invention, and a heating module for heating the LPDDR chip in the chip seat 322 is provided in the pressure head 323, and the heating module is electrically connected to the circuit board 7. In this embodiment, the LPDDR chip to be tested can be heated by the heating module to test the performance of the LPDDR chip at different temperatures. It should be noted that the LPDDR chip will have different ambient temperatures when actually used, and it needs to adapt to the operation under different ambient temperatures. To this end, this embodiment simulates the ambient temperature by the heating module to test the performance of the LPDDR chip at different temperatures. The heating module is an electric heater, which can be a PTC heater, including but not limited to this, and those skilled in the art can choose according to actual conditions. The heating module proposed in the embodiment of the present invention can share a power supply with the test motherboard 2, that is, it is connected to an external power supply through a power interface 5. The heating module can also be provided with a power supply separately, and a power supply positive and negative electrode interface is provided at the upper left of the test bench 1 to supply power to the heating module separately through the power supply positive and negative electrode interface. As a preference, the present invention chooses to supply power to the heating module separately to avoid the problem of inaccurate testing caused by the heating module occupying the power supply of the test motherboard 2.
[0050] Embodiment 10
[0051] See also Figure 1 The test bench 1 according to the embodiment of the present invention is also provided with a temperature controller 8 for controlling the heating module. In this embodiment, the temperature controller 8 can monitor the test temperature of the LPDDR chip to be tested in real time, and the detected temperature can be displayed in real time on the screen of the temperature controller 8 for the operator to view.
[0052] The above are only partial or preferred embodiments of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.
Claims
1. A LPDDR chip testing device, characterized in that: The test bench comprises a test mainboard arranged in the test bench and a test socket arranged on the test bench, wherein the test mainboard is located in an inner cavity of the test socket, and the test bench is also provided with a display interface for outputting test data to a display, a power interface for supplying power to the test mainboard and a plurality of test buttons, wherein the display interface, the power interface and the plurality of test buttons are electrically connected to the test mainboard respectively; The test seat comprises a mounting platform and a plurality of test fixtures arranged on the mounting platform, wherein the test fixture comprises a pressure cover hinged to the mounting platform and a plurality of chip seats for accommodating LPDDR chips, wherein the plurality of chip seats are arranged side by side and located below the pressure cover, and a plurality of pressure heads for resisting the LPDDR chips in the chip seats are arranged on a side of the pressure cover facing the chip seats; A mounting plate for mounting the plurality of pressing heads is provided below the pressure cover, a plurality of guide columns are provided through the circumference of the mounting plate, a first elastic member is sleeved on the guide column, one end of the guide column is connected to the pressure cover, and a accommodating cavity for the mounting plate and the plurality of pressing heads to move up and down is provided in the pressure cover.
2. The LPDDR chip testing device according to claim 1, characterized in that: A rotating shaft is provided on the other side of the pressure cover relative to its hinged side, and a locking member for fixing the pressure cover is sleeved on the rotating shaft. A second elastic member is provided between the locking member and the pressure cover, and the locking member includes a pressing part and a hooking part connected to the pressing part, and a hooking plate is provided on the mounting platform corresponding to the hooking part.
3. The LPDDR chip testing device according to claim 2, characterized in that: A threaded hole is penetrated through the pressure cover, a threaded column is provided in the threaded hole, a rotating seat located above the pressure cover is provided at one end of the threaded column, a recessed portion is provided on the side wall of the rotating seat, and the recessed portion extends a preset length along the rotation direction of the rotating seat, and the locking member also includes an abutment portion connected to the pressing portion and extending toward the rotating seat.
4. The LPDDR chip testing device according to claim 3, characterized in that: The other end of the threaded column is provided with an abutment plate located on the mounting plate, the mounting plate is provided with a positioning groove corresponding to the abutment plate, and the abutment plate is embedded in the positioning groove.
5. The LPDDR chip testing device according to claim 4, characterized in that: The abutment plate is provided with a plurality of through holes, the plurality of through holes are distributed around the center of the abutment plate, and a rotatable roller is provided in the through holes.
6. The LPDDR chip testing device according to claim 3, characterized in that: A limiting groove is provided on one side of the rotating seat facing the threaded hole, and the limiting groove extends by a preset length along the rotating direction of the rotating seat. A limiting column located on the pressure cover is correspondingly provided below the limiting groove.
7. The LPDDR chip testing device according to claim 1, characterized in that: A circuit board is arranged between the mounting plate and the pressing head. A heating module for heating the LPDDR chip in the chip seat is arranged in the pressing head. The heating module is electrically connected to the circuit board.
8. The LPDDR chip testing device according to claim 7, characterized in that: The test bench is also provided with a temperature controller for controlling the heating module.
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